Separating immersion cooling device and separating immersion cooling system

Abstract

This invention discloses a separate immersion cooling device and a separate immersion cooling system. The separate immersion cooling system includes a separate immersion cooling device, which comprises a condensation device, multiple cooling tanks, multiple outflow pipes, and multiple return pipes. The separate immersion cooling device is suitable for cooling a device immersed in a cooling tank for dissipating heat.

Description

Technical Field

[0001] This invention relates to a cooling device and a cooling system, and more particularly to an immersion cooling device and a cooling system. Background Technology

[0002] Existing immersion cooling systems typically house one or more coolers within a cooling tank. However, due to the need to disassemble and reassemble devices to be cooled inside the cooling tank, the coolers cannot be placed in locations that would obstruct the disassembly or reassembly of these devices. Therefore, the coolers are often placed side-by-side with the devices to be cooled. This results in a relatively large volume of immersion cooling systems and limited utilization of the internal space of the cooling tank.

[0003] Furthermore, due to limitations in the condensation capacity of the coolers, multiple cooling tanks, each containing multiple coolers, not only consume energy during operation but also have limited condensation efficiency. Summary of the Invention

[0004] This invention provides a detachable immersion cooling device. According to some embodiments, the detachable immersion cooling device includes a condensing device, multiple cooling tanks, and piping assemblies. The condensing device includes a condenser located inside the condensing device. The cooling tanks are detachably connected to the condensing device, each cooling tank including an outlet and a return port, with the outlet located higher than the return port. Each piping assembly connects its outlet to the condensing device and its return port to the condensing device.

[0005] According to some embodiments, the condensing device includes a housing, multiple condensing inlets, multiple condensing outlets, and a partition. The housing has a accommodating space, and the partition is located between the condensing inlets and condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, the vapor space is connected to the condensing space, and the condenser is located in the condensing space.

[0006] According to some embodiments, the piping assembly includes multiple outflow pipes and multiple return pipes. The outflow pipes connect the outflow outlets to the condenser inlets. The return pipes connect the return outlets to the condenser outlets.

[0007] According to some embodiments, each cooling tank of the separate immersion cooling device has a liquid adjustment hole, and the cooling tanks are connected through the liquid adjustment holes. The position of each liquid adjustment hole in its cooling tank corresponds to the position of the return port of the cooling tank.

[0008] According to some embodiments, the piping assembly of the separate immersion cooling device includes multiple liquid regulating pipes, the number of which is one less than the number of cooling tanks, and each liquid regulating pipe connects two of the cooling tanks.

[0009] According to some embodiments, each cooling tank of the separate immersion cooling device also includes a cover and a sensor. The sensor is located in the cover, wherein the sensor senses the movement of the cover and generates an activation signal.

[0010] According to some embodiments, the condensation device also includes a fan located at the junction of the vapor space and the condensation space, which, when receiving one of the start signals, pumps fluid from the vapor space toward the condensation space.

[0011] According to some embodiments, the partition of the separate immersion cooling device includes a connecting side and an unconnected side, the unconnected side being located at the connection between the vapor space and the condensation space, and the connecting side being connected to the housing and located between the condensation inlet and the condensation outlet.

[0012] The present invention further proposes a separate immersion cooling device. According to some embodiments, the separate immersion cooling device includes a condensing device, multiple cooling tanks, and a piping assembly. The condensing device includes a condenser located inside the condensing device. The cooling tanks are detachably connected to the condensing device, each cooling tank including an outlet and a liquid regulating port, and one of the multiple cooling tanks including a return port, with the outlet located higher than the return port. The piping assembly connects the outlet to the condensing device, connects the return port to the condensing device, and also connects to the liquid regulating port.

[0013] According to some embodiments, the piping assembly includes multiple outlet pipes, return pipes, and leveling pipes. The outlet pipes connect the outlets to the condenser inlets. The return pipes connect the condenser outlets to the return inlets. The leveling pipes connect to the leveling port.

[0014] The present invention also proposes a separate immersion cooling system, which, according to some embodiments, includes multiple servers, a condensation device, multiple cooling tanks, and a piping assembly.

