Display panel, display module and method for detecting binding deformation of display module

Abstract

This disclosure provides a display panel, a display module, and a method for detecting deformation of their bonding. A display panel includes: a bonding area having multiple pins for bonding with an integrated circuit chip; and at least one identification area adjacent to the bonding area, the identification area having an identifier for indicating the offset of the bonding area. This disclosure, by providing an easily identifiable identification area, enables real-time and rapid determination of the display panel's deformation after bonding, and allows for real-time and rapid assessment of whether the deformation is abnormal, thereby avoiding the risk of the display panel detaching from the integrated circuit chip.

Description

Technical Field

[0001] This disclosure relates to the field of displays, and more particularly to a method for detecting deformation of a display panel, a display module, and their bonding. Background Technology

[0002] Currently, AMOLED (Active-matrix organic light emitting diode) is becoming the mainstream in small and medium-sized product segments. COP (Chip On Pi) is a type of AMOLED packaging technology.

[0003] During the COP bonding process, which involves pressing the IC chip pins (IC bump) together with the flexible display panel pins (Panel Pad), the pressure generated during bonding causes deformation of the flexible display panel. During prolonged use of the flexible display panel, the shear forces between the deformed film layers can easily cause the IC chip to detach from the flexible display panel, resulting in malfunctions and problems with its operation.

[0004] The existing COP process lacks detection methods for display panel deformation, thus making it impossible to monitor the risks of the COP process. Summary of the Invention

[0005] In view of this, the purpose of this disclosure is to propose a method for detecting deformation of a display panel, a display module and its bonding structure, which can detect the deformation of the display panel and achieve effective risk monitoring.

[0006] For the purposes described above, this disclosure provides a display panel, including:

[0007] The bonding area has multiple pins for bonding with the integrated circuit chip.

[0008] And at least one identifier area is set adjacent to the binding area, the identifier area is set with an identifier, the identifier is used to indicate the offset of the binding area.

[0009] In one embodiment, the binding area includes a first boundary and a second boundary that are disposed opposite to each other, and a plurality of pins are located between the first boundary and the second boundary; the plurality of pins include a first column of pins arranged along the first boundary and a second column of pins arranged along the second boundary; the identification area includes a first identification area, which is disposed on the side of the first boundary away from the second boundary.

[0010] In one embodiment, the marking area further includes a second marking area, which is located on the side of the second boundary away from the first boundary; the first marking area and the second marking area are symmetrically arranged.

[0011] In one embodiment, the identification area is an equilateral triangle, and multiple identifiers are evenly distributed within the identification area.

[0012] In one embodiment, the identifier includes at least one of a cross symbol, a star symbol, a snowflake symbol, a bar symbol, and a scale symbol.

[0013] Based on the same inventive concept, this disclosure also discloses a display module, which includes a display panel as described above; and an integrated circuit chip, which is bonded to the display panel.

[0014] Based on the same inventive concept, this disclosure also discloses a method for detecting deformation of display panel bonding, including:

[0015] Obtain the parameters after the display panel is bound. The bound parameters include the image of the identifier of the display panel identification area.

[0016] Based on the image of the identifier, determine whether the display panel binding deformation is abnormal.

[0017] In one embodiment, the identifiers include at least one of a cross symbol, a star symbol, a snowflake symbol, a bar symbol, and a scale symbol, and the parameters obtained after the display panel is bound include identifying the number of identifiers in the identification area using an optical instrument.

[0018] In one embodiment, it includes:

[0019] Retrieve standard parameters for display panel binding;

[0020] Compare the bound parameters with the standard parameters;

[0021] If the difference does not meet the preset threshold, it is determined that the display panel binding deformation is abnormal.

[0022] In one embodiment, the standard parameter is the standard size of the binding region or the standard deformation rate of the binding region;

[0023] Compare the differences between the bound parameters and the standard parameters, including: calculating the bound size or bound deformation of the bound region based on the image of the identifier, and then comparing the bound size with the standard size, or comparing the bound deformation with the standard deformation rate.

