Method and system for determining shorted locations of coplanar waveguide transmission lines

Abstract

The application discloses a short-circuit position determination method and system of a coplanar waveguide transmission line, a storage medium and an electronic device, and belongs to the technical field of superconducting circuits. The short-circuit position determination method comprises the following steps: acquiring characteristic information of a plurality of positions of a ground clearance, the plurality of positions being distributed along the extension direction of the ground clearance; and determining a short-circuit position electrically connected to the center transmission conductor and the ground according to the fluctuation of the characteristic information. Compared with the prior art, the application can identify the short-circuit defect positions of each coplanar waveguide transmission line on a quantum chip, and can realize rapid positioning, thereby helping to accurately and efficiently implement a repair process for the short-circuit defect.

Description

Technical Field

[0001] This application belongs to the field of superconducting circuits, especially the field of superconducting quantum computing technology. In particular, this application relates to a method, system, storage medium, and electronic device for determining the short-circuit location of a coplanar waveguide transmission line. Background Technology

[0002] The qubit, located on a quantum chip, is the basic unit for performing quantum computing. In superconducting quantum computing systems, various superconducting circuits with different functions exist around the qubit, such as drive control signal lines, flux modulation signal lines, and readout signal lines built based on coplanar waveguide transmission lines. Quantum chips fabricated using current processes often experience unexpected short circuits in the coplanar waveguide transmission lines, causing the entire superconducting circuit to fail to meet design goals. Therefore, it is frequently necessary to repair the short circuit location, but identifying and locating the short circuit is a very challenging problem. Summary of the Invention

[0003] The purpose of this application is to provide a method, system, storage medium, and electronic device for determining the short-circuit location of a coplanar waveguide transmission line, which can identify and determine short-circuit defects in a coplanar waveguide transmission line.

[0004] One embodiment of this application provides a method for determining the short-circuit location of a coplanar waveguide transmission line, wherein the coplanar waveguide transmission line includes a central transmission conductor and grounds located on both sides of the central transmission conductor, and the gap between the central transmission conductor and the grounds is a ground gap. The method for determining the short-circuit location includes:

[0005] The system acquires feature information of multiple locations of the ground gap, the multiple locations being distributed along the extension direction of the ground gap; and determines the short-circuit location of the electrical connection between the central transmission conductor and the ground based on the fluctuation of the feature information.

[0006] In some embodiments of the short-circuit location determination method described above, the step of obtaining feature information of multiple locations of the ground gap includes: providing a substrate on which the coplanar waveguide transmission line is formed, the coplanar waveguide transmission line including the ground gap;

[0007] On the substrate, multiple locations of the ground gap are determined along the extension direction of the ground gap, and the ground gap is scanned to obtain the film thickness at each location.

[0008] In some embodiments of the short-circuit location determination method described above, the step of scanning the ground gap to obtain the film thickness at each location includes: moving a probe along the extension direction of the ground gap in a plane parallel to the coplanar waveguide transmission line and transmitting a probe signal to each location of the ground gap; and determining the film thickness at each location based on the feedback signal of the probe signal at each location.

[0009] In some embodiments of the short-circuit location determination method described above, the step of obtaining feature information of multiple locations of the ground gap includes: generating a photograph of the coplanar waveguide transmission line based on a substrate on which the coplanar waveguide transmission line is formed; performing grayscale processing on the photograph to obtain a comparison photograph; determining multiple locations of the ground gap along the extension direction of the ground gap on the comparison photograph, and obtaining the grayscale value of each location.

[0010] In some embodiments of the short-circuit location determination method described above, the photograph includes at least one of an optical microscope photograph and an electron microscope photograph.

[0011] In some embodiments of the short-circuit location determination method described above, the step of determining multiple locations of the ground gap along the extension direction of the ground gap includes: providing a standard diagram, the standard diagram including a standard transmission line corresponding to the coplanar waveguide transmission line, the standard transmission line including a standard ground gap; determining multiple reference positions on the standard ground gap according to scanning requirements; and determining multiple locations of the ground gap corresponding to the multiple reference positions.

[0012] In some embodiments of the short-circuit location determination method described above, the standard diagram includes at least one of a photograph of a standard chip and a design diagram of a standard chip.

