Earphone and electronic device

Abstract

Embodiments of the present application provide an earphone and an electronic device. The earphone comprises an earphone shell, a yoke, a first sound unit and a second sound unit. The first sound unit is a moving coil loudspeaker, which has high low-frequency diving capability. The second sound unit is arranged on one side of the magnetic circuit structure of the first sound unit or the outer periphery of the yoke, and has high-frequency sound output capability. Since the first sound unit and the second sound unit can output different frequency sounds respectively, the earphone can simultaneously meet the needs of high and low sound, and improve the high-frequency extension and low-frequency diving performance. Compared with the traditional earphone which adopts the axial stacking of high sound unit and low sound unit, the second sound unit in the earphone of the present application is arranged on one side of the magnetic circuit structure or the outer periphery of the yoke, so that the axial size of the earphone is small, the overall thickness is close to the thickness of the single moving coil unit, and the space utilization is improved. The electronic device with the earphone also meets the needs of high and low sound, and the earphone occupies a small space.

Description

Technical Field

[0001] This application relates to the field of headphone technology, and more particularly to a headphone and an electronic device. Background Technology

[0002] Sound quality is a fundamental requirement for headphones, and users' demands for headphone sound quality are constantly increasing, requiring headphones to have wider high-frequency extension and better low-frequency extension. Traditional headphones use a single speaker unit, which is difficult to design to achieve high quality in both high and low frequencies simultaneously, resulting in poor output sound quality. Based on this, the industry has developed headphone solutions that combine tweeters and woofers, using independent vibration systems for high-quality high and low frequencies respectively. However, existing headphones using tweeter and woofer combinations have two units stacked axially, resulting in a large axial dimension, which is difficult to meet the space constraints of headphone internals. The industry needs a headphone that occupies less space and provides excellent high and low frequency sound quality. Summary of the Invention

[0003] This application provides an earphone and an electronic device that solves the problem of finding an earphone that occupies a small space and has good high and low frequency sound quality.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, embodiments of this application provide an earphone, which includes an earphone shell, a frame, a first sound-producing unit, and a second sound-producing unit; the frame is disposed on the earphone shell; the first sound-producing unit includes a magnetic circuit structure mounted on the frame, a diaphragm, and a voice coil connected to the diaphragm, the magnetic circuit structure having an annular air gap, the diaphragm being spaced apart from the magnetic circuit structure, at least a portion of the voice coil being housed within the annular air gap, and the connection between the voice coil and the diaphragm forming a bass vibration source surface; the second sound-producing unit is mounted on the side of the magnetic circuit structure facing the diaphragm or on the outer periphery of the frame, the second sound-producing unit having a treble vibration source surface, the treble vibration source surface and the bass vibration source surface having the same orientation.

[0005] The headphones provided in this application embodiment use a dynamic driver as the first sound unit, which has high low-frequency extension capability. The second sound unit is located on one side of the magnetic circuit structure of the first sound unit or on the outer periphery of the frame, and has the ability to output high-frequency sound. Since the first and second sound units can output sound at different frequencies respectively, the headphones can simultaneously meet the needs of high and low frequencies, improving high-frequency extension and low-frequency extension performance. Compared with traditional headphones that use axially stacked tweeter and woofer units, the second sound unit in the headphones of this application is located on one side of the magnetic circuit structure or on the outer periphery of the frame, making the axial dimension of the headphones smaller, and the overall thickness is close to that of a single dynamic driver unit, improving space utilization.

[0006] In one possible implementation, the earphone shell has an earcup, and the earcup and earphone shell together form a front cavity, with both the first and second speaker units facing the front cavity. The earcup reduces external noise and provides comfort and a seal when wearing the headphones. The sound waves generated by the first and second speaker units pass through the front cavity formed by the earcup and earphone shell before entering the ear canal.

[0007] In one possible implementation, the second sound-producing unit is equipped with a horn located within the front cavity. The horn has a first end and a second end positioned opposite each other, with the first end aligned with the outer periphery of the second sound-producing unit, and the second end oriented towards the sound output direction of the second sound-producing unit. After the horn is installed, the sound waves generated by the second sound-producing unit propagate in a more concentrated direction, which can improve the high-frequency sensitivity and effective bandwidth of the second sound-producing unit, achieving good high-frequency sound quality.

[0008] In one possible implementation, the earphone shell is provided with a grille frame that covers the diaphragm. The grille frame has multiple sound outlets for sound output from the first sound unit. The sound generated by the first sound unit is guided by the grille frame and output through the multiple sound outlets, thereby improving the sound uniformity of the earphone.

[0009] In one possible implementation, the horn and grille frame are an integral structure, with the second end of the horn connected to the grille frame, the first end of the horn fixed or abutting against the outer periphery of the second sound unit, and the edge of the grille frame connected to the earphone shell. Making the horn and grille frame an integral structure facilitates molding and assembly.

[0010] In one possible implementation, the headphone shell includes an annular partition and a first rear shell. The front side of the annular partition and the bass resonator face the same direction, and the frame is mounted in the inner hole of the annular partition. The first rear shell is connected to the rear side of the annular partition and covers the rear of the first driver unit. The inner side of the first rear shell, the rear side of the annular partition, and the rear side of the first driver unit form a first rear cavity. The first rear shell has a first resonant channel communicating with the first rear cavity. The frame has a first vent hole and / or the magnetic circuit structure has a second vent hole. The annular air gap and the first rear cavity are connected through the first vent hole and / or the second vent hole. The annular air gap in the first driver unit and the first rear cavity are connected through the first vent hole and / or the second vent hole, allowing air to flow between the annular air gap and the first rear cavity, forming a Helmholtz resonator. This reduces the frequency response of the headphones at the mid-low frequency points, reduces low-frequency sensitivity, improves the flatness of the mid-low frequency response curve, and enhances the mid-frequency or low-frequency sound quality of the headphones.

[0011] In one possible implementation, the earphone shell further includes a second rear shell connected to the rear side of the annular partition. The inner side of the second rear shell, the rear side of the annular partition, and the outer side of the first rear shell form a second rear cavity. The first and second rear cavities are connected through a first resonant channel. The annular partition has a through hole connecting the front cavity and the second rear cavity. This embodiment of the earphone employs a dual rear cavity design. The first and second rear cavities are connected through the first resonant channel, allowing air to flow between them. Furthermore, the front and second rear cavities are connected through the through hole, allowing air to flow between them, forming a Helmholtz resonator. This reduces the frequency response of the earphone at another low-to-mid frequency point, improves low-frequency sensitivity, enhances the flatness of the mid-to-low frequency response curve, and improves the mid-to-low frequency sound quality of the earphone.

[0012] In one possible implementation, the second rear shell has one or more second resonant channels communicating with the second rear cavity and an external space. These second resonant channels, combined with the air volume within the second rear cavity, function as part of a resonator, reducing the frequency response at higher mid-low frequency points, improving the flatness of the mid-low frequency response curve, and further enhancing the mid-low frequency sound quality of the headphones.

[0013] In one possible implementation, the volume of the second rear cavity is 4 cubic centimeters (cm²). 3 Up to 16cm 3 It can reduce the frequency response of headphones below 1kHz, reduce low-frequency sensitivity, improve the flatness of the low-frequency response curve, meet the requirements of passive noise reduction of external space noise, improve the low-frequency sound quality of headphones, and the second back shell with a second resonant channel is easy to mold.

[0014] In one possible implementation, the length of the second resonant channel ranges from 4 mm to 20 mm. This can reduce the frequency response of the headphones below 1 kHz, reduce low-frequency sensitivity, improve the flatness of the low-frequency response curve, meet the requirements for passive noise reduction against external ambient noise, improve the low-frequency sound quality of the headphones, and the second back shell with the second resonant channel is easy to mold.

[0015] In one possible implementation, the cross-sectional area of ​​the second resonant channel ranges from 3 mm² to 10 mm². This can reduce the frequency response of the headphones below 1 kHz, reduce low-frequency sensitivity, improve the flatness of the low-frequency response curve, meet the requirements for passive noise reduction against external ambient noise, improve the low-frequency sound quality of the headphones, and the second back shell with the second resonant channel is easy to mold.

[0016] In one possible implementation, the second rear shell has a main channel and multiple sub-channels. The main channel has two oppositely positioned ends. One end of the main channel is connected to the second rear cavity, and the other end of the main channel is connected to the multiple sub-channels. The ends of the multiple sub-channels furthest from the main channel are respectively connected to the second rear shell and connected to the external space. The main channel and each sub-channel are connected to form a second resonant channel. Arranging more resonant channels in a smaller space improves the frequency response at different mid-to-low frequency points and satisfies the compact structure of the headphone rear cavity.