[0024] Compared with the prior art, the technical solution provided in this disclosure can quickly and in real time determine the deformation of the display panel after bonding by setting an easily identifiable identifier on the display panel, and can determine whether the deformation of the display panel after bonding is abnormal in real time and quickly, thereby avoiding the risk of the display panel falling off from the integrated circuit chip. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A plan view of the display panel provided in an embodiment of this disclosure;

[0027] Figure 2 A top view of the pins of a display panel and an integrated circuit chip normally bonded together, as provided in an embodiment of this disclosure;

[0028] Figure 3 A top view of the pins of a display panel and an integrated circuit chip abnormally bonded according to an embodiment of this disclosure;

[0029] Figure 4 A schematic diagram of the shape of an identifier provided in another embodiment of this disclosure;

[0030] Figure 5 A plan view of a display panel provided in another embodiment of this disclosure;

[0031] Figure 6 This is a cross-sectional view of the display module before binding, provided in an embodiment of this disclosure;

[0032] Figure 7 This is a cross-sectional view of the display module after binding, provided in an embodiment of this disclosure;

[0033] Figure 8 A flowchart of a method for detecting deformation of a display panel binding provided in an embodiment of this disclosure. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0035] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] like Figure 6 and Figure 7 As shown, during COP bonding of a flexible display panel, the panel is subjected to pressure, causing it to deform towards the integrated circuit chip. This can lead to a misalignment between the pins of the integrated circuit chip and the pins on the flexible display panel. In areas with significant deformation, the film layer of the display module may detach under shear force, resulting in malfunctions.

[0037] Currently, there is no process method in the COP packaging technology for display panels to monitor the deformation of the display panel. Therefore, when abnormalities occur in existing COP packaging, it is impossible to make timely adjustments and improvements, and display modules are prone to failure after leaving the factory.

[0038] Therefore, this disclosure provides a display panel that can quickly and in real-time determine the deformation of the display panel after bonding, and can quickly and in real-time determine whether the deformation of the display panel after bonding is abnormal, thereby avoiding the risk of the display panel detaching from the integrated circuit chip. Figure 1The diagram illustrates an embodiment of a display panel according to this disclosure, comprising: a bonding region 110 and an identification region adjacent to the bonding region 110. The display panel 100 is preferably a flexible display panel. The bonding region 110 is provided with a plurality of pins 111 for bonding with an integrated circuit chip 200. The identification region includes at least one identifier (Mark) 123 for indicating the offset of the bonding region 110. It should be noted that the pins 111 of the display panel 100 are typically bonded to the integrated circuit chip 200 in a row. It is understood that the bonding region 110 can be a region with a visible boundary defined on the display panel 100 for setting the pins 111 to bond the integrated circuit chip 200; in some embodiments, no identifiable markings are provided on the display panel 100, in which case the bonding region 110 is a hypothetical virtual region, and the edge of the pins 111 can be selected as the boundary of the bonding region 110.

[0039] The binding region 110 includes a first boundary 114 and a second boundary 115 that are set relatively to each other. For example... Figure 1 As shown, pin 111 is located between the first boundary 114 and the second boundary 115. Pin 111 includes a first column of pins 112 arranged along the first boundary 114 and a second column of pins 113 arranged along the second boundary 115. The identification area includes a first identification area 121, which is located on the side of the first boundary 114 away from the second boundary 115. It is understood that the display panel 100 typically has multiple rows of pins 111 bonded to the integrated circuit chip 200. The first column of pins 112 and the second column of pins 113 in this disclosure are for illustrative purposes only. In some embodiments, pin 111 may also include pins in other columns.

