Three-dimensional digital microscope

Abstract

The present invention is a three-dimensional digital microscope (100) capable of obtaining positional information of various parts of a semiconductor device. It includes a control unit (50), which generates a three-dimensional line graph including positional information of various parts of the semiconductor device. The control unit (50) obtains a vertical view image of the semiconductor device and multiple stereo images, extracts the contour lines in the vertical view image, generates a vertical view line graph, converts the vertical view line graph into multiple stereo line graphs based on shape parameters stored in the storage unit, repeatedly performs shape parameter adjustment and conversion of the vertical view line graph into each stereo line graph until the converted stereo line graph overlaps with each stereo image, synthesizes the generated vertical view line graph and each stereo line graph overlapping with each stereo image to generate a three-dimensional line graph including positional information of various parts of the semiconductor device, and outputs the positional information of each part in the generated three-dimensional line graph.

Description

Technical Field

[0001] This disclosure relates to the structure of a three-dimensional digital microscope for obtaining positional information of various parts of a three-dimensional object. Background Technology

[0002] As an apparatus for measuring the three-dimensional shape of an object, a confocal laser microscope (see, for example, Patent Document 1) is used. The confocal laser microscope performs a two-dimensional scan of the specimen using a laser beam focused at a single point by an objective lens. The reflected light passes through a pinhole located at a position conjugate to the focal point of the objective lens and is received by a photodetector. This type of confocal laser microscope blocks most of the light from outside the focal point (focal position) with the pinhole, so almost no brightness information is detected from light outside the focal point. Utilizing this characteristic, the confocal laser microscope changes the focal position, thereby obtaining tomographic images of the object at various heights. Through image processing, a three-dimensional image of the object is constructed from multiple tomographic images, and the three-dimensional shape of the object is measured.

[0003] Furthermore, a method is disclosed as follows: using a charge-coupled device (CCD) camera with a microscope to photograph the bonding wire fixed on the XY platform from both left and right directions, and calculating the three-dimensional coordinates of the bonding wire based on the left and right image data (see, for example, Patent Document 2). The method described in Patent Document 2 discloses the following: pre-registering the positions of the pad and the lead wire, setting a small region between the pad and the lead wire including the center line of the wire, detecting the outline of the wire from the small region, repeating the above steps to detect the position of the center line of the wire, and generating a three-dimensional line drawing of the wire based on this.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2011-2715

[0007] Patent Document 2: Japanese Patent Application Publication No. 10-54709 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] In addition, in recent years, there has been a demand for high-precision detection of the shape of all wires connecting the electrodes of a semiconductor chip to the electrodes of a substrate.

[0010] As a method, the method of measuring the shape of each wire individually using a confocal laser microscope, as described in Patent Document 1, is also considered. However, when using a confocal laser microscope, it is difficult to perform image recognition and processing on overlapping wires, resulting in difficulty in accurately measuring the three-dimensional shape of all wires. Moreover, since it is difficult to accurately focus the laser beam on a highly reflective object such as gold used in the wires, the accuracy of the three-dimensional shape measurement is reduced when the confocal laser microscope described in Patent Document 1 is applied to the measurement of the three-dimensional shape of the wires.

[0011] Furthermore, the information regarding the bonding positions of the wires includes various errors such as substrate strain, bonding errors of the semiconductor die, and bonding position errors in wire bonding. Therefore, as described in Patent Document 2, when generating a three-dimensional line drawing based on pre-registered information about the positions or connection points of the pads and leads, the error is large, making it difficult to accurately detect the three-dimensional shape of the wires.

[0012] Therefore, the purpose of this disclosure is to measure the three-dimensional shape of most articles, including wires, with high precision in a short time.

[0013] Technical means to solve the problem

[0014] The three-dimensional digital microscope disclosed herein is a three-dimensional digital microscope capable of obtaining positional information of various parts of a three-dimensional object. It is characterized by comprising: a control unit that generates a three-dimensional line drawing including positional information of various parts of the object; the control unit obtains a vertical view image of the object taken from a vertically upward position and multiple stereoscopic images of the object taken from multiple obliquely upward positions; extracts contour lines from the vertical view image of the object; generates a vertical view line drawing of the object; converts the vertical view line drawing into multiple stereoscopic line drawings based on shape parameters including height information of the object stored in a storage unit; repeatedly performs shape parameter adjustment and conversion of the vertical view line drawing into each stereoscopic line drawing until each converted stereoscopic line drawing overlaps with each stereoscopic image; synthesizes the generated vertical view line drawing and each stereoscopic line drawing overlapping with each stereoscopic image to generate a three-dimensional line drawing including positional information of various parts of the object; and outputs the positional information of each part in the generated three-dimensional line drawing.

[0015] As described above, by repeatedly adjusting the shape parameters and converting the vertical view line drawing into various 3D line drawings until each 3D line drawing overlaps with each 3D image, it is possible to generate 3D line drawings that accurately fit each 3D image. Therefore, it is possible to generate 3D line drawings containing positional information of each part of an object with high precision, and to determine the 3D shape of each part of the object with good accuracy and efficiency.

[0016] In the three-dimensional digital microscope disclosed herein, the object may be a device comprising multiple components and multiple wires connecting the components. The control unit extracts the outlines of each component and each wire in the vertical view image and generates a vertical view line drawing of the device. The shape parameters are the height of each component from the reference plane, the slope of the surface of each component, and the bending parameters of each wire.

[0017] Therefore, it is possible to generate a three-dimensional line drawing of a device that includes multiple components and multiple wires connecting the components with high precision, and to measure the three-dimensional shape of various parts of an object with good accuracy and high efficiency.

[0018] The three-dimensional digital microscope disclosed herein may include: a display unit for displaying images and line graphs; and an input unit for user data input. The control unit displays a vertical view image of an object on the display unit, generates a vertical view line graph from the outline lines in the vertical view image drawn by the user through the input unit, converts the vertical view line graph into various stereo line graphs based on the adjusted shape parameters input by the user from the input unit, and displays the converted stereo line graphs and stereo images on the display unit in an overlapping manner, repeating the above steps.

[0019] As described above, since the outline of the vertical view image drawn by the user on the display is generated as a vertical view line drawing, even vertical view images that are difficult to process can be reliably generated. Furthermore, since the shape parameters are adjusted by the user's input, and the converted 3D line drawings are displayed on the display overlapping with the 3D images, the user can compare the converted 3D line drawings with the 3D images while adjusting the shape parameters until they overlap, thus generating the 3D line drawing desired by the user. Therefore, it is possible to generate a 3D line drawing of the object desired by the user with high accuracy, and to measure the 3D shape of each part of the object with good accuracy and efficiency.

[0020] In the three-dimensional digital microscope disclosed herein, the object may be a device comprising multiple components and multiple wires connecting the components. The control unit generates a vertical view line drawing of the device from the contour lines of each component and each wire in the vertical view image drawn by the user operation input unit. The shape parameters are the height of each component from the reference plane, the slope of the surface of each component, and the bending parameters of each wire.

[0021] Therefore, by using a small number of parameters input by the user, a three-dimensional line drawing of a device including multiple components and multiple wires connecting the components can be generated with high precision, enabling the accurate and efficient determination of the three-dimensional shape of various parts of an object.

[0022] In the three-dimensional digital microscope disclosed herein, the control unit can display a three-dimensional line graph on the display unit, and the position information of a part of the three-dimensional line graph selected by the user operation input unit can be displayed on the display unit.

[0023] Thus, the user can observe the three-dimensional lines displayed on the display. Figure 1 By obtaining the positional information of each part of an object, the three-dimensional shape of each part of the object can be easily measured.

[0024] In the three-dimensional digital microscope disclosed herein, each conductor may have multiple bending points between its starting point and its ending point. The bending parameters are the three-dimensional coordinate positions of each bending point of each conductor. The three-dimensional coordinate positions of each bending point are a set of coordinate positions in the coordinate system formed by the length direction axis extending from the starting point to the ending point of the conductor within the reference plane, the transverse axis extending from the starting point of the conductor in a direction orthogonal to the length direction axis within the reference plane, and the height direction axis extending through the starting point in a direction perpendicular to the reference plane.

[0025] When connecting one component to another using multiple conductors, since each conductor has the same rising and bending shape from its starting point, a single bending parameter can be used to convert the vertical view of the conductors into a three-dimensional view. Therefore, a three-dimensional view of the conductors can be generated with high accuracy by inputting a small number of parameters, enabling accurate and efficient determination of the three-dimensional shape of each part.

[0026] In the three-dimensional digital microscope disclosed herein, the three-dimensional coordinate positions of each bending point may include three-dimensional proportional coordinate positions, which are a group of proportional length direction coordinate positions proportional to the total length of the conductor between the starting point and the ending point, proportional lateral coordinate positions proportional to the total length of the conductor, and proportional height direction coordinate positions proportional to the total length of the conductor.

[0027] In the components where the starting point and ending point are located, and among wires of the same thickness, the position of the bend point at the end of each wire is set to be proportional to the total length of the wire. Therefore, by specifying a ratio relative to the total length of the wire as a bending parameter, the position of the bend point at the end of multiple wires of different lengths can be specified. Thus, the shape of multiple wires contained in a group can be specified by the user inputting a small number of shape parameters.

[0028] In the three-dimensional digital microscope disclosed herein, the control unit can group multiple conductors into multiple groups, including components where the starting point is located, components where the ending point is located, and conductors of common thickness. The control unit extracts the contour lines from the vertical view image to generate a vertical view line drawing. The bending parameters stored in the storage unit include multiple group bending parameters defined for each group. Based on the bending parameters of each group, the control unit converts each vertical view line drawing of each conductor included in each group into multiple stereo line drawings. The adjustment of each group bending parameter and the conversion of each vertical view line drawing of each conductor included in each group into stereo line drawings are repeatedly performed until the converted stereo line drawings of each conductor included in each group overlap with the stereo images of each conductor included in each group.

[0029] In the three-dimensional digital microscope disclosed herein, the control unit can group multiple guide wires into multiple groups, including components where the starting point is located, components where the ending point is located, and guide wires of common thickness. The control unit generates vertical view line drawings of the object from the contour lines of each component and each guide wire in the vertical view image drawn by the user's input unit. The bending parameters stored in the storage unit include multiple group bending parameters defined for each group. Based on the group bending parameters, the control unit converts the vertical view line drawings of each guide wire included in each group into multiple stereoscopic line drawings. Then, based on the adjusted group bending parameters input by the user from the input unit, the control unit converts the vertical view line drawings of each guide wire included in each group into stereoscopic line drawings. The converted stereoscopic line drawings are then displayed on the display unit, overlapping with the stereoscopic images. The above steps are repeated.

