Connector and method of manufacturing the same

Abstract

The present invention is a connector and a manufacturing method thereof. The connector includes a substrate, a cover layer, and a terminal. The substrate has a first surface and a second surface opposite to each other, and a conductive via extending to the first surface and the second surface. The cover layer is disposed on the first surface and has a first opening. The terminal has a fixing member, a lifting member, and a pin. The fixing member is disposed between the substrate and the cover layer. The lifting member extends from the fixing member in a direction away from the substrate and passes through the first opening, wherein a first portion of the lifting member is located within the first opening, and a second portion of the lifting member is located outside the first opening. The pin extends from the fixing member into the conductive via and electrically connects the conductive via. The terminal used in the connector of the present invention can simplify the manufacturing steps of the connector.

Description

Technical Field

[0001] This disclosure provides a connector and a method for manufacturing the same, particularly a connector with pins and a method for manufacturing the same. Background Technology

[0002] With the rapid development of the technology industry, electronic products are becoming increasingly diverse in form and function. Therefore, circuit boards (PCBs) used in electronic products have become crucial components in related technologies. To expand the applications of PCBs, various types of terminals can be configured on them to connect PCBs with other electronic components or to connect multiple PCBs, enabling signal transmission or power supply. Summary of the Invention

[0003] According to some embodiments of this disclosure, a connector includes a substrate, a cover layer, and terminals. The substrate has a first surface and a second surface opposite to each other, and conductive vias extending to the first surface and the second surface. The cover layer is disposed on the first surface and has a first opening. The terminals have a retainer, an extender, and pins. The retainer is disposed between the substrate and the cover layer. The extender extends from the retainer in a direction away from the substrate and through the first opening, wherein a first portion of the extender is located within the first opening, and a second portion of the extender is located outside the first opening. The pins extend from the retainer into the conductive vias and are electrically connected to the conductive vias.

[0004] In some embodiments, the pin directly contacts the inner wall of the conductive via. In some embodiments, the pin has an end and a connecting end. The end is located within the conductive via and has a first width, wherein the first width is smaller than the diameter of the conductive via. The connecting end connects to a fixing member relative to the end, wherein the connecting end has a second width, wherein the second width is larger than the diameter of the conductive via. In some embodiments, the width of the pin between the end and the connecting end is not greater than the second width. In some embodiments, the width of the pin increases from the end to the connecting end. In some embodiments, the ratio of the second width to the diameter of the conductive via is between 1.1 and 1.3.

[0005] In some embodiments, the pin has a cutout portion that extends from the connecting end to the end. In some embodiments, the cutout portion has a third width, the ratio of the third width to the second width being between 0.25 and 0.50.

[0006] In some embodiments, the connector further includes an adhesive layer disposed between the retainer and the substrate, and has a second opening formed on the conductive via, wherein the width of the second opening is equal to or greater than the diameter of the conductive via such that pins pass through the second opening and are inserted into the conductive via. In some embodiments, the adhesive layer is exposed in the first opening.

[0007] According to other embodiments of this disclosure, a method of manufacturing a connector includes providing a substrate and providing a first cover layer and a plurality of first terminals attached to the first cover layer. The substrate has a first surface, a second surface opposite the first surface, and conductive vias, wherein the conductive vias extend to the first surface and the second surface. The first cover layer has a first opening. Each first terminal has a retainer for connecting the first cover layer, an extension extending from the retainer and through the first opening, and a pin extending from the retainer in a direction away from the first opening. A portion of the extension extends beyond the first opening. The method of manufacturing the connector further includes configuring the first cover layer and the plurality of first terminals attached to the first cover layer onto a first surface of the substrate, inserting the pins into the conductive vias, and electrically connecting the pins to the conductive vias. The retainer is located between the substrate and the first cover layer.

[0008] In some embodiments, electrically connecting pins to conductive vias includes making the pins directly contact the conductive vias.

