Passive induction linkage detection method and apparatus

Abstract

The application discloses a passive induction linkage detection method and device, comprising the following steps: obtaining the identification code of the to-be-detected inductor, obtaining the identification code of each chip in the stress chip set, associating the identification code with each identification code and generating a first mapping table; driving the stress chip set to run through the excitation area of the inductor according to a preset control instruction, and synchronously detecting the excitation signal generated when each chip in the stress chip set is excited; calculating the running track of the stress chip set, obtaining the excitation position of the corresponding chip in the stress chip set when the excitation signal is generated; calculating the distance between the excitation position of each chip and the inductor, the real-time speed of each chip when the chip is excited, and generating the excitation threshold value according to the running track; and loading the excitation threshold value into the corresponding identification code entry in the first mapping table; the excitation threshold value at least includes the excitation range of the installation spacing between the chip and the inductor, and the speed limit range of the chip when running on the track.

Description

Technical Field

[0001] This application relates to the field of passive sensing technology, and more specifically, to a passive sensing linkage detection method and device. Background Technology

[0002] In suspended production systems, the demand for automation is increasing, requiring the use of a large number of sensors and passive chips to detect the position of the carrier, load / query the mounting information, and confirm the process.

[0003] Based on the actual situation of the suspended production system, passive chips are mostly installed on carriers, while sensors are installed at the corresponding nodes of the suspension track to achieve functions such as monitoring the operation of the carriers and online data acquisition. The entire suspended system contains a large number of carriers and sensors, and the passive chips mounted on the carriers are often not of the same type, with certain differences between individuals.

[0004] The current sensor installation and passive chip installation are relatively independent and do not involve linkage detection. As a result, there is no effective reference data after installation. The vehicle and the sensor still need to undergo systematic and repeated debugging to ensure that the function of each node is perfect and reliable, which is a great waste of time, manpower and resources. Summary of the Invention

[0005] To address the aforementioned issues, this application provides a passive sensing linkage detection method and apparatus. This method implements multi-level linkage detection between the sensor and the chip, acquiring effective excitation data. This facilitates the implementation of the sensor and the realization of its corresponding functions, and provides an effective reference basis for system debugging.

[0006] In a first aspect, embodiments of this application provide a passive sensing linkage detection method, the method comprising: Obtain the identification code of the sensor to be tested and the identification code of each chip in the stress chip group, associate the identification code with each of the identification codes and generate a first mapping form; The stress chip group is driven to run according to the preset control command and pass through the excitation area of ​​the sensor, and the excitation signal generated when each chip in the stress chip group is excited is detected synchronously. Calculate the running trajectory of the stress chip group to obtain the excitation position of the corresponding chip in the stress chip group when the excitation signal is generated; Based on the running trajectory, the distance between the excitation position of each chip and the sensor, the real-time speed of each chip when it is excited, and the excitation threshold are generated and loaded into the corresponding fill item in the first mapping form. The excitation threshold includes at least the excitation range of the mounting distance between the chip and the sensor, and the speed limit range of the chip during on-orbit operation.

[0007] Preferably, it also includes pre-setting the distribution of each chip in the stress response chip group, specifically including: Multiple chips are evenly distributed in a ring on the carrier to form the stress chip group. When the stress chip group is driven to rotate, the running trajectory of the chips is a ring trajectory. At least a portion of the chip's running trajectory lies within the excitation region of the sensor, ensuring that the chip and the sensor have basic excitation conditions when the chip rotates.

[0008] Preferably, the step of "obtaining the identification code of the sensor under test and the identification code of each chip in the stress chip group, associating the identification code and each of the identification codes and establishing a first mapping form" specifically includes: Obtain the identification code of the sensor to be tested and the identification code of each chip in the stress chip group; the identification code and the identification code are unique; The identifier code is used as the index item for querying, and the identification code is used as a subordinate option of the identifier code. The first mapping form is then established. Each of the identifier codes in the first mapping form has a filler field to load the activation threshold.