[0030] Among components where the starting point and the ending point are located, and among wires of similar thickness, the shapes of the wires are similar. Therefore, by grouping the wires, it is possible to generate 3D line diagrams for each wire that fit the 3D image of each wire by allowing the user to input a small number of bending parameters.

[0031] In the three-dimensional digital microscope disclosed herein, multiple traverses grouped together may each have multiple bends between their start and end points. The bend parameters of the group are the three-dimensional coordinate positions of each bend point common to all traverses in the group. The three-dimensional coordinate positions of each bend point are a group of coordinates formed by the length direction axis extending from the start to the end point of the traverse within the reference plane, the lateral axis extending from the start point of the traverse in a direction orthogonal to the length direction axis within the reference plane, and the height direction axis extending through the start point in a direction perpendicular to the reference plane.

[0032] In components with the starting point and the ending point, and among conductors of similar thickness, the rising and bending shapes of each conductor from the starting point are identical. Therefore, within a group of conductors, the user can adjust the bending parameters of a group to generate 3D line graphs for each conductor that fit the 3D images of each conductor.

[0033] In the three-dimensional digital microscope disclosed herein, the three-dimensional coordinate positions of each bending point may include three-dimensional proportional coordinate positions, which are a group of proportional length direction coordinate positions proportional to the total length of the conductor between the starting point and the ending point, proportional lateral coordinate positions proportional to the total length of the conductor, and proportional height direction coordinate positions proportional to the total length of the conductor.

[0034] Therefore, it is possible to generate 3D line graphs of each conductor that fit the 3D images of each conductor by using a small number of parameters input by the user.

[0035] The effects of the invention

[0036] This disclosure enables the high-precision measurement of the three-dimensional shape of most items, including wires, in a short time. Attached Figure Description

[0037] Figure 1 This is an elevation view showing the system structure of a three-dimensional digital microscope according to the implementation method.

[0038] Figure 2 This is a plan view showing the system structure of a three-dimensional digital microscope according to the implementation method.

[0039] Figure 3 This is an elevation view of a semiconductor device as a three-dimensional object. Figure 2 The detailed elevation view of section A is shown.

[0040] Figure 4 It is a plan view representing a semiconductor device as a three-dimensional object. Figure 2 The detailed plan view of section A is shown.

[0041] Figure 5 This is a functional block diagram representing the structure of a three-dimensional digital microscope for implementing an embodiment.

[0042] Figure 6 It means Figure 5 The diagram shown is constructed from data from the component shape parameter database.

[0043] Figure 7 It means Figure 5 The diagram shown is constructed from data from the bending parameter database.

[0044] Figure 8 It means based on Figure 7The diagram shows the bending parameter data of each conductor calculated from the bending parameter data shown.

[0045] Figure 9 This is a flowchart illustrating the three-dimensional line drawing generation process of a three-dimensional digital microscope according to an implementation method.

[0046] Figure 10 This is a flowchart illustrating the three-dimensional shape measurement operation of a three-dimensional digital microscope according to an embodiment.

[0047] Figure 11 This diagram illustrates the state in which a vertical view image of a semiconductor device, captured by a vertical view camera, is displayed on the display section of the three-dimensional digital microscope in the embodiment.

[0048] Figure 12 This diagram illustrates the state in which a stereoscopic image of a semiconductor device captured by a stereoscopic camera is displayed on the display section of a three-dimensional digital microscope in an embodiment.

[0049] Figure 13 This is a diagram showing a vertical view line drawing obtained by tracing the outline of a vertical view image of a semiconductor device captured by a vertical view camera on the display section of a three-dimensional digital microscope in an embodiment.

[0050] Figure 14 The display is superimposed on the display section of the three-dimensional digital microscope in the embodiment. Figure 12 The stereoscopic image shown is Figure 13 The diagram shown is a vertical view line drawing.

[0051] Figure 15 The shape parameter conversion before adjustment is displayed on the display unit of the three-dimensional digital microscope in the embodiment. Figure 13 The diagram shows a 3D line drawing obtained from the vertical view line drawing.

[0052] Figure 16 The display is superimposed on the display section of the three-dimensional digital microscope in the embodiment. Figure 15 The 3D line drawing shown is consistent with Figure 12 The diagram shown is a 3D image.

[0053] Figure 17 The adjusted shape parameter transformation is displayed on the display unit of the three-dimensional digital microscope in the embodiment. Figure 13 The vertical view line diagram shown is aligned with... Figure 12 The diagram shows a three-dimensional line drawing created by overlapping three-dimensional images.

[0054] Figure 18 This is a flowchart illustrating the other three-dimensional line graph generation actions of a three-dimensional digital microscope in an embodiment.

[0055] Figure 19 This is an elevation view showing the system structure of a three-dimensional digital microscope in other embodiments.

[0056] Figure 20 yes Figure 19 The diagram shows a plan view of the semiconductor device.

[0057] Figure 21 yes Figure 20 Detailed elevation view of part B of the semiconductor device shown.

[0058] Figure 22 yes Figure 20 A detailed plan view of section B of the semiconductor device shown.

[0059] Figure 23 This is a functional block diagram of a three-dimensional digital microscope in other implementations.

[0060] Figure 24 It means Figure 23 The diagram shows the data structure of the conductor grouping database.

[0061] Figure 25 It means Figure 23 The diagram shown is constructed from data from the component shape parameter database.

[0062] Figure 26 It means Figure 23 The diagram shown is constructed from data from the database of group bending parameters.

[0063] Figure 27 It means based on Figure 23 The diagram shows the data constructed from the bending parameter data of each conductor group, calculated from the bending parameter data of each conductor group.

[0064] Figure 28 This is a flowchart illustrating the three-dimensional line graph generation action of a three-dimensional digital microscope in other embodiments.

[0065] Figure 29 This is a flowchart illustrating the three-dimensional line graph generation action of a three-dimensional digital microscope in other embodiments. Figure 28 The flowchart shown is a continuation.

[0066] Figure 30 This refers to the display unit of a three-dimensional digital microscope in other embodiments displaying images taken using a vertical view camera. Figures 19-22 A diagram showing the state of a vertical view image of a semiconductor device.

[0067] Figure 31 This refers to the display unit of a three-dimensional digital microscope in other embodiments displaying images taken using a stereo camera. Figures 19-22 A diagram showing the state of a three-dimensional image of a semiconductor device.

[0068] Figure 32 This refers to the display section of a three-dimensional digital microscope in other embodiments. Figures 19-22 The diagram shows the state of the semiconductor device in a vertical view.

[0069] Figure 33 This refers to the display section of a three-dimensional digital microscope in other embodiments. Figures 19-22 A diagram showing the state of a three-dimensional line drawing of a semiconductor device.

[0070] Figure 34 Is Figure 2 , Figure 3 The example shown has multiple bends near the starting point of the conductor. Detailed Implementation

[0071] Hereinafter, the three-dimensional digital microscope 100 according to the embodiments will be described with reference to the accompanying drawings. The three-dimensional digital microscope 100 is an apparatus that generates a three-dimensional line drawing including positional information of each part of a three-dimensional object based on an image obtained by photographing a three-dimensional object. In the following description, it will be described that the three-dimensional digital microscope 100 generates a three-dimensional line drawing of a semiconductor device 10, which is a three-dimensional object, and outputs positional information of each part of the semiconductor device 10, but it can also generate a three-dimensional line drawing of a three-dimensional object other than the semiconductor device 10. Here, it is assumed that the semiconductor device 10 includes, for example, Figure 1 , Figure 2 The lead frame 11, the semiconductor chip 20 mounted on the lead frame 11, and the wire 30 connecting the pad 25 of the semiconductor chip 20 to the lead 12 of the lead frame 11 are described, but other semiconductor devices 10 may also be used.

[0072] like Figure 1 , Figure 2 As shown, the three-dimensional digital microscope 100 includes a vertical view camera 41, four stereo cameras 42 to 45, a control unit 50, an input unit 53, and a display unit 54. Furthermore, the three-dimensional digital microscope 100 includes an illumination device 46 for illuminating the semiconductor device 10. In the following description, the X and Y directions are assumed to be orthogonal directions on a horizontal plane, and the Z direction is assumed to be a vertical direction. Furthermore, the three-dimensional digital microscope 100 of this embodiment is described as including four stereo cameras 42 to 45, but this is not a limitation. Two or more stereo cameras are acceptable, as are four or more.

[0073] like Figure 1 , Figure 2As shown, the vertical view camera 41 is positioned directly above the semiconductor device 10 with its optical axis 41a extending perpendicularly along the Z direction relative to the surface of the semiconductor device 10, capturing images of the semiconductor device 10 from a vertically upward position, thereby obtaining images such as... Figure 11 The vertical view image 110 shown is illustrated. Stereo cameras 42 and 43 are configured such that their optical axes 42a and 43a extend along the X direction, and are positioned to photograph the semiconductor device 10 from an obliquely upward direction in the X direction. Furthermore, stereo cameras 44 and 45 are configured such that their optical axes 44a and 45a extend along the Y direction, and are positioned to photograph the semiconductor device 10 from an obliquely upward direction in the Y direction. Stereo cameras 42 to 45 photograph the semiconductor device 10 from multiple obliquely upward directions, thus obtaining an image as shown... Figure 12 Multiple stereoscopic images 510 are shown. Image data obtained by the vertical view camera 41 and stereoscopic cameras 42 to 45 are input into the control unit 50. The illumination device 46 may be, for example, a visible light illumination device that emits visible light including multiple wavelengths, such as a light-emitting diode (LED) or a lamp.

[0074] The control unit 50 is a computer that includes a central processing unit (CPU) 51, which performs internal information processing, and a storage unit 52, which stores data or programs. The control unit 50 generates a three-dimensional line drawing including position information of various parts of the semiconductor device 10 based on the vertical view image 110 obtained by the vertical view camera 41 and the stereoscopic images 510 obtained by the stereoscopic cameras 42 to 45. (See below for further details.) Figure 5 The structure of the control unit 50 will be described in detail below. An input unit 53 for the user to input data is connected to the control unit 50. Furthermore, a display unit 54 for displaying images or line graphs is connected to the control unit 50. The input unit 53 may include, for example, a keyboard or a mouse. The display unit 54 may include, for example, a monitor.

[0075] Then, referring to Figure 3 , Figure 4 The detailed structure of the wires 30 of the semiconductor device 10 will be described. In addition, for the purpose of explanation, the pads 25 of the semiconductor chip 20 and the leads 12 of the lead frame 11 protrude from the surfaces of the semiconductor chip 20 and the lead frame 11, but this is not a limitation. The pads 25 and the leads 12 may be on the same surface as the semiconductor chip 20 and the lead frame 11, or they may be recessed from the surface.