[0015] The condensing unit includes a housing, multiple condensing inlets, multiple condensing outlets, a partition, and a condenser. The housing has a accommodating space. The partition is located between the condensing inlets and condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, the vapor space is connected to the condensing space, and the condenser is located in the condensing space.

[0016] The cooling tanks are detachably connected to the condenser unit. Each cooling tank is used to house a portion of the servers. The distance between the wall of each cooling tank and the corresponding server's casing ranges from 1.5 to 2.0 mm. Each cooling tank includes an outlet and a return outlet, with the outlet located higher than the return outlet. The piping assembly includes multiple outlet pipes and multiple return pipes. The outlet pipes connect the outlets to the condenser inlets. The return pipes connect the return outlets to the condenser outlets.

[0017] According to some embodiments, each cooling tank of the separate immersion cooling system has a liquid adjustment hole, and the cooling tanks are connected through the liquid adjustment holes. The position of each liquid adjustment hole in its cooling tank corresponds to the position of the return port of the cooling tank.

[0018] According to some embodiments, the piping assembly of the separate immersion cooling system includes multiple liquid regulating pipes, the number of which is one less than the number of cooling tanks, and each liquid regulating pipe connects to two of the cooling tanks.

[0019] According to some embodiments, each cooling tank of the separate immersion cooling system also includes a cover and a sensor. The sensor is located in the cover, wherein the sensor senses the movement of the cover and generates an activation signal.

[0020] According to some embodiments, the condenser of the split immersion cooling system further includes a fan located at the connection between the vapor space and the condensation space. When the fan receives one of the start signals, it pumps fluid from one of the vapor spaces to the condensation space.

[0021] According to some embodiments, the partition of the separate immersion cooling system includes multiple connected sides and unconnected sides. The unconnected sides are located at the connection between the vapor space and the condensation space, and the connected sides are connected to the housing. One of the connected sides is located between the condensation inlet and the condensation outlet.

[0022] The present invention also proposes a separate immersion cooling system, which, according to some embodiments, includes multiple servers, a condensation device, multiple cooling tanks, and a piping assembly.

[0023] The condensing unit includes a housing, multiple condensing inlets, condensing outlets, a partition, and a condenser. The housing has a accommodating space. The partition is located between the condensing inlets and condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, the vapor space is connected to the condensing space, and the condenser is located in the condensing space.

[0024] The cooling tanks are detachably connected to the condenser unit. Each cooling tank is used to house a portion of the servers. The distance between the wall of each cooling tank and the corresponding server's casing ranges from 1.5 to 2.0 mm. Each cooling tank includes an outlet and a liquid leveling port, and one of the cooling tanks includes a return port. The piping assembly includes multiple outlet pipes, return pipes, and leveling pipes. The outlet pipes connect the outlets to the condenser inlets; the return pipes connect the condenser outlets and the return ports; and the leveling pipes connect to the liquid leveling ports.

[0025] According to some embodiments, the separate immersion cooling device, because its condenser is located outside the cooling tank, eliminates the need to reserve space inside the cooling tank for the condenser, thus effectively utilizing the internal space of the cooling tank. A single cooling tank can accommodate multiple devices to be cooled. According to some embodiments, the condenser in the condenser is not limited by the internal space of the cooling tank; users can select large-size condensers with high condensing power to improve condensation capacity. According to some embodiments, the multiple cooling tanks of the separate immersion cooling device can be combined in a diverse and flexible manner, not limited by the type and size of the condenser, thereby saving manufacturing costs. According to some embodiments, externally configuring the condenser instead of arranging multiple condensers (or condensers) inside the cooling tank saves manufacturing costs.

