Antenna module and electronic device including the antenna module

Abstract

An electronic device is disclosed. The disclosed electronic device includes: a housing including side surface members; a support member; a display; an antenna module including at least one patch antenna; a PCB; a wireless communication circuit disposed on the PCB; a first conductive member; a first connection portion; a second connection portion; and a protrusion formed to extend from a first segment of the first conductive member toward the interior of the housing and electrically connected to the first conductive member. The antenna module is disposed at positions corresponding to a first opening formed by the first conductive member, the support member, the first connection portion, and the second connection portion, and corresponding to a second opening formed by the first conductive member, the support member, the first connection portion, and the protrusion. The wireless communication circuit can be electrically connected to the protrusion and the antenna module.

Description

Technical Field

[0001] This disclosure relates to an antenna module and an electronic device including the antenna module. Background Technology

[0002] Due to the development of mobile communication technology, electronic devices, including at least one antenna, have become widely distributed. Electronic devices can transmit and / or receive radio frequency (RF) signals, including voice signals or data (e.g., messages, pictures, videos, music files, or games), by using antennas.

[0003] An electronic device's antenna can transmit and / or receive signals belonging to different frequency bands using multiple frequency bands. The electronic device can serve global communication frequency bands by using signals belonging to different frequency bands. For example, an electronic device can perform communication using signals belonging to the low-frequency band (LB) (e.g., Global Positioning System (GPS), Legacy, Wi-Fi 1) and / or communication using signals belonging to the high-frequency band (HB) (e.g., Wi-Fi 2).

[0004] Electronic devices can transmit and / or receive signals by using a housing itself, comprising a conductive material, and an antenna module disposed within the housing as a radiator. For example, at least a portion of the metal housing included in the electronic device can be electrically connected to a power supply unit, and the power supply unit can transmit and / or receive signals belonging to various frequency bands through at least a portion of the metal housing. Electronic devices may include a structure having an opening filled with a non-conductive material in a region within the housing to effectively transmit and / or receive frequency signals.

[0005] The above information is presented as background information only to aid in understanding this disclosure. No decision has been made, nor any assertion, regarding whether any of the above content can be considered prior art in connection with this disclosure. Summary of the Invention

[0006] Technical issues

[0007] In electronic devices, various components (e.g., camera modules) can be housed inside a casing. However, as the number of components to be housed increases, the internal space becomes increasingly limited.

[0008] For example, as the installation space narrows, interference may occur between multiple antenna radiators that transmit and / or receive signals in different frequency ranges. Furthermore, the aesthetics of the electronics may be compromised when antenna operation is performed using an additional portion of the housing.

[0009] The aspects of this disclosure will at least solve the aforementioned problems and / or disadvantages and provide at least the following advantages. Therefore, one aspect of this disclosure is to provide an electronic device that uses at least a portion of a physical structure defining the appearance of the electronic device to radiate electromagnetic signals.

[0010] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description or may be learned by practice of the presented embodiments.

[0011] Technical solution

[0012] According to one aspect of this disclosure, an electronic device is provided. The electronic device includes: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surrounding the space between the first and second plates and connecting one side of the first plate and one side of the second plate; a support member disposed in the space between the first and second plates; a display disposed on a first surface of the support member and exposed through at least a portion of the first plate; an antenna module disposed on the second surface of the support member facing a direction opposite to the first surface and including one or more patch antennas; a printed circuit board (PCB) disposed on the second surface of the support member; wireless communication circuitry disposed on the PCB; a first conductive member included in the side member and extending from a first end toward a third direction to a second end; a first connector projecting toward the interior of the housing from a point between the first and second ends of the first conductive member and physically connected to the support member; a second connector extending toward the interior of the housing from a second end of the first conductive member and physically connected to the support member; and a protrusion extending toward the interior of the housing from a first end of the first conductive member and electrically connected to the first conductive member. For example, the antenna module may be positioned at a location corresponding to at least one of a first opening defined by a first conductive member, a support member, a first connector, and a second connector, and a second opening defined by a first conductive member, a support member, a first connector, and a protrusion, and the wireless communication circuit may be electrically connected to the protrusion and the antenna module.

[0013] According to another aspect of this disclosure, an electronic device is provided. The electronic device includes: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surrounding the space between the first and second plates and connecting one side of the first plate and one side of the second plate; a support member disposed in the space between the first and second plates; a display disposed on a first surface of the support member and exposed through at least a portion of the first plate; an antenna module disposed on the second surface of the support member facing a direction opposite to the first surface and including one or more patch antennas; a PCB disposed on the second surface of the support member; a wireless communication circuit disposed on the PCB; and a first conductive member included in the side member. The device comprises: a first conductive member extending from a first end toward a third direction toward a second end; a second conductive member included in a side member and physically spaced apart from the first conductive member by a first partition; a first connector protruding from a point between the first and second ends of the first conductive member toward the interior of the housing and physically connected to a support member; a second connector protruding from the second end of the first conductive member toward the interior of the housing and physically connected to the support member; and a protrusion protruding from a point toward the interior of the housing and electrically connected to the second conductive member, said point being spaced apart from the first end of the second conductive member adjacent to the first partition in a fourth direction, the fourth direction being the direction opposite to the third direction. For example, the antenna module may be disposed at a location corresponding to a first opening defined by the first conductive member, the support member, the first connector, and the second connector, or a second opening defined by the first conductive member, the second conductive member, the first connector, the support member, and the protrusion, and a wireless communication circuit may be electrically connected to the protrusion and the antenna module.

[0014] Electronic devices according to embodiments disclosed in this disclosure can overcome spatial limitations by using at least a portion of a physical structure that defines the appearance of the electronic device to transmit and / or receive frequency signals of various frequency bands.

[0015] Beneficial effects

[0016] According to the various embodiments disclosed herein, the limitation of the installation space in the housing of an electronic device can be overcome by utilizing the physical structure of a portion of the housing as an antenna radiator.

[0017] In addition, the electronic device may have a housing structure that is implemented together with an antenna module for transmitting and / or receiving signals in a specific frequency band, so as to allow signals in multiple frequency bands including a specific frequency band to be effectively transmitted and / or received.

[0018] In addition, it can provide various effects that can be understood directly or indirectly through the instruction manual.

[0019] Other aspects, advantages, and distinctive features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments disclosed in conjunction with the accompanying drawings. Attached Figure Description

[0020] The above and other aspects, features and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 A diagram of an electronic device in a network environment according to embodiments of the present disclosure;

[0022] Figure 2 A perspective view of the front surface of an electronic device according to an embodiment of the present disclosure is shown;

[0023] Figure 3 A perspective view of the rear surface of an electronic device according to an embodiment of the present disclosure is shown;

[0024] Figure 4 An exploded perspective view of an electronic device according to an embodiment of the present disclosure is shown;

[0025] Figure 5 The structure of an electronic device including a plurality of openings according to an embodiment of the present disclosure is shown;

[0026] Figure 6 The structure of an electronic device including an antenna module according to an embodiment of the present disclosure is shown;

[0027] Figure 7 The structure of an electronic device including a plurality of openings according to an embodiment of the present disclosure is shown;

[0028] Figure 8 The structure of an electronic device including an antenna module according to an embodiment of the present disclosure is shown;

[0029] Figure 9 The structure of an electronic device including a plurality of openings according to an embodiment of the present disclosure is shown;

[0030] Figure 10 A side surface of an electronic device including an antenna module according to an embodiment of the present disclosure is shown;

[0031] Figures 11 to 13 The radiation performance of electronic devices according to various embodiments of the present disclosure due to their internal structure is illustrated; and

[0032] Figure 14 This is a block diagram of an electronic device supporting conventional network communication and fifth-generation (5G) network communication according to embodiments of the present disclosure.

[0033] Throughout the accompanying drawings, it should be noted that similar reference numerals are used to depict the same or similar elements, features, and structures. Detailed Implementation

[0034] The following description, taken with reference to the accompanying drawings, is provided to aid in a comprehensive understanding of the various embodiments of this disclosure as defined by the claims and their equivalents. It includes various specific details to aid understanding, but these are to be considered exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of this disclosure. Furthermore, descriptions of well-known functions and constructions may be omitted for clarity and brevity.

