An antenna

Abstract

The application discloses an antenna, comprising a plurality of radiation units, at least two adjacent radiation units are provided with a decoupling structure correspondingly, the decoupling structure comprises two microstrip line units, the microstrip line unit comprises at least one microstrip line, and the two microstrip line units are respectively located on the opposite sides of the two radiation units along the direction perpendicular to the arrangement direction of the two adjacent radiation units.The antenna provided by the embodiment of the application is provided with the decoupling structure composed of the microstrip line on the two sides of the at least two adjacent radiation units, so as to form an indirect coupling field through the decoupling structure, the direct coupling field between the adjacent radiation units is offset by the indirect coupling field, the mutual coupling between the adjacent radiation units is reduced, the isolation between the adjacent radiation units is improved, and the problem that the adjacent radiation units of the antenna with closely arranged radiation units have strong mutual coupling is solved.

Description

Technical Field

[0001] This invention relates to the field of communication technology, and more particularly to an antenna. Background Technology

[0002] With the gradual evolution of communication systems, antennas have been used more and more widely. Taking phased array antennas as an example, in related technologies, phased array antennas include multiple radiating elements. Multiple radiating elements can radiate the phase-shifted radio frequency signal to form a beam with a main lobe direction.

[0003] In related technologies, radiating elements are typically deployed on the same side of a substrate using metal film deposition technology. With the increasing demand for antenna miniaturization, multiple radiating elements need to be densely arranged on a smaller substrate without compromising antenna performance or radiation efficiency. The mutual coupling between these radiating elements can negatively impact the performance of multi-radiating-element antenna systems, such as radiation pattern distortion, degraded radiation performance, changes in input and radiation impedance, and reduced antenna radiation efficiency. Therefore, reducing the mutual coupling effect between radiating elements and improving their isolation are crucial issues that urgently need to be addressed as antenna integration and miniaturization progress. Summary of the Invention

[0004] This invention provides an antenna to reduce the mutual coupling effect between radiating elements and improve the isolation between radiating elements.

[0005] The present invention provides an antenna, comprising a first substrate, a plurality of radiating elements and at least one decoupling structure, wherein the plurality of radiating elements are arranged in an array on one side of the first substrate;

[0006] At least two adjacent radiation units constitute a radiation unit group, and the radiation unit group includes a first radiation unit and a second radiation unit arranged adjacent to each other.

[0007] The decoupling structure is configured correspondingly to the radiating unit group, and the decoupling structure includes two microstrip line units, each of which includes at least one microstrip line.

[0008] The first radiating element and the second radiating element are disposed in the same layer and arranged along the first direction;

[0009] Along the second direction, the two microstrip line units are located on opposite sides of the radiating unit group, and the vertical projections of the two microstrip line units on the first substrate are symmetrically arranged about the center point of the vertical projection of the radiating unit group on the first substrate.

[0010] The second direction intersects with the first direction.

[0011] The antenna provided in this invention features a decoupling structure composed of microstrip lines on both sides of at least two adjacent radiating elements. When any one of the radiating elements is operational, a parasitic electric field is generated on the decoupling structure. This parasitic electric field couples onto the other radiating element to form a compensating electric field, thus canceling the coupling electric field formed by the direct coupling of the operational radiating element onto that element. This reduces the mutual coupling between adjacent radiating elements, improves the isolation between them, and solves the problem of strong mutual coupling between adjacent radiating elements in antennas with closely spaced radiating elements, which is beneficial for improving the antenna's integration. Simultaneously, the parasitic electric field on the decoupling structure also couples onto the operational radiating element to form a positive electric field enhancement, thereby enhancing the native electric field on the operational radiating element and improving the antenna's radiation efficiency. Furthermore, the decoupling structure is composed of microstrip lines, has a simple structure, and can be directly fabricated using mature panel technology, making it easy to implement.

[0012] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of an antenna in related technologies;

[0015] Figure 2 for Figure 1 A schematic diagram of the electric field distribution of a medium-sized antenna;

[0016] Figure 3 for Figure 1 A schematic diagram of the electric field intensity distribution of a medium-sized antenna;

[0017] Figure 4 This is a schematic diagram of another antenna structure in related technologies;

[0018] Figure 5 This is a schematic diagram of an antenna structure provided in an embodiment of the present invention;

[0019] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure along the A-A' direction;

[0020] Figure 7This is a schematic diagram of the mutual coupling electric field of an antenna in related technologies;

[0021] Figure 8 This is a schematic diagram of the mutual coupling electric field of an antenna provided in an embodiment of the present invention;

[0022] Figure 9 A schematic diagram of the electric field intensity distribution of an antenna provided in an embodiment of the present invention;

[0023] Figure 10 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0024] Figure 11 for Figure 10 A schematic diagram of the cross-sectional structure along the B-B' direction;

[0025] Figure 12 A schematic diagram of the mutual coupling electric field of another antenna provided in an embodiment of the present invention;

[0026] Figure 13 A schematic diagram of the simulation results of an antenna provided in an embodiment of the present invention;

[0027] Figure 14 A schematic diagram of simulation results for another antenna provided in an embodiment of the present invention;

[0028] Figure 15 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0029] Figure 16 for Figure 15 A schematic diagram of the cross-sectional structure along the C-C' direction;

[0030] Figure 17 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0031] Figure 18 for Figure 17 A schematic diagram of the cross-sectional structure along the D-D' direction;

[0032] Figure 19 A schematic diagram of the cross-sectional structure of an antenna provided in an embodiment of the present invention;

[0033] Figure 20 A schematic diagram of the cross-sectional structure of another antenna provided in an embodiment of the present invention;

[0034] Figure 21 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0035] Figure 22 for Figure 21 Schematic diagram of the cross-sectional structure along the E-E' direction;

[0036] Figure 23 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0037] Figure 24 for Figure 23 Schematic diagram of the cross-sectional structure along the F-F' direction;

[0038] Figure 25 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0039] Figure 26 for Figure 25 Schematic diagram of the cross-sectional structure along the G-G' direction;

[0040] Figure 27 A schematic diagram of the cross-sectional structure of another antenna provided in an embodiment of the present invention;

[0041] Figure 28 A schematic diagram of the cross-sectional structure of another antenna provided in an embodiment of the present invention;

[0042] Figure 29 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0043] Figure 30 for Figure 29 A schematic diagram of the cross-sectional structure along the H-H' direction;

[0044] Figure 31 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0045] Figure 32 for Figure 31 A schematic diagram of the cross-sectional structure along the I-I' direction;

[0046] Figure 33 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0047] Figure 34 for Figure 33 A schematic diagram of the cross-sectional structure along the J-J' direction;

[0048] Figure 35 A schematic diagram of simulation results for another antenna provided in an embodiment of the present invention;

[0049] Figure 36 A schematic diagram of simulation results for another antenna provided in an embodiment of the present invention;

[0050] Figure 37 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0051] Figure 38 for Figure 37Schematic diagram of the cross-sectional structure along the K-K' direction;

[0052] Figure 39 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0053] Figure 40 for Figure 39 A schematic diagram of the cross-sectional structure along the L-L' direction;

[0054] Figure 41 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0055] Figure 42 for Figure 41 Schematic diagram of the cross-sectional structure along the M-M' direction;

[0056] Figure 43 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0057] Figure 44 for Figure 43 A schematic diagram of the cross-sectional structure along the N-N' direction;

[0058] Figure 45 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0059] Figure 46 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention;

[0060] Figure 47 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Detailed Implementation

[0061] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0062] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0063] Traditional antennas with multiple radiating elements typically have low integration and a loose structure. The spacing between adjacent radiating elements is set to be greater than or equal to 0.5λ (where λ is the operating wavelength), and must be less than the maximum wavelength at which grating lobes appear. That is, the spacing d between adjacent radiating elements must satisfy d < λ / (1 + sinθ), where θ is the maximum designed scanning angle. Taking an antenna with an operating wavelength of 6 GHz as an example, a spacing greater than or equal to 0.5λ (~25 mm) between adjacent radiating elements can ensure that the isolation between adjacent radiating elements meets the antenna performance requirements.

[0064] As antenna integration and miniaturization increase, the spacing between adjacent radiating elements needs to be significantly reduced.

[0065] Figure 1 This is a schematic diagram of the structure of an antenna in related technologies. Figure 2 for Figure 1 A schematic diagram of the electric field distribution of a medium-sized antenna. Figure 3 for Figure 1 A schematic diagram of the electric field intensity distribution of a medium-sized antenna.

[0066] like Figure 1 As shown, the antenna includes radiating element 1 and radiating element 2 arranged adjacent to each other.

[0067] The inventors discovered that when the distance between radiating element 1 and radiating element 2 is reduced to less than 0.5λ, when radiating element 1 is working while radiating element 2 is not working (i.e., only radiating element 1 is being fed), radiating element 1 radiates radio frequency signals outward. At this time, the electric field formed by the antenna can be... Figure 2 The distribution of electric field lines 3 can be represented by the distribution of electric field intensity, which can be expressed by... Figure 3 The grayscale distribution in the image is represented as follows, where... Figure 3 In this context, the stronger the electric field, the darker the grayscale color.

[0068] Depend on Figure 2 Distribution of electric field line 3 and Figure 3 The electric field intensity distribution shows that when the distance between radiating element 1 and radiating element 2 is less than 0.5λ, feeding radiating element 1 will create a large coupled electric field on radiating element 2. Similarly, feeding radiating element 2 will also create a large coupled electric field on radiating element 1. This mutual coupling between radiating elements will have many negative effects on the performance of antennas with multiple radiating elements, such as radiation pattern distortion, deterioration of radiation performance, changes in input impedance and radiation impedance, and reduced antenna radiation efficiency. Therefore, improving the isolation between radiating elements is an urgent problem to be solved in highly integrated antennas.

[0069] Figure 4 This is a schematic diagram of another antenna structure in related technologies, such as... Figure 4 As shown, the inventors further discovered that in order to reduce the mutual coupling effect between radiating element 1 and radiating element 2 and improve the isolation between radiating element 1 and radiating element 2, a vertical barrier 4 can be inserted between radiating element 1 and radiating element 2. However, the vertical barrier 4 requires a large space between radiating element 1 and radiating element 2, which is not conducive to the high integration and miniaturization design of the antenna. At the same time, the vertical barrier 4 also presents significant challenges in the manufacturing and packaging processes.

[0070] Based on the above-mentioned technical problems, embodiments of the present invention provide an antenna, including a first substrate, a plurality of radiating elements and at least one decoupling structure. The plurality of radiating elements are arranged in an array on one side of the first substrate. At least two adjacent radiating elements constitute a radiating element group. The radiating element group includes a first radiating element and a second radiating element arranged adjacently. The decoupling structure is arranged correspondingly to the radiating element group. The decoupling structure includes two microstrip line elements. The microstrip line elements include at least one microstrip line. The first radiating element and the second radiating element are arranged in the same layer and along a first direction. Along a second direction, the two microstrip line elements are located on opposite sides of the radiating element group, and the vertical projections of the two microstrip line elements on the first substrate are symmetrically arranged about the center point of the vertical projection of the radiating element group on the first substrate. The second direction intersects the first direction.

[0071] By employing the above technical solution, when any one of the radiating elements is operational, a parasitic electric field can be formed on the decoupling structure. This parasitic electric field couples onto another radiating element to form a compensating electric field, thus canceling the coupling electric field formed by the operational radiating element on that element. This reduces the mutual coupling between adjacent radiating elements, improves the isolation between them, and solves the problem of strong mutual coupling between closely spaced radiating elements in antennas, which is beneficial for improving antenna integration. Simultaneously, the parasitic electric field on the decoupling structure also couples onto the operational radiating element to form a positive electric field enhancement, thereby strengthening the native electric field on the operational radiating element and improving the antenna's radiation efficiency. Furthermore, the decoupling structure is composed of microstrip lines, has a simple structure, and can be directly fabricated using mature panel technology, making it easy to implement.

