Substrate and storage system

Abstract

A substrate and a storage system are provided that can suppress the degradation of characteristics of electrical signals flowing between a connector of a storage system and a connector of a host device. The substrate includes a first connector (101) that can be fitted into a connector of a host device. The first connector (101) includes a plurality of connector terminals (101b) arranged in a first direction and a substrate portion (101a) that includes a surface (S1) on which the plurality of connector terminals (101b) are provided and extends in the first direction. The substrate portion (101a) has a surface (S3) perpendicular to the surface (S1), a first protrusion (101c1) provided on the surface (S3) and protruding in the first direction, a surface (S4) located on the opposite side of the surface (S3), and a second protrusion (101c2) provided on the surface (S4) and protruding in a direction opposite to the first direction.

Description

[0001] This application claims priority to Japanese Patent Application No. 2022-045554 (filed on March 22, 2022). This application incorporates the entire contents of that basic application by reference. Technical Field

[0002] Embodiments of the present invention relate to a substrate and a storage system. Background Technology

[0003] The storage system includes, for example, a substrate, a memory disposed on the substrate, a memory controller disposed on the substrate, and a connector disposed at an end of the substrate. The connector of the storage system is, for example, a connector capable of being fitted into a host device. Summary of the Invention

[0004] The object of the present invention is to provide a substrate and a storage system capable of suppressing the degradation of the characteristics of electrical signals flowing between the connector of the storage system and the connector of the host device.

[0005] One embodiment of the substrate includes a first connector capable of being fitted into a connector of a host device. The first connector includes a plurality of connector terminals disposed in a first direction and a substrate portion including a first surface having the plurality of connector terminals and extending in the first direction. The substrate portion includes a second surface perpendicular to the first surface, a first protrusion disposed on the second surface and protruding in the first direction, a third surface located on the opposite side of the second surface, and a second protrusion disposed on the third surface and protruding in a direction opposite to the first direction. Attached Figure Description

[0006] Figure 1 This is a block diagram illustrating an example of the structure of the storage system according to the first embodiment.

[0007] Figure 2 (a) is a top view showing an example of the more detailed structure of the storage system of the first embodiment. (b) is a side view showing an example of the more detailed structure of the storage system of the first embodiment.

[0008] Figure 3 This is a cross-sectional view of the connector according to the first embodiment.

[0009] Figure 4 (a) is a cross-sectional view of the substrate portion before processing according to the first embodiment. (b) is a cross-sectional view of the substrate portion after processing according to the first embodiment, having the first protrusion. (c) is a cross-sectional view of the substrate portion after processing according to the first embodiment, having the first protrusion and the second protrusion.

[0010] Figure 5 This is a cross-sectional view of the connector and the connector of the host device according to the first embodiment.

[0011] Figure 6 This is a cross-sectional view of the connector of a modified example of the first embodiment.

[0012] Figure 7 This is a top view showing an example of the structure of the connector of the storage system according to the second embodiment.

[0013] Figure 8 (a) is a cross-sectional view of the connector of the storage system of the second embodiment, including the 9th and 10th surfaces. (b) is a cross-sectional view of the connector of the storage system of the second embodiment, excluding the 9th and 10th surfaces.

[0014] Figure 9 (a) is a top view showing the state in which the center line of the connector terminal of the connector of the second embodiment deviates from the center line of the connector terminal of the host device connector. (b) is a top view showing the state after the connector terminal of the connector of the second embodiment has moved in the -X and -Y directions. (c) is a top view showing the state after the connector terminal of the connector of the second embodiment has moved further in the -X and -Y directions.

[0015] Figure 10 This is a top view showing an example of the structure of the connector in the first variation of the second embodiment.

[0016] Figure 11 This is a cross-sectional view showing an example of the structure of the connector in the first variation of the second embodiment.

[0017] Figure 12 (a) is a top view showing the state in which the center line of the connector terminal of the first modification of the second embodiment deviates from the center line of the connector terminal of the host device connector. (b) is a top view showing the state in which the connector terminal of the first modification of the second embodiment moves toward the -X and -Y directions. (c) is a top view showing the state in which the connector terminal of the first modification of the second embodiment moves further toward the -X and -Y directions.

[0018] Figure 13 This is a top view showing an example of the structure of the connector in the second variation of the second embodiment.

[0019] Figure 14 This is a cross-sectional view showing an example of the structure of the connector in the second variation of the second embodiment.

[0020] Figure 15(a) is a top view showing the state in which the center line of the connector terminal of the storage system of the second modification of the second embodiment deviates from the center line of the connector terminal of the host device. (b) is a top view showing the state in which the connector terminal of the connector of the second modification of the second embodiment moves toward the -X and -Y directions. (c) is a top view showing the state in which the connector terminal of the connector of the second modification of the second embodiment moves further toward the -X and -Y directions.

[0021] Figure 16 This is a top view showing an example of the structure of the first side of the connector of the storage system according to the third embodiment.

[0022] Figure 17 This is a top view showing an example of the structure of the second side of the connector of the storage system according to the third embodiment.

[0023] Figure 18 This is a top view showing a connector during the manufacturing process of the storage system of the third embodiment.

