Wafer transfer machine early pick-up prevention device

Abstract

The application discloses a wafer conveying machine early-taken prevention device, and relates to the technical field of wafer conveying machines.The device comprises a box body, a bearing table is arranged on the box body, and a positioning groove for positioning a wafer is arranged at the center end of the bearing table; wherein a positioning frame is arranged on one side of the bearing table in a relative manner, a guide groove is arranged on one side of the two positioning frames, a guide seat is slidably arranged in the guide groove, and a protective plate is fixedly arranged between the two guide seats; the protective plate is connected with a lifting mechanism arranged in the box body; in the wafer processing engineering, the wafer product is moved to the positioning groove by the wafer conveying machine for positioning; in order to avoid the staff from taking away the product in advance, in this process, the lifting mechanism is used to push the protective plate to slide towards the top of the box body to isolate the bearing table, so that the staff cannot take away the product; when the wafer conveying machine completes the processing, the lifting mechanism is used to drive the protective plate to reset and shrink into the box body, so that the staff can take away the product.

Description

Technical Field

[0001] This invention relates to the field of wafer transfer machine technology, and specifically to a wafer transfer machine anti-early pickup device. Background Technology

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits; its raw material is silicon. A wafer transfer machine is a device used to move circular wafers during the production process.

[0003] In existing technologies, when using a wafer transfer machine to transfer wafers, under normal circumstances, the products on the download table need to be returned normally, the machine will indicate that the operation is complete, and the operator will take the products away. However, operators often do not follow the requirements, do not check the machine status, and subconsciously take the products off the table in advance, which leads to abnormalities such as wafer breakage, scratches, and machine alarms. Summary of the Invention

[0004] The purpose of this invention is to provide a device for preventing premature pickup in a wafer transfer machine, thereby solving the following technical problems:

[0005] Operators who do not follow instructions, do not check the machine's condition, and subconsciously remove products from the platform in advance can cause abnormalities such as broken pieces, scratches, and machine alarms.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] A wafer transfer machine anti-early pickup device includes a housing, on which a support platform is provided, and a positioning groove for positioning wafers is provided at the center end of the support platform.

[0008] Among them, positioning frames are arranged opposite each other on one side of the support platform, and guide grooves are opened on the side of the two positioning frames that are close to each other. Guide seats are slidably arranged in the guide grooves, and protective plates are fixedly arranged between the two guide seats.

[0009] The protective plate is connected to the lifting mechanism installed in the box.

[0010] Preferably, the center end of the positioning groove is further provided with a circular groove, in which a disc is vertically embedded and connected to a lifting mechanism that drives its lifting.

[0011] Preferably, the lifting mechanism includes a first rack fixedly connected to the protective plate, the first rack meshing with a gear mechanism, and the gear mechanism being fixedly connected to the output end of a drive motor fixedly arranged in the housing.

[0012] Preferably, the lifting mechanism includes a support column fixedly connected to the disc, a support plate connected to the end of the support column, and the support plate fixedly connected to the second rack;

[0013] The second rack meshes with a gear mechanism.

[0014] Preferably, a number of adsorption holes are arranged in a circumferential array on the periphery of the circular groove, and each set of adsorption holes is connected to an annular air cavity arranged at the bottom of the support platform.

[0015] The annular air chamber is connected to the negative pressure mechanism.

[0016] Preferably, the negative pressure mechanism includes a negative pressure pipe communicating with the annular air chamber, and the other end of the negative pressure pipe is communicating with a cylinder arranged in the housing.

[0017] The cylinder is equipped with a gas plug, which forms a gas chamber with the upper wall of the cylinder. The gas plug is connected to an adjustment mechanism that drives it to slide in the cylinder. An exhaust pipe is installed on the other side of the gas chamber.

[0018] Preferably, the adjusting mechanism includes a push rod fixedly connected to the air plug, and a limiting plate fixedly connected to the end of the push rod;

[0019] The push rod is equipped with a return spring, one end of which is fixed to the limiting plate and the other end is fixed to the cylinder.

[0020] Preferably, the adjustment mechanism further includes a lever, with a limiting seat fixedly connected perpendicularly to one side of the lever;

[0021] The limiting seat is fixed to the positioning rod, a through groove is opened on one side of the positioning frame, and the guide seat is slidably connected to the positioning rod through an L-shaped bracket.

