Test platform and two-phase flow based electronic device insulation test method and apparatus

Abstract

This application relates to a test platform and a method, apparatus, and equipment for insulating electronic devices based on two-phase flow. The method includes acquiring the operating parameters of the test platform; calculating a control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state based on the operating parameters; placing the electronic device to be tested in the inner cavity of the enclosure, and controlling the vaporization of the cooling medium in the test platform according to the control temperature to obtain a mixed two-phase flow insulation test environment; performing an insulation test on the electronic device under this environment, and controlling the operation of a thermal relay in the test platform according to the control temperature during the insulation test. This two-phase flow-based insulating electronic device test method allows the test platform to perform insulation tests on the electronic device under test in a gas-liquid two-phase flow environment, and controls the thermal relay according to the control temperature to ensure stable insulation testing.

Description

Technical Field

[0001] This application relates to the field of two-phase flow insulation testing technology, and in particular to a test platform and a method, apparatus and equipment for testing the insulation of electronic devices based on two-phase flow. Background Technology

[0002] Immersion phase change cooling generally refers to directly immersing the heating element completely in a liquid cooling medium. When the heating element is operating normally, its surface temperature reaches the boiling point of the cooling medium. The cooling medium boils, carrying away heat, and the gaseous cooling medium is cooled back to liquid state through a condensation system and circulated back to the heating element for further cooling. Immersion phase change cooling is widely used in data centers and generator rotor cooling. Immersion phase change cooling improves heat transfer efficiency and significantly reduces the overall thermal resistance, energy consumption, equipment size, and cost of the heat transfer circuit. The application of phase change medium immersion power electronic devices will generate significant economic benefits. Currently, there is a lack of research on insulation testing of phase change medium immersion power electronic devices under high-voltage environments.

[0003] Traditional insulation testing equipment and standards conduct withstand voltage tests and impulse voltage tests on power electronic devices and their special structures. However, current insulation testing research mostly focuses on single-phase environments such as air insulation or transformer oil insulation, lacking research on insulation testing under two-phase flow environments. How to conduct insulation tests under two-phase flow is still unclear, as is the insulation performance of power electronic devices under two-phase flow. This leads to shortcomings in the current understanding, verification, and application of device insulation problems under two-phase flow conditions. In other words, existing insulation testing environments are all single-phase. A gas-liquid two-phase medium fills the voids of power electronic devices, and the environment in which power electronic devices exist includes gas-liquid mixtures, gas-solid mixtures, and liquid-solid mixtures. The interfaces between different phases are locations with a high probability of breakdown. The complex environment of two-phase flow places higher demands on insulation testing equipment and standards. Summary of the Invention

[0004] This application provides a test platform and a method, apparatus, and equipment for insulating electronic devices based on two-phase flow, which solves the technical problem that existing insulation tests for power electronic devices are carried out under a single-phase condition, and this test method is not applicable to insulation tests of power electronic devices in a mixed-phase environment.

[0005] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0006] On the one hand, a two-phase flow-based insulation testing method for electronic devices is provided, applied to a test platform. The test platform includes a housing and a cooling medium built into the housing. The insulation testing method for electronic devices includes the following steps:

[0007] The operating parameters of the test platform are obtained, including the boiling point of the cooling medium, the mass of vaporization of the cooling medium per unit time, the latent heat of vaporization of the cooling medium, the convective heat transfer coefficient of the cooling medium, and the inner area of ​​the bottom layer of the chamber.

[0008] Based on the operating parameters, the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state is calculated.

[0009] The electronic device to be tested for insulation is placed in the inner cavity of the enclosure, and the cooling medium of the test platform is vaporized according to the controlled temperature to obtain a mixed two-phase flow insulation test environment;

[0010] Insulation tests are conducted on electronic devices to be tested under the insulation test environment. During the insulation test, the operation of thermal relays in the test platform is controlled according to the control temperature.