[0009] In some embodiments, the fabrication step of attaching a first terminal to the first cover layer includes providing a metal foil layer and a patterned metal foil layer to form a plurality of planar terminals, wherein the planar terminals are interconnected, and each planar terminal has an upward portion and a pin portion. The fabrication step of attaching a first terminal to the first cover layer further includes stamping the planar terminals such that the upward portion and pin portion of each planar terminal are bent in opposite directions to form a first terminal, wherein the upward portion forms an upward member, and the pin portion forms a pin. The fabrication step of attaching a first terminal to the first cover layer further includes attaching a metal foil layer to the first cover layer, the upward member passing through a first opening in the first cover layer and a portion of the upward member extending beyond the first opening. The fabrication step of attaching a first terminal to the first cover layer further includes patterning a metal foil layer to separate the first terminals, wherein the first terminals remain attached to the first cover layer.

[0010] In some embodiments, patterning a metal foil layer to form a planar terminal includes forming a cutout in the pin portion. In some embodiments, the cutout is located within the conductive via after the pin is inserted into it.

[0011] In some embodiments, the method of manufacturing a connector further includes configuring an adhesive layer on a first surface of a substrate, wherein the adhesive layer has a second opening and a conductive via is exposed in the second opening.

[0012] In some embodiments, after the pin is inserted into the conductive via, the retainer directly contacts the adhesive layer. In some embodiments, inserting the pin into the conductive via includes continuously moving the pin within the conductive via until the pin directly contacts the conductive via.

[0013] In some embodiments, the method of manufacturing a connector further includes providing a second cover layer and a plurality of second terminals attached to the second cover layer, wherein the second cover layer is substantially identical to the first cover layer, and the second terminals are substantially identical to the first terminals. The method of manufacturing a connector further includes, while configuring the first cover layer and the first terminals attached to the first cover layer to a first surface of a substrate, configuring the second cover layer and the second terminals attached to the second cover layer to a second surface of the substrate.

[0014] The connector provided by the embodiments of this disclosure has a simple manufacturing method. The connector terminals are designed with protruding pins, and the terminals and conductive vias are electrically connected by direct contact through the insertion of the pins, thereby simplifying the connector manufacturing process. Attached Figure Description

[0015] Please read the following embodiments in conjunction with the accompanying drawings for a clear understanding of the viewpoints of this disclosure. It should be noted that, according to industry standard practice, the various features are not drawn to scale. In fact, for the sake of clear discussion, the dimensions of the various features may be arbitrarily enlarged or reduced.

[0016] Figure 1 , Figure 2 , Figure 3A , Figure 3B , Figure 3C , Figure 4A , Figure 4B , Figure 4C and Figure 4D Views illustrating various stages of terminal manufacturing are provided based on some embodiments of this disclosure.

[0017] Figure 5 , Figure 6A , Figure 6B and Figure 6C Views illustrating various stages of connector manufacturing are shown according to some embodiments of this disclosure.

[0018] [Explanation of Key Component Symbols]

[0019] 100: Metal foil layer; 110: Planar terminal

[0020] 120: Upward section 130: Stitch section

[0021] 132: Openwork section 140: Openwork area

[0022] 210: Terminal 220: Upward component

[0023] 230: Stitch 232: End

[0024] 234: Connecting end; 240: Fixing component

[0025] 300: Cover layer; 302: Opening

[0026] 400: Substrate; 402: Conductive via

[0027] 500: Adhesive layer; 502: Opening

[0028] 600: Connector D: Diameter

[0029] S1: First surface; S2: Second surface

[0030] W1: First width W2: Second width

[0031] AA: line BB: line Detailed Implementation

[0032] When an element is referred to as "on," it can mean that the element is directly on another element, or that another element exists between the two. Conversely, when an element is referred to as "directly on" another element, it cannot mean that another element exists between the two. As used herein, the term "and / or" includes any combination of one or more of the listed related items.

[0033] In this document, the use of terms such as first, second, and third, etc., to describe various elements, components, regions, layers, and / or blocks is understandable. However, these elements, components, regions, layers, and / or blocks should not be limited by these terms. These terms are limited to identifying individual elements, components, regions, layers, and / or blocks only. Therefore, the first element, component, region, layer, and / or block mentioned below may also be referred to as the second element, component, region, layer, and / or block without departing from the intent of this disclosure.

[0034] Furthermore, to facilitate the description of the relationship between one element or feature in a diagram and another element or feature(s), spatial terms such as "below," "below," "lower part," "above," "upper part," and similar terms may be used. In addition to the orientations shown in the diagrams, spatial terms also cover different orientations of the device in use or operation. When the device is turned to a different orientation (e.g., rotated 90 degrees or otherwise), the spatial adjectives used therein will also be interpreted according to the orientation after the turn.