[0024] Explanation of reference numerals in the attached figures

[0025] 1…Information Processing System

[0026] 10… Storage System

[0027] 10Y, 10Z... centerline

[0028] 20… Main unit

[0029] 100...Substrate

[0030] 101, 101', 101”, 101'A, 101'B… Connectors (Connector 1)

[0031] 101a…Substrate Section

[0032] 101b, 101b'... Connector terminals (first connector terminal)

[0033] 101d1…First grounding layer

[0034] 101d2…Second Grounding Layer

[0035] 101d3…Third grounding layer

[0036] 101d4… Fourth grounding layer

[0037] 101c1…First convex part

[0038] 101c2…Second convex part

[0039] 101d1…First grounding layer

[0040] 101d2…Second Grounding Layer

[0041] 101e…Matching

[0042] 101f…Matching Part

[0043] 101g…Matching

[0044] 101h…convex part

[0045] 102… Interface Circuit

[0046] 103…Volatile Memory

[0047] 104… Controller

[0048] 105…Non-volatile memory

[0049] 106…protrusion

[0050] 201, 201b… connector terminals

[0051] 301(+), 301(-)... Conductive parts

[0052] 301a…First linear conductive part

[0053] 301b…Second linear conductive part

[0054] 301(L)...lead wire

[0055] θ1, θ2, θ3, θ4,…angles

[0056] CL1…First Centerline

[0057] CL2…Second Centerline

[0058] CL3…Third centerline

[0059] CL4…4th Centerline

[0060] W...width

[0061] T…thickness

[0062] L…length

[0063] L1…First Size

[0064] L2…Second Size

[0065] L3…3rd size

[0066] L4…4th size

[0067] L6…6th size

[0068] L11…11th dimension

[0069] L12…12th size

[0070] L13…13th size

[0071] L14…14th size

[0072] L26… 26th size

[0073] S1…Page 1

[0074] S2… Page 2

[0075] S3… Page 3

[0076] S3a, S3b... Part of the third side

[0077] S4…Page 4

[0078] S4a, S4b... Part of the fourth side

[0079] S5… Page 5

[0080] S6… Page 6

[0081] S7… Page 7

[0082] S8… Page 8

[0083] S9… Page 9

[0084] S10… Page 10

[0085] S11… Page 11

[0086] S12… Page 12

[0087] SLT… Gap Detailed Implementation

[0088] Hereinafter, the implementation method will be described with reference to the accompanying drawings.

[0089] (First Embodiment)

[0090] Figure 1 This is a block diagram illustrating an example of the structure of the information processing system 1 according to the first embodiment. The information processing system 1 includes a storage system 10 and a host device 20.

[0091] Host device 20 is a device for performing information processing. Host device 20 is, for example, a personal computer, a tablet computer, or a server. Host device 20 includes connector 201. Connector 201 is a receptacle connector. Connector 201 is an electronic component including multiple connector terminals. Connector terminals are terminals for transmitting and receiving signals to external devices.

[0092] Storage system 10 is a storage device configured to write data to and read data from non-volatile memory. Storage system 10 is, for example, an SSD (Solid State Drive). Storage system 10 can be connected to host device 20. Storage system 10 functions as an external storage device for host device 20. Storage system 10 includes a connector (first connector) 101, interface (I / F) circuitry 102, volatile memory 103, controller 104, and non-volatile memory 105.

[0093] Connector 101 is an edge connector. Connector 101 is an electronic component comprising multiple connector terminals. The form factor of connector 101 is, for example, M.2 or EDSFF (Enterprise and Data Center SSD Form Factor). Connector 101 can be mated with connector 201. If connector 101 is mated with connector 201, then connector 101 and connector 201 are connected. As a result, storage system 10 and host device 20 are connected.

[0094] The interface circuit 102 is, for example, an interface conforming to the PCI Express (registered trademark) (PCIe) standard, which is a type of serial communication.

[0095] Volatile memory 103 is a memory that stores data. Volatile memory 103 is, for example, DRAM (Dynamic Random Access Memory). If the power supply to volatile memory 103 is disconnected, the stored information (data) will be lost. Volatile memory 103 is used as a buffer when transmitting and receiving signals between host device 20 and storage system 10.

[0096] The controller 104 is an integrated circuit that controls the various parts of the storage system 10. The controller 104 comprehensively controls the interface circuit 102, the volatile memory 103, and the non-volatile memory 105. Specifically, when the controller 104 receives a write request from the host device 20 via the interface circuit 102, it writes the data specified by the write request to the non-volatile memory 105. Conversely, when the controller 104 receives a read request from the host device 20 via the interface circuit 102, it reads the data specified by the read request from the non-volatile memory 105 and sends it to the host device 20.

[0097] Non-volatile memory 105 is a memory that stores data non-volatilely. Non-volatile memory 105 is, for example, NAND flash memory. Other examples of non-volatile memory 105 include MRAM (Magnetoresistive Random Access Memory), PRAM (Phase Change Random Access Memory), ReRAM (Resistive Random Access Memory), or FeRAM (Ferroelectric Random Access Memory). Furthermore, the number of non-volatile memories 105 can be two or more.

[0098] Next, a more detailed description of the structure of the storage system 10 of the first embodiment will be provided. Figure 2 (a) is a top view showing an example of the more detailed structure of the storage system 10 of the first embodiment. Figure 2 (b) is a side view of storage system 10.

