Layout method, device and storage medium of hardware module

Abstract

The present disclosure relates to a hardware module layout method, device and storage medium, and is applied to a terminal. The method comprises: obtaining a heat perception value of the hardware module at a set layout position according to a touch frequency and a heat distribution of each touch position on a touch screen of the terminal, wherein the heat perception value is negatively correlated with the heat value; taking the set layout position as a variable, the heat perception value as an objective function, and performing iterative calculation until the objective function converges to obtain an optimal layout position of the set layout position. The present disclosure can comprehensively consider the heat capacity of the hardware module itself and the touch frequency of different parts on the touch screen in actual use, and the optimal layout position obtained can avoid the generation of terminal heat problems as much as possible.

Description

Technical Field

[0001] This disclosure relates to the field of terminal technology, and in particular to a hardware module layout method, apparatus, and storage medium. Background Technology

[0002] With the development of mobile terminal technology, devices with touchscreens such as mobile phones and tablets have gradually become indispensable tools for people's production and daily life. More and more people need to use these devices for learning, work, and entertainment. As the performance of mobile phones and other devices improves, overheating during use is inevitable. Therefore, it is necessary to add more heat dissipation measures to improve their heat dissipation capacity, reduce localized temperatures, and avoid hot spots.

[0003] Therefore, how to set the position of hardware modules in the terminal to achieve optimal hot layout is an urgent problem to be solved. Summary of the Invention

[0004] To overcome the problems existing in the related technologies, this disclosure provides a hardware module layout method, apparatus, and storage medium.

[0005] According to a first aspect of the present disclosure, a hardware module layout method is provided, applied to a terminal, the method comprising:

[0006] Determine the touch frequency of each touch position on the terminal's touchscreen;

[0007] Determine the heat distribution of the hardware module mapped onto the touch screen when the layout position is set, wherein the heat distribution includes the heat value of each touch position;

[0008] Based on the touch frequency of each touch position and the heat distribution, the heat perception value of the hardware module corresponding to the set layout position is obtained, wherein the heat perception value is negatively correlated with the heat value;

[0009] Using the set layout position as a variable and maximizing the heat perception value as the objective function, iterative calculations are performed until the objective function converges to obtain the optimal layout position of the set layout position.

[0010] In some possible implementations, the heat perception value of the hardware module corresponding to the set layout position is obtained based on the touch frequency of each touch position and the heat distribution, including:

[0011] The touch frequency of each touch position and the heat distribution are superimposed to obtain the heat superposition information of each touch position;

[0012] Based on the heat accumulation information of each touch position and the preset heat sensing function, the heat sensing value of the hardware module corresponding to the set layout position is obtained.

[0013] In some possible implementations, the touch frequency of each touch location and the heat distribution are superimposed to obtain heat superposition information for each touch location, including:

[0014] The touch frequency and heat distribution of each touch position are normalized respectively;

[0015] The normalized touch frequencies and the normalized heat distribution of each touch position are superimposed according to a preset weighting ratio to obtain the heat superposition information of each touch position.

[0016] In some possible implementations, the method further includes:

[0017] The heat sensing function is negatively correlated with the heat superposition information of each touch position;

[0018] The heat sensing function and the heat superposition information of each touch position are negatively correlated in the set direction and the attenuation value meets the set attenuation degree.

[0019] Alternatively, the heat sensing function is negatively correlated with the heat superposition information of each touch position, and negatively correlated with the attenuation value of the heat superposition information of each touch position in a set direction that meets a set attenuation degree.

[0020] In some possible implementations, the method further includes:

[0021] The set direction is one of the following:

[0022] maximum gradient direction

[0023] The direction parallel to the first side of the touch screen

[0024] The direction parallel to the second side of the touch screen

[0025] The direction forms a set angle with the first side of the touch screen.

[0026] The direction forms a set angle with the second side of the touchscreen;

[0027] The second side is adjacent to the first side.

