Feedthrough assembly and device comprising a feedthrough assembly

Abstract

Various embodiments of an electronic device module and an implantable medical device including such a module are disclosed. The module includes a feedthrough connector assembly having an electrically conductive connector including an electrically conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the connector, and a feedthrough pin disposed within a through-hole extending through the connector. The module also includes an electronics layer having a substrate and an electronic component disposed on or within the substrate. The electronic component is electrically connected to the contact of the electrically conductive connector such that the electronic component is electrically connected to the connector. A major surface of the substrate of the electronics layer faces the electrically conductive inner surface of the connector without any intervening non-conductive layer disposed between the major surface of the substrate and the electrically conductive inner surface of the connector.

Description

Technical Field

[0001] This disclosure generally relates to a feedthrough connector assembly, and more particularly to an implantable medical device including said feedthrough connector assembly. Background Technology

[0002] Implantable medical devices, such as implantable pacemakers, deliver pacing pulses to a patient's heart and monitor the patient's cardiac condition. In some examples, an implantable pacemaker includes a pulse generator and one or more electrical leads. The pulse generator may be implanted, for example, in a small pouch in the patient's chest. The electrical leads may be coupled to the pulse generator, which may include circuitry for generating pacing pulses and / or sensing cardiac electrical activity. The electrical leads may extend from the pulse generator to a target site (e.g., the atrium and / or ventricle), such that electrodes at the distal ends of the leads are positioned at the target site. The pulse generator can then provide electrical stimulation to the target site and / or monitor cardiac electrical activity at the target site via the electrodes.

[0003] Other implantable pacemakers are configured to be implanted entirely within the chambers of the heart. These pacemakers may be referred to as intracardiac pacing devices or leadless pacing devices, and may include one or more electrodes on their outer casing to deliver therapeutic electrical signals and / or sense intrinsic depolarization of the heart. Such pacemakers may be positioned inside or outside the heart, and in some examples, may be anchored to the heart wall via a fixation mechanism. Summary of the Invention

[0004] This disclosure generally relates to a feedthrough connector assembly and an electronic device module utilizing such a feedthrough connector assembly. The electronic device module may include a feedthrough connector assembly and an electronic layer. The assembly may include a conductive connector having a conductive inner surface and contacts disposed on the inner surface and electrically connected to the connector. The assembly may also include feedthrough pins electrically isolated from the connector. The electronic layer may include a substrate and electronic components disposed on or within the substrate, wherein the electronic components are electrically connected to the contacts of the conductive connector. The main surface of the substrate of the electronic layer faces the conductive inner surface of the connector, without any intervening non-conductive layer disposed between the main surface of the substrate and the conductive inner surface of the connector. The feedthrough pins extend through the dielectric substrate and the connector and beyond the outer surface of the connector while maintaining isolation from the connector.

[0005] In one example, aspects of this disclosure relate to an electronic device module including a feedthrough connector assembly. The assembly includes a conductive connector having a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the connector; and a feedthrough pin disposed within a via extending through the connector between the inner and outer surfaces. The feedthrough pin is electrically isolated from the connector and includes a first end adjacent to the inner surface of the connector and a second end adjacent to the outer surface of the connector. The electronic device module also includes an electronic layer having a substrate and electronic components disposed on or within the substrate. The electronic components are electrically connected to the contact of the conductive connector, such that the electronic components are electrically connected to the connector. The main surface of the substrate of the electronic layer faces the conductive inner surface of the connector, without any intervening non-conductive layer disposed between the main surface of the substrate and the conductive inner surface of the connector.

[0006] In another example, aspects of this disclosure relate to an implantable medical device including a power source and an electronic component module electrically connected to the power source. The electronic component module includes an electronics layer and a feedthrough connector assembly electrically connected to the electronics layer. The electronics layer includes a substrate and electronic components disposed on the substrate. Furthermore, the feedthrough connector assembly includes a conductive connector having a conductive inner surface, an outer surface, and contacts disposed on the inner surface and electrically connected to the connector; and a feedthrough pin disposed within a via extending through the connector between the inner and outer surfaces. The feedthrough pin is electrically isolated from the connector and includes a first end adjacent to the inner surface of the connector and a second end adjacent to the outer surface of the connector. The electronic components are connected to the contacts of the conductive connector such that the electronic components are electrically connected to the connector. Furthermore, the main surface of the substrate of the electronics layer faces the conductive inner surface of the connector, without any intervening non-conductive layer disposed between the main surface of the substrate and the conductive inner surface of the connector.

[0007] In another example, an aspect of this disclosure relates to a method comprising configuring a feedthrough pin through a via of a conductive connector, wherein a first end of the feedthrough pin is adjacent to a conductive inner surface of the connector, and a second end of the feedthrough pin is adjacent to an outer surface of the connector. The method further comprises providing a contact on an inner surface of the connector such that the contact is electrically connected to the connector; and electrically connecting electronic components of an electronic layer to the contact such that the electronic components are electrically connected to the connector. The electronic components are disposed on or within a substrate of the electronic components. Furthermore, the main surface of the substrate of the electronic layer faces the conductive inner surface of the connector, without any intervening non-conductive layer disposed between the main surface of the substrate and the conductive inner surface of the connector.

[0008] Details of one or more aspects of this disclosure are illustrated in the following drawings and description. Other features, objects, and advantages of the technology described in this disclosure will become apparent from the description, drawings, and claims. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of one implementation of an implantable medical device placed inside a patient's body.

[0010] Figure 2 yes Figure 1 A schematic perspective view of an implantable medical device.

[0011] Figure 3 yes Figure 1 A schematic block diagram of an implantable medical device.

[0012] Figure 4 yes Figure 1 A schematic perspective view of an implantable medical device.

[0013] Figure 5 yes Figure 1 A schematic partially exploded diagram of an implantable medical device.

[0014] Figure 6 yes Figure 1 A schematic partially exploded view of the electronic component module of an implantable medical device.

[0015] Figure 7 yes Figure 6 A schematic side view of the electronic module.

[0016] Figure 8 yes Figure 6 A schematic cross-sectional view of the feedthrough connector assembly of the electronic device module.

[0017] Figure 9 This is a schematic cross-sectional view of one embodiment of the contacts of the feedthrough connector assembly.

[0018] Figure 10 This is a schematic perspective view of another embodiment of the feedthrough connector assembly.

