Apparatus and method for laser processing a workpiece

Abstract

The invention relates to an apparatus for laser machining a workpiece (14) in a machining plane (42), comprising a first laser machining unit (20) for forming a first focal region (38) extending along a first main extension direction (40), and at least one further laser machining unit (22; 90, 92) for forming at least one further focal region (54, 56) extending along a further main extension direction (58, 60) oriented transversely to the first main extension direction (40), the first focal region (38) and the at least one further focal region (54, 56) being spaced apart from one another at a working distance (A; A1, A2) parallel to the machining plane (42), the first laser machining unit (20) and the first focal region (38) and the at least one further laser machining unit (22; 90, 92) and the at least one further focal region (54, 56) each being movable in a feed direction (78) oriented parallel to the machining plane (42), and the workpiece (14) being made of a material (12) which is transparent to the laser beams respectively forming the first focal region (38) and the at least one further focal region (54, 56).

Description

Technical Field

[0001] This invention relates to an apparatus for laser processing of workpieces in a processing plane.

[0002] The present invention also relates to a method for laser processing of workpieces in a processing plane. Background Technology Summary of the Invention

[0003] The object of this invention is to provide a method as described at the beginning, by means of which multiple chamfered modified areas can be formed on a workpiece in fewer working steps and / or in a shorter processing time.

[0004] According to the present invention, this objective is achieved in the apparatus described at the beginning in the following manner: the apparatus includes: a first laser processing unit for forming a first focal region extending along a first main extension direction; and at least one additional laser processing unit for forming at least one additional focal region extending along at least one additional main extension direction oriented transverse to the first main extension direction, the first focal region and the at least one additional focal region being spaced apart from each other by a working distance parallel to the processing plane, the first laser processing unit and the first focal region and the at least one additional laser processing unit and the at least one additional focal region each being movable along a feed direction oriented parallel to the processing plane, and the workpiece being made of a material transparent to the laser beam, the first focal region and the at least one additional focal region being formed by the laser beam respectively.

[0005] Using the apparatus according to the invention, multiple modified regions can be generated, particularly at a machined portion of the workpiece. These modified regions are oriented transversely to and, in particular, perpendicular to the machining plane, and, especially, the workpiece material is separable within these modified regions. This allows, for example, the separation of workpiece segments having multiple separation surfaces oriented transversely to and, in particular, perpendicular to the machining plane in the separation region. Specifically, these separation surfaces have a geometry corresponding to the focal area.

[0006] Because the first laser processing unit and the at least one additional laser processing unit are spaced apart by a working distance, the first focusing area and the at least one additional focusing area can be used to achieve quasi-synchronous processing and / or time-staggered processing of the workpiece. In particular, it is no longer necessary to use different equipment to form the material modification section along processing lines oriented laterally to each other.

[0007] For example, the working distance is greater than or equal to the length or width of the workpiece segment to be separated from the workpiece in the machining plane.

[0008] In principle, multiple additional focal zones can be provided, each of which is specifically assigned a separate main extension direction.

[0009] In the present context, the at least one additional laser processing unit should be understood, for example, as a second laser processing unit and / or a third laser processing unit. Similarly, in the present context, the at least one additional focusing area should be understood, for example, as a second focusing area and / or a third focusing area.

[0010] The first focal region and the at least one additional focal region do not necessarily have to be constructed in a straight line; instead, they may have, for example, a curved shape.

[0011] In particular, the main extension direction of the focal zone should be understood as the direction of the straight line extending through the starting and ending points of the focal zone.

[0012] For example, the working distance is at least 1 mm and / or at most 100 cm.

[0013] Advantageously, the first laser processing unit and the at least one other laser processing unit are arranged to face the same outer side of the workpiece. This, in particular, allows for a technically simple structure of the equipment.

[0014] For the same reason, it may be advantageous for the first focusing area and the at least one additional focusing area to be coupled into the workpiece via the same outer surface of the workpiece or to be able to be coupled into the workpiece via the same outer surface of the workpiece.

[0015] Specifically, the first focusing area and the at least one additional focusing area are coupled into the workpiece from the same direction.

[0016] Specifically, "laser machining of a workpiece in the machining plane" should be understood as meaning machining the workpiece parallel to and / or along the machining plane in the feed direction. Specifically, the first principal extension direction and / or the other principal extension direction are each oriented transversely to or perpendicular to the machining plane.

[0017] In particular, during the laser processing of the workpiece, a material modification portion is formed that extends laterally or perpendicularly to the processing plane (that is, particularly extending in the directional component in the depth direction of the workpiece).

[0018] For example, the workpiece extends parallel to the machining plane.

[0019] For example, the length and / or width directions of the workpiece are oriented parallel to the machining plane.

[0020] For example, the depth direction of the workpiece is oriented perpendicular to the machining plane.

[0021] For example, the first primary extension direction is oriented parallel to or transverse to the depth direction of the workpiece.

[0022] For example, the processing plane is oriented parallel to or at least approximately parallel to the outer surface of the workpiece facing the first laser processing unit and / or the second laser processing unit.

[0023] For example, the first laser processing unit and the at least one other laser processing unit are arranged parallel to the processing plane and spaced apart from each other.

[0024] For example, the first laser processing unit and the first focusing area, as well as the at least one additional laser processing unit and the at least one additional focusing area, may move relative to the workpiece in the feed direction and / or may move relative to the workpiece parallel to the processing plane.

[0025] For example, the workpiece is plate-shaped and / or flat in structure.

[0026] Advantageously, the first laser processing unit and the at least one other laser processing unit are mechanically coupled and / or technically coupled to each other, such that the movement of the first laser processing unit and the first focusing area is one in a common feed direction, and the movement of the at least one other laser processing unit and the at least one other focusing area is the other. This allows for synchronous processing and / or time-staggered processing of different spatial regions of the workpiece.

[0027] For the same reason, it may be advantageous for the first laser processing unit and the at least one additional laser processing unit to be mechanically coupled and / or technically coupled to each other, such that the movement of the first laser processing unit and the first focusing area is performed by one party and the movement of the at least one additional laser processing unit and the at least one additional focusing area is performed by the other party along processing contours oriented parallel to each other and / or along processing contours that are parallel to each other and offset from each other.

[0028] Specifically, the device can be configured to include a holding device on which a first laser processing unit and the at least one additional laser processing unit are arranged, wherein the first laser processing unit and the first focusing area, as well as the at least one additional laser processing unit and the at least one additional focusing area, can move in a common feed direction by means of the holding device. Thus, mechanical coupling between the first laser processing unit and the at least one additional laser processing unit can be achieved, for example, in a technically simple manner.

[0029] For example, the first laser processing unit and the at least one other laser processing unit each have a housing by means of which the first laser processing unit and the at least one other laser processing unit are arranged on and / or fastened to the holding device.

[0030] For example, the additional main extension direction is oriented at an angle of at least 1° and / or at most 89° relative to the first main extension direction.

[0031] Advantageously, with respect to the depth direction perpendicular to the machining plane, the first focal area and the at least one other focal area may have partial sections arranged in the same position, and / or, with respect to the depth direction perpendicular to the machining plane, the first focal area and the at least one other focal area may have partial sections arranged in different positions. Thus, material-modified sections can be generated at different depth sections of the workpiece, for example, along machining lines oriented differently from each other.

[0032] For example, the first focal area and the at least one other focal area partially overlap in terms of depth direction perpendicular to the processing plane.

[0033] For example, the first focal area and the at least one other focal area are adjacent to each other in the depth direction perpendicular to the processing plane. In particular, the minimum distance in the depth direction between the first focal area and the at least one other focal area does not exceed 10% of the length of the first focal area.

[0034] Specifically, the first focusing area and the at least one additional focusing area extend in a common plane, which is oriented particularly perpendicular to the processing plane.

[0035] Advantageously, the device includes an adjustment mechanism for adjusting the working distance, parallel to the processing plane, between the first focusing area and the at least one additional focusing area and / or between the first laser processing unit and the at least one additional laser processing unit. Specifically, the working distance can be adjusted parallel to both a length direction parallel to the processing plane and a width direction parallel to the processing plane. This allows for the adjustment of the corresponding length of the processing line on the workpiece material. For example, at a specific processing location on the workpiece, the corresponding length of the processing line and / or separation line generated by the at least one additional focusing area can be adjusted relative to the length of the processing line and / or separation line generated by the first focusing area.

