An acoustic output device

Abstract

This application provides an acoustic output device, which includes a vibration component and a mass element. The vibration component may include a piezoelectric structure and a vibration element. The piezoelectric structure converts electrical signals into mechanical vibrations, and the vibration element is connected to the piezoelectric structure at a first position to receive mechanical vibrations and generate sound signals. The mass element is connected to the piezoelectric structure at a second position. By connecting the mass element to the piezoelectric structure, this application reduces the amplitude difference between the resonance peak and resonance trough of the vibration response at the first position of the piezoelectric structure within a target frequency range, thereby improving the sound quality of the sound signal.

Description

Technical Field

[0001] This specification relates to the field of acoustics, and in particular to an acoustic output device. Background Technology

[0002] Piezoelectric ceramic driven acoustic output devices utilize the inverse piezoelectric effect of piezoelectric ceramic materials to generate vibrations and radiate sound waves outwards. Compared with traditional electromechanical acoustic output devices, piezoelectric ceramic driven acoustic output devices have advantages such as high electromechanical conversion efficiency, low energy consumption, small size, and high integration. However, compared with traditional electromagnetic acoustic output devices, piezoelectric ceramic driven acoustic output devices have problems such as insufficient low-frequency output and more vibration modes in the audible range, resulting in poorer sound quality. A beam structure can be used in piezoelectric ceramic driven acoustic output devices to improve low-frequency output capability and reduce low-frequency resonant frequencies. However, using a beam structure may introduce more higher-order modes in the audible range, especially potentially creating wideband resonance valleys in the mid-frequency range, weakening the mid-frequency output.

[0003] Therefore, it is desirable to propose an acoustic output device that can suppress higher-order modes in the audible range and improve the sound quality of the acoustic output device in the mid-low frequency range. Summary of the Invention

[0004] This specification provides an acoustic output device, which may include a vibration component and a mass element. The vibration component includes a piezoelectric structure and a vibration element. The piezoelectric structure can convert electrical signals into mechanical vibrations, and the vibration element can be connected to the piezoelectric structure at a first position to receive the mechanical vibrations and generate sound signals. The mass element can be connected to the piezoelectric structure at a second position.

[0005] Compared to existing technologies, the beneficial effects of this application are as follows:

[0006] (1) By connecting the mass element to the second position of the piezoelectric structure, the amplitude difference between the resonance peak and resonance valley of the vibration response of the piezoelectric structure at the first position within the target frequency range can be reduced, thereby improving the sound quality of the sound signal; (2) By adjusting the distribution of the mass at the second position, the sensitivity of the acoustic output device in the target frequency band (e.g., the mid-frequency band) can be improved; (3) According to the vibration modes of the piezoelectric structure in different target frequency ranges, multiple mass elements can be added to the piezoelectric structure to improve the output of the acoustic output device in multiple frequency bands, thereby facilitating the improvement of the sound quality across the entire frequency band; (4) In some embodiments of this specification, the elastic connection between the mass element and the piezoelectric structure can also produce a damping effect on the piezoelectric structure, making the vibration response curve of the acoustic output device relatively smooth in the target frequency range, thereby further improving the sound quality of the sound signal generated by the acoustic output device. Attached Figure Description

[0007] Figure 1 This is a block diagram of an exemplary acoustic output device according to some embodiments of this specification;

[0008] Figure 2 This is a schematic diagram of the structure of an exemplary vibration assembly shown in some embodiments of this specification;

[0009] Figure 3A This is a schematic diagram of the equivalent structure of the exemplary beam structure shown in some embodiments of this specification at a second position;

[0010] Figure 3B This is an equivalent structural diagram showing a mass element connected to a second position in a beam structure according to some embodiments of this specification;

[0011] Figure 4A This is a vibration diagram of an exemplary beam structure shown in some embodiments of this specification;

[0012] Figure 4B This is a vibration diagram of the beam structure with connected mass elements according to some embodiments of this specification;

[0013] Figure 4C This is a vibration response curve of the beam structure with and without additional mass elements at the first position according to some embodiments of this specification;

[0014] Figure 5A and 5B This is a schematic diagram of the vibration of an exemplary vibration assembly shown according to some embodiments of this specification;

[0015] Figure 5C This is a schematic diagram of a vibration assembly with a connected mass element, as shown in some embodiments of this specification.

[0016] Figure 5D This is a vibration response curve of the vibration assembly at a first position with or without a mass element, according to some embodiments of this specification;

[0017] Figure 6 This is a schematic diagram of the structure of the fusion of the elastic part and the mass part according to some embodiments of this specification;

[0018] Figure 7 This is a vibration response curve at the first position of a beam structure connected to a mass element that combines elasticity and mass, according to some embodiments of this specification.

[0019] Figure 8 This is a schematic diagram of a structure in which a uniformly distributed, elastic mass element is connected to a beam structure, according to some embodiments of this specification.

[0020] Figure 9 This is a schematic diagram of the structure of an elastically non-uniformly distributed mass element according to some embodiments of this specification;

[0021] Figure 10 This is a schematic diagram of the structure of a mass element with uniformly distributed mass and / or damping, as shown in some embodiments of this specification.

[0022] Figure 11 This is a schematic diagram of the structure connecting an exemplary elastic element and a mass part according to some embodiments of this specification;

[0023] Figure 12 This is a vibration response curve of a beam structure with a connected elastic and mass-separated mass element, as shown in some embodiments of this specification, at a first position.

[0024] Figure 13 This is a vibration response curve of the piezoelectric structure at the first position when the mass of the mass element shown in some embodiments of this specification is concentrated at the second position;

[0025] Figure 14 This is a vibration response curve of the piezoelectric structure at the first position when the mass elements are concentrated and uniformly distributed according to some embodiments of this specification;

[0026] Figure 15 This is a schematic diagram of a piezoelectric structure with multiple mass elements connected on it, according to some embodiments of this specification;

[0027] Figure 16 This is a vibration response curve of the piezoelectric structure at the first position after connecting multiple mass elements, as shown in some embodiments of this specification.

[0028] Figure 17 This is a schematic diagram of the elastic connection between the mass element, the piezoelectric structure, and the housing, as shown in some embodiments of this specification;

[0029] Figure 18 This is a vibration response curve of a piezoelectric structure at a first position when the first elastic coefficient and the second elastic coefficient are different, according to some embodiments shown in this specification;

[0030] Figure 19 This is a vibration response curve of the piezoelectric structure at the first position corresponding to different mr values ​​when the mass of the vibration element is 0.5g, according to some embodiments of this specification;

[0031] Figure 20 This is a vibration response curve of the piezoelectric structure at the first position corresponding to different mr values ​​when the mass of the vibration element is 1g, according to some embodiments of this specification;

[0032] Figure 21This is a vibration response curve of the piezoelectric structure at the first position corresponding to different mr values ​​when the mass of the vibrating element is 2g, according to some embodiments of this specification.