[0040] Before binding, the display panel 100 did not deform, such as Figure 7 As shown. After bonding, the display panel 100 will not undergo significant deformation, and the integrated circuit chip 200 will bond normally with the display panel 100, as... Figure 2 As shown; however, an abnormal display panel 100 will arch upwards, resulting in a large deformation of the display panel 100, causing the marking area to change accordingly, such as Figure 6 As shown. At this time, the integrated circuit chip 200 will be misaligned relative to the display panel 100, obscuring the identifier 123, as... Figure 3 As shown. Therefore, by simply counting the number of bound identifiers 123, the deformation of the display panel 100 can be reflected, and this can be used to monitor the risk of film peeling from the display module. The judgment is fast and the structure is simple. The deformation of the display panel 100 discussed in this disclosure occurs in the area between the rows of pins 111.

[0041] For example, the identification area also includes a second identification area 122, such as Figure 5 As shown. The second identification area 122 is located on the side of the second boundary 115 away from the first boundary 114. The first identification area 121 and the second identification area 122 are symmetrically arranged. Specifically, the second identification area 122 and the first identification area 121 are symmetrically arranged with respect to the center line of the binding area 110, as shown in the figure. Figure 5 As shown in the diagram, in this embodiment, the number of identifiers 123 can be counted on both sides of the display panel 100 for ease of use. If the pin 111 shifts, it can still be considered a good product within the allowable range. If the identifier 123 is only set on one side of the display panel 100, considering that the pin 111 may shift away from the identifier 123, it will affect the accuracy of counting the identifier 123. Therefore, setting two sets of identifier areas can not only observe whether the pin 111 has shifted, but also accurately determine the deformation of the display panel 100, with strong anti-interference ability and high accuracy.

[0042] For example, the identifier 123 is preferably a cross-shaped symbol. The cross-shaped identifier 123 is easier to observe and count. Of course, at least one of the following symbols can also be selected as needed: star-shaped symbol, snowflake-shaped symbol, bar-shaped symbol, and scale symbol.

[0043] For example, the identification area is shaped like an equilateral triangle, with one side of the triangle parallel to the boundary of the binding area 110. Multiple identifiers 123 are evenly distributed within the identification area. The equilateral triangle makes it easier to identify and determine the number of identifiers 123.

[0044] For example, the identification area is rectangular, with one side of the rectangle parallel to the boundary of the binding area 110, such as... Figure 4 As shown.

[0045] For example, the number of identifiers 123 at the marked area is counted visually. Each identifier 123 can also correspond to a specific deformation value, thereby quantifying the deformation of the bound display panel 100 based on the number of identifiers 123. This method is fast and low-cost.

[0046] Alternatively, optical instruments can be used to automatically measure the length of identifiers 123 or detect their quantity, saving manpower and achieving higher accuracy. An automated optical microscope is preferred as the optical instrument.

[0047] To achieve the basic functions of the display panel 100, the display panel 100 in this embodiment may further include other necessary modules or components, such as a display screen, circuitry, etc. It should be noted that any suitable existing construction can be selected from the other necessary modules or components included in the display panel 100. To clearly and concisely illustrate the technical solutions provided by this disclosure, the above-mentioned parts will not be repeated here, and the accompanying drawings have also been simplified accordingly. However, it should be understood that the scope of this disclosure is not limited thereto.

[0048] This disclosure enables real-time and rapid determination of the deformation of the display panel 100 after bonding by setting an easily identifiable identifier 123 on the display panel 100, thereby avoiding the risk of the display panel 100 and the integrated circuit chip 200 detaching.

[0049] Based on the same inventive concept, this disclosure also discloses a display module, which includes a display panel 100 as described above; and an integrated circuit chip 200, which is bonded to the display panel 100.

[0050] For example, the integrated circuit chip 200 is disposed on the top of the display panel 100, including multiple integrated circuit chip pins 210 corresponding to pins 111, such as... Figure 6-7 As shown. The integrated circuit chip pin 210 is located at the bottom of the integrated circuit chip 200. In the COP packaging process, the deformation of the integrated circuit chip 200 can be ignored and is considered a rigid body. The distance between the integrated circuit chips 200 before and after bonding is considered to remain constant, denoted as Lc.

