Wafer cleaning chucking device

Abstract

This invention belongs to the field of semiconductor manufacturing technology and discloses a wafer cleaning clamping device. The wafer cleaning clamping device includes a cleaning stage, a fixing base, a locking assembly, and a gripper assembly. Multiple fixing bases are evenly distributed along the circumference of the cleaning stage, and each fixing base has a receiving cavity. The locking assembly is disposed within the receiving cavity. Multiple gripper assemblies are also provided, with each gripper assembly corresponding to one of the fixing bases. The gripper assemblies are disposed on the cleaning stage and include a gripper base and grippers rotatably connected to the gripper base via a first pin. The grippers can support the wafer. The grippers are connected to the locking assembly. When the cleaning stage rotates, the locking assembly allows the grippers to rotate around the first pin, thereby clamping the wafer. The wafer cleaning clamping device provided by this invention, by incorporating a locking assembly, eliminates the need for a power system when the cleaning stage rotates, effectively simplifying the overall structure and reducing manufacturing costs.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer cleaning and clamping device. Background Technology

[0002] A wafer refers to the chip used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. During semiconductor manufacturing, contaminants such as particles, organic matter, natural oxide layers, or metallic impurities are inevitably generated. A cleaning machine is a process equipment used to non-destructively clean the wafer surface to remove impurities and obtain the desired clean surface, preparing it for subsequent processes. Cleaning machines are widely used in various stages of integrated circuit manufacturing, including pre- and post-film deposition cleaning, post-plasma etching cleaning, post-ion implantation cleaning, post-chemical mechanical polishing cleaning, and post-metal deposition cleaning. Cleaning technology is one of the most important factors affecting chip yield.

[0003] As semiconductor manufacturing technology continues to advance and chip sizes shrink, their sensitivity to impurities increases, leading to a continuous increase in cleaning steps. For example, the cleaning process for 90nm chips involves approximately 90 steps, while the cleaning process for 20nm chips reaches 215 steps. Currently, cleaning steps account for about one-third of the entire semiconductor manufacturing process, and almost all manufacturing processes require cleaning before and after. Related technologies often require clamping structures with dynamic systems to hold wafers during cleaning, resulting in complex structures and high manufacturing costs. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer cleaning clamping device that solves the problems of complex structure and high manufacturing cost of existing clamping devices. This wafer cleaning clamping device does not require a power system, which effectively simplifies the overall structure.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A wafer cleaning clamping device, comprising:

[0007] Cleaning station;

[0008] The fixing base is provided in multiple ways, and the multiple fixing bases are evenly distributed along the circumference of the washing table. Each fixing base is provided with a receiving cavity.

[0009] A locking assembly is disposed within the receiving cavity;

[0010] The clamping assembly is provided in multiple ways, with each clamping assembly and each fixing seat corresponding to one another. The clamping assembly is disposed on the cleaning table. Each clamping assembly includes a clamping seat and a clamping jaw rotatably connected to the clamping seat via a first pin. The clamping jaw can support the wafer. The clamping jaw is connected to the locking assembly. When the cleaning table rotates, the locking assembly can cause the clamping jaw to rotate around the first pin so that the clamping jaw clamps the wafer. When the cleaning table stops rotating, the locking assembly can cause the clamping jaw to return to its original state.

[0011] Optionally, the receiving cavity is provided with a slide rail, and the locking assembly is slidably connected to the slide rail. The locking assembly includes a push rod, one end of which slides out of the fixed seat and is rotatably connected to the gripper.

[0012] Optionally, the locking assembly further includes a movable sleeve, a first spring, and a reset member. The movable sleeve is slidably connected to the slide rail. The first spring is disposed inside the movable sleeve. The push rod slidably passes through the movable sleeve and is connected to the first spring. The reset member is sleeved on the outside of the movable sleeve. A preload adjustment member is threadedly connected to the end of the movable sleeve away from the gripper assembly. One end of the reset member is connected to the cavity wall of the receiving cavity, and the other end of the reset member is connected to the preload adjustment member.

[0013] Optionally, the locking assembly further includes a locking pressure adjusting member, which is screwed into the movable sleeve at one end away from the gripper assembly.

[0014] Optionally, the gripper includes a protrusion, an arc portion, and a hook portion connected in sequence. The push rod and the protrusion are rotatably connected by a second pin, and the arc portion and the gripper seat are rotatably connected by a first pin. The hook portion applies a clamping force to the wafer.

[0015] Optionally, the receiving cavity extends radially along the washing table, and the opening of the receiving cavity is threadedly connected to a stroke adjustment element.