[0033] Among them, 100, acoustic output device; 110, vibration component; 120, mass element; 211, piezoelectric structure; 212, vibration element; 2111, piezoelectric material layer; 2112, substrate; 2113, fixed end; 2114, free end; 411a, beam structure; 430, resonance peak; 440, resonance valley; 420, mass element; 450, resonance peak; 511a, beam structure; 512a, vibration element; 530, resonance valley; 540, resonance valley; 520, mass element; 621a, elastic structure; 621b, elastic structure; 6211b, high-mass material; 621c, elastic structure; 6211c, high-mass material; 720, resonance valley; 710, resonance peak; 8 21. Elastic structure; 811. Beam structure; 822. Mass component; 921. Elastic structure; 911. Beam structure; 922. Mass component; 1021. Elastic structure; 1023. Porous structure; 1122. Mass component; 1121. Elastic element; 1220. Resonance valley; 1210. Resonance peak; 1310. Resonance valley; 1320. Resonance peak; 1410. Resonance peak; 1511. Piezoelectric structure; 1520. Mass element; 1512. Vibrating element; 1610. Second-order valley; 1620. Third-order valley; 1720. Mass element; 1711. Piezoelectric structure; 1810. Resonance peak; 1820. Resonance valley; 1910. Resonance peak; 2010. Resonance peak; 2110. Resonance peak. Detailed Implementation

[0034] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0035] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0036] As indicated in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0037] Flowcharts are used in this specification to illustrate the operations performed by the system according to embodiments of this specification. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0038] This specification provides an acoustic output device. The acoustic output device may include a vibrating component and a mass element. In some embodiments, the vibrating component may include a piezoelectric structure (e.g., a beam structure) and a vibrating element (e.g., a diaphragm, a diaphragm, etc.), the piezoelectric structure being used to convert electrical signals into mechanical vibrations. The vibrating element may be mechanically connected to the piezoelectric structure at a first position to receive the mechanical vibrations and generate a sound signal. In some embodiments, the mass element may be connected to the piezoelectric structure at a second position (e.g., an elastic connection). The first and second positions are located at different positions along the length of the piezoelectric structure (e.g., the beam structure). The mass element elastically connected to the piezoelectric structure can reduce the amplitude difference between the resonance peak and resonance trough of the vibration response at the first position of the piezoelectric structure within a target frequency range (e.g., 50Hz-5000Hz), thereby improving the sound quality of the sound signal. Simultaneously, the elastic connection can dampen the piezoelectric structure, making the vibration response curve of the acoustic output device relatively smooth within the target frequency range, thereby further improving the sound quality of the sound signal generated by the acoustic output device.

[0039] Figure 1 This is a block diagram of an exemplary acoustic output device according to some embodiments of this specification. Figure 1 As shown, the acoustic output device 100 may include a vibration component 110 and a mass element 120.

[0040] In some embodiments, the acoustic output device 100 may include a moving-coil driven acoustic output device, an electrostatic driven acoustic output device, a piezoelectric driven acoustic output device, a moving-iron driven acoustic output device, a gas driven acoustic output device, an electromagnetic driven acoustic output device, or any combination thereof. In some embodiments, the acoustic output device 100 may include a piezoelectric ceramic driven acoustic output device. In some embodiments, the acoustic output device 100 may be implemented as eyeglasses, a smart bracelet, headphones, a hearing aid, a smart helmet, a smartwatch, smart clothing, a smart backpack, a smart accessory, or any combination thereof. For example, the acoustic output device 100 may be functional eyeglasses for nearsightedness, reading glasses, cycling glasses, or sunglasses, or it may be intelligent eyeglasses (e.g., audio glasses with headphone functionality). As another example, the acoustic output device 100 may also be a head-mounted device such as a helmet, an augmented reality (AR) device, or a virtual reality (VR) device. In some embodiments, augmented reality devices or virtual reality devices may include virtual reality helmets, virtual reality glasses, augmented reality helmets, augmented reality glasses, etc., or any combination thereof. For example, virtual reality devices and / or augmented reality devices may include Google Glass, Oculus Rift, HoloLens, Gear VR, etc.

[0041] Vibration component 110 can be used to convert a signal containing sound information into a sound signal. In some embodiments, the signal containing sound information may include an electrical signal, an optical signal, etc. In some embodiments, the sound signal may include bone conduction sound waves or air conduction sound waves, which can be transmitted to the ear via bone conduction or air conduction. For example, vibration component 110 can receive an electrical signal, generate mechanical vibration, and thus output a sound wave. In some embodiments, vibration component 110 may include a conversion structure for converting a signal containing sound information into mechanical vibration. Exemplary conversion structures may include a moving coil structure, an electrostatic structure, a piezoelectric structure, a moving iron structure, a pneumatic structure, an electromagnetic structure, etc., or any combination thereof. In some embodiments, vibration component 110 may include a vibrating element (e.g., a diaphragm, a vibrating plate) for converting mechanical vibration into a sound signal. By way of example only, vibration component 110 may include a piezoelectric structure and a vibrating element, with the vibrating element connected to the piezoelectric structure at a first position, the piezoelectric structure being used to convert a signal containing sound information into mechanical vibration, and the vibrating element being used to receive the mechanical vibration to generate a sound signal. Further description of the vibration component can be found in other parts of this specification, such as Figure 2 And its related descriptions.

[0042] The mass element 120 can be used to provide mass to the mechanical vibration of the vibration assembly 110. This mass is used to change the amplitude difference between the resonance peak and resonance valley of the mechanical vibration generated by the vibration assembly 110, making the frequency response curve relatively flat, thereby improving the sound quality of the sound signal. Taking a piezoelectric structure as an example, the mass element 120 can be connected to the piezoelectric structure at a second position. In some embodiments, the piezoelectric structure can have a beam structure (e.g., a cantilever beam). The first position and the second position can be set at different positions along the length of the beam structure, so that the mass element 120 connected to the second position can be effectively added to the beam structure, thereby changing the vibration state of the beam structure at the first position, and thus changing the vibration state of the vibration assembly 110 connected to the first position. In some embodiments, the beam structure can include a fixed end. Here, the fixed end can refer to a position on the beam structure where the vibration acceleration or acceleration level is less than a vibration acceleration threshold. As an example only, the vibration acceleration level of the fixed end can be less than 0.8dB, 0.6dB, 0.4dB, 0.2dB, or 0.05dB, etc. In some embodiments, the difference between the vibration acceleration level of the beam structure at the first position and the vibration acceleration level at the fixed end can be greater than 20dB, 30dB, 40dB, or 50dB, etc. In some embodiments, within the target frequency range, the vibration response of the piezoelectric structure at the first position has a resonant peak and a resonant trough. The mass element 120 can reduce the amplitude difference between the resonant peak and the resonant trough. As an example only, the target frequency range varies depending on the application field of the acoustic output device; the target frequency range may include 50Hz-5000Hz, 500Hz-3000Hz, 500Hz-2000Hz, or 1000Hz-2000Hz, etc.

[0043] In some embodiments, a second position can be provided such that, within a target frequency range, the mass element 120 can reduce the amplitude difference between the resonant peak and the resonant trough. As an example only, to ensure that the mass element 120 at the second position can minimize the amplitude difference between the resonant peak and the resonant trough, the ratio of the distance between the second position and the fixed end to the length of the beam structure can be greater than 1 / 3, 2 / 5, 2 / 3, etc. In some embodiments, the mass of the mass element 120 can be set such that, within a target frequency range, the mass element 120 can reduce the amplitude difference between the resonant peak and the resonant trough. In some embodiments, the mass of the mass element 120 can be concentrated at the second position or uniformly distributed around the second position. In some embodiments, to avoid the limited effect of reducing the amplitude difference due to an excessively small mass of the mass element 120 and the significant weakening of the piezoelectric structure's vibration due to an excessively large mass, the mass of the mass element 120 can be set within a target mass range. As an example only, the target mass range can include 0.09-6g, 0.1-6g, 0.2-6g, 0.5-6g, or 1-5g, etc.

