Tiled planar photoelectric computing imaging system

Abstract

The application relates to the field of optical imaging, in particular to a block type planar photoelectric computing imaging system. The system comprises a lens array and a chip assembly, the chip assembly comprises a packaging array, a waveguide array, a phase shift module, an interference module and a light splitting module arranged in sequence, the lens array is connected with the packaging array of at least two chip assemblies through a fiber array, the lens array comprises a plurality of linearly arranged lenses, each lens is connected with the incident end of a fiber in the fiber array, the emitting end of the fiber can be connected with a packaging pin, and the lens pair constituting a baseline can be connected with two adjacent packaging pins in one chip assembly through the corresponding fiber. In the system, the waveguide array and the lens array pass through the fiber array, the spacing of the waveguide array can be reduced, the arrangement of the chip assembly and the arrangement of the lens are no longer related, and N baseline connected chips can be divided into several parts to compress the size of the chip assembly and reduce the preparation difficulty.

Description

Technical Field

[0001] This application relates to the field of optical imaging technology, specifically to a modular planar photoelectric computational imaging system. Background Technology

[0002] Traditional imaging methods are easily affected by lens manufacturing processes. To improve imaging resolution and imaging distance, it is necessary to increase the aperture of the lens, but the fabrication of large-aperture lenses is becoming increasingly difficult. Based on this difficulty, those skilled in the art have developed a long-distance, wide-angle imaging method based on interferometric imaging, namely the segmented planar imaging detector for electro-optical reconnaissance (SPIDER). Current segmented planar imaging detectors based on interferometric imaging have two structural disadvantages: (1) Difficult fabrication process. In order to increase the number of baselines, the number of lenses and waveguides increases. With the waveguide spacing remaining unchanged, the chip size increases, and the manufacturing process becomes more difficult. There are cases where waveguides are arranged crosswise inside the chip. Once there is a cross, it is necessary to adopt a layered fabrication method for the optical path. This method divides the entire chip into at least three layers. Compared with the single-layer process, the process steps are three times more, the process time is greatly increased, the process stability decreases, and the process difficulty increases. (2) High process loss. The coupling loss is high, the coupling efficiency between the array lens and the array waveguide is low, and alignment is difficult. The additional losses are large, and the waveguides arranged in upper and lower layers will introduce additional losses. The energy at both ends of the MMI is inconsistent, resulting in a serious decrease in visibility. Summary of the Invention

[0003] In view of this, the present application provides a segmented planar photoelectric computational imaging system to solve the technical problems of high chip processing difficulty and high coupling loss in existing planar photoelectric reconnaissance systems.

[0004] This application provides a modular planar photoelectric computational imaging system, including a lens array and chip components. The chip components include a package array, a waveguide array, a phase-shifting module, an interferometer module, and a beam-splitting module arranged sequentially along the optical path. The lens array is connected to the package arrays of at least two chip components via an optical fiber array.

[0005] The lens array consists of multiple linearly arranged lenses, each lens being connected to the incident end of an optical fiber in the fiber array.

[0006] Each chip assembly contains a package array with 2N package pins, and the output end of an optical fiber can be connected to one package pin.

[0007] The lens pairs that form the baseline can be connected one-to-one with two adjacent package pins in a chip assembly via corresponding optical fibers.

[0008] Each chip assembly contains a phase shift module with 2N phase modulators.

[0009] Within the same chip assembly, each package pin is connected to each phase modulator in a one-to-one correspondence via waveguides in the waveguide array, arranged sequentially.

[0010] Each chip assembly contains an interference module comprising N multimode interference couplers.

[0011] Within the same chip assembly, every two adjacent phase modulators are connected to a multimode interference coupler in sequence.

[0012] Where N is a positive integer greater than or equal to 2.

[0013] According to the aforementioned embodiments of this application, in the same chip assembly, each phase modulator is connected to a corresponding multimode interference coupler through a waveguide. The waveguides connecting the phase modulator and the multimode interference coupler do not overlap and are located in the same layer of the chip assembly.

[0014] According to any of the foregoing embodiments of this application, the beam splitting module in each chip assembly includes N arrayed waveguide gratings, and in the same chip assembly, each multimode interference coupler is connected to each arrayed waveguide grating in a one-to-one correspondence according to the arrangement order.

[0015] According to any of the foregoing embodiments of this application, there are multiple sets of lens arrays, which are uniformly arranged along the circumferential direction. The arrangement direction of the lenses in the lens array is the radial direction of the circumference, so as to form a radial lens array.