[0019] Figure 11 yes Figure 10 A schematic cross-sectional view of the feedthrough connector assembly.

[0020] Figure 12 This is a schematic perspective cross-sectional view of another embodiment of the feedthrough connector assembly.

[0021] Figure 13 This is a schematic perspective view of another implementation of an implantable medical device.

[0022] Figure 14 yes Figure 13 A schematic cross-sectional view of an implantable medical device.

[0023] Figure 15This is a flowchart of an implementation scheme for a method of forming an implantable medical device.

[0024] Figure 16 This is a schematic cross-sectional view of another embodiment of the feedthrough connector assembly. Detailed Implementation

[0025] This disclosure generally relates to a feedthrough connector assembly and an electronic device module utilizing such a feedthrough connector assembly. The electronic device module may include the feedthrough connector assembly and an electronic layer. The assembly may include a conductive connector having a conductive inner surface and contacts disposed on the inner surface and electrically connected to the connector. The assembly may also include feedthrough pins electrically isolated from the connector. The electronic layer may include a substrate and electronic components disposed on or within the substrate, wherein the electronic components are electrically connected to the contacts of the conductive connector. The main surface of the substrate of the electronic layer faces the conductive inner surface of the connector, without any intervening non-conductive layer disposed between the main surface of the substrate and the conductive inner surface of the connector. The feedthrough pins extend through the connector and beyond the outer surface of the connector while maintaining isolation from the connector.

[0026] A typical connector assembly for an implantable medical device may include a feedthrough pin that is electrically connected to an electronic module housed within the device housing. The feedthrough pin may extend from inside the housing and beyond the connector connected to the housing. Because one or both of the housing or the connector may be electrically activated, the feedthrough pin is typically electrically isolated from both the connector and the housing. Openings in the connector and the housing through which the feedthrough pin extends must be sealed to prevent bodily fluids and contaminants from flowing into the interior of the housing, which could damage the electronic components therein.

[0027] One or more embodiments of this disclosure may provide a feedthrough connector assembly including feedthrough pins that can be connected to an electronic device module disposed within a device housing, wherein the feedthrough pins are reliably electrically connected to the module while making efficient use of space within the housing. The feedthrough connector assembly may be compatible with various standard surface mount processes and reliably and dimensionally efficient in connecting to solderable components or subassemblies of integrated circuits or die stacks.

[0028] Figure 1 This is a schematic diagram of one embodiment of an implantable medical device 12 (IMD) placed within the body of patient 2. IMD 12 may include any suitable medical device, such as a pacemaker, pressure sensing device, heart monitor, other physiological sensors, etc. IMD 12 may include the arrangement of electronic modules and feedthrough connector assemblies, as further described herein. IMD 12 may be, for example, an implantable leadless pacemaker configured to be fully implanted within one chamber of the heart 4, and to deliver electrical signals to the heart below the sternum 3 via electrodes carried on the pacemaker's housing.

[0029] The IMD 12 is typically described as an intracardiac pacing device attached to a chamber of the heart 4. In one or more embodiments, the IMD 12 may be attached to the outer surface of the heart 4, such that the device is located outside the heart but can pace a desired chamber. In one or more embodiments, the IMD 12 is attached to the outer surface of the heart 4, and one or more components of the device may contact the epicardium of the heart. Figure 1 The diagram schematically illustrates an IMD 12 attached to the ventricular wall of the heart 4 via one or more fixation elements (e.g., serrations, spirals, etc.) that pierce the tissue. These fixation elements secure the IMD 12 to the cardiac tissue and maintain contact between the electrodes (e.g., cathodes or anodes) and the cardiac tissue. The IMD 12 can be implanted at or near the apex of the heart. In one or more embodiments, the pacing device can be implanted at other ventricular locations, such as on the free wall or septum, at the atrium, or anywhere on or within the heart 4.

[0030] Figure 2 yes Figure 1 A schematic side view of the IMD 12. In one or more embodiments, the IMD 12 is adapted to be implanted within the chamber of the heart 4 of a patient 2, for example, to monitor the electrical activity of the heart and / or to deliver electrical therapy to the heart. Figure 2 In the example shown, IMD 12 includes a housing 14, fixed teeth 16, and electrodes 18 and 20.

[0031] The housing 14 of the IMD 12 may include any suitable size and take any suitable one or more shapes. The housing 14 extends along the longitudinal axis 10 between a first end 6 and a second end 8. In one or more embodiments, the housing 14 may have a cylindrical (e.g., pill-shaped) shape factor. In one or more embodiments, the housing 14 comprises an elongated tubular housing. Furthermore, the housing 14 may include any suitable one or more materials as further described herein.

[0032] The IMD 12 may include a fixation mechanism suitable for securing the pacemaker 12 to tissue within the patient 2. For example, in Figure 2In the embodiments shown, the IMD 12 includes retaining teeth 16 extending from the housing 14, which are adapted to engage with tissue to substantially secure the housing in position within the patient 2. In one or more embodiments, the retaining teeth 16 are adapted to anchor the housing 14 to cardiac tissue, such that the pacemaker 12 moves with the cardiac tissue during cardiac contraction. The retaining teeth 16 may comprise any suitable one or more materials, such as shape memory materials (e.g., nitinol). Although the IMD 12 includes a plurality of retaining teeth 16 adapted to anchor the device to tissue, in one or more embodiments, other types of fixation mechanisms (such as, but not limited to, barbs, coils, etc.) may be used to secure the device to the tissue.

[0033] Housing 14, also referred to as an elongated housing, houses the electronic components of IMD 12, such as sensing circuitry for sensing electrical activity via electrodes 18 and 20 and therapy generation circuitry for delivering electrical stimulation therapy via the electrodes. The electronic components may include any discrete and / or integrated electronic circuitry implementing analog and / or digital circuitry capable of producing the functionality characteristic of the IMD 12 described herein. In one or more embodiments, housing 14 may also house components for sensing other physiological parameters, such as acceleration, pressure, sound, and / or impedance. Although shown with two electrodes 18 and 20, device 12 may include any suitable number of electrodes disposed in any suitable portion or section of the housing.