[0017] In one possible implementation, a second sound unit is configured as a single unit, mounted in the middle of the side of the magnetic circuit structure facing the diaphragm, and coaxially arranged with the first sound unit. This achieves dual-unit crossover for both high and low frequencies without altering the overall size of the bass unit.

[0018] In one possible implementation, a second sound unit is configured as a single unit, mounted on the side of the magnetic circuit structure facing the diaphragm, and offset from the first sound unit. This achieves dual-unit crossover for both high and low frequencies without altering the overall size of the bass unit.

[0019] In one possible implementation, multiple second sound units are arranged around the outer periphery of the frame. The output sound has a good sense of space, achieving a stereo effect. The overall structure is small in both the axial and radial directions, meeting the requirement of a compact headphone structure.

[0020] In one possible implementation, the magnetic circuit structure includes a magnetic base, a magnet, and a magnetic plate. The magnetic base includes a plate-shaped portion and a cylindrical portion connected to the outer edge of the plate-shaped portion. The magnet is mounted on the plate-shaped portion, and the magnetic plate is mounted on the magnet. The outer peripheral surfaces of the magnet and the magnetic plate are spaced from the inner wall of the cylindrical portion, forming an annular air gap. One end of the annular air gap near the magnetic plate forms an opening for the voice coil to extend into. The magnetic circuit structure generates magnetic lines of force passing through the annular air gap, called a first magnetic field. When an audio current passes through the voice coil, a second magnetic field is generated. The second magnetic field of the voice coil interacts with the first magnetic field of the magnetic circuit structure, causing the voice coil to vibrate and thus driving the diaphragm to vibrate.

[0021] In one possible implementation, the magnetic circuit structure includes a magnetic base, a ring magnet, and a magnetic ring. The magnetic base includes a plate-shaped portion and a columnar portion connected to the middle of the plate-shaped portion. The ring magnet is mounted on the plate-shaped portion, and the magnetic ring is mounted on the ring magnet. The inner circumferential surfaces of the ring magnet and the magnetic ring are spaced apart from the outer circumferential surface of the columnar portion, forming an annular air gap. One end of the annular air gap near the magnetic ring forms an opening for the voice coil to extend into. The magnetic circuit structure generates magnetic lines of force passing through the annular air gap, called a first magnetic field. When an audio current passes through the voice coil, a second magnetic field is generated. The second magnetic field of the voice coil interacts with the first magnetic field of the magnetic circuit structure, causing the voice coil to vibrate and thus driving the diaphragm to vibrate.

[0022] In one possible implementation, the magnetic circuit structure includes a magnetic base, an inner magnet, an outer magnet, an inner magnetic guide plate, and an outer magnetic guide plate. The inner and outer magnets are coaxially spaced on the magnetic base. The inner and outer magnetic guide plates are correspondingly mounted on the inner and outer magnets, spaced apart. An annular air gap is formed between the assembly consisting of the inner magnet and the inner magnetic guide plate and the assembly consisting of the outer magnet and the outer magnetic guide plate. One end of the annular air gap near the inner magnetic guide plate forms an opening for the voice coil to extend into. This magnetic circuit structure generates magnetic lines of force passing through the annular air gap, referred to as a first magnetic field. When an audio current passes through the voice coil, a second magnetic field is generated. The second magnetic field of the voice coil interacts with the first magnetic field of the magnetic circuit structure, causing the voice coil to vibrate and thus driving the diaphragm to vibrate.

[0023] In one possible implementation, the headphones also include a flexible suspension for elastically supporting the voice coil and diaphragm on the frame. Using a flexible suspension to elastically support the voice coil and diaphragm on the frame facilitates vibration of the voice coil and diaphragm within a predetermined range, reduces swing polarization, and improves reliability.

[0024] In one possible implementation, the elastic suspension includes an inner ring, a middle ring, and an outer ring arranged coaxially, a first cantilever connecting the inner and middle rings, and a second cantilever connecting the middle and outer rings, with the first and second cantilever suspended in the air. When the voice coil vibrates up and down in the annular air gap, the middle ring and the connection between the diaphragm and the middle ring vibrate accordingly. The first and second cantilever provide traction on the inner and outer sides of the middle ring, guiding the voice coil and diaphragm to vibrate within a predetermined range.

[0025] In one possible implementation, the elastic suspension is configured as a flexible circuit board for providing audio current to the voice coil and the second driver. The outer ring has an input terminal, the voice coil is electrically connected to the middle ring, and the second driver is electrically connected to the inner ring. This eliminates the need for manual wiring of the voice coil and the second driver, improving assembly efficiency and reliability.

[0026] In one possible implementation, the second sound-emitting unit is a microelectromechanical speaker, a piezoelectric ceramic sound-emitting plate, an electrostatic speaker, or a flat panel speaker. This integrates the second sound-emitting unit with the first sound-emitting unit, improving sound quality and reducing the space occupied by the speaker.

[0027] In one possible implementation, the basin frame has a through hole, and the magnetic circuit structure is at least partially assembled within the through hole; a stop arm is provided on the inner wall of the through hole, and the magnetic circuit structure has a limiting groove, with the stop arm engaging with the limiting groove to limit the position of the magnetic circuit structure relative to the basin frame. This achieves axial and circumferential positioning of the magnetic circuit structure.

[0028] Secondly, embodiments of this application provide an electronic device, including the aforementioned headphones. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the earphone provided in an embodiment of this application; Figure 2 for Figure 1 An exploded 3D view of the headphone section structure; Figure 3 for Figure 1 A three-dimensional sectional view of the headphone section structure; Figure 4 for Figure 1 An enlarged view of the headphone section structure; Figure 5 The frequency response curves of the first and second sound units and the synthesized signal of the headphones during simulated ear testing are shown. Figure 6 This is a schematic diagram of the frequency response curve of the headphones; Figure 7 This is the frequency response curve of the headphones when tested using a baffle free field.

[0030] Figure 8 This is a schematic diagram of the structure of an earphone provided in another embodiment of this application; Figure 9 This is a schematic diagram of the structure of an earphone provided in another embodiment of this application; Figure 10 A schematic diagram of the structure of a plurality of second resonant channels and a second rear shell in an earphone provided in another embodiment of this application; Figure 11 This is a schematic diagram of the structure of an earphone provided in another embodiment of this application; Figure 12 for Figure 11 A top view of the headphone section structure; Figure 13 for Figure 1 A schematic diagram of the headphone structure after the earphone shell and diaphragm have been disassembled; Figure 14 (a), (b), and (c) in the text are respectively Figure 1 The front view, top view, and bottom view of the headphone section structure. Detailed Implementation

[0031] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this implementation. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0032] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0033] It should be understood that, in the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0035] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0036] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0037] See Figures 1 to 4 This application provides an earphone, which includes an earphone shell 700, a frame 100, a first sound unit 200, and a second sound unit 300. The frame 100 is disposed on the earphone shell 700. The first sound unit 200 includes a magnetic circuit structure 210 mounted on the frame 100, a diaphragm 230, and a voice coil 220 connected to the diaphragm 230. The magnetic circuit structure 210 has an annular air gap 211. The diaphragm 230 is spaced apart from the magnetic circuit structure 210. At least a portion of the voice coil 220 is housed within the annular air gap 211. The connection between the voice coil 220 and the diaphragm 230 forms a bass vibration sound source surface 200a. The second sound unit 300 is mounted on the side of the magnetic circuit structure 210 facing the diaphragm 230 (e.g., ...). Figure 1 (As shown) or the outer periphery of the frame 100, the second sound unit 300 has a high-frequency vibration source surface 300a, and the high-frequency vibration source surface 300a and the low-frequency vibration source surface 200a have the same orientation.

[0038] The headphones can be over-ear or ear-hook headphones, and they can cover the ears when worn.

[0039] The headphones provided in this application embodiment use a dynamic driver as the first sound unit 200, which has high low-frequency extension capability. A second sound unit 300 is located on one side of the magnetic circuit structure 210 of the first sound unit 200 or on the outer periphery of the frame 100, and has the capability to output high-frequency sound. Since the first sound unit 200 and the second sound unit 300 can output sound at different frequencies respectively, the headphones can simultaneously meet the needs of high and low frequencies, improving high-frequency extension and low-frequency extension performance. Compared with traditional headphones that use a tweeter and woofer stacked axially, the second sound unit 300 in the headphones of this application is located on one side of the magnetic circuit structure 210 or on the outer periphery of the frame 100, making the axial dimension of the headphones smaller, and the overall thickness close to that of a single dynamic driver unit, improving space utilization.

