cooling device

Abstract

The invention provides a cooling device (1) having a housing (2) for accommodating at least one heat-emitting electronic component (11), in particular at least one power electronics component, and having a cooling system for cooling the at least one heat-emitting electronic component (11), wherein the at least one heat-emitting electronic component (11) is arranged in the housing (2) and the cooling system comprises at least one heat exchanger, wherein at least one profile element (5) is provided as heat exchanger, which is made of at least one thermally conductive material and is arranged in the housing (2), wherein the at least one profile element (5) is fixed in the housing (2) on the end side by at least one fixed accommodation element (6, 7) in the housing (2).

Description

Technical Field

[0001] The present invention relates to a cooling device having a housing for accommodating at least one heat-generating electronic component, particularly at least one power electronic component, and a cooling system for cooling at least one heat-generating electronic component, wherein at least one heat-generating electronic component is arranged within the housing, and the cooling system includes at least one heat exchanger. Background Technology

[0002] The use of cooling devices with housings and cooling systems for cooling heat-generating electronic components is known in the prior art. In most cases, the electronic components are integrated into the housing, the core function of which is to protect the components from media such as dust and liquid particles, as well as to prevent shock loads and excessively high or low temperatures. Heat-generating electronic components are typically arranged on a circuit board. These components should not exceed a predetermined or specific temperature, otherwise they will be damaged or at least cease to function properly. It is known that heat must be dissipated from the heat-generating electronic components to maintain this temperature. For this purpose, it is known to provide a cooling mechanism of predetermined or suitable dimensions. It is also known that if at least a portion of the electronic component must or should be cooled, the housing is constructed such that the heat source is in thermal contact with the housing, which is then cooled from its outside by one or more cooling plates, i.e., outside the housing. These cooling plates can have liquid flowing through them; that is, they are liquid-cooled plates.

[0003] For example, DE 10 2018 002 980 A1 discloses a heat exchanger unit comprising at least one thermoelectric element, particularly a Peltier element, at least one heat exchanger element for heat exchange with the thermoelectric element, and at least one distributor element for supplying or discharging a heat exchange medium flowing through the at least one heat exchanger element. At least one retaining frame is provided to hold the at least one heat exchanger element at the at least one thermoelectric element. The distributor element is connected to the heat exchanger element and the retaining frame. However, in this configuration, only a retaining frame is provided, without a housing that completely surrounds the thermoelectric element. Therefore, this structure with a retaining frame is unsuitable for environments with dust and liquid particles, and this could prove problematic for electronic components.

[0004] As disclosed in EP 3 418 653 A2, an apparatus for tempering a temperable volume or a volume to be tempered includes at least one wall surrounding the temperable volume, providing separation of cooling and heating functions for the tempering apparatus. At least one wall for heating the at least one volume to be tempered or tempered can be heated. Furthermore, at least one cooling device is provided for cooling the temperable volume. This at least one cooling device includes at least one thermoelectric element and at least one heat exchanger for dissipating heat from the thermoelectric element. The heat exchanger can be an air heat exchanger or a medium-flow heat exchanger. Summary of the Invention

[0005] In existing solutions, cooling is achieved through a cooling plate, but the high weight of both the casing and the cooling plate has proven to be disadvantageous. Similarly, when using a cooling plate through which water flows, such inefficient cooling has proven to be disadvantageous due to the high thermal resistance between the heat sources and the cooling medium.

[0006] Therefore, the present object of the present invention is to provide a cooling device having a housing for accommodating at least one heat-generating electronic component, particularly at least one power electronic component, and a cooling system for cooling at least one heat-generating electronic component, wherein at least one heat-generating electronic component is arranged within the housing, and the cooling system includes at least one heat exchanger, wherein effective and space-optimized cooling of at least one heat-generating electronic component arranged within the housing is achieved.

[0007] For the cooling device according to the foregoing portion of technical solution 1 of this application, this task is thus solved by providing at least one profile element as a heat exchanger, which is made of at least one thermally conductive material and arranged in a housing, wherein at least one profile element is fixed in the housing at its end by at least one fixing receiving element in the housing. Further embodiments of the invention are defined in the dependent other technical solutions.

[0008] A cooling device is achieved by arranging a cooling mechanism in the form of at least one profile element close to at least one heat-generating electronic component. This profile element is designed as a heat exchanger and arranged within the housing of the cooling device, resulting in significantly improved cooling of the component or components compared to prior art solutions. Here, at least one profile element is mechanically fixed at its end within the housing to hold it in place. The at least one profile element is then positioned with optimal spacing relative to the at least one heat-generating electronic component or the circuit board in which it is arranged or located, thus achieving excellent heat conduction to dissipate heat from and supply heat to the at least one heat-generating electronic component. In principle, fixing at least one profile element inside the housing can be achieved by clamping the at least one profile element for cooling within the longitudinally extending region between clamping elements within the housing. However, at the clamping points between the clamping elements, area available for cooling the heat-generating electronic component is lost. Therefore, alternatively, according to the invention, at least one profile element is mechanically fixed at its end within the housing by at least two retaining elements. At least one profile element is received therein and simultaneously positioned. This avoids the need for additional space between clamping elements that hold at least one profile component within the housing. Furthermore, the total installation space of the cooling device can be minimized because the arrangement of the clamping elements within the housing, with the profile components sandwiched between them, eliminates the need for additional installation space for clamping the profile components. Therefore, the space occupied by those clamping elements within the housing can now be used to cool other electronic components. While maintaining or providing a relatively large installation space than actually required for cooling, more heat-generating electronic components can be arranged and cooled within it compared to solutions using existing technology. The installation space required for cooling heat-generating electronic components can also be constructed as small as possible, thus smaller than existing solutions, because more cooling surface on each profile component is available for heat dissipation due to its end-side reception and fixation in the fixed receiving element, as this cooling surface is not lost due to clamping between the clamping elements.