[0044] In some embodiments, the connection between the mass element 120 and the piezoelectric structure may include an elastic connection. For example, the acoustic output device 100 or the mass element 120 may include an elastic element (not shown), through which the mass element 120 is elastically connected to the piezoelectric structure at a second position. As another example, at least a portion of the mass element 120 may be an elastic structure, through which the mass element 120 is elastically connected to the piezoelectric structure at a second position. In some embodiments, a first elastic coefficient may be set between the mass element 120 and the piezoelectric structure such that, within a target frequency range, the mass element 120 can reduce the amplitude difference between the resonant peak and the resonant trough. By way of example only, the first elastic coefficient between the mass element 120 and the piezoelectric structure may be set in the range of 9 N / m - 6 × 10⁻⁶. 6 N / m, 50N / m-6×10 6 N / m, or 100N / m-6×10 6 Within the range of N / m, etc.

[0045] In some further embodiments, the mass element 120 may be connected to the housing of the acoustic output device 100. This connection may include an elastic connection. For example, the acoustic output device 100 or the mass element 120 may include an elastic element (not shown), through which the mass element 120 is elastically connected to the housing of the acoustic output device 100. As another example, at least a portion of the mass element 120 may be an elastic structure, through which the mass element 120 is elastically connected to the housing of the acoustic output device 100. The elastic connection between the mass element 120 and the housing may have a second elastic coefficient. In some embodiments, a first elastic coefficient may be less than the second elastic coefficient. In some embodiments, the ratio between the second elastic coefficient and the first elastic coefficient may be less than a preset threshold. By way of example only, the ratio between the second elastic coefficient and the first elastic coefficient may be less than 10.

[0046] In some embodiments, the mass element 120 can be of any shape, such as a regular or irregular structure like a cylinder, cuboid, cone, frustum, or sphere. In some embodiments, the material of the mass element 120 can be any material with a certain degree of rigidity, including but not limited to plastic, wood, and metal. In some embodiments, the material of the mass element 120 can also include various metamaterials such as negative stiffness materials and cubic stiffness materials that are beneficial for extending the audio bandwidth of the acoustic output device 100. In some embodiments, the mass element 120 can also be used to provide damping for the mechanical vibration of the vibration assembly 110, which is used to smooth the response curve in the low-frequency range. For example, the mass element 120 itself can provide damping for the vibration assembly 110. As another example, the mass element 120 can include a damping portion that can provide damping for the vibration assembly 110. In some embodiments, the mass element 120 provides damping for the mechanical vibration of the vibration assembly 110 through an elastic connection with the vibration assembly 110. Further description of the mass element 120 can be found in other parts of this specification, such as Figure 3 and its related description.

[0047] It should be understood that, Figure 1 The description of the acoustic output device 100 is for illustrative purposes only and is not intended to limit the scope of this specification. Various modifications and variations can be made by those skilled in the art under the guidance of this specification, and all such modifications and variations will fall within the scope of protection of this specification. In some embodiments, the components shown in the figures may be adjusted according to actual conditions. For example, the acoustic output device 100 may include multiple mass elements. As another example, the acoustic output device 100 may include an elastic element for providing elasticity between the mass elements and the vibrating assembly.

[0048] Figure 2 This is a schematic diagram of the structure of an exemplary vibration assembly according to some embodiments of this specification. For example... Figure 2 As shown, the vibration assembly may include a piezoelectric structure 211 and a vibration element 212. The vibration element 212 may be connected to the piezoelectric structure 211. The connection may include bolt connection, riveting, interference fit, snap-fit, adhesive, injection molding, welding, magnetic attraction, or any combination thereof.

[0049] The piezoelectric structure 211 can be used to convert electrical signals into mechanical vibrations. In some embodiments, the piezoelectric structure may include a piezoelectric material. Exemplary piezoelectric materials may include piezoelectric crystals, piezoelectric ceramics, piezoelectric polymers, etc. Figure 2 As shown, the piezoelectric structure 211 may have a beam structure (e.g., a cantilever beam), which may include a piezoelectric material layer 2111 and a substrate 2112. The metal substrate 2112 extends along the length direction of the beam structure. In the direction perpendicular to the length of the beam structure (e.g., ...), Figure 2Along the length direction L shown, the metal substrate 2112 and the piezoelectric material layer 2111 are overlapped. In some embodiments, the beam structure may include n (n is a positive integer greater than 1) layers of piezoelectric material layer 2111 and n-1 layers of metal substrate 2112, and the metal substrate 2112 and the piezoelectric material layer 2111 may be overlapped along the length direction perpendicular to the beam structure.

[0050] The beam structure may include a fixed end 2113 and a free end 2114. The fixed end here may refer to a location on the beam structure where the vibration acceleration or acceleration level is less than a vibration acceleration threshold. As an example only, the vibration acceleration level of the fixed end 2113 may be less than 0.8dB, 0.6dB, 0.4dB, 0.2dB, or 0.05dB, etc. In some embodiments, the fixed end 2113 may be connected to a fixed position or structure on the acoustic output device. The fixed position or structure here may refer to a location or structure on the acoustic output device where the vibration acceleration or acceleration level is less than a vibration acceleration threshold. For example, the acoustic output device may include a housing (…). Figure 2 (Not shown in the image), the beam structure can be housed within the shell, and its fixed end 2113 can be fixedly connected to the shell. For example, the acoustic output device may include a counterweight, and the fixed end 2113 of the beam structure can be fixedly connected to the counterweight. The free end 2114 can refer to the end of the beam structure that can vibrate freely.

[0051] The vibrating element 212 is used to receive mechanical vibrations and convert them into sound signal output. In some embodiments, the vibrating element 212 can be connected to the piezoelectric structure 211 (or beam structure) at a first position to receive the mechanical vibrations generated by the piezoelectric structure 211. In some embodiments, the first position can be set at a location on the beam structure where the mechanical vibration amplitude is large. The difference between the vibration acceleration level of the beam structure at the first position and the vibration acceleration level of the fixed end 2113 can be greater than a difference threshold. For example, the difference between the vibration acceleration level at the first position and the vibration acceleration level of the fixed end 2113 can be greater than 20dB, 30dB, 40dB, or 50dB, etc. As an example only, the first position connected to the vibrating element 212 can be the free end 2114. In some embodiments, when the acoustic output device is an air-conductive acoustic output device, the vibrating element 212 can be a diaphragm. The diaphragm can receive the mechanical vibrations generated by the piezoelectric structure 211 and further drive the air to vibrate to generate a sound signal. In some embodiments, when the acoustic output device is a bone conduction acoustic output device, the vibration element 212 can be a vibrating plate, which can contact the human body to transmit vibration, thereby generating a sound signal.