[0072] The above is the core idea of ​​this invention. The technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0073] Figure 5 This is a schematic diagram of an antenna structure provided in an embodiment of the present invention. Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure along the A-A' direction, as shown below. Figure 5 and Figure 6 As shown, the antenna provided in this embodiment of the invention includes a first substrate 10, a plurality of radiating elements 11, and at least one decoupling structure 12. The plurality of radiating elements 11 are arranged in an array on one side of the first substrate 10. At least two adjacent radiating elements 11 constitute a radiating element group 20, which includes adjacent first radiating elements 111 and second radiating elements 112. The decoupling structure 12 is correspondingly arranged with the radiating element group 20 and includes two microstrip line elements 120, each including at least one microstrip line 13. The first radiating elements 111 and the second radiating elements 112 are arranged in the same layer and along a first direction X. Along a second direction Y, the two microstrip line elements 120 are located on opposite sides of the radiating element group 20, and the vertical projections of the two microstrip line elements 120 on the first substrate 10 are symmetrically arranged about the center point O of the vertical projection of the radiating element group 20 on the first substrate 10. The second direction Y intersects the first direction X.

[0074] Specifically, such as Figure 5 and Figure 6As shown, the radiating unit 11 is used for transmitting and receiving signals, and the first substrate 10 is used to support the radiating unit 11. At least two radiating units 11 are disposed on the first substrate 10, and the at least two radiating units 11 can be located in the same film layer and arranged in an array.

[0075] When the antenna is working, different signals can be transmitted to different radiating elements 11 to enable multiple radiating elements 11 to independently transmit and receive signals. For example, signals of different frequencies can be transmitted to different radiating elements 11 to achieve multi-band communication. Different radiating elements 11 can work individually, simultaneously, or alternately to meet various functional requirements of the antenna; this embodiment of the invention does not impose specific limitations on this.

[0076] Furthermore, the first substrate 10 can be made of a material with a low dielectric constant (Dk) and low dielectric loss (DF). The lower the dielectric constant of the first substrate 10, the lower the dielectric loss to the radio frequency (RF) signal. Similarly, the lower the dielectric loss of the first substrate 10, the lower the dielectric loss to the RF signal. For example, the dielectric constant of the first substrate 10 can satisfy Dk ≤ 5, and the dielectric loss can satisfy DF ≤ 0.07, so that the first substrate 10 has low dielectric loss to the RF signal, which is beneficial to improving the radiation efficiency of the antenna.

[0077] Based on the above requirements for the dielectric constant and dielectric loss of the first substrate 10, the first substrate 10 can be selected as a glass substrate or a printed circuit board (PCB) to enable the antenna to have high radiation efficiency.

[0078] Furthermore, the thinner the first substrate 10, the lower the dielectric loss of the radio frequency signal on the first substrate 10. In this embodiment, the thickness h of the first substrate 10 can be set to satisfy 0.3mm ≤ h ≤ 1.1mm. Using a thinner first substrate 10 can reduce the dielectric loss of the radio frequency signal and improve the radiation efficiency of the antenna. It is understood that within the above thickness range, selecting a first substrate 10 of 0.3mm can achieve lower dielectric loss. However, if the first substrate 10 is further thinned, it is prone to damage, which is detrimental to the support performance of the first substrate 10.

[0079] Furthermore, any two adjacent radiating units 11 can form a radiating unit group 20, for example, such as Figure 5 and Figure 6 As shown, the radiation unit group 20 can be composed of a first radiation unit 111 and a second radiation unit 112 arranged adjacent to each other.

[0080] As mentioned above, when the distance between the first radiating element 111 and the second radiating element 112 is small, the first radiating element 111 and the second radiating element 112 will couple with each other, causing problems such as radiation pattern distortion, deterioration of radiation performance, changes in input impedance and radiation impedance, and reduction of antenna radiation efficiency.

[0081] Specifically, Figure 7 This is a schematic diagram of the mutual coupling electric field polarity of an antenna in related technologies, such as... Figure 7 As shown, when the first radiation unit 111 and the second radiation unit 112 are not provided with corresponding decoupling structures, there is only a direct coupling field between the first radiation unit 111 and the second radiation unit 112, and no other coupling fields exist. For example, when only the first radiation unit 111 is fed, the coupling electric field generated directly by the first radiation unit 111 on the second radiation unit 112 is the direct coupling field.

[0082] In this case, the direction of the current induced in the first radiating unit 111 by the direct coupling field is opposite to the direction of the current induced in the second radiating unit 112. Therefore, the coupling will result in a reversal of electric field polarity, such as... Figure 7 As shown, if the first radiating unit 111 has a positive electric field, a negative electric field will be coupled to the second radiating unit 112, which will affect the radiation performance of the second radiating unit 112.

[0083] Continue to refer to Figure 5 and Figure 6 In this embodiment, at least one radiating unit group 20 is provided with a decoupling structure 12, wherein the decoupling structure 12 includes two microstrip line units 120, each microstrip line unit 120 being composed of at least one microstrip line 13. Furthermore, if the arrangement direction of the first radiating unit 111 and the second radiating unit 112 is a first direction X, then along a second direction Y intersecting the first direction X, the two microstrip line units 120 are located on opposite sides of the radiating unit group 20, that is, the arrangement direction of the two microstrip line units 120 intersects the arrangement direction of the first radiating unit 111 and the second radiating unit 112. Figure 5 and Figure 6 The example given is that the first direction X is perpendicular to the second direction Y.

[0084] Figure 8 This is a schematic diagram of the mutual coupling electric field of an antenna provided in an embodiment of the present invention, as shown below. Figure 8As shown, after setting the decoupling structure 12 on the radiation unit group 20, in addition to the direct coupling field mentioned above, an indirect coupling field will also be formed between the first radiation unit 111 and the second radiation unit 112. For example, when only the first radiation unit 111 is fed, the coupling electric field indirectly generated by the first radiation unit 111 on the second radiation unit 112 through the decoupling structure 12 is the indirect coupling field.

[0085] Thus, in addition to the direct coupling field affecting the induced current on the first radiation unit 111 and the second radiation unit 112, the indirect coupling field also affects the induced current on the first radiation unit 111 and the second radiation unit 112. Therefore, the induced current on the first radiation unit 111 and the second radiation unit 112 can be considered as the superposition of the current generated by the direct coupling field and the indirect coupling field.

[0086] For details, please refer to [link / reference]. Figure 8 As mentioned earlier, if the first radiating unit 111 has a positive electric field, it will directly couple to the second radiating unit 112 to form a negative electric field, which will affect the radiation performance of the second radiating unit 112. Simultaneously, the first radiating unit 111 will also couple to the microstrip line 13 in the two microstrip line units 120 to form a parasitic electric field. Since coupling results in polarity reversal, if the first radiating unit 111 has a positive electric field, the parasitic electric field coupled to the microstrip line 13 will be a negative electric field.

[0087] Furthermore, such as Figure 8 As shown, the negative electric field on the microstrip line 13 couples to the second radiating element 112 to form a compensating electric field. Since the coupling will cause a polarity reversal, the compensating electric field is a positive electric field. This positive electric field will compensate for the negative electric field formed by the direct coupling of the first radiating element 111 to the second radiating element 112, thereby canceling at least part of the negative electric field formed by the direct coupling of the first radiating element 111 to the second radiating element 112. This reduces the mutual coupling between the first radiating element 111 and the second radiating element 112, improves the isolation between the first radiating element 111 and the second radiating element 112, and solves the problem of strong mutual coupling between adjacent radiating elements 11 in the antenna with closely placed radiating elements 11, which is beneficial to improving the integration of the antenna.

[0088] At the same time, such as Figure 8As shown, the negative electric field formed by the coupling of the first radiating unit 111 on the microstrip line 13 in the two microstrip line units 120 will also provide negative feedback to the first radiating unit 111, forming a feedback enhancement electric field in the first radiating unit 111. Since the coupling will cause polarity reversal, the feedback enhancement electric field is a positive electric field, thereby forming a positive electric field enhancement on the first radiating unit 111, which can enhance the original electric field on the first radiating unit 111 and improve the radiation efficiency of the first radiating unit 111.

[0089] Further reference Figure 5 The vertical projections of the two microstrip line units 120 on the first substrate 10 are symmetrically arranged about the center point O of the vertical projection of the radiating unit group 20 on the first substrate 10, so that the parasitic electric field formed on the two microstrip line units 120 contributes symmetrically to the electric field compensation of the first radiating unit 111 and the second radiating unit 112, thereby avoiding the introduction of new additional coupling electric fields that would be detrimental to the decoupling effect of the decoupling structure 12.

[0090] Wherein, the center point O of the vertical projection of the radiating unit group 20 on the first substrate 10 refers to the geometric center of the vertical projection of the radiating unit group 20 on the first substrate 10, such as... Figure 5 As shown, the vertical projections of the two microstrip line units 120 on the first substrate 10 are symmetrically arranged about the center point O of the vertical projection of the radiating unit group 20 on the first substrate 10. This can be achieved by using a straight line passing through the center point O and extending along the first direction X as the first axis of symmetry, and the vertical projections of the two microstrip line units 120 on the first substrate 10 are symmetrically arranged about the first axis of symmetry. At the same time, using a straight line passing through the center point O and extending along the second direction Y as the second axis of symmetry, the vertical projection of each microstrip line unit 120 on the first substrate 10 is symmetrical about the second axis of symmetry. This arrangement ensures that the parasitic electric field formed on the two microstrip line units 120 contributes symmetrically to the electric field compensation of the first radiating unit 111 and the second radiating unit 112, thereby avoiding the introduction of new additional coupling electric fields that would be detrimental to the decoupling effect of the decoupling structure 12.

[0091] Figure 9 This is a schematic diagram of the electric field intensity distribution of an antenna provided in an embodiment of the present invention. Figure 9 In this context, a darker grayscale color indicates a stronger electric field.

[0092] like Figure 9As shown, when the distance between the first radiating unit 111 and the second radiating unit 112 is less than 0.5λ, by setting the decoupling structure 12, when the first radiating unit 111 is working and the second radiating unit 112 is not working, that is, when only the first radiating unit 111 is fed, the first radiating unit 111 will couple to the microstrip line 13 in the two microstrip line units 120 to form a parasitic electric field. The parasitic electric field on the microstrip line 13 will then couple to the second radiating unit 112 to form a compensating electric field. This compensating electric field will cancel out at least part of the coupling electric field formed by the first radiating unit 111 directly coupling to the second radiating unit 112. Figure 3 As can be seen from the comparison, the coupling electric field strength formed on the second radiating element 112 is greatly reduced, thereby reducing the mutual coupling between the first radiating element 111 and the second radiating element 112, improving the isolation between the first radiating element 111 and the second radiating element 112, and thus solving the problem that the antenna with closely placed radiating elements 11 will have strong mutual coupling between adjacent radiating elements 11, which is beneficial to improving the integration of the antenna.

[0093] Meanwhile, continue to refer to Figure 9 The parasitic electric field formed by the coupling of the first radiating unit 111 to the microstrip line 13 in the two microstrip line units 120 will also provide negative feedback to the first radiating unit 111, coupling to form a feedback-enhanced electric field in the first radiating unit 111, thereby enhancing the electric field coupled to the first radiating unit 111. Figure 3 As can be seen from the comparison, the native electric field on the first radiating unit 111 is enhanced, which helps to improve the radiation efficiency of the first radiating unit 111.

[0094] It should be noted that the length and width of the microstrip line 13 in the microstrip line unit 120, as well as the spacing between the microstrip line 13 and the corresponding radiating unit 11, can be optimized according to the antenna's operating frequency, impedance matching requirements, radiation performance, and loss requirements.

[0095] Among them, such as Figure 5 As shown, by adjusting the length Lm and width Wm of the microstrip line 13 and the spacing d between the microstrip line 13 and the adjacent radiating unit 11, the influence of the electric field generated by the working radiating unit 11 on the electric field of the adjacent radiating unit 11 can be minimized.

[0096] Specifically, regarding the length Lm of the microstrip line 13, the inventors discovered through research that the length Lm of the microstrip line 13 is related to the operating frequency of the antenna. The length Lm of the microstrip line 13 can be set to be on the same order of magnitude as the operating wavelength of the antenna to achieve better antenna radiation performance. For example, if the decoupling structure 12 is applied to a millimeter-wave antenna, the length Lm of the microstrip line 13 is on the order of millimeters; if the decoupling structure 12 is applied to a centimeter-wave antenna, the length Lm of the microstrip line 13 is on the order of centimeters.

