Antenna and electronic device including the same

Abstract

According to various embodiments, an electronic device includes a housing, an antenna structure disposed in an internal space of the housing and including a substrate, at least one conductive patch disposed on the substrate, and at least one feeding portion disposed at a designated point of the at least one conductive patch, an electronic component disposed to at least partially overlap the at least one conductive patch when the substrate is viewed from above, and a wireless communication circuit disposed in the internal space, electrically connected to the at least one feeding portion, and forming a beam pattern in a first direction through the at least one conductive patch, wherein the electronic component is electrically connected to the main board through at least one electric connection structure disposed on the substrate, the at least one electric connection structure can include a first conductive path disposed to pass through the at least one conductive patch and a ground layer of the substrate, and a second conductive path passing through the at least one conductive patch and electrically connected to the ground layer.

Description

Technical Field

[0001] This disclosure relates to an antenna and an electronic device including the antenna. Background Technology

[0002] With the development of wireless communication technology, electronic devices (e.g., electronic devices used for communication) are widely used in daily life, resulting in an exponential increase in content usage. Due to the rapid growth in content usage, network capacity is gradually reaching its limit, and after the commercialization of fourth-generation (4G) communication systems, research is now being conducted on next-generation communication systems (e.g., fifth-generation (5G), pre-5G, or new radio (NR) communication systems) using ultra-high frequency (e.g., millimeter wave) bands (e.g., the 3GHz to 300GHz band) to meet the growing demand for radio data services. Summary of the Invention

[0003] Technical issues

[0004] Current development focuses on next-generation wireless communication technologies to allow signal transmission / reception using frequencies ranging from 3 GHz to 100 GHz. This involves addressing high free-space losses due to frequency characteristics, implementing efficient mounting structures to increase antenna gain, and developing related novel antenna modules (e.g., antenna structures). Antenna modules can comprise arrays of antenna elements (e.g., conductive patches) arranged at regular intervals. These antenna elements can be configured to form a beam pattern in any direction within the electronic device. For example, the antenna module can be configured such that it forms a beam pattern in at least a portion of at least one of the front, rear, or side surfaces within the internal space of the electronic device.

[0005] Meanwhile, various electronic components (e.g., button devices and / or at least one sensor module) and an antenna module may be disposed in the electronic device, and the electronic components may have an appropriate arrangement structure to perform their functions without compromising the radiation performance of the antenna module.

[0006] However, in increasingly thinner electronic devices, the space available to house antenna modules within the device's internal dimensions without compromising radiation performance due to interference from other electronic components is gradually decreasing. Therefore, electronic devices require effective antenna arrangement structures with other electronic components without sacrificing radiation performance.

[0007] One aspect of this disclosure is to provide an antenna having an efficient arrangement structure with other electronic components and an electronic device including the antenna.

[0008] Another aspect of this disclosure is to provide an antenna that can be disposed together with other electronic components without reducing radiation performance, thereby helping to make the electronic device thinner, and an electronic device including the antenna.

[0009] Solution to the problem

[0010] According to one aspect of this disclosure, an electronic device is provided. The electronic device includes: a housing; an antenna structure disposed within an internal space of the housing, and including a substrate, at least one conductive patch, and at least one feed portion disposed at a specific location on the at least one conductive patch, the substrate having a first substrate surface facing a first direction, a second substrate surface facing a direction opposite to the first substrate surface, and a ground layer disposed in a space between the first substrate surface and the second substrate surface, the at least one conductive patch being disposed between the ground layer and the first substrate surface, or exposed on the first substrate surface; electronic components disposed on the first substrate surface, the electronic components being configured to at least partially overlap the at least one conductive patch when viewed from above; and a wireless communication circuit disposed within the internal space, electrically connected to the at least one feed portion, and configured to form a beam pattern in a first direction through the at least one conductive patch, wherein the electronic components are electrically connected to a motherboard via at least one electrical connection structure disposed on the substrate, and wherein the at least one electrical connection structure includes a first conductive path configured to pass through the at least one conductive patch and the ground layer, and a second conductive path passing through the at least one conductive patch and electrically connected to the ground layer.

[0011] Beneficial effects of the invention

[0012] Antennas according to embodiments of the present disclosure help to utilize arrangement space because at least one electronic component (e.g., a button device) is arranged together through at least a portion of the antenna structure without reducing radiation performance.

[0013] In addition, various effects may be provided through the explicit or implicit understanding of this disclosure. Attached Figure Description

[0014] In conjunction with the accompanying drawings, the same or similar reference numerals may be used for the same or similar parts.

[0015] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure;

[0016] Figure 2 This is a block diagram illustrating an electronic device for supporting conventional network communication and fifth-generation (5G) network communication according to embodiments of the present disclosure;

[0017] Figure 3aThis is a perspective view illustrating a mobile electronic device according to an embodiment of the present disclosure;

[0018] Figure 3b This is a rear perspective view showing a mobile electronic device according to an embodiment of the present disclosure;

[0019] Figure 3c This is an exploded perspective view showing a mobile electronic device according to an embodiment of the present disclosure;

[0020] Figure 4a References are shown to illustrate embodiments according to this disclosure. Figure 2 A schematic diagram showing and describing the structure of the third antenna module;

[0021] Figure 4b According to embodiments of this disclosure Figure 4a The cross-sectional view of the third antenna module shown is taken along line Y-Y'.

[0022] Figure 5a This is a partial cross-sectional perspective view of an electronic device according to an embodiment of the present disclosure, in which an antenna structure and a button device are provided;

[0023] Figure 5b This illustrates an embodiment according to the present disclosure. Figure 5a A top view of the electronic device shown;

[0024] Figure 6a This is a cross-sectional view showing a partial view of an antenna structure including a button device according to an embodiment of the present disclosure;

[0025] Figure 6b This is a perspective view schematically illustrating the arrangement relationship between the keypad and the conductive pad according to an embodiment of the present disclosure;

[0026] Figure 6c This is a cross-sectional view showing a partial view of an antenna structure including a button device according to an embodiment of the present disclosure;

[0027] Figure 7a and Figure 7b This is a view illustrating the arrangement of conductive paths according to various embodiments of the present disclosure;

[0028] Figure 7c and Figure 7d This is a view showing the arrangement structure of the power supply section according to various embodiments of the present disclosure;

[0029] Figure 8 This illustrates an embodiment according to the present disclosure. Figure 7c A graph showing the radiation performance of the antenna structure in the configuration, depending on the presence or absence of a button device;

[0030] Figure 9This is a diagram illustrating the arrangement of conductive paths according to embodiments of the present disclosure;

[0031] Figure 10 It is shown that the embodiments according to this disclosure depend on Figure 9 A graph showing the radiation performance of an antenna structure with respect to the separation distance between the two conductive paths;

[0032] Figure 11 This is a diagram illustrating the arrangement of conductive pads included in an electronic component according to an embodiment of the present disclosure;

[0033] Figures 12a to 12c This is a diagram illustrating the configuration of an antenna structure including a button device according to various embodiments of the present disclosure;

[0034] Figure 13 This is a diagram illustrating the configuration of an antenna structure including a button device according to an embodiment of the present disclosure;

[0035] Figure 14 This illustrates an embodiment according to the present disclosure. Figure 13 A graph showing the radiation performance of the antenna structure in the configuration, depending on the presence or absence of a button device;

[0036] Figure 15 This is a diagram illustrating the configuration of an antenna structure including a button module according to an embodiment of the present disclosure;

[0037] Figure 16a and Figure 16b This illustrates various embodiments depending on the present disclosure. Figure 15 A graph showing the radiation performance of the antenna structure with movable arrangement of the button module in the configuration.

[0038] Figure 17 This is a diagram illustrating the configuration of an antenna structure including a button module according to an embodiment of the present disclosure;

[0039] Figure 18a This is a partial cross-sectional perspective view of an electronic device according to an embodiment of the present disclosure, wherein the button device is disposed in the housing;

[0040] Figure 18b This is a partial illustration of an embodiment according to the present disclosure. Figure 18a A cross-sectional view of the electronic device taken from line 18b-18b; and

[0041] Figures 19a to 19e This is a diagram illustrating the configuration of buttons or housings for radiation of an antenna structure according to various embodiments of the present disclosure. Detailed Implementation

[0042] Figure 1This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0043] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0044] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0045] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0046] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0047] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0048] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0049] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0050] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0051] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0052] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0053] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0054] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0056] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0057] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0058] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0059] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0060] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0061] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0062] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0063] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0064] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0065] Figure 2 An electronic device in a network environment 200 including multiple cellular networks is shown according to one embodiment of the present disclosure.

[0066] Reference Figure 2The electronic device 101 includes a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front-end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, an antenna 248, a processor 120, and a memory 130. The second network 199 includes a first cellular network 292 and a second cellular network 294. The electronic device 101 may also include references... Figure 1 At least one of the described components, the second network 199 may also include at least one other network. The first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192. The fourth RFIC 228 may be omitted or included as part of the third RFIC 226.

[0067] The first communication processor 212 can establish a communication channel in a frequency band used for wireless communication with the first cellular network 292, and support conventional network communication through the established communication channel. The first cellular network can be a conventional network including second-generation (2G), 3G, 4G, or Long Term Evolution (LTE) networks. The second communication processor 214 can establish a communication channel corresponding to a specified frequency band (e.g., about 6 GHz to about 60 GHz) in the frequency band used for wireless communication with the second cellular network 294, and support 5G network communication through the established communication channel. The second cellular network 294 can be a 5G network defined in the 3G Partnership Program (3GPP). The first communication processor 212 or the second communication processor 214 can establish a communication channel corresponding to another specified frequency band (e.g., about 6 GHz or less) in the frequency band used for wireless communication with the second cellular network 294, and support 5G network communication through the established communication channel. The first communication processor 212 and the second communication processor 214 can be implemented as a single chip or a single package. The first communication processor 212 or the second communication processor 214 can be formed as a single chip or a single package with the processor 120, the auxiliary processor 123 or the communication module 190.

