Substrate processing method and substrate processing apparatus

Abstract

A substrate processing method and a substrate processing apparatus are provided. In the substrate processing method, a processing liquid is discharged from an inner tank (110), an outer tank (120), and a circulation pipe (141) (first liquid discharge step S1). After the processing liquid is discharged, the processing liquid is newly supplied to the inner tank (110) through a new liquid supply port (185) (first supply step S2). After the processing liquid is newly supplied to the inner tank (110), the processing liquid accumulated in the inner tank (110) is discharged until an inner tank lower limit level (LVL) (second liquid discharge step S3). After the processing liquid is discharged until the inner tank lower limit level (LVL), the processing liquid is newly supplied to the inner tank (110) through the new liquid supply port (185) (second supply step S4). The inner tank lower limit level (LVL) indicates a liquid level higher than a position of a circulation liquid guide inlet (132) arranged inside the inner tank (110), and indicates a liquid level higher than a position of the new liquid supply port (185) arranged inside the inner tank (110).

Description

Technical Field

[0001] This invention relates to a substrate processing method and a substrate processing apparatus. Background Technology

[0002] The substrate processing apparatus described in Patent Document 1 performs a prescribed treatment on the substrate by immersing it in a processing solution containing one or more chemical solutions and pure water. The substrate processing apparatus includes a processing tank and a processing solution replacement unit. The processing tank stores the processing solution used for the prescribed treatment of the substrate. When the processing solution in the processing tank exceeds its shelf life, the processing solution replacement unit replaces the processing solution.

[0003] [Background Technical Documents]

[0004] [Patent Literature]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2019-79954 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] However, in the substrate processing apparatus described in Patent Document 1, air may be introduced into the processing solution during the replacement process. For example, air in the circulation line that circulates the processing solution may be introduced into the processing solution during replacement. Or, for example, air may be introduced into the processing solution when chemical solution is sprayed from the chemical solution outlet of the chemical solution line into the processing tank for replacement, or when pure water is sprayed from the pure water outlet of the pure water line into the processing tank.

[0008] The inventors of this application conducted intensive research and discovered that when air is mixed into the processing liquid, it may affect the processing of the substrate.

[0009] The purpose of this invention is to provide a substrate processing method and a substrate processing apparatus that can suppress air from mixing into the processing liquid.

[0010] [Technical means to solve the problem]

[0011] According to one aspect of the present invention, a substrate processing method introduces the processing liquid into the inner tank via a circulation pipe and a circulation liquid inlet, through an outer tank into which the processing liquid overflows from an inner tank containing the accumulated processing liquid, thereby enabling the processing liquid accumulated in the inner tank to circulate. The substrate processing method uses the processing liquid to process a substrate in the inner tank. The substrate processing method includes a first draining step, a first supplying step, a second draining step, and a second supplying step. In the first draining step, the processing liquid is drained from the inner tank, the outer tank, and the circulation pipe. In the first supplying step, after the processing liquid is drained in the first draining step, the processing liquid is re-supplyed to the inner tank through a new liquid supply inlet, thereby re-accumulating the processing liquid in the inner tank. In the second draining step, after the processing liquid is re-supplyed to the inner tank, the processing liquid accumulated in the inner tank is drained until the lower limit level of the inner tank is reached. In the second supply step, after the treatment fluid is discharged up to the lower limit level of the inner tank, the treatment fluid is resupplyed to the inner tank through the new fluid supply port, thereby allowing the treatment fluid to re-accumulate in the inner tank. The lower limit level of the inner tank refers to a liquid level higher than the position of the circulating fluid inlet located inside the inner tank, and also refers to a liquid level higher than the position of the new fluid supply port located inside the inner tank.

[0012] In one embodiment of the invention, it is preferable that the second draining process and the second supply process are performed multiple times.

[0013] In one embodiment of the invention, it is preferable that the number of times the second draining step and the second supply step are performed is determined based on the dissolved oxygen concentration in the treatment liquid stored in the inner tank.

[0014] In one embodiment of the invention, it is preferable that the treatment liquid accumulated in the outer tank is not discharged during the second drainage step.

[0015] In one embodiment of the invention, it is preferable to stop the pump when the treatment liquid in the inner tank is drained up to the lower limit level of the inner tank during the second draining step. Preferably, the treatment liquid in the inner tank is circulated through the circulation piping by driving the pump when the treatment liquid is supplied up to at least the upper limit level of the inner tank during the second supply step. Preferably, the upper limit level of the inner tank refers to a liquid level in the inner tank that is higher than the lower limit level of the inner tank.

[0016] In one embodiment of the invention, it is preferred that the treatment solution is alkaline.

[0017] According to another aspect of the present invention, the substrate processing apparatus includes an inner tank, an outer tank, a circulating liquid inlet component, a circulating pipe, a drain pipe, a drain valve, a pump, a fresh liquid supply pipe, a supply valve, and a control unit. The inner tank stores the processing liquid. The outer tank is disposed outside the inner tank, allowing the processing liquid overflowing from the inner tank to flow into it. The circulating liquid inlet component has a circulating liquid inlet through which the processing liquid supplied from the outer tank is introduced into the inner tank. The circulating pipe circulates the processing liquid stored in the inner tank by supplying the processing liquid from the outer tank to the circulating liquid inlet component. The drain pipe branches off from the circulating pipe and discharges the processing liquid. The drain valve opens and closes the flow path of the drain pipe. The pump is disposed upstream of the drain pipe on the circulating pipe and delivers the processing liquid from the circulating pipe. The fresh liquid supply pipe has a fresh liquid supply port through which the processing liquid is re-supplied to the inner tank. The supply valve opens and closes the flow path of the new liquid supply piping. The control unit controls the drain valve, the pump, and the supply valve. The control unit controls the drain valve and the pump to discharge the processed liquid from the inner tank, the outer tank, and the circulation piping. After discharging the processed liquid, the control unit controls the supply valve to resupply the processed liquid to the inner tank. After resupplying the processed liquid, the control unit controls the drain valve and the pump to discharge the processed liquid accumulated in the inner tank up to the lower limit level of the inner tank. After discharging the processed liquid up to the lower limit level of the inner tank, the control unit controls the supply valve to resupply the processed liquid to the inner tank. The lower limit level of the inner tank represents a liquid level higher than the position of the circulation liquid inlet located inside the inner tank, and also represents a liquid level higher than the position of the new liquid supply inlet located inside the inner tank.

[0018] [Invention Effects]

[0019] According to the present invention, a substrate processing method and a substrate processing apparatus capable of suppressing air from mixing into the processing liquid can be provided. Attached Figure Description

[0020] Figure 1 This is a schematic cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0021] Figure 2 (a) is a diagram showing the state of the substrate of this embodiment before it is immersed in the processing liquid. (b) is a diagram showing the state of the substrate of this embodiment immersed in the processing liquid.

[0022] Figure 3 This is a schematic diagram illustrating the substrate processing apparatus of this embodiment.

[0023] Figure 4This is a graph showing the relationship between the dissolved oxygen concentration and the etching amount in the processing solution of this embodiment.

[0024] Figure 5 This is a schematic diagram illustrating the first draining step in the processing fluid replacement method of this embodiment.

[0025] Figure 6 This is a schematic diagram illustrating the first supply step in the processing fluid replacement method of this embodiment.

[0026] Figure 7 This is a schematic diagram illustrating the second draining step in the treatment fluid replacement method of this embodiment.

[0027] Figure 8 This is a schematic diagram illustrating the second supply step in the processing fluid replacement method of this embodiment.

[0028] Figure 9 This is a timing diagram showing the replacement sequence of the processing fluid in the processing fluid replacement method of this embodiment.

[0029] Figure 10 This is a flowchart illustrating the substrate processing method of this embodiment.

[0030] Figure 11 It means Figure 10 The flowchart shows the detailed processing steps of process S20.

[0031] Figure 12 It means Figure 10 The flowchart shows the detailed processing of the subsequent stage of process S20. Detailed Implementation

[0032] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, in the drawings, the same or equivalent parts are labeled with the same reference numerals, and will not be described repeatedly. Additionally, in the drawings, the X-axis, Y-axis, and Z-axis are appropriately illustrated for ease of understanding. The X-axis, Y-axis, and Z-axis are orthogonal to each other; the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0033] Reference Figures 1-12 The substrate processing apparatus 100 according to an embodiment of the present invention will now be described. First, referring to... Figures 1-3 The substrate processing apparatus 100 will be described below. Figure 1 This is a schematic cross-sectional view showing the substrate processing apparatus 100. Figure 1 The substrate processing apparatus 100 shown is batch-processing and uses processing solution LQ to process multiple substrates W together. The substrate processing apparatus 100 can also process a single substrate W.