[0052] mass components ( Figure 2(Not shown) can be connected to the piezoelectric structure 211 at a second position. In some embodiments, the first position and the second position can be located at different positions along the length of the beam structure. In some embodiments, the second position can be located between the fixed end 2113 of the beam structure and the first position. In some embodiments, the ratio of the distance between the second position and the fixed end 2113 of the beam structure to the length of the beam structure can be greater than 1 / 3, 2 / 5, or 2 / 3, etc. In some embodiments, the piezoelectric structure 211 may resonate when converting an electrical signal into mechanical vibration. Accordingly, the vibration response of the piezoelectric structure 211 at the first position has a resonance peak and a resonance trough. For example, within a target frequency range, the vibration response of the piezoelectric structure 211 at the first position has a resonance peak and a resonance trough. Exemplary target frequency ranges may include 50Hz-5000Hz, 500Hz-3000Hz, 500Hz-2000Hz, or 1000Hz-2000Hz, etc. The mass element can be used to reduce the location and amplitude difference of the resonance peak and valley at the first position, thereby making the vibration waveform of the vibrating element at the first position smoother. In some embodiments, the second position can be located at the antinode (i.e., the position with the largest amplitude) of the mechanical vibration of the beam structure at a specific frequency. In this way, the mechanical vibration of the antinode region (the vibration wave region within a certain range to the left and / or right of the position with the largest amplitude) at that specific frequency can be suppressed by the mass element, and part of the vibration energy is transferred to the first position, thus enhancing the mechanical vibration at that specific frequency at the first position. The specific frequency can be the frequency corresponding to the resonance valley at the first position of the piezoelectric structure. Because the vibration of the piezoelectric structure at the resonance valley is enhanced at the first position, and the damping provided by the mass element reduces the vibration at the resonance peak, the vibration mode of the piezoelectric structure at the first position can be made smoother, thereby effectively improving the sound quality.

[0053] The following will combine Figure 3A and Figure 3B The principle of how a mass element changes the vibration mode of a piezoelectric structure is illustrated by an example. Figure 3A This is a schematic diagram of the equivalent structure of the exemplary beam structure shown in some embodiments of this specification at a second position; Figure 3B This is an equivalent structural diagram showing a mass element connected to a second position in a beam structure according to some embodiments of this specification.

[0054] like Figure 3A As shown, the beam structure under mechanical vibration state, its vibration at the second position can be equivalent to the forced vibration of a single-degree-of-freedom system, and its vibration equation can be expressed as (ignoring the influence of internal damping):

[0055]

[0056] Where m1 represents the mass of the beam structure at the second position (i.e., the antinode region), k1 represents the equivalent elastic coefficient at the second position, ξ represents the vibration displacement at the second position, F represents the magnitude of the excitation force, ω represents the angular frequency of the excitation force, and Fcosωt represents the component of the excitation force along the vibration direction at the second position. A particular solution to equation (1) is:

[0057]

[0058] Where, ω0 This represents the natural angular frequency at the second position. Without considering damping, when the angular frequency ω of the excitation force equals the natural angular frequency ω0 at the second position, resonance occurs at the second position, and the amplitude (displacement ξ) is infinite. Considering the effect of actual damping, the amplitude peaks at this point; that is, the second position (or the antinode region) is where the beam structure experiences its maximum displacement perpendicular to its length.

[0059] In some embodiments, the mass element can be elastically connected to the piezoelectric structure. For example, the mass element can be elastically connected to the piezoelectric structure via an elastic member (e.g., an elastic member disposed independently of the mass element). Alternatively, the mass element can be elastically connected to the piezoelectric structure via its own elastic structure (e.g., an elastic structure integrated with the mass element). In some embodiments, the mass element can be elastically connected to a second location on the beam structure. The vibration of the beam structure at the second location after the mass element is installed can be equivalent to... Figure 3B The forced vibration of the two-degree-of-freedom system is shown. Figure 3B The mass element with mass m2 and the elastic element with elastic coefficient k2 shown represent mass elements elastically connected to the beam structure, and their vibration equation can be expressed as (ignoring the influence of internal damping):

[0060]

[0061] Where ξ2 represents the vibration displacement of the mass element, and the meanings of the other symbols can be found in equation (1) and its related explanations (ξ1 is the same as ξ). A particular solution of equation (3) is:

[0062]

[0063] in, Let α represent the natural angular frequency of the mass element, and α = m2 / m1 be the mass ratio of the mass element to the mass at the second position. Therefore, it can be seen that the natural angular frequency ω of the mass element can be adjusted. r When the angular frequency ω of the excitation force is equal to that of the vibration force, the vibration displacement ξ1 at the second position is zero. At this point, the vibration equation of the mass element is:

[0064]

[0065] Equation (5) can be transformed into:

[0066] k2·ξ2|ω r =ω + Fcosωt = 0. (1)

[0067] As shown in equation (6), the resultant force of the elastic coefficient k2 of the mass element and the excitation force Fcosωt on the second position of the beam structure is zero. Therefore, without considering damping, adding a mass element to the second position of the beam structure can transfer the vibration of the antinode to the mass element, thus eliminating the large-amplitude vibration of the beam structure at the second position. Considering the actual damping effect, adding a mass element to the second position of the beam structure can also significantly suppress or destroy the vibration mode of the beam structure at the second position. At this time, the mechanical vibration generated by the beam structure can be transmitted to the first position, increasing the vibration amplitude at the first position and making the vibration mode smoother, thereby effectively improving the sound quality output by the acoustic output device.

[0068] In some embodiments, the inherent angular frequency ω of the mass element r It can be represented as Therefore, the elastic modulus between the mass element and the piezoelectric structure and / or the mass element can be set, thereby setting the natural angular frequency ω of the mass element. r This allows the mass element to reduce the amplitude difference between the resonant peak and the resonant valley at the first position at the target frequency. For example, the elastic coefficient and / or the mass of the mass element can be set such that the natural angular frequency ω of the mass element... r The frequency is the same as or similar to a preset target frequency, thereby reducing the amplitude difference between the resonant peak and the resonant valley at the first position at the target frequency. As an example only, the target frequency range can be between 50Hz and 5000Hz. Accordingly, the elastic coefficient and / or the mass of the mass element can be set such that the ratio of the elastic coefficient between the mass element and the piezoelectric structure to the mass of the mass element is within (100π). 2 -(10000π) 2 Within a certain range. In some embodiments, the mass of the mass element can be set within a target mass range. As an example only, the target mass range may include 0.09-6g, 0.1-6g, 0.2-6g, 0.5-6g, or 1-5g, etc. Accordingly, in order for the mass element to reduce the amplitude difference between the resonant peak and the resonant valley within the target frequency range, the elastic modulus between the mass element and the piezoelectric structure can be in the range of 9N / m-6×10⁶N / m.

[0069] It should be noted that the above description of the vibration assembly and mass element is for illustrative purposes only and does not limit the scope of this specification. Those skilled in the art can make various modifications and changes to the vibration assembly and mass element under the guidance of this specification. However, these modifications and changes remain within the scope of this specification. For example, Figure 2 The fixed end 2113 shown is located at the end of the beam structure. It should be noted that the fixed end 2113 can also be located at other positions on the beam structure. For example, the mass element may include multiple individually disposed mass blocks.

[0070] The following will combine Figures 4A-4C and Figures 5A-5C Describe the influence of mass elements on the vibration state of a beam structure. Figure 4A This is a vibration diagram of an exemplary beam structure shown in some embodiments of this specification; Figure 4B This is a vibration diagram of the beam structure with connected mass elements according to some embodiments of this specification; Figure 4C This is a vibration response curve of the beam structure shown in some embodiments of this specification at the first position with or without additional mass elements.

[0071] like Figure 4A The beam structure 411a shown resonates during mechanical vibration (e.g., when the angular frequency or frequency of the mechanical vibration is equal to the angular frequency or frequency of the beam structure 411a in this mode of vibration). At this time, the vibration amplitude is largest at the middle of the beam structure 411a, and less mechanical vibration is transmitted to the free end (i.e., the first position), resulting in a smaller vibration amplitude at the first position. Correspondingly, the vibration response of the beam structure 411a at the first position generates a resonance valley. The vibration response curve of the beam structure 411a at the first position is shown below. Figure 4C As shown by the dashed lines in the image. Figure 4C As shown, the vibration response curve of the beam structure 411a at the first position shows a relatively obvious resonance peak 430 and resonance valley 440 in the range of 100Hz-1000Hz (i.e., the mid-low frequency band), which weakens the output of the acoustic output device in the mid-low frequency band, thereby affecting the sound quality of the output sound.