[0034] Additionally, housing 14 may also house a memory including instructions that, when executed by processing circuitry housed within the housing, cause IMD 12 to perform various functions attributable to the device herein. In one or more embodiments, housing 14 may house communication circuitry enabling IMD 12 to communicate with other electronic devices, such as a medical device programmer. In one or more embodiments, housing 14 may house an antenna for wireless communication. Housing 14 may also house a power source, such as a battery.

[0035] The housing 14 may be hermetically or nearly hermetically sealed using any suitable one or more techniques to help prevent fluid ingress into the housing. For example, in one or more embodiments, one or more portions of the housing 14 may be hermetically sealed together using one or more laser diffusion bonding techniques described in co-owned U.S. Patent No. 10,124,559B2 entitled “KINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURES ANDMETHODS”.

[0036] The IMD 12 includes electrodes 18, 20 that can be connected to the housing using any suitable one or more technologies. In one or more embodiments, at least one of the electrodes 18, 20 may be mechanically connected to the housing 14. In one or more embodiments, at least one of the electrodes 18, 20 may be defined by a conductive external portion of the housing 14. For example, electrode 20 may be defined by a conductive portion of the housing 14 that exposes tissue.

[0037] Electrodes 18 and 20 are electrically isolated from each other. Electrode 18 may be referred to as a tip electrode, and retaining teeth 16 may be adapted to anchor IMD 12 to tissue, such that electrode 18 remains in contact with the tissue. In one or more embodiments, retaining teeth 16 may also be electrically connected to one or more electronic components, such that the teeth are adapted to direct electrical signals to the patient's tissue and / or receive electrical signals from the tissue. In one or more embodiments, a portion of housing 14 may be covered with or formed of insulating material to isolate electrodes 18 and 20 from each other and / or to provide one or both of the electrodes with the desired size and shape.

[0038] Electrode 20 may be part of housing 14, such as second portion 24, which does not include such insulating material. Electrode 20 may be a majority or all of housing 14, but a majority of housing (excluding electrode 20) may be covered with an insulating coating. In one or more embodiments, electrode 20 may be coated with a material to promote conductivity. In one or more embodiments, electrode 20 may be part of a separate ring portion of housing 14 that is conductive. Electrodes 18, 20 that may include conductive portions of the first portion 22 of housing 14 may be electrically connected to at least some electronics of pacemaker 12 (e.g., sensing circuitry, electrical stimulation circuitry, or both). In one or more embodiments, housing 14 may include end cap 26 that may accommodate or enclose feedthrough connector assemblies (e.g., Figure 3 The feedthrough connector assembly 42) is used to electrically connect the electrode 18 to electronic devices within the housing 14, while electrically isolating the electrode (e.g., including electrode 20 or other conductive portions of the housing) from the housing 14.

[0039] exist Figure 2In the embodiments shown, housing 14 includes a first portion 22 and a second portion 24. The first portion 22 may be disposed adjacent to a first end 6 of housing 14, while the second portion 24 may be disposed adjacent to a second end 8 of housing 14. As used herein, the term "adjacent to the first end" means that an element or component is disposed closer to the first end 6 of housing 14 than to the second end 8 of housing 14. Similarly, the term "adjacent to the second end" means that an element or component is disposed closer to the second end 8 of housing 14 than to the first end 6 of housing 14. In one or more embodiments, the second portion 24 may define at least a portion of a power supply housing (e.g., a battery) for housing the IMD 12. In one or more embodiments, the second portion 24 may include conductive portions of housing 14 forming electrodes 20.

[0040] The first portion 22 of housing 14 can be attached to the second portion 24 of housing using any suitable technology or one or more. In one or more embodiments, the first portion 22 of housing 14 can be attached to the second portion 24 of housing using laser bonding. For example, electromagnetic radiation (e.g., light) can be directed through the outer surface of the first portion 22 and focused at the interface between the first and second portions 24 to form a laser bond.

[0041] A bond can be formed between the first portion 22 and the second portion 24 of the housing 14 using any suitable electromagnetic radiation. In one or more embodiments, the electromagnetic radiation may include a laser, which may include any suitable wavelength or wavelength range. In one or more embodiments, the laser may include light with a wavelength of at least 200 nm. In one or more embodiments, the laser may include a wavelength of no more than 10,000 nm. For example, the laser may include UV light, visible light, IR light, and combinations thereof. In one or more embodiments, a UV laser may be used to provide light with a wavelength of about 350 nm and a pulse width of about 30 ns. In one or more embodiments, the materials of the first portion 22 and the second portion 24 of the housing 14, as well as the power level and wavelength of the light used, may be selected such that the light does not directly damage, ablate, distort, or cut the housing, and that the first and second portions of the housing maintain their integral properties.

[0042] Generally, light can be provided by any suitable laser or laser system. For example, a laser can generate light with a relatively narrow set of wavelengths (e.g., a single wavelength). The light emitted by the laser can form a collimated beam that is not focused at a specific point. The light emitted by the laser can be focused at the interface between the first portion 22 and the second portion 24 of the housing 14 to generate laser bonding.

[0043] Although lasers can provide light with a narrow wavelength range, in one or more embodiments, a laser can represent one or more devices that emit light with a wider wavelength range than a single typical laser. A wide variety of devices can be used to emit light with narrow or wide wavelength ranges. In one or more embodiments, the laser can include one or more laser devices, including diode and fiber lasers. Laser sources can also include, for example, TI sapphire, argon-ion, Nd:YAG, XeF, HeNe, dye, GaAs / AlGaAs, CO2, alexandrite, InGaAs, InGaAsP, Nd:glass, Yb:YAG, or Yb fiber lasers. Laser devices can also include one of continuous wave, modulated, or pulsed modes. Therefore, a wide variety of laser devices can be used in the bonding process. In one or more embodiments, the laser power level can be set to approximately 1W, distributed over a focused beam diameter of approximately 10 μm with a high-cap or Gaussian space energy profile.

[0044] exist Figure 2 In one embodiment, the IMD 12 may further include a flange 28 connected at the second end 8 of the housing defining the opening to the second portion 24 of the housing 14. The flange 28 allows a medical device to be attached to the IMD 12, for example, for delivery and / or retrieval of a device. For example, extending through the insertion into the heart 4 ( Figure 1 The tethering element of the catheter in the ) can be attached to the flange 28 and / or through the opening to insert or remove the IMD 12.