[0009] Preferably, the preset control commands specifically include: A predefined sensor detection command is used to confirm the installation location of the sensor; A predefined startup command is used to drive the stress response chipset to run; Predefine the interval unit and speed adjustment range for first-level speed adjustment; The actual distribution positions of each chip in the stress chip group are pre-recorded; Obtain the actual distribution location of the chip; if the acquisition fails, wait for data entry until the acquisition is successful. The installation position of the sensor is detected, and the initial position of the current stress chip group is adjusted to the installation position of the sensor to complete the initial locking, thereby obtaining the relative positional relationship between each chip and the sensor in the initial state; Execute the forward drive rule in the startup command: drive the stress chip group to rotate forward, adjust the rotation speed of the forward rotation according to the interval unit of the first-level speed adjustment, and after each speed adjustment, the stress chip group rotates at least two revolutions; After completing the forward speed adjustment within the specified speed range, the drive is stopped. Execute the reverse drive rule in the startup command: drive the stress chip group to rotate in the reverse direction, adjust the speed of the reverse rotation according to the interval unit of the first-level speed adjustment, and after each speed adjustment, the stress chip group rotates at least two revolutions; After completing the reverse speed adjustment sequentially within the specified speed range, the drive is stopped. Waiting for the actual distribution location of each chip in the stress chip group to be entered, or continuing to run with the current entered data of the stress chip group.

[0010] Preferably, the "synchronous detection of the excitation signal generated when each chip in the stress chip group is excited" specifically includes: The excitation signal generated by each chip in the stress chip group when it is rotated is detected. The excitation signal is associated with the corresponding chip identification code, and a timestamp is added to each excitation signal; the timestamp is the time when the excitation signal was generated. The signal strength and data integrity of the excitation signal are detected, and the excitation signals with insufficient signal strength or missing data integrity are marked; the unmarked excitation signals are extracted.

[0011] Preferably, the step of "calculating the running trajectory of the stress chip group and obtaining the excitation position of the corresponding chip in the stress chip group when the excitation signal is generated" specifically includes: The running trajectory of the stress chip group is calculated based on its initial position and rotation speed; the running trajectory includes a forward trajectory and a reverse trajectory, and the timeline of the running trajectory is consistent with the timeline of the excitation signal. Obtain the timestamp of the unmarked excitation signal, and extract the excitation position of the chip corresponding to the excitation signal in the running trajectory based on the timestamp; Obtain the reference timestamps when the chip is directly below the sensor's mounting position at each rotation speed; Based on the rotational speed corresponding to each of the reference timestamps, the timestamps of the excitation signals at each rotational speed are sequentially queried, and the runtime difference between the timestamp of the excitation signal and the reference timestamp is calculated; the runtime difference is a vector.

[0012] Preferably, the step of "calculating the distance between the excitation position of each chip and the sensor, and the real-time speed of each chip when it is excited, according to the running trajectory, and generating an excitation threshold, and loading the excitation threshold into the corresponding fill item in the first mapping form" specifically includes: The installation position of the sensor is obtained, and the distance between the excitation position and the installation position of each chip is calculated sequentially based on the excitation position. The excitation range of the installation distance between each chip and the sensor is statistically generated. The extracted unlabeled excitation signals are obtained, and the real-time speed of each chip when it is excited is queried sequentially based on the timestamp of the excitation signals. The speed limit range of each chip during on-orbit operation is statistically generated. The excitation range and speed limit range are integrated and output as the excitation threshold of each chip; Query the first mapping form, and load the excitation threshold into the corresponding sub-option in the first mapping form based on the identification code of each chip; A query connection entry for the database of speed time difference is established under the aforementioned sub-options. The time difference of the sub-options is associated with the corresponding speed and then entered into the database.

[0013] Secondly, embodiments of this application provide a passive sensing linkage detection device, the device comprising: Data mapping module: acquires the identification code of the sensor under test and the identification code of each chip in the stress chipset, associates the identification code with each identification code and generates the first mapping form; Synchronous detection module: Drives the stress chip group to run and pass through the excitation area of ​​the sensor according to the preset control instructions, and synchronously detects the excitation signal generated by each chip in the stress chip group when it is excited; Data processing module: Calculates the running trajectory of the stress chipset and obtains the excitation position of the corresponding chip in the stress chipset when the excitation signal is generated; Threshold output module: Calculates the distance between the excitation position of each chip and the sensor, and the real-time speed of each chip when it is excited, according to the running trajectory. It also generates the excitation threshold and loads the excitation threshold into the corresponding fill item in the first mapping form. The excitation threshold includes at least the excitation range of the mounting distance between the chip and the sensor, and the speed limit range of the chip during on-orbit operation.

[0014] Thirdly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the method provided as in the first aspect or any possible implementation of the first aspect.

[0015] Fourthly, embodiments of this application provide a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the method provided as in the first aspect or any possible implementation thereof.

