A portable skin cooling device

Abstract

The application belongs to the technical field of cold compress instruments, and relates to a portable skin cooling device, which comprises a shell, a cavity in the shell, an electric heating element fixed in the cavity of the shell, a cooling head inlaid on the surface of the shell, a power supply in the shell, a PCB board in the shell, and a central control module on the PCB board. The electric heating element is used for refrigeration, the central control module is used for controlling the refrigeration temperature of the electric heating element, and the cooling head is used for ice compress with the skin.

Description

Technical Field

[0001] This invention belongs to the field of cold compress technology and relates to a portable skin cooling device. Background Technology

[0002] Traditional treatments for skin conditions and itching involve the use of medications, steroids, hand creams, and lotions. These methods are slow, cumbersome, and can cause various side effects. Relieving itching through cold regulation is a non-pharmacological, natural technique. When the skin is subjected to a harmless cold stimulus, the cold activates temperature-sensitive cells, thereby reducing itching. Studies indicate that heat increases itching, while cold can relieve itching. The cold stimulus needs to be strong to be effective in suppressing irritation, inflammation, pain, and itching. Cold temperatures can numb nerves and reduce blood flow to the area, thus reducing the sensation of itching and pain. Ice can also reduce swelling and discomfort associated with various rashes or allergy symptoms.

[0003] However, current technology generally uses ice or ice packs for cold compresses. Ice or ice packs need to be prepared in advance and stored in containers, and cannot be used immediately. Ice is too cold when applied directly to the skin, posing a risk of frostbite, and ice / ice packs are prone to condensation and melting when exposed to the atmosphere, making them extremely inconvenient to use. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a portable skin cooling device that uses an electric heating element to apply ice packs, thereby relieving itching, reducing pain and inflammation, decreasing the risk of frostbite, and is convenient to use and carry.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A portable skin cooling device, comprising:

[0007] A housing, wherein the housing has a cavity;

[0008] The heating element is fixed inside the cavity of the housing, and the heating element is provided with a cooling surface;

[0009] A cooling head is embedded in the surface of the housing, and the cooling head is connected to the cooling surface of the heating element;

[0010] A power source, located inside the housing, is used to supply power to the heating element;

[0011] A PCB board is located inside the housing, and the PCB board is connected to the heating element and the power supply respectively.

[0012] The heating element is used for cooling, the PCB board is equipped with a central control module, the central control module is used to control the cooling temperature of the heating element, and the cooling head is used to apply ice to the skin.

[0013] Furthermore, the heating element includes a TEC semiconductor cooler.

[0014] Furthermore, the heating element is composed of multiple TEC semiconductor coolers whose hot and cold surfaces are alternately stacked or arranged in a planar array.

[0015] Furthermore, it also includes a cooling temperature sensor, which is located inside the housing and connected to the PCB board. The cooling temperature sensor is used to monitor the temperature data of the cooling head and feed it back to the central control module.

[0016] Furthermore, the housing is provided with a heat dissipation module, and the heating element includes a cooling surface and a heating surface, with the heat dissipation module connected to the heating surface.

[0017] Furthermore, the heat dissipation module includes a heat absorption tube, and a phase change material is sealed inside the heat absorption tube.

[0018] Furthermore, it also includes a heat dissipation temperature sensor, which is fixed inside the housing and connected to the central control module. The heat dissipation temperature sensor is used to monitor the temperature of the heat dissipation module and feed it back to the central control module.

[0019] Furthermore, it also includes a vibration motor, which is fixed inside the housing and connected to the central control module.

[0020] Furthermore, it also includes LEDs and radio frequency electrodes.

[0021] Furthermore, it also includes an electrotherapy electrode, which is fixed to the surface of the housing and connected to the central control module. The electrotherapy electrode is used for electrotherapy.

[0022] The advantages of the technical solution of this invention compared to the prior art are as follows:

[0023] 1. It has a good skin cooling effect. Through the cooling surface and cooling head of the electric heating element, it can quickly reduce skin temperature, reduce discomfort and pain, and help reduce swelling and soothe the skin.