[0009] Advantageously, the fixed receiving element includes at least one flange, at least one connecting portion, and at least one receiving opening for receiving at least one profile element, wherein each connecting portion is used to connect the fixed receiving element to a fluid connector for supplying and discharging cooling medium to and from the profile element. Thus, the fixed receiving element includes, on one hand, a flange with at least one receiving opening arranged therein. It is particularly configured as a slit to securely receive and hold at least one profile element therein. To achieve an optimized arrangement of the mounting space for the fixed receiving element within the housing of the cooling device, the fixed receiving element also has at least one connecting portion that can connect to the respective connecting portions of the fluid connectors, through which connection can be made to, in particular, a cooling medium conduit for supplying and discharging cooling medium to and from the profile element of the cooling device. Therefore, at least one connecting portion may have at least one circumferential wall forming the actual connecting portion. In particular, it can be received within the respective connecting portions of the fluid connectors for supplying and discharging the cooling medium, thereby being engaged with the latter. Here, in particular, the connecting portion of the fixed receiving element can be engaged with the connecting portion of the fluid connector. At least one sealing element for sealing against leakage of cooling medium can be or advantageously arranged within at least one circumferential wall of at least one connection of the fixed receiving element. The at least one sealing element may extend, in particular, within the connection of the fixed receiving element, or within another section of the connection and / or fluid connector, for supplying and discharging cooling medium to and from the profile element. This makes it possible to ensure a complete seal, preventing unwanted leakage of cooling medium from the connector to the outside.

[0010] To allow at least one profile element to pass through in a sealed manner, at least one sealing element advantageously has at least one slit-shaped through-hole. At least one flange also advantageously includes at least one receiving opening, wherein the at least one receiving opening is designed as a slit-shaped through-hole for allowing at least one profile element to pass through and be mechanically secured. Thus, each end of the profile element passes not only through the flange portion securing the receiving element within the area of ​​the slit-shaped through-hole or receiving opening of the flange portion, but also through a corresponding slit-shaped through-hole in the at least one sealing element. In this way, the profile element is not only mechanically secured at its end but also correspondingly sealed to prevent leakage of cooling medium outwards in the respective joint connection areas.

[0011] The housing may further advantageously comprise at least two housing portions, each having at least one receiving opening at each of its two opposing ends. In particular, the at least two housing portions may each have at least one groove at each of its two opposing ends, wherein, after the housing portions are joined together to form a closed housing, the respective grooves in the housing portions form their respective receiving openings at the opposing ends of the housing. The receiving openings on the housing or the respective grooves on the housing portions are used to receive respective fluid connectors for supplying and discharging cooling medium to and from at least one profile element within the housing. Thus, each fluid connector for supplying and discharging cooling medium to and from at least one profile element within the housing of the cooling device is arranged in a receiving opening within the housing. Therefore, a total of two fluid connectors are arranged in the respective receiving openings at the two opposing ends of the housing. In principle, more than one fluid connector may also be arranged at each end of the housing. However, typically, one fluid connector at each housing end is sufficient. Each fluid connector can protrude its respective connecting portion into a receiving opening in the housing, corresponding to, for example, a groove in two housing halves attached to each other, wherein the flange of a fixed receiving element for receiving a profile element rests against the corresponding inner side of the housing, covering at least one receiving opening for receiving the fluid connector. In this case, the fixed receiving element engages with the fluid connector with its connecting portion. Therefore, the fixed receiving element not only mechanically fixes at least one profile element inside the housing, but also additionally stabilizes the individual fluid connectors, because the connecting portions of the fixed receiving element and the fluid connectors engage with each other, particularly in a form-fit and / or material-fit manner, or are arranged and accommodated by each other. At least one sealing element can be configured such that it is axially supported by a flange between the end section of the connecting portion of the fixed receiving element and the inner side of the fluid connector, while being radially supported on one side on the inner side of the connecting portion of the fixed receiving element and on the other side on the inner side of a section of the fluid connector. This results in a very compact, space-optimized arrangement of the fluid connector, the fixed housing element, and at least one sealing element within the various housings of the cooling device housing. In this arrangement, or in this housing system consisting of the fluid connector, the fixed housing element, and the sealing element, at least one profile element of the cooling device can be well mechanically and securely housed and sealed within the various housing openings of the housing.

[0012] At least one profile element can be, in particular, an aluminum profile element, such as an extruded aluminum profile. Furthermore, it can advantageously have several internal flow channels through which the cooling medium can flow or be circulated. Instead of aluminum, other materials with good thermal conductivity can be used for the profile element serving as a heat exchanger. The internal flow channels can also have varying widths. This also applies to the web regions or webs arranged within the profile element, which stabilize the shape of the profile element and are positioned between the flow channels. The width of the web regions or webs can also be specifically optimized for the application. If at least one profile element is made of aluminum or an aluminum profile, especially an extruded aluminum profile, very good cooling can be achieved even at low volumetric flow rates when flowing through the profile element configured as a liquid heat exchanger, especially since a very thin wall thickness of the profile element is advantageous, as it provides a large surface area available for heat transfer.