[0076] exist Figure 3In the example shown, the conductor 30 connects the pad 25 of the semiconductor chip 20 to the lead 12 of the lead frame 11. After the conductor 30 is joined to the pad 25, it forms multiple bends, and then loops towards the lead 12 to join it. Therefore, the conductor 30 includes a starting point 31 on the pad 25, a first bend point 32 to a third bend point 34 located near the pad 25, a fourth bend point 35 on the ending side, and an ending point 36 on the lead 12. In the following description, the conductor 30 is described as a zigzag shape formed by connecting the starting point 31, the first bend point 32 to the fourth bend point 35, and the ending point 36. The positions of the starting point 31, the first bend point 32 to the fourth bend point 35, and the ending point 36 are represented by a set of coordinates in the LRH coordinate system, including the length direction axis L extending from the starting point 31 to the ending point 36 of the conductor 30 within the surface of the upper surface 11a of the lead frame 11 (which serves as the reference plane), the lateral axis R extending from the starting point 31 of the conductor 30 in a direction orthogonal to the length direction axis L within the surface of the upper surface 11a of the lead frame 11, and the height direction axis H extending through the starting point 31 in a direction perpendicular to the upper surface 11a of the lead frame 11, representing the length direction coordinate position Ln, the lateral axis Rn, and the height direction coordinate position Hn. Here, n is a natural number, and the set of length direction coordinate positions Ln, lateral axis Rn, and height direction coordinate positions Hn in the LRH coordinate system constitutes the three-dimensional coordinate position.

[0077] If the position of the starting point 31 is represented by the LRH coordinate system, then as follows Figure 3 , Figure 4 As shown, the coordinates of the starting point 31 are represented by (L1, R1, H1). Similarly, the coordinates of the first bend point 32 to the fourth bend point 35 are represented by (L2, R2, H2), (L3, R3, H3), (L4, R4, H4), and (L5, R5, H5), respectively. Furthermore, the coordinates of the ending point 36 are represented by (L6, R6, H6). Figure 4 As shown, the total length of the conductor 30 from its starting point 31 to its ending point 36 along the length direction axis L is the total length LT of the conductor. Furthermore, the length from the starting point 31 to the fourth bend point 35 along the length direction axis L is the length L5.

[0078] Then, referring to Figure 5 Details of the control unit 50 of the three-dimensional digital microscope 100 according to the embodiment will be described. For example... Figure 5 As shown, the control unit 50 of the three-dimensional digital microscope 100 includes an image acquisition unit 61, a vertical view line graph generation unit 62, a line graph conversion unit 63, a line graph synthesis unit 64, a three-dimensional line graph storage unit 65, a position information output unit 66, and a shape parameter database 70.

[0079] The image acquisition unit 61 connects the vertical view camera 41 to the stereo cameras 42 to 45, and inputs the vertical view image 110 obtained by the vertical view camera 41 and the multiple stereo images 510 obtained by the stereo cameras 42 to 45 respectively. The image acquisition unit 61 outputs the vertical view image 110 to the vertical view line drawing generation unit 62 and outputs the stereo images 510 to the line drawing conversion unit 63.

[0080] An input unit 53 and a display unit 54 are connected to the vertical view line drawing generation unit 62. The vertical view line drawing generation unit 62 displays the vertical view image 110 input from the image acquisition unit 61 on the display unit 54. Furthermore, the vertical view line drawing generation unit 62 displays the outline lines of the vertical view image 110 drawn by the user operation input unit 53 on the display unit 54. Then, it generates the outline lines from the vertical view image 110 input by the user as... Figure 13 The vertical view line drawing 110a shown is output to the line drawing conversion unit 63 and the line drawing synthesis unit 64.

[0081] The line drawing conversion unit 63, based on shape parameters stored in the shape parameter database 70, converts the vertical view line drawing 110a input from the vertical view line drawing generation unit 62 into a three-dimensional line drawing 510a, and displays the converted three-dimensional line drawing 510a superimposed on the three-dimensional image 510 input from the image acquisition unit 61 on the display unit 54. Furthermore, based on adjusted shape parameters input by the user from the input unit 53, the line drawing conversion unit 63 converts the vertical view line drawing 110a input from the vertical view line drawing generation unit 62 into a three-dimensional line drawing 510a, and displays the converted three-dimensional line drawing 510a superimposed on the three-dimensional image 510 input from the image acquisition unit 61 on the display unit 54, repeating the above steps until the user approves. Figure 17 The user-approved 3D line drawing 510a is output to the line drawing synthesis unit 64.

[0082] The line drawing synthesis unit 64 synthesizes the vertical view line drawing 110a input from the vertical view line drawing generation unit 62 and the three-dimensional line drawing 510a input from the line drawing conversion unit 63 to generate a three-dimensional line drawing of the semiconductor device 10. The three-dimensional line drawing includes a set of numerous points arranged along the line drawing connecting the starting point 31, the first bend point 32 to the fourth bend point 35, and the ending point 36 of the conductor 30, and a set of numerous points arranged along the outline of the pad 25 and the lead 12. The three-dimensional line drawing includes positional information for each of these points. Positional information, for example, is generated by... Figure 1 , Figure 2 The coordinate positions are defined by the XYZ coordinate system shown. The line graph synthesis unit 64 stores the generated three-dimensional line graph, which includes the position information of each part of the semiconductor device 10, in the three-dimensional line graph storage unit 65.

[0083] The position information output unit 66 reads the three-dimensional line graph from the three-dimensional line graph storage unit and displays the three-dimensional line graph on the display unit 54. Then, the position information of a part of the three-dimensional line graph selected by the user operation input unit 53 is displayed on the display unit 54.

[0084] The shape parameter database 70 is a database that stores various parameters, including the height information of the semiconductor device 10, including the component shape parameter database 71 and the bending parameter database 72.

[0085] like Figure 6 As shown, the component shape parameter database 71 is a database that stores the height and surface slope of the lead frame 11, lead 12, semiconductor chip 20, and pad 25, which are components other than the wires 30 constituting the semiconductor device 10. Figure 6 The reference plane shown is Figure 3 The upper surface 11a of the lead frame 11 is shown. Therefore, the height Z of the lead frame 11 from the reference plane is 0. Furthermore, the surfaces of the lead 12, the semiconductor chip 20, and the pad 25 are shown to be 10 μm, 200 μm, and 210 μm higher than the upper surface 11a of the lead frame 11, respectively. Moreover, the slope of each component's surface is represented by a set of slopes in the X direction (XT), Y direction (YR), and Z direction (ZR).

[0086] Figure 7 The bending parameter database 72 shown is a collection of... Figure 3 , Figure 4 A database is established and stored to associate and store the sets of length direction coordinates Ln, lateral coordinates Rn, and height direction coordinates Hn in the LRH coordinate system of the starting point 31, the first bend point 32 to the fourth bend point 35, and the ending point 36 of the conductor 30 shown, with the sets of proportional length direction coordinates LPn, proportional lateral coordinates RPn, and proportional height direction coordinates Hpn described below. Here, the sets of length direction coordinates Ln, lateral coordinates Rn, and height direction coordinates Hn constitute three-dimensional coordinate positions, and the sets of proportional length direction coordinates LPn, proportional lateral coordinates RPn, and proportional height direction coordinates Hpn constitute three-dimensional proportional coordinate positions.

[0087] The proportional length direction coordinate position LPn indicates the percentage of the total length LT of the conductor 30 from which the bend point is located. Furthermore, the proportional lateral coordinate position RPn indicates the percentage of the total length LT of the conductor 30 from which the bend point is located. And the proportional height direction coordinate position Hpn indicates the percentage of the total length of the conductor 30 in terms of the height displacement relative to the bend point closer to the starting point 31 than the bend point itself. Figure 7In the example, the length direction coordinate L of the fourth bend point 35 is shown to be 60% of the total length LT of the conductor 30 at a distance from the starting point 31, the lateral coordinate position is 0, and the height is 1% lower than the height of the third bend point 34 on the side of the starting point 31 than the total length of the conductor 30.

[0088] like Figure 8 As shown, when the total length of conductor 30 is 1900 μm, the length direction coordinate L5 of the fourth bend point 35 is 1900 × 60% = 1140 μm. Furthermore, the height direction coordinate of the fourth bend point 35 is 281 μm, which is 1900 × 1% = 19 μm lower than the height direction coordinate 300 μm of the third bend point 34 on the starting point 31 side. When the length of conductor 30 is 2300 μm, the length direction coordinate and height direction coordinate of the fourth bend point 35 are 1380 μm and 277 μm, respectively. Furthermore, when the length of conductor 30 is 2500 μm, the length direction coordinate and height direction coordinate of the fourth bend point 35 are 1500 μm and 272 μm, respectively. In addition, in Figure 7 If any of the length direction coordinate position Ln, the lateral coordinate position Rn, and the height direction coordinate position Hn in the bending parameter database 72 shown are not 0, the values ​​of the length direction coordinate position Ln, the lateral coordinate position Rn, and the height direction coordinate position Hn stored in the bending parameter database 72 directly become the respective coordinate positions.

[0089] like Figures 1-4 As shown, when connecting the pad 25 of the semiconductor chip 20 to the lead 12 of the lead frame 11 using multiple wires 30, the multiple wires 30 include various wires 30 with different total lengths LT. Here, the rising and bending shapes of the multiple wires 30 from the starting point 31 are all the same. Therefore, the relative positions of the first bend point 32 to the third bend point 34 near the starting point 31 with respect to the starting point 31 are the same. Therefore, in Figure 7 In the bending parameter database 72 shown, the LRH coordinate system of the first bending point 32 to the third bending point 34 (refer to...) Figure 3 , Figure 4 The length direction coordinate position Ln, the lateral coordinate position Rn, and the height direction coordinate position Hn relative to the first bending point 32 to the third bending point 34 of the multiple conductors 30 are each specified by only one set.

[0090] On the other hand, the position of the fourth bend point 35 at the end of the multiple conductors 30 is set to be proportional to the total length LT of the conductors 30. Therefore, by specifying the ratio relative to the total length LT of the conductors 30 as the bending parameter of the fourth bend point 35, as shown in the reference... Figure 7 , Figure 8As explained, the position of the fourth bend point 35 on the end side of multiple conductors 30 can be specified using a single parameter.

[0091] As mentioned above, Figure 7 The bending parameter database 72 shown uses a small number of parameters to specify the coordinate positions of the starting point 31, the first bending point 32 to the fourth bending point 35, and the ending point 36 of multiple conductors 30.