[0011] Preferably, calculating the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state based on the operating parameters includes: calculating the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state using a temperature calculation formula based on the operating parameters; the temperature calculation formula is:

[0012]

[0013] In the formula, T' is the boiling point of the cooling medium, T0 is the control temperature of the cooling medium in the test platform when it is in a mixed two-phase flow state, r is the latent heat of vaporization of the cooling medium, h is the convective heat transfer coefficient of the cooling medium, Δm is the mass of the cooling medium vaporized per unit time, and A is the area of ​​the inner layer at the bottom of the chamber.

[0014] Preferably, the operation of the thermal relay in the test platform controlled according to the control temperature during the insulation test includes:

[0015] During the insulation test, the surface temperature of the bottom of the inner layer of the enclosure is acquired in real time.

[0016] The comparison result is obtained by comparing the surface temperature with the control temperature;

[0017] The operation of the thermal relay in the test platform is controlled according to the comparison results so that the insulation test environment is always in a mixed two-phase flow environment.

[0018] Preferably, controlling the operation of the thermal relay in the test platform based on the comparison results includes:

[0019] If the comparison result shows that the surface temperature is not less than the control temperature, then the thermal relay in the test platform is controlled to stop working;

[0020] If the comparison result shows that the surface temperature is lower than the control temperature, then the thermal relay in the test platform is activated.

[0021] Preferably, the insulation test performed on the electronic device to be tested under the insulation test environment includes: applying voltage to the electronic device to be tested under the insulation test environment to perform the insulation test.

[0022] On the other hand, this application also provides a test platform, including a housing, a cooling medium, a valve section, a thermal relay, an induction heater, a thermocouple, and a control module for controlling the operation of the thermal relay, the induction heater, and the thermocouple. The housing is a sealed structure with a first cavity and a second cavity located below the first cavity. The first cavity contains the cooling medium. The valve section is fixed or suspended on the first cavity and completely immersed in the cooling medium. The thermocouple is located at the bottom of the first cavity. The induction heater is evenly distributed in the second cavity. The output terminal of the thermal relay is connected to the induction heater and the thermocouple, respectively. The input terminal of the thermal relay is connected to an AC power supply. The top and bottom of the first cavity are connected through a cooling circulation system. The control module performs an insulation test on the electronic device to be tested according to the above-described two-phase flow-based electronic device insulation test method.

[0023] Furthermore, this application also provides an electronic device insulation test device based on two-phase flow, applied on a test platform. The test platform includes a housing and a cooling medium built into the housing. The electronic device insulation test device includes a data acquisition module, a calculation module, a test environment acquisition module, and a test module.

[0024] The data acquisition module is used to acquire the operating parameters of the test platform, including the boiling point of the cooling medium, the mass of vaporization of the cooling medium per unit time, the latent heat of vaporization of the cooling medium, the convective heat transfer coefficient of the cooling medium, and the inner area of ​​the bottom layer of the chamber.

[0025] The calculation module is used to calculate, based on the operating parameters, the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state;

[0026] The test environment acquisition module is used to place the electronic device to be tested for insulation in the inner cavity of the enclosure, and control the cooling medium of the test platform to vaporize according to the control temperature to obtain a mixed two-phase flow insulation test environment;

[0027] The test module is used to perform insulation tests on electronic devices to be tested under the insulation test environment, and to control the operation of thermal relays in the test platform according to the control temperature during the insulation test.

[0028] Preferably, the calculation module is further configured to calculate, based on the operating parameters and using a temperature calculation formula, the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state; the temperature calculation formula is:

[0029]

[0030] In the formula, T' is the boiling point of the cooling medium, T0 is the control temperature of the cooling medium in the test platform when it is in a mixed two-phase flow state, r is the latent heat of vaporization of the cooling medium, h is the convective heat transfer coefficient of the cooling medium, Δm is the mass of the cooling medium vaporized per unit time, and A is the area of ​​the inner layer at the bottom of the chamber.

[0031] Preferably, the test module is also used to acquire the surface temperature of the bottom of the inner layer of the box in real time during the insulation test, and control the thermal relay in the test platform to stop working if the surface temperature is not less than the control temperature; or control the thermal relay in the test platform to start running if the surface temperature is less than the control temperature, so that the insulation test environment is always in a mixed two-phase flow environment.