[0026] According to some embodiments, the separate immersion cooling system includes separate immersion cooling units suitable for cooling multiple servers. Since the condenser is located outside the cooling tank, there is no need to reserve space for the condenser within each cooling tank, effectively utilizing the internal space of the cooling tank; a single cooling tank can accommodate multiple servers. According to some embodiments, because the condenser in the condenser is not limited by the internal space of the cooling tank, users can select large-size, high-capacity condensers based on the power and number of servers. According to some embodiments, multiple cooling tanks can be combined in a diverse and flexible manner, not limited by the type and size of the condenser; therefore, users can plan the cooling tanks used based on the size and number of servers, saving manufacturing costs. Furthermore, according to some embodiments, the separate immersion cooling system places the condenser outside the cooling tank, replacing the existing method of placing multiple condenser units (or condensers) inside the cooling tank, thus saving manufacturing costs. Attached Figure Description

[0027] Figure 1 A perspective view of a split-type immersion cooling device according to some embodiments;

[0028] Figure 2 A side view of a split immersion cooling apparatus according to some embodiments;

[0029] Figure 3 A perspective view of a split-type immersion cooling device according to some embodiments;

[0030] Figure 4 A perspective view of a split-type immersion cooling device according to some embodiments;

[0031] Figure 5 A perspective view of a split-type immersion cooling device according to some embodiments;

[0032] Figure 6 A perspective view of a split-type immersion cooling device according to some embodiments;

[0033] Figure 7 A perspective view of a split-type immersion cooling device according to some embodiments;

[0034] Figure 8 This is a schematic diagram illustrating the usage of a split-type immersion cooling device according to some embodiments;

[0035] Figure 9 This is a top view of the cooling tank in a split immersion cooling system according to some embodiments, omitting the condensation device, outflow pipe, and return pipe.

[0036] Symbol Explanation

[0037] 100: Separate Immersion Cooling System

[0038] 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H: Separate immersion cooling device

[0039] 10: Piping Assembly

[0040] 11: Condensation unit

[0041] 111: Box

[0042] 112: Condensation Inlet

[0043] 113: Condensate outlet

[0044] 114: partition

[0045] 1141: Connecting edge

[0046] 1142: No connected edge

[0047] 115: Condenser

[0048] 1151: Cooling pipe

[0049] 116: Fan

[0050] 12: Cooling tank

[0051] 121: Outlet

[0052] 122: Return port

[0053] 123: Adjustment hole

[0054] 124: Cover

[0055] 125: Sensor

[0056] 126: Wall

[0057] 13: Outflow pipe

[0058] 14: Return pipe

[0059] 15: Liquid preparation tube

[0060] 16: Multi-port pipe

[0061] 17: Positioning tube

[0062] 2: Server

[0063] 21: Outer shell

[0064] H: Distance

[0065] D: Vertical direction

[0066] L: Condensate

[0067] S: Storage space

[0068] S1: Vapor space

[0069] S2: Condensation space

[0070] V: Hot steam Detailed Implementation

[0071] Please see Figure 1 and Figure 2 , Figure 1 A perspective view of a split immersion cooling apparatus 1A according to some embodiments is shown. Figure 2 A side view of a separate immersion cooling device 1B according to some embodiments is shown. The separate immersion cooling devices 1A and 1B include a condensation device 11, a plurality of cooling tanks 12, and a piping assembly 10.

[0072] The condensing unit 11 includes a condenser 115 located inside the condensing unit 11. Cooling tanks 12 are detachably connected to the condensing unit 11. Each cooling tank 12 includes an outlet 121 and a return port 122. The outlet 121 is located higher than the return port 122; "higher" means that in a vertical direction D, the outlet 121 is higher than the return port 122. Piping assemblies 10 connect the outlets 121 to the condensing unit 11 respectively, and the return ports of the piping assemblies 10 also connect to the condensing unit 11 respectively.

[0073] in accordance with Figure 1In the illustrated embodiment, the condensing device 11 includes a housing 111, multiple condensing inlets 112, multiple condensing outlets 113, a partition 114, and a condenser 115. The condensing inlets 112 and condensing outlets 113 are located below the housing 111, on opposite sides below the housing 111. The housing 111 has a receiving space S. The partition 114 is located between the condensing inlets 112 and condensing outlets 113, dividing the receiving space S into a vapor space S1 and a condensing space S2. The condensing inlets 112 connect to the vapor space S1, and the condensing outlets 113 connect to the condensing space S2. The vapor space S1 connects to the condensing space S2. The condenser 115 is located in the condensing space S2. The condenser 115 includes multiple cooling pipes 1151. In some embodiments, the cooling pipes 1151 are copper pipes. In some embodiments, the condenser 115 is a water-cooled condenser 115. In other embodiments, the condenser 115 is an air-cooled condenser 115. These embodiments can all be used for condensation capabilities that condense hot vapor into a liquid state; however, the present invention does not limit the type of condenser 115.