[0016] Each lens array is connected to a package array of at least two chip components via a set of fiber optic arrays.

[0017] According to any of the foregoing embodiments of this application, all chip components are arranged in a rectangular array.

[0018] According to any of the foregoing embodiments of this application, the block-type planar photoelectric computational imaging system further includes a camera, and the waveguide array in the square array of chip components corresponds one-to-one with the pixel of the camera.

[0019] According to any of the foregoing embodiments of this application, the chip component is made of SiN.

[0020] According to any of the foregoing embodiments of this application, the coupling region width of the multimode interference coupler ranges from 9.5um to 10.5um, the width of the tapered waveguide ranges from 2.1um to 2.5um, and the coupling region length ranges from 225um to 235um.

[0021] According to any of the foregoing embodiments of this application, the arrayed waveguide grating has 10 to 32 channels, a channel width of 190 nm to 210 nm, a channel spacing of 22 nm to 25 nm, crosstalk less than -30 dB, a minimum insertion loss of 2.61 dB, and an output waveguide spacing of 30 μm to 40 μm.

[0022] The segmented planar photoelectric computational imaging system of this application improves the coupling of the lens array to the waveguide array by coupling the lens array to the fiber array. The fiber array and the waveguide array are coupled. Since the waveguide array and the lens array are connected by the fiber array, the spacing of the waveguide array can be reduced, thereby compressing the size of the chip components and reducing the manufacturing difficulty. With the addition of the fiber array in the middle, the arrangement of the chip components and the arrangement of the lenses are no longer related. The chip connected by N baselines can be divided into several parts, further reducing the chip size. After introducing the fiber array, only the fiber parts need to be crossed, while the waveguides on the chip components do not need to be crossed. This eliminates the need to introduce a multi-layer structure, further reducing the manufacturing difficulty and producing maximum visibility. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a traditional modular planar photoelectric computational imaging system.

[0024] Figure 2a This is a schematic diagram of the structure of a block-type planar photoelectric computational imaging system according to an embodiment of this application;

[0025] Figure 2b This is a schematic diagram of the structure of a block-type planar photoelectric computational imaging system according to an embodiment of this application;

[0026] Figure 2c This is a schematic diagram of the structure of a segmented planar photoelectric computational imaging system according to another embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the lens array in a modular planar photoelectric computational imaging system according to an embodiment of this application;

[0028] Figure 4 This is a comparison diagram between a traditional segmented planar photoelectric computational imaging system and a segmented planar photoelectric computational imaging system according to an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the structure of a radial lens array in a modular planar photoelectric computational imaging system according to an embodiment of this application;

[0030] Figure 6 The graph shows the relationship between the phase change and coupling efficiency of the MMI when the splitting ratio of the MMI in the embodiments of this application is 1:3.

[0031] Figure 7 The graph shows the performance of the MMI in the implementation case of this application. The horizontal axis represents wavelength and the vertical axis represents loss. After parameter optimization, the 1dB non-uniform bandwidth is 200nm and the 3dB additional loss bandwidth is 200nm.

[0032] Figure 8 The graph shows the performance of the AWG in this application implementation case. The horizontal axis represents wavelength and the vertical axis represents energy. After parameter optimization, the channel width of this AWG is 200nm, the channel spacing is 23nm, the crosstalk is less than -30dB, and the minimum insertion loss is 2.61dB. Detailed Implementation

[0033] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0034] Please see Figures 2a to 2c This application provides a modular planar photoelectric computational imaging system, including a lens array 100, an optical fiber array 200, and a chip assembly 300. The lens array 100 includes multiple linearly arranged lenses 110 for collecting long-distance visible light in the visible light band of 600nm to 800nm. The chip assembly 300 includes a package array 310, a waveguide array 320, a phase shift module 330, an interference module 340, and a beam splitting module 350 arranged sequentially along the optical path. The waveguide array 320 is used to guide the incident light from the optical fiber array 200 to the phase shift module 330. The phase shift module 330 is used to change the phase of the light entering the interference module 330. The interference module 340 is used to interfere the two beams of light entering this module to calculate the visibility. The beam splitting module 350 is used to perform wavelength division processing on the collected visible light. The number of beam splitting modules depends on the design of the beam splitting module itself. The beam splitting module can be an arrayed waveguide grating.

