Electronic device

Abstract

The present disclosure relates to an electronic device, comprising: a photosensitive module, comprising: a first conductive piece for conducting static electricity and at least one second conductive piece for transmitting signals; a circuit mainboard, comprising: a first spring corresponding to the first conductive piece, at least one second spring corresponding to the second conductive piece, and a protection piece; the protection piece is located in the circuit where the second spring in the preset range of the first spring, for inhibiting the transient voltage generated in the process of conducting static electricity. By setting the protection piece on the circuit where the second spring is located, the interference of static electricity on the electronic device can be reduced without affecting the signal quality; since the second spring is located in the preset range of the first spring, by setting the protection piece on the circuit where the second spring in the preset range of the first spring is located, compared with setting the protection piece on all second springs, the material cost of the electronic device can be saved.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and more particularly to an electronic device. Background Technology

[0002] With continuous technological advancements, electronic products are constantly evolving towards smaller size and more powerful functionality. Currently, in the end-user market, electronic devices are becoming increasingly powerful and smaller in size. The chip integration density on printed circuit boards (PCBs) in electronic devices is increasing, and the components are becoming smaller as well. With components becoming smaller and denser, higher demands are placed on the protection of electronic devices.

[0003] In related technologies, due to the existence of gaps in electronic devices, if static electricity is generated during the contact between the electronic device and the outside world, the static electricity can enter the electronic device through the gaps, causing functional damage to the electronic device system (e.g., interference with signal transmission) or damage to the hardware in the electronic device. Summary of the Invention

[0004] This disclosure provides an electronic device.

[0005] An electronic device is provided according to an embodiment of this disclosure, comprising:

[0006] A photosensitive module includes: a first conductive element for electrostatic conduction and at least one second conductive element for signal transmission;

[0007] The circuit board includes: a first spring corresponding to the first conductive element, at least one second spring corresponding to the second conductive element, and a protective element;

[0008] The protective element, located within a preset range of the first spring, is part of the circuit containing the second spring, and is used to suppress transient voltages generated during electrostatic conduction.

[0009] In some embodiments, the protective element is located in the circuit where the second spring is located, which is adjacent to the first spring.

[0010] In some embodiments, the first spring is located at the edge of at least one of the second springs;

[0011] The protective element is a single piece located in the circuit of a second spring adjacent to the first spring.

[0012] In some embodiments, there are at least two second springs, and the first spring is located between any two second springs;

[0013] There are two protective components, each located in the circuit of the two second springs adjacent to the first spring.

[0014] In some embodiments, the electronic device further includes:

[0015] Mid-frame;

[0016] A light guide is located within the middle frame and adjacent to the photosensitive module. The light output surface of the light guide is opposite to the photosensitive surface of the photosensitive module, and is used to transmit the ambient light of the current environment of the electronic device to the photosensitive module.

[0017] In some embodiments, the light input surface of the light guide is exposed to the environment in which the electronic device is currently located through a light-transmitting hole on the mid-frame.

[0018] In some embodiments, the first spring includes: a grounding spring;

[0019] The grounding spring is used to conduct static electricity that has been conducted to the first conductive element through the light-transmitting hole to the grounding terminal of the circuit board when it is electrically connected with the first conductive element.

[0020] In some embodiments, the photosensitive module is used to convert the optical signal transmitted by the light guide into an electrical signal;

[0021] The second spring is used to transmit the electrical signal to the circuit board when it is electrically connected to the second conductive element.

[0022] In some embodiments, the protective element includes a transient voltage suppression diode.

[0023] In some embodiments, one end of the transient voltage suppression diode is connected to a second spring within a preset range of the first spring, and the other end is connected to the ground terminal of the circuit board.

[0024] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0025] The electronic device in this embodiment includes: a photosensitive module, including: a first conductive element for electrostatic conduction and at least one second conductive element for signal transmission; a circuit board, including: a first spring corresponding to the first conductive element, at least one second spring corresponding to the second conductive element, and a protective element; the protective element is a circuit containing the second spring located within a preset range of the first spring, used to suppress transient voltages generated during electrostatic conduction.

