A thermoelectric device refrigeration performance test system

Abstract

The application relates to a thermoelectric device refrigeration performance test system. The thermoelectric device refrigeration performance test system comprises a measuring unit, a power supply unit and a sample table, the sample table is used for clamping a to-be-tested thermoelectric device, the power supply unit and the to-be-tested thermoelectric device constitute a test loop to divide two ends of the to-be-tested thermoelectric device into a hot end and a cold end, the sample table comprises a constant-temperature part used for keeping the temperature of the hot end of the thermoelectric device constant and a movable-temperature part used for selectively providing heat for the cold end of the thermoelectric device, the hot end of the to-be-tested thermoelectric device is in abutment with the constant-temperature part, the cold end of the to-be-tested thermoelectric device is in abutment with the movable-temperature part, the measuring unit is connected with the constant-temperature part, the to-be-tested thermoelectric device and the movable-temperature part respectively and is used for collecting refrigeration parameters of the to-be-tested thermoelectric device, wherein the measuring unit realizes the test on the refrigeration capacity of the thermoelectric device by using the temperature difference between the first temperature and the second temperature of the movable-temperature part at at least two positions away from the thermoelectric device.

Description

Technical Field

[0001] This application relates to the field of semiconductor device testing technology, specifically to a thermoelectric device cooling performance testing system. Background Technology

[0002] Thermoelectric conversion technology based on the Peltier effect can achieve refrigeration. Compared with traditional refrigeration technology, thermoelectric refrigeration has the advantages of not requiring a compressor, being green and environmentally friendly, safe and reliable, and having a long lifespan. Moreover, it has a fast response speed and high temperature control accuracy. It can be integrated into other electronic devices for local refrigeration and temperature control, and in some special occasions (such as confined spaces and large temperature differences), it is even irreplaceable.

[0003] Chinese Patent CN 113466542 A discloses a thermoelectric refrigeration device performance testing apparatus and method, but it has the following problems: On the one hand, when testing the cooling capacity and cooling efficiency, the apparatus directly uses the electric power of the cold end compensation heater as the cooling capacity of the device. As is well known, a large part of the electric heating power is radiated to the external environment through heat. Therefore, the method will lead to an overestimation of the cooling capacity and an underestimation of the cooling efficiency. On the other hand, the apparatus uses a point contact pressurization method, which concentrates the force on the sample and easily leads to uneven temperature on the cold surface of the sample or even damage to the sample.

[0004] In addition, Chinese patent CN 212459488 U discloses a semiconductor cooling chip temperature difference testing device. Although the device is equipped with a first heat insulation pad and a second heat insulation pad, it still indirectly connects the hot end and the cold end. The cold end load is greatly affected by heat conduction, convection and radiation, and there is no temperature control device for the hot end. As the test time increases, the temperature of the hot end rises rapidly, and the temperature of the cold end will also rise. Therefore, it can only roughly measure the temperature difference at room temperature, and the device cannot test the cooling capacity and cooling efficiency.

[0005] In summary, the existing technology has insufficient accuracy in measuring the refrigeration performance of thermoelectric devices and needs further improvement. Summary of the Invention

[0006] This application provides a system and method for testing the cooling performance of thermoelectric devices, so as to achieve more accurate measurement of the cooling performance of thermoelectric devices.

[0007] A first aspect of this application provides a system for testing the cooling performance of a thermoelectric device, comprising a measurement unit, a power supply unit, and a sample stage. The sample stage is used to hold the thermoelectric device under test. The power supply unit and the thermoelectric device under test form a test circuit to divide the two ends of the thermoelectric device under test into a hot end and a cold end. The sample stage includes a constant temperature section for keeping the temperature of the hot end of the thermoelectric device constant and a dynamic temperature section for selectively providing heat to the cold end of the thermoelectric device. The hot end of the thermoelectric device under test abuts against the constant temperature section, and the cold end of the thermoelectric device under test abuts against the dynamic temperature section. The measurement unit is connected to the constant temperature section, the thermoelectric device under test, and the dynamic temperature section respectively to collect the cooling parameters of the thermoelectric device under test. The measurement unit uses the temperature difference between a first temperature and a second temperature at at least two locations away from the thermoelectric device to test the cooling capacity of the thermoelectric device.

[0008] Optionally, in some embodiments of this application, the dynamic temperature section has a first hole on the side near the cold end of the thermoelectric device to be measured, and a second hole on the side away from the cold end of the thermoelectric device to be measured. The first hole and the second hole are respectively connected to the measuring unit to obtain a first temperature and a second temperature, so as to realize the calculation of the cooling capacity of the thermoelectric device to be measured.

[0009] Optionally, in some embodiments of this application, the cooling capacity of the thermoelectric device under test is calculated using the following formula.