[0022] Preferably, a telescopic spring is provided on the positioning rod, one end of which is fixed to the L-shaped bracket and the other end is fixed to the limiting seat. An arc-shaped end is provided at the end of the positioning rod, and an arc-shaped part is provided above the positioning frame.

[0023] Preferably, a first electrode plate is provided on the first rack, and a second electrode plate is correspondingly arranged at the bottom of the support platform;

[0024] LED strips are installed on the protective plate.

[0025] The beneficial effects of this invention are:

[0026] (1) In the wafer product of the present invention, during the processing process, the wafer transfer machine is used to transfer the wafer to the positioning slot for positioning. In order to prevent the staff from taking the product away in advance, during this process, the lifting mechanism pushes the protective plate to slide towards the top of the box to isolate the support platform so that the staff cannot take the product away. After the wafer transfer machine finishes processing, the lifting mechanism drives the protective plate to reset and retract into the box so that the staff can take the product away.

[0027] (2) When the wafer product of the present invention is located in the positioning groove, in order to improve its stability in the positioning groove and avoid its displacement from affecting the processing accuracy of the wafer transfer machine, a negative pressure is generated in the annular air cavity by a negative pressure mechanism, so that the product is adsorbed into the positioning groove through the adsorption hole under the action of negative pressure, so as to improve the processing stability. Attached Figure Description

[0028] The invention will now be further described with reference to the accompanying drawings.

[0029] Figure 1 This is a schematic diagram of the structure of the wafer transfer machine anti-early pickup device of the present invention;

[0030] Figure 2 This is a schematic diagram of the lifting mechanism in the wafer transfer machine anti-early pickup device of the present invention;

[0031] Figure 3 This is a schematic diagram of the lifting mechanism in the wafer transfer machine anti-early pickup device of the present invention;

[0032] Figure 4 This is a schematic diagram of the annular air cavity in the wafer transfer machine anti-early pickup device of the present invention;

[0033] Figure 5 This is a schematic diagram of the disk structure in the wafer transfer machine anti-early pickup device of the present invention;

[0034] Figure 6 yes Figure 2 A schematic diagram of the structure of the intermediate amplifier section;

[0035] Figure 7 This is a schematic diagram of the cylinder structure in the wafer transfer machine anti-early pickup device of the present invention.

[0036] In the diagram: 1. Box body; 2. Support platform; 3. Protective plate; 4. Disc; 5. Cylinder; 6. Negative pressure pipe; 7. Arc-shaped part; 8. Second rack; 101. Through groove; 102. Positioning frame; 103. Guide groove; 104. Guide seat; 201. Positioning groove; 202. Adsorption hole; 203. Circular groove; 301. Light strip; 302. Second electrode plate; 501. Air inlet pipe; 502. Exhaust pipe; 503. Limiting plate; 504. Push rod; 505. Return spring; 601. Annular air chamber; 701. L-shaped bracket; 702. Positioning rod; 703. Telescopic spring; 704. Paddle plate; 705. Limiting seat; 706. Arc-shaped end; 801. Gear mechanism; 802. First rack; 803. Support plate; 804. Support column; 805. Drive motor. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] Example 1

[0039] Please see Figures 1-2 As shown, the present invention is a wafer transfer machine anti-early pickup device, including a housing 1, on which a support platform 2 is arranged, wherein a positioning groove 201 for positioning wafers is opened at the center end of the support platform 2; in this embodiment, by opening the positioning groove 201 in the support platform 2 to position the product, the product will not deviate or fall off the support platform 2 during the wafer transfer machine processing, thus achieving higher stability.

[0040] Positioning frames 102 are arranged opposite each other on one side of the support platform 2. Guide grooves 103 are opened on the side of the two positioning frames 102 that are close to each other. Guide seats 104 are slidably arranged in the guide grooves 103. Protective plates 3 are fixedly arranged between the two guide seats 104. In one embodiment of this example, the protective plate 3 is made of acrylic sheet.

[0041] The protective plate 3 is connected to the lifting mechanism installed in the housing 1. It can be explained that during the wafer processing, the wafer is transferred to the positioning slot 201 for positioning by the wafer transfer machine. In order to prevent the staff from taking the product away in advance, the lifting mechanism pushes the protective plate 3 to slide upward towards the housing 1 to isolate the support platform 2, so that the staff cannot take the product away. After the wafer transfer machine finishes processing, the lifting mechanism drives the protective plate 3 to reset and retract into the housing 1 so that the staff can take the product away.

