A tilt fit full welding device for eutectic welding and a control method thereof

Abstract

The application discloses a pitch and roll bonding full-welding device for eutectic welding, which comprises an upper computer module and an output processing module, wherein the upper computer module comprises an input module, a storage module, a memory unit, a CPU unit and an interface module; and the output processing module comprises a pitch and roll bonding array cooperative control module and a pitch and roll bonding array module. The application realizes pitch and roll bonding of chips, has high bonding efficiency and precision, and effectively reduces the cavity degree of eutectic welding of the chips.

Description

Technical Field

[0001] This invention relates to the field of eutectic welding, and more specifically to an overhead-fitting full welding device and an overhead-fitting full welding control method for eutectic welding. Background Technology

[0002] With the rapid development of technology and the accelerating pace of digital transformation, the semiconductor industry is clearly on an upward trend. Simultaneously, its extensive applications in fields requiring extremely high precision, such as radar, remote control and telemetry, and aerospace, place high demands on its reliability. Chip bonding, as a crucial step in the semiconductor device assembly process, has a significant impact on the reliability of semiconductor devices. Chip bonding methods mainly include conductive adhesive bonding and eutectic bonding. Because eutectic bonding has better thermal and electrical conductivity than conductive adhesive, as the power of integrated chip products increases, more and more chips are using eutectic bonding instead of conductive adhesive bonding for interconnection.

[0003] Eutectic welding, also known as low-melting-point alloy welding, is characterized by the ability to form an alloy from two different metals in a specific weight ratio at temperatures far below their respective melting points. Based on this characteristic, welding of chips to substrates, substrates to housings, and cover plates to shells can be achieved at relatively low temperatures. Compared to other welding methods, eutectic welding offers advantages such as high thermal conductivity, low electrical resistance, rapid heat transfer, high reliability, and high shear strength after bonding. It is suitable for welding chips to substrates in high-frequency, high-power devices, and is essential for power devices with extremely high heat dissipation requirements.

[0004] Patent publication number CN115424960B discloses a eutectic bonding and casing sealing fixture for RF power amplifier chips. It uses a spring-loaded needle to apply pressure to the chip, replacing the traditional method of counterweight pressure blocks. The applied pressure can be adjusted by adjusting the compression of the needle, which helps to find the optimal pressure value. It can reduce the structure of the fixture, reduce costs, and make operation more convenient. While making the pressure adjustable, it simplifies the fixture structure. However, this device cannot achieve fine control of the pressure, thus failing to guarantee the accuracy of eutectic bonding.

[0005] Patent publication number CN216818319U discloses a sealed cavity and vacuum eutectic furnace for semiconductor chip welding. It uses heating components set on the top and bottom of the carrier assembly respectively, and performs non-contact heating in alignment, providing efficient and fast heating and uniform temperature distribution for the chip and the carrier assembly. At the same time, it uses cooling pipes embedded in the carrier assembly for direct contact cooling, which improves the cooling speed of the chip. It can balance heating and cooling performance. However, this device will result in a high welding void rate, and the welding quality cannot be effectively guaranteed. Summary of the Invention

[0006] The purpose of this invention is to provide a pitch bonding full-welding device for eutectic bonding, which achieves chip pitch bonding through coordinated control of the pitch bonding array and precise control of the pitch fixture, resulting in high bonding efficiency and accuracy, and effectively reducing the voids in chip eutectic bonding.

[0007] The technical solution of the present invention is as follows:

[0008] An overhead bonding full welding device for eutectic welding includes a host computer module and an output processing module that is communicatively connected to the host computer module.

[0009] The host computer module is used to process preset tasks based on the acquired real-time X-ray images of chip eutectic bonding, and to obtain the pitch time, pitch frequency, and pitch amplitude of the pitch device; the host computer module includes:

[0010] The input module is used to acquire and preprocess real-time X-ray images of chip eutectic bonding and to calculate void data of chip eutectic bonding. The void data includes real-time void degree and void area ratio.

[0011] The storage module, which is connected in communication with the input module, is used to store the hole data and preset tasks. The preset tasks include pitch time, pitch frequency and pitch amplitude calculation tasks.

[0012] The memory unit is connected to the storage module via the host computer bus and is used to temporarily store empty data and preset task data;

[0013] The CPU unit communicates with the storage module via the host computer bus and is used to process preset tasks based on the hole data. The preset tasks include pitch time calculation, pitch frequency calculation and pitch amplitude calculation of the pitch device.

[0014] The interface module communicates with the storage module and the output processing module via the host computer bus, and is used to transmit the preset task processing results to the pitch and fit array collaborative control module.

[0015] The output processing module is used to perform coordinated and refined control of the bonding between the pitch bonding array module and the pitch bonding array chip based on the preset task processing results. It includes:

[0016] The pitch bonding array collaborative control module communicates with the interface module and is used to control the main pitch, auxiliary pitch and central pitch in the pitch bonding array to work together with the action points on the pitch bonding array chip to bond, and to calculate the energizing current of the pitch lever according to the preset task processing results, and then to finely control the pitch amplitude of the pitch lever by adjusting the on and off state of the pitch lever and the magnitude of the energizing current.

[0017] The pitch bonding array module communicates with the pitch bonding array coordination control module. It coordinates the bonding of multiple pitch levers within the module with the action points on the pitch bonding array chip, and adjusts the power on / off state and current magnitude of each pitch lever to achieve pitch amplitude adjustment of the pitch rod within each pitch lever.

[0018] Furthermore, the electromagnet assembly includes a cylindrical electromagnet, a coil wound on the electromagnet, and armatures symmetrically mounted on both sides of the spring mounting plate and arranged perpendicular to the electromagnet, with the armatures cooperating with the electromagnet.