[0010] ,

[0011] Wherein, λ is the thermal conductivity of the material of the dynamic temperature section; ΔT is the difference between the first temperature and the second temperature on the dynamic temperature section; W is the cross-sectional length of the dynamic temperature section; L is the cross-sectional width of the dynamic temperature section; and H is the distance between the first hole and the second hole on the dynamic temperature section.

[0012] Optionally, in some embodiments of this application, the dynamic temperature section includes a temperature measuring block, a heat flow meter, and a heat source. The dynamic temperature section is connected to the temperature measuring block via one side of the heat flow meter, and the other side of the heat flow meter is connected to the heat source. The dynamic temperature section abuts against the cold end of the thermoelectric device to be measured via the temperature measuring block.

[0013] The heat source can provide heat to the cold end of the thermoelectric device under test so that the cold end and the hot end of the thermoelectric device under test have the same temperature. The measuring unit obtains the cooling capacity of the thermoelectric device under test based on the temperature values ​​of the heat flow meter at different locations away from the thermoelectric device under test.

[0014] Optionally, in some embodiments of this application, the cooling parameters include cooling efficiency, and the measuring unit is connected to the thermoelectric device under test for measuring the input power of the thermoelectric device under test, wherein...

[0015] The measurement unit obtains the cooling efficiency of the thermoelectric device under test based on the input power of the thermoelectric device under test and the cooling capacity.

[0016] Optionally, in some embodiments of this application, the cross-sectional dimensions of the temperature measuring block and the heat flow meter are consistent with the cold end dimensions of the thermoelectric device to be measured.

[0017] Optionally, in some embodiments of this application, the thermoelectric device cooling performance testing system further includes a temperature control unit, which is used to control the temperature of the constant temperature section and the heat source, wherein...

[0018] The temperature control unit has dual-channel PID control to independently control the constant temperature section and the heat source.

[0019] Optionally, in some embodiments of this application, the sample stage further includes a clamping part, which abuts against the constant temperature part and the dynamic temperature part respectively to clamp the thermoelectric device to be tested.

[0020] Optionally, in some embodiments of this application, the clamping part includes a frame, a drive shaft, and a driver, wherein the driver is used to drive the drive shaft to move in a set direction, wherein

[0021] The frame includes an upper pressure plate, an upper support rod, and a base plate. The upper pressure plate and the base plate are movably connected through the upper support rod. The constant temperature section, the temperature difference electrical device to be measured, and the dynamic temperature section are stacked sequentially on the base plate. The upper pressure plate abuts against the dynamic temperature section, and the transmission shaft passes through the base plate and abuts against the constant temperature section.

[0022] Optionally, in some embodiments of this application, the clamping portion further includes a bellows, which is sleeved on the drive shaft disposed between the substrate and the driver, wherein...

[0023] The bellows is sealed and fixed to the substrate and the driver.

[0024] Optionally, in some embodiments of this application, the cooling performance includes maximum temperature difference, maximum cooling capacity, and cooling efficiency, wherein...

[0025] When the thermoelectric device cooling performance testing system is testing the maximum cooling capacity or the cooling efficiency, the dynamic temperature section provides heat to the cold end of the thermoelectric device.

[0026] Optionally, in some embodiments of this application, the test system further includes an atmosphere unit for providing a test atmosphere for the thermoelectric device.

[0027] A second aspect of this application provides a method for testing the cooling performance of a thermoelectric device, using the aforementioned thermoelectric device cooling performance testing system. The testing method includes the following steps:

[0028] The thermoelectric device to be measured is placed on the sample stage so that it comes into contact with the constant temperature section and the dynamic temperature section, and is electrically connected to the power supply unit and the measurement unit.

[0029] Adjust the thermostat to the set temperature, obtain the cooling temperature difference value under different current values, and determine the maximum temperature difference value and the optimal operating current.

[0030] Adjust the power supply unit to the optimal operating current state, and provide heat to the cold end of the thermoelectric device by adjusting the dynamic temperature section, so that the cold end and hot end of the thermoelectric heater under test are at the same temperature, obtain the cooling capacity data and input power under different temperature differences, and determine the maximum cooling capacity and cooling efficiency.

[0031] The beneficial effects of this application are as follows:

[0032] When testing the maximum temperature difference, a temperature measuring block is set up and made to fit tightly against and cover the cold end of the thermoelectric device. This is relative to the pressure contact temperature measurement, which avoids the cold end of the thermoelectric device transferring heat between the structural components and the surrounding environment, effectively reducing the impact of environmental heat load.

[0033] A high thermal conductivity temperature measuring block is used to be closely attached to the thermoelectric device, resulting in a more uniform temperature field. Compared with point contact temperature measurement, it can better reflect the true temperature difference of the thermoelectric device.