[0035] Methods for manufacturing connectors may include etching processes, electroplating processes, or seed layer processes prior to electroplating to electrically connect terminals and a substrate. When there are many manufacturing processes, it is more difficult to improve the yield of the final connector, potentially increasing manufacturing costs. The connector provided in this disclosure has a simplified manufacturing method. The connector terminals are designed with protruding pins. By inserting the pins into the conductive vias of the substrate and electrically connecting the terminals to the conductive vias of the substrate through direct contact, steps such as electroplating and pre-plating seed layer growth are eliminated. This simplifies the process, reduces process costs, and improves connector yield.

[0036] Figure 1 , Figure 2 , Figure 3A , Figure 3B , Figure 3C , Figure 4A , Figure 4B , Figure 4C and Figure 4D Views illustrating various stages of terminal manufacturing are provided based on some embodiments of this disclosure. Figure 1 , Figure 2 , Figure 3A and Figure 4A This is a 3D image. Figure 3B and Figure 4B They are respectively Figure 3A and Figure 4A A stereoscopic view from another perspective. Figure 3C and Figure 4C They are respectively Figure 3A and Figure 4A Cross-sectional view. Figure 4D A schematic diagram of a single terminal is shown based on some embodiments of this disclosure.

[0037] It should be noted that, unless otherwise specified, the order in which these operations or events are described as a series of operations or events in the following embodiments should not be limited. For example, some operations or events may be performed in a different order than those disclosed herein, some operations or events may occur simultaneously, some operations or events may be unnecessary, and / or some operations or events may be repeated. Furthermore, actual processes may require additional operations before, during, or after each step to fully form the terminals. Therefore, this disclosure may briefly describe some of these additional operations.

[0038] Please refer to Figure 1 First, a metal foil layer 100 is provided. The material of the metal foil layer 100 may include gold, silver, copper, nickel, tin, other suitable metals, or alloys of combinations thereof. In some embodiments, the metal foil layer 100 may be a copper foil layer.

[0039] Next, the metal foil layer 100 is patterned to form a plurality of planar terminals 110 interconnected with each other. The planar terminals 110 have raised portions 120 and pin portions 130. In some embodiments, the raised portions 120 and pin portions 130 are coplanar with each other. The pin portions 130 have cutout portions 132. For example, Figure 1 The cutout 132 can be an opening formed through the pin portion 130. In the subsequent process of inserting the terminal into the conductive via, the cutout 132 can provide flexible space for the subsequently formed terminal to shrink in volume (described later). For clarity, in Figure 1 In the perspective view, the sides of the metal foil layer 100 and its derivatives are indicated by a net. Subsequent perspective views (e.g., Figure 2 , Figure 3A , Figure 3B , Figure 4A , Figure 4B , Figure 4D , Figure 5 and Figure 6A It also has the same way of marking.

[0040] Methods for patterning the metal foil layer 100 to form the planar terminal 110 may include machining (e.g., stamping), laser processing, etching techniques (e.g., wet etching), other suitable techniques, or combinations thereof. In embodiments employing wet etching, the method for patterning the metal foil layer 100 may further include configuring photoresist on the metal foil layer 100, forming a photoresist pattern, and etching the metal foil layer 100 through the photoresist pattern.

[0041] To improve the yield of subsequent terminal forming processes, a cutout area 140 is formed around the raised portion 120 and the pin portion 130. The cutout area 140 prevents the formed raised portion 120 and pin portion 130 from contacting the metal foil layer 100, thereby reducing the need for subsequent stamping operations (e.g., Figure 2 The risk of damage to the lifting part 120 and the pin part 130 due to friction with the metal foil layer 100 during operation.

[0042] Please refer to Figure 2 The flat terminal 110 is stamped into a three-dimensional terminal 210. Specifically, the raised portion 120 and the pin portion 130 (see reference) Figure 1 The terminals 210 are bent in opposite directions to form three-dimensional terminals, wherein the bent upward portion 120 forms an upward member 220, and the bent pin portion 130 forms a pin 230. After bending, the upward member 220 and the pin 230 are not coplanar. In some embodiments, the angle between the pin 230 and the metal foil layer 100 is between about 85 degrees and about 95 degrees, for example, about 90 degrees.