[0035] The terms and words used in the following description and claims are not limited to their literal meaning, but are used by the inventors only to enable a clear and consistent understanding of this disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this disclosure is provided for illustrative purposes only and is not intended to limit the purpose of this disclosure as defined in the appended claims and their equivalents.

[0036] It will be understood that the singular forms “one” and “the” include plural indicators unless the context clearly indicates otherwise. Thus, for example, referring to “the surface of a component” includes referring to one or more such surfaces.

[0037] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment of the present disclosure. (Refer to...) Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0038] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0039] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0040] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0041] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0042] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0043] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0044] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0045] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0046] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0047] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0048] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0050] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0051] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0052] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0053] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0054] Wireless communication module 192 can support 5G networks beyond fourth-generation (4G) networks and next-generation communication technologies (such as New Radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable low-latency communications (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0055] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0056] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0057] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0058] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102 or 104 or server 108. For example, if electronic device 101 is required to automatically perform a function or service or should perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0059] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0060] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the corresponding component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0061] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0062] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0063] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0064] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0065] Figure 2 An electronic device 200 according to an embodiment of the present disclosure (e.g., Figure 1 A perspective view of the front surface of the electronic device 101. Figure 3 This is a perspective view of the rear surface of an electronic device 200 according to an embodiment of the present disclosure.

[0066] Reference Figure 2 and Figure 3 The electronic device 200 according to an embodiment may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing may refer to defining Figure 2 The structure comprises some of the first surface 210A, the second surface 210B, and the side surface 210C. According to an embodiment, the first surface 210A may be defined by a front panel 202 (e.g., a glass plate or a polymer plate including various coatings), at least a portion of which is substantially transparent. The second surface 210B may be defined by a substantially opaque rear panel 211. For example, the rear panel 211 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above. The side surface 210C may be coupled to the front panel 202 and the rear panel 211 and may be defined by a side frame structure (or “side member”) 218 ​​comprising metal and / or polymer. In some embodiments, the rear panel 211 and the side frame structure 218 may be integrally formed and may comprise the same material (e.g., a metallic material, such as aluminum).

[0067] In the illustrated embodiment, the front panel 202 may include two first regions 210D that are biased from the first surface 210A toward the rear panel 211 and extend seamlessly at opposite ends of the long side of the front panel 202. In the illustrated embodiment (see...) Figure 3 In this embodiment, the rear panel 211 may include two second regions 210E that extend seamlessly from the second surface 210B, offset from the front panel 202, and at the opposite end of the long side of the rear panel 211. In some embodiments, the front panel 202 (or the rear panel 211) may include only one of the first regions 210D (or the second regions 210E). In other embodiments, some of the first regions 210D or the second regions 210E may not be included. In an embodiment, when viewed from the side of the electronic device 200, the side frame structure 218 may have a first thickness (width) on its side surface that does not include either the first region 210D or the second region 210E, and a second thickness less than the first thickness on its side surface that includes either the first region 210D or the second region 210E.

[0068] In an embodiment, at least one antenna radiator (e.g., a conductive pattern) may be disposed on a side member of the housing 210 of the electronic device 200 (e.g., Figure 3 The side frame structure 218), two first regions 210D that are biased toward the rear plate 211 from the first surface 210A of the front plate 202 and extend seamlessly, or two regions (e.g., first region 210D and second region 210E) that are biased toward the front plate 202 from the second surface 210B of the rear plate 211 and extend seamlessly.

[0069] In an embodiment, the first region 210D or the second region 210E may be planar to substantially define a plane with the first surface 210A or the second surface 210B without deflection.

[0070] In an embodiment, at least one antenna radiator can radiate signals in a specific frequency band. In an embodiment, at least one antenna radiator can be an auxiliary radiator. For example, at least one antenna radiator can radiate signals belonging to the 5G Sub-6 frequency band (such as n41, n78, and / or n79) from about 3.5 GHz to about 6 GHz. As another example, at least one antenna radiator can radiate frequencies in a Wi-Fi band. The Wi-Fi band can include bands such as 802.11a and / or 802.11b.

[0071] In one embodiment, at least one antenna radiator may be a main radiator. In another embodiment, some frequency bands radiated by the main radiator and some frequency bands radiated by the auxiliary radiator may be the same, while the remaining frequency bands may be different.

[0072] In one embodiment, as another example, at least one antenna radiator can radiate frequencies in the millimeter-wave band. For example, the millimeter-wave band may include bands such as about 24 to 34 GHz and / or about 37 to 44 GHz. As another example, at least one antenna radiator can radiate frequencies in the 11ay band.

[0073] According to an embodiment, the electronic device 200 may include a display 201 (e.g., Figure 1 Display module 160), audio modules 203, 207 and 214 (e.g., Figure 1 The audio module 170), sensor modules 204, 216 and 219 (e.g., Figure 1 Sensor module 176), camera modules 205, 212 and 213 (e.g., Figure 1 The electronic device 200 may include at least one of the following: camera module 180, key input device 217, light-emitting element 206, and connector holes 208 and 209. In some embodiments, at least one of the components (e.g., key input device 217 or light-emitting element 206) may be omitted from the electronic device 200, or additional components may be included in the electronic device 200.

[0074] For example, the display 201 may be visually exposed through a substantial portion of the front panel 202. In some embodiments, at least a portion of the display 201 may be exposed through the front panel 202 defining at least a portion of a first region 210D and a second region 210E of a side surface 210C, and a first surface 210A. In some embodiments, the corners of the display 201 may have a shape substantially the same as the adjacent external shape of the front panel 202. In other embodiments (not shown), to increase the area of ​​visual exposure of the display 201, the spacing between the outer edge of the display 201 and the outer edge of the front panel 202 may be substantially the same.

[0075] In other embodiments (not shown), a portion of the screen display area of ​​the display 201 may have a recess or opening, and may include at least one of an audio module 214, a sensor module 204, a camera module 205, and a light-emitting element 206 aligned with the recess or opening. In other embodiments (not shown), at least one of the audio module 214, sensor module 204, camera module 205, fingerprint sensor 216, and light-emitting element 206 may be included on the rear surface of the screen display area of ​​the display 201. In other embodiments (not shown), the display 201 may be coupled to, or positioned adjacent to, a touch detection circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for a stylus that detects magnetic field types. In some embodiments, at least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be disposed in a first region 210D and / or a second region 210E. In another example, a portion of the screen display area of ​​display 201 may include a different pixel structure, a different pixel density, and / or a different wiring structure compared to another area, and may include at least one of an audio module 214, a sensor module 204, a camera module 205, and a light-emitting element 206 disposed at a position aligned with the portion of the area.

[0076] Audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sound may be disposed in the microphone hole 203, and in some embodiments, multiple microphones may be configured to detect the direction of sound. Speaker holes 207 and 214 may include an external speaker hole 207 and a call receiver hole 214. In some embodiments, speaker holes 207 and 214 and microphone hole 203 may be implemented by a single hole, or a speaker may be included without using speaker holes 207 or 214 (e.g., a piezoelectric speaker).

[0077] Sensor modules 204, 216, and 219 can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device 200 or the external environmental state. For example, sensor modules 204, 216, and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 210A of the first housing 210 and / or a third sensor module 219 (e.g., an HRM sensor) and / or a fourth sensor module 216 (e.g., a fingerprint sensor) disposed on a second surface 210B of the housing 210. The fingerprint sensor may be disposed not only on the first surface 210A of the housing 210 (e.g., a display 201) but also on the second surface 210B. The electronic device 200 may further include at least one of the following sensor modules (not shown): a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 204.

[0078] Camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200, a second camera device 212 disposed on a second surface 210B, and / or a flash 213. Camera modules 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. For example, the flash 213 may include a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras or wide-angle / telephoto lenses) and image sensors may be disposed on one surface of the electronic device 200.