[0040] Both the first sound-producing unit 200 and the second sound-producing unit 300 are loudspeakers, capable of outputting sounds within different frequency ranges. These ranges represent low, mid, and high frequencies, with relatively varying frequencies. The second sound-producing unit 300 has a higher frequency than the first sound-producing unit 200. While their frequencies are relative, there may be some overlap, or no overlap at all. Specifically, the maximum frequency of the second sound-producing unit 300 is greater than that of the first sound-producing unit 200, or the frequency at which the second sound-producing unit 300 has the highest energy is greater than that of the first sound-producing unit 200 (the frequency with the highest energy can be understood as the frequency with the highest loudness). The voice coil 220 in the first sound-producing unit 200 can vibrate within a first frequency range, producing low and mid-frequency sounds. The second sound-producing unit 300 can vibrate within a second frequency range, producing high-frequency sounds. For example, the first frequency range is 50 Hz to 5000 Hz, and the second frequency range is 300 Hz to 20000 Hz. The specific frequency range is not limited. In the first sound-producing unit 200, the magnetic circuit structure 210 provides a first magnetic field. When an audio current passes through the voice coil 220, which is located in the first magnetic field provided by the magnetic circuit structure 210, the voice coil 220 generates a second magnetic field that varies with the audio current. This second magnetic field interacts with the first magnetic field provided by the magnetic circuit structure 210, causing the voice coil 220 to vibrate in the first magnetic field of the magnetic circuit structure 210 with the audio current. Since the voice coil 220 is connected to the diaphragm 230, the voice coil 220 will drive the diaphragm 230 to vibrate, thereby producing a sound with the same waveform as the original audio current.

[0041] The headphones use a crossover to separate sound signals of different frequency bands, amplify and process them separately, and then transmit them to the first speaker unit 200 and the second speaker unit 300 for playback. This achieves separate enhancements in low-frequency extension and high-frequency bandwidth expansion, resulting in a superior sound quality experience. The crossover is a conventional component, and combined with speaker units capable of outputting different frequency bands, it can easily achieve a wide sound range.

[0042] According to national standards or the loudspeaker testing standards recommended by the International Electrotechnical Commission (IEC), the earphones of this application were placed on a simulated ear for simulated ear testing. A simulated ear is a coupling cavity used to replace the human ear in receiving sound signals. Inputting a recorded file signal to the earphones yields results such as... Figure 5 The frequency response curves of the first and second sound units and the synthesized curves are shown. The frequency response curve of the first sound unit has a higher loudness in the low and mid-frequency range, while the frequency response curve of the second sound unit has a higher loudness in the high-frequency range. By synthesizing the frequency response curves of the two sound units, the unevenness of the synthesized frequency response curve is reduced, and the frequency response curve appears flatter, which is beneficial to improving the sound quality of the headphones in different frequency bands.

[0043] In some embodiments, see Figure 1 The earphone shell 700 has an earcup 800, which, together with the earcup 800, forms a front cavity 801. The first speaker unit 200 and the second speaker unit 300 are both positioned facing the front cavity 801. The earcup 800 is typically ring-shaped, covering the entire auricle when the headphones are worn. The earcup 800 reduces external noise and provides comfort and a good seal when wearing the headphones. The bass vibration source surface 200a of the first speaker unit 200 and the treble vibration source surface 300a of the second speaker unit 300 are both located on the earphone shell 700. The sound waves generated by the first speaker unit 200 and the second speaker unit 300 pass through the front cavity 801 formed by the earcup 800 and the earphone shell 700 before entering the ear canal.

[0044] Setting the earcups 800 increases the distance between the high-frequency vibration source surface 300a of the second sound unit 300 and the eardrum, resulting in a greater distance between them and the eardrum. This can lead to insufficient high-frequency response perceived by the human ear. (See also...) Figure 1To improve the mid-to-high frequency output sound quality of the second sound unit 300, in some embodiments, the second sound unit 300 is provided with a horn 910. The horn 910 is located within the front cavity 801 and has a first end 911 and a second end 912 arranged opposite to each other. The outer peripheries of the first end 911 and the second sound unit 300 are aligned, and the second end 912 is oriented towards the sound output direction of the second sound unit 300. The shape of the horn 910 can be exponential, linear, or other shapes. An exponential horn is a trumpet-shaped horn with an inner diameter that gradually increases, while a linear horn is a tubular horn with a uniform inner diameter. The inner diameter of the horn is smaller on the side closer to the second sound unit 300, and larger on the side farther from the second sound unit 300. The horn 910 is used to propagate the mid-to-high frequency sound generated by the second sound unit 300 along the direction from the first end 911 to the second end 912. Compared to the case without horn 910, the sound wave propagation direction generated by the second sound unit 300 is more concentrated after horn 910 is set, which can improve the high frequency sensitivity and effective bandwidth of the second sound unit 300 and achieve good high frequency sound quality.

[0045] The sensitivity of a loudspeaker, also known as sound pressure level (SPL), refers to the sound pressure level measured at a distance of 1 meter (m) from the loudspeaker's axis when a 1-watt (W) electrical power signal is applied to the loudspeaker. Improved high-frequency sensitivity translates to improved high-frequency response, manifested as... Figure 6 The frequency response curve shown shifts upward in the high-frequency region.

[0046] Effective bandwidth refers to the effective range of a loudspeaker's frequency response. On the frequency response curve of a loudspeaker measured with a sinusoidal input signal, within the bandwidth of one octave band in the region of highest sensitivity, the arithmetic mean of the sound pressure level is calculated at four points (1 / 3 octave band). A horizontal line is drawn from this arithmetic mean down 10 dB. The frequency range corresponding to the intersection of this line and the high and low ends of the frequency response curve is shown below. High-frequency bandwidth extension is manifested as... Figure 6 The frequency response curve shown extends towards higher frequencies on the frequency axis.

[0047] According to national standards or the International Electrotechnical Commission (IEC) recommended loudspeaker testing standards, the headphones of this application were mounted on a baffle and tested in a free field. The baffle isolates the bass-reflex sound waves generated at the back of the loudspeaker, reducing diffraction interference of the bass-reflex sound waves on the normal sound waves. A sine wave signal is input to the headphones; the sound pressure generated by the headphones is received by a microphone and converted into an electrical signal, thus obtaining the signal... Figure 7 The frequency response curve of the headphones shown is... Figure 7 It can be concluded that the effective bandwidth of the headphones in this application has been greatly improved.

[0048] After setting the horn 910 to enhance the mid-to-high frequency sound quality of the second speaker unit 300, it is necessary to improve the low-frequency sound quality of the first speaker unit 200 to enhance the overall sound balance of the headphones. In some embodiments, see [reference needed]. Figure 1 The earphone shell 700 is provided with a grille frame 920, which covers the diaphragm 230. The grille frame 920 has multiple sound outlets 921 for sound output from the first sound unit 200. The sound generated by the first sound unit 200 is guided by the grille frame 920 and output through the multiple sound outlets 921, which can improve the low-frequency sound quality of the first sound unit 200 and improve the sound balance of the earphone. The grille frame 920 has a certain space, allowing the diaphragm 230 and voice coil 220 in the first sound unit 200 to move freely within the space.

[0049] For example, the grille frame 920 can be cylindrical or partially spherical, with one end of the grille frame 920 being an opening and the other end having multiple sound outlet holes 921. During assembly, the opening of the grille frame 920 surrounds the diaphragm 230 in the first sound-emitting unit 200, and the opening end of the grille frame 920 is fixed to the earphone shell 700 by snaps, adhesives, or other means. This structure is easy to form and assemble.

[0050] The first damping layer 105 can be attached to the grille frame 920 to cover the sound outlet 921. The first damping layer allows airflow, facilitates the outward propagation of sound waves, and prevents external substances from entering the earphone. The first damping layer can be made of porous materials such as non-woven fabric or micro-perforated materials.

[0051] With the horn 910 and the grid frame 920 configured, in some embodiments, see [reference needed]. Figure 1 The horn 910 and the grille frame 920 are integrated into one structure. The second end 912 of the horn 910 is connected to the grille frame 920, and the first end 911 of the horn 910 is fixed or abuts against the outer periphery of the second sound unit 300. The edge of the grille frame 920 is connected to the earphone shell 700. Integrating the horn 910 and the grille frame 920 into one structure facilitates molding and assembly. The first end 911 of the horn 910 and the outer periphery of the second sound unit 300, as well as the grille frame 920 and the earphone shell 700, can be joined by adhesive, snap-fit, or other assembly methods.

[0052] To improve the low-frequency sound quality of headphones, in some embodiments, see [reference needed]. Figure 1The earphone shell 700 includes an annular partition 710 and a first rear shell 720. The front side of the annular partition 710 and the bass resonator surface 200a face the same direction. The frame 100 is installed in the inner hole of the annular partition 710. The first rear shell 720 is connected to the rear side of the annular partition 710 and covers the rear of the first speaker unit 200. The inner side of the first rear shell 720, the rear side of the annular partition 710, and the rear side of the first speaker unit 200 form a first rear cavity 730. The first rear shell 720 has a first resonant channel 721 communicating with the first rear cavity 730. Figure 4 The basin stand 100 has a first vent 104 and / or the magnetic circuit structure 210 has a second vent 2123. The annular air gap 211 and the first rear cavity 730 are connected through the first vent 104 and / or the second vent 2123.