[0026] Firstly, by setting a protective component on the circuit where the second spring is located, the interference of static electricity on electronic devices can be reduced without affecting signal quality. Secondly, since the second spring is located within the preset range of the first spring, setting a protective component on the circuit where the second spring is located within the preset range of the first spring can save on the material cost of electronic devices compared to setting a protective component on all second springs.

[0027] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0029] Figure 1 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment. Figure 1 .

[0030] Figure 2 This is a schematic diagram of the structure of a photosensitive module according to an exemplary embodiment.

[0031] Figure 3 This is a schematic diagram illustrating a structure for setting a protective element according to an exemplary embodiment.

[0032] Figure 4 This is a circuit structure diagram illustrating a protective element according to an exemplary embodiment.

[0033] Figure 5 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment. Figure 2 .

[0034] Figure 6 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment. Figure 3 .

[0035] Figure 7 This is a schematic diagram of a static discharge structure according to an exemplary embodiment.

[0036] Figure 8 This is a hardware structure of an electronic device according to an exemplary embodiment. Detailed Implementation

[0037] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0038] Figure 1 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment. Figure 1 ,like Figure 1 As shown, the electronic device 100 includes:

[0039] The photosensitive module 101 includes: a first conductive element 102 for electrostatic conduction and at least one second conductive element 103 for signal transmission;

[0040] The circuit board 104 includes: a first spring 105 corresponding to the first conductive element 102, at least one second spring 106 corresponding to the second conductive element, and a protective element 107.

[0041] The protective element 107, located within a predetermined range of the first spring 105 and the circuit containing the second spring 106, is used to suppress transient voltages generated during electrostatic conduction.

[0042] In this embodiment of the disclosure, the electronic device can be a wearable electronic device and a mobile terminal, including smartphones, laptops and tablets, and the wearable electronic device includes a smartwatch. The embodiments of this disclosure are not limited.

[0043] In some embodiments, the photosensitive module can be used to collect optical signals and convert the collected optical signals into electrical signals, which can then be used to adjust the device parameters of the electronic device. For example, the electrical signals can be used to control the brightness of the display screen of the electronic device.

[0044] In this embodiment, the photosensitive module includes a first conductive element and a second conductive element. The first conductive element can be used to conduct static electricity; the second conductive element can be used to transmit signals. In some embodiments, the first and second conductive elements may include metal components, such as gold fingers; or, for example, metal springs. It should be noted that the gold fingers are metal conductive contacts that can serve as an interface for establishing electrical connections between the photosensitive module and peripheral circuits.

[0045] In some embodiments, the first conductive element can be connected to the ground terminal on the circuit board; wherein, the number of the first conductive element can be one or more, which can be set as needed.

[0046] In other embodiments, the first conductive element may also include a grounded conductive element.

[0047] In some embodiments, the second conductive element can be connected to a corresponding connection interface on the circuit board. The number of second conductive elements can be one or more, depending on the requirements.

[0048] In this embodiment, the circuit board includes a first contact spring and a second contact spring. The first and second contact springs can be metal sheets with a certain degree of elasticity and ductility. In some embodiments, one end of the first contact spring can be electrically connected to a first conductive element, and the other end of the first contact spring can be fixed to the circuit board; one end of the second contact spring can be electrically connected to a second conductive element, and the other end of the second contact spring can be fixed to the circuit board.

[0049] In some embodiments, the first contact spring can be used to receive static electricity transmitted by the first conductive element. The number of first contact springs can be one or more, depending on the needs. When there are multiple first contact springs, protective elements can be provided for each first contact spring according to the layout described above. For example, a protective element can be provided in the circuit containing the second contact spring within a preset range of the first first contact spring, and a protective element can be provided in the circuit containing the second contact spring adjacent to the second first contact spring.