[0074] in accordance with Figure 1 In the illustrated embodiment, there are two cooling tanks 12. In some embodiments, there are more than two cooling tanks 12. The piping assembly 10 includes a plurality of outflow pipes 13 and a plurality of return pipes 14, the outflow pipes 13 connecting the outflow outlets 121 to the condensation inlets 112 respectively. The return pipes 14 connecting the return outlets 122 to the condensation outlets 113 respectively. Figure 1 In the illustrated embodiment, the number of outlets 121 is the same as the number of condenser inlets 112, and the number of return ports 122 is the same as the number of condenser outlets 113. Each outlet 121 is connected to each condenser inlet 112 via an outlet pipe 13. Each return port 122 is connected to the condenser outlet 113 via a return pipe 14. In some embodiments, the cooling tank 12 contains a working fluid and a device to be cooled, such as a server. The server is immersed in the working fluid, which is liquid. The outlets 121 are positioned above the liquid surface of the working fluid in the vertical direction D, and the return ports 122 may be positioned below or above the liquid surface of the working fluid. After the working fluid absorbs the heat energy generated by the server, it forms hot vapor. The hot vapor enters the vapor space S1 of the cooling device through the outlets 121, outlet pipes 13, and condenser inlets 112 for condensation (see below for details).

[0075] like Figure 2As shown, the vapor space S1 is connected to the condensation space S2. The connection point between the two is located at the upper part of the accommodating space S in the vertical direction D. Thus, as hot vapor flows upward in the vapor space S1, it further reaches the condensation space S2 through the connection point. After being condensed by the condenser 115, the hot vapor condenses into condensate L, which then flows downward. Next, the condensate L flows back to each cooling tank 12 through the condensation outlet 113, the return pipe 14, and the return port 122, completing the circulation of hot vapor cooling into condensate.

[0076] The partition 114 of the separate immersion cooling device 1B includes a connecting edge 1141 and an unconnected edge 1142. The unconnected edge 1142 is located at the connection between the vapor space S1 and the condensation space S2. The connecting edge 1141 is connected to the housing 111 and located between the condensation inlet 112 and the condensation outlet 113. That is, multiple condensation inlets 112 and multiple condensation outlets 113 are respectively located on both sides of the connecting edge 1141. The connecting edge 1141 can be one or more, depending on... Figure 1 and Figure 2 In the illustrated embodiment, the connecting edge 1141 includes the connection point between the partition 114 and the bottom of the housing 111 and the inner wall of the housing 111. The unconnected edge 1142 can be one or more, indicating that it is not connected to the housing 111. With this partition 114 structure, the accommodating space S can be divided into a vapor space S1 and a condensation space S2. Since the connecting edge 1141 of the partition 114 is located between the condensation inlet 112 and the condensation outlet 113, it can effectively separate the hot vapor and the condensate L.

[0077] Please see Figure 3 A perspective view of a separate immersion cooling apparatus 1C according to some embodiments is shown. Each cooling tank 12 of the separate immersion cooling apparatus 1C has a liquid regulating hole 123, the position of which corresponds to the position of a return port 122 in the same cooling tank 12. In some embodiments, the position of the liquid regulating hole 123 in the vertical direction D is equal to the position of the return port 122. In other embodiments, the position of the liquid regulating hole 123 in the vertical direction D is lower than the position of the return port 122. Figure 3 In the illustrated embodiment, the position of the regulating hole 123 is lower than the position of the return port 122. The cooling tanks 12 are connected through the regulating holes 123. According to some embodiments, the regulating holes 123 of two cooling tanks 12 can be connected through the regulating pipe 15 of the piping assembly 10. By utilizing the principle of the connecting pipe, the amount of working fluid in each cooling tank 12 is evenly distributed, so that the liquid level of the working fluid in each cooling tank 12 is consistent. This prevents the amount of working fluid returning to each cooling tank 12 after condensation in the cooling device from being different, which would affect the heat dissipation capacity of the cooling tanks 12.