[0013] Another embodiment of this application provides a short-circuit location determination system for a coplanar waveguide transmission line, comprising: an information acquisition module for acquiring feature information of multiple locations of the ground gap, the multiple locations being distributed along the extension direction of the ground gap; and a short-circuit identification module for determining the short-circuit location electrically connecting the central transmission conductor and the ground based on the fluctuation of the feature information.

[0014] A third embodiment of this application provides a storage medium storing a computer program, wherein the computer program is configured to execute the short-circuit location determination method as described above when running.

[0015] A fourth embodiment of this application provides an electronic device including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the short-circuit location determination method as described above.

[0016] Compared with the prior art, the method for determining the short-circuit location of a coplanar waveguide transmission line provided in this application first obtains the feature information of multiple locations distributed along the extension direction of the ground gap, and then determines the short-circuit location of the electrical connection between the central transmission conductor and the ground based on the fluctuation of the feature information. This enables the identification of the short-circuit defect location of each coplanar waveguide transmission line on the quantum chip and enables rapid positioning, thereby helping to accurately and efficiently implement the repair process for the short-circuit defect. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a superconducting circuit prepared in a related technology;

[0018] Figure 2 A flowchart of a method for determining the short-circuit location of a coplanar waveguide transmission line in one embodiment provided in this application;

[0019] Figure 3 This is a schematic diagram of the superconducting circuit in one embodiment of this application;

[0020] Figure 4 A structural diagram of a short-circuit location determination system for a coplanar waveguide transmission line in one embodiment of this application.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1 - First coplanar waveguide transmission line, 11 - First central transmission conductor, 12 - First grounding layer, 111 - First standard area conductor, 112 - Open circuit area conductor, 101 - First standard interval, 102 - First open circuit sensitive interval, 103 - Second open circuit sensitive interval.

[0023] 2 - Second coplanar waveguide transmission line, 21 - Second center transmission conductor, 22 - Second grounding layer, 211 - Second standard area conductor, 212 - Short circuit area conductor, 201 - Second standard interval, 202 - First short circuit sensitive interval, 203 - Second short circuit sensitive interval. Detailed Implementation

[0024] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, one or more embodiments are now described with reference to the accompanying drawings, wherein similar reference numerals are used throughout the text to refer to similar components. In the following description, numerous specific details are set forth for purposes of explanation in order to provide a more thorough understanding of one or more embodiments. However, it will be apparent that one or more embodiments may be practiced in various circumstances without these specific details, and the various embodiments may be combined with and referenced to each other without contradiction.

[0026] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0027] Additionally, it should be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" a substrate, layer (or film), region, and / or pattern, it can be located directly on another layer or substrate, and / or intercalation layers may also be present. Furthermore, it should be understood that when a layer is referred to as being "under" another layer, it can be located directly under that layer, and / or one or more intercalation layers may also be present. Additionally, references to "on" and "under" the layers may be made based on the accompanying drawings.

[0028] Quantum computing is a new discipline that considers computational processes from the perspective of fundamental quantum mechanics principles. The realization of a quantum computer requires qubits (qubits) as basic units that obey the laws of quantum mechanics. A qubit, as a two-level system following the laws of quantum mechanics, can exist in any superposition of 0 and 1 states. Depending on the physical system used to construct the qubit, there are different physical implementation methods. Superconducting quantum chips include qubits and superconducting circuit structures such as microwave resonant cavities. A qubit is a two-level system composed of a capacitor and a Josephson junction with nonlinear inductive properties.

[0029] Various circuit structures with different functions exist around qubits, such as the drive control signal line (xy-control line, also known as the xy control line or pulse modulation signal line) for XY rotation operations on qubits, couplers for inter-qubit coupling, readout resonant cavities coupled to qubits, and readout signal lines coupled to the readout cavities. Additionally, Z-rotation operations on qubits are performed by control signal lines near the superconducting quantum interference device (squid), called flux control signal lines (z-control line, also known as z control line or frequency modulation signal line). These flux control signal lines are positioned near the superconducting quantum interference device (squid) and are excited by current, coupling with the superconducting quantum interference device (squid) through magnetic flux. It should be noted that the readout signal line, flux control signal line, and drive control line are all part of the superconducting circuitry on the quantum chip, generally employing a coplanar waveguide transmission line structure for transmitting microwave signals. The coplanar waveguide transmission line consists of a central transmission conductor and ground planes located on both sides of the central transmission conductor; the gap between the central transmission conductor and the ground planes is called the ground gap.