[0036] The working distance between the first focusing area and several other focusing areas can be set and adjusted.

[0037] Specifically, one or more working distances are selected such that the target geometry is formed at the machining location of the workpiece and / or in the separation area.

[0038] In particular, when the first focal area is shifted (hypothetically) by a working distance in the direction of the at least one other focal area, at least one of the following applies:

[0039] -The at least one or all of the additional focal areas extend entirely or more than 60% of the plane containing the first focal area on a particular side.

[0040] - The first focal region and the at least one additional focal region are adjacent to each other and / or at least partially overlap;

[0041] - The first focal area and the at least one additional focal area form a spatially continuous region.

[0042] In particular, this results in a process in which the material of the workpiece is spatially continuous in terms of depth at a defined machining location.

[0043] Advantageously, the device includes a setting means for respectively setting the working positions of the first focal area and the at least one additional focal area with respect to the depth direction perpendicular to the machining plane. For example, this can adapt the first focal area and the at least one additional focal area to the workpiece depth and / or workpiece thickness. Furthermore, this can, for example, position the first focal area and the at least one additional focal area relative to each other to be set parallel to the depth direction to the target geometry.

[0044] In particular, when laser-processing a workpiece, the corresponding working positions of the first focal zone and the at least one additional focal zone in terms of depth are constant or at least approximately constant.

[0045] Advantageously, the first focusing area formed by the first laser processing unit has a quasi-non-diffractive beam profile and / or a Bessel-like beam profile. Thus, a focusing area elongated parallel to the workpiece depth direction can be achieved in a technically simple manner.

[0046] Quasi-non-diffractive beams and / or Bessel-like beams should be understood in particular as beams in which the transverse intensity distribution is propagation-invariant. The transverse intensity distribution is specifically understood as the intensity distribution in a cross-sectional plane oriented perpendicular to the main propagation direction of the beam. In particular, in the case of quasi-non-diffractive beams and / or Bessel-like beams, the transverse intensity distribution is substantially constant along the longitudinal direction of the beam and / or the beam propagation direction.

[0047] The first focusing region can be formed by means of at least two quasi-non-diffractive beams and / or Bessel-like beams oriented parallel to each other. Thus, for example, a first focusing region with an asymmetric beam cross-section can be formed.

[0048] Advantageously, the first focused area formed by the first laser processing unit is asymmetrical and, in particular, elliptical in a cross-section parallel to the processing plane. Therefore, in particular, the formation of cracks in the workpiece material can be controlled when forming the material-modified portion by means of laser processing.

[0049] Advantageously, the device has an adjustment mechanism for rotating the orientation of the maximum diameter of the cross-section of the first focal zone in the processing plane, and in particular, this maximum diameter can be oriented parallel to the feed direction by means of the adjustment mechanism, especially automatically parallel to the feed direction. Thus, in particular, a controlled orientation of cracks substantially parallel to the feed direction can be obtained during laser processing of the workpiece material. In particular, this enables optimized material separation.

[0050] For example, the maximum diameter of the cross-section of the first focal zone rotates about a rotation axis perpendicular to the machining plane.

[0051] Advantageously, the at least one additional focal zone formed by means of the at least one additional laser processing unit is formed by splitting the laser beam into multiple sub-beams, wherein these sub-beams are correspondingly focused in mutually adjacent sub-regions of the at least one additional focal zone. This makes it possible to realize a focal zone with a definable three-dimensional geometry in a technically simple manner.

[0052] Then, it can be configured such that each sub-beam has one of two different polarization states, wherein these sub-beams with correspondingly different polarization states are focused in these adjacent sub-regions of the at least one additional focusing region.

[0053] Advantageously, the apparatus includes an adjustment device for rotating the first focal area and / or the at least one additional focal area about a rotation axis oriented transversely to, perpendicularly to, or parallel to the machining plane. In particular, the adjustment device can be used to adjust, and especially can be automatically adjusted, the at least one additional focal area to an orientation at a fixed angle relative to the feed direction. The rotation axis need not be symmetrically positioned relative to the at least one additional focal area. For example, to machine workpieces in different feed directions, the orientation of the at least one additional focal area relative to the first focal area can be adjusted using the adjustment device.

[0054] In particular, the feed direction is perpendicular to the orientation of the at least one additional focus area.

[0055] Advantageously, the device may have a coupling device for coupling an input laser beam into a first laser processing unit and the at least one additional laser processing unit, by means of which the input laser beam is split into a first sub-beam for coupling into the first laser processing unit and at least one additional sub-beam for coupling into the at least one additional laser processing unit. For example, this allows the device to operate using a single laser source.

[0056] Specifically, it can be configured such that the input laser beam is at least partially guided and / or coupled by optical fiber.

[0057] In principle, it is also possible to couple a laser beam from a separate laser source into the first laser processing unit and the at least one other laser processing unit.

[0058] Advantageously, the coupling device includes a polarization beam splitter for splitting the input laser beam into a first sub-beam and the at least one additional sub-beam. This allows for the decomposition of the input laser beam in a technically simple manner.

[0059] For example, the corresponding polarizations of the first sub-beam and the at least one other sub-beam can be adjusted by means of a coupling device.

[0060] For example, the respective intensity and / or power of the first sub-beam and the at least one other sub-beam can be adjusted by means of a coupling device.

[0061] In one embodiment, a second focusing region having a second main extension direction and a third focusing region having a third main extension direction are formed by means of at least one additional laser processing unit, wherein the second main extension direction and the third main extension direction are each oriented transversely to the first main extension direction. In this embodiment, two additional focusing regions, namely the second focusing region and the third focusing region, are formed exemplarily.

[0062] Specifically, the second and third focusing areas are arranged spaced apart from each other in the depth direction perpendicular to the machining plane, and / or the first focusing area is arranged between the second and third focusing areas in the depth direction perpendicular to the machining plane.

[0063] Specifically, it can be configured such that when material is loaded onto the workpiece along the depth direction, the second and third focal zones each extend between the first focal zone and an outer side of the workpiece.

[0064] In particular, the first focal zone extends between the second and third focal zones in terms of depth, and especially extends entirely between the second and third focal zones.

[0065] Specifically, the combination of the first focusing area and the at least one additional focusing area extends from the first outer side of the workpiece to the second outer side of the workpiece, which is spaced apart from the first outer side in the depth direction.

[0066] Advantageously, the second and third focusing areas are arranged at least sectionally in the same position in terms of the width and / or length direction parallel to the machining plane. In particular, this allows for time-synchronous machining of the workpiece material using the second and third focusing areas.

[0067] As an alternative, the second and third focusing areas can be arranged spaced apart from each other in the width and / or length direction parallel to the machining plane. For example, here, the first focusing area is arranged between the second and third focusing areas. For example, this allows for time-staggered machining of the workpiece material using the first, second, and third focusing areas.

[0068] In one embodiment, the device includes a single first laser processing unit and / or a single additional laser processing unit, specifically by means of the additional laser processing unit forming a second focusing region having a second main extending direction and a third focusing region having a third main extending direction, the second and third main extending directions each oriented transversely to the first main extending direction, and the second and third focusing regions being arranged at least segmentally at the same location with respect to the width and / or length direction parallel to the processing plane. In this embodiment, two additional focusing regions, namely the second and third focusing regions, are exemplary formed by means of the additional laser processing unit.

[0069] In particular, when projected onto the processing plane, the second and third focal areas overlap.

[0070] In an embodiment, the device includes a single first laser processing unit and / or a second laser processing unit and a third laser processing unit. Specifically, a second focusing area is formed by means of the second laser processing unit and a third focusing area is formed by means of the third laser processing unit. The second and third focusing areas are each oriented laterally to the first focusing area, and are spaced apart from each other in the width and / or length direction parallel to the processing plane. For example, in this embodiment, there are two additional laser processing units and two additional focusing areas.