[0016] The beneficial effects of this invention are as follows: This invention relates to a passive sensing linkage detection method and device, which links the detection of the quality of sensors and chips, and distinguishes the differences between individuals by the difference data between each sensor and chip, which is beneficial to the on-orbit installation of sensors and the effective implementation of high-precision operations.

[0017] By repeatedly detecting and activating data through speed adjustments, the differential data from each sensor during system debugging provides a basic reference for the effective implementation of automated operation of the entire suspension system, saving time, manpower, and resources. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A flowchart illustrating a passive sensing linkage detection method provided in an embodiment of this application; Figure 2 A schematic diagram of the structure of a passive sensing linkage detection device provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 4 This is a schematic diagram of the main body of a linkage detection device provided in an embodiment of this application; Figure 5 This is a schematic diagram of the internal structure of a linkage detection device provided in an embodiment of this application; Figure 6 This is a schematic diagram of the carrier plate distribution of a linkage detection device provided in an embodiment of this application. Detailed Implementation

[0020] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0021] In the following description, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The following description provides multiple embodiments of this application, which can be substituted or combined with each other. Therefore, this application can also be considered to include all possible combinations of the same and / or different embodiments described. Thus, if one embodiment includes features A, B, and C, and another embodiment includes features B and D, then this application should also be considered to include embodiments containing one or more other possible combinations of A, B, C, and D, even if such embodiments are not explicitly described in the following text.

[0022] The following description provides examples and does not limit the scope, applicability, or examples set forth in the claims. Changes may be made to the function and arrangement of the described elements without departing from the scope of this application. Various processes or components may be appropriately omitted, substituted, or added to the examples. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Furthermore, features described with respect to some examples may be combined into other examples.

[0023] See Figure 1 , Figure 1 This is a schematic flowchart illustrating a passive sensing linkage detection method provided in an embodiment of this application. In this embodiment, the method includes: S101. Obtain the identification code of the sensor to be tested and the identification code of each chip in the stress chip group, associate the identification code with each of the identification codes and generate a first mapping form.

[0024] The implementing entity of this application can be a passive chip and sensor linkage detection device, which achieves linkage detection by driving the passive chip to rotate repeatedly through the excitation area of ​​the sensor. The basic implementation structure can be found in [reference needed]. Figure 4-6 The system mainly includes a support frame 1, a control box 2, a carrier plate 3, a carrier board 4, a drive motor 5, and a mounting bracket 6. The carrier board 4 is built into the support frame 1. The carrier plate 3 and the drive motor 5 are respectively located on the upper and lower sides of the carrier board 4. The output shaft of the drive motor 5 passes through the carrier board 4 and is fixed to the carrier plate 3 to drive the carrier plate 3 and realize the rotation of the carrier plate 3. The carrier plate 3 has mounting positions 31 for mounting the stress chip group. Multiple mounting positions 31 are evenly distributed in a ring, and each mounting position 31 is equipped with a chip 8. The rotation trajectory of the mounting position 31 is located directly below the mounting bracket 6. The mounting bracket 6 is equipped with a clamping device 7 for clamping, snapping, or installing sensors. The control box 2 includes at least a display screen 21 and a button assembly 22 to realize basic control operations, including data input, start and stop control, etc.

[0025] In this application, the chips in the stress chip group can be of different types or of the same type, as long as they have a unique identification code; for chips of different types, comparative data can be obtained; for chips of the same type, the impact of process defects of individual chips can be reduced.

[0026] Based on the actual situation, the trajectory of the vehicle in orbit has certain curves, descents and ascents. It is not completely straight relative to the sensor, which makes the relative positional relationship between the sensor and the chip slightly complicated. Conventional reciprocating detection methods differ from the actual situation. This application uses a turntable as a carrier to simulate the in-orbit operation situation more realistically.

[0027] In the embodiments of this application, the distribution of each chip in the stress-relief chip group can be preset, that is, mounting positions are created on the carrier disk as needed. Multiple chips are evenly distributed in a ring on the carrier to form a stress-relief chip group. When the stress-relief chip group is driven to rotate, the running trajectory of the chips is a ring trajectory. At least a portion of the chip's running trajectory is located in the excitation area of ​​the sensor, so that the chip and the sensor have basic excitation conditions when rotating. It can be understood that the chip can be driven to rotate multiple times and repeatedly pass through the excitation area of ​​the sensor multiple times to achieve data acquisition, thereby improving the validity and authenticity of the data.