[0097] Meanwhile, the length Lm of the microstrip line 13 is also related to the optimal decoupling frequency range. Specifically, as the length Lm of the microstrip line 13 decreases, the optimal decoupling frequency range of the decoupling structure 12 shifts to higher frequencies, and the decoupling effect of the decoupling structure 12 becomes better. Therefore, if it is necessary to reduce the mutual coupling effect in the high-frequency range, the length Lm of the microstrip line 13 can be set to be shorter; if it is necessary to reduce the mutual coupling effect in the low-frequency range, the length Lm of the microstrip line 13 can be set to be longer.

[0098] Regarding the width Wm of the microstrip line 13, the inventors discovered through research that the width Wm of the microstrip line 13 is inversely proportional to the isolation degree. That is, the larger the width Wm of the microstrip line 13, the worse the isolation effect of the decoupling structure 12 on adjacent radiating units 11, while the smaller the width Wm of the microstrip line 13, the better the isolation effect of the decoupling structure 12 on adjacent radiating units 11.

[0099] Meanwhile, the width Wm of the microstrip line 13 is also related to the optimal decoupling frequency range. A larger width Wm shifts the optimal decoupling frequency range of the decoupling structure 12 towards lower frequencies; conversely, a smaller width Wm shifts the optimal decoupling frequency range towards higher frequencies. Therefore, to reduce mutual coupling effects in the high-frequency range, the width Wm of the microstrip line 13 can be set narrower; conversely, to reduce mutual coupling effects in the low-frequency range, the width Wm of the microstrip line 13 can be set wider.

[0100] Regarding the spacing d between the microstrip line 13 and the adjacent radiating unit 11, the inventors discovered through research that the smaller the spacing d between the microstrip line 13 and the adjacent radiating unit 11, the better the decoupling effect of the decoupling structure 12.

[0101] Optionally, the spacing d between the microstrip line 13 and the adjacent radiating unit 11 can be set from 3μm to 10μm. In this case, the field strength of the parasitic electric field formed by the coupling of the first radiating unit 111 on the microstrip line 13 is sufficient to cancel the coupling electric field formed by the coupling of the first radiating unit 111 on the second radiating unit 112, thereby enabling the decoupling structure 12 to achieve the best decoupling effect.

[0102] However, the spacing d between the microstrip line 13 and the adjacent radiating element 11 is not limited to the above range. Considering the ease of fabrication, the spacing d between the microstrip line 13 and the adjacent radiating element 11 can also be set to be larger. For example, the spacing d between the microstrip line 13 and the adjacent radiating element 11 can be set to a range of 8μm to 20μm, so as to reduce the difficulty of antenna fabrication while achieving a better decoupling effect in the decoupling structure 12.

[0103] As explained above, the isolation effect of the decoupling structure 12 can be adjusted by coordinating the length Lm and width Wm of the microstrip line 13 and the spacing d between the microstrip line 13 and the adjacent radiating unit 11. Since a large width Wm of the microstrip line 13 would be detrimental to improving the isolation, the required decoupling frequency range can be obtained mainly by adjusting the length Lm of the microstrip line 13. At the same time, the field strength of the parasitic electric field coupled on the microstrip line 13 can be coarsely adjusted by adjusting the length Lm of the microstrip line 13 and the spacing d between the microstrip line 13 and the adjacent radiating unit 11. Furthermore, the field strength of the parasitic electric field coupled on the microstrip line 13 can be finely adjusted by adjusting the width Wm of the microstrip line 13, so that the field strength of the parasitic electric field coupled on the microstrip line 13 by the first radiating unit 111 is sufficient to cancel out the coupling electric field coupled on the second radiating unit 112 by the first radiating unit 111, so that the decoupling structure 12 achieves a good decoupling effect.

[0104] In this embodiment, the width Wm of the microstrip line 13 can range from a few micrometers to several hundred micrometers. A width Wm less than or equal to 100 μm can improve antenna isolation by more than 10 dB without adversely affecting the antenna's radiation efficiency. Therefore, the decoupling structure 12 only occupies less than 100 micrometers of space, significantly reducing the spacing between adjacent radiating elements 11. Taking a 6 GHz antenna as an example, without the decoupling structure 12, the spacing between adjacent radiating elements 11 needs to be greater than or equal to 0.5λ (~25 mm) to ensure isolation. However, with the addition of the decoupling structure 12, the spacing between adjacent radiating elements 11 can be reduced from ~25 mm to 1 mm~2 mm while maintaining isolation, thus facilitating high integration and miniaturization of the antenna design.

[0105] Meanwhile, the decoupling structure 12 is composed of microstrip lines 13, which has a simple structure and can be directly fabricated using mature panel technology, making it easy to implement.

[0106] In summary, the antenna provided by this invention features a decoupling structure composed of microstrip lines on both sides of at least two adjacent radiating elements. When any one of the radiating elements is operational, a parasitic electric field is generated on the decoupling structure. This parasitic electric field couples onto the other radiating element to form a compensating electric field, thus canceling the coupling electric field formed by the direct coupling of the operational radiating element onto that element. This reduces the mutual coupling between adjacent radiating elements, improves the isolation between them, and solves the problem of strong mutual coupling between adjacent radiating elements in antennas with closely spaced radiating elements, which is beneficial for improving the antenna's integration. Simultaneously, the parasitic electric field on the decoupling structure also couples onto the operational radiating element to form a positive electric field enhancement, thereby enhancing the native electric field on the operational radiating element and improving the antenna's radiation efficiency. Furthermore, the decoupling structure is composed of microstrip lines, has a simple structure, and can be directly fabricated using mature panel technology, making it easy to implement.

[0107] Continue to refer to Figure 5 and Figure 6 Optionally, one of the two microstrip line units 120 includes a first microstrip line 131 and the other includes a second microstrip line 132. Both the first microstrip line 131 and the second microstrip line 132 extend along the arrangement direction of the first radiating unit 111 and the second radiating unit 112. The vertical projections of the first microstrip line 131 and the second microstrip line 132 on the first substrate 10 are symmetrically arranged about the center point O of the vertical projection of the radiating unit group 20 on the first substrate 10.

[0108] Specifically, such as Figure 5 and Figure 6 As shown, in the two microstrip line units 120 of the decoupling structure 12, one microstrip line unit 120 is composed of a first microstrip line 131 and the other microstrip line unit 120 is composed of a second microstrip line 132. That is, the decoupling structure 12 is composed of only two microstrip lines 13, namely the first microstrip line 131 and the second microstrip line 132. The structure is simple and the fabrication process is easy to realize.

[0109] Furthermore, such as Figure 5 As shown, the first microstrip line 131 and the second microstrip line 132 both extend along the arrangement direction of the first radiating unit 111 and the second radiating unit 112 (the first direction X in the figure), and the first microstrip line 131 and the second microstrip line 132 are arranged along the direction intersecting the arrangement direction of the first radiating unit 111 and the second radiating unit 112 (the second direction Y in the figure). The first microstrip line 131 and the second microstrip line 132 are located on opposite sides of the radiating unit group 20, and the vertical projections of the first microstrip line 131 and the second microstrip line 132 on the first substrate 10 are symmetrically arranged about the center point O of the vertical projection of the radiating unit group 20 on the first substrate 10.

[0110] For example, such as Figure 5 As shown, with a straight line passing through the center point O and extending along the first direction X as the first axis of symmetry, the vertical projections of the first microstrip line 131 and the second microstrip line 132 on the first substrate 10 are symmetrically arranged about the first axis of symmetry; at the same time, with a straight line passing through the center point O and extending along the second direction Y as the second axis of symmetry, the vertical projections of the first microstrip line 131 and the second microstrip line 132 on the first substrate 10 are both symmetrical about the second axis of symmetry.

[0111] With this configuration, when power is supplied to the first radiating unit 111, the first radiating unit 111 will couple to form a parasitic electric field on the first microstrip line 131 and the second microstrip line 132. The parasitic electric fields on the first microstrip line 131 and the second microstrip line 132 will then couple to the second radiating unit 112 to form a compensating electric field, thus canceling out at least part of the coupling electric field formed by the direct coupling of the first radiating unit 111 to the second radiating unit 112. Similarly, when power is supplied to the second radiating unit 112, the second radiating unit 112 will couple to form a parasitic electric field on the first microstrip line 131 and the second microstrip line 132. The parasitic electric fields on the first microstrip line 131 and the second microstrip line 132 will then couple to the first radiating unit 111, thus canceling out at least part of the coupling electric field formed by the direct coupling of the second radiating unit 112 to the first radiating unit 111. Therefore, the arrangement of the first microstrip line 131 and the second microstrip line 132 reduces the mutual coupling between the first radiating element 111 and the second radiating element 112, and improves the isolation between the first radiating element 111 and the second radiating element 112. This solves the problem that there is strong mutual coupling between adjacent radiating elements 11 when the antenna with closely placed radiating elements 11 is located, which is beneficial to improving the integration of the antenna.

[0112] Meanwhile, the parasitic electric fields coupled on the first microstrip line 131 and the second microstrip line 132 will also provide negative feedback to the fed radiating element 11, forming a feedback enhancement electric field on the working radiating element 11, thereby forming a positive electric field enhancement on the fed radiating element 11, which helps to improve the radiation efficiency of the antenna.

[0113] It should be noted that the lengths of the first microstrip line 131 and the second microstrip line 132 can be optimized to meet the requirements of the antenna's operating frequency, impedance matching, radiation performance, and loss, thereby minimizing the mutual coupling effect between adjacent radiating elements 11.

[0114] The inventors discovered that, along the second direction Y, the first microstrip line 131 and the first radiating unit 111 at least partially overlap, and the first microstrip line 131 and the second radiating unit 112 at least partially overlap; similarly, along the second direction Y, the second microstrip line 132 and the first radiating unit 111 at least partially overlap, and the second microstrip line 132 and the second radiating unit 112 at least partially overlap, which can enable the decoupling structure 12 to achieve a better decoupling effect.

[0115] Furthermore, along the first direction X, the length of the first microstrip line 131 is less than or equal to the sum of the lengths of the first radiating unit 111 and the second radiating unit 112; similarly, the length of the second microstrip line 132 is less than or equal to the sum of the lengths of the first radiating unit 111 and the second radiating unit 112, which can also enable the decoupling structure 12 to achieve a better decoupling effect.

[0116] Figure 10 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 11 for Figure 10 A schematic diagram of the cross-sectional structure along the B-B' direction, as shown below. Figure 10 and Figure 11 As shown, optionally, one of the two microstrip line units 120 includes a third microstrip line 133 and a fourth microstrip line 134 arranged along a first direction X, and the third microstrip line 133 and the fourth microstrip line 134 are insulated from each other; the other includes a fifth microstrip line 135 and a sixth microstrip line 136 arranged along the first direction, and the fifth microstrip line 135 and the sixth microstrip line 136 are insulated from each other. The third microstrip line 133, the fourth microstrip line 134, the fifth microstrip line 135 and the sixth microstrip line 136 all extend along the first direction X. Along the second direction Y, the third microstrip line 133 and the fifth microstrip line 135 at least partially overlap with the first radiating unit 111, and the fourth microstrip line 134 and the sixth microstrip line 136 at least partially overlap with the second radiating unit 112.

[0117] Specifically, such as Figure 10 and Figure 11 As shown, in the two microstrip line units 120 of the decoupling structure 12, one microstrip line unit 120 is composed of a third microstrip line 133 and a fourth microstrip line 134 that are insulated from each other, and the other microstrip line unit 120 is composed of a fifth microstrip line 135 and a sixth microstrip line 136 that are insulated from each other. That is, the decoupling structure 12 is composed of four microstrip lines 13: the third microstrip line 133, the fourth microstrip line 134, the fifth microstrip line 135 and the sixth microstrip line 136.

[0118] Furthermore, such as Figure 10As shown, the third microstrip line 133, the fourth microstrip line 134, the fifth microstrip line 135, and the sixth microstrip line 136 all extend along the arrangement direction of the first radiating unit 111 and the second radiating unit 112 (as shown in the first direction X in the figure). The third microstrip line 133 and the fifth microstrip line 135 are arranged along the direction intersecting with the arrangement direction of the first radiating unit 111 and the second radiating unit 112 (as shown in the second direction Y in the figure), and the fourth microstrip line 134 and the sixth microstrip line 136 are arranged along the direction intersecting with the arrangement direction of the first radiating unit 111 and the second radiating unit 112 (as shown in the second direction Y in the figure). The third microstrip line 133 and the fifth microstrip line 135 can be located on opposite sides of the first radiating unit 111, and the fourth microstrip line 134 and the sixth microstrip line 136 can be located on opposite sides of the second radiating unit 112. The vertical projections of the third microstrip line 133, the fourth microstrip line 134, the fifth microstrip line 135 and the sixth microstrip line 136 on the first substrate 10 are symmetrically arranged about the center point O of the vertical projection of the radiating unit group 20 on the first substrate 10.