[0072] The output of the acoustic output device in the mid-frequency range can be increased by increasing the vibration amplitude at the first position. For example... Figure 4B As shown, a mass element 420 is elastically connected to the antinode region (i.e., the second position) of the beam structure 411a during mechanical vibration. The mass element 420 can be used to suppress the vibration modes in the antinode region, thereby changing the vibration modes at the first position, enabling the beam structure to output a smoother vibration response curve, thus improving the output of the acoustic output device in this mid-frequency range. The vibration response curve of the beam structure 411a at the first position after connecting the mass element 420 is shown below. Figure 4CAs shown by the solid line in the image. Figure 4C As shown, in the 100Hz-1000Hz range (e.g., around 500Hz), the vibration response curve of the beam structure 411a at the first position produces a resonance peak 450. Compared to the case without a mass element, the amplitude difference between the resonance peak and the resonance valley of the vibration response curve at the first position is significantly reduced, and the response curve in the mid-low frequency range is relatively flat, thereby improving the sound quality of the acoustic output device in the mid-low frequency range. In some embodiments, the elastic connection between the mass element and the beam structure 411a can have a certain damping effect, so that the resonance peak and resonance valley in the mid-low frequency range present a smooth transition, without the transition being too sharp, which is beneficial to the improvement of sound quality.

[0073] Figure 5A and 5B This is a schematic diagram of the vibration of an exemplary vibration assembly shown according to some embodiments of this specification; Figure 5C This is a schematic diagram of a vibration assembly with a connected mass element, as shown in some embodiments of this specification. Figure 5D This is a vibration response curve of the vibration assembly at a first position with or without a mass element, according to some embodiments of this specification.

[0074] like Figure 5A and 5B The vibration assembly shown includes a beam structure 511a and a vibration element 512a. The vibration element 512a is connected to the free end (i.e., the first position) of the beam structure 511a. Figure 5A and 5B The vibration components shown correspond to the vibration modes of the beam structure at different frequencies. Figure 5A and 5B Under the corresponding vibration mode, the vibration amplitude at the first position on the beam structure is relatively small, while the vibration amplitude at other positions is relatively large. For example, as... Figure 5A As shown, the vibration amplitude of beam structure 511a is greatest at position A, resulting in less mechanical vibration being transmitted to the free end (i.e., the first position), thus leading to a smaller vibration amplitude at the first position. The vibration response curve of beam structure 511a at the first position is shown in the figure. Figure 5D As shown by the dashed lines in the diagram. Combined with... Figure 5D Within the 500Hz-1000Hz range, the vibration response curve of the vibrating component at its first position exhibits a resonance valley of 530. For example, as... Figure 5B As shown, the beam structure 511a experiences the greatest vibration amplitude at position B, resulting in less mechanical vibration being transmitted to the free end (i.e., the first position), thus leading to a smaller vibration amplitude at the first position. Combined with... Figure 5D Within the 1000Hz-2000Hz range, the vibration response curve of the vibrating component at the first position exhibits a resonance valley of 540. In some embodiments, such as Figure 5AThe resonance valley 530 shown in the 500Hz-1000Hz range can be called a second-order valley, such as... Figure 5B The resonance valley 540 shown in the 1000Hz-2000Hz range can be called a third-order valley.

[0075] To enhance the second-order and third-order valleys, such as Figure 5C As shown, a mass element 520 is elastically connected to the antinode region of the third-order valley of mechanical vibration in beam structure 511a (i.e., the region where position B is located). The mass element 520 can be used to suppress the vibration modes in the antinode region, thereby changing the vibration mode of beam structure 511a at the first position. The vibration response curve of the vibration assembly at the first position after connecting the mass element 520 is shown in the figure. Figure 5D The solid curve shown is, as Figure 5D As shown, the original second-order and third-order valleys in the 500Hz-2000Hz range (i.e., the mid-low frequency band) are significantly improved. Compared to the case without mass components, the amplitude difference between the resonant peak and the resonant valley is significantly reduced, making the response curve in the mid-low frequency band relatively flat, thereby improving the sound quality of the acoustic output device in the mid-low frequency band.

[0076] In some embodiments, the mass element may include a mass portion having mass and an elastic portion having elasticity. The mass element can achieve an elastic connection with the piezoelectric structure through its elastic portion. In some embodiments, the mass element may further include a damping portion for increasing the vibration damping of the piezoelectric structure, the damping portion serving to smooth the vibration response curve. In some embodiments, the mass portion may include a metallic or non-metallic material. In some embodiments, the damping portion may be implemented as a damping material, such as rubber.

[0077] In some embodiments, the elastic portion may be integrated with the mass portion. Alternatively, the elastic portion may be at least a part of the mass element. For example, at least a part of the mass element may be an elastic structure. The mass element can be elastically connected to the piezoelectric structure through the elastic structure. An exemplary elastic structure may include a spring structure. In some embodiments, the elastic structure may be made of an elastic material. Exemplary elastic materials may include rubber, latex, silicone, sponge, etc., or any combination thereof. In some embodiments, the elastic structure may serve as both the elastic portion and the mass portion. For example, the elastic structure may include a high-mass and / or high-density metal rubber. As another example, a higher-mass material may be added to the elastic structure, such as adding metal powder to a sponge. In some embodiments, the elastic structure may include a damping portion. For example, the elastic structure may be made using a damping material (e.g., nitrile butadiene). As another example, a damping material may be added to the elastic structure, such as a damping coating applied to the surface of the elastic structure or penetrating into the interior of the elastic structure.

[0078] Figure 6This is a schematic diagram of the structure in which the elastic part and the mass part are fused according to some embodiments of this specification. For example... Figure 6 As shown, in some embodiments, high-quality material can be uniformly distributed in the elastic structure 621a. For example, it can be integrally molded after uniformly doping a certain mass of metal powder into silicone. In some embodiments, high-quality material 6211b can be disposed at the central position of the elastic structure 621b. In some embodiments, high-quality material 6211c can be disposed at multiple positions in the elastic structure 621c.

[0079] Figure 7 This is a vibration response curve at the first position when a beam structure, according to some embodiments of this specification, is connected to a mass element that integrates elasticity and mass. For example... Figure 7 As shown, "M_r2=5.1722E-4kg,E_r=1E6 Pa" indicates that the total mass of the mass element is 0.51722g and the elastic modulus between the mass element and the beam structure is 10. 6 The vibration response curve at the first position at Pa. Figure 7 It can be seen that within the 100Hz-1000Hz range, the resonance valley 720 appearing at the first position of the beam structure after adding different mass elements is effectively improved, and the amplitude difference between the resonance peak 710 and the resonance valley 720 is reduced. Therefore, connecting the mass element, which integrates the elastic part and the mass part, to the piezoelectric structure can reduce the amplitude difference between the resonance peak and the resonance valley of the piezoelectric structure at the first position within the target range. In addition, as the mass of the mass element gradually increases, the resonance peak appearing in the low-frequency range (e.g., 80Hz-300Hz) gradually moves closer to the zero point of the horizontal axis. Correspondingly, the sensitivity of the acoustic output device to low frequencies gradually decreases. In some embodiments, in order to ensure the low-frequency sensitivity of the acoustic output device, the total mass of the mass element, which is separately provided for the elastic part and the mass part, can be within the target mass range. As an example only, the target mass range may include 0.09-6g, 0.1-6g, 0.2-6g, 0.5-6g, or 1-5g, etc.