[0034] In maximum cooling mode, based on the linear relationship between temperature difference and cooling capacity, the method of obtaining the maximum cooling capacity by measuring a set of "temperature difference - cooling capacity" can avoid errors introduced by some accidental factors compared to testing only one point.

[0035] Using a heat flow meter to measure cooling capacity is more accurate and avoids the effects of heater thermal radiation and convection. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1This is a schematic diagram of a thermoelectric device refrigeration performance testing system provided in this application;

[0038] Figure 2 This is a structural diagram of a sample holder provided in this application;

[0039] Figure 3 This is a structural diagram of a heat flow meter provided in this application;

[0040] Figure 4 This is a structural diagram of a sample stage for a clamping mechanism provided in this application.

[0041] Figure 5 This is a schematic diagram of a maximum temperature difference test principle provided in this application;

[0042] Figure 6 This application provides a schematic diagram of a test principle for maximum cooling capacity and cooling efficiency.

[0043] Figure 7 The thermal conductivity property of a copper block used in a heat flow meter provided in this application;

[0044] Figure 8 This is a graph showing the relationship between the cooling temperature difference and the current of the thermoelectric device tested in the embodiment.

[0045] Figure 9 This is a graph showing the relationship between the cooling capacity of the thermoelectric device and the cooling temperature difference tested in the example.

[0046] Figure 10 The graph shows the relationship between the cooling efficiency of the thermoelectric device and the cooling temperature difference tested in the example.

[0047] Figure label:

[0048] 10. Atmosphere unit; 20. Sample stage;

[0049] 210, constant temperature section; 211, constant temperature stage; 212, constant temperature source;

[0050] 220, Dynamic temperature section; 221, Temperature measuring block; 222, Heat flow meter; 2221, First hole; 2222, Second hole; 223, Heat source;

[0051] 230, Clamping part; 2311, Upper pressure plate; 2312, Upper support rod; 2313, Base plate; 2314, Lower pressure plate; 2315, Lower support rod; 232, Drive shaft; 2331, Cylinder; 2332, Cylinder connector; 2333, Weighing sensor; 234, Bellows; 235, Thermal insulation component;

[0052] 30, Thermoelectric device; 40, Power supply unit; 50, Measurement unit; 60, Control unit; 70, Temperature control unit. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," "right," "front," and "back" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.

[0054] It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment in the following embodiments have their own emphasis; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0055] With the application and development of thermoelectric refrigeration technology in the industrial field, devices of various shapes and sizes have emerged, some even with very irregular shapes. However, the most direct technical parameters reflecting the refrigeration performance of thermoelectric devices mainly include their maximum temperature difference ∆T_max, maximum cooling capacity Q_max, and refrigeration efficiency COP at a certain temperature.

[0056] The definitions of maximum temperature difference, maximum cooling capacity, and cooling efficiency are as follows:

[0057] In cooling mode, when the thermoelectric device is operating at the optimal current and the cold end thermal load is zero, the temperature difference between the two ends of the device at steady state is the maximum temperature difference ∆T_max.

[0058] In cooling mode, when the thermoelectric device is operating at the optimal current and the temperature difference between its two ends is zero, the heat extraction capacity of the cold end of the device is the maximum cooling capacity Q_max.

[0059] In cooling mode, when the thermoelectric device is working, the ratio of the cooling capacity to the input electrical power is the cooling efficiency.

[0060] Please see Figures 1-10 , Figure 1The image illustrates a system for testing the refrigeration performance of a thermoelectric device 30. This system is used to test the refrigeration performance of the thermoelectric device 30, including maximum temperature difference, maximum cooling capacity, and refrigeration efficiency. The system includes an atmosphere unit 10 for providing a test atmosphere for the thermoelectric device 30, a sample stage 20 for placing the thermoelectric device 30, a power supply unit 40 for electrically connecting to the thermoelectric device 30 to form a test circuit, and a measurement unit 50 for acquiring the refrigeration parameters of the thermoelectric device 30. The test atmosphere is preferably a vacuum or an inert test atmosphere.

[0061] The power supply unit 40 and the thermoelectric device 30 constitute the test circuit. The conducting current of the test circuit forms the hot and cold ends of the thermoelectric device 30. Please refer to [link / reference]. Figure 2 The sample stage 20 includes a constant temperature section 210 and a dynamic temperature section 220. Specifically, the hot end of the thermoelectric device 30 abuts against the constant temperature section 210, which is used to keep the hot end of the thermoelectric device 30 at a constant temperature.