[0034] The substrate processing apparatus 100 includes an inner tank 110, an outer tank 120, a substrate holding section 125, a circulating liquid introduction section 130, a circulation section 140, and a control device CTL.

[0035] The inner tank 110 stores a processing solution LQ for immersing multiple substrates W. The inner tank 110 is capable of accommodating multiple substrates W. The inner tank 110 immerses multiple substrates W in the processing solution LQ, thereby processing multiple substrates W.

[0036] The processing solution LQ is, for example, an etching solution. For example, the processing solution LQ is used to etch a polycrystalline silicon film formed on a substrate W. In this embodiment, as an example, the processing solution LQ is alkaline. For example, the processing solution LQ (etching solution) can be an aqueous solution obtained by dissolving an alkaline metal hydroxide such as sodium or potassium (an aqueous solution of NaOH or KOH), or an aqueous solution obtained by dissolving a quaternary ammonium hydroxide such as TMAH (tetramethylammonium hydroxide). The quaternary ammonium hydroxide can be at least one of TMAH, TBAH (tetrabutylammonium hydroxide), TPeAH (tetrapentylammonium hydroxide), THAH (tetrahexylammonium hydroxide), TEAH (tetraethylammonium hydroxide), TPAH (tetrapropylammonium hydroxide), and choline hydroxide, or a substance other than these. These substances are all contained in an organic base. Furthermore, in this paragraph, TMAH does not refer to an aqueous solution, but rather to an anhydride. This also applies to other quaternary ammonium hydroxides such as TBAH.

[0037] The outer tank 120 is positioned outside the inner tank 110. The outer tank 120 surrounds the inner tank 110. The treatment fluid LQ overflowing from the inner tank 110 flows into the outer tank 120. The upper edge of the outer tank 120 is higher than the upper edge of the inner tank 110.

[0038] The substrate holding section 125 holds multiple substrates W. The substrate holding section 125 can also hold a single substrate W. The substrate holding section 125 immerses the multiple substrates W, which are spaced apart and arranged neatly, in the processing liquid LQ accumulated in the inner tank 110. The circulation liquid introduction section 130 introduces the processing liquid LQ accumulated in the outer tank 120 into the inner tank 110. The circulation liquid introduction section 130 is disposed inside the inner tank 110. The circulation section 140 circulates the processing liquid LQ accumulated in the inner tank 110 by supplying the circulation liquid LQ from the outer tank 120 to the circulation liquid introduction section 130.

[0039] Next, refer to Figure 1 The details of each component are explained below. The circulating fluid inlet 130 includes multiple circulating fluid inlet components 131. Figure 1 In the example, the circulating fluid inlet 130 includes two circulating fluid inlet components 131. However, the number of circulating fluid inlet components 131 is not particularly limited, and may be three or more. Alternatively, the circulating fluid inlet 130 may also include one circulating fluid inlet component 131.

[0040] Multiple circulating fluid inlet components 131 are disposed inside the inner tank 110. Specifically, the multiple circulating fluid inlet components 131 are disposed inside the inner tank 110 on the bottom side of the inner tank 110. As an example, the multiple circulating fluid inlet components 131 are each a straight-extending tube.

[0041] Each of the multiple circulating fluid inlet components 131 has multiple circulating fluid inlet ports 132. The circulating fluid inlet ports 132 are through holes provided in the circulating fluid inlet components 131. The circulating fluid inlet components 131 introduce the processing fluid LQ supplied from the outer tank 120 into the inner tank 110 through the circulating fluid inlet ports 132. In other words, the circulating fluid inlet ports 132 spray the processing fluid LQ supplied from the outer tank 120 by the circulation section 140 into the interior of the inner tank 110. Alternatively, each of the multiple circulating fluid inlet components 131 may have only one circulating fluid inlet port 132.

[0042] exist Figure 1 In the example, the circulating fluid inlet 132 opens vertically upwards. However, the direction of the circulating fluid inlet 132 is not particularly limited. For example, the circulating fluid inlet 132 may also open upwards outwards or upwards inwards. Additionally, for example, the circulating fluid inlet 132 may open downwards outwards or downwards inwards. Furthermore, for example, the circulating fluid inlet 132 may open vertically downwards, horizontally outwards, or horizontally inwards. Moreover, the directions of the multiple circulating fluid inlets 132 may differ among the multiple circulating fluid inlet components 131. Furthermore, the heights of the multiple circulating fluid inlet components 131 may also differ.

[0043] The circulation unit 140 includes a circulation piping 141, a pump 142, a heater 143, a filter 144, a regulating valve 145, and a valve 146. The pump 142, heater 143, filter 144, regulating valve 145, and valve 146 are arranged sequentially from upstream to downstream of the circulation piping 141.

[0044] The circulation piping 141 extends from the outer tank 120 to the circulation fluid inlet 131. Furthermore, the circulation piping 141 circulates the processing fluid LQ accumulated in the inner tank 110 by supplying processing fluid LQ from the outer tank 120 to the circulation fluid inlet 131. Specifically, the upstream end of the circulation piping 141 is located in the outer tank 120, and the downstream end of the circulation piping 141 is connected to each circulation fluid inlet 131. The circulation piping 141 has an inlet 141x. The inlet 141x is located at the downstream end of the circulation piping 141. The inlet 141x faces vertically downwards. However, the direction of the inlet 141x is not particularly limited. The processing fluid LQ of the outer tank 120 enters the circulation piping 141 through the inlet 141x. Alternatively, for example, the downstream end of the circulation piping 141 may be connected to the bottom of the outer tank 120, with the inlet 141x facing vertically upwards.

[0045] Pump 142 pumps the treatment fluid LQ from the circulation piping 141 toward each circulation fluid inlet 131. Therefore, the treatment fluid LQ is supplied from the circulation piping 141 to each circulation fluid inlet 131. As a result, each circulation fluid inlet 131 ejects the treatment fluid LQ supplied from the circulation piping 141 from its respective circulation inlet 132 into the interior of the inner tank 110. Heater 143 heats the treatment fluid LQ flowing in the circulation piping 141, regulating the temperature of the treatment fluid LQ. Filter 144 filters the treatment fluid LQ flowing in the circulation piping 141. Adjusting valve 145 adjusts the opening of the circulation piping 141 to adjust the flow rate of the treatment fluid LQ supplied to the circulation fluid inlet 131. Valve 146 opens and closes the circulation piping 141. When the treatment fluid LQ is circulating, valve 146 is open, opening the flow path of the circulation piping 141.

[0046] The control device CTL controls the various components of the substrate processing apparatus 100. The control device CTL may also include an input device and a display device.

[0047] Specifically, the control device CTL includes a control unit A1 and a storage unit A2. The control unit A1 includes a processor such as a CPU (Central Processing Unit). The storage unit A2 includes a storage device that stores data and computer programs. The processor in the control unit A1 executes the computer program stored in the storage device of the storage unit A2, controlling each configuration of the substrate processing apparatus 100. Specifically, the control unit A1 controls the substrate holding unit 125 and the circulation unit 140. Furthermore, for example, the storage unit A2 includes a main storage device such as a semiconductor memory, and auxiliary storage devices such as semiconductor memory and hard disk drives. The storage unit A2 may also include a removable medium such as an optical disc. The storage unit A2 is, for example, a non-transitory storage medium that can be read by a computer.

[0048] Next, refer to Figure 2The substrate holding portion 125 will be described. Figure 2 (a) and Figure 2 (b) is a schematic perspective view of the substrate processing apparatus 100 before and after the substrate W is placed into the inner tank 110. Furthermore, in Figure 2 (a) and Figure 2 In (b), the processing liquid LQ has been omitted for the sake of simplifying the attached diagram.

[0049] like Figure 2 As shown in (a), the substrate holding portion 125 includes a body plate 126 and a holding rod 127. The body plate 126 is a plate extending along a vertical direction D. The holding rod 127 extends from a main surface of the body plate 126 in a predetermined direction D10. The predetermined direction D10 is substantially parallel to the horizontal direction and substantially orthogonal to the body plate 126. A plurality of substrates W are held in a vertical position (vertical position) by the plurality of holding rods 127 in a neatly arranged state with intervals between them.

[0050] exist Figure 2 In (a), the substrate holding portion 125 is located above the inner tank 110. The substrate holding portion 125 descends along the vertical direction D while holding multiple substrates W. Thus, the multiple substrates W are inserted into the inner tank 110. Figure 2 As shown in (b), when the substrate holding part 125 descends to the inner tank 110, a plurality of substrates W are immersed in the processing liquid LQ in the inner tank 110.