[0032] This application also provides a terminal device, including a processor and a memory;

[0033] The memory is used to store program code and transmit the program code to the processor;

[0034] The processor is used to execute the above-described two-phase flow-based electronic device insulation test method according to the instructions in the program code.

[0035] This invention relates to a test platform and a method, apparatus, and equipment for insulating electronic devices based on two-phase flow. The method includes acquiring the operating parameters of the test platform; calculating a control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state based on the operating parameters; placing the electronic device to be tested in the inner cavity of the enclosure; controlling the vaporization of the cooling medium in the test platform according to the control temperature to obtain a mixed two-phase flow insulation test environment; performing an insulation test on the electronic device under this environment; and controlling the operation of a thermal relay in the test platform according to the control temperature during the insulation test. As can be seen from the above technical solution, the embodiments of this application have the following advantages: This two-phase flow-based insulating electronic device test method allows the test platform to perform insulation tests on the electronic device under insulation test in a gas-liquid two-phase flow environment, and controls the thermal relay according to the control temperature to ensure the stable conduct of the insulation test. This solves the technical problem that existing power electronic device insulation tests are implemented in a single-phase state, and this test method is not applicable to insulation tests of power electronic devices in a mixed-phase environment. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a flowchart illustrating the steps of the two-phase flow-based insulation test method for electronic devices described in the embodiments of this application.

[0038] Figure 2 This is a schematic diagram of the structure of the test platform described in the embodiments of this application;

[0039] Figure 3 This is a schematic diagram illustrating the working principle of the induction heater in the test platform described in the embodiments of this application;

[0040] Figure 4 This is a frame diagram of an electronic device insulation testing device based on two-phase flow, according to an embodiment of this application. Detailed Implementation

[0041] To make the inventive objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] This application provides a test platform and a method, apparatus, and equipment for insulating electronic devices based on two-phase flow, which solves the technical problem that existing insulation tests for power electronic devices are carried out under a single-phase condition, and this test method is not applicable to insulation tests of power electronic devices in a mixed-phase environment.

[0043] Example 1:

[0044] Figure 1 This is a flowchart illustrating the steps of the two-phase flow-based insulation testing method for electronic devices described in this application. Figure 2 This is a schematic diagram of the structure of the test platform described in the embodiments of this application.

[0045] This application provides an insulation testing method for electronic devices based on two-phase flow, applied to a testing platform, such as... Figure 2As shown, the test platform includes a housing 1, a cooling medium 2, a valve section 3, a thermal relay 8, an induction heater 5, a thermocouple 6, and a control module that controls the operation of the thermal relay 8, the induction heater 5, and the thermocouple 6. The housing 1 has a sealed structure and has a first cavity 11 and a second cavity 12 located below the first cavity 11. The first cavity 11 contains the cooling medium 2. The valve section 3 is fixed or suspended on the first cavity 11 and is completely immersed in the cooling medium 2. The thermocouple 6 is located at the bottom of the first cavity 11. The induction heaters 5 are evenly distributed in the second cavity 12. The output terminal of the thermal relay 8 is connected to the induction heater 5 and the thermocouple 6 respectively. The input terminal of the thermal relay 8 is connected to the AC power supply. The top and bottom of the first cavity 11 are connected through to the cooling circulation system 7. The control module performs insulation tests on the electronic devices to be tested according to the two-phase flow-based electronic device insulation test method.

[0046] It should be noted that the housing 1 contains the cooling medium 2 and the valve section 3. The opening of the housing 1 is connected to the valve section wire 4, which is connected to the valve section 3. An induction heater 5 is installed at the bottom of the housing 1 to achieve a two-phase flow state of the cooling medium. The valve section 3 is placed in the first chamber 11 and is completely immersed in the cooling medium 2. The housing 1 is connected to the cooling circulation system 7 to maintain the normal operation of the phase change cooling system. In this embodiment, the temperature of the induction heater 5 in the second chamber 11 is set above the boiling point of the cooling medium 2, and the cooling medium 2 is heated to boiling by thermal convection.