[0042] Specifically, in this embodiment, the protective plate 3 is guided by the arrangement of guide grooves 103 and guide seats 104, which makes the transfer of the protective plate 3 more stable. At the same time, the protective plate 3 adopts a pressure plate so that the staff can observe the wafer in real time and ensure the processing stability of the wafer transfer machine.

[0043] Example 2

[0044] Based on Embodiment 1, a circular groove 203 is also provided at the center end of the positioning groove 201. A disc 4 is vertically embedded in the circular groove 203, and the disc 4 is connected to a lifting mechanism that drives its lifting. It can be explained that after the wafer product is processed by the wafer transfer machine in the positioning groove 201, it is stored in the positioning groove 201 along with the protective plate 3. In order to facilitate the removal of the product by the staff, this embodiment sets up a lifting mechanism to lift the product placed in the positioning groove 201 to a certain height for easy retrieval.

[0045] Please see Figures 3-4 The lifting mechanism includes a first rack 802 fixedly connected to the protective plate 3. The first rack 802 meshes with a gear mechanism 801. The gear mechanism 801 is fixedly connected to the output end of a drive motor 805 fixedly arranged in the housing 1. It can be explained that when the protective plate 3 is driven to lift, the drive motor 805 is started to drive the gear mechanism 801 to rotate. The gear mechanism 801 drives the protective plate 3 to lift by meshing with the first rack 802.

[0046] The lifting mechanism includes a support column 804 fixedly connected to the disc 4, and a support plate 803 connected to the end of the support column 804. The support plate 803 is fixedly connected to the second rack 8, wherein the second rack 8 meshes with the gear mechanism 801. It can be explained that the gear mechanism 801 drives the second rack 8 to rise and fall synchronously during rotation, and the second rack 8 drives the disc 4 to rise and fall synchronously through the support plate 803 and the support column 804.

[0047] In this embodiment, the first rack 802 and the second rack 8 are arranged in parallel and staggered, and both mesh synchronously with the gear mechanism 801. Specifically, in this embodiment, by arranging the first rack 802 and the second rack 8 in parallel and staggered, the gear mechanism 801 drives both racks to move in opposite directions synchronously during rotation.

[0048] It should be noted that when the gear mechanism 801 drives the first rack 802 to rise, the first rack 802 drives the protective plate 3 to rise to a certain height to isolate the support platform 2. At this time, the gear mechanism 801 drives the second rack 8 to fall, so that the disc 4 can retract into the circular groove 203 for processing by the transfer machine. When the transfer machine finishes processing and the product needs to be picked up, the gear mechanism 801 drives the first rack 802 to fall. Similarly, the gear mechanism 801 drives the disc 4 to rise through the second rack 8, lifting the product to a certain height away from the support platform 2. It can be seen that this embodiment uses a synchronous drive to drive the protective plate 3 and the disc 4 to rise and fall, which has a high degree of automation.

[0049] As a further embodiment, several sets of adsorption holes 202 are arranged in a circumferential array around the periphery of the circular groove 203. Each set of adsorption holes 202 is connected to an annular air cavity 601 arranged at the bottom of the support platform 2. The annular air cavity 601 is connected to a negative pressure mechanism. It can be explained that when the wafer product is located in the positioning groove 201, in order to improve its stability in the positioning groove 201 and avoid its displacement from affecting the processing accuracy of the wafer transfer machine, this embodiment generates negative pressure in the annular air cavity 601 through the negative pressure mechanism. Under the action of negative pressure, the product is adsorbed into the positioning groove 201 through the adsorption holes 202 to improve processing stability.

[0050] Please see Figures 5-7 The negative pressure mechanism includes a negative pressure pipe 6 connected to an annular air chamber 601. The other end of the negative pressure pipe 6 is connected to a cylinder 5 installed in the housing 1. A gas plug is installed in the cylinder 5. The gas plug and the upper wall of the cylinder 5 form an air chamber. The gas plug is connected to an adjustment mechanism that drives it to slide in the cylinder 5. A one-way valve for air intake is installed between the negative pressure pipe 6 and the air chamber. An exhaust pipe 502 is installed on the other side of the air chamber. A one-way valve for exhaust is installed between the exhaust pipe 502 and the air chamber. An air intake pipe 501 is connected to the cavity enclosed by the gas plug and the lower wall of the cylinder 5.