[0028] In the embodiments of this application, step S101 specifically includes: Obtain the identification code of the sensor to be tested and the identification code of each chip in the stress chip group; the identification code and the identification code are unique; The identifier code is used as the index item for querying, and the identification code is used as a subordinate option of the identifier code. The first mapping form is then established. Each of the identifier codes in the first mapping form has a filler field to load the activation threshold.

[0029] In this application, the identifier and identification code are unique and can be customized according to the type of sensor and chip to facilitate the establishment of each associated item in the first mapping form. For example, the index item corresponds to the sensor, and the subordinate options correspond to the chip. Each sensor can correspond to several types of passive chips for linkage detection.

[0030] In one specific embodiment, each sub-option in the first mapping form can be equipped with a filler field, which is in an empty state, to load the excitation threshold. When it is necessary to query or retrieve the corresponding linkage detection data, the sensor's identification code can be used as the first index, and then the corresponding chip's identification code can be selected from the sub-options to obtain the corresponding linkage detection data.

[0031] Understandably, based on the query call of the first mapping form, a database of rotational speed time difference can also be established to record the corresponding original experimental data, and a database call interface can be established in the subordinate options of the first mapping form to facilitate direct query and call.

[0032] S102. Drive the stress chip group to run and pass through the excitation area of ​​the sensor according to the preset control command, and synchronously detect the excitation signal generated when each chip in the stress chip group is excited.

[0033] In this embodiment, the control commands required for the preset linkage detection include adjustments to the rotation speed and direction of the carrier disk. The rotation speed limit range can be set according to industry standard parameters. Through the linkage detection method of this application, the specific experimental parameters under the node rotation speed limit are obtained to ensure that the functional requirements of the node are stably realized.

[0034] In one possible implementation, the preset control command specifically includes: A predefined sensor detection command is used to confirm the installation location of the sensor; A predefined startup command is used to drive the stress response chipset to run; Predefine the interval unit and speed adjustment range for first-level speed adjustment; The actual distribution positions of each chip in the stress chip group are pre-recorded; Obtain the actual distribution location of the chip; if the acquisition fails, wait for data entry until the acquisition is successful. The installation position of the sensor is detected, and the initial position of the current stress chip group is adjusted to the installation position of the sensor to complete the initial locking, thereby obtaining the relative positional relationship between each chip and the sensor in the initial state; Execute the forward drive rule in the startup command: drive the stress chip group to rotate forward, adjust the rotation speed of the forward rotation according to the interval unit of the first-level speed adjustment, and after each speed adjustment, the stress chip group rotates at least two revolutions; After completing the forward speed adjustment within the specified speed range, the drive is stopped. Execute the reverse drive rule in the startup command: drive the stress chip group to rotate in the reverse direction, adjust the speed of the reverse rotation according to the interval unit of the first-level speed adjustment, and after each speed adjustment, the stress chip group rotates at least two revolutions; After completing the reverse speed adjustment sequentially within the specified speed range, the drive is stopped. Waiting for the actual distribution location of each chip in the stress chip group to be entered, or continuing to run with the current entered data of the stress chip group.

[0035] Understandably, the execution of control commands can be manually triggered by staff.

[0036] Understandably, the installation position of the sensor is fixed, but multiple sensors can be set. When performing linkage detection, the chip distribution and sensor position should be clearly identified first, so as to calculate the relative positional relationship between the two. This makes it easier to obtain the actual running trajectory of the chip based on the rotation speed and correlate the real-time position of the chip with the excitation time of the signal.

[0037] Understandably, the interval unit is a fixed value, and each time the speed is adjusted, only one interval unit is adjusted. For example, when rotating forward, the speed can be adjusted from low to high; when rotating in reverse, the speed can be adjusted from high to low. At least two revolutions are required at each speed to acquire two excitation signals, providing redundant data.

[0038] When recording the actual position of the chip on the carrier disk, the recording can be based on the number of the carrier position; the drive motor can be set to an initial position so that the carrier disk also has an initial position, thereby determining the relative position of the chip and the sensor.

[0039] In the embodiments of this application, when executing control commands, the excitation signals generated when each chip in the stress chip group is excited are synchronously detected, specifically including: The excitation signal generated by each chip in the stress chip group when it is rotated is detected. The excitation signal is associated with the corresponding chip identification code, and a timestamp is added to each excitation signal; the timestamp is the time when the excitation signal was generated. The signal strength and data integrity of the excitation signal are detected, and the excitation signals with insufficient signal strength or missing data integrity are marked; the unmarked excitation signals are extracted.