[0028] In some possible implementations, the touch frequency of each touch position is represented by a touch frequency contour map, and the heat distribution is represented by a heat value contour map. Then, the heat superposition information of each touch position is represented by a heat superposition contour map.

[0029] Based on the heat accumulation information of each touch position and a preset heat sensing function, the heat sensing value of the hardware module corresponding to the set layout position is obtained, including:

[0030] Based on the heat accumulation contour map corresponding to the heat accumulation information of each touch position, obtain the height value of each contour line in the heat accumulation contour map and the width value corresponding to each height value;

[0031] The ratio of the height heat generation ratio coefficient to each height value and the ratio of the width heat generation ratio coefficient to each width value are obtained respectively. The sum of the obtained ratios is used as the heat generation sensing value of the hardware module at the set layout position.

[0032] According to a second aspect of the present disclosure, a hardware module layout apparatus is provided, applied to a terminal, the apparatus comprising:

[0033] The first determining module is configured to determine the touch frequency of each touch position in the touch screen of the terminal;

[0034] The second determining module is configured to determine the heat distribution of the hardware module mapped onto the touch screen when the layout position is set, wherein the heat distribution includes the heat value of each touch position;

[0035] The first calculation module is configured to obtain the heat perception value of the hardware module at the set layout position based on the touch frequency of each touch position and the heat distribution, wherein the heat perception value is negatively correlated with the heat value;

[0036] The second calculation module is configured to perform iterative calculations using the set layout position as a variable and maximizing the heat perception value as the objective function until the objective function converges, thereby obtaining the optimal layout position of the set layout position.

[0037] In some possible implementations, the first computing module includes:

[0038] The overlay processing unit is configured to overlay the touch frequency of each touch position and the heat distribution to obtain heat overlay information of each touch position;

[0039] The processing unit is configured to obtain the heat sensing value of the hardware module at the set layout position based on the heat superposition information of each touch position and a preset heat sensing function.

[0040] In some possible implementations, the overlay processing unit includes:

[0041] The normalization processing unit is configured to normalize the touch frequency and the heat distribution of each touch position respectively;

[0042] The weighted overlay unit is configured to overlay the normalized touch frequency and the normalized heat distribution of each touch position according to a preset weighting ratio to obtain the heat overlay information of each touch position.

[0043] In some possible implementations, the heat sensing function is negatively correlated with the heat superposition information of each touch position;

[0044] The heat sensing function and the heat superposition information of each touch position are negatively correlated in the set direction and the attenuation value meets the set attenuation degree.

[0045] Alternatively, the heat sensing function is negatively correlated with the heat superposition information of each touch position, and negatively correlated with the attenuation value of the heat superposition information of each touch position in a set direction that meets a set attenuation degree.

[0046] In some possible implementations, the setting direction is one of the following:

[0047] maximum gradient direction

[0048] The direction parallel to the first side of the touch screen

[0049] The direction parallel to the second side of the touch screen

[0050] The direction forms a set angle with the first side of the touch screen.

[0051] The direction forms a set angle with the second side of the touchscreen;

[0052] The second side is adjacent to the first side.

[0053] In some possible implementations, the touch frequency of each touch position is represented by a touch frequency contour map, the heat distribution is represented by a heat value contour map, and the heat superposition information of each touch position is represented by a heat superposition contour map.

[0054] The computing unit is further configured to obtain the height value of each contour line and the width value corresponding to each height value in the heat superposition contour map based on the heat superposition contour map corresponding to the heat superposition information of each touch position; obtain the ratio of the height heat ratio coefficient to each height value and the ratio of the width heat ratio coefficient to each width value respectively, and sum the obtained ratios as the heat perception value of the hardware module at the set layout position.

[0055] According to a third aspect of the present disclosure, a layout apparatus for a hardware module is provided, comprising:

[0056] processor;

[0057] Memory used to store processor-executable instructions;

[0058] The processor is configured to perform a layout method for a hardware module as described in any of the first aspects of the disclosed exemplary embodiments.