[0051] In addition, such as Figure 1 As shown, the substrate holding portion 125 may further include a lifting unit 128. The lifting unit 128 is positioned at the processing position where the plurality of substrates W held by the substrate holding portion 125 are located within the inner trench 110. Figure 2 (b) shows the position, and the retracted position of the plurality of substrates W held by the substrate holding portion 125 above the inner trench 110. Figure 2 The body plate 126 is raised and lowered between the positions shown in (a).

[0052] Figure 3 This is a schematic diagram showing the substrate processing apparatus 100. Furthermore, in Figure 3 To simplify the accompanying drawings, the substrate holding part 125, the adjusting valve 145, and the valve 146 have been omitted. Additionally, in Figure 3 In the text, regarding the inner groove 110 and the outer groove 120, it indicates that along... Figure 2 (a) Section of line III-III.

[0053] like Figure 3As shown, the substrate processing apparatus 100 further includes an inner tank drainage section 150, a drainage section 160, a tank 170, a fresh solution supply section 180, a tank cleaning section 190, an inner tank level sensor 210, an outer tank level sensor 220, and a sensor cleaning section 230. The substrate processing apparatus 100 may also further include a dissolved oxygen meter 240. The dissolved oxygen meter 240 measures the dissolved oxygen concentration of the processing solution LQ and outputs information indicating the dissolved oxygen concentration to the control section A1. The dissolved oxygen meter 240 measures the dissolved oxygen concentration of the processing solution LQ, for example, using diaphragm polarography.

[0054] When the processing liquid LQ is discharged from the inner tank 110, the inner tank drainage section 150 supplies the processing liquid LQ from the inner tank 110 to the circulation section 140. The circulation section 140 supplies the processing liquid LQ supplied from the inner tank drainage section 150 to the drainage section 160. Alternatively, when the processing liquid LQ is discharged from the outer tank 120, the circulation section 140 supplies the processing liquid LQ from the outer tank 120 to the drainage section 160. Alternatively, when the processing liquid LQ remaining in the circulation section 140 is discharged, the circulation section 140 supplies the processing liquid LQ remaining in the circulation section 140 to the drainage section 160. The drainage section 160 discharges the processing liquid LQ supplied from the circulation section 140 to the tank 170. The tank 170 accumulates the processing liquid LQ discharged through the drainage section 160. The tank 170 is, for example, a cooling tank for cooling the processing liquid LQ discharged through the drainage section 160.

[0055] The new fluid supply unit 180 resupply the treatment fluid LQ to the inner tank 110 or the outer tank 120. The tank cleaning unit 190 uses cleaning water to clean the inner tank 110 and the outer tank 120. The inner tank level sensor 210 detects the level (liquid surface level) of the treatment fluid LQ accumulated in the inner tank 110 and outputs the detection result to the control unit A1. The outer tank level sensor 220 detects the level (liquid surface level) of the treatment fluid LQ accumulated in the outer tank 120 and outputs the detection result to the control unit A1. The sensor cleaning unit 230 uses cleaning fluid to clean the inner tank level sensor 210 and the outer tank level sensor 220. The cleaning fluid used by the tank cleaning unit 190 and the sensor cleaning unit 230 is, for example, deionized water, carbonated water, electrolyzed water, hydrogen water, ozone water, or hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm).

[0056] In detail, the circulation section 140 further includes valves 147 and 148. The inner tank drainage section 150 includes an inner tank drainage pipe 151 and valve 152. The circulation pipe 141 includes a first pipe 141a, a second pipe 141b, and a third pipe 141c. The drainage section 160 includes a drainage pipe 161 and a drainage valve 162. The fresh liquid supply section 180 includes a fresh liquid supply pipe 181, a fresh liquid supply pipe 182, a supply valve 183, a supply valve 184, and a flow meter 186. The tank cleaning section 190 includes a pipe 191, a valve 192, and a flow meter 193. The inner tank level sensor 210 includes a sensor pipe 211, a sensor body 212, valves 213 and 214. The outer tank level sensor 220 includes a sensor pipe 221, a sensor body 222, valves 223 and 224. The sensor cleaning unit 230 includes piping 231, piping 232, valve 233, and valve 234.

[0057] In the circulation section 140, the circulation piping 141 extends from the inside of the outer tank 120, through connection points B1 and B2, to the circulation fluid inlet component 131. The first piping 141a extends from the inside of the outer tank 120 to connection point B1. The second piping 141b extends from connection point B1 to connection point B2. The third piping 141c extends from connection point B2 to the circulation fluid inlet component 131. The pump 142 is located on the second piping 141b. That is, the pump 142 is located upstream of the drainage piping 141 and the drainage valve 162. Valve 147, heater 143, filter 144, and regulating valve 145 are also included. Figure 1 ), and valve 146 ( Figure 1 The pipes are arranged sequentially from upstream to downstream in the third pipe 141c.

[0058] Valve 148 is configured on the first pipe 141a. Valve 148 opens and closes the flow path of the first pipe 141a. When valve 148 is open, the flow path of the first pipe 141a is open. When valve 148 is closed, the flow path of the first pipe 141a is blocked. Valve 147 is configured between connection point B2 and heater 143. That is, valve 147 is configured in the circulation pipe 141 between pump 142 and heater 143. Valve 147 opens and closes the flow path of the third pipe 141c. When valve 147 is open, the flow path of the third pipe 141c is open. When valve 147 is closed, the flow path of the third pipe 141c is blocked. By opening valves 147 and 148, closing valve 152 and drain valve 162, and driving pump 142, the processing liquid LQ of the inner tank 110 is circulated through the circulation pipe 141.

[0059] In the circulating fluid inlet section 130, the circulating fluid inlet component 131 extends along a predetermined direction D10. Furthermore, in each circulating fluid inlet component 131, a plurality of circulating fluid inlet ports 132 ( Figure 1They are arranged at intervals along the specified direction D10.

[0060] In the inner tank drainage section 150, one end of the inner tank drainage pipe 151 is located inside the inner tank 110, and the other end of the inner tank drainage pipe 151 is connected to the circulation pipe 141 via connection point B1. That is, the inner tank drainage pipe 151 branches off from connection point B1 of the circulation pipe 141 and extends from connection point B1 to the interior of the inner tank 110. A valve 152 is disposed on the inner tank drainage pipe 151. The valve 152 opens and closes the flow path of the inner tank drainage pipe 151. When the valve 152 is open, the flow path of the inner tank drainage pipe 151 is open. When the valve 152 is closed, the flow path of the inner tank drainage pipe 151 is blocked.

[0061] In the drainage section 160, one end of the drainage pipe 161 is connected to the circulation pipe 141 via connection point B2. The other end of the drainage pipe 161 is connected to the tank 170. That is, the drainage pipe 161 branches off from the circulation pipe 141 via connection point B2 and extends to the tank 170. Furthermore, the drainage pipe 161 drains the processed liquid LQ into the tank 170. A drainage valve 162 is disposed on the drainage pipe 161. The drainage valve 162 opens and closes the flow path of the drainage pipe 161. When the drainage valve 162 is open, the flow path of the drainage pipe 161 is open. When the drainage valve 162 is closed, the flow path of the drainage pipe 161 is blocked.

[0062] By opening drain valves 162 and 152, closing valves 147 and 148, and driving pump 142, the processing liquid LQ in the inner tank 110 is discharged into tank 170 through the inner tank drain pipe 151, the second pipe 141b, and the drain pipe 161. Conversely, by opening drain valves 162 and 148, closing valves 147 and 152, and driving pump 142, the processing liquid LQ in the outer tank 120 is discharged into tank 170 through the first pipe 141a, the second pipe 141b, and the drain pipe 161.

[0063] In the fresh liquid supply section 180, the fresh liquid supply pipe 181 extends from the fresh liquid tank TA containing the accumulated treatment liquid LQ to the interior of the inner tank 110. A supply valve 183 is disposed on the fresh liquid supply pipe 181. The supply valve 183 opens and closes the flow path of the fresh liquid supply pipe 181. When the supply valve 183 is open, the flow path of the fresh liquid supply pipe 181 is open. When the supply valve 183 is closed, the flow path of the fresh liquid supply pipe 181 is blocked.

[0064] One end of the fresh liquid supply pipe 182 is connected to the fresh liquid supply pipe 181 via connection point B3. The other end of the fresh liquid supply pipe 182 is located inside the outer tank 120. The supply valve 184 opens and closes the flow path of the fresh liquid supply pipe 182. When the supply valve 184 is open, the flow path of the fresh liquid supply pipe 182 is open. When the supply valve 184 is closed, the flow path of the fresh liquid supply pipe 182 is blocked.