[0099] The storage system 10 is configured on a substrate 100. The substrate 100 is a substrate including a printed wiring board. The printed wiring board is, for example, a multilayer printed wiring board with conductive patterns of three or more layers. A connector 101, an interface circuit 102, a volatile memory 103, a controller 104, and a non-volatile memory 105 are mounted on the substrate 100. The connector 101 is disposed at an end of the substrate 100.

[0100] The substrate 100 has a plate-like shape. The substrate 100 has a length L, a width W, and a thickness T. The length L of the substrate 100 is the distance between the ends of the substrate 100 from one end of the substrate 100 where the connector 101 is disposed to the opposite end of the substrate 100 (hereinafter referred to as the horizontal direction). The width W of the substrate 100 is the distance between the ends of the substrate 100 in a direction perpendicular to the horizontal direction (hereinafter referred to as the vertical direction). The thickness T of the substrate 100 is the distance between the ends of the substrate 100 in a direction perpendicular to both the horizontal and vertical directions. The length L of the substrate 100 is greater than the width W of the substrate 100. However, the length L of the substrate 100 is sometimes smaller than the width W of the substrate 100. Additionally, the length L of the substrate 100 is sometimes the same as the width W of the substrate 100. Figure 2 (a) and Figure 2(b) shows the X-axis, Y-axis (first axis), and Z-axis. The X-axis, Y-axis, and Z-axis are orthogonal to each other. Hereinafter, the direction of the arrow pointing to the X-axis in the attached diagram will be called the +X direction, and the direction opposite to the arrow pointing to the X-axis will be called the -X direction. The direction of the arrow pointing to the Y-axis will be called the +Y direction (first direction), and the direction opposite to the arrow pointing to the Y-axis will be called the -Y direction. The direction of the arrow pointing to the Z-axis will be called the +Z direction, and the direction opposite to the arrow pointing to the Z-axis will be called the -Z direction. The direction of the X-axis is parallel to the aforementioned horizontal direction. The direction of the Y-axis is parallel to the aforementioned vertical direction. The direction of the Z-axis is parallel to the direction perpendicular to both the aforementioned horizontal and vertical directions.

[0101] Next, the cross-sectional structure of the connector 101 in the first embodiment will be described. Figure 3 This is a cross-sectional view of the connector 101 according to the first embodiment. The cross-sectional view shows the connector 101 along... Figure 2 The cross section of line III-III. Connector 101 includes a base portion 101a and a plurality of connector terminals (first connector terminals) 101b, 101b'.

[0102] The substrate portion 101a is a part of the substrate 100. The substrate portion 101a extends in the Y-axis direction. The material of the substrate portion 101a is an insulating material.

[0103] Connector terminals 101b and 101b' are terminals for transmitting and receiving signals to external devices. The material of connector terminals 101b and 101b' is, for example, gold (Au). The number of connector terminals 101b is the same as the number of connector terminals 101b'. The center line of one connector terminal 101b coincides with the center line of its corresponding connector terminal 101b' (10Z). The center line 10Z is parallel to the Z-axis.

[0104] The substrate portion 101a includes a first surface S1, a second surface S2, a third surface S3, a fourth surface S4, a first protrusion 101c1, a second protrusion 101c2, and a slit SLT.

[0105] The normal to surface S1 is parallel to the Z-axis. Multiple connector terminals 101b are provided on surface S1. Surface S2 is the surface opposite to surface S1. The normal to surface S2 is parallel to the Z-axis. Multiple connector terminals 101b' are provided on surface S2. Surface S3 is the surface perpendicular to surface S1. The normal to surface S3 is parallel to the Y-axis. Surface S4 is the surface opposite to surface S3. The normal to surface S4 is parallel to the Y-axis.

[0106] A first protrusion 101c1 is provided on the third surface S3. The first protrusion 101c1 protrudes in the +Y direction. The material of the first protrusion 101c1 is an insulating material. The first protrusion 101c1 includes a fifth surface S5 and a sixth surface S6. The fifth surface S5 is in contact with the third surface S3. The angle θ1 formed by the fifth surface S5 and the third surface S3 is, for example, 90 degrees. The fifth surface S5 faces the same direction as the first surface S1. The sixth surface S6 is the surface opposite to the fifth surface S5. The sixth surface S6 is in contact with the third surface. The angle θ2 formed by the sixth surface S6 and the third surface S3 is, for example, 90 degrees. The sixth surface S6 faces the same direction as the second surface S2.

[0107] A second protrusion 101c2 is provided on the fourth surface S4. The second protrusion 101c2 protrudes in the -Y direction. The material of the second protrusion 101c2 is an insulating material. The second protrusion 101c2 includes a seventh surface S7 and an eighth surface S8. The seventh surface S7 is in contact with the fourth surface S4. The angle θ3 formed by the seventh surface S7 and the fourth surface S4 is, for example, 90 degrees. The seventh surface S7 faces the same direction as the first surface S1. The eighth surface S8 is the surface opposite to the seventh surface S7. The eighth surface S8 is in contact with the fourth surface. The angle θ4 formed by the eighth surface S8 and the fourth surface S4 is, for example, 90 degrees. The eighth surface S8 faces the same direction as the second surface S2.

