Antenna device and radome

Abstract

In order to provide an antenna device and a radome capable of suppressing the antenna device from being large-sized, an antenna device (100) includes a substrate (10) on a first surface of which a plurality of antenna elements (20) are arranged; and a radome (50) having thermal conductivity that covers the substrate (10) and forms a plurality of slots (53) at positions facing each of the plurality of antenna elements (20). The radome (50) includes a fin (56) that protrudes to an opposite side to the first surface side; and a wall portion (52) that is provided between an antenna element (20) and an antenna element (20) adjacent to the antenna element (20), and is capable of transferring heat of a heat generating component (40) connected to the substrate (10) to the fin (56).

Description

Technical Field

[0001] This disclosure relates to antenna devices and radomes. Background Technology

[0002] In antenna-integrated base station devices, resin radomes are used to protect the antenna surface. When using resin radomes, the radome is thickened to enhance durability and similar performance. Therefore, as in Patent Document 1, it has been studied to protect the antenna surface by using a shell made of conductor instead of a resin radome.

[0003] Existing technical documents

[0004] Patent documents

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2012-175422 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] Incidentally, in recent years, with the increasing capacity of communications, antenna devices including a greater number of antenna elements than those disclosed in Patent Document 1 have been studied. Antenna devices comprising a large number of antenna elements require a large number of transceivers associated with those elements, which often leads to a larger antenna device size. Therefore, it is necessary to curb the enlargement of antenna devices.

[0008] One object of this disclosure is to solve the above-mentioned problems and to provide an antenna device and radome capable of suppressing the enlargement of the antenna device.

[0009] Solution for solving the problem

[0010] The antenna device according to this disclosure includes:

[0011] A first substrate, configured to arrange a plurality of antenna elements on a first surface; and

[0012] The radome, configured to cover the first substrate, has multiple slots formed at locations facing each of the plurality of antenna elements and is thermally conductive.

[0013] The antenna radome includes

[0014] A heat sink, configured to protrude from the opposite side of the first surface, and

[0015] The wall portion is configured to be disposed between a first antenna element and a second antenna element adjacent to the first antenna element among the plurality of antenna elements, and is capable of transferring heat from the heat-generating component connected to the first substrate to the heat sink.

[0016] The radome according to this disclosure is thermally conductive and includes:

[0017] The planar portion, configured such that, in a state where a first substrate covering a plurality of antenna elements arranged on a first surface has a plurality of slots formed at positions facing each of the plurality of antenna elements, and includes heat sinks protruding from the opposite side of the first surface; and

[0018] The wall portion is configured to be disposed between a first antenna element and a second antenna element adjacent to the first antenna element among the plurality of antenna elements, and is capable of transferring heat from the heat-generating component connected to the first substrate to the heat sink.

[0019] The effects of the invention

[0020] According to this disclosure, an antenna device and radome capable of suppressing the enlargement of the antenna device can be provided. Attached Figure Description

[0021] Figure 1 This is a schematic top view of an antenna device according to a first exemplary embodiment;

[0022] Figure 2 This is a schematic cross-sectional view of an antenna device according to a first exemplary embodiment;

[0023] Figure 3 This is a diagram illustrating the flow of thermal radiation in an antenna device according to a first exemplary embodiment;

[0024] Figure 4 This is an enlarged view of the planar portion of the radome according to variant example 1;

[0025] Figure 5 This is a schematic top view of the antenna device according to Variation Example 2;

[0026] Figure 6 This is a schematic top view of the antenna device according to Variation Example 2;

[0027] Figure 7 This is a schematic cross-sectional view of an antenna device according to a second exemplary embodiment; and

[0028] Figure 8 This is a diagram illustrating the flow of thermal radiation in an antenna device according to a second exemplary embodiment. Detailed Implementation

[0029] In the following description, exemplary embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. Note that appropriate omissions and simplifications have been made to the following description and drawings for clarity of explanation. Furthermore, in the following drawings, the same elements are represented by the same reference numerals, and repeated descriptions are omitted where necessary. In each exemplary embodiment, deviations in parallel, horizontal, vertical, and similar directions are permitted to the extent that they do not impair the effects of the present disclosure. Additionally, in the drawings used to illustrate exemplary embodiments, when directions are not specifically described, reference is made to the directions shown in the drawings.

[0030] (Considerations for exemplary implementations)

[0031] First, before describing the details of the exemplary embodiments, the considerations that led to the exemplary embodiments will be explained.

[0032] Active antenna systems (AAS) are known as antenna devices for fifth-generation mobile communications. AAS enables flexible beamforming, multi-user multiple-input multiple-output (MU-MIMO), massive MIMO, and similar effects by providing transceivers for each antenna element that constitutes a super-multi-element antenna array. As a result, AAS can significantly improve cell throughput and frequency utilization efficiency because it can spatially multiplex and collectively transmit radio signals from multiple communication terminals and multiple layers.

[0033] In an AAS with fully digital beamforming capabilities for MU-MIMO, transceivers are arranged in association with each antenna. These transceivers include an analog-to-digital converter (ADC), a digital-to-analog converter (DAC), a transmitter and receiver (TRX), and an RF front-end. Therefore, as the number of transceivers increases in proportion to the number of antennas, the power consumption in the AAS also increases with the number of antenna elements and transceivers.

[0034] As mentioned above, resin radomes are typically used in antenna-integrated base station devices to protect the antenna surface. When using a resin radome, it is placed on the antenna surface; however, there is a possibility that the radome may obstruct heat radiation from the antenna assembly. Since an AAS has a large number of antenna elements, the area of ​​the array antenna also increases. Therefore, when a resin radome is used in an AAS, it is difficult to radiate heat from the antenna surface. Thus, heat sinks are provided in a housing on the back side opposite to the antenna surface of the AAS, and heat radiation is achieved by increasing the height and number of these sinks. Therefore, when using a resin radome for an AAS, the envelope volume of the heat sink increases, and the weight of the heat sink also increases, leading to a larger AAS.