[0047] In this embodiment of the application, the housing 1 may be made of metal material. The selected metal material should meet the requirements of high strength, low density, low resistivity and high thermal conductivity, so as to facilitate heat dissipation of the housing 1 and eddy current heating.

[0048] It should be noted that the enclosure 1 should be strictly sealed, with no air leakage at the welded joints, no air leakage at the outlet of the valve section wire 4, and no air leakage at the air outlet of the enclosure 1, ensuring that the interior of the enclosure 1 does not come into contact with the external air. The valve section 3 is suspended inside the first cavity 11 of the enclosure 1, or the valve section 3 is fixed inside the first cavity 11 by a bracket, and the valve section 3 is completely immersed in the cooling medium 2. In this embodiment, the valve section 3 is completely immersed in the cooling medium 2 to ensure the cooling effect and to avoid contact between the valve section 3 and the inner wall of the first cavity 11 (including the bottom inner surface of the first cavity 11) to avoid electrical safety problems. When using this experimental platform for insulation testing, the installation position of the valve section 3 in the first cavity 11 should also avoid direct contact between the valve section 3 and the surface of the first cavity 11 to avoid damage to the valve section 3 due to high temperature.

[0049] In this embodiment, for the heating part, the test strip uses an induction heater 5 to achieve the two-phase state of the medium required for the test. The induction heater 5 generates an alternating magnetic field, and the metal of the induction heater 5, which is built into the second cavity 12, generates eddy currents to generate heat. The induction heater 5 has advantages such as high heating temperature, non-contact heating, high heating efficiency, fast heating speed, easy temperature control, and the ability to perform localized heating.

[0050] In this embodiment, the cooling circulation system 7 can use either air cooling or water cooling to cool the gaseous cooling medium 2. Generally, water cooling has a stronger cooling capacity than air cooling, but the external cooling water pipeline is more complex.

[0051] It should be noted that the cooling circulation system 7 is a commonly used circulating cooling system in this field, and the specific structure and contents of the cooling circulation system 7 will not be described in detail here.

[0052] Figure 3 This is a schematic diagram illustrating the working principle of the induction heater in the test platform described in the embodiments of this application. Figure 3 The middle circular part is a solenoid.

[0053] like Figure 3 As shown in the embodiment of this application, the induction heater 5 has a built-in solenoid and an induction heating coil. When the AC power supply is input to the induction heater 5 through the thermal relay 8, the solenoid is supplied with alternating current, and the induction heater 5 generates an alternating magnetic field, which generates eddy currents in the metal housing 1 and heats the cooling medium 2 in the first cavity 11.

[0054] It should be noted that the alternating current, after passing through the power electronic energy conversion device built into the induction heater 5, is output to the induction heating coil at various frequency levels of alternating voltage. A first alternating current of the same frequency is randomly generated on the induction heating coil, and eddy currents are induced in the heated housing 1 as a second alternating current. In this embodiment, the effective value of the second alternating current I is:

[0055]

[0056] The heating power P of the induction heater 5 is:

[0057]

[0058] In the formula, E is the effective value of the induced electromotive force (V), R is the equivalent resistance of the heated chamber (Ω), X is the equivalent reactance of the heated chamber (Ω), and Φ m is the amplitude of the alternating magnetic flux / Web, N is the number of turns of the induction heating coil, and f is the frequency of the alternating current / Hz.

[0059] like Figure 1 As shown, the insulation test method for electronic devices based on two-phase flow includes the following steps:

[0060] S1. Obtain the operating parameters of the test platform, including the boiling point of the cooling medium, the mass of the cooling medium vaporized per unit time, the latent heat of vaporization of the cooling medium, the convective heat transfer coefficient of the cooling medium, and the area of ​​the inner layer at the bottom of the chamber.

[0061] It should be noted that in step S1, the operating parameters of the cooling medium in the test platform in a two-phase flow state are obtained to provide data for subsequent calculation and control of the temperature.

[0062] S2. Based on the operating parameters, the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state is obtained.