[0019] Furthermore, the pitch-fitting array module includes a pitch base, and multiple pitch devices are provided on the bottom surface of the pitch base. The multiple pitch devices are a central pitch device located at the center of the bottom surface of the pitch base, a main pitch device located around the bottom surface of the pitch base and symmetrical to the central pitch device, and an auxiliary pitch device located at the middle of the upper and lower sides of the bottom surface of the pitch base and symmetrical to the central pitch device.

[0020] The center pitch, main pitch, and auxiliary pitch constitute a pitch bonding array, which corresponds to the center action point, the four corner action points, and the upper and lower action points on the pitch bonding array chip, respectively.

[0021] Furthermore, the main pitch device includes a first main pitch device, a second main pitch device, a third main pitch device, and a fourth main pitch device. The first main pitch device, the second main pitch device, the third main pitch device, and the fourth main pitch device are respectively located at the four corner positions on the bottom surface of the square pitch base, and correspond to the upper left corner position, the lower left corner position, the lower right corner position, and the upper right corner position on the pitch bonding array chip, respectively.

[0022] The auxiliary pitch device includes a fifth auxiliary pitch device and a sixth auxiliary pitch device. The fifth auxiliary pitch device and the sixth auxiliary pitch device are respectively located at the upper middle position and the lower middle position on the bottom surface of the pitch base, and respectively correspond to the upper middle position and the lower middle position on the pitch bonding array chip.

[0023] The central pitch gauge includes a seventh auxiliary pitch gauge, which corresponds to the central action point on the pitch bonding array chip.

[0024] Furthermore, the pitch device includes a first housing, a first pitch head located at the center of the bottom of the first housing with one end of the first pitch head vertically penetrating the bottom surface of the first housing to the outside, an electromagnet assembly fixedly installed on the bottom surface of the first housing and symmetrically arranged on both sides of the first pitch head, a first spring mounting plate fixedly installed on the other end of the first pitch head and cooperating with the electromagnet assembly, and a first spring connecting the first spring mounting plate and the top surface of the first housing. The pitch device is attached to the action point on the pitch bonding array chip through the first pitch head at one end of the first pitch head.

[0025] The electromagnet assembly includes a first electromagnet in the shape of a cylinder, a first coil wound on the first electromagnet, and a first armature symmetrically and horizontally mounted on the left and right sides of the first spring mounting plate and arranged perpendicular to the first electromagnet. The first armature cooperates with the first electromagnet.

[0026] In this invention, the pitch-fitting array module consists of a pitch base and seven pitch devices located at different points on the pitch base. Each pitch device consists of a first spring, a first armature, a first electromagnet, a first winding coil, a first pitch rod, and a first pitch head made of fiber cotton material. When the first winding coil of the first pitch device is energized, the core of the first electromagnet generates electromagnetic force to attract the armature located above it. The first armature moves downward, causing the first pitch rod made of metal material to move downward. When the first winding coil is de-energized, the attraction of the first electromagnet core to the first armature disappears. At this time, the first spring, which is stretched, springs back upward due to the downward movement of the first armature, thereby causing the first pitch rod to move upward.

[0027] Furthermore, the pitch device includes a second housing, a second pitch head located at the center of the bottom of the second housing with one end of the second pitch head vertically penetrating the bottom surface of the second housing to the outside, an electromagnet assembly fixedly installed on the bottom surface of the second housing and symmetrically arranged on both sides of the second pitch head, a second spring mounting plate fixedly installed on the other end of the second pitch head and cooperating with the electromagnet assembly, and a second spring connecting the second spring mounting plate and the top surface of the second housing. The pitch device is attached to the action point on the pitch bonding array chip through the second pitch head at one end of the second pitch head.

[0028] The electromagnet assembly includes a sickle-shaped second electromagnet, a second armature whose one end is movably connected to one end of a second spring mounting plate and whose other end is movably connected to one end of the "U"-shaped blade of the second electromagnet, and a second coil wound around one end of the "U"-shaped blade of the second electromagnet. The other end of the "U"-shaped blade of the second electromagnet extends laterally outward to form a handle. The handle and the top surface of the "U"-shaped blade of the second electromagnet are located on the same plane. An air gap region is formed between the second armature, the top surface of the "U"-shaped blade of the second electromagnet, and the top surface of the handle.

[0029] The present invention also provides a pitch-fitting full-welding control method for the above-mentioned pitch-fitting full-welding device, the method comprising the following steps:

[0030] The input module acquires real-time X-ray images of chip eutectic bonding in real time and performs image preprocessing on the chip eutectic bonding X-ray images; based on the preprocessed chip eutectic bonding real-time X-ray images, the chip eutectic bonding void ratio is calculated;

[0031] The CPU unit determines whether the weld void rate in the chip eutectic welding X-ray image is less than a preset weld void rate threshold. If the weld void rate is greater than the preset weld void rate threshold, it calculates the real-time void depth and void area ratio in the chip eutectic welding X-ray image. Based on the real-time void depth and void area ratio, it calculates the pitch time, pitch frequency, and pitch amplitude of the pitching device.

[0032] The pitch-fitting collaborative control module performs collaborative and refined control of the pitch-fitting array module based on the pitch time, pitch frequency, and pitch amplitude of the pitch gauge.

[0033] The pitch-fitting full welding control method for eutectic welding of the present invention controls the pitch amplitude of the pitch rod by controlling the magnitude of the energizing current of the electromagnet coil in the pitch tool; and controls the pitch frequency and single pitch duration of the pitch rod by controlling the energizing frequency and the duration of each energizing.

[0034] Furthermore, coordinated control of the pitch-fit array is implemented, specifically including:

[0035] The pitch-fitting collaborative control module sends collaborative control signals to the pitch-fitting array module;

[0036] The pitch-fit array module receives the coordinated control signal and aligns its internal main pitch tool with the main pitch point located at the four corner positions on the pitch-fit array chip. Simultaneously, the auxiliary pitch tool located between the main pitch tool and the central pitch tool in the pitch-fit array module is coordinated to be aligned with the upper middle or lower middle positions on the pitch-fit array chip, and the central pitch tool in the pitch-fit array is coordinated to be aligned with the central position on the pitch-fit array chip.