[0119] For example, such as Figure 10 As shown, with a straight line passing through the center point O and extending along the first direction X as the first axis of symmetry, the vertical projections of the third microstrip line 133 and the fifth microstrip line 135 on the first substrate 10 are symmetrically arranged about the first axis of symmetry, and the vertical projections of the fourth microstrip line 134 and the sixth microstrip line 136 on the first substrate 10 are symmetrically arranged about the first axis of symmetry; at the same time, with a straight line passing through the center point O and extending along the second direction Y as the second axis of symmetry, the vertical projections of the third microstrip line 133 and the fourth microstrip line 134 on the first substrate 10 are symmetrical about the second axis of symmetry, and the vertical projections of the fifth microstrip line 135 and the sixth microstrip line 136 on the first substrate 10 are symmetrical about the second axis of symmetry.

[0120] Figure 12 A schematic diagram of the mutual coupling electric field of another antenna provided in an embodiment of the present invention is shown below. Figure 12 As shown, in this embodiment, when power is fed to the first radiating unit 111, a native electric field (e.g., ...) is formed on the first radiating unit 111. Figure 12 The primary electric field in the middle is a positive electric field. The first radiating unit 111 will couple to form parasitic electric fields on the third microstrip line 133, the fourth microstrip line 134, the fifth microstrip line 135, and the sixth microstrip line 136 (e.g., the primary electric field is a positive electric field). Figure 12 The parasitic electric field in the middle is a negative electric field.

[0121] The electric field intensity on microstrip line 13 is concentrated near the center of microstrip line 13. Therefore, along the second direction Y, by setting the fourth microstrip line 134 and the sixth microstrip line 136 to at least partially overlap with the second radiating unit 112, i.e., the fourth microstrip line 134 and the sixth microstrip line 136 are located on opposite sides of the second radiating unit 112, the positions with the strongest parasitic electric field intensity on the fourth microstrip line 134 and the sixth microstrip line 136 are located on opposite sides of the second radiating unit 112. This allows the parasitic electric fields on the fourth microstrip line 134 and the sixth microstrip line 136 to couple onto the second radiating unit 112 to form a stronger and more symmetrical compensating electric field relative to the center of the second radiating unit 112 (e.g., ...). Figure 12 The compensation electric field is a positive electric field, which can better cancel the coupling electric field formed by the direct coupling of the first radiation unit 111 to the second radiation unit 112 (e.g., the compensation electric field is a positive electric field), thereby better canceling the coupling electric field formed by the direct coupling of the first radiation unit 111 to the second radiation unit 112 (e.g., the coupling electric field is a positive electric field). Figure 12 (The coupled electric field is a negative electric field); similarly, when the second radiating unit 112 is fed, the second radiating unit 112 will couple and form a parasitic electric field on the third microstrip line 133, the fourth microstrip line 134, the fifth microstrip line 135 and the sixth microstrip line 136. Along the second direction Y, by setting the third microstrip line 133 and the fifth microstrip line 135 to at least partially overlap with the first radiating unit 111, that is, the third microstrip line 133 and the fifth microstrip line 135 are respectively located on opposite sides of the first radiating unit 111. This allows the parasitic electric field strength on the third microstrip line 133 and the fifth microstrip line 135 to be strongest at opposite sides of the first radiating unit 111. Consequently, the parasitic electric fields on the third microstrip line 133 and the fifth microstrip line 135 can couple on the first radiating unit 111 to form a stronger and more symmetrical compensating electric field relative to the center of the first radiating unit 111. This can better counteract the coupling electric field formed by the second radiating unit 112 directly coupling to the first radiating unit 111.

[0122] Therefore, the arrangement of the third microstrip line 133, the fourth microstrip line 134, the fifth microstrip line 135 and the sixth microstrip line 136 reduces the mutual coupling between the first radiating element 111 and the second radiating element 112, and improves the isolation between the first radiating element 111 and the second radiating element 112. This solves the problem that the antenna with closely placed radiating elements 11 will have strong mutual coupling between adjacent radiating elements 11, which is beneficial to improving the integration of the antenna.

[0123] Meanwhile, along the second direction Y, the third microstrip line 133 and the fifth microstrip line 135 at least partially overlap with the first radiating element 111, that is, the third microstrip line 133 and the fifth microstrip line 135 are located on opposite sides of the first radiating element 111. When feeding the first radiating element 111, the positions with the strongest parasitic electric field intensity on the third microstrip line 133 and the fifth microstrip line 135 can be located on opposite sides of the first radiating element 111. This allows the parasitic electric field on the third microstrip line 133 and the fifth microstrip line 135 to couple on the first radiating element 111 to form a stronger and more symmetrical feedback enhancement electric field relative to the center position of the first radiating element 111, thereby forming a better positive electric field enhancement for the first radiating element 111, which helps to improve the radiation efficiency of the antenna.

[0124] Similarly, along the second direction Y, the fourth microstrip line 134 and the sixth microstrip line 136 at least partially overlap with the second radiating element 112, that is, the fourth microstrip line 134 and the sixth microstrip line 136 are located on opposite sides of the second radiating element 112. When feeding the second radiating element 112, the positions with the strongest parasitic electric field intensity on the fourth microstrip line 134 and the sixth microstrip line 136 can be located on opposite sides of the second radiating element 112. This allows the parasitic electric field on the fourth microstrip line 134 and the sixth microstrip line 136 to couple on the second radiating element 112 to form a stronger and more symmetrical feedback enhancement electric field relative to the center position of the second radiating element 112, thereby forming a better positive electric field enhancement for the second radiating element 112, which helps to improve the radiation efficiency of the antenna.

[0125] Figure 13 This is a schematic diagram of the simulation results of an antenna provided by an embodiment of the present invention. The example is taken with the first radiating element 111 working and the second radiating element 112 not working, i.e., only the first radiating element 111 is fed. Curve S11-1 represents the return loss of the first radiating element 111 without the decoupling structure 12, and curve S22-1 represents the return loss of the second radiating element 112 without the decoupling structure 12. Curve S11-2 represents the return loss of the first radiating element 111 after the decoupling structure 12 is set, and curve S22-2 represents the return loss of the second radiating element 112 after the decoupling structure 12 is set.

[0126] like Figures 10-13As shown, after setting the decoupling structure 12 provided in this embodiment of the invention, the return loss of the first radiation unit 111 within the operating bandwidth range becomes smaller, indicating that the radiation performance of the first radiation unit 111 is effectively improved; while the return loss of the second radiation unit 112 within the operating bandwidth range becomes larger, indicating that the influence of the electric field of the first radiation unit 111 on the second radiation unit 112 is reduced, and the isolation between the first radiation unit 111 and the second radiation unit 112 is effectively improved.

[0127] Figure 14 This is a schematic diagram of simulation results for another antenna provided in an embodiment of the present invention. The example illustrates the situation where the first radiating element 111 is operational while the second radiating element 112 is not operational, meaning only the first radiating element 111 is being fed. Curve S21-1 represents the insertion loss of the first radiating element 111 without the decoupling structure 12, and curve S21-2 represents the insertion loss of the first radiating element 111 after the decoupling structure 12 is configured. Figures 10-12 , Figure 14 As shown, after setting the decoupling structure 12 provided in this embodiment of the invention, the insertion loss of the first radiating unit 111 within the operating bandwidth becomes smaller, indicating that the radiation efficiency of the first radiating unit 111 is effectively improved.

[0128] Continue to refer to Figures 10-12 It should be noted that the spacing between two microstrip lines 13 in the same microstrip line unit 120 can be set according to the size of the radiating unit 11. The larger the size of the radiating unit 11, the larger the spacing between the two microstrip lines 13 in the same microstrip line unit 120 can be; the smaller the size of the radiating unit 11, the smaller the spacing between the two microstrip lines 13 in the same microstrip line unit 120 can be. This embodiment of the invention does not impose specific limitations on this.

[0129] Continue to refer to Figure 6 and Figure 11 Optionally, the microstrip line 13 and the radiating unit 11 are arranged in the same layer.

[0130] As mentioned above, the smaller the spacing d between the microstrip line 13 and the radiating unit 11, the better the decoupling effect of the decoupling structure 12. Therefore, in this embodiment, by setting the microstrip line 13 and the radiating unit 11 to be arranged in the same layer, the microstrip line 13 and the radiating unit 11 can have a smaller spacing, thereby obtaining a better decoupling effect.

[0131] Meanwhile, since the microstrip line 13 and the radiating unit 11 are disposed on the same film layer, the number of metal layers can be reduced, thereby achieving the purpose of reducing production costs and substrate thickness. Furthermore, the microstrip line 13 can be made of the same material as the radiating unit 11, allowing the microstrip line 13 and the radiating unit 11 to be fabricated in the same process, thereby shortening the process time.

[0132] Continue to refer to Figure 5 , Figure 6 , Figure 10 and Figure 11 Optionally, the antenna provided in this embodiment of the invention further includes a liquid crystal phase shifter 14 located on the side of the first substrate 10 away from the radiating element 11. The liquid crystal phase shifter 14 includes a second substrate 15 and a third substrate 16 disposed opposite to each other, with the third substrate 16 located on the side of the second substrate 15 away from the radiating element 11. The liquid crystal phase shifter 14 also includes a delay line 17, a liquid crystal layer 18, and a ground metal layer 19. The liquid crystal layer 18 is located between the second substrate 15 and the third substrate 16, the delay line 17 is located between the third substrate 16 and the liquid crystal layer 18, and the ground metal layer 19 is located between the second substrate 15 and the liquid crystal layer 18. The ground metal layer 19 includes a first cutout portion 191, and the radiating element 11 covers the first cutout portion 191 along the thickness direction of the first substrate 10.

[0133] Among them, such as Figure 5 , Figure 6 , Figure 10 and Figure 11 As shown, delay line 17 is used to transmit radio frequency (RF) signals, which can be provided by a feed source such as an RF integrated circuit or an RF chip.

[0134] For example, such as Figure 5 , Figure 6 , Figure 10 and Figure 11 As shown, a power supply structure 40 can be connected to one end of the delay line 17. The power supply structure 40 can be bonded to the flexible printed circuit board 41 (FPC). The radio frequency chip can be bonded to the flexible printed circuit board 41 so that the delay line 17 can receive the radio frequency signal provided by the radio frequency chip through the flexible printed circuit board 41.

[0135] Continue to refer to Figure 5 , Figure 6 , Figure 10 and Figure 11The power supply structure 40 may include a power supply section 401, a first grounding section 402, and a second grounding section 403. The power supply section 401 is located between the first grounding section 402 and the second grounding section 403. The power supply section 401 is connected to the delay line 17 and is used to transmit radio frequency signals to the delay line 17. The power supply section 401, the first grounding section 402, and the second grounding section 403 constitute a coplanar waveguide (CPW) structure. The coplanar waveguide structure has the characteristics of small size, light weight, and planar structure, which makes it easy to obtain linear polarization, circular polarization, dual polarization, and multi-band operation. At the same time, as a microwave planar transmission structure with superior performance and easy processing, the coplanar waveguide has performance advantages over microstrip lines in the millimeter-wave band.

[0136] It should be noted that the power supply method of delay line 17 is not limited to the above embodiment. In other embodiments, the delay line 17 can also be powered in other ways, such as directly placing the radio frequency chip on the third substrate 16 to be directly connected to the delay line 17. The embodiments of the present invention do not specifically limit this.

[0137] Continue to refer to Figure 5 , Figure 6 , Figure 10 and Figure 11 The radio frequency (RF) signal on delay line 17 is transmitted in liquid crystal layer 18 between delay line 17 and ground metal layer 19. By applying voltage signals to delay line 17 and ground metal layer 19 respectively, an electric field can be formed between delay line 17 and ground metal layer 19. The electric field can drive the liquid crystal molecules in liquid crystal layer 18 to deflect, thereby changing the dielectric constant of liquid crystal layer 18. The change in dielectric constant of liquid crystal layer 18 causes the RF signal transmitted on delay line 17 to undergo phase shift, thereby changing the phase of the RF signal and realizing the phase shifting function of the RF signal. It can be understood that by controlling the voltage signals on delay line 17 and ground metal layer 19, the deflection angle of liquid crystal molecules in liquid crystal layer 18 can be controlled, thereby controlling the phase adjusted during the phase shifting process of the RF signal, and ultimately realizing the beam pointing control of the RF signal transmitted by the antenna.