[0108] The shape of the first protrusion 101c1 is the same as the shape of the second protrusion 101c2. The dimensions of the first protrusion 101c1 and the second protrusion 101c2 are the same. The center line of the first protrusion 101c1 and the center line of the second protrusion 101c2 are aligned (10Y).

[0109] The slit SLT is located off-center from the center of the substrate portion 101a in the Y-axis direction. The slit SLT engages with protrusions or the like of the connector provided on the main unit 20.

[0110] Next, the method of forming the first protrusion 101c1 and the second protrusion 101c2 will be described. Figure 4 (a) shows the substrate portion 101a before processing. Figure 4 (b) shows the processed substrate portion 101a having the first protrusion 101c1. Figure 4 (c) shows the processed substrate portion 101a having a first protrusion 101c1 and a second protrusion 101c2.

[0111] A first protrusion 101c1 is formed on the substrate 101a by laser processing. Compared with milling, laser processing has higher processing accuracy. However, when using laser processing, the energy density of the laser decreases in areas where the focal length of the laser exceeds a certain distance, making it impossible to melt the substrate 101a. Therefore, the first dimension L1, the second dimension L2, the third dimension L3, and the fourth dimension L4 are set to be below the aforementioned certain distance. The first dimension L1 is the dimension of the first protrusion 101c1 in the Y-axis direction. The second dimension L2 is the dimension of the first protrusion 101c1 in the Z-axis direction. The third dimension L3 is the dimension of the first protrusion 101c1 in the Z-axis direction between the first protrusion 101c1 and the first surface S1. The fourth dimension L4 is the dimension of the first protrusion 101c1 in the Z-axis direction between the second surface S2. Furthermore, although not shown, the dimension of the first protrusion 101c1 in the X-axis direction (the fifth dimension) is also set to be below the aforementioned certain distance.

[0112] Furthermore, a second protrusion 101c2 is formed on the substrate portion 101a by laser processing. Dimensions L11 (11th), L12 (12th), L13 (13th), and L14 (14th) are set to a distance less than or equal to the aforementioned certain distance. Dimension L11 is the Y-axis dimension of the second protrusion 101c2. Dimension L12 is the Z-axis dimension of the second protrusion 101c2. Dimension L13 is the Z-axis dimension between the second protrusion 101c2 and the first surface S1. Dimension L14 is the Z-axis dimension between the second protrusion 101c2 and the second surface S2. Furthermore, although not shown, the X-axis dimension (15th dimension) of the second protrusion 101c2 is also set to a distance less than or equal to the aforementioned certain distance.

[0113] Figure 5 This is a cross-sectional view of the connector 101 of the storage system and the connector 201 of the host device according to the first embodiment.

[0114] The first protrusion 101c1 and the second protrusion 101c2 are formed by laser processing. The Y-axis dimension (6th dimension L6) of connector 101 and the Y-axis dimension (26th dimension L26) of connector 201 are approximately equal.

[0115] Next, the effects of this embodiment will be explained.

[0116] In this embodiment, the slit SLT engages with the protrusions of the connector provided on the host device 20. This prevents the storage system 10 from being mounted on the host device 20 with its front and back sides reversed. Furthermore, in this embodiment, by laser processing the substrate portion 101a, the first protrusion 101c1 and the second protrusion 101c2, which have high dimensional accuracy and high positional accuracy relative to the connector terminals 101b and 101b', can be obtained. Additionally, in this embodiment, by minimizing positional deviation, the contact state between the connector terminals 101b and 101b' of the connector 101 and the connector terminals of the connector 201 is maintained well. This suppresses the degradation of the characteristics of the electrical signals flowing between the connector 101 of the storage system and the connector 201 of the host device.

[0117] Next, a variation of the first embodiment will be described. Figure 6 This is a cross-sectional view of connector 101A, a modified example of the first embodiment.

[0118] The difference between connector 101A and connector 101 is that connector 101A has a first ground layer 101d1, a second ground layer 101d2, a third ground layer 101d3 and a fourth ground layer 101d4.

[0119] The first grounding layer 101d1, the second grounding layer 101d2, the third grounding layer 101d3, and the fourth grounding layer 101d4 are layers that function as ground. The first grounding layer 101d1, the second grounding layer 101d2, the third grounding layer 101d3, and the fourth grounding layer 101d4 are formed, for example, by plating.

[0120] The first grounding layer 101d1 is disposed in the portion S3a between the +Y direction end of the first surface S1 and the fifth surface S5 in the third surface S3. Additionally, the first grounding layer 101d1 is also disposed in the fifth surface S5. Furthermore, the first grounding layer 101d1 is also disposed in the +Y direction end of the first surface S1. Alternatively, the first grounding layer 101d1 is disposed in the +Y direction end of the first surface S1.

[0121] The second grounding layer 101d2 is disposed in the portion S3b between the +Y direction end of the second surface S2 and the sixth surface S6 in the third surface S3. Additionally, the second grounding layer 101d2 is also disposed in the sixth surface S6. Furthermore, the second grounding layer 101d2 is also disposed in the +Y direction end of the second surface S2. Alternatively, the second grounding layer 101d2 is disposed in the +Y direction end of the second surface S2.