[0030] Figure 1 This is a schematic diagram of the structure of a superconducting circuit prepared in a related technology.

[0031] Combination Figure 1 As shown, the yield rate of quantum chip fabrication is difficult to reach 100%, and the fabrication process often encounters abnormalities in superconducting circuits, such as open circuits (e.g., Figure 1 The first coplanar waveguide transmission line 1) or short circuit (such as Figure 1 The first coplanar waveguide transmission line 1 is often open-circuited due to discontinuities in the thin film morphology of the first central transmission conductor 11 caused by the fabrication process. Similarly, the second coplanar waveguide transmission line 2 is often short-circuited to ground due to adhesion between the thin film morphology of the second central transmission conductor 21 and ground caused by the fabrication process. These anomalies prevent the control or reading of qubits, significantly impacting the functionality of quantum chips. To ensure the normal functioning of the coplanar waveguide transmission lines, repair processes are often required at the abnormal locations. However, identifying and locating the short-circuit and open-circuit locations is a very challenging problem.

[0032] Methods for determining the location of open circuits in coplanar waveguide transmission lines

[0033] Reference Figure 1 As shown, to address the problem of difficulty in identifying and locating the break point in a coplanar waveguide transmission line, this application provides a method for determining the break point location. The method includes: firstly, acquiring feature information of multiple locations of the central transmission conductor, wherein the multiple locations are distributed along the path direction of the central transmission conductor, such as... Figure 1A first coplanar waveguide transmission line 1 is constructed, where the qubit structure is not shown. Then, based on fluctuations in characteristic information, the break point of the central transmission conductor is determined among the plurality of locations. The fluctuation can be whether the characteristic information is within a preset range, with locations within this range identified as break points; or it can be the magnitude of the difference between the characteristic information at one location and the characteristic information at other locations (e.g., the remaining locations among the plurality of locations, or adjacent locations), with locations where the difference is greater than a preset threshold identified as break points. These steps enable rapid location of the break point, facilitating accurate and efficient implementation of repair processes. The repair process can involve coating the break point; for example, a transmission layer can be formed by depositing superconducting material to cover the break point, allowing the coplanar waveguide transmission line to remain connected.

[0034] In this embodiment, the feature information may be the film thickness and grayscale value of the central transmission conductor at multiple locations. The film thickness can be determined using devices such as a profilometer, ellipsometry, film thickness gauge, profilometer, and AFM. The grayscale value can be determined based on image processing and recognition. It is understood that the feature information of the central transmission conductor at multiple locations is not limited to film thickness and grayscale value; it may also be other feature information that reflects whether the thin film used to form the central transmission conductor has fractured, such as linewidth.

[0035] In practice, this characteristic information at each location can be obtained by scanning the central transmission conductor.

[0036] For example, in a plane parallel to the coplanar waveguide transmission line, a probe is moved along the path of the central transmission conductor and a probe signal is emitted to multiple locations on the central transmission conductor. These multiple locations are the locations where feature information (such as film thickness) needs to be detected and identified. The film thickness at each location is determined based on the feedback signal of the probe signal at each location. The probe signal can be a terahertz signal or a laser signal. Different feedback signals are generated after the probe signal is reflected at different locations. The film thickness at the corresponding location can be obtained by collecting and processing the feedback signal. The probe signal can also be other signals that can realize the detection of thin-film circuit thickness or relative distance changes.

[0037] For example, a photograph of the coplanar waveguide transmission line can be generated based on a substrate on which the coplanar waveguide transmission line is formed; the photograph is then subjected to grayscale processing, i.e., grayscale conversion, to obtain a comparison photograph containing grayscale information; on the comparison photograph, multiple positions of the central transmission conductor are determined along the path direction of the central transmission conductor, and the central transmission conductor is scanned to obtain the grayscale value at each position. The photograph may include at least one of optical microscopy photographs and electron microscopy photographs. Grayscale value is a parameter that measures the brightness of each pixel in a grayscale image. A specific grayscale value range represents the brightness of a certain pixel. For example, 0 to 255 represents a specific grayscale value range, where 0 represents the darkest and 255 represents the brightest, and the larger the grayscale value, the brighter it is. In this embodiment, the grayscale value at each position can be the average of the grayscale values ​​of multiple pixels at the corresponding position.