[0016] Optionally, the locking assembly includes a first tension member and a counterweight block slidably disposed in the receiving cavity. The counterweight block is located outside the gripper assembly. One end of the first tension member is connected to the gripper, and the other end of the first tension member is connected to the counterweight block. The locking assembly further includes a second tension member, which is disposed inside the gripper assembly. One end of the second tension member is connected to the fixed base, and the other end of the second tension member is connected to the gripper.

[0017] Optionally, both the first tension member and the second tension member are spring members.

[0018] Optionally, the locking assembly includes a third tension member and a counterweight slidably disposed in the receiving cavity. The counterweight is located outside the gripper assembly. One end of the third tension member is connected to the gripper, and the other end of the third tension member is connected to the counterweight. The fixed seat is set at an angle to the cleaning table.

[0019] Optionally, the third tensioning member is a spring.

[0020] The beneficial effects of the present invention are as follows: The wafer cleaning clamping device provided by the present invention, by setting a locking component, when the cleaning table rotates, the locking component pushes or pulls the clamping jaws to rotate around the first pin shaft by centrifugal force, so that the clamping jaws clamp the wafer; after the cleaning table stops rotating, the locking component can restore the clamping jaws to the original state (i.e., the state in which the clamping jaws do not clamp the wafer). Compared with the prior art, no power system is required, which effectively simplifies the overall structure and reduces the processing and manufacturing cost. Attached Figure Description

[0021] Figure 1 This is a three-dimensional view of the wafer cleaning clamping device provided in Embodiment 1 of the present invention;

[0022] Figure 2 This is a top view of the wafer cleaning clamping device provided in Embodiment 1 of the present invention;

[0023] Figure 3 yes Figure 2 Section at point AA Figure 1 ;

[0024] Figure 4 yes Figure 2 Section at point AA Figure 2 ;

[0025] Figure 5 This is a schematic diagram of the locking assembly provided in Embodiment 2 of the present invention. Figure 1 ;

[0026] Figure 6 This is a schematic diagram of the locking assembly provided in Embodiment 3 of the present invention. Figure 2 .

[0027] In the picture:

[0028] 100. Cleaning station;

[0029] 200. Wafer;

[0030] 300. Fixture;

[0031] 410. Thrust rod; 420. Moving sleeve; 430. First spring; 440. Locking pressure adjusting component; 450. Preload adjusting component; 460. First tensioning component; 470. Counterweight; 480. Second tensioning component; 490. Third tensioning component;

[0032] 510. Gripper seat; 520. First pin; 530. Gripper; 531. Protrusion; 532. Arc-shaped part; 533. Hook part; 540. Second pin;

[0033] 600. Stroke adjustment components;

[0034] 700. Reset component. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0036] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0039] Example 1

[0040] This embodiment provides a wafer cleaning clamping device, such as Figures 1-4As shown, the wafer cleaning clamping device includes a cleaning stage 100, a fixing base 300, a locking assembly, and a gripper assembly. Multiple fixing bases 300 are provided, evenly distributed around the circumference of the cleaning stage 100, and each fixing base 300 has a receiving cavity. The locking assembly is located within the receiving cavity. Multiple gripper assemblies are provided, with each gripper assembly corresponding to one of the fixing bases 300. The gripper assembly is located on the cleaning stage 100 and includes a gripper base 510 and a gripper 530 rotatably connected to the gripper base 510 via a first pin 520. The gripper 530 can support the wafer 200. The gripper 530 is connected to the locking assembly. When the cleaning stage 100 rotates, the locking assembly allows the gripper 530 to rotate around the first pin 520, thereby clamping the wafer 200. When the cleaning stage 100 stops rotating, the locking assembly allows the gripper 530 to return to its original state.

[0041] The wafer cleaning clamping device provided in this embodiment, by setting a locking component, when the cleaning table 100 rotates, the locking component pushes or pulls the clamp 530 around the first pin 520 by centrifugal force, so that the clamp 530 clamps the wafer 200; after the cleaning table 100 stops rotating, the locking component can restore the clamp 530 to its original state (i.e., the state in which the clamp 530 does not clamp the wafer 200). Compared with the prior art, no power system is required, which effectively simplifies the overall structure and reduces the processing and manufacturing cost.