[0063] It should be noted that in step S2, the control temperature of the cooling medium in the test platform in a mixed two-phase flow state is calculated using the temperature calculation formula based on the operating parameters; the temperature calculation formula is:

[0064]

[0065] In the formula, T' is the boiling point of the cooling medium, T0 is the control temperature of the cooling medium in the test platform when it is in a mixed two-phase flow state, r is the latent heat of vaporization of the cooling medium, h is the convective heat transfer coefficient of the cooling medium, Δm is the mass of the cooling medium vaporized per unit time, and A is the area of ​​the inner layer at the bottom of the chamber. In the embodiment, when performing insulation tests on the test platform, the operation of the induction heater 5 can be controlled according to the calculated control temperature to ensure the stability of the test environment in a mixed two-phase flow state. The exact value of A should be the area perpendicular to the heat transfer direction; here, it is roughly taken as the area of ​​the inner layer at the bottom of the chamber (i.e., the area of ​​the bottom of the first cavity); the convective heat transfer coefficient h of the cooling medium is determined by the properties of the cooling medium itself and also changes with the boiling state of the cooling medium; the temperature T of the cooling medium... l As time t changes, room temperature T1≤T l ≤T'; T represents the average temperature of the entire bottom inner surface of the box (i.e., the bottom surface of the first cavity), which is taken as room temperature when not heated.

[0066] In this embodiment, the heat transfer of the cooling medium in the test platform in a mixed two-phase flow state is expressed by Newton's convection heat transfer formula, which is q = (TT / T). l Ah, where q is the heat transferred per unit time / W.

[0067] It should be noted that, according to Newton's law of convection heat transfer, when the cooling medium boils, T l The magnitude is equal to T', T continues to increase with time, and the heat q transferred per unit time increases from (TT) lThe boiling degree of the cooling medium is determined by the magnitude of T. Taking FC-72 as an example, its latent heat of vaporization is approximately 92.09 J / g. This means that 1g of FC-72 can completely vaporize after absorbing 92.09 J of heat, neglecting heat loss. By increasing T to increase the heat transferred per unit time (q), FC-72 can vaporize in a shorter time, thus intensifying the boiling degree. This two-phase flow-based insulation test method for electronic devices uses the setting of a target value for T to control the boiling state of the cooling medium.

[0068] In this embodiment, according to the law of conservation of mass, qt = rm → q / r = m / t, where t is the heating time in seconds and m is the mass of the cooling medium vaporized in grams. If Δm = m / t, the temperature calculation formula is obtained based on Newton's convection heat transfer formula and the law of conservation of mass.

[0069] It should be noted that this two-phase flow-based electronic device insulation test method controls the vaporization mass of the cooling medium per unit time by controlling the magnitude of T0, i.e., controlling the boiling degree of the cooling medium. It is important to note that the convective heat transfer coefficient h of the cooling medium varies with the boiling degree of the cooling medium. First, h of the cooling medium at different boiling degrees must be obtained. Then, based on the desired boiling degree of the cooling medium, the control temperature T0 is calculated using the given temperature calculation formula.

[0070] S3. Place the electronic device to be tested for insulation in the inner cavity of the enclosure, and vaporize the cooling medium of the test platform according to the controlled temperature to obtain a mixed two-phase flow insulation test environment.

[0071] It should be noted that in step S3, the electronic device to be tested for insulation is placed in the first cavity of the enclosure, and the induction heater and thermal relay are started until the cooling medium in the first cavity vaporizes evenly and stably to produce bubbles, indicating that the test platform is in an insulation test environment in a mixed two-phase flow state.

[0072] S4. Perform insulation tests on the electronic devices to be tested in an insulation test environment. During the insulation test, control the operation of the thermal relay in the test platform according to the control temperature.

[0073] It should be noted that this two-phase flow-based electronic device insulation testing method controls the opening and closing of a thermal relay by controlling the temperature. During the insulation test on the test platform, the environment is ensured to be in a mixed two-phase flow state. In this embodiment, in the insulation test environment, a voltage is applied to the electronic device to be tested for insulation. During the test, the breakdown status of the electronic device, the cooling medium, and other components inside the enclosure are observed and recorded to obtain the test results. This two-phase flow-based electronic device insulation testing method allows the test platform to perform insulation tests on the electronic device in a gas-liquid two-phase flow environment, and controls the thermal relay according to the control temperature to ensure the stable conduct of the insulation test.