[0065] By opening the supply valve 183 and closing the supply valve 184, the processing fluid LQ can be supplied to the inner tank 110 via the fresh fluid supply pipe 181. Specifically, the fresh fluid supply pipe 181 has a fresh fluid supply port 185. Moreover, the fresh fluid supply pipe 181 supplies the processing fluid LQ to the inner tank 110 through the fresh fluid supply port 185. For example, the fresh fluid supply pipe 181 can resupply the processing fluid LQ to the inner tank 110 through the fresh fluid supply port 185. The fresh fluid supply port 185 is located at the downstream end of the fresh fluid supply pipe 181. The fresh fluid supply port 185 is disposed inside the inner tank 110. The fresh fluid supply port 185 opens, for example, vertically downward. However, the direction of the fresh fluid supply port 185 is not particularly limited. In addition, the fresh fluid supply unit 180 may have multiple fresh fluid supply pipes 181 and multiple fresh fluid supply ports 185.

[0066] By opening the supply valve 184 and closing the supply valve 183, the treatment fluid LQ can be supplied to the outer tank 120 using the new fluid supply piping 182.

[0067] Flow meter 186 is positioned upstream of connection point B3 on the new liquid supply line 181. Flow meter 186 measures the flow rate of the treatment fluid LQ flowing in the new liquid supply line 181 upstream of connection point B3.

[0068] In the tank cleaning section 190, piping 191 extends from the cleaning water tank TB to the inner tank 110. A valve 192 is located on piping 191. When valve 192 is open, the flow path of piping 191 is opened, supplying cleaning water to the inner tank 110. When valve 192 is closed, the flow path of piping 191 is blocked, stopping the supply of cleaning water to the inner tank 110. A flow meter 193 is located upstream of valve 192 on piping 191. Flow meter 193 measures the flow rate of the treatment fluid LQ flowing in piping 191.

[0069] In the inner tank level sensor 210, the front end of the sensor tube 211 is immersed in the processing liquid LQ accumulated in the inner tank 110. Moreover, while supplying nitrogen gas to the sensor tube 211 at a fixed flow rate, the sensor body 212 measures the gas pressure of the nitrogen gas in the sensor tube 211, thereby detecting the liquid level of the processing liquid LQ in the inner tank 110.

[0070] In the outer tank level sensor 220, the front end of the sensor tube 221 is immersed in the processing liquid LQ accumulated in the outer tank 120. Moreover, while supplying nitrogen gas to the sensor tube 221 at a fixed flow rate, the sensor body 222 measures the gas pressure of the nitrogen gas in the sensor tube 221, thereby detecting the liquid level of the processing liquid LQ in the outer tank 120.

[0071] In the sensor cleaning unit 230, one end of pipe 231 is connected to the cleaning water tank TC, and the other end of pipe 231 is connected to the sensor tube 211 via connection point B4. Tank TC may also be shared with tank TB. Valve 233 is disposed on pipe 231. Valve 233 opens and closes the flow path of pipe 231. When valve 233 is open, the flow path of pipe 231 is open, and cleaning water is supplied to sensor tube 211. As a result, sensor tube 211 is cleaned. When valve 233 is closed, pipe 231 is blocked, and the supply of cleaning water to sensor tube 211 stops.

[0072] One end of pipe 232 is connected to pipe 231 via connection point B6. The other end of pipe 232 is connected to sensor pipe 221 via connection point B5. Valve 234 is disposed on pipe 232. Valve 234 opens and closes the flow path of pipe 232. When valve 234 is open, the flow path of pipe 232 is opened, supplying cleaning water to sensor pipe 221. As a result, sensor pipe 221 is cleaned. When valve 234 is closed, pipe 232 is blocked, stopping the supply of cleaning water to sensor pipe 221.

[0073] The control unit A1 controls valves 147, 148, 152, 192, 213, 214, 223, 224, 233, 234, drain valve 162, and supply valves 183 and 184. Additionally, the control unit A1 controls pump 142 and heater 143.

[0074] Next, refer to Figure 4 The effects of air infiltration into the processing solution LQ on the treatment of substrate W are explained. As an example, the dissolved oxygen concentration in the processing solution LQ is described. Figure 4 This is a graph showing the relationship between the dissolved oxygen concentration of the processing solution LQ and the etching amount. The horizontal axis represents the dissolved oxygen concentration (ppm) of the processing solution LQ, and the vertical axis represents the etching amount of the substrate W.

[0075] in addition, Figure 4 An example is shown where an aqueous solution of TMAH is used as the alkaline treatment solution LQ. The concentration of TMAH is 0.31%. In this example, a polycrystalline silicon film (polycrystalline silicon layer) is formed on the substrate W. Figure 4This indicates the amount of etching of the polysilicon film when the substrate W is immersed in the TMAH. The amount of etching is the value obtained by subtracting the thickness of the polysilicon film after immersion from the thickness of the polysilicon film before immersion in the TMAH. Sometimes the amount of etching is recorded as "the amount of etching of the substrate W".

[0076] like Figure 4 As shown, the lower the dissolved oxygen concentration in the processing solution LQ, the greater the etching amount (processing amount) of the substrate W. The etching amount (processing amount) is approximately proportional to the dissolved oxygen concentration. The proportionality constant is negative.

[0077] The above is for reference only. Figure 4 As explained, for example, when the processing solution LQ is alkaline, the processing volume of substrate W is affected by the dissolved oxygen concentration of the processing solution LQ. Therefore, when processing substrate W, the lower the dissolved oxygen concentration of the processing solution LQ, the better.

[0078] In other words, for example, if the processing solution LQ is alkaline, air mixing into the processing solution LQ will affect the processing of substrate W. This is because air contains oxygen. Therefore, when processing substrate W, the less air mixed into the processing solution LQ, the better.

[0079] Next, refer to Figure 1 and Figures 5-8 The substrate processing method of this embodiment will be described. For example... Figure 1 As shown, the substrate processing method involves treating the substrate W in the inner tank 110 using a processing solution LQ. Furthermore, in this substrate processing method, the processing solution LQ overflowing from the inner tank 110 and flowing into the outer tank 120 is introduced into the inner tank 110 via a circulation pipe 141 and a circulation inlet 132, thus enabling the processing solution LQ accumulated in the inner tank 110 to circulate.

[0080] The substrate processing method includes a process solution replacement method. Figures 5-8 This is a schematic diagram illustrating the process of replacing the treatment fluid. For example... Figures 5-8 As shown, the treatment fluid replacement method includes steps S1 to S4. The treatment fluid replacement method is performed after the service life of the treatment fluid LQ has expired. The service life refers to the time during which the treatment process itself cannot be sufficiently performed if the state of the treatment fluid LQ continues to change and continued use of the treatment fluid LQ is desired. In other words, the service life refers to the time during which the treatment fluid LQ can no longer be used to maintain its treatment performance. The service life can be determined based on experiments and / or experience.

[0081] In the following cases, expired treatment fluid LQ may sometimes be described as "used treatment fluid LQ" or "old fluid". In addition, treatment fluid LQ that is replaced by expired treatment fluid LQ and resupplied may sometimes be described as "unused treatment fluid LQ" or "new fluid".

[0082] First, such as Figure 5 As shown, in step S1, the treatment liquid LQ is discharged from the inner tank 110, the outer tank 120, and the circulation pipe 141 into the tank 170. As a result, the inner tank 110, the outer tank 120, and the circulation pipe 141 become empty. The treatment liquid LQ discharged in step S1 is, for example, treatment liquid that has reached the end of its service life. Step S1 corresponds to an example of the "first discharge step" of the present invention.

[0083] exist Figure 5 In the diagram, state ST11 indicates the state during the discharge of the treatment fluid LQ. State ST12 indicates the state where the inner tank 110, outer tank 120, and circulation piping 141 are empty.

[0084] As an example, firstly, the treatment liquid LQ of the inner tank 110 is discharged using the inner tank drain pipe 151, the second pipe 141b, and the drain pipe 161. Next, the treatment liquid LQ of the outer tank 120 is discharged using the first pipe 141a, the second pipe 141b, and the drain pipe 161. Finally, the treatment liquid LQ is discharged from the circulation pipe 141 (first pipe 141a to third pipe section 25c).

[0085] Specifically, in process S1, control unit A1 controls drain valve 162, valve 147, valve 148, valve 152, and pump 142 to discharge the treatment liquid LQ from inner tank 110, outer tank 120, and circulation pipe 141 to tank 170. Furthermore, in this case, drain valve 162 is opened, valve 147 and supply valve 183 are closed, and pump 142 is driven. Additionally, when discharging treatment liquid LQ from outer tank 120, valve 148 is opened and valve 152 is closed. When discharging treatment liquid LQ from inner tank 110, valve 152 is opened and valve 148 is closed. Details of the control will be described below.

