drift tracking of acoustic scans

Abstract

In acoustic inspection, if the probe assembly cannot maintain a controlled lateral position relative to the structure being inspected, such as a weld, nearby defects may be missed or mistaken for features observed earlier as the probe assembly translates along the scan axis. The apparatus and techniques described herein can help track the lateral displacement of the probe assembly relative to a region of interest, such as the edge or centerline of a weld. For example, such techniques can be used to gate received ultrasonic data or update the presentation to the user, such as updating overlays (e.g., weld templates) and scale positions in S-scans or other image representations.

Description

[0001] Priority requirements

[0002] This patent application claims the benefit of priority to Badeau’s U.S. Provisional Patent Application Serial No. 63 / 119,376 (Attorney’s File No. 6409.193PRV), filed November 30, 2020, entitled “DRIFT TRACKING FORACOUSTIC SCAN”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This document generally relates to, but is not limited to, non-destructive assessment, and more specifically to devices and techniques for ultrasound examination using B-scan imaging mode. Background Technology

[0004] Various inspection techniques can be used to image or otherwise analyze a structure without damaging it. For example, one or more of X-ray inspection, eddy current inspection, or acoustic (e.g., ultrasound) inspection can be used to obtain data for imaging features on or within a test sample. For example, an array of ultrasonic transducer elements can be used to perform acoustic imaging, such as imaging a region of interest within the test sample. Different imaging modalities can be used to represent the received acoustic signals that have been scattered or reflected by the structure on or within the test sample.

[0005] For example, amplitude representation or "A-scan" representation may include generating a graph or other display of the amplitude of the received ultrasonic signal relative to time or depth, such as along a linear beam axis or ray passing through the test sample. Beamforming can be performed using coherent excitation of the ultrasonic transducer to provide desired beam angles and focal positions. For example, coherent excitation may include applying a specified delay value (or phase shift) to pulses transmitted by a single array element (or thus defined aperture) to establish one or more desired beam angles and focal positions. Alternatively or additionally, beamforming may be performed at reception, for example, by summing the received acoustic echo signals in a manner that delays (or shifts) the signals received from the individual array elements, to provide one or more desired beam angles and focal positions.

[0006] A sector representation, or "S-scan" representation, may include one or more two-dimensional plots (e.g., a brightness plot or a color plot) showing the amplitude of ultrasonic signals received at various scan angles corresponding to different beam directions extending radially outward from the origin. A corresponding scan angle within an S-scan may be associated with a corresponding A-scan representation along a line defined by the corresponding scan angle. As an illustrative but non-limiting example, such a scan may include generating shear waves in a corresponding beam spanning an angular range of 40 to 70 degrees downward relative to the plane where the transducer is located. As an illustrative example, such a method may be used for "angle beam" inspection of weld structures.

[0007] In another imaging mode, a "B-scan" representation can be formed, for example, by creating a two-dimensional image (again, as an illustrative example, including one or more of brightness or color to represent the received signal amplitude). A B-scan can be constructed using received A-scan echo data corresponding to a corresponding scan angle within an S-scan, where the A-scan representation is aggregated for different positions along the scan axis. The scan axis can be defined, for example, as a path parallel to the structure being inspected, such as a weld, and a sector scan represents a sector extending laterally outward from the scan axis. The B-scan imaging mode represents the projected amplitude of the received A-scan echo data along the depth axis corresponding to a corresponding scan angle along the scan axis, thereby effectively producing a depth scan plane representation for the selected scan angle. Summary of the Invention

[0008] Various focusing or beamforming techniques can be performed to help construct an image representing a region of interest on or within a test sample. For example, such a region may include weld structures. The use of an array of ultrasonic transducer elements may include the use of a phased array beamforming method and may be referred to as Phased Array Ultrasonic Testing (PAUT). For example, as described above, a delay-sum beamforming technique may be used, which includes, for example, coherently exciting the respective transducer elements or apertures for beamforming during transmission, or coherently summing the time-domain representations of the received acoustic signals from each transducer element or aperture for beamforming during reception, or both. Furthermore, as described above, one or more of S-scan and B-scan imaging techniques may be used, for example, to facilitate the inspection of weld structures (e.g., welds connecting portions of plates or pipes).