[0080] For example only, Figures 8-10 Examples of mass elements that integrate the elastic and mass components and are connected to a beam structure are shown. Figure 8 This is a schematic diagram of a structure in which a uniformly distributed, elastic mass element is connected to a beam structure, according to some embodiments of this specification. Figure 9 This is a schematic diagram of the structure of an elastically non-uniformly distributed mass element according to some embodiments of this specification. Figure 10 This is a schematic diagram of the structure of a mass element with uniformly distributed mass and / or damping, as shown in some embodiments of this specification.

[0081] like Figure 8As shown, the mass element may include an elastic structure 821. The elastic structure 821 may extend along the length direction of the beam structure 811. The elastic structure 821 may have a plurality of mass portions 822. In some embodiments, the elasticity of the elastic structure 821 may be uniformly distributed along the length direction of the beam structure 811. The mass portions 822 within the elastic structure 821 may be non-uniformly distributed along the length direction of the beam structure 811. For example, as... Figure 8 As shown, the vibration modes of the beam structure 811 at different frequency bands can be represented by the dashed lines in the figure. The mass portion 822 within the elastic structure 821 can be distributed at multiple second positions. These multiple second positions are respectively located in the antinode regions of the beam structure 811 vibration at different frequency bands, thereby reducing the amplitude difference between the resonance peaks and resonance valleys at the first positions at multiple frequency bands and improving the sound quality of the acoustic output device at multiple frequency bands.

[0082] like Figure 9 As shown, the mass element may include an elastic structure 921. The elastic structure 921 may extend along the length direction of the beam structure 911, and may have multiple mass portions 922 within it. In some embodiments, the elastic structure 921 may be non-uniformly distributed along the length direction of the beam structure 911. For example, compared to a region without mass portions 922, a region of the elastic structure 921 with redistributed mass portions 922 may have greater elasticity. As another example, compared to a region with mass portions 922 of smaller mass, a region of the elastic structure 921 with larger mass portions 922 may have greater elasticity.

[0083] like Figure 10 As shown, the elastic structure 1021 may include a pore structure 1023. The pore structure 1023 may include at least one pore. In some embodiments, the pore structure may be uniformly distributed in the elastic structure 1021. In some embodiments, the pore structure 1023 may include a damping material. The damping material can smooth the vibration response curve of the acoustic output device, thereby effectively improving sound quality.

[0084] In some embodiments, the elastic portion may be separated from the mass portion. For example, the elastic portion may include an elastic element, through which the mass element can be elastically connected to the piezoelectric structure. Exemplary elastic elements may include foam, silicone, springs, compression springs, or any combination thereof. In some embodiments, the mass portion may be made of metallic or non-metallic materials. The density of the material may be within a preset density range. In some embodiments, the mass portion may be made of a metal (e.g., iron, copper, or metal alloy) block, an encapsulated liquid, or a battery, circuit board, or other device for an acoustic output device. In some embodiments, the mass portion may be connected to the elastic element. Exemplary connection methods may include bolting, riveting, interference fit, snap-fit, bonding, injection molding, welding, magnetic attraction, or any combination thereof. In some embodiments, both the mass portion and the elastic element may be of any shape, such as a cylinder, cuboid, cone, frustum, sphere, or other regular or irregular structures.

[0085] Figure 11 This is a schematic diagram illustrating the connection between an exemplary elastic element and a mass part according to some embodiments of this specification. Figure 11 As shown, the mass part 1122 is connected to one end of the elastic member 1121. The other end of the elastic member 1121 can be further connected to a piezoelectric structure ( Figure 6 (Not shown) Connection.

[0086] Figure 12 This is a vibration response curve of a beam structure with a connected elastic and mass-separated mass element, as shown in some embodiments of this specification, at a first position. For example... Figure 12 As shown, "M_r2=2.3889E-4kg,E_r=1E6 Pa" indicates that the total mass of the mass element is 0.23889g, and the elastic modulus between the mass element and the beam structure is 10. 6 The vibration response curve at the first position at Pa. Figure 12 It can be seen that within the 100Hz-1000Hz range, when adding mass elements with different masses and elastic separation, the resonance valley 1220 of the vibration response of the beam structure at the first position is effectively improved, and the amplitude difference between the resonance peak 1210 and the resonance valley 1220 decreases. Furthermore, as the mass of the mass element gradually increases, the resonance peak appearing in the low-frequency range (e.g., 80Hz-300Hz) gradually approaches the zero point on the horizontal axis. Correspondingly, the sensitivity of the acoustic output device to low frequencies gradually decreases. In some embodiments, to ensure the low-frequency sensitivity of the acoustic output device, the total mass of the mass elements with the elastic part and mass part separately disposed can be within a target mass range. As an example only, the target mass range may include 0.09-6g, 0.1-6g, 0.2-6g, 0.5-6g, or 1-5g, etc. In some embodiments, combined with... Figure 7 and Figure 12It is known that to achieve a similar resonance valley enhancement effect at the same frequency, the mass required when the mass and elasticity are separated is smaller than the mass required when the mass and elasticity are integrated. In some embodiments, considering the portability of the acoustic output device and the comfort of wearing it, in order to achieve the same sound quality optimization effect and reduce the weight of the acoustic output device, a mass element with the mass part and elasticity part set separately can be used.

[0087] It should be understood that, Figure 6-12 The examples provided are for illustrative purposes only and are not intended to limit the scope of this specification. Various modifications and variations can be made by those skilled in the art under the guidance of this specification; for example, the pore structure 1023 may be non-uniformly distributed in the elastic structure. As another example, in a mass element where the mass part is separated from the elastic part, the mass part may be located on the side of the elastic part. All such modifications and variations will fall within the scope of this specification.

[0088] In some embodiments, the mass of the mass element can be concentrated at the second location of the piezoelectric structure. This concentrated distribution refers to the mass of the mass element being concentrated within the region where the second location is located (e.g., the region with the second location as its geometric center). In some embodiments, the size of the region (e.g., area, side length, diameter, etc.) can be smaller than a preset value. For example, the region can be a square region, and the side length of the square region can be less than 25mm, 20mm, 18mm, 16mm, or 12mm, etc. As another example, the region can be a circular region, and the diameter of the circular region can be less than 25mm, 20mm, 18mm, 16mm, or 12mm, etc. Figure 13 This is a vibration response curve of the piezoelectric structure at the first position when the mass of the mass element shown in some embodiments of this specification is concentrated at the second position. Figure 13 The diagram illustrates the vibration response curves at the first position when the mass of the mass element is concentrated at the second position, and when the mass element and the piezoelectric structure have different elastic moduli. For example, "7.5*1col" represents the response curve at the first position when the mass element is connected to the piezoelectric structure via a single row of rectangular foam with a length of 7.5 mm, and "15*2col" represents the response curve at the first position when the mass element is connected to the piezoelectric structure via a double row of rectangular foam with a length of 15 mm. The length of the rectangular foam can refer to its dimension along the length of the piezoelectric structure (or beam structure). Rectangular foams of different lengths have the same width and thickness. As the length and / or number of rows of rectangular foam increase, the elastic modulus between the mass element and the piezoelectric structure increases. Figure 13It can be seen that when the mass of the mass element is concentrated at the second position, the resonance valley 1310 of the piezoelectric structure at the first position is effectively enhanced when the mass element and the piezoelectric structure have different elastic coefficients. Furthermore, as the elastic coefficient increases, the resonance peak 1320 corresponding to the mass element in the mid-frequency band shifts to the right along the horizontal axis, increasing the effect of smooth damping transition. Therefore, in some embodiments, the frequency corresponding to the mid-frequency peak of the acoustic output device and the sensitivity of the acoustic output device in the mid-frequency band can be adjusted by setting the elasticity of the mass element.