[0059] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium is provided, wherein when instructions in the storage medium are executed by a processor of a terminal, the terminal is enabled to perform a layout method of a hardware module as described in any of the first aspects of the disclosed exemplary embodiments.

[0060] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: they can comprehensively consider the heat generation capacity of the hardware module itself and the touch frequency of different positions on the touch screen in actual use to obtain a better layout position of the hardware module, improve the reliability of the hardware module layout, and automatically optimize and determine the optimal layout position of the hardware module, thereby improving the efficiency of the hardware module layout.

[0061] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0062] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0063] Figure 1 This is a flowchart illustrating a layout method for a hardware module according to an exemplary embodiment;

[0064] Figure 2 This is a schematic diagram of a touch frequency contour plot shown according to an exemplary embodiment;

[0065] Figure 3 This is a schematic diagram of a contour plot of heat characterization values ​​according to an exemplary embodiment;

[0066] Figure 4 This is a structural diagram of a layout device for a hardware module according to an exemplary embodiment;

[0067] Figure 5 This is a structural diagram illustrating a layout device for a hardware module according to an exemplary embodiment. Detailed Implementation

[0068] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0069] Given that users interact with the screen at different frequencies during daily use (including tapping, swiping, etc.), this disclosure constructs areas with higher touch frequencies based on big data of touchscreen usage. It also considers the heat dissipation capacity of the hardware and constructs a heat distribution mapping of the hardware modules onto the touchscreen. Based on the touch area of ​​the touchscreen and the heat distribution mapping of the hardware modules onto the touchscreen, an optimal thermal layout scheme is achieved.

[0070] In an exemplary embodiment of this disclosure, a hardware module layout method is provided, which is applied to a terminal, including electronic devices with screen display and touch functions such as mobile phones, tablets, and smart wearable devices. Figure 1 This is a flowchart illustrating a layout method for a hardware module according to an exemplary embodiment, such as... Figure 1 As shown, the hardware module layout method includes steps S101 to S104:

[0071] Step S101: Determine the touch frequency of each touch position on the terminal's touchscreen;

[0072] Step S102: Determine the heat distribution of the hardware module mapped onto the touch screen when setting the layout position, wherein the heat distribution includes the heat value of each touch position;

[0073] Step S103: Based on the touch frequency of each touch position and the heat distribution, obtain the heat perception value of the hardware module corresponding to the set layout position, wherein the heat perception value is negatively correlated with the heat value;

[0074] Step S104: Using the set layout position as a variable and maximizing the heat perception value as the objective function, perform iterative calculations until the objective function converges to obtain the optimal layout position of the set layout position.

[0075] In step S101, the terminal can be a terminal of a set type. Terminals of a set type are categorized into different types based on their physical specifications. These physical specifications include at least one of the following: overall terminal size, touchscreen screen size, touchscreen aspect ratio, terminal thickness, form factor, and weight. For example, based on overall size, terminals can be categorized as 6.5 inches and 8 inches; based on screen size, as 6.3 inches and 7 inches; based on aspect ratio, as 4:3 and 16:9; based on thickness, as 8–8.5 mm and 8.5–9 mm; based on form factor, as curved and flat; and based on weight, as 190g±5g and 200±5g. When setting the terminal type based on these specifications, only one parameter may be considered, or two or more parameters may be used in combination.

[0076] The layout of different hardware modules in terminals with different configuration types is also different. Therefore, terminals are divided into different configuration types, and the layout of hardware modules is determined according to the configuration type of the terminal, so that the final calculated optimal layout position is more accurate.

[0077] In step S101, each touch position in the touch screen can be a touch unit in the touch screen. A coordinate system can be set in the touch screen according to actual needs, and the position coordinates of the touch unit can be obtained accordingly.

[0078] There are two methods for representing touch frequency in touch coordinates:

[0079] The hardware module in step S102 can be a hardware module with a heat dissipation capacity greater than a set value, such as: CPU, baseband chip, radio frequency antenna transmitter chip, speaker driver chip, etc.