[0009] A wide variety of defects can be detected using ultrasound-based acoustic inspection. In one approach, the PAUT method can be used to identify defects such as cracks, voids, pores, or lack of fusion. The PAUT method can provide a beam that sweeps across various angles transverse to the weld axis. Such a method can be used to provide an S-scan representation, and selected scan angles within the S-scan representation can be used to provide B-scan images at selected angles along the scan axis. As an illustrative example, photoelectric or electromechanical methods can be used to measure the movement of the transducer along the scan axis.

[0010] Furthermore, the inventors have recognized that users viewing an S-scan or B-scan representation of a weld structure can use different image features corresponding to weld characteristics as visual references (e.g., markers or reference points distinct from defects). Such image features can include echoes associated with the weld geometry itself, referred to as geometric echoes. If the probe assembly cannot maintain a controlled (e.g., constant) lateral position relative to the weld being inspected as it translates along the scan axis, nearby defects may be missed or mistaken for earlier observed geometric echoes. For example, in some applications, the received ultrasonic echoes are gated (e.g., in depth or propagation time) to retain only information corresponding to the weld region.

[0011] Differences in the lateral position of the probe assembly relative to its initial position, such as differences in position relative to the initial lateral distance between the probe assembly and the weld centerline, can cause the echo data to fail to provide the expected spatial inspection coverage of the weld structure. This is because the scanned area or the received echo data is now gated in an undesirable manner, potentially missing defects. As another example, a user may have already observed a feature on a display with a previously observed geometric echo indication, for example, at or near a certain depth or lateral position relative to the weld centerline, but the probe assembly may have drifted laterally relative to the weld to a different location. In this example, the user might mistakenly assume that the later observed feature is a geometric echo associated with the same previously observed weld feature (e.g., the corner of the cap or root), thus missing a potential defect.

[0012] To at least partially address such technical challenges, the inventors have developed a machine-implemented technique to help track the lateral displacement of a probe assembly relative to a region of interest, such as the edge or centerline of a weld. Such a technique is commonly referred to as “index offset tracking.” This technique can be used, for example, to gate received ultrasonic data or update weld overlays or other markers such as scale positions, for example, to update the presentation of an S-scan or other image representation to the user.

[0013] In the example, techniques such as machine-implemented methods can be used to assist in ultrasound examinations. This technique may include: obtaining first B-scan echo data from a specified first depth range at a specified scanning angle, the first depth range including at least a portion of the structure being examined; generating first sums of echo amplitudes across scanning axis positions based on the first B-scan echo data, the first sums corresponding to different corresponding depths; identifying extreme values ​​in each of the first sums; determining an index value corresponding to the first extreme value for each scanning axis position; identifying second extreme values ​​within a specified second depth range relative to the determined first depth, the second depth range defining a window surrounding the determined first depth; determining an offset value relative to the index value using the identified second extreme value; and, for example, updating the presentation of an indication of the determined offset value for display to a user.

[0014] In the example, the technique optionally includes determining multiple offset values ​​corresponding to different scan axis positions. In the example, the technique optionally includes determining multiple offset values ​​corresponding to different specified scan angles. In the example, updating the rendering for display includes generating weld overlay template positions using the determined offset values.

[0015] This summary is intended to provide an overview of the subject matter of this patent application. Furthermore, this summary is not intended to provide an exclusive or exhaustive description of the invention. Detailed descriptions are included to provide additional information regarding this patent application. Attached Figure Description

[0016] The patent or application document includes at least one color drawing. Upon request and payment of the necessary fees, the Patent Office will provide a copy of the patent or application disclosure with the color drawing.

[0017] In drawings that are not necessarily drawn to scale, similar reference numerals may describe similar parts in different views. Similar reference numerals with different letter suffixes may indicate different instances of similar parts. The drawings generally illustrate the various embodiments discussed in this document by way of example rather than limitation.

[0018] Figure 1 An example including an acoustic inspection system is shown in general, which can be used, for example, to perform at least a portion of one or more techniques shown and described herein.

[0019] Figure 2A The image shows a general example of a side view (e.g., a cross-sectional view) of an acoustic inspection configuration that facilitates angular beam inspection of weld structures.