[0086] Next, as Figure 6As shown, in step S2, the processing liquid LQ is re-supplied to the inner tank 110, thereby re-accumulating the processing liquid LQ in the inner tank 110. That is, after the processing liquid LQ is discharged from the inner tank 110, the outer tank 120, and the circulation pipe 141 (after the processing liquid LQ is discharged in step S1), the processing liquid LQ is re-supplied to the inner tank 110 through the new liquid supply pipe 181 and the new liquid supply port 185, thereby re-accumulating the processing liquid LQ in the inner tank 110. When the inner tank 110 is full of processing liquid LQ, the processing liquid LQ overflows from the inner tank 110 and flows into the outer tank 120. As a result, the processing liquid LQ is accumulated not only in the inner tank 110 but also in the outer tank 120. Step S2 corresponds to an example of the "first supply step" of the present invention.

[0087] exist Figure 6 In the above, state ST21 indicates the intermediate state of resupplying treatment fluid LQ to inner tank 110. State ST22 indicates the state where the liquid level of treatment fluid LQ in inner tank 110 reaches the inner tank metering level LVI, and the liquid level of treatment fluid LQ in outer tank 120 reaches the outer tank metering level LVO.

[0088] The inner tank metering level LVI indicates the liquid level in the inner tank 110 when it is filled with the treatment fluid LQ. In other words, the inner tank metering level LVI represents the upper limit of the liquid level of the treatment fluid LQ that should be accumulated in the inner tank 110. The inner tank metering level LVI is an example of the "inner tank upper limit level" of this invention.

[0089] The outer tank metering level LVO represents the liquid level corresponding to the amount of processed liquid LQ required to circulate in the outer tank 120. In other words, the outer tank metering level LVO represents the upper limit of the processed liquid LQ level that should be stored in the outer tank 120. From this perspective, the outer tank metering level LVO can also be recorded as the upper limit level of the outer tank. The outer tank metering level LVO is lower than the full level of the outer tank metering level LVO. The outer tank metering level LVO can be determined experimentally and / or empirically.

[0090] Specifically, in process S2, control unit A1 controls supply valve 183 to resupply process fluid LQ to inner tank 110 after the process fluid LQ has been discharged from inner tank 110, outer tank 120, and circulation pipe 141. Therefore, process fluid LQ is resupplyed to inner tank 110 from fresh fluid supply pipe 181. Furthermore, in this case, supply valve 183 is open, valves 147, 148, 152 and drain valve 162 are closed, and pump 142 stops. Details of the control will be described below.

[0091] Furthermore, when the inner tank 110 and outer tank 120 are in state ST22, the control unit A1 controls valves 147, 148, 152, drain valve 162, and pump 142 to circulate the processing fluid LQ of the inner tank 110 through the circulation pipe 141. In this state, valves 147 and 148 are open, valves 152, supply valve 183, and drain valve 162 are closed, and pump 142 is driven. Details of the control will be described below.

[0092] Next, as Figure 7 As shown, in step S3, the processing liquid LQ accumulated in the inner tank 110 is discharged into the tank 170 until the lower limit level (LVL) of the inner tank is reached. That is, after the processing liquid LQ is resupplyed to the inner tank 110 (after step S2), the processing liquid LQ accumulated in the inner tank 110 is discharged into the tank 170 until the lower limit level (LVL) of the inner tank is reached. In this case, the processing liquid LQ in the inner tank 110 is discharged into the tank 170 via the inner tank drain pipe 151, the second pipe 141b, and the drain pipe 161. On the other hand, in this embodiment, the processing liquid LQ in the outer tank 120 is not discharged. Step S3 corresponds to an example of the "second draining step" of the present invention.

[0093] exist Figure 7 In the diagram, state ST31 indicates the intermediate state of the treatment fluid LQ being discharged from the inner tank 110. State ST32 indicates the state of the treatment fluid LQ being discharged from the inner tank 110 until the lower limit level LVL of the inner tank is reached.

[0094] The lower limit level (LVL) of the inner tank indicates the level of the circulating fluid inlet 132 located inside the inner tank 110. Figure 1 The position of the liquid level is higher than that of the new liquid supply port 185 located inside the inner tank 110. Therefore, when the liquid level of the processed liquid LQ is at the lower limit level LVL of the inner tank, the new liquid supply port 185 and the circulating liquid inlet 132 of the circulating liquid inlet component 131 are at a higher position than the position of the new liquid supply port 185 located inside the inner tank 110. Figure 1 It is located in the treatment fluid LQ and does not protrude from the treatment fluid LQ to the outside. In addition, the inner tank metering level LVI indicates the liquid level in the inner tank 110 that is higher than the inner tank lower limit level LVL.

[0095] Specifically, in process S3, control unit A1 controls drain valve 162, valve 147, valve 148, valve 152, and pump 142 in a manner that drains the accumulated processing fluid LQ in inner tank 110 up to the lower limit level LVL of inner tank after resupplying processing fluid LQ to inner tank 110. Furthermore, in this case, drain valve 162 and valve 152 are open, valves 147, 148 and supply valve 183 are closed, and pump 142 is driven. Details of the control will be described below.

[0096] Furthermore, in the presence of multiple new liquid supply ports 185, the lower limit level (LVL) of the inner tank indicates a higher level than the circulating liquid inlet 132. Figure 1 The lower limit level (LVL) of the inner tank is higher than the position of the uppermost new liquid supply port 185. Additionally, in the case of multiple circulation liquid inlets 132, the LVL indicates a liquid level higher than the position of the uppermost circulation liquid inlet 132. Figure 1 The liquid level is higher than the position of the new liquid supply port 185. Furthermore, in the presence of multiple new liquid supply ports 185 and multiple circulating liquid inlets 132, the inner tank lower limit level (LVL) indicates a liquid level higher than the position of the uppermost circulating liquid inlet 132. Figure 1 The liquid level is higher than the position of the new liquid supply port 185 located at the top.

[0097] Next, as Figure 8 As shown, in step S4, the processing fluid LQ is re-supplied to the inner tank 110, thereby re-accumulating the processing fluid LQ in the inner tank 110. That is, after the processing fluid LQ is discharged from the inner tank 110 up to the lower limit level LVL of the inner tank (after step S3), the processing fluid LQ is re-supplied to the inner tank 110 through the new fluid supply pipe 181 and the new fluid supply port 185, thereby re-accumulating the processing fluid LQ in the inner tank 110. Step S4 corresponds to an example of the "second supply step" of the present invention.

[0098] exist Figure 8 In the diagram, state ST41 indicates an intermediate state during the resupply of treatment fluid LQ to the inner tank 110. State ST42 indicates a state where the level of treatment fluid LQ in the inner tank 110 reaches the inner tank metering level LVI, and the level of treatment fluid LQ in the outer tank 120 reaches the outer tank metering level LVO.

[0099] Specifically, in process S4, control unit A1 controls supply valve 183 to resupply the inner tank 110 with the treatment fluid LQ after it has been drained from the inner tank 110 up to the lower limit level LVL. Therefore, the inner tank 110 is resupplyed with the treatment fluid LQ from the new fluid supply pipe 181. Furthermore, in this case, supply valve 183 is open, valves 147, 148, 152 and drain valve 162 are closed, and pump 142 stops. Details of the control will be described below.

[0100] Furthermore, when the inner tank 110 and outer tank 120 are in state ST42, the control unit A1 controls valves 147, 148, 152, drain valve 162, and pump 142 to circulate the processing fluid LQ in the inner tank 110 through the circulation pipe 141. In this state, valves 147 and 148 are open, valves 152, supply valve 183, and drain valve 162 are closed, and pump 142 is activated. Details of the control will be described below.

[0101] The above is for reference only. Figures 5-8 As explained, according to this embodiment, the old liquid is replaced with new liquid in steps S1 and S2. That is, in steps S1 and S2, the replacement of all the treatment liquid LQ is performed in the inner tank 110 and the outer tank 120.

[0102] Then, after all the treatment fluid LQ is replaced, in step S3, the treatment fluid LQ is drained until the inner tank reaches the lower limit level LVL, and in step S4, the inner tank 110 is re-supplyed with treatment fluid LQ. Specifically, in step S3, the new fluid supply port 185 and the circulating fluid inlet 132 are located below the liquid level of the treatment fluid LQ. Therefore, it is possible to prevent air from entering the new fluid supply pipe 181 from the new fluid supply port 185 and from entering the circulating fluid inlet 132. Figure 1 It enters the circulating fluid inlet component 131.

[0103] As a result, in step S4, air can be prevented from entering the fresh liquid supply pipe 181 and the circulating liquid inlet component 131, and the processing liquid LQ can be re-supplyed to the inner tank 110. Furthermore, in step S3, air can be prevented from entering the fresh liquid supply pipe 181 and the circulating liquid inlet component 131, and the processing liquid LQ mixed with air can be discharged in step S2, as well as the air remaining in the circulating pipe 141. As a result, air mixing into the processing liquid LQ can be prevented. Therefore, the processing of the substrate W can be performed effectively.