[0074] This application provides a two-phase flow-based insulation testing method for electronic devices. The method includes acquiring the operating parameters of a test platform; calculating a control temperature based on the operating parameters to determine the temperature at which the cooling medium in the test platform is in a mixed two-phase flow state; placing the electronic device to be tested in the inner cavity of a housing; controlling the vaporization of the cooling medium in the test platform according to the control temperature to obtain a mixed two-phase flow insulation test environment; performing an insulation test on the electronic device under this environment; and controlling the operation of a thermal relay in the test platform according to the control temperature during the insulation test. This two-phase flow-based insulation testing method allows the test platform to perform insulation tests on the electronic device under test in a gas-liquid two-phase flow environment, and controls the thermal relay according to the control temperature to ensure stable insulation testing. It solves the technical problem that existing power electronic device insulation tests are performed in a single-phase state, and this method is not suitable for insulation testing of power electronic devices in a mixed-phase environment.

[0075] In one embodiment of this application, the operation of the thermal relay in the test platform controlled by the control temperature during the insulation test includes:

[0076] During the insulation test, the surface temperature of the bottom of the inner layer of the enclosure is acquired in real time.

[0077] The comparison results are obtained by comparing the surface temperature with the control temperature;

[0078] Based on the comparison results, the operation of the thermal relay in the test platform is controlled so that the insulation test environment is always in a mixed two-phase flow environment;

[0079] Based on the comparison results, the operation of the thermal relay in the test platform is controlled as follows:

[0080] If the comparison result shows that the surface temperature is not lower than the control temperature, then the thermal relay in the control test platform will stop working;

[0081] If the comparison result shows that the surface temperature is lower than the control temperature, then the thermal relay in the control test platform will be activated.

[0082] It should be noted that if the temperature required for the induction heater to heat is the control temperature T0, the normally open contact of the thermal relay closes, AC power supplies the induction heater, and the thermocouple monitors the surface temperature T of the inner layer of the first cavity in real time. b When T b When T ≥ T0, a first control signal is issued. The thermal relay receives this first control signal as a shutdown signal, the closed contacts of the thermal relay open, and the induction heater stops heating. A lower-temperature cooling medium is used to cool the bottom of the chamber. When T... b When the temperature is less than T0, a second control signal is issued. The thermal relay receives this second control signal as an activation signal, and the induction heater reheats. Heating stops when the temperature reaches the control temperature T0. This cycle is repeated to control the two-phase flow.

[0083] Example 2:

[0084] Figure 4 This is a framework diagram of the electronic device insulation testing device based on two-phase flow as described in the embodiments of this application.

[0085] like Figure 4 As shown, this application embodiment provides an electronic device insulation test device based on two-phase flow, applied on a test platform. The test platform includes a housing and a cooling medium built into the housing. The electronic device insulation test device includes a data acquisition module 10, a calculation module 20, a test environment acquisition module 30, and a test module 40.

[0086] The data acquisition module 10 is used to acquire the operating parameters of the test platform, including the boiling point of the cooling medium, the mass of the cooling medium vaporized per unit time, the latent heat of vaporization of the cooling medium, the convective heat transfer coefficient of the cooling medium, and the inner area of ​​the bottom layer of the chamber.

[0087] Calculation module 20 is used to calculate the control temperature of the cooling medium in the test platform when it is in a mixed two-phase flow state based on the operating parameters;

[0088] The test environment acquisition module 30 is used to place the electronic device to be tested for insulation in the inner cavity of the enclosure, and control the cooling medium of the test platform to vaporize according to the control temperature to obtain a mixed two-phase flow insulation test environment;

[0089] Test module 40 is used to perform insulation tests on electronic devices to be tested in an insulation test environment. During the insulation test, the operation of the thermal relay in the test platform is controlled according to the control temperature.