[0020] Figure 2B Broadly shown includes Figure 2AAn example of a plan view of an acoustic inspection configuration, which shows the lateral position of the transducer probe assembly and indicates the ideal scan path along the scan axis, as well as the varying scan paths, such as those that may occur when the probe moves along the scan path during the inspection operation.

[0021] Figure 2C and Figure 2D An example is shown in general, including a simplified side view that illustrates how variations in the probe's lateral position (e.g., "Δd") can be trigonometrically determined based on the propagation delay value within the structure under test and the refraction angle of the scan.

[0022] Figure 3A An illustrative example of an S-scan representation obtained using angular beam inspection of a weld structure is shown, which illustrates geometric echo characteristics such as those that can be used to perform lateral positional motion tracking as shown and described herein.

[0023] Figure 3B An illustrative example is shown of a B-scan representation obtained using angular beam inspection of a weld structure, which is consistent with... Figure 3A The selected scan angle corresponds to the S-scan representation, where along Figure 3B The different positions of the horizontal axis and along such Figure 2B The different positions of the scanning axis described in the figure correspond to the vertical axis of the B scan image, where the vertical axis represents the projection depth of the selected scanning angle data.

[0024] Figure 4A The diagram generally illustrates techniques such as summing the acoustic echo amplitudes of each row as shown in the B-scan representation, which is performed across the scan axis, wherein such sums are plotted to determine the depth locations where extrema (e.g., maximum values) occur.

[0025] Figure 4B It roughly shows how to approach Figure 4A A depth gating (or a corresponding propagation time gating) is established at the detected extreme values ​​in the determined sum, for example, it can be used to provide a depth gating (or a corresponding propagation time gating) for lateral position offset tracking.

[0026] Figure 5A This demonstrates in general how depth gating (or the corresponding propagation time gating) can be used to provide lateral position offset tracking relative to a determined depth corresponding to the initial lateral position of the acoustic transducer probe.

[0027] Figure 5B This section presents an example of a representation of the result of probe lateral position drift based on the representation of the geometric echo of the weld structure.

[0028] Figure 6 This paper generally illustrates a technique, such as a method, that may include determining a drift or offset value for the lateral position of a transducer probe.

[0029] Figure 7 A block diagram is shown illustrating an example of a machine on which any or more of the techniques (e.g., methods) discussed herein can be performed. Detailed Implementation

[0030] This subject matter relates to apparatus and techniques that can be used to determine the drift in the lateral position of an acoustic probe assembly relative to a region of interest (e.g., a weld). Specifically, this subject matter can be used to track, store, or present one or more offset data, such as offset data relative to an initial or nominal lateral position associated with the region of interest. The determined offset drift can be plotted or overlaid on scanned imaging data, for example, to help a user distinguish benign image features such as geometric echoes from features indicating defects or flaws. As an example, a template corresponding to the weld structure can be repositioned, or the imaging representation of the scanned data can be otherwise updated to show or compensate for the drift in the lateral position of the acoustic probe assembly relative to a feature of interest such as a weld. The techniques described in this document can be machine-implemented, for example using... Figure 1 The acoustic inspection system 100 shown can be used to perform some or all of the work, and the acoustic inspection system 100 can be used with, for example, Figure 7 The machine 700 shown may be communicatively coupled or may include the machine 700.

[0031] Figure 1 An example including an acoustic inspection system 100 is generally shown, which can be used to perform at least a portion of one or more techniques shown and described herein. The inspection system 100 may include a test instrument 140, such as a handheld or portable component. The test instrument 140 may be electrically coupled to a probe assembly, such as using a multi-conductor interconnect 130. The probe assembly 150 may include one or more electroacoustic transducers, such as a transducer array 152 including respective transducers 154A to 154N. The transducer array may follow a linear or curved profile, or may include an array of elements extending along two axes, for example, to provide a matrix of transducer elements. The space occupied by the elements does not need to be square or arranged along a straight axis. The element size and spacing may vary depending on the inspection application.

