Jig and integral ring body support post structure made thereby

Abstract

The present application discloses a jig and an integrated ring body support column structure made by the jig. The jig comprises a carrier, an upper cover and a powder leakage cover from bottom to top. Each mold cavity of the carrier is provided with a copper column. The powder can be filled into the mold cavity from the powder leakage cover through the upper cover, and then an annular powder ring is filled on the outer surface of the copper column. Through the heating process, the copper column and the annular powder ring are sintered together, and the annular powder ring becomes a sintered ring body, which is integrated with the copper column to form an integrated ring body support column structure without assembly gap. In this way, the problem of water accumulation caused by the assembly gap between the copper column and the sintered ring body in the past technology or process is improved, and defects such as expansion, cracking and separation from the column body caused by water accumulation and freezing of the copper column and the sintered ring body are avoided.

Description

Technical Field

[0001] This invention relates to a jig and its application, and more particularly to a jig and the integral ring support column structure made therefrom. Background Technology

[0002] With the rapid advancement of the technology industry, the functions of electronic products are becoming increasingly sophisticated, resulting in more heat being generated during operation. If this heat cannot be dissipated in time and accumulates in the electronic components (such as processors) inside the electronic product, it will inevitably affect the overall operating performance of the electronic product due to excessive temperature, or even cause damage to the electronic components.

[0003] Generally speaking, the industry typically uses heat dissipation devices with heat sources that are in confined spaces or require a large area for heat dissipation, such as heat exchange plates, as heat conduction or temperature equalization.

[0004] It is well known that a heat spreader consists of an upper plate covering a lower plate, which together define a sealed chamber. The sealed chamber is in a vacuum state and is filled with a working liquid (such as pure water). The sealed chamber is also equipped with capillary structures and support columns, with the two ends of the support columns respectively abutting the inner sides of the upper and lower plates inside the sealed chamber.

[0005] However, the typical or traditional support column is a solid copper column, whose function is only to provide support and prevent the heat spreader from thermally expanding (the upper and lower plates expand outwards when heated, causing bulges or swelling). Because the outer surface of the copper column is smooth, it cannot provide any capillary force. As a result, the working fluid after evaporation and condensation can only be subjected to gravity or slowly flow back to the evaporation zone (lower plate) through the capillary structure of the condensation zone (upper plate). The return flow rate and process are too slow, which can easily cause the water to return to the evaporation zone too slowly, resulting in dry burning and poor heat transfer efficiency.

[0006] Therefore, manufacturers improved the support column, enabling it to not only provide support but also exert capillary force. This improved support column can be broadly categorized into two types. One type is a sintered support column formed by directly sintering ordinary powder. The porous structure of the sintered support column allows the condensed liquid to flow back to the evaporation zone via capillary force. While this sintered support column possesses capillary force, it also presents several problems. Firstly, the porous structure of the sintered support column results in a lower density than a solid copper column, leading to weaker support strength. This makes it susceptible to breakage or collapse under high external pressure, and its pull-out force is also insufficient, easily causing bulging of the heat spreader.

[0007] Another type of support column involves attaching a ring-shaped structure made of sintered powder to the outside of a solid copper column. The porous nature of this ring structure generates capillary force, drawing the condensed liquid back to the evaporation zone and achieving a smooth vapor-liquid circulation effect. This ring-shaped structure is manufactured using a graphite mold with a cavity containing a central carbon rod. Powder is then filled into the cavity to form a ring-shaped structure surrounding the carbon rod. The mold is then placed in a sintering furnace for sintering, and after cooling, the sintered ring-shaped body is removed from the cavity. Because the melting point of the graphite mold and carbon rod is relatively higher than that of the sintering powder, they can withstand the sintering temperature without melting and sintering together with the ring-shaped body. This allows the ring-shaped body to easily detach from the cavity and separate from the carbon rod.