[0035] Meanwhile, forced air cooling systems and natural air cooling systems are known as cooling systems for suppressing temperature rise in internal equipment. Forced cooling systems cool internal equipment by using fans to push outside air into the internal equipment or to draw superheated air out of the internal equipment. Natural air cooling systems are systems where heat is diffused from the internal equipment; the heat is directed to heat sinks, and then heat radiation efficiency is improved by ensuring the number and length of the sinks to increase the heat radiation area relative to the external environment.

[0036] When a forced cooling system is used for an AAS, effects of heat radiation and miniaturization can be expected. However, since the fan or similar device needs to be continuously driven, failures may occur due to continuous operation, leading to reduced reliability and requiring immediate maintenance in case of failure. Furthermore, since AASs are also deployed in urban areas, the rotational noise of the fan can cause undesirable noise when a forced cooling system is used. Therefore, AASs are more likely to use natural cooling systems compared to forced cooling systems. Thus, even when using natural cooling systems for AASs, it is desirable to improve the heat radiation efficiency of the AAS while achieving miniaturization and weight reduction. According to this disclosure, a structure is realized that can improve the heat radiation efficiency of the AAS while suppressing its large size.

[0037] (First Exemplary Implementation)

[0038] Reference Figure 1 and Figure 2 This section describes a construction example of the antenna device 100 according to a first exemplary embodiment. Figure 1 This is a schematic top view of an antenna device according to a first exemplary embodiment. Figure 2 This is an enlarged cross-sectional view of the antenna device according to the first exemplary embodiment, and it shows the view along... Figure 1 An enlarged cross-sectional view of a portion of the section cut by cutting line II-II. Note that... Figure 1 This is a top view with the substrate 10 described later substantially parallel to the horizontal plane. However, when operating the antenna device 100, since the substrate 10 described later is arranged substantially perpendicular to the horizontal plane, therefore... Figure 1 This can also be referred to as the front view of the antenna device 100.

[0039] Antenna device 100 is an antenna array comprising multiple antenna elements, and may be, for example, an AAS (Antenna Assemblies). Because antenna device 100 comprises a large number of antenna elements, it may be referred to as an antenna system. Figure 1 and Figure 2 As shown, the antenna device 100 includes a substrate 10, a plurality of antenna elements 20, a ground layer 30, a plurality of heat-generating components 40, and an antenna cover 50.

[0040] First, refer to Figure 2 This section describes an example of the construction of antenna device 100.

[0041] The substrate 10 is provided with an electrical wiring pattern, and a plurality of antenna elements 20 are arranged on a first surface on the positive Z-axis side of the substrate 10. Since the first surface is in the direction from which radio waves are radiated from the antenna elements 20, it can be referred to as the front or top surface, and the second surface of the substrate 10 opposite to the first surface can be referred to as the back or bottom surface. Each of the plurality of antenna elements 20 is arranged such that it is separated from each other by a predetermined distance along the X-axis on the top surface of the substrate 10. Each of the plurality of antenna elements 20 is electrically connected to the ground layer 30 and the radome 50 via a ground wire provided on the front surface of the substrate 10. Note that, although not shown in the figure, each of the plurality of antenna elements 20 is also arranged such that it is separated from each other by a predetermined interval in the Y-axis direction.

[0042] In the substrate 10, thermal vias 11 are formed as through-holes penetrating the substrate 10. The thermal vias 11 are formed in the substrate 10 near the antenna elements 20 and between adjacent antenna elements 20. In other words, the thermal vias 11 are formed around each antenna element 20, and each antenna element 20 is surrounded by a plurality of thermal vias 11 on the substrate 10. Note that in Figure 2 In this configuration, thermal vias 11 are formed between all adjacent antenna elements 20, but thermal vias 11 may not be formed between some adjacent antenna elements 20.

[0043] Each of the antenna elements 20 can be arranged at equal intervals with adjacent antenna elements 20. Antenna elements 20 are fed antenna elements and, for example, patch antennas. Antenna elements 20 are primary resonators in which a transceiver (not shown) connected to the back of the substrate 10 transmits and receives signals. The antenna arrangement 100 radiates radio waves from the slot antenna elements to a direction pointed towards the top surface of the substrate 10 through the dual resonance of the antenna elements 20 and the slot antenna element constituted by the slot 53 described later, in a direction that allows signals to be transmitted to and received from the communication device.

[0044] For example, the same number of heat-generating components 40 as the number of antenna elements 20 are connected to the back side of the substrate 10. Each of the heat-generating components 40 may be, for example, an amplifier (AMP). A ground layer 30, made of, for example, copper foil, is formed on the back side of the substrate 10 and on the thermal via 11. Each heat-generating component 40 is connected to the substrate 10 via the ground layer 30. Each heat-generating component 40 may be arranged at a location associated with each antenna element 20. Each of the plurality of heat-generating components 40 may be arranged at a location sandwiching each antenna element 20 and the substrate 10 along the negative Z-axis direction of each antenna element 20. The heat-generating components 40 are electrically connected to the antenna element 20 via the ground layer 30. Furthermore, the heat-generating components 40 are thermally connected to the radome 50, which will be described later, via the ground layer 30. In other words, it is configured such that the heat generated by the heat-generating components 40 can be transferred to the radome 50 via the thermal via 11. In other words, the thermal via 11 is configured as a heat radiation path and transfers the heat generated by the heat-generating components 40 to the radome 50.

