Polishing apparatus

Abstract

The present disclosure relates to a polishing apparatus. The polishing apparatus comprises a frame, a carrier for assembling a device to be polished, a conveying mechanism connected to the frame, the conveying mechanism for conveying the carrier to a polishing position, and a polishing mechanism connected to the frame, the polishing mechanism for polishing a gum on a surface of the device to be polished assembled by the carrier when the conveying mechanism conveys the carrier to the polishing position.

Description

Technical Field

[0001] This disclosure relates to the field of terminal technology, and in particular to a polishing device. Background Technology

[0002] Currently, many high-end models on the market have high waterproof ratings. For areas that require adhesive bonding, the waterproof performance can be improved by increasing the amount of adhesive applied. However, increasing the amount of adhesive can cause glue to overflow after pressing, which can affect the appearance of the equipment and result in poor aesthetics. Summary of the Invention

[0003] This disclosure provides a polishing apparatus to address the shortcomings of related technologies.

[0004] According to a first aspect of the present disclosure, a polishing apparatus is provided, comprising:

[0005] frame;

[0006] A carrier for assembling the equipment to be polished;

[0007] A conveying mechanism connected to the frame, the conveying structure being used to convey the carrier to the polishing position;

[0008] A polishing mechanism is connected to the frame and is used to polish the adhesive material on the surface of the equipment to be polished assembled on the carrier when the carrier is transported to the polishing position by the conveying mechanism.

[0009] Optionally, the conveying mechanism includes:

[0010] A transverse conveying component is assembled on the frame. The transverse conveying component includes a loading position and a lifting position. After the carrier is conveyed to the loading position, it is conveyed to the lifting position by the transverse conveying component in a direction perpendicular to the height direction of the polishing equipment.

[0011] A longitudinal lifting component is assembled on the frame and is used to lift the carrier at the lifting position to the polishing position along the height direction of the polishing equipment.

[0012] Optionally, the lateral conveying component includes:

[0013] A base, which is connected to the frame;

[0014] A conveyor belt, which is movably connected to the base;

[0015] A drive motor is disposed on the base body, and the drive motor is used to drive the conveyor belt to reciprocate relative to the base body.

[0016] Optional, also includes:

[0017] A camera component, used to acquire image information of the device to be polished;

[0018] A controller, which is communicatively connected to the imaging component, is used to determine the distribution information of the adhesive material on the surface of the device to be polished based on the image information of the device to be polished.

[0019] Optionally, the image information includes image information of the device to be polished before it is polished;

[0020] The controller is communicatively connected to the polishing mechanism, and the controller is used to plan the polishing path of the polishing mechanism based on the distribution information of the adhesive material on the surface of the equipment to be polished.

[0021] Optionally, the image information includes image information of the device to be polished after polishing;

[0022] The controller is communicatively connected to the polishing mechanism. The controller is used to control the polishing mechanism to stop polishing or to polish again based on the distribution information of the adhesive material on the surface of the equipment to be polished.

[0023] Optional, also includes:

[0024] An environmental condition adjustment mechanism is provided to adjust the spatial environmental conditions within the polishing equipment where the equipment to be polished is placed, so as to soften the adhesive material on the surface of the equipment to be polished.

[0025] Optionally, the conveying mechanism includes:

[0026] A body adjustment mechanism is movably assembled to the frame and is movable relative to the frame to adjust the carrier between multiple polishing positions.

[0027] Optional, also includes:

[0028] A controller is connected to the actuator and is used to control the polishing mechanism to change the polishing parts or control the polishing intensity of the polishing mechanism according to the type of the equipment to be polished.

[0029] Optionally, the polishing mechanism includes:

[0030] Executive agency;

[0031] A control unit, which is used to control the motion trajectory of the actuator;

[0032] A polishing component is connected to the actuator and moves with the actuator to polish the device to be polished.

[0033] Optionally, the polished part includes a coarse polished part and a fine polished part; or, the polished part includes a coarse polished area and a fine polished area.

[0034] Optionally, the polished component includes Velcro attached to the actuator.