[0008] However, both the annular structure and the copper pillar are manufactured separately and then assembled. During the sintering process, it is difficult to ensure the uniformity of the annular structure's quality. This leads to inconsistencies in the center of the joint between the annular structure and the copper pillar, causing concentricity errors and assembly tolerances. Consequently, eccentricity and assembly gaps arise during assembly. (That is, if the inner diameter of the annular structure is excessively smaller than the outer diameter of the copper pillar, the annular structure cannot fit snugly onto the copper pillar. If the inner diameter of the annular structure is excessively larger than the outer diameter of the copper pillar, an assembly gap will form between the inner surface of the annular structure and the outer surface of the copper pillar, preventing a tight fit. This will cause the annular structure on the copper pillar to wobble and result in assembly gap problems.) This gap can cause water accumulation. When the heat spreader is not working and the external environment is at zero degrees Celsius, the accumulated water in this gap will freeze, causing the annular structure to expand (bulge), crack, or break, thereby reducing the heat exchange efficiency of the heat spreader or rendering it inoperable.

[0009] Therefore, how to solve the above-mentioned problems and defects is the direction that the inventors of this case and related manufacturers in this industry are eager to study and improve. Summary of the Invention

[0010] In order to solve the above problems, the main objective of the present invention is to provide a jig and an integral ring support column structure made therefrom.

[0011] On one hand, the present invention provides a fixture comprising, from bottom to top, a carrier, a top cover, and a powder inlet cover. The carrier has a top surface and a bottom surface, the top surface having a plurality of cavities. The top cover covers the top surface of the carrier and has an upper surface and a lower surface. The lower surface faces the top surface of the carrier and has a plurality of positioning grooves corresponding to each cavity. A set of powder discharge holes is provided on the outer side of each positioning groove, penetrating the upper and lower surfaces and communicating with the cavity. The powder inlet cover is disposed on the upper surface of the top cover and has a material feeding area. The material feeding area has a plurality of feeding ports, each feeding port corresponding to and communicating with each set of powder discharge holes of the top cover.

[0012] In one embodiment of the fixture of the present invention, the powder funnel cover is provided with a plurality of funnel cover positioning holes, the carrier is located on a base, the base has a settling area and a plurality of positioning pins, the settling area is for placing the carrier, and the plurality of positioning pins correspond to the plurality of funnel cover positioning holes for positioning the powder funnel cover.

[0013] In one embodiment of the fixture of the present invention, each mold cavity has a cavity bottom, the cavity bottom is provided with a fixing part, the fixing part is connected to a powder discharge hole, the powder discharge hole penetrates the fixing part and the bottom surface of the carrier and is connected to the mold cavity.

[0014] In one embodiment of the fixture of the present invention, the top surface of the carrier is provided with at least one engagement recess, and the lower surface of the upper cover is provided with at least one engagement protrusion corresponding to the engagement recess of the carrier.

[0015] On the other hand, the present invention provides an integral ring support column structure, including a copper column and a sintered ring. The copper column has an upper end, a lower end, and an outer surface, the outer surface of which is covered by the sintered ring, and the sintered ring and the copper column are sintered together to form an integral structure without assembly gaps;

[0016] In addition, the sintered ring has an upper end and a lower end, and the upper and lower ends of the copper pillar can be flush with or have a height difference from the upper and lower ends of the sintered ring, respectively.

[0017] This invention uses this fixture to create an integrated ring support column structure, which can improve the problems of assembly eccentricity and assembly gap caused by the separate fabrication of the column and the ring structure in the past well-known technology or process, and the water accumulation problem in the assembly gap. This can cause the copper column and the sintered ring to expand (bulge) and detach from the column due to water accumulation and freezing. Attached Figure Description

[0018] Figure 1A A three-dimensional exploded view of the jig;

[0019] Figure 1B A schematic diagram showing the dissection of the jig;

[0020] Figure 1C for Figure 1B A partially enlarged schematic diagram of 1C;

[0021] Figure 1D for Figure 1B A magnified 1D view of a portion of the image;

[0022] Figures 2A to 2C A schematic diagram of another implementation of the fixture;

[0023] Figure 3A flowchart illustrating the steps involved in fabricating an integrated ring-shaped support column structure using a jig;