[0079] Key input device 217 may be disposed on side surface 210C of housing 210. In another embodiment, electronic device 200 may not include some or all of the above-described key input devices 217, and the un-included key input devices 217 may be implemented on display 201 in different forms such as soft keys. In some embodiments, the key input device may include sensor module 216 disposed on second surface 210B of housing 210.

[0080] For example, the light-emitting element 206 may be disposed on the first surface 210A of the housing 210. For example, the light-emitting element 206 may provide status information about the electronic device 200 in the form of light. In other embodiments, for example, the light-emitting element 206 may provide a light source that interacts with the operation of the camera module 205. For example, the light-emitting element 206 may include a light-emitting diode (LED), an IR LED, and / or a xenon lamp.

[0081] Connector holes 208 and 209 may include a first connector hole 208 and / or a second connector hole (e.g., a headphone jack) 209. The first connector hole 208 may accommodate a connector (e.g., a USB connector) for transmitting power and / or data to and from an external electronic device, and for receiving power and / or data from an external electronic device. The second connector hole 209 may accommodate a connector for transmitting audio signals to and from an external electronic device.

[0082] Figure 4 An electronic device according to embodiments of this disclosure (e.g., Figure 2 and / or Figure 3 Exploded perspective view 400 of the electronic device 200. (Refer to...) Figure 2 The electronic device 200 may include a side bezel structure 410 (e.g., Figure 2 The side frame structure 218), the first support member 411 (e.g., bracket), the front panel 420, and the display 430 (e.g., Figure 2 The display 201), PCB 440, battery 450, second support member 460 (e.g., rear housing), short-range antenna 470 and / or rear plate 480 (e.g., Figure 3 (The rear plate 211). In some embodiments, at least one of the elements (e.g., the first support member 411 or the second support member 460) may be omitted from the electronic device 200, or additional components may be additionally included in the electronic device 200. At least one of the components of the electronic device 200 may be... Figure 2 or Figure 3 At least one of the components of the electronic device 200 is the same or similar, and repeated descriptions thereof will be omitted.

[0083] Reference Figure 4 According to an embodiment, the side frame structure 410 may include one or more conductive members surrounding the space between the front panel 420 and the rear panel 480 of the electronic device 200 and spaced apart from each other by partitions. For example, the side frame structure 410 may include a plurality of conductive members spaced apart from each other by at least one partition. The electronic device 200 may include at least one end and / or one point of the plurality of conductive members extending into the housing (e.g., Figure 2 The electronic device 200 may include a protruding structure inside the housing 210. For example, the electronic device 200 may include at least one connector that protrudes into the housing from at least one end and / or one point of the plurality of conductive members and is physically connected to a support member (e.g., a first support member 411). As another example, the electronic device 200 may include a protrusion that protrudes into the housing from at least one end of the plurality of conductive members and is electrically connected to at least one of the plurality of conductive members.

[0084] According to an embodiment, the first support member 411 may be disposed in the space between the front panel 420 and the rear panel 480. The first support member 411 may be disposed inside the electronic device 200 to connect to or be integrally formed with the side bezel structure 410. For example, the first support member 411 may be formed of a metallic material and / or a non-metallic material (e.g., a polymer). In an embodiment, the display 430 may be disposed on a first surface of the first support member 411 (e.g., a surface facing the +z-axis direction), and the PCB 440 may be disposed on a second surface facing the opposite direction to the first surface (e.g., a surface facing the -z-axis direction).

[0085] According to an embodiment, the processor (e.g., Figure 1 The processor 120), memory (e.g., Figure 1 The memory 130), and the interface (e.g., Figure 1 Interface 177), antenna module (not shown), and / or wireless communication circuitry (e.g., Figure 1 The wireless communication module 192 can be disposed in the PCB 440. For example, the processor 120 may include one or more of a central processing unit (CPU), application processor (AP), graphics processing unit (GPU), image signal processor (ISP), sensor hub processor (SHP), or communication processor (CP). For example, the memory may include volatile and / or non-volatile memory. For example, the interface may include a high-definition multimedia interface (HDMI), a universal serial bus (USB), an SD card interface, and / or an audio interface. For example, the interface can electrically or physically connect the electronic device 200 to an external electronic device (e.g., Figure 1 The electronic devices 102 and 104 may include a USB connector, an SD card / MMC connector, or an audio connector. The wireless communication circuit may be a radio frequency integrated circuit (RFIC). For example, the wireless communication circuit may feed electrical signals to a protrusion formed at least a portion of the housing.

[0086] For example, the antenna module may include at least one patch antenna. The antenna module may be configured to radiate frequencies in a specific frequency band (e.g., a millimeter-wave band). For example, the antenna module may be electrically connected to wireless communication circuitry mounted on PCB 440. The antenna module may receive electrical signals (e.g., baseband signals or intermediate frequency (IF) signals) in a specific frequency band from the wireless communication circuitry located in PCB 440. The antenna module may amplify the received electrical signals using at least one circuit (e.g., an RFIC) and may provide power to at least one radiator included in the antenna module.

[0087] According to an embodiment, battery 450 is a device for supplying power to at least one component of electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of battery 450 may be disposed substantially parallel to PCB 440. Battery 450 may be integrally disposed inside electronic device 200 and may be configured to be removable from electronic device 200.

[0088] According to an embodiment, a short-range antenna 470 may be disposed between the rear panel 480 and the battery 450. For example, antenna 470 may include a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. For example, antenna 470 may enable short-range communication with an external device or may wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by one or a combination of a side frame structure 410 and / or a first support member 411. Various antenna structures for electronic devices will be described below.

[0089] Figure 5 The structure 500 of an electronic device 501 including a plurality of openings according to an embodiment of the present disclosure is shown.

[0090] Reference Figure 5 According to an embodiment, electronic device 501 (e.g., Figure 1 The electronic device 101 may include a side member 510 (e.g., Figure 4 The side frame structure 410. The side member 510 may correspond to at least a portion of the housing that defines the appearance of the electronic device 501. The side member 510 may include a plurality of regions physically separated by at least one partition.

[0091] According to an embodiment, the side member 510 may include a first conductive member 517a, a second conductive member 517b, and / or a third conductive member 517c, physically separated by a first partition 521 or a second partition 522. For example, the side member may further include a protrusion 515 formed to protrude from one end of at least one of the first conductive member 517a, the second conductive member 517b, and / or the third conductive member 517c in a direction (e.g., the +x direction) facing the interior of the housing.

[0092] According to an embodiment, the electronic device 501 may include a support member 511 (e.g., Figure 4The first support member 511. For example, the support member 511 may be disposed in the space between the first plate and the second plate. For example, a display exposed through at least a portion of the first plate may be disposed on a first surface of the support member (e.g., a surface facing the +z direction). As another example, an antenna module including at least one antenna (e.g., a patch antenna) may be disposed on a second surface of the support member 511 facing a direction opposite to the first surface (e.g., a surface facing the -z direction).

[0093] Referring to the area corresponding to reference numeral 503 in the accompanying drawings, according to an embodiment, the electronic device 501 may have a structure including at least one opening (e.g., a first opening 519a or a second opening 519b) defined by a support member 511, a plurality of conductive members 517a, 517b and / or 517c, and a connector 550. For example, the electronic device 501 may radiate electrical signals of a specific frequency band by using an antenna module disposed in a region adjacent to the first opening 519a or the second opening 519b.

[0094] According to an embodiment, the antenna module (e.g., Figure 14 The third antenna module 1446 may include multiple antennas, printed circuit boards, or RFICs (e.g., Figure 14 (The third RFIC 1426). For example, the plurality of antennas may form at least one array. The antenna module may transmit and / or receive RF signals with frequencies of about 6 GHz to about 60 GHz.

[0095] According to an embodiment, the antenna module can transmit and / or receive signals of a specific frequency band by using an opening (first opening 519a or second opening 519b) located in a region adjacent to the antenna module.

[0096] In the following text, Figure 6 The physical structure of the antenna module, including the area corresponding to reference numeral 503, and at least one opening structure will be described in more detail below.

[0097] Figure 6 The structure of an electronic device including an antenna module 697 according to an embodiment of the present disclosure is shown.