[0050] In some embodiments, the first spring can be a grounding spring.

[0051] In some embodiments, the second spring can be used to receive signals transmitted by the second conductive element. The number of second springs can be one or more, depending on the requirements. For example, if there are three second conductive elements, the number of second springs can also be set to three.

[0052] In some embodiments, the position of the first spring can be determined based on the position of the first conductive element; that is, the position of the first spring can correspond to the position of the first conductive element. The position of the second spring can also be determined based on the position of the second conductive element; that is, the position of the second spring can correspond to the position of the second conductive element.

[0053] In some embodiments, when the distance between the first conductive element and the second conductive element is similar, the distance between the first spring and the second spring is also similar. That is, the second spring located within a preset range of the first spring can also be understood as the second spring corresponding to the second conductive element within the preset range of the first conductive element.

[0054] In some embodiments, when there are multiple second conductive elements and multiple second spring contacts, signal transmission can be achieved through each second conductive element and each second spring contact respectively. In the embodiments of this disclosure, when a second conductive element is electrically connected to a corresponding second spring contact, it can transmit serial data from the photosensitive module to the circuit board, so that the circuit board can adjust the device parameters of the electronic device based on the received serial data; wherein, the serial data may include: an electrical signal converted by the photosensitive module based on the collected optical signal.

[0055] Taking a scenario with three second conductive elements and three second contact springs as an example, the serial data line (SDA) in the photosensitive module can be electrically connected to the corresponding first second contact spring through the first second conductive element, enabling the circuit board to receive the serial data transmitted by the photosensitive module. The serial clock line (SCL) in the photosensitive module can also be electrically connected to the corresponding second second contact spring through the second second conductive element, ensuring the synchronization of the serial data received by the circuit board. Furthermore, the power signal module in the photosensitive module can be electrically connected to the corresponding third second contact spring through the third second conductive element, thereby providing operating voltage to the photosensitive module. The power signal module may include: VIO18_PMU.

[0056] In other embodiments, when there are multiple second conductive elements and multiple second springs, different signals can be transmitted through each second conductive element and each second spring. Taking two second conductive elements and two second springs as an example, a first electrical signal can be transmitted to the circuit board through a first second spring connected to a first second conductive element; a second electrical signal can also be transmitted to the circuit board through a second second spring connected to a second second conductive element. The first electrical signal may include: an electrical signal converted by the photosensitive module based on ambient light when the ambient light brightness collected by the photosensitive module is less than a preset ambient light brightness; the second electrical signal may include: an electrical signal converted by the photosensitive module based on ambient light when the ambient light brightness collected by the photosensitive module is greater than or equal to the preset ambient light brightness.

[0057] In some embodiments, the photosensitive module further includes a printed circuit board (PCB) and a photosensitive chip disposed on the PCB. The photosensitive chip can be fixed to the PCB to prevent it from moving. The photosensitive chip can include a CMOS chip, a CCD chip, etc. In some embodiments, the PCB can be any of a rigid board, a flexible board, or a rigid-flex board. The photosensitive chip can be soldered to the PCB using pads or metal bumps. The pads or metal bumps can be made of copper-tin, or copper-silver, copper-tin-silver, copper-nickel-tin, copper-nickel-silver, copper-nickel-tin-silver, etc.

[0058] In some embodiments, the circuit board may further include: a PCB, various functional components disposed on the PCB, a control chip, and a processor, etc. The circuit board can provide connection interfaces for pre-connected components. For example, connection interfaces for display components, power supply, and audio output components of electronic devices.

[0059] In some embodiments, since the connection between the first conductive element and the first spring is an electrical connection, there will be capacitive impedance at the contact point between the first conductive element and the first spring. When static electricity flows back from the first conductive element of the photosensitive module to the first spring in the circuit board, a sudden voltage will be generated due to the capacitive impedance, and it cannot be discharged in a short time, resulting in a secondary discharge near the first spring. At this time, the static electricity will enter the second spring adjacent to the first spring, thereby causing functional damage to the circuit board or damage to the components in the circuit board.