[0024] Figure 4 A schematic diagram showing the process before the copper pillar is placed into the mold cavity;

[0025] Figure 5 A schematic diagram and a magnified view of the copper pillar after it has been placed into the mold cavity;

[0026] Figures 6(a) to 6(d) A schematic diagram of the continuous operation of filling powder into the mold cavity to form a ring-shaped powder ring;

[0027] Figure 7 A three-dimensional schematic diagram of an integral ring support column structure made using a jig;

[0028] Figure 8 This is a partial schematic diagram of an integrated ring-shaped support column structure applied within a temperature distribution plate.

[0029] Explanation of icon numbers:

[0030] Fixture 10; Base 11; Positioning pin 1112; Sealing area 112; Carrier 12; Top surface 121; Bottom surface 122; Mold cavity 123; Cavity bottom 1231; Fixing part 1232; Fixing part depth d1; Powder discharge hole 1233; Gap 1234; Connecting recess 125; Top cover 13; Positioning groove 131; Groove depth d2; Powder discharge hole 132; Upper surface 133; Lower surface 13 4; 135; 15; 15; 151; 152; 153; 153; 21; 211; 212; 211; 212; 211; 212; 21; 22; 20; 22; 22; 22; 22; 22; 22; 30; 301; 302; 303; 303; Detailed Implementation

[0031] The above-mentioned objectives of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0032] like Figures 1A to 1D As shown, a jig 10 is used to manufacture an integral ring support column structure. The jig 10 includes, from bottom to top, a carrier 12, an upper cover 13, and a powder inlet cover 15.

[0033] The carrier 12 has a top surface 121 and a bottom surface 122. The top surface 121 has a plurality of cavities 123 and at least one mating recess 125. In this embodiment, for example, but not limited to, it means that the plurality of mating recesses 125 are respectively distributed at the four corners of the top surface 121. Each cavity 123 has a cavity bottom 1231, and the cavity bottom 1231 is provided with a fixing part 1232. The fixing part 1232 is provided downward from the cavity bottom 1231, and a fixing part depth d1 is defined between the bottom side of the fixing part 1232 and the cavity bottom 1231. In addition, a powder discharge hole 1233 is provided on the bottom side of the fixing part 1232, the powder discharge hole 1233 penetrates the fixing part 1232 and the bottom surface 122 of the carrier 12 and communicates with the cavity 123. In addition, a bevel is provided at the connection between the fixing part 1232 and the powder discharge hole 1233 to guide excess powder to the powder discharge hole 1233.

[0034] In this embodiment, the aforementioned carrier 12 is preferably made of graphite, which has a higher melting point than the sintering powder and copper pillar. It can withstand the sintering temperature and will not combine with the sintered ring and copper pillar after sintering, making it easy to detach from the mold cavity 123.

[0035] The top cover 13 covers the top surface 121 of the carrier 12 and has an upper surface 133, a lower surface 134, and a plurality of powder dispensing holes 132. The lower surface 134 faces the top surface 121 of the carrier 12 and has a positioning groove 131 at each corresponding mold cavity 123, the positioning groove 131 having a groove depth d2. Each set of powder dispensing holes 132 penetrates the upper surface 133 and the lower surface 134 and is located outside (i.e., radially outside) of each positioning groove 131, communicating with the mold cavity 123 of the carrier 12. In addition, the lower surface 134 has at least one engaging protrusion 135 (e.g., ...). Figure 1B The corresponding bonding recess 125 of the bonding carrier 12 (e.g.) Figure 1A This creates a concave-convex joint. In this embodiment, for example, but not limited to, several joint protrusions 135 are distributed at the four corners of the upper cover 13 to respectively insert into a plurality of joint recesses 125, so that the upper cover 13 can be aligned and positioned with the carrier 12, thereby ensuring that each positioning groove 131 and each set of powder dispensing holes 132 are aligned with each mold cavity 123 without misalignment. Furthermore, the material of the upper cover 13 is preferably the same as that of the carrier 12, which is graphite, thereby enabling it to withstand sintering temperatures.