[0089] In some embodiments, the mass of the mass element can be uniformly distributed around the second location. Here, uniform distribution can refer to the mass being uniformly distributed over an area surrounding the second location. In some embodiments, the area of ​​the surrounding area can be within a preset area range. For example, the preset area range can include 1*1mm. 2 -30*30mm 2 1*2mm 2 -30*20mm 2 2*2mm 2 -30*15mm 2 Or 3*3mm 2 -30*10mm 2 wait. Figure 14 This is a vibration response curve of the piezoelectric structure at the first position when the mass elements are concentrated and uniformly distributed according to some embodiments of this specification. Figure 14 The diagram illustrates the vibration response curves at the first position when different masses are concentrated or distributed at the second position, assuming the same elastic modulus between the mass element and the piezoelectric structure. For example, "15*2col+1.5g" represents the response curve at the first position when the mass element is connected to the piezoelectric structure via a double row of rectangular foam with a length of 15mm, and the mass element weighs 1.5g and is concentratedly distributed; "15*2col+distributed 1.5g" represents the response curve at the first position when the mass element is connected to the piezoelectric structure via a double row of rectangular foam with a length of 15mm, and the mass element weighs 1.5g and is uniformly distributed. Figure 14 As shown, compared to a concentrated distribution, a uniform distribution increases the frequency of the resonance peak 1410 at the first position and enhances the damping effect. When a concentrated distribution mass is added to the uniformly distributed mass, the frequency of the resonance peak 1410 at the first position decreases while the damping effect remains unchanged. Therefore, in some embodiments, the frequency corresponding to the mid-frequency peak of the acoustic output device can be adjusted by setting the mass distribution method of the mass element. In some embodiments, given a fixed mass of the mass element, a uniform distribution of mass around the second position on the piezoelectric structure, compared to a concentrated distribution of mass on the second position on the piezoelectric structure, can increase the frequency corresponding to the mid-frequency peak of the acoustic output device and improve the mid-frequency sensitivity.

[0090] Figure 15 This is a schematic diagram of a piezoelectric structure with multiple mass elements connected on it, according to some embodiments of this specification. In some embodiments, such as... Figure 15 As shown, the piezoelectric structure 1511 can have multiple second positions, and the vibrating element 1512 can be connected to the piezoelectric structure 1511 at a first position. The multiple second positions can each be connected to a mass element 1520. The multiple second positions on the piezoelectric structure 1511 can be determined based on the vibration modes of the piezoelectric structure 1511 within different target frequency ranges. For example, in combination with... Figure 3A and 3B According to its description, within a certain target frequency range, the second position can be set at the antinode position when the piezoelectric structure 1511 resonates within that target frequency range. Figure 16 This is a vibration response curve of the piezoelectric structure at a first position after connecting multiple mass elements, as shown in some embodiments of this specification. Figure 16 As shown, "Silicone-3rd Valley Esi1=5.5255E6 Pa" indicates that the elastic modulus of the antinode region of the beam structure at the frequency corresponding to the third valley is 5.5255*10. 6 The vibration response curve at the first position when Pa is a mass element. Combined with... Figure 5D and Figure 16 After connecting mass elements to the antinodes of the beam structure at the frequencies corresponding to the second and third valleys, the second valley 1610 and the third valley 1620 of the first position vibration of the piezoelectric structure 1511 are both enhanced. Furthermore, the damped mass elements can make the vibration response curve at the first position flatter, thereby improving the sound quality of the acoustic output device. Therefore, by adding multiple mass elements to the piezoelectric structure, the output of the acoustic output device in multiple frequency bands can be improved, thus facilitating the enhancement of sound quality across the entire frequency range.

[0091] In some embodiments, the mass element can be fixed by connecting it to other components of the acoustic output device (e.g., battery, housing, etc.). In some embodiments, fixing the mass element can prevent its own vibration from affecting the vibration modes of the vibrating assembly. In some embodiments, the connection between the mass element and the acoustic output device can be an elastic connection. This elastic connection can reduce the impact of the acoustic output device's vibration on the vibration of the vibrating assembly through the mass element, and also reduce the impact of the connection between the mass element and the acoustic output device on the vibration of the mass element. In some embodiments, the mass element is elastically connected to the housing of the acoustic output device. In some embodiments, the elastic connection between the mass element and the housing can be similar to the elastic connection between the mass element and the piezoelectric structure, and will not be described further here. Figure 17This is a schematic diagram illustrating the elastic connection between the mass element, piezoelectric structure, and housing according to some embodiments of this specification. For example... Figure 17 As shown, one side of the mass element 1720 can be elastically connected to the piezoelectric structure 1711 via an elastic structure or elastic element, and the other side of the mass element 1720 can be elastically connected to the housing via an elastic structure or elastic element. Figure 17 (Not shown) Elastic connection.

[0092] In some embodiments, the modulation of the diaphragm mode at the first position of the piezoelectric structure by the mass element can be achieved by setting the elasticity between the mass element and the piezoelectric structure, and the elasticity between the mass element and the housing. In some embodiments, the elastic coefficient between the mass element and the piezoelectric structure (i.e., the first elastic coefficient) can be smaller than the elastic coefficient between the mass element and the housing (i.e., the second elastic coefficient), thereby reducing the amplitude difference between the resonance peak and resonance valley of the vibration at the first position within the target frequency range, thus making the vibration response curve at the first position smoother. Figure 18 This is a vibration response curve of a piezoelectric structure at a first position when the first elastic coefficient and the second elastic coefficient are different, according to some embodiments of this specification. Figure 18 The corresponding elasticity can be achieved using rectangular foam. Here, n1 and n2 represent the number of rectangular foam layers between the mass element and the piezoelectric structure, and the number of rectangular foam layers between the mass element and the shell, respectively. The more layers of rectangular foam, the smaller the corresponding elastic modulus. According to... Figure 18 As shown, setting the first elastic coefficient to be greater than or less than the second elastic coefficient can reduce the amplitude difference between the resonance peak 1810 and resonance valley 1820 of the vibration at the first position in the mid-low frequency range. Furthermore, a first elastic coefficient less than the second elastic coefficient can make the vibration response curve at the first position smoother, which is beneficial for improving the sound quality of the acoustic output device. In some embodiments, the ratio between the second elastic coefficient and the first elastic coefficient can be less than a preset threshold. For example, the ratio between the second elastic coefficient and the first elastic coefficient can be less than 50. Another example, the ratio between the second elastic coefficient and the first elastic coefficient can be less than 40. Another example, the ratio between the second elastic coefficient and the first elastic coefficient can be less than 30. Another example, the ratio between the second elastic coefficient and the first elastic coefficient can be less than 20. Another example, the ratio between the second elastic coefficient and the first elastic coefficient can be less than 10. Yet another example, the ratio between the second elastic coefficient and the first elastic coefficient can be less than 5.