[0053] In this design, the front and rear sides of the annular partition 710 face away from each other, with the front side facing the ear. The first resonant channel 721 is a channel structure formed on the first rear shell 720, which can be configured as a tube or a hole. The annular air gap 211 in the first sound unit 200 and the first rear cavity 730 are connected by a first vent hole 104 and / or a second vent hole 2123, allowing air to flow between the annular air gap 211 and the first rear cavity 730, forming a Helmholtz resonator, referred to simply as the first resonator.

[0054] The formula for the natural frequency of a Helmholtz resonator is as follows:

[0055] Where f0 is the resonant frequency of the Helmholtz resonator, с is the speed of sound, S is the cross-sectional area of ​​the opening or resonant channel, d is the diameter of the opening or resonant channel, l is the length of the opening or resonant channel, and V is the volume of the cavity connected to the opening or resonant channel. When the frequency of the incident sound wave entering the opening or resonant channel is close to the natural frequency of the resonator, the vibration speed of the air in the opening or resonant channel is at its maximum, thus consuming sound energy.

[0056] By setting appropriate parameters for the first resonator, such as the volume of the first rear cavity 730, and the cross-sectional area and length of the vents (first vent 104 and / or second vent 2123), the natural frequency of the first resonator can be obtained. When the first sound-producing unit 200 operates, it generates sound waves that enter the vents and the first rear cavity 730, causing the air within them to vibrate. When the frequency of the incident sound wave entering the vent is close to the natural frequency of the first resonator, the air within the vent vibrates strongly, consuming sound energy. This reduces the frequency response of the headphones at the mid-to-low frequency points, lowers low-frequency sensitivity, improves the flatness of the mid-to-low frequency response curve, and enhances the mid-to-low frequency sound quality of the headphones. Multiple vents can be provided, and they can be circular, arc-shaped, or other shapes.

[0057] In the case where only the first rear cavity 730 exists and the second rear cavity is not described below, the first resonant channel 721 on the first rear shell 720 connects the first rear cavity 730 and the external space 10 of the earphone. The first resonant channel 721, combined with the air volume within the first rear cavity 730, serves as part of the first resonator and can also reduce the frequency response of the earphone at the resonator's natural frequency, thereby improving the mid-frequency or low-frequency sound quality of the earphone. The first resonant channel 721 can be disposed on the surface of the first rear shell 720, for example, the resonant channel can be integrally formed on the rear shell.

[0058] In some embodiments, a first damping layer 105 may be provided at the first vent 104 of the frame 100, and a second damping layer 2124 may be provided at the second vent 2123 of the magnetic circuit structure 210. The first damping layer 105 and the second damping layer 2124 allow airflow and generate damping to absorb the airflow energy passing through the vents, reducing the frequency response at the natural frequency, making the mid-low frequency response flatter, and improving the mid- or low-frequency sound quality of the headphones. The first damping layer and the second damping layer may be made of porous materials such as non-woven fabric or micro-perforated materials.

[0059] To further improve the low-frequency sound quality of the headphones, with the first rear shell 720 set and the first rear cavity 730 formed, refer to... Figure 8 In some embodiments, the earphone shell 700 further includes a second rear shell 740, which is connected to the rear side of the annular partition 710. The inner side of the second rear shell 740, the rear side of the annular partition 710, and the outer side of the first rear shell 720 form a second rear cavity 750. The first rear cavity 730 and the second rear cavity 750 are connected through a first resonant channel 721. The annular partition 710 has a through hole 711 that connects the front cavity 801 and the second rear cavity 750.

[0060] This embodiment of the earphone adopts a dual-rear-cavity design. The first rear cavity 730 and the second rear cavity 750 are connected through a first resonant channel 721, allowing air to flow between the two cavities. Furthermore, the front cavity 801 and the second rear cavity 750 are connected through a through-hole 711, allowing air to flow between them, forming a Helmholtz resonator, referred to simply as the second resonator. By setting appropriate parameters for the second resonator, such as the volume of the second rear cavity 750, the cross-sectional area and length of the first resonant channel 721, and the cross-sectional area and length of the through-hole 711, the natural frequency of the second resonator can be changed. When the first sound-producing unit 200 operates, it generates sound waves, causing vibrations in the vent and the air within the first rear cavity 730, as well as in the first resonant channel 721, the second rear cavity 750, and the through-hole 711. The first sound-generating unit 200 generates sound waves, similar to a first resonator. When the frequency of the incident sound wave entering the first resonant channel 721 is close to the natural frequency of the second resonator, the air within the first resonant channel 721 vibrates strongly, consuming sound energy. The second resonator reduces the frequency response of the headphones at another low-to-mid frequency point, increases low-frequency sensitivity, improves the flatness of the low-to-mid frequency response curve, and enhances the mid-to-low frequency sound quality of the headphones. The natural frequency of the second resonator can be set higher than that of the first resonator to reduce the frequency response at higher low-to-mid frequency points.

[0061] A damping layer can be installed at the through-hole 711. The damping layer allows airflow and generates damping to absorb the airflow energy passing through the through-hole 711, reducing the frequency response at the resonator's natural frequency, resulting in a flatter mid-low frequency response and improving the mid- or low-frequency sound quality of the headphones. The damping layer can be made of porous materials such as non-woven fabric or micro-perforated materials.

[0062] When setting the earphone shell 700, the annular partition 710, the first rear shell 720 and the second rear shell 740 can adopt an assembly structure, or the annular partition 710 and the first rear shell 720 can be integrally formed and the second rear shell 740 can be assembled on the annular partition 710.

[0063] exist Figure 8 In the illustrated embodiment, both the first rear shell 720 and the second rear shell 740 are shell-shaped with openings, such as cylindrical or partially spherical. The open ends of both the first rear shell 720 and the second rear shell 740 are connected to the annular partition 710, and the second rear shell 740 is fitted over the first rear shell 720. The first resonant channel 721 can be disposed at any position on the surface of the first rear shell 720, and the second resonant channel 741 can be disposed at any position on the surface of the second rear shell 740, for example, the resonant channel can be integrally formed on the corresponding rear shell.

[0064] In other embodiments, both the first rear shell 720 and the second rear shell 740 are shells with openings, and the ends of the first rear shell 720 and the second rear shell 740 away from the annular partition 710 are connected, with the second rear cavity 750 being approximately annular. Alternatively, the first rear shell 720 is a shell with an opening, the open end of which is connected to the annular partition 710, and the second rear shell 740 is connected to a portion of the outer periphery of the first rear shell 720, forming a structure in which the first rear cavity 730 and the second rear cavity 750 are connected through the first resonant channel 721. These are all dual-rear-cavity headphone designs. The first resonant channel 721 can be disposed on the outer peripheral surface of the first rear shell 720, and the second resonant channel 741 can be disposed at any position on the surface of the second rear shell 740, for example, the resonant channel can be integrally formed on the corresponding rear shell.

[0065] To further improve the low-frequency sound quality of the headphones, with the first rear shell 720 and the second rear shell 740 forming a dual rear cavity, refer to... Figure 9 In some embodiments, the second rear housing 740 has one or more second resonant channels 741 communicating with the second rear cavity 750 and the external space 10. The second resonant channel 741 is a channel structure formed on the second rear housing 740 and can be configured as a tube or hole. The second resonant channel 741, combined with the air volume within the second rear cavity 750, serves as part of a second resonator. The natural frequency of the resonator corresponding to the second resonant channel 741 can be set to be higher than the natural frequency of the resonator corresponding to the first resonant channel 721, reducing the frequency response at higher mid-low frequency points, improving the flatness of the mid-low frequency response curve, and further enhancing the mid-low frequency sound quality of the headphones. The second resonant channel 741 can be integrally formed on the surface of the second rear housing 740. By setting multiple second resonant channels 741 and adjusting the cross-sectional area and length of the second resonant channels 741, multiple Helmholtz resonators with different natural frequencies can be obtained.