[0122] The third grounding layer 101d3 is disposed in the portion S4a between the end of the first surface S1 in the -Y direction and the seventh surface S7 in the fourth surface S4. Additionally, the third grounding layer 101d3 is also disposed in the seventh surface S7. Furthermore, the third grounding layer 101d3 is also disposed in the end of the first surface S1 in the -Y direction. Alternatively, the third grounding layer 101d3 is disposed in the end of the first surface S1 in the -Y direction.

[0123] The fourth grounding layer 101d4 is disposed in the portion S4b between the end of the second surface S2 in the -Y direction and the eighth surface S8 in the fourth surface S4. Additionally, the fourth grounding layer 101d4 is also disposed in the eighth surface S8. Furthermore, the fourth grounding layer 101d4 is also disposed in the end of the second surface S2 in the -Y direction. Alternatively, the fourth grounding layer 101d4 is disposed in the end of the second surface S2 in the -Y direction.

[0124] The connector of the host device has at least one of the following: a grounding layer corresponding to the first grounding layer 101d1, a grounding layer corresponding to the second grounding layer 101d2, a grounding layer corresponding to the third grounding layer 101d3, and a grounding layer corresponding to the fourth grounding layer 101d4.

[0125] Next, the effects of the modified example of the first embodiment will be explained. According to the modified example of the first embodiment, the degradation of electrical signal characteristics can be suppressed. The connector 101A of the storage system includes a first ground layer 101d1, a second ground layer 101d2, a third ground layer 101d3, and a fourth ground layer 101d4. The ground potential when the connector 101A of the storage system and the connector of the host device are connected is more stable in the presence of ground layers than in the absence of ground layers. If the ground potential is stable, the degradation of electrical signal characteristics flowing between the connector of the storage system and the connector of the host device is suppressed. Furthermore, generally speaking, the larger the contact area between the ground layer of the connector of the storage system and the ground layer of the connector of the host device, the more stable the potential. Therefore, for example, the size of the ground layer of the connector of the storage system and the size of the ground layer of the connector of the host device can be increased. As a result, the contact area can be increased, and thus the potential is stabilized. For example, the size of the first ground layer 101d1 in the Y-axis direction can be increased. The size of the first ground layer 101d1 in the Y-axis direction can be made larger than, for example, the size of the connector terminal 101b in the Y-axis direction. This increases the contact area, thus stabilizing the potential.

[0126] (Second Implementation)

[0127] Figure 7 This is a top view showing an example of the structure of the connector 101' of the storage system according to the second embodiment. Figure 8 (a) and Figure 8 (b) is a cross-sectional view showing an example of the structure of connector 101'. Figure 8(a) is along Figure 7 A sectional view of VIIIA-VIIIA. Figure 8 (b) is along Figure 7 A sectional view of VIIIB-VIIIB. Furthermore, in Figure 8 (a) and Figure 8 (b) shows the structure of the first surface S1 of the substrate portion 101a. Furthermore, in the description of this embodiment, structures identical to those in the first embodiment are sometimes labeled with the same reference numerals and detailed descriptions are omitted.

[0128] The connector terminal 101b of connector 101' includes a mating portion 101e. The mating portion 101e is a component capable of mating with the connector terminal of the host device's connector. The mating portion 101e is located at the end of the connector terminal 101b in the -X direction.

[0129] The fitting portion 101e includes a 9th surface S9 and a 10th surface S10. The 9th surface S9 and the 10th surface S10 form a V-shaped groove. For example... Figure 7 As shown, the dimension in the Y-axis direction between the 9th surface S9 and the 10th surface S10 decreases towards the +X direction. Additionally, as... Figure 8 As shown in (a), the dimension in the Y-axis direction between the 9th face S9 and the 10th face S10 decreases toward the -Z direction.

[0130] The 9th surface S9 and the 10th surface S10 are obtained, for example, by processing the conductive film that becomes the connector terminal 101b using wet etching (isotropic etching).

[0131] Next, use Figure 9 of (a), Figure 9 (b) and Figure 9 (c) The reason for the mating of connector terminals 101b and 201b is explained as follows: the center line CL1 of connector terminal 101b and the center line CL2 of connector terminal 201b of the host device connector are aligned. Center line CL1 is a line parallel to the X-axis that bisects connector terminal 101b in the XY plane (hereinafter referred to as the first center line CL1). Center line CL2 is a line parallel to the X-axis that bisects connector terminal 201b in the XY plane (hereinafter referred to as the second center line CL2). Connector terminal 201b is fixed. Connector terminal 101b is movable. Figure 9 (a) is a top view showing the state in which connector terminal 101b and connector terminal 201b are in contact due to the positional deviation between the center line CL1 of connector terminal 101b and the center line CL2 of connector terminal 201b of the host device connector. Figure 9(b) is a top view showing the state after the connector terminal 101b moves toward the -X and -Y directions with the 9th surface S9 in contact with the connector terminal 201b. Figure 9 (c) is a top view showing the state after the connector terminal 101b has moved further in the -X and -Y directions, with the 9th surface S9 in contact with the connector terminal 201b.