[0080] The heat dissipation capability of a hardware module refers to the heat dissipation capability of each hardware module in its operating mode. The heat distribution mapped onto the touchscreen can be the heat values ​​of the hardware modules mapped to various touch positions on the touchscreen in their normal operating mode.

[0081] The touch frequency of each touch position on the touch screen in step S101 can be represented by a contour plot. Figure 2 This is a schematic diagram of a contour plot of touch frequency according to an exemplary embodiment, such as... Figure 2 As shown, touch coordinates on the same contour line have the same touch frequency, meaning the number of touches within a set time is the same. The values ​​represented by the contour lines gradually increase from the edge of the touchscreen to the middle of the touchscreen, and the highest touch frequency point is called the peak point of the contour line.

[0082] The heat distribution on the touchscreen in step S102 can also be represented by a contour map. Figure 3 This is a schematic diagram of a contour plot of heat values ​​on a touchscreen, according to an exemplary embodiment, such as... Figure 3 As shown, the values ​​represented by the contour lines gradually increase from the edge of the touchscreen to the center, with the highest heat value being the peak point of the contour lines.

[0083] In one possible implementation, step S103, based on the touch frequency of each touch position and the heat distribution, obtains the heat perception value of the hardware module corresponding to the set layout position, including:

[0084] Step S103A: The touch frequency of each touch position and the heat distribution are superimposed to obtain the heat superposition information of each touch position;

[0085] Step S103B: Based on the heat accumulation information of each touch position and the preset heat sensing function, obtain the heat sensing value of the hardware module corresponding to the set layout position.

[0086] In one possible implementation, the method in step S103A of superimposing the touch frequency of each touch position and the heat distribution to obtain the heat superposition information of each touch position includes:

[0087] S103A-1, the touch frequency and heat distribution of each touch position are normalized respectively.

[0088] Normalization is a dimensionless data processing method that facilitates subsequent operations on different types of data.

[0089] When performing normalization, you can use the maximum value among multiple values, the current value, a linear function, or the logarithmic result. Different normalization methods have different effects, and you can use different normalization methods according to different processing needs.

[0090] In one example, the touch frequencies at each touch location are normalized by setting the highest frequency value to 1. Based on the ratio of the highest frequency value to 1, the data in the first information is converted into the corresponding normalized value. The second information is also normalized by setting the highest heat index value to 1. Based on the ratio of the highest heat index value to 1, the data in the second information is converted into the corresponding normalized value. The normalized data can then be directly superimposed to obtain the data for the third information.

[0091] S103A-2, the normalized touch frequency of each touch position and the normalized heat distribution are superimposed according to a preset weighting ratio to obtain the heat superposition information of each touch position.

[0092] The preset weighting ratio can be set according to usage requirements. For example, for the optimal layout position of the hardware module, if more attention is paid to the impact of touch frequency, the weighting ratio corresponding to touch frequency can be set to be larger. If more attention is paid to the impact of heat value, the weighting ratio corresponding to heat distribution can be set to be larger. This embodiment does not impose any restrictions on this. The final optimal layout position of the hardware module takes into account the impact of touch frequency and heat distribution.

[0093] The heat sensing function in step S103B satisfies one of the following:

[0094] First, the heat sensing function and the heat superposition information of each touch position are negatively correlated;

[0095] Second, the heat sensing function and the heat superposition information of each touch position are negatively correlated in the set direction and the attenuation value meets the set attenuation degree.

[0096] Third, the heat sensing function is negatively correlated with the heat superposition information of each touch position, and is also negatively correlated with the attenuation value of the heat superposition information of each touch position in a set direction that meets the set attenuation degree.

[0097] The set direction is one of the following: the maximum gradient direction, the direction parallel to the first side of the touch screen, the direction parallel to the second side of the touch screen, the direction forming a set angle with the first side of the touch screen, and the direction forming a set angle with the second side of the touch screen; wherein the second side is adjacent to the first side.