[0045] Note that, although in Figure 2 While figures are omitted, the heating element 40 is connected to an external circuit via at least one of the signal lines and control lines of the substrate 10, excluding the ground line. Furthermore, the ground pads (GND PAD1) on the back side of the heating element 40 or the ground patches (GND Pins) arranged around the heating element 40 are connected to the ground pattern surface (GND pattern) on the substrate 10 using a reflow soldering process employing surface mount technology (SMT) or similar techniques. Alternatively, the ground pads (GND PAD1) on the back side of the heating element 40 or the ground patches (GND Pins) arranged around the heating element 40 are connected to ground terminals (GND PAD2) for connecting ground pins using a reflow soldering process employing surface mount technology (SMT) or similar techniques. The ground connection portion, indicating the portion where the ground patches are connected to each other, is connected to the ground layer 30 in a manner that forms a heat radiation path not only through electrical grounding but also through thermal means.

[0046] The radome 50 is thermally conductive and is, for example, a metal radome made of a metal such as aluminum, silver, or copper. Note that the radome 50 may not be made of metal, as long as it is a thermally conductive conductor. The radome 50 is fixed to the substrate 10 while covering the substrate 10 and is configured as a protective member protecting the substrate 10. The radome 50 includes a planar portion 51 and a wall portion 52.

[0047] The planar portion 51 is arranged parallel to the substrate 10 at a distance corresponding to the height of the wall portion 52, separated from the substrate 10 when it covers the substrate 10. In the planar portion 51, a number of slots 53, equal to the number of antenna elements 20, are formed at positions facing each antenna element 20 when it covers the substrate 10. Each of the plurality of slots 53 is formed at a position in the positive Z-axis direction of each antenna element 20. The slots 53 serve as slot antenna elements. A slot antenna element is a sub-resonator having the same resonant frequency as the antenna element 20, and serves as an antenna element that combines with the antenna element 20 to resonate and widen the bandwidth. In the antenna device 100, since the slots 53 serve as slot antenna elements, signals can be transmitted to and received from the communication device in a wider bandwidth in the direction pointed to by the outer surface of the radome 50, which is opposite to the front side of the substrate 10. Note that the radome 50 can be referred to as a slot antenna because the plurality of slots 53 serve as a plurality of slot antenna elements.

[0048] Furthermore, the planar portion 51 includes a first heat sink 54, which protrudes from the outer surface opposite to the front side of the substrate 10. The first heat sink 54 is a sheet for radiating heat generated in the heat-generating component 40 to the outside. The first heat sink 54 is arranged near the slot 53, which serves as a slot antenna element. The first heat sink 54 protrudes relative to the planar portion 51 in the positive Z-axis direction and the vertical direction, and protrudes from the outer surface of the planar portion 51 in such a way that the wall portion 52 extends in the positive Z-axis direction. The first heat sink 54 transfers the heat from the heat-generating component 40 transmitted from the wall portion 52 to the air, thereby radiating the heat from the heat-generating component 40 to the outside of the antenna device 100. In other words, the outside air removes the heat from the heat-generating component 40 transmitted from the wall portion 52 by contacting the surface of the first heat sink 54 and radiates the heat to the outside.

[0049] The wall portion 52 is disposed perpendicular to the planar portion 51 along the negative Z-axis direction. The wall portion 52 is configured to connect to the substrate 10 and surround each antenna element 20 when the radome 50 covers the substrate 10. Specifically, the wall portion 52 is configured to connect to the substrate 10 between adjacent antenna elements 20 when the radome 50 covers the substrate 10. Furthermore, the wall portion 52 is configured to connect to the substrate 10 near its end when the radome 50 covers the substrate 10. The wall portion 52 is configured to connect to the substrate 10 when the radome 50 covers the substrate 10, to be thermally connected to the heat-generating member 40 connected to the back side of the substrate 10, and to transfer heat from the heat-generating member 40 to at least the first heat sink 54. Specifically, the wall portion 52 is disposed at the location of the heat-passing hole 11 formed on the substrate 10 when the radome 50 covers the substrate 10, and is configured to transfer heat from the heat-generating member 40 through the heat-passing hole 11 and to transfer the transferred heat to at least the first heat sink 54. Note that the heat from the heating element 40 is transferred from the wall 52 to the first heat sink 54, and the first heat sink 54 radiates the heat to the outside.

[0050] Furthermore, the wall portion 52 is electrically connected to the substrate 10 on which the antenna elements 20 are disposed. As described above, since the wall portion 52 is disposed between two adjacent antenna elements 20, each antenna element 20 is configured to reduce interaction with other antenna elements 20, including adjacent antenna elements 20. In other words, the wall portion 52 reduces interaction with other antenna elements 20 with respect to each antenna element 20 and improves the antenna characteristics of the antenna device 100.

[0051] Notice, Figure 2 It is along the way Figure 1 The cross-sectional view is taken along the cutting line II-II through the center of the slots 53 arranged in the X-axis direction. However, the cross-sectional view taken along the cutting line through the center of the slots 53 arranged in the Y-axis direction is similar except for the heat sink, so its illustration and description are omitted.

[0052] Next, we will refer to Figure 1 The planar portion 51 of the radome 50 is described. The planar portion 51 includes a plurality of slots 53 formed at positions facing each antenna element 20, and heat sinks 56 comprising a plurality of first heat sinks 54 and a plurality of second heat sinks 55 disposed between adjacent antenna elements 20. Figure 1 As shown, the slot 53 is X-shaped.