[0104] For example, suppressing air ingress into the processing solution LQ is equivalent to suppressing oxygen dissolution in the processing solution LQ. Therefore, if air ingress into the processing solution LQ can be suppressed, the dissolved oxygen concentration in the processing solution LQ can be reduced. As a result, the reduction in the amount of material processed (etched) on the substrate W due to dissolved oxygen can be suppressed. Figure 4 This is particularly effective when the treatment solution LQ is alkaline.

[0105] Furthermore, in this embodiment, during step S3, control unit A1 closes valve 148. Therefore, during step S3, control unit A1 does not discharge the processing liquid LQ accumulated in the outer tank 120. Consequently, the inlet 141x of the circulation pipe 141 is located below the liquid level of the processing liquid LQ in the outer tank 120. In other words, the inlet 141x of the circulation pipe 141 is located within the processing liquid LQ in the outer tank 120 and does not protrude to the outside of the processing liquid LQ. Therefore, it is possible to prevent air from entering the circulation pipe 141 from the inlet 141x. As a result, it is possible to further suppress air from mixing into the processing liquid LQ.

[0106] Furthermore, in this embodiment, when the processing liquid LQ in the inner tank 110 is discharged until the lower limit level LVL of the inner tank is reached in step S3, the control unit A1 stops driving the pump 142. Therefore, it is possible to reliably prevent the liquid level of the processing liquid LQ from falling below the lower limit level LVL of the inner tank. In addition, when the processing liquid LQ is supplied to at least the inner tank metering level LVI in step S4, the control unit A1 drives the pump 142 to circulate the processing liquid LQ in the inner tank 110 through the circulation pipe 141. Therefore, it is possible to remove the air remaining in the circulation pipe 141. As an example, in this embodiment, when the liquid level of the processing liquid LQ in the inner tank 110 reaches the inner tank metering level LVI and the liquid level of the processing liquid LQ in the outer tank 120 reaches the outer tank metering level LVO, the control unit A1 drives the pump 142.

[0107] Therefore, in this embodiment, steps S3 and S4 can be performed either once or multiple times. When steps S3 and S4 are performed multiple times, it is possible to suppress air from entering the fresh liquid supply pipe 181 and the circulating liquid inlet component 131, and to more effectively remove the processed liquid LQ mixed with air, as well as the air remaining in the circulating pipe 141. Thus, it is possible to more effectively suppress air from mixing into the processed liquid LQ.

[0108] Here, the number of times each of processes S3 and S4 is executed is recorded as "N". That is, when processes S3 and S4 are grouped together, N groups are executed. "N" represents an integer greater than 1.

[0109] For example, when the volume of the treatment fluid LQ at the inner tank quantitative level LVI is set as "V1", the volume of the treatment fluid LQ at the outer tank quantitative level LVO is set as "V2", the capacity of the circulation piping 141 is set as "V3", and the volume of the treatment fluid LQ discharged from the inner tank 110 in process S3 is set as "V4", "N" can be determined by the following formula. Specifically, volume V4 represents the volume of the treatment fluid LQ from the inner tank quantitative level LVI to the inner tank lower limit level LVL. When "N" in the following formula has a decimal point, either the value obtained by rounding down below the decimal point can be set as the number of executions N, or the value obtained by rounding down below the decimal point can be set as the number of executions N.

[0110] N = (V1 + V2 + V3) / V4

[0111] According to this example, in process S2, state ST22 ( Figure 6 In this process, all the "treatment fluid LQ mixed with air" present in the inner tank 110, outer tank 120, and circulation piping 141 can be replaced with new treatment fluid LQ that suppresses air mixing.

[0112] In addition, in this embodiment, the control unit A1 can also control the dissolved oxygen meter 240 ( Figure 3 The control unit A1 obtains information indicating the dissolved oxygen concentration of the treatment solution LQ. Furthermore, the control unit A1 can determine the execution frequency N of each of steps S3 and S4 based on the dissolved oxygen concentration of the treatment solution LQ accumulated in the inner tank 110. In this case, the execution frequency N of each of steps S3 and S4 can be optimized based on the dissolved oxygen concentration of the treatment solution LQ. For example, the higher the dissolved oxygen concentration of the treatment solution LQ, the more times N of each of steps S3 and S4 are executed by the control unit A1. The execution frequency N of each of steps S3 and S4 can be 1 time or more than 2 times.

[0113] Next, refer to Figure 9 The method for replacing the treatment fluid is explained. Figure 9 This is a timing diagram showing the replacement sequence of the processing fluid LQ in the processing fluid replacement method of this embodiment. The horizontal axis represents time. Additionally, Figure 9 The example illustrates the case where the number of executions N = 2. Figure 9 In the process S1 to process S4, respectively represent Figures 5-8 Processes S1 to S4.

[0114] like Figure 9As shown, process S1 (first draining process) begins at time t1 and ends at time t2. Process S2 (first supplying process) begins at time t2 and ends at time t3. Then, process S3 (second draining process) begins at time t4 and ends at time t5. Next, process S4 (second supplying process) begins at time t5 and ends at time t6. Then, process S3 (second draining process) begins at time t7 and ends at time t8. Finally, process S4 (second supplying process) begins at time t8 and ends at time t9.

[0115] In addition, Figure 9 In the code, the liquid replacement in processes S1 and S2 is recorded as "complete liquid replacement". In addition, the liquid replacement in processes S3 and S4 is recorded as "partial liquid replacement".

[0116] Next, refer to Figure 2 , Figure 3 and Figures 10-12 The details of the substrate processing method of this embodiment will be described. Figure 10 This is a flowchart illustrating the substrate processing method of this embodiment.

[0117] like Figure 10 As shown, the substrate processing method includes steps S11 to S21. The substrate processing method is performed using a substrate processing apparatus 100.

[0118] like Figure 2 and Figure 10 As shown, firstly, in process S11, the control unit A1 controls the substrate holding unit 125 to immerse the substrate W in the processing solution LQ of the inner tank 110. As a result, the substrate holding unit 125 lowers the substrate W and immerses the substrate W in the processing solution LQ.

[0119] Next, in process S12, the substrate W is treated with processing liquid LQ in inner tank 110.

[0120] Next, in process S13, the control unit A1 controls the substrate holding unit 125 to lift the substrate W from the processing liquid LQ in the inner tank 110. As a result, the substrate holding unit 125 raises the substrate W and lifts it from the processing liquid LQ.

[0121] Next, in process S14, control unit A1 determines whether the replacement time for processing fluid LQ has arrived. In other words, control unit A1 determines whether the service life of processing fluid LQ has expired.

[0122] If it is determined in process S14 that the replacement time for the treatment fluid LQ has not arrived (No), return to process S11.

[0123] On the other hand, if it is determined in step S14 that the replacement time for the processing fluid LQ has arrived (yes), the process proceeds to step S15. In this case, processing proceeds to step S15 based on the condition that tank 170 becomes empty.

[0124] Next, as Figure 3 and Figure 10 As shown, in step S15, control unit A1 empties outer tank 120 by discharging processing liquid LQ from outer tank 120 to tank 170. Specifically, control unit A1 opens drain valve 162 and valve 148, and closes valves 147 and 152. Additionally, control unit A1 drives pump 142. As a result, processing liquid LQ is discharged from outer tank 120 to tank 170, emptying outer tank 120. Specifically, processing liquid LQ is discharged from outer tank 120 to tank 170 via first pipe 141a, second pipe 141b, and drain pipe 161. Furthermore, in step S15, control unit A1 closes valves 192, 233, 235, and supply valves 183 and 184.

[0125] Next, in step S16, control unit A1 empties inner tank 110 by discharging the treatment fluid LQ from inner tank 110 to tank 170. Specifically, control unit A1 opens drain valve 162 and valve 152, and closes valves 147 and 148. Additionally, control unit A1 continues to drive pump 142. As a result, treatment fluid LQ is discharged from inner tank 110 to tank 170, and inner tank 110 becomes empty. Specifically, treatment fluid LQ is discharged from inner tank 110 to tank 170 via inner tank drain pipe 151, second pipe 141b, and drain pipe 161. Furthermore, in step S16, control unit A1 closes valves 192, 233, 235, and supply valves 183 and 184.

[0126] Next, in step S17, control unit A1 empties circulation pipe 141 by discharging the processed liquid LQ from circulation pipe 141 to tank 170. Specifically, control unit A1 opens drain valve 162 and valves 147 and 148. Additionally, control unit A1 stops pump 142. As a result, the processed liquid LQ is discharged from circulation pipe 141 to tank 170 due to its own weight, and circulation pipe 141 becomes empty. Furthermore, in step S17, control unit A1 closes valves 152, 192, 233, 235 and supply valves 183 and 184.