[0078] Please see Figure 4 and Figure 5 Perspective views of separate immersion cooling apparatuses 1D and 1E according to some embodiments are shown respectively. According to... Figure 4 In the illustrated embodiment, the number of liquid regulating pipes 15 is equal to the number of cooling tanks 12. According to... Figure 5 In the embodiment shown, the number of liquid regulating pipes 15 is one less than the number of cooling tanks 12. In some embodiments, such as Figure 4 and Figure 5 In the embodiment shown, some of the multiple cooling tanks 12 have two liquid adjustment holes 123.

[0079] Please see Figure 6 A perspective view of a split-type immersion cooling device 1F according to some embodiments is shown. The piping assembly 10 includes a multi-port pipe 16 that connects to the liquid leveling holes 123 of the cooling tanks 12, distributing the amount of working fluid evenly through the multi-port pipe 16 to ensure that the liquid level of the working fluid in each cooling tank 12 is the same. Multiple multi-port pipes 16 can be connected to the cooling tanks 12, depending on... Figure 6 In the illustrated embodiment, the multi-port pipe 16 has three pipes. In some embodiments, the multi-port pipe 16 has four pipes, depending on the number and arrangement of the cooling tanks 12, and the present invention is not limited thereto.

[0080] Please see Figure 7 The diagram illustrates a perspective view of a detachable immersion cooling apparatus 1G according to some embodiments. The detachable immersion cooling apparatus 1G includes a condenser 11, a plurality of cooling tanks 12, and a piping assembly 10. The condenser 11 includes a condenser 115 located inside the condenser 11. The cooling tanks 12 are detachably connected to the condenser 11, each cooling tank 12 including an outlet 121 and a regulating port 123. One of the multiple cooling tanks includes a return port 122, with the outlet 121 positioned higher than the return port 122. The piping assembly 10 connects the outlet 121 to the condenser 11, connects the return port to the condenser, and also connects the regulating port 123 (see below for details).

[0081] in accordance with Figure 7 In the illustrated embodiment, the piping assembly 10 includes multiple outflow pipes 13, return pipes 14, and adjusting pipes 17. The multiple outflow pipes 13 connect the outflow outlets 121 to the condenser inlet 112, while the return outlets 122 are correspondingly connected to the condenser outlets 113 via the return pipes 14. The adjusting pipes 17 connect to multiple adjusting holes 123 to balance the amount of working fluid in each cooling tank 12, ensuring a consistent liquid level in each cooling tank 12.

[0082] Please see Figure 8The diagram illustrates the usage state of the separate immersion cooling device 1H according to some embodiments. A cooling tank 12 contains working fluid, and multiple devices to be cooled are immersed in the cooling tank 12 (not shown). Each cooling tank 12 also includes a cover 124 and a sensor 125. The sensor 125 is located on the cover 124 and can sense the movement of the cover 124 to generate an activation signal. For example, an activation signal is emitted when the cover 124 is lifted. The condensation device 11 also includes a fan 116 located at or near the connection between the vapor space S1 and the condensation space S2. When the fan 116 receives one of the activation signals, it pumps the fluid (such as hot vapor V of the working fluid) from the vapor space S1 towards the condensation space S2. In some embodiments, sensor 125 is a reed switch. When the cover 124 of the cooling tank 12 is lifted, the reed switch transmits a start signal to fan 116. Fan 116 then activates its 100% extraction capacity, allowing the hot vapor V in the cooling tank 12 to quickly enter the accommodating space S for condensation. The hot vapor V condenses into condensate L, protecting the user from contact with the working fluid and preventing the hot vapor V from escaping. According to some embodiments, each sensor 125 of the separate immersion cooling device does not emit a start signal when the corresponding cover 124 is closed. There may be one or more fans 116, depending on the user's needs and the size of the accommodating space S. According to some embodiments, when there is only one fan 116, as long as the cover 124 of any one of the multiple cooling tanks 12 is open, fan 116 will still operate at 100%. According to some embodiments, when there are multiple fans 116, all fans 116 will operate at 100% capacity as long as the cover 124 of any one cooling slot 12 is open. According to other embodiments, when there are multiple fans 116, the fan 116 (which may be one or more) corresponding to the cooling slot 12 whose cover 124 is open will operate at 100% capacity; "corresponding" here refers, for example, to the cooling slot 12 and the fan 116 being positionally aligned. According to some embodiments, when all the covers 124 of the cooling slots 12 are closed, the sensor 125 will not send a start signal, and at this time, whether there is one or more fans 116, they will stop operating.