[0042] Optionally, a slide rail is provided inside the receiving cavity, and a locking assembly is slidably connected to the slide rail. The locking assembly includes a push rod 410, one end of which slidably extends out of the fixed seat 300 and is rotatably connected to the gripper 530. Under the action of centrifugal force, the locking assembly slides radially outward along the cleaning table 100, and the push rod 410 slides out of the fixed seat 300 and supplies the gripper 530 with an outward pushing force. Under the action of the pushing force, the gripper 530 rotates around the first pin 520. After rotating a certain angle, the gripper 530 clamps the wafer 200. By setting the push rod 410, the accuracy and reliability of the pushing force transmission are improved.

[0043] Furthermore, the locking assembly also includes a movable sleeve 420, a first spring 430, and a reset member 700. The movable sleeve 420 is slidably connected to the slide rail. The first spring 430 is disposed inside the movable sleeve 420. The push rod 410 is slidably inserted through the movable sleeve 420 and connected to the first spring 430. The reset member 700 is sleeved on the outside of the movable sleeve 420. A preload adjustment member 450 is threadedly connected to the end of the movable sleeve 420 away from the gripper assembly. One end of the reset member 700 is connected to the cavity wall of the receiving cavity, and the other end of the reset member 700 is connected to the preload adjustment member 450. The reset member 700 assists in completing the rebound of the locking assembly so that the push rod 410 drives the gripper 530 to return to its original state, avoiding affecting the subsequent cleaning process.

[0044] Optionally, the locking assembly also includes a locking pressure adjusting member 440, which is screwed into the movable sleeve 420 at the end away from the gripper assembly. By turning the locking pressure adjusting member 440, the compression dimension of the first spring 430 can be adjusted, thereby assisting in adjusting the initial preload.

[0045] In this embodiment, the weight range of the thrust rod 410 is 0.5g to 0.6g, preferably 0.58g. According to the formula FL=mω2r, by setting the weight range of the thrust rod 410, the centrifugal force of the thrust rod 410 can be effectively controlled to be within a relatively stable range.

[0046] Based on the rotational speed changes of the cleaning table 100, the working state of the wafer cleaning clamping device is analyzed. When the locking assembly is in the initial state, the first spring 430 is in a compressed state, with a compression dimension X. 01 The initial preload F is obtained. 夹紧 F 夹紧 =KX 01 Tightening the preload adjustment element 450 compresses the reset element 700, resulting in a compression dimension X. 02 The initial restoring force, F, is obtained. 复位 =KX 02 When the cleaning table 100 is first started and rotating at low speed, the preload adjustment component 450 and the moving sleeve 420 are a single unit, and the preload F... 夹紧 Under the action of centrifugal force, the push rod 410, the preload adjustment component 450, and the moving sleeve 420 form a temporary unit (hereinafter referred to as the temporary unit). As the rotation speed of the cleaning table 100 increases, this temporary unit gradually slides outward along the radial direction of the cleaning table 100 until the push rod 410 pushes the gripper 530 to rotate at a certain angle and clamps the wafer 200. This point is named the first rotation speed point, and the distance the temporary unit moves outward is L1. 夹紧 =KX 01 F 复位 =K(X) 02 +L1).

[0047] As the rotational speed of the cleaning table 100 increases, the pre-tension adjustment component 450 and the moving sleeve 420 form a centrifugal assembly (hereinafter referred to as the centrifugal component). This centrifugal component overcomes the elastic force of the first spring 430 and continues to move outward along the slide rail. At this time, the push rod 410 can no longer move because it has already clamped the wafer 200. Therefore, the centrifugal component and the push rod 410 generate relative displacement. The centrifugal component continues to move along the slide rail until it contacts the side wall of the fixed seat 300. The push rod 410 is subjected to the pressure F of the first spring 430. T The resultant force F on the push rod 410 is the reaction force F of the gripper 530 and the jaw 530. 合 =FF TThen the centrifugal force at this time is F. L =FF T When the movable sleeve 420 and the fixed seat 300 are in full contact, the gripper 530 cannot move, and the final pressure F exerted by the push rod 410 on the gripper 530 is F = F L +F T =F L +F 夹紧 +KL2, the spring force F of the reset piece 700 复位 =K(X) 02 +L1+L2), this is called the second rotational speed point.