[0051] It can be explained that when the product is in the positioning groove 201, the adjustment mechanism drives the air plug to move towards the bottom in the cylinder 5. At this time, during the movement, the air plug generates negative pressure in the annular air chamber 601 through the negative pressure pipe 6, so as to adsorb the product through the adsorption hole 202.

[0052] The adjustment mechanism includes a push rod 504 fixedly connected to the air plug, and a limiting plate 503 fixedly connected to the end of the push rod 504. A return spring 505 is arranged on the push rod 504. One end of the return spring 505 is fixed to the limiting plate 503, and the other end is fixed to the cylinder 5.

[0053] The adjustment mechanism also includes a lever 704, with a limiting seat 705 fixedly connected perpendicularly to one side of the lever 704. The limiting seat 705 is fixed to the positioning rod 702. A through slot 101 is opened on one side of the positioning frame 102. The guide seat 104 is slidably connected to the positioning rod 702 through an L-shaped bracket 701. It can be explained that during the process of driving the protective plate 3 to extend upward, the guide seat 104 drives the limiting seat 705 and the lever 704 to rise and fall through the L-shaped bracket 701 and the positioning rod 702.

[0054] In this embodiment, a telescopic spring 703 is arranged on the positioning rod 702. One end of the telescopic spring 703 is fixed to the L-shaped bracket 701, and the other end is fixed to the limiting seat 705. An arc-shaped end 706 is provided at the end of the positioning rod 702. An arc-shaped part 7 is arranged above the positioning frame 102. The distance between the outer end face of the arc-shaped part 7 and the positioning frame 102 gradually increases and then decreases.

[0055] It can be explained that the guide seat 104 drives the L-shaped bracket 701 to move upward in three stages:

[0056] First stage: Positioning rod 702 is located below arc-shaped part 7, arc-shaped end 706 is not in contact with arc-shaped part 7, and at the same time, the lever 704 and the limiting plate 503 are in a misaligned and separated state;

[0057] Second stage: As the guide seat 104 continues to drive the L-shaped bracket 701 to rise, the positioning rod 702 is pushed towards the limiting plate 503 by the abutment action of the arc-shaped part 7. The telescopic spring 703 is stretched synchronously, which causes the lever 704 to move below the limiting plate 503. As the L-shaped bracket 701 continues to rise, the lever 704 drives the limiting plate 503 to rise synchronously. The limiting plate 503 drives the air plug in the cylinder 5 to rise through the push rod 504, and discharges the gas in the cavity through the exhaust pipe 502. At this time, the return spring 505 is stretched synchronously.

[0058] Third stage: When the L-shaped bracket 701 is moved to the maximum distance between the outer end face of the arc-shaped part 7 and the positioning frame 102, the moving plate 704 moves to the maximum distance towards the limiting plate 503. As the L-shaped bracket 701 continues to rise, the telescopic spring 703 drives the positioning rod 702 to gradually return to its original position, always maintaining the arc-shaped end 706 sliding against the arc-shaped part 7. Finally, when the moving plate 704 is once again in a misaligned separation state from the limiting plate 503, the limiting plate 503 is driven to return to its original position and retract under the pulling force of the return spring 505. The limiting plate 503 carries the air plug to the cylinder 5 through the push rod 504 and moves towards the bottom. At this time, the air chamber generates negative pressure at the annular air chamber 601 through the negative pressure pipe 6, realizing the adsorption of the product.

[0059] Furthermore, a first electrode plate is provided on the first rack 802, and a second electrode plate 302 is correspondingly arranged at the bottom of the support platform 2. A light strip 301 is arranged on the protective plate 3. Specifically, the light strip 301 is composed of several sets of LED beads. It can be explained that when the protective plate 3 rises to its maximum height, the first electrode plate and the second electrode plate 302 come into contact, generating an electrical signal, which in turn supplies power to the light strip 301, causing it to emit light and form a warning light to remind the operator to avoid picking up the product.