[0032] Modular probe assemblies 150 can be configured, for example, to allow the test instrument 140 to be used with a variety of different probe assemblies 150. Typically, the transducer array 152 includes piezoelectric transducers that are acoustically coupled to a target 158 ​​(e.g., a test sample or "subject of test") via a coupling medium 156. The coupling medium can include a fluid or gel or solid film (e.g., an elastomer or other polymeric material), or a combination of fluid, gel, or solid structures. For example, an acoustic transducer assembly can include a transducer array coupled to a wedge-shaped structure comprising a rigid thermosetting polymer (e.g., available from C-Lec Plastics) with known acoustic propagation characteristics. Furthermore, during the test, water can be injected as a coupling medium 156 between the wedge and the structure under test.

[0033] Test instrument 140 may include digital and analog circuitry, such as front-end circuitry 122 comprising one or more transmit signal chains, receive signal chains, or switching circuitry systems (e.g., transmit / receive switching circuitry systems). The transmit signal chains may include amplifier and filter circuitry systems, for example, to provide transmit pulses to be transmitted via interconnect 130 to probe assembly 150 for acoustic transmission of target 158, for example, to image or otherwise detect defects 160 on or within the structure of target 158 ​​by receiving acoustic energy scattered or reflected in response to acoustic transmission.

[0034] Although Figure 1 A single probe assembly 150 and a single transducer array 152 are shown, but other configurations can also be used, such as multiple probe assemblies connected to a single test instrument 140 or multiple transducer arrays 152 used in conjunction with single or multiple probe assemblies 150 for tandem inspection. Similarly, test protocols can be executed using coordination between multiple test instruments 140, for example, in response to an overall test program established from a master test instrument 140 or by another remote system (e.g., computing facility 108 or general-purpose computing devices such as laptop computer 132, tablet computer, smartphone, desktop computer, etc.). As an illustrative example, test programs can be established according to published standards or regulatory requirements and can be executed upon initial development or used for continuous monitoring on a repeating basis.

[0035] The receiving signal chain of the front-end circuitry 122 may include one or more filter or amplifier circuits and analog-to-digital conversion facilities, for example, to digitize the echo signal received using probe assembly 150. Digitization may be performed coherently, for example, to provide multiple digitized data channels aligned or referenced to each other in time or phase. The front-end circuitry may be coupled to and controlled by one or more processor circuits, such as processor circuitry 102 included as part of test instrument 140. The processor circuitry may be coupled to memory circuitry, for example, to execute instructions causing test instrument 140 to perform one or more of the following: acoustic transmission, acoustic acquisition, processing, or storage of data related to acoustic testing, or otherwise to perform the techniques shown and described herein. Test instrument 140 may be communicatively coupled to other parts of system 100, for example, using wired or wireless communication interface 120.

[0036] For example, the implementation of one or more techniques as shown and described herein can be achieved on the on-board test instrument 140 or using other processing or storage facilities—such as computing facility 108 or general-purpose computing devices such as laptop computer 132, tablet computer, smartphone, desktop computer, etc. For example, processing tasks that would be very slow or beyond the capabilities of the on-board test instrument 140 if performed remotely (e.g., on a separate system) in response to a request from the test instrument 140 can be performed. Similarly, the storage of imaging data or intermediate data (e.g., A-scan matrix of time-series data or compressed phase data) can be achieved, for example, using a remote facility communicatively coupled to the test instrument 140. The test instrument may include, for example, a display 110 for presenting configuration information or results, and input devices 112 including, for example, one or more of a keyboard, trackball, function keys or soft keys, mouse interface, touchscreen, stylus, etc., for receiving operator commands, configuration information, or responses to queries.

[0037] Figure 2A (Not drawn to scale) A side view (e.g., sectional view) of an acoustic inspection configuration 200, which facilitates angle beam inspection of weld structure 260 using one or more probe assemblies (e.g., acoustic inspection probe 150A), is generally shown. Figure 2B Broadly shown includes Figure 2AAn example plan view of the acoustic inspection configuration 200 shows an ideal scan path 282A along the scan axis, and a variable scan path 280A, such as the variable scan path 280A that may occur when the probe 150A moves along the scan path 282A during the inspection operation. Typically, the ideal scan path 282A will follow weld features such as edges, scribing, or markings to maintain a fixed lateral distance (e.g., d1 of the transducer probe 150A) relative to the weld structure 260 being inspected. Figure 2A and Figure 2B The acoustic probe 150A can be included as follows: Figure 1 A portion of the system 100 shown, or communicatively coupled to, for example, system 100.