[0062] The cold end of the thermoelectric device 30 abuts against the dynamic temperature section 220. The dynamic temperature section 220 is used to selectively provide heat to the cold end of the thermoelectric device 30 to ensure that the cold end of the thermoelectric device 30 has sufficient heat to absorb heat. Specifically, when the thermoelectric device 30 refrigeration performance testing system is used to test the maximum temperature difference of the thermoelectric device 30, the dynamic temperature section 220 does not need to provide heat to the cold end of the thermoelectric device 30; when the thermoelectric device 30 refrigeration testing system is used to test the maximum cooling capacity and cooling efficiency of the thermoelectric device, the dynamic temperature section 220 is used to conduct heat to the thermoelectric device 30, so that the cold end temperature of the thermoelectric device 30 is maintained at a specific value.

[0063] The measuring unit 50 is connected to the constant temperature unit 210, the thermoelectric device 30 and the dynamic temperature unit 220 respectively to measure the refrigeration parameters of the thermoelectric device 30, such as the temperature values ​​of the cold end and the hot end, the refrigeration capacity, the input power and other refrigeration parameters.

[0064] When it is necessary to measure the maximum temperature difference of the thermoelectric device 30, the temperature of the constant temperature stage 211 is set to keep it constant, and the power supply unit 40 gradually increases the output current from small to large, so that the cold end of the thermoelectric device 30 begins to cool. At this time, the dynamic temperature section 220 does not provide heat. After the cold end temperature stabilizes, the temperature difference between the cold end and the hot end of the thermoelectric device 30 under different currents is collected by the measuring unit 50 to determine the maximum temperature difference.

[0065] When it is necessary to measure the maximum cooling capacity of the thermoelectric device 30, the temperature of the constant temperature stage 211 is set to keep it constant, the power supply unit 40 outputs a specific current, preferably the output current under the maximum temperature difference state, the dynamic temperature unit 220 provides heat to the thermoelectric device 30 until the cold end temperature is the same as the hot end temperature, and the cooling capacity under different temperature differences is detected by the measuring unit 50 to determine the maximum cooling capacity.

[0066] When it is necessary to measure the cooling efficiency (COP) of the thermoelectric device 30, the temperature of the constant temperature stage 211 is set to be kept constant, and the power supply unit 40 outputs a specific current to make the cold end and the hot end of the thermoelectric device 30 have a temperature difference. The input power and cooling capacity are obtained by the measurement unit 50 to determine the cooling efficiency. The input power is calculated by measuring the input voltage and current at both ends of the thermoelectric device pins.

[0067] Therefore, by setting up an atmosphere unit 10, a sample stage 20 including a constant temperature section 210 and a dynamic temperature section 220, a power supply unit 40 and a measurement unit 50 to form a cooling performance testing system for the thermoelectric device 30 under test, and by forming a test circuit with the power supply unit 40 and the thermoelectric device 30, and especially by setting the dynamic temperature section 220 to selectively output heat, the cooling performance of the thermoelectric device 30 under test can be directly tested, thus improving the detection efficiency.

[0068] Please continue reading. Figures 2-4 In one embodiment, the dynamic temperature unit 220 includes a temperature measuring block 221, a heat flow meter 222, and a heat source 223. The heat flow meter 222 is connected to the heat source 223 on one side and to the temperature measuring block 221 on the other side. The heat flow meter 222 is connected to the measuring unit 50 for measuring the cooling capacity of the thermoelectric device 30. The temperature measuring block 221 abuts against the cold end of the thermoelectric device 30 and is connected to the measuring unit 50 for measuring the cold end temperature of the thermoelectric device 30. The heat source 223 is connected to the heat flow meter 222 to provide heat, such as an electric heater, preferably a sheathed electric heater.

[0069] Please see Figure 2 , Figure 3 The heat flow meter 222 has a first hole 2221 near the cold end of the thermoelectric device 30 and a second hole 2222 away from the cold end of the thermoelectric device 30. The first hole 2221 and the second hole 2222 are used to accommodate the measuring end of the measuring unit 50 to detect the temperature difference between the first hole 2221 and the second hole 2222, thereby determining the cooling capacity of the thermoelectric device 30.

[0070] Specifically, the cooling capacity of the thermoelectric device 30 is calculated using the following formula:

[0071] ,

[0072] in,

[0073] λ is the thermal conductivity of the heat flow meter material, in W / mK;

[0074] ΔT is the difference between the first and second temperatures on the heat flow meter, in K.

[0075] W represents the cross-sectional length of the heat flow meter, in meters (m).

[0076] L is the cross-sectional width of the heat flow meter, in meters (m).

[0077] H is the distance between the first and second temperature sensing holes on the heat flow meter, in meters (m).

[0078] Therefore, by setting up a dynamic temperature section 220 including a heat flow meter 222, a temperature measuring block 221 and a heat source 223, the cooling capacity of the thermoelectric device 30 can be measured very well.