[0037] Furthermore, the pitch-fitting array module receives the cooperative control signal and aligns its internal main pitch sensor with the main pitch points located at the four corner positions on the pitch-fitting array chip; simultaneously, the auxiliary pitch sensors located between the main and central pitch sensors in the pitch-fitting array module are cooperatively aligned with the upper-middle or lower-middle positions on the pitch-fitting array chip, and the central pitch sensor in the pitch-fitting array is cooperatively aligned with the central position on the pitch-fitting array chip, specifically including:

[0038] When the first primary pitch sensor is attached to the upper left corner action point on the pitch bonding array chip, the fifth secondary pitch sensor is attached to the upper middle action point on the pitch bonding array chip, and the seventh central pitch sensor is attached to the central action point on the pitch bonding array chip.

[0039] When the second primary pitch lever is attached to the lower left corner action point on the pitch bonding array chip, the sixth secondary pitch lever is attached to the lower middle action point on the pitch bonding array chip, and the seventh central pitch lever is attached to the central action point on the pitch bonding array chip.

[0040] When the third primary pitch lever is attached to the lower right corner action point on the pitch bonding array chip, the sixth secondary pitch lever is attached to the lower middle action point on the pitch bonding array chip, and the seventh central pitch lever is attached to the central action point on the pitch bonding array chip.

[0041] When the fourth primary pitch sensor is attached to the upper right corner action point on the pitch bonding array chip, the fifth secondary pitch sensor is attached to the upper middle action point on the pitch bonding array chip, and the seventh central pitch sensor is attached to the central action point on the pitch bonding array chip.

[0042] Furthermore, the pitch-fitting collaborative control module provides refined control over the pitch-fitting array module, specifically including:

[0043] Based on the pitch angle of the pitch device, the magnetic flux φ of the electromagnet inside the pitch device is calculated, and its expression is:

[0044]

[0045] (1) In the formula, v is the voltage difference applied between the terminals of the second winding coil, N is the number of turns of the second winding coil, R is the resistance of the second winding coil, and A g θ1 is the cross-sectional area of ​​the air gap, θ1 is the rotation angle between the tool holder and the second armature, i.e., the pitch amplitude of the pitching device, μ0 is the vacuum permeability, and l c Let A be the average path length of the magnetic core. c Let c1 and c2 be the average cross-sectional area of ​​the magnetic core, where c1 and c2 are constants.

[0046] Based on the magnetic flux φ of the electromagnet inside the pitch sensor, the current i flowing through the electromagnet inside the pitch sensor can be calculated, and its expression is:

[0047] Ni=φR (2),

[0048] (2) In the formula, N is the number of turns of the coil, R is the resistance of the second winding coil, and φ is the magnetic flux of the electromagnet;

[0049] Adjust the current value, on / off time, and on / off frequency of the electromagnet inside the pitch device.

[0050] Technical principle of the invention:

[0051] 1. In terms of the structural design of the pitch device, two types of pitch devices are designed: basic type and sickle type. ① For the basic type pitch device, based on the mechanism that the electromagnet attracts the armature when energized and has no attraction to the armature when de-energized, the movement of the first armature drives the movement of the first spring and the first pitch rod made of metal material. When the first winding coil of the first electromagnet of the pitch device is energized, the iron core of the first electromagnet generates an electromagnetic force that attracts the first armature located above it. The first armature moves downward, causing the first pitch rod to move downward. When the first winding coil of the first electromagnet is de-energized, the attraction of the iron core of the first electromagnet to the first armature disappears. At this time, the spring that is stretched due to the downward movement of the first armature bounces back upward, thereby causing the first pitch rod to move upward. ② For the sickle-shaped pitch device, according to the working characteristics of the electromagnet, when the second winding coil of the second electromagnet of the sickle-shaped pitch device is energized, the second electromagnet generates an electromagnetic force that attracts the movable second armature through the fixed handle. The movable second armature rotates downward, causing the second pitch rod to move downward. When the second winding coil of the second electromagnet is de-energized, the attraction of the fixed handle to the second armature disappears, and the movable second armature rotates upward, causing the second pitch rod to move upward.

[0052] 2. Regarding the pitch control of the pitch lever: ① For the basic pitch lever, the pitch amplitude of the metal pitch lever is controlled by controlling the magnitude of the energizing current of the first winding coil of the first electromagnet in the pitch lever; the pitch frequency and single pitch duration of the metal pitch lever are controlled by controlling the energizing frequency and the duration of each energizing cycle; ② For the sickle-shaped pitch lever, the magnitude of the current of the second coil in the sickle-shaped pitch lever is strictly controlled to control the magnitude of the attractive force of the fixed handle on the second armature, thereby finely controlling the rotation angle of the movable second armature, and thus achieving precise control of the pitch amplitude of the second pitch lever.

[0053] 3. Regarding the layout of the pitch array, to achieve a high degree of chip fit, seven pitch control points are arranged. Four main pitch points are arranged at the four top corners of the chip, and one pitch center point is arranged at the center of the chip. When the four main pitch points are in action, the center pitch point is in action simultaneously. In addition, two auxiliary pitch points are arranged, located at the upper center and lower center of the chip, respectively. The auxiliary pitch points move with their main pitch points. The pitch point located at the upper center is an auxiliary pitch point for the two main pitch points at the upper left and right top corners of the chip, and the pitch point located at the lower center is an auxiliary pitch point for the two main pitch points at the lower left and right top corners of the chip.

[0054] The present invention has the following beneficial effects:

[0055] 1. This invention achieves pitch bonding of the pitch bonding array chip by coordinating the control of multiple pitch gauges in the pitch bonding array, resulting in high pitch bonding degree and bonding efficiency.