[0038] Methods for determining the short-circuit location of coplanar waveguide transmission lines

[0039] To address the problem of difficulty in identifying and locating short-circuit locations, another embodiment of this application provides a method for determining the short-circuit location of a coplanar waveguide transmission line. This method can identify and determine the location of short-circuit defects in a coplanar waveguide transmission line, facilitating the implementation of repair processes.

[0040] See Figure 2 and combined Figure 1 As shown, an embodiment of this application provides a method for determining the short-circuit location of a coplanar waveguide transmission line, wherein the coplanar waveguide transmission line includes a center transmission conductor, and the short-circuit location determination method includes the following steps S201 to S202, wherein:

[0041] Step S201: Obtain feature information of multiple locations of the ground clearance, wherein the multiple locations are distributed along the extension direction of the ground clearance, such as... Figure 1 The second coplanar waveguide transmission line 2 in the middle, where the qubit structure is not shown;

[0042] Step S202: Determine the short-circuit location of the electrical connection between the central transmission conductor and the ground based on the fluctuation of the feature information. The fluctuation can be determined by whether the feature information is within a predetermined range, and the location within the predetermined range is determined as the short-circuit location; or the fluctuation can be determined by the difference between the feature information of a certain location and the feature information of several other locations (e.g., the remaining locations among the multiple locations, or the adjacent locations of the location), and the location with a difference greater than a preset threshold is determined as the short-circuit location.

[0043] Steps S201 to S202 enable the identification and rapid localization of short-circuit defects in each coplanar waveguide transmission line on the quantum chip, thereby facilitating the accurate and efficient implementation of the repair process for the short-circuit defect. The repair process can involve etching at the short-circuit location. For example, a conductive film is formed at the identified short-circuit location to bond the central transmission conductor and the ground, forming an electrical connection between the two. The conductive film can be removed by a point etching process, thereby obtaining a coplanar waveguide transmission line with the short-circuit defect removed and normal electrical conduction.

[0044] In some embodiments, the step of obtaining feature information of multiple locations of the ground gap includes: providing a substrate on which the coplanar waveguide transmission line is formed, the coplanar waveguide transmission line including the ground gap; determining multiple locations of the ground gap on the substrate along the extension direction of the ground gap, and scanning the ground gap to obtain the film thickness at each location. It is understood that if there is an adhered conductive film at a certain location of the ground gap, it will cause a short circuit defect. By scanning the ground gap, the film thickness of the ground gap at multiple locations can be quickly determined. A film thickness of 0 indicates no short circuit, while a film thickness greater than a certain threshold will cause a short circuit.

[0045] For example, the step of scanning the ground gap to obtain the film thickness at various locations includes: moving a probe along the extension direction of the ground gap in a plane parallel to the coplanar waveguide transmission line and emitting a probe signal to various locations of the ground gap; determining the film thickness at each location based on the feedback signal of the probe signal at each location. The probe signal can be a terahertz signal or a laser signal. Different feedback signals are generated after the probe signal is reflected at different locations, and the film thickness at the corresponding location can be obtained based on the acquisition and processing of these feedback signals. The probe signal can also be other signals that can realize the detection of thin-film circuit thickness or relative distance changes.

[0046] In other embodiments, the step of obtaining feature information of multiple locations of the ground gap includes: generating a photograph of the coplanar waveguide transmission line based on a substrate on which the coplanar waveguide transmission line is formed; performing grayscale processing on the photograph, i.e., converting the photograph to grayscale, thereby obtaining a comparison photograph; determining multiple locations of the ground gap along the extension direction of the ground gap on the comparison photograph, and obtaining the grayscale value of each location. The photograph may include at least one of optical microscopy photographs and electron microscopy photographs. Grayscale value is a parameter that measures the brightness of each pixel in a grayscale image. A specific grayscale value range represents the brightness of a certain pixel. For example, a specific grayscale value range is represented by 0 to 255, where 0 represents the darkest and 255 represents the brightest. The larger the grayscale value, the brighter the image. In this embodiment, the grayscale value of each location may be the average of the grayscale values ​​of multiple pixels at the corresponding location.

[0047] It is understandable that the grayscale value of the location on the substrate with a thin film (the area where the central transmission conductor is located in an ideal state) should be in the first range, and the grayscale value of the location without a thin film (the area where the ground gap is located in an ideal state) should be in the second range. The two ranges are clearly distinguishable and can be predetermined. After determining multiple locations of the ground gap and then obtaining the grayscale value of each location, the location with the grayscale value in the first range can be identified as the short location. The first range can be a preset range.