[0038] refer to Figure 2A and Figure 2B Acoustic probes, such as probe 150A and optionally another probe 150B, can be conveyed along the scanning path 280A by hand-operated or electrically or manually actuated scanner assembly 264 (e.g., as...). Figure 2B The scanning axis (parallel to the long axis of the weld structure 260) is shown. The scanner assembly 264 may include a frame or other support assembly and one or more wheels 266 to follow the contour of the pipe or plate or other object 258 being inspected, and may include a magnetic portion to, for example, secure the scanner assembly 264 to the surface of the object 258 if the object is ferromagnetic.

[0039] Typically, acoustic inspection probe assemblies (e.g., probes 150A and 150B) may each include one or more acoustic transducers, such as acoustic transducer array 152, configured to transmit or receive acoustic energy through a wedge-shaped structure to provide angular beamforming capability. For example, transmit or receive beamforming can generate pulsed acoustic energy 268 to form a beam spanning a specified range α of downward angle, thereby providing fan-shaped imaging or “S-scan” imaging. The acoustic energy 268 transmitted to object 258 may have a propagation path including one or more internal reflections. The scattered or reflected acoustic energy can then be detected using either the first acoustic probe 150A or the second acoustic probe 150B. Using phased array ultrasonic beamforming technology, the beam of acoustic energy 268 can be scanned across different angles to acoustically probe a scan area “R” containing part or all of the weld structure 260.

[0040] For example, a selected beam angle within the downward angle range α can be used to obtain echo information indicating the angle of the weld cap 272, such as ray "R2", or the weld root 274, such as ray "R1". Typically, the probe 150A or scanner assembly 264 is oriented to provide a specified lateral offset d1 relative to the centerline 270 of the weld structure 260. This can be referred to as the initial offset or "index offset". As shown by the geometry of the rays representing acoustic energy 268, the index offset d1 affects the scan range "R" of the acoustic coverage of the weld structure 260. Typically, the index offset d1 is established to create a scan region R that laterally surrounds the desired portion of the weld, and specifically provides coverage of key weld features. Gating of the acoustic signals received in the time domain can also be performed, for example, to limit acoustic imaging to the scan range "R", to suppress unwanted reflections from outside the region "R", or to suppress the detection of acoustic energy associated with unwanted acoustic propagation patterns.

[0041] like Figure 2A and Figure 2B As shown, symmetrical coverage of the weld structure 260 can be provided, for example, by using a second acoustic probe 150B laterally positioned relative to the first acoustic probe 150A. Typically, the techniques described in this document can be used to perform probe lateral position drift tracking (e.g., tracking deviations of the actual scan path 280A from the “ideal” path 282A) on the first acoustic probe 150A, the second acoustic probe 150B, or both. Most commonly, the first acoustic probe 150A will be used for both transmitting and receiving (e.g., without or in the absence of the second probe 150B). In another example, the second probe 150B is used for both transmitting and receiving (and the first probe 150A is not used). When using the second probe 150B, a second index offset d2 (which may or may not be the same value as the first index offset d1) can be established to define the corresponding scan area of ​​acoustic coverage associated with the second acoustic probe 150B (or associated with transmit / receive operations together with the first acoustic probe 150A and the second acoustic probe 150B, wherein the second acoustic probe operates in transmit mode rather than receive mode).

[0042] Although Figure 2BThe example generally illustrates a planar object 258 being inspected, but the techniques described herein can be applied to curved structures such as cylindrical structures, including pipes, towers, or other welded structures as illustrative examples. For instance, welded structure 260 could be a circumferential weld (e.g., a ring weld) between pipe segments, and scan path 282A could define a circumferential path around the outer diameter (e.g., outer surface) of the pipe. In another example, scan path 282A could define a circumferential path around the inner diameter (e.g., inner surface) of the pipe. For example, a support tower for a wind turbine or other large structure could be allowed access to the inner diameter of the structure to allow for inspection positioning on the inward-facing portion of the structure.