[0035] Optional, also includes:

[0036] An automatic spraying mechanism is disposed on the frame and is used to spray liquid toward the actuator and / or polishing parts after the control body controls the actuator to move to the spraying position.

[0037] Optional, also includes:

[0038] A consumable replacement mechanism is connected to the frame and is used to replace the polishing parts disposed on the actuator.

[0039] Optionally, the polishing mechanism includes a consumable replacement position and a consumable loading position;

[0040] The consumable replacement mechanism includes:

[0041] A disassembly component is used to remove the polishing part of the polishing mechanism located at the consumable replacement position;

[0042] A consumables recycling device, wherein the consumables recycling device is used to recycle the polished parts removed by the disassembly mechanism;

[0043] A consumables loading tray is used to hold polished parts. When the polishing mechanism is in the consumables loading position, it picks up and attaches the polished parts from the consumables loading tray. The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0044] As can be seen from the above embodiments, the polishing mechanism of the polishing equipment in this disclosure can polish and wipe away the adhesive material on the surface of the equipment to be polished. The intelligent mechanized operation replaces the traditional manual operation, realizes the automation of the process flow, reduces labor costs, and improves production efficiency.

[0045] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0046] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0047] Figure 1 This is a schematic diagram of the structure of a polishing device according to an exemplary embodiment.

[0048] Figure 2 This is a schematic diagram illustrating the assembly of a carrier and a polishing device according to an exemplary embodiment.

[0049] Figure 3 This is a schematic diagram illustrating the assembly of a transverse conveying component and a carrier according to an exemplary embodiment.

[0050] Figure 4 This is a schematic diagram illustrating the assembly of a longitudinal lifting component and a carrier according to an exemplary embodiment.

[0051] Figure 5 This is a partially exploded schematic diagram of a longitudinal lifting component and a carrier according to an exemplary embodiment.

[0052] Figure 6 This is a partial schematic diagram of the front view of a longitudinal lifting component and a carrier assembly according to an exemplary embodiment.

[0053] Figure 7 This is a schematic diagram of a polishing mechanism according to an exemplary embodiment.

[0054] Figure 8 yes Figure 7 A partially enlarged schematic diagram of the polishing mechanism.

[0055] Figure 9 This is a schematic diagram of a consumable replacement mechanism according to an exemplary embodiment.

[0056] Figure 10 This is a schematic diagram of a partial structural frame of a polishing apparatus according to an exemplary embodiment. Detailed Implementation

[0057] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0058] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0059] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0060] More and more terminal devices are equipped with an IP68 waterproof rating. Currently, the waterproof performance between the screen and the frame is mainly improved by increasing the amount of adhesive applied between them. However, due to the increased amount of adhesive, excess adhesive will inevitably occur after the screen and frame are pressed together, affecting the overall appearance of the device.

[0061] In one related technology, a glue-wiping machine is mainly used to wipe away the residual adhesive. However, by simply wiping with a glue-wiping machine, residual adhesive is easily left at the corners of the terminal device after processing, and the adhesive line between the frame and the screen is rough and dull. Therefore, this related technology also requires manual polishing of the device after glue wiping, which increases labor costs and has low work efficiency.

[0062] Based on this, this disclosure provides a method such as Figure 1 The polishing equipment 100 shown may include a frame 1, a carrier 2, a conveying mechanism 3, and a polishing mechanism 4. The frame 1 can serve as a support for the polishing equipment 100 to fix other components. The frame 1 can be formed by connecting multiple rod-like structures, or by connecting plate-like structures, or by combining rod-like and plate-like structures. This disclosure does not impose any limitations on this. The carrier 2 can be used to assemble the equipment to be polished. Taking a mobile phone terminal as an example, the equipment to be polished can be the equipment to be processed after the screen and frame have been pressed together and preliminarily glued by an adhesive applicator, or the equipment to be polished can be the equipment to be processed after the screen and frame have been pressed together but before preliminarily glued. Figure 2As shown, the carrier 2 may include an upper plate 21 and a lower plate 22. The equipment to be polished can be assembled between the upper plate 21 and the lower plate 22. By having the upper plate 21 and the lower plate 22 act on the equipment to be polished in two opposite directions, pressure can be maintained on the equipment to be polished, which is beneficial for the polishing equipment 100 to connect with other equipment on the production line. The carrier 2 may also include an elastic member 23, which can be connected to the lower plate 22. The other end of the elastic member 23 can be bent and pressed against the surface of the upper plate 21. In this way, the elastic member 23 can maintain the force generated by the cooperation between the upper plate 21 and the lower plate 22 on the equipment to be polished.