[0071] According to the present invention, a method for laser processing a workpiece is provided, wherein a first focal zone extending along a first main extension direction is formed by means of a first laser processing unit, and at least one additional focal zone extending along a second main extension direction oriented transverse to the first main extension direction is formed by means of at least one additional laser processing unit, the first focal zone and the at least one additional focal zone being spaced apart from each other by a working distance parallel to the processing plane, the workpiece being loaded with the first focal zone and the at least one additional focal zone, the first laser processing unit and the first focal zone and the at least one additional laser processing unit and the at least one additional focal zone each moving relative to the workpiece in a feed direction oriented parallel to the processing plane, and the workpiece being made of a material that is transparent to the laser beams that respectively form the first focal zone and the at least one additional focal zone.

[0072] The method according to the invention particularly has one or more features and / or advantages of the device according to the invention.

[0073] In particular, the method according to the invention can be implemented by means of a device according to the invention. In particular, the device according to the invention performs the method according to the invention.

[0074] Advantageously, the workpiece can be loaded at a defined machining location with a first focal zone and at least one additional focal zone in a time-staggered manner. For example, this allows for the generation of a material-modified portion along a machining line oriented transversely to the machining plane at a defined machining location, with respect to a machining line oriented perpendicular to the machining plane, in a time-staggered manner.

[0075] For example, the workpiece is first loaded at a defined machining location by at least one additional focal zone, and then by a first focal zone, or vice versa.

[0076] Advantageously, a second and a third focusing area can be formed by means of the at least one additional laser processing unit, each of the second and third focusing areas being oriented laterally to the first focusing area, and the second and third focusing areas being spaced apart from each other in the depth direction perpendicular to the processing plane, and / or the first focusing area being arranged between the second and third focusing areas in the depth direction perpendicular to the processing plane.

[0077] Advantageously, the workpiece can be loaded simultaneously with the second and third focal zones at a defined processing location, and the workpiece can be loaded with the first focal zone at that processing location in a time-staggered manner relative to the loading of the workpiece with the second and third focal zones.

[0078] For example, the value of the time difference between loading a workpiece at a defined machining location with a first focal zone and loading a workpiece with at least one additional focal zone corresponds to the quotient of the working distance and the feed rate (when the feed rate and feed direction are constant).

[0079] In one embodiment, the workpiece can be loaded in a first focal zone, a second focal zone, and a third focal zone at staggered times, specifically, the loading of the workpiece in the first focal zone occurs between the loading of the workpiece in the second focal zone and the loading of the workpiece in the third focal zone.

[0080] In particular, the device according to the invention and / or the method according to the invention have one or more of the features set forth below.

[0081] Specifically, the movement of the first laser processing unit in the feed direction causes a corresponding movement of the first focused distribution in the feed direction.

[0082] In particular, the movement of the at least one additional laser processing unit in the feed direction causes a corresponding movement of the at least one additional focusing distribution in the feed direction.

[0083] For example, the first focal region and / or the at least one additional focal region are each constructed in a straight and / or elongated and / or linear and / or stretched manner.

[0084] Specifically, the first focal region and / or the at least one additional focal region each extend parallel to a straight line.

[0085] Specifically, the first focusing region and the at least one additional focusing region each form a spatially continuous interaction region for laser processing of the workpiece, wherein, in particular, local material modification portions can be formed in the interaction regions by loading the workpiece material onto the interaction regions, by means of which material separation can be achieved. In principle, the first focusing region and / or the at least one additional focusing region may have nulls and / or interruptions, particularly small compared to the (total) length of the first focusing region and / or the at least one additional focusing region.

[0086] Specifically, by means of the relative movement of the workpiece with respect to the first focal zone and the at least one additional focal zone, a material modification portion is formed in the material of the workpiece along the machining line and / or machining surface belonging to the first focal zone and the at least one additional focal zone.

[0087] Specifically, the workpiece can be configured such that a material-modified portion is formed along the machining line and / or machining surface by means of a first focusing area and at least one additional focusing area, making the workpiece separable or allowing the workpiece to be separated.

[0088] Advantageously, by applying thermal loads and / or mechanical stresses and / or by etching with the aid of at least one wet chemical solution, the material of the workpiece can be separable along the machining lines and / or machining surfaces, or the material of the workpiece can be separated along the machining lines and / or machining surfaces. For example, etching is performed in an ultrasonically assisted etching bath.

[0089] Specifically, the input laser beam can be configured to be a pulsed laser beam or an ultrashort pulse laser beam. For example, a first focusing region and / or at least one additional focusing region are formed by means of a pulsed laser beam or an ultrashort pulse laser beam.

[0090] Control electronics can be configured for spatially resolved pulse control (especially including pulse-on-demand) to control the laser source used to provide the input laser beam.

[0091] Specifically, a workpiece clamping portion is provided for the workpiece, which in particular has a non-reflective and / or strongly scattering surface.

[0092] Specifically, the device may be configured to include a laser source for providing an input laser beam for coupling into a first laser processing unit and into the at least one additional laser processing unit, wherein, in particular, a pulsed laser beam or an ultrashort pulse laser beam is provided by means of the laser source.

[0093] The wavelength of the input laser beam is, for example, at least 300 nm and / or at most 1500 nm. The wavelength is, for example, 515 nm or 1030 nm.

[0094] Specifically, the input laser beam has an average power of at least 1 W to 1 kW. For example, the input laser beam comprises pulses with pulse energies of at least 10 μJ and / or at most 50 mJ. The input laser beam can be configured to comprise single pulses or pulse trains, wherein the pulse trains have 2 to 20 sub-pulses and, in particular, time intervals of approximately 20 ns.

[0095] The light-transmitting material should be understood in particular as the material through which at least 70%, particularly at least 80%, particularly at least 90% of the laser energy of the first focal zone and / or at least one additional focal zone is transmitted.

[0096] For example, the material of the workpiece is glass or includes glass.

[0097] To determine the spatial dimensions, such as the corresponding length and / or diameter, of the first focal region and / or the at least one additional focal region, a modified intensity distribution is considered, comprising only intensity values ​​above a specific intensity threshold. Here, the intensity threshold is chosen, for example, such that values ​​below this threshold have an intensity so low that they are no longer related to the interaction of the material with respect to the material's modification. The intensity threshold is, for example, 50% of the global maximum intensity of the actual intensity distribution. The length and diameter of the corresponding focal region should be understood accordingly as: the length of the maximum extension and / or the maximum extension dimension of the corresponding focal region along its longitudinal central axis, and the length of the maximum extension and / or the maximum extension dimension of the corresponding focal region in a plane oriented perpendicular to the longitudinal central axis, based on the modified intensity distribution.

[0098] The first focal region and / or the at least one additional focal region should be specifically understood as spatially continuous regions of intensity above the mentioned intensity threshold, wherein the regions are capable of having interruptions in spatial extent not exceeding 10% and, in particular, no more than 5% of the maximum extension scale and / or maximum length of the first focal region and / or the at least one additional focal region.

[0099] Such interruptions in the first focal region and / or at least one other focal region are formed, for example, by splitting the laser beam into multiple sub-beams and focusing the sub-beams into adjacent sub-regions. Thus, the focal region is generated by an arrangement of mutually spaced-apart focused light points.

[0100] If there exists an intensity distribution with an interruption larger than the interruption mentioned above, then such an intensity distribution should be understood in particular as a different focal region.

[0101] In particular, the expressions “approximately” and “at least approximately” should generally be understood to mean a deviation of no more than 10%. Unless otherwise stated, the expressions “approximately” and “at least approximately” should be understood in particular to mean that the deviation of the actual value and / or distance and / or angle from the ideal value and / or distance and / or angle does not exceed 10%. Attached Figure Description

[0102] The following description of preferred embodiments is provided to explain the invention in more detail with reference to the accompanying drawings.

[0103] In the attached diagram:

[0104] Figure 1 A first exemplary embodiment of an apparatus for laser processing of workpieces is shown, the apparatus having a first laser processing unit and a second laser processing unit;

[0105] Figure 2 Another exemplary embodiment of an apparatus for laser processing of workpieces is shown, the apparatus having a first laser processing unit, a second laser processing unit, and a third laser processing unit;

[0106] Figure 3a A cross-sectional view of the simulated intensity distribution of an example of the first focal region in the xz plane oriented parallel to the main extension direction of the first focal region is shown.