[0098] Reference Figure 6 Reference numeral 600a, according to an embodiment, refers to an electronic device (e.g., Figure 1 The electronic device 101 may include a housing (e.g., Figure 2 The antenna module 697 is located inside the housing 210. The antenna module 697 can be supplied from components mounted on a PCB (e.g., Figure 4The antenna module 697 provides power to a wireless communication circuit on one surface of the PCB 440 and transmits and / or receives signals. The antenna module 697 can transmit and receive signals from various frequency bands. For example, 5G network communication can be performed using the antenna module 697. As an example, the antenna module 697 can communicate with the outside based on electrical signals from specific frequency bands such as n41, n78, and / or n79 (e.g., the 5G Sub-6 band from about 3.5 GHz to about 6 GHz) and / or ultra-high frequency millimeter wave bands (e.g., 28 GHz or 39 GHz). The antenna module 697 may include at least one antenna. For example, the antenna module 697 can form a directional beam by using at least one antenna included on one surface of it.

[0099] Reference Figure 6 According to reference numeral 600b in the accompanying drawings, the electronic device may include a housing (e.g., Figure 2 The housing 210 defines a plurality of openings and includes at least one component inside the housing. For example, the electronic device may include a first conductive member 617a, which is connected to the partition 613 (e.g., Figure 5 The first end of the first partition 521) extends toward a third direction (e.g., the +y direction) to the second end, serving as a side member (e.g.,) included in the housing. Figure 4The first conductive member 617a is part of the side frame structure 410. The first conductive member 617a may be physically spaced from the second conductive member 617b by a partition 613. The first conductive member 617a and the second conductive member 617b may correspond to a portion of the housing that defines the appearance of the electronic device. As another example, the electronic device may include at least one connector 650 and / or a protrusion 615 projecting from a point on the first conductive member 617a toward the interior of the housing (e.g., the +x direction). The electronic device may include a plurality of openings (e.g., a first opening 619a, a second opening 619b, and / or a third opening 619c) defined by the first conductive member 617a, the support member 611, at least one connector 650, and / or the protrusion 615. When viewed from a second surface (e.g., a surface facing the -z direction), the electronic device may include a second opening 619b, a third opening 619c defined by the support member 611 and the protrusion 615 along the outer edge of the protrusion 615, and a partition 613. For example, the distance L1 from the separator 613 to one end of the second opening 619b can be approximately 22 mm to approximately 23 mm. The distance L2 from a point on the first conductive member 617a to one end of the protrusion 615 can be approximately 8 mm to approximately 9 mm. For example, the electronic device can perform conventional network communication including second-generation (2G), third-generation (3G), fourth-generation (4G), and / or long-term evolution (LTE) networks by using an antenna (which uses multiple openings 619a, 619b, and / or 619c). According to an embodiment, the operating frequency of the antenna formed by using the first conductive member 617a, the second conductive member 617b, the support member 611, or the protrusion 615 can be varied according to the distance L1 or L2. As an example, the wireless communication circuitry included in the electronic device can communicate with the outside by using an antenna module 697 to radiate electrical signals in a frequency band of approximately 700 MHz to approximately 3 GHz via the multiple openings. According to an embodiment, the second opening 619b and the third opening 619c can be a single, connected opening.

[0100] According to an embodiment, the wireless communication circuit included in the electronic device can indirectly power the protrusion 615.

[0101] In the following text, reference will be made to Figures 7 to 10 Describes the internal structure of the housing of an electronic device that includes multiple openings. Figure 7 and Figure 8 The internal structure described in the text and in Figure 9 and Figure 10 The internal structure described in the text may differ.

[0102] Figure 7 The structure 700 of an electronic device including a plurality of openings 719a, 719b and 719c according to an embodiment of the present disclosure is shown.

[0103] Reference Figure 7 Electronic devices (e.g.) Figure 1 The electronic device 101 can radiate frequency signals of a specific frequency band by using at least some of a plurality of openings 719a, 719b and / or 719c defined by at least one component (e.g., a first conductive member 717a, a support member 711, a protrusion 715, a first connector 750 and a second connector 760). For example, the electronic device may include a housing (e.g., Figure 2 The housing 210). The housing may include a first plate (e.g., facing a first direction (e.g., the +z direction)). Figure 4 The front plate 420), and the second plate facing the second direction (e.g., the -z direction) (e.g., Figure 4 The rear plate 480) and the side member 710 (e.g., connecting one side of the first plate and one side of the second plate) Figure 4 The side frame structure 410). As another example, the electronic device may further include a support member 711 disposed in the space between the first plate and the second plate, a display disposed on a first surface of the support member 711 and visually exposed through at least a portion of the first plate, and an antenna module (e.g., Figure 6 The antenna module 697 is disposed on a second surface facing a direction opposite to the first surface of the support member 711 and includes at least one patch antenna or PCB (e.g., PCB 440) disposed on the second surface of the support member 711. As an example, at least one wireless communication circuit may be disposed in the PCB. The wireless communication circuit may be electrically connected to the protrusion 715 and / or the antenna module to supply power.

[0104] According to an embodiment, the side member may have a structure comprising a plurality of conductive members physically separated by at least one partition. For example, the side member may include a first conductive member 717a extending from a first end 721 toward a third direction (e.g., the +y direction) toward a second end 732. For example, the side member may include the first conductive member 717a, a second conductive member 717b physically spaced apart by a first partition 720 formed in a region adjacent to the first end 721 of the first conductive member 717a, and a third conductive member 717c physically spaced apart by a second partition 730 formed in a region adjacent to the second end 732 of the first conductive member 717a. The second conductive member 717b may extend from one end 722 toward a fourth direction (e.g., the -y direction), which is opposite to the third direction. At least a portion of the third conductive member 717c may extend from one end 731 toward the third direction. The plurality of conductive members 717a, 717b, and 717c may be included in a portion of a side member 710 defining the appearance of an electronic device.

[0105] According to embodiments, the electronic device may include a plurality of connectors physically connecting the first conductive member 717a and the support member 711. For example, the electronic device may include a first connector 750, which is formed to protrude from a point 718 between a first end 721 and a second end 732 of the first conductive member 717a in a direction facing inwards and is physically connected to the support member 711. As another example, the electronic device may include a second connector 760, which is formed to protrude from a second end 732 of the first conductive member 717a in a fourth direction facing inwards and is physically connected to the support member 711.

[0106] According to an embodiment, the electronic device may include a protrusion 715 formed to extend from the first conductive member 717a. For example, the electronic device may include the protrusion 715, which is formed to project from a first end 721 of the first conductive member 717a in a direction facing inwards (e.g., the +x direction) and is electrically connected to the first conductive member 717a. The protrusion 715 may be supplied with power from wireless communication circuitry mounted on a PCB. For example, the protrusion 715 may be physically connected to the PCB via at least one conductive elastomer (e.g., a C-clamp and / or a spring pin) and may be supplied with power from wireless communication circuitry mounted on the PCB via the conductive elastomer.

[0107] According to embodiments, an electronic device may include a plurality of openings (e.g., a first opening 719a, a second opening 719b, and / or a third opening 719c) defined by at least one component. For example, the first opening 719a may be defined by a first conductive member 717a, a support member 711, a first connector 750, and / or a second connector 760. As another example, the second opening 719b may be defined by the first conductive member 717a, the support member 711, the first connector 750, and / or a protrusion 715. The first opening 719a may extend a certain distance from a first end 751 of the first connector 750 in a first direction. The second opening 719b may extend a certain distance from a second end 752 of the first connector 750 in a fourth direction. For example, the length or shape of the first opening 719a and the second opening 719b may vary depending on the connection point of the first connector 750. Furthermore, as another example, the third opening 719c may be defined by the support member 711 and the protrusion 715 along the outer edge of the protrusion 715. For example, a non-conductive material may fill at least one region of the plurality of openings. For example, the classification of the second opening 719b, the third opening 719c, and / or the first partition 720 can be a classification of logical regions.