[0060] In some embodiments, the protective element can be a voltage limiting protection device. By placing the protective element on the circuit where the second spring is located within a preset range of the first spring, transient voltages generated during electrostatic conduction can be suppressed, thereby protecting the circuits in the main board. The protective element may include a transient voltage suppressor (TVS) diode.

[0061] In some embodiments, the preset range may include a range within a preset radius centered on the first spring piece; for example, it may be a range of 1 cm from the first spring piece, or even a range of 0.5 cm from the first spring piece. The preset range can be set according to actual needs, and no specific limitation is made here.

[0062] Figure 2 This is a schematic diagram illustrating the structure of a photosensitive module according to an exemplary embodiment, such as... Figure 2 As shown. Taking one first conductive element 102 and three second conductive elements 103 as an example, the first conductive element 102 is located on the far right of the three second conductive elements 103.

[0063] Figure 3 This is a schematic diagram illustrating a structure for providing a protective element according to an exemplary embodiment, such as... Figure 3 As shown. Taking one first conductive element and three second conductive elements as an example, there is one first spring and three second springs. When the first conductive element is located on the far right of the three second conductive elements, the position of the first spring is on the far right of the three second springs. In this case, the protective element can be set in the circuit of the second spring adjacent to the first spring, so only one protective element is needed, which can reduce the material cost.

[0064] Figure 4 This is a circuit structure diagram illustrating a protective element according to an exemplary embodiment, such as... Figure 4 As shown. Taking the second conductive element as an example to electrically connect the power signal module (VIO18_PMU) in the photosensitive module to the corresponding second contact spring, and the protection element is located on the second contact spring, the device includes: a first contact spring (GND contact spring), a second contact spring (VIO18 contact spring), a TVS, a capacitor, and a switching power supply chip.

[0065] The electronic device in this embodiment includes: a photosensitive module, including: a first conductive element for electrostatic conduction and at least one second conductive element for signal transmission; a circuit board, including: a first spring corresponding to the first conductive element, at least one second spring corresponding to the second conductive element, and a protective element; the protective element is a circuit containing the second spring located within a preset range of the first spring, used to suppress transient voltages generated during electrostatic conduction.

[0066] Firstly, by setting a protective component on the circuit where the second spring is located, the interference of static electricity on electronic devices can be reduced without affecting signal quality. Secondly, since the second spring is located within the preset range of the first spring, setting a protective component on the circuit where the second spring is located within the preset range of the first spring can save on the material cost of electronic devices compared to setting a protective component on all second springs.

[0067] In some embodiments, the protective element is located in the circuit where the second spring is located, which is adjacent to the first spring.

[0068] In some embodiments, the circuit containing the corresponding second spring can be protected according to the electrostatic discharge path. When electrostatic discharge is conducted to the first conductive element, the first conductive element will transfer the electrostatic discharge to the first spring. However, since the connection between the first conductive element and the first spring is an electrical connection, there will be capacitive impedance at the contact point between the first conductive element and the first spring. When the electrostatic discharge flows back to the first spring in the circuit board through the first conductive element of the photosensitive module, a sudden voltage will be generated due to this capacitive impedance, and it cannot be discharged in a short time, resulting in a secondary discharge near the first spring. At this time, the electrostatic discharge will enter the second spring adjacent to the first spring, thereby causing functional damage to the circuit board or damage to the components in the circuit board. Therefore, a protective device can be set in the circuit containing the second spring adjacent to the first spring.

[0069] In some embodiments, when the first spring is located at the leftmost or rightmost position of at least one second spring, it is determined whether there are other sensitive signals besides the photosensitive signal in the vicinity of the first spring. If there are no other sensitive signals, a protective element can be installed in the circuit where the second spring adjacent to the first spring is located. If there are other sensitive signals, a protective element can be installed in the circuit where the second spring adjacent to the first spring is located and in the circuit that transmits the sensitive signal. The photosensitive signal can be understood as the signal transmitted from the photosensitive module to the main circuit board.