[0048] In some embodiments of the short-circuit location determination method described above, the step of determining multiple locations of the ground gap along its extension direction may include: providing a standard diagram, the standard diagram including a standard transmission line corresponding to the coplanar waveguide transmission line, the standard transmission line including a standard ground gap; determining multiple reference positions on the standard ground gap according to scanning requirements; and determining multiple locations corresponding to the ground gap and the multiple reference positions. The standard diagram may include at least one of a photograph of a standard chip or a design drawing of a standard chip. The photograph of the standard chip may include at least one of an optical microscope photograph or an electron microscope photograph. Using the standard transmission conductor in the standard diagram as a reference standard facilitates the early determination of the location information to be scanned, such as specific coordinates, to enable precise control of the scanning operation.

[0049] Regarding the coplanar waveguide transmission line after process repair

[0050] Figure 3 This document provides a schematic diagram of a superconducting circuit in one embodiment of this application, illustrating the structure of a coplanar waveguide transmission line after process repair of abnormal locations. The coplanar waveguide transmission line shown in the figure includes a central transmission conductor and ground layers located on both sides of the central transmission conductor. It should be noted that, for the sake of focusing on the description of the embodiment, Figure 1 and Figure 3 The middle portion of the substrate is omitted and not shown.

[0051] In the embodiments of this application, the open circuit sensitive interval corresponds to the location of the open circuit defect, the short circuit sensitive interval corresponds to the location of the short circuit defect, and the standard interval corresponds to the location of the part of the center conductor that is free of abnormalities (meets design requirements).

[0052] The following is an example of a coplanar waveguide transmission line that achieves connectivity after undergoing process repair for an open circuit defect, namely... Figure 3 The shape and structure of the first coplanar waveguide transmission line 1 having at least one open circuit sensitive section.

[0053] See Figure 3The first coplanar waveguide transmission line 1 includes a first central transmission conductor 11 and a first ground layer 12. A first standard section 101, a first open-circuit sensitive section 102, and a second open-circuit sensitive section 103 are distributed along the signal transmission direction of the first coplanar waveguide transmission line 1. The line width of the first standard section conductor 111 in the first standard section 101 is denoted as W10. The line width of the open-circuit section conductor 112 in the first open-circuit sensitive section 102 is denoted as W11. The line width of the central transmission conductor in the second open-circuit sensitive section 103 is denoted as W12. Both W11 and W12 can be greater than or equal to W10.

[0054] In some embodiments of this application, a portion of the central transmission conductor within the circuit-sensitive interval may be a transmission layer formed by depositing a film at the circuit-breaking location after step S202. The linewidth of this portion may be greater than or equal to the linewidth of the central transmission conductor within the standard interval. It is understood that by designing the linewidth of this portion to be greater than the linewidth of the central transmission conductor within the standard interval, this application helps to avoid breaks and discontinuities in the fabrication process due to the narrowness of the thin film.

[0055] In some embodiments of this application, the central transmission conductor includes a first portion located within the standard interval and a second portion located within the circuit-sensitive interval. The first portion is located in the same film layer and is formed by the same deposition process, while the second portion is located in another film layer and is formed by a relatively independent deposition process. Specifically, the first portion of this coplanar waveguide transmission line can be referred to... Figure 3 The first standard area conductor 111 in the middle, the second part can be referred to Figure 2 Conductor 112 in the broken-circuit zone.

[0056] In some embodiments, the linewidth of the first standard area conductor 111 is uniform. In other embodiments, the circuit breaker conductor 112 is a circular or rectangular film covering the first portion, and the circular or rectangular film contacts the first standard area conductor 111 to achieve electrical connection. In still other embodiments, when the coating process forms the central transmission conductor, the portion in the circuit breaker sensitive area is prone to discontinuity (this discontinuity may be caused by uneven coating or tearing during peeling, etc.), leading to a circuit breaker in the central transmission conductor. To increase the coating space in this area and facilitate increasing the linewidth of the circuit breaker conductor 112 in this space, in specific implementations, the first ground layer 12 in the first circuit breaker sensitive area 102 can be recessed towards the side away from the central transmission conductor. In one embodiment, the spacing between the circuit breaker conductor 112 and the first ground layer 12 is the same as the spacing between the first standard area conductor 111 and the first ground layer 12 within the standard interval. In a specific implementation, the center transmission conductor within the circuit breaker sensitive interval protrudes towards the first ground layer 12, and the protrusion and the depression of the first ground layer 12 are in the same direction and have the same amplitude.