[0036] The powder inlet cover 15 is disposed on the upper surface 133 of the upper cover 13, and has a material placement area 151 and a plurality of inlet cover positioning holes 153. The plurality of inlet cover positioning holes 153 are, for example, but not limited to, distributed at the four corners of the powder inlet cover 15. The material placement area 151 is used to place powder (e.g., copper powder, titanium powder, or other metal or non-metal powder), and has a plurality of feeding ports 152 therein, and each feeding port 152 is connected to each set of powder discharge holes 132 of the upper cover 13. In this way, each feeding port 152, each set of powder discharge holes 132 and each mold cavity 123 connected together form a powder filling path from top to bottom.

[0037] Please continue to refer to this. Figures 2A to 2C As shown, the aforementioned carrier 12 can be optionally mounted on a base 11. Thus, the fixture 10, from bottom to top, includes a base 11, a carrier 12, a top cover 13, and a powder infuser cover 15. The base 11 has a settling area 112 and a plurality of positioning pins 1112. The settling area 112 is for positioning the aforementioned carrier 12, and the plurality of positioning pins 1112 are, for example, but not limited to, distributed at the four corners of the base 11, to correspond to the infuser cover positioning holes 153 of the aforementioned powder infuser cover 15.

[0038] This allows the positioning holes 153 of the powder inlet cover 15 to align with the positioning pins 1112 that are fitted onto the base 11, forming a positioning connection with the base 11. This ensures that the powder inlet cover 15 is vertically aligned and positioned with the carrier 12 and the upper cover 13 at the same reference position. This also fixes the powder inlet cover 15 onto the upper cover 13, with each feeding port 152 corresponding to each set of powder discharge holes 132 on the upper cover 13. Simultaneously, it allows the carrier 12 and the upper cover 13 to be positioned between the base 11 and the powder inlet cover 15.

[0039] The following describes the method and steps for fabricating an integrated powder ring copper column structure using the aforementioned fixture.

[0040] Please continue to refer to this. Figure 3 A flowchart outlining the steps involved in creating an integrated ring-shaped support column structure. Figure 4 Figure 6 shows the matching. Figure 3 The implementation diagram of each step is shown in the figure. The fabrication method of the support column structure with powder rings includes the following steps:

[0041] Step A (S1): Place the copper pillars into the mold cavity of the carrier respectively.

[0042] In this step, such as Figure 4 and Figure 5As shown, the carrier 12 is pre-placed on the base 11. Before it is covered by the top cover 13, each pre-prepared copper pillar 21 is placed into each mold cavity 123. Each copper pillar 21 has an upper end 211, a lower end 212, and an outer surface 213. The lower end 212 of the copper pillar 21 placed in the mold cavity 123 is temporarily fixed to the fixing part 1232 of the bottom 1231 of the mold cavity 123, while the upper end 211 protrudes from the top surface 121 of the carrier 12. Furthermore, the inner diameter of the fixing part 1232 is larger than the outer diameter of the copper pillar 21, thereby forming a gap 1234 between the inner side of the fixing part 1232 and the outer surface of the lower end 212 of the copper pillar 21. The gap 1234 is located below the mold cavity 123 and above the powder discharge hole 1233 to facilitate the subsequent discharge of scattered powder (such as...) from the mold cavity 123. Figure 5 (As shown).

[0043] Step B (S2): Place the top cover and the powder inlet cover sequentially from bottom to top on the top surface of the carrier.

[0044] In this step, such as Figure 5 As shown, after the copper pillar 21 is placed into the mold cavity 123, the upper cover 13 is placed on the top surface 121 of the carrier 12, and then the powder filter cover 15 is placed on the upper surface 133 of the upper cover 13.