[0043] Please refer to Figure 3AThe metal foil layer 100 is attached to the cover layer 300. Specifically, the cover layer 300 has an opening 302 through which the upward-facing member 220 can pass and, in this view (i.e., Figure 3A In the middle section, the pins 230 and other metal foil layers 100 are visible, but are not visible in this view due to being obscured by the covering layer 300. Similarly, for the purpose of clear understanding, in Figure 3A In the perspective view, the side associated with the cover layer 300 is marked with another mesh background. Subsequent perspective views (e.g., Figure 3B , Figure 4A , Figure 4B , Figure 4D , Figure 5 and Figure 6A It also has the same way of marking.

[0044] The metal foil layer 100 and the cover layer 300 can be joined by lamination. The material of the cover layer 300 may include polyimide (PI), polyethylene terephthalate (PET), polyurethane (PU), polyethylene (PE), polyvinyl chloride polymer (PVC), other suitable materials, or any combination of the above materials.

[0045] Please refer to Figure 3B , Figure 3B for Figure 3A A stereoscopic view from another perspective. For example, Figure 3B Depicting the Figure 3A The pins 230 are presented after the structure is flipped 180 degrees. In some embodiments, the opening 302 of the cover layer 300 is smaller than the cutout area 140 of the metal foil layer 100.

[0046] Please refer to Figure 3C , Figure 3C for Figure 3A The cross-sectional view is shown in section [number], and the location of the cross-section is shown in section [number]. Figure 2 Line AA. For clarity, the cross-sections of the cut portion of the metal foil layer 100 and the portion of the terminal 210 are indicated with one mesh background, while the cross-section of the cut portion of the cover layer 300 is indicated with another mesh background. Subsequent cross-sectional views (e.g., Figure 4C , Figure 6B and Figure 6C () is also marked in a similar manner.

[0047] The upward-pointing member 220 can extend and pass through the opening 302, thus the upward-pointing member 220 can be located on opposite sides of the cover layer 300. That is, the extension range of the upward-pointing member 220 is greater than the thickness of the cover layer 300, and it is distributed on the upper and lower sides of the cover layer 300. The upward-pointing member 220 may have a first portion 222 located within the opening 302 of the cover layer 300, and a second portion 224 located outside the opening 302 of the cover layer 300. In other words, the second portion 224 of the upward-pointing member 220 extends beyond the opening 302 and protrudes from one side of the cover layer 300, such as the upper surface of the cover layer 300. Figure 3C As shown.

[0048] Please refer to Figure 4A , Figure 4B and Figure 4C A patterned metal foil layer 100 is used to separate terminals 210, wherein these terminals 210 remain attached to the cover layer 300. Figure 4A Similar to Figure 3A The difference is that the metal foil layer 100, which was originally visible in Figure 3, is removed after the patterning process. Figure 4B From the perspective of the image, it can be clearly described that the originally connected terminals 210 are separated from each other after the patterning process, and a retainer 240 is formed. Therefore, the lifting member 220 extends from the retainer 240 and passes through the opening 302, while the pin 230 extends from the retainer 240 in a direction away from the opening 302.

[0049] exist Figure 4C In this embodiment, the fastener 240 is connected to the cover layer 300 in a contact (e.g., direct contact) manner, wherein the terminals 210 can remain attached to the cover layer 300. In some embodiments, the terminals 210 were originally formed from the metal foil layer 100 in an array, and after being separated into individual terminals 210, the individual terminals 210 can maintain their original array arrangement by remaining attached to the cover layer 300.

[0050] Methods for patterning the metal foil layer 100 to separate the terminals 210 may include machining (e.g., stamping), laser processing, etching techniques (e.g., wet etching), other suitable techniques, or combinations thereof. In embodiments employing wet etching, the method for patterning the metal foil layer 100 may further include configuring photoresist on the metal foil layer 100, forming a photoresist pattern, and etching the metal foil layer 100 through the photoresist pattern.

[0051] Please refer to Figure 4D The shape and construction of a single terminal 210 are further described below. For clarity, Figure 4DThe overlay 300 is not shown to clearly show the terminal 210. The terminal 210 has an upward member 220, a pin 230, and a retainer 240. The pin 230 has an end 232 located away from the retainer 240 and having a first width W1. The pin 230 also has a connecting end 234 connecting to the retainer 240, located relative to the end 232 and having a second width W2, wherein the second width W2 is greater than the first width W1. In some embodiments, the width of the pin 230 increases from the end 232 to the connecting end 234. In other words, the width of the pin 230 between the end 232 and the connecting end 234 may be equal to or less than the second width W2.