[0098] In some possible implementations, the touch frequency of each touch position in steps S101 and S103 is represented by a touch frequency contour map, and the heat distribution in steps S102 and S103 is represented by a heat value contour map. Therefore, the heat superposition information of each touch position is represented by a heat superposition contour map. Thus, in step S103B, based on the heat superposition information of each touch position and a preset heat sensing function, the heat sensing value of the hardware module corresponding to the set layout position is obtained, including:

[0099] S103B-1, Based on the heat superposition contour map corresponding to the heat superposition information of each touch position, obtain the height value of each contour line in the heat superposition contour map and the width value corresponding to each height value.

[0100] In the overlay contour map, the height value of each contour line can be the height value of all contour lines in the overlay contour map, or it can be the highest N height values, where N is an integer greater than zero, such as N being 3, 4, 5, etc.

[0101] The width corresponding to the height value is information such as the width in the direction of maximum height or fixed in the x-axis or y-axis direction. It can also be the attenuation value of the height value in a set direction that conforms to a set attenuation degree. For example, the attenuation degree is set to -3dB.

[0102] S103B-2, respectively obtain the ratio of the height heat generation ratio coefficient to each height value, and the ratio of the width heat generation ratio coefficient to each width value, and sum the obtained ratios as the heat generation sensing value of the hardware module at the set layout position.

[0103] In one example, taking three height values ​​and three width values ​​in a heat overlay contour map as an example, for instance, H1, H2, and H3 represent successively decreasing heat values, and W1, W2, and W3 represent the corresponding heat values ​​attenuated according to a set attenuation rate in a set direction, then the calculation function for the heat perception value can be expressed as:

[0104] f(x,y)=m1 / H1+m2 / H2+m3 / H3+n1 / W1+n2 / W2+n3 / W3

[0105] Where (x,y) represents the set layout position of the hardware module, m1, m2, and m3 correspond to the height heat generation ratio coefficients, and n1, n2, and n3 correspond to the width heat generation ratio coefficients, all of which are empirical values.

[0106] In some implementations, the calculation function for the heat sensing value may only consider the height value of each contour line in the heat overlay contour map, or only consider the width value corresponding to the height value of each contour line in the heat overlay contour map.

[0107] Furthermore, step S104 can be completed through an optimization algorithm. For example, the objective function is to maximize the heat perception value f(x,y), and the layout position (x,y) of the hardware module is used as the variable. Iterative calculations are performed until convergence or the iteration stopping condition is met. Finally, the (x,y) at the point of convergence or when the iteration stopping condition is met is the optimal layout position of the hardware module.

[0108] Among them, the optimization algorithm is the swarm intelligence optimization algorithm. The swarm intelligence optimization algorithm is an algorithm that uses various random factors combined with metaheuristic rules to find the optimal solution globally, including genetic algorithms, particle swarm optimization, simulated annealing, etc.

[0109] For example, maximizing the heat perception value can be used as the objective function in the algorithm. The initial layout position of the hardware module in the terminal and the heat perception value of each touch position are input into the algorithm to obtain the layout position predicted for the first time. The heat perception value of each touch position is updated using the layout position predicted for the first time. The layout position predicted for the first time and the updated heat perception value of each touch position are input into the algorithm. This process is repeated multiple times until the objective function converges and the optimal layout position is obtained.

[0110] In addition, in this embodiment of the present disclosure, the position layout can be performed not only for one hardware module, but also for multiple hardware modules at the same time. In this case, a heat value contour map can be generated based on the heat distribution of multiple hardware modules. This heat value contour map is superimposed with the touch frequency contour map to obtain a heat superimposed contour map. Iterative calculations are then performed to comprehensively consider the heat distribution of these multiple hardware modules and the touch frequency of each touch position in the touch screen, thereby obtaining the optimal layout position of these multiple hardware modules at the same time.