[0108] According to an embodiment, the electronic device may further include an antenna module disposed at a position corresponding to the first opening 719a and / or the second opening 719b. Details regarding the internal structure of the housing of the electronic device including the antenna module can be found in the description to be given below. Figure 8 Further description.

[0109] Figure 8 The structure of an electronic device 800 including an antenna module 897 according to an embodiment of the present disclosure is shown.

[0110] Reference Figure 8 According to embodiments of this disclosure, electronic devices (e.g., Figure 1 The electronic device 101 may include a side member 810 (e.g., Figure 4 The antenna module 897 is located inside the side frame structure 410. The antenna module 897 may be positioned corresponding to a plurality of openings (e.g., a first opening 819a and / or a second opening 819b) defined by at least one component included in the electronic device. The side member 810 included in the electronic device may include a plurality of conductive members (e.g., a first conductive member 817a, a second conductive member 817b, and / or a third conductive member 817c) which are physically spaced apart from each other by at least one partition (e.g., a first partition 820 and a second partition 830). For example, the electronic device may include a protrusion 815 which is formed in a direction facing the interior of the housing (e.g., Figure 8 The electronic device may include a first connector 850, which is formed to protrude from a point on the first conductive member 817a toward the interior of the housing in a second direction and is physically connected to the support member 811. The electronic device may include a second connector 860, which is formed to protrude from one end of the first conductive member 817a (e.g., in the +x direction) and is electrically connected to the first conductive member 817a. Figure 7 The second end 732) protrudes in the direction facing the inside of the shell and is physically connected to the support member 811.

[0111] According to an embodiment, the electronic device may include a plurality of openings (e.g., a first opening 819a, a second opening 819b, and / or a third opening 819c) defined by a plurality of constituent elements. For example, a non-conductive material may fill at least one region of the plurality of openings. The structure of the plurality of openings can be described by the methods described above. Figure 7 The description is replaced by [the description].

[0112] According to an embodiment, an antenna module 897 disposed inside the housing of an electronic device can be positioned corresponding to at least some of the plurality of openings. For example, the antenna module 897 can be positioned corresponding to a region of a first opening 819a and / or a second opening 819b. The antenna module 897 may include at least one antenna (e.g., a first patch antenna 897a, a second patch antenna 897b, a third patch antenna 897c, a fourth patch antenna 897d, and / or a fifth patch antenna 897e). For example, at least one antenna 897a to 897e can be configured to form a beam pattern in the -x-axis direction. Then, when viewed from a second surface (e.g., a surface facing the -z direction), one end of the first connector 850 connected to the support member 811 can be positioned corresponding to a point between two adjacent antennas among the at least one antenna (e.g., the first to fifth patch antennas 897a to 897e). For example, in Figure 8 In this configuration, the end of the first connector 850 connected to the support member 811 can be configured to correspond to a point between the second patch antenna 897b and the third patch antenna 897c.

[0113] In the following text, reference will be made to Figure 9 and Figure 10 Describes the internal structure of another housing of an electronic device that includes multiple openings. (Refer to...) Figure 9 and Figure 10 The internal structure of the housing of the described electronic device may include, with Figure 7 and Figure 8 The components of the internal structure shown are similar to those of the components shown.

[0114] Figure 9 The structure 900 of an electronic device including a plurality of openings 919a, 919b and 919c according to an embodiment of the present disclosure is shown.

[0115] Reference Figure 9 According to embodiments of this disclosure, electronic devices (e.g., Figure 1 The electronic device 101 can radiate frequency signals of a specific frequency band by using an antenna (which uses at least some of a plurality of openings 919a, 919b and 919c defined by at least one component element). For example, the electronic device may include a housing (e.g., Figure 2 The housing 210). The housing may include a first plate (e.g., facing a first direction (e.g., the +z direction)). Figure 4 The front plate 420), and the second plate facing the second direction (e.g., the -z direction) (e.g., Figure 4 The rear plate 480) and the side member 910 (e.g., connecting one side of the first plate and one side of the second plate) Figure 4The side frame structure 410). As another example, the electronic device may further include a support member 911 disposed in the space between the first plate and the second plate, a display disposed on a first surface of the support member 911 and visually exposed through at least a portion of the first plate, and an antenna module disposed on a second surface facing a direction opposite to the first surface of the support member 911 and including at least one patch antenna (e.g., Figure 6 Antenna module 697), and PCB (e.g., disposed on the second surface of support member 911). Figure 4 (PCB 440). As an example, at least one wireless communication circuit may be disposed in the PCB. The wireless communication circuit may be electrically connected to the protrusion 915 and / or the antenna module to supply power.

[0116] According to an embodiment, the side member 910 may include a plurality of conductive members physically separated by at least one partition. For example, the side member 910 may include a first conductive member 917a extending from a first end 921 toward a third direction (e.g., the +y direction) to a second end 932. For example, the side member 910 may include the first conductive member 917a, a second conductive member 917b physically separated by a first partition 920 formed in a region adjacent to the first end 921 of the first conductive member 917a, and a third conductive member 917c physically separated by a second partition 930 formed in a region adjacent to the second end 932 of the first conductive member 917a. The second conductive member 917b may extend from one end 922 toward a fourth direction (e.g., the -y direction) (which is the direction opposite to the third third direction). At least a portion of the third conductive member 917c may extend from one end 931 toward a third third direction. The plurality of conductive members 917a, 917b, and 917c may be included in a portion of the appearance defining the electronic device of the side member 910.

[0117] According to embodiments, the electronic device may include a plurality of connectors physically connecting the first conductive member 917a and the support member 911. For example, the electronic device may include a first connector 950 formed to protrude from a point 918 between a first end 921 and a second end 932 of the first conductive member 917a in a direction facing inwards and physically connected to the support member 911. As another example, the electronic device may include a second connector 960 formed to protrude from a point between a second end 932 of the first conductive member 917a and the first connector 950 in a direction facing inwards and physically connected to the support member 911.

[0118] According to an embodiment, the electronic device may include a protrusion 915 formed to extend from the second conductive member 917b. For example, the electronic device may include the protrusion 915, which is formed to project from a point in a direction facing the interior of the housing and electrically connected to the second conductive member 917b, said point being spaced a specific distance from a first end 922 of the second conductive member 917b adjacent to the first partition 920 in a fourth direction (e.g., the -y direction) (which is opposite to a third direction (e.g., the +y direction)). The protrusion 915 may be supplied with power from wireless communication circuitry mounted on the PCB. For example, the protrusion 915 may be physically connected to the PCB via at least one conductive elastomer (e.g., a C-clamp and / or a spring pin) and may be supplied with power from wireless communication circuitry mounted on the PCB via the conductive elastomer.

[0119] According to embodiments, the electronic device may include a plurality of openings (e.g., a first opening 919a, a second opening 919b, and / or a third opening 919c) defined by at least one component. For example, the first opening 919a may be defined by a first conductive member 917a, a support member 911, a first connector 950, and / or a second connector 960. As another example, the second opening 919b may be defined by the first conductive member 917a, the second conductive member 917b, the first connector 950, the support member 911, and / or a protrusion 915. The first opening 919a may extend a certain distance from a first end 951 of the first connector 950 in a first direction. The second opening 919b may extend a certain distance from a second end 952 of the first connector 950 in a fourth direction. For example, the length or shape of the first opening 919a and the second opening 919b may vary depending on the position of the first connector 950. Furthermore, as another example, the third opening 919c may be defined by the support member 911, the second conductive member 917b, and the protrusion 915 along the outer edge of the protrusion 915. The third opening 919c may be formed along the outer edge of the protrusion 915 and may extend a specific distance in the fifth direction to one end 991. For example, a non-conductive material may fill at least one region of the plurality of openings. When viewed from the second surface, the electronic device may include the second opening 919b, the third opening 919c, and / or the first partition 920. For example, the classification of the second opening 919b, the third opening 919c, and / or the first partition 920 may be a classification of logical regions.

[0120] According to an embodiment, the electronic device may further include an antenna module disposed at a location corresponding to the first opening 919a and / or the second opening 919b. Details regarding the internal structure of the housing of the electronic device including the antenna module can be found in the description to be given later. Figure 10 Further description.