[0057] In this embodiment, the coplanar waveguide transmission line can be formed from a superconducting material that exhibits superconductivity at temperatures equal to or below the critical temperature, such as approximately 10–100 millikrvin (mK) or approximately 4K, such as aluminum, niobium, tantalum, or titanium nitride, etc. In practice, the material is not limited to these; any material exhibiting superconductivity at temperatures equal to or below the critical temperature can be used to form the coplanar waveguide transmission line. These materials can be deposited using deposition processes such as chemical vapor deposition, physical vapor deposition (e.g., evaporation or sputtering), epitaxial techniques, and other deposition processes. Exemplary examples include ion beam assisted deposition (IBAD), vacuum evaporation, molecular beam epitaxy (MBE), pulsed laser deposition (PLD), chemical vapor deposition (CVD), sol-gel deposition, and magnetron sputtering.

[0058] The following is an example of a coplanar waveguide transmission line obtained after repairing short-circuit defects using advanced technology. Figure 3 The shape and structure of the second coplanar waveguide transmission line 2 having at least one short-circuit sensitive section.

[0059] See Figure 3The second coplanar waveguide transmission line 2 includes a second central transmission conductor 11 and a second ground layer 22. Along the signal transmission direction of the second coplanar waveguide transmission line 2, there are a second standard interval 201, a first short-circuit sensitive interval 202, and a second short-circuit sensitive interval 203. The distance between the second standard section conductor 211 in the second standard interval 201 and the second ground layer 22 is denoted as S20. The distance between the short-circuit section conductor 212 in the first short-circuit sensitive interval 202 and the second ground layer 22 is denoted as S21. The distance between the central transmission conductor in the second short-circuit sensitive interval 203 and the second ground layer 22 is denoted as S22. In this embodiment, the second coplanar waveguide transmission line 2 also has the structural characteristic that S21 and S22 are both greater than or equal to S20.

[0060] In specific implementation, the form is not limited to the above. As long as the second coplanar waveguide transmission line 2 is a coplanar waveguide transmission line with a standard interval and at least one short-circuit sensitive interval, and the distance between the center transmission conductor and the ground layer within the short-circuit sensitive interval is greater than or equal to the distance between the center transmission conductor and the ground layer within the standard interval, it is acceptable. It is understood that if both S21 and S22 are greater than the distance limit of S20, it will be more helpful in preventing the center transmission conductor and the ground layer from sticking together during the coating process, thereby reducing the occurrence of accidental short circuits.

[0061] This structural form, where the spacing is greater than the spacing between the center transmission conductor and the grounding layer within the standard interval, can be achieved in the following way.

[0062] In some embodiments of this application, the grounding layer within the short-circuit sensitive region is recessed towards the side away from the central transmission conductor. For example, in conjunction with the foregoing, if the second grounding layer 22 within the first short-circuit sensitive region 202 adopts the aforementioned recessed structure, the linewidth of the short-circuit region conductor 212 can be consistent with that of the second standard region conductor 211. This allows for a relatively increased distance between the central transmission conductor and the grounding layer within the short-circuit sensitive region while maintaining a consistent linewidth for the central transmission conductor. In another example, in conjunction with… Figure 3 As shown, the second grounding layer 22 within the first short-circuit sensitive zone 202 adopts the aforementioned recessed structure, and the line width of the short-circuit zone conductor 212 can also adopt a structure that is smaller than the line width of the second standard zone conductor 211.

[0063] In some implementation examples, to maintain a consistent grounding layer topography, the structure of the center transmission conductor can be modified. For instance, the linewidth of the center transmission conductor located in the short-circuit sensitive section can be smaller than that of the center transmission conductor in the standard section. Specifically, in conjunction with... Figure 3As shown, the short-circuit region conductor 212 has a linewidth smaller than that of the second standard region conductor 211. In some other embodiments, the center transmission conductor in the short-circuit sensitive area and the center transmission conductor in the standard area are located on the same layer; specifically, in conjunction with... Figure 3 As shown, the short-circuit region conductor 212 and the second standard region conductor 211 can be an integral structure, which facilitates the formation of a single coating.