[0068] When transmitting, the first RFIC 222 can convert the baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of approximately 700 MHz to approximately 3 GHz used in the first cellular network 292 (e.g., a conventional network). When receiving, the RF signal can be obtained from the first cellular network 292 through the first antenna module 242, and the RF signal can be preprocessed by the first RFFE 232. The first RFIC 222 can convert the preprocessed RF signal back into a baseband signal for processing by the first communication processor 212.

[0069] When transmitting, the second RFIC 224 can convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into a Sub6 band (e.g., 6 GHz or less) RF signal (hereinafter referred to as a 5G Sub6 RF signal) to be used in the second cellular network 294 (e.g., a 5G network). When receiving, the 5G Sub6 RF signal can be obtained from the second cellular network 294 (e.g., a 5G network) via the second antenna module 244, and preprocessed by the second RFFE 234. The second RFIC 224 can convert the preprocessed 5G Sub6 RF signal back into a baseband signal, which can then be processed by the corresponding communication processor in the first communication processor 212 or the second communication processor 214.

[0070] The third RFIC 226 can convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as a 5G Above6 RF signal) in the 5G Above6 frequency band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (e.g., a 5G network). Upon reception, the 5G Above6 RF signal can be obtained from the second cellular network 294 via antenna 248 and preprocessed by the third RFFE 236. The third RFIC 226 can convert the preprocessed 5G Above6 RF signal back into a baseband signal for processing by the second communication processor 214. The third RFFE 236 can be formed as part of the third RFIC 226.

[0071] Electronic device 101 may include a fourth RFIC 228, separate from or at least part of the third RFIC 226. In this case, the fourth RFIC 228 may convert a baseband signal generated by the second communication processor 214 into an intermediate frequency (IF) RF signal (e.g., about 9 GHz to about 11 GHz) and transmit the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second cellular network 294 via antenna 248 and converted into an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal back into a baseband signal for processing by the second communication processor 214.

[0072] The first RFIC 222 and the second RFIC 224 can be implemented as at least part of a single package or a single chip. The first RFFE 232 and the second RFFE 234 can be implemented as at least part of a single package or a single chip. At least one of the first antenna module 242 and the second antenna module 244 can be omitted, or can be combined with another antenna module to process RF signals of corresponding multiple frequency bands.

[0073] The third RFIC 226 and antenna 248 can be disposed on the same substrate to form a third antenna module 246. For example, the wireless communication module 192 or processor 120 can be disposed on the first substrate (e.g., a main printed circuit board (PCB)). The third RFIC 226 is disposed in a local area (e.g., the lower surface) of the first substrate and a separate second substrate (e.g., a sub-PCB), and the antenna 248 is disposed in another local area (e.g., the upper surface) of the first substrate and the separate second substrate, thereby forming the third antenna module 246. By disposing the third RFIC 226 and antenna 248 on the same substrate, the length of the transmission line between them can be reduced. This can reduce signal loss (e.g., attenuation) in the high-frequency band (e.g., from about 6 GHz to about 60 GHz) used in 5G network communication caused by the transmission line. Therefore, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294.

[0074] Antenna 248 can be configured as an antenna array comprising multiple antenna elements suitable for beamforming. In this case, the third RFIC 226 may include multiple phase shifters 238 corresponding to the multiple antenna elements as part of the third RFFE 236. During transmission, each of the multiple phase shifters 238 can shift the phase of a 5G Above6 RF signal that will be transmitted through the corresponding antenna element to an external location (e.g., a base station of a 5G network) of the electronic device 101. During reception, each of the multiple phase shifters 238 can convert the phase of a 5G Above6 RF signal received from the external location through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception to be performed via beamforming between the electronic device 101 and the external location.

[0075] The second cellular network 294 can operate independently of the first cellular network 292 (e.g., a legacy network) (e.g., standalone (SA)) or in conjunction with the first cellular network 292 (e.g., non-standalone (NSA)). For example, a 5G network may only have an access network (e.g., a 5G radio access network (RAN) or a next-generation (NG) RAN) and no next-generation core network (NGC). After accessing the access network of the 5G network, the electronic device 101 can access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., an evolved packet-switched core network (EPC)). LTe protocol information for communicating with the legacy network or New Radio (NR) protocol information for communicating with the 5G network can be stored in memory 130 for access by processor 120, the first communication processor 212, or the second communication processor 214.

[0076] Figure 3a A perspective view showing the front surface of a mobile electronic device 300 according to an embodiment is shown. Figure 3b It shows Figure 3a A perspective view of the rear surface of the mobile electronic device 300 shown.

[0077] Figure 3a or Figure 3b The electronic device 300 may be at least partially similar to Figure 1 The electronic device 101 may also include other embodiments of the electronic device.

[0078] Reference Figure 3a and Figure 3bThe mobile electronic device 300 may include a housing 310, wherein the housing 310 includes a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a side surface 310C surrounding the space between the first surface 310A and the second surface 310B. The housing 310 may refer to a structure forming a portion of the first surface 310A, the second surface 310B, and the side surface 310C. The first surface 310A may be formed from a front panel 302 (e.g., a glass or polymer panel coated with various coatings), at least partially of which is substantially transparent. The second surface 310B may be formed from a substantially opaque rear panel 311. The rear panel 311 may be formed from, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The side surface 310C may be formed from a side frame structure (or “side member”) 318 bonded to the front panel 302 and the rear panel 311 and comprising metal and / or polymer. The back panel 311 and the side frame structure 318 can be integrally formed and can be made of the same material (e.g., a metallic material such as aluminum).

[0079] The front panel 302 may include two first regions 310D, each disposed along its long edge and seamlessly curved and extending from a first surface 310A toward the rear panel 311. Similarly, the rear panel 311 may include two second regions 310E, each disposed along its long edge and seamlessly curved and extending from a second surface 310B toward the front panel 302. The front panel 302 (or the rear panel 311) may include only one of the first regions 310D (or the second regions 310E). The first region 310D or the second region 310E may be partially omitted. When viewed from the side of the mobile electronic device 300, the side frame structure 318 may have a first thickness (or width) on the side excluding the first region 310D or the second region 310E, and may have a second thickness less than the first thickness on the other side including the first region 310D or the second region 310E.

[0080] Mobile electronic device 300 may include at least one of the following: display 301, audio modules 303, 307 and 314, sensor modules 304, 316 and 319, camera modules 305, 312 and 313, key input device 317, light-emitting device, and connector holes 308 and 309. Mobile electronic device 300 may omit at least one of the above components (e.g., key input device 317 or light-emitting device), or may include other components.

[0081] For example, a large portion of the display 301 may be exposed through the front panel 302. At least a portion of the display 301 may be exposed through the front panel 302 forming a first region 310D of the first surface 310A and side surfaces 310C. The outline of the display 301 (i.e., edges and corners) may have a substantially the same shape as the outline of the front panel 302. The spacing between the outline of the display 301 and the outline of the front panel 302 may remain substantially constant in order to increase the exposed area of ​​the display 301.

[0082] A recess or opening may be formed in a portion of the display area of ​​the display 301 to accommodate at least one of the audio module 314, sensor module 304, camera module 305, and light-emitting device. At least one of the audio module 314, sensor module 304, camera module 305, fingerprint sensor 316, and light-emitting element may be arranged on the back of the display area of ​​the display 301. The display 301 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a stylus. At least a portion of sensor modules 304 and 319 and / or at least a portion of key input device 317 may be arranged in a first region 310D and / or a second region 310E. Audio modules 303, 307, and 314 may correspond to microphone hole 303 and speaker holes 307 and 314, respectively. Microphone hole 303 may contain a microphone for acquiring external sound, and in this case, may contain multiple microphones for sensing the direction of sound. Speaker holes 307 and 314 can be classified as external speaker hole 307 and call receiver hole 314. Microphone hole 303 and speaker holes 307 and 314 can be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) can be provided without speaker holes 307 and 314.

[0083] Sensor modules 304, 316, and 319 can generate electrical signals or data corresponding to the internal operating state of the mobile electronic device 300 or to external environmental conditions. Sensor modules 304, 316, and 319 may include a first sensor module 304 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface 310A of the housing 310, and / or a third sensor module 319 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on a second surface 310B of the housing 310. A fingerprint sensor may be disposed on both the second surface 310B and the first surface 310A (e.g., a display 301) of the housing 310. The electronic device 300 may also include at least one of the following sensors: a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0084] Camera modules 305, 312, and 313 may include a first camera device 305 disposed on a first surface 310A of the electronic device 300, and a second camera device 312 disposed on a second surface 310B, and / or a flash 313. Camera module 305 or camera module 312 may include one or more lenses, an image sensor, and / or an image signal processor. Flash 313 may include, for example, a light-emitting diode or a xenon lamp. Two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device 300.

[0085] The key input device 317 may be arranged on the side surface 310C of the housing 310. The mobile electronic device 300 may not include some or all of the key input devices 317 described above, and the un-included key input devices 317 may be implemented in another form, such as soft keys on the display 301. The key input device 317 may include a sensor module 316 arranged on the second surface 310B of the housing 310.

[0086] A light-emitting device may be disposed on a first surface 310A of the housing 310. For example, the light-emitting device may provide status information of the electronic device 300 in an optical form. The light-emitting device may provide a light source associated with the operation of the camera module 305. The light-emitting device may include, for example, a light-emitting diode (LED), an IR LED, or a xenon lamp.

[0087] Connector holes 308 and 309 may include a first connector hole 308 and / or a second connector hole 309, wherein the first connector hole 308 is adapted for a connector (e.g., a USB connector) for transmitting power and / or data to and receiving power and / or data from an external electronic device, and the second connector hole 309 is adapted for a connector (e.g., a headphone jack) for transmitting audio signals to and receiving audio signals from an external electronic device.

[0088] Some sensor modules 305 in camera modules 305 and 312, some sensor modules 304 in sensor modules 304 and 319, or indicators may be arranged to be exposed through the display 301. For example, camera modules 305, sensor modules 304, or indicators may be arranged within the interior space of the electronic device 300 so as to be in contact with the external environment through a perforated opening in the display 301 to the front panel 302. In another embodiment, some sensor modules 304 may be arranged to perform their functions within the interior space of the electronic device without being visually exposed through the front panel 302. For example, in this case, the area of ​​the display 301 facing the sensor modules may not require a perforated opening.