[0121] Figure 10 The structure of an electronic device 1000 including an antenna module 1097 according to an embodiment of the present disclosure is shown.

[0122] Reference Figure 10 According to embodiments of this disclosure, electronic devices (e.g., Figure 1 The electronic device 101 may include a housing (e.g., Figure 2 The antenna module 1097 is located inside the housing 210. For example, the antenna module 1097 may correspond to a plurality of openings (e.g., a first opening 919a and / or a second opening 919b) defined by at least one component included in the electronic device, and may be located adjacent to the side member 1010 included in the housing.

[0123] According to an embodiment, the antenna module 1097 may be disposed at a location corresponding to at least a portion of the plurality of openings. For example, the antenna module may be disposed corresponding to the first opening (e.g., Figure 9 The first opening 919a) and / or the second opening (e.g., Figure 9 The location of the second opening 919b). The antenna module 1097 may include at least one antenna (e.g., a first patch antenna 1097a, a second patch antenna 1097b, a third patch antenna 1097c, a fourth patch antenna 1097d, and / or a fifth patch antenna 1097e). For example, the at least one antenna may include a first patch antenna 1097a, a second patch antenna 1097b, a third patch antenna 1097c, a fourth patch antenna 1097d, and / or a fifth patch antenna 1097e. For example, at least one antenna 1097a to 1097e may be disposed in the antenna module 1097 to form a beam pattern from the side member 1010 toward the direction facing the outside of the housing (-x direction). Then, when viewed from the second surface (e.g., a surface facing the -z direction), the first connector (e.g., Figure 9 The first connector 950) is connected to the support member (e.g., Figure 9 One end of the support member 911 can be configured to correspond to a point between two adjacent patch antennas of at least one of the antennas 1097a to 1097e. For example, the end of the first connector connected to the support member can be configured to correspond to a point between the second patch antenna 1097b and the third patch antenna 1097c. For example, the first separator 1020 can be formed in the -x direction relative to a point between the fourth patch antenna 1097d and the fifth patch antenna 1097e.

[0124] According to an embodiment, the antenna module 1097 may be configured not to overlap with the side member 1010 when viewed from the -x direction at least one antenna 1097a to 1097e included in the antenna module 1097.

[0125] Figures 11 to 13 The radiation performance of electronic devices 1110, 1120 and 1130 due to the internal structure of the openings, according to various embodiments of the present disclosure, is shown.

[0126] Reference Figures 11 to 13 According to an embodiment, electronic devices (e.g., Figure 1 The electronic device 101 can be accessed by using at least one opening (e.g., Figure 7 or Figure 9 The antenna is formed by a second opening 719b or 919b and / or a third opening 719c or 919c formed inside the housing. For example, the second opening (e.g., Figure 9 The lengths OL1, OL3, or OL5 of the second opening (919b) can be the lengths of the second opening in the y-axis direction. The third opening (e.g., Figure 9 The length of the third opening (919c) OL2, OL4 or OL6 can be the length of the third opening in the y-axis direction.

[0127] From Figures 11 to 13 Identify based on the opening (e.g., Figure 7 or Figure 9 The operating frequency of the antenna (the second opening 719b or 919b and / or the third opening 719c or 919c) is changed, the opening being formed according to the conductive members of the protrusions 1115, 1215, and 1315 of substantially the same length and position formed in the conductive member. For example, a wireless communication circuit can indirectly supply power to the protrusions 1115, 1215, and 1315. The conductive member may include a first conductive member (e.g., Figure 6 A portion of the first conductive member 617a) or the second conductive member (e.g., Figure 6 At least a portion of the second conductive member 617b).

[0128] Reference Figure 11 According to the attached figure reference 1100, in an embodiment, the length OL1 of the second opening 1119b can be referred to as approximately 17 mm, and the length OL2 of the third opening 1119c can be referred to as approximately 5 mm. Then, the resonant frequencies of the radiators referred to as the second opening 1119b and the third opening 1119c can be the resonant frequencies of the approximately 1.5 GHz band 1110 and the approximately 2.8 GHz band 1120.

[0129] Reference Figure 12According to the attached figure reference 1200, in an embodiment, the length OL3 of the second opening 1219b can be referred to as approximately 10 mm, and the length OL4 of the third opening 1219c can be referred to as approximately 12 mm. Then, the resonant frequencies of the radiators referred to as the second opening 1219b and the third opening 1219c can be the resonant frequencies of the approximately 1.2 GHz band 1210 and the approximately 3.8 GHz band 1220.

[0130] Reference Figure 13 According to the embodiment, the length OL5 of the second opening 1319b can be referred to as approximately 5 mm, and the length OL6 of the third opening 1319c can be referred to as approximately 17 mm. Then, the resonant frequencies of the radiators referred to as the second opening 1319b and the third opening 1319c can be the resonant frequencies of the band 1310, which is less than 1 GHz.

[0131] According to an embodiment, the frequency band of the resonant frequency of the antenna can be changed according to the length of the opening used as the antenna.

[0132] Figure 14 This is a block diagram 1400 of an electronic device 101 supporting conventional network communication and 5G network communication according to embodiments of the present disclosure. (Refer to...) Figure 14 The electronic device 101 may include a first communication processor 1412, a second communication processor 1414, a first radio frequency integrated circuit (RFIC) 1422, a second RFIC 1424, a third RFIC 1426, a fourth RFIC 1428, a first radio frequency front-end (RFFE) 1432, a second RFFE 1434, a first antenna module 1442, a second antenna module 1444, and an antenna 1448. The electronic device 101 may further include a processor 120 and a memory 130. The second network 199 may include a first cellular network 1492 and a second cellular network 1494. According to another embodiment, the electronic device 101 may further include... Figure 1 At least one of the components shown, and the second network 199 may further include at least one other network. According to an embodiment, the first communication processor 1412, the second communication processor 1414, the first RFIC 1422, the second RFIC 1424, the fourth RFIC 1428, the first RFFE 1432, and the second RFFE 1434 may constitute at least a portion of the wireless communication module 192. According to another embodiment, the fourth RFIC 1428 may be omitted or may be included in a portion of the third RFIC 1426.

[0133] The first communication processor 1412 can establish a communication channel in a frequency band for wireless communication with the first cellular network 1492, and can support traditional network communication through the established communication channel. According to various embodiments, the first cellular network 1492 can be a traditional network including second-generation (2G), third-generation (3G), fourth-generation (4G), or Long Term Evolution (LTE). The second communication processor 1414 can establish a communication channel corresponding to a designated frequency band (e.g., about 6 GHz to about 60 GHz) for wireless communication with the second cellular network 1494, and can support 5G network communication through the established communication channel. According to various embodiments, the second cellular network 1494 can be a 5G network defined by 3GPP. Furthermore, according to embodiments, the first communication processor 1412 or the second communication processor 1414 can establish a communication channel corresponding to another designated frequency band (e.g., about 6 GHz or less) for wireless communication with the second cellular network 1494, and can support 5G network communication through the established communication channel. According to embodiments, the first communication processor 1412 and the second communication processor 1414 can be implemented in a single chip or a single package. According to various embodiments, the first communication processor 1412 or the second communication processor 1414 can be coupled with… Figure 1 The processor 120, auxiliary processor 123, or communication module 190 are housed together in a single chip or a single package.

[0134] The first RFIC 1422 can convert a baseband signal generated by the first communication processor 1412 into a radio frequency signal of approximately 700 MHz to approximately 3 GHz for use in the first cellular network 1492 (e.g., a conventional network) during signal transmission. The RF signal can be acquired from the first cellular network 1492 (e.g., a conventional network) via an antenna (e.g., a first antenna module 1442), and the acquired RF signal is preprocessed by an RFFE (e.g., a first RFFE 1432) during signal reception. The first RFIC 1422 can convert the preprocessed RF signal back into a baseband signal, such that the preprocessed RF signal is processed by the first communication processor 1412.