[0013] Depending on the application, such as in the automotive field where vibrations may occur during vehicle operation, at least one profile element can be additionally clamped and secured to at least one fixed receiving element using at least one clamp. It can be connected to, particularly at least partially engaged with, or be engaged with the fixed receiving element. Specifically, at least one clamp is at least partially engaged with the flange portion of the fixed receiving element. Furthermore, the flange portion may have at least one fixing and / or fastening device on one of its surfaces, to which the at least one clamp can be connected. For example, at least one clamp can be clamped onto the flange portion of the fixed receiving element. To enable at least one profile element to be secured by at least one clamp, the at least one clamp further advantageously includes at least one slit-shaped opening through which the profile element can extend.

[0014] In addition, at least one fastening device can be provided for securing at least one clamp within the housing. For example, a pin-type fastening device engaged at or into the clamp is arranged in the housing portion. The pin-type fastening device can be arranged, in particular, on either side or adjacent to receiving openings at two opposing ends of the housing or to corresponding recesses in the housing portion. For example, the pin-type fastening device can engage with a fixing and / or fastening device arranged at the flange of the fixing receiving element, or with a corresponding through-hole of at least one clamp, thereby securing not only at least one clamp to the fixing receiving element and within the housing, but also simultaneously securing the fixing receiving element to its position adjacent to the receiving opening in the housing. Thus, for example, at least one profile element can be pre-assembled at its end with at least one clamp, the fixing receiving element, and a fluid connector, and if necessary, at least one sealing element can be inserted. This pre-assembled unit, consisting of the profile element, clamp, fixing receiving element, fluid connector, and, if necessary, sealing element, can be pushed onto the pin-type fastening device and engaged in the corresponding recess in the housing portion. Subsequently, at least one additional housing component is attached to these pre-installed components of the cooling device, and the housing components are interconnected, particularly in terms of material fit.

[0015] To support the profile element extending longitudinally within the housing, and particularly to prevent bending, at least one support device can be provided within the housing for supporting the at least one profile element. For example, at least one pin-shaped or tapered-to-pin-shaped support device can be arranged and project inward from the outside of the housing. The profile element can be supported on at least one pin-shaped or tapered-to-pin-shaped support device. For example, a plurality of support devices, such as a plurality of pin-shaped or tapered-to-pin-shaped support devices, arranged adjacent to or offset from each other can be provided to support the profile element over its entire width. In particular, at least one support device can be arranged to extend through approximately half of the longitudinal extension direction of the at least one profile element through the housing of the cooling device, thereby providing approximately central support for the at least one profile element within the housing, wherein the central support relates to the total length of the profile element extending within the housing of the cooling device.

[0016] Furthermore, it is advantageous that at least one profile element and / or the housing is provided with at least one retaining and supporting element for maintaining the spacing between at least one circuit board and at least one profile element. For example, at least one circuit board can be housed on such a retaining and supporting element, such as four such retaining and supporting elements, and detachably connected thereto, for example by screws. One or more heat-dissipating electronic components can be or will be arranged at or on the circuit board.

[0017] Furthermore, it is possible to arrange at least one flat plate element on or above at least one profile element to reduce the spacing between the profile element and at least one heat-generating electronic component and / or the circuit board on which at least one heat-generating electronic component is disposed. For example, it is possible that at least one flat plate element is connected to at least one profile element by a material-fitting manner, particularly by soldering. Thus, it is advantageous to arrange at least one flat plate element on the profile element, rather than using an outer profile to approach heat-generating electronic components arranged at different heights on the circuit board. Due to the material-fitting connection between at least one flat plate element and at least one profile element, smooth heat transfer can be achieved from the heat-generating electronic component to the flat plate element, and from the latter to the profile element, as well as the cooling medium flowing through it.

[0018] At least one profile element and at least one circuit board with heat-dissipating electronic components can also be interconnected, particularly detachably or non-detachably. For this purpose, one or more spacing-maintaining and mounting elements can be provided, which engage on the edge side of at least one profile element on one hand, and include at least one connecting device for detachable connection, particularly to the circuit board. In this way, an ideal spacing can be set and maintained between at least one profile element and at least one circuit board with heat-dissipating electronic components mounted thereon.

[0019] Since at least one profile element may bend in an undesirable manner in the absence of supporting elements and / or assembly elements connecting the circuit board and profile element to each other, reinforcement devices for the profile element can also be provided, particularly those that are engaged into at least one profile element. For example, it can extend within at least one flow channel inside at least one profile element. In this regard, the design of at least one reinforcement element in the form of a reinforcing rod is particularly suitable, as it can be smoothly engaged into at least one internal flow channel of at least one profile element, thereby reinforcing it longitudinally. Attached Figure Description

[0020] For a more detailed description of the invention, please refer to the embodiments of the invention described in more detail below with reference to the accompanying drawings. These embodiments are illustrated in the following drawings.

[0021] Figure 1 This is an exploded perspective view of a first embodiment of the cooling device according to the present invention, including two housing halves, a profile element, two fixed receiving elements, two sealing elements, and two fluid connectors.