[0066] When assembling a Helmholtz resonator with a second resonant channel, the volume of the second rear cavity 750 is approximately 4 cubic centimeters (cm²). 3 Up to 16cm 3The length of the second resonant channel 741 ranges from 4 mm to 20 mm, and the cross-sectional area ranges from 3 mm² to 10 mm². The Helmholtz resonator formed by these parameters can reduce the frequency response of the headphones below 1 kHz, reduce low-frequency sensitivity, and improve the flatness of the low-frequency response curve. Appropriate length and cross-sectional area of ​​the second resonant channel 741 satisfy the passive noise reduction requirements of the external space 10, improving the low-frequency sound quality of the headphones. Furthermore, the second rear shell 740 with the second resonant channel 741 is easy to mold. This embodiment avoids passive noise reduction losses caused by an excessively short length or excessively large cross-sectional area of ​​the second resonant channel 741, which would allow noise from the external space 10 to enter the ear and affect sound quality. It also avoids excessively long length or excessively small cross-sectional area of ​​the second resonant channel 741, which would increase the difficulty of manufacturing and reduce consistency.

[0067] In some embodiments of a Helmholtz resonator with a second resonant channel, the volume of the second rear cavity 750 is 6 cm³. 3 Up to 12cm 3 In some embodiments, the length of the second resonant channel 741 ranges from 6 mm to 16 mm. In some embodiments, the cross-sectional area of ​​the second resonant channel 741 ranges from 4 mm² to 8 mm². Helmholtz resonators formed within these ranges effectively improve the low-frequency sound quality of headphones and are easy to mold. For example, the volume of the second rear cavity 750 ranges from 8 cm². 3 It is equipped with two second resonant channels 741, with lengths of 10mm and 16mm respectively, and a cross-sectional area of ​​6mm² for both channels. This reduces the frequency response of the headphones at the two low-frequency points and improves the flatness of the mid-low frequency response curve.

[0068] Setting up multiple resonant channels can improve the response at different frequency points. How to arrange multiple resonant channels within the relatively small space of the headphone's rear cavity, and how to increase the length of each channel, are problems that need to be solved. (See also...) Figure 10In some embodiments, the second rear shell 740 has a main channel 7411 and multiple sub-channels (7412, 7413). The main channel 7411 has two oppositely arranged ends. One end of the main channel 7411 is connected to the second rear cavity 750, and the other end of the main channel 7411 is connected to the multiple sub-channels (7412, 7413). The ends of the multiple sub-channels (7412, 7413) away from the main channel 7411 are respectively connected to the second rear shell 740 and connected to the external space 10. The main channel 7411 and each sub-channel (7412, 7413) are respectively connected to form a second resonant channel (741a, 741b). The second resonant channel adopts a combination of the main channel and multiple sub-channels, that is, the main channel 7411 is connected to the second rear cavity 750 as a common channel, and each sub-channel is connected to the external space 10 as a branch. More resonant channels can be arranged in a smaller space, improving the frequency response at different mid-low frequency points and satisfying the compact structure of the headphone rear cavity. This increases the length of the second resonant channel, reducing the amount of external noise entering the ear through the second resonant channel and resulting in better passive noise cancellation. The number of sub-channels can be set as needed.

[0069] For example, the earphone is provided with a dual rear cavity, and the first rear shell 720 has two second resonant channels (741a, 741b). See also Figure 10 The two second resonant channels (741a and 741b) are formed by combining a main channel 7411 with multiple sub-channels (7412 and 7413). One end of the main channel 7411 is connected to sub-channels 7412 and 7413. Sub-channels 7412 and the main channel 7411 form the second resonant channel 741a, and sub-channels 7413 and the main channel 7411 form the second resonant channel 741b.

[0070] exist Figure 10In the illustrated embodiment, the main channel 7411 extends in a straight line with a length of L5. The sub-channel 7412 extends in an L-shape with a length of L3+L4, and one end of the sub-channel 7412 is directly connected to one end of the main channel 7411. The sub-channel 7413 extends in a straight line with a length of L3 and is perpendicularly connected to one end of the main channel 7411. Therefore, the length of the second resonant channel 741a is L1=L3+L4+L5, and the length of the second resonant channel 741b is L2=L3+L5. The cross-sectional areas of the two second resonant channels are equal. By taking values ​​for the volume of the second rear cavity 750, the lengths of the second resonant channels (741a, 741b), and their cross-sectional areas, the natural frequencies of the resonators corresponding to different resonant channels can be obtained. For example, the second resonant channel 741a resonates before the lower frequency of 400Hz to reduce the response magnitude of the lower low frequency point and its vicinity, while another second resonant channel 741b resonates from 600Hz to 1kHz to reduce the response magnitude of the higher low frequency point and its vicinity, thereby reducing the sensitivity at the frequency response peak and making the low-frequency curve of the headphones flatter.

[0071] In other embodiments, the main channel and the sub-channels may extend in a straight line, curve, L-shape or other manner, and the main channel and the sub-channels may be connected at different angles.

[0072] There are different implementation options for setting up the first sound unit 200 and the second sound unit 300. The first implementation is a nested, coaxial arrangement of the first sound unit 200 and the second sound unit 300: see [link / reference] Figure 1 , Figure 3 The second sound unit 300 is configured as a single unit, mounted in the middle of the side of the magnetic circuit structure 210 facing the diaphragm 230, and coaxially arranged with the first sound unit 200. This method facilitates molding and assembly. The second sound unit 300 occupies less space and is located on the side of the magnetic circuit structure 210 facing the diaphragm 230, achieving high and low frequency crossover without changing the overall size of the bass unit.

[0073] For example, the first sound-producing unit 200 is nested in the middle of the second sound-producing unit 300. The high-frequency vibration source surface 300a of the second sound-producing unit 300 and the low-frequency vibration source surface 200a of the first sound-producing unit 200 are coplanar. This can reduce the situation where different units output different frequencies of sound and cause sound separation, and make the spatial position of the instrument more accurate.

[0074] The second implementation involves a nested, non-coaxial arrangement of the first and second sound units 200: the second sound unit 300 is configured as a single unit, mounted on the side of the magnetic circuit structure 210 facing the diaphragm 230, and offset from the first sound unit 200. This offset arrangement means that their axes are spaced apart. The second sound unit 300 occupies less space and, by being located on the side of the magnetic circuit structure 210 facing the diaphragm 230, achieves dual-unit crossover for both high and low frequencies without altering the overall size of the bass unit.

[0075] The third implementation involves arranging multiple second sound-producing units 300 around each other: see [link / reference] Figure 11 , Figure 12 Multiple second-sound units 300 are configured, arranged around the outer periphery of the frame 100. These multiple second-sound units 300, which produce mid-to-high frequencies, are positioned around the first-sound unit 200, which produces low frequencies. The first-sound unit 200 and the multiple second-sound units 300 work together to produce sound, resulting in a good sense of space and achieving a stereo effect. Because the second-sound units 300 occupy relatively little space, the overall structure is smaller in both the axial and radial directions, meeting the requirements for a compact headphone structure.

[0076] For example, the three second sound units 300 are evenly distributed around the outer periphery of the first sound unit 200, roughly on the same plane, resulting in a smaller overall structure and thus a smaller overall headphone size. The specific number of second sound units 300 can be set as needed.

[0077] When multiple second sound-producing units 300 are provided, a horn 910 can be provided for each different second sound-producing unit 300 to guide the sound of the different second sound-producing units 300. The horn 910 and the grille frame 920 can be a one-piece molded structure.

[0078] There are several possible implementation methods when designing the magnetic circuit structure of the first sounding unit. The first magnetic circuit structure is an internal magnet structure, that is, a magnet is placed inside the voice coil. See [reference needed] Figure 2 , Figure 4The magnetic circuit structure 210 includes a magnetic base 212, a magnet 213, and a magnetic plate 214. The magnetic base 212 includes a plate-shaped portion 2121 and a cylindrical portion 2122 connected to the outer edge of the plate-shaped portion 2121. The magnet 213 is mounted on the plate-shaped portion 2121, and the magnetic plate 214 is mounted on the magnet 213. Both the outer peripheral surfaces of the magnet 213 and the magnetic plate 214 are spaced from the inner wall of the cylindrical portion 2122, forming an annular air gap 211. One end of the annular air gap 211 near the magnetic plate 214 forms an opening for the voice coil 220 to extend into. The cylindrical portion 2122 is mounted on the frame 100. The magnet 213 is axially magnetized, and the magnetic circuit structure 210 generates magnetic lines of force passing through the annular air gap 211, referred to as the first magnetic field.

[0079] For example, magnetic field lines can originate from the bottom of magnet 213, pass through the plate-shaped portion 2121 of magnetic base 212, travel along the cylindrical portion 2122 to the top of the cylindrical portion 2122, pass through the annular air gap 211, and return to the top of magnet 213. Voice coil 220 extends at least partially through the opening of the annular air gap 211, generating a second magnetic field when audio current passes through voice coil 220. The second magnetic field of voice coil 220 interacts with the first magnetic field of magnetic circuit structure 210, causing voice coil 220 to vibrate and drive diaphragm 230 to vibrate.