[0107] Figure 3b It shows that according to Figure 3a A cross-sectional diagram of the intensity distribution of the first focal region in the xy plane oriented perpendicular to the main extension direction;

[0108] Figure 4a A cross-sectional view of the simulated intensity distribution in the xz plane, oriented parallel to the main extension direction of the first focal region, is shown as another example of the first focal region;

[0109] Figure 4b It shows that according to Figure 4a A cross-sectional diagram of the intensity distribution of the focal region in the xy plane oriented perpendicular to the main extension direction;

[0110] Figure 5a Cross-sectional views of simulated intensity distribution in the yz plane, oriented parallel to the respective principal extension directions of the second and third focal regions, are shown for examples of the second and third focal regions, respectively.

[0111] Figure 5b A cross-sectional view of the simulated intensity distribution of an example of the second focal region in a yz plane oriented parallel to the main extension direction of the second focal region is shown.

[0112] Figure 5c A cross-sectional view of the simulated intensity distribution of an example of the third focal region in the yz plane oriented parallel to the main extension direction of the third focal region is shown.

[0113] Figure 6 A schematic cross-sectional view of a workpiece segment processed by means of the device and subsequently separated is shown in an xy plane oriented parallel to the width and length directions of the workpiece.

[0114] Figure 7 It shows that according to Figure 6 A schematic cross-sectional view of a workpiece segment in a yz plane oriented parallel to the workpiece depth direction;

[0115] Figure 8 A schematic cross-sectional view of a section of the workpiece in the yz plane is shown, which is modified by loading with the aid of a second and a third focusing region;

[0116] Figure 9 A schematic cross-sectional view of a section of a workpiece in the yz plane is shown, where the section is modified by the first focusing area at the processing location that has already been modified by the second and third focusing areas;

[0117] Figure 10 The workpiece is shown according to Figure 9 A schematic cross-sectional view of the segment, showing the beam path of the sub-beam used to form the first focusing region; and

[0118] Figure 11 A schematic cross-sectional view of a section of a workpiece in the yz plane is shown, in which a material-modified section is formed along a curved machining line by loading material into a curved focal zone.

[0119] In all exemplary embodiments, elements that are identical or have equivalent functions are represented by the same reference numerals. Detailed Implementation

[0120] A first exemplary embodiment of a device for laser-processing workpieces. Figure 1 As shown in the figure, and indicated by 10 in the figure. With the aid of device 10, localized material modification portions, such as submicron or atomic-level defects, that weaken the material can be created on the material 12 of workpiece 14. At the created material modification portions, workpiece 14 can be separated into different workpiece segments, for example, in subsequent steps, or workpiece segments can be separated from workpiece 14, for example.

[0121] Specifically, device 10 includes a laser source 16 for providing the input laser beam 18 (in Figure 1 (Simplified illustration). The input laser beam 18 is particularly a pulsed laser beam and / or an ultrashort pulse laser beam. For example, the input laser beam 18 is a Gaussian beam and / or has a diffracted beam profile.

[0122] According to Figure 1 In an exemplary embodiment, the device 10 includes a first laser processing unit 20 and a second laser processing unit 22 arranged spaced apart from the first laser processing unit 20.

[0123] The device 10 includes, for example, a coupling device 24 for coupling an input laser beam 18 into a first laser processing unit 20 and a second laser processing unit 22. Using the coupling device 24, the input laser beam 18 is decomposed into a first sub-beam 26 for coupling into the first laser processing unit 20 and a second sub-beam 28 for coupling into the second laser processing unit 22.

[0124] Alternatively, laser beams from different laser sources can be coupled into the first laser processing unit 20 and the second laser processing unit 22. For example, separate laser sources can be provided for the first laser processing unit 20 and the second laser processing unit 22.

[0125] According to Figure 1 In an exemplary embodiment, the input laser beam 18 is decomposed by polarization beam splitting. The coupling device 24 includes a polarization element 30 for adjusting the polarization direction of the input laser beam 18. In particular, the polarization element 30 is a delay plate or includes a delay plate, such as a half-wave plate or a quarter-wave plate.

[0126] The polarizing element 30 is arranged in the beam path of the input laser beam 18. After passing through the polarizing element 30, the input laser beam becomes linearly polarized, for example, with a defined polarization direction. In principle, circularly polarized or elliptically polarized light can also be generated by means of the polarizing element 30.

[0127] Furthermore, the coupling device 24 includes a polarization beam splitter 32 for splitting the input laser beam 18 into a first sub-beam 26 and a second sub-beam 28. The polarization beam splitter 32 is positioned downstream of the polarization element 30 with respect to the beam propagation direction 34 of the input laser beam 18. For example, the polarization beam splitter 32 is positioned on the first laser processing unit 20.

[0128] Using polarization beam splitter 32, the input laser beam 18 is split into a first sub-beam 26 and a second sub-beam 28 based on the polarization direction. In particular, the intensity of the first sub-beam 26 relative to the second sub-beam 28 can be adjusted by adjusting the polarization direction using polarization element 30.

[0129] For example, a first sub-beam 26 is formed by partial reflection of the input laser beam 18 at the polarization beam splitter 32 and is deflected and / or coupled into the first laser processing unit 20. For example, a second sub-beam 28 is formed by partial transmission of the input laser beam 18 and is conducted to the second laser processing unit 22.

[0130] In particular, in order to deflect and / or couple the second sub-beam 28 into the second laser processing unit 22, a mirror element 36 is provided, for example, arranged on the second laser processing unit 22.

[0131] The first laser processing unit 20 images the first sub-beam 26 onto the first focusing region 38, the first focusing region 38 ( Figure 3a , Figure 3b as well as Figure 4a , 4bIt has a quasi-non-diffractive beam profile and / or a Bessel-like beam profile. In particular, the first focusing region 38 is formed in an elongated manner and / or in an elongated manner and / or as a straight line.

[0132] For information on the formation and properties of quasi-non-diffractive beams, please refer to the following book: "Structured Light Fields: Applications in Optical Trapping, Manipulation and Organisation", M. Springer Science & Business Media (2012), ISBN 978-3-642-29322-1, with particular reference to Chapter 5, “Non-Diffracting Beams for the Three-Dimensional Moulding of Matter”. Its entire contents are hereby explicitly quoted.

[0133] In order to form the first focusing area 38, the first laser processing unit 20 includes, for example, an axonal prism element (not shown).

[0134] The first focusing region 38 has a first main extending direction 40, and the first focusing region 38 extends along the first main extending direction. In the example shown, the first main extending direction 40 is perpendicular to the processing plane 42 (in Figure 1 (Simplified illustration) Orientation allows the workpiece 14 to be processed in the processing plane using the equipment 10.

[0135] For example, workpiece 14 has a plate-like form and extends parallel to the machining plane 42. In particular, a workpiece holder (not shown) is provided for proper arrangement and / or fixation of workpiece 14 on the device 10.

[0136] For example, the length direction x and width direction y of workpiece 14 are oriented parallel to the machining plane 42, while the depth direction z of workpiece 14 is oriented perpendicular to the machining plane 42. Therefore, in the example shown, the first main extension direction 40 of the first focal region 38 is oriented parallel to the depth direction z.

[0137] Figure 3a and Figure 3b An example of the first focal region 38 is shown in the figure, where Figure 3a The intensity distribution in the xz plane oriented parallel to the first principal extension direction 40° is shown. In the grayscale representation shown, brighter grayscale values ​​indicate higher intensity.

[0138] The first focal zone 38 should be specifically understood as referring to the global maximum intensity distribution 50, which is spatially continuous. Specifically, only this global maximum intensity distribution 50 relates to the interaction with the material 12 to be processed on the workpiece 14.

[0139] The maximum intensity distribution 50 is surrounded, for example, by secondary intensity distributions 52, which appear particularly during the actual implementation of the first focus region 38. These secondary intensity distributions 52 are arranged around and / or spaced apart from the maximum intensity distribution 50. The secondary intensity distributions 52 are, for example, secondary maximum values ​​or include secondary maximum values.