[0083] Please see Figure 9 The diagram illustrates a top view of the cooling tank 12 in a split immersion cooling system 100 according to some embodiments. To illustrate the relationship between the cooling tank 12 and the server 2, a simplified view is provided. Figure 9 The condenser unit 11, outlet pipe 13, and return pipe 14 are omitted. The separate immersion cooling system 100 includes multiple servers 2, condenser units 11, multiple cooling tanks 12, and piping assemblies 10. For information on the condenser unit 11, cooling tanks 12, and piping assemblies 10, please refer to [link to relevant documentation]. Figures 1 to 8And the above-mentioned related explanations. The condenser 11 and cooling tank 12 used in the separate immersion cooling system 100 can be Figures 1 to 8 The present invention is not limited to any of the embodiments shown.

[0084] like Figure 9 As shown, each cooling tank 12 is filled with working fluid. The cooling tank 12 is used to house a portion of the multiple servers 2. The distance H between the wall 126 of the cooling tank 12 and the outer casing 21 of the corresponding server 2 (i.e., the server 2 placed within the cooling tank 12) ranges from 1.5 to 2.0 mm. Since the condensation device 11 is located outside the cooling tank 12 (see...), Figure 8 Users do not need to consider the size of the external cooling device, based on Figure 9 In the embodiment shown, for each cooling tank 12, the space within the cooling tank 12 can be effectively utilized to immerse multiple servers 2, and the volume ratio of the cooling tank 12 is greatly reduced.

[0085] According to some embodiments, users can select a suitable outlet pipe based on factors such as the power of the condenser, the power of the device to be cooled, and the rate at which the working fluid generates hot steam. This includes the material, length, and pipe diameter. The present invention is not limited in these respects.

[0086] According to some embodiments, the separate immersion cooling device, because its condenser is located outside the cooling tank, eliminates the need to reserve space for the condenser within the cooling tank, effectively utilizing the internal space of the cooling tank. A single cooling tank can accommodate multiple devices to be cooled. According to some embodiments, the condenser in the condenser is not limited by the internal space of the cooling tank; users can select large-size condensers with high condensing power to enhance condensation capacity. According to some embodiments, the multiple cooling tanks of the separate immersion cooling device can be combined in a diverse and flexible manner, not limited by the type and size of the condenser, thus saving manufacturing costs. According to some embodiments, replacing the existing method of arranging multiple condensers (or condensers) inside the cooling tank with an externally configured condenser saves manufacturing costs.

[0087] According to some embodiments, the separate immersion cooling system includes separate immersion cooling units suitable for cooling multiple servers. Since the condenser is located outside the cooling tank, there is no need to reserve space for the condenser within each cooling tank, effectively utilizing the internal space of the cooling tank. Multiple servers can be placed in a single cooling tank. According to some embodiments, because the condenser in the condenser is not limited by the internal space of the cooling tank, users can select large-size, high-capacity condensers based on the power and number of servers. According to some embodiments, multiple cooling tanks can be combined in a diverse and flexible manner, not limited by the type and size of the condenser. Therefore, users can plan the cooling tanks used according to the size and number of servers, saving manufacturing costs. Furthermore, according to some embodiments, the separate immersion cooling system places the condenser outside the cooling tank, replacing the existing method of placing multiple condenser units (or condensers) inside the cooling tank, thus saving manufacturing costs.

Claims

1. A separate immersion cooling device, comprising: A condensing device, comprising a condenser located inside the condensing device; Multiple cooling tanks, detachably connected to the condensation device, each cooling tank including an outlet and a return port, the outlet being located higher than the return port; and The piping assembly connects each of its outlets to the condenser unit, and each of its return ports connects each of its return ports to the condenser unit. wherein The condensing device includes a housing, multiple condensing inlets, multiple condensing outlets, and a partition. The housing has a accommodating space. The partition is located between the condensing inlets and the condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, the vapor space is connected to the condensing space, and the condenser is located in the condensing space.