[0092] The image acquisition unit 61, vertical view line graph generation unit 62, line graph conversion unit 63, line graph synthesis unit 64, and position information output unit 66 within each functional block of the control unit 50 described above can be executed by the CPU 51, which is a processor, and stored in [the relevant data]. Figure 1 The program in the storage unit 52 shown is used to implement this. Furthermore, the three-dimensional line drawing storage unit 65 and the shape parameter database 70 can be implemented by storing data constructed from specific data in the storage unit 52.

[0093] Then, referring to Figure 9 , Figures 10-16 The three-dimensional line graph generation operation of the three-dimensional digital microscope 100 of the embodiment will be described.

[0094] like Figure 9 As shown in step S101, the image acquisition unit 61 acquires a vertical view image 110 of the semiconductor device 10 captured by the vertical view camera 41, stores it in the storage unit 52, and outputs it to the vertical view line drawing generation unit 62. This will be utilized... Figure 1 , Figure 2 The vertical view shown was captured by camera 41. Figure 2 A vertical view image 110 of part A of the semiconductor device 10 shown is presented. Figure 11 .like Figure 11 As shown, the vertical view image 110 includes a vertical view pad image 125, a vertical view wire image 130, a vertical view lead image 112, and a vertical view semiconductor chip image 120. For example... Figure 11 As shown, the vertical view guide image 130 includes a vertical view starting point image 131, vertical first bend point images 132 to vertical fourth bend point images 135, and a vertical view ending point image 136, forming a straight line connecting the vertical view starting point image 131 and the vertical view ending point image 136. Moreover, the vertical view starting point image 131 coincides with the origin of the LRH coordinate system.

[0095] Image acquisition unit 61 Figure 9 In step S102, multiple stereoscopic images captured by the four stereoscopic cameras 42 to 45 are obtained, stored in the storage unit 52, and the obtained stereoscopic images are output to the line drawing conversion unit 63.

[0096] will utilize Figure 2 The stereo camera 45 shown photographs the semiconductor device 10. Figure 1 The stereoscopic image 510 obtained from part A shown is shown in Figure 12 .like Figure 12 As shown, the stereoscopic image 510 includes a stereoscopic pad image 525, a stereoscopic wire image 530, a stereoscopic lead image 512, and a stereoscopic semiconductor chip image 520. For example... Figure 3 As shown, the pad 25 and the lead wire 12 are higher than the upper surface 11a of the lead wire frame 11, which serves as the reference plane. Therefore, the three-dimensional pad image 525 and the three-dimensional lead wire image 512 are offset from the origin of the LRH coordinate system towards the positive R direction, depending on the height of the pad 25 and the lead wire 12.

[0097] Furthermore, the three-dimensional conductor image 530 includes a three-dimensional starting point image 531, three-dimensional first bend point images 532 to fourth bend point images 535, and a three-dimensional ending point image 536. The starting point 31 and ending point 36 of the conductor 30 are located on the surfaces of the pad 25 and the lead wire 12, respectively. Therefore, similar to the three-dimensional pad image 525 and the three-dimensional lead wire image 512, they are biased towards the positive R direction from the origin of the LRH coordinate system based on the height of the pad 25 and the lead wire 12. Moreover, the first bend point 32 to the fourth bend point 35 of the conductor 30 are also positioned above the upper surface 11a of the lead wire frame 11, which serves as the reference plane. Therefore, the three-dimensional first bend point images 532 to the fourth bend point images 535 are biased towards the positive R direction based on the height of the first bend point 32 to the fourth bend point 35 from the upper surface 11a of the lead wire frame 11. Thus, the three-dimensional conductor image 530 as a whole is an image that bends and protrudes towards the positive R direction.

[0098] exist Figure 9 In step S103, the vertical view line graph generation unit 62 will take the input from the image acquisition unit 61... Figure 11 The vertical view image 110 shown is displayed on the display unit 54. If the user operates the input unit 53 to draw an outline along the contour of the vertical view image 110 displayed on the display unit 54, the vertical view line drawing generation unit 62 will overlap the user-input line with the vertical view image 110 and display it on the display unit 54. Thus, the user can draw the outline of the vertical view image 110 displayed on the display unit 54. Then, after the user finishes drawing the outline, the vertical view line drawing generation unit 62... Figure 9 In step S104, the outline of the vertical view image 110 drawn by the user is generated as follows: Figure 13 The vertical view line diagram 110a is shown. (See figure 110a.) Figure 11As shown, the vertical view line diagram 110a includes a vertical view pad line diagram 125a, a vertical view lead line diagram 112a, a vertical view conductor line diagram 130a, and a vertical view semiconductor chip line diagram 120a. Here, the vertical view conductor line diagram 130a includes a vertical view starting point line diagram 131a, vertical view first bend point line diagrams 132a to fourth bend point line diagrams 135a, and a vertical view ending point line diagram 136a. Then, the vertical view line diagram generation unit 62 outputs the generated vertical view line diagram 110a to the line diagram conversion unit 63.

[0099] The following description explains how the line drawing conversion unit 63 processes the stereoscopic image 510 captured by the stereoscopic camera 45. The line drawing conversion unit 63... Figure 9 In step S105, the shape parameters stored in the shape parameter database 70 are used to... Figure 13 The vertical view line shown in Figure 110a is converted to an approximation as shown in Figure 110a. Figure 16 The stereoscopic line drawing 510a of the stereoscopic image 510 shown. (As shown...) Figure 14 As shown, the vertical view line diagram 110a before conversion deviates from the stereoscopic image 510.

[0100] Line graph conversion unit 63 is based on the storage in Figure 6 The component shape parameter database 71 shows the height Z of each of the lead frame 11, lead 12, semiconductor chip 20, and pad 25 from the upper surface 11a of the lead frame 11 (which serves as a reference plane), the slope of each part of the surface, the arrangement position of each stereo camera 42 to stereo camera 45, and the tilt angle of each optical axis 42a to optical axis 45a relative to the semiconductor device 10. When the semiconductor device 10 is photographed using each stereo camera 42 to stereo camera 45, the positions of the stereo lead image 512, stereo semiconductor chip image 520, and stereo pad image 525 displayed on the display unit 54 are calculated. Then, the vertical view lead line diagram 112a, vertical view semiconductor chip line diagram 120a, and vertical view pad line diagram 125a are moved to the stated positions and converted into stereo lead line diagram 512a, stereo semiconductor chip line diagram 520a, and stereo pad line diagram 525a.

[0101] Subsequently, the line graph conversion unit 63 is based on Figure 7 The bending parameter database 72 shown is used to calculate the following: Figure 8 The bending parameters of the multiple conductors 30 shown are stored in the storage unit 52. Then, the line graph conversion unit 63 is based on... Figure 8The bending parameters of the conductor shown, the arrangement positions of each stereo camera 42 to stereo camera 45, and the tilt angles of each optical axis 42a to optical axis 45a relative to each conductor 30 are used to calculate the positions of the stereo starting point image 531, the stereo first bending point image 532 to the stereo fourth bending point image 535, and the stereo ending point image 536 displayed on the display unit 54 when the conductor 30 is photographed using each stereo camera 42 to stereo camera 45. Then, as shown... Figure 15 As shown, the vertical view starting line diagram 131a, the vertical view first bend point line diagram 132a to the vertical view fourth bend point line diagram 135a, and the vertical view ending line diagram 136a are moved to the positions described above, and are respectively converted into three-dimensional starting line diagram 531a, three-dimensional first bend point line diagram 532a to the three-dimensional fourth bend point line diagram 535a, and three-dimensional ending line diagram 536a. They are then connected with lines to generate a three-dimensional guide line diagram 530a.

[0102] Line graph conversion unit 63 Figure 9 In step S105, after converting the vertical view line drawing 110a of the semiconductor device 10 into a three-dimensional line drawing 510a that approximates the three-dimensional image 510, as follows... Figure 9 Step S106 Figure 16 As shown, the stereoscopic image 510 of the semiconductor device 10 and the stereoscopic line drawing 510a are displayed on the display unit 54.

[0103] like Figure 16 As shown, the stereoscopic line drawing 510a, which is similar to the stereoscopic image 510 displayed on the display unit 54, deviates slightly from the stereoscopic image 510. The user compares the stereoscopic image 510 displayed on the display unit 54 with the stereoscopic line drawing 510a and inputs component shape parameters or bending parameters. The line drawing conversion unit 63... Figure 9 In step S107, the component shape parameters or bending parameters are adjusted based on user input. The adjustment of the component shape parameters or bending parameters can also be achieved by updating the data stored using user input. Figure 6 The data of the height Z or the slope in the XYZ direction from the reference plane in each cell of the component shape parameter database 71 shown are stored in the storage unit 52 and updated. Figure 7 The data of each coordinate position in the bending parameter database 72 shown are stored in the storage unit 52.

[0104] Line graph conversion unit 63 Figure 9 In step S108, the adjusted component shape parameters and bending parameters are used, along with... Figure 9 Similarly, in step S105, the vertical view line drawing 110a is converted into a three-dimensional line drawing 510a. Figure 9In step S109, the stereoscopic image 510 of the semiconductor device 10 and the stereoscopic line drawing 510a are superimposed and displayed on the display unit 54 (line drawing conversion step). Then, the line drawing conversion unit 63... Figure 9 In step S110, it is determined whether user approval has been input from input unit 53. If user approval has not been received, ... Figure 9 In step S113, the user's input is received and returned. Figure 9 In step S107, the shape parameters are adjusted. Figure 9 In step S109, the vertical view line drawing 110a is converted into a three-dimensional line drawing 510a. Figure 9 In step S109, the stereoscopic image 510 and the stereoscopic line drawing 510a are displayed on the display unit 54 under overlapping conditions. As described above, the line drawing conversion unit 63 repeats this process. Figure 9 Steps S107 to S110, S113 and up Figure 9 The process continues until the user inputs approval in step S110.

[0105] By adjusting the shape parameters using user input, the deviation between the stereoscopic line drawing 510a and the stereoscopic image 510 displayed on the display unit 54 gradually decreases, such as... Figure 17 As shown, the three-dimensional line drawing 510a, represented by a dashed line, overlaps with the outline of the three-dimensional image 510, represented by a solid line. Furthermore, in Figure 17 In order to clearly show the outlines of the stereoscopic line drawing 510a and the stereoscopic image 510, they are shown slightly off-center in the drawing. In reality, the stereoscopic line drawing 510a, represented by a single-dot dashed line, overlaps with the outline of the stereoscopic image 510, represented by a solid line. Then, the user... Figure 9 After the approval is entered in step S110, the line drawing conversion unit 63 stores the approved 3D line drawing 510a in the storage unit 52.