[0132] In the case of connecting the host device and the storage system, sometimes a positional misalignment occurs between connector terminal 101b and connector terminal 201b. For example, as... Figure 9 As shown in (a), the first center line CL1 of connector terminal 101b deviates from the second center line CL2 of connector terminal 201b in the +Y direction. Furthermore, the first center line CL1 sometimes deviates from the second center line CL2 in the -Y direction. Additionally, the first center line CL1 and the second center line CL2 sometimes coincide.

[0133] When the first centerline CL1 deviates from the second centerline CL2 in the Y direction, the ninth surface S9 contacts the connector terminal 201b to connect the host device and the storage system. If a force including a component in the -X direction is applied to the connector terminal 101b while the ninth surface S9 is in contact with the connector terminal 201b, the connector terminal 101b receives a force including a component in the -Y direction from the connector terminal 201b. Therefore, as... Figure 9 As shown in (b), the connector terminal 101b moves in the -X and -Y directions in a manner that reduces the deviation of the first center line CL1 relative to the second center line CL2 in the +Y direction. Thus, the 9th surface S9 guides the movement of the connector terminal 101b in a manner that reduces the deviation between the first and second center lines. Hereinafter, this function will be referred to as the function of a guide.

[0134] If a force including the -X direction is further applied to connector terminal 101b while it is in contact with connector terminal 201b on surface S9, connector terminal 101b will move further in both the -X and -Y directions. Therefore, as Figure 9 As shown in (c), connector terminal 101b engages with connector terminal 201b in such a manner that the first center line CL1 and the second center line CL2 coincide. This suppresses the degradation of the characteristics of the electrical signal flowing between connector 101' of the storage system and the connector of the host device.

[0135] Furthermore, when the 10th surface S10 contacts the connector terminal 201b, the 10th surface S10 serves to guide the movement of the connector terminal 101b in a manner that reduces the deviation between the first center line and the second center line.

[0136] Next, a variation of the second embodiment will be described. Figure 10 This is a top view showing an example of the structure of connector 101'A of the first variation of the second embodiment. Figure 11 This is a cross-sectional view showing an example of the structure of connector 101'A. Figure 11 It is along Figure 10 A sectional view of XI-XI.

[0137] The connector terminal 101b of connector 101'A includes a rectangular portion (hereinafter referred to as the main portion) surrounded by solid and dashed lines in the XZ plane and a protrusion 106. The center line CL3 of connector terminal 101b is a line parallel to the X-axis that bisects the main portion of connector terminal 101b in the XY plane (hereinafter referred to as the third center line CL3). The protrusion 106 is located at the -Y end of the 11th surface S11. The protrusion 106 includes a 12th surface S12. The 11th surface S11 and the 12th surface S12 constitute a mating portion 101f. The normal of the 11th surface S11 is parallel to the X-axis. The 12th surface S12 serves as a guide. In connector 101'A, the number of surfaces serving as guides is one. Alternatively, instead of providing the protrusion at the -Y end of the 11th surface S11, it may be provided at the +Y end of the 11th surface S11.

[0138] The angle between face S12 (12th face) and face S11 (11th face) is an obtuse angle. The normal to face S11 (11th face) is parallel to the X-axis.

[0139] Next, use Figure 12 of (a), Figure 12 (b) and Figure 12 (c) will explain the reason why the positional deviation between the third center line CL3 and the second center line CL2 becomes smaller, resulting in the mating of connector terminals 101b and 201b. Furthermore, in Figure 12 of (a), Figure 12 (b) and Figure 12 In (c), the dashed lines used to show the extent of the main portion of connector terminal 101b are omitted. Figure 12 (a) is a top view showing the state in which connector terminal 101b and connector terminal 201b are in contact due to the positional deviation between the center line CL1 of connector terminal 101b and the center line CL2 of connector terminal 201b. Figure 12 (b) is a top view showing the state after the connector terminal 101b moves toward the -X and -Y directions, with the 12th surface S12 in contact with the connector terminal 201b. Figure 12(c) is a top view showing the state after the connector terminal 101b has moved further in the -X and -Y directions, with the 12th surface S9 in contact with the connector terminal 201b.

[0140] As described above, in the case of connecting the host device and the storage system, a positional misalignment sometimes occurs between connector terminal 101b and connector terminal 201b. For example, as Figure 12 As shown in (a), the third centerline CL3 deviates from the second centerline CL2 in the +Y direction. Furthermore, the third centerline CL3 sometimes deviates from the second centerline CL2 in the -Y direction. Additionally, the third centerline CL3 and the second centerline CL2 sometimes coincide.

[0141] When the third centerline CL3 deviates from the second centerline CL2 in the Y direction, the 12th surface S12 contacts the connector terminal 201b if the host device and the storage system are to be connected. If a force including a component in the -X direction is applied to the connector terminal 101b while the 12th surface S12 is in contact with the connector terminal 201b, the connector terminal 101b receives a force including a component in the -Y direction from the connector terminal 201b. Therefore, as Figure 12 As shown in (b), connector terminal 101b moves toward the -X and -Y directions in such a way that the deviation of the third center line CL3 from the second center line CL2 in the +Y direction is reduced.