[0045] Figure 3 This is a schematic block diagram of one embodiment of IMD 12, which includes a power source 30 (e.g., a battery), an electronics module 32, and an electrical contact assembly 34. Although Figure 3 The IMD is described as IMD 12, but Figure 3 The structure shown can also be used in other implantable or external medical devices, such as cardioverter defibrillators, physiological monitors, or neurostimulators or any other electronic devices.

[0046] The housing 14 includes a first portion 22, a second portion 24, and a sidewall 36 disposed within the housing between the battery 30 and the electrical contact assembly 34. The sidewall 36 may be disposed within the first housing portion 22 and the second housing portion 24 or at the boundary between the first housing portion and the second housing portion. In one or more embodiments, the first housing portion 22 and the second housing portion 24 are shared with a ground terminal of the battery 30. In one or more embodiments, one or both of the first housing portion 22 and the second housing portion 24 are non-conductive. For example, the first housing portion 22 may be formed of a non-conductive material such as sapphire, which can more easily transmit electromagnetic signals into and out of the housing 14 compared to metals or other conductive materials.

[0047] like Figure 3 As shown in the embodiment illustrated, a sidewall 36 extends across the housing 14 between the battery 30 on one side and the electrical contact assembly 34 on the other side. The sidewall 36 may include at least one feedthrough (not shown) to allow electrical connection between the battery 30 and the electronics module 32. As discussed herein, the feedthrough assembly 42 may also include at least one feedthrough to allow electrical connection between the electrode 18 and the electronics layer 40. The electronics module 32 is disposed between the electrode 18 and the electrical contact assembly 34. In one or more embodiments, the electrical contact assembly 34 may be secured to the sidewall 36 to provide mechanical support for the electronics module 32. The electrical contact assembly 34 provides electrical connection between the battery 30 and the electronics module 32.

[0048] IMD 12 may also include a battery connector 38 disposed between the battery 30 and the electrical contact assembly 34. A sidewall 36 may form part or all of the battery connector 38. The battery connector 38, sidewall 36, and electrical contact assembly 34 may be electrically connected to the electronics module 32 using any suitable technology or one or more of these methods. In one or more embodiments, the battery connector 38, sidewall 36, and / or electrical contact assembly 34 may include feedthroughs and / or openings for establishing an electrical connection between the battery 30 and the electronics module 32.

[0049] Electrical contact assembly 34 may include any suitable component for electrically connecting the electronics module 32 and the battery 30, such as one or more embodiments of the electrical contact assembly described in co-owned U.S. Patent Application Serial No. 17 / 071,463 entitled “ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE”. In one or more embodiments, electrical contact assembly 34 may include spring contacts for holding the electronics module 32 in place and for providing an electrical connection between the electronics module and the battery 30.

[0050] The IMD 12 can be manufactured using a single tube for the first housing portion 22 or as two tube segments for such a housing portion. Using a single tube for the housing portion 22 reduces the cost and complexity of the pacemaker 12's housing compared to two segments (e.g., two half-tubes). A single tube opens up new housing options and can be manufactured from alternative materials. For example, a single sapphire tube for the first housing portion 22 could allow for wireless charging of the battery 30, even when the IMD 12 is implanted in a patient.

[0051] In one or more embodiments, at least one of the first portion 22 and the second portion 24 of the housing 14 may comprise a substantially transparent material. As used herein, the phrase “substantially transparent” means that, assuming no reflection at the air-substrate boundary, portions 22, 24 of the housing 14 transmit more than 50% of the electromagnetic radiation incident on that portion for a selected wavelength or wavelength range. In one or more embodiments, at least one of the first portion 22 and the second portion 24 may substantially transmit electromagnetic radiation with a wavelength of at least 200 nm. In one or more embodiments, at least one of the first portion 22 and the second portion 24 may substantially transmit electromagnetic radiation with a wavelength greater than 10,000 nm. In one or more embodiments, at least one of the first portion 22 and the second portion 24 may substantially transmit electromagnetic radiation in the wavelength range of 200 nm to 10,000 nm. In one or more embodiments, at least one of the first portion 22 and the second portion 24 may substantially transmit at least one of UV light, visible light, or IR light. The substantially transparent material may comprise at least one of glass, quartz, silicon dioxide, sapphire, silicon carbide, diamond, or gallium nitride.

[0052] In one or more embodiments, the first housing portion 22 may include a substantially transparent material, allowing one or more sensors, transmitters, or detectors to be disposed within and emitting or receiving electromagnetic radiation through this portion. For example, Figure 4 yes Figures 1 to 3 The perspective view of IMD 12, with the first transparent portion 22 partially removed for clarity. (See image.) Figure 4 As shown, the electronic device module 32 is disposed within the first part 22.

[0053] The electronic device module 32 may include any suitable components or parts. For example, such as Figure 3 As shown, the electronic device module 32 includes one or more electronic layers 40 and a feedthrough connector assembly 42 electrically connected to the one or more electronic layers 40. The electronic device module 32 may also include one or more coils 44 electrically connected to the electronic layers 40.

[0054] Figures 5 to 7 yes Figures 1 to 4 Various schematic diagrams of the electronic device module 32 of the pacemaker 12. Module 32 includes an electronics layer 40 and a feedthrough connector assembly 42 electrically connected to the electronics layer.

[0055] Electronic layer 40 includes a first electronic layer 48, a second electronic layer 50, and a third electronic layer 52. Although shown as including three electronic layers, electronic layer 40 may include any suitable number of layers, such as one, two, three, four, five, or more layers. Each layer in electronic layer 40 may include a substrate. For example, the first electronic layer 48 includes a substrate 54 having a first main surface 56 and a second main surface 58.

[0056] The electronic layer 40 can be positioned relative to the feedthrough connector assembly 42 and the battery 30 in any suitable relationship. In one or more embodiments, the electronic layers 40 can be positioned such that they are substantially orthogonal to the longitudinal axis 10 of the IMD 12. Figure 5 The housing 14 of the device extends along a longitudinal axis. For example, the first main surface 56 of the substrate 54 of the first electronic layer 48 is substantially orthogonal to the longitudinal axis 10 of the housing 14. As used herein, the term “substantially orthogonal” means that the longitudinal axis 10 forms an angle of no more than 10 degrees with the substrate of one or more layers of the electronic layer 40.