2. The separate immersion cooling device as described in claim 1, wherein, The partition includes a connecting edge and an unconnected edge. The unconnected edge is located at the connection between the vapor space and the condensation space, and the connecting edge is connected to the housing and located between the condensation inlets and the condensation outlets.

3. The separate immersion cooling device as described in claim 1, wherein, Each cooling tank has a liquid adjustment port, and the cooling tanks are connected through the liquid adjustment ports. The position of each liquid adjustment port in its cooling tank corresponds to the position of the return port of the corresponding cooling tank. The piping assembly includes a plurality of liquid adjustment pipes, the number of which is one less than the number of cooling tanks. Each liquid adjustment pipe connects two of the cooling tanks.

4. The separate immersion cooling device as described in claim 1, wherein, Each of these cooling tanks also includes: Cover; and The sensor is located within the cover. The sensor generates a start signal by sensing the movement of the cover.

5. The separate immersion cooling device as described in claim 4, wherein, The condensation device also includes a fan located at the junction of the vapor space and the condensation space. The start signal activates the fan, which pumps the fluid from the vapor space toward the condensation space.

6. The separate immersion cooling device as described in claim 1, wherein, The condensing device includes a housing, multiple condensing inlets, multiple condensing outlets, and a partition. The housing has a accommodating space. The partition is located between the condensing inlets and the condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, and the vapor space is connected to the condensing space. The condenser is located in the condensing space. The piping assembly includes multiple liquid regulating pipes, the number of which is one less than the number of cooling tanks. Each cooling tank has a liquid regulating hole, and the cooling tanks are connected through these holes. Each liquid regulating hole is located in the cooling tank corresponding to the location of the return port of that cooling tank. Each liquid regulating pipe connects two of the cooling tanks. Each of these cooling tanks further includes: Cover; and The sensor is located within the cover. The sensor should sense the movement of the cover to generate a start signal; The condensation device further includes a fan located at the junction of the vapor space and the condensation space. When the fan receives one of the activation signals, it draws fluid from the vapor space towards the condensation space. The partition includes a connecting edge and an unconnected edge. The unconnected edge is located at the connection between the vapor space and the condensation space, and the connecting edge is connected to the housing and located between the condensation inlets and the condensation outlets.

7. A separate immersion cooling device, comprising: A condensing device, comprising a condenser located inside the condensing device; Multiple cooling tanks, detachably connected to the condensation device, each cooling tank including an outlet and a liquid regulating port, one of the cooling tanks including a return port, the outlet being located higher than the return port; and The piping assembly connects each of the outlets to the condenser, connects the return port to the condenser, and also connects to the liquid leveling ports. in, The condensing device includes a housing, multiple condensing inlets, condensing outlets, and a partition. The housing has a accommodating space. The partition is located between the condensing inlets and the condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, the vapor space is connected to the condensing space, and the condenser is located in the condensing space.

8. The separate immersion cooling device as described in claim 7, wherein, The partition includes an unconnected side and multiple connected sides. The unconnected side is located at the connection between the vapor space and the condensation space. The connected sides are connected to the housing. One of the connected sides is located between the condensation inlets and the condensation outlets.

9. The separate immersion cooling device as described in claim 7, wherein, Each of these cooling tanks also includes: Cover; and The sensor is located within the cover. The sensor generates a start signal by sensing the movement of the cover.

10. The separate immersion cooling device as described in claim 9, wherein, The condensation device also includes a fan located at the junction of the vapor space and the condensation space. The start signal activates the fan, which pumps the fluid from the vapor space toward the condensation space.

11. The separate immersion cooling device as described in claim 7, wherein, The condensing device includes a housing, multiple condensing inlets, multiple condensing outlets, and a partition. The housing has a accommodating space. The partition is located between the condensing inlets and the condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, the vapor space is connected to the condensing space, and the condenser is located in the condensing space. Each of these cooling tanks also includes: Cover; and The sensor is located within the cover. The sensor should sense the movement of the cover to generate a start signal; The condensation device further includes a fan located at the connection between the vapor space and the condensation space. The start signal activates the fan, which draws fluid from the vapor space towards the condensation space. The partition includes an unconnected side and multiple connected sides. The unconnected side is located at the connection between the vapor space and the condensation space. The connected sides are connected to the housing. One of the connected sides is located between the condensation inlets and the condensation outlets.