[0089] Figure 3c It shows Figure 3a An exploded perspective view of the mobile electronic device 300 shown.

[0090] Reference Figure 3c The mobile electronic device 300 may include a side frame structure 310, a first support member 3211 (e.g., a bracket), a front panel 302, a display 301, an electromagnetic induction panel, a PCB 340, a battery 350, a second support member 360 (e.g., a rear cover), an antenna 370, and a rear panel 311. The mobile electronic device 300 may omit at least one of the above components (e.g., the first support member 3211 or the second support member 360), or may include another component. Some components of the electronic device 300 may be compatible with... Figure 3a or Figure 3b The components of the mobile electronic device 300 shown are the same or similar, therefore, their description is omitted below.

[0091] A first support member 3211 is disposed inside the mobile electronic device 300 and may be connected to or integrated with the side bezel structure 320. The first support member 3211 may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member 3211 may be coupled to a display 301 on one side and to a PCB 340 on the other side. A processor, memory, and / or interface may be mounted on the PCB 340. The processor may include, for example, one or more of a CPU, AP, GPU, ISP, sensor central processor, or CP.

[0092] The memory may include, for example, volatile memory or non-volatile memory.

[0093] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital Card (SD) card interface, and / or an audio interface. The interface enables the mobile electronic device 300 to be electrically or physically connected to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0094] Battery 350 is a means for supplying power to at least one component of mobile electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell. At least a portion of battery 350 may be arranged on a plane substantially the same as PCB 340. Battery 350 may be integrally arranged within mobile electronic device 300 and may be detachably arranged from mobile electronic device 300.

[0095] Antenna 370 may be disposed between rear panel 311 and battery 350. Antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. Antenna 370 may perform short-range communication with external devices or transmit and receive power required for wireless charging. The antenna structure may be formed by a portion of side frame structure 320 and / or first support member 3211, or a combination of side frame structure 320 and first support member 3211.

[0096] Figure 4a Reference is shown to one embodiment of the present disclosure. Figure 2 The structure of the third antenna module is described. Figure 4a (a) is a perspective view showing the third antenna module 246 as viewed from one side. Figure 4a (b) is a perspective view showing the third antenna module 246 as viewed from the other side. Figure 4a (c) shows along Figure 4a (a) is a cross-sectional view of the third antenna module 246 taken by line X-X'.

[0097] Reference Figure 4a The third antenna module 246 includes a printed circuit board 410, an antenna array 430, an RFIC 452, and a PMIC 454. The third antenna module 246 also includes a shielding member 490. At least one of the above components may be omitted, or at least two of the components may be integrally formed.

[0098] The printed circuit board 410 may include multiple conductive layers and multiple non-conductive layers stacked alternately with the conductive layers. The printed circuit board 410 may provide electrical connections between the printed circuit board 410 and / or various electronic components disposed externally, using wiring and conductive paths formed in the conductive layers.

[0099] Antenna array 430 includes a plurality of antenna elements 432, 434, 436, or 438 configured to form a directional beam. Antenna elements 432, 434, 436, or 438 may be formed on a first surface of printed circuit board 410. Antenna array 430 may be formed inside printed circuit board 410. Antenna array 430 may include multiple antenna arrays of the same or different shapes or types (e.g., dipole antenna arrays and / or patch antenna arrays).

[0100] RFIC 452 may be disposed spaced apart from the antenna array on a second surface of printed circuit board 410 opposite to the first surface. RFIC 452 is configured to process signals of a selected frequency band transmitted / received via antenna array 430. When transmitting, RFIC 452 can convert baseband signals obtained from the communication processor into RF signals of the specified frequency band. When receiving, RFIC 452 can convert RF signals received via antenna array 430 into baseband signals and transmit the baseband signals to the communication processor.

[0101] When transmitting, RFIC 452 can convert the IF signal (e.g., from about 9 GHz to about 11 GHz) obtained from the intermediate frequency integrated circuit (IFIC) into an RF signal of the selected frequency band. When receiving, RFIC 452 can down-convert the RF signal obtained through antenna array 430, convert the RF signal into an IF signal, and transmit the IF signal to the IFIC.

[0102] The PMIC 454 may be disposed in another local area (e.g., a second surface) of the printed circuit board 410, spaced apart from the antenna array 430. The PMIC 454 may receive voltage from the main PCB to provide the power required by the RFIC 452 on the antenna module.

[0103] The shielding member 490 may be disposed on a portion (e.g., a second surface) of the printed circuit board 410 to electromagnetically shield at least one of the RFIC 452 or PMIC 454. The shielding member 490 may include a shielding cover.

[0104] Alternatively, the third antenna module 246 can be electrically connected to another printed circuit board (e.g., a main circuit board) via a module interface. The module interface may include a connecting member, a coaxial cable connector, a board-to-board connector, an interposer, or a flexible PCB (FPCB). The antenna module's RFIC 452 and / or PMIC 454 can be electrically connected to the printed circuit board via the connecting member.

[0105] Figure 4b This illustrates an embodiment of the present disclosure. Figure 4a The cross-sectional view of the third antenna module 246 taken along line Y-Y' in (a). The printed circuit board 410 of the embodiment shown may include an antenna layer 411 and a network layer 413.

[0106] Reference Figure 4b The antenna layer 411 includes at least one dielectric layer 437-1 and antenna elements 436 and / or feed portions 425 formed on or inside the outer surface of the dielectric layer. The feed portion 425 may include feed points 427 and / or feed lines 429.

[0107] Network layer 413 includes at least one dielectric layer 437-2, at least one ground layer 433 formed on or inside the outer surface of the dielectric layer, at least one conductive path 435, transmission line 423 and / or feeder line 429.

[0108] Figure 4a (c) The RFIC 452 can be electrically connected to the network layer 413 via the first solder bump 440-1 and the second solder bump 440-2. Alternatively, various connection structures (e.g., solder or ball grid array (BGA)) can be used instead of solder bumps. The RFIC 452 can be electrically connected to the antenna element 436 via the first solder bump 440-1, transmission line 423, and feed section 425. The RFIC 452 can also be electrically connected to the ground layer 433 via the second solder bump 440-2 and conductive path 435. The RFIC 452 can also be electrically connected to the aforementioned module interface via feed line 429.

[0109] Figure 5a This is a partial cross-sectional perspective view of an electronic device according to an embodiment of the present disclosure, in which an antenna structure and a button device are provided. Figure 5b This illustrates an embodiment according to the present disclosure. Figure 5a A top view of the electronic device shown.

[0110] Figure 5a and Figure 5b The electronic device 300 shown may be at least partially similar to Figure 1 The electronic device 101 shown or Figure 3a The electronic device 300 shown may be an alternative embodiment of an electronic device.

[0111] Figure 5a and Figure 5b The antenna structure 500 shown (e.g., an antenna or antenna module) may be at least partially similar to Figure 1 Antenna module 197 or Figure 2 The third RFIC 226 may include other embodiments of the antenna structure.

[0112] Figure 5a and Figure 5b The button device 600 shown may be at least partially similar to Figure 1 Input module 150 or Figure 3a The key input device 317 may be included in other embodiments, or may include key input devices.

[0113] Reference Figure 5a and Figure 5b Electronic device 300 (e.g., Figure 1 Electronic device 101 or Figure 3a The electronic device 300 may include a housing 310, the housing 310 including a side member 320, an antenna structure 500 (e.g., an antenna or antenna module) disposed within the interior space of the housing 310, and a button device 600 at least partially facing the antenna structure 500 and visible from the outside through at least a portion of the housing. According to an embodiment, the side member 320 may be formed as a side surface of the electronic device 300 (e.g., Figure 3a The side member 320 may include at least a portion of the side surface 310C of the electronic device 300, and may be configured to be at least partially visible from the outside. According to an embodiment, the side member 320 may include a support member 3211 (e.g., a support structure) that extends at least partially into the interior space of the electronic device 300.

[0114] According to various embodiments, the antenna structure 500 may include a substrate 590 and conductive patches 510 and 520 as antenna elements disposed on the substrate 590. According to embodiments, the antenna structure 500 may operate as an array antenna via the conductive patches 510 and 520. According to embodiments, the substrate 590 may have a first substrate surface 5901 facing a first direction (direction ①), a second substrate surface 5902 facing a direction opposite to the first substrate surface 5901, and a substrate side surface 5903 surrounding the space between the first substrate surface 5901 and the second substrate surface 5902. According to embodiments, the electronic device 300 may include a wireless communication circuit (e.g., [missing information]) electrically connected to the conductive patches 510 and 520 of the antenna structure 500. Figure 1 Wireless communication module 192 in Figure 4b RFIC 452 or Figure 6a The wireless communication circuit 595 in the embodiment may be disposed on the surface 5902 of the second substrate. In some embodiments, the wireless communication circuit 595 may be disposed on the surface 5902 of the second substrate. In some embodiments, the wireless communication circuit 595 may be disposed on an electrical connection member spaced apart from the substrate 590 in the internal space of the electronic device 300 (e.g., Figure 17 The electrical connection member 597 is electrically connected to conductive patches 510 and 520 disposed in the substrate 590. According to an embodiment, conductive patches 510 and 520 may include a first conductive patch 510 and a second conductive patch 520 spaced apart from each other at a predetermined interval. In some embodiments, conductive patches 510 and 520 may be replaced by a single conductive patch. In some embodiments, conductive patches 510 and 520 may be replaced by three or more conductive patches spaced apart from each other at a predetermined interval. According to an embodiment, the wireless communication circuit 595 may be configured to transmit and / or receive radio signals in the range of approximately 3 GHz to 100 GHz via the conductive patches 510 and 520.