[0093] In some embodiments, by setting the mass ratio mr between the mass element and the vibrating assembly, the mass element can reduce the amplitude difference between the resonance peak and resonance valley of the vibration response at the first position within the target frequency range. In some embodiments, the mass ratio mr between the mass element and the vibrating assembly can also be set to make the vibration response curve in frequency bands outside the target frequency range (e.g., the region after the resonance peak corresponding to the mass element) smoother, thereby improving the sound quality in the corresponding frequency band. The mass of the vibrating assembly can refer to the total mass of the piezoelectric structure and the vibrating element.

[0094] Figure 19 This is a vibration response curve of the piezoelectric structure at the first position corresponding to different mr values ​​when the mass of the vibrating element is 0.5g, according to some embodiments of this specification. For example... Figure 19 As shown, "M_z=5E-4kg,mr=0.1" represents the vibration response curve at the first position when the mass of the vibrating element is 0.5g and mr is 0.1. Combined with... Figure 19 As shown, in some embodiments, when the mass of the vibrating element is 0.1-0.9g, mr can be less than 5. In some embodiments, when the mass of the vibrating element is 0.1-0.9g, mr can be less than 2. In some embodiments, when the mass of the vibrating element is 0.1-0.9g, mr can be less than 1. In some embodiments, to make the vibration response curve in the mid-frequency range after the resonance peak 1910 corresponding to the mass element smoother, mr can be greater than 1.

[0095] Figure 20 This is a vibration response curve of the piezoelectric structure at the first position corresponding to different mr values ​​when the mass of the vibrating element is 1g, according to some embodiments of this specification. Combined with... Figure 19 As shown, in some embodiments, when the mass of the vibrating element is 0.9-1.8g, the mr can be less than 2. In some embodiments, when the mass of the vibrating element is 0.9-1.8g, the mr can be less than 1.5. In some embodiments, when the mass of the vibrating element is 0.9-1.8g, the mr can be less than 0.8. In some embodiments, when the mass of the vibrating element is 0.9-1.8g, in order to make the vibration response curve in the mid-frequency range after the resonance peak 2010 corresponding to the mass element smoother, the mr can be greater than 0.8.

[0096] Figure 21 This is a vibration response curve of the piezoelectric structure at the first position corresponding to different mr values ​​when the mass of the vibrating element is 2g, according to some embodiments of this specification. Combined with... Figure 19As shown, in some embodiments, when the mass of the vibrating element is 1.8-5g, mr can be less than 1. In some embodiments, when the mass of the vibrating element is 1.8-5g, mr can be less than 0.5. In some embodiments, when the mass of the vibrating element is 1.8-5g, mr can be less than 0.2. In some embodiments, when the mass of the vibrating element is 1.8-5g, in order to make the vibration response curve in the mid-frequency range after the resonance peak 2110 corresponding to the mass element smoother, mr can be greater than 0.2.

[0097] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects may be any one or a combination of the above, or any other possible beneficial effects. For example, the sound quality optimization effect of the acoustic output device can be optimized by simultaneously setting the mass ratio mr of the mass element and the mass distribution of the mass element at the second position.

[0098] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification and therefore remain within the spirit and scope of the exemplary embodiments described herein.

[0099] Furthermore, this specification uses specific terms to describe embodiments thereof. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "an embodiment," "one embodiment," or "an alternative embodiment" in different locations throughout this specification do not necessarily refer to the same embodiment. Moreover, certain features, structures, or characteristics in one or more embodiments of this specification can be appropriately combined.

[0100] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this specification are not intended to limit the order of the processes and methods described herein. Although various examples have been discussed in the foregoing disclosure of some embodiments of the invention that are currently considered useful, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the spirit and scope of the embodiments described herein. For example, while the system components described above can be implemented using hardware devices, they can also be implemented solely using software solutions, such as installing the described system on existing servers or mobile devices.

[0101] Similarly, it should be noted that, in order to simplify the description disclosed herein and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of embodiments in this specification may sometimes combine multiple features into a single embodiment, drawing, or description thereof. However, this method of disclosure does not imply that the subject matter of this specification requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of a single embodiment disclosed above.

[0102] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this specification are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0103] For each patent, patent specification, patent specification disclosure, and other materials such as articles, books, specifications, publications, and documents referenced in this specification, the entire contents of these materials are incorporated herein by reference. This excludes historical documents that are inconsistent with or conflict with this specification, as well as documents that limit the broadest scope of the claims in this specification (currently or subsequently appended to this specification). It should be noted that in the event of any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials and the content of this specification, the descriptions, definitions, and / or terminology used in this specification shall prevail.

[0104] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. An acoustic output device, characterized in that, include: Vibration components, including piezoelectric structures and vibrating elements, wherein, The piezoelectric structure is used to convert electrical signals into mechanical vibrations; and The vibrating element is connected to the piezoelectric structure at a first position thereon, and receives the mechanical vibration to generate a sound signal; and A mass element, wherein the mass element is connected to the piezoelectric structure at a second position on the piezoelectric structure; The piezoelectric structure has a beam structure, the second position is located in the antinode region of the mechanical vibration of the beam structure, the number of the mass element is one, or the mass element includes multiple mass parts, the multiple mass parts are distributed in multiple second positions.

2. The acoustic output device according to claim 1, characterized in that, Within the 50Hz-5000Hz range, the vibration response of the piezoelectric structure at its first position has a resonance peak and a resonance valley, and the mass element reduces the amplitude difference between the resonance peak and the resonance valley.

3. The acoustic output device according to claim 1, characterized in that, The beam structure includes a fixed end, and the difference between the vibration acceleration level of the beam structure at the first position and the vibration acceleration level of the fixed end is greater than 20 dB.

4. The acoustic output device according to claim 3, characterized in that, The ratio of the distance between the second position and the fixed end of the beam structure to the length of the beam structure is greater than 1 / 3.

5. The acoustic output device according to claim 1, characterized in that, The ratio of the elastic modulus between the mass element and the piezoelectric structure to the mass element's mass is (100π). 2 -(10000π) 2 Within the range.

6. The acoustic output device according to claim 1, characterized in that, The mass element is further connected to the housing of the acoustic output device, and the ratio of the elastic coefficient between the mass element and the housing to the elastic coefficient between the mass element and the piezoelectric structure is less than 10.

7. The acoustic output device according to claim 6, characterized in that, The elastic modulus between the mass element and the piezoelectric structure is less than the elastic modulus between the mass element and the housing.

8. The acoustic output device according to claim 1, characterized in that, The mass of the vibration element is 0.1-0.9g, and the ratio of the mass of the mass element to the mass of the vibration assembly is less than 5.

9. The acoustic output device according to claim 1, characterized in that, The mass of the vibrating element is 0.9-1.8g, and the ratio of the mass of the mass element to the mass of the vibrating assembly is less than 2.

10. The acoustic output device according to claim 1, characterized in that, The mass of the vibrating element is 1.8-5g, and the ratio of the mass of the mass element to the mass of the vibrating assembly is less than 1.

11. The acoustic output device according to claim 1, characterized in that, The mass element is elastically connected to the piezoelectric structure via an elastic element; or At least a portion of the mass element is an elastic structure, and the mass element is elastically connected to the piezoelectric structure through the elastic structure.

12. The acoustic output device according to claim 11, characterized in that, The elastic structure includes a porous structure, and the porous structure includes a damping material.

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