[0024] 2. Precise temperature control: The combination of the central control module and the cooling temperature sensor can accurately control the cooling temperature, avoiding overcooling or undercooling, and providing safe and effective cooling.

[0025] 3. Effective heat dissipation: Through the heat dissipation module and phase change material, heat can be effectively absorbed and released, maintaining a stable operating temperature of the device and heating elements, improving service life and safety. In addition, the fanless design eliminates operating noise and provides excellent waterproof and dustproof performance.

[0026] 4. Multifunctional application: The device offers both phototherapy and electrotherapy functions to meet the needs of different skin problems and provide a more comprehensive treatment effect.

[0027] 5. The vibration motor enhances comfort. The vibration motor inside the device provides a massage and soothing effect, increasing comfort during use and making the entire treatment process more enjoyable.

[0028] Other features and advantages of the invention will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings. Attached Figure Description

[0029] The present invention will now be described in detail with reference to the accompanying drawings, so that the above-mentioned advantages of the present invention will become more apparent.

[0030] Figure 1 This is an exploded view of a portable skin cooling device according to the present invention;

[0031] Figure 2 This is a connection block diagram of a portable skin cooling device according to the present invention;

[0032] Figure 3 This is a schematic diagram of the temperature control of a portable skin cooling device according to the present invention. Detailed Implementation

[0033] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0034] In the description of this invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0036] In the embodiments of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] Reference Appendix Figure 1-3 As shown, a portable skin cooling device includes:

[0038] Housing 100, wherein a cavity is provided inside the housing 100;

[0039] The heating element 200 is fixed inside the cavity of the housing 100, and the heating element 200 is provided with a cooling surface;

[0040] A cooling head 300 is embedded in the surface of the housing 100, and the cooling head 300 is connected to the cooling surface of the heating element 200;

[0041] A power supply 400 is located inside the housing 100, and the power supply 400 is used to supply power to the heating element 200;

[0042] A PCB board 500 is located inside the housing 100, and the PCB board 500 is connected to the heating element 200 and the power supply 400 respectively.

[0043] The heating element 200 is used for cooling, the PCB board 500 is provided with a central control module, the central control module is used to control the cooling temperature of the heating element 200, and the cooling head 300 is used for applying ice to the skin.

[0044] The power supply 400 is a DC power supply. When cold compress is needed, the power supply 400 supplies power to the heating element 200. During charging, a power protection circuit on the PCB protects the power supply. The heating element 200 provides cooling. When the cooling head 300 is placed close to the skin, the heating element 200 continuously cools to maintain a low temperature, compensating for the rebound of skin surface temperature to body temperature. The cooling effect stimulates the skin and constricts blood vessels and pores, thus reducing blood flow and providing immediate and temporary relief and comfort to alleviate irritation, pain, or itching.

[0045] The cooling head 300 is made of hypoallergenic and highly thermally conductive materials, such as stainless steel or titanium alloy. Because the cooling head 300 comes into direct contact with the skin for cooling, hypoallergenic materials are used to avoid allergic reactions in individuals with sensitive skin. Furthermore, to optimize the user experience and ensure a more even cooling effect, highly thermally conductive materials are used, preventing uneven cooling or inefficient temperature transfer.

[0046] When applying cold compresses, it's crucial to consider preventing frostbite. There are two methods to prevent frostbite: one is constant power. The heating element 200 is DC-driven, and the central control module maintains a constant operating current to achieve constant power, ensuring the cooling capacity is slightly greater than the body's heat dissipation, thus preventing excessively low temperatures that could cause frostbite. The other is a timer. A timer unit on the PCB sets a continuous cold compress time threshold. Once the threshold is reached, the heating element 200 automatically shuts off, preventing the user from falling asleep during use and avoiding the health risks of continuous cold compresses.

[0047] Furthermore, the storage unit on the PCB can be used to pre-load various control drivers for different usage needs. For example, the optimal ice application time and the 200W cooling power of the heating element can be set to meet specific requirements such as relieving itching, pain, and swelling. This allows users to easily set and switch between these modes with a single click.