[0115] According to various embodiments, the substrate 590 of the antenna structure 500 can be disposed facing the side member 320 in the internal space of the electronic device 300. For example, in the internal space of the electronic device 300, the substrate 590 can be configured such that the first substrate surface 5901 faces the side member 320, thereby causing the beam pattern of the antenna structure 500 to be formed in a first direction (direction ①) facing the side member 320. According to an embodiment, the substrate 590 can be disposed on a mounting portion 3212 provided by the structural shape of the support member 3211. According to an embodiment, the substrate 590 can be fixed to the mounting portion 3212 via a conductive plate 550 for supporting the substrate side surface 5903 and / or the second substrate surface 5902. For example, the substrate 590 can be fixed to the conductive plate 550 by tape or adhesive, and the conductive plate 550 can be fixed to the mounting portion 3212 or the side member 320 by fastening members such as screws.

[0116] According to various embodiments, the button device 600 may include a button 610 and key modules 620 and 630. The button 610 is exposed to the outside through an opening 321 formed in the side member 320 and has pressing protrusions 611 and 612 projecting in the substrate direction (negative x-axis direction). Key modules 620 and 630 are disposed on the surface 5901 of the first substrate to be switched on and off in response to a pressing operation of the button 610. According to embodiments, the button 610 is configured to be externally visible to the electronic device 300 and allows at least one function of the electronic device 300 to be performed by user manipulation (e.g., pressing or touching). According to embodiments, the at least one function may include various functions such as volume up / down, wake-up, sleep, or power on / off. According to an embodiment, when viewed from above on the surface 5901 of the first substrate, key modules 620 and 630 may include a first key module 620 that at least partially overlaps with the first conductive patch 510, and a second key module 630 that at least partially overlaps with the second conductive patch 520. In some embodiments, when the antenna structure 500 includes three or more conductive patches, at least one conductive patch may be disposed at a position not corresponding to key modules 620 and 630. According to an embodiment, the pressing protrusions 611 and 612 of the button 610 may include a first pressing protrusion 611 for pressing the first key module 620 and a second pressing protrusion 612 for pressing the second key module 630. According to an embodiment, the first pressing protrusion 611 and the second pressing protrusion 612 may be integrally formed with the button 610, or may be provided separately and structurally combined with the button 610.

[0117] According to various embodiments, the first key module 620 may include a first button substrate 621 (e.g., a keyboard) disposed on the surface 5901 of a first substrate and a first conductive contact 622 (e.g., a metal dome) disposed on the first button substrate 621 and adjacent to or in contact with the first pressing protrusion 611. For example, when the first pressing protrusion 611 presses the first conductive contact 622 by pressing the button 610, a switching operation can be performed by a circuit structure configured in the first button substrate 621. In some embodiments, when the first conductive contact 622 has a metal dome, a carbon contact, which is a circuit structure disposed above and spaced apart from the first button substrate 621, can be electrically connected by the deformation of the metal dome caused by the pressing of the first pressing protrusion 611, thereby enabling a switching operation. In some embodiments, when the button 610 and the first pressing protrusion 611 are at least partially formed of a conductive material, the first button substrate 621 can perform a switching operation by detecting a capacitance change caused by a user touch. According to an embodiment, the second button module 630 may include a second button substrate 631 (e.g., a keyboard) disposed on the surface 5901 of the first substrate, and a second conductive contact 632 (e.g., a metal dome) disposed on the second button substrate 631 and adjacent to or in contact with the second pressing protrusion 612. According to an embodiment, the second button module 630 may be disposed on the surface 5901 of the first substrate in substantially the same manner as the first button module 620.

[0118] Although the button device 600 according to embodiments of the present disclosure includes a button 610 for pressing key modules 620 and 630 by means of pressing protrusions 611 and 612 spaced apart from each other by a specified interval, this is not a limitation. For example, the button device 600 may include two buttons respectively disposed at positions corresponding to pressing protrusions 611 and 612. In some embodiments, when three or more conductive patches are disposed in the antenna structure 500, the button device 600 may include three or more key modules and at least one button for pressing the key modules. In some embodiments, the button device 600 may be replaced by at least one other electronic component. For example, at least one other electronic component may include a sensor module (e.g., Figure 3b Sensor module 319), camera module (e.g., Figure 3b The camera module 312), and the speaker device (e.g., Figure 3a External speaker 307), microphone device (e.g., Figure 3a Microphone 303 in the microphone), or connector port (e.g., Figure 3a(Connector hole 308 in the housing). In some embodiments, at least one other electronic component may be configured to correspond to the exterior of the electronic device 300 through the structural shape of the housing 310. In some embodiments, the substrate 590 of the antenna structure 500 may be configured as a rear cover facing the electronic device 300 (e.g., Figure 3b The rear plate 311 in the middle, such that in the direction facing the rear surface (e.g., Figure 3b A beam pattern is formed on the negative z-axis direction. In this case, the buttons 610 of the button device 600 can be exposed on the rear surface of the electronic device 300 (e.g., the negative z-axis direction). Figure 3b The rear surface 310B is seen from the outside.

[0119] According to various embodiments, the antenna structure 500 may include an electrical connection structure for electrically connecting a button device 600 disposed on a first substrate surface 5901 of the substrate 590 to the motherboard of the electronic device 300 (e.g., Figure 3c (Printed circuit board 340 in the substrate). According to an embodiment, the electrical connection structure can be disposed through the internal structure of the substrate, which will be described in detail below.

[0120] An electronic device 300 according to an embodiment of the present disclosure includes an antenna structure 500 and a button device 600. The button device 600 is configured to at least partially overlap with the antenna structure 500 and has an arrangement structure to reduce the radiation performance degradation caused by the button device 600, thereby achieving effective utilization of component installation space without affecting radiation performance.

[0121] Figure 6a This is a cross-sectional view showing, in part, an antenna structure including a button device according to an embodiment of the present disclosure. Figure 6b This is a perspective view schematically illustrating the arrangement relationship between the button device and the conductive pad according to an embodiment of the present disclosure.

[0122] Figure 6a and Figure 6b Only the arrangement between the first button module 620 of the button device 600 and the first conductive patch 510 of the antenna structure 500 is shown, but the arrangement between the second button module 630 and the second conductive patch 520 of the antenna structure 500 can also be substantially the same. In some embodiments, such as Figure 6a and Figure 6b As shown, the electronic device 300 may include an antenna structure 500 having a single conductive patch 510, which corresponds to a button device 600 having a single key module 620.

[0123] Reference Figure 6a and Figure 6b Electronic devices (e.g.) Figure 5aThe electronic device 300 may include an antenna structure 500 and a button device 600, the button device 600 being configured to at least partially overlap with the antenna structure 500. According to an embodiment, the antenna structure 500 may include a substrate 590 having a first substrate surface 5901 facing a first direction (direction ①) and a second substrate surface 5902 facing a direction opposite to the first substrate surface 5901, and a first conductive patch 510 (hereinafter referred to as "conductive patch") disposed between the first substrate surface 5901 and the second substrate surface 5902. According to an embodiment, the conductive patch 510 may be disposed in an insulating layer 591 between the first substrate surface 5901 and the second substrate surface 5902, or may be exposed through at least a portion of the first substrate surface. According to an embodiment, the substrate 590 may include a ground layer 592. According to an embodiment, the conductive patch 510 may be disposed between the ground layer 592 and the first substrate surface 5901 in the insulating layer 591. According to an embodiment, the antenna structure 500 may include a feed section 511, which is configured to at least partially penetrate the insulating layer 591 vertically, and one end is electrically connected to at least a portion of the conductive patch 510. According to an embodiment, the other end of the feed section 511 may be electrically connected to a wireless communication circuit 595 disposed on the second substrate surface 5902 via a first wiring structure 5931 (e.g., electrical wiring) disposed in the insulating layer 591 between the ground layer 592 and the second substrate surface 5902. According to an embodiment, the feed section 511 may include a conductive path, which is configured to at least partially pass through a first via 5921 formed in the ground layer 592.

[0124] According to various embodiments, the button device 600 may be disposed on the first substrate surface 5901 of the antenna structure 500. According to an embodiment, the button device 600 may include a first key module 620 (hereinafter referred to as a "key module") disposed on the first substrate surface 5901 and a button 610 for operating the key module 620 by user manipulation. According to an embodiment, at least a portion of the button 610 may be formed on a side member (e.g., Figure 5a The opening in at least a portion of the side member 320 (e.g., Figure 5a An opening 321 is exposed to allow external visibility and operability. According to an embodiment, button 610 may include a first pressing protrusion 611 (hereinafter referred to as a "pressing protrusion") extending to contact or approach key module 620. According to an embodiment, the first key module 620 may include a first button substrate 621 (e.g., a keyboard) disposed on a first substrate surface 5901 and a first conductive contact 622 (hereinafter referred to as a "conductive contact") disposed on the first button substrate 621 (hereinafter referred to as the "button substrate"). According to an embodiment, the conductive contact 622 may include a metal dome that is pressed by the pressing protrusion 611.

[0125] According to various embodiments, the antenna structure 500 may include a method for connecting the button device 600 to an electronic device (e.g., Figure 5a The motherboard of the electronic device 300 (e.g., Figure 3c The electrical connection structure of the printed circuit board 340 in the substrate 590 is at least a portion thereof. According to an embodiment, the electrical connection structure may include one or more conductive paths 623 and 624 configured to at least partially penetrate the substrate 590. According to an embodiment, one or more conductive paths 623 and 624 may include a first conductive path 623 (e.g., a signal path) and a second conductive path 624 (e.g., a ground path). The first conductive path 623 is disposed in an insulating layer 591 of the substrate 590 to pass from the key module 620 through a second through-hole 5101 formed in the conductive patch 510 and a third through-hole 5922 formed in the ground layer 592. The second conductive path 624 is configured to penetrate the conductive patch 510 from the key module 620. According to an embodiment, the first conductive path 623 may be configured to remain electrically isolated from the conductive patch 510 and the ground layer 592. According to an embodiment, the second conductive path 624 may remain electrically isolated from the conductive patch 510. In another embodiment, the second conductive path 624 may be connected to the ground layer 592 while being electrically connected to the conductive patch 510. According to an embodiment, the first conductive path 623 can be electrically connected to a connector 596 (e.g., a B2B connector) disposed on the second substrate surface 5902 via a second wiring structure 5932 (e.g., electrical wiring) disposed in an insulating layer 591 between the ground layer 592 and the second substrate surface 5902. In some embodiments, the conductive patch 510 and / or the wireless communication circuit 595 can be electrically connected to the motherboard (e.g., a flexible printed circuit board (FPCB) type RF cable or coaxial cable) via another electrical connection component (e.g., an FRC flexible printed circuit board (FPCB) type RF cable or coaxial cable). Figure 3c In a printed circuit board, the other electrical connection member extends from the substrate 590 and is provided separately from the connector 596. In some embodiments, when the wireless communication circuit 595 is provided in an electronic device (e.g., a printed circuit board), ... Figure 5a When the first wiring structure 5931 is located in a position other than the substrate 590 within the internal space of the electronic device 300, it can also be electrically connected to the connector 596, so that the RF signal of the conductive patch 510 and the key input signal of the key module 620 can be transmitted to the motherboard (e.g., ...) through the connector 596. Figure 3c (Printed circuit board 340 in the middle). In some embodiments, although the wireless communication circuit 595 is disposed on the surface 5902 of the second substrate, the RF signal of the conductive patch 510 and the key input signal of the key module 620 can be transmitted to the main board through the connector 596 (e.g., Figure 3c Printed circuit board 340 in the middle.