[0056] 2. This invention achieves chip pitch bonding with high precision by precisely controlling multiple pitch gauges in the pitch bonding array, effectively reducing the voids in chip eutectic bonding, and solving the technical problem that the existing device causes a high bonding void rate and low bonding quality. Attached Figure Description

[0057] Figure 1 This is a schematic diagram of the tilt-fit full welding device for eutectic welding described in an embodiment of the present invention. Figure 1 ;

[0058] Figure 2 This is a general schematic diagram of the tilt-fit full welding device for eutectic welding described in the embodiments of the present invention. Figure 2 ;

[0059] Figure 3 This is a diagram of the effective sites of the pitch-fitting array chip described in an embodiment of the present invention;

[0060] Figure 4 This is a schematic diagram of the structure of the pitching device according to Embodiment 1 of the present invention;

[0061] Figure 5 This is a schematic diagram of the structure of the pitch control device in Embodiment 2 of the present invention;

[0062] Figure 6 This is a schematic diagram of the structure and corresponding electrical structure of the sickle-shaped electromagnet described in an embodiment of the present invention;

[0063] Figure 7 This is a flowchart of the pitch-fitting full welding control method described in an embodiment of the present invention. Detailed Implementation

[0064] As attached Figure 1 As shown, a pitch-fitting full welding device for eutectic welding includes a host computer module and an output processing module that is communicatively connected to the host computer module.

[0065] The host computer module is used to process preset tasks based on the acquired real-time X-ray images of chip eutectic bonding, and to obtain the pitch time, pitch frequency, and pitch amplitude of the pitch device; the host computer module includes:

[0066] The input module is used to acquire and preprocess real-time X-ray images of chip eutectic bonding and to calculate void data of chip eutectic bonding. The void data includes real-time void degree and void area ratio.

[0067] The storage module, which is connected in communication with the input module, is used to store the hole data and preset tasks. The preset tasks include pitch time, pitch frequency and pitch amplitude calculation tasks.

[0068] The memory unit is connected to the storage module via the host computer bus and is used to temporarily store empty data and preset task data;

[0069] The CPU unit communicates with the storage module via the host computer bus and is used to process preset tasks based on the hole data. The preset tasks include pitch time calculation, pitch frequency calculation and pitch amplitude calculation of the pitch device.

[0070] The interface module communicates with the storage module and the output processing module via the host computer bus, and is used to transmit the preset task processing results to the pitch and fit array collaborative control module.

[0071] The output processing module is used to perform coordinated and refined control of the bonding between the pitch bonding array module and the pitch bonding array chip based on the preset task processing results. It includes:

[0072] The pitch bonding array collaborative control module communicates with the interface module and is used to control the main pitch, auxiliary pitch and central pitch in the pitch bonding array to work together with the action points on the pitch bonding array chip. It also calculates the current of the pitch lever based on the preset task processing results, and then finely controls the pitch amplitude of the pitch lever by adjusting the on and off state of the pitch lever and the magnitude of the current.

[0073] The pitch bonding array module communicates with the pitch bonding array coordination control module. It coordinates the bonding of multiple pitch levers within the module with the action points on the pitch bonding array chip, and adjusts the power on / off state and current magnitude of each pitch lever to achieve pitch amplitude adjustment of the pitch rod within each pitch lever.

[0074] This invention provides a pitch-fitting full-welding device for eutectic bonding, which achieves eutectic bonding of chips through coordinated control of the pitch-fitting array.

[0075] As attached Figure 2 and attached Figure 3 As shown, the pitch-fitting array module includes a pitch base B1, and multiple pitch devices B2 are arranged on the bottom surface of the pitch base B1. The multiple pitch devices B2 are a central pitch device arranged at the center of the bottom surface of the pitch base, a main pitch device arranged around the bottom surface of the pitch base and symmetrical to the central pitch device, and an auxiliary pitch device arranged at the middle of the upper and lower sides of the bottom surface of the pitch base and symmetrical to the central pitch device.

[0076] The center pitch mount, main pitch mount, and auxiliary pitch mounts form a pitch bonding array, which corresponds to the center action point, the four corner action points, and the upper and lower action points on the pitch bonding array chip, respectively. In this embodiment of the invention, a total of seven pitch mounts are arranged, including a center pitch mount, four main pitch mounts, and two auxiliary pitch mounts. The pitch base is used to fix and install each pitch mount to form a pitch bonding array.

[0077] The primary pitch mount includes a first primary pitch mount 1, a second primary pitch mount 2, a third primary pitch mount 3, and a fourth primary pitch mount 4. The first primary pitch mount 1, the second primary pitch mount 2, the third primary pitch mount 3, and the fourth primary pitch mount 4 are respectively located at the four corner positions on the bottom surface of the square pitch base, and correspond to the upper left corner action point X1, the lower left corner action point X2, the lower right corner action point X3, and the upper right corner action point X4 on the pitch bonding array chip, respectively. The secondary pitch mount includes a fifth secondary pitch mount 5 and a sixth secondary pitch mount 6. The fifth secondary pitch mount 5 and the sixth secondary pitch mount 6 are respectively located at the upper middle position and the lower middle position on the bottom surface of the pitch base, and correspond to the upper middle position X5 and the lower middle position X6 on the pitch bonding array chip, respectively. The central pitch mount includes a seventh secondary pitch mount 7, which corresponds to the central action point X7 on the pitch bonding array chip.