[0035] like Figure 2cAs shown, the lens array 100 is connected to the packaging array 310 of at least two chip components 300 via the fiber array 200. Each lens 110 is connected to the incident end of one fiber 210 in the fiber array 200, and the emitting end of the fiber 210 is connected to the packaging pin of the packaging array 310, for guiding the incident light from the lens 110 to the waveguide array 320, which then guides the light to the phase shift module 330. The packaging array 310 in each chip component 300 includes 2N (N is a positive integer greater than or equal to 2) packaging pins. The emitting end of one fiber 210 can be connected to one packaging pin, i.e., there is a one-to-one correspondence between the lens 110, the fiber 210, and the packaging pin. In the lens array 100, the lenses are matched in pairs to form a baseline, such as... Figure 3 As shown, 2N lenses are arranged in a straight line, with an equal number of lenses on both sides of the midpoint of the line. Two lenses symmetrical about the midpoint are paired to form a baseline. Therefore, 2N lenses can form N baselines. The lens pairs forming the baselines are connected one-to-one to two adjacent package pins in a chip assembly 300 via corresponding optical fibers. Following the order from the center to both ends of the lens array 100, or from both ends to the center, the optical fiber pairs corresponding to all lens pairs forming the baselines are connected one-to-one to the package pins according to the arrangement order of the package pins. For example... Figure 2a As shown, the lens pairs forming the baseline are numbered in order from both ends to the center. The lens pairs at both ends are numbered as the first pair of lenses, and the lens at the center is numbered as the Nth pair of lenses, starting from the first end (…). Figure 2a (middle and upper end) to tail end ( Figure 2a Following the order of the middle and lower ends, the first two package pins of the package array 310 are numbered as the first pair of package pins, and the last two package pins are numbered as the Nth pair of package pins. Therefore, the two optical fibers corresponding to the first pair of lenses are connected one-to-one with the first pair of package pins, the two optical fibers corresponding to the second pair of lenses are connected one-to-one with the second pair of package pins, the two optical fibers corresponding to the third pair of lenses are connected one-to-one with the third pair of package pins, and so on, until the two optical fibers corresponding to the Nth pair of lenses are connected one-to-one with the Nth pair of package pins. Specifically, as shown... Figure 2b As shown, the lens array includes 8 lenses, numbered 1 to 8 in sequence. Following the connection method described above, lenses with the same number are connected to the package pins; that is, lens number 1 is connected to package array number 1, and lens number 8 is connected to package array number 8. For example... Figure 2c As shown, in the case of a lens array connecting multiple chip components, 2N lenses are numbered 1 to 2N in order of arrangement. According to the aforementioned rule, lenses 110 with the same number are connected to the package pins through an optical fiber. That is, lens 110 numbered 1 is connected to the package pin numbered 1, and lens 2N is connected to the package pin numbered 2N.

[0036] Each chip assembly 300 contains a phase shift module 330, which includes 2N phase shifters 331 (PS). Within the same chip assembly 300, each package pin is connected to each phase shifter 331 in a one-to-one correspondence from the beginning to the end or from the end to the beginning. Figure 2a As shown, following the arrangement from the beginning to the end, the package pin at the beginning is connected to the phase modulator 331 at the beginning, and the package pin at the end is connected to the phase modulator 331 at the end. Specifically, the connection is made through waveguides in the waveguide array 320, which guide the light from the fiber optic output to the phase modulator 331. The lens, fiber, package pin, and phase modulator 331 have a one-to-one correspondence. In this way, there is no intersection between the waveguides connecting the package pin and the phase modulator 331.

[0037] Each chip assembly 300 contains an interference module 340, which includes N multimode interference couplers 341 (MMI couplers). Within the same chip assembly 300, every two adjacent phase modulators 331 are connected to a corresponding MMI coupler 341 in sequence via waveguides in the waveguide array 320. Figure 2a As shown, the phase modulators are numbered in order from the beginning to the end. The two phase modulators at the beginning are numbered as the first pair of phase modulators, the phase modulators at the third and fourth positions are numbered as the second pair of phase modulators, the phase modulators at the fifth and sixth positions are numbered as the third pair of phase modulators, and so on. The two phase modulators at the end are numbered as the Nth pair of phase modulators. Similarly, the multimode interference couplers 341 are numbered in order from the beginning to the end. The multimode interference coupler 341 at the beginning is the first multimode interference coupler, the multimode interference coupler adjacent to the first multimode interference coupler is the second multimode interference coupler, and so on. The multimode interference coupler at the end is the Nth multimode interference coupler. The first pair of phase modulators is connected to the first multimode interference coupler, the second pair of phase modulators is connected to the second multimode interference coupler, and so on. The Nth pair of phase modulators is connected to the Nth multimode interference coupler. The phase modulators and multimode interference couplers are connected to each other via waveguides. In this way, all the waveguides connecting the phase modulator 331 and the multimode interference coupler 341 can be arranged in the order of the phase modulator 331, without crossing or overlapping each other.