[0126] Figure 6c This is a cross-sectional view partially illustrating an antenna structure including a button device according to various embodiments of the present disclosure. Figure 6a Compared to the configuration shown, the antenna structure 500 may further include at least one conductive dummy patch 5111 disposed in an insulating layer 591 between the first substrate surface 5901 and the conductive patch 510. According to an embodiment, the dummy patch 5111 may be spaced apart from the conductive patch 510 at a predetermined interval to allow capacitive coupling to the conductive patch 510. According to an embodiment, the dummy patch 5111 may have a smaller size than the conductive patch 510. In some embodiments, the dummy patch 5111 may have a size substantially the same as or larger than the conductive patch 510. According to an embodiment, the dummy patch 5111 can help extend the bandwidth of the operating frequency band of the antenna structure 500 without reducing radiation performance.

[0127] Figure 7a and Figure 7b This is a view of the arrangement of conductive paths according to various embodiments of the present disclosure.

[0128] Figure 7a and Figure 7b This is a top view of the substrate 590 of the antenna structure 500. To explain the arrangement of the conductive paths 623 and 624 connected to the key module 620, the keys (e.g., Figure 6a Button 610 in the diagram is not depicted.

[0129] Reference Figure 7a The antenna structure 500 may include conductive paths 623 and 624 disposed in the substrate 590 and electrically connected to the key module 620. According to an embodiment, conductive paths 623 and 624 may include a first conductive path 623 for transmitting key input signals of the key module 620, and a path 624 for connecting the key module 620 and a ground layer (e.g., ...). Figure 6a The second conductive path 624 of the ground layer 592 in the middle. According to the embodiment, when the substrate 590 is viewed from above, since the conductive paths 623 and 624 are located in the region overlapping with or near the center C of the conductive patch 510, it can be advantageous in reducing the reduction of radiation performance of the antenna structure 500. For example, the patch antenna including the conductive patch 510 has an electric field distribution that is symmetrical about left and right with respect to the vertical direction of the operating polarized wave, so that it can have a virtual ground plane (virtual short plane or e-plane) at the center C of the conductive patch 510, where the electric field becomes zero in the vertical direction of the polarized wave. Therefore, at this location, because the conductive patch 510 and the ground layer (e.g., the second conductive path 624 of the ground layer 592 in the middle) are both located in the middle of the conductive patch 510 and the ground layer (e.g., the ground layer 592 in the middle of the ground layer 592), the second conductive path 624 of the ground layer 592 in the middle ... Figure 6aSince there is no electric field between the grounding layers 592 and the grounding layers 592, the reduction in radiation performance of the antenna structure 500 can be reduced even with the conductive paths 623 and 624. In another example, because the patch antenna including the conductive patch 510 has a stronger electric field from the center C to the edge, the metal structure located at the center of the conductive patch 510 (e.g., conductive paths 623 and 624) has a relatively smaller impact on radiation performance than the metal structure located at the edge.

[0130] According to various embodiments, utilizing the structural characteristics of a patch antenna including conductive patch 510, when viewing the substrate 590 from above, the conductive paths 623 and 624 according to embodiments of the present disclosure can be configured to overlap with a point near the center C of the conductive patch 510. According to embodiments, when viewing the substrate 590 from above, the first conductive path 623 and the second conductive path 624 can be positioned at locations overlapping points symmetrical to each other with respect to the center C of the conductive patch 510. Although for ease of description, the two conductive paths 623 and 624 are shown as spaced apart from each other with respect to the center C, this should not be construed as limiting. For example, the two conductive paths 623 and 624 can be configured to contact each other with respect to the center C.

[0131] Reference Figure 7b When the substrate 590 is viewed from above, one of the two conductive paths 623 and 624 (e.g., the second conductive path 624) can be positioned at a location overlapping the center C of the conductive patch 510. For example, the key module 620 is connected to the ground layer of the substrate 590 (e.g., Figure 6a The second conductive path 624 of the ground layer 592 can be disposed at a position overlapping with the center C. In one embodiment, since it is more advantageous for the first conductive path 623 to be disposed closer to the center C, it can be disposed at a position contacting the second conductive path 624. In another embodiment, the first conductive path 623 can be disposed at a position overlapping with the center C, and the second conductive path 624 can be disposed at a position as close as possible to the first conductive path 623.

[0132] Figure 7c and Figure 7d This is a view showing the arrangement of the power supply section according to various embodiments of the present disclosure.

[0133] Reference Figure 7cAntenna structure 500-1 may include two feed sections 511 and 512 disposed in conductive patch 510, thereby operating with dual polarization. In this case, when the substrate 590 is viewed from above, antenna structure 500-1 may include a first feed section 511 disposed on a first virtual line L1 passing through the center C and a second feed section 512 disposed on a second virtual line L2 passing through the center C and intersecting the first virtual line L1 at a specified angle. According to an embodiment, the specified angle may include 90 degrees. According to an embodiment, antenna structure 500-1, which includes two feed sections 511 and 512 and supports dual polarization, may also include conductive paths 623 and 624, which are disposed at positions overlapping with a point near the center C when the substrate 590 is viewed from above. According to an embodiment, conductive paths 623 and 624 may be symmetrically arranged with respect to the center C, or alternatively, one conductive path 624 may be disposed at a position overlapping with the center C, and the other conductive path 623 may be disposed adjacent to the conductive path 624. In some embodiments, conductive paths 623 and 624 may be positioned at a point overlapping with the center C, but not overlapping with the first and second virtual lines L1 and L2. This is because, when the antenna structure 500-1 supports polarization diversity, the conductive patch 510 generates two perpendicular polarized waves, and the virtual ground plane with zero electric field becomes perpendicular to each other at the center C of the conductive patch 510, thus the center C of the conductive patch 510 functions as a virtual GND point. In some embodiments, conductive paths 623 and 624 may be arranged in a direction perpendicular to the illustrated arrangement direction.

[0134] Reference Figure 7d Antenna structure 500-2 can function as a dual-fed dual-polarized antenna. This antenna further includes a third feed section 513, symmetrical to the first feed section 511 and disposed on the first virtual line L1 relative to the center C of the conductive patch 510, and a fourth feed section 514, symmetrical to the second feed section 512 and disposed on the second virtual line L2 relative to the center C. Even in this case, conductive paths 623 and 624 can be disposed in the substrate 590 at locations overlapping with the point near the center C, thereby not only reducing the reduction in radiation performance of antenna structure 500-2 but also facilitating the implementation of a button device (e.g., Figure 6a An improved arrangement structure for the button device 600 in the middle.

[0135] Figure 8 This illustrates an embodiment according to the present disclosure. Figure 7c The radiation performance curve of the antenna structure depends on the presence or absence of a button device in the configuration.

[0136] Reference Figure 8 It can be seen that, Figure 7cIn the dual-polarization antenna structure 500-1, when the button device 600 is not located on the substrate 590 (e.g., Figure 7c Compared to the gains of vertical polarization (curve 803) and horizontal polarization (curve 804) on the substrate 590, when the button device (e.g., Figure 6a The button device 600 in the middle) is connected through two conductive paths (e.g., Figure 7c Conductive paths 623 and 624 in the substrate 590 are provided (e.g., Figure 7c The vertical polarization (curve 801) and horizontal polarization (curve 802) on the substrate 590 in the antenna structure 500-1 will not change significantly enough to affect the radiation performance in the operating frequency band 810 (e.g., approximately 28 GHz). This means that even if the conductive patch 510 and the button device 600 of the antenna structure 500-1 are arranged to overlap each other, the radiation performance of the antenna structure 500-1 will not be significantly reduced by placing the two conductive paths 623 and 624 at or near the center C.

[0137] Figure 9 This is a diagram illustrating the arrangement of conductive paths according to an embodiment of the present disclosure.

[0138] Reference Figure 9 The antenna structure 500 may include conductive paths 623 and 624 disposed in the substrate 590 and electrically connected to the key module 620. According to an embodiment, conductive paths 623 and 624 may include a first conductive path 623 for transmitting key input signals of the key module 620, and a path 624 for connecting the key module 620 and a ground layer (e.g., ...). Figure 6a The second conductive path 624 of the ground layer 592 in the antenna structure 500. According to an embodiment, when the substrate 590 is viewed from above, the antenna structure 500 may include a second conductive path 624 disposed at a position overlapping the center C of the conductive patch 510, and a first conductive path 623 disposed at a position having a specified separation distance D1 from the second conductive path 624. According to an embodiment, when the substrate 590 is viewed from above, the first conductive path 623 may be disposed within approximately 30% of the straight-line distance (D) from the second conductive path 624 disposed at the center C of the conductive patch 510 to the end of the conductive patch 510. According to an embodiment, even when both the first conductive path 623 and the second conductive path 624 are disposed in areas not overlapping the center C of the conductive patch 510, each of the first conductive path 623 and the second conductive path 624 may be configured such that each separation distance D1 from the center C is within 30% of the straight-line distance D between the center C of the conductive patch 510 and the end of the conductive patch.