[0078] Specifically, the pitch alignment array has seven pitch points on the chip. The first main pitch point X1 is located at the upper left corner of the chip, the second main pitch point X2 is located at the lower left corner of the chip, the third main pitch point X3 is located at the lower right corner of the chip, the fourth main pitch point X4 is located at the upper right corner of the chip, the fifth auxiliary pitch point X5 is located at the upper center of the chip, the sixth auxiliary pitch point X6 is located at the lower center of the chip, and the seventh center pitch point X7 is located at the center of the chip. When the pitch array is controlled in a coordinated manner, the seventh central pitch gauge, the fifth auxiliary pitch gauge, and the sixth auxiliary pitch gauge act as auxiliary pitch gauges in coordination with the four main pitch gauges: the first main pitch gauge, the second main pitch gauge, the third main pitch gauge, and the fourth main pitch gauge. In this embodiment, the four vertices corresponding to the chip bonding area and the center point of the chip bonding area are used as the main pitch points. At the same time, the two midpoints between the center point and the edge are used as auxiliary pitch points. The main pitch points at the four vertices and the central pitch point play the most basic and core role in the pitch bonding and welding of the chip, realizing the bonding of the four vertices of the chip. The purpose of the two auxiliary pitch points is to work in conjunction with the main pitch points and supplement the bonding work of the main pitch points. This ensures that in addition to the bonding of the four vertices pitched by the main pitch points, the other parts between the four vertices and the center point are also bonded, thus ensuring a higher degree of bonding of the entire chip. When working in tandem, the first, second, third, and fourth main pitch sensors operate in turn. When the first main pitch sensor is active, the fifth auxiliary pitch sensor and the seventh center pitch sensor operate simultaneously with it; when the second main pitch sensor is active, the sixth auxiliary pitch sensor and the seventh center pitch sensor operate simultaneously with it; when the third main pitch sensor is active, the sixth auxiliary pitch sensor and the seventh center pitch sensor operate simultaneously with it; and when the fourth main pitch sensor is active, the fifth auxiliary pitch sensor and the seventh center pitch sensor operate simultaneously with it. The overall goal is to achieve a higher degree of fit between the entire chip. Specifically, the tandem operation includes two aspects: first, the four main pitch points and the center pitch point work together sequentially to achieve basic fit between the chip's perimeter and center; second, the two auxiliary pitch points simultaneously cooperate with the four main pitch points and the center pitch point to achieve further fit between the chip's center and its perimeter. The synergistic effect of these two aspects enables a high degree of bonding of the entire chip.

[0079] Pitch device B2 is implemented using the following two pitch device embodiments:

[0080] Pitch indicator embodiment 1

[0081] As attached Figure 4As shown, the pitch device B2 includes a first housing T1, a first pitch head T7 located at the center of the bottom of the first housing with one end of the first pitch head T7 vertically penetrating the bottom surface of the first housing to the outside, a first pitch rod T6 fixedly installed on the bottom surface of the first housing T1 and symmetrically arranged on both sides of the first pitch rod T6, a first spring mounting plate T8 fixedly installed on the other end of the first pitch rod T6 and cooperating with the electromagnet assembly, and a first spring T2 connecting the first spring mounting plate T8 and the top surface of the first housing T1. The pitch device B2 is attached to the action point on the pitch bonding array chip through the first pitch head T7 at one end of the first pitch rod T6.

[0082] As attached Figure 5 As shown, the electromagnet assembly includes a first electromagnet T4 in the shape of a cylinder, a first coil T5 wound on the first electromagnet T4, and a first armature T3 symmetrically and horizontally installed on the left and right sides of the first spring mounting plate T8 and arranged perpendicular to the first electromagnet T4. The first armature T3 cooperates with the first electromagnet T4.

[0083] As can be seen, the pitch device B2 consists of a first outer shell T1, two identical springs T2, two identical armatures T3, two identical electromagnets T4 and their wound coils T5, a metal pitch rod T6, and a fiber cotton pitch head T7. When the electromagnet coil is energized, the electromagnet core generates electromagnetic force to attract the armature above it, thereby driving the metal pitch rod downward. When the electromagnet coil is de-energized, the attraction force of the electromagnet core on the armature disappears, and at this time, the stretched spring causes the metal pitch rod to spring back upward.

[0084] Pitch tool embodiment two

[0085] The pitch device B2 includes a second housing R1, a second pitch head R5 located at the center of the bottom of the second housing with one end of the head R5 perpendicularly penetrating the bottom surface of the second housing to the outside, a second pitch rod R4 fixedly installed on the bottom surface of the second housing R1 and symmetrically arranged on both sides of the second pitch rod R4, a second spring mounting plate R6 fixedly installed on the other end of the second pitch rod R4 and cooperating with the electromagnet assembly, and a second spring R2 connecting the second spring mounting plate R6 and the top surface of the second housing R1. The pitch device is attached to the action point on the pitch bonding array chip through the second pitch head R5 at one end of the second pitch rod R4.

[0086] The electromagnet assembly includes a sickle-shaped second electromagnet R3, a second armature U2 whose one end is movably connected to one end of a second spring mounting plate R6 and whose other end is movably connected to one end of the "U"-shaped blade of the second electromagnet R3, and a second coil R7 wound around one end of the "U"-shaped blade of the second electromagnet R3. The other end U1 of the "U"-shaped blade of the second electromagnet R3 extends laterally outward to form a handle U4. The handle U4 and the top surface of the "U"-shaped blade of the second electromagnet R3 are located on the same plane. An air gap region U3 is formed between the second armature U2, the top surface of the "U"-shaped blade of the second electromagnet R3, and the top surface of the handle U4.

[0087] As attached Figure 7 As shown, the pitch bonding full welding control method applied to the above-mentioned pitch bonding full welding device includes the following steps:

[0088] S1. Acquire real-time X-ray images of chip eutectic bonding, and perform image preprocessing on the real-time acquired chip eutectic bonding X-ray images in the input module;

[0089] S2. Determine if the bonding is accurate: Determine if the eutectic welding meets the welding accuracy requirements. When the welding accuracy is determined to be substandard, calculate and obtain the real-time void depth and void area ratio.

[0090] S3. Calculate the pitch time, pitch frequency and pitch amplitude of the pitch device based on the real-time cavity depth and cavity area ratio;

[0091] S4. Based on the pitch time, pitch frequency and pitch amplitude of the pitch mount, the pitch fit coordination control module performs coordinated and refined control of the pitch fit array;

[0092] S5. Acquire a new round of real-time X-ray images of chip eutectic welding, repeat step S1 until the chip eutectic welding accuracy meets the standard, and end the pitch and fit coordination control of chip eutectic welding.