[0079] It should be noted that this application utilizes the temperature difference of the heat flow meter 222 at different locations relative to the thermoelectric device 30, and leverages the inherent characteristics of the heat flow meter 222 to effectively test the cooling capacity of the thermoelectric device 30. This solution effectively solves the problem in existing technologies where directly using the electrical power of the cold-side heater of the thermoelectric device 30 as the calculation of its cooling capacity leads to an overestimation of the measured value, thus improving measurement accuracy.

[0080] It should also be noted that the purpose of setting the temperature measuring block 221 is to make the surface contact temperature measurement, thereby making the temperature difference of the temperature difference device 30 more uniform.

[0081] In one embodiment, the side temperature measuring block 221 is a sheet-like block with a cross-section consistent with the outline dimensions of the thermoelectric device 30. Correspondingly, the heat flow meter 222 is preferably a cylinder with a base cross-sectional dimension consistent with the dimensions of the thermoelectric device 30. This allows for better measurement of the cold junction temperature and cooling capacity of the thermoelectric device 30.

[0082] In one embodiment, when testing the maximum temperature difference of the thermoelectric device, the dynamic temperature section 220 preferably consists only of the temperature measuring block 221. Since the heat flow meter 222 itself is a large heat load, its presence will affect the maximum achievable temperature limit of the cold end of the thermoelectric device when measuring the maximum temperature difference, leading to a significant error between the measured maximum temperature difference and the theoretical value. By ensuring that the dynamic temperature section consists only of the temperature measuring block when measuring the maximum temperature difference, the testing error can be minimized and the testing accuracy improved.

[0083] Accordingly, in a preferred embodiment, when testing the maximum cooling capacity and cooling efficiency of the thermoelectric device, by setting up a heat flow meter, the actual heat absorbed by the cold end of the thermoelectric device can be calculated more accurately, thereby improving the measurement accuracy.

[0084] Please continue reading. Figure 2 , Figure 5The temperature control unit 210 includes a temperature control stage 211 and a temperature control source (not shown in the figure). The temperature control source is connected to the temperature control stage 211 to ensure that the temperature of the temperature control stage 211 is constant. Preferably, the temperature control source is a water-cooled jacket.

[0085] In another embodiment, the temperature stage may be equipped with an electric heater to increase the testing temperature range of the thermoelectric device.

[0086] In another embodiment, in order to make the temperature control of the hot end of the thermoelectric device 30 more stable, the cross-sectional dimension of the constant temperature stage 211 is larger than that of the thermoelectric device 30.

[0087] In another embodiment, the constant temperature section 210 and the dynamic temperature section 220 are provided with blind holes for accommodating the detection terminals of the measuring unit 50, thereby minimizing the influence of environmental factors on the temperature detection of the thermoelectric device 30 and improving the detection accuracy.

[0088] In another embodiment, the constant temperature stage 211, the temperature measuring block 221 and the heat flow meter 222 are all made of materials with high thermal conductivity, such as metallic copper, aluminum, silicon nitride ceramic, aluminum nitride ceramic, etc.

[0089] In another embodiment, in order to better achieve temperature measurement of the thermoelectric device 30, the thermoelectric device 30 is connected to the temperature measuring block 221 and the constant temperature stage 211 by thermal grease to achieve good thermal contact.

[0090] Furthermore, the power supply unit 40 is preferably a programmable DC power supply.

[0091] In yet another implementation, please refer to Figures 5-6 In order to eliminate the influence of the leads on the test results during voltage testing, the measuring unit 50 and the thermoelectric device 30 are connected in a "four-wire" manner to form a refrigeration test circuit.

[0092] In another embodiment, the measurement unit 50 is provided with at least six channels. Channel 1 (ch1), channel 2 (ch4), channel 3 (ch3), and channel 4 (ch4) are used to acquire the hot side temperature, cold side temperature, first temperature of heat flow meter 222, and second temperature of heat flow meter 222 of thermoelectric device 30, respectively. Channel 5 (ch5) and channel 6 (ch6) are used to acquire the test current and the input voltage of thermoelectric device, respectively.

[0093] In another embodiment, the sample stage 20 also includes a temperature control unit with dual-channel PID temperature control. The first channel is used to control the temperature of the constant temperature stage 211 by controlling the temperature of the constant temperature source, and the second channel controls the cold junction temperature of the thermoelectric device 30 by controlling the temperature of the heat source 223.

[0094] In another embodiment, the sample stage 20 further includes a control unit, which is connected to a temperature control unit, a power supply unit 40, a measurement unit 50, and a dynamic temperature unit 220 to achieve automatic control. The control unit can selectively control the heating power of the heat source 223 to selectively provide heat to the cold end of the thermoelectric device 30. The control unit is preferably an industrial computer. The control unit is connected to the power supply unit 40 and the measurement unit 50 via a USB to GPIB connector, and to the temperature control unit via a USB to RS-485 connector.