[0139] Figure 10 This illustrates an embodiment of the present disclosure that depends on the separation distance between two conductive paths. Figure 9The graph shows the radiation performance of the antenna structure.

[0140] Reference Figure 10 It can be seen that when the first conductive path (e.g., Figure 9 The first conductive path 623) and the second conductive path (e.g., Figure 9 The separation distance of the second conductive path 624 in the middle (e.g., Figure 9 When the separation distance D1 in the antenna gradually increases towards the edge, the antenna structure (e.g., Figure 9 The gain of the antenna structure 500 decreases in the operating frequency band 1010 (e.g., approximately 28 GHz). For example, when the first conductive path 623 is located at approximately 30% (e.g., 28%) of the separation distance D1 from the center C of the second conductive path (e.g., the conductive patch 510), approximately 0.4 mm, a gain reduction of approximately 1 dB is observed. Furthermore, when the separation distance (D1) is changed to approximately 0.6 mm, corresponding to approximately 50% (e.g., 42%), a gain reduction exceeding 2 dB is observed. From these results, it can be seen that the antenna structure 500 can be used without significant performance degradation when the first conductive path 623 and / or the second conductive path 624 are positioned based on the center C within approximately 30% of the linear distance D from the center C to the edge portion of the conductive patch 510. However, when set at a separation distance D1 farther from the center C than described above, it may be difficult to use due to performance degradation.

[0141] Figure 11 This is a diagram illustrating the arrangement of conductive pads included in an electronic component according to an embodiment of the present disclosure.

[0142] Reference Figure 11 The key module 620 may include components disposed on a substrate (e.g., Figure 6a The first substrate surface of the substrate 590 in the substrate (e.g., Figure 6a The surface mount device (SMD) pad 625 is located between the first substrate surface 5901 and the button substrate 621. According to an embodiment, the SMD pad 625 may include a conductive pad 6251 and a connection portion 6252, the conductive pad 6251 being used for electrical connection to surfaces exposed to the substrate (e.g., ...). Figure 6a The first substrate surface of the substrate 590 in the substrate (e.g., Figure 6a The first conductive path 623 (e.g., a signal path) on the first substrate surface 5901 is connected to a second conductive path 624 (e.g., a ground path). According to an embodiment, the conductive pad 6251 and the connection portion 6252 can be connected via a button device (e.g., ...). Figure 6a The conductive contacts of the key device 600 in the middle (e.g., Figure 6aThe conductive contacts 622 in the conductive pads are selectively electrically connected to each other. According to an embodiment, when viewed from above, the conductive pads 6251 and the connecting portions 6252 are positioned at locations overlapping the first conductive path 623 and the second conductive path 624 exposed on the first substrate surface 5901, such that they can be electrically connected to each other solely through the operation of mounting the key module 620 onto the first substrate surface 5901. According to an embodiment, the conductive pads 6251 and the connecting portions 6252 can be electrically connected to the first conductive path 623 and the second conductive path 624, respectively, via soldering, conductive tape, conductive bonding, and / or an electrical connection member (e.g., a conductive contact spring).

[0143] According to various embodiments, depending on the arrangement of the button 610 and / or the design of the key module 620 (e.g., the arrangement of the conductive contact 622), the conductive pad 6251 may be eccentrically positioned to engage with the conductive patch (e.g., Figure 6a The center C of the conductive patch 510 in the middle has a certain spacing distance, rather than corresponding to the first conductive path 623. In this case, the conductive pad 6251 is formed with an elongated shape, such that the conductive contacts of the bonding module (e.g., Figure 6a The conductive contact 622 in the conductive pad 6251 can be electrically connected at a first point P1, and the first conductive path 623 can be electrically connected at a second point P2 of the conductive pad 6251, which is closer to the center C of the conductive patch 510 than the first point P1. Therefore, by forming the conductive pad 6251 with an elongated shape and allowing the first conductive path 623 to be closer to the center C, the antenna structure (e.g., Figure 6a The radiation performance of the antenna structure 500 in the antenna structure 500 is reduced. In some embodiments, the connection pad 6251 can also be electrically connected to the second conductive path 624 in substantially the same manner. In some embodiments, the conductive pad 6251 and the connection portion 6252 of the SMD pad 625 can be directly formed on the button substrate (e.g., Figure 6a On the button substrate 621). In some embodiments, the SMD pad 625, including the conductive pad 6251 and the connection portion 6252, can be used. Figure 6c The virtual patch 5111 in the middle is replaced.

[0144] Figures 12a to 12c This is a diagram illustrating the configuration of an antenna structure including a button device according to various embodiments of the present disclosure.

[0145] Reference Figure 12aThe antenna structure 700 may include a substrate 590, and further include a first conductive patch 710, a second conductive patch 720, a third conductive patch 730, and / or a fourth conductive patch 740, as a plurality of antenna elements arranged side-by-side at specified intervals on the substrate 590. In an embodiment, although not shown, each of the conductive patches 710, 720, 730, and 740 may have… Figure 7a Feeding structure (e.g., single-feed structure), Figure 7c The feeding structure (dual polarization feeding structure) or Figure 7d The feeding structure (dual-fed dual-polarized feeding structure). For example, antenna structure 700 can operate as an array antenna with a 1×4 structure.

[0146] According to various embodiments, when viewed from above, the button device 600 may be positioned at a location at least partially overlapping the substrate 590. According to embodiments, the button device 600 may include a button 610, and further include a first button module 620 having a first button substrate 621 and a first conductive contact 622, and a second button module 630 having a second button substrate 631 and a second conductive contact 632, to generate a key input signal through operation of the button 610. According to embodiments, when viewed from above, the first button module 620 may be positioned at a location overlapping the first conductive patch 710. According to embodiments, when viewed from above, the second button module 630 may be positioned at a location overlapping the fourth conductive patch 740. In another embodiment, button modules 620 and 630 may be positioned at locations overlapping the second conductive patch 720 and / or the third conductive patch 730. In some embodiments, the button device 600 may have two buttons configured to be operable via two button modules 620 and 630.

[0147] In description Figure 12b When the antenna structure 700 and the button device 600 shown are in conjunction with... Figure 12a The antenna structure 700 and the button device 600 shown are essentially the same components, which are assigned the same reference numerals, and detailed descriptions can be omitted.

[0148] Reference Figure 12b When viewed from above, the first button module 620 of the button device 600 may be positioned overlapping the first conductive patch 710. According to an embodiment, when viewed from above, the second button module 630 of the button device 600 may be positioned to overlap the space between the third conductive patch 730 and the fourth conductive patch 740. This arrangement may depend on the size of the buttons 610 of the button device 600 and / or the pressing protrusions formed on the buttons 610 (e.g., Figure 5aThe location of the pressing protrusions 611 and 612 in the middle is determined by the arrangement of the protrusions.

[0149] In description Figure 12c When the button device 600 shown is used, it is in conjunction with... Figure 12a The button device 600 shown has essentially the same components as those in the drawings, which are referred to by the same reference numerals and can be omitted in a detailed description.

[0150] Reference Figure 12c The antenna structure 750 may include a substrate 590, and may also include a first conductive patch 751, a second conductive patch 752 disposed side-by-side with the first conductive patch 751 in a second direction (direction ②), a third conductive patch 753 disposed side-by-side with the first conductive patch 751 in a third direction (direction ③) perpendicular to the second direction (direction ②), and a fourth conductive patch 754 disposed side-by-side with the second conductive patch 752 in the third direction (direction ③), serving as a plurality of antenna elements disposed on the substrate 590. According to an embodiment, the fourth conductive patch 754 may be disposed side-by-side with the third conductive patch 753 in the second direction (direction ②). For example, the antenna structure 750 may function as an array antenna with a 2×2 structure.

[0151] According to various embodiments, when the substrate 590 is viewed from above, the button device 600 may include a first button module 620 disposed at a position overlapping with the first conductive patch 751 and a second button module 630 disposed at a position overlapping with the third conductive patch 753. According to an embodiment, when the substrate 590 is viewed from above, the button 610 may be disposed at a position at least partially overlapping with the first conductive patch 751 and the third conductive patch 753. In another embodiment, when the substrate 590 is viewed from above, the first button module 620 and / or the second button module 630 may be disposed at a position overlapping with the second conductive patch 752 and / or the third conductive patch 753. In this case, the arrangement and / or shape of the button 610 may be changed. In some embodiments, the button device 600 may have two buttons configured to be operable via two button modules 620 and 630.

[0152] although Figures 12a to 12c The antenna structures 700 and 750 shown both include two key modules 620 and 630, but this is not a limitation. For example, each of the antenna structures 700 and 750 may include one key module or three or more key modules disposed on the substrate 590.

[0153] Figure 13 This illustrates the configuration of an antenna structure including a button device according to an embodiment of the present disclosure.

[0154] Reference Figure 13The antenna structure 800 may include a substrate 590 and further include a first conductive patch 810, a second conductive patch 820, a third conductive patch 830, a fourth conductive patch 840, and / or a fifth conductive patch 850, as a plurality of antenna elements arranged side-by-side at predetermined intervals on the substrate 590. According to an embodiment, although not shown, each of the conductive patches 810, 820, 830, 840, and 850 may have… Figure 7c The power supply structure (dual-polarization power supply structure). In some embodiments, each of the conductive patches 810, 820, 830, 840, and 850 can be used with Figure 7a The power supply structure (single-feed structure) or Figure 7d The feeding structure (dual-fed dual-polarized feeding structure) can be used instead. For example, antenna structure 800 can operate as an array antenna with a 1×5 structure.