[0051] Based on the same inventive concept, this disclosure also discloses a method for detecting deformation of display panel bonding, such as... Figure 8 As shown, it includes:

[0052] The parameters of the display panel 100 after binding are obtained, including images of identifiers 123 in the identification area of ​​the display panel. Specifically, this includes identifying the number of identifiers 123 in the identification area using optical instruments. Identifiers 123 include at least one of the following: cross-shaped symbols, star-shaped symbols, snowflake-shaped symbols, bar-shaped symbols, and scale symbols.

[0053] Based on the image of identifier 123, it is determined whether the bonding deformation of display panel 100 is abnormal. When the number of identifiers 123 detected by the optical instrument reaches a threshold, a bonding abnormality is determined. The threshold includes the minimum range of the identifier area 100 that can be recognized by the optical instrument.

[0054] Alternatively, visual inspection can be used instead of optical instruments to count the number of identifiers 123 in the marked area, which is less costly.

[0055] In some embodiments, the method further includes:

[0056] Obtain the standard parameters for binding the display panel 100. The standard parameters are the standard dimensions of the binding area. The standard parameters can also be called ideal parameters, which are the ideal values ​​in the actual design, such as the length, width, area, perimeter of the binding area 110, or the spacing between rows of pins 111 (e.g., the first column of pins 112 and the second column of pins 113).

[0057] The comparison between the parameters after binding and the standard parameters includes: calculating the size of the bound area after binding based on the image of identifier 123, and then comparing the size after binding with the standard size. Specifically, the size of the bound area 110 after binding is measured using an optical instrument. The difference between the size of the bound area 110 after binding and the standard size is calculated. The optical instrument is preferably an automated optical microscope, which is capable of measuring the size of the bound area 110 after binding. The optical instrument allows for accurate measurement of the size of the display panel 100 after binding, quantifying the test results. Preferably, the measurement... Figure 6 The spacing L between the first column pins 112 and the second column pins 113 of the bonding area 110 shown p’ This is the dimension after binding. At this point, the standard dimension is the spacing between pins 112 in the first column and pins 113 in the second column, such as... Figure 7 The L shown p It should be noted that after bonding, the integrated circuit chip 200 covers the pins 111 of the display panel 100, and the spacing between the first column pins 112 and the second column pins 113 can be measured from below using an optical instrument.

[0058] If the difference does not meet a preset threshold, the display panel 100 is deemed to have an abnormal bonding deformation. The threshold includes the maximum difference between the bonded size and the standard size, i.e., L. p -L p’ The maximum difference. Afterwards, the maintenance personnel were notified to adjust the technical parameters of the packaging process, including pressure, temperature, etc.

[0059] Furthermore, comparing the differences between the bound parameters and the standard parameters includes: calculating the deformation of the bound area 110 after binding based on the image of identifier 123, and then comparing the bound deformation with the standard deformation rate. Specifically, the dimensions of the bound area 110 after binding are measured using optical instruments. The deformation rate of the bound area 110 of the display panel 100 is calculated as: Deformation rate = (Dimension after binding - Standard parameter) / Standard parameter. Preferably, the deformation rate is calculated based on the gap between the spacing of the first column pins 112 and the second column pins 113 before and after binding, i.e., ΔL = (L p -Lp’ ) / L p Correspondingly, the threshold at this time is the maximum deformation rate of the bound region 110.