[0138] Continue to refer to Figure 5 , Figure 6 , Figure 10 and Figure 11 A first cutout portion 191 is provided on the ground metal layer 19. Along the thickness direction of the first substrate 10, there is an overlapping area between the radiating unit 11, the first cutout portion 191 and the delay line 17. The liquid crystal layer 18 between the delay line 17 and the ground metal layer 19 phase-shifts the radio frequency signal, that is, after changing the phase of the radio frequency signal, the phase-shifted radio frequency signal is coupled to the radiating unit 11 at the first cutout portion 191 of the ground metal layer 19, so as to realize the radiating unit 11 radiating the signal outward.

[0139] The delay lines 17 can be correspondingly arranged with the radiating units 11. For example, the delay lines 17 and radiating units 11 can be arranged in a one-to-one correspondence, and the radiating units 11 corresponding to different delay lines 17 are mutually insulated. At this time, different voltage signals can be applied to different delay lines 17 to make the liquid crystal molecules at the corresponding positions of different delay lines 17 deflect at different angles, thereby making the dielectric constant of the liquid crystal layer 18 at each position different, thus adjusting the phase of the radio frequency signal at the positions of different delay lines 17, and finally achieving different beam directions of the radio frequency signal.

[0140] It should be noted that the materials of the radiating element 11, the delay line 17 and the grounding metal layer 19 can be, but are not limited to, low-impedance materials such as copper, silver, silver alloys and copper alloys, in order to effectively reduce energy loss caused by excessive resistance, thereby improving the radiation efficiency of the antenna.

[0141] Furthermore, the thickness of the radiating element 11, the delay line 17, and the ground metal layer 19 can be set within the range of 1μm to 3μm, so that the thickness of the radiating element 11, the delay line 17, and the ground metal layer 19 is relatively thin, which is beneficial for the design of a thinner antenna. At the same time, the radio frequency signal will flow through a certain depth on the surface of the metal layer, which is the skin depth. Therefore, by adopting the above-mentioned thickness range for the radiating element 11, the delay line 17, and the ground metal layer 19, the thickness of the radiating element 11, the delay line 17, and the ground metal layer 19 can also be greater than or equal to the skin depth, thereby avoiding the radio frequency signal from penetrating the metal structure such as the delay line 17 and the ground metal layer 19 and causing energy loss.

[0142] Continue to refer to Figure 5 , Figure 6 , Figure 10 and Figure 11 A support structure 42 may also be provided between the second substrate 15 and the third substrate 16. The support structure 42 is used to support the second substrate 15 and the third substrate 16, thereby providing a space for the liquid crystal layer 18. The support structure 42 may be a frame or similar structure, and this embodiment of the invention is not limited thereto.

[0143] Figure 15 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 16 for Figure 15 A schematic diagram of the cross-sectional structure along the C-C' direction. Figure 17 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 18 for Figure 17 A schematic diagram of the cross-sectional structure along the D-D' direction, as shown below. Figures 15-18As shown, optionally, the microstrip line 13 and the delay line 17 are disposed on the same layer, and the ground metal layer 19 includes a second cutout portion 192, which covers the microstrip line 13 along the thickness direction of the first substrate 10.

[0144] Among them, such as Figures 15-18 As shown, by placing the microstrip line 13 and the delay line 17 on the same film layer, one metal layer can be eliminated, thereby reducing production costs and substrate thickness. Furthermore, the microstrip line 13 can be made of the same material as the delay line 17, allowing them to be fabricated in the same process, thus shortening the process time.

[0145] Meanwhile, a second cutout portion 192 corresponding to the microstrip line 13 is provided on the ground metal layer 19, and there is an overlapping area between the second cutout portion 192 and the microstrip line 13 along the thickness direction of the first substrate 10, thereby avoiding the ground metal layer 19 from shielding the microstrip line 13 and affecting the electric field coupling between the radiating unit 11 and the microstrip line 13, and ensuring the decoupling effect of the microstrip line 13 on the adjacent radiating unit 11.

[0146] Continue to refer to Figure 5 , Figure 6 , Figure 10 , Figure 11 , Figures 15-18 Optionally, the first substrate 10 and the second substrate 15 are bonded together by a first adhesive 30, and there is a gap between the first adhesive 30 and the radiating unit 11 along the thickness direction of the first substrate 10.

[0147] Among them, such as Figure 5 , Figure 6 , Figure 10 , Figure 11 , Figures 15-18 As shown, in this embodiment, the second substrate 15 of the liquid crystal phase shifter 14 is an independent substrate different from the first substrate 10. During the antenna fabrication process, a radiating unit 11 can be formed on the first substrate 10 and a ground metal layer 19 can be formed on the second substrate 15. Then, the first substrate 10 and the second substrate 15 are bonded together with the first adhesive 30. Thus, the fabrication of the radiating unit 11 and the ground metal layer 19 can be achieved without setting a double-sided conductive metal layer on a single substrate, thereby reducing the difficulty of the manufacturing process and improving production efficiency.

[0148] Furthermore, since the dielectric constant of the first adhesive 30 is greater than that of air, by ensuring that the first adhesive 30 and the radiating element 11 do not overlap along the thickness direction of the first substrate 10, the dielectric loss of the radio frequency signal between the first substrate 10 and the second substrate 15 can be reduced, thereby improving the radiation efficiency of the antenna.

[0149] The specific shape of the first adhesive 30 can be as follows: Figure 5 , Figure 6 , Figure 10 , Figure 11 , Figures 15-18 The shape shown is square, but it is not limited to this. In other embodiments, the range of the first adhesive 30 can be adjusted according to actual needs.

[0150] It should be noted that the smaller the thickness of the first adhesive 30, the lower the dielectric loss of the radio frequency signal between the first substrate 10 and the second substrate 15, which is beneficial to improving the radiation efficiency of the antenna. However, if the thickness of the first adhesive 30 is too small, it will affect the bonding firmness of the first adhesive 30. Therefore, the thickness of the first adhesive 30 can be set according to the material of the first adhesive 30.

[0151] For example, when the first adhesive 30 is a frame adhesive, the thickness of the first adhesive 30 can be set to about 100 micrometers, that is, its thickness can be set from 100μm to 1000μm. While ensuring the bonding firmness between the first substrate 10 and the second substrate 15, the first adhesive 30 can have a thinner thickness, thereby making the dielectric loss of the first adhesive 30 on the radio frequency signal smaller, which is beneficial to improving the radiation efficiency of the antenna.

[0152] Figure 19 This is a schematic diagram of the cross-sectional structure of an antenna provided in an embodiment of the present invention. Figure 20 A schematic diagram of the cross-sectional structure of another antenna provided in an embodiment of the present invention is shown below. Figure 19 and Figure 20 As shown, optionally, the first substrate 10 and the second substrate 15 are the same substrate.

[0153] in, Figure 19 The antenna structure shown is similar to Figure 6 The difference between the antenna structures shown is that the first substrate 10 and the second substrate 15 share the same substrate. Similarly, Figure 20 The antenna structure shown is similar to Figure 11 The difference in the antenna structure shown is that the first substrate 10 and the second substrate 15 share the same substrate. Therefore, the explanations of the same or corresponding structures and terms as described in the above embodiments will not be repeated here.

[0154] like Figure 19 and Figure 20 As shown, in this embodiment, by setting the first substrate 10 and the second substrate 15 to be the same substrate, the overall thickness of the substrate can be reduced, which is beneficial to the thinner and lighter design of the antenna; at the same time, it can also reduce the dielectric loss of radio frequency signals on the substrate, which is beneficial to improving the radiation efficiency of the antenna.

[0155] Figure 21This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 22 for Figure 21 A schematic diagram of the cross-sectional structure along the E-E' direction. Figure 23 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 24 for Figure 23 A schematic diagram of the cross-sectional structure along the F-F' direction, as shown below. Figures 21-24 As shown, optionally, the antenna provided in this embodiment of the invention further includes a ground metal layer 19 and a coaxial cable interface 31. The ground metal layer 19 is located on the side of the first substrate 10 away from the radiating element 11, and along the thickness direction of the first substrate 10, the ground metal layer 19 and the radiating element 11 at least partially overlap. The coaxial cable interface 31 is located on the side of the ground metal layer 19 away from the radiating element 11. The first substrate 10 includes a first through hole 101, and the coaxial cable interface 31 is connected to the radiating element 11 through the first through hole 101.

[0156] Specifically, such as Figures 21-24 As shown, the coaxial cable interface 31 may include a conductive inner core 311 located in the middle and an insulating outer sheath 312 on the outer layer of the conductive inner core 311, but is not limited to this.

[0157] The conductive core 311 of the coaxial cable interface 31 passes through the first through hole 101 on the first substrate 10 and is electrically connected to the radiation unit 11. The coaxial cable interface 31 can provide coaxial power to the radiation unit 11 through an external radio frequency integrated circuit, thereby exciting a radio frequency electromagnetic field between the radiation unit 11 and the ground metal layer 19 and radiating it outward through the radiation unit 11.

[0158] Continue to refer to Figures 21-24 It should be noted that the conductive inner core 311 of the coaxial cable interface 31 is separated from the grounding metal layer 19 by the insulating outer sheath 312 of the coaxial cable interface 31 to ensure insulation between the conductive inner core 311 of the coaxial cable interface 31 and the grounding metal layer 19.

[0159] Furthermore, when the first substrate 10 is a glass substrate, the first through-hole 101 can be achieved using a single-substrate glass drilling technique. Simultaneously, low-temperature chemical vapor deposition (CVD) technology can be used to fabricate the radiating unit 11 and the grounding metal layer 19 through a double-sided film deposition process, but this is not a limitation.

[0160] Figure 25 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 26 for Figure 25 A schematic diagram of the cross-sectional structure along the G-G' direction, as shown below. Figure 25 and Figure 26As shown, optionally, the antenna provided in this embodiment of the invention further includes a waveguide structure 32 located on the side of the first substrate 10 away from the radiating element 11. The waveguide structure 32 includes a fourth substrate 33 and a fifth substrate 34 disposed opposite to each other, with the fifth substrate 34 located on the side of the fourth substrate 33 away from the radiating element 11. The waveguide structure 32 includes a hollow waveguide 321 and a ground metal layer 19. The hollow waveguide 321 is located between the fourth substrate 33 and the fifth substrate 34, and the ground metal layer 19 is located between the fourth substrate 33 and the hollow waveguide 321. The ground metal layer 19 includes a third cutout portion 193. Along the thickness direction of the first substrate 10, the radiating element 11 covers the third cutout portion 193, and the hollow waveguide 321 and the third cutout portion 193 at least partially overlap. The hollow waveguide 321 is used to feed the radio frequency signal provided by the feed source into the radiating element 11.

[0161] Specifically, such as Figure 25 and Figure 26 As shown, a feed line 35 can be provided on the fifth substrate 34. The feed line 35 is used to transmit the radio frequency signal provided by the feed source. The feed source can be a radio frequency integrated circuit or radio frequency chip, etc. The embodiments of the present invention do not specifically limit this.

[0162] For example, such as Figure 25 and Figure 26 As shown, a power supply structure 40 can be connected to one end of the power supply wire 35. The power supply structure 40 can be bonded to a flexible printed circuit board 41 (FPC). The radio frequency chip can be bonded to the flexible printed circuit board 41 so that the power supply wire 35 can receive the radio frequency signal provided by the radio frequency chip through the flexible printed circuit board 41.

[0163] Optional, such as Figure 25 and Figure 26 As shown, the feeding structure 40 may include a feeding section 401, a first grounding section 402, and a second grounding section 403. The feeding section 401 is located between the first grounding section 402 and the second grounding section 403. The feeding section 401 is connected to the delay line 17 and is used to transmit radio frequency signals to the delay line 17. The feeding section 401, the first grounding section 402, and the second grounding section 403 constitute a coplanar waveguide (CPW) structure. The coplanar waveguide structure features small size, light weight, and planar structure, making it easy to achieve linear polarization, circular polarization, dual polarization, and multi-band operation. Furthermore, as a high-performance and easily fabricated microwave planar transmission structure, the coplanar waveguide offers performance advantages over microstrip lines in the millimeter-wave band.