[0038] Traditional modular planar photoelectric computational imaging system structure, such as Figure 1 As shown in the figure, only four baselines are drawn. When the number of baselines increases, the size of the chip component 300 increases exponentially. Figure 4As shown, in the traditional scheme, the cross-section indicated by the black dashed box also has a layered structure caused by intersecting waveguides. The traditional block-type planar photoelectric computational imaging system structure has the following defects: (1) Difficult fabrication process. In order to increase the number of baselines, the number of lenses increases, the number of waveguides increases, and with the waveguide spacing remaining unchanged, the chip size increases, and the process difficulty increases; there are such Figure 1 The waveguides shown are arranged in a cross pattern. Once there is a cross, it is necessary to adopt a layered fabrication method for the optical path. This method divides the entire chip into at least three layers. Compared with the single-layer process, the process steps are three times more, the process time is greatly increased, the process stability is reduced, and the process difficulty is increased. (2) Large process loss. The coupling loss is large, the coupling efficiency between the array lens and the array waveguide is low, and the alignment is difficult. The additional loss is large. The waveguides arranged in upper and lower layers will introduce additional loss. The energy at both ends of the MMI is inconsistent, resulting in a serious decrease in visibility.

[0039] In the segmented planar photoelectric computational imaging system of this application embodiment, the coupling of the lens array 100 to the waveguide array 320 is improved to couple the lens array 100 to the fiber array 200, and the fiber array 200 and the waveguide array 320 are coupled. The array encapsulation between the fiber array 200 and the waveguide array 320 increases the overall system's shock resistance and interference resistance; the encapsulation process is a standard industrial process. The segmented planar photoelectric computational imaging system of this application embodiment has the following three advantages:

[0040] 1. In traditional structures, the waveguide array 320 and the lens array 100 are coupled. Since the arrangement of the lenses determines the number and distance of the baselines, and the size of the chip assembly 300 must be larger than this baseline distance, the side length of the traditional chip assembly 300 is several centimeters or more. In the segmented planar photoelectric computational imaging system of this application, because the waveguide array 320 and the lens array 100 are connected by an optical fiber array 200, the spacing of the waveguide array 320 can be reduced to 127 μm, which is more than ten times smaller than the 2 mm spacing of the lens array. This allows for a reduction in the size of the chip assembly 300 and a decrease in fabrication difficulty.

[0041] 2. With the addition of fiber optic array 200 in the middle, the arrangement of chip assembly 300 and lens array 100 are no longer correlated. The chip connected by N baselines can be divided into several parts (e.g., Figure 2c As shown in the figure, the chip size is further reduced, and these chips no longer need to be arranged closely as in traditional designs.

[0042] 3. In traditional designs, due to the direct coupling between the lens array 100 and the waveguide array 320, waveguide intersections occur after the baselines are arranged. This situation is usually resolved by introducing a multi-layer structure (such as...). Figure 4(As shown), however, the segmented planar photoelectric computational imaging system of this application only requires the fiber optic sections to cross, while the waveguides on the chip assembly 300 do not need to cross, thus eliminating the need for a multi-layer structure. From a conventional design perspective, a multi-layer structure requires three SiN layers and four SiO2 layers, involving numerous process steps. With improvements, the process steps and complexity of the segmented planar photoelectric computational imaging system of this application are significantly reduced. Without the introduction of a multi-layer structure, the energy entering the MMI will remain as similar as possible to produce maximum visibility.

[0043] The lenses in the lens array 100 can also be arranged in other ways, such as multiple lenses arranged in multiple straight lines, and multiple straight lines forming a lens array 100. The number of lenses in each straight line can be the same or different.