[0040] Understandably, when an excitation signal is detected, a timestamp is added to clarify the time when the excitation signal was generated; furthermore, the data integrity and signal strength of the excitation signal are detected to ensure that data interaction can be effectively implemented.

[0041] Excitation signals with insufficient signal strength or missing data are marked and no longer included in the data statistics; they can be archived. Unmarked excitation signals are included in the data statistics.

[0042] Thus, the excitation signals of each chip at various speeds were initially screened, and the data that remained were all reliable and valid. Based on this data, statistical analysis and calculations were performed to derive the corresponding parameter ranges and patterns, which have practical reference value.

[0043] S103. Calculate the running trajectory of the stress chip group and obtain the excitation position of the corresponding chip in the stress chip group when the excitation signal is generated.

[0044] In the embodiments of this application, the running trajectory of each chip can be calculated based on the initial position and rotation speed of the stress chip group, and the relative positional relationship between each chip and the sensor is determined based on the timeline; therefore, when the excitation signal is detected, the position of the chip is also determined, i.e., the excitation position.

[0045] Based on practical considerations, the position of the chip directly below the sensor can be used as the standard position for generating the excitation signal. By comparing this position with the actual detected excitation position, the corresponding runtime difference (excitation delay) can be calculated. It is understood that there should be significant differences in excitation delay at different rotational speeds, and the data obtained in this application during multi-level rotational speed adjustments should exhibit these differences.

[0046] In one possible implementation, step S103 specifically includes: The running trajectory of the stress chip group is calculated based on its initial position and rotation speed; the running trajectory includes a forward trajectory and a reverse trajectory, and the timeline of the running trajectory is consistent with the timeline of the excitation signal. Obtain the timestamp of the unmarked excitation signal, and extract the excitation position of the chip corresponding to the excitation signal in the running trajectory based on the timestamp; Obtain the reference timestamps when the chip is directly below the sensor's mounting position at each rotation speed; Based on the rotational speed corresponding to each of the reference timestamps, the timestamps of the excitation signals at each rotational speed are sequentially queried, and the runtime difference between the timestamp of the excitation signal and the reference timestamp is calculated; the runtime difference is a vector.

[0047] In the embodiments of this application, a unified timeline is used to mark timestamps, and the time when the chip reaches the excitation position and the standard position is calculated, thereby obtaining the runtime difference (excitation delay). It is understood that there are at least three possible cases for the excitation position relative to the standard position, and this application uses a vector to represent the difference between the two.

[0048] For data with excessively large differences, it can be considered that the excitation delay is too large, making it unsuitable for process nodes and function implementations that require high precision. The corresponding rotational speed is not recommended for implementation or for the use of this type of sensor in the orbital operation. When the staff conducts systematic debugging, similar situations can be avoided directly.

[0049] In the embodiments of this application, the excitation positions at each rotation speed are extracted sequentially based on the gradient of rotation speed adjustment, and then associated and bound with the corresponding chips. The extraction of excitation positions can include the direction of the running trajectory to form a distinction, so that the excitation positions extracted from the forward trajectory and the reverse trajectory can be mutually verified to determine the validity of the excitation positions.

[0050] S104. Calculate the distance between the excitation position of each chip and the sensor, and the real-time speed of each chip when it is excited, according to the running trajectory. Generate an excitation threshold and load the excitation threshold into the corresponding fill item in the first mapping form.

[0051] In the embodiments of this application, after acquiring the running trajectory of the stress-sensing chipset, the distance between the excitation location and the sensor, and the rotational speed of each chip when it is excited can be obtained. By statistically analyzing the valid data, the corresponding excitation threshold can be obtained. The excitation threshold includes at least the excitation range of the mounting distance between the chip and the sensor, and the speed limit range of the chip during on-orbit operation.

[0052] It is understandable that the distance between the excitation position and the sensor is calculated with the excitation chip as the starting point and the sensor as the ending point; during effective excitation, the forward and reverse rotations can just confirm the corresponding excitation range.

[0053] It is understandable that when extracting the rotational speed during effective excitation, there is no essential difference between the rotational speed values ​​of forward and reverse rotation, and the speed limit range can be directly calculated.