[0093] In step S2, the specific steps for determining whether the bonding is accurate or whether the eutectic welding meets the welding precision requirements are as follows: determine whether the welding void rate in the chip eutectic welding X-ray image is less than the preset welding void rate threshold. If the welding void rate is greater than the preset welding void rate threshold, calculate and obtain the real-time void depth and void area ratio in the chip eutectic welding X-ray image.

[0094] Preferably, in step S4, the pitch-fitting collaborative control module performs collaborative control of the pitch-fitting array, specifically including:

[0095] S401. The pitch assembly receives the cooperative control signal from the pitch fit cooperative control module;

[0096] S402. The main pitch device in the pitch bonding array of the pitch device assembly is bonded to the main pitch point located at the four corner action points on the pitch bonding array chip; at the same time, the auxiliary pitch device located between the main pitch device and the central pitch device in the pitch bonding array is bonded to the upper middle or lower middle action point on the pitch bonding array chip, and the central pitch device located in the pitch bonding array is bonded to the central action point on the pitch bonding array chip.

[0097] Preferably, in step S402, the main pitch sensor in the pitch bonding array of the pitch sensor assembly is bonded to the main pitch point located at the four corner action points on the pitch bonding array chip. Simultaneously, the auxiliary pitch sensor located between the main pitch sensor and the central pitch sensor in the pitch bonding array is bonded to the upper-middle or lower-middle action point on the pitch bonding array chip, and the central pitch sensor in the pitch bonding array is bonded to the central action point on the pitch bonding array chip. Specifically, this includes:

[0098] S4021. When the first main pitch device 1 is attached to the upper left corner action point on the pitch bonding array chip, the fifth auxiliary pitch device 5 is attached to the upper middle action point on the pitch bonding array chip, and the seventh center pitch device 7 is attached to the center action point on the pitch bonding array chip.

[0099] S4022. When the second main pitch device 2 is attached to the lower left corner action point on the pitch bonding array chip, the sixth auxiliary pitch device 6 is attached to the lower middle action point on the pitch bonding array chip, and the seventh center pitch device 7 is attached to the center action point on the pitch bonding array chip.

[0100] S4023. When the third main pitch device 3 is attached to the lower right corner action point on the pitch bonding array chip, the sixth auxiliary pitch device 6 is attached to the lower middle action point on the pitch bonding array chip, and the seventh center pitch device 7 is attached to the center action point on the pitch bonding array chip.

[0101] S4024. When the fourth primary pitch device 4 is attached to the upper right corner action point on the pitch bonding array chip, the fifth secondary pitch device 5 is attached to the upper middle action point on the pitch bonding array chip, and the seventh central pitch device 7 is attached to the central action point on the pitch bonding array chip.

[0102] Preferably, in step S4, the pitch-fitting collaborative control module performs fine-grained control on the pitch-fitting array, specifically including:

[0103] S403. Based on the pitch angle of the pitch device, calculate the magnetic flux φ of the electromagnet inside the pitch device, and its expression is:

[0104]

[0105] (1) In the formula, v is the voltage difference applied between the terminals of the second winding coil, N is the number of turns of the second winding coil, R is the resistance of the second winding coil, and A g θ1 is the cross-sectional area of ​​the air gap, θ1 is the rotation angle between the tool holder and the second armature T3, i.e., the pitch amplitude of the pitching device, μ0 is the vacuum permeability, and l c Let A be the average path length of the magnetic core. c Let c1 and c2 be the average cross-sectional area of ​​the magnetic core, where c1 and c2 are constants.

[0106] Based on the magnetic flux φ of the electromagnet inside the pitch sensor, the current i flowing through the electromagnet inside the pitch sensor can be calculated, and its expression is:

[0107] Ni=φR (2),

[0108] (2) In the formula, N is the number of turns of the coil, R is the resistance of the second winding coil, and φ is the magnetic flux of the electromagnet;

[0109] S403. Adjust the current value, on / off time, and on / off frequency of the electromagnet inside the pitch device.

[0110] The derivation of formula (1) is as follows:

[0111] like Figure 6 As shown, N is the number of turns of the second winding coil, the resistance of the second winding coil is R, and the magnetic circuit consists of a soft iron core including a "U"-shaped blade, a second armature U2, and an air gap U3; when a voltage difference v is applied between the terminals of the second coil, the electromagnetic relay satisfies the following equation:

[0112]

[0113] Where i is the current flowing through the second winding coil, and φ is the magnetic flux through the iron core. The current i and the electromagnetic flux φ are related by the magnetic equivalent circuit equation, as follows:

[0114] Ni=φR (2)

[0115] Where R = R g +R c R g For air gap reluctance, R c The magnetic reluctance of the magnetic core is represented as follows:

[0116]

[0117] Among them, l g and A g It is the length and cross-sectional area of ​​the air gap, r gθ1 is the average turning radius of the cross-section, θ1 is the rotation angle of the second armature, μ0 is the free permeability, and l c Let A be the average path length of the magnetic core. c μ is the average cross-sectional area of ​​the magnetic core. c The permeability of the core material can be expressed as:

[0118]

[0119] Where c1 and c2 are both constants, and R is represented as follows:

[0120]

[0121] Combining formulas (2), (3), and (6), we can obtain:

[0122]

[0123] Depending on the required pitch amplitude, there are different θ1 values. φ can be calculated and then substituted into equation (2) to obtain the current i corresponding to that pitch amplitude.