[0063] The conveying mechanism 3 can be connected to the frame 1. The carrier 2 can be placed on the conveying mechanism 3 and then conveyed to the polishing position by the conveying mechanism 3. The polishing mechanism 4 can be connected to the frame 1. The polishing mechanism 4 can be used to polish the adhesive material on the surface of the device to be polished assembled on the carrier 2 after the conveying mechanism 3 conveys the carrier 2 to the polishing position. For example, it can polish the cured adhesive residue between the frame and the screen, or it can polish the cured adhesive line between the screen and the frame, so that the adhesive line is smooth and shiny.

[0064] As can be seen from the above embodiments, the polishing mechanism 4 of the polishing equipment 100 in this disclosure can polish and wipe away the adhesive material on the surface of the equipment to be polished. The intelligent mechanized operation replaces the traditional manual operation, realizes the automation of the process flow, reduces labor costs, and improves production efficiency.

[0065] In this embodiment, the conveying mechanism 3 may include a transverse conveying component 31 and a longitudinal lifting component 32, which are respectively assembled on the frame 1. The transverse conveying component 31 may include a loading position. After the carrier 2 is conveyed to the loading position, it can be translated and conveyed to the lifting position in a direction perpendicular to the height direction of the polishing equipment 100 by the action of the transverse conveying component 31. After the carrier 2 reaches the lifting position, the longitudinal lifting component 32 can be used to lift the carrier 2 at the lifting position to the polishing position along the height direction of the polishing equipment 100, so that the subsequent polishing mechanism 4 can polish the equipment to be polished at the polishing position. The carrier 2 may be placed manually at the loading position, or it may be conveyed to the loading position by the front-end equipment on the production line, or it may be picked up and placed at the loading position by a robot arm that has completed the process in the front-end equipment. The front-end equipment may be, for example, a pressure holding device or a glue wiping device, and this disclosure does not limit it.

[0066] like Figures 3-6As shown, the transverse conveying component 31 may include a base 311, a conveyor belt 312, and a drive motor 313. The base 311 can be connected to the frame 1 to achieve a fixed connection between the transverse conveying component 31 and the frame 1. The conveyor belt 312 can be movably connected to the base 311. The drive motor 313 can be connected to the base 311 and can drive the conveyor belt 312 to reciprocate relative to the base 311 to convey the carrier placed on the transverse conveying component 31. For example, the carrier 2 at the loading position can be conveyed to the lifting position by controlling the speed and revolutions of the drive motor 313.

[0067] Furthermore, the transverse conveying component 31 may also include multiple positioning cylinders 314, each of which is fixedly connected to the base 311. The longitudinal lifting component 32 may include a positioning element 321 and a longitudinal lifting cylinder 322, with the positioning element 321 connected to the longitudinal lifting cylinder 322. After the carrier 2 is conveyed to the lifting position by the transverse conveying component 31, one or more positioning cylinders 314 can be activated to restrict the movement of the carrier 2 in the height direction of the polishing equipment 100. Then, the longitudinal lifting cylinder 322 is activated, and the positioning element 321 can move a first stroke with the longitudinal lifting cylinder 322 to connect with the carrier 2. During this process, the positioning cylinder 314 limits the movement of the carrier 2, preventing displacement of the carrier 2 during the connection between the positioning element 321 and the carrier 2. Furthermore, after the positioning component 321 is connected to the carrier 2, the positioning cylinder 314 can be released from its height restriction in the polishing equipment 100. The positioning component 321 can then move a second stroke along the height direction of the polishing equipment 100 with the longitudinal lifting cylinder 322. The force of the longitudinal lifting component 32 can be transmitted to the carrier 2 through the positioning component 321, causing the carrier 2 to move to the polishing position. The positioning component 321 may include a positioning pin, and the carrier 2 may include a positioning hole that mates with the positioning pin.