[0155] According to various embodiments, when the substrate 590 is viewed from above, the button device 600 may be disposed at a position at least partially overlapping with the substrate 590. According to embodiments, the button device 600 may include a button 610, and further include a first button module 620 having a first button substrate 621 and a first conductive contact 622, and a second button module 630 having a second button substrate 631 and a second conductive contact 632, to generate a key input signal through operation of the button 610. According to embodiments, when the substrate 590 is viewed from above, the first button module 620 may be disposed at a position overlapping with the first conductive patch 810. According to embodiments, when the substrate 590 is viewed from above, the second button module 630 may be disposed at a position overlapping with the fourth conductive patch 840. In some embodiments, the button modules 620 and 630 may be symmetrically arranged relative to the third conductive patch 830. For example, based on the third conductive patch 830, the first button module 620 may be disposed on the second conductive patch 820, and the second button module 630 may be disposed on the fourth conductive patch 840. In another example, based on the third conductive patch 830, the first key module 620 can be disposed on the first conductive patch 810, and the second key module 630 can be disposed on the fifth conductive patch 850. In some embodiments, the key modules 620 and 630 can be asymmetrically disposed on any two of the conductive patches 810, 820, 830, 840, and 850. In some embodiments, the button device 600 can have two buttons arranged to be operable via the two key modules 620 and 630.

[0156] Figure 14 This illustrates an embodiment according to the present disclosure. Figure 13 The radiation performance curve of the antenna structure depends on the presence or absence of a button device in the configuration.

[0157] Reference Figure 14It can be seen that, Figure 13 Supports dual polarization and includes conductive patches with a 1×5 array structure (e.g., Figure 13 In the antenna structure 800 of conductive patches 810, 820, 830, 840, and 850, compared to the vertical polarization (curve 1403) and horizontal polarization (curve 1404) when the button device 600 is not arranged, when the button device (e.g., Figure 13 The key module of the key device 600 in the middle (e.g., Figure 13 When the key modules 620 and 630 are configured to overlap with some of the conductive patches 810 and 840 among the conductive patches 810, 820, 830, 840, and 850, the gain of the vertical polarization (curve 1401) and horizontal polarization (curve 1402) will not change significantly enough to affect the radiation performance in the operating frequency band 1410 (e.g., approximately 28 GHz). This means that even if the conductive patches 810, 820, 830, 840, and 850 have an array arrangement and the key modules 620 and 630 are configured to overlap with some of the conductive patches 810 and 840, the radiation performance of the antenna structure 800 will not be significantly reduced.

[0158] Figure 15 This is a diagram illustrating the configuration of an antenna structure including a button module according to an embodiment of the present disclosure.

[0159] In description Figure 15 When the antenna structure shown is 800, it is similar to... Figure 13 The antenna structure 800 shown uses the same reference numerals for essentially the same components, and detailed descriptions can be omitted.

[0160] Reference Figure 15 When viewed from above, the first key module 620 may be positioned at a location that at least partially overlaps with the first conductive patch 810. According to an embodiment, while maintaining this partial overlap with the first conductive patch 810, the center of the first key module 620 may be offset to the right by a first distance t1 from the center of the first conductive patch 810 along a second direction (direction ②) parallel to the long side 590a of the substrate 590, and downward by a second distance t2 along a third direction (direction ③) parallel to the short side 590b of the substrate 590. According to an embodiment, while maintaining a partial overlap with the fifth conductive patch 850, the center of the second key module 630 may be offset to the left by a first distance t1 from the center of the fifth conductive patch 850 along a second direction (direction ②) parallel to the long side 590a of the substrate 590, and downward by a second distance t2 along a third direction (direction ③) parallel to the short side 590b of the substrate 590. In this case, each of the first and second key modules 620 and 630 may be shaped to have the following characteristics: Figure 11 The conductive pad 6251 shown, and the first conductive path of the substrate 590 (e.g., Figure 11 The first conductive path 623 in the middle can be formed as an electrical connection at a position close to the center of the conductive patch 810 or 850.

[0161] Figure 16a and Figure 16b This illustrates various embodiments depending on the present disclosure. Figure 15 The graph shows the radiation performance of the antenna structure with the key module movable arrangement in the configuration.

[0162] Reference Figure 16a and Figure 16b The graph shows that in Figure 15 In the configuration, when the substrate 590 is viewed from above, and the first and second key modules 620 and 630 are respectively positioned at the centers of the first and fifth conductive patches 810 and 850, the gain of the horizontal and vertical polarization of the antenna structure 800 varies depending on whether it is offset from the center by a first offset distance t1 (e.g., approximately 6 mm) along a second direction (direction ②) parallel to the long side 590a of the substrate 590, or offset from the center by a second offset distance t2 (e.g., approximately 6 mm) along a third direction (direction ③) parallel to the short side 590b of the substrate 590, or when offset by the first offset distance t1 and the second offset distance t2. It can be seen that the gain variation is insufficient to affect the radiation performance in the operating frequency band 1601 or 1602 (e.g., approximately 28 GHz). This means that even if the key modules 620 and 630 are offset and at least partially overlap with the conductive patches 810 and 850, the radiation performance of the antenna structure 800 will not be significantly reduced.

[0163] Figure 17 This is a diagram illustrating the configuration of an antenna structure including a button module according to an embodiment of the present disclosure.

[0164] Reference Figure 17 Electronic devices (e.g.) Figure 5a The electronic device 300 may include an antenna structure 1700 and a button device 600. The antenna structure 1700 includes a substrate 590 and a plurality of conductive patches 1710, 1720, 1730, and 1740 disposed on the substrate 590. The button device 600 includes a first button module 620 and / or a second button module 630. When viewed from above, the first button module 620 and / or the second button module 630 are configured to overlap with some of the conductive patches 1710 and 1740. According to an embodiment, the antenna structure 1700 may include an electrical connection member 597 extending from the substrate 590, and a wireless communication circuit 598 (e.g., Figure 6aThe wireless communication circuit 595 (e.g., RFIC) is disposed on the electrical connection member 597. According to an embodiment, the electrical connection member 597 may include a flexible printed circuit board (FPCB) type RF cable (FRC) or a coaxial cable.

[0165] According to various embodiments, the electrical connection member 597 can be electrically connected to an electronic device (e.g., via a connector (not shown)). Figure 5a The motherboard of the electronic device 300 (e.g., Figure 3c The printed circuit board 340 in the circuit board. Therefore, the antenna structure 1700 can be electrically connected to the main board (e.g., via the electrical connection member 597). Figure 3c The printed circuit board 340 in the motherboard). In some embodiments, the wireless communication circuit 598 may be located on the motherboard (e.g., printed circuit board 340 in the motherboard). Figure 3c On the printed circuit board 340). According to an embodiment, the key device 600 may be disposed on the substrate 590 and connected via conductive paths including connections to key modules 620 and 630 (e.g., Figure 6a The electrical connection structure of the first conductive path 623 in the middle is electrically connected to the electrical connection member 597.

[0166] Figure 18a This is a partial cross-sectional perspective view of an electronic device according to an embodiment of the present disclosure, wherein a button device is disposed in a housing. Figure 18b This partially illustrates the alignment of embodiments according to this disclosure. Figure 18a A cross-sectional view of the electronic device taken from line 18b-18b.

[0167] Reference Figure 18a and Figure 18b The electronic device 300 may include a housing 310 containing a side member 320, an antenna structure 500 disposed in the interior space of the housing 310 to form a beam pattern in a first direction (direction ①) facing the side member 320, and a button device 600 at least partially facing the antenna structure 500 and configured to be at least partially visible from the outside and operable through the side member 320. According to an embodiment, when the side member 320 is viewed from the outside, at least a portion of the button device 600 may be configured to overlap with the antenna structure 500.

[0168] According to various embodiments, the button device 600 may include a button 610 and a first button module 620 or a second button module 630 disposed between the button 610 and the substrate 590 of the antenna structure 500. The button 610 protrudes at least partially or is exposed to the outside through an opening 321 formed in the side member 320. According to an embodiment, the first button module 620 may include a first button substrate 621 disposed on the substrate 590 and a first conductive contact 622 disposed on the first button substrate 621. The second button module 630 may include a second button substrate 631 and a second conductive contact 632.

[0169] According to various embodiments, the side member 320 may include a conductive material 320a of the electronic device 300. According to an embodiment, the side member 320 may include a non-conductive material 320b inserted into the conductive material 320a. According to an embodiment, an opening 321 may be formed in the conductive material 320a. In this case, the antenna structure 500 may be configured such that a beam pattern is formed through the opening 321 in a first direction (direction ①), with a button 610, which is configured to overlap with the substrate 590, facing this first direction. To allow for smooth formation of the beam pattern, the button 610 may be formed of a non-conductive material (e.g., an injection-molded material).

[0170] Figures 19a to 19e This is a diagram illustrating the configuration of buttons or housings for radiation of an antenna structure according to various embodiments of the present disclosure.

[0171] Reference Figure 19a The button device 600 may include a button 610, which includes a pair of pressing protrusions 611 and 612 and key modules 620 and 630 respectively disposed at positions corresponding to the pair of pressing protrusions 611 and 612. According to an embodiment, as described above, the key modules 620 and 630 may be disposed on the substrate 590 of the antenna structure 500.

[0172] According to various embodiments, the antenna structure 500 may be configured such that a beam pattern is formed in a first direction (direction ①) facing the button 610. In this case, the button 610, configured to at least partially overlap with the direction of the beam pattern, may have a conductive material 610a (e.g., metal) and / or a non-conductive material 610b (e.g., polymer). For example, the button 610 may be formed from at least partially segmented conductive material 610a by insert injection molding of non-conductive material 610b. According to embodiments, in the button 610, the non-conductive material 610b may be disposed between (e.g., in the middle) a pair of pressing protrusions 611 and 612.

[0173] Reference Figure 19b Because of Figure 19aIn the configuration, button 610 includes pressing protrusions 611 and 612 formed of non-conductive material 610b, which can reduce interference when antenna structure 500 forms beam pattern.

[0174] Reference Figure 19c The button 610 may be exposed or protruded from the opening 321 of the side member 320 so that it is visible from the outside. According to an embodiment, in the exposed portion of the side member 320 when viewed from the outside, the button may be formed of a conductive material 610a disposed at the center and a non-conductive material 610b surrounding at least a portion of the edge of the conductive material 610a. For example, the non-conductive material 610b may be configured in a closed-loop shape along the edge of the conductive material 610a, or optionally in an open-loop shape, wherein the conductive material 610a is at least partially inserted therein.