[0053] Specifically, such as Figure 1As shown in the lower right portion, the slot 53 includes a first opening 53a extending in a first direction, for example, at an angle of 45 degrees to the X-axis, and a second opening 53b extending in a second direction, different from the first direction, for example, at an angle of 135 degrees (-45 degrees) to the X-axis. The first opening 53a and the second opening 53b are, for example, rectangular openings. The slot 53 is formed such that the first opening 53a and the second opening 53b intersect each other, for example, at the center of the slot 53. The slot 53 serves as a slot antenna element capable of transmitting and receiving two polarized waves. Therefore, the slot 53 includes a first opening 53a and a second opening 53b.

[0054] Note that it is understood that the angles formed between the first and second directions and the X-axis are not limited to those described above, but can be appropriately set, and the shapes of the first opening 53a and the second opening 53b do not have to be rectangular. Furthermore, the slot 53 can be used as a slot antenna element associated with, for example, a polarized wave, and the slot 53 may include one of the first opening 53a and the second opening 53b.

[0055] Heat sink 56 protrudes from the outer surface of the planar portion 51, opposite to the front side of the substrate 10. In other words, the first heat sink 54 and the second heat sink 55 protrude from the outer surface of the planar portion 51, opposite to the front side of the substrate 10. The heat sink 56 is arranged between two adjacent slots 53 near the slot 53 used as slot antenna elements.

[0056] The first heat sink 54 is arranged between two adjacent slots 53 along the X-axis. The first heat sink 54 is arranged between two adjacent slots 53 along the X-axis and extends from the end of the planar portion 51 in the negative Y-axis direction to the end of the planar portion 51 in the positive Y-axis direction. Note that... Figure 1 The shape of the first heat sink 54 shown is an example, so other shapes can be used.

[0057] The second heat sink 55 is arranged between two adjacent slots 53 along the Y-axis. Furthermore, the second heat sink 55 is arranged between two adjacent first heat sinks 54. The second heat sink 55 consists of three rectangular heat sinks with the Y-axis as the longitudinal direction and the X-axis as the transverse direction. The second heat sink 55 consists of three heat sinks whose length in the longitudinal direction is shorter than that of the first heat sinks 54. Since the second heat sink 55 includes three heat sinks, it can be referred to as a heat sink group. Note that the second heat sink 55 consists of three heat sinks, but the number of heat sinks included in the second heat sink 55 may not be three. Furthermore, since... Figure 1 The shapes of the first heat sink 54 and the second heat sink 55 shown are an example, so other shapes can be used.

[0058] Next, we will refer to Figure 3 The flow of thermal radiation in the antenna device 100 in the first exemplary embodiment is described. Figure 3 This is a diagram illustrating the flow of thermal radiation in an antenna device according to a first exemplary embodiment. Figure 3 Is Figure 2 The schematic cross-sectional view shown includes a diagram with white arrows illustrating the heat flow generated by the heating element 40. (See diagram for example.) Figure 3 As shown, the heat generated in the heat-generating component 40 is transferred to the wall 52 of the thermally conductive radome 50 via the grounding layer 30.

[0059] Specifically, the heat-generating component 40 is positioned in the negative Z-axis direction of the antenna element 20, and heat-passing holes 11 are formed between two adjacent antenna elements 20. The heat generated in the heat-generating component 40 is transferred to two wall portions 52 covering the two heat-passing holes 11 via at least two heat-passing holes 11 arranged near the heat-generating component 40. Then, the heat from the heat-generating component 40 transferred to the two wall portions 52 is transferred to the planar portion 51 and radiated from the heat sink 56 near the slot 53, which serves as a slot antenna element, arranged in the planar portion 51.

[0060] As described above, the antenna device 100 includes a thermally conductive radome 50, which also serves as a slot antenna and protects the substrate 10 on which the antenna elements 20 are disposed. The radome 50 includes a heat sink 56 on its outer surface, and the heat sink 56 is disposed near the slot 53 used as a slot antenna element. The substrate 10 includes thermal path holes 11 and is configured as a heat radiation path for transferring heat generated from the heat-generating component 40 to the heat sink. Furthermore, the radome 50 includes a wall portion 52 located between two adjacent antenna elements 20, which can transfer heat from the heat-generating component 40 to the heat sink 56. Because the antenna device 100 includes this configuration, heat from the heat-generating component 40 can be radiated to the outside.

[0061] In this document, Patent Document 1 does not disclose an antenna device including a heat sink. Therefore, when implementing an antenna device including a large number of antenna elements using the technology disclosed in Patent Document 1, a heat sink is required in addition to the housing made of a conductor, and there is a possibility of increasing the size of the antenna device. In contrast, in the antenna device 100 according to the first exemplary embodiment, since the radome 50 protecting the antenna element 20 includes a heat sink 56, it is not necessary to provide a heat sink 56 other than the radome 50. Therefore, according to the antenna device 100 according to the first exemplary embodiment, since it is not necessary to provide a heat sink on the back side of the antenna device 100, the large size of the antenna device can be suppressed.

[0062] Furthermore, since the radome 50 includes a heat sink 56, the antenna device 100 can also have the heat sink arranged on the rear side of the antenna device 100. Therefore, according to the antenna device 100 of the first exemplary embodiment, a heat radiation path can be further provided on the rear side of the antenna device 100, and the degrees of freedom when mounting the antenna device 100 are improved. Moreover, according to the antenna device 100 of the first exemplary embodiment, even when antenna elements are mounted at high density, the antenna device can be miniaturized, and manufacturing costs can be suppressed.

[0063] Furthermore, in the antenna device 100, heat generated from each of the plurality of heat-generating components 40 can be radiated from the heat sink 56 via at least two heat-passing holes 11 disposed near each of the plurality of heat-generating components 40 and two wall portions 52 covering the two heat-passing holes 11. In other words, the antenna device 100 can radiate heat generated by each of the plurality of heat-generating components 40 from the heat sink 56 via multiple heat transfer paths. Therefore, according to the antenna device 100 according to the first exemplary embodiment, thermal radiation efficiency can be improved.