[0068] The sequential actions in "After the carrier 2 is transported to the lifting position by the transverse conveying component 31, the one or more positioning cylinders 314 can be activated to restrict the movement of the carrier 2 in the height direction of the polishing equipment 100" do not have a set duration; they can be spaced out for a certain period of time or they can be without interval, and this disclosure does not impose any restrictions on this. Similarly, the sequential actions in "After the positioning component 321 is connected to the carrier 2, the limiting of the positioning cylinder 314 in the height direction of the polishing equipment 100 can be released" do not have a set duration; they can be spaced out for a certain period of time or they can be without interval, and this disclosure does not impose any restrictions on this.

[0069] In this embodiment, after the positioning member 321 is connected to the carrier 2, the positioning cylinder 314 releases its restriction on the carrier 2. Therefore, in order to avoid or reduce the risk of the carrier 2 overturning due to the lifting action of the longitudinal lifting cylinder 322 during the second stroke of the longitudinal lifting cylinder 322, the longitudinal lifting member 32 may also include a transverse clamping cylinder 323. The transverse clamping cylinder 323 is used to clamp the carrier 2 from two opposite directions after the positioning member 321 is connected to the carrier 2. For example, the two opposite directions in which the transverse clamping cylinder 323 clamps the carrier can both be parallel to the conveying direction of the transverse conveying member 31. Based on this, the clamping action of the transverse clamping cylinder 323 reduces the risk of the carrier 2 overturning and increases the probability that the carrier 2 is successfully lifted to the polishing position.

[0070] The timing of the lateral clamping cylinder 323 clamping the carrier 2 and the timing of the positioning cylinder 314 releasing its limit on the carrier 2 are unrelated; the two actions can be performed independently. For example, the lateral clamping cylinder 323 can clamp the carrier 2 after the positioning cylinder 314 releases its limit; or the lateral clamping cylinder 323 can clamp the carrier 2 before the positioning cylinder 314 releases its limit; or the lateral clamping cylinder 323 clamping the carrier 2 and the positioning cylinder 314 releasing its limit can be performed simultaneously. This disclosure does not impose any specific limitations on this.

[0071] It should be noted that, in the embodiments provided in this disclosure, the conveying mechanism 3 is described using the example of a transverse conveying component 31 and a longitudinal lifting component 32. In other embodiments, the conveying mechanism 3 may also include a transverse conveying component 31. For example, after the carrier 2 is conveyed to the loading position of the transverse conveying component 31, the carrier 2 can be conveyed to the polishing position in a direction perpendicular to the height direction of the polishing equipment 100 by the transverse conveying component 31. Alternatively, in some embodiments, the conveying mechanism 3 may also include a longitudinal lifting component 32. The longitudinal positioning component 32 may include a loading position. For example, after the carrier 2 is conveyed to the loading position of the longitudinal positioning component 32, the carrier 2 can be lifted to the polishing position in the height direction of the polishing equipment 100 by the longitudinal positioning component 32. The specific design can be customized as needed, and this disclosure does not impose any limitations on this.

[0072] In the above embodiments, such as Figure 7 and Figure 8As shown, the polishing mechanism 4 may include an actuator 41, a control body 42, and a polishing component 43. The control body 42 may be connected to the actuator 41. The control body 42 can control the movement trajectory of the actuator 41 by executing a set program, or the control body 42 may control the movement trajectory of the actuator 41 according to the received user instructions. The polishing component 43 may be connected to the actuator 41. The polishing component 43 can move with the actuator 41 to polish the various surfaces of the device to be polished that need to be cleaned.