[0135] During signal transmission, the second RFIC 1424 can convert the baseband signal generated by the first communication processor 1412 or the second communication processor 1414 into a Sub6 band RF signal (e.g., about 6 GHz or less) for the second cellular network 1494 (e.g., a 5G network) (hereinafter, a 5G sub6 RF signal). During signal reception, the 5G Sub6 RF signal can be acquired from the second cellular network 1494 (e.g., a 5G network) via an antenna (e.g., a second antenna module 1444), and the RF signal acquired via the RFFE (e.g., a second RFFE 1434) can be preprocessed. The second RFIC 1424 can convert the processed 5G Sub6 RF signal back into a baseband signal, such that the 5G Sub6 RF signal is processed by the corresponding one of the first communication processor 1412 or the second communication processor 1414.

[0136] The third RFIC 1426 can convert the baseband signal generated by the second communication processor 1414 into an RF signal (hereinafter, 5G Above6 RF signal) in the 5G Above6 band (e.g., about 6 GHz to about 60 GHz) for use in the second cellular network 1494 (e.g., a 5G network). During signal reception, the 5G Above6 RF signal can be acquired from the second cellular network 1494 (e.g., the 5G network) via an antenna (e.g., antenna 1448) and can be preprocessed by the third RFFE 1436. For example, the third RFFE 1436 can perform signal preprocessing by using a phase shifter 1438. The third RFIC 1426 can convert the preprocessed 5G Above6 RF signal back into a baseband signal, such that the preprocessed 5G Above6 RF signal is processed by the second communication processor 1414. According to an embodiment, the third RFFE 1436 may be included as a part of the third RFIC 1426.

[0137] According to an embodiment, electronic device 101 may include a fourth RFIC 1428, separate from or at least part of the third RFIC 1426. In this case, the fourth RFIC 1428 may convert a baseband signal generated by the second communication processor 1414 into an intermediate frequency (IF) RF signal (e.g., about 9 GHz to about 11 GHz), and then transmit the IF signal to the third RFIC 1426. The third RFIC 1426 may convert the IF signal into a 5G Above6 RF signal. The 5G Above6 RF signal may be received from a second cellular network 1494 (e.g., a 5G network) via an antenna (e.g., antenna 1448) and may be converted into an IF signal by the third RFIC 1426. The fourth RFIC 1428 may convert the RF signal back into a baseband signal, such that the RF signal is processed by the second communication processor 1414.

[0138] According to an embodiment, the first RFIC 1422 and the second RFIC 1424 can be implemented as at least a portion of a single chip or a single package. According to an embodiment, the first RFFE 1432 and the second RFFE 1434 can be implemented as at least a portion of a single chip or a single package. According to an embodiment, at least one of the first antenna module 1442 or the second antenna module 1444 can be omitted or coupled to another antenna module to process RF signals in multiple corresponding frequency bands.

[0139] According to an embodiment, the third RFIC 1426 and the antenna 1448 can be disposed on the same substrate to form a third antenna module 1446. Figure 14 The third antenna module 1446 can be the same as described above. Figure 6 Antenna module 697 Figure 8 Antenna module 897 and Figure 10The antenna module 1097 corresponds to the antenna module 1097. For example, the wireless communication module 192 or the processor 120 may be disposed in the first substrate (e.g., the main PCB). The third RFIC 1426 may be disposed in a portion of a second substrate (e.g., a sub-PCB) separate from the first substrate (e.g., the lower surface), and the antenna 1448 may be disposed in another portion of the second substrate (e.g., the upper surface) to form the third antenna module 1446. According to an embodiment, for example, the antenna 1448 may include an antenna array that can be used for beamforming. The length of the transmission line between the third RFIC 1426 and the antenna 1448 can be reduced by arranging the third RFIC 1426 and the antenna 1448 in the same substrate. For example, this can reduce signal loss in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used for 5G network communication due to the transmission line. Therefore, the electronic device 101 can improve the quality or speed of communication with the second cellular network 1494 (e.g., a 5G network).

[0140] The second cellular network 1494 (e.g., a 5G network) can operate independently of or in conjunction with the first cellular network 1492 (e.g., a legacy network). For example, the 5G network may only have an access network (e.g., a 5G Radio Access Network (RAN) or a Next Generation (NG) RAN) and may not have a core network (e.g., a Next Generation Core (NGC)). The electronic device 101 can access the access network of the 5G network and then, under the control of the core network of the legacy network (e.g., an Evolved Packet Core (EPC)), access external networks (e.g., the Internet). Protocol information for communicating with the legacy network (e.g., LTE protocol information) or for communicating with the 5G network (e.g., New Radio (NR) protocol information) can be stored in memory 130 and can be accessed by another component (e.g., processor 120, a first communication processor 1412, or a second communication processor 1414).

[0141] According to an embodiment, an electronic device may include: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surrounding the space between the first plate and the second plate and connecting one side of the first plate and one side of the second plate; a support member disposed in the space between the first plate and the second plate; a display disposed on a first surface of the support member and exposed through at least a portion of the first plate; an antenna module disposed on the second surface of the support member facing a direction opposite to the first surface and including one or more patch antennas; a printed circuit board (PCB) disposed on the second surface of the support member; a wireless communication circuit disposed on the PCB; a first conductive member included in the side surface member and extending from a first end toward a third direction to a second end; a first connector protruding toward the interior of the housing from a point between the first end and the second end of the first conductive member and physically connected to the support member; a second connector extending toward the interior of the housing from the second end of the first conductive member and physically connected to the support member; and a protrusion extending toward the interior of the housing from the first end of the first conductive member and electrically connected to the first conductive member. For example, the antenna module can be positioned corresponding to a first opening defined by a first conductive member, a support member, a first connector, and a second connector, and a second opening defined by the first conductive member, the support member, the first connector, and the protrusion, and the wireless communication circuit can be electrically connected to the protrusion and the antenna module.

[0142] According to an embodiment, an electronic device may further include a second conductive member and a third conductive member. For example, the second conductive member may be spaced apart from the first conductive member by a first partition formed in a region adjacent to a first end of the first conductive member, and the third conductive member may be spaced apart from the first conductive member by a second partition formed in a region adjacent to a second end of the first conductive member. The first conductive member, the second conductive member, and the third conductive member may correspond to a portion of a housing that defines the appearance of the electronic device.

[0143] According to an embodiment, when viewed from the second surface, the second opening, the third opening defined by the support member and the protrusion along the outer edge of the protrusion, and the first partition may be a connected opening.

[0144] According to an embodiment, when viewed from the second surface, the distance from the first partition to one end of the second opening can correspond to 22mm to 23mm, and the distance from the point of the first conductive member to one end of the protrusion can correspond to 8mm to 9mm.

[0145] According to an embodiment, the at least one patch antenna included in the antenna module may be configured to face a direction opposite to the direction facing the interior of the housing.

[0146] According to an embodiment, the wireless communication circuit can be configured to radiate frequency signals of a specific frequency band in the direction facing the first surface by using an antenna module via a first opening and a second opening.

[0147] According to an embodiment, the electronic device may further include at least one conductive elastomer physically coupled to the PCB and the protrusion. For example, a wireless communication circuit can be electrically connected to the protrusion via the at least one conductive elastomer to supply power.

[0148] According to an embodiment, the at least one conductive elastomer may include at least one of a C-clamp or a spring pin. For example, the antenna module can transmit and receive millimeter-wave (mmWave) signals.

[0149] According to an embodiment, the electronic device may further include a non-conductive material filling at least one region of the first opening or the second opening.

[0150] According to an embodiment, when viewed from the second surface, the connection of the first connector to one end of the support member may correspond to a point between two adjacent patch antennas in the one or more patch antennas.