[0064] Furthermore, in the antenna device 100, since the wall portion 52 is electrically connected to the substrate 10 and disposed between two adjacent antenna elements 20, the mutual influence between each antenna element 20 and other antenna elements 20 can be reduced. Conversely, since the antenna device according to Patent Document 1 does not include the wall portion 52 included in the antenna device 100 according to the first exemplary embodiment, the antenna device according to Patent Document 1 causes multiple resonances in the space within the housing made of a conductor. Therefore, when using the antenna device according to Patent Document 1, the antenna gain may be degraded or a costly structure may be required because measures such as attaching an absorber are needed to suppress multiple resonances. On the other hand, according to the antenna device 100 according to the first exemplary embodiment, the reduction in antenna gain can be suppressed because the mutual influence between antenna elements 20 can be reduced. Furthermore, according to the antenna device 100 according to the first exemplary embodiment, since it is not necessary to attach an absorber for suppressing multiple resonances, development and manufacturing costs can be reduced.

[0065] Furthermore, in antenna devices, when a resin radome is used to protect the antenna surface, the front side of the antenna device cannot be used for heat radiation. Therefore, when a resin radome is used in an antenna device, a heat sink needs to be provided on the back side of the antenna device. Conversely, since the antenna device 100 according to the first exemplary embodiment includes a thermally conductive radome 50, a structure that includes a heat radiation mechanism on the front side of the antenna can be realized. Then, since the radome 50 includes a heat sink 56, it is not necessary to include a heat sink 56 in addition to the radome 50. Therefore, according to the antenna device 100 according to the first exemplary embodiment, the heat radiation efficiency of the antenna device can be improved, and miniaturization of the antenna device can be facilitated. In addition, in the antenna device 100, the antenna characteristics of the antenna device 100 can be further improved by optimizing the size and positional relationship of the heat sink 56 and correcting the antenna pattern distortion caused by the mutual coupling between the antenna elements 20.

[0066] Furthermore, in antenna devices, when a resin radome is used to protect the antenna surface, a certain amount of space needs to be ensured between the antenna element and the resin radome to properly adjust the antenna characteristics. Conversely, in the antenna device 100 according to the first exemplary embodiment, since the slot antenna element and the radome 50 are formed from the same component, there is no need to provide space between the antenna element and the radome, thus contributing to the miniaturization of the device.

[0067] (Variant Example 1)

[0068] In the first exemplary embodiment, the shape of the slot 53 is described as X-shaped, but the shape of the slot 53 can be of the so-called dog-bone type, and the slot 53 can be used as a dog-bone antenna.

[0069] Figure 4 This is an enlarged view of the planar portion 51 of the radome 50 according to Variation Example 1. Specifically, Figure 4 This is an enlarged view of one of the plurality of slots 53 provided in the planar portion 51. Note that in Variant Example 1, the shape of the slot 53 is different from that of the first exemplary embodiment, but the other constructions are similar to those of the first exemplary embodiment, and therefore their description will be omitted as appropriate.

[0070] like Figure 4 As shown, similar to the first exemplary embodiment, the slot 53 includes a first opening 53a extending in a first direction and a second opening 53b extending in a second direction, and the first opening 53a and the second opening 53b are formed to intersect at, for example, the center of the slot 53. Furthermore, the ends of the first opening 53a and the second opening 53b of the slot 53 are widened.

[0071] Specifically, in the end portions 53c and 53d that serve as the two ends of the first opening 53a, the width in the vertical direction orthogonal to the first direction is wider than the width in that vertical direction of the portion of the first opening 53a that is different from the two ends of the first opening 53a. Furthermore, in the end portions 53e and 53f that serve as the two ends of the second opening 53b, the width in the vertical direction orthogonal to the second direction is wider than the width in that vertical direction of the portion of the second opening 53b that is different from the two ends of the second opening 53b.

[0072] As described above, even when the shape of the slot 53 in the first exemplary embodiment is modified as in Variation 1, similar advantageous effects as in the first exemplary embodiment can be obtained. Furthermore, when the shape of the slot 53 in the first exemplary embodiment is modified as in Variation 1, the bandwidth of the antenna device 100 can be widened.

[0073] (Variant Example 2)

[0074] In a first exemplary embodiment, the construction of the antenna device 100 can be modified in a manner that does not corrode the interior of the antenna device 100.

[0075] Figure 5 and Figure 6 This is a schematic top view of the antenna device according to Variation Example 2. Specifically, Figure 6 This is a perspective view through the slot portion of the antenna device 100 according to variant 2.

[0076] like Figure 5 and Figure 6 As shown, a sealing material 61 for sealing the slot 53 is arranged in the positive Z-axis direction of the slot 53. The sealing material 61 is a resin that transmits radio waves. Note that the slot 53 can be sealed by filling it with a liquid resin such as silicone resin. As described above, even when the antenna device 100 according to the first exemplary embodiment is manufactured as in Variant 2, similar advantageous effects as in the first exemplary embodiment can be obtained. Furthermore, in the antenna device 100 according to Variant 2, since the slot 53 is sealed with resin and has an airtight structure, corrosion inside the antenna device 100 can be prevented.

[0077] (Second Exemplary Implementation)

[0078] Next, a second exemplary embodiment will be described. The second exemplary embodiment differs from the first exemplary embodiment in the manner in which the heating element 40 is connected to the substrate 10.