[0106] Furthermore, when the stereoscopic line drawing 510a overlaps with the outline of the stereoscopic image 510 represented by solid lines, the data stored in... Figure 6 The data of the height Z or the slope in the XYZ direction from the reference plane in each cell of the component shape parameter database 71 shown become data representing the height and slope of each component of the semiconductor device 10. Therefore, the height and slope of each component of the semiconductor device 10 can also be detected using the data of the height Z or the slope in the XYZ direction from the reference plane stored in each cell of the component shape parameter database 71.

[0107] In the above description, the case in which the line drawing conversion unit 63 converts the vertical view line drawing 110a into a stereoscopic line drawing 510a that is consistent with the stereoscopic image displayed on the display unit 54 when the semiconductor device 10 is photographed using the stereoscopic camera 45 has been described. However, the case in which the vertical view line drawing 110a is converted into a stereoscopic line drawing that is consistent with the stereoscopic image displayed on the display unit 54 when photographed using other stereoscopic cameras 42 to 44 is also the same.

[0108] When the semiconductor device 10 is photographed using four stereo cameras 42 to 45, the line drawing conversion unit 63 converts the vertical view line drawing 110a into a stereo line drawing that is consistent with the stereo images displayed on the display unit 54, and stores the converted stereo line drawings in the storage unit 52.

[0109] Line graph synthesis section 64 Figure 9 In step S111, the vertical view line drawing 110a is combined with each three-dimensional line drawing to generate a three-dimensional line drawing including the positional information of each part of the semiconductor device 10. The line drawing synthesis unit 64 constructs a three-dimensional line drawing in the form of a set of numerous points arranged along the line connecting the starting point 31, the first bend point 32 to the fourth bend point 35, and the ending point 36 of the conductor 30, and a set of numerous points arranged along the outline of the pad 25 and the lead wire 12. Then, the coordinate positions of the numerous points constituting the three-dimensional line drawing are calculated, and each coordinate position is associated with each point to generate a three-dimensional line drawing including the positional information of each part of the semiconductor device 10. Here, the positional information is, for example, derived from... Figure 1 , Figure 2 The coordinate positions are defined by the XYZ coordinate system shown.

[0110] Then, the line graph synthesis unit 64 in Figure 9 In step S112, the generated three-dimensional line drawing, which includes the position information of each part of the semiconductor device 10, is stored in the three-dimensional line drawing storage unit 65 of the storage unit 52.

[0111] Then, referring to Figure 10 The three-dimensional shape measurement operation of the three-dimensional digital microscope 100 is explained.

[0112] like Figure 10 As shown in step S201, the position information output unit 66 reads the three-dimensional line graph from the three-dimensional line graph storage unit and displays the three-dimensional line graph on the display unit 54. As explained above, the three-dimensional line graph is configured as a set of a large number of points arranged along the line connecting the starting point 31, the first bend point 32 to the fourth bend point 35, and the ending point 36 of the conductor 30, and a set of a large number of points arranged along the outline of the pad 25 and the lead wire 12. However, when displayed on the display unit 54, it is displayed in a way that can be seen as a generally continuous line to the user.

[0113] Location information output unit 66 Figure 10 In step S202, after the user selects a portion of the 3D image displayed on the display unit 54, the position information of points close to the selected portion within a large number of points constituting the 3D line graph storage unit 65 is read and displayed on the display unit 54. For example, if the input unit 53 includes a mouse, and the user clicks on a portion of the 3D image displayed on the display unit 54 using the mouse, the position information of points close to the selected position is displayed on the display unit 54.

[0114] Furthermore, when the number of points constituting the three-dimensional line graph is small and the user selects a location between points, the location information output unit 66 can calculate the location information of the location selected by the user based on the location information of the points at both ends and display it on the display unit 54.

[0115] The three-dimensional digital microscope 100 described above generates a vertical view line drawing 110a from the outline of the vertical view image 110 drawn by the user on the display unit 54. Therefore, even for vertical view images 110 that are difficult to process, the vertical view line drawing 110a can be reliably generated. Furthermore, since the shape parameters are adjusted by the user's input, and the converted stereoscopic line drawing 510a is displayed on the display unit 54 in an overlapping manner with the stereoscopic image 510, the user can compare the converted stereoscopic line drawing 510a with the stereoscopic image 510 while adjusting the shape parameters until the two overlap, thereby generating the stereoscopic line drawing 510a that the user expects. As a result, a three-dimensional line drawing of the object expected by the user can be generated with high precision, and the three-dimensional shape of each part of the semiconductor device 10 can be measured with good accuracy.

[0116] Furthermore, the three-dimensional digital microscope 100 specifies the ratio of the total length LT of the conductor 30 to the total length LT of the conductor 30 in the bending parameter database 72 as a bending parameter. Therefore, it is possible to specify the position of the bending point at the end of multiple conductors 30 with different total lengths LT using a single parameter. Thus, the shape of multiple conductors 30 contained in a group can be specified by the user inputting a small number of shape parameters.

[0117] Furthermore, since the three-dimensional digital microscope 100 generates a three-dimensional line graph containing a large set of points arranged along a line graph connecting the starting point 31, the first bend point 32 to the fourth bend point 35, and the ending point 36 of the guide wire 30, and a large set of points arranged along the outline of the pad 25 and the guide wire 12, and including the positional information of each of these points, it is possible to compare the positional information of the part selected by the user with the three-dimensional line graph. Figure 1 The image is displayed on the display unit 54. As a result, the three-dimensional shape of each part of the semiconductor device 10, including multiple wires 30, can be measured with high precision in a short time.

[0118] Then, referring to Figure 18 Other three-dimensional line drawing generation operations of the three-dimensional digital microscope 100 of the embodiment will be described.

[0119] exist Figure 18 In step S301, the image acquisition unit 61 acquires a vertical view image 110 of the semiconductor device 10 captured by the vertical view camera 41, stores it in the storage unit 52, and outputs it to the vertical view line graph generation unit 62. Furthermore, the image acquisition unit 61... Figure 18 In step S302, multiple stereoscopic images captured by the four stereoscopic cameras 42 to 45 are obtained, stored in the storage unit 52, and the obtained stereoscopic images are output to the line drawing conversion unit 63.

[0120] Vertical view line drawing generation unit 62 in Figure 18 In step S303, the contour lines of the vertical view image 110 input from the image acquisition unit 61 are extracted using methods such as pattern recognition and edge recognition to generate a vertical view line drawing 110a. The vertical view line drawing generation unit 62 outputs the generated vertical view line drawing 110a to the line drawing conversion unit 63.

[0121] The following description explains how the line drawing conversion unit 63 processes the stereoscopic image 510 captured by the stereoscopic camera 45. The line drawing conversion unit 63... Figure 18 In step S304, the vertical view line drawing 110a is converted into a three-dimensional line drawing 510a using the shape parameters stored in the component shape parameter database 71 and the bending parameter database 72 in the shape parameter database 70. Then, the line drawing conversion unit 63... Figure 18 In step S305, the contour lines of the stereoscopic image 510 are extracted using methods such as pattern recognition and edge recognition, and the converted stereoscopic line drawing 510a is compared with the extracted contour lines of the stereoscopic image 510. Then, the line drawing conversion unit 63... Figure 18 In step S306, it is determined whether the converted stereo line drawing 510a overlaps with the outline of the stereo image 510.

[0122] Line graph conversion unit 63 Figure 18 If the determination in step S306 is negative, proceed to... Figure 18 In step S310, adjust the shape parameters and return. Figure 18 Step S304. Then, while correcting the shape parameters, the transformation is performed until the stereoscopic line drawing 510a overlaps with the stereoscopic image 510. Figure 18 The determination continues until it is confirmed in step S306. Then, the line graph conversion unit 63... Figure 18 After determining "yes" in step S306, proceed to... Figure 18In step S307, the stereo line graph 510a overlapping with the stereo image 510 is generated as a stereo line graph 510a for synthesis.

[0123] Similarly, the line graph conversion unit 63 repeats the process. Figure 18 In steps S304 to S306 and step S310, the vertical view line drawing 110a is converted into a stereo line drawing that overlaps with the stereo images captured by stereo cameras 42 to 44, and each stereo line drawing is generated for synthesis.

[0124] Line graph synthesis section 64 Figure 18 In step S308, the vertical view line drawing 110a is combined with the composite stereo line drawing 510a and the composite stereo line drawing captured by stereo cameras 42 to 44 to generate a three-dimensional line drawing including the position information of each part of the semiconductor device 10. Then, the line drawing synthesis unit 64 performs... Figure 18 In step S309, the generated three-dimensional line graph is stored in the three-dimensional line graph storage unit 65.

[0125] As explained above, the three-dimensional digital microscope 100 of this embodiment repeatedly performs shape parameter adjustments and conversions from the vertical view line graph 110a to the stereo line graph 510a via the line graph conversion unit 63 until the stereo line graph 510a overlaps with the stereo image 510, thereby generating a stereo line graph 510a that accurately fits the stereo image 510. This allows for the high-precision generation of three-dimensional line graphs including positional information of various parts of the semiconductor device 10. Furthermore, it enables the high-precision measurement of the three-dimensional shape of various parts of the semiconductor device 10, including multiple conductive lines 30, in a short time.

[0126] Then, referring to Figures 19-33 Other embodiments of the three-dimensional digital microscope 200 will be described. (Referring to the above...) Figures 1 to 17 The same symbols are used for the same parts of the three-dimensional digital microscope 100 described, and the descriptions are omitted.

[0127] 200-inch 3D digital microscope Figure 19 As shown, this is an apparatus for generating a three-dimensional line graph containing positional information of various parts of a semiconductor device 210. The semiconductor device 210 includes two types of guide wires 30, one at the component where the starting point is located and the other at the component where the ending point is located, and an upper guide wire 90. A three-dimensional digital microscope 200 includes a control unit 55 instead of the control unit 50 of the three-dimensional digital microscope 100. See below for reference. Figure 23 The structure of the control unit 55 will be explained.

[0128] First, refer to Figures 20-22The structure of semiconductor device 210 will be described. Semiconductor device 210 includes lead frame 11, lead wire 12, first semiconductor chip 21, first pad 26 and second pad 27 disposed on the upper surface of the first semiconductor chip 21, second semiconductor chip 22, third pad 28 disposed on the upper surface of the second semiconductor chip 22, wire 30, and upper wire 90.

[0129] The first semiconductor chip 21 is as described above. Figures 1-4 The semiconductor chip 20 described has the same size and thickness, and a second pad 27 is disposed in the center of its upper surface. Furthermore, the first pad 26 disposed around the upper surface has the same configuration as the pad 25 of the semiconductor chip 20. The second semiconductor chip 22 is smaller than the first semiconductor chip 21, thicker than the first semiconductor chip 21, and is mounted on the upper surface of the first semiconductor chip 21 in the center. A third pad 28 is disposed on the upper surface of the second semiconductor chip 22. The heights of the upper surfaces of the lead 12, the first pads 26 to 28, the first semiconductor chip 21, and the second semiconductor chip 22, from lowest to highest, are: lead 12, upper surface of the first semiconductor chip 21, first pad 26, second pad 27, upper surface of the second semiconductor chip 22, and third pad 28.