[0054] In one specific embodiment, step S104 specifically includes: The installation position of the sensor is obtained, and the distance between the excitation position and the installation position of each chip is calculated sequentially based on the excitation position. The excitation range of the installation distance between each chip and the sensor is statistically generated. The extracted unlabeled excitation signals are obtained, and the real-time speed of each chip when it is excited is queried sequentially based on the timestamp of the excitation signals. The speed limit range of each chip during on-orbit operation is statistically generated. The excitation range and speed limit range are integrated and output as the excitation threshold of each chip; Query the first mapping form, and load the excitation threshold into the corresponding sub-option in the first mapping form based on the identification code of each chip; A query connection entry for the database of speed time difference is established under the aforementioned sub-options. The time difference of the sub-options is associated with the corresponding speed and then entered into the database.

[0055] In this application, the final output excitation threshold is loaded into the first mapping form and can be indexed according to actual needs. Furthermore, a database of rotational speed time differences can be established, and the data of the runtime difference (excitation delay) at each rotational speed can be associated with the corresponding rotational speed and then entered into the database. A database query connection entry can be established in the subordinate options of the first mapping form.

[0056] In the embodiments of this application, the excitation range and speed limit range can be calculated and statistically determined sequentially based on the adjustment of the rotation speed. The excitation range can be formed by determining two boundary values ​​based on the forward and reverse rotation data.

[0057] The following will be combined with the appendix Figure 2 This application provides a detailed description of the passive sensing linkage detection device provided in its embodiments. It should be noted that the appendix... Figure 2 The passive sensing linkage detection device shown is used to perform the functions described in this application. Figure 1 The methods shown in the embodiments are for illustrative purposes only, illustrating the parts relevant to the embodiments of this application. For specific technical details not disclosed, please refer to this application. Figure 1 The example shown.

[0058] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of a passive sensing linkage detection device provided in an embodiment of this application. Figure 2 As shown, the device includes: Data mapping module 201: acquires the identification code of the sensor under test and the identification code of each chip in the stress chip group, associates the identification code with each identification code and generates the first mapping form; Synchronous detection module 202: Drives the stress chip group to run and pass through the excitation area of ​​the sensor according to the preset control instructions, and synchronously detects the excitation signal generated when each chip in the stress chip group is excited; Data processing module 203: Calculates the running trajectory of the stress chipset, obtains the excitation position of the corresponding chip in the stress chipset when the excitation signal is generated, and calculates the running difference of the chip; Threshold output module 204: Calculates the distance between the excitation position of each chip and the sensor, and the real-time speed of each chip when it is excited, according to the running trajectory, and generates the excitation threshold. The excitation threshold is then loaded into the corresponding fill item in the first mapping form. The excitation threshold includes at least the excitation range of the mounting distance between the chip and the sensor, and the speed limit range of the chip during on-orbit operation.

[0059] Those skilled in the art will clearly understand that the technical solutions of the embodiments of this application can be implemented by means of software and / or hardware. In this specification, "unit" and "module" refer to software and / or hardware that can independently complete or cooperate with other components to complete a specific function, wherein the hardware may be, for example, a field-programmable gate array (FPGA), an integrated circuit (IC), etc.

[0060] Each processing unit and / or module in the embodiments of this application can be implemented by an analog circuit that implements the functions described in the embodiments of this application, or by software that executes the functions described in the embodiments of this application.

[0061] See Figure 3 It shows a schematic diagram of the structure of an electronic device according to an embodiment of this application, which can be used to implement... Figure 1 The method in the illustrated embodiment. (As shown) Figure 3 As shown, the electronic device 300 may include: at least one central processing unit 301, at least one network interface 304, user interface 303, memory 305, and at least one communication bus 302.

[0062] The communication bus 302 is used to enable communication between these components.

[0063] The user interface 303 may include a display screen and a camera. Optionally, the user interface 303 may also include a standard wired interface and a wireless interface.

[0064] The network interface 304 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface).

[0065] The central processing unit 301 may include one or more processing cores. The central processing unit 301 connects to various parts within the electronic device 300 using various interfaces and lines. It executes various functions of the terminal 300 and processes data by running or executing instructions, programs, code sets, or instruction sets stored in the memory 305, and by calling data stored in the memory 305. Optionally, the central processing unit 301 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The central processing unit 301 may integrate one or more of the following: a central processing unit (CPU), a graphics processing unit (GPU), and a modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the content required for display; and the modem handles wireless communication. It is understood that the modem may also be implemented as a separate chip without being integrated into the central processing unit 301.