[0073] The control unit 42 may include a robotic arm, and the polishing component 43 may include Velcro, which can be attached to the actuator 41 and is easy to adhere and remove for easy replacement. Of course, to adapt to different cleaning methods for areas of varying hardness on the polishing equipment and minimize damage, the polishing component may include a coarse polishing component and a fine polishing component. Both can be simultaneously installed on the actuator 41, allowing selection of the appropriate polishing component 43 based on the hardness and brightness requirements of the polishing area; alternatively, only one of the coarse or fine polishing components may be installed on the actuator 41, with replacement based on the hardness of the polishing area. In some embodiments, the same polishing component 43 may include both a coarse and fine polishing area, allowing selection of the appropriate area for polishing the equipment based on its hardness.

[0074] Furthermore, the polishing equipment 100 may also include a controller (not shown), which can be communicatively connected to the actuator 41. The controller can be used to control the polishing mechanism 4 to change the polishing part 43, or to control the polishing intensity of the polishing mechanism 4, depending on the type of device to be polished assembled on the carrier 2. For example, when the controller identifies the device to be polished as a mobile phone terminal with a curved screen, the controller can issue an instruction to the polishing mechanism 4 to change the polishing part 43 upon receiving the instruction. For instance, a softer polishing part can be used to avoid damaging the screen. Alternatively, the polishing intensity of the polishing mechanism can be controlled to avoid excessive force acting on the curved screen and causing damage. This polishing intensity can be controlled by controlling the forming trajectory of the actuator. Similarly, when the controller identifies the device to be polished as a mobile phone terminal with a flexible screen, it can also control the polishing mechanism 4 to change to a softer polishing part, or control the polishing intensity of the polishing mechanism 4. Of course, in some cases, coarse or fine polishing parts, or coarse or fine polishing areas, can be selected according to the brightness requirements of each location.

[0075] In this embodiment, the polishing equipment 100 may further include an automatic spraying mechanism 5, which can be connected to the frame 1. The automatic spraying mechanism 5 can spray liquid towards at least one of the actuator 41 and the polishing part 43 after the control body 42 controls the actuator 41 to move to a set spraying position, thereby improving the polishing effect of the polishing part 43. The automatic spraying mechanism 5 may include a glue spraying system and a piezoelectric valve, etc. The glue spraying system can precisely control the frequency and volume of liquid spraying, achieving precise control of the sprayed liquid.

[0076] Furthermore, the polishing equipment 100 may also include a consumable replacement mechanism 6, which can be connected to the frame 1. The consumable replacement mechanism 6 can replace the polishing part 43 set on the actuator 41. For example, when the polishing part 43 is Velcro, the consumable replacement mechanism 6 can peel off the Velcro on the actuator 41 and reattach a new Velcro, thereby realizing automatic replacement of consumables and saving labor costs.

[0077] Specifically, such as Figure 9 As shown, the polishing mechanism 4 may include a consumable replacement position and a consumable loading position. The control body 42 can control the actuator 41 to move to the consumable replacement position or the consumable loading position. The consumable replacement mechanism 6 may include a disassembly component 61, a consumable recycling device 62, and a consumable loading tray 63. The disassembly component 61 can be used to remove the polished parts of the polishing mechanism 4 located at the consumable replacement position and place the removed consumables in the consumable recycling device 62 for recycling. The consumable loading tray 63 can be used to place the polished parts 43. For example, the consumable loading tray 63 can be divided into two areas, one area for placing coarse polished parts and the other area for placing fine polished parts. When the polishing mechanism 4 is located at the consumable loading position, the control body 42 controls the movement of the actuator 41 to pick up and attach the polished parts 43 in the consumable loading tray 63. The disassembly component 61 may include a robotic arm, a robotic hand, or other mechanical structure capable of adsorbing the polished part 43. The consumable recycling device 62 may include a consumable recycling box. The consumable feeding tray 63 may be connected to the consumable receiving equipment to realize automatic replenishment of the polished part 43, which is conducive to the automated production of the production line. Alternatively, the polished part 43 may be manually placed on the consumable feeding tray 63 by the production line personnel. The specific design can be customized as needed, and this disclosure does not impose any restrictions on this.

[0078] It should be noted that, in the embodiments provided in this disclosure, the polishing equipment 100 is described as including both an automatic spraying mechanism 5 and a consumable replacement mechanism 6. In other embodiments, the polishing equipment 100 may also include an automatic spraying mechanism 5 or a consumable replacement mechanism 6, and this disclosure does not impose any restrictions on this.