[0130] Wire 30 connects the first pad 26 of the first semiconductor chip 21 to the lead 12 of the lead frame 11. The shape of wire 30 is the same as described above. Figure 3 , Figure 4 The wire 30 described is the same. The upper wire 90 connects the third pad 28 of the second semiconductor chip 22 to the second pad 27 of the first semiconductor chip 21.

[0131] like Figure 21 As shown, conductor 30, like conductor 30 described above, includes a starting point 31, first bend points 32 to 4th bend points 35, and an ending point 36. Upper conductor 90 includes a starting point 91, first bend points 92 to 4th bend points 95 located on the third pad 28 of the second semiconductor chip 22, and an ending point 96 located on the second pad 27 of the first semiconductor chip 21. In the following description, upper conductor 90, like conductor 30, is described as a zigzag line connecting the starting point 91, first bend points 92 to 4th bend points 95, and ending point 96.

[0132] The positions of the starting point 31, the first bend point 32 to the fourth bend point 35, and the ending point 36 of conductor 30 are based on the above reference. Figure 3 , Figure 4The coordinates L1n, R1n, and H1n in the first LRH coordinate system formed by the same length axis L1, lateral axis R1, and height axis H1 represent the coordinates L1n, R1n, and H1n in the length axis L, lateral axis R1, and height axis H1.

[0133] like Figure 21 , Figure 22 As shown, the coordinates of the starting point 31 of the first LRH coordinate system are represented by (L11, R11, H11). Similarly, the coordinates of the first bend point 92 to the fourth bend point 95 are represented by (L12, R12, H12), (L13, R13, H13), (L14, R14, H14), and (L15, R15, H15), respectively. Furthermore, the coordinates of the ending point 36 are represented by (L16, R16, H16). Figure 22 As shown, the total length of the conductor 30 from its starting point 31 to its ending point 36 along the length direction axis L1 is the total length LT1 of the conductor. Furthermore, the length from the starting point 31 to the fourth bend point 35 along the length direction axis L is the length L15.

[0134] On the other hand, the positions of the starting point 91, the first bend point 92 to the fourth bend point 95, and the ending point 96 of the upper conductor 90 are represented by a set of length direction coordinates L2n, lateral coordinates R2n, and height direction coordinates H2n in a second LRH coordinate system formed by the length direction axis L2 extending from the starting point 91 to the ending point 96 of the upper conductor 90 within the plane of the upper surface 11a of the lead frame 11 (which serves as the reference plane), the lateral axis R2 extending from the starting point 91 of the upper conductor 90 in a direction orthogonal to the length direction axis L2 within the plane of the upper surface 11a of the lead frame 11, and the height direction axis H2 extending through the starting point 91 in a direction perpendicular to the upper surface 11a of the lead frame 11. Here, n is a natural number.

[0135] If the positions of the starting point 91, the first bend point 92 to the fourth bend point 95, and the ending point 96 are represented by the second LRH coordinate system, then as follows Figure 21 , Figure 22 As shown, the coordinates of the starting point 91 are represented by (L21, R211, H21). Similarly, the coordinates of the first bend point 92 to the fourth bend point 95 are represented by (L22, R22, H22), (L23, R23, H23), (L24, R24, H24), and (L25, R25, H25), respectively. Furthermore, the coordinates of the ending point 96 are represented by (L26, R26, H26). Figure 22As shown, the total length of the upper conductor 90 from the starting point 91 to the ending point 96 along the length direction axis L2 is the total length LT2 of the conductor. Moreover, the lengths from the starting point 91 to the third bend point 94 and the fourth bend point 95 along the length direction axis L2 are length L24 and length L25, respectively.

[0136] like Figure 23 As shown, the control unit 55 of the three-dimensional digital microscope 200 is in reference Figure 5 The control unit 50 of the described three-dimensional digital microscope 200 includes a guide wire grouping database 73, and the shape parameter database 70 of the control unit 50 is set as a shape parameter database 75 including a component shape parameter database 71 and a group bending parameter database 74. Furthermore, the vertical view line drawing generation unit 262 generates the vertical view image 1210 (see reference 1210) drawn by the user operation input unit 53. Figure 30 The components and the outlines of each wire 30 and upper wire 90 in the semiconductor device 210 are generated as vertical view lines in Figure 1210a (refer to Figure 1210a). Figure 32 Furthermore, the multiple conductors 30 and the upper conductor 90 are grouped into multiple groups, including the component where the starting point is located, the component where the ending point is located, and conductors of common thickness. The line drawing conversion unit 263 uses the group bending parameter database 74 to convert the vertical view line drawing 1210a into a three-dimensional line drawing 5210a (see reference). Figure 33 Other functional blocks are the same as those mentioned above. Figure 5 The control unit 50 described is the same.

[0137] like Figure 24 As shown, the conductor grouping database 73 is a database that stores grouping information for multiple conductors of the same thickness, including the component where the starting point is located, the component where the ending point is located, and the conductors. Since the components where the starting point is located, the component where the ending point is located, and the conductors of the same thickness are all in the same position relative to the starting point, and the position of the bending point on the ending side is specified to be proportional to the total length of the conductor, the bending shape of the multiple conductors included in a conductor group can be specified using a bending parameter data.

[0138] like Figure 25 As shown, the component shape parameter database 71 is the same as the one mentioned above. Figure 6 The component shape parameter database 71 described has the same data structure, but as Figure 25 As shown, the data stored includes the heights and surface slopes of the first semiconductor chip 21, the first pad 26, the second pad 27, the second semiconductor chip 22, and the third pad 28.

[0139] like Figure 26As shown, the group bending parameter database 74 includes multiple group bending parameter databases 74a and 74b. Figure 26 In the example shown, group bending parameter database 74a can be applied to the first conductor group, and group bending parameter database 74b can be applied to the second conductor group.

[0140] Since the coordinate positions of the third bend point 94 and the fourth bend point 95 of the upper conductor 90 constituting the second conductor group are defined as proportional to the total length LT2 of the upper conductor 90, the fields for the length direction coordinate position L, the lateral coordinate position R, and the height direction coordinate position H are all entered as 0, and at least one of the proportional length direction coordinate position LP, the proportional lateral coordinate position RP, and the proportional height direction coordinate position HP is stored with a value.

[0141] Figure 27 and Figure 8 Similarly, the use of Figure 26 The example shown in the group bending parameter database 74a calculates the coordinate positions of the starting point 31, the first bending point 32 to the fourth bending point 35, and the ending point 36 of the conductor 30 in the first group, and demonstrates its application. Figure 26 The example shown is from the group bending parameter database 74b, which calculates the coordinate positions of the starting point 91, the first bending point 92 to the fourth bending point 95, and the ending point 96 of the upper guide wire 90 in the second group. Figure 27 The coordinate positions of the fourth bend point 35 of the first conductor group 30 (represented by shaded area) and the third bend point 94 and fourth bend point 95 of the upper conductor 90 of the second conductor group are calculated based on the proportional length direction coordinate position LP, the proportional lateral coordinate position RP, and the proportional height direction coordinate position HP, respectively.

[0142] Then, referring to Figure 28 , Figure 29 The process of generating 3D line graphs using the 3D digital microscope 200 is explained. Furthermore, the above references... Figure 9 The same operation of the three-dimensional digital microscope 100 is explained simply.

[0143] Image acquisition unit 61 Figure 28 In step S401, the image captured by the vertical view camera 41 is obtained. Figure 30 The vertical view image 1210 of the semiconductor device 210 shown is stored in the storage unit 52 and output to the vertical view line drawing generation unit 262. Furthermore, the image acquisition unit 61... Figure 28 In step S402, the image captured by the stereo camera 45 is obtained. Figure 31The stereoscopic image 5210 shown, along with multiple stereoscopic images (not shown) captured by the other three stereoscopic cameras 42 to 44, are stored in the storage unit 52, and the obtained stereoscopic image 5210 and other stereoscopic images are output to the line drawing conversion unit 263. Furthermore, as... Figures 30-31 As shown, the vertical view image 1210 of the semiconductor device 210 becomes a... Figure 10 The image shown is a composite image formed by combining the vertical view image 110 with the vertical view second pad image 127, the vertical view upper wire image 190, the vertical view third pad image 128, the vertical view first semiconductor chip image 121, and the vertical view second semiconductor chip image 122. Furthermore, the stereoscopic image 5210 becomes... Figure 11 The stereoscopic image 510 shown is a composite image formed by combining the stereoscopic second pad image 527, the stereoscopic upper conductor image 590, the stereoscopic third pad image 528, the stereoscopic first semiconductor chip image 521, and the stereoscopic second semiconductor chip image 522. Furthermore, the vertical view first pad image 126 and the stereoscopic first pad image 526 are... Figure 10 The vertical view padding image 125 and the stereo padding image 525 shown are the same images. Here, the vertical view guide image 190 includes the vertical view start point image 191, the vertical view first bend point image 192 to the vertical view fourth bend point image 195, and the vertical view end point image 196. The stereo guide image 590 includes the stereo start point image 591, the stereo first bend point image 592 to the stereo fourth bend point image 595, and the stereo end point image 596.

[0144] exist Figure 28 In step S403, the vertical view line drawing generation unit 262, as shown... Figure 30 As shown, the vertical view image 1210 input from the image acquisition unit 61 is displayed on the display unit 54. If the user operates the input unit 53 to draw an outline line along the contour of the vertical view image 1210 displayed on the display unit 54, the vertical view line drawing unit 262 overlaps the user-input line with the vertical view image 1210 and displays it on the display unit 54. The vertical view line drawing unit 262 in... Figure 28 In step S404, based on the drawn lines input by the user, the starting points 31 of each conductor 30 and upper conductor 90, the components where the starting points 91 are located, and the components where the ending points 36 are located are identified. Then, referring to... Figure 24 The conductor grouping database 73 shown divides multiple conductors 30 and multiple upper conductors 90 into multiple groups.

[0145] In this embodiment, all the multiple wires 30 have their starting points 31 on the first pad 26 of the first semiconductor chip 21 and their ending points 36 on the leads 12 of the lead frame 11, and all have the same thickness of 25 μm. Therefore, the vertical view line pattern generation unit 262 refers to... Figure 24 The conductor grouping database 73 divides all conductors 30 into the first group. Furthermore, Figure 20 The multiple upper guide lines 90 arranged within the single-dotted line frame all have their starting points 91 on the third pad 28 of the second semiconductor chip 22 and their ending points 96 all on the second pad 27 of the first semiconductor chip 21, and all have the same thickness of 10μm. Therefore, the vertical view line drawing generation unit 262 refers to... Figure 24 The conductor grouping database 73 divides all the upper conductors 90 into a second group. Furthermore, in this embodiment, the semiconductor device 210 is described as including two conductor groups, so the total number of groups Nend is 2. However, it may also include, for example, three or more conductor groups with different bending shapes or thicknesses.