[0111] In the exemplary embodiments of this disclosure, the optimal layout position can be obtained by comprehensively considering the heat generation capacity of the hardware module itself and the touch frequency of different parts of the touch screen in actual use, which can minimize the occurrence of terminal heat generation problems.

[0112] In the exemplary embodiments of this disclosure, Figure 4 This is a structural diagram illustrating a layout arrangement of a hardware module according to an exemplary embodiment, such as... Figure 4 As shown, the device includes:

[0113] First determining module 401: configured to determine the touch frequency of each touch position in the touch screen of the terminal;

[0114] The second determining module 402 is configured to determine the heat distribution of the hardware module mapped onto the touch screen when the layout position is set, wherein the heat distribution includes the heat value of each touch position;

[0115] The first calculation module 403 is configured to obtain the heat perception value of the hardware module at the set layout position based on the touch frequency of each touch position and the heat distribution, wherein the heat perception value is negatively correlated with the heat value;

[0116] The second calculation module 404 is configured to perform iterative calculations using the set layout position as a variable and the maximization of the heat perception value as the objective function until the objective function converges, thereby obtaining the optimal layout position of the set layout position.

[0117] In some possible implementations, the first computing module 403 includes:

[0118] The overlay processing unit is configured to overlay the touch frequency of each touch position and the heat distribution to obtain heat overlay information of each touch position;

[0119] The processing unit is configured to obtain the heat sensing value of the hardware module at the set layout position based on the heat superposition information of each touch position and a preset heat sensing function.

[0120] In some possible implementations, the overlay processing unit includes:

[0121] The normalization processing unit is configured to normalize the touch frequency and the heat distribution of each touch position respectively;

[0122] The weighted overlay unit is configured to overlay the normalized touch frequency and the normalized heat distribution of each touch position according to a preset weighting ratio to obtain the heat overlay information of each touch position.

[0123] In some possible implementations, the heat sensing function is negatively correlated with the heat superposition information of each touch position;

[0124] The heat sensing function and the heat superposition information of each touch position are negatively correlated in the set direction and the attenuation value meets the set attenuation degree.

[0125] Alternatively, the heat sensing function is negatively correlated with the heat superposition information of each touch position, and negatively correlated with the attenuation value of the heat superposition information of each touch position in a set direction that meets a set attenuation degree.

[0126] In some possible implementations, the setting direction is one of the following:

[0127] maximum gradient direction

[0128] The direction parallel to the first side of the touch screen

[0129] The direction parallel to the second side of the touch screen

[0130] The direction forms a set angle with the first side of the touch screen.

[0131] The direction forms a set angle with the second side of the touchscreen;

[0132] The second side is adjacent to the first side.

[0133] In some possible implementations, the touch frequency of each touch position is represented by a touch frequency contour map, the heat distribution is represented by a heat value contour map, and the heat superposition information of each touch position is represented by a heat superposition contour map.

[0134] The computing unit is further configured to obtain the height value of each contour line and the width value corresponding to each height value in the heat superposition contour map based on the heat superposition contour map corresponding to the heat superposition information of each touch position; obtain the ratio of the height heat ratio coefficient to each height value and the ratio of the width heat ratio coefficient to each width value respectively, and sum the obtained ratios as the heat perception value of the hardware module at the set layout position.

[0135] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0136] When the hardware module layout device is a terminal, its structure can also be as follows: Figure 5 As shown. Figure 5 This is a block diagram illustrating a layout device 500 for a hardware module according to an exemplary embodiment. For example, device 500 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0137] Reference Figure 5 The device 500 may include one or more of the following components: a processing component 502, a memory 504, a power supply component 506, a multimedia component 508, an audio component 510, an input / output (I / O) interface 512, a sensor component 514, and a communication component 516.

[0138] Processing component 502 typically controls the overall operation of device 500, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 502 may include one or more processors 520 to execute instructions to complete all or part of the steps of the methods described above. Furthermore, processing component 502 may include one or more modules to facilitate interaction between processing component 502 and other components. For example, processing component 502 may include a multimedia module to facilitate interaction between multimedia component 508 and processing component 502.