[0060] The working principle of this invention: During the processing, the wafer is transferred to the positioning groove 201 for positioning by the wafer transfer machine. The negative pressure mechanism generates negative pressure in the annular air cavity 601, so that the product is adsorbed into the positioning groove 201 through the adsorption hole 202 under the action of negative pressure.

[0061] During this process, the drive motor 805 is started to drive the gear mechanism 801 to rotate. The gear mechanism 801 meshes with the first rack 802 to drive the protective plate 3 to rise and fall, pushing the protective plate 3 to slide upward toward the box 1 to isolate the support platform 2, so that the staff cannot take away the product.

[0062] After the transfer machine finishes processing, the lifting mechanism drives the protective plate 3 to retract into the housing 1. When the gear mechanism 801 drives the first rack 802 to rise, the first rack 802 drives the protective plate 3 to rise to a certain height to isolate the support platform 2. At this time, the gear mechanism 801 drives the second rack 8 to descend, so that the disc 4 can retract into the circular groove 203 for transfer machine processing. When the transfer machine finishes processing and the product needs to be picked up, the gear mechanism 801 drives the first rack 802 to descend. Similarly, the gear mechanism 801 drives the disc 4 to rise through the second rack 8, lifting the product to a certain height away from the support platform 2.

[0063] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0064] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0065] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A wafer transfer machine anti-early pickup device, comprising a housing (1), wherein a support platform (2) is provided on the housing (1), characterized in that, The center end of the support platform (2) is provided with a positioning groove (201) for positioning the wafer. Among them, the positioning frame (102) is arranged opposite to one side of the bearing platform (2), and the two positioning frames (102) are opened on the side close to each other. The guide seat (104) is slidably arranged in the guide groove (103), and the protective plate (3) is fixedly arranged between the two guide seats (104). The protective plate (3) is connected to the lifting mechanism installed in the box (1); the center end of the positioning groove (201) is also provided with a circular groove (203), and a disc (4) is installed in the circular groove (203) and is connected to the lifting mechanism that drives it to rise and fall. The lifting mechanism includes a first rack (802) fixedly connected to the protective plate (3), the first rack (802) meshing with the gear mechanism (801), and the gear mechanism (801) fixedly connected to the output end of the drive motor (805) fixedly arranged in the housing (1); The lifting mechanism includes a support column (804) fixedly connected to the disc (4), a support plate (803) connected to the end of the support column (804), and the support plate (803) fixedly connected to the second rack (8); the second rack (8) meshes with the gear mechanism (801); A number of adsorption holes (202) are arranged in a circumferential array on the periphery of the circular groove (203). Each set of adsorption holes (202) is connected to an annular air cavity (601) arranged at the bottom of the support platform (2). The annular air cavity (601) is connected to a negative pressure mechanism. The negative pressure mechanism includes a negative pressure pipe (6) connected to an annular air chamber (601), and the other end of the negative pressure pipe (6) is connected to a cylinder (5) arranged in the housing (1); an air plug is arranged in the cylinder (5), and the air plug and the upper wall of the cylinder (5) form an air chamber. The air plug is connected to an adjustment mechanism that drives it to slide in the cylinder (5), and an exhaust pipe (502) is arranged on the other side of the air chamber. A first electrode plate is provided on the first rack (802), and a second electrode plate (302) is correspondingly arranged at the bottom of the support platform (2); a light strip (301) is arranged on the protective plate (3); The adjustment mechanism includes a push rod (504) fixedly connected to the air plug, and a limiting plate (503) fixedly connected to the end of the push rod (504); a return spring (505) is arranged on the push rod (504), one end of the return spring (505) is fixed to the limiting plate (503), and the other end is fixed to the cylinder (5); The adjustment mechanism also includes a lever (704), and a limiting seat (705) is fixedly connected to one side of the lever (704) perpendicularly; the limiting seat (705) is fixed to the positioning rod (702), and a through groove (101) is opened on one side of the positioning frame (102); the guide seat (104) is slidably connected to the positioning rod (702) through the L-shaped bracket (701); A telescopic spring (703) is installed on the positioning rod (702). One end of the telescopic spring (703) is fixed to the L-shaped bracket (701), and the other end is fixed to the limiting seat (705). An arc-shaped end (706) is provided at the end of the positioning rod (702), and an arc-shaped part (7) is provided above the positioning frame (102).

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