[0048] In this embodiment, for ease of gripping during use, the housing 100 is cylindrical, and the cooling head 300 is embedded in the port of the housing 100. The cooling head 300 can also take different shapes, geometric shapes, such as circular, concave, convex, or roller forms. The cooling head 300 can be of different sizes and is suitable for various inflammations, relieving pain and itching, and promoting collagen production.

[0049] In this embodiment, the heating element 200 includes a TEC semiconductor cooler. The TEC semiconductor cooler is... A TEC semiconductor cooler is a device that transfers heat from one side of an object to the other to cool or heat it. It uses a bismuth-antimony compound semiconductor element to generate a voltage when two different metals are connected, and then uses an electric current to transfer heat from one side of the device to the other. This process, known as the Peltier effect, allows for precise temperature control and reduces energy consumption compared to conventional methods. Compared to other cooling devices, TEC semiconductor coolers offer the following advantages:

[0050] 1. No refrigerant required: TEC refrigeration units do not require the use of traditional refrigerants, making it an environmentally friendly and sustainable refrigeration technology.

[0051] 2. High reliability: TEC refrigeration units are made of semiconductor materials and have no moving parts, thus exhibiting high reliability. TEC is not easily damaged or malfunctions.

[0052] 3. TEC refrigeration units are relatively small and compact, making them suitable for small or portable devices.

[0053] 4. Excellent control flexibility: TEC cooling devices feature rapid response and precise temperature control. By adjusting the voltage or current, the cooling effect can be precisely controlled to meet different needs and treatment requirements.

[0054] 5. Low energy consumption: Compared to traditional refrigeration equipment, TEC refrigeration units consume less energy. They only consume energy when cooling is needed and do not require additional energy for refrigerant circulation, thus saving energy.

[0055] 6. Low noise: The TEC cooling unit has no moving parts, so it operates with a low noise level, providing a quieter and more comfortable cooling experience.

[0056] In this embodiment, the heating element 200 is composed of multiple TEC semiconductor coolers with alternating hot and cold surfaces stacked or arranged in a planar array.

[0057] TEC stacking increases the efficiency and capacity of thermoelectric conversion by stacking multiple TECs together. The principle of TEC stacking is to connect multiple TEC modules in a specific way, allowing heat to be transferred between the TECs. Each TEC module has two contact surfaces, a cold side and a hot side. By stacking multiple TECs together, a structure with alternating cold and hot surfaces can be formed. In TEC stacking, when current passes through each TEC module, a heat difference is generated at each contact surface. This allows for a larger temperature difference and higher cooling or heating capacity. TEC stacking also provides greater thermoelectric conversion efficiency and a more precise temperature control range.

[0058] Planar array placement: Planar array placement refers to arranging multiple TEC modules on a single plane to form a two-dimensional array structure. Each TEC module typically has only one contact surface, either a cold or hot surface. Planar array placement is suitable for scenarios requiring a large ice application area.

[0059] This embodiment also includes a cooling temperature sensor, located inside the housing 100 and connected to the PCB board 500. The cooling temperature sensor monitors the temperature data of the cooling head 300 and feeds it back to the central control module. Because the cooling head 300 is a component that comes into direct contact with the skin, there is heat conduction between the cooling head 300 and the heating element 200. This results in a certain delay in temperature control, affecting the accuracy and response speed. To improve the safety of ice application and the accuracy of temperature control, the cooling temperature sensor directly monitors the temperature of the cooling head 300. The central control module can control the power of the heating element 200 in real time based on the data feedback from the cooling temperature sensor, achieving constant temperature control and avoiding sudden temperature changes to ensure a comfortable user experience.

[0060] Based on feedback from the cold temperature sensor, the central control module can control the operating mode of the cold temperature sensor via pulse control. When the device is initially started, to quickly bring the cooling head 300 to the preset ice-packing temperature, the proportion of time the pulse is active in the pulse control is increased. The control pulse is adjusted in real time based on feedback from the cold temperature sensor. Pulse period t o Within, the initial cooling time is t. on The adjustment time is Δt. If the real-time temperature is higher than the threshold temperature, Δt is a positive number; if the real-time temperature is lower than the threshold temperature, Δt is a negative number.

