A three-dimensional funnel-shaped passive heat dissipation structure

Abstract

The present application relates to the field of electronic or photonic chip heat dissipation, circuit element heat dissipation, etc., the traditional passive heat dissipation structure does not consider the heat flow direction, and the area of simple metal sheet and air convection heat exchange is also very limited, the present application discloses a three-dimensional funnel-shaped passive heat dissipation structure, a plurality of high-thermal-conductivity annular funnel structure heat dissipation monomers are fixed on the bottom plate, and the area between the heat dissipation monomers is filled with heat dissipation medium. In use, the bottom plate is in contact with the element to be cooled, and the upper end of the heat dissipation monomer is in contact with air. Compared with the traditional copper sheet heat dissipation of the same size, the present application can obtain lower temperature of the element to be cooled at the same heat power of the element to be cooled, and save more materials. The present application is used for CPU heat dissipation, power supply heat dissipation, graphics card heat dissipation and other occasions requiring high efficiency and stable heat dissipation.

Description

Technical fields:

[0001] This invention relates to the fields of heat dissipation of electronic or photonic chips and heat dissipation of circuit components, and more specifically, to a three-dimensional funnel-shaped passive heat dissipation structure. Background technology:

[0002] In today's technologically advanced society, the miniaturization and integration of electronic devices have made heat dissipation a critical issue. Effective heat dissipation for electronic devices helps extend their lifespan, improve performance, and reduce malfunctions. Generally, heat dissipation methods are divided into active and passive heat dissipation. While most passive heat dissipation methods are less efficient than active ones, they are more reliable, quieter, simpler in structure, and do not require additional energy. Traditional passive heat dissipation structures often use copper or aluminum metal sheets, relying on these high thermal conductivity materials for heat transfer, primarily through natural convection. However, these traditional passive heat dissipation structures do not consider guiding the direction of heat flow, and the area of ​​heat exchange between the metal sheet and the air is very limited. This is because traditional passive heat dissipation does not consider structural design. Another significant drawback of traditional passive heat dissipation structures is the limited selection of materials. The failure to integrate structural design with material selection leads to weak heat dissipation and low material efficiency in traditional passive heat dissipation devices. Summary of the Invention:

[0003] To address the aforementioned problems and shortcomings, this invention provides a three-dimensional funnel-shaped passive heat dissipation structure for electronic devices. This invention primarily aims to solve the problems of weak heat dissipation effect and low material saving in existing passive heat dissipation structures.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A three-dimensional passive heat dissipation structure for electronic devices includes several annular funnel-shaped heat dissipation units made of high thermal conductivity material. The heat dissipation units are fixedly connected to one side of a base plate and are in a coaxial position. The space between the heat dissipation units is filled with a heat dissipation medium.

[0006] Furthermore, the heat dissipation medium is a gas or liquid used for convective heat dissipation.

[0007] Furthermore, the base plate is connected to the heat dissipation component using a high thermal conductivity adhesive, and the base plate material is the same as the heat dissipation unit material.

[0008] Furthermore, several heat dissipation units include a connecting end face connected to the base plate and an inclined surface for heat dissipation. The inclined surfaces of all heat dissipation units have the same inclination direction, the thickness of the inclined surface increases uniformly from the connecting end face to the top surface of the inclined surface, and the area of ​​the top surface of the inclined surface is greater than the area of ​​the connecting end face.

[0009] Furthermore, the number of heat dissipation units shall not be less than two.

[0010] Furthermore, the height of each heat sink unit is the same.

[0011] Furthermore, the tilt angle of the heat sink unit ranges from 0° to 90°.

[0012] In use, the component to be cooled is connected to the base plate of the heat dissipation structure using a high thermal conductivity adhesive. This invention can be widely used for CPU cooling, power supply cooling, graphics card cooling, and other applications requiring high efficiency and stable heat dissipation.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] (1) Simple materials and material saving: The heat dissipation structure of the present invention only requires a high thermal conductivity material to form an annular funnel array structure.

[0015] (2) The structure of the present invention is a passive heat dissipation system, which does not require additional power to maintain the heat dissipation system.

[0016] (3) Good heat dissipation effect: Compared with the traditional passive heat dissipation structure, it can reduce the final average temperature of the chip to be cooled by a lot. Attached Figure Description

[0017] Figure 1 This is a cross-sectional side view of the three-dimensional structure of the present invention;

[0018] Figure 2 This is a top view of the three-dimensional structure of the present invention;

[0019] Figure 3 This is a three-dimensional view of the structure of the present invention;

[0020] Figure 4 and Figure 5 These are trend graphs showing the final average temperature of the chip as a function of heat generation power after the structure of this invention and the traditional copper sheet heat dissipation structure of the same size are used to dissipate heat on the same type of chip.

[0021] In the diagram, 1-heat sink unit, 2-sloping surface, 3-bottom surface. Detailed Implementation

[0022] To make the advantages, design methods and processes of the present invention clearer, the technical solutions of the present invention will be clearly described below. Obviously, the described examples are only one implementation scheme of the present invention, but are by no means a limitation of the present invention. Any other changes in form made according to the innovative concept of the present invention should be considered within the technical scope of the present invention.