[0052] Please refer to Figure 4D and Figure 6C In subsequent processes, since pins 230 can be inserted into the substrate 400 and the conductive via 402 to form the connector 600, the width of pins 230 matches the diameter D of the conductive via 402. To ensure that pins 230 can be inserted into the conductive via 402, the first width W1 of pins 230 can be designed to be smaller than the diameter D of the conductive via 402. The second width W2 of pins 230 can be designed to be larger than the diameter D of the conductive via 402 to ensure that after pins 230 can be inserted into the conductive via 402, pins 230 can directly contact the inner wall of the conductive via 402. In other words, the diameter D of the conductive via 402 can be between the first width W1 and the second width W2.

[0053] In some embodiments, the ratio of the second width W2 to the diameter D of the conductive via 402 is between about 1.1 and about 1.3, for example, 1.1, 1.2, or 1.3. When the ratio of the second width W2 to the diameter D of the conductive via 402 is less than the aforementioned lower limit, the pin 230 may not be able to fit tightly against the inner wall of the conductive via 402, increasing the possibility of poor electrical contact between the pin 230 and the conductive via 402. When the ratio of the second width W2 to the diameter D of the conductive via 402 is greater than the aforementioned upper limit, the pin 230 may not be able to be fully inserted into the conductive via 402, causing the terminal 210 to protrude excessively from the surface of the substrate 400, resulting in an increase in connector thickness or an undesirable connector structure. Additionally, the pin 230 and the conductive via 402 may be designed to interfere with each other.

[0054] The pin 230 has a cutout portion 132 formed therein. Furthermore, the cutout portion 132 can extend from the connecting end 234 to the end 232. The cutout portion 132 has a third width W3, wherein the third width W3 is smaller than the second width W2.

[0055] Please refer to the matching instructions first. Figure 4D and Figure 6CAs mentioned above, since the width of some pins 230 can be designed to be larger than the diameter D of the conductive via 402, during the insertion of pins 230 into the conductive via 402 of the substrate 400, pins 230 may be subjected to slight deformation due to compression from the inner wall of the conductive via 402 (e.g., the width of pins 230 may shrink inward due to compression). In this case, the cutout portion 132 can provide elastic space for the pins 230 to shrink inward. In some embodiments, the ratio of the third width W3 to the second width W2 is between about 0.25 and about 0.50, for example, 0.25, 0.30, 0.35, 0.40, 0.45, and 0.50.

[0056] When the ratio of the third width W3 to the second width W2 is less than the aforementioned lower limit, the elastic space provided by the cutout portion 132 for the pin 230 to retract may be insufficient. This could result in the pin 230 not being fully inserted into the conductive via 402 after the subsequent process of inserting the pin 230 into the conductive via 402, causing the terminal 210 to protrude excessively from the surface of the substrate 400, thus increasing the connector thickness or causing the connector structure to deviate from expectations. When the ratio of the third width W3 to the second width W2 is greater than the aforementioned upper limit, although the elastic space provided by the cutout portion 132 for the pin 230 to retract may be sufficient, the pin 230 may not be able to tightly abut against the inner wall of the conductive via 402, increasing the possibility of poor electrical contact between the pin 230 and the conductive via 402.

[0057] At this point, a terminal 210 having an upward member 220, a pin 230, and a fixing member 240 has been substantially manufactured. Furthermore, the terminal 210 remains attached to the cover layer 300 and arranged in a designed array. The cover layer 300 allows the terminal 210 to maintain this array arrangement.

[0058] Figure 5 , Figure 6A , Figure 6B and Figure 6C Views illustrating various stages of connector manufacturing are shown according to some embodiments of this disclosure. Figure 5 and Figure 6A This is a 3D image. Figure 6B for Figure 6A The cross-sectional diagram, the location of which can be referenced Figure 2 Line AA. Figure 6C for Figure 6A The cross-sectional diagram, the location of which can be referenced Figure 2 BB line.