[0061] In this embodiment, the surface of the housing 100 is equipped with a digital display device, which is connected to the central control module and can be used to display the real-time temperature of the cooling head 300 and the remaining power of the power supply 400. This allows users to easily understand the cooling status of the cooling head 300.

[0062] In this embodiment, the housing 100 is equipped with a heat dissipation module, and the heating element 200 includes a cooling surface and a heating surface. The heat dissipation module is connected to the heating surface. A TEC (Thermoelectric Cooler) is a device that transfers heat from one side of a device to the other to cool or heat an object. Therefore, during operation, the other side of the TEC's cooling surface is the heating surface. Its cooling principle involves current flowing through P-type and N-type semiconductor materials connected on both sides, causing one side to absorb heat and the other side to dissipate heat, thus achieving a cooling effect. During TEC cooling, the heat dissipation on the other side affects the cooling effect. This is because the TEC's cooling effect is achieved by transferring heat from one side to the other. If the other side cannot effectively dissipate heat, heat will accumulate inside the TEC, leading to a decrease in the temperature difference and a weakened cooling effect.

[0063] Therefore, in order to ensure the cooling effect of the TEC, it is necessary to ensure that the other side can effectively dissipate heat.

[0064] This can be achieved by using radiators, fans, or other cooling devices to increase the heat dissipation surface area and improve heat dissipation efficiency. Additionally, optimizing the selection of heat dissipation materials and the treatment of contact surfaces can also be considered to enhance heat dissipation performance.

[0065] In this embodiment, the heat dissipation module includes a heat absorption pipe 600, and a phase change material is sealed inside the heat absorption pipe 600. There are many conventional heat dissipation solutions, such as using radiators, fans, or other cooling devices to increase the heat dissipation surface area and improve heat dissipation efficiency.

[0066] This implementation also includes a heat pipe, which is a heat dissipation element that utilizes the phenomenon that liquids absorb heat when they turn into gases and gases release heat when they turn into gases, enabling the rapid transfer of heat from one location to another.

[0067] Compared to ordinary metal sheets, heat pipes offer the following advantages:

[0068] It has a fast heat transfer rate and can effectively remove heat energy.

[0069] It has a long heat transfer distance and can effectively disperse heat energy.

[0070] It can transfer heat without any moving parts, making the heat pipe quiet, noiseless, maintenance-free, and highly reliable.

[0071] The advantage of TEC cooling units is their low noise, while conventional heat dissipation methods generate significant noise and increase the number of openings in the housing 100, compromising its dustproof and waterproof performance. The phase change material is encapsulated in a brass cylinder to increase the surface area exposed to the surrounding environment. This improves heat transfer efficiency. The radiator temperature rises as the TEC operating temperature increases, until... At a set temperature, the phase change material begins to melt and absorb additional heat from the system, allowing it to dissipate heat more effectively. Once all the phase change material has melted and reached the desired temperature, it needs to rest and be protected from overheating. It begins to re-solidify, returning to its original state and continuing to absorb and dissipate heat.

[0072] Heat dissipation is achieved by incorporating phase change material within the heat absorption tube, offering the following advantages compared to traditional air cooling:

[0073] 1. No fans or other mechanical equipment are needed, so there is no noise.

[0074] 2. Phase change materials (PCMs) possess high heat capacity and thermal conductivity, enabling them to rapidly absorb and release heat. Compared to fan cooling, PCM-based heat dissipation is more effective in reducing equipment temperature and improving heat dissipation efficiency.

[0075] 3. Phase change material (PCM) cooling does not require an additional power supply and does not generate extra energy consumption. Compared to fan cooling, PCM cooling is more energy-efficient and environmentally friendly, and also improves the cruising capability of portable devices.

[0076] 4. Phase change material (PCM) heat dissipation has no mechanical parts, resulting in lower maintenance costs. Compared to fan cooling, it eliminates the need for regular fan cleaning and replacement, reducing equipment maintenance work and expenses.

