石墨烯晶圆的转移方法
By forming a transfer medium layer of organic small molecule compounds and PMMA layers on the surface of graphene wafers, and combining it with heat treatment technology, the problems of PMMA residue and organic solvent use were solved, achieving efficient and clean graphene wafer transfer, thus improving production efficiency and industrialization potential.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING GRAPHENE INST
- Filing Date
- 2022-03-21
- Publication Date
- 2026-07-17
AI Technical Summary
In existing graphene transfer methods, it is difficult to completely remove the residues of polymers such as PMMA, which affects the structure and properties of graphene. At the same time, the use of organic solvents poses safety and efficiency issues, which limits the industrial application of graphene.
A transfer medium layer comprising an organic small molecule compound layer and a polymethyl methacrylate layer is used. The organic small molecules are volatilized through heat treatment, achieving conformal contact between graphene and the target substrate. This avoids the use of organic solvents, reduces contaminant residue, and enhances adhesion.
It enables large-area, clean, and non-destructive graphene wafer transfer, improving production efficiency and reducing costs. At the same time, it reduces residual contaminants on the graphene surface, is suitable for various substrates and growth substrates, and promotes the industrial application of graphene.
Smart Images
Figure CN116812924B_ABST