[0090] In this embodiment, the calculation module 20 is further configured to calculate, based on the operating parameters and using a temperature calculation formula, the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state; the temperature calculation formula is:

[0091]

[0092] In the formula, T' is the boiling point of the cooling medium, T0 is the control temperature of the cooling medium in the test platform when it is in a mixed two-phase flow state, r is the latent heat of vaporization of the cooling medium, h is the convective heat transfer coefficient of the cooling medium, Δm is the mass of the cooling medium vaporized per unit time, and A is the area of ​​the inner layer at the bottom of the chamber.

[0093] In this embodiment of the application, the test module 40 is also used to acquire the surface temperature of the bottom of the inner layer of the box in real time during the insulation test. Based on the comparison between the surface temperature and the control temperature, if the surface temperature is not less than the control temperature, the thermal relay in the test platform is controlled to stop working; or if the surface temperature is less than the control temperature, the thermal relay in the test platform is controlled to start running, so that the insulation test environment is always in a mixed two-phase flow environment.

[0094] In this embodiment of the application, the current acquisition submodule is further configured to increase the operating power of the condensing element if the comparison result shows that the current velocity is less than the velocity threshold, or decrease the operating power of the condensing element if the comparison result shows that the current velocity is greater than the velocity threshold.

[0095] It should be noted that the modules in the apparatus of Embodiment 2 correspond to the steps in the method of Embodiment 1. The content of the two-phase flow-based electronic device insulation test method has been described in detail in Embodiment 1, and the content of the modules in the apparatus will not be described in detail in this Embodiment 2.

[0096] Example 3:

[0097] This application provides a terminal device, including a processor and a memory;

[0098] Memory is used to store program code and transfer the program code to the processor;

[0099] The processor is used to execute the above-described two-phase flow-based electronic device insulation test method according to the instructions in the program code.

[0100] For example, a computer program can be divided into one or more modules / units, one or more of which are stored in memory and executed by a processor to complete this application. One or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in a terminal device.

[0101] Terminal devices can be computing devices such as desktop computers, laptops, handheld computers, and cloud servers. Terminal devices may include, but are not limited to, processors and memory. Those skilled in the art will understand that this does not constitute a limitation on the terminal device, which may include more or fewer components than illustrated, or combinations of certain components, or different components. For example, a terminal device may also include input / output devices, network access devices, buses, etc.

[0102] The processor referred to can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor.

[0103] Memory can be an internal storage unit of a terminal device, such as a hard drive or RAM. Memory can also be an external storage device, such as a plug-in hard drive, SmartMedia Card (SMC), Secure Digital (SD) card, or Flash Card. Furthermore, memory can include both internal and external storage units. Memory is used to store computer programs and other programs and data required by the terminal device. Memory can also be used for temporary storage of data that has been output or will be output.

[0104] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0105] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.

[0106] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0107] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0108] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0109] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An insulation test method for electronic devices based on two-phase flow, applied to a test platform, the test platform comprising a housing and a cooling medium built into the housing, characterized in that, The insulation test method for electronic devices includes the following steps: The operating parameters of the test platform are obtained, including the boiling point of the cooling medium, the mass of vaporization of the cooling medium per unit time, the latent heat of vaporization of the cooling medium, the convective heat transfer coefficient of the cooling medium, and the inner area of ​​the bottom layer of the chamber. Based on the operating parameters, the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state is calculated. The electronic device to be tested for insulation is placed in the inner cavity of the enclosure, and the cooling medium of the test platform is vaporized according to the controlled temperature to obtain a mixed two-phase flow insulation test environment; Insulation tests are conducted on electronic devices to be tested under the insulation test environment. During the insulation test, the operation of the thermal relay in the test platform is controlled according to the control temperature. The control temperature for the cooling medium in the test platform to be in a mixed two-phase flow state is calculated based on the operating parameters, including: using a temperature calculation formula based on the operating parameters; the temperature calculation formula is: ； In the formula, T 'The boiling point of the cooling medium,' T 0 represents the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state. r The latent heat of vaporization of the cooling medium, h Δ is the convective heat transfer coefficient of the cooling medium. m The mass of the cooling medium vaporized per unit time. A This refers to the area of ​​the inner bottom layer of the box. The operation of the thermal relay in the test platform during the insulation test, based on the controlled temperature, includes: During the insulation test, the surface temperature of the bottom of the inner layer of the enclosure is acquired in real time. The comparison result is obtained by comparing the surface temperature with the control temperature; The operation of the thermal relay in the test platform is controlled according to the comparison results so that the insulation test environment is always in a mixed two-phase flow environment.