[0142] If a force including a component in the -X direction is further applied to the connector terminal 101b while it is in contact with the connector terminal 201b on the 12th surface S12, the connector terminal 101b will move further in both the -X and -Y directions. Therefore, as Figure 12 As shown in (c), connector terminal 101b moves toward the -X and -Y directions in such a way that the deviation of the third center line CL3 from the second center line CL2 in the +Y direction is further reduced, and connector terminal 101b engages with connector terminal 201b in such a way that connector terminal 201b contacts the 11th surface S11 and the 12th surface S12. Thus, the characteristic degradation of the electrical signal flowing between connector 101 of the storage system and the connector of the host device is suppressed. Furthermore, when the form factor is M.2, using connector 101'A is advantageous in suppressing the characteristic degradation of the electrical signal compared to connector 101'.

[0143] Next, a second variation of the second embodiment will be described. Figure 13 This is a top view showing an example of the structure of connector 101'B of the second variation of the second embodiment. Figure 14 This is a cross-sectional view showing an example of the structure of connector 101'B. Figure 14 It is along Figure 13 A sectional view of XIV-XIV.

[0144] The connector terminal 101b of connector 101'B includes a rectangular portion (hereinafter referred to as the main portion) surrounded by solid and dashed lines in the XZ plane, a protrusion 106, and a convex portion 101h. The center line CL4 of connector terminal 101b is a line parallel to the X-axis that bisects the main portion of connector terminal 101b in the XY plane (hereinafter referred to as the fourth center line CL4). The convex portion 101h is located at the end of the 11th plane S11 in the +Y direction. The convex portion 101h protrudes in the -X direction. The material of the convex portion 101h is the same as the material of connector terminal 101b.

[0145] Next, use Figure 15 of (a), Figure 15 (b) and Figure 15 (c) will explain the reason why the positional deviation between the fourth center line CL4 and the second center line CL2 becomes smaller, resulting in the mating of connector terminals 101b and 201b. Furthermore, in Figure 15 of (a), Figure 15 (b) and Figure 15 In (c), the dashed lines used to show the extent of the main portion of connector terminal 101b are omitted. Figure 15 (a) is a top view showing the state in which connector terminal 101b and connector terminal 201b are in contact due to the positional deviation between the center line CL1 of connector terminal 101b and the center line CL2 of connector terminal 201b. Figure 15 (b) is a top view showing the state in which the connector terminal 101b moves toward the -X and -Y directions when the 12th surface S12 and the connector terminal 201b are in contact. Figure 12 (c) is a top view showing the state in which the connector terminal 101b moves further toward the -X and -Y directions when the 12th surface S12 is in contact with the connector terminal 201b.

[0146] As described above, in the case of connecting the host device and the storage system, a positional misalignment sometimes occurs between connector terminal 101b and connector terminal 201b. For example, as Figure 15 As shown in (a), the fourth centerline CL4 deviates from the second centerline CL2 in the +Y direction. Furthermore, the fourth centerline CL4 sometimes deviates from the second centerline CL2 in the -Y direction. Additionally, the fourth centerline CL4 and the second centerline CL2 sometimes coincide.

[0147] When the fourth centerline CL4 deviates from the second centerline CL2 in the Y direction, the 12th surface S12 contacts the connector terminal 201b if the host device and the storage system are to be connected. If a force including a component in the -X direction is applied to the connector terminal 101b while the 12th surface S12 is in contact with the connector terminal 201b, the connector terminal 101b receives a force including a component in the -Y direction from the connector terminal 201b. Therefore, as Figure 15 As shown in (b), connector terminal 101b is moved toward the -X and -Y directions in such a way that the deviation of the fourth center line CL4 from the second center line CL2 in the +Y direction is reduced.

[0148] If a force including a component in the -X direction is further applied to the connector terminal 101b while it is in contact with the connector terminal 201b on the 12th surface S12, the connector terminal 101b will move further in both the -X and -Y directions. Therefore, as Figure 15 As shown in (c), connector terminal 101b moves toward the -X and -Y directions in such a way that the deviation of the fourth center line CL4 from the second center line CL2 in the +Y direction is further reduced, and connector terminal 101b engages with connector terminal 201b in such a way that connector terminal 201b contacts the 11th surface S11, the 12th surface S12 and the protrusion 101h. Thus, the degradation of the characteristics of the electrical signal flowing between the connector of the host device and the connector 101'B of the storage system is suppressed.

[0149] (Third Implementation)

[0150] Figure 16 This is a top view showing an example of the structure of the first side S1 of the connector 101” of the storage system of the third embodiment. Figure 17 This is a top view showing an example of the structure of the second side S2 of the connector 101” of the storage system of the third embodiment. Furthermore, in the description of this embodiment, the same reference numerals are sometimes used for structures identical to those in the first embodiment, and detailed descriptions are omitted.

[0151] like Figure 16 As shown, connector 101” includes a plurality of connector terminals 101b. Additionally, as... Figure 17 As shown, connector 101" includes a plurality of connector terminals 101b'. A conductive portion 301(+) is provided at the outermost connector terminal 101b in the +Y direction. Additionally, a conductive portion 301(-) is provided at the outermost connector terminal 101b in the -Y direction. Furthermore, a lead wire 301(L) is provided at the end of each connector terminal 101b in the -X direction.