[0048] After the cleaning process is completed, the rotational speed of the cleaning table 100 gradually decreases. When the rotational speed drops to a level greater than or equal to the second rotational speed point, the pressure of the push rod 410 remains approximately unchanged. For example, when the weight of the push rod 410 is 0.58g, the maximum operating speed of the cleaning table 100 is 2000 r / min, and r = 150 mm, according to F... L From the formula = mω²r, we can see that F L =1N, centrifugal force F L If the speed is very small, the final pressure F of the push rod 410 on the gripper 530 will not change with the speed; when the speed drops to less than the second speed point but greater than or equal to the first speed point, the elastic force F of the reset member 700 will... 复位 =K(X) 02 The force (L1 + L2) is greater than the centripetal force required for the centrifugal component to make circular motion. The reset component 700 gradually overcomes the frictional force and restores its deformation, causing the centrifugal component to move radially inward. During this process, the push rod 410 will not be displaced due to the elastic force of the first spring 430, and the wafer 200 continues to be clamped. When the rotational speed drops to less than the first rotational speed point and approaches zero, the reset component 700 overcomes the resistance and pushes the temporary whole back to its original position.

[0049] Optionally, the gripper 530 includes a protrusion portion 531, an arc portion 532, and a hook portion 533 connected in sequence. The push rod 410 and the protrusion portion 531 are rotatably connected by a second pin 540, and the arc portion 532 and the gripper seat 510 are rotatably connected by a first pin 520. The hook portion 533 applies a clamping force to the wafer 200 to ensure the reliability of the movement and operation of the gripper 530.

[0050] In this embodiment, the receiving cavity extends radially along the cleaning table 100, and the cavity opening is threadedly connected to a stroke adjustment member 600. By turning the stroke adjustment member 600, the stroke of the locking assembly within the receiving cavity can be adjusted, thus expanding the application range.

[0051] Example 2

[0052] This embodiment provides a wafer cleaning clamping device, and the basic structure of the wafer cleaning clamping device provided in this embodiment is the same as that in Embodiment 1, with only some structural differences. This embodiment only describes the structures that are different from those in Embodiment 1.

[0053] like Figure 5 As shown, the locking assembly includes a first tension member 460 and a counterweight 470 slidably disposed in the receiving cavity. The counterweight 470 is located outside the gripper assembly. One end of the first tension member 460 is connected to the gripper 530, and the other end of the first tension member 460 is connected to the counterweight 470. The locking assembly also includes a second tension member 480, which is disposed inside the gripper assembly. One end of the second tension member 480 is connected to the fixed base 300, and the other end of the second tension member 480 is connected to the gripper 530. When the cleaning table 100 rotates, under the action of centrifugal force, the counterweight 470 moves outward along the radial direction of the cleaning table 100, which stretches the first stretching member 460. The first stretching member 460 drives the gripper 530 to rotate around the first pin 520. The gripper 530 clamps the wafer 200. At the same time, when the gripper 530 rotates, it will drive the second stretching member 480 to extend. When the cleaning table 100 stops rotating, the counterweight 470 returns to its original position under the pulling force of the first stretching member 460 and the second stretching member 480.

[0054] For example, the elastic modulus of the first tension member 460 is K2, the elastic modulus of the second tension member 480 is K1, and the set pressure F of the wafer 200 is... 设定 =K2L X (L X Let L be the deformation of the first tension member 460 when the wafer 200 is clamped, L0 = F / K1 for the second tension member 480, and L = (K1L0) / K2 for the first tension member 460. Then, the final displacement L of the counterweight 470 is... 终 =L0+L+L X =L0+(K1L0) / K2+F 设定 / K2. In practical applications, the weight and position of the counterweight 470 can be adjusted, and the first tension member 460 and the second tension member 480 with appropriate elastic coefficients can be selected to adjust the clamping force of the gripper 530 and the rotation speed of the cleaning table 100 during clamping.

[0055] Both the first tension member 460 and the second tension member 480 are preferably spring members, which have a simple structure and are easy to process and manufacture.

[0056] Example 3

[0057] This embodiment provides a wafer cleaning clamping device, and the basic structure of the wafer cleaning clamping device provided in this embodiment is the same as that in Embodiment 1, with only some structural differences. This embodiment only describes the structures that are different from those in Embodiment 1.

[0058] like Figure 6 As shown, the locking assembly includes a third tension member 490 and a counterweight 470 slidably disposed in the receiving cavity. The counterweight 470 is located outside the gripper assembly. One end of the third tension member 490 is connected to the gripper 530, and the other end of the third tension member 490 is connected to the counterweight 470. The fixing seat 300 is set at an angle to the cleaning table 100. When the cleaning table 100 rotates, the counterweight 470 stretches the third tension member 490 under the action of centrifugal force. The third tension member 490 pulls the gripper 530 to rotate, so that the gripper 530 clamps the wafer 200. When the cleaning table 100 stops rotating, the counterweight 470 returns to its original position under the action of gravity, and the third tension member 490 and the gripper 530 return to their initial state.