[0022] Figure 2 It is based on Figure 1An exploded perspective view of the cooling device, in which the components of the profile element, two fixed housing elements, two sealing elements and two fluid connectors are pre-assembled together so as to be housed in and at the two housing halves.

[0023] Figure 3 It is based on Figure 1 and 2 A perspective view of a cooling device, wherein its housing is closed by joining two housing halves together, and the cooling device is assembled.

[0024] Figure 4 It is through according to Figure 3 A longitudinal sectional view of the assembled cooling device.

[0025] Figure 4a It is based on Figure 4 A detailed cross-sectional view of the cooling device in one side of the area, with a fluid connector attached and engaged therein, which houses the connection of the fixed connector element, the sealing element, and the end of the profile element.

[0026] Figure 5 Compared to Figure 1 The illustrated embodiment of the cooling device according to the invention is an improved second embodiment of the invention, wherein the fixing receiving element is further provided with or can be connected to a clamp for clamping and fixing the profile element.

[0027] Figure 6 This is a detailed cross-sectional view of the end of a cooling device according to a third embodiment of the present invention, wherein a second embodiment of a clamp for clamping and securing the profile in a fixed receiving element is arranged in the fixed receiving element.

[0028] Figure 7 It is based on Figure 5 An exploded perspective view of the second assembly step of the cooling device, wherein the components of the profile elements, clamps, fixing and receiving elements, sealing elements and fluid connectors have been pre-assembled so that the unit can be further finalized in the lower housing half of the cooling device housing.

[0029] Figure 8 It is based on assembly Figure 5 An exploded perspective view of the third assembly step of the cooling device, wherein the unit in the lower housing half, consisting of profile elements, clamps, fixing and receiving elements, sealing elements and fluid connectors, is assembled by pushing it onto pin-type fixing devices within the housing half.

[0030] Figure 9 This is an exploded perspective view of another embodiment of the cooling device according to the invention, wherein, compared with the one according to... Figure 1 The implementation method differs in that a support device that gradually transitions into a pin shape is arranged within at least one half of the housing to support the profile element within the housing.

[0031] Figure 10 This is a further exploded view of a profile element according to the invention, with a flat plate element attached thereon and retaining and supporting elements arranged on the edge side, and a circuit board on which heat-dissipating electronic components are arranged.

[0032] Figure 11 This is a side view and a partial sectional view of another embodiment of the profile element according to the invention, which is housed in a retaining and supporting element on the edge side, wherein a circuit board on which heat-dissipating electronic components are arranged is also fixed.

[0033] Figure 12 It is a perspective view of the arrangement of the accommodating and supporting elements, corresponding to Figure 11 It contains profile components, but no circuit board is fixed to them.

[0034] Figure 12a It is based on Figure 12 A detailed view of the area in which the arranged profile elements are housed within one of the retaining and supporting elements.

[0035] Figure 13 It is a front and partial sectional view of a profile element according to the invention, with two reinforcing rods engaged in its flow channel.

[0036] Figure 14 This is a front and partial sectional view of a profile element according to the invention, with reinforcing bars arranged in its flow channels.

[0037] Figure 15 This is a front and partial sectional view of another embodiment of the profile element according to the invention, with reinforcing devices arranged therein. Detailed Implementation

[0038] exist Figures 1 to 4a The image shows a first embodiment of the cooling device 1. It includes a housing 2 formed by two housing halves 21 and 22, two fluid connectors 3 and 4, a profile element 5, two fixed receiving elements 6 and 7, and two sealing elements 8 and 9. Figures 1 to 4aIn the illustrated embodiment, the two housing halves 21 and 22 are designed with identical structures. However, they can also be constructed as housing parts with different designs. Both have a groove 23 and 24 at their narrow side ends. These grooves 23 and 24 are arranged opposite to each other with respect to the two housing halves 21 and 22, respectively, to accommodate the connecting portions 31 and 41 of the fluid connectors 3 and 4. Each fluid connector has a fluid interface 30 and 40 and a connecting portion 31 or 41. The connecting portions 31 and 41 of the two fluid connectors 3 and 4 are designed as circumferential walls, which... Figure 1 This can be seen very clearly. Through their respective connecting portions 31 and 41, the two fluid connectors 3 and 4 are located in the grooves 23 and 24 of the two housing halves 21 and 22, or, after the two housing halves 21 and 22 are joined together, in the receiving openings 25 and 26 formed by their respective grooves 23 and 24 (see...). Figure 4 ).

[0039] Two retaining elements 6 and 7 are used to securely hold the ends 50 and 51 of the profile element 5. For this purpose, each retaining element 6 and 7 has a slot-shaped through-hole 60 and 70, extending within the flange portion 61 or 71 of the two retaining elements 6 and 7. In addition to their respective flange portions 61 and 71, each retaining element 6 and 7 has a connecting portion 62 and 72, respectively, for connecting the two retaining elements 6 and 7 to the fluid connectors 3 and 4. The connecting portions 62 and 72 of the two retaining elements 6 and 7 are respectively constructed as circumferential walls, from... Figure 1 This can also be seen very clearly. As in... Figure 4 and 4a It can be clearly seen that the ends 50 and 51 of the profile element 5 are pushed through and accommodated in the slit-shaped through holes 60 and 70 of the two fixed receiving elements 6 and 7, respectively, and the two ends protrude into or pass through the respective connecting portions 62 and 72 of the two fixed receiving elements 6 and 7. The two opposing ends 50 and 51 of the profile element 5 are positioned and held in the two slit-shaped through holes 60 and 70.