[0127] Next, in process S18, control unit A1 uses cleaning water to clean the inner tank level sensor 210 and the outer tank level sensor 220. Specifically, control unit A1 cleans sensor tubes 211 and 221 by opening valves 233 and 235. Control unit A1 closes valves 233 and 235 after cleaning. (Details omitted.) Furthermore, in... Figure 10 In order to simplify the accompanying drawings, the processing corresponding to process S18 has been omitted.

[0128] Next, in process S19, control unit A1 uses cleaning water to clean the inner tank 110 and the outer tank 120. Specifically, control unit A1 cleans the inner tank 110 and the outer tank 120 by opening valve 192. Control unit A1 closes valve 192 after cleaning. Details omitted. Furthermore, in Figure 10 In order to simplify the accompanying drawings, the processing corresponding to process S19 has been omitted.

[0129] Next, in process S20, control unit A1 refills the processing fluid LQ into the inner tank 110 and the outer tank 120. In other words, control unit A1 replaces the old fluid in the inner tank 110 and the outer tank 120 with new fluid. Details will be described below.

[0130] Next, in step S21, the control unit A1 adjusts the temperature of the processing liquid LQ to the target value. Specifically, the control unit A1 adjusts the temperature of the processing liquid LQ to the target value by controlling the heater 143. After step S21, the process proceeds to step S11.

[0131] Furthermore, steps S14 to S20 implement the processing fluid replacement method of this embodiment.

[0132] Figure 11 and Figure 12 It means Figure 10 A flowchart detailing process S20. (See attached flowchart.) Figure 11 and Figure 12 As shown, Figure 10 Process S20 includes processes S201 to S214.

[0133] First, such as Figure 3 and Figure 11 As shown, in process S201, control unit A1 restarts the supply of processing fluid LQ to inner tank 110. Specifically, control unit A1 restarts the supply of processing fluid LQ to inner tank 110 by opening supply valve 183 and closing drain valves 162, 147, 148, 152, 192, 233, 235, and supply valve 184. Specifically, processing fluid LQ is supplied to inner tank 110 from new fluid supply pipe 181 and new fluid supply port 185. When inner tank 110 is full of processing fluid LQ, processing fluid LQ overflows from inner tank 110 and flows into outer tank 120.

[0134] Next, in process S202, the control unit A1 determines, based on the detection results of the outer tank level sensor 220, whether the level of the processing liquid LQ accumulated in the outer tank 120 has reached the outer tank quantitative level LVO. Figure 6 ).

[0135] If it is determined in process S202 that the liquid level of the treatment liquid LQ has not reached the quantitative level LVO of the outer tank (No), repeat the process of process S202 until the liquid level of the treatment liquid LQ reaches the quantitative level LVO of the outer tank.

[0136] On the other hand, if it is determined in process S202 that the liquid level of the processing liquid LQ has reached the quantitative level LVO of the outer tank, the processing proceeds to process S203.

[0137] Next, in process S203, control unit A1 drives pump 142. In this case, control unit A1 opens valves 147 and 148. As a result, the processing liquid LQ in the inner tank 110 is circulated through circulation piping 141.

[0138] Next, in process S204, the control unit A1 determines, based on the detection results of the external tank level sensor 220, whether the liquid level of the processing fluid LQ in the external tank 120 is stable at the external tank quantitative level LVO. Specifically, if the liquid level of the processing fluid LQ in the external tank 120 remains at the external tank quantitative level LVO for a specified period, the control unit A1 determines that the liquid level of the processing fluid LQ is stable at the external tank quantitative level LVO.

[0139] If, in step S204, it is determined that the level of the treatment fluid LQ is not stable at the external tank quantitative level LVO (No), the process of step S204 is repeated until the level of the treatment fluid LQ stabilizes at the external tank quantitative level LVO. For example, if the level of the external tank 120 drops due to the drive of pump 142 (circulation of treatment fluid LQ) in step S203, the control unit A1 adjusts the external tank 120 by replenishing treatment fluid LQ from the new fluid supply pipe 181 and the new fluid supply port 185 via the inner tank 110 to stabilize the level of the external tank 120 at the external tank quantitative level LVO.

[0140] On the other hand, if it is determined in process S204 that the liquid level of the processing liquid LQ is stable at the external tank quantitative level LVO (yes), the processing proceeds to process S205.

[0141] Next, in process S205, control unit A1 stops supplying processing fluid LQ to inner tank 110. Specifically, control unit A1 stops supplying processing fluid LQ to inner tank 110 by closing supply valve 183.

[0142] Next, in process S206, control unit A1 begins discharging the processed liquid LQ from inner tank 110 to tank 170, provided that the empty capacity of tank 170 is sufficient to hold the discharged liquid. In other words, discharge of processed liquid LQ from inner tank 110 to tank 170 begins when the empty capacity of tank 170 is sufficient to hold the processed liquid LQ from the inner tank quantitative level LVI to the inner tank lower limit level LVL. Specifically, control unit A1 begins discharging processed liquid LQ from inner tank 110 to tank 170 by closing valves 147 and 148 and opening drain valves 162 and 152. In this case, processed liquid LQ is discharged from inner tank 110 to tank 170 via inner tank drain pipe 151, second pipe 141b, and drain pipe 161. Furthermore, the circulation of processed liquid LQ stops when valve 147 is closed.

[0143] Next, in process S207, the control unit A1 determines whether the liquid level of the treatment liquid LQ in the inner tank 110 has reached the lower limit level LVL of the inner tank based on the detection result of the inner tank level sensor 210.

[0144] If, in step S207, it is determined that the level of the treatment fluid LQ has not reached the lower limit level (LVL) of the inner tank (No), the process of step S207 is repeated until the level of the treatment fluid LQ reaches the lower limit level (LVL) of the inner tank. That is, the treatment fluid LQ is continuously discharged from the inner tank 110 until the level of the treatment fluid LQ reaches the lower limit level (LVL) of the inner tank.

[0145] On the other hand, if it is determined in process S207 that the liquid level of the processing liquid LQ has reached the lower limit level LVL of the inner tank, the processing proceeds to process S208.

[0146] Next, in process S208, control unit A1 stops pump 142. As a result, the discharge of treatment liquid LQ from inner tank 110 to tank 170 stops. In addition, control unit A1 closes drain valve 162 and valve 152.

[0147] Next, in process S209, control unit A1 begins to resupply the processing fluid LQ to the inner tank 110. Specifically, control unit A1 begins to resupply the processing fluid LQ to the inner tank 110 by opening supply valve 183. Specifically, processing fluid LQ is supplied to the inner tank 110 from new fluid supply piping 181 and new fluid supply port 185.

[0148] Next, as Figure 3 and Figure 12 As shown, in process S210, the control unit A1 determines, based on the detection result of the inner tank level sensor 210, whether the liquid level of the processing liquid LQ accumulated in the inner tank 110 has reached the inner tank quantitative level LVI. Figure 8Additionally, based on the detection results of the external tank level sensor 220, the control unit A1 determines whether the level of the processing fluid LQ accumulated in the external tank 120 has reached the external tank quantitative level LVO. Figure 8 ).

[0149] If, in step S210, it is determined that the liquid level of the treatment fluid LQ in the inner tank 110 has not reached the inner tank quantitative level LVI (No), or if, in step S210, it is determined that the liquid level of the treatment fluid LQ in the outer tank 120 has not reached the outer tank quantitative level LVO (No), the process of step S210 is repeated until the liquid level of the treatment fluid LQ in the inner tank 110 reaches the inner tank quantitative level LVI and the liquid level of the treatment fluid LQ in the outer tank 120 reaches the outer tank quantitative level LVO.

[0150] On the other hand, if in process S210 it is determined that the liquid level of the processing liquid LQ in the inner tank 110 has reached the inner tank quantitative level LVI, and in process S210 it is determined that the liquid level of the processing liquid LQ in the outer tank 120 has reached the outer tank quantitative level LVO, then the process proceeds to process S211.

[0151] Next, in process S211, control unit A1 drives pump 142. In this case, control unit A1 opens valves 147 and 148. As a result, the processing liquid LQ in the inner tank 110 is circulated through circulation piping 141.

[0152] Next, in process S212, the control unit A1 determines, based on the detection results of the inner tank level sensor 210, whether the liquid level of the treatment fluid LQ in the inner tank 110 is stable at the inner tank quantitative level LVI. Specifically, if the liquid level of the treatment fluid LQ in the inner tank 110 remains at the inner tank quantitative level LVI for a specified period, the control unit A1 determines that the liquid level of the treatment fluid LQ is stable at the inner tank quantitative level LVI.