[0146] Then, after the user's outline is drawn and the grouping of each guide wire 30 and the upper guide wire 90 is completed, the vertical view line drawing generation unit 262... Figure 28 In step S404, the outline of the vertical view image 1210 drawn by the user is generated as... Figure 32 The vertical view shown is in Figure 1210a.

[0147] Line graph conversion unit 263 in Figure 28 In step S405, the counter N is set to 1. Then, the line graph conversion unit 263... Figure 28 In step S406, with Figure 9 Similarly, in step S105, using Figure 25 The component shape parameters shown and the group bending parameter database 74a of the first group are used to convert the vertical view lead line diagram 112a, vertical view first pad line diagram 126a, vertical view first semiconductor chip line diagram 121a, and vertical view wire line diagram 130a of each component of lead wire 12, first semiconductor chip 21, and first pad 26 and the multiple wires 30 included in the first group into three-dimensional lead line diagram 512a, three-dimensional first pad line diagram 526a, three-dimensional first semiconductor chip line diagram 521a, and three-dimensional wire line diagram 530a, respectively. Here, the vertical view guide line diagram 190a includes the vertical view starting point line diagram 191a, the vertical view first bend point line diagram 192a to the vertical view fourth bend point line diagram 195a, and the vertical view ending point line diagram 196a. The three-dimensional guide line diagram 590a includes the three-dimensional starting point line diagram 591a, the three-dimensional first bend point line diagram 592a to the three-dimensional fourth bend point line diagram 595a, and the three-dimensional ending point line diagram 596a.

[0148] Subsequently, the line graph conversion unit 263 in Figure 28 In step S407, with Figure 9 Similarly, in step S106, the converted stereoscopic lead line diagram 512a, stereoscopic first pad line diagram 526a, stereoscopic wire line diagram 530a, stereoscopic first semiconductor chip line diagram 521a are displayed on the display unit 54 in conjunction with the stereoscopic image 5210.

[0149] Line graph conversion unit 263 in Figure 29 In step S408, based on user input, the component shape parameters or the bending parameters of the first group of wires 30 are adjusted. The adjustment of the component shape parameters or bending parameters can also be achieved, for example, by updating the data stored using user input. Figure 25 The data of the height Z or the slope in the XYZ direction from the reference plane in each cell of the component shape parameter database 71 shown are stored in the storage unit 52 and updated. Figure 26 The coordinate data of each group bending parameter database 74 shown are stored in the storage unit 52.

[0150] Line graph conversion unit 263 in Figure 29 In step S409, the adjusted component shape parameters and the bending parameters of the first group of wires 30 are used, along with... Figure 29 Similarly, in step S406, the vertical view lead line diagram 112a, the vertical view first pad line diagram 126a, the vertical view first semiconductor chip line diagram 121a, and the vertical view wire line diagram 130a are converted into three-dimensional lead line diagrams 512a, 526a, 521a, and 530a, respectively. Figure 29 In step S410, the converted stereoscopic lead line diagram 512a, stereoscopic first pad line diagram 526a, stereoscopic first semiconductor chip line diagram 521a, stereoscopic wire line diagram 530a are displayed on the display unit 54 in conjunction with the stereoscopic image 5210.

[0151] Then, the line graph conversion unit 263 in Figure 29 In step S411, it is determined whether user approval has been input from the input unit 53. If user approval has not been received, ... Figure 29 In step S412, the user's input is received and returned. Figure 29 In step S408, the shape parameters of the first group of conductors 30 are adjusted. Then, the line drawing conversion unit 263 repeats the process. Figure 29 Steps S408 to S411, S412 and up Figure 29In step S411, the user inputs approval. As a result, the converted stereoscopic lead line diagram 512a, stereoscopic first pad line diagram 526a, stereoscopic first semiconductor chip line diagram 521a, and stereoscopic wire line diagram 530a are superimposed on the stereoscopic lead image 512, stereoscopic first pad image 526, stereoscopic first semiconductor chip image 521, and stereoscopic wire image 530.

[0152] Then, the line graph conversion unit 263 in Figure 29 After the user inputs approval in step S411, the line graph conversion unit 263 enters... Figure 29 In step S413, determine whether the counter N is equal to the total number of groups Nend. Then, in Figure 29 If the determination in step S413 is negative, then... Figure 29 In step S414, the counter N is incremented by only 1, and then the process returns. Figure 28 Step S406. Then, the line graph conversion unit 263 uses... Figure 25 The component shape parameters shown and the group bending parameter database 74b of the second group convert the vertical view second pad line diagram 127a, vertical view third pad line diagram 128a, vertical view second semiconductor line diagram 122a, and vertical view upper conductor line diagram 190a into three-dimensional second pad line diagram 527a, three-dimensional third pad line diagram 528a, three-dimensional second semiconductor chip line diagram 522a, and three-dimensional upper conductor line diagram 590a, respectively.

[0153] Then, the line graph conversion unit 263 in Figure 29 In step S407, the three-dimensional line drawings and three-dimensional images of each component of the second pad 27, the second semiconductor chip 22, the third pad 28, and the multiple upper conductive lines 90 included in the second group are overlaid and displayed, and the process is repeated for each component of the second pad 27, the second semiconductor chip 22, the third pad 28, and the multiple upper conductive lines 90 included in the second group. Figure 32 Steps S408 to S410 continue until user approval. Thus, the converted stereoscopic second pad line diagram 527a, stereoscopic third pad line diagram 528a, stereoscopic second semiconductor chip line diagram 522a, and stereoscopic upper conductor line diagram 590a are superimposed on the stereoscopic second pad image 527, stereoscopic third pad image 528, stereoscopic second semiconductor chip image 522, and stereoscopic upper conductor image 590. Then, in Figure 29 If the user's approval is entered in step S411, proceed to... Figure 29 Step S413. Then, in Figure 29 After determining "yes" in step S413, proceed to... Figure 29 Step S415.

[0154] Line graph synthesis section 64 Figure 32In step S415, the vertical view line drawing 1210a generated by the vertical view line drawing generation unit 262 is combined with the three-dimensional line drawing 5210a, which includes the three-dimensional line drawing of all the conductors, including the three-dimensional line drawing of the first group of conductors and the three-dimensional line drawing of the second group of conductors, to generate a three-dimensional line drawing containing the position information of each part of the semiconductor device 210.

[0155] Then, the line graph synthesis unit 64 in Figure 32 In step S416, the generated three-dimensional line drawing containing the position information of each part of the semiconductor device 210 is stored in the three-dimensional line drawing storage unit 65 of the storage unit 52.

[0156] Furthermore, when the contour lines of the stereoscopic line drawing 5210a overlap with those of the stereoscopic image 5210, the data stored in... Figure 25 The data of the height Z or the slope in the XYZ direction from the reference plane in each cell of the component shape parameter database 71 shown become data representing the height and slope of each component of the semiconductor device 210. Therefore, the height and slope of each component of the semiconductor device 210 can also be detected using the data of the height Z or the slope in the XYZ direction from the reference plane stored in each cell of the component shape parameter database 71.

[0157] As explained above, components at the starting point, components at the ending point, and wires of the same thickness are all positioned relative to the starting point due to the location of the bends near the starting point. The location of the bends at the ending point is defined as proportional to the total length of the wire. Therefore, the bending shape of multiple wires in a wire group can be defined using a single bending parameter. Thus, the 3D digital microscope 200 can generate stereoscopic line drawings of each wire 30 and upper wire 90 by the user inputting a small number of bending parameters. Consequently, the 3D digital microscope 200 can measure the 3D shape of the semiconductor device 210 with high precision in a short time.

[0158] In reference Figure 28 , Figure 27 In the described three-dimensional line drawing generation process of the three-dimensional digital microscope 200, for illustrative purposes, the first group of guide wires 30 is converted from a vertical view line drawing to a three-dimensional line drawing, and then the second group of upper guide wires 90 is converted from a vertical view line drawing to a three-dimensional line drawing. This has been explained, but it is not limited to this. For example, the conversion of the first group of guide wires 30 and the second group of upper guide wires 90 from vertical view line drawings to three-dimensional line drawings can be performed simultaneously. After the user approves the overall three-dimensional line drawing, a three-dimensional line drawing is synthesized based on the three-dimensional line drawing.

[0159] Furthermore, the 3D digital microscope 200 is also as described above. Figure 18Like other three-dimensional line drawing generation operations of the described three-dimensional digital microscope 100, the line drawing conversion unit 63 can repeatedly perform the adjustment of shape parameters and the conversion of vertical view line drawing 1210a to stereo line drawing 5210a until the stereo line drawing 5210a overlaps with the stereo image 5210, thereby generating a stereo line drawing 5210a that accurately fits the stereo image 5210.

[0160] The guide wires 30 and upper guide wires 90 used by the three-dimensional digital microscopes 100 and 200 described above to generate three-dimensional line graphs are processed into a broken line shape by connecting the starting point 31, starting point 91, first bend point 32, first bend point 92 to fourth bend point 35, fourth bend point 95, and ending point 36 and ending point 96. The above situation has been explained, but it is not limited to this.

[0161] For example, it can also be like Figure 34 As shown, multiple bending points 37a to 37j are provided in the bending portion between the first bending point 32 and the second bending point 33, and the bending point between the first bending point 32 and the second bending point 33 of the conductor 30 is defined in greater detail. This allows for the generation of a more detailed three-dimensional line drawing of the conductor 30, and enables more detailed measurement of the shape of the conductor 30. The same applies to the upper conductor 90.