[0164] It should be noted that the power supply method of the power supply conductor 35 is not limited to the above embodiment. In other embodiments, power can also be supplied to the power supply conductor 35 in other ways.

[0165] For example, Figure 27 This is a schematic diagram of the cross-sectional structure of another antenna provided in an embodiment of the present invention.

[0166] in, Figure 27 The antenna structure shown is similar to Figure 26 The difference in the antenna structure shown is that the antenna feed RF chip 36 is directly mounted on the fifth substrate 34, so that the antenna feed RF chip 36 can be directly connected to the feed wire 35 to realize the feed of RF signals. The same or corresponding structures and terms as those in the above embodiments will not be repeated here.

[0167] Continue to refer to Figure 25 and Figure 26 Along the thickness direction of the first substrate 10, the feed wire 35 and the hollow waveguide 321 overlap at least partially to feed the radio frequency signal transmitted by the feed wire 35 into the hollow waveguide 321.

[0168] Among them, the hollow waveguide 321 is a metal tube structure with a hollow cavity. Electromagnetic energy can be guided and propagated in the internal space of the hollow waveguide 321. The metal tube wall can prevent electromagnetic energy leakage to the outside, thus achieving signal transmission with minimal loss.

[0169] Continue to refer to Figure 25 and Figure 26 A third cutout portion 193 is provided on the ground metal layer 19. Along the thickness direction of the first substrate 10, there is an overlapping area between the radiating unit 11, the third cutout portion 193 and the hollow waveguide 321. The radio frequency signal transmitted by the hollow waveguide 321 is coupled to the radiating unit 11 at the third cutout portion 193 of the ground metal layer 19, so that the radiating unit 11 radiates the signal outward, thereby realizing the waveguide feeding of the radiating unit 11.

[0170] The wall material of the hollow waveguide 321 can be, but is not limited to, low-impedance materials such as copper, to effectively reduce energy loss caused by excessive resistance, thereby helping to improve the radiation efficiency of the antenna.

[0171] In addition, the wall thickness of the hollow waveguide 321 can be set in the range of 1μm to 3μm, so that the wall thickness of the hollow waveguide 321 is thinner, which is beneficial to reduce the space occupied by the hollow waveguide 321; at the same time, the thickness of the hollow waveguide 321 can be greater than or equal to the skin depth, thereby avoiding the energy loss caused by the radio frequency signal penetrating the wall of the hollow waveguide 321.

[0172] Continue to refer to Figure 25 The hollow waveguide 321 can be a rectangular waveguide to realize signal transmission in transverse electric mode (TE) or transverse magnetic mode (TM), but is not limited to this.

[0173] It should be noted that the height of the hollow waveguide 321 can be set according to the operating wavelength of the antenna. For example, the height of the hollow waveguide 321 can be set to be on the same order of magnitude as the operating wavelength of the antenna to achieve better signal transmission performance. For example, if the hollow waveguide 321 is used in a millimeter-wave antenna, the height of the hollow waveguide 321 can be on the order of millimeters; if the hollow waveguide 321 is used in a centimeter-wave antenna, the height of the hollow waveguide 321 can be on the order of centimeters.

[0174] Meanwhile, the diameter of the hollow waveguide 321 can also be set according to the working wavelength (working frequency) of the antenna, and this embodiment of the invention does not specifically limit this.

[0175] Continue to refer to Figures 25-27 A support structure 42 may also be provided between the fourth substrate 33 and the fifth substrate 34. The support structure 42 is used to support the fourth substrate 33 and the fifth substrate 34, thereby providing a space for the hollow waveguide 321. The support structure 42 may be made of materials such as resin to provide good support performance, and the embodiments of the present invention are not limited in this regard.

[0176] Continue to refer to Figures 25-27 Optionally, the first substrate 10 and the fourth substrate 33 are bonded together by a second adhesive 43, and there is a gap between the second adhesive 43 and the radiating unit 11 along the thickness direction of the first substrate 10.

[0177] Among them, such as Figures 25-27 As shown, in this embodiment, the fourth substrate 33 of the waveguide structure 32 is an independent substrate different from the first substrate 10. During the antenna fabrication process, a radiating element 11 can be formed on the first substrate 10 and a grounding metal layer 19 can be formed on the fourth substrate 33. Then, the first substrate 10 and the fourth substrate 33 are bonded together with the second adhesive 43. Thus, the fabrication of the radiating element 11 and the grounding metal layer 19 can be achieved without setting a double-sided conductive metal layer on a single substrate, thereby reducing the difficulty of the manufacturing process and improving production efficiency.

[0178] Furthermore, since the dielectric constant of the second adhesive 43 is greater than that of air, by ensuring that the second adhesive 43 and the radiating element 11 do not overlap along the thickness direction of the first substrate 10, the dielectric loss of the radio frequency signal between the first substrate 10 and the fourth substrate 33 can be reduced, thereby improving the radiation efficiency of the antenna.

[0179] The specific shape of the second adhesive 43 can be as follows: Figures 25-27 The shape shown is square, but it is not limited to this. In other embodiments, the range of the second adhesive 43 can be adjusted according to actual needs.

[0180] It should be noted that the smaller the thickness of the second adhesive 43, the smaller the dielectric loss of the radio frequency signal between the first substrate 10 and the fourth substrate 33, which is beneficial to improving the radiation efficiency of the antenna. However, if the thickness of the second adhesive 43 is too small, it will affect the adhesion of the second adhesive 43. Therefore, the thickness of the second adhesive 43 can be set according to the material of the second adhesive 43.

[0181] For example, when the second adhesive 43 is a frame adhesive, the thickness of the second adhesive 43 can be set to about 100 micrometers, that is, its thickness can be set from 100μm to 1000μm. While ensuring the bonding firmness between the first substrate 10 and the fourth substrate 33, the second adhesive 43 can have a thinner thickness, thereby making the dielectric loss of the second adhesive 43 on the radio frequency signal smaller, which is beneficial to improving the radiation efficiency of the antenna.

[0182] Figure 28 This is a schematic diagram of the cross-sectional structure of another antenna provided in an embodiment of the present invention, as shown below. Figure 28 As shown, optionally, the first substrate 10 and the fourth substrate 33 are the same substrate.

[0183] like Figure 28 As shown, in this embodiment, by setting the first substrate 10 and the fourth substrate 33 to be the same substrate, the overall thickness of the substrate can be reduced, which is beneficial to the thinner and lighter design of the antenna; at the same time, it can also reduce the dielectric loss of radio frequency signals on the substrate, which is beneficial to improving the radiation efficiency of the antenna.

[0184] in, Figure 28 The antenna structure shown is similar to Figure 27 The difference in the antenna structure shown is that the first substrate 10 and the fourth substrate 33 share the same substrate. The same or corresponding structures and terms as described in the above embodiments will not be repeated here.

[0185] Figure 29 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 30 for Figure 29 A schematic diagram of the cross-sectional structure along the H-H' direction, as shown below. Figures 4-30 As shown, microstrip line 13 can optionally be floating, or microstrip line 13 can be grounded.

[0186] For example, such as Figures 4-28As shown, the microstrip line 13 can be floating, meaning it is not electrically connected to any signal lines and does not receive any signals. This configuration simplifies the connection structure of the microstrip line 13 and makes it easy to implement. Furthermore, there is no need to drill holes in the first substrate 10 to connect the microstrip line 13 to other structures. In schemes using liquid crystal phase shifters 14, this also avoids penetrating the liquid crystal cell and causing liquid crystal leakage.

[0187] In other embodiments, such as Figure 29 and Figure 30 As shown, the microstrip line 13 can also be grounded. By grounding the microstrip line 13, it is less susceptible to the effects of static electricity accumulation in the external environment, which can prevent phase drift or frequency drift of the radio frequency signal. It can also make the parasitic electric field formed on the microstrip line 13 more stable, thereby making the compensation of the direct coupling field between adjacent radiating units 11 more stable and the decoupling effect more stable.

[0188] It should be noted that in the antenna structure provided in any of the above embodiments, the microstrip line 13 can be grounded to make the antenna work more stably. Those skilled in the art can make the setting according to actual needs, which will not be elaborated here.

[0189] Continue to refer to Figure 29 and Figure 30 Optionally, the antenna provided in this embodiment of the invention further includes a ground metal layer 19. The ground metal layer 19 is located on the side of the first substrate 10 away from the radiating element 11, and along the thickness direction of the first substrate 10, the ground metal layer 19 at least partially overlaps with the radiating element 11. The first substrate 10 includes a second through-hole 102, and along the thickness direction of the first substrate 10, the second through-hole 102 at least partially overlaps with the microstrip line 13, and the microstrip line 13 is connected to the ground metal layer 19 through the second through-hole 102.

[0190] Specifically, such as Figure 29 and Figure 30 As shown, the microstrip line 13 can be electrically connected to the ground metal layer 19 through the second through-hole 102 on the first substrate 10 to achieve grounding of the microstrip line 13. This eliminates the need for additional grounding interfaces on the microstrip line 13, resulting in a simpler structure. Furthermore, when the first substrate 10 is a glass substrate, the second through-hole 102 can be implemented using single-substrate glass drilling technology, making the process easy to implement.

[0191] It should be noted that the diameter of the second through-hole 102 can also be optimized through simulation design based on the requirements of the antenna's operating frequency, impedance matching, radiation performance, and loss. For example, the diameter of the second through-hole 102 can be set to be on the same order of magnitude as the antenna's operating wavelength to achieve a better decoupling effect. For instance, if the decoupling structure 12 is applied to a millimeter-wave antenna, the second through-hole 102 is on the order of millimeters; if the decoupling structure 12 is applied to a centimeter-wave antenna, the second through-hole 102 is on the order of centimeters.

[0192] Figure 31 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 32 for Figure 31 A schematic diagram of the cross-sectional structure along the I-I' direction, as shown below. Figure 31 and Figure 32 As shown, optionally, a first current-draining microstrip line 137 is provided on the side of the first microstrip line 131 away from the radiating unit group 20. The first current-draining microstrip line 137 extends along the second direction Y, and one end of the first current-draining microstrip line 137 is connected to the first microstrip line 131 at its center. A second current-draining microstrip line 138 is provided on the side of the second microstrip line 132 away from the radiating unit group 20. The second current-draining microstrip line 138 extends along the second direction Y, and one end of the second current-draining microstrip line 138 is connected to the second microstrip line 132 at its center. The vertical projections of the first current-draining microstrip line 137 and the second current-draining microstrip line 138 on the first substrate 10 are symmetrically arranged about the center point O of the vertical projection of the radiating unit group 20 on the first substrate 10.

[0193] Specifically, such as Figure 31 and Figure 32 As shown, in the two microstrip line units 120 of the decoupling structure 12, one microstrip line unit 120 is composed of a first microstrip line 131 and a first drainage microstrip line 137, and the other microstrip line unit 120 is composed of a second microstrip line 132 and a second drainage microstrip line 138. That is, the decoupling structure 12 is composed of four microstrip lines 13: the first microstrip line 131, the first drainage microstrip line 137, the second microstrip line 132, and the second drainage microstrip line 138.

[0194] Among them, such as Figure 31 and Figure 32As shown, the first current-guiding microstrip line 137 and the second current-guiding microstrip line 138 both extend along the second direction Y. One end of the first current-guiding microstrip line 137 is connected to the first microstrip line 131 at the center position of the first microstrip line 131, and one end of the second current-guiding microstrip line 138 is connected to the second microstrip line 132 at the center position of the second microstrip line 132. This makes the vertical projection of the two microstrip line units 120 on the first substrate 10 symmetrical about the center point O of the vertical projection of the radiation unit group 20 on the first substrate 10. This makes the contribution of the parasitic electric field formed on the two microstrip line units 120 to the electric field compensation of the first radiation unit 111 and the second radiation unit 112 symmetrical, avoiding the introduction of new additional coupling electric fields that would be detrimental to the decoupling effect of the decoupling structure 12.