[0079] Reference Figure 7 This section describes a construction example of the antenna device 200 according to a second exemplary embodiment. Figure 7 This is a schematic cross-sectional view of an antenna device according to a second exemplary embodiment, and is related to... Figure 2 Corresponding figures. Note that in the second exemplary embodiment, the schematic front view of the antenna device is similar, therefore its illustration and description are omitted. In other words, since the radome 50 according to the second exemplary embodiment has a similar construction to that of the first exemplary embodiment, its description will be appropriately omitted.

[0080] Antenna device 200 includes substrates 10 and 70, a plurality of antenna elements 20, ground layers 30 and 80, a plurality of heat-generating components 40, an radome 50, and a heat-transferring member 90. Antenna device 200 has a configuration that further includes substrate 70, ground layer 80, and heat-transferring member 90 in the configuration of antenna device 100 according to the first exemplary embodiment. Note that substrate 10, the plurality of antenna elements 20, ground layer 30, the plurality of heat-generating components 40, and radome 50 are substantially similar to those components in the first exemplary embodiment, and therefore common descriptions are appropriately omitted.

[0081] The substrate 70 is a substrate on which heat-generating components 40 are disposed. In the substrate 70, the number of heat-generating components 40, the same as the number of antenna elements 20, is disposed on a fourth surface opposite to the third surface facing the substrate 10. In other words, the number of heat-generating components 40, the same as the number of antenna elements 20, is disposed on the bottom surface of the substrate 70 in the negative Z-axis direction. Since the third surface faces the same direction as the front surface of the substrate 10, the third surface can be referred to as the front or top surface of the substrate 70, and the fourth surface can be referred to as the back or bottom surface of the substrate 70. Each of the plurality of heat-generating components 40 can be disposed at a position associated with each antenna element 20. In other words, each of the plurality of heat-generating components 40 can be disposed in the negative Z-axis direction of each antenna element 20.

[0082] A thermal via 71 is formed in the substrate 70 as a through-hole penetrating the substrate 70. The thermal via 71 is formed in the substrate 70 near the heating element 40. For example, the thermal via 71 is formed around each heating element 40. In other words, the thermal via 71 is formed on the substrate 70 such that each heating element 40 is surrounded by a plurality of thermal via 71.

[0083] In the substrate 70, heat transfer members 90, in the same number as the number of antenna elements 20 and the number of heat-generating components 40, are arranged on the front side facing the substrate 10. Each of the plurality of heat transfer members 90 is arranged at a position associated with each antenna element 20 and each heat-generating component 40. In other words, each of the plurality of heat transfer members 90 is arranged in the negative Z-axis direction of each of the antenna elements 20 and in the positive Z-axis direction of each of the heat-generating components 40.

[0084] A ground layer 80, made of, for example, copper foil, is formed on the front side, the thermal via 71, and the back side of the substrate 70. Each heating element 40 is connected to the heat transfer member 90 via the ground layer 80. The heating element 40 is electrically and thermally connected to the heat transfer member 90 via the ground layer 80. In other words, the heating element 40 is configured to transfer heat from the heating element 40 to the heat transfer member 90 via the thermal via 71. In other words, the thermal via 71 is configured as a heat radiation path and transfers the heat generated by the heating element 40 to the heat transfer member 90.

[0085] Note that, although in Figure 7 While figures are omitted, the heating element 40 is connected to an external circuit via at least one of the signal lines and control lines of the substrate 10, excluding the ground line. Furthermore, the ground pads (GND PAD1) on the back side of the heating element 40 or the ground patches (GND Pins) arranged around the heating element 40 are connected to the ground pattern surface (GND pattern) on the substrate 10 using a reflow soldering process employing surface mount technology (SMT) or similar techniques. Alternatively, the ground pads (GND PAD1) on the back side of the heating element 40 or the ground patches (GND Pins) arranged around the heating element 40 are connected to ground terminals (GND PAD2) for connecting ground pins using a reflow soldering process employing surface mount technology (SMT) or similar techniques. The ground connection portion, indicating the portion where the ground patches are connected to each other, is connected to the ground layer 80 in a manner that forms a heat radiation path not only through electrical grounding but also through thermal means.

[0086] A heat transfer member 90 connects substrate 10 and substrate 70 to each other. In other words, substrate 10 is arranged on the back side of substrate 10 in a manner connected to the heat transfer member 90. The heat transfer member 90 can be a filter (filter component) or a high-frequency coaxial cable. When the heat transfer member 90 is a filter, it can be an RF bandpass filter (BPF) constructed with a structure having high thermoelectric conductivity. The RF BPF can electrically and thermally connect the RF loop (not shown), TRX loop (not shown), and digital loop (not shown) arranged on substrate 70 to the antenna element 20 arranged on substrate 10. In other words, the RF BPF can be effectively utilized between each antenna element 20 and the RF and TRX in an electrical loop manner and in a thermal radiation path manner.

[0087] The heat transfer member 90 connects the back side of the substrate 10, opposite to the front side where the antenna element 20 is disposed, to the front side of the substrate 70. The heat transfer member 90 is electrically connected to the heat-generating member 40 and the antenna element 20. Furthermore, the heat transfer member 90 is thermally connected to the heat-generating member 40 and the wall portion 52 of the radome 50. In other words, it is configured such that heat generated by the heat-generating member 40 can be transferred to the wall portion 52 via the heat transfer member 90. In other words, the wall portion 52 of the radome 50 is configured to transfer heat from the heat-generating member 40 to the heat sink 56 via the heat transfer member 90. Specifically, the wall portion 52 is configured to transfer heat from the heat-generating member 40 to the heat sink 56 via the heat passage hole 71, the heat transfer member 90, and the heat passage hole 11.