[0139] Memory 504 is configured to store various types of data to support the operation of device 500. Examples of this data include instructions for any application or method operating on device 500, contact data, phonebook data, messages, pictures, videos, etc. Memory 504 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0140] Power supply component 506 provides power to various components of device 500. Power supply component 506 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to device 500.

[0141] Multimedia component 508 includes a screen that provides an output interface between the device 500 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 508 includes a front-facing camera and / or a rear-facing camera. When the device 500 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0142] Audio component 510 is configured to output and / or input audio signals. For example, audio component 510 includes a microphone (MIC) configured to receive external audio signals when device 500 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 504 or transmitted via communication component 516. In some embodiments, audio component 510 also includes a speaker for outputting audio signals.

[0143] I / O interface 512 provides an interface between processing component 502 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0144] Sensor assembly 514 includes one or more sensors for providing status assessments of various aspects of device 500. For example, sensor assembly 514 may detect the on / off state of device 500, the relative positioning of components such as the display and keypad of device 500, changes in the position of device 500 or a component of device 500, the presence or absence of user contact with device 500, the orientation or acceleration / deceleration of device 500, and temperature changes of device 500. Sensor assembly 514 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 514 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 514 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0145] Communication component 516 is configured to facilitate wired or wireless communication between device 500 and other devices. Device 500 can access wireless networks based on communication standards, such as WiFi, 4G, or 5G, or combinations thereof. In one exemplary embodiment, communication component 516 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 516 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0146] In an exemplary embodiment, the apparatus 500 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0147] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 504 including instructions, which can be executed by a processor 520 of the device 500 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0148] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0149] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A hardware module layout method, applied to a terminal, characterized in that, The method includes: Determine the touch frequency of each touch position on the terminal's touchscreen; Determine the heat distribution of the hardware module mapped onto the touch screen when the layout position is set, wherein the heat distribution includes the heat value of each touch position; Based on the touch frequency of each touch position and the heat distribution, the heat perception value of the hardware module corresponding to the set layout position is obtained, including: superimposing the touch frequency of each touch position and the heat distribution to obtain the heat superposition information of each touch position; Based on the heat accumulation information of each touch position and the preset heat sensing function, the heat sensing value of the hardware module corresponding to the set layout position is obtained. The heat perception value is negatively correlated with the heat value; Using the set layout position as a variable and maximizing the heat perception value as the objective function, iterative calculations are performed until the objective function converges to obtain the optimal layout position of the set layout position.

2. The method as described in claim 1, characterized in that, The touch frequency and heat distribution of each touch location are superimposed to obtain the heat superposition information of each touch location, including: The touch frequency and heat distribution of each touch position are normalized respectively; The normalized touch frequencies and the normalized heat distribution of each touch position are superimposed according to a preset weighting ratio to obtain the heat superposition information of each touch position.

3. The method as described in claim 1, characterized in that, The method further includes: The heat sensing function is negatively correlated with the heat superposition information of each touch position; The heat sensing function and the heat superposition information of each touch position are negatively correlated in the set direction and the attenuation value meets the set attenuation degree. Alternatively, the heat sensing function is negatively correlated with the heat superposition information of each touch position, and negatively correlated with the attenuation value of the heat superposition information of each touch position in a set direction that meets a set attenuation degree.

4. The method as described in claim 3, characterized in that, The method further includes: The set direction is one of the following: maximum gradient direction The direction parallel to the first side of the touch screen The direction parallel to the second side of the touchscreen The direction forms a set angle with the first side of the touch screen. The direction forms a set angle with the second side of the touchscreen; The second side is adjacent to the first side.