12. A separate immersion cooling system, comprising: The separate immersion cooling device as described in claim 1; and Multiple servers, among which, Each cooling tank is used to house a portion of the servers, and the distance between the wall of each cooling tank and the corresponding server casing ranges from 1.5 to 2.0 mm.

13. The separate immersion cooling system as described in claim 12, wherein, Each of these cooling tanks also includes: Cover; and The sensor is located within the cover. The sensor generates a start signal by sensing the movement of the cover.

14. The separate immersion cooling system as described in claim 13, wherein, The condensation device also includes a fan located at the junction of the vapor space and the condensation space. The start signal activates the fan, which pumps the fluid from the vapor space toward the condensation space.

15. The separate immersion cooling system as described in claim 12, wherein, The condensing device includes a housing, multiple condensing inlets, multiple condensing outlets, and a partition. The housing has a accommodating space. The partition is located between the condensing inlets and the condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, and the vapor space is connected to the condensing space. The condenser is located in the condensing space. The piping assembly includes multiple liquid regulating pipes, the number of which is one less than the number of cooling tanks. Each cooling tank has a liquid regulating hole, and the cooling tanks are connected through these holes. Each liquid regulating hole is located in the cooling tank corresponding to the location of the return port of that cooling tank. Each liquid regulating pipe connects two of the cooling tanks. Each of these cooling tanks further includes: Cover; and The sensor is located within the cover. The sensor should sense the movement of the cover to generate a start signal; The condensation device further includes a fan located at the junction of the vapor space and the condensation space. When the fan receives one of the activation signals, it draws fluid from the vapor space towards the condensation space. The partition includes a connecting edge and an unconnected edge. The unconnected edge is located at the connection between the vapor space and the condensation space, and the connecting edge is connected to the housing and located between the condensation inlets and the condensation outlets.

16. A separate immersion cooling system, comprising: The separate immersion cooling device as described in claim 7; and Multiple servers, among which, Each cooling tank is used to house a portion of the servers, and the distance between the wall of each cooling tank and the corresponding server casing ranges from 1.5 to 2.0 mm.

17. The separate immersion cooling system as described in claim 16, wherein, Each of these cooling tanks also includes: Cover; and The sensor is located within the cover. The sensor generates a start signal by sensing the movement of the cover.

18. The separate immersion cooling system as described in claim 17, wherein, The condensation device also includes a fan located at the junction of the vapor space and the condensation space. When the fan receives one of the activation signals, it pumps the fluid from the vapor space toward the condensation space.

19. The separate immersion cooling system as described in claim 16, wherein, The condensing device includes a housing, multiple condensing inlets, multiple condensing outlets, and a partition. The housing has a accommodating space. The partition is located between the condensing inlets and the condensing outlets to divide the accommodating space into a vapor space and a condensing space. The condensing inlets are connected to the vapor space, the condensing outlets are connected to the condensing space, the vapor space is connected to the condensing space, and the condenser is located in the condensing space. Each of these cooling tanks further includes: Cover; and The sensor is located within the cover. The sensor should sense the movement of the cover to generate a start signal; The condensation device further includes a fan located at the junction of the vapor space and the condensation space. When the fan receives one of the activation signals, it draws fluid from the vapor space towards the condensation space. The partition includes an unconnected side and multiple connected sides. The unconnected side is located at the connection between the vapor space and the condensation space. The connected sides are connected to the housing. One of the connected sides is located between the condensation inlets and the condensation outlets.

20. A separate immersion cooling device, comprising: A condensing device, comprising a condenser located inside the condensing device; Multiple cooling tanks, detachably connected to the condensation device, each cooling tank including an outlet and a return port, the outlet being above the liquid level and the return port below the liquid level, with the outlet located higher than the return port; and The piping assembly connects each of its outlets to the condenser and each of its return ports to the condenser.

Images