[0095] In another implementation, please refer to Figure 4 In order to better achieve contact between the thermoelectric device 30 and the constant temperature section 210 and the dynamic temperature section 220, the sample stage 20 also includes a clamping section 230.

[0096] As an example implementation, the clamping part 230 includes a frame 231, a drive shaft 232, a driver 233, a thermoelectric device 30, a constant temperature part 210, and a dynamic temperature part 220 disposed within the frame 231. The constant temperature part 210 abuts against one side of the frame 231, and the dynamic temperature part 220 abuts against the other side of the frame 231. The drive shaft 232 passes through the frame 231 and abuts against the constant temperature part 210. The drive shaft 232 is movable relative to the frame 231. The driver 233 is used to drive the adjustment of the position of the drive shaft 232 relative to the frame 231, thereby achieving the abutment between the frame 231 and the constant temperature part 210 and the dynamic temperature part 220.

[0097] In another embodiment, the frame includes an upper pressure plate 2311, an upper support rod 2312, and a base plate 2313. The upper pressure plate 2311 and the base plate 2313 are movably connected via the upper support rod 2312, preferably by bolts, allowing the upper pressure plate 2311 to be adjusted relative to the upper support rod 2312. A constant temperature section 210, a thermoelectric device 30, and a dynamic temperature section 220 are stacked sequentially on the base plate 2313, with the upper pressure plate 2311 abutting against the dynamic temperature section 220. The base plate 2313 has through holes for the drive shaft 232 to pass through and abut against the constant temperature section 210.

[0098] In another embodiment, the clamping part 230 further includes a bellows 234, which is sleeved on the drive shaft disposed between the substrate 2313 and the driver 233. The bellows 234 is sealed and fixed to the substrate 2313 and the driver 233 by flanges to provide a better test atmosphere for the thermoelectric device 30.

[0099] In another embodiment, the actuator 233 includes a cylinder 2331, a cylinder 2331 connector, and a weighing sensor 2333. One end of the cylinder 2331 connector is connected to the cylinder 2331, and the other end is connected to the weighing sensor 2333. The weighing sensor 2333 is connected to the drive rod via a flange of a bellows 234. The weighing sensor 2333 is used to display the clamping force, facilitating the measurement operator to adjust the clamping force on the constant temperature section 210 and the dynamic temperature section 220.

[0100] In another embodiment, the frame 231 further includes a lower pressure plate 2314 and a lower support rod 2315. The lower pressure plate 2314 is movably connected to the base plate 2313 via the lower support rod 2315, preferably by bolts, so that the relative position of the lower pressure plate 2314 and the lower support rod 2315 can be adjusted. The cylinder 2331 is fixedly connected to the lower pressure plate 2314, and the output end of the cylinder 2331 passes through the lower pressure plate 2314 and is connected to the cylinder 2331 connector. The extension and retraction of the output end of the cylinder 2331 drives the force transmission shaft to press the thermoelectric device 30 through the constant temperature section 210 and the dynamic temperature section 220.

[0101] In another embodiment, the clamping part 230 further includes a heat insulation member 235, which is disposed between the upper pressure plate 2311 and the dynamic temperature part 220 to reduce geothermal transfer between the dynamic temperature part 220 and the surrounding environment and improve energy utilization efficiency.

[0102] This application also provides a test procedure for testing the cooling performance of a thermoelectric device 30 using a thermoelectric device 30 cooling performance testing system, the test procedure including:

[0103] Step 1: Place the thermoelectric device 30 to be tested on the sample stage 20, so that the thermoelectric device 30 to be tested is in contact with the dynamic temperature section 220 and the constant temperature section 210, and electrically connect the thermoelectric device 30 to the power supply unit 40 and the measurement unit 50.

[0104] Step 2: Provide a test atmosphere to the thermoelectric device under test 30 through the atmosphere unit 10, so that the thermoelectric device under test 30 is in the test atmosphere;

[0105] Step 3: Control the temperature controller to keep the constant temperature stage 211 at the set temperature, obtain the cooling temperature difference value under different current values, and determine the maximum temperature difference value and the optimal operating current.

[0106] Step 4: Adjust the power supply unit 40 to the optimal operating current state, adjust the heat source 223 to make the cold side and hot side of the temperature difference heater the same, obtain the cooling capacity data and input power under different temperature differences, and determine the maximum cooling capacity and cooling efficiency.

[0107] Example:

[0108] This embodiment provides an implementation scheme for measuring the performance of a thermoelectric device 30 (model TEC1-12703, cross-sectional size 30×30mm) at different temperatures using a thermoelectric device 30 refrigeration performance testing system and testing method provided in this application.