[0059] It should be noted that, unless otherwise specified, the order in which these operations or events are described as a series of operations or events in the following embodiments should not be limited. For example, some operations or events may be performed in a different order than those disclosed herein, some operations or events may occur simultaneously, some operations or events may be unnecessary, and / or some operations or events may be repeated. Furthermore, actual processes may require additional operations before, during, or after each step to fully form the connector. Therefore, this disclosure may briefly describe some of these additional operations.

[0060] Please refer to Figure 5 A substrate 400 is provided, including a first surface S1, a second surface S2 opposite to the first surface S1, and a conductive via 402, wherein the conductive via 402 extends to the first surface S1 and the second surface S2. Furthermore, a cover layer 300 and a plurality of terminals 210 attached to the cover layer 300 are provided, wherein the pins 230 of each terminal 210 face and are aligned with the respective conductive via 402. It should be noted that, for ease of understanding of the drawings, Figure 5 The conductive via 402 is simplified and only its position in the substrate 400 is shown.

[0061] In some embodiments, an adhesive layer 500 may be disposed on the first surface S1 and the second surface S2 of the substrate 400 to fix the cover layer 300 and the terminal 210 to the substrate 400. The adhesive layer 500 has an opening 502, wherein the position of the opening 502 corresponds to the conductive via 402. For example, the opening 502 is located directly above the conductive via 402, such that the inner wall of the conductive via 402 can be exposed in the opening 502. In some embodiments, the size of the opening 502 may be equal to or greater than the diameter D of the conductive via 402, to facilitate subsequent processes (e.g., Figures 6A to 6C The process pin 230 can pass through the opening 502 and be inserted into the conductive via 402. The material of the adhesive layer 500 may include epoxy resin, silicone resin, or other suitable materials, or any combination of the above materials.

[0062] Please refer to Figure 6A , Figure 6B and Figure 6C Next, a cover layer 300 and several terminals 210 attached to the cover layer 300 are configured onto the first surface S1 and the second surface S2 of the substrate 400, and pins 230 are inserted into the conductive vias 402. Specifically, two pins 230 are inserted into the same conductive via 402 from the first surface S1 and the second surface S2, respectively. Figure 6B and Figure 6CAs shown. After the pin 230 is inserted into the conductive via 402, since the pin 230 is designed to directly contact the inner wall of the conductive via 402, the pin 230 is electrically connected to the conductive via 402 in a direct contact manner.

[0063] Accordingly, the connector 600 can be completed through the above operations, wherein the two terminals 210 inserted into the same conductive via 402 are electrically connected to each other through the conductive via 402. It is worth mentioning that before the several terminals 210 are combined with the substrate 400, the several terminals 210 are separated from each other and are kept in an array arrangement by the cover layer 300; then, the several independent terminals 210 are mechanically combined with the substrate 400, thereby simplifying the manufacturing process.

[0064] In some embodiments, the cover layer 300 and a plurality of terminals 210 may be sequentially disposed on the first surface S1 and the second surface S2. For example, the cover layer 300 and the plurality of terminals 210 may first be disposed on the first surface S1, and then another cover layer 300 and some other terminals 210 may be disposed on the second surface S2, and vice versa. In some other embodiments, the cover layer 300 and the plurality of terminals 210 may be simultaneously disposed on the first surface S1 and the second surface S2. The cover layer 300 and the plurality of terminals 210 may be connected to the substrate 400 by a lamination method.

[0065] As previously mentioned, the individual terminals 210 maintain their original arrangement by remaining attached to the cover layer 300. The arrangement of the terminals 210 attached to the cover layer 300 can be designed to correspond to the arrangement of the conductive vias 402. Therefore, when using the cover layer 300, multiple terminals 210 can be simultaneously inserted into their corresponding conductive vias 402, thereby improving production efficiency. Furthermore, the cover layer 300 can also electrically isolate each terminal 210, such as... Figure 6A As shown.

[0066] In some embodiments using adhesive layer 500 ( Figure 6A (The adhesive layer 500 could not be drawn due to the viewing angle.) The adhesive layer 500 can fix the cover layer 300 and the terminal 210 to the substrate 400 to improve the reliability of the connector 600.