[0043] Figure 3A An angular beam inspection of the weld structure is shown (e.g., using...). Figure 2A and Figure 2B The fan-shaped scan, or "S-scan," obtained by the inspection configuration 200 shown is an illustrative example of the 390A, which indicates that the 390A demonstrates geometric echo characteristics such as those that can be used to perform offset tracking as shown and described herein. Figure 3A In the example, the user can identify image features such as 364A corresponding to geometric echoes associated with weld structure features. A weld overlay or template 362 can be overlaid on representation 390A to aid in identifying or otherwise recognizing other features of the weld structure, or to help locate the spatial position of potential defects relative to known weld structure feature locations. Typically, the drift tracking techniques described in this document can be used, for example, to reposition the weld overlay or template 362 in response to drift detected in the lateral position of the acoustic probe location. For example, template 362 can be moved laterally (e.g., left or right) based on lateral drift detected at a specific location along the scan axis, as indicated by arrows in the horizontal direction. Lines indicating the selected scan angle 366A or other identifiers can be used to select the beam angle that can generate its corresponding B-scan representation. Typically, the S-scan plane is represented parallel to the depth index plane and orthogonal to the scan axis. Figure 3A In the illustrative example of 390A, geometric echo 364A and another echo 368A are crossed by a selected scan angle 366A.

[0044] Figure 3B An illustrative example of B-scan representation of 366B obtained using angular beamforming inspection of the weld structure is shown, where the B-scan representation of 366B is compared with... Figure 3A The selected scan angle 366A corresponds to the S-scan representation, where along... Figure 3B The different positions of the horizontal axis and along such Figure 2B The different positions of the scanning axis 382 described herein correspond to the vertical axis of the B-scan diagram 366B, which represents the projection depth of the selected scanning angle data, and along which... Figure 3B Different positions along the vertical axis correspond to different positions along the thickness of the part being inspected. For example, in Figure 3A The echo 364A seen in Figure 3B The line formed at 364B along the scan axis 382 represents the geometric echo seen from angle 366A along the scan axis 382. Figure 3B In this process, when an ultrasonic scan is performed along the scan axis 382, ​​the geometric echo 364B, together with other features such as echo 368B, forms a linear path across the B-scan representation 366B. If the transducer probe (e.g., probe 150A or 150B as shown above) maintains a constant lateral distance from the weld being measured relative to the scan axis 382, ​​the geometric echo 364B line and other features 368B can appear at a stable depth. Identifying and tracking the lateral position of the acoustic probe using the B-scan representation 366B can include identifying the depth (or corresponding delay value) corresponding to the geometric echo 364B and then tracking changes in the depth or delay value of the geometric echo 364B. Tracking the geometric echo 364B is illustrative, and another image feature that generates a consistent echo at a specified depth or propagation time can be tracked to provide lateral position offset detection or compensation.

[0045] Figure 2C and Figure 2D An example including a simplified side view is generally shown, illustrating how variations in lateral position (e.g., "Δd") can be trigonometrically determined based on the propagation delay value within the structure under test and a given known refraction angle of the scan. Typically, as described above, the S-scan spans various scan angles within the object under test 258, and for a beam established by the acoustic probe 150A (e.g., by a phase array structure included as part of probe 150A), a selected angle can be represented by β1. The selected angle can be used to generate a B-scan representation. The B-scan representation (e.g., Figure 3B The vertical axis of 366B corresponds to the depth within object 258.

[0046] The geometrical echo associated with the corner root 274 (or other feature) of weld structure 260 can provide the measured round-trip propagation delay “τ1” to the interface between probe 150A and object 258. If the selected scanning angle β1 and the propagation speed of the acoustic wave (e.g., a shear wave within object 258) are known (e.g., denoted as “c”), the lateral distance D1 can be determined as half of the propagation delay τ1, multiplied by the propagation speed c, and then multiplied by the sine of the selected beam angle β1 to provide the propagation path along the lateral axis (e.g., as shown in the image). Figure 2C The projection onto the horizontal direction (as shown). The distance d1 from the probe 150A surface is slightly offset laterally relative to the lateral distance D1. The reference is similar to... Figure 2C of Figure 2DThe lateral position of probe 150A has shifted slightly (e.g., when the probe is scanned parallel to weld 260 or other structures). The probe may now be at a new, unknown lateral position dx. To track the change or "drift" in lateral position, the difference "Δd" can be determined because the index offset d1 is different from the new position d. x The difference between them is usually related to the determined lateral position D1 and the lateral position D of the sound beam incident on the acoustic probe 150A. x The differences between them are the same. Generally, the following relationship applies:

[0047] D1=[(τ1C) / 2]·sin(β1) Equation 1.