[0109] Based on the cross-sectional dimensions of the sample, the dimensions of the constant temperature stage 211 were determined to be 60×60mm. The cross-sectional dimensions of the temperature measuring block 221 and the heat flow meter 222 were 30×30mm. The heat flow meter 222 was made of high-purity copper and its thermal conductivity was as follows: Figure 7 As shown, the distance between the two temperature measuring holes is 30mm. After applying thermal paste to the cold and hot ends of the sample, install it onto the sample holder, connect the leads, and insert the thermocouple into the corresponding temperature measuring hole.

[0110] Close the sample chamber and establish a vacuum environment. When the vacuum level is higher than 10⁻¹ Pa, start the thermoelectric device 30 cooling performance test. Set the temperature of the constant temperature stage 211 to 25℃ and 50℃, set the current step to 0.5A and the temperature step to 5℃, and start the test.

[0111] The system controls the operation of the temperature controller and data acquisition unit. When the temperature stabilizes, the DC power supply outputs current from 0 according to the set step size. During this process, the current and the cooling temperature difference are recorded, and a curve showing the relationship between the cooling temperature difference and the current is plotted. Figure 8 As shown in the figure, the optimal operating current of the sample is 3A, and the maximum temperature difference corresponding to the cold side temperatures of 25℃ and 50℃ are 62℃ and 73℃, respectively.

[0112] Next, the maximum cooling capacity and cooling efficiency were tested. The sample chamber was opened, and the heat flow meter 222, heat source 223, and insulation block were installed on the sample holder. The clamping mechanism was activated, and the pressure was set to 30 kg. The test atmosphere was re-established, and the DC power supply was controlled to output the optimal operating current of 3 A. The data acquisition unit was activated, and when the temperature stabilized, the heat source 223 was controlled to start heating according to the set step value. During the heating process, the input power, cooling capacity, and temperature difference were recorded, and the relationship between temperature difference and cooling capacity, and between cooling efficiency and temperature difference, were plotted as follows: Figure 9 , Figure 10 As shown, linear fitting of the cooling capacity and temperature difference curves at 25℃ and 50℃ yields the maximum cooling capacity of the thermoelectric device 30 as 24.4W and 26.8W, respectively.

[0113] The solution of this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

[0114] Throughout this specification, the terms "an embodiment," "embodiment," or "specific embodiment" refer to a particular feature, structure, or characteristic described in connection with an embodiment that is included in at least one embodiment of this application, but not necessarily in all embodiments. Therefore, the various representations of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout this specification do not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic of any specific embodiment of this application may be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments described and illustrated herein may be based on the teachings herein and will be considered part of the spirit and scope of this application.

[0115] It should also be understood that one or more of the elements shown in the figures may be implemented in a more separate or more integrated manner, or may even be removed because they are inoperable in certain circumstances or provided because they may be useful for a particular application.

[0116] Furthermore, unless otherwise expressly stated, any arrows in the accompanying drawings should be considered illustrative only and not limiting. Additionally, unless otherwise stated, the term "or" as used herein is generally intended to mean "and / or". Where a term is anticipated to provide a separation or combination capability that is unclear, a combination of components or steps will also be considered as indicated.

Claims

1. A thermoelectric device refrigeration performance testing system, comprising a measurement unit, a power supply unit, and a sample stage, wherein the sample stage is used to hold the thermoelectric device under test, and the power supply unit and the thermoelectric device under test form a test circuit to divide the two ends of the thermoelectric device under test into a hot end and a cold end, characterized in that: The sample stage includes a constant-temperature section and a dynamic-temperature section for maintaining a constant hot-end temperature of the thermoelectric device. The dynamic-temperature section can selectively provide heat to the cold end of the thermoelectric device. The hot end of the thermoelectric device under test abuts against the constant-temperature section, and the cold end of the thermoelectric device under test abuts against the dynamic-temperature section. The measuring unit is connected to the constant-temperature section, the thermoelectric device under test, and the dynamic-temperature section respectively to collect the cooling parameters of the thermoelectric device under test. The measuring unit utilizes the temperature difference between the first and second temperatures at at least two locations away from the thermoelectric device to test the cooling capacity of the thermoelectric device. The sample stage further includes a clamping part, which abuts against the constant temperature part and the dynamic temperature part respectively to clamp the thermoelectric device to be tested; the clamping part includes a frame, a drive shaft and a driver, the driver is used to drive the drive shaft to move in a set direction, wherein the thermoelectric device, the constant temperature part and the dynamic temperature part are disposed in the frame, the constant temperature part abuts against one side of the frame and the dynamic temperature part abuts against the other side of the frame; the drive shaft passes through the frame and abuts against the constant temperature part, the drive shaft can move relative to the frame, and the driver is used to drive the adjustment of the position of the drive shaft relative to the frame.