[0066] The memory 305 may include random access memory (RAM) or read-only memory. Optionally, the memory 305 may include a non-transitory computer-readable storage medium. The memory 305 may be used to store instructions, programs, code, code sets, or instruction sets. The memory 305 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the above-described method embodiments, etc.; the data storage area may store data involved in the above-described method embodiments, etc. Optionally, the memory 305 may also be at least one storage device located remotely from the aforementioned central processing unit 301. Figure 3 As shown, the memory 305, which serves as a computer storage medium, may include an operating system, a network communication module, a user interface module, and program instructions.

[0067] exist Figure 3In the illustrated electronic device 300, the user interface 303 is mainly used to provide an input interface for the user and to acquire user input data; while the central processing unit 301 can be used to call the passive sensing linkage detection application stored in the memory 305 and specifically perform the following operations: Obtain the identification code of the sensor to be tested and the identification code of each chip in the stress chip group, associate the identification code with each of the identification codes and generate a first mapping form; The stress chip group is driven to run according to the preset control command and pass through the excitation area of ​​the sensor, and the excitation signal generated when each chip in the stress chip group is excited is detected synchronously. Calculate the running trajectory of the stress chip group to obtain the excitation position of the corresponding chip in the stress chip group when the excitation signal is generated; Based on the running trajectory, the distance between the excitation position of each chip and the sensor, the real-time speed of each chip when it is excited, and the excitation threshold are generated and loaded into the corresponding fill item in the first mapping form. The excitation threshold includes at least the excitation range of the mounting distance between the chip and the sensor, and the speed limit range of the chip during on-orbit operation.

[0068] This application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-described method. The computer-readable storage medium may include, but is not limited to, any type of disk, including floppy disks, optical disks, DVDs, CD-ROMs, microdrives, as well as magneto-optical disks, ROMs, RAMs, EPROMs, EEPROMs, DRAMs, VRAMs, flash memory devices, magnetic cards or optical cards, nanosystems (including molecular memory ICs), or any type of medium or device suitable for storing instructions and / or data.

[0069] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0070] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0071] In the several embodiments provided in this application, it should be understood that the disclosed apparatus can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some service interface; the indirect coupling or communication connection between devices or units may be electrical or other forms.

[0072] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0073] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0074] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage device (CMD). Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned memory includes various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0075] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, which may include: a flash drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc.

[0076] The foregoing description is merely an exemplary embodiment of this disclosure and should not be construed as limiting the scope of this disclosure. Any equivalent changes and modifications made in accordance with the teachings of this disclosure shall still fall within the scope of this disclosure. Those skilled in the art will readily conceive of embodiments of this disclosure upon considering the specification and practicing the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not described herein. The specification and embodiments are to be considered exemplary only, and the scope and spirit of this disclosure are defined by the claims.

Claims

1. A passive sensing linkage detection method, characterized in that, The method includes: The identification code of the sensor to be tested and the identification code of each chip in the stress chip group are obtained. The identification code is associated with each of the identification codes and a first mapping form is generated. Each identification code in the first mapping form is provided with a fill field to load the excitation threshold. The stress chip group is driven to run according to the preset control command and pass through the excitation area of ​​the sensor, and the excitation signal generated when each chip in the stress chip group is excited is detected synchronously. Calculate the running trajectory of the stress chip group to obtain the excitation position of the corresponding chip in the stress chip group when the excitation signal is generated; Based on the running trajectory, the distance between the excitation position of each chip and the sensor, the real-time speed of each chip when it is excited, and the excitation threshold are generated and loaded into the corresponding fill item in the first mapping form. The excitation threshold includes at least the excitation range of the mounting distance between the chip and the sensor, and the speed limit range of the chip during on-orbit operation.

2. The method according to claim 1, characterized in that, The step of "obtaining the identification code of the sensor to be tested and the identification code of each chip in the stress chip group, associating the identification code and each of the identification codes and establishing a first mapping form" specifically includes: Obtain the identification code of the sensor to be tested and the identification code of each chip in the stress chip group; the identification code and the identification code are unique; The identifier is used as an index item for querying, and the identification code is used as a subordinate option of the identifier to establish the first mapping form.