[0080] The second type of magnetic circuit structure is the external magnet structure, in which a magnet is placed outside the voice coil. The magnetic circuit structure includes a magnetic base, a ring magnet, and a magnetic ring. The magnetic base includes a plate-shaped portion and a columnar portion connected to the middle of the plate-shaped portion. The ring magnet is mounted on the plate-shaped portion, and the magnetic ring is mounted on the ring magnet. The inner circumferential surfaces of both the ring magnet and the magnetic ring are spaced from the outer circumferential surface of the columnar portion, forming an annular air gap. The end of the annular air gap near the magnetic ring forms an opening for the voice coil to extend into. The magnetic base is mounted on the frame. The ring magnet is axially magnetized, and the magnetic circuit structure generates magnetic lines of force passing through the annular air gap, called the first magnetic field.

[0081] For example, magnetic field lines can originate from the bottom of the magnet, pass through the plate-like portion of the magnetic base, travel along the columnar portion to its top, pass through the annular air gap, and then return to the top of the magnet. The voice coil extends at least partially through the opening of the annular air gap, generating a second magnetic field when an audio current passes through the voice coil. The second magnetic field of the voice coil interacts with the first magnetic field of the magnetic circuit structure, causing the voice coil to vibrate and thus driving the diaphragm to vibrate.

[0082] The third type of magnetic circuit structure is the inner and outer magnetic structure, where magnets are placed on both the inner and outer sides of the voice coil. The magnetic circuit structure includes a magnetic base, an inner magnet, an outer magnet, an inner magnetic guide plate, and an outer magnetic guide plate. The inner and outer magnets are coaxially spaced on the magnetic base. The inner and outer magnetic guide plates are correspondingly mounted on the inner and outer magnets, spaced apart. An annular air gap is formed between the assembly consisting of the inner magnet and the inner magnetic guide plate and the assembly consisting of the outer magnet and the outer magnetic guide plate. The end of the annular air gap near the inner magnetic guide plate forms an opening for the voice coil to extend into. The magnetic base is mounted on the frame. The inner and outer magnets are axially magnetized. This magnetic circuit structure generates magnetic lines of force passing through the annular air gap, known as the first magnetic field.

[0083] For example, magnetic field lines can originate from the bottom of the inner magnet, pass sequentially through the magnetic base, the outer magnet, and the outer magnetic plate, pass through the annular air gap, enter the inner magnet, and return to the top of the inner magnet. The voice coil extends at least partially through the opening of the annular air gap, generating a second magnetic field when an audio current passes through it. This second magnetic field interacts with the first magnetic field of the magnetic circuit structure, causing the voice coil to vibrate and thus driving the diaphragm to vibrate.

[0084] See Figures 2 to 4 In some embodiments, the headphones also include an elastic suspension 400 for elastically supporting the voice coil 220 and diaphragm 230 on the frame 100. Using the elastic suspension 400 to elastically support the voice coil 220 and diaphragm 230 on the frame 100 facilitates the vibration of the voice coil 220 and diaphragm 230 within a predetermined range, reducing swing polarization and improving reliability.

[0085] When specifically configuring the elastic suspension, refer to... Figure 13 The elastic suspension 400 includes an inner ring portion 410, a middle ring portion 420, and an outer ring portion 430 coaxially arranged; a first cantilever 440 connecting the inner ring portion 410 and the middle ring portion 420; and a second cantilever 450 connecting the middle ring portion 420 and the outer ring portion 430. The first cantilever 440 and the second cantilever 450 are suspended. The annular structures of the inner ring portion 410, the middle ring portion 420, and the outer ring portion 430 can be circular, elliptical, polygonal, rounded rectangle, etc. For example, these annular structures are all circular, with the diameter of the outer ring portion 430 larger than the diameter of the middle ring portion 420, and the diameter of the middle ring portion 420 larger than the diameter of the inner ring portion 410. Here, the diameter refers to the average of the inner and outer diameters of the annular structure. Figure 3The diameter of the voice coil 220 is close to that of the middle ring 420, and the voice coil 220 is connected to the middle ring 420. The inner ring 410 is located close to the second sound unit 300, and the outer ring 430 is connected to the frame 100. When the voice coil 220 vibrates up and down in the annular air gap 211, the middle ring 420 and the connection between the diaphragm 230 and the middle ring 420 vibrate accordingly. The first cantilever 440 and the second cantilever 450 provide traction on the inner and outer sides of the middle ring 420, guiding the voice coil 220 and the diaphragm 230 to vibrate within a predetermined range, effectively reducing the possibility of swing polarization or even breakage of the voice coil 220, and improving the reliability of the first sound unit 200.

[0086] For example, the elastic suspension 400 can be integrally molded, which facilitates mass production. Alternatively, the elastic suspension 400 can be divided into multiple parts, which are connected together by welding. For instance, the inner ring 410, the middle ring 420, the outer ring 430, the first cantilever 440, and the second cantilever 450 are all independent parts, which are connected to form the elastic suspension 400 as a whole. This method is suitable for manufacturing elastic suspensions 400 with large radial dimensions.

[0087] For example, the diaphragm 230 and the voice coil 220 can be connected to both sides of the central ring portion 420 respectively, so that the voice coil 220 and the diaphragm 230 are connected. For example, the voice coil 220 is welded to one side of the central ring portion 420 and the diaphragm 230 is bonded to the other side of the central ring portion 420, forming a dual compliance system that effectively controls the sway. The voice coil 220 and the diaphragm 230 are elastically supported on the frame 100 by the elastic suspension 400.

[0088] In some embodiments, to improve the assembly efficiency of the voice coil and the second sounding unit, see [reference]. Figure 3 , Figure 13 The elastic suspension 400 is configured as a flexible circuit board to provide audio current to the voice coil 220 and the second sound-producing unit 300. The outer ring 430 has an input terminal 431, the voice coil 220 is electrically connected to the middle ring 420, and the second sound-producing unit 300 is electrically connected to the inner ring 410. The flexible circuit board is provided with energized wires (not shown in the figure) and multiple sets of positive and negative terminals 411 and 421. During assembly, the voice coil 220 and the second sound-producing unit 300 are respectively placed in the middle ring 420 and the inner ring 410, and the corresponding positive and negative terminals are soldered. The end of the voice coil 220 is connected to the positive and negative terminals 421 of the middle ring 420, the second sound-producing unit 300 is connected to the positive and negative terminals 411 of the inner ring 410, and the input terminal 431 of the outer ring 430 is connected to the external circuit to complete the circuit connection and realize signal transmission. There is no need to manually lead wires to the voice coil 220 and the second sound-producing unit 300, which reduces the difficulty of the process, improves the assembly efficiency and reliability, and facilitates the realization of automated process.

[0089] For example, see Figure 2 The second sound unit 300 may be configured with an auxiliary flexible circuit board 301, which is welded to the inner ring portion 410 of the elastic suspension 400. This facilitates the fabrication of the elastic suspension 400. The auxiliary flexible circuit board 301 is bendable, which facilitates the assembly of the second sound unit 300 and the elastic suspension 400. The second sound unit 300 is adjusted to a predetermined position so that the bass vibration source surface 200a and the treble vibration source surface 300a are as coplanar as possible. Alternatively, the second sound unit 300 can also be directly integrated onto the inner ring portion 410 of the elastic suspension 400.

[0090] For example, see Figure 13 The outer ring 430 of the elastic suspension 400 can be provided with two sets of input terminals 431, which serve as signal input terminals for the second sound unit 300 and the voice coil 220 respectively, enabling the separate transmission of different audio signals. It is understandable that the outer ring 430 can be provided with one or more sets of input terminals 431 to achieve signal transmission.

[0091] Furthermore, the flexible circuit board can be electrically connected to a System-in-a-Package (SIP) chip to drive the first speaker unit 200 and the second speaker unit 300. See also... Figure 14 A wiring board 460 may be installed on the side of the frame 100 facing away from the diaphragm 230 or on the outer wall of the magnetic base. The wiring board 460 is electrically connected to the flexible circuit board and has wiring terminals to facilitate the connection of the speaker to external circuits.

[0092] In some embodiments, to improve the fatigue resistance of the cantilever, the cantilever of the elastic suspension is made relatively long within a limited space, see reference. Figure 13 Both the first cantilever 440 and the second cantilever 450 are meanderingly designed. Taking the first cantilever 440 as an example, the first cantilever 440 includes a first radial extension arm 441, a circumferential extension arm 442, and a second radial extension arm 443 connected in sequence. The first radial extension arm 441 and the second radial extension arm 443 are located on different radial directions, which allows the first cantilever 440 to be relatively long while meeting the requirements of limited space. The second cantilever 450 is similar and will not be described in detail.