2. The thermoelectric device refrigeration performance testing system according to claim 1, characterized in that, The dynamic temperature section has a first hole on the side near the cold end of the thermoelectric device under test, and a second hole on the side away from the cold end of the thermoelectric device under test. The first hole and the second hole are respectively connected to the measuring unit to obtain a first temperature and a second temperature, so as to realize the calculation of the cooling capacity of the thermoelectric device under test.

3. A thermoelectric device refrigeration performance testing system according to claim 1 or 2, characterized in that, The cooling capacity of the thermoelectric device under test is calculated using the following formula. ； Wherein, λ is the thermal conductivity of the material of the dynamic temperature section; ΔT is the difference between the first temperature and the second temperature on the dynamic temperature section; W is the cross-sectional length of the dynamic temperature section; L is the cross-sectional width of the dynamic temperature section; and H is the distance between the first hole and the second hole on the dynamic temperature section.

4. The thermoelectric device refrigeration performance testing system according to claim 1, characterized in that, The dynamic temperature unit includes a temperature measuring block, a heat flow meter, and a heat source. One side of the heat flow meter is connected to the temperature measuring block, and the other side of the heat flow meter is connected to the heat source. The dynamic temperature unit abuts against the cold end of the thermoelectric device under test via the temperature measuring block. The heat source can provide heat to the cold end of the thermoelectric device under test so that the cold end and the hot end of the thermoelectric device under test have the same temperature. The measuring unit obtains the cooling capacity of the thermoelectric device under test based on the temperature values ​​of the heat flow meter at different locations away from the thermoelectric device under test.

5. The thermoelectric device refrigeration performance testing system according to claim 4, characterized in that, The cooling parameters include cooling efficiency. The measuring unit is connected to the thermoelectric device under test for measuring the input power of the thermoelectric device under test. The measurement unit obtains the cooling efficiency of the thermoelectric device under test based on the input power of the thermoelectric device under test and the cooling capacity.

6. A thermoelectric device refrigeration performance testing system according to claim 4, characterized in that, The cross-sectional dimensions of the temperature measuring block and the heat flow meter are consistent with the cold end dimensions of the thermoelectric device to be measured.

7. The thermoelectric device refrigeration performance testing system according to claim 4, characterized in that, The thermoelectric device refrigeration performance testing system further includes a temperature control unit, which is used to control the temperature of the constant temperature section and the heat source. The temperature control unit has dual-channel PID control to independently control the constant temperature section and the heat source.

8. A thermoelectric device refrigeration performance testing system according to claim 1, characterized in that, The frame includes an upper pressure plate, an upper support rod, and a base plate. The upper pressure plate and the base plate are movably connected through the upper support rod. The constant temperature section, the temperature difference electrical device to be measured, and the dynamic temperature section are stacked sequentially on the base plate. The upper pressure plate abuts against the dynamic temperature section, and the transmission shaft passes through the base plate and abuts against the constant temperature section.

9. The thermoelectric device refrigeration performance testing system according to claim 8, characterized in that, The clamping part further includes a bellows, which is sleeved on the drive shaft between the substrate and the driver, wherein... The bellows is sealed and fixed to the substrate and the driver.

10. The thermoelectric device refrigeration performance testing system according to claim 1, characterized in that, The refrigeration performance includes maximum temperature difference, maximum cooling capacity, and refrigeration efficiency, wherein... When the thermoelectric device cooling performance testing system is testing the maximum cooling capacity or the cooling efficiency, the dynamic temperature section provides heat to the cold end of the thermoelectric device.

11. The thermoelectric device refrigeration performance testing system according to claim 10, characterized in that, The testing system also includes an atmosphere unit, which is used to provide a test atmosphere for the thermoelectric device.

12. A method for testing the cooling performance of a thermoelectric device, characterized in that, The refrigeration performance testing system for a thermoelectric device according to any one of claims 1-11 is used for testing, and the testing method includes the following steps: The thermoelectric device to be measured is placed on the sample stage so that it comes into contact with the constant temperature section and the dynamic temperature section, and is electrically connected to the power supply unit and the measurement unit. Adjust the thermostat to the set temperature, obtain the cooling temperature difference value under different current values, and determine the maximum temperature difference value and the optimal operating current. Adjust the power supply unit to the optimal operating current state, and provide heat to the cold end of the thermoelectric device by adjusting the dynamic temperature section, so that the cold end and hot end of the thermoelectric heater under test are at the same temperature, obtain the cooling capacity data and input power under different temperature differences, and determine the maximum cooling capacity and cooling efficiency.

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