[0140] The secondary intensity distribution section 52 is not important for laser-processed workpiece 14 because, due to its low intensity, it has no interaction with the material 12 of workpiece 14 and / or the interaction is negligible. In particular, a material modification section suitable for processing material 12 and especially suitable for separating material cannot be formed by means of the secondary intensity distribution section 52.

[0141] Figure 3b It shows Figure 3a The first focusing region 38 shown is a cross-section in the xy plane oriented perpendicular to the first main extension direction 40. In the example shown, the first focusing region 38 has a symmetrical cross-section. In particular, the diameter d0 of the first focusing region 38 is the same in any direction within the xy plane. The first focusing region 38 is configured, for example, as a circle in the cross-section oriented perpendicular to the first main extension direction 40.

[0142] Instead, it can be configured such that the first focusing area 38 generated by the first laser processing unit 20 has an asymmetric cross-section in the xy plane. Figure 4a and Figure 4b ).

[0143] For this purpose, the first focusing region 38 is formed, for example, by means of two parallel quasi-non-diffractive beams and / or Bessel-like beams. Figure 4a Two beams are oriented relative to each other such that they at least partially overlap, thereby forming a spatially continuous focal zone.

[0144] According to Figure 4a and Figure 4b In the example, similar to about Figure 3a and Figure 3b In the way this example is explained, the first focal region 38 should be understood as referring to the maximum intensity distribution region 50. The secondary intensity distribution region 52 is negligible in relation to the interaction of the material with the workpiece 14.

[0145] According to Figure 4a and Figure 4b In the example, the first focal region 38 has an asymmetric cross-section in the xy plane oriented perpendicular to the first main extension direction 40, that is, in particular, the value of the diameter of the first focal region 38 is different for different directions in the xy plane and / or not the same for every direction in the xy plane.

[0146] exist Figure 4b In the example shown, the first focal region 38 has a maximum diameter d max The maximum diameter is, for example, oriented parallel to the length direction x.

[0147] The length l of the first focusing region 38 is, for example, on the order of micrometers, such as 300 μm to 2000 μm. In the example shown, this length l is oriented parallel to the first main extension direction 40.

[0148] Diameter d0, or maximum diameter d max For example, the scale is on the micrometer level.

[0149] The second sub-beam 28 is imaged into the second focusing region 54 and the third focusing region 56 by means of the second laser processing unit 22. Figure 5a , Figure 5b and Figure 5c Specifically, the second focusing region 54 and the third focusing region 56 are formed by means of the second laser processing unit 22 to form an appropriate three-dimensional focusing distribution.

[0150] The second focusing region 54 has a second main extension direction 58, while the third focusing region 56 has a third main extension direction 60. The second focusing region 54 extends parallel to the second main extension direction 58, while the third focusing region 56 extends parallel to the third main extension direction 60.

[0151] The second main extension direction 58 and the third main extension direction 60 are each oriented laterally to the first main extension direction 40.

[0152] In particular, the corresponding orientation and / or angle between the second main extension direction 58 and the first main extension direction 40 and / or between the third main extension direction 60 and the first main extension direction 40 are adjustable.

[0153] For example, the second principal extension direction 58 and the third principal extension direction 60 each form a minimum angle α of approximately 25° with the first principal extension direction 40.

[0154] Specifically, the second focusing region 54 and the third focusing region 56 are each formed by a plurality of sub-beams, which are focused in a plurality of adjacent sub-regions 62 of the second focusing region 54 and the third focusing region 56 respectively.

[0155] In particular, the adjacent sub-regions 62 into which the sub-beams are focused are arranged so closely together in space that a spatially continuous region is created in terms of interaction with the material 12 of the workpiece 14. Specifically, this allows for the formation of spatially continuous regions of material-modified portions on the material 12 of the workpiece 14 by means of the second focusing region 54 and the third focusing region 56, making the workpiece separable, especially after laser processing, within these continuous regions.

[0156] For example, in order to form the second focusing region 54 and the third focusing region 56, the second sub-beam 28 coupled into the second laser processing unit 22 is split into a plurality of additional sub-beams by means of the second laser processing unit 22, and these additional sub-beams are correspondingly focused into sub-regions 62 of the second focusing region 54 and the third focusing region 56.

[0157] Specifically, by focusing the additional sub-beams into these sub-regions 62, corresponding focal points are formed in the sub-regions 62. In particular, by focusing the additional sub-beams into the sub-regions 62, the light intensity in these sub-regions is so high that there is significant interaction with the material 12 of the workpiece 14 in these sub-regions 62.

[0158] Specifically, these sub-regions 62 are located on straight lines that are oriented parallel to the second main extension direction 58 and the third main extension direction 60, respectively.

[0159] In one embodiment, the second sub-beam 28 coupled into the second laser processing unit 22 is split into a plurality of additional sub-beams by means of the second laser processing unit 22, each of the plurality of additional sub-beams having a different polarization state. In particular, the sub-beams having correspondingly different polarization states are then focused into adjacent sub-regions 62 of the second focusing region 54 and the third focusing region 56.

[0160] Regarding the technical realization of the second focusing region 54 and / or the third focusing region 56 by forming sub-beams with different polarization states, reference is made to an unpublished German patent application by the same applicant, document reference number 102019217577.5 (filed on November 14, 2019). The entire contents of that application are hereby explicitly incorporated.

[0161] In principle, there are different possibilities for technically realizing the second focusing region 54 and / or the third focusing region 56 by focusing the sub-beam into different sub-regions 62. For example, different technical possibilities are described in the scientific publication “Structured light for ultrafast laser micro-and nanoprocessing” (authors D. Flamm et al., arXiv:2012.10119v1 [Physics. Optics], December 18, 2020). Its entire contents are explicitly quoted here.

[0162] For example, the second focusing region 54 has a length l2 on the order of micrometers, such as a length l2 from 100 μm to 400 μm. For example, the third focusing region 56 has a length l3 on the order of micrometers, such as a length l3 from 100 μm to 400 μm.

[0163] For example, workpiece 14 has a first outer surface 64 and a second outer surface 66 spaced apart from the first outer surface 64 in parallel with the depth direction z.

[0164] In the example shown, the first laser processing unit 20 and the second laser processing unit 22 are each arranged facing the first outer surface 64. Thus, for example, the first focusing area 38, the second focusing area 54 and the third focusing area 56 from the same direction can be coupled into the workpiece 14 and / or the first focusing area 38, the second focusing area 54 and the third focusing area 56 can be coupled into the workpiece 14 via the same outer surface of the workpiece 14.

[0165] The first laser processing unit 20 and the second laser processing unit 22 are spaced apart from each other by a working distance A, wherein the distance direction is parallel to the length direction x and / or the width direction y. Accordingly, based on Figure 1 In an exemplary embodiment, the first focusing region 38 is spaced apart from the second focusing region 54 and the third focusing region 56 by a working distance A.

[0166] In order to adjust the working distance A, the equipment 10 specifically includes an adjustment device 68. Using the adjustment device 68, the working distance A can be fixedly adjusted and / or limited, in particular, during the operation of the equipment 10.

[0167] Specifically, by means of the adjustment device 68, the corresponding working distances A between the first focusing area 38, the second focusing area 54 and the third focusing area 56 can be adjusted in the length direction x and the width direction y, respectively.

[0168] Furthermore, the device 10 may be configured to include an adjustment device 70, by means of which the corresponding working positions 72 of the first focusing region 38 and / or the second focusing region 54 and / or the third focusing region 56 in the depth direction z are adjusted. Figure 3a and Figure 5a (Simplified Chinese version) is adjustable.

[0169] Specifically, the first focusing region 38 and / or the second focusing region 54 and / or the third focusing region 56 can be shifted relative to each other with respect to the depth direction z by means of the adjustment device 70.

[0170] Furthermore, the device 10 can be configured to include an adjustment device 74, which, in the case of an asymmetrical cross-section of the first focusing region 38, allows adjustment of the maximum diameter d in the processing plane 42. max Orientation 76 and / or orientation (in) Figure 4b (Simplified Chinese version)

[0171] The first laser processing unit 20 and the second laser processing unit 22 can each move relative to the workpiece 14 parallel to the feed direction 78, particularly the common feed direction, wherein the feed direction 78 is oriented parallel to the processing plane 42.