[0088] Note that, to improve heat transfer efficiency, the heat transfer plate can be arranged between the substrate 10 and the heat transfer member 90, or between the heat transfer member 90 and the substrate 70. Furthermore, when the heat transfer member 90 is a high-frequency coaxial connection, a filter is mounted on the bottom surface of the substrate 10. Then, the substrate 70, on which a transceiver (not shown) for frequency sharing is arranged, is configured such that frequency sharing can be achieved by exchanging and connecting the frequency-dependent substrate 10 according to the operating frequency band.

[0089] Next, we will refer to Figure 8 The flow of thermal radiation in the antenna device 200 in the second exemplary embodiment is described. Figure 8 This is a diagram illustrating the flow of thermal radiation in an antenna device according to a second exemplary embodiment. Figure 8 Is Figure 7 The schematic cross-sectional view shown includes a diagram with white arrows illustrating the heat flow generated by the heating element 40. Figure 8 As shown, the heat generated in the heating element 40 is transferred to the heat transfer member 90 via the grounding layer 80. Specifically, the heating element 40 is arranged at a position in the negative Z-axis direction between the heat transfer member 90 and the antenna element 20, and a heat path hole 71 is formed near the heating element 40. The heat generated in the heating element 40 is transferred to the heat transfer member 90 via at least two heat path holes 71 arranged near the heating element 40.

[0090] Heat from the heat-generating component 40 is transferred via heat transfer member 90 to ground layer 30 disposed on the back side of substrate 10, and then via ground layer 30 to wall portion 52 of radome 50. Specifically, heat transfer member 90 is disposed at a position of antenna element 20 in the negative Z-axis direction, and heat passage holes 11 are formed between two adjacent antenna elements 20. Heat generated in the heat-generating component 40 is transferred via at least two heat passage holes 11 disposed near the heat-generating component 40 to two wall portions 52 covering the two heat passage holes 11. Then, the heat from the heat-generating component 40 transferred to the two wall portions 52 is transferred to planar portion 51 and radiated from heat sink 56 near slot 53, which serves as slot antenna element, disposed in planar portion 51.

[0091] As described above, in the antenna device 200, the heat-generating component 40 is arranged in a different position than in the first exemplary embodiment, but a heat-passing hole 71 is formed on the substrate 70, and a ground layer 80 is formed on the top surface of the heat-passing hole 71 and the substrate 70. Furthermore, the antenna device 200 is provided with a heat-transferring member 90 connected to the ground layer 80 and the ground layer 30. Therefore, the antenna device 200 can radiate the heat generated by the heat-generating component 40 to the outside via the heat-passing hole 71, the ground layer 80, the heat-transferring member 90, the ground layer 30, the heat-passing hole 11, the wall portion 52, the planar portion 51, and the heat sink 56. Therefore, the antenna device 200 according to the second exemplary embodiment can obtain similar advantageous effects to the first exemplary embodiment.

[0092] Note that this disclosure is not limited to the exemplary embodiments described above, and appropriate modifications can be made without departing from the scope of this disclosure. Furthermore, this disclosure can be implemented by appropriately combining each exemplary embodiment.

[0093] Furthermore, some or all of the above exemplary embodiments may be described as supplementary notes, but are not limited thereto.

[0094] (Supplementary Note 1)

[0095] An antenna device, comprising:

[0096] A first substrate, configured to arrange a plurality of antenna elements on a first surface; and

[0097] The radome, configured to cover the first substrate, has multiple slots formed at locations facing each of the plurality of antenna elements and is thermally conductive.

[0098] The antenna radome includes

[0099] A heat sink, configured to protrude from the opposite side of the first surface, and

[0100] The wall portion is configured to be disposed between a first antenna element and a second antenna element adjacent to the first antenna element among the plurality of antenna elements, and is capable of transferring heat from the heat-generating component connected to the first substrate to the heat sink.

[0101] (Supplementary Note 2)

[0102] According to the antenna device described in Supplementary Note 1, the heat sink is arranged between a first slot and a second slot adjacent to the first slot in the plurality of slots.

[0103] (Supplementary Note 3)

[0104] According to the antenna device described in supplementary note 1 or 2, wherein,

[0105] The first substrate includes a first thermal path hole that penetrates the first substrate and is disposed between the first antenna element and the second antenna element, and

[0106] The wall portion is disposed at the position covering the first heat passage hole when the antenna cover covers the first substrate, and is capable of transferring heat from the heat-generating component to the heat sink through the first heat passage hole.

[0107] (Supplementary Note 4)

[0108] According to any one of Supplementary Notes 1 to 3, the antenna device wherein the heating element is arranged on a second surface of the first substrate opposite to the first surface.

[0109] (Supplementary Note 5)

[0110] The antenna device according to any one of Supplementary Notes 1 to 3 further includes:

[0111] A second substrate, configured to accommodate the heating element; and

[0112] A heat transfer member is configured to connect a second surface of the first substrate, which is opposite to the first surface, and the second substrate to each other.

[0113] The wall portion is capable of transferring heat from the heat-generating component to the heat sink via the heat transfer member.

[0114] (Supplementary Note 6)

[0115] According to the antenna device described in Supplementary Note 5, wherein...

[0116] The second substrate includes a second thermal path hole that penetrates the second substrate.

[0117] The heating element is disposed on a fourth surface of the second substrate, which is opposite to the third surface of the second surface.

[0118] The wall portion can transfer heat from the heat-generating component to the heat sink via the second heat passage hole and the heat transfer member.

[0119] (Supplementary Note 7)

[0120] According to the antenna device described in Supplementary Note 6, the heat transfer component is a filter or a high-frequency coaxial cable.