5. The method according to any one of claims 3 to 4, characterized in that, The touch frequency of each touch position is represented by a touch frequency contour map, and the heat distribution is represented by a heat value contour map. Then, the heat superposition information of each touch position is represented by a heat superposition contour map. Based on the heat accumulation information of each touch position and a preset heat sensing function, the heat sensing value of the hardware module corresponding to the set layout position is obtained, including: Based on the heat accumulation contour map corresponding to the heat accumulation information of each touch position, obtain the height value of each contour line in the heat accumulation contour map and the width value corresponding to each height value; Wherein, the width value is the attenuation value of the height value in the set direction that conforms to the set attenuation degree; The ratio of the height heat generation ratio coefficient to each height value and the ratio of the width heat generation ratio coefficient to each width value are obtained respectively. The sum of the obtained ratios is used as the heat generation sensing value of the hardware module at the set layout position.

6. A hardware module layout device, applied to a terminal, characterized in that, The device includes: The first determining module is configured to determine the touch frequency of each touch position in the touch screen of the terminal; The second determining module is configured to determine the heat distribution of the hardware module mapped onto the touch screen when the layout position is set, wherein the heat distribution includes the heat value of each touch position; The first calculation module is configured to obtain the heat perception value of the hardware module at the set layout position based on the touch frequency of each touch position and the heat distribution, wherein the heat perception value is negatively correlated with the heat value; The second calculation module is configured to perform iterative calculations with the set layout position as the variable and the maximization of the heat perception value as the objective function until the objective function converges, thereby obtaining the optimal layout position of the set layout position. The first arithmetic module includes: The overlay processing unit is configured to overlay the touch frequency of each touch position and the heat distribution to obtain heat overlay information of each touch position; The processing unit is configured to obtain the heat sensing value of the hardware module at the set layout position based on the heat superposition information of each touch position and a preset heat sensing function.

7. The apparatus as claimed in claim 6, characterized in that, The overlay processing unit includes: The normalization processing unit is configured to normalize the touch frequency and the heat distribution of each touch position respectively; The weighted overlay unit is configured to overlay the normalized touch frequency and the normalized heat distribution of each touch position according to a preset weighting ratio to obtain the heat overlay information of each touch position.

8. The apparatus as claimed in claim 6, characterized in that, The heat sensing function is negatively correlated with the heat superposition information of each touch position; The heat sensing function and the heat superposition information of each touch position are negatively correlated in the set direction and the attenuation value meets the set attenuation degree. Alternatively, the heat sensing function is negatively correlated with the heat superposition information of each touch position, and negatively correlated with the attenuation value of the heat superposition information of each touch position in a set direction that meets a set attenuation degree.

9. The apparatus as claimed in claim 8, characterized in that, The set direction is one of the following: maximum gradient direction The direction parallel to the first side of the touch screen The direction parallel to the second side of the touchscreen The direction forms a set angle with the first side of the touch screen. The direction forms a set angle with the second side of the touchscreen; The second side is adjacent to the first side.

10. The apparatus according to any one of claims 8 to 9, characterized in that, The touch frequency of each touch position is represented by a touch frequency contour map, the heat distribution is represented by a heat value contour map, and the heat superposition information of each touch position is represented by a heat superposition contour map. The computing unit is further configured to obtain the height value of each contour line in the heat superposition contour map and the width value corresponding to each height value based on the heat superposition contour map corresponding to the heat superposition information of each touch position. Wherein, the width value is the attenuation value of the height value in the set direction that conforms to the set attenuation degree; The computing unit is also configured to obtain the ratio of the height heat generation ratio coefficient to each height value, and the ratio of the width heat generation ratio coefficient to each width value, and to sum the obtained ratios as the heat generation sensing value of the hardware module at the set layout position.

11. A hardware module layout device, characterized in that, include: processor; Memory used to store processor-executable instructions; The processor is configured to execute the layout method of the hardware module as described in any one of claims 1-5.

12. A non-transitory computer-readable storage medium, wherein instructions in the storage medium, when executed by a processor of a terminal, enable the terminal to perform a layout method of a hardware module as described in any one of claims 1-5.

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