[0057] The electronic layers 40 can be electrically connected together using any suitable one or more techniques. In one or more embodiments, one or more layers in the electronic layers 40 may include one or more conductive vias configured to pass through the respective substrates of the one or more layers in the electronic layers. Furthermore, one or more conductive pads 60 may be disposed on one or more layers in the electronic layers 40 to provide electrical connections between the feedthrough assembly 42 and the electronic layers, between one or more layers in the electronic layers, and between the electronic layers and the electrical contact assembly 34. For example, the conductive pad 62 may be disposed between the feedthrough assembly 42 and the first electronic layer 48 (e.g., between their conductive surfaces) to provide an electrical connection between the feedthrough assembly and the first electronic layer. In one or more embodiments, this connection may be between the housing 14 and the first electronic layer 48, or between one or more of the feedthrough pins 80 of the assembly and the first electronic layer. The conductive pad 60 may include any suitable conductive contact, such as solder bumps, solder balls, conductive epoxy, copper brazing alloy, etc.

[0058] One or more layers in the electronic layers 40 may include electronic components disposed on their respective substrates. For example, the first electronic layer 48 includes electronic components 64 disposed on a first main surface 56 of the substrate 54. Electronic components 64 may be disposed on at least one of the first main surface 56 or the second main surface 58 of the substrate 54. Any suitable number of electronic components may be disposed on one or both main surfaces 56, 58 of the substrate 54. Furthermore, electronic components 64 may be electrically connected to one or more additional electronic components disposed on the substrate 54 or on the second electronic layer 50 or the third electronic layer 52 using any suitable one or more techniques. In one or more embodiments, electronic components 64 may be disposed on a patterned conductive layer (not shown) disposed on the substrate 54 using any suitable one or more techniques. One or more conductive vias may be disposed between the first main surface 56 and the second main surface 58 of the substrate 54 to provide one or more conductive paths between the patterned conductive layer and other elements or components disposed on the side of the substrate 54 opposite to the electronic components 64. Furthermore, one or more conductive pads 60 may be directly connected to the electronic components 64 to electrically connect the components to one or more additional components or devices.

[0059] Coil 44 is electrically connected to one or more layers in electronic layer 40. Such coil 44 may include any suitable number of coils disposed on or within housing 46, and one or more electronic components also disposed within the housing. Coil 44 can be used to inductively couple IMD 12 to an external inductive charging system for charging the device when implanted in patient 4, or for telemetry or other types of communication with a transceiver outside the patient. Coil 44 can be electrically connected to electronic layer 40 using any suitable one or more technologies. Furthermore, coil 44 can be electrically connected to, for example, a third electronic layer 52 using any suitable one or more technologies. Housing 46 of coil 44 can provide one or more electrical pathways between battery 30 and electronic layer 40 using any suitable one or more technologies. In one or more embodiments, one or more conductors 47 ( Figure 4 It can be disposed on or within the housing 46 to provide one or more of these electrical pathways.

[0060] The feedthrough connector assembly 42 is also electrically connected to one or more layers in the electronic layer 40. For example... Figures 5 to 8 As shown, component 42 includes a conductive connector 66 having an inner surface 68, an outer surface 70, and one or more contacts 72 disposed on the inner surface and electrically connected to the connector. Component 42 also includes a through-hole 86 ( Figure 8A feedthrough pin 80 is provided within the connector 66, the through-hole extending through the connector 66 between the inner surface 68 and the outer surface 70. The feedthrough pin 80 is electrically isolated from the connector 66 and includes a first end 82 adjacent to the inner surface 68 of the connector and a second end 84 adjacent to the outer surface 70 of the connector. As used herein, the term "adjacent to the inner surface" means that an element or component is positioned closer to the inner surface 68 of the connector 66 than the outer surface 70 of the connector. Similarly, as used herein, the term "adjacent to the outer surface" means that an element or component is positioned closer to the outer surface 70 of the connector 66 than the inner surface 68.

[0061] Component 42 can take any suitable shape or have any suitable size. In one or more embodiments, component 42 may include an elliptical cross-section in a plane substantially parallel to the inner surface 68 of connector 66.

[0062] The connector 66 may also take any suitable shape or have any suitable size. Furthermore, the connector 66 may comprise any suitable material or material, such as at least one of titanium, copper, niobium, tantalum, or alloys thereof. In one or more embodiments, the connector 66 is conductive.

[0063] The connector 66 may include a flange 88 that at least partially forms the outer surface 70 of the connector. The flange 88 may be adapted to connect the connector 66 to the end cap 26. Figure 2 ).

[0064] The feedthrough connector assembly 42 may also include one or more conductive contacts 72 disposed on the inner surface 68 of the connector 66 and electrically connected to the connector. Any suitable number of contacts 72 may be disposed on the inner surface 68 in any suitable arrangement or array. The conductive pad 72 may include at least one of any suitable conductive structure, such as solder bumps, solder paste, conductive epoxy, or conductive contacts.

[0065] For example, Figure 9 This is a schematic cross-sectional view of one embodiment of contact 172. Contact 172 may include a portion disposed on the inner surface of the conductive connector (e.g., Figures 5 to 8The conductive connector 66 comprises a seed layer or adhesion layer 174 on its inner surface 68, a conductive layer 176 disposed on the seed layer, and solder balls 178 disposed on the conductive layer, such that the conductive layer and the seed layer are located between the solder balls and the conductive inner surface of the connector. The seed layer 174 and the conductive layer 176 may comprise any suitable one or more conductive materials, such as materials that improve adhesion to subsequent metal layers, such as nickel, nickel-vanadium, titanium, zirconium, etc. The conductive layer 176 may be additionally metallized to provide enhanced conductivity and solderability, such as copper, gold, tin-lead, or other solderable conductive materials. The seed layer 174 and the conductive layer 176 may comprise the same material or different materials. Furthermore, any suitable one or more techniques (e.g., plating, sputtering, sintering, vapor deposition, etc.) may be used to deposit the seed layer 174 and the conductive layer 176. In one or more embodiments, the seed layer 174 may be disposed on the inner surface of the connector, after which the conductive layer 176 is deposited on the seed layer. The seed layer 174 and the conductive layer 176 can be patterned using any suitable technique or technology to form the contacts. The solder ball 178 may also comprise any suitable conductive material or technology, such as the same material described herein with respect to contact 72, which can be disposed on the conductive layer using any suitable technique or technology, such as physical masking of non-target areas during vapor deposition or plating, laser-defined patterning by removing unwanted material after complete deposition, etc.