[0172] The first laser processing unit 20 and the second laser processing unit 22 are coupled to each other in terms of control technology and / or mechanically, such that they move relative to the workpiece along a common feed direction 78 during the operation of the equipment 10. In particular, the working distance A between the first laser processing unit 20 and the second laser processing unit 22 remains constant during the operation of the equipment 10.

[0173] For example, the device 10 includes a holding device 79 on which a first laser processing unit 20 and a second laser processing unit 22 are disposed. For example, movement of the holding device 79 in the feed direction 78 causes corresponding movement of the first laser processing unit 20 and the second laser processing unit 22 in the feed direction.

[0174] Specifically, the first laser processing unit 20 and the second laser processing unit 22 each have a housing 81, by means of which the first laser processing unit 20 and the second laser processing unit 22 are respectively arranged and / or fastened to the holding device 79.

[0175] Furthermore, the movement of the first laser processing unit 20 in the defined feed direction 78 causes the associated first focusing area 38 to move correspondingly relative to the workpiece 14 in the feed direction 78.

[0176] Accordingly, the movement of the second laser processing unit 22 in the defined feed direction 78 causes the associated second focusing area 54 and third focusing area 56 to move relative to the workpiece 14 in the feed direction 78.

[0177] Specifically, it can be configured such that, during the operation of the equipment 10, the maximum diameter d is adjusted by means of the adjusting device 74. max The orientation 76 is parallel to the feed direction 78, especially the automatic orientation parallel to the feed direction 78.

[0178] Furthermore, the device 10 may be configured with an adjustment device 80, by means of which the second focusing area 54 and the third focusing area 56 can each rotate about a rotation axis 82 oriented perpendicular to the processing plane 42. This rotation axis 82 need not be arranged symmetrically with respect to the extended dimensions of the second focusing area 54 and the third focusing area 56, but rather, for example, at the corresponding start point 84 or end point 86 of the second focusing area 54 and the third focusing area 56 (in... Figure 5a (Simplified Chinese version)

[0179] In principle, the rotation axis 82 can also be oriented laterally or parallel to the machining plane 42.

[0180] With the aid of the setting device 80, the orientation 88 and / or orientation of the second focusing region 54 and the third focusing region 56 relative to the rotation axis 82 can be set during the operation of the equipment 10. Specifically, during the operation of the equipment 10, the second focusing region 54 and the third focusing region 56 are oriented at a fixed angle β relative to the feed direction 78, particularly automatically oriented. Figure 8 ).

[0181] Specifically, during the operation of the equipment, the angle β selected by means of the adjustment device 80 is 90°.

[0182] The first focusing area 38, the second focusing area 54, and the third focusing area 56 do not necessarily have a straight shape. In principle, the first focusing area 38 and / or the second focusing area 54 and / or the third focusing area 56 can also have a curved shape and / or a curved longitudinal central axis (in...). Figure 11 (Simplified Chinese version)

[0183] Regarding the formation and properties of quasi-non-diffractive beams and / or Bessel-like beams with curved shapes, refer to the scientific publication “Bessel-like optical beams with arbitrary trajectoryories” by I. Chremmos et al., Optics Letters, Vol. 37, No. 23, December 1, 2012.

[0184] For example, the corresponding main extension directions 40, 58, and 60 of the focal zones 38, 54, and 56 should be understood as the directions of the straight lines passing through the starting point 84 and the ending point 86 of the assigned focal zones 38, 54, and 56.

[0185] Device 10' in Figure 2 Another embodiment shown is based on device 10. Figure 1 The difference from the embodiments described above is that the second focal region 54 and the third focal region 56 are not formed by means of a single laser processing unit, but rather a separate laser processing unit is provided for forming the second focal region 54 and the third focal region 56 respectively.

[0186] In particular, device 10' has one or more features and / or advantages of device 10 described above.

[0187] The device 10' includes a first laser processing unit 20 designed to form a first focusing area 38.

[0188] Furthermore, the apparatus 10' includes a second laser processing unit 90 and a third laser processing unit 92. The second laser processing unit 90 and the third laser processing unit 92 are constructed of the same type and / or have the same functions as the second laser processing unit 22 described above, and thus reference can be made to the preceding description in this regard. In particular, the second laser processing unit 90 and the third laser processing unit 92 possess one or more features and / or advantages of the second laser processing unit 22 described above.

[0189] The second focusing area 54 is formed by means of the second laser processing unit 90, while the third focusing area 56 is formed by means of the third laser processing unit 92.

[0190] According to Figure 2 In one embodiment, the second laser processing unit 90 is spaced apart from the first laser processing unit 20 by a first working distance A1, and the third laser processing unit 92 is spaced apart from the first laser processing unit 20 by a second working distance A2, wherein the corresponding distance directions of the working distances A1 and A2 are parallel to the processing plane 42.

[0191] Therefore, the second focusing area 54 generated by the second laser processing unit 90 is separated from the first focusing area 38 generated by the first laser processing unit 20 by a working distance A1, and the third focusing area 56 generated by the third laser processing unit 92 is separated from the first focusing area 38 by a working distance A2.

[0192] In the example shown, the first laser processing unit 20 and the first focusing area 38 are arranged between the second laser processing unit 90, the second focusing area 54, and the third laser processing unit 92, the third focusing area 56, with respect to the length direction x and / or the width direction y, respectively. In principle, the laser processing units 20, 90, 92, or the focusing areas 38, 54, 56, can also be positioned in any other desired order with respect to the length direction x and / or the width direction y.

[0193] The first laser processing unit 20, the second laser processing unit 90, and the third laser processing unit 92 are arranged on the holding device 79 and can move relative to the workpiece 14 parallel to the common feed direction 78 by means of the holding device 79. Accordingly, the first focusing area 38, the second focusing area 54, and the third focusing area 56 can move relative to the workpiece 14 parallel to the common feed direction 78.

[0194] Device 10' includes a coupling device 24', which in principle has the same function as the coupling device 24 described above, and therefore reference can be made to the above description in this regard. In particular, coupling device 24' has one or more features and / or advantages of the coupling device 24 described above.

[0195] In the example shown, the input laser beam 18 is decomposed into a first sub-beam 94 for coupling to the third laser processing unit 92, a second sub-beam 96 for coupling to the first laser processing unit 20, and a third sub-beam 98 for coupling to the second laser processing unit 90 by means of a coupling device 24', the decomposition being particularly performed by means of polarization beam splitting.

[0196] For example, the coupling device 24' includes a first polarizing element 30a and a second polarizing element 30b arranged downstream of the first polarizing element 30a in the beam propagation direction 34.

[0197] With regard to the beam propagation direction 34, a first polarization beam splitting element 32a for splitting the input laser beam 18 into a first sub-beam 94 and a transmitted beam 100 is arranged between a first polarization element 30a and a second polarization element 30b.

[0198] The transmitted beam 100 is incident on the second polarizing element 30b, and is then split into a second sub-beam 96 and a third sub-beam 98 by means of the second polarizing beam splitter 32b.

[0199] The intensity ratio and / or power ratio of the first sub-beam 94, the second sub-beam 96, and the third sub-beam 98 can be adjusted by means of the first polarization beam splitter 32a and the second polarization beam splitter 32b.

[0200] In principle, laser beams from different laser sources can also be coupled into the first laser processing unit 20, the second laser processing unit 90, and the third laser processing unit 92, respectively.

[0201] The operating mode of device 10 is as follows:

[0202] By using the device 10 to perform laser processing on the workpiece 14, one or more workpiece segments 101 can be separated from the workpiece 14, for example. Figure 6 ).

[0203] Therefore, the material 12 of the workpiece 14 is loaded with the first focusing area 38, the second focusing area 54 and the third focusing area 56.

[0204] For example, by means of the second laser processing unit 22, a second focusing region 54 and a third focusing region 56 are arranged and formed such that: the second focusing region 54 is arranged to be spaced apart from the third focusing region 56 in the depth direction z, and / or the second focusing region 54 and the third focusing region 56 are arranged at the same position in terms of the length direction x and / or the width direction y.