[0040] These two sealing elements 8 and 9 are used to prevent liquid leakage in the area where the retaining elements 6 and 7 are engaged with the fluid connector fittings 3 and 4. Figure 4 , 4aAs shown, the two sealing elements 8 and 9 are respectively housed on one side in the circumferential walls of the two connecting portions 62 and 72 of the fixed receiving elements 6 and 7, and on the other side in the fluid connectors 3 and 4. Here, each sealing element 8 and 9 also has a slit-shaped through-hole 80 and 90 through which the ends 50 and 51 of the profile element 5 extend or can extend. Each of the two sealing elements 8 and 9 also has a flange portion 81 and 91 that protrudes approximately centrally with respect to its lateral extension, and two adjacent sealing portions 82 and 83 and 92 and 93. Figure 4 , 4a It can be seen that the two sealing elements 8 and 9, with their respective sealing portions 83 and 92, engage with the connecting portions 62 and 72 of the two fixed receiving elements 6 and 7, which are configured as circumferential walls, and with their respective sealing portions 82 and 93, engage with the respective transition portions 32 and 42 of the two fluid connectors 3 and 4. In this case, the outer diameter of each sealing element 8 and 9 within the region of its sealing portion 82, 83 or 92, 93, is adapted, on the one hand, to the inner diameter of the connecting portions 62 and 72 of the two fixed receiving elements 6 and 7, and on the other hand, to the inner diameter of the two transition portions 32 and 42 of the two fluid connectors 3 and 4. Thus, radial sealing of each sealing element 8 and 9 can be obtained in the connecting portions 62 and 72 of the two fixed receiving elements 6 and 7, and in the transition portions 32 and 42 of the two fluid connectors 3 and 4.

[0041] The axial sealing of the two fixed receiving elements 6, 7 relative to the two fluid connectors 3, 4 is achieved by the respective protruding flanges 81, 91, especially... Figure 4a The detailed view also shows the fluid connector 4 and flange 91. Each of the protruding flanges 81 and 91 rests axially against the inner surface 33 of the two connectors 3 and 4 (see...). Figure 5 On the one hand, it rests against the outer axial surfaces 63 and 73 of the two fixed receiving elements 6 and 7. In particular, the protruding flange portions 81 or 91 are axially clamped between these surfaces 33, 43 and 63, 73, thus achieving a particularly good sealing effect in this area.

[0042] Especially from Figure 4a and Figure 5It can also be seen that the connecting portions 62 and 72 of the two fixed receiving elements 6 and 7 respectively fit against the inner sides 34 or 44 of the connecting portions of the two fluid connectors 3 and 4. After the cooling device 1 is assembled, the connecting portions 31 or 41 of the two fluid connectors 3 and 4 are located in the respective receiving openings 25 and 26 of their housing 2. The flange portions 61 and 71 of the two fixed receiving elements 6 and 7 rest flat against the inner sides 27 and 28 of the two housing halves 21 and 22 with their outer surfaces flat, wherein each flange portion 61 and 71 is also axially supported at the two housing halves 21 and 22. Figure 4a This is shown on the outer surface 74 of the flange 71. This achieves a compact unit comprising a fixed receiving element 6 or 7 and a fluid connector 3, 4 that engages in the respective receiving openings 25, 26 of the housing 2. The ends 50, 51 of the profile element 5 are received, fixed, and held within this compact unit.

[0043] For the assembly of the cooling device 1, the profile element 5, configured as a heat exchanger, can first be connected to the two fixed receiving elements 6 and 7 by pushing them onto the two ends 50 and 51 of the profile element 5. Here, the two flange portions 61 and 71 of the two fixed receiving elements 6 and 7 face each other, while the two connecting portions 62 and 72 of the fixed receiving elements 6 and 7 face away from each other. After the two fixed receiving elements 6 and 7 are attached to the two ends 50 and 51 of the profile 5, two sealing elements 8 and 9 can be attached there and engaged into the respective connecting portions 62 and 72 of the two fixed receiving elements 6 and 7. Then, fluid connectors 3 and 4 can be attached to the sealing elements 8 and 9 and the connecting portions 62 and 72 of the two fixed receiving elements 6 and 7, respectively, in an overlapping state. In this way, a pre-assembled assembly consisting of the profile element 5, the fixed receiving elements 6 and 7, the sealing elements 8 and 9, and the fluid connectors 3 and 4 is formed. In a further assembly step, the heat-dissipating electronic component 11 is arranged on at least one circuit board 10 adjacent to the profile element 5, since the profile element 5 is designed as a heat exchanger to dissipate the heat released by the heat-dissipating electronic component. In this case, the circuit board 10 can also be arranged on both sides of the profile element 5, i.e., on opposite sides of the latter. The pre-assembled assembly and at least one circuit board 10 with the heat-dissipating electronic component 11 are then joined into the first housing half 21. Thus, the two connecting portions 31, 41 of the two fluid connectors 3, 4 are located in two opposite recesses 23, 24 of the first housing half 21. To close the housing 2, the second housing half 22 is then attached to the first housing half 21, specifically connecting the two housing parts with mutually mating materials. The two opposite recesses 23, 24 respectively accommodate the connecting portions 31 or 41 of the two fluid connectors 3, 4.