[0048]

[0049] exist Figure 2D The image shows a slightly different angle β2. Generally, for small changes in the lateral position of the probe (e.g., a few millimeters), Because even if the beam is not perfectly aligned to scan the corner of the weld, the geometrical echo associated with the weld root is still detectable at the same selected scanning angle. Typically, in this literature, the propagation delay value can be related to the depth value (e.g., shown on the vertical axis in a B-scan representation) and the lateral distance (e.g., D1, D...). x ) can be determined by trigonometric functions as described above.

[0050] Figure 3B and Figure 4A The B-scan representation 366B can represent the "raw," uncompensated B-scan to which lateral probe position drift tracking will be performed. In the illustrative example, Figure 4A The diagram generally illustrates a technique for summing the acoustic echo amplitudes of rows 484-1 to 484-M as shown in B-scan representation 366B, performed along the scan axis across positions 482-1 to 482-N, where such sums are plotted to determine the depth location where an extreme value 364C (e.g., a maximum value) occurs. In this way, representation 398 can be established corresponding to the pixel amplitudes (or other values ​​indicating echo amplitude) of rows at different depths (or delays) summed across "N" scan axis positions for "M" different depths (or delays).

[0051] Typically, the M positions on the vertical axis correspond to the M samples in the A-scan. For representation 398, the N A-scans are summed sample by sample (e.g., the first sample in each of the N A-scans is summed to provide the first value in representation 398). Representation 398 can be referred to as the "merged A-scan" representation, where its vertical axis represents the total amplitude and its horizontal axis represents the depth (or time delay) axis, equivalent to the vertical axis of B-scan 390B. The extreme value 364C corresponds to depth 396, which defines the central trend (e.g., average or median depth) of the depth of the geometric echo 364B. Depth 396 can then be considered as a nominal depth or delay value corresponding to the geometric echo 364B, with which future drift of the echo 364B position can be tracked or compensation can be applied. Typically, depth 396 is an indexed depth value along a selected beam axis in a sector scan.

[0052] Figure 4B It roughly shows how to approach Figure 4A The merged A-scan shown represents establishing a window or "depth gating" (or corresponding propagation time gating) at the detected extreme value 364C in the sum obtained from 398. This can be used, for example, to provide a window or "depth gating" (or corresponding propagation time gating) for lateral probe position tracking within a specified window relative to a reference lateral position (e.g., the probe's initial or average lateral position). In such cases... Figure 4B In the merged A-scan representation 398 shown, a tracking window or strobe can be established, for example, by limits 388A and 388B specified relative to an index depth 396 corresponding to the earlier identified extreme value 364C. During further scans or B-scan analysis, the window defined by limits 388A and 388B can be used as a search window, as in the example. Figure 5A As exemplified in the example. In the illustrative example, the user can select the width of the window (e.g., relative to the center or total width of the window), or limit the values ​​of 388A and 388B, or otherwise define the depth range of the search window for further tracking or compensation. In another example, the window (defined by the limits of the values ​​of 388A and 388B) can be automatically built, for example, using a scattering marker of the merged A-scan 398 values. For example, standard deviation or variance values ​​can be used to build the window (and the corresponding limits of the values ​​of 388A and 388B relative to the index depth of 396) without requiring user input.

[0053] The phrase "tracking" refers to a graphical or digital representation of the drift of the acoustic probe relative to the tracked feature in the lateral position as the probe scans along the scan axis. Such a graphical representation may include a covering layer above the B-scan image, or a numerical value representing the offset (e.g., in millimeters or other units, based on a delay value or the offset distance along the lateral axis), or both. For illustration, Figure 5AThis generally illustrates how depth gating (or corresponding propagation time gating) defined by limits 588A and 588B can be used to provide probe lateral position tracking within a specified window relative to a depth 396 corresponding to the initial or average probe lateral position. Figure 5B Generally, this shows a correspondence with the index depth—for example, with the geometric echo from the weld structure—and can be, for example, based on the index depth. Figure 5A The B-scan represents an example of an analysis of 566 to plot or store – an offset or “drift” representation.