[0023] like Figures 1-3As shown, this invention discloses a three-dimensional funnel-shaped passive heat dissipation structure, comprising several annular funnel-shaped heat dissipation units 1 made of a high thermal conductivity material. These heat dissipation units 1 are fixedly connected to a base plate 3. The heat dissipation units 1 have different diameters, and all heat dissipation units are coaxial. The base plate 3 is connected to the element to be cooled by a high thermal conductivity adhesive. Figure 2 As can be seen from the top view, the top surfaces of several heat dissipation units 1 are concentric circles, and the space between the heat dissipation units 1 is filled with a heat dissipation medium, which is a gas or liquid used for convective heat dissipation.

[0024] Several heat dissipation units 1 include a connecting end face that connects to the base plate 3 and an inclined surface 2 for heat dissipation, such as Figure 1 and Figure 2 As shown, the inclined surfaces of all heat sink units have the same inclination direction. The thickness of the inclined surface 2 increases uniformly from the connecting end to the top surface of the inclined surface. The area of ​​the top surface of the inclined surface 2 is greater than the area of ​​the connecting end. The height of the heat sink units 1 is the same. The inclination angle of the heat sink units 1 ranges from 0° to 90°. In the embodiment shown in the figure, the heat sink unit 1 is in the shape of a hollow frustum.

[0025] Figure 1 This is a cross-sectional view of the structure of the present invention along the axial direction. The plurality of heat dissipation units 1 of the present invention are arranged sequentially from the inside to the outside according to the size of the funnel structure. The size and thickness of the connecting end face of the heat dissipation unit 1, the size and thickness of the inclined surface 2, and the spacing between adjacent heat dissipation units 1 can all be adjusted according to the actual heat dissipation requirements. Air or other low thermal conductivity materials only need to fill the space between each annular funnel.

[0026] The number and height of the heat dissipation units can be adjusted according to the heat dissipation requirements, and the number of heat dissipation units shall not be less than 2.

[0027] Example 1:

[0028] like Figure 1 As shown, Figure 1 This is a cross-sectional side view of a three-dimensional structure; in this example, Figure 1 The high thermal conductivity material of the heat sink unit is copper, with a thermal conductivity k = 398 W / (m·K). The heat dissipation medium is air. In this embodiment, the largest heat sink unit, inclined surface 2, has a top surface diameter of 48 mm, a connecting end surface diameter of 24 mm, and a height of 2 mm. The spacing between the sides of each heat sink unit away from the base plate and the thickness of the top surface of the inclined surface are 1 mm. The spacing between the connecting end surfaces of each heat sink unit and the thickness of the connecting end surfaces are 0.5 mm. There are a total of 12 heat sink units. The chip to be cooled has a diameter of 24 mm, a height of 0.25 mm, and a heat generation power of 1 W / cm². 2 .

[0029] Figure 2 This is a top-view 3D structural diagram of this example, showing that the entire structure appears as multiple equidistant concentric rings when viewed from above. Figure 3 A three-dimensional diagram of this structure. Figure 4 This example structure and a traditional copper sheet heat dissipation structure are used to illustrate the trend of the final average temperature of the chip after heat dissipation as a function of heat generation power. The traditional copper sheet has a diameter of 48mm and a height of 2mm. Figure 4 It can be seen that the heat dissipation structure using this example reduces the chip temperature more effectively than the traditional copper sheet structure, with a heat generation power of 1W / cm². 2 The temperature can be reduced by 191.36K, and the greater the heat generation power of the chip, the greater the temperature reduction.

[0030] Example 2:

[0031] The largest heat sink unit has an 80mm diameter top surface on its inclined surface, a 20mm diameter connecting end surface, and a 2mm height. There are 15 heat sink units. Compared to traditional copper fin heat sinks with a diameter of 80mm and a height of 2mm, this allows for a heat output of 5W / cm² on a 20mm diameter fin. 2 The average temperature of the chip to be cooled was reduced by 236.4K, such as Figure 5 As shown.

[0032] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A three-dimensional passive heat dissipation structure for electronic devices, characterized in that: The heat dissipation unit includes several annular funnel-shaped heat dissipation units made of high thermal conductivity materials. These heat dissipation units are fixedly connected to one side of the base plate and are in a coaxial position. The heat dissipation units are arranged sequentially from the inside to the outside according to the size of the funnel structure. The heat dissipation units are in the shape of hollow frustums. The space between the heat dissipation units is filled with heat dissipation medium. The number of heat dissipation units is not less than 2; the plurality of heat dissipation units includes a connecting end face connected to the base plate and an inclined surface for heat dissipation, the inclined surfaces of all heat dissipation units have the same inclination direction, the thickness of the inclined surface increases uniformly from the connecting end face to the top surface of the inclined surface, and the area of ​​the top surface of the inclined surface is greater than the area of ​​the connecting end face. The tilt angle of the heat dissipation unit ranges from 0° to 90°.

2. The three-dimensional passive heat dissipation structure according to claim 1, characterized in that: The heat dissipation medium is a gas or liquid used for convective heat dissipation.

3. The three-dimensional passive heat dissipation structure according to claim 1, characterized in that: The base plate is connected to the heat dissipation component by a high thermal conductivity adhesive, and the base plate is made of the same material as the heat dissipation unit.

4. The three-dimensional passive heat dissipation structure according to claim 1, characterized in that: The heat dissipation units are all the same height.

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