[0059] For example, the elastic modulus of the third tension member 490 is K, the final displacement of the counterweight 470 is L, and the set pressure F of the wafer 200 is... 设定 =KL X (L X (The deformation of the third stretching member 490 when wafer 200 is clamped), and the elongation L of the third stretching member 490. x =L-L0. In practical applications, the weight and position of the counterweight 470 can be adjusted, and a third tensioning member 490 with a suitable elastic coefficient can be selected to adjust the clamping force of the gripper 530 and the rotation speed of the cleaning table 100 during clamping.

[0060] The third tensioning component 490 is a spring component, which has a simple structure and is easy to process and manufacture.

[0061] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A wafer cleaning clamping device, characterized in that, include: Cleaning station (100); A plurality of fixed seats (300) are provided, and the plurality of fixed seats (300) are evenly distributed along the circumference of the cleaning table (100), and each fixed seat (300) is provided with a receiving cavity; A locking assembly is disposed within the receiving cavity; The clamping assembly is provided in multiple ways, and the multiple clamping assemblies and the multiple fixing seats (300) are arranged one-to-one. The clamping assembly is disposed on the cleaning table (100). The clamping assembly includes a clamping seat (510) and a clamping jaw (530) rotatably connected to the clamping seat (510) through a first pin (520). The clamping jaw (530) can support the wafer (200). The clamping jaw (530) is connected to the locking assembly. When the cleaning table (100) rotates, the locking assembly can make the clamping jaw (530) rotate around the first pin (520) so that the clamping jaw (530) clamps the wafer (200). When the cleaning table (100) stops rotating, the locking assembly can make the clamping jaw (530) return to its original state. The cavity is provided with a slide rail, and the locking assembly is slidably connected to the slide rail. The locking assembly includes a push rod (410), one end of which slides through the fixed seat (300) and is rotatably connected to the gripper (530). The locking assembly further includes a movable sleeve (420), a first spring (430), and a reset member (700). The movable sleeve (420) is slidably connected to the slide rail. The first spring (430) is disposed inside the movable sleeve (420). The push rod (410) is slidably inserted through the movable sleeve (420) and connected to the first spring (430). The reset member (700) is sleeved on the outside of the movable sleeve (420). A preload adjustment member (450) is threadedly connected to one end of the movable sleeve (420) away from the gripper assembly. One end of the reset member (700) is connected to the cavity wall of the receiving cavity, and the other end of the reset member (700) is connected to the preload adjustment member (450).

2. The wafer cleaning clamping device according to claim 1, characterized in that, The locking assembly further includes a locking pressure adjusting member (440), which is screwed into the movable sleeve (420) at one end away from the gripper assembly.

3. The wafer cleaning clamping device according to claim 1, characterized in that, The gripper (530) includes a protrusion (531), an arc portion (532), and a hook portion (533) connected in sequence. The push rod (410) and the protrusion (531) are rotatably connected by a second pin (540). The arc portion (532) and the gripper seat (510) are rotatably connected by a first pin (520). The hook portion (533) applies a clamping force to the wafer (200).

4. The wafer cleaning clamping device according to claim 1, characterized in that, The receiving cavity extends radially along the cleaning table (100), and the opening of the receiving cavity is threadedly connected to a stroke adjustment element (600).

5. The wafer cleaning clamping device according to claim 1, characterized in that, The locking assembly includes a first tension member (460) and a counterweight (470) slidably disposed in the receiving cavity. The counterweight (470) is located outside the gripper assembly. One end of the first tension member (460) is connected to the gripper (530), and the other end of the first tension member (460) is connected to the counterweight (470). The locking assembly also includes a second tension member (480), which is disposed inside the gripper assembly. One end of the second tension member (480) is connected to the fixed base (300), and the other end of the second tension member (480) is connected to the gripper (530).

6. The wafer cleaning clamping device according to claim 5, characterized in that, Both the first tension member (460) and the second tension member (480) are spring members.

7. The wafer cleaning clamping device according to claim 1, characterized in that, The locking assembly includes a third tension member (490) and a counterweight (470) slidably disposed in the receiving cavity. The counterweight (470) is located outside the gripper assembly. One end of the third tension member (490) is connected to the gripper (530), and the other end of the third tension member (490) is connected to the counterweight (470). The fixed seat (300) is set at an angle to the cleaning table (100).

8. The wafer cleaning clamping device according to claim 7, characterized in that, The third tensioning member (490) is a spring.

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