[0045] The lower surface 134 of the upper cover 13 covers the top surface 121 of the carrier 12. The positioning groove 131 of the lower surface 134 is aligned with the upper end 211 of the solid copper pillar 21 in each mold cavity 123. The depth d2 of the groove matches the protruding length of the upper end 211, providing a protruding space for positioning. Thus, the upper end 211 and lower end 212 of the copper pillar 21 in the mold cavity 123 are temporarily fixed by the positioning groove 131 of the upper cover 13 and the fixing part 1232 of the carrier 12, respectively, so that the copper pillar 21 can stand stably and vertically in the mold cavity 123, preventing it from tilting. This improves the concentricity of the two (i.e., the powder ring and the copper pillar 21 are coaxial, with no center point offset), and maintains a consistent thickness of the powder ring, preventing uneven thickness issues. Furthermore, each set of powder-feeding holes 132 on the top cover 13 avoids the upper end 211 of the copper pillar 21 and is directly connected to each mold cavity 123 of the carrier 12 below it, so that the powder to be filled later is filled into the mold cavity 123 and does not fall to the upper end 211 to form residual powder, thus avoiding the problem of incomplete bonding between the upper end 211 and the inner side of the heat spreader.

[0046] The positioning holes 153 of the powder inlet cover 15 are aligned with the positioning pins 1112 of the sleeve base 11 to form a positioning connection, and the carrier 12 and the upper cover 13 are positioned between them. Each feeding port 152 of the feeding area 151 of the powder inlet cover 15 is aligned with each set of powder dropping holes 132 of the upper cover 13 below it. In this way, the feeding port 152, each set of powder dropping holes 132 and the mold cavity 123 are connected from top to bottom to form a powder filling path.

[0047] Step C (S3): Place the powder in the material placement area of ​​the powder funnel cover, and let the powder fill the mold cavity through the powder drop hole from each feeding port, thereby filling an annular powder ring on the outer surface of the copper pillar.

[0048] In this step, as shown in Figure 6(a), pre-prepared powder 20 (e.g., copper powder, titanium powder, or other metal or non-metal powder) is placed in the feeding area 151 of the powder inlet cover 15. The powder 20 enters the powder discharge hole 132 of the upper cover 13 from each feeding port 152. Then, the powder passing through the powder discharge hole 132 is filled into the mold cavity 123. As the powder 20 continues to fill the mold cavity 123, it gradually fills the outer surface of the copper pillar 21 to form an annular powder ring 22. In some embodiments, the powder 20 is fed into the mold cavity 123 by high-pressure gas or vibration, which can make the sintered powder 20 in the mold cavity 123 tightly packed and formed, so that the formed annular powder ring 22 will not be loose, thereby improving the yield of the finished product obtained by subsequent sintering.

[0049] Step D(S4): Remove the powder drain cap to stop the powder from continuing to fill the cavity.

[0050] In this step, as shown in Figure 6(b), after the outer surface of the copper pillar 21 is filled with a ring-shaped powder ring 22, the powder drain cover 15 and the powder 20 on it are removed to stop the powder 20 from being filled into the mold cavity 123. Furthermore, some loose powder 20 in the mold cavity 123 can be discharged from the mold cavity 123 through the powder discharge hole 1233 from the gap 1234.

[0051] Step E (S5): The top cover and the carrier are heated together to sinter the copper pillar and the annular powder ring in the mold cavity. The annular powder ring is sintered into a sintered ring integrally formed on the outer surface of the copper pillar. The two are an integral structure without assembly gaps.

[0052] In this step, as shown in Figures 6(c) and 6(d), the upper cover 13, the carrier 12, and the copper pillar 21 with an annular powder ring 22 are fed into a heating furnace (e.g., a sintering furnace) for heating treatment. Heating causes the granular powder 20 to bond together. After heating treatment, the annular powder ring 22 becomes a sintered ring 22 directly bonded to the outer surface 213 of the copper pillar 21. This makes the two an integral structure without assembly gaps. Then, the upper cover 13 is removed to separate it from the carrier 12, and the support pillar structure forming the integral ring is taken out from the mold cavity 123. Since the sintered ring 22 is formed by heating the powder 20, it is a capillary structure (or capillary organization) with porous structure capable of generating capillary forces.

[0053] The following is an example of the application of this integrated ring support column structure in a two-phase flow device.