[0195] Meanwhile, the first current-guiding microstrip line 137 can play a current-guiding role. By setting one end of the first current-guiding microstrip line 137 to be connected to the first microstrip line 131 at the center position to form a T-shaped microstrip line structure, the induced charge on the first microstrip line 131 can be concentrated at the connection point of the first current-guiding microstrip line 137 and the first microstrip line 131, that is, the current density at the connection point of the first current-guiding microstrip line 137 and the first microstrip line 131 is the largest, thereby maximizing the parasitic electric field strength at the connection point of the first current-guiding microstrip line 137 and the first microstrip line 131. Consequently, in the first direction X, the parasitic electric field formed on the microstrip line unit 120 where the first current-guiding microstrip line 137 and the first microstrip line 131 are located contributes symmetrically to the electric field compensation of the first radiation unit 111 and the second radiation unit 112, which is beneficial to improving the decoupling effect of the decoupling structure 12.

[0196] Similarly, the second current-guiding microstrip line 138 can also play a current-guiding role. By setting one end of the second current-guiding microstrip line 138 to be connected to the second microstrip line 132 at the center position of the second microstrip line 132 to form a T-shaped microstrip line structure, the induced charge on the second microstrip line 132 can be concentrated at the connection point of the second current-guiding microstrip line 138 and the second microstrip line 132, that is, the current density at the connection point of the second current-guiding microstrip line 138 and the second microstrip line 132 is the largest, thereby maximizing the parasitic electric field strength at the connection point of the second current-guiding microstrip line 138 and the second microstrip line 132. Consequently, in the first direction X, the parasitic electric field formed on the microstrip line unit 120 where the second current-guiding microstrip line 138 and the second microstrip line 132 are located contributes symmetrically to the electric field compensation of the first radiation unit 111 and the second radiation unit 112, which is beneficial to improving the decoupling effect of the decoupling structure 12.

[0197] Figure 33 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 34 for Figure 33 A schematic diagram of the cross-sectional structure along the J-J' direction, as shown below. Figure 33 and Figure 34 As shown, optionally, the first drain microstrip line 137 is grounded and the second drain microstrip line 138 is grounded.

[0198] Specifically, such as Figure 33 and Figure 34 As shown above, when the T-shaped microstrip line structure is excited, the induced charge will be concentrated at the connection point of the first current-guiding microstrip line 137 and the first microstrip line 131, and at the connection point of the second current-guiding microstrip line 138 and the second microstrip line 132. That is, the current density is the largest at the connection point of the first current-guiding microstrip line 137 and the first microstrip line 131, and the parasitic electric field strength is the largest at the connection point of the second current-guiding microstrip line 138 and the second microstrip line 132.

[0199] In this embodiment, by grounding the first current-guiding microstrip line 137 and the second current-guiding microstrip line 138, excessive current density is avoided at the connection points of the first current-guiding microstrip line 137 and the first microstrip line 131, and at the connection points of the second current-guiding microstrip line 138 and the second microstrip line 132. In other words, the accumulation and polarization of charge at the connection points of the first current-guiding microstrip line 137 and the first microstrip line 131, and at the connection points of the second current-guiding microstrip line 138 and the second microstrip line 132, which would generate a secondary coupling field that would disrupt the indirect coupling field, is avoided, thereby ensuring the decoupling effect.

[0200] Continue to refer to Figure 33 and Figure 34 Optionally, a ground metal layer 19 is provided on the side of the first substrate 10 away from the radiation unit 11. The first substrate 10 also includes a third through hole 103. Along the thickness direction of the first substrate 10, at least one third through hole 103 overlaps at least partially with the first drain microstrip line 137 and at least one third through hole 103 overlaps at least partially with the second drain microstrip line 138, so that the first drain microstrip line 137 and the second drain microstrip line 138 are connected to the ground metal layer 19 through the third through hole 103, thereby realizing the grounding of the first drain microstrip line 137 and the second drain microstrip line 138. In the T-shaped microstrip structure, during excitation, the first and second guiding microstrip lines 137 and 138 act as guides, allowing the induced charge to flow to the grounded metal layer 19 via the first and second guiding microstrip lines 137 and 138. This prevents the accumulation of charge at the connection points of the first and second guiding microstrip lines 137 and 131, and the connection points of the second and second guiding microstrip lines 138 and 132, which would generate a secondary coupling field that would disrupt the indirect coupling field, thus ensuring the decoupling effect.

[0201] Meanwhile, no additional interfaces are needed for grounding the first and second microstrip lines 137 and 138, resulting in a simple structure. When the first substrate 10 is a glass substrate, the third through-hole 103 can be achieved using single-substrate glass drilling technology, which is also easy to implement.

[0202] It should be noted that the diameter of the third through-hole 103 can also be optimized through simulation design based on the requirements of the antenna's operating frequency, impedance matching, radiation performance, and loss. For example, the diameter of the third through-hole 103 can be set to be on the same order of magnitude as the antenna's operating wavelength to achieve a better decoupling effect. For instance, if the decoupling structure 12 is applied to a millimeter-wave antenna, the third through-hole 103 is on the order of millimeters; if the decoupling structure 12 is applied to a centimeter-wave antenna, the third through-hole 103 is on the order of centimeters.

[0203] Figure 35 This is a schematic diagram of the simulation results of another antenna provided in an embodiment of the present invention. Taking the first radiating element 111 as working and the second radiating element 112 as not working, i.e. only feeding the first radiating element 111, as an example, curve S11-3 represents the return loss of the first radiating element 111 after setting the decoupling structure 12, curve S22-3 represents the return loss of the second radiating element 112 after setting the decoupling structure 12; curve S11-4 represents the return loss of the first radiating element 111 without setting the decoupling structure 12, and curve S22-4 represents the return loss of the second radiating element 112 without setting the decoupling structure 12.

[0204] like Figures 33-35 As shown, after setting the decoupling structure 12 provided in this embodiment of the invention, the return loss of the first radiation unit 111 within the operating bandwidth range does not become larger, indicating that the radiation performance of the first radiation unit 111 is not affected; while the return loss of the second radiation unit 112 within the operating bandwidth range becomes larger, indicating that the influence of the electric field of the first radiation unit 111 on the second radiation unit 112 becomes smaller, and the isolation between the first radiation unit 111 and the second radiation unit 112 is effectively improved.

[0205] Figure 36 This is a schematic diagram of simulation results for another antenna provided in an embodiment of the present invention. The example illustrates the situation where the first radiating element 111 is operational while the second radiating element 112 is not operational, meaning only the first radiating element 111 is fed. Curve S21-3 represents the insertion loss of the first radiating element 111 after the decoupling structure 12 is set, and curve S21-4 represents the insertion loss of the first radiating element 111 without the decoupling structure 12. Figure 33 , Figure 34 and Figure 36As shown, after setting the decoupling structure 12 provided in this embodiment of the invention, the insertion loss of the first radiating unit 111 within the operating bandwidth becomes smaller, indicating that the radiation efficiency of the first radiating unit 111 is effectively improved.

[0206] Figure 37 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 38 for Figure 37 A schematic diagram of the cross-sectional structure along the K-K' direction. Figure 39 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 40 for Figure 39 A schematic diagram of the cross-sectional structure along the L-L' direction, as shown below. Figures 37-40 As shown, optionally, the antenna provided in this embodiment of the invention further includes an impedance matching unit 44, which is connected to the microstrip line 13 in a one-to-one correspondence. The impedance matching unit 44 includes at least one of a resistor, a capacitor, and an inductor.

[0207] Specifically, such as Figures 37-40 As shown, each microstrip line 13 is connected to an impedance matching unit 44. As mentioned earlier, when the radiating unit 11 is fed, a parasitic electric field is coupled on the microstrip line 13. The impedance matching unit 44 is used to adjust the load size of the microstrip line 13. The different load sizes of the microstrip line 13 can adjust the ease of radiation of the parasitic electric field on the microstrip line 13, and thus adjust the strength of the compensation electric field formed by the parasitic electric field on the microstrip line 13 coupled on the adjacent radiating unit 11, so that the strength of the compensation electric field matches the strength of the coupled electric field formed directly on the radiating unit 11, thereby just canceling the coupled electric field formed directly on the radiating unit 11, and minimizing the influence of the electric field generated by the working radiating unit 11 on the electric field of the adjacent radiating unit 11.

[0208] Furthermore, the impedance matching unit 44 may include at least one of a resistor, a capacitor, and an inductor. For example, the impedance matching unit 44 may be an RLC circuit, specifically a circuit structure of a resistor in series, an inductor in parallel, and a capacitor. The resistor may be a variable resistor, and / or the capacitor may be a variable capacitor, etc., to achieve flexible adjustment of the load, thereby realizing dynamic compensation of the mutual coupling electric field between adjacent radiating units 11, so as to improve the stability of the indirect coupling field and ensure the decoupling effect.

[0209] Continue to refer to Figures 37-40The impedance matching unit 44 can be electrically connected to the control flexible circuit board 45. By binding the corresponding control integrated circuit to the control flexible circuit board 45, the control integrated circuit can transmit load control signals to the impedance matching unit 44 through the control flexible circuit board 45, thereby adjusting the load size of the impedance matching unit 44. Furthermore, the coupling between different radiation units 11 can be dynamically adjusted in the control integrated circuit, and compensation algorithms and optimization algorithms can be integrated to achieve the optimal decoupling effect.

[0210] It should be noted that in the antenna structure provided in any of the above embodiments, microstrip lines 13 can be set to connect accordingly to achieve dynamic compensation of the mutual coupling electric field between adjacent radiating elements 11, improve the stability of the indirect coupling field, and ensure the decoupling effect. Those skilled in the art can set it according to actual needs, which will not be elaborated here.

[0211] Figure 41 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 42 for Figure 41 A schematic diagram of the cross-sectional structure along the M-M' direction. Figure 43 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 44 for Figure 43 A schematic diagram of the cross-sectional structure along the N-N' direction, as shown below. Figures 41-44 As shown, optionally, the antenna provided in this embodiment of the invention further includes a radio frequency chip 46, which is electrically connected or coupled to the microstrip line 13. The radio frequency chip 46 is used to apply additional radio frequency signals to the microstrip line 13.

[0212] Specifically, such as Figures 41-44 As shown, the antenna also includes a radio frequency (RF) chip 46. The RF chip 46 can apply an additional RF signal to the microstrip line 13 to create an additional electric field on the microstrip line 13. This additional electric field, superimposed on the parasitic electric field formed by the microstrip line 13, couples onto the radiating element 11 to form a compensation electric field, compensating for the coupling electric field directly coupled onto the radiating element 11. The intensity and waveform of the additional electric field can be finely adjusted by the RF chip 46 to match the intensity of the compensation electric field with the intensity of the coupling electric field directly coupled onto the radiating element 11, thus precisely canceling out the coupling electric field directly coupled onto the radiating element 11 and achieving optimal decoupling.

[0213] For example, if a stronger compensation electric field is needed to cancel the coupling electric field formed by direct coupling on the radiating unit 11, an additional electric field that can enhance the parasitic electric field can be superimposed on the microstrip line 13 by the radio frequency chip 46; if a weaker compensation electric field is needed to cancel the coupling electric field formed by direct coupling on the radiating unit 11, an additional electric field that can weaken the parasitic electric field can be superimposed on the microstrip line 13 by the radio frequency chip 46.

[0214] For example, the waveform of the additional radio frequency signal can be adjusted by the radio frequency chip 46 to adjust the maximum radiation direction of the superimposed electric field on the microstrip line 13, thereby causing the parasitic electric field on the microstrip line 13 to be superimposed with the additional electric field to be shifted to the desired radiation direction.

[0215] By adopting the above technical solution, the coupling between different radiating units 11 can be dynamically adjusted in the RF chip 46, and compensation algorithms and optimization algorithms can be integrated to achieve the best decoupling effect.

[0216] Continue to refer to Figure 41 and Figure 42 The microstrip line 13 can be electrically connected to the control flexible circuit board 45. This allows the RF chip 46 to be bonded to the control flexible circuit board 45, enabling the RF chip 46 to transmit additional RF signals to the microstrip line 13 through the control flexible circuit board 45. This achieves the adjustment of the additional electric field on the microstrip line 13. At this time, the RF chip 46 and the microstrip line 13 are electrically connected. The coupling between different radiating units 11 can be dynamically adjusted in the RF chip 46. Compensation algorithms and optimization algorithms can be integrated to achieve the optimal decoupling effect.