[0079] In the above embodiments, the controller is connected to the control body 42, and the controller controls the control body 42 of the polishing mechanism 4 to drive the actuator 41 to move according to the motion trajectory, thereby polishing the equipment to be polished; in other embodiments, such as Figure 10 As shown, the conveying mechanism 3 may also include a body adjustment mechanism 7, which is movably assembled to the frame 1. By moving the body adjustment mechanism relative to the frame 1, the carrier can be adjusted between multiple polishing positions, thereby adjusting the position of the equipment to be polished. When the polishing mechanism 4 is stationary, the position of the equipment to be polished can be adjusted by the body adjustment mechanism 7, and the contact area between the equipment to be polished and the polishing mechanism can be adjusted, thereby achieving the purpose of polishing each position of the equipment to be polished.

[0080] Based on the technical solution of this disclosure, in some optional embodiments, it is still based on Figure 10 As shown, the polishing device 100 may further include a camera component 8 and a controller 9. The camera component 8 can be used to acquire image information of the device to be polished. For example, it can take pictures when the device is assembled on the carrier, when it is transported to the polishing position, or when the polishing mechanism returns to the starting position after polishing for a certain period of time or after completing a certain amount of polishing. The controller 9 can communicate with the camera component 8, thereby acquiring the image information obtained by the camera component 8. The controller 9 can determine the distribution information of the adhesive material on the surface of the device to be polished based on the image information. Based on this distribution information, it is beneficial to accurately adjust the polishing mechanism 4 to polish the area where the adhesive material is distributed, avoiding scratching other areas; or it is also beneficial to determine the polishing effect based on the distribution information of the adhesive material, thereby determining whether polishing is needed again.

[0081] Specifically, in one embodiment, the image information may include image information of the device to be polished before polishing. The controller 9 may be communicatively connected to the polishing mechanism 4. The controller 9 may be used to plan the polishing path of the polishing mechanism 4 according to the distribution information of the adhesive on the surface of the device to be polished, which is beneficial to improving the polishing efficiency of the polishing mechanism 4. In another embodiment, the image information may include image information of the device to be polished after polishing. The controller 9 may be connected to the polishing mechanism 4. The controller 9 may control the polishing mechanism 4 to stop polishing or to polish again according to the image information after polishing. During the polishing process, the same polishing part 43 as the previous one may be selected, such as coarse polishing parts, or a different polishing part 43 may be selected, such as changing from coarse polishing parts to fine polishing parts.

[0082] In the above embodiments, it is still based on Figure 10As shown, the polishing equipment 100 may further include an environmental condition adjustment mechanism 10. This mechanism 10 can be assembled onto the frame 1 and can be fixedly or movably connected to it. The environmental condition adjustment mechanism 10 can adjust the spatial environmental conditions within the polishing equipment 100 where the equipment to be polished is placed, thereby softening the adhesive material on the surface of the equipment and reducing the polishing difficulty of the polishing mechanism 4. For example, the environmental condition adjustment mechanism 10 can adjust the ambient humidity or ambient temperature.

[0083] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0084] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A polishing device, characterized in that, include: frame; A carrier is used to assemble a device to be polished, which is a device to be processed after the screen and the frame are pressed together. The carrier includes an upper plate, a lower plate and an elastic member. The device to be polished is assembled between the upper plate and the lower plate. The elastic member is connected to the lower plate and its other end is bent and pressed against the upper plate to maintain pressure on the device to be polished. A conveying mechanism connected to the frame, the conveying mechanism being used to convey the carrier to the polishing position; A polishing mechanism, connected to the frame, is used to polish the adhesive material on the surface of the equipment to be polished assembled on the carrier when the conveying mechanism conveys the carrier to the polishing position; The conveying mechanism includes a transverse conveying component and a longitudinal lifting component. The transverse conveying component includes multiple positioning cylinders, which restrict the movement of the carrier along the height direction of the polishing equipment when the carrier is in the lifting position. The longitudinal lifting component includes a positioning element, a longitudinal lifting cylinder, and a transverse clamping cylinder. The positioning element connects to the carrier during the first stroke of the longitudinal lifting cylinder, and then releases the restriction of the carrier's movement in the height direction. After the positioning element moves a second stroke along the height direction with the longitudinal lifting cylinder, it moves the carrier to the polishing position. The transverse clamping cylinder clamps the carrier from two opposite directions after the positioning element connects to the carrier, and the clamping direction is parallel to the conveying direction of the transverse conveying component.