[0175] Reference Figure 19d The opening 321 may have a conductive material 320a or a non-conductive material 320b of the side member 320. In this case, the non-conductive material 320b may be exposed to the outside through the opening 321 or disposed at a position facing the protruding button 610. For example, the non-conductive material 320b may form the entire inner edge of the opening 321, or a portion of the inner edge of the opening 321 may be formed by the intervention of the conductive material 320a.

[0176] Reference Figure 19e When viewed from the outside, the button 610 of the button device 600 can be configured to at least partially overlap with the first and second button modules 620 and 630 disposed on the antenna structure 500. According to an embodiment, the button 610 can be formed of a conductive material. In this case, the button 610 can be formed to have a second width TH2 smaller than the first width TH1 of the opening 321. Therefore, the beam pattern formed by the antenna structure 500 can be transmitted to the outside through the space between the opening 321 and the button 610.

[0177] In some embodiments, when the first width TH1 and the second width TH2 are formed to be substantially the same, the beam pattern of the antenna structure 500 can be transmitted through the side member (e.g., near the button 610) Figure 19d The non-conductive portion formed in the side member 320 is transferred to the outside.

[0178] According to various embodiments, electronic devices (e.g., Figure 5a The electronic device 300 may include: a housing (e.g., Figure 5a Housing 310 in the middle); antenna structure (e.g., Figure 5a The antenna structure 500 is disposed within the internal space of the housing and includes a substrate (e.g., Figure 6a The substrate 590 in the middle), and at least one conductive patch (e.g., Figure 6a The conductive patch 510 in the middle), and at least one feed part (e.g., Figure 6a The power supply section 511 in the middle) and at least one electrical connection structure disposed on the substrate, the substrate having a first direction (e.g., Figure 5a The first substrate surface (e.g., in the first direction (direction ①)) of the first direction in the middle. Figure 5a The first substrate surface 5901 and the second substrate surface facing the opposite direction to the first substrate surface (e.g., Figure 5a The second substrate surface 5902), and the ground layer (e.g., disposed in the space between the first substrate surface and the second substrate surface) Figure 6a The at least one conductive patch is disposed between the ground layer and the surface of the first substrate or exposed on the surface of the first substrate. The at least one power supply is disposed at the location of the at least one conductive patch. The electrical connection structure includes a first conductive path configured to pass through the at least one conductive patch and the ground layer (e.g., ...). Figure 6a The first conductive path 623 in the middle) and the second conductive path passing through the at least one conductive patch and electrically connected to the ground layer (e.g., Figure 6a The second conductive path 624 in the middle); electronic components (e.g., Figure 6a The electronic component (600) is disposed on the surface of the first substrate and, when viewed from above, is configured to at least partially overlap with the at least one conductive patch. The electronic component is electrically connected to the motherboard (e.g., via the at least one electrical connection structure). Figure 3c Printed circuit board 340 in the middle); and wireless communication circuit (e.g., Figure 6a The wireless communication circuit 595 is disposed in the internal space, electrically connected to the at least one power supply unit, and configured to form a beam pattern in a first direction through the at least one conductive patch.

[0179] According to various embodiments, the at least one power supply may include: a first power supply disposed on a first line passing through the center of the at least one conductive patch, and a second power supply disposed on a second line passing through the center and perpendicular to the first line.

[0180] According to various embodiments, when at least one conductive patch is viewed from above, the first conductive path and the second conductive path can be arranged symmetrically with respect to the center.

[0181] According to various embodiments, the first conductive path and the second conductive path may be disposed within 30% of the straight-line distance from the center to the end of the at least one conductive patch.

[0182] According to various embodiments, when the at least one conductive patch is viewed from above, the second conductive path may be positioned at a location overlapping the center.

[0183] According to various embodiments, the first conductive path may be disposed within 30% of the straight-line distance from the center to the end of the at least one conductive patch.

[0184] According to various embodiments, the electronic device may further include a connector disposed on a second substrate surface of a substrate and electrically connected to a first conductive path, and the connector may be electrically connected to a motherboard.

[0185] According to various embodiments, the electronic device may further include a surface mount device (SMD) pad disposed between the electronic component and the surface of the first substrate, the SMD pad including a first conductive pad electrically connected to a first conductive path exposed on the surface of the first substrate.

[0186] According to various embodiments, when viewed from above, the first conductive pad can be formed with an elongated shape from the center outwards, electronic components can be electrically connected at a first point on the first conductive pad, and a first conductive path can be electrically connected at a second point on the first conductive pad that is closer to the center than the first point.

[0187] According to various embodiments, the SMD pad may include a second conductive pad electrically connected to a second conductive path exposed on the surface of the first substrate. When viewed from above, the second conductive pad may be formed with an elongated shape extending outward from the center. Electronic components may be electrically connected at a first point on the second conductive pad, and the second conductive path may be electrically connected at a second point on the second conductive pad that is closer to the center than the first point.

[0188] According to various embodiments, when the surface of the first substrate is viewed from above, the radiation performance of the antenna structure can be determined by the separation distance from the center to the second conductive path.

[0189] According to various embodiments, the electronic component may include a button device having at least one button that is at least partially exposed to the outside, the at least one button being exposed through an opening formed in a conductive portion disposed at least partially in the housing.

[0190] According to various embodiments, a non-conductive portion may be formed along the edge of the opening.

[0191] According to various embodiments, when viewed from above, at least one button may be configured to at least partially overlap with at least one conductive patch.

[0192] According to various embodiments, the at least one button may be formed of a non-conductive material.

[0193] According to various embodiments, at least one button may have at least two conductive portions segmented by at least one non-conductive portion.

[0194] According to various embodiments, at least one conductive patch may include a plurality of conductive patches arranged at predetermined intervals.

[0195] According to various embodiments, the key device may include key modules respectively configured to overlap with two or more of a plurality of conductive patches, wherein at least one electrical connection structure may be provided on each key module.

[0196] According to various embodiments, the key modules can be symmetrically arranged in multiple conductive patches.

[0197] According to various embodiments, the at least one button may include one button that together houses a key module, or two or more buttons that separately house at least two key modules.

[0198] Furthermore, the embodiments and accompanying drawings of this disclosure are merely examples provided to facilitate the description and understanding of this disclosure, and are not intended to limit the scope of this disclosure. Therefore, in addition to the embodiments disclosed herein, the scope of this disclosure should be interpreted to include all variations or modifications of the technical content derived from this disclosure.

Claims

1. An electronic device comprising: case; An antenna structure, disposed within the internal space of the housing, includes: The substrate has a first substrate surface facing a first direction, a second substrate surface facing a direction opposite to the first substrate surface, and a ground layer disposed in the space between the first substrate surface and the second substrate surface. At least one conductive patch is disposed between the ground layer and the surface of the first substrate, or exposed on the surface of the first substrate, and At least one power supply unit is disposed at the location of the at least one conductive patch; An electronic component, disposed on the surface of the first substrate and configured to at least partially overlap the at least one conductive patch when viewed from above, the electronic component being electrically connected to a motherboard via at least one electrical connection structure; and A wireless communication circuit, disposed in the internal space, electrically connected to the at least one feed unit, and configured to form a beam pattern in the first direction via the at least one conductive patch, wherein the at least one electrical connection structure includes: A first conductive path is configured to pass through the at least one conductive patch and the ground layer, and A second conductive path passes through the at least one conductive patch and is electrically connected to the grounding layer.

2. The electronic device according to claim 1, wherein the at least one power supply unit comprises: A first power supply section is disposed on a first line passing through the center of the at least one conductive patch, and The second power supply unit is disposed on a second line that passes through the center and is perpendicular to the first line.

3. The electronic device according to claim 1, wherein when viewed from above, the first conductive path and the second conductive path are arranged symmetrically with respect to the center of the at least one conductive patch.

4. The electronic device of claim 2, wherein the first conductive path and the second conductive path are disposed within 30% of the straight-line distance from the center of the at least one conductive patch to one end.

5. The electronic device of claim 1, wherein when viewed from above, the second conductive path is disposed at a position overlapping the center of the at least one conductive patch.

6. The electronic device of claim 5, wherein the first conductive path is disposed within 30% of a straight-line distance from the center of the at least one conductive patch to one end.

7. The electronic device according to claim 1, further comprising: A connector disposed on the second substrate surface of the substrate and electrically connected to the first conductive path. The connector therein is electrically connected to the motherboard.

8. The electronic device according to claim 1, further comprising: Surface mount device (SMD) pads are disposed between the electronic component and the surface of the first substrate. The SMD pads include first conductive pads electrically connected to the first conductive path exposed on the surface of the first substrate.

9. The electronic device according to claim 8, When viewed from above, the first conductive pad is formed with an elongated shape extending outward from the center of the at least one conductive pad. The electronic component is electrically connected at a first point on the first conductive pad, and The first conductive path is electrically connected at a second point on the first conductive pad that is closer to the center than the first point.

10. The electronic device according to claim 8, The SMD pads include second conductive pads electrically connected to the second conductive path exposed on the surface of the first substrate. When viewed from above, the second conductive pad is formed to have an elongated shape extending outward from the center of the at least one conductive pad. The electronic component is electrically connected at a first point on the second conductive pad, and The second conductive path is electrically connected at a second point on the second conductive pad that is closer to the center than the first point.

11. The electronic device of claim 1, wherein, when viewed from above, the radiation performance of the antenna structure is determined by the separation distance from the center of the at least one conductive patch to the second conductive path.

12. The electronic device of claim 1, wherein the electronic component includes a button device having at least one button, the button being at least partially exposed to the outside through an opening formed in a conductive portion, the conductive portion being at least partially disposed in the housing.

13. The electronic device of claim 12, wherein a non-conductive portion is formed along the edge of the opening.

14. The electronic device of claim 12, wherein when viewed from above, the at least one button is configured to at least partially overlap with the at least one conductive patch.

15. The electronic device of claim 12, wherein the at least one button is formed of a non-conductive material.

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