[0124] In this embodiment of the invention, the pitch bonding array module receives a coordinated control signal and bonds its internal main pitch lever to the main pitch points located at the four corner action points on the pitch bonding array chip. Simultaneously, the auxiliary pitch lever located between the main pitch lever and the central pitch lever in the pitch bonding array module is bonded to the upper middle or lower middle action points on the pitch bonding array chip, and the central pitch lever in the pitch bonding array is bonded to the central action point on the pitch bonding array chip. This achieves coordinated control of the pitch levers, realizes chip pitch bonding with high precision, effectively reduces the voids in chip eutectic bonding, and solves the technical problem of high bonding void rate and low bonding quality caused by the existing device.

[0125] This invention first acquires a real-time X-ray image of chip eutectic bonding and preprocesses it. Then, it determines whether the bonding void rate in the chip eutectic bonding X-ray image is less than a preset bonding void rate threshold. If the bonding void rate is greater than the preset threshold, it calculates the real-time void depth and void area ratio in the chip eutectic bonding X-ray image, as well as the pitch time, pitch frequency, and pitch amplitude of the pitch device. Finally, based on the pitch amplitude, it first calculates the magnetic flux of the electromagnet inside the pitch device, then calculates the current value of the electromagnet inside the pitch device, and adjusts the pitch amplitude of the armature by adjusting the current value, thereby achieving fine control of the pitch device, realizing chip pitch fit with high precision, effectively reducing the void degree of chip eutectic bonding, and solving the technical problem that the existing device causes a high bonding void rate and low bonding quality.

Claims

1. A pitch-fitting full welding device for eutectic welding, comprising a host computer module and an output processing module communicatively connected to the host computer module, characterized in that: The host computer module is used to process preset tasks based on the acquired real-time X-ray images of chip eutectic bonding, and to obtain the pitch time, pitch frequency, and pitch amplitude of the pitch device; the host computer module includes: The input module is used to acquire and preprocess real-time X-ray images of chip eutectic bonding and to calculate void data of chip eutectic bonding, wherein the void data includes real-time void degree and void area ratio. The storage module, which is communicatively connected to the input module, is used to store the hole data and preset tasks, including pitch time, pitch frequency and pitch amplitude calculation tasks. The memory unit is connected to the storage module via the host computer bus and is used to temporarily store empty data and preset task data; The CPU unit is connected to the storage module via the host computer bus and is used to process preset tasks based on the hole data. The preset tasks include pitch time calculation, pitch frequency calculation and pitch amplitude calculation of the pitch device. The interface module communicates with the storage module and the output processing module via the host computer bus, and is used to transmit the preset task processing results to the pitch and fit array collaborative control module. The output processing module is used to perform coordinated and refined control of the bonding between the pitch bonding array module and the pitch bonding array chip based on the preset task processing results. It includes: The pitch bonding array collaborative control module communicates with the interface module and is used to control the main pitch, auxiliary pitch and central pitch in the pitch bonding array to work together with the action points on the pitch bonding array chip. It also calculates the current of the pitch lever based on the preset task processing results, and then finely controls the pitch amplitude of the pitch lever by adjusting the on and off state of the pitch lever and the magnitude of the current. The pitch bonding array module communicates with the pitch bonding array coordination control module. It coordinates the bonding of multiple pitch levers within the module with the action points on the pitch bonding array chip, and adjusts the power on / off state and current magnitude of each pitch lever to achieve pitch amplitude adjustment of the pitch rod within each pitch lever.

2. The pitch-fitting full welding device for eutectic welding as described in claim 1, characterized in that: The pitch-fitting array module includes a pitch base (B1), and multiple pitch devices (B2) are provided on the bottom surface of the pitch base (B1). The multiple pitch devices (B2) are respectively a central pitch device located at the center of the bottom surface of the pitch base, a main pitch device located around the bottom surface of the pitch base and symmetrical to the central pitch device, and an auxiliary pitch device located at the middle of the upper and lower sides of the bottom surface of the pitch base and symmetrical to the central pitch device. The central pitch gauge, the main pitch gauge, and the auxiliary pitch gauge form a pitch bonding array, and correspond to the central action point, the four corner action points, and the upper and lower action points on the pitch bonding array chip, respectively.

3. The pitch-fitting full welding device for eutectic welding as described in claim 2, characterized in that, The main pitch device includes a first main pitch device (1), a second main pitch device (2), a third main pitch device (3), and a fourth main pitch device (4). The first main pitch device (1), the second main pitch device (2), the third main pitch device (3), and the fourth main pitch device (4) are respectively set at the four corner positions on the bottom surface of the square pitch base, and respectively correspond to the upper left corner position, lower left corner position, lower right corner position, and upper right corner position on the pitch bonding array chip. The auxiliary pitch device includes a fifth auxiliary pitch device (5) and a sixth auxiliary pitch device (6). The fifth auxiliary pitch device (5) and the sixth auxiliary pitch device (6) are respectively located at the upper middle position and the lower middle position on the bottom surface of the pitch base, and respectively correspond to the upper middle position and the lower middle position on the pitch bonding array chip. The central pitch gauge includes a seventh auxiliary pitch gauge (7), which corresponds to the central action point on the pitch bonding array chip.

4. The pitch-fitting full welding device for eutectic welding as described in claim 3, characterized in that: The pitch device (B2) includes a first housing (T1), a first pitch head (T7) located at the center of the bottom of the first housing and extending vertically through the bottom surface of the first housing to the outside, a first pitch rod (T6), an electromagnet assembly fixedly installed on the bottom surface of the first housing (T1) and symmetrically arranged on both sides of the first pitch rod (T6), a first spring mounting plate (T8) fixedly installed on the other end of the first pitch rod (T6) and cooperating with the electromagnet assembly, and a first spring (T2) connected between the first spring mounting plate (T8) and the top surface of the first housing (T1). The pitch device (B2) is attached to the action point on the pitch bonding array chip through the first pitch head (T7) at one end of the first pitch rod (T6). The electromagnet assembly includes a cylindrical first electromagnet (T4), a first coil (T5) wound on the first electromagnet (T4), and a first armature (T3) symmetrically and horizontally mounted on the left and right sides of the first spring mounting plate (T8) and arranged perpendicularly to the first electromagnet (T4). The first armature (T3) cooperates with the first electromagnet (T4).