[0070] In other embodiments, when the first spring is located between any two second springs, protective elements can be provided on the circuits of the two second springs adjacent to the first spring. In this case, the number of second springs can include at least two, that is, the number of second springs can be greater than or equal to 2.

[0071] In some embodiments, a protective element is provided in the circuit where the second spring is located, which is adjacent to the first spring, so that static electricity can be conducted to the ground terminal of the circuit board through the protective element.

[0072] In some embodiments, the first spring is located at the edge of at least one of the second springs;

[0073] The protective element is a single piece located in the circuit of a second spring adjacent to the first spring.

[0074] In some embodiments, the edge position may include: the leftmost edge of at least one second spring piece, and may also include: the rightmost edge of at least one second spring piece.

[0075] In some embodiments, when the first spring is located on the far left of at least one second spring, a protective element may be provided. The protective element may be located in the circuit of a second spring adjacent to the first spring, thus saving material costs for the electronic device. The number of second springs may include multiple springs or only one.

[0076] In other embodiments, if the first spring is located on the far right of at least one second spring, the protective element can be located in the circuit where a second spring is located adjacent to the first spring.

[0077] In some embodiments, there are at least two second springs, and the first spring is located between any two second springs;

[0078] There are two protective components, each located in the circuit of the two second springs adjacent to the first spring.

[0079] In some embodiments, the number of second spring pieces may include three or four, which can be set according to actual needs and is not specifically limited here.

[0080] In some embodiments, when the first spring is located between any two second springs, the protective element can be configured as two, which can be respectively located in the circuits of the two second springs adjacent to the first spring.

[0081] Figure 5 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment. Figure 2 ,like Figure 5 As shown, the electronic device includes:

[0082] Mid-frame 501;

[0083] The light guide 502 is located inside the middle frame 501 and adjacent to the photosensitive module 101. The light output surface of the light guide 502 is opposite to the photosensitive surface of the photosensitive module 101, and is used to transmit the ambient light of the current environment of the electronic device to the photosensitive module 101.

[0084] In some embodiments, the middle frame includes: the edge of the electronic device and a frame enclosed by the edge. The middle frame can form a surrounding space, which can be an open space on both sides enclosed by the frame. The middle frame can include various shapes such as rectangle and circle.

[0085] In some embodiments, a groove can be provided in the middle frame to hold the light guide post in place.

[0086] In some embodiments, the light guide is adjacent to the photosensitive module; wherein the light output surface of the light guide is opposite to the photosensitive surface of the photosensitive module, and can be used to transmit ambient light from the current environment of the electronic device to the photosensitive module. Ambient light may include light provided by any light source in the environment where the electronic device is located. It can be understood that the electronic device can receive light provided by any light source, including but not limited to sunlight and lamp light. In some embodiments, the light guide may include a light guide column.

[0087] In some embodiments, the light input surface of the light guide is exposed to the environment in which the electronic device is currently located through a light-transmitting hole on the mid-frame.

[0088] In some embodiments, the mid-frame further includes a light-transmitting hole. In this embodiment, the light input surface of the light guide can be exposed to the environment in which the electronic device is currently located through the light-transmitting hole on the mid-frame, so that the light guide can transmit the ambient light in which the electronic device is currently located to the photosensitive module.

[0089] Figure 6 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment. Figure 3 ,like Figure 6 As shown. The electronic device includes: a mid-frame 501, a light guide 502, and a photosensitive module 101. Figure 6 This is a three-dimensional structural diagram of the mid-frame 501, light guide 502, and photosensitive module 101.

[0090] In some embodiments, the first spring includes: a grounding spring;

[0091] The grounding spring is used to conduct static electricity that has been conducted to the first conductive element through the light-transmitting hole to the grounding terminal of the circuit board when it is electrically connected with the first conductive element.