[0054] exist Figure 5A In the diagram, B-scan representation 566 shows how the position of the geometric echo varies along scan axis 582. As an illustrative example, Figure 5B The graph can represent the offset value relative to index depth 396 (e.g., such that the offset value is represented as a positive or negative offset value relative to the zero-value index set at depth 396). It can be generated during or after performing a B-scan acquisition. Figure 5B The graph shown. For example, Figure 5B The graph shown can also provide weld overlay 546, which illustrates the possible boundaries of interest related to the weld structure being inspected. In another example, the difference in depth values ​​associated with variations in the probe's lateral position can be used to determine the Δd value, as mentioned above regarding... Figure 2C and Figure 2D The discussion. Besides B-scan views, or alternatives such as... Figure 5B The Δd value obtained from the view shown can also be used to update the position of the weld overlay or other templates in the S-scan view. Figure 5B In this context, the probe's lateral position offset value can be determined as the value along the lateral axis between the ultrasonic probe and a feature of interest, such as a weld edge or centerline. As an illustrative example, and as discussed above regarding... Figure 2C and Figure 2D The determination discussed can be performed based on the trigonometric function of the scan angle or using a fixed scaling value to adjust the offset value initially determined in the depth dimension or starting from a delay value determined along the depth dimension.

[0055] refer to Figure 5A and Figure 5B Along the scan axis 582, the first position 582A shows a geometric echo position 564A that is deeper than the index depth 396, and Figure 5B The corresponding curve in the graph shows the relationship with Figure 5B The index depth 396 in the representation indicates the tracked position is deeper. Similarly, at the second position 582B along the scan axis 582, the corresponding geometric echo position 564B is shown as shallower than index depth 396, and Figure 5BThe tracked positions shown are shallower than index depth 396. The offset values ​​at each position along scan axis 582 can be used to modify... Figure 5A Images, such as Figure 5A The corresponding pixel column in image 566 is shifted up or down to make the geometric echo linearly aligned along index depth 396, and such a modification in B-scan imaging can be called offset compensation. In another example, it can be as follows Figure 5B The provided weld cover 546 or other template is provided, or the weld cover 546 or other template is used to cover the weld. Figure 5A On B-scan imaging, this provides the user with indications of index drift and relative displacement of the weld structure in the image. As mentioned above, data indicating depth offset can be converted into lateral offset and, in addition to the B-scan view, can be provided as... Figure 5B The view shown can also be used to update the position of the weld overlay or other templates in the S-scan view.

[0056] Figure 6 The illustration generally illustrates technique 600, such as a method that may include determining a drift or offset value for the lateral position of a transducer probe. For example, at 620, first B-scan echo data can be obtained from a specified first depth range at a specified scan angle (e.g., a specified fan-shaped or “S-scan” beam angle). At 625, first sums of echo amplitudes across scan axis positions can be generated based on the first B-scan echo data. Each of the sums may correspond to a row of values ​​at the corresponding depth. At 630, a first extreme value can be identified among the values ​​of the first sums. For example, at 635, the depth position corresponding to the sum with the maximum value in the first sums can be determined. At 640, for each scan position, a second extreme value can be identified, for example, from a second depth range relative to the determined first depth. The second depth range may span a specified depth window to form a search window, as discussed elsewhere herein. Such a window may be established around a reference to an “index” depth corresponding to the depth identified at 635. At 645, the second extreme value can be used to determine an offset value relative to the first depth. The offset value can be determined as a depth offset value, or optionally, a lateral offset value at 650°. For example, a delay or depth value along a specified scanning angle can be converted into a lateral offset distance between the ultrasonic probe assembly and a feature of the structure being inspected, such as an offset distance along the surface of the structure being inspected. Figure 2A and Figure 2B As shown (e.g., offset relative to distance d1 or distance d2), and can be as follows Figure 2C and Figure 2DThe derivation is shown. Optionally, at 655, a series of offset values ​​can be determined corresponding to different scan angles, such as by averaging or otherwise aggregating to improve the estimation of lateral offset. For example, a new B-scan can be performed at each