2. The insulation test method for electronic devices based on two-phase flow according to claim 1, characterized in that, Controlling the operation of the thermal relay in the test platform based on the comparison results includes: If the comparison result shows that the surface temperature is not less than the control temperature, then the thermal relay in the test platform is controlled to stop working; If the comparison result shows that the surface temperature is lower than the control temperature, then the thermal relay in the test platform is activated.

3. The insulation test method for electronic devices based on two-phase flow according to claim 1, characterized in that, The insulation test performed on the electronic device to be tested under the insulation test environment includes: applying voltage to the electronic device to be tested under the insulation test environment to perform the insulation test.

4. An experimental platform, characterized in that, The device includes a housing, a cooling medium, a valve section, a thermal relay, an induction heater, a thermocouple, and a control module for controlling the operation of the thermal relay, the induction heater, and the thermocouple. The housing is a sealed structure with a first cavity and a second cavity located below the first cavity. The first cavity contains the cooling medium. The valve section is fixed or suspended on the first cavity and completely immersed in the cooling medium. The thermocouple is located at the bottom of the first cavity. The induction heater is evenly distributed in the second cavity. The output terminal of the thermal relay is connected to the induction heater and the thermocouple, respectively. The input terminal of the thermal relay is connected to an AC power supply. The top and bottom of the first cavity are connected through a cooling circulation system. The control module performs an insulation test on the electronic device to be tested according to the two-phase flow-based electronic device insulation test method as described in any one of claims 1-3.

5. An insulation testing device for electronic devices based on two-phase flow, applied on a testing platform, the testing platform comprising a housing and a cooling medium built into the housing, characterized in that, The electronic device insulation testing device includes a data acquisition module, a calculation module, a test environment acquisition module, and a testing module; The data acquisition module is used to acquire the operating parameters of the test platform, including the boiling point of the cooling medium, the mass of vaporization of the cooling medium per unit time, the latent heat of vaporization of the cooling medium, the convective heat transfer coefficient of the cooling medium, and the inner area of ​​the bottom layer of the chamber. The calculation module is used to calculate, based on the operating parameters, the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state; The test environment acquisition module is used to place the electronic device to be tested for insulation in the inner cavity of the enclosure, and control the cooling medium of the test platform to vaporize according to the control temperature to obtain a mixed two-phase flow insulation test environment; The test module is used to perform insulation tests on electronic devices to be tested under the insulation test environment, and to control the operation of thermal relays in the test platform according to the control temperature during the insulation test. The calculation module is also used to calculate, based on the operating parameters and using a temperature calculation formula, the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state; the temperature calculation formula is: ； In the formula, T 'The boiling point of the cooling medium,' T 0 represents the control temperature at which the cooling medium in the test platform is in a mixed two-phase flow state. r The latent heat of vaporization of the cooling medium, h Δ is the convective heat transfer coefficient of the cooling medium. m The mass of the cooling medium vaporized per unit time. A This refers to the area of ​​the inner bottom layer of the box. The test module is also used to acquire the surface temperature of the bottom of the inner layer of the box in real time during the insulation test. Based on the comparison between the surface temperature and the control temperature, if the surface temperature is not less than the control temperature, the thermal relay in the test platform is controlled to stop working; or if the surface temperature is less than the control temperature, the thermal relay in the test platform is controlled to start running, so that the insulation test environment is always in a mixed two-phase flow environment.

6. A terminal device, characterized in that, Including the processor and memory; The memory is used to store program code and transmit the program code to the processor; The processor is configured to execute the two-phase flow-based electronic device insulation test method as described in any one of claims 1-3 according to the instructions in the program code.

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