[0060] The above embodiments of this disclosure achieve the following technical effects: By setting identifiers 123 in the identification area, it is only necessary to count the number of identifiers 123 to determine in real time and quickly whether the deformation of the display panel 100 after bonding is abnormal, thereby avoiding the risk of the display panel 100 and the integrated circuit chip 200 detaching. By measuring the parameters of the bonding area 110 after bonding in the COP process and comparing them with standard parameters, the deformation of the display panel 100 can be accurately measured, thereby determining whether the deformation will cause abnormalities, monitoring the risk of the display panel 100 and the integrated circuit chip 200 detaching in real time, and realizing online full inspection of the display panel 100, effectively preventing defective products from flowing out. Using an optical microscope to measure the parameters of the bonding area 110 after bonding, no slicing is required, achieving the effect of non-destructive measurement of the deformation of the display panel 100. Based on the quantitative monitoring results, the risk of the display panel 100 and the integrated circuit chip 200 detaching from different products can be compared horizontally, facilitating subsequent comparative analysis of different products. When the display panel 100 and the integrated circuit chip 200 are at risk of detachment, maintenance personnel can be promptly reminded to make corrections, improving the yield of the display module.

[0061] Although this disclosure has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0062] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

[0063] It should be noted that the method of this embodiment can be executed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method of this embodiment, and the multiple devices will interact with each other to complete the above method.

[0064] It should be noted that the above description describes some embodiments of this disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0065] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the above program, it implements the method for detecting display panel bonding deformation as described in any of the above embodiments.

[0066] The processor can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0067] Memory can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage devices, dynamic storage devices, etc.

[0068] It should be noted that although the above-described device only shows the processor, memory, and computer program, in actual implementation, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0069] The electronic device described above is used to implement the corresponding display panel binding deformation detection method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0070] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A display panel, characterized by, include: A bonding area is provided with multiple pins, which are used for bonding with an integrated circuit chip; And at least one identification area is set adjacent to the binding area, the identification area is provided with multiple identifiers, the identifiers are used to indicate the offset of the binding area, the offset of the binding area is determined according to the number of identifiers that are visible after binding among the multiple identifiers.

2. The display panel of claim 1, wherein, The binding area includes a first boundary and a second boundary that are set opposite to each other, and the plurality of pins are located between the first boundary and the second boundary; the plurality of pins include a first column of pins arranged along the first boundary and a second column of pins arranged along the second boundary; the marking area includes a first marking area, which is located on the side of the first boundary away from the second boundary.

3. The display panel of claim 2, wherein, The marking area further includes a second marking area, which is located on the side of the second boundary away from the first boundary; the first marking area and the second marking area are symmetrically arranged.

4. The display panel of claim 1, wherein, The identification area is in the shape of an equilateral triangle, and multiple identifiers are evenly distributed within the identification area.

5. The display panel of claim 1, wherein, The identifiers include at least one of the following: cross-shaped symbols, star-shaped symbols, snowflake-shaped symbols, bar-shaped symbols, and scale symbols.

6. A display module, characterized by The display module includes a display panel as described in any one of claims 1-5; and an integrated circuit chip, the integrated circuit chip being bonded to the display panel. 7.A method for detecting a binding deformation of a display panel, characterized in that, include: Obtain the parameters after the display panel is bound, wherein the bound parameters include images of multiple identifiers of the display panel identification area; Based on the image of the identifier, identify the number of identifiers that are visible after binding among the multiple identifiers, and determine whether the binding deformation of the display panel is abnormal.

8. The method of claim 7, wherein the method further comprises: The identifiers include at least one of the following: cross-shaped symbols, star-shaped symbols, snowflake-shaped symbols, bar-shaped symbols, and scale symbols. Obtaining the parameters after the display panel is bound includes identifying the number of identifiers in the identification area using optical instruments.

9. The method of claim 7, wherein the method further comprises: include: Obtain the standard parameters bound to the display panel; Compare the differences between the bound parameters and the standard parameters; In response to the difference not meeting a preset threshold, it is determined that the display panel binding deformation is abnormal.

10. The method of claim 9, wherein the method further comprises: The standard parameter is the standard size of the binding area or the standard deformation rate of the binding area; Comparing the difference between the bound parameters and the standard parameters includes: calculating the bound size or bound deformation of the bound region based on the image of the identifier, and then comparing the bound size with the standard size, or comparing the bound deformation with the standard deformation rate.

Images