[0066] Back Figures 5 to 8 The contact 72 can be disposed on the inner surface 68 of the connector 66 using any suitable one or more techniques (e.g., sputtering, plating, etc.). For example, a conductive material can be disposed on the inner surface 68 and subsequently patterned to form the contact 72. In one or more embodiments, the contact 72 can be integral with the connector 66, i.e., the contact and the connector are formed as a single entity.

[0067] Contact 72 may be adapted to electrically connect connector 66 to one or more layers in the electronic layer 40 of electronic device module 32. In one or more embodiments, contact 72 may provide redundant connections between connector 66 and other components of IMD 12 (e.g., one or more layers in electronic layer 40). Electronic components 64 of electronic layer 40 may be electrically connected to one or more contacts 72 of conductive connector 66, such that the electronic components are electrically connected to connector 66. In one or more embodiments, the main surface of the substrate of the electronic layer of layer 40 faces the conductive inner surface 68 of connector 66, without any intervening non-conductive layer disposed between the main surface of the substrate and the conductive inner surface 68 of connector 66. For example, as Figure 7As shown, the second main surface 58 of the substrate 54 of the first electronic layer 48 faces the conductive inner surface 68 of the connector 66, and no intervening non-conductive layer is disposed between the second main surface of the substrate and the conductive inner surface of the connector. The conductive pad 60 disposed on the second main surface 58 of the substrate 54 of the first electronic layer 48 is spaced apart from the conductive inner surface 68 of the connector 66 and is isolated from the connector by a gap formed between the electronic layer 40 and the connector. Therefore, no non-conductive layer is needed between the electronic layer 40 and the connector 66 to isolate the electronic layer from the connector.

[0068] A through-hole 86 passes through the connector 66 and is disposed between the inner surface 68 and the outer surface 70. The through-hole 86 can take any suitable shape or have any suitable size. In one or more embodiments, the through-hole 86 may have a cross-sectional area in a plane parallel to the inner surface 68 of the connector 66, which is larger than the cross-sectional area of ​​the feedthrough pin 80 in the same plane.

[0069] A feedthrough pin 80 is disposed within a through-hole 86 of the connector 66 and includes a first end 82 adjacent to the inner surface 68 of the connector 66 and a second end 84 adjacent to the outer surface 70 of the connector. The feedthrough pin 80 may comprise any suitable one or more materials, such as the same materials described herein with respect to the connector 66. Furthermore, the feedthrough pin 80 may take any suitable shape or have any suitable dimensions. In one or more embodiments, the first end 82 of the feedthrough pin 80 may extend beyond any suitable length of the inner surface 68 of the connector 66. In one or more embodiments, the first end 82 of the feedthrough pin 80 may be flush with the inner surface 68 of the connector 66 such that the end face at the first end of the feedthrough pin 80 is in the plane defined by the inner surface 68 of the connector 66, or the first end may be recessed from the inner surface such that the first end is disposed within the through-hole 86.

[0070] As mentioned herein, any suitable technique or method can be used to electrically isolate the feedthrough pin 80 from the connector 66. For example, insulating material 94 can be disposed within the via 86. Figure 8 As shown, insulating material 94 can be disposed within the via 86, and within at least a portion 96 of the via 86, between the wall portion 96 and the feedthrough pin 80, to electrically isolate the feedthrough pin from the connector. Any suitable insulating material 94 can be used to isolate the feedthrough pin 80 within the via 86, such as glass, sapphire, epoxy resin, or other non-conductive materials that provide a seal.

[0071] The feedthrough pin 80 may be adapted to be electrically connected to one or more layers in the electronic layer 40 of the electronic device module 32. In one or more embodiments, the feedthrough pin 80 may include a contact 90 disposed at a first end 82 of the pin. The contact 90 may include any suitable one or more contacts, such as contact 72. Any suitable one or more techniques may be used to position the contact 90 at the first end 82 of the pin 80. In one or more embodiments, the contact 90 is integral with the first end 82 of the pin 80 and may take any suitable one or more shapes; for example, the pin and the contact may form a pinhead at the first end of the pin. Furthermore, in one or more embodiments, one or more conductive pads may be electrically connected to the feedthrough pin 80 to provide an electrical connection between the feedthrough pin and one or more layers in the electronic layer 40.

[0072] For example, Figures 10 to 11 This is a schematic exploded view and cross-sectional view of another embodiment of the feedthrough connector assembly 200. This article is about... Figures 5 to 8 All the design considerations and possibilities described for the feedthrough connector assembly 42 also apply to Figures 10 to 11 A feedthrough connector assembly 200. Assembly 200 includes a connector 266 having a conductive inner surface 268, an outer surface 270, and one or more contacts 272 disposed on the inner surface and electrically connected to the connector. The assembly also includes a feedthrough pin 280 disposed within a through-hole 286 extending through the connector between the inner surface 268 and the outer surface 270 to reach 266. The feedthrough pin 280 is electrically isolated from the connector 266 and includes a first end 282 adjacent to the inner surface 268 of the connector 266 and a second end 284 adjacent to the outer surface 270 of the connector.

[0073] Figures 10 to 11 Feedthrough connector assembly 200 and Figures 5 to 8 One difference between components 42 is that component 200 includes a conductive pad 290 disposed at a first end 282 of feedthrough pin 280. The conductive pad 290 is electrically connected to the feedthrough pin 280 using any suitable one or more techniques; for example, the conductive pad may be soldered to the feedthrough pin. In one or more embodiments, the conductive pad 290 is integral with the feedthrough pin 280. The conductive pad 290 may take any suitable one or more shapes and have any suitable dimensions. In one or more embodiments, one or more contacts 289 may be disposed on the conductive pad 290, which are electrically connected to the conductive pad using any suitable one or more techniques. The conductive pad 290 can connect the feedthrough pin 280 to one or more electronic layers of the electronic module (e.g., ...). Figures 3 to 7 The electronic layer 40 of the electronic module 32 is electrically connected. Furthermore, the conductive pad may comprise any suitable one or more conductive materials, such as at least one of copper, niobium, titanium, platinum, or platinum-iridium.