[0044] In some embodiments, to simplify the structure of the chip assembly 300 and reduce its fabrication difficulty, each phase modulator 331 in the same chip assembly 300 is connected to a corresponding multimode interference coupler 341 via a waveguide. The waveguides in the waveguide array 320 do not overlap and are located in the same layer of the chip assembly 300. Due to the introduction of the fiber array 200, a baseline pairing relationship has been established between the lens array 100 and the waveguide array 320. Therefore, the phase modulator 331 and the multimode interference coupler 341 can be connected in the order of arrangement without considering the baseline pairing problem. Thus, the waveguides connecting the phase modulator 331 and the multimode interference coupler 341 can be completely non-intersecting, thereby being located in the same layer of the chip assembly 300, further reducing the fabrication difficulty of the chip assembly 300.

[0045] In some embodiments, the beam splitting module 350 in each chip assembly 300 includes N arrayed waveguide gratings (AWGs). Within the same chip assembly 300, each multimode interference coupler 341 is connected to each arrayed waveguide grating 351 in a one-to-one correspondence according to the arrangement order. Similarly, the connection between the multimode interference coupler 341 and the arrayed waveguide grating 351 does not require consideration of baseline matching. Therefore, they can be connected completely according to the arrangement order, thereby eliminating the intersection between the waveguides connecting the multimode interference coupler 341 and the arrayed waveguide grating 351, further reducing the fabrication difficulty of the chip assembly 300.

[0046] In some embodiments, such as Figure 5 (a) and Figure 5As shown in (b), there are multiple sets of lens arrays 100, which are uniformly arranged along the circumference. The lenses in the lens arrays 100 are arranged in the radial direction of the circumference to form a radial lens array. This radial lens array is equivalent to lenses of the same size. Based on the principle of interferometric imaging, high-resolution and high-quality long-distance imaging information can be obtained. Each set of lens arrays 100 is connected to the packaging array 310 of at least two chip components 300 through a set of fiber arrays 200. The arrangement order of the chip components 300 corresponding to each set of lens arrays 100 is independent of the arrangement of the lenses in the lens arrays 100. Therefore, all the chip components 300 corresponding to the lens arrays 100 can be arranged in any form according to the actual needs of the system and the available space. That is, the chip components 300 do not need to be arranged radially like the lens arrays 100, so the layout of the chip components 300 can be rationally planned according to the actual situation.

[0047] In some embodiments, all chip components 300 are arranged in a rectangular array. Compared to a circular array, a rectangular array occupies less space. Based on the advantage that the chip components 300 in the modular planar photoelectric computational imaging system of this application can be arranged in any layout, all chip components 300 can be arranged in a rectangular array, making the photonic integrated circuit (PIC) formed by the chip components 300 more compact.

[0048] In some embodiments, the block-type planar photoelectric computational imaging system further includes a camera for receiving energy from the wavelength of the beam splitting module 350; the waveguide array in the square array of the chip components 300 corresponds one-to-one with the pixels of the camera, which can reduce packaging costs.

[0049] In some embodiments, the chip component is made of SiN. The MMI (Mesh Interference Machine) plays a role in interferometry processing of visible light in the 600–800 nm wavelength band within the entire modular planar optoelectronic computational imaging system chip. Therefore, the insertion loss and non-uniformity of the MMI device are relatively important attributes. Excessive insertion loss leads to data distortion, while excessive non-uniformity reduces interferometric visibility. An important performance parameter of the MMI is the splitting ratio. This splitting ratio, once the MMI device is fabricated, is an internal attribute that cannot be adjusted, unlike the input light power ratio, which can be adjusted. The overall visibility of the modular planar optoelectronic computational imaging system is affected by the MMI, and the visibility of the modular planar optoelectronic computational imaging system directly affects the imaging quality. In this embodiment, the chip component is made of SiN, which allows for a large splitting ratio tolerance of the MMI. This embodiment has the following characteristics:

[0050] 1. The MMI design of this type can achieve a visibility of over 80% when the splitting ratio is between 1:3 and 1:1, which gives it a certain advantage in visibility (e.g., Figure 5 (As shown).

[0051] 2. Due to the large spectrophotometer ratio tolerance, the MMI's graphic structure parameters also have a large tolerance, allowing for process errors within a wide range and reducing processing difficulty.

[0052] 3. The MMI design itself is good, with a 1dB non-uniformity bandwidth (the difference in beam ratio is within 1dB) of 200nm and a 3dB additional loss (the overall insertion loss of the MMI) of 200nm.

[0053] The above three points demonstrate that the MMI in the embodiments of this application has good performance.