[0054] Please continue to refer to this. Figure 7 and Figure 8 As shown, please refer to the following: Figure 1C , Figure 1D , Figure 5 and Figures 6(a) to 6(c) The aforementioned integrated ring support column structure can be applied within a temperature equalization plate 30. The sintered ring 22 has an upper end 221 and a lower end 222. The upper end 211 and lower end 212 of the copper column 21 can be flush with the upper end 221 and lower end 222 of the sintered ring, respectively, or have a height difference.

[0055] In this embodiment, the upper end 211 of the copper pillar 21 slightly protrudes from the upper end 221 of the sintering ring 22, forming an upper height difference h1 (as shown in FIG. 6(d)). Furthermore, by means of the fixing depth d1 of the fixing part 1232, the lower end 212 of the copper pillar 21 slightly protrudes from the lower end 222 of the sintering ring 22, forming a lower height difference h2 (as shown in FIG. 6(d)). The upper and lower height differences h1 and h2 between the copper pillar 21 and the sintering ring 22 are used to match the thickness of a capillary structure 303 on the inner surface of the upper cover 301 and the lower cover 302 of the heat spreader 30. The upper end 211 and lower end 212 of the copper pillar 21 are connected to the inner surfaces of the upper cover 301 and the lower cover 302, respectively. The upper end 221 and lower end 222 of the sintered ring 22 can contact or connect with the capillary structure 303 on the inner surfaces of the upper cover 301 and the lower cover 302, respectively. The copper pillar 21 serves as a support pillar to help the heat spreader 30 resist external pressure or withstand internal gas pressure. The sintered ring 22 serves as a reflux capillary structure for the vapor-liquid circulation of the working liquid within the heat spreader 30.

[0056] As described above, the integrated ring support column structure completed using the above-mentioned fixture and steps has a copper column 21 and a sintered ring 22 that are integrated into one structure without any assembly gap. This can improve the problem of water accumulation caused by assembly gaps in previous technologies or processes, which caused the copper column and sintered ring to expand (bulge) and detach from the column due to water accumulation and freezing.

Claims

1. A jig, characterized in that: include: A carrier having a top surface and a bottom surface, the top surface having a plurality of cavities; A top cover covers the top surface of the carrier and has an upper surface and a lower surface. The lower surface faces the top surface of the carrier and has a plurality of positioning grooves corresponding to each mold cavity. A set of powder dropping holes is provided on the outside of each positioning groove, penetrating the upper surface and the lower surface and connecting to the mold cavity. A powder inlet cover is disposed on the upper surface of the cover and has a material placement area. The material placement area has a plurality of feeding ports, each feeding port corresponding to a set of powder discharge holes of the cover.

2. The fixture as described in claim 1, characterized in that: The powder dispenser cover has a plurality of dispenser cover positioning holes. The carrier is located on a base. The base has a settling area and a plurality of positioning pins. The settling area is for placing the carrier. The plurality of positioning pins are positioned corresponding to the plurality of dispenser cover positioning holes of the powder dispenser cover.

3. The fixture as described in claim 1, characterized in that: Each mold cavity has a bottom, and the bottom of the cavity is provided with a fixing part. The fixing part is connected to a powder discharge hole, which passes through the fixing part and the bottom surface of the carrier and is connected to the mold cavity.

4. The fixture as described in claim 1, characterized in that: The top surface of the carrier is provided with at least one mating recess, and the lower surface of the cover is provided with at least one mating protrusion corresponding to the mating recess of the carrier.

5. An integral ring support column structure made using the jig according to any one of claims 1 to 4, characterized in that: Include: A copper pillar has an upper end, a lower end, and an outer surface, the outer surface of which is formed with a sintered ring, the sintered ring being sintered together with the copper pillar to form an integral structure without assembly gaps.

6. The integrated ring-shaped support column structure as described in claim 5, characterized in that: The sintered ring has an upper end and a lower end, and the upper and lower ends of the copper pillar have a height difference from the upper and lower ends of the sintered ring, respectively.

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