一种无电镀的镀铜活化剂及其制备方法
By optimizing the stabilizer and surfactant composition of the electroless copper plating activator, the problems of high cost and poor stability of palladium activator were solved, achieving uniform copper plating on non-conductive material layers, reducing costs and improving the density of the copper plating layer and the quality of the circuit board.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG HAILITONG TECHNOLOGY CO LTD
- Filing Date
- 2023-05-09
- Publication Date
- 2026-07-17
AI Technical Summary
In existing chemical copper plating processes, palladium activator is expensive and highly sensitive, and alternative activators such as gold, silver, and nickel have poor stability and effectiveness, making it difficult to meet the needs of circuit board production, especially when plating copper on non-conductive material layers.
An electroless copper plating activator containing metal salts, stabilizers, and surfactants is used. By optimizing the structure and composition of the stabilizer, the metal ions are stabilized by electron conjugation, thereby controlling their deposition rate and distribution on the circuit board, improving the autocatalytic activity and uniformity of copper plating, and improving wetting performance through the synergistic effect of stabilizers and surfactants.
It achieves uniformity and density of copper plating on non-conductive material layers, reduces costs, avoids the use of palladium, and has good activator stability, adapts to actual production needs, and improves the flatness of the copper plating layer and the backlight level of the circuit.
Smart Images
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