[0093] In some embodiments, to ensure symmetrical vibration on both sides of the voice coil in the radial direction, effectively reduce and suppress wobble, and improve sound quality, a centrally symmetrical cantilever arrangement can be used. (See also...) Figure 13There are multiple first cantilever arms 440, which are symmetrically arranged around the axis of the middle ring portion 420. Similarly, there are multiple second cantilever arms 450, which are also symmetrically arranged around the axis of the middle ring portion 420. That is, the bending methods of all first cantilever arms 440 and all second cantilever arms 450 are identical. For example, three first cantilever arms 440 are symmetrically arranged between the inner ring portion 410 and the middle ring portion 420, and four second cantilever arms 450 are symmetrically arranged between the middle ring portion 420 and the outer ring portion 430. The specific number of cantilever arms is not limited.

[0094] As an example, the elastic suspension, voice coil, diaphragm, and magnetic circuit structure all adopt a centrally symmetrical structure, ensuring that the three factors of mass, compliance, and magnetic field strength are completely centrally symmetrical, which is beneficial to improving the output sound quality of the first sound unit. Among them, compliance refers to the flexibility of the axial movement of the vibrating component.

[0095] In some embodiments, to increase the sound output area of ​​the first sound-emitting unit to obtain better sound quality, see [reference needed]. Figure 13 The ratio between the diameter difference between the outer ring 430 and the middle ring 420 and the diameter difference between the middle ring 420 and the inner ring 410 ranges from 0.6 to 1.4. Here, the diameter refers to the average of the inner and outer diameters of the annular structure. Thus, the voice coil 220 is approximately positioned midway between the inner and outer edges of the diaphragm 230, increasing the sound output area of ​​the first sound-producing unit 200 and improving its sound output performance.

[0096] When installing the second sound unit, to ensure that the high-frequency vibration source surface and the low-frequency vibration source surface are set on the same plane, refer to [reference needed]. Figure 2 A bracket 500 is provided in the middle of the side of the magnetic circuit structure 210 facing the diaphragm 230, and the second sound unit 300 is mounted on the bracket 500. This raises the position of the second sound unit 300 relative to the magnetic circuit structure 210 by a certain distance, so that the connection between the diaphragm 230 and the voice coil 220 is coplanar with the second sound unit 300. The outer diameter of the bracket 500 is smaller than the outer diameter of the frame 100, just enough to provide support for the second sound unit 300.

[0097] For example, when the first magnetic circuit structure 210 is used, the upper side of the magnetic circuit structure 210 is a magnetic guide plate 214, and the upper surface of the magnetic guide plate 214 is provided with an assembly groove 2141 to facilitate the positioning and assembly of the bracket 500, thereby improving assembly efficiency. It is understood that when other magnetic circuit structures are used, an assembly groove can also be provided to position and assemble the bracket.

[0098] When installing the elastic suspension 400, the inner ring 410 of the elastic suspension 400 can be connected to the bracket 500, and the outer ring 430 can be connected to the frame 100. This facilitates the assembly of the elastic suspension 400 and allows the elastic suspension 400 to be made relatively large within a limited space. Correspondingly, the first cantilever 440 and the second cantilever 450 can be made relatively long to meet the elastic support requirements of the elastic suspension 400 for the voice coil 220 and the diaphragm 230.

[0099] In some embodiments, to achieve better sound quality by making the air pressure on both sides of the second sound unit more similar, see [reference needed]. Figure 3 The magnetic circuit structure 210 has an axial through hole 215 in the middle, and the bracket 500 has a mounting groove 501 for mounting the second sound unit 300, which is connected to the axial through hole 215. This allows the second sound unit 300 to be stably mounted in the mounting groove 501. The inner side of the second sound unit 300 is connected to the outside through the axial through hole 215 of the magnetic circuit structure 210, reducing the negative pressure inside the second sound unit 300 and making the air pressure on both sides of the second sound unit 300 closer, which is beneficial to improving the output sound effect of the second sound unit 300. The second sound unit 300 can be mounted on the bracket 500 by adhesive, snap-fit, tight fit, or other methods.

[0100] For example, when using the first magnetic circuit structure 210, through holes are provided in the middle of the plate-shaped portion 2121 of the magnetic base 212, the middle of the magnet 213, and the middle of the magnetic plate 214, thus forming an axial through hole 215 in the magnetic circuit structure 210. When using other magnetic circuit structures, an axial through hole can also be formed by opening through holes in the corresponding structure, thereby cooperating with the mounting groove of the bracket to achieve communication between the inside of the second sound unit and the outside.

[0101] In some embodiments, to achieve better sound quality by making the air pressure on both sides of the diaphragm of the first sound unit more similar, see [reference needed]. Figure 2 , Figure 3 The sidewall of the bracket 500 has vent holes 502, and the annular air gap 211 and the axial through hole 215 are connected through the vent holes 502. In this way, the inner side of the diaphragm 230 is connected to the outside through the vent holes 502 of the bracket 500 and the axial through hole 215 of the magnetic circuit structure 210, reducing the negative pressure inside the diaphragm 230 and making the air pressure on both sides of the diaphragm 230 closer, which is beneficial to improving the output sound effect of the first sound unit 200. For example, the bracket 500 is generally cylindrical, and the sidewall of the bracket 500 can be provided with multiple vent holes 502 along the circumference, facilitating the flow of gas between the annular air gap 211 and the axial through hole 215.

[0102] When assembling the diaphragm onto the bracket and frame, refer to... Figure 4The bracket 500 has a first positioning groove 503, and the frame 100 has a second positioning groove 101. A first support ring 601 is provided at the first positioning groove 503, and a second support ring 602 is provided at the second positioning groove 101. The inner edge of the diaphragm 230 is connected to the first support ring 601, and the outer edge of the diaphragm 230 is connected to the second support ring 602. This facilitates the assembly of the diaphragm 230 onto the bracket 500 and the frame 100, so that the bass vibration source surface 200a at the connection between the voice coil 220 and the diaphragm 230 can be as coplanar as possible with the treble vibration source surface 300a of the second sound unit 300. The first support ring 601 and the second support ring 602 are respectively disposed in the first positioning groove 503 and the second positioning groove 101. This effectively utilizes the axial space, making the structure compact, and positions the inner and outer edges of the diaphragm 230 higher than the connection between the voice coil 220 and the diaphragm 230, which facilitates the formation of a larger space for the diaphragm 230 to vibrate, thereby improving the output sound effect of the first sound unit 200. The shapes of the first support ring 601 and the second support ring 602 are set according to the shape of the diaphragm 230.

[0103] In some embodiments, a double-arched diaphragm may be used to improve the stiffness of the diaphragm. See also Figure 3 The diaphragm 230 includes a first annular portion 231 and a second annular portion 232 coaxially arranged. The outer edge of the first annular portion 231 is connected to the inner edge of the second annular portion 232. The radial cross-sections of the first annular portion 231 and the second annular portion 232 are arched. A voice coil 220 is connected at the junction between the first annular portion 231 and the second annular portion 232. The concave surfaces of both the first annular portion 231 and the second annular portion 232 face the magnetic circuit structure 210, which helps to improve the stiffness of the diaphragm 230 and the reliability of its vertical vibration. It is understood that the radial cross-section of either the first annular portion 231 or the second annular portion 232 can also be individually arched, which would also improve the stiffness of the diaphragm 230. The annular shape in the diaphragm 230 can be circular, elliptical, polygonal, rounded rectangular, etc., and the first annular portion 231 and the second annular portion 232 are set to corresponding shapes, which are not limited here.

[0104] For specific settings of the second sound unit, please refer to [reference needed]. Figure 3 The second speaker unit 300 is a microelectromechanical speaker (MEMS speaker), a piezoelectric ceramic sound-producing plate, an electrostatic speaker, or a flat panel speaker. These second speaker units 300 have a compact structure and occupy less space, making them easy to assemble onto one side of the magnetic circuit structure 210 of the first speaker unit 200 or the outer periphery of the frame 210, thus integrating the second speaker unit 300 with the first speaker unit 200, improving sound quality, and reducing the space occupied by the speaker.

[0105] When setting up the speaker frame and the first speaker unit, refer to... Figure 3The ratio between the outer diameter of the frame 100 and the distance from the bottom surface of the magnetic circuit structure 210 to the bass resonant surface 200a ranges from 1 to 9. The outer diameter of the frame 100 refers to its maximum diameter, i.e., the diameter of its outer edge. The bottom surface of the magnetic circuit structure 210 refers to the side of the magnetic circuit structure 210 facing away from the diaphragm 230. This loudspeaker coaxially positions the second sounding unit 300 with the first sounding unit 200, and the tweeter resonant surface 300a and the bass resonant surface 200a are coplanar, fully utilizing axial space to simultaneously meet the needs of both high and low frequencies, thus improving high-frequency response.