[0153] If it is determined in process S212 that the liquid level of the treatment fluid LQ is not stable at the inner tank quantitative level LVI (No), repeat the process of process S212 until the liquid level of the treatment fluid LQ is stable at the inner tank quantitative level LVI.

[0154] On the other hand, if it is determined in process S212 that the liquid level of the processing liquid LQ is stable at the inner tank quantitative level LVI (yes), the processing proceeds to process S213.

[0155] Next, in process S213, control unit A1 stops supplying processing fluid LQ to inner tank 110. Specifically, control unit A1 stops supplying processing fluid LQ to inner tank 110 by closing supply valve 183.

[0156] Next, in process S214, the control unit A1 determines whether processes S206 to S213 have been executed M times. M represents an integer greater than or equal to 1. For example, M can be determined based on experiments and / or experience. Figure 10 This represents the case where M=2.

[0157] If it is determined in process S214 that processes S206 to S213 have not been executed M times (no), the process proceeds to process S206.

[0158] On the other hand, if it is determined in process S214 that processes S206 to S213 have been executed M times (yes), then processing proceeds to... Figure 10 Process S21.

[0159] The above is for reference only. Figures 10-12 As explained, according to the substrate processing method of this embodiment, after all the processing liquid LQ in steps S15 to S19 is replaced, the processing liquid LQ is discharged in steps S206 and S207 until the lower limit level LVL of the inner tank is reached, and the processing liquid LQ is resupplying to the inner tank 110 in step S209. In particular, in steps S206 and S207, the fresh liquid supply port 185 and the circulating liquid inlet 132 are located below the liquid surface of the processing liquid LQ. Therefore, it is possible to prevent air from entering the fresh liquid supply pipe 181 from the fresh liquid supply port 185 and from entering the circulating liquid inlet 132. Figure 1 It enters the circulating fluid inlet component 131.

[0160] As a result, in step S209, air can be prevented from entering the fresh liquid supply pipe 181 and the circulating liquid inlet component 131, and the processing liquid LQ can be re-supplyed to the inner tank 110. Furthermore, in steps S206 and S207, air can be prevented from entering the fresh liquid supply pipe 181 and the circulating liquid inlet component 131, and in steps S201 to S205, the processing liquid LQ mixed with air can be discharged, and the air remaining in the circulating pipe 141 can be discharged. As a result, air mixing into the processing liquid LQ can be prevented. Therefore, the processing of the substrate W can be performed effectively.

[0161] Here, Figure 10 Steps S15 to S17 correspond to an example of the "first draining step" of the present invention. Furthermore, Figure 11 Steps S201 to S205 correspond to an example of the "first supply step" of the present invention. Furthermore, Figure 11 Steps S206 to S208 correspond to an example of the "second draining step" of the present invention. Furthermore, Figure 11 and Figure 12 Steps S209 to S213 correspond to an example of the "second supply step" of the present invention.

[0162] In addition, Figure 7 Process S3 and Figure 11 In process S206, the treatment liquid LQ is discharged only from the inner tank 110, and not from the outer tank 120. However, in Figure 7 Process S3 and Figure 11 In process S206, as long as the inlet 141x of the circulation pipe 141 is ( Figure 3 If the liquid is located within the treatment liquid LQ and does not protrude to the outside of the treatment liquid LQ, then in addition to being discharged from the inner tank 110, the treatment liquid LQ can also be discharged from the outer tank 120. In this case, the discharge time of the treatment liquid LQ can be shortened.

[0163] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the described embodiments and can be implemented in various forms without departing from its spirit. Furthermore, the various constituent elements disclosed in the embodiments can be appropriately modified. For example, a constituent element from all the constituent elements shown in one embodiment can be added to the constituent elements of other embodiments, or several constituent elements from all the constituent elements shown in one embodiment can be deleted from the embodiment.

[0164] Furthermore, the accompanying drawings are schematic representations of the core components for ease of understanding of the invention. There may be instances where the thickness, length, number, and spacing of the components shown in the drawings differ from the actual dimensions for ease of drawing. Also, the configuration of the components shown in the described embodiments is merely an example and is not particularly limited; various modifications can be made without substantially departing from the effects of the invention.

[0165] [Industrial Applicability]

[0166] This invention relates to a substrate processing method and a substrate processing apparatus, which are industrially applicable.

[0167] [Explanation of Symbols]

[0168] 100: Substrate processing apparatus

[0169] 110: Inner groove

[0170] 120: Outer groove

[0171] 131: Circulating fluid inlet component

[0172] 132: Circulating fluid inlet

[0173] 141: Circulation piping

[0174] 142: Pump

[0175] 161: Drainage piping

[0176] 162: Drain valve

[0177] 181: New fluid supply piping

[0178] 183: Supply valve

[0179] A1: Control Department

[0180] LVI: Inner tank quantitative level (upper limit level of the inner tank)

[0181] LVL: Lower limit of the inner groove level

[0182] LVO: External tank quantitative level (external tank upper limit level)

[0183] W: Substrate.

Claims

1. A substrate processing method comprising: supplying the processing liquid, which overflows from an inner tank containing the processing liquid, into an outer tank via a circulation pipe and a circulation inlet, thereby circulating the processing liquid stored in the inner tank; and using the processing liquid to process a substrate within the inner tank; the substrate processing method comprising: The first drainage process involves discharging the treated liquid from the inner tank, the outer tank, and the circulation piping. In the first supply process, after the treatment liquid is discharged in the first discharge process, the treatment liquid is re-supplied to the inner tank through the new liquid supply port, thereby allowing the treatment liquid to be re-accumulated in the inner tank. The second draining process involves, after resupplying the treatment fluid to the inner tank, draining the treatment fluid accumulated in the inner tank until it reaches the lower limit level of the inner tank; and In the second supply process, after the treatment liquid is discharged until the lower limit level of the inner tank is reached, the treatment liquid is re-supplyed to the inner tank through the new liquid supply port, thereby re-accumulating the treatment liquid in the inner tank. The lower limit level of the inner tank indicates a liquid level higher than the position of the circulating liquid inlet located inside the inner tank, and also indicates a liquid level higher than the position of the new liquid supply inlet located inside the inner tank.

2. The substrate processing method according to claim 1, wherein the second draining step and the second supply step are performed multiple times.

3. The substrate processing method according to claim 1 or 2, wherein the number of times the second draining step and the second supply step are performed is determined based on the dissolved oxygen concentration in the processing liquid stored in the inner tank.

4. The substrate processing method according to claim 1 or 2, wherein in the second draining step, the processing liquid accumulated in the outer tank is not drained.

5. The substrate processing method according to claim 1 or 2, wherein in the second draining step, when the processing liquid in the inner tank is drained until the lower limit level of the inner tank is reached, the pump being driven is stopped. In the second supply step, if the treatment liquid is supplied at least to the upper limit level of the inner tank, the treatment liquid in the inner tank is circulated through the circulation piping by driving the pump. The upper limit level of the inner tank indicates the liquid level in the inner tank that is higher than the lower limit level of the inner tank.

6. The substrate processing method according to claim 1 or 2, wherein the processing solution is alkaline.

7. A substrate processing apparatus comprising: Inner tank, for accumulating treatment fluid; An outer tank is disposed outside the inner tank and is used for the flow of the treatment liquid overflowing from the inner tank; The circulating fluid inlet component has a circulating fluid inlet, through which the processing fluid supplied from the outer tank is introduced into the inner tank; The circulating piping circulates the treatment fluid stored in the inner tank by supplying the treatment fluid from the outer tank to the circulating fluid inlet component. A drain pipe branches off from the circulation pipe and drains the treated liquid. The drain valve opens and closes the flow path of the drain pipe; A pump is disposed upstream of the circulation piping, and delivers the treatment liquid from the circulation piping. The new liquid supply piping has a new liquid supply port, and the treatment liquid is re-supplyed to the inner tank through the new liquid supply port; The supply valve opens and closes the flow path of the new liquid supply piping; and The control unit controls the drain valve, the pump, and the supply valve; The control unit The drain valve and the pump are controlled to discharge the treatment liquid from the inner tank, the outer tank, and the circulation piping. After the treatment fluid is discharged, the supply valve is controlled to resupply the treatment fluid to the inner tank. After the treatment fluid is resupplyed, the drain valve and the pump are controlled to drain the treatment fluid accumulated in the inner tank until the lower limit level of the inner tank is reached. After the treatment fluid has been drained down to the lower limit level of the inner tank, the supply valve is controlled to resupply the inner tank with treatment fluid. The lower limit level of the inner tank indicates a liquid level higher than the position of the circulating liquid inlet located inside the inner tank, and also indicates a liquid level higher than the position of the new liquid supply inlet located inside the inner tank.

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