3. The method according to claim 1, characterized in that, The preset control commands specifically include: A predefined sensor detection command is used to confirm the installation location of the sensor; A predefined startup command is used to drive the stress-relief chipset to run; Predefine the interval unit and speed adjustment range for first-level speed adjustment; The actual distribution positions of each chip in the stress chip group are pre-recorded; Obtain the actual distribution location of the chip; if the acquisition fails, wait for data entry until the acquisition is successful. The installation position of the sensor is detected, and the initial position of the current stress chip group is adjusted to the installation position of the sensor to complete the initial locking, thereby obtaining the relative positional relationship between each chip and the sensor in the initial state; Execute the forward drive rule in the startup command: drive the stress chip group to rotate forward, adjust the rotation speed of the forward rotation according to the interval unit of the first-level speed adjustment, and after each speed adjustment, the stress chip group rotates at least two revolutions; After completing the forward speed adjustment within the specified speed range, the drive is stopped. Execute the reverse drive rule in the startup command: drive the stress chip group to rotate in the reverse direction, adjust the speed of the reverse rotation according to the interval unit of the first-level speed adjustment, and after each speed adjustment, the stress chip group rotates at least two revolutions; After completing the reverse speed adjustment sequentially within the specified speed range, the drive is stopped. Waiting for the actual distribution location of each chip in the stress chip group to be entered, or continuing to run with the current entered data of the stress chip group.

4. The method according to claim 3, characterized in that, The phrase "synchronously detecting the excitation signal generated when each chip in the stress chip group is excited" specifically includes: The excitation signal generated by each chip in the stress chip group when it is rotated is detected. The excitation signal is associated with the corresponding chip identification code, and a timestamp is added to each excitation signal; the timestamp is the time when the excitation signal was generated. The signal strength and data integrity of the excitation signal are detected, and the excitation signals with insufficient signal strength or missing data integrity are marked; the unmarked excitation signals are extracted.

5. The method according to claim 4, characterized in that, The phrase "calculating the operating trajectory of the stress chip group and obtaining the excitation position of the corresponding chip in the stress chip group when the excitation signal is generated" specifically includes: The running trajectory of the stress chip group is calculated based on its initial position and rotation speed; the running trajectory includes a forward trajectory and a reverse trajectory, and the timeline of the running trajectory is consistent with the timeline of the excitation signal. Obtain the timestamp of the unmarked excitation signal, and extract the excitation position of the chip corresponding to the excitation signal in the running trajectory based on the timestamp; Obtain the reference timestamps when the chip is directly below the sensor's mounting position at each rotation speed; Based on the rotational speed corresponding to each reference timestamp, the timestamp of the excitation signal at each rotational speed is sequentially queried, and the runtime difference between the timestamp of the excitation signal and the reference timestamp is calculated.

6. The method according to claim 2, characterized in that, The step of "calculating the distance between the excitation position of each chip and the sensor, and the real-time speed of each chip when it is excited, according to the running trajectory, and generating an excitation threshold, and loading the excitation threshold into the corresponding fill item in the first mapping form" specifically includes: The installation position of the sensor is obtained, and the distance between the excitation position and the installation position of each chip is calculated sequentially based on the excitation position. The excitation range of the installation distance between each chip and the sensor is statistically generated. The extracted unlabeled excitation signals are obtained, and the real-time speed of each chip when it is excited is queried sequentially based on the timestamp of the excitation signals. The speed limit range of each chip during on-orbit operation is statistically generated. The excitation range and speed limit range are integrated and output as the excitation threshold of each chip; The first mapping form is queried, and the excitation threshold is loaded into the corresponding sub-option in the first mapping form based on the identification code of each chip; each sub-option is provided with a fill item for loading the excitation threshold; A query connection entry for the database of speed time difference is established under the aforementioned sub-options. The time difference of the sub-options is associated with the corresponding speed and then entered into the database.

7. A passive sensing linkage detection device, characterized in that, include: Data mapping module: acquires the identification code of the sensor under test and the identification code of each chip in the stress chip group, associates the identification code with each identification code and generates a first mapping form; each identification code in the first mapping form has a fill field to load the excitation threshold; Synchronous detection module: Drives the stress chip group to run and pass through the excitation area of ​​the sensor according to the preset control instructions, and synchronously detects the excitation signal generated by each chip in the stress chip group when it is excited; Data processing module: Calculates the running trajectory of the stress chipset and obtains the excitation position of the corresponding chip in the stress chipset when the excitation signal is generated; Threshold output module: Calculates the distance between the excitation position of each chip and the sensor, and the real-time speed of each chip when it is excited, according to the running trajectory. It also generates the excitation threshold and loads the excitation threshold into the corresponding fill item in the first mapping form. The excitation threshold includes at least the excitation range of the mounting distance between the chip and the sensor, and the speed limit range of the chip during on-orbit operation.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method as described in any one of claims 1-6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method as described in any one of claims 1-6.

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