[0151] According to an embodiment, an electronic device may include: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surrounding the space between the first plate and the second plate and connecting one side of the first plate and one side of the second plate; a support member disposed in the space between the first plate and the second plate; a display disposed on a first surface of the support member and exposed through at least a portion of the first plate; an antenna module disposed on the second surface of the support member facing a direction opposite to the first surface and including one or more patch antennas; a PCB disposed on the second surface of the support member; a wireless communication circuit disposed on the PCB; and a first conductive member, including... The first conductive member is included in the side member and extends from a first end toward a third direction to a second end; a second conductive member is included in the side member and physically spaced apart from the first conductive member by a first partition; a first connector protrudes from a point between the first and second ends of the first conductive member toward the interior of the housing and is physically connected to the support member; a second connector protrudes from the second end of the first conductive member toward the interior of the housing and is physically connected to the support member; and a protrusion protrudes from a point toward the interior of the housing and is electrically connected to the second conductive member, said point being spaced apart from the first end of the second conductive member adjacent to the first partition in a fourth direction, the fourth direction being the direction opposite to the third direction. For example, the antenna module can be disposed at a position corresponding to a first opening defined by the first conductive member, the support member, the first connector, and the second connector, and a second opening defined by the first conductive member, the second conductive member, the first connector, the support member, and the protrusion, and a wireless communication circuit can be electrically connected to the protrusion and the antenna module.

[0152] According to an embodiment, the electronic device may further include a third conductive member. For example, the third conductive member may be physically spaced apart from the first conductive member by a second partition formed in a region adjacent to the second end of the first conductive member, and the first conductive member, the second conductive member, and the third conductive member may correspond to a portion of a housing that defines the appearance of the electronic device.

[0153] According to an embodiment, when viewed from the second surface, the second opening, the first partition, and the third opening defined by the support member, the second conductive member, and the protrusion along the outer edge of the protrusion can be a single connected opening.

[0154] According to an embodiment, when viewed from the second surface, the distance from one end of the first opening adjacent to the first connector to one end of the third opening can correspond to 22mm to 23mm, and the distance from the point of the second conductive member to one end of the protrusion can correspond to 8mm to 9mm.

[0155] According to an embodiment, the at least one patch antenna included in the antenna module may be configured to face a direction opposite to the direction facing the interior of the housing.

[0156] According to an embodiment, the electronic device can be configured to radiate frequency signals of a specific frequency band in the direction facing the first surface through the first opening and the second opening.

[0157] According to an embodiment, the electronic device may further include at least one conductive elastomer physically coupled to the PCB and the protrusion. For example, a wireless communication circuit may be configured to supply power to the protrusion electrically connected thereto via the at least one conductive elastomer.

[0158] According to an embodiment, the at least one conductive elastomer may include at least one of a C-clamp or a spring pin. For example, the antenna module can transmit and receive millimeter-wave (mmWave) signals.

[0159] According to an embodiment, the electronic device may further include a non-conductive material filling at least one region of the first opening or the second opening.

[0160] According to an embodiment, when viewed from the second surface, the connection of the first connector to one end of the support member may correspond to a point between two adjacent patch antennas in the one or more patch antennas.

[0161] Although this disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device comprising: The housing includes a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surrounding the space between the first plate and the second plate and connecting one side of the first plate and one side of the second plate. A supporting member is disposed in the space between the first plate and the second plate; A display is disposed on the first surface of the support member and exposed through at least a portion of the first plate; An antenna module is disposed on a second surface of the support member facing a direction opposite to the first surface and includes one or more patch antennas; A printed circuit board (PCB) is disposed on the second surface of the support member; A wireless communication circuit is mounted on the PCB. A first conductive member is included in the side member and extends from the first end toward the second end in a third direction; A first connector protrudes from a point between the first end and the second end of the first conductive member toward the interior of the housing and is physically connected to the support member; The second connector extends from the second end of the first conductive member toward the interior of the housing and is physically connected to the support member; as well as A protrusion extends from the first end of the first conductive member toward the interior of the housing and is electrically connected to the first conductive member. The antenna module is positioned corresponding to a first opening defined by the first conductive member, the support member, the first connector, and the second connector, and a second opening defined by the first conductive member, the support member, the first connector, and the protrusion. The wireless communication circuit is electrically connected to the protrusion and the antenna module.

2. The electronic device of claim 1, further comprising: Second conductive component; as well as Third conductive component, The second conductive member is spaced apart from the first conductive member by a first partition formed in a region adjacent to the first end of the first conductive member. The third conductive member is spaced apart from the first conductive member by a second partition formed in a region adjacent to the second end of the first conductive member, and The first conductive member, the second conductive member, and the third conductive member correspond to a portion of the housing that defines the appearance of the electronic device.

3. The electronic device of claim 2, wherein when viewed from the second surface, the second opening, the third opening defined by the support member and the protrusion along the outer edge of the protrusion, and the first partition are connected as one opening.

4. The electronic device of claim 3, wherein, when viewed from the second surface, the distance from the first partition to one end of the second opening corresponds to 22 mm to 23 mm, and The distance from one point of the first conductive member to one end of the protrusion corresponds to 8 mm to 9 mm.

5. The electronic device of claim 1, wherein the one or more patch antennas in the antenna module are configured to face a direction opposite to the direction facing the interior of the housing.

6. The electronic device of claim 1, wherein the wireless communication circuit is configured to radiate a frequency signal of a specific frequency band in the direction facing the first surface by using the antenna module via the first opening and the second opening.

7. The electronic device of claim 1, further comprising: At least one conductive elastomer is physically connected to the PCB and the protrusion. The wireless communication circuit is electrically connected to the protrusion via at least one conductive elastomer to supply power.

8. The electronic device of claim 7, wherein the at least one conductive elastomer comprises at least one of a C-clip or a spring pin, and The antenna module described herein transmits and receives millimeter-wave (mmWave) signals.

9. The electronic device of claim 1, further comprising: A non-conductive material is filled in at least one region of the first opening or the second opening.

10. The electronic device as claimed in claim 1, The one or more patch antennas include at least two patch antennas, and When viewed from the second surface, the connection of the first connector to one end of the support member corresponds to a point between two adjacent patch antennas of the at least two patch antennas.

11. An electronic device comprising: The housing includes a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surrounding the space between the first plate and the second plate and connecting one side of the first plate and one side of the second plate. A supporting member is disposed in the space between the first plate and the second plate; A display is disposed on the first surface of the support member and exposed through at least a portion of the first plate; An antenna module is disposed on a second surface of the support member facing a direction opposite to the first surface and includes one or more patch antennas; A printed circuit board (PCB) is disposed on the second surface of the support member; A wireless communication circuit is mounted on the PCB. A first conductive member is included in the side member and extends from the first end toward the third end toward the second end; The second conductive member is included in the side member and is physically spaced apart from the first conductive member by a first partition. A first connector protrudes from a point between the first end and the second end of the first conductive member toward the interior of the housing and is physically connected to the support member; The second connector protrudes from the second end of the first conductive member toward the interior of the housing and is physically connected to the support member; as well as A protrusion, extending from a point toward the interior of the housing and electrically connected to the second conductive member, wherein the point is spaced apart in a fourth direction from the first end of the second conductive member adjacent to the first partition, the fourth direction being opposite to the third direction. The antenna module is disposed at a position corresponding to at least one of a first opening defined by the first conductive member, the support member, the first connector, and the second connector, or a second opening defined by the first conductive member, the second conductive member, the first connector, the support member, and the protrusion. The wireless communication circuit is electrically connected to the protrusion and the antenna module.

12. The electronic device of claim 11, further comprising: Third conductive component, The third conductive member is physically spaced from the first conductive member by a second partition formed in a region adjacent to the second end of the first conductive member, and The first conductive member, the second conductive member, and the third conductive member correspond to a portion of the housing that defines the appearance of the electronic device.

13. The electronic device of claim 12, wherein, when viewed from the second surface, the second opening, the first partition, and the third opening defined by the support member, the second conductive member, and the protrusion along the outer edge of the protrusion are a connected opening.

14. The electronic device of claim 13, wherein, when viewed from the second surface, the distance from one end of the first opening adjacent to the first connector to one end of the third opening corresponds to 22 mm to 23 mm, and The distance from one point of the second conductive member to one end of the protrusion corresponds to 8 mm to 9 mm.

15. The electronic device of claim 11, wherein the one or more patch antennas in the antenna module are configured to face a direction opposite to the direction facing the interior of the housing.

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