[0205] Using the first laser processing unit 20, a first focusing region 38 is arranged and formed such that it extends, in particular, entirely between the second focusing region 54 and the third focusing region 56 in the depth direction z. Here, the first focusing region 38 is spaced apart from the second and third focusing regions 54 and 56 by a working distance A. Figure 1 In the case shown, the working distance A is, for example, oriented parallel to the feed direction 78.

[0206] Specifically, with respect to the depth direction z, the third focusing region 56 extends within the material 12 between the second outer surface 66 of the workpiece 14 and the first focusing region 38. Specifically, with respect to the depth direction z, the second focusing region 54 extends between the first focusing region 38 and the first outer surface 64.

[0207] For example, the corresponding positions of the first focusing area 38, the second focusing area 54, and the third focusing area 56 in the depth direction can be adjusted by means of the adjustment device 70.

[0208] Specifically, the first focusing area 38, the second focusing area 54, and the third focusing area 56 for machining workpiece 14 extend in a common plane, which is specifically oriented perpendicular to the machining plane 42. For example, this can be achieved by means of appropriate adjustment of the adjusting devices 68 and 80.

[0209] By loading the workpiece 14 at a defined processing location 102 with a second focusing region 54 and a third focusing region 56, a suitable material modification portion is generated in the material 12 of the workpiece 14 at that processing location 102. Figure 8 ).

[0210] The material-modified portion generated at the processing section 102 by means of the second focusing region 54 is arranged along the second processing line 104. Correspondingly, the material-modified portion is formed at the processing section 102 along the third processing line 106 by means of the third focusing region 56.

[0211] By moving relative to the material 12 through the second focusing area 54 and the third focusing area 56, a material modification section is formed along the corresponding processing surface and / or processing plane, which is oriented, for example, parallel to the second processing line 104 and the feed direction 78 and parallel to the third processing line 106 and the feed direction 78.

[0212] The first focusing zone 38 illuminates the workpiece 14 at the processing area 102 of interest after the second focusing zone 54 and / or the third focusing zone 56. Figure 9 ), where the time interval corresponds, for example, to the quotient of the working distance and the feed rate (in the case of constant feed rate and feed direction).

[0213] At the processing section 102, by loading material 12 with a first focusing area 38, a material modification section is generated in the material 12 along the first processing line 108. The material modification section is formed along a corresponding processing surface and / or processing plane by the relative movement of the first focusing area 38 with respect to the material 12. The processing surface and / or processing plane is oriented, for example, parallel to the first processing line 108 and the feed direction 78.

[0214] Specifically, the lengths and / or shapes of the first processing line 108, the second processing line 104, and the third processing line 106 correspond to the lengths and / or shapes of the first focusing area 38, the second focusing area 54, and the third focusing area 56 within the material 12 when the workpiece 14 is loaded.

[0215] The first processing line 108 has a length l' corresponding to the first focusing region 38, the second processing line 104 has a length l'2 corresponding to the second focusing region 54, and the third processing line 106 has a length l'3 corresponding to the third focusing region 56.

[0216] For example, the workpiece 14 is laser-processed along a given processing contour 110 by means of the equipment 10, wherein the processing contour 110 is, for example, a closed contour. As a result, a corresponding material modification portion is formed on the material 12 along the processing surfaces corresponding to the processing lines 104, 106, 108, at which the material 12 is separable.

[0217] Thus, for example, workpiece segment 101 can be separated from and / or isolated from workpiece 14. For example, the separation of workpiece segment 101 can be carried out by thermal loading and / or by applying mechanical stress and / or by etching with the aid of at least one wet chemical solution (e.g., in an ultrasonic-assisted etching bath).

[0218] The geometry of workpiece segment 101 in the separation region 112 and / or edge region ( Figure 7 This corresponds to the geometry of the first focusing area 38, the second focusing area 54, and the third focusing area 56 previously loaded on the workpiece 14. The workpiece segment 101 has an edge 114 (chamfer) in the separation region 112 that has been generated by means of the second focusing area 54 and the third focusing area 56.

[0219] For example, if the second focusing region 54 and / or the third focusing region 56 have a curved shape, then the associated second processing line 104 and third processing line 106 also have a corresponding curved shape. Figure 11 For example, this allows for the formation of rounded edges in the separation region 112.

[0220] By adjusting the corresponding working distances A in the length direction x and width direction y between the first focusing area 38, the second focusing area 54, and the third focusing area 56 using the adjusting device 68, the corresponding lengths l, l2, and l3, as well as l, l'2, and l'3, can be defined. In particular, this allows for the definition of the edge length in the separation region 112.

[0221] If the first focusing area 38 generated by the first laser processing unit 20 has an asymmetrical cross-section ( Figure 4a and Figure 4b If the maximum diameter d is 0, then the maximum diameter d is 0. max The orientation 76 is oriented, in particular, parallel to the feed direction 78, by means of the setting device 74. This results in the formation of cracks in the material 12, which are oriented at least approximately parallel to the feed direction 74 and / or parallel to the corresponding machining plane, which in particular enables improved material separation.

[0222] In particular, if the machining part 102 is loaded with the first focal zone 38 after the machining part 102 has been loaded with the second focal zone 54 as in the example described above, the use of the first focal zone 38 with an asymmetrical cross-section and the adjustment of the orientation 76 parallel to the feed direction 78 are related.

[0223] Since a second processing line 104 has been formed at processing location 102, there is a shielding effect on the sub-beam 116 that forms the first focusing region 38 (in Figure 10(Simplified diagram). Especially in the case of a symmetrical cross-section of the first focal region 38, this may interfere with crack formation in the material 12, and to the extent that, for example, cracks form at different angles relative to the feed direction 78 and / or not substantially parallel to the feed direction 78 as desired. In this case, crack formation can also be controlled by using a first focal region 38 with an asymmetrical cross-section and by adjusting the orientation 76 parallel to the feed direction 78, such that cracks form substantially parallel to the feed direction 78.

[0224] In principle, Figure 2 The device 10' shown has the same operating mode as device 10.

[0225] In the case of device 10', according to Figure 2 In an exemplary embodiment, the second focusing area 54 is spaced apart from the first focusing area 38 by a working distance A1, and the third focusing area 56 is spaced apart from the first focusing area 38 by a working distance A2, wherein the first focusing area 38 is arranged between the second focusing area 54 and the third focusing area 56.

[0226] Accordingly, in the example shown, at a defined processing location 102 of workpiece 14, the material modification portion is first formed along the second processing line 104, then along the first processing line 108, and then along the third processing line 106.

[0227] In principle, the order in which the first processing line 108, the second processing line 104, and the third processing line 106 are created can be implemented in any other order. For this purpose, equipment 10, 10' can be adapted and / or configured accordingly if necessary.

[0228] List of reference numerals

[0229] A working distance

[0230] A1 First Working Distance

[0231] A2 Second Working Distance

[0232] α angle

[0233] β angle

[0234] d0 diameter

[0235] d max Maximum diameter

[0236] l length

[0237] l2 length

[0238] l3 length

[0239] l' length

[0240] l'2 length

[0241] l'3 length

[0242] x length direction

[0243] y-direction (width)