[0044] Through two fluid connectors 3 and 4, a cooling medium, in particular, can be supplied to the profile element 5, which is designed as a heat exchanger or liquid heat exchanger. Especially... Figures 11 to 15 As can be seen, the profile element 5 has flow channels 54, which are separated from each other by a web 55. A medium (particularly a cooling medium) supplied through one of the two fluid connectors 3 and 4 flows through these flow channels 54, passes through the profile element 5, and exits the cooling device 1 again through the other of the two fluid connectors 3 and 4. Inside the housing 2 of the cooling device 1, not only are the aforementioned components arranged, but also a circuit board 10 is mainly arranged, which is equipped with heat-dissipating electronic components 11. Therefore, the heat released by these components can be dissipated through the profile element 5. Figure 10 and Figure 11 An exemplary circuit board 10 is shown, while Figure 11 A heat-generating electronic component 11 is presented in the middle.

[0045] Figures 5 to 8 It shows Figures 1 to 4 A variation of the cooling device shown. In this embodiment, in addition to the respective fixed receiving elements 6, 7, an additional clamp 12 is provided, which is attached to the two ends 50, 51 of the profile element 5 and partially engaged with the respective fixed receiving elements 6, 7. Figure 6 The image shows a simplified embodiment of this clamp 12, which fully engages with the slot-shaped through-hole 70 of the retaining element 7. By providing the clamp 12 to be received in the slot-shaped through-hole 70 of the retaining element 7, it is possible to ensure that the end 51 of the profile element 5 is better secured and held in the latter.

[0046] exist Figure 5 , Figure 7 and Figure 8 In the embodiment of the clamp 12 shown, it has a clamping portion 120 that engages with a slit-shaped through-hole 64 in the flange portion 65 of the fixed receiving element 6, and a retaining portion 121 that is relatively larger than the clamping portion 120. The clamp has a slit-shaped through-hole 124 passing through its clamping portion 120 and its retaining portion 121, in which the profile element 5 can be fixedly held in a clamping manner. The flange portion 65 of the fixed receiving element 6 has four fastening elements 66 in the direction away from the connecting portion 62. Corresponding fastening elements 122 are also provided on the retaining portion 121 of the clamp 12 at their end sides. All fastening elements 66, 122 are respectively provided with a through-hole 67 or 123. In at least one of the two housing halves 21 and 22, here in Figure 5 , 7 In the housing half 21 of component 8, pin-type retaining devices 29 are arranged on both sides of each groove 23, 24. They are used to engage with the respective through holes 67 or 123 of the fastening elements 66 or 122 of the retaining element 6 and the clamp 12, and to hold them in place. Figure 8 As shown, the end fastening element 122 of the clamp 12 is respectively engaged between two adjacent and spaced fastening elements 66 at the flange portion 65 of the fixed receiving element 6, and then two pin-type fastening devices 29 are pushed through through holes 67 and 123 arranged with one on top of the other.

[0047] Figure 9 Another embodiment of the cooling device 1 is shown. (Compared to...) Figure 1The implementation differs in that a support device 13 is arranged at least in the first housing half 21. It comprises three pin-shaped or elongated support elements 130, adjacent to each other, positioned approximately centrally on the inner side 28 of the first housing half 21 with respect to its longitudinal extension. Thus, the pin-shaped or elongated converging support elements 130 extend at their ends toward the profile element 5 to be joined thereto, and can centrally support it within the housing 2 with respect to its longitudinal extension. In this way, bending of the profile element 5 is prevented, particularly from being moved away from the heat-generating electronic components 11, which are arranged as close as possible to the profile element 5 within the housing 2. Figure 9 In the illustrated embodiment of the support elements 130, they are interconnected. However, they can also be arranged individually, adjacent to each other or offset from each other. Furthermore, in the illustrated embodiment, the middle support element 130 is configured to be flat at its end, while the two outer support elements 130 are configured to be inclined or chamfered to provide particularly good support for the profile element 5.

[0048] Figure 10 Another embodiment of the cooling device 1 is shown. Here, in one aspect, a flat plate element 14 is attached to a section of the profile element 5. The flat plate element 14 can be provided to reduce the distance between the profile element 5 or its outer side 52 and at least one heat-generating electronic component 11, which is arranged on the circuit board 10 in a direction toward the profile element 5. The flat plate element 14 can be attached to the outer side 52 of the profile element 5 in a material-fitting manner, or it can be fixed flatly on the surface of the profile element 5.

[0049] Figure 10 Also shown is a retaining and supporting element 16 that engages with profile element 5 at the edge. The retaining and supporting element 16, here... Figure 10 The system comprises four retaining and supporting elements 16 for securing at least one circuit board 10 thereto and maintaining a predetermined distance between the circuit board 10 and the profile element 5. Specifically, two retaining and supporting elements 16 can be pushed onto the profile element 5 at their edges, thus having a corresponding connecting portion abutting against two opposing outer sides 52, 53 of the profile element 5, thereby engaging the profile element 5 in a clamping manner. Similarly, another form of retaining and supporting element 16 can be connected to the profile element 5 in a form-fit and / or material-fit and / or force-fit manner. In particular, the circuit board 10 is screwed onto the retaining and supporting elements 16.