[0054] In some embodiments, the coupling region width (CW) of the multimode interference coupler 341 ranges from 9.5 μm to 10.5 μm, the tapered waveguide width (TW) ranges from 2.1 μm to 2.5 μm, and the coupling region length (CL) ranges from 150 μm to 17 μm. Please participate. Figure 7 Under these parameter settings, the 1dB non-uniformity of the multimode interference coupler 341 is greater than 150nm, with a peak value of 200nm, and the 3dB additional loss is greater than 160nm, with a peak value of 200nm. The multimode interference coupler 341 of this application embodiment enables the entire segmented planar photoelectric computational imaging system to be applicable to the visible light band of 600nm to 800nm.

[0055] In some embodiments, the arrayed waveguide grating has 10–32 channels, a channel width of 190 nm–210 nm, a channel spacing of 22 nm–25 nm, crosstalk less than -30 dB, a minimum insertion loss of 2.61 dB, and an output waveguide spacing of 30 μm–40 μm. With these parameter settings, the spectral application range of the segmented planar photoelectric computational imaging system can be extended to around 700 nm, and the resolution of the segmented planar photoelectric computational imaging system can be improved. For example… Figure 8 As shown, this AWG has a channel width of 200nm, a channel spacing of 23nm, crosstalk less than -30dB, a minimum insertion loss of 2.61dB, and an output waveguide spacing of [missing information]. Figure 8 It can be seen that the segmented planar photoelectric computational imaging system of this application embodiment is applicable to the visible light band of 600nm to 800nm.

Claims

1. A modular planar photoelectric computational imaging system, comprising a lens array and a chip assembly, characterized in that: The chip assembly includes a package array, a waveguide array, a phase-shifting module, an interference module, and a beam splitting module arranged sequentially along the optical path. The lens array is connected to the package arrays of at least two chip assemblies via an optical fiber array. The lens array comprises multiple linearly arranged lenses, each lens being connected to the incident end of an optical fiber in the optical fiber array. Each chip assembly contains a package array with 2N package pins, and the output end of an optical fiber is connected to one package pin. The lens pairs that form the baseline are connected one-to-one with two adjacent package pins in a chip assembly via corresponding optical fibers. Each chip assembly contains a phase shift module with 2N phase modulators. Within the same chip assembly, each package pin is connected to each phase modulator in a one-to-one correspondence via waveguides in the waveguide array, arranged sequentially. Each chip assembly contains an interference module comprising N multimode interference couplers. Within the same chip assembly, every two adjacent phase modulators are connected to a multimode interference coupler in sequence. Where N is a positive integer greater than or equal to 2.

2. The segmented planar photoelectric computational imaging system according to claim 1, characterized in that: In the same chip assembly, each phase modulator is connected to a corresponding multimode interference coupler via a waveguide. The waveguides connecting the phase modulator and the multimode interference coupler do not overlap and are located in the same layer of the chip assembly.

3. The segmented planar photoelectric computational imaging system according to claim 1, characterized in that: The beam splitting module in each chip assembly includes N arrayed waveguide gratings. In the same chip assembly, each multimode interference coupler is connected to each arrayed waveguide grating in a one-to-one correspondence according to the arrangement order.

4. The segmented planar photoelectric computational imaging system according to claim 1, characterized in that: The lens array comprises multiple sets, which are uniformly arranged along the circumference, with the lenses arranged radially along the circumference to form a radial lens array. Each lens array is connected to a package array of at least two chip components via a set of fiber optic arrays.

5. The segmented planar photoelectric computational imaging system according to claim 4, characterized in that: All chip components are arranged in a rectangular array.

6. The segmented planar photoelectric computational imaging system according to claim 5, characterized in that: It also includes the camera, with the waveguide array in the square array of chip components corresponding one-to-one with the camera's pixels.

7. The segmented planar photoelectric computational imaging system according to claim 1, characterized in that: The chip assembly is made of SiN.

8. The segmented planar photoelectric computational imaging system according to claim 1, characterized in that: The coupling region width of the multimode interference coupler ranges from 9.5µm to 10.5µm, the width of the tapered waveguide ranges from 2.1µm to 2.5µm, and the length of the coupling region ranges from 225µm to 235µm.

9. The segmented planar photoelectric computational imaging system according to claim 3, characterized in that: The arrayed waveguide grating has 10 to 32 channels, a channel width of 190 nm to 210 nm, a channel spacing of 22 nm to 25 nm, crosstalk less than -30 dB, a minimum insertion loss of 2.61 dB, and an output waveguide spacing of 30 μm to 40 μm.

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