[0152] The conductive portion 301(+) includes a first linear conductive portion 301a and a second linear conductive portion 301b. The first linear conductive portion 301a is parallel to the X-axis direction. The distance D1 in the X direction from the end 100e of the substrate 100 in the -X direction to the end of the first linear conductive portion 301a is shorter than the distance D2 in the X direction from the end 100e of the substrate 100 on which the connector 101” is disposed to the end of the lead 301(L). Furthermore, the first linear conductive portion 301a is positioned away from the connector terminal 101b in the +Y direction. The second linear conductive portion 301b is disposed at an angle relative to the first linear conductive portion 301a. The angle formed by the second linear conductive portion 301b and the Y-axis is an acute angle (greater than 0 degrees and less than 90 degrees). Additionally, the second linear conductive portion 301b connects the first linear conductive portion 301a and the connector terminal 101b.

[0153] The conductive portion 301(-) includes a first linear conductive portion 301a and a second linear conductive portion 301b. The first linear conductive portion 301a is parallel to the X-axis direction. The distance D1 in the X-direction from the end 100e of the substrate 100 in the -X direction to the end of the first linear conductive portion 301a is shorter than the distance D2 in the X-direction from the end 100e of the substrate 100 on which the connector 101” is disposed to the end of the lead 301(L). In addition, the first linear conductive portion 301a is disposed at a position away from the connector terminal 101b in the -Y direction. The second linear conductive portion 301b is disposed obliquely relative to the first linear conductive portion 301a and connects the first linear conductive portion 301a and the connector terminal 101b. The angle formed by the second linear conductive portion 301b and the Y-axis is an acute angle.

[0154] The potential of the conductive part 301(+) and the potential of the conductive part 301(+) are, for example, ground potential. When the form factor is EDSFF, if the potential of the conductive part 301(+) and the potential of the conductive part 301(+) are set to ground potential, the degradation of the characteristics of the electrical signal can be suppressed.

[0155] The dimensions of the conductive portion 301(+), the conductive portion 301(-), and the dimension in the Y-axis direction between the conductive portions 301(+) and 301(-) are determined as follows. These dimensions are determined in a way that minimizes the deviation between the center line of connector 101” parallel to the X-axis and the center line of the host device connector parallel to the X-axis. As a result, the degradation of the characteristics of the electrical signal flowing between connector 101” of the storage system and the host device connector is suppressed.

[0156] Figure 18This is a top view showing connector 101 in the middle of manufacturing.

[0157] A conductive pattern 301, which is a lead 301 (L) before processing, is formed at the -X direction end of each connector terminal 101b. A conductive pattern 301, which is a conductive portion 301 (+) before processing, is formed at the far end of the connector terminal 101b located in the +Y direction. A conductive pattern 301, which is a conductive portion 301 (-) before processing, is formed at the far end of the connector terminal 101b located in the -Y direction. The conductive pattern 301 is formed, for example, by gold plating. In this case, the materials of the lead 301 (L), the conductive portion 301 (+), and the conductive portion 301 (-) are the same.

[0158] Multiple conductive patterns 301 are processed simultaneously, for example, using an etching mask (not shown) and wet etching, to form leads 301(L), conductive portions 301(+) and conductive portions 301(-).

[0159] The embodiments described are illustrative. The scope of the invention is not limited to the embodiments described.

Claims

1. A substrate, A first connector having a connector capable of fitting into a host device. The first connector includes: Multiple connector terminals are arranged in the first direction; and The substrate portion includes a first surface on which the plurality of connector terminals are disposed, and extends in the first direction. The substrate portion includes: The second surface is perpendicular to the first surface; The first protrusion is disposed on the second surface and protrudes in the first direction; The third surface is located on the opposite side of the second surface; The second protrusion is provided on the third surface and protrudes in a direction opposite to the first direction; A first grounding layer is disposed at the first protrusion; and The second grounding layer is disposed at the second protrusion. The dimension of the first ground layer and / or the second ground layer in the first direction is larger than the dimension of each connector terminal in the first direction.

2. The substrate according to claim 1, The material of the first protrusion is an insulating material. The material of the second protrusion is an insulating material.

3. The substrate according to claim 1, The substrate portion is part of the substrate.

4. The substrate according to claim 1, The plurality of connector terminals include a first connector terminal, which includes a mating portion capable of engaging with the connector terminals of the host device.

5. The substrate according to claim 4, The fitting portion includes a fourth surface and a fifth surface. The angle formed by the fourth surface and the fifth surface is an acute angle.

6. The substrate according to claim 4, The fitting portion includes a fourth surface and a sixth surface. The angle between the fourth and sixth surfaces is an obtuse angle.

7. The substrate according to claim 6, It also has a protrusion provided on the sixth surface.

8. The substrate according to claim 1, The connector terminal at the far end in the first direction among the plurality of connector terminals is provided with a conductive portion. The conductive part includes: The first linear conductive portion exits from the connector terminal at the outermost end; The second linear conductive portion is arranged at an angle relative to the first linear conductive portion, and the connector terminal at the outermost end is connected to the first linear conductive portion.

9. The substrate according to claim 2, The first protrusion has a first dimension smaller than the thickness of the substrate in a direction perpendicular to the first surface. The second protrusion has a second dimension smaller than the thickness of the substrate in a direction perpendicular to the first surface.

10. A storage system comprising: The substrate according to any one of claims 1 to 9; and A non-volatile memory is disposed on the substrate.

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