[0217] Continue to refer to Figure 43 and Figure 44 The radio frequency chip 46 can be placed on the fifth substrate 34. The radio frequency chip 46 can transmit additional radio frequency signals to the microstrip line 13 through the additional hollow waveguide 322 to adjust the additional electric field on the microstrip line 13. At this time, the radio frequency chip 46 and the microstrip line 13 are coupled. The coupling between different radiating units 11 can be dynamically adjusted in the radio frequency chip 46, and compensation algorithms and optimization algorithms can be integrated to achieve the optimal decoupling effect.

[0218] Continue to refer to Figure 41 and Figure 42 The RF chip 46 can be a different chip from the antenna feed RF chip 36. The antenna feed RF chip 36 is used to provide RF signals to the radiating element 11, and the RF chip 46 is used to provide additional RF signals to the microstrip line 13. Thus, the above functions can be achieved using a lower-cost RF chip.

[0219] Continue to refer to Figure 43 and Figure 44 The RF chip 46 can also be the same chip as the antenna feed RF chip 36, that is, a single chip can be used to simultaneously provide RF signals to the radiating element 11 and additional RF signals to the microstrip line 13, thereby reducing the space occupied by the RF chip and facilitating the high integration and miniaturization design of the antenna.

[0220] It should be noted that the method of adjusting the parasitic electric field on the microstrip line 13 is not limited to the above embodiments. In other embodiments, the parasitic electric field on the microstrip line 13 can also be adjusted by connecting the microstrip line 13 to an external independent liquid crystal phase shifter. For example, an SMA or SMP interface or other radio frequency connector can be connected to one end of the microstrip line 13, and a corresponding radio frequency connector can also be provided on the liquid crystal cell of the external liquid crystal phase shifter to realize the connection between the microstrip line 13 and the external liquid crystal phase shifter. Then, the parasitic electric field on the microstrip line 13 can be adjusted by the external liquid crystal phase shifter to achieve the optimal decoupling effect. The embodiments of the present invention do not specifically limit this.

[0221] Figure 45 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 46 This is a schematic diagram of another antenna structure provided in an embodiment of the present invention. Figure 47 A schematic diagram of another antenna structure provided in an embodiment of the present invention is shown below. Figures 45-47 As shown, optionally, in any row of radiating elements 11, any two adjacent radiating elements 11 are provided with a decoupling structure 12. In any column of radiating elements 11, any two adjacent radiating elements 11 are provided with a decoupling structure 12.

[0222] For example, Figure 45 The diagram shows the two-dimensional layout of the decoupling structure 12, consisting of two microstrip lines 13, in a radiating element array. Figure 46 The diagram shows the two-dimensional layout of the decoupling structure 12, consisting of four microstrip lines 13, in a radiating element array. Figure 47 The diagram shows a two-dimensional layout of the decoupling structure 12 with a T-shaped microstrip line structure in a radiating unit array, as shown below. Figures 45-47As shown, the antenna can be configured with multiple radiating elements 11 arranged in an array. In each row of radiating elements 11, any two adjacent radiating elements 11 are provided with a decoupling structure 12. In each column of radiating elements 11, any two adjacent radiating elements 11 are also provided with a decoupling structure 12. This can compensate for and cancel the direct coupling field between any two adjacent radiating elements 11, reduce the mutual coupling between any two adjacent radiating elements, and improve the isolation between any two adjacent radiating elements 11. This solves the problem of strong mutual coupling between adjacent radiating elements in an antenna with closely arranged radiating elements 11, which is beneficial to improving the integration of the antenna.

[0223] It should be noted that the number and layout of the radiating elements 11 can be set according to actual needs, and the embodiments of the present invention do not limit this.

[0224] Continue to refer to Figure 45 and Figure 47 Optionally, any two adjacent rows of radiating elements 11 may share at least one microstrip line 13, and any two adjacent columns of radiating elements 11 may share at least one microstrip line 13.

[0225] For example, Figure 45 The diagram illustrates a two-dimensional layout of a decoupling structure 12 composed of two microstrip lines 13 in a radiating element array. The decoupling structures 12 corresponding to any two adjacent rows of radiating elements 11 can share at least one microstrip line element 120, thereby reducing the space occupied by the decoupling structure 12 between adjacent rows of radiating elements 11. This, while ensuring isolation, is beneficial for the high integration and miniaturization design of the antenna. Similarly, the decoupling structures 12 corresponding to any two adjacent columns of radiating elements 11 can also share at least one microstrip line element 120, thereby reducing the space occupied by the decoupling structure 12 between adjacent columns of radiating elements 11. This, while ensuring isolation, is beneficial for the high integration and miniaturization design of the antenna.

[0226] Figure 47 The diagram illustrates a two-dimensional layout of a decoupling structure 12 with a T-shaped microstrip line structure in a radiating element array. The decoupling structures 12 corresponding to any two adjacent rows of radiating elements 11 can share at least one microstrip line 13, thereby reducing the space occupied by the decoupling structures 12 between adjacent rows of radiating elements 11. This, while ensuring isolation, is beneficial for the high integration and miniaturization design of the antenna. Similarly, the decoupling structures 12 corresponding to any two adjacent columns of radiating elements 11 can also share at least one microstrip line 13, thereby reducing the space occupied by the decoupling structures 12 between adjacent columns of radiating elements 11. This, while ensuring isolation, is beneficial for the high integration and miniaturization design of the antenna.

[0227] It should be noted that the two-dimensional layout structure of the decoupling structure 12 in the radiating element array is not limited to the above embodiments. In other embodiments, the decoupling structure 12 may also adopt other layout structures in the radiating element array. The embodiments of the present invention do not make specific limitations on this.

[0228] The antenna provided in the embodiments of the present invention can be an antenna of the type of liquid crystal antenna or phased array antenna, but is not limited to this. It is understood that in any antenna with multiple radiating elements, the decoupling structure provided in any embodiment of the present invention can be used to reduce the mutual coupling between adjacent radiating elements, improve the isolation between radiating elements, and thus solve the problem that there will be strong mutual coupling between adjacent radiating elements in antennas with closely placed radiating elements, thereby improving the integration of the antenna.

[0229] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. An antenna, characterized in that, It includes a first substrate, a plurality of radiating units and at least one decoupling structure, wherein the plurality of radiating units are arranged in an array on one side of the first substrate; At least two adjacent radiation units constitute a radiation unit group, and the radiation unit group includes a first radiation unit and a second radiation unit arranged adjacent to each other. The decoupling structure is configured correspondingly to the radiating unit group, and the decoupling structure includes two microstrip line units, each of which includes at least one microstrip line. The first radiating element and the second radiating element are disposed in the same layer and arranged along the first direction; Along the second direction, the two microstrip line units are located on opposite sides of the radiating unit group, and the vertical projections of the two microstrip line units on the first substrate are symmetrically arranged about the center point of the vertical projection of the radiating unit group on the first substrate. Wherein, the second direction intersects with the first direction; One of the two microstrip line units includes a third microstrip line and a fourth microstrip line arranged along the first direction, and the third microstrip line and the fourth microstrip line are insulated from each other; the other includes a fifth microstrip line and a sixth microstrip line arranged along the first direction, and the fifth microstrip line and the sixth microstrip line are insulated from each other. The third microstrip line, the fourth microstrip line, the fifth microstrip line and the sixth microstrip line all extend along the first direction; Along the second direction, the third microstrip line and the fifth microstrip line at least partially overlap with the first radiating element, and the fourth microstrip line and the sixth microstrip line at least partially overlap with the second radiating element; The third and fifth microstrip lines are located on opposite sides of the first radiating unit, and the fourth and sixth microstrip lines are located on opposite sides of the second radiating unit. A straight line passing through the center point and extending along the first direction is used as the first axis of symmetry. The vertical projections of the third and fifth microstrip lines onto the first substrate are symmetrical about the first axis of symmetry, and the vertical projections of the fourth and sixth microstrip lines onto the first substrate are symmetrical about the first axis of symmetry. A straight line passing through the center point and extending along the second direction is used as the second axis of symmetry. The vertical projections of the third and fourth microstrip lines onto the first substrate are symmetrical about the second axis of symmetry, and the vertical projections of the fifth and sixth microstrip lines onto the first substrate are symmetrical about the second axis of symmetry.

2. The antenna according to claim 1, characterized in that, The microstrip line is disposed in the same layer as the radiating unit.

3. The antenna according to claim 1, characterized in that, The antenna further includes a liquid crystal phase shifter located on the side of the first substrate away from the radiating unit. The liquid crystal phase shifter includes a second substrate and a third substrate disposed opposite to each other. The third substrate is located on the side of the second substrate away from the radiating unit. The liquid crystal phase shifter also includes a delay line, a liquid crystal layer, and a ground metal layer; The liquid crystal layer is located between the second substrate and the third substrate, the delay line is located between the third substrate and the liquid crystal layer, and the ground metal layer is located between the second substrate and the liquid crystal layer; The grounding metal layer includes a first hollow portion, and the radiating unit covers the first hollow portion along the thickness direction of the first substrate.

4. The antenna according to claim 3, characterized in that, The microstrip line and the delay line are arranged on the same layer; The grounding metal layer includes a second cutout portion that covers the microstrip line along the thickness direction of the first substrate.

5. The antenna according to claim 3, characterized in that, The first substrate and the second substrate are bonded together by a first adhesive. Along the thickness direction of the first substrate, there is a gap between the first adhesive and the radiating unit.

6. The antenna according to claim 3, characterized in that, The first substrate and the second substrate are the same substrate.

7. The antenna according to claim 1, characterized in that, The antenna also includes a grounded metal layer and a coaxial cable interface; The grounding metal layer is located on the side of the first substrate away from the radiating unit, and along the thickness direction of the first substrate, the grounding metal layer at least partially overlaps with the radiating unit. The coaxial cable interface is located on the side of the grounding metal layer away from the radiating unit. The first substrate includes a first through hole, and the coaxial cable interface is connected to the radiating unit through the first through hole.

8. The antenna according to claim 1, characterized in that, The antenna further includes a waveguide structure located on the side of the first substrate away from the radiating element. The waveguide structure includes a fourth substrate and a fifth substrate disposed opposite to each other, and the fifth substrate is located on the side of the fourth substrate away from the radiating element. The waveguide structure includes a hollow waveguide and a grounded metal layer; The hollow waveguide is located between the fourth substrate and the fifth substrate, and the grounding metal layer is located between the fourth substrate and the hollow waveguide; The grounding metal layer includes a third hollow portion. Along the thickness direction of the first substrate, the radiating unit covers the third hollow portion, and the hollow waveguide at least partially overlaps with the third hollow portion. The hollow waveguide is used to feed the radio frequency signal provided by the feed source into the radiating unit.

9. The antenna according to claim 8, characterized in that, The first substrate and the fourth substrate are bonded together by a second adhesive. Along the thickness direction of the first substrate, there is a gap between the second adhesive and the radiating unit.

10. The antenna according to claim 8, characterized in that, The first substrate and the fourth substrate are the same substrate.

11. The antenna according to any one of claims 1-10, characterized in that, The microstrip line is either floating or grounded.

12. The antenna according to claim 11, characterized in that, The antenna also includes a grounded metal layer; The grounding metal layer is located on the side of the first substrate away from the radiating unit, and along the thickness direction of the first substrate, the grounding metal layer at least partially overlaps with the radiating unit. The first substrate includes a second via. Along the thickness direction of the first substrate, the second via at least partially overlaps with the microstrip line, and the microstrip line is connected to the ground metal layer through the second via.

13. The antenna according to claim 1, characterized in that, The antenna also includes an impedance matching unit, which is connected to the microstrip line in a one-to-one correspondence. The impedance matching unit includes at least one of a resistor, a capacitor, and an inductor.

14. The antenna according to claim 1, characterized in that, The antenna also includes a radio frequency (RF) chip, which is electrically connected or coupled to the microstrip line and is used to apply additional RF signals to the microstrip line.

15. The antenna according to claim 1, characterized in that, In any row of the radiating elements, any two adjacent radiating elements are provided with the decoupling structure. In any column of the radiating elements, any two adjacent radiating elements are provided with the decoupling structure.

16. The antenna according to claim 15, characterized in that, At least one microstrip line is shared between any two adjacent rows of the radiating elements. At least one microstrip line is shared between any two adjacent columns of the radiating elements.

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