[0067] exist Figure 6B and Figure 6C In the cross-sectional view shown, the conductive via 402 extends to the first surface S1 and the second surface S2, and has a diameter D. It should be noted that... Figure 5 The conductive via 402 is simplified in its depiction to clearly show its position within the substrate 400. Figure 5 The conductive via 402 shown will interact with Figure 6B and Figure 6CThe conductive via 402 shown has some slight discrepancies, but these slight discrepancies do not affect the understanding of the conductive via 402 of this invention by those skilled in the art.

[0068] The retainer 240 of terminal 210 is located between substrate 400 and cover layer 300. In some embodiments using adhesive layer 500, adhesive layer 500 is disposed between retainer 240 and substrate 400 and directly contacts retainer 240 and substrate 400 to secure retainer 240 to substrate 400. Uplift member 220 passes through opening 302 and extends beyond cover layer 300 in a direction away from substrate 400. In some embodiments, adhesive layer 500 is exposed in opening 302. Pin 230 extends from retainer 240 into conductive via 402 and is located within conductive via 402. In this way, cutout portion 132 of pin 230 can also be located within conductive via 402.

[0069] As previously mentioned, the width of the end 232 of pin 230 (e.g., Figure 4D The first width W1) is smaller than the diameter D of the conductive via 402, and the width of the connection end 234 of the pin 230 (e.g., Figure 4D The second width (W2) is greater than the diameter D of the conductive via 402. Furthermore, the width of the pin 230 may increase from the end 232 to the connecting end 234. During the insertion of the pin 230 into the conductive via 402, the pin 230 continuously extends into the conductive via 402 until it abuts against the inner wall of the conductive via 402. In some embodiments, the pin 230 may move towards the interior of the conductive via 402 while rubbing against the inner wall of the conductive via 402. This allows the pin 230 to make close and direct contact with the inner wall of the conductive via 402, facilitating electrical connection between the pin 230 and the conductive via 402.

[0070] Because the width of some pins 230 (e.g., the width adjacent to the connection end 234) is greater than the diameter D of the conductive via 402, in some embodiments, when pins 230 are inserted into the conductive via 402, pins 230 may deform, for example, by being squeezed by the inner wall of the conductive via 402, causing the width of pins 230 to shrink inward to accommodate the size of the conductive via 402. At this time, the cutout portion 132 may also deform as a result to provide elastic space for the pins 230 to retract inward.

[0071] Accordingly, the connector 600 can be completed through the above steps, wherein the two terminals 210 corresponding to the same conductive via 402 are electrically connected to each other by direct contact with the conductive via 402. Compared with existing technologies, such as electroplating and a seed layer process before electroplating to electrically connect the terminals on both sides of the conductive via, the manufacturing method of the connector 600 provided in this disclosure can help simplify the process operation, thereby reducing process costs and improving yield.

[0072] In summary, the connector provided by the embodiments of this disclosure has a simple manufacturing method, wherein the connector terminals are designed with protruding pins. First, several terminals, separate from each other, are fabricated on a cover layer, and these terminals are attached to the cover layer to maintain an array arrangement. Next, the pins of several independent terminals are inserted into conductive vias to electrically connect the terminals and conductive vias in a direct contact manner. This simplifies the connector manufacturing process, thereby reducing manufacturing costs and improving connector yield.

[0073] The foregoing outlines the features of several embodiments of this disclosure, enabling those skilled in the art to more readily understand it. Anyone skilled in the art should understand that this specification can easily serve as a basis for changes or designs to other structures or processes to achieve the same objectives and / or obtain the same advantages as the embodiments of this invention. Anyone skilled in the art will also understand that equivalent structures described above do not depart from the spirit and scope of this invention, and that modifications, substitutions, and alterations can be made without departing from the spirit and scope of this disclosure.

Claims

1. A connector, characterized in that, include: A substrate has a first surface, a second surface opposite to the first surface, and a conductive via extending to the first surface and the second surface; A cover layer disposed on the first surface has a first opening; as well as Terminals, having: A fastener is disposed between the substrate and the cover layer; An upward member extends from the fixing member in a direction away from the substrate and passes through the first opening, wherein a first portion of the upward member is located inside the first opening and a second portion of the upward member is located outside the first opening; as well as A pin extends from the fixing member into the conductive through hole and is electrically connected to the conductive through hole. The pin has an end located in the conductive through hole and a connecting end connected to the fixing member and relative to the end. The end has a first width, and the connecting end has a second width. The width of the pin between the end and the connecting end is not greater than the second width.