[0077] Phase change materials can be hydrated salts or mixtures of hydrated salts, paraffin compounds, organic compounds such as decanoic acid, lauric acid, stearic acid, and other fatty acids. The set melting point of a phase change material will be determined by the application conditions, operating temperature, and ambient temperature.

[0078] This embodiment also includes a heat dissipation temperature sensor, which is fixed inside the housing 100 and connected to the central control module. The heat dissipation temperature sensor monitors the temperature of the heat dissipation module and feeds it back to the central control module. In TEC (Heat Transfer Device) cooling applications, monitoring the radiator temperature is crucial, as it directly affects the TEC's heat dissipation efficiency. When the radiator temperature is too high, the TEC's heat dissipation capacity decreases, leading to a decline in cooling performance. Therefore, by monitoring the radiator temperature, the heat dissipation system can be adjusted and optimized in a timely manner to ensure efficient TEC cooling. Simultaneously, excessively high radiator temperatures can cause overheating of the radiator and surrounding components, even leading to malfunctions or damage. By monitoring the radiator temperature, temperature anomalies can be detected promptly, allowing for appropriate measures to protect the safe operation of the system. Furthermore, the TEC's lifespan and stability are closely related to the radiator temperature. Excessively high radiator temperatures cause the TEC's operating temperature to rise, accelerating its aging process and reducing its lifespan. Temperature fluctuations can also affect the TEC's stability and performance. By monitoring the radiator temperature, the TEC's operating temperature can be controlled within a suitable range, extending its lifespan and improving stability.

[0079] In another embodiment, a vibration motor is also included, which is fixed inside the housing 100 and connected to the central control module. The vibration motor is fixed to the housing 100 and achieves a vibration massage effect on the skin by causing resonance between the housing 100 and the cooling head 300.

[0080] Applying ice can effectively reduce pain and inflammation, while the vibration motor can stimulate the skin and muscles, distract attention, and reduce the perception of pain. Using them together can provide better pain relief.

[0081] The vibration from the motor can promote local blood circulation and increase blood flow. Applying ice, on the other hand, constricts blood vessels, reducing the amount of blood flowing into the area. Using them together can provide a better effect of promoting blood circulation while applying ice.

[0082] The combined use of ice packs and a vibration motor can accelerate the recovery process at the injured site. Ice packs can reduce inflammation and swelling, alleviating tissue damage. The vibration motor, on the other hand, can promote local blood circulation, enhance nutrient supply to muscles and tissues, and accelerate the recovery and repair process.

[0083] The vibration from the vibration motor can help relax tense muscles and relieve muscle fatigue and tension. Applying ice can relieve muscle pain and discomfort by lowering the local temperature. Using both together can provide a better muscle relaxation effect.

[0084] In another implementation example, an LED is also included, which is used for phototherapy. The LED is a red LED and / or a blue LED.

[0085] Applying ice can reduce inflammation and swelling, while red light therapy has also been shown to have anti-inflammatory effects. Combining ice application and red light therapy can more effectively relieve inflammatory responses and reduce pain and discomfort. Red light therapy is widely used in tissue repair and wound rehabilitation. It can promote cell metabolism, increase ATP cellular energy production, and accelerate wound healing and tissue repair processes. Ice application, on the other hand, can reduce blood flow to the affected area, reducing inflammation and providing a better environment for tissue repair.

[0086] Blue light therapy has been proven to have antibacterial properties, effectively killing bacteria and reducing the risk of infection. Combining ice packs with blue light therapy can provide additional antibacterial effects while applying ice, which is beneficial for wound healing after trauma or surgery.

[0087] In another embodiment, a radiofrequency electrode is also included, which is fixed to the surface of the housing 100 and connected to the central control module. The radiofrequency electrode stimulates the deep tissues of the skin by generating heat, promoting collagen regeneration and tissue tightening. However, radiofrequency treatment may cause a certain degree of heat and discomfort on the skin surface.

[0088] In this situation, applying an ice pack can help cool the skin, reduce discomfort, and provide additional soothing relief. Ice packs can alleviate the feeling of heat by lowering skin temperature, reducing redness and local inflammation.