2. The polishing equipment according to claim 1, characterized in that, The conveying mechanism includes: A transverse conveying component is assembled on the frame. The transverse conveying component includes a loading position and a lifting position. After the carrier is conveyed to the loading position, it is conveyed to the lifting position by the transverse conveying component in a direction perpendicular to the height direction of the polishing equipment. A longitudinal lifting component is assembled on the frame and is used to lift the carrier at the lifting position to the polishing position along the height direction of the polishing equipment.

3. The polishing equipment according to claim 2, characterized in that, The transverse conveying component includes: A base, which is connected to the frame; A conveyor belt, which is movably connected to the base; A drive motor is disposed on the base body, and the drive motor is used to drive the conveyor belt to reciprocate relative to the base body.

4. The polishing equipment according to claim 1, characterized in that, Also includes: A camera component, used to acquire image information of the device to be polished; A controller, which is communicatively connected to the imaging component, is used to determine the distribution information of the adhesive material on the surface of the device to be polished based on the image information of the device to be polished.

5. The polishing equipment according to claim 4, characterized in that, The image information includes image information of the device to be polished before it is polished; The controller is communicatively connected to the polishing mechanism, and the controller is used to plan the polishing path of the polishing mechanism based on the distribution information of the adhesive material on the surface of the equipment to be polished.

6. The polishing equipment according to claim 4, characterized in that, The image information includes image information of the polished device after polishing; The controller is communicatively connected to the polishing mechanism. The controller is used to control the polishing mechanism to stop polishing or to polish again based on the distribution information of the adhesive material on the surface of the equipment to be polished.

7. The polishing equipment according to claim 1, characterized in that, Also includes: An environmental condition adjustment mechanism is provided to adjust the spatial environmental conditions within the polishing equipment where the equipment to be polished is placed, so as to soften the adhesive material on the surface of the equipment to be polished.

8. The polishing equipment according to claim 1, characterized in that, Also includes: A controller is connected to the polishing mechanism. The controller is used to control the polishing mechanism to change the polishing parts or control the polishing intensity of the polishing mechanism according to the type of the equipment to be polished.

9. The polishing equipment according to claim 1, characterized in that, The polishing mechanism includes: Executive agency; A control unit, which is used to control the motion trajectory of the actuator; A polishing component is connected to the actuator and moves with the actuator to polish the device to be polished.

10. The polishing equipment according to claim 9, characterized in that, The polished part includes a coarse polished part and a fine polished part; or, the polished part includes a coarse polished area and a fine polished area.

11. The polishing equipment according to claim 9, characterized in that, The polished component includes Velcro attached to the actuator.

12. The polishing equipment according to claim 9, characterized in that, Also includes: An automatic spraying mechanism is disposed on the frame and is used to spray liquid toward the actuator and / or polishing parts after the control body controls the actuator to move to the spraying position.

13. The polishing equipment according to claim 9, characterized in that, Also includes: A consumable replacement mechanism is connected to the frame and is used to replace the polishing parts disposed on the actuator.

14. The polishing equipment according to claim 13, characterized in that, The polishing mechanism includes a consumable replacement position and a consumable loading position; The consumable replacement mechanism includes: A disassembly component is used to remove the polishing part of the polishing mechanism located at the consumable replacement position; A consumables recycling device, wherein the consumables recycling device is used to recycle the polished parts removed from the disassembled components; A consumables feeding tray is used to place polished parts. When the polishing mechanism is located at the consumables feeding position, it picks up and attaches the polished parts in the consumables feeding tray.

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