[0106] When assembling the basket frame and magnetic circuit structure, refer to Figure 3 The basin stand 100 has a through hole 102, and the magnetic circuit structure 210 is at least partially assembled within the through hole 102; the inner wall of the through hole 102 is provided with a stop arm 103, which, in conjunction with... Figure 2 The magnetic circuit structure 210 has a limiting groove 216, and the stop arm 103 engages with the limiting groove 216 to limit the position of the magnetic circuit structure 210 relative to the basin frame 100. After assembling the magnetic circuit structure 210, it is inserted into the through hole 102 from the bottom end of the basin frame 100. When the stop arm 103 of the basin frame 100 is inserted into the limiting groove 216 of the magnetic circuit structure 210, the stop arm 103 blocks the magnetic circuit structure 210, achieving axial and circumferential positioning of the magnetic circuit structure 210. The magnetic circuit structure 210 and the basin frame 100 can be connected by bonding, snapping, tight fitting, or other methods.

[0107] For example, when using the first magnetic circuit structure 210, the cylindrical portion 2122 of the magnetic guide seat 212 has a limiting groove 216 at one end edge away from the plate portion 2121, and the through hole 102 of the basin frame 100 has a stop arm 103 at one end edge near the diaphragm 230. When assembling the magnetic circuit structure 210 and the basin frame 100, the axial positioning of the magnetic circuit structure 210 and the basin frame 100 is achieved by the stop arm 103 engaging with the limiting groove 216.

[0108] See Figure 1 , Figures 8 to 11 This application provides an electronic device including the aforementioned headphones. The electronic device can be a mobile phone, tablet computer, smartphone, smart glasses, AR (Augmented Reality) / VR (Virtual Reality) device, hearing aid, headphones, speaker, etc. For example, the electronic device is a pair of headphones, which includes a headband and two headphones, each corresponding to one end of the headband.

[0109] Since this electronic device adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0110] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An earphone, characterized in that, include: Earphone shell, frame, first driver unit, and second driver unit; The basin is mounted on the earphone shell; The first sound-producing unit includes a magnetic circuit structure mounted on the frame, a diaphragm, and a voice coil connected to the diaphragm. The magnetic circuit structure has an annular air gap. The diaphragm is spaced apart from the magnetic circuit structure. At least a portion of the voice coil is housed within the annular air gap. The connection between the voice coil and the diaphragm forms a bass vibration source surface. The second sound-producing unit is installed on the side of the magnetic circuit structure facing the diaphragm or on the outer periphery of the frame. The second sound-producing unit has a high-frequency vibration source surface, and the high-frequency vibration source surface and the low-frequency vibration source surface face the same direction. The second sound unit is provided with a horn, which has a first end and a second end that are arranged opposite to each other; the earphone shell is provided with a grille frame, the horn and the grille frame are an integral structure, the second end of the horn is connected to the grille frame, the first end of the horn is fixed or abutted against the outer periphery of the second sound unit, and the edge of the grille frame is connected to the earphone shell.

2. The earphone according to claim 1, characterized in that, The earphone shell is provided with an ear cup, and the ear cup and the earphone shell form a front cavity. The first sound unit and the second sound unit are both arranged facing the front cavity.

3. The earphone according to claim 2, characterized in that, The horn is located inside the front cavity, with the outer periphery of the first end and the second sound unit aligned, and the second end facing the sound output direction of the second sound unit.

4. The earphone according to claim 3, characterized in that, The grille frame is disposed on the diaphragm, and the grille frame has a plurality of sound outlet holes for the first sound-emitting unit to emit sound.

5. The headphones according to any one of claims 1 to 4, characterized in that, The earphone shell includes an annular partition and a first rear shell; the front side of the annular partition and the bass vibration source surface face the same direction, and the frame is installed in the inner hole of the annular partition; The first rear shell is connected to the rear side of the annular partition, and the first rear shell covers the rear of the first sound unit. The inner side of the first rear shell, the rear side of the annular partition, and the rear side of the first sound unit form a first rear cavity. The first rear shell has a first resonant channel communicating with the first rear cavity. The basin frame has a first vent hole and / or the magnetic circuit structure has a second vent hole, and the annular air gap and the first rear cavity are connected through the first vent hole and / or the second vent hole.

6. The earphone according to claim 5, characterized in that, The earphone shell also includes a second rear shell, which is connected to the rear side of the annular partition. The inner side of the second rear shell, the rear side of the annular partition, and the outer side of the first rear shell form a second rear cavity. The first rear cavity and the second rear cavity are connected through the first resonant channel. The annular partition has a through hole that connects the front cavity and the second rear cavity.

7. The earphone according to claim 6, characterized in that, The second rear shell has one or more second resonant channels communicating with the second rear cavity and the external space.

8. The earphone according to claim 7, characterized in that, The second rear shell has a main channel and multiple sub-channels. The main channel has two oppositely arranged ends. One end of the main channel is connected to the second rear cavity, and the other end of the main channel is connected to multiple sub-channels. The ends of the multiple sub-channels away from the main channel are respectively connected to the second rear shell and connected to the external space. The main channel and each sub-channel are respectively connected to form a second resonant channel.

9. The headphones according to claim 7 or 8, characterized in that, The volume of the second rear cavity is 4 cm. 3 Up to 16cm 3 .

10. The headphones according to claim 7 or 8, characterized in that, The length of the second resonant channel ranges from 4 mm to 20 mm.

11. The headphones according to claim 7 or 8, characterized in that, The cross-sectional area of ​​the second resonant channel ranges from 3 mm² to 10 mm².

12. The headphones according to any one of claims 1 to 11, characterized in that, The pronunciation frequency of the second pronunciation unit is greater than that of the first pronunciation unit.

13. The headphones according to any one of claims 1 to 12, characterized in that, The second sound unit is configured as one, and the second sound unit is installed in the middle of the side of the magnetic circuit structure facing the diaphragm. The second sound unit is coaxially arranged with the first sound unit. Alternatively, the second sound unit can be configured as one unit, which is installed on the side of the magnetic circuit structure facing the diaphragm, and the second sound unit is eccentrically positioned relative to the first sound unit; Alternatively, the second sound unit may be configured as a plurality of units, which are arranged around the outer periphery of the basin frame.

14. The headphones according to any one of claims 1 to 13, characterized in that, The magnetic circuit structure includes a magnetic base, a magnet, and a magnetic plate mounted on the magnet; the magnetic base includes a plate-shaped portion and a cylindrical portion connected to the outer edge of the plate-shaped portion, the magnet is mounted on the plate-shaped portion, the outer peripheral surface of the magnet and the outer peripheral surface of the magnetic plate are spaced from the inner wall of the cylindrical portion to form the annular air gap, one end of the annular air gap near the magnetic plate forms an opening for the voice coil to extend into, and the cylindrical portion is mounted on the frame; Alternatively, the magnetic circuit structure includes a magnetic base, an annular magnet, and a magnetic ring. The magnetic base includes a plate-shaped portion and a columnar portion connected to the middle of the plate-shaped portion. The annular magnet is mounted on the plate-shaped portion, and the magnetic ring is mounted on the annular magnet. The inner circumferential surface of the annular magnet and the inner circumferential surface of the magnetic ring are spaced apart from the outer circumferential surface of the columnar portion to form an annular air gap. One end of the annular air gap near the magnetic ring forms an opening for the voice coil to extend into. The magnetic base is mounted on the frame. Alternatively, the magnetic circuit structure includes a magnetic base, an inner magnet, an outer magnet, an inner magnetic plate, and an outer magnetic plate. The inner magnet and the outer magnet are coaxially spaced on the magnetic base. The inner magnetic plate and the outer magnetic plate are correspondingly mounted on the inner magnet and the outer magnet, respectively. The inner magnetic plate and the outer magnetic plate are spaced apart. An annular air gap is formed between the assembly formed by the inner magnet and the inner magnetic plate and the assembly formed by the outer magnet and the outer magnetic plate. One end of the annular air gap near the inner magnetic plate forms an opening for the voice coil to extend into. The magnetic base is mounted on the frame.

15. The headphones according to any one of claims 1 to 14, characterized in that, The second sound unit is a microelectromechanical speaker, a piezoelectric ceramic sound-producing plate, an electrostatic speaker, or a flat panel speaker.

16. The headphones according to any one of claims 1 to 15, characterized in that, The basin stand has a through hole, and the magnetic circuit structure is at least partially assembled in the through hole; the inner wall of the through hole is provided with a stop arm, and the magnetic circuit structure has a limiting groove, and the stop arm engages with the limiting groove to limit the position of the magnetic circuit structure relative to the basin stand.

17. An electronic device, characterized in that, Includes the headphones as described in any one of claims 1 to 16.

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