[0089] When using radiofrequency electrodes in conjunction with ice packs, the general steps are as follows:

[0090] First, perform radiofrequency treatment: correctly place the radiofrequency electrodes on the skin, and select the appropriate energy and time for treatment as needed.

[0091] Ice pack: After radiofrequency treatment, gently press or glide the cooling surface of the heating element onto the treatment area to cool the skin.

[0092] Using radiofrequency electrodes in combination with ice packs can help relieve the heat and discomfort during radiofrequency treatment, while also providing a soothing effect.

[0093] In another embodiment, an electrotherapy electrode is also included. The electrotherapy electrode is fixed to the surface of the housing 100 and connected to the central control module. The electrotherapy electrode is used for electrotherapy.

[0094] Electrotherapy is a method of relieving pain by stimulating nerve conduction with electrical current. While ice packs reduce inflammation and swelling by lowering local temperature, electrotherapy can alleviate pain by stimulating nerves and interfering with the transmission of pain signals.

[0095] Electrotherapy can reduce muscle tension and spasms by stimulating muscle fibers. Applying ice can alleviate muscle pain and discomfort by lowering local temperature. Combining both can provide even better muscle relaxation.

[0096] Electrotherapy uses electrical stimulation to promote local blood circulation and increase blood flow. Ice packs, on the other hand, constrict blood vessels, reducing the amount of blood flowing into the area. Using them together can provide a better effect of promoting blood circulation while applying ice.

[0097] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A portable skin cooling device, characterized in that, include: A housing (100) having a cavity inside; A heating element (200) is fixed inside the cavity of the housing (100), and the heating element (200) is provided with a cooling surface; A cooling head (300) is embedded in the surface of the housing (100), and the cooling head (300) is connected to the cooling surface of the heating element (200); A power supply (400) is located inside the housing (100), and the power supply (400) is used to supply power to the heating element (200); A PCB board (500) is located inside the housing (100), and the PCB board (500) is connected to the heating element (200) and the power supply (400) respectively; The heating element (200) is used for cooling, the PCB board (500) is provided with a central control module, the central control module is used to control the cooling temperature of the heating element (200), and the cooling head (300) is used to apply ice to the skin. It also includes a cooling temperature sensor, which is located inside the housing (100) and connected to the PCB board (500). The cooling temperature sensor is used to monitor the temperature data of the cooling head (300) and feed it back to the central control module. The housing (100) is equipped with a heat dissipation module; The heat dissipation module includes a heat absorption tube (600), and a phase change material is sealed inside the heat absorption tube (600); Based on feedback from the cooling temperature sensor, the central control module can control the cooling temperature through pulse control. Within the pulse period t0, the initial cooling time is ton, and the adjustment time is Δt. If the real-time temperature is higher than the threshold temperature, then Δt is a positive number; if the real-time temperature is lower than the threshold temperature, then Δt is a negative number.

2. The portable skin cooling device according to claim 1, characterized in that, The heating element (200) includes a TEC semiconductor cooler.

3. The portable skin cooling device according to claim 2, characterized in that, The heating element (200) is composed of multiple TEC semiconductor coolers whose hot and cold surfaces are alternately stacked or arranged in a planar array.

4. The portable skin cooling device according to claim 1, characterized in that, The heating element (200) includes a cooling surface and a heating surface, and the heat dissipation module is connected to the heating surface.

5. The portable skin cooling device according to claim 4, characterized in that, It also includes a heat dissipation temperature sensor, which is fixed inside the housing (100) and connected to the central control module. The heat dissipation temperature sensor is used to monitor the temperature of the heat dissipation module and feed it back to the central control module.

6. The portable skin cooling device according to claim 1, characterized in that, It also includes a vibration motor, which is fixed inside the housing (100) and connected to the central control module.

7. The portable skin cooling device according to claim 1, characterized in that, It also includes LEDs and radio frequency electrodes.

8. The portable skin cooling device according to claim 1, characterized in that, It also includes an electrotherapy electrode, which is fixed to the surface of the housing (100) and connected to the central control module. The electrotherapy electrode is used for electrotherapy.

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