[0064] It should be noted that the first ground layer 12 and the second ground layer 22 can be the same thin film formed on the substrate. In this application, the first coplanar waveguide transmission line 1 and the second coplanar waveguide transmission line 2 are distinguished for descriptive purposes.

[0065] In addition, the standard interval is the interval in which the abnormal part of the coplanar waveguide transmission line does not appear, the open circuit sensitive interval is the interval in which the open circuit of the coplanar waveguide transmission line appears, and the short circuit sensitive interval is the interval in which the short circuit of the coplanar waveguide transmission line appears. The center transmission conductor in the standard interval is referred to as the standard area conductor, the center transmission conductor in the open circuit sensitive interval is referred to as the open circuit conductor, and the center transmission conductor in the short circuit sensitive interval is referred to as the short circuit conductor.

[0066] Figure 4 This is a schematic diagram of a short-circuit location determination system for a coplanar waveguide transmission line, provided in an embodiment of this application.

[0067] See Figure 4 A second aspect of this application provides a short-circuit location determination system for a coplanar waveguide transmission line corresponding to the above-described short-circuit location determination method. The short-circuit location determination system includes the following modules:

[0068] The information acquisition module 401 is used to acquire feature information of multiple locations of the ground gap, wherein the multiple locations are distributed along the extension direction of the ground gap;

[0069] The short-circuit identification module 402 is used to determine the short-circuit location of the electrical connection between the central transmission conductor and the ground based on the fluctuation of the feature information.

[0070] Corresponding to the short-circuit location determination method for coplanar waveguide transmission lines provided in this application embodiment, and addressing the problem of difficulty in identifying short-circuit defect locations in coplanar waveguide transmission lines on quantum chips in related fabrication technologies, the short-circuit location determination system provided in this application embodiment acquires feature information of multiple locations of the ground gap through the information acquisition module 401. These multiple locations are distributed along the extension direction of the ground gap. Then, the short-circuit identification module 402 determines the short-circuit location of the electrical connection between the central transmission conductor and the ground based on the fluctuation of the feature information. This enables the identification of short-circuit defect locations of each coplanar waveguide transmission line on the quantum chip and achieves rapid positioning, thereby facilitating accurate and efficient implementation of the repair process for the short-circuit defect.

[0071] Based on the method for determining the short-circuit location of a coplanar waveguide transmission line according to the above embodiments, this application also proposes a non-temporary computer storage medium storing a computer program thereon. When the computational base program is executed, it can implement the method for determining the short-circuit location of a coplanar waveguide transmission line according to the above embodiments.

[0072] Specifically, in this embodiment, the storage medium can be configured to store a computer program for performing steps S201 to S202:

[0073] Step S201: Obtain feature information of multiple locations of the ground clearance, wherein the multiple locations are distributed along the extension direction of the ground clearance, such as... Figure 1 The second coplanar waveguide transmission line 2 in the middle, where the qubit structure is not shown;

[0074] Step S202: Determine the short-circuit location of the electrical connection between the central transmission conductor and the ground based on the fluctuation of the characteristic information.

[0075] Embodiments of this application also provide a storage medium storing a computer program, wherein the computer program is configured to execute the short-circuit location determination method at runtime.

[0076] Specifically, in this embodiment, the storage medium may include, but is not limited to, USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks, and other media capable of storing computer programs.

[0077] As described above, based on the short-circuit location determination method of the above embodiments, this application proposes an electronic device, including a memory and a processor. The memory stores a computer program, and the processor is configured to run the short-circuit location determination method of the above embodiments when the computer program is executed.

[0078] Specifically, the aforementioned electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the aforementioned processor, and the input / output device is connected to the aforementioned processor.

[0079] Specifically, in this embodiment, the processor can be configured to execute the following steps S201 to S202 via a computer program:

[0080] Step S201: Obtain feature information of multiple locations of the ground clearance, wherein the multiple locations are distributed along the extension direction of the ground clearance, such as... Figure 1 The second coplanar waveguide transmission line 2 in the middle, where the qubit structure is not shown;

[0081] Step S202: Determine the short-circuit location of the electrical connection between the central transmission conductor and the ground based on the fluctuation of the characteristic information.