[0092] In some embodiments, static electricity can enter the photosensitive module through the gap in the light guide post and flow back along the first conductive element in the photosensitive module to the grounding spring in the circuit board. In this way, the grounding spring can conduct the static electricity to the ground terminal of the circuit board. For example, the static electricity can be conducted to the circuit of the circuit board through the second spring corresponding to the grounding spring, and then to the ground terminal of the circuit board through the circuit. Alternatively, a wire can be provided between the circuit board and the photosensitive module; when one end of the wire is connected to the grounding spring, the static electricity can be directly conducted to the ground terminal of the circuit board through the wire.

[0093] In some embodiments, the causes of static electricity may include: static electricity generated by friction between the electronic device and external objects, such as static electricity generated by friction between the electronic device and the bag when the electronic device is placed in the bag; it may also include: static electricity generated when a user touches the electronic device.

[0094] Figure 7 This is a schematic diagram of a static discharge structure according to an exemplary embodiment, such as... Figure 7 As shown. Taking the first spring 105 as one and the second spring 106 as three as an example, the first spring 105 is located at the rightmost of the three second springs 106. Static electricity 701 can enter the photosensitive module 101 from the light guide column gap 702 and flow back to the first spring 105 in the circuit board along the first conductive element 102 in the photosensitive module 101. Since the first spring 105 is electrically connected to the first conductive element 102, the first spring 105 can conduct static electricity to the second spring 106 adjacent to the first spring 105.

[0095] In some embodiments, the photosensitive module is used to convert the optical signal transmitted by the light guide into an electrical signal;

[0096] The second spring is used to transmit the electrical signal to the circuit board when it is electrically connected to the second conductive element.

[0097] In some embodiments, the photosensitive module can be used to convert the optical signal transmitted by the light guide into an electrical signal, and transmit the electrical signal to the main circuit board via a second spring. In this way, the main circuit board can adjust the device parameters of the electronic device based on the received electrical signal. For example, the electrical signal can be used to control the brightness of the display screen of the electronic device.

[0098] In some embodiments, the protective element includes a transient voltage suppression diode.

[0099] In some embodiments, the protective element may be a TVS, and the TVS model may include PESD3V3V1BCSF, which operates at a voltage of 3.3 volts (V).

[0100] In some embodiments, a TVS is a high-efficiency protection device that is typically connected in parallel in a circuit. When the circuit is operating normally, the TVS is in a high-resistance state; when an abnormal overvoltage occurs and reaches the breakdown voltage of the TVS, the TVS becomes a low-resistance state, providing a low-impedance conduction path for instantaneous current while clamping the abnormal high voltage within a safe level to protect the circuit; when the abnormal overvoltage disappears, the TVS returns to the high-resistance state, and the circuit operates normally.

[0101] In some embodiments, one end of the transient voltage suppression diode is connected to a second spring within a preset range of the first spring, and the other end is connected to the ground terminal of the circuit board.

[0102] In some embodiments, a transient voltage suppression diode can be provided in the circuit where the second spring is located within a preset range of the first spring. This not only reduces the interference of static electricity on electronic devices without affecting signal quality, but also saves on the material costs of electronic devices.

[0103] In some embodiments, one end of the transient voltage suppression diode can be connected to a second spring within a preset range of the first spring, and the other end can be connected to the ground terminal of the circuit board, so as to transfer the static electricity entering the circuit where the second spring is located to the ground terminal of the circuit board, thereby protecting the circuit where the second spring is located.

[0104] In some embodiments, the preset range may include a range within a preset radius centered on the first spring piece; for example, it may be a range of 1 cm from the first spring piece, or even a range of 0.5 cm from the first spring piece. The preset range can be set according to actual needs, and no specific limitation is made here.

[0105] Figure 8 This describes the hardware structure of an electronic device according to an exemplary embodiment. For example, the electronic device may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0106] Reference Figure 8 The electronic device may include one or more of the following components: processing component 802, memory 804, power supply component 806, multimedia component 808, audio component 810, input / output (I / O) interface 812, sensor component 814, and communication component 816.