[0074] In one or more embodiments, the conductive pad 290 may be disposed within a concave surface 269, which is disposed within the inner surface 268 of the connector 266. The concave surface 269 may take any suitable shape or have any suitable dimensions. In one or more embodiments, the concave surface 269 may have a depth substantially equal to the thickness of the conductive pad 290, such that the pad is substantially flush with the inner surface 268 of the connector 266. Any suitable technique or method may be used to electrically isolate the conductive pad 290 from the connector 266. In one or more embodiments, the conductive pad 290 is electrically isolated from the connector 266 by a non-conductive layer 291 disposed between conductive pads on the concave surface 269. The non-conductive layer 291 may comprise any suitable non-conductive material or method. In one or more embodiments, the non-conductive layer 291 is a ceramic disc disposed within the concave surface 269 of the inner surface 268 of the connector 266. Furthermore, in one or more embodiments, an insulating material 293 may be disposed between the conductive pad 290 and one or more sides 267 of the concave surface. The insulating material 293 may comprise any suitable one or more materials, such as at least one of glass, sapphire, ceramic, or epoxy resin or other insulating polymers. In one or more embodiments, the insulating material 293 and the non-conductive layer 291 may be the same one or more materials. In one or more embodiments, the insulating material 293 and the non-conductive layer 291 are integral.

[0075] Component 200 also includes a housing 294 disposed within the through-hole 286 between the wall 296 of the through-hole and the feedthrough pin 280. The housing 294 may comprise any suitable one or more materials. Insulating material 293 may also be disposed between the feedthrough pin 280 and the housing 294.

[0076] The various feedthrough connector assemblies described herein may also include one or more electronic devices. For example, Figure 12 This is a schematic perspective view of another embodiment of the feedthrough connector assembly 300. All design considerations and possibilities described herein with respect to feedthrough connector assemblies 12 and 200 also apply to feedthrough connector assembly 300. One difference between assembly 300 and assemblies 12 and 200 is that assembly 300 includes connector electronics 392 disposed at a first end 382 of feedthrough pin 380. Connector electronics 392 is electrically connected to feedthrough pin 380 using any suitable one or more techniques. Furthermore, connector electronics 392 may include any suitable one or more electronic devices, such as at least one of a capacitor, inductor, or other electrical filtering component. In one or more embodiments, connector electronics are electrically isolated from connector 366 using any suitable one or more techniques.

[0077] Another difference between component 300 and components 12 and 200 is that capacitor 365 is disposed within the through-hole 386 of connector 366. Capacitor 365 may include any suitable capacitor and may be electrically connected to pin 380 and connector 366 using any suitable one or more technologies. In one or more embodiments, the inner surface 371 of capacitor 365 may be electrically connected to pin 380, and the outer surface 373 of capacitor may be electrically connected to connector 366.

[0078] Figure 16 This is a schematic cross-sectional view of another embodiment of the feedthrough connector assembly 600. All design considerations and possibilities described herein with respect to feedthrough connector assemblies 12, 100, 200, and 300 also apply to feedthrough connector assembly 600. One difference between assembly 600 and assemblies 12, 100, 200, and 300 is that the feedthrough pin 680 and the contact 690 are integrated. An insulating layer or disc 691 may be disposed between the contact 690 and the concave surface 669 of the connector 666 to electrically isolate the contact 690 from the connector. In one or more embodiments, the disc 691 may be a ceramic disc. Furthermore, an insulating material 694, such as glass, may be disposed between the feedthrough pin 680 and one or more portions of the via 686 to electrically isolate the feedthrough pin from the connector 666. In one or more embodiments, the insulating material 694 may alternatively be disposed between the recessed sidewall of the concave surface 669 and the contact 690.

[0079] Various embodiments of the feedthrough connector assembly described herein may include any suitable number of feedthrough pins, such as two, three, four, five, or more. For example, Figures 13 to 14 These are various views of another embodiment of the pacemaker 400. This article is about Figures 1 to 8 All the design considerations and possibilities described in the implantable medical device 12 also apply to Figures 13 to 14 400 implantable medical devices.

[0080] One difference between device 400 and device 10 is that device 400 includes four feedthrough pins 402 extending from the end cap 404 of the device. Each feedthrough pin 402 can be electrically connected to one or more electronic layers of an electronic device module (e.g., Figure 7The electronic device module 32 may have one or more electronic layers 40. For example, each feedthrough pin in the feedthrough pin 402 may have a solder joint 408 for connecting the pin to the electronic layer. Furthermore, each feedthrough pin in the feedthrough pin 402 may be disposed within a via 406 that extends through the connector 410. In one or more embodiments, two or more feedthrough pins in the feedthrough pin 402 may be disposed in the same via 406 and electrically isolated using an insulating material. In one or more embodiments, each feedthrough pin 402 may be disposed in its respective via 406. Furthermore, each feedthrough pin in the feedthrough pin 402 may extend beyond the outer surface of the connector 410, such as... Figure 8 The feedthrough pin 80 and connector 66 are shown.

[0081] The various embodiments of the pacemaker, electronic module, and feedthrough connector assembly described herein can be manufactured using any suitable one or more technologies. For example, Figure 15 This is a flowchart of one embodiment of a method 500 for forming a pacemaker 12. Although regarding... Figures 1 to 8 The pacing device 12 is described, but this method can be used to form any suitable implantable medical device.

[0082] At 502, the feedthrough pin 80 can be configured to pass through the via 86 of the conductive connector 66 using any suitable technique or method. In one or more embodiments, a portion of the feedthrough pin 80 adjacent to the inner surface 68 of the conductive connector 66 can be removed such that the end face at the first end 82 of the feedthrough pin lies in the plane defined by the inner surface 68 of the conductive connector. This portion of the feedthrough pin 80 can be removed using any suitable technique or method; for example, the first end 82 can be planarized. In one or more embodiments, the inner surface 68 can also be planarized together with the first end 82 of the feedthrough pin 80.

[0083] At 504, one or more contacts 72 may be disposed on the inner surface 68 of the connector 66, such that the one or more contacts are electrically connected to the connector. One or more contacts 72 may be disposed on the inner surface 68 using any suitable one or more techniques. In one or more embodiments, a seed layer (e.g., Figure 9 The seed layer 174 can be disposed on the conductive inner surface 68 of the conductive connector 66, and the conductive layer (e.g., Figure 9 The conductive layer 176 can be disposed on the seed layer (e.g., by sputtering), the seed layer and the conductive layer can be patterned using any suitable one or more techniques, and solder balls or contact pads (e.g., Figure 9Solder balls 178 can be disposed on a patterned conductive layer. In one or more embodiments, a seed layer can be patterned prior to depositing the conductive layer. In one or more embodiments, the seed layer and the conductive layer can be patterned together.