[0050] Figures 11 to 12aAnother embodiment of the connection between the profile element 5 and the circuit board 10 is shown, wherein the profile element 5 is surrounded at its edge by a retaining and supporting element 16. The retaining and supporting element 16 is used to achieve a positionally fixed connection between the profile element 5 and the circuit board 10 on which the heat-dissipating electronic components 11 are attached. For this purpose, Figures 11 to 12a The two retaining and supporting elements 16 shown each have a fastening element 161, in the form of a screw or rivet, inserted into and secured therein through a vertically extending slot or hole 160. This is in Figure 11 This is particularly clear. Through these fastening elements 161, the circuit board 10 can be securely or detachably connected to the retaining and supporting element 16, depending on the configuration of each fastening element 161. The profile element 5 is engaged at its edge into the receiving portion 162 of the retaining and supporting element 16 so that it can be secured to the profile element 5, particularly in a form-fit and / or force-fit manner. By connecting or attaching at least one circuit board 10 to the retaining and supporting element 16, a fixed spacing can be achieved between the circuit board 10 with at least one heat-dissipating electronic component 11 and the profile element 5. This is in Figure 11 This can also be seen in the text.

[0051] Figures 13 to 15 This illustrates another possibility for reinforcing or stabilizing the profile element 5 in its longitudinal extension direction. For this purpose, reinforcing rods 17, 18, or reinforcing devices are joined to the flow channels 54 inside each profile element 5. According to... Figure 13 In the embodiment, the reinforcing rod 17 has a rectangular outline, and according to Figure 14 In this embodiment, the reinforcing rod 18 has a double-T profile. In each case, the profile element 5 can be reinforced in its longitudinal direction in this way. The reinforcing rods 17, 18 are particularly shaped-fittingly located in the respective flow channels 54 of the profile element 5.

[0052] According to Figure 15 In this embodiment, instead of a reinforcing rod, a section inside the profile element 5 is not formed as a flow channel, but is instead constructed as a reinforcing part 19. A portion on either side of this is a web 55, which still exists there, separating the various flow channels inside the profile element 5 from each other. Figure 9 As shown, such a reinforcing device, particularly provided as a reinforcing rod 17, 18 or a reinforcing part 19 or other embodiments, can be provided, especially attached to or replacing the support device 13 inside the profile element 5, to stabilize the shape of the profile element 5, especially to maintain an ideal distance from the circuit board 10 inside the housing 2 of the cooling device 1.

[0053] Besides the variations of the cooling device described above and shown in the figures, many other embodiments are possible, particularly any combination of the above features, wherein the cooling device includes a housing for accommodating at least one heat-generating electronic component, particularly arranged on a circuit board, such as one or more power electronic components arranged on a circuit board, and a cooling system for cooling the at least one heat-generating electronic component. The at least one heat-generating electronic component is thus arranged within the housing. The cooling system includes at least one profile element configured as a heat exchanger, composed of at least one thermally conductive material. This profile element is arranged within the housing and is fixed and held within the housing at its end by at least one retaining element.

[0054] Label Explanation

[0055] 1. Cooling device

[0056] 2. Shell

[0057] 3. Fluid connector fittings

[0058] 4. Fluid connector fittings

[0059] 5 Profile Components

[0060] 6. Fixed receiving element

[0061] 7. Fixed receiving element

[0062] 8 Sealing elements

[0063] 9. Sealing elements

[0064] 10 circuit boards

[0065] 11. Exothermic electronic components

[0066] 12 Fixtures

[0067] 13 Supporting components

[0068] 14 Flat panel components

[0069] 16. Holding and supporting elements

[0070] 17 Reinforcing Rods

[0071] 18 Reinforcing Rods

[0072] 19. Reinforcement Section

[0073] 21 First shell section

[0074] 22 Second shell section

[0075] 23 Grooves

[0076] 24 Grooves

[0077] 25 Accommodation opening

[0078] 26 Accommodating openings

[0079] 27. Inner side

[0080] 28 Inner side

[0081] 29 Pin-type fasteners

[0082] 30 Fluid Interface

[0083] 31 Connecting part

[0084] 32 Transition Section

[0085] 33 Inner surface

[0086] 34 Inner surface of the connection part

[0087] 40 Fluid Interface

[0088] 41 Connecting part

[0089] 42 Transition Section

[0090] 43 Inner surface

[0091] 44 Inner surface of the connection part

[0092] 50 First end

[0093] 51 Second end

[0094] 52 Outer side

[0095] 53 Outer side

[0096] 54 flow channels

[0097] 55 Web

[0098] 60 slit-shaped through hole

[0099] 61 Flange section

[0100] 62 Connecting part

[0101] 63 Axial outer surface

[0102] 64. Slit-shaped through-hole

[0103] 65 Flange section

[0104] 66 Fastening components

[0105] 67 Through Hole

[0106] 70 Slit-shaped through-hole

[0107] 71 Flange section

[0108] 72 Connecting part

[0109] 73 Axial outer surface

[0110] 74 71 outer surface

[0111] 80 slit-shaped through hole

[0112] 81. Protruding flange

[0113] 82 Sealing section

[0114] 83 Sealing section

[0115] 90-degree slit-shaped through hole

[0116] 91. Protruding flange

[0117] 92 Sealing section

[0118] 93 Sealing section

[0119] 120 clamping part

[0120] 121 Maintenance Department

[0121] 122 Fastening components

[0122] 123 Through Hole

[0123] 124 Slit-shaped through holes

[0124] 130 gradually transforms into a pin-shaped support element

[0125] 160 slots / holes

[0126] 161 Fastening elements

[0127] 162 Reception Department

Claims

1. A cooling device (1) having a housing (2) for accommodating at least one heat-generating electronic component (11) and a cooling system for cooling said at least one heat-generating electronic component (11), wherein, The at least one exothermic electronic component (11) is arranged within the housing (2), and the cooling system includes at least one heat exchanger, characterized in that, At least one profile element (5) is provided as a heat exchanger, which is made of at least one thermally conductive material and has a plurality of internal flow channels through which a cooling medium can flow or be circulated. The at least one profile element (5) is arranged in the housing (2), wherein the at least one profile element (5) is fixed in the housing (2) at its end side by at least one fixing receiving element (6, 7) in the housing (2), the fixing receiving element (6, 7) including at least one flange (61, 71), at least one connecting part (62, 72) and at least one slit-shaped through hole (60, 70) for receiving the at least one profile element (5), wherein the at least one slit-shaped through hole (60, 70) allows the at least one profile element (5) to pass through and be mechanically fixed, the connecting parts (62, 72) are used to connect the fixing receiving element (6, 7) to the fluid connector (3, 4) for supplying and discharging the cooling medium to and from the profile element (5). The connecting portion (62, 72) includes at least one circumferential wall that forms the actual connecting portion. The circumferential wall is accommodated in the connecting portions (31, 41) of the respective fluid connectors (3, 4) for supplying cooling medium to the profile element (5) and discharging cooling medium from the profile element (5).

2. The cooling device (1) according to claim 1, characterized in that, The at least one exothermic electronic component (11) is at least one power electronic component.

3. The cooling device (1) according to claim 1, characterized in that, At least one sealing element (8, 9) is provided for sealing against leakage of cooling medium, and at least one of the sealing elements (8, 9) for sealing against leakage of cooling medium can be arranged or arranged in at least one connection (62, 72) of the at least one fixed receiving element (6, 7).

4. The cooling device (1) according to claim 3, characterized in that, The at least one sealing element (8, 9) has at least one slit-shaped through hole (80, 90) for the at least one profile element (5) to pass through it in a sealing manner.

5. The cooling device (1) according to claim 1, characterized in that, The housing (2) includes at least two housing portions (21, 22), wherein the housing (2) has at least one receiving opening (25, 26) at each of two opposite ends for receiving each fluid connector (3, 4) to supply and discharge cooling medium to the at least one profile element (5).

6. The cooling device (1) according to claim 5, characterized in that, The at least two housing portions (21, 22) at two opposite ends each have at least one groove (23, 24) for receiving each fluid connector (3, 4) to supply and discharge cooling medium to the at least one profile element (5).

7. The cooling device (1) according to claim 1, characterized in that, The at least one fixed receiving element (6, 7) rests against the inner side (27) of the housing (2) with its flange (61, 71), and at least one receiving opening (25, 26) thereunder is for receiving the fluid connector (3, 4), wherein its connecting portion (62, 72) is engaged with the connecting portion (31, 41) of the fluid connector (3, 4).

8. The cooling device (1) according to claim 1, characterized in that, At least one clamp (12) is provided for clamping and securing the at least one profile element (5) in the at least one fixed receiving element (6, 7), and is capable of being connected or coupled to the fixed receiving element (6, 7).

9. The cooling device (1) according to claim 8, characterized in that, The at least one clamp (12) is at least partially capable of engaging or engaging into the fixed receiving element (6, 7).

10. The cooling device (1) according to claim 8, characterized in that, At least one fixing device (29) is provided for fixing the at least one clamp (12) in the housing (2).

11. The cooling device (1) according to claim 10, characterized in that, The pin-type fastener (29) to be engaged at or engaged therein in the clamp (12) is arranged in at least one of the housing portions (21, 22).

12. The cooling device (1) according to claim 1, characterized in that, At least one support device (13) is provided for supporting the at least one profile element (5) in the housing (2).

13. The cooling device (1) according to claim 12, characterized in that, At least one pin-shaped or gradually pin-shaped support device (130) is arranged in the housing (2) and protrudes toward the interior of the housing.

14. The cooling device (1) according to any one of claims 1 to 13, characterized in that, The at least one profile element (5) and / or the housing (2) are provided with or have at least one retaining and supporting element (16) for maintaining the distance between at least one circuit board (10) and the at least one profile element (5).

15. The cooling device (1) according to any one of claims 1 to 13, characterized in that, At least one flat element (14) can be arranged or positioned on or above the at least one profile element (5) to reduce the spacing between the profile element (5) and at least one heat-dissipating electronic component (11) and / or a circuit board (10) on which the at least one heat-dissipating electronic component (11) is arranged.

16. The cooling arrangement (1) according to claim 15, characterized in that, The at least one flat plate element (14) can be connected or joined to the at least one profile element (5) in a material-fit manner.

17. The cooling arrangement (1) according to claim 16, characterized in that, The at least one flat plate element (14) can be connected or joined to the at least one profile element (5) by welding.

18. The cooling device (1) according to any one of claims 1 to 13, characterized in that, The at least one profile element (5) is an aluminum profile element.

19. The cooling device (1) according to claim 18, characterized in that, The at least one profile element (5) is an aluminum extrusion profile.

Images