[0107] Processing component 802 typically controls the overall operation of an electronic device, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0108] Memory 804 is configured to store various types of data to support the operation of the electronic device. Examples of this data include instructions for any application or method operating on the electronic device, contact data, phonebook data, messages, pictures, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0109] Power supply component 806 provides power to various components of an electronic device. Power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device.

[0110] Multimedia component 808 includes a screen that provides an output interface between the electronic device and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When the electronic device is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0111] Audio component 810 is configured to output and / or input audio signals. For example, audio component 810 includes a microphone (MIC) configured to receive external audio signals when the electronic device is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

[0112] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0113] Sensor assembly 814 includes one or more sensors for providing state assessments of various aspects of the electronic device. For example, sensor assembly 814 can detect the on / off state of the electronic device, the relative positioning of components such as the display and keypad of the electronic device, changes in the position of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, the orientation or acceleration / deceleration of the electronic device, and temperature changes of the electronic device. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0114] Communication component 816 is configured to facilitate wired or wireless communication between electronic devices and other devices. The electronic devices can access wireless networks based on communication standards, such as WiFi, 4G, or 5G, or combinations thereof. In one exemplary embodiment, communication component 816 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 816 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0115] In an exemplary embodiment, the electronic device may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0116] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0117] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, include: A photosensitive module includes: a first conductive element for electrostatic conduction and at least one second conductive element for signal transmission; the first conductive element includes: a grounded conductive element; the second conductive element is used to transmit an electrical signal converted by the photosensitive module based on the acquired optical signal; The circuit board includes: a first contact spring corresponding to the first conductive element, at least one second contact spring corresponding to the second conductive element, and a protective element; the first conductive element is electrically connected to the first contact spring, and the portion of the first conductive element in contact with the first contact spring has capacitive impedance. During the process of static electricity flowing back from the first conductive element of the photosensitive module to the first contact spring in the circuit board, a sudden transient voltage is generated based on the capacitive impedance; the second contact spring is used to receive the signal transmitted by the second conductive element. The protective component, located within a predetermined range of the first spring, is used to suppress transient voltages generated during electrostatic conduction. The protective component includes a transient voltage suppression diode, one end of which is connected to the second spring within the predetermined range of the first spring, and the other end of which is connected to the ground terminal of the circuit board.

2. The electronic device according to claim 1, characterized in that, The protective element is located in the circuit where the second spring is located, which is adjacent to the first spring.

3. The electronic device according to claim 1, characterized in that, The first spring is located at the edge of at least one of the second springs; The protective element is a single piece located in the circuit of a second spring adjacent to the first spring.

4. The electronic device according to claim 1, characterized in that, There are at least two second springs, and the first spring is located between any two second springs; There are two protective components, each located in the circuit of the two second springs adjacent to the first spring.

5. The electronic device according to claim 1, characterized in that, The electronic device also includes: Mid-frame; A light guide is located within the middle frame and adjacent to the photosensitive module. The light output surface of the light guide is opposite to the photosensitive surface of the photosensitive module, and is used to transmit the ambient light of the current environment of the electronic device to the photosensitive module.

6. The electronic device according to claim 5, characterized in that, The light input surface of the light guide is exposed to the environment in which the electronic device is currently located through the light-transmitting hole on the middle frame.

7. The electronic device according to claim 6, characterized in that, The first spring includes: a grounding spring; The grounding spring is used to conduct static electricity that has been conducted to the first conductive element through the light-transmitting hole to the grounding terminal of the circuit board when it is electrically connected with the first conductive element.

8. The electronic device according to claim 5, characterized in that, The photosensitive module is used to convert the optical signal transmitted by the light guide into an electrical signal; The second spring is used to transmit the electrical signal to the circuit board when it is electrically connected to the second conductive element.

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