[0244] z Depth direction

[0245] 10, 10' equipment

[0246] 12 Materials

[0247] 14 Workpieces

[0248] 16 laser sources

[0249] 18 Input laser beam

[0250] 20 First Laser Processing Unit

[0251] 22 Second Laser Processing Unit

[0252] 24, 24' Coupling Device

[0253] 26 First Sub-beam

[0254] 28 Second Sub-beam

[0255] 30 Polarizing element

[0256] 30a First polarization element

[0257] 30b Second polarization element

[0258] 32 Polarization beam splitter element

[0259] 32a First polarization beam splitter element

[0260] 32b Second polarization beam splitter element

[0261] 34. Beam propagation direction

[0262] 36. Mirror element

[0263] 38 First Focus Area

[0264] 40 First main extension direction

[0265] 42 Machining plane

[0266] 50 Maximum intensity distribution area

[0267] 52 Secondary intensity distribution section

[0268] 54 Second Focus Area

[0269] 56 Third Focus Area

[0270] 58 Second main extension direction

[0271] 60 Third main extension direction

[0272] 62 sub-regions

[0273] 64 First outer surface

[0274] 66 Second outer surface

[0275] 68 Adjustment device

[0276] 70 Adjustment device

[0277] 72 Work Location

[0278] 74 Adjustment device

[0279] 76 Orientations

[0280] 78 Feed direction

[0281] 79 Holding device

[0282] 80 Adjustment device

[0283] 81 Casing

[0284] 82 Rotation axis

[0285] 84 Starting Point

[0286] 86 Finish Line

[0287] 88 Orientation

[0288] 90 Second Laser Processing Unit

[0289] 92 Third Laser Processing Unit

[0290] 94 First Sub-beam

[0291] 96 Second Sub-beam

[0292] 98 Third Sub-beam

[0293] 100 Transmitted Beam

[0294] 101 Workpiece Section

[0295] 102 Processing area

[0296] 104 Second Processing Line

[0297] 106 Third Processing Line

[0298] 108 First Processing Line

[0299] 110 Machining contour

[0300] 112 Separation Region

[0301] 114 Edge

[0302] 116 sub-beams

Claims

1. An apparatus for laser processing of a workpiece (14) in a processing plane (42), the apparatus comprising: A first laser processing unit (20) is used to form a first focusing area (38) extending along a first main extension direction (40). as well as At least one additional laser processing unit (22; 90, 92) is used to form at least one additional focusing area (54, 56), which extends along an additional main extension direction (58, 60) oriented transversely to the first main extension direction (40). The first focusing area (38) and the at least one additional focusing area (54, 56) are spaced apart from each other by working distances (A; A1, A2) parallel to the processing plane (42). The first laser processing unit (20) and the first focusing area (38) and the at least one additional laser processing unit (22; 90, 92) and the at least one additional focusing area (54, 56) are respectively capable of moving along a feed direction (78) oriented parallel to the processing plane (42), and the workpiece (14) is formed by the first focusing area (38) ... The material (12) is transparent to the laser beam of the at least one additional focal region (54, 56), wherein the at least one additional focal region is configured to form chamfered or rounded edges for the processing contour of the first focal region, and the at least one additional focal region (54, 56) is formed by means of the at least one additional laser processing unit (22; 90, 92) by splitting the laser beam into a plurality of sub-beams, wherein these sub-beams are correspondingly focused in mutually adjacent sub-regions (62) of the at least one additional focal region (54, 56).

2. The device as described in claim 1, characterized in that, The first laser processing unit (20) and the at least one additional laser processing unit (22; 90, 92) are arranged to face the same outer side (64; 66) of the workpiece (14); and / or, the first focusing area (38) and the at least one additional focusing area (54, 56) are coupled into or are capable of being coupled into the workpiece (14) through the same outer side (64; 66) of the workpiece (14); and / or The device includes a holding device on which a first laser processing unit and at least one additional laser processing unit are arranged, wherein the first laser processing unit and a first focusing area, and the at least one additional laser processing unit and the at least one additional focusing area, are movable in a common feed direction by means of the holding device.

3. The device as described in any one of the preceding claims, characterized in that, The first laser processing unit (20) and the at least one additional laser processing unit (22; 90, 92) are mechanically coupled and / or technically coupled to each other, such that the movement of the first laser processing unit (20) and the first focusing area (38) and the movement of the at least one additional laser processing unit (22; 90, 92) and the at least one additional focusing area (54, 56) are along a common feed direction (78); or The first laser processing unit (20) and the at least one additional laser processing unit (22; 90, 92) are mechanically coupled and / or technically coupled to each other, such that the movement of the first laser processing unit (20) and the first focusing area (38) and the movement of the at least one additional laser processing unit (22; 90, 92) and the at least one additional focusing area (54, 56) are along processing contours (110) that are oriented parallel to each other and / or offset from each other.

4. The device as described in claim 1 or 2, characterized in that, The additional main extension directions (58, 60) are oriented at an angle (α) of at least 1° and at most 89° relative to the first main extension direction (40).

5. The device as described in claim 1 or 2, characterized in that, An adjustment device (68) is provided for adjusting a working distance (A; A1, A2) oriented parallel to the processing plane (42) between the first focusing area (38) and the at least one other focusing area (54, 56) and / or between the first laser processing unit (20) and the at least one other laser processing unit (22; 90, 92). The working distance (A; A1, A2) is adjustable in a length direction (x) parallel to the processing plane (42) and in a width direction (y) parallel to the processing plane (42).

6. The device as described in claim 1 or 2, characterized in that, The first focusing area (38) formed by means of the first laser processing unit (20) has a quasi-non-diffractive beam profile and / or a Bessel-like beam profile.

7. The device as described in claim 1 or 2, characterized in that, The first focusing area (38) formed by means of the first laser processing unit (20) is elliptical in cross section parallel to the processing plane (42).

8. The device as described in claim 7, characterized in that, The maximum diameter (d) of the cross-section of the first focusing region (38) is provided. max The orientation (76) of the maximum diameter (d) is adjusted by a device (74) that rotates in the machining plane (42). max It can be oriented parallel to the feed direction (78) by means of the adjustment device (74).

9. The device as described in claim 1 or 2, characterized in that, The system is provided with a setting device (80) for rotating the first focusing area (38) and / or the at least one additional focusing area (54, 56) about a rotation axis (82) that is oriented laterally to, perpendicularly to, or parallel to the processing plane (42), and is capable of setting the at least one additional focusing area (54, 56) to an orientation (88) at a fixed angle (β) relative to the feed direction (78) by means of the setting device (80).

10. The device as claimed in claim 1 or 2, characterized in that, A coupling device (24, 24') is provided for coupling an input laser beam (18) into the first laser processing unit (20) and the at least one additional laser processing unit (22; 90, 92), wherein the input laser beam (18) is split by means of the coupling device (24, 24') into a first sub-beam (26; 94) for coupling into the first laser processing unit (20) and at least one additional sub-beam (28; 96, 98) for coupling into the at least one additional laser processing unit (22; 90, 92).

11. The device as claimed in claim 1 or 2, characterized in that, A second focusing region (54) having a second main extension direction (58) and a third focusing region (56) having a third main extension direction (60) are formed by means of at least one additional laser processing unit (22; 90, 92), the second main extension direction (58) and the third main extension direction (60) being oriented laterally to the first main extension direction (40), and the second focusing region (54) and the third focusing region (56) being spaced apart from each other in a depth direction (z) perpendicular to the processing plane (42) and / or the first focusing region (38) being arranged between the second focusing region (54) and the third focusing region (56) in a depth direction (z) perpendicular to the processing plane (42).

12. The device as claimed in claim 11, characterized in that, With respect to the width direction (y) and / or length direction (x) parallel to the processing plane (42), the second focusing area (54) and the third focusing area (56) are arranged at least in the same position in sections; or, with respect to the width direction (y) and / or length direction (x) parallel to the processing plane (42), the second focusing area (54) and the third focusing area (56) are arranged spaced apart from each other.

13. A method for laser processing of a workpiece (14) using the apparatus according to any one of claims 1 to 12, characterized in that, A first focal region (38) extending along a first main extension direction (40) is formed by means of a first laser processing unit (20), and at least one additional focal region (54, 56) is formed by means of at least one additional laser processing unit (22; 90, 92), the at least one additional focal region extending along an additional main extension direction (58, 60) oriented transversely to the first main extension direction (40), wherein the first focal region (38) and the at least one additional focal region (54, 56) are spaced apart from each other by working distances (A; A1, A2) parallel to the processing plane (42), with the first focal region (38) and the at least one additional focal region (54, 56) being... The workpiece (14) is loaded such that the first laser processing unit (20) and the first focal area (38) and the at least one additional laser processing unit (22; 90, 92) and the at least one additional focal area (54, 56) each move relative to the workpiece (14) in a feed direction (78) oriented parallel to the processing plane (42), and the workpiece (14) is made of a material (12) that is transparent to the laser beams that form the first focal area (38) and the at least one additional focal area (54, 56), wherein the at least one additional focal area is configured to form chamfered or rounded edges for the processing contour of the first focal area.

14. The method as described in claim 13, characterized in that, The workpiece (14) is loaded at a determined processing location (102) in a time-staggered manner with the first focusing area (38) and the at least one additional focusing area (54, 56).

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