[0084] At 506, one or more electronic components 64 of one or more electronic layers 40 can be electrically connected to contact 72, such that the electronic components are electrically connected to connector 66. The main surface 56 (i.e., the second main surface) of the substrate 54 of electronic layer 48 faces the conductive inner surface 68 of connector 66, without any intervening non-conductive layer disposed between the main surface of the substrate and the conductive inner surface of the connector. Feedthrough pins 80 can also be electrically connected to one or more electronic layers 40 using any suitable technique or one or more techniques.

[0085] At point 508, connector 66 can be connected to a first end 6 of the elongated tubular housing 14, such that an electronic module 32 (e.g., one or more electronic layers 40) is disposed within the housing. Connector 66 to the first end 6 of housing 14 can be achieved using any suitable technique or method. In one or more embodiments, end cap 26 is connected to connector 66, wherein the end cap defines the first end 6 of housing 14.

[0086] At 510, a power source (e.g., battery 30) can be electrically connected to one or more layers of the electronics layer 40, for example, by pressing a first side of the electronics module 32 against the electrical contact assembly 34. A first portion 22 of the housing 14 can be disposed above the electronics module 32 and connected to a second portion 24 of the housing 14 using any suitable technique or method (e.g., laser bonding). Furthermore, an end cap 26 can be connected to a connector 66 of the feedthrough assembly 42 of the electronics module 32 using any suitable technique or method (e.g., soldering).

[0087] It should be understood that the various aspects disclosed herein can be combined with combinations different from those specifically presented in the specification and drawings. It should also be understood that, depending on the example, certain actions or events of any of the processes or methods described herein may be performed in different sequences, and may be completely added, combined, or omitted (e.g., performing these techniques may not require all the described actions or events). Furthermore, although for clarity some aspects of this disclosure are described as being performed by a single module or unit, it should be understood that the techniques of this disclosure can be performed by combinations of units or modules associated with, for example, a medical device.

[0088] In one or more examples, the described techniques may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functionality may be stored as one or more instructions or code on a computer-readable medium and executed by a hardware-based processing unit. A computer-readable medium may include a computer-readable storage medium, which corresponds to a tangible medium, such as a data storage medium (e.g., RAM, ROM, EEPROM, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and is accessible by a computer).

[0089] The instructions can be executed by one or more processors, such as one or more digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field-programmable arrays (FPGAs), or other equivalent integrated or discrete logic circuits. Therefore, as used herein, the term "processor" can refer to any of the foregoing structures or any other physical structures suitable for implementing the described techniques. Furthermore, this technique can be fully implemented in one or more circuit or logic elements.

Claims

1. An electronic device module, the electronic device module comprising: Feedthrough connector assembly, the feedthrough connector assembly comprising: A conductive connector, comprising a conductive inner surface, an outer surface, and contacts disposed on the inner surface and electrically connected to the connector; and A feedthrough pin, wherein the feedthrough pin is disposed within a via extending through the connector between the inner and outer surfaces of the connector, wherein the feedthrough pin is electrically isolated from the connector and includes a first end adjacent to the inner surface of the connector and a second end adjacent to the outer surface of the connector; and An electronic layer comprising a substrate and electronic components disposed on or within the substrate, wherein the electronic components are electrically connected to the contacts of the conductive connector, such that the electronic components are electrically connected to the connector, and further wherein the main surface of the substrate of the electronic layer faces the conductive inner surface of the connector, without any intervening non-conductive layer disposed between the main surface of the substrate and the conductive inner surface of the connector.

2. The module according to claim 1, the module further comprising a conductive pad disposed at the first end of the feedthrough pin and electrically connected to the feedthrough pin.

3. The module according to claim 2, wherein the conductive pad is disposed within a concave surface disposed on the inner surface of the conductive connector, wherein the conductive pad is electrically isolated from the connector by a non-conductive layer disposed between the conductive pad and the concave surface.

4. The module according to claim 3, wherein the non-conductive layer comprises a ceramic disk.

5. The module according to claim 3 or 4, wherein the non-conductive layer is disposed between the conductive pad and one or more sides of the concave surface.

6. The module according to any one of claims 1-4, the module further comprising a connector electronics disposed at the first end of the feedthrough pin and electrically connected to the feedthrough pin.

7. The module according to any one of claims 1-4, the module further comprising a second feedthrough pin disposed within a second through-hole extending through the connector between the inner surface and the outer surface of the connector, wherein the second feedthrough pin is electrically isolated from the connector and includes a first end adjacent to the inner surface of the connector and a second end adjacent to the outer surface of the connector.

8. The module according to any one of claims 1-4, the module further comprising a capacitor disposed within the through hole of the connector, wherein the capacitor is electrically connected to the feedthrough pin and the connector.

9. The module according to any one of claims 1-4, the module further comprising an insulating material disposed within the through hole between the wall of the through hole and the feedthrough pin.

10. An implantable medical device, the implantable medical device comprising: power supply; and According to claim 1, the electronic device module is electrically connected to the power supply.

11. The apparatus of claim 10, further comprising an elongated tubular housing extending along a longitudinal axis between a first end and a second end, and further wherein a first portion of the housing adjacent to the first end encloses the electronic device module, and a second portion of the housing adjacent to the second end encloses the power supply.

12. The device of claim 11, wherein the first portion of the elongated tubular housing comprises a substantially transparent material.

13. The apparatus of claim 11, wherein the longitudinal axis is substantially orthogonal to the substrate of the electronic layer of the electronic device module.

14. The apparatus according to any one of claims 10 to 13, the apparatus further comprising a capacitor disposed within the through-hole of the connector, wherein the capacitor is electrically connected to the feedthrough pin and the connector; and / or the apparatus further comprising an insulating material disposed within the through-hole and between the wall of the through-hole and the feedthrough pin.

15. The apparatus according to any one of claims 10 to 13, wherein, The electronic module is configured such that it is substantially perpendicular to the longitudinal axis of the implantable medical device.

16. The apparatus of claim 15, wherein the main surface of the substrate of the electronic layer is substantially perpendicular to the longitudinal axis.

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