2. The connector according to claim 1, characterized in that, The pin makes direct contact with the inner wall of the conductive via.

3. The connector according to claim 1, characterized in that, The first width is smaller than the diameter of the conductive via; and The second width is greater than the diameter of the conductive via.

4. The connector according to claim 3, characterized in that, The width of the pin increases from the end to the connection end.

5. The connector according to claim 3, characterized in that, The ratio of the second width to the diameter of the conductive via is between 1.1 and 1.

3.

6. The connector according to claim 3, characterized in that, The pin has a cutout portion that extends from the connecting end to the end.

7. The connector according to claim 6, characterized in that, The cutout portion has a third width, the ratio of which to the second width is between 0.25 and 0.

50.

8. The connector according to claim 1, characterized in that, Further includes: An adhesive layer is disposed between the fastener and the substrate and has a second opening formed on the conductive via, wherein the width of the second opening is equal to or greater than the diameter of the conductive via such that the pin passes through the second opening and is inserted into the conductive via.

9. The connector according to claim 8, characterized in that, The adhesive layer is exposed in the first opening.

10. A method for manufacturing a connector, characterized in that, include: A substrate is provided having a first surface, a second surface opposite to the first surface, and a conductive via extending to the first surface and the second surface; A first cover layer and a plurality of first terminals attached to the first cover layer are provided, wherein the first cover layer has a first opening, and each of the first terminals has: Fasteners connect the first cover layer; An upward component extends from the fixing component and passes through the first opening, with a portion of the upward component extending beyond the first opening; as well as A pin extends from the fastener in a direction away from the first opening, wherein the pin includes an end with a first width and a connecting end with a second width, the connecting end connecting to the fastener and relative to the end, the width of the pin between the end and the connecting end is not greater than the second width; The first cover layer and the first terminal attached to the first cover layer are disposed on the first surface of the substrate, wherein the fastener is located between the substrate and the first cover layer; Insert the pin into the conductive via, wherein the end is located inside the conductive via; as well as The pin is electrically connected to the conductive via.

11. The method of manufacturing a connector according to claim 10, characterized in that, Electrically connecting the pin to the conductive via includes making the pin directly contact the conductive via.

12. The method of manufacturing a connector according to claim 10, characterized in that, The steps for manufacturing the first terminal attached to the first cover layer include: Provide a metal foil layer; The metal foil layer is patterned to form a plurality of planar terminals, wherein the planar terminals are connected to each other, and each of the planar terminals has an upward portion and a pin portion; The planar terminal is stamped such that the raised portion and the pin portion of each of the planar terminals are bent in opposite directions to form the first terminal, wherein the raised portion forms the raised member and the pin portion forms the pin; The metal foil layer is attached to the first cover layer, the lifting member passes through the first opening in the first cover layer and a portion of the lifting member extends beyond the first opening; and The metal foil layer is patterned to separate the first terminal, wherein the first terminal remains attached to the first cover layer.

13. The method of manufacturing a connector according to claim 12, characterized in that, Patterning the metal foil layer to form the planar terminal includes forming a cutout in the pin portion.

14. The method of manufacturing a connector according to claim 13, characterized in that, After the pin is inserted into the conductive through hole, the cutout portion is located inside the conductive through hole.

15. The method of manufacturing a connector according to claim 10, characterized in that, Further includes: An adhesive layer is disposed on the first surface of the substrate, wherein the adhesive layer has a second opening and the conductive via is exposed in the second opening.

16. The method of manufacturing a connector according to claim 15, characterized in that, After the pin is inserted into the conductive via, the retainer comes into direct contact with the adhesive layer.

17. The method of manufacturing a connector according to claim 10, characterized in that, Inserting the pin into the conductive via includes continuously moving the pin within the conductive via until the pin directly contacts the conductive via.

18. The method of manufacturing a connector according to claim 10, characterized in that, Further includes: A second cover layer is provided and a plurality of second terminals are attached to the second cover layer, wherein the second cover layer is substantially the same as the first cover layer and the second terminals are substantially the same as the first terminals; as well as When the first cover layer and the first terminal attached to the first cover layer are disposed on the first surface of the substrate, the second cover layer and the second terminal attached to the second cover layer are disposed on the second surface of the substrate.

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