5. The pitch-fitting full welding device for eutectic welding as described in claim 3, characterized in that: The pitch device (B2) includes a second housing (R1), a second pitch head (R5) located at the center of the bottom of the second housing and extending vertically through the bottom surface of the second housing to the outside, a second pitch rod (R4), an electromagnet assembly fixedly installed on the bottom surface of the second housing (R1) and symmetrically arranged on both sides of the second pitch rod (R4), a second spring mounting plate (R6) fixedly installed on the other end of the second pitch rod (R4) and cooperating with the electromagnet assembly, and a second spring (R2) connecting the second spring mounting plate (R6) and the top surface of the second housing (R1). The pitch device is attached to the action point on the pitch bonding array chip through the second pitch head (R5) at one end of the second pitch rod (R4). The electromagnet assembly includes a sickle-shaped second electromagnet (R3), a second armature (U2) whose one end is movably connected to one end of a second spring mounting plate (R6) and whose other end is movably connected to one end of the "U"-shaped blade of the second electromagnet (R3), and a second coil (R7) wound around one end of the "U"-shaped blade of the second electromagnet (R3). The other end (U1) of the "U"-shaped blade of the second electromagnet (R3) extends laterally outward to form a handle (U4). The handle (U4) and the top surface of the "U"-shaped blade of the second electromagnet (R3) are located on the same plane. An air gap region (U3) is formed between the second armature (U2), the top surface of the "U"-shaped blade of the second electromagnet (R3), and the top surface of the handle (U4).

6. A pitch-fitting full-welding control method applied to the pitch-fitting full-welding device according to claim 5, characterized in that, The method includes the following steps: The input module acquires real-time X-ray images of chip eutectic bonding in real time and performs image preprocessing on the chip eutectic bonding X-ray images; based on the preprocessed chip eutectic bonding real-time X-ray images, the chip eutectic bonding void ratio is calculated; The CPU unit determines whether the weld void rate in the chip eutectic welding X-ray image is less than a preset weld void rate threshold. If the weld void rate is greater than the preset weld void rate threshold, it calculates the real-time void depth and void area ratio in the chip eutectic welding X-ray image. Based on the real-time void depth and void area ratio, it calculates the pitch time, pitch frequency, and pitch amplitude of the pitching device. The pitch-fitting collaborative control module performs collaborative and refined control of the pitch-fitting array module based on the pitch time, pitch frequency, and pitch amplitude of the pitch gauge.

7. The pitch-fitting full welding control method as described in claim 6, characterized in that, Coordinated control of the pitch-fit array specifically includes: The pitch-fitting collaborative control module sends collaborative control signals to the pitch-fitting array module; The pitch-fit array module receives the coordinated control signal and aligns its internal main pitch tool with the main pitch point located at the four corner positions on the pitch-fit array chip. Simultaneously, the auxiliary pitch tool located between the main pitch tool and the central pitch tool in the pitch-fit array module is coordinated to be aligned with the upper middle or lower middle positions on the pitch-fit array chip, and the central pitch tool in the pitch-fit array is coordinated to be aligned with the central position on the pitch-fit array chip.

8. The pitch-fitting full welding control method as described in claim 7, characterized in that, The pitch alignment array module receives a coordinated control signal and aligns its internal main pitch sensor with the main pitch points located at the four corner positions on the pitch alignment array chip. Simultaneously, the auxiliary pitch sensors located between the main and central pitch sensors in the pitch alignment array module are coordinated and aligned with the upper-middle or lower-middle positions on the pitch alignment array chip, and the central pitch sensor in the pitch alignment array is coordinated and aligned with the central position on the pitch alignment array chip. Specifically, this includes: When the first main pitch device (1) is attached to the upper left corner action point on the pitch bonding array chip, the fifth auxiliary pitch device (5) is attached to the upper middle action point on the pitch bonding array chip, and the seventh center pitch device (7) is attached to the center action point on the pitch bonding array chip. When the second main pitch device (2) is attached to the lower left corner action point on the pitch bonding array chip, the sixth auxiliary pitch device (6) is attached to the lower middle action point on the pitch bonding array chip, and the seventh center pitch device (7) is attached to the center action point on the pitch bonding array chip. When the third main pitch device (3) is attached to the lower right corner action point on the pitch bonding array chip, the sixth auxiliary pitch device (6) is attached to the lower middle action point on the pitch bonding array chip, and the seventh center pitch device (7) is attached to the center action point on the pitch bonding array chip. When the fourth main pitch device (4) is attached to the upper right corner action point on the pitch bonding array chip, the fifth auxiliary pitch device (5) is attached to the upper middle action point on the pitch bonding array chip, and the seventh central pitch device (7) is attached to the central action point on the pitch bonding array chip.

9. The pitch-fitting full welding control method as described in claim 8, characterized in that, The pitch-fitting collaborative control module provides fine-grained control over the pitch-fitting array module, specifically including: The magnetic flux of the electromagnet inside the pitch sensor is calculated based on the pitch angle of the pitch sensor. Its expression is: （1）， (1) In the formula, The voltage difference applied between the terminals of the second wound coil. The number of turns for the second winding coil. For the resistance of the second wound coil, It is the cross-sectional area of ​​the air gap. It is the rotation angle between the handle and the second armature (U2), that is, the pitch angle of the pitch device. The permeability of free space, The average path length of the magnetic core. The average cross-sectional area of ​​the magnetic core. All are constants; Based on the magnetic flux of the electromagnet inside the pitch sensor The current value of the electromagnet inside the pitch sensor was calculated. Its expression is: （2）, (2) In the formula, The number of coil turns. For the resistance of the second wound coil, is the magnetic flux of the electromagnet; Adjust the current value, on / off time, and on / off frequency of the electromagnet inside the pitch device.

Images