[0162] Explanation of symbols

[0163] 10, 210: Semiconductor devices

[0164] 11: Lead Frame

[0165] 11a: Upper surface

[0166] 12: Lead wire

[0167] 20: Semiconductor chips

[0168] 21: First Semiconductor Chip

[0169] 22: Second semiconductor chip

[0170] 25: Padding

[0171] 26: First pad

[0172] 27: Second pad

[0173] 28: Third pad

[0174] 30: Wire

[0175] 31, 91: Starting point

[0176] 32~35, 92~95: First bend point to fourth bend point

[0177] 36, 96: The finish line

[0178] 37a~37j: Bend points

[0179] 41: Vertical View Camera

[0180] 41a~45a: Optical axis

[0181] 42-45: Stereo camera

[0182] 46: Lighting device

[0183] 50, 55: Control Department

[0184] 51: CPU

[0185] 52: Storage Department

[0186] 53: Input Section

[0187] 54: Display Section

[0188] 61: Image Acquisition Department

[0189] 62: Vertical View Line Drawing Generation Unit

[0190] 63: Line Chart Conversion Section

[0191] 64: Line Chart Composition Section

[0192] 65: 3D Line Graph Storage Department

[0193] 70: Shape Parameter Database

[0194] 71: Component Shape Parameter Database

[0195] 72: Bending Parameter Database

[0196] 73: Conductor Grouping Database

[0197] 74, 74a, 74b: Group Bending Parameter Database

[0198] 75: Shape Parameter Database

[0199] 90: Upper conductor

[0200] 100, 200: Three-dimensional digital microscope

[0201] 110, 1210: Vertical view images

[0202] 110a, 1210a: Vertical view line diagram

[0203] 112: Vertical view leader image

[0204] 112a: Vertical view leader line diagram

[0205] 120: Vertical view semiconductor chip image

[0206] 120a: Vertical view of semiconductor chip line drawing

[0207] 121: Vertical view of the first semiconductor chip image

[0208] 121a: Vertical view of the first semiconductor chip line diagram

[0209] 122: Vertical view of the second semiconductor chip image

[0210] 122a: Vertical view of the second semiconductor line diagram

[0211] 125: Vertical view of the padding image

[0212] 125a: Vertical View Padding Line Drawing

[0213] 126: Vertical view of the first pad image

[0214] 126a: Vertical view of the first padding line diagram

[0215] 127: Vertical view of the second pad image

[0216] 127a: Vertical View of Second Pad Line Drawing

[0217] 128: Vertical view of the third pad image

[0218] 128a: Vertical View, Third Pad Line Diagram

[0219] 130: Vertical view of the guide wire image

[0220] 130a: Vertical View Guide Path Diagram

[0221] 131: Vertical view starting point image

[0222] 131a: Vertical view starting point line diagram

[0223] 132-135: Images of the first bend point to the fourth bend point

[0224] 132a~135a: Dotted line diagram of the first bend to the fourth bend

[0225] 136: Vertical view endpoint image

[0226] 136a: Vertical View Endpoint Line Diagram

[0227] 190: Image of the traverse in the vertical view

[0228] 190a: Guide lines in the vertical view

[0229] 191: Vertical view starting point image

[0230] 191a: Vertical view starting line diagram

[0231] 192-195: Images of the first bend point to the fourth bend point

[0232] 192a~195a: Dotted line diagram of the first bend to the fourth bend

[0233] 196: Vertical view endpoint image

[0234] 196a: Vertical View End Line Diagram

[0235] 510, 5210: Stereoscopic images

[0236] 510a, 5210a: 3D line drawing

[0237] 512: 3D Lead Wire Image

[0238] 512a: 3D Lead Wire Diagram

[0239] 520: 3D Semiconductor Chip Image

[0240] 520a: 3D Semiconductor Chip Line Diagram

[0241] 521: Stereoscopic image of the first semiconductor chip

[0242] 521a: 3D Line Diagram of the First Semiconductor Chip

[0243] 522: Stereoscopic image of the second semiconductor chip

[0244] 522a: 3D Line Diagram of Second Semiconductor Chip

[0245] 525: 3D padding image

[0246] 525a: 3D Padding Line Diagram

[0247] 526~528: Stereoscopic images of the first and third padding layers

[0248] 526a~528a: Three-dimensional first liner line drawing~Three-dimensional third liner line drawing

[0249] 530: 3D traverse image

[0250] 530a: 3D traverse diagram

[0251] 531: Three-dimensional starting point image

[0252] 531a: Three-dimensional starting point line diagram

[0253] 532~535: Images of the first and fourth bending points in 3D.

[0254] 532a~535a: 3D diagram of the first bend and line drawing to the fourth bend and line drawing.

[0255] 536: Three-dimensional endpoint image

[0256] 536a: 3D finish line diagram

[0257] 590: 3D upper guide wire image

[0258] 590a: 3D top traverse diagram

[0259] 591: Three-dimensional starting point image

[0260] 591a: Three-dimensional starting point line diagram

[0261] 592~595: Images of the first and fourth bending points in 3D.

[0262] 592a~595a: 3D diagram of the first bend and line drawing ~ 3D diagram of the fourth bend and line drawing

[0263] 596: Three-dimensional endpoint image

[0264] 596a: 3D finish line diagram

Claims

1. A three-dimensional digital microscope capable of acquiring positional information of various parts of a three-dimensional object, characterized in that... include: The control unit generates a three-dimensional line drawing that includes the positional information of each part of the article. The control unit Obtain a vertical view image of the object taken from a vertically upward position, and multiple stereoscopic images of the object taken from multiple obliquely upward positions. Extract the outline lines from the vertical view image of the item to generate a vertical view line drawing of the item. Based on shape parameters including the height information of the item stored in the storage unit, the vertical view line drawing is converted into multiple 3D line drawings. The adjustment of the shape parameters and the conversion of the vertical view line drawing into each of the 3D line drawings are repeated until the converted 3D line drawings overlap with each of the 3D images. The generated vertical view line drawing and the three-dimensional line drawings superimposed on each of the three-dimensional images are combined to generate a three-dimensional line drawing that includes the positional information of each part of the item. Output the position information of each part in the generated 3D line graph.

2. The three-dimensional digital microscope according to claim 1, characterized in that... : The article is a device comprising multiple components and multiple wires connecting the components. The control unit Extract the outlines of each component and each conductor from the vertical view image to generate the vertical view line drawing of the device. The shape parameters are the height of each component from the reference plane, the slope of the surface of each component, and the bending parameters of each conductor.

3. The three-dimensional digital microscope according to claim 1, characterized in that... include: The display section shows images and line graphs; as well as The input section is where users input data. The control unit repeatedly performs the following operations: The vertical view image of the item is displayed on the display unit, and the outline lines in the vertical view image drawn by the user through the input unit are generated as the vertical view line drawing. Based on the adjusted shape parameters input by the user from the input unit, the vertical view line drawing is converted into each of the three-dimensional line drawings, and the converted three-dimensional line drawings are displayed on the display unit in an overlapping manner with each of the three-dimensional images.

4. The three-dimensional digital microscope according to claim 3, characterized in that... : The article is a device comprising multiple components and multiple wires connecting the components. The control unit The vertical view line drawing of the device is generated by combining the outlines of each component in the vertical view image drawn by the user operating the input unit with the outlines of each of the wires. The shape parameters are the height of each component from the reference plane, the slope of the surface of each component, and the bending parameters of each conductor.

5. The three-dimensional digital microscope according to claim 3, characterized in that... : The control unit displays the three-dimensional line graph on the display unit. The location information of a part of the three-dimensional line graph selected by the user through the input unit is displayed on the display unit.

6. The three-dimensional digital microscope according to claim 4, characterized in that... : The control unit displays the three-dimensional line graph on the display unit. The location information of a part of the three-dimensional line graph selected by the user through the input unit is displayed on the display unit.

7. The three-dimensional digital microscope according to claim 2, 4, or 6, characterized in that... : Each of the aforementioned conductors has multiple bends between its starting and ending points. The bending parameters are the three-dimensional coordinate positions of each bending point of each conductor. The three-dimensional coordinate positions of each of the bending points are respectively A set of length direction coordinate position, lateral coordinate position, and height direction coordinate position in a coordinate system formed by the length direction axis extending from the starting point to the ending point of the conductor within the reference plane, the lateral axis extending from the starting point of the conductor in a direction orthogonal to the length direction axis within the reference plane, and the height direction axis extending through the starting point in a direction perpendicular to the reference plane.

8. The three-dimensional digital microscope according to claim 7, characterized in that... : The three-dimensional coordinate positions of each of the aforementioned bending points include three-dimensional scale coordinate positions. The three-dimensional proportional coordinate position is a group of proportional length direction coordinate position proportional to the total length of the conductor between the starting point and the ending point, proportional lateral coordinate position proportional to the total length of the conductor, and proportional height direction coordinate position proportional to the total length of the conductor.

9. The three-dimensional digital microscope according to claim 2, characterized in that... : The control unit divides the multiple conductors into several groups, including the component where the starting point is located, the component where the ending point is located, and conductors with the same thickness, and extracts the contour lines from the vertical view image to generate the vertical view line drawing. The bending parameters stored in the storage unit include multiple group bending parameters specified for each of the groups. The control unit Based on the bending parameters of each group, the vertical view line diagrams of each conductor included in each group are converted into multiple three-dimensional line diagrams. Repeatedly perform the adjustment of the bending parameters of each group and the conversion of the vertical view line drawing of each conductor included in each group to the three-dimensional line drawing, until the converted three-dimensional line drawing of each conductor included in each group overlaps with the three-dimensional image of each conductor included in each group.

10. The three-dimensional digital microscope according to claim 4, characterized in that... : The control unit divides the multiple wires into multiple groups, including components where the starting point is located, components where the ending point is located, and wires of the same thickness. It then generates a vertical view line drawing of the item from the contour lines of each component and each wire in the vertical view image drawn by the user through the input unit. The bending parameters stored in the storage unit include multiple group bending parameters specified for each of the groups. The control unit repeatedly performs the following operations: Based on the bending parameters of each group, the vertical view line diagrams of each conductor included in each group are converted into multiple three-dimensional line diagrams. Subsequently, based on the adjusted bending parameters of each group input by the user from the input unit, the vertical view line drawing of each conductor included in each group is converted into a three-dimensional line drawing, and the converted three-dimensional line drawing and the three-dimensional image are displayed on the display unit.

11. The three-dimensional digital microscope according to claim 9 or 10, characterized in that... : The multiple conductors in one group each have multiple bends between the starting point and the ending point. The group bending parameters are the three-dimensional coordinate positions of each bending point common to all the conductors in the group. The three-dimensional coordinate positions of each bending point are respectively A set of length direction coordinate position, lateral coordinate position, and height direction coordinate position in a coordinate system formed by the length direction axis extending from the starting point to the ending point of the conductor within the reference plane, the lateral axis extending from the starting point of the conductor in a direction orthogonal to the length direction axis within the reference plane, and the height direction axis extending through the starting point in a direction perpendicular to the reference plane.

12. The three-dimensional digital microscope according to claim 11, characterized in that... : The three-dimensional coordinate positions of each bending point include three-dimensional scale coordinate positions. The three-dimensional proportional coordinate position is a group of proportional length direction coordinate position proportional to the total length of the conductor between the starting point and the ending point, proportional lateral coordinate position proportional to the total length of the conductor, and proportional height direction coordinate position proportional to the total length of the conductor.

Images