[0082] It should be noted that the embodiments of the above systems, storage media, and electronic devices have the same beneficial effects as the embodiments of the short-circuit location determination method described above, and therefore will not be repeated. For technical details not disclosed in the embodiments of the systems, storage media, and electronic devices of this application, those skilled in the art should refer to the description of the above preparation method for understanding; for the sake of brevity, they will not be repeated here.

[0083] It should be noted that the technical solutions of this application embodiment can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes one or more instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in this application embodiment. The aforementioned storage medium can be a non-transitory storage medium, including: USB flash drive, portable hard drive, read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk, and other media capable of storing program code; it can also be a transient storage medium.

[0084] In the description of this specification, the references to terms such as "an embodiment," "some embodiments," "embodiments of this application," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0085] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

[0086] The above description, based on the embodiments shown in the drawings, details the structure, features, and effects of this application. The above description is only a preferred embodiment of this application, but this application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of this application, or modifications to equivalent embodiments, that do not exceed the spirit covered by the specification and drawings, should be within the protection scope of this application.

Claims

1. A method for determining the short-circuit location of a coplanar waveguide transmission line, wherein the coplanar waveguide transmission line includes a central transmission conductor and grounds located on both sides of the central transmission conductor, and the gap between the central transmission conductor and the grounds is a ground clearance, characterized in that... The method includes: Feature information of multiple locations of the ground gap is obtained by scanning the central transmission conductor. These multiple locations are distributed along the extension direction of the ground gap. The feature information reflects the film thickness and grayscale value of the central transmission conductor at these multiple locations; and... The short-circuit location between the central transmission conductor and the ground is determined based on the fluctuation of the characteristic information.

2. The method according to claim 1, characterized in that, The step of obtaining feature information of multiple locations of the ground clearance includes: A substrate is provided having the coplanar waveguide transmission line formed thereon, the coplanar waveguide transmission line including the ground gap; On the substrate, multiple locations of the ground gap are determined along the extension direction of the ground gap, and the ground gap is scanned to obtain the film thickness at each location.

3. The method according to claim 2, characterized in that, The step of scanning the ground clearance to obtain the film thickness at various locations includes: In a plane parallel to the coplanar waveguide transmission line, the probe is moved along the extension direction of the ground gap and a detection signal is emitted to various positions of the ground gap. The film thickness at each location is determined based on the feedback signals from the detection signal at each location.

4. The method according to claim 1, characterized in that, The step of obtaining feature information of multiple locations of the ground clearance includes: A photograph of the coplanar waveguide transmission line generated on a substrate on which the coplanar waveguide transmission line is formed; The photos are processed to grayscale to obtain comparison photos; On the comparison photograph, multiple locations of the ground gap are determined along the extension direction of the ground gap, and the ground gap is scanned to obtain the grayscale value of each location.

5. The method according to claim 4, characterized in that, The photographs include at least one of light micrographs and electron micrographs.

6. The method according to claim 2 or 4, characterized in that, The step of determining multiple locations of the ground gap along the extension direction of the ground gap includes: A standard diagram is provided, the standard diagram including a standard transmission line corresponding to the coplanar waveguide transmission line, the standard transmission line including a standard ground clearance; Based on the scanning requirements, multiple reference positions are determined on the standard ground clearance; Determine multiple positions corresponding to the ground clearance and the multiple reference positions.

7. The method according to claim 6, characterized in that, The standard diagram includes at least one of a photograph of a standard chip and a design diagram of a standard chip.

8. A short-circuit location determination system for a coplanar waveguide transmission line, characterized in that, The coplanar waveguide transmission line includes a central transmission conductor and grounds located on both sides of the central transmission conductor, the gap between the central transmission conductor and the grounds being a ground clearance, and the system includes: The information acquisition module is used to acquire feature information of multiple locations of the ground gap by scanning the central transmission conductor. These multiple locations are distributed along the extension direction of the ground gap. The feature information reflects the film thickness and grayscale value of the central transmission conductor at these multiple locations. A short-circuit identification module is used to determine the location of a short circuit between the central transmission conductor and the ground based on fluctuations in characteristic information.

9. A storage medium, characterized in that, The storage medium stores a computer program, wherein the computer program is configured to execute the method described in any one of claims 1 to 7 when it is run.

10. An electronic device comprising a memory and a processor, characterized in that, The memory stores a computer program, and the processor is configured to run the computer program to perform the method according to any one of claims 1 to 7.

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