[0121] (Supplementary Note 8)

[0122] According to any one of Supplementary Notes 1 to 7, each of the plurality of slots is formed by intersecting a first opening extending in a first direction and a second opening extending in a second direction different from the first direction.

[0123] (Supplementary Note 9)

[0124] According to the antenna device described in Supplementary Note 8, both ends of the first opening and the second opening are widened.

[0125] (Supplementary Note 10)

[0126] The antenna device according to any one of Supplementary Notes 1 to 9, wherein the plurality of slots are sealed with resin.

[0127] (Supplementary Note 11)

[0128] An antenna radome having thermal conductivity, the antenna radome comprising:

[0129] The planar portion, configured such that, in a state where a first substrate covering a plurality of antenna elements arranged on a first surface has a plurality of slots formed at positions facing each of the plurality of antenna elements, and includes heat sinks protruding from the opposite side of the first surface; and

[0130] The wall portion is configured to be disposed between a first antenna element and a second antenna element adjacent to the first antenna element among the plurality of antenna elements, and is capable of transferring heat from the heat-generating component connected to the first substrate to the heat sink.

[0131] (Supplementary Note 12)

[0132] According to Supplementary Note 11, the radome is arranged between a first slot and a second slot adjacent to the first slot in the plurality of slots.

[0133] (Supplementary Note 13)

[0134] According to Supplementary Note 12, the radome is provided at the position of covering the first heat passage hole formed on the first substrate when the radome covers the first substrate, and is able to transfer heat from the heat-generating component to the heat sink via the first heat passage hole.

[0135] (Supplementary Note 14)

[0136] According to any one of Supplementary Notes 11 to 13, each of the plurality of slots is formed by intersecting a first opening extending in a first direction and a second opening extending in a second direction different from the first direction.

[0137] (Supplementary Note 15)

[0138] According to the radome described in Supplementary Note 14, both ends of the first opening and the second opening are widened.

[0139] (Supplementary Note 16)

[0140] According to any one of Supplementary Notes 11 to 15, the radome wherein the plurality of slots are sealed with resin.

[0141] Although the invention of this application has been described with reference to exemplary embodiments, the invention of this application is not limited to the above description. Within the scope of this invention, various modifications that can be understood by those skilled in the art can be made to the structure and details of the invention.

[0142] This application is based on and claims priority to Japanese Application Special Purpose 2021-023028, filed on February 17, 2021, the entire disclosure of which is incorporated herein by reference.

[0143] Explanation of reference numerals in the attached figures

[0144] 10, 70 substrate

[0145] 11, 71 Thermal passage holes

[0146] 20 antenna elements

[0147] 30, 80 grounding layers

[0148] 40 Heating Components

[0149] 50 radome

[0150] 51. Planar section

[0151] 52 Wall section

[0152] 53 Slot

[0153] 53a First opening

[0154] 53b Second opening

[0155] 53c, 53d, 53e, 53f end caps

[0156] 54 First heat sink

[0157] 55 Second heat sink

[0158] 56 Heatsink

[0159] 61 Sealing materials

[0160] 90 Heat transfer components

[0161] 100 and 200 antenna devices

Claims

1. An antenna device, comprising: A first substrate is configured to arrange a plurality of antenna elements on a first surface; and The radome, configured to cover the first substrate, has multiple slots formed at locations facing each of the plurality of antenna elements and is thermally conductive. The antenna radome includes A heat sink, configured to protrude from the opposite side of the first surface, and The wall portion is configured to be disposed between a first antenna element and a second antenna element adjacent to the first antenna element among the plurality of antenna elements, and is capable of transferring heat from the heat-generating component connected to the first substrate to the heat sink.

2. The antenna device according to claim 1, wherein the heat sink is arranged between a first slot and a second slot adjacent to the first slot in the plurality of slots.

3. The antenna device according to claim 1, wherein... The first substrate includes a first thermal path hole that penetrates the first substrate and is disposed between the first antenna element and the second antenna element, and The wall portion is disposed at the position covering the first heat passage hole when the antenna cover covers the first substrate, and is capable of transferring heat from the heat-generating component to the heat sink through the first heat passage hole.

4. The antenna device according to any one of claims 1 to 3, wherein the heating element is disposed on a second surface of the first substrate opposite to the first surface.

5. The antenna device according to any one of claims 1 to 3, further comprising: A second substrate is configured to accommodate the heating element; and A heat transfer member is configured to connect a second surface of the first substrate, which is opposite to the first surface, and the second substrate to each other. The wall portion is capable of transferring heat from the heat-generating component to the heat sink via the heat transfer member.

6. The antenna device according to claim 5, wherein... The second substrate includes a second thermal path hole that penetrates the second substrate. The heating element is disposed on a fourth surface of the second substrate, which is opposite to the third surface of the second surface. The wall portion can transfer heat from the heat-generating component to the heat sink via the second heat passage hole and the heat transfer member.

7. The antenna device according to claim 6, wherein the heat transfer component is a filter or a high-frequency coaxial cable.

8. The antenna device according to any one of claims 1 to 3, wherein each of the plurality of slots is formed by intersecting a first opening extending in a first direction and a second opening extending in a second direction different from the first direction.

9. The antenna device according to claim 8, wherein both ends of the first opening and the second opening are widened.

10. A radome having thermal conductivity, the radome comprising: The planar portion is configured such that, in the state of covering a first substrate on a first surface where a plurality of antenna elements are arranged, a plurality of slots are formed at a position facing each of the plurality of antenna elements, and includes a heat sink protruding from the opposite side of the first surface. and The wall portion is configured to be disposed between a first antenna element and a second antenna element adjacent to the first antenna element among the plurality of antenna elements, and is capable of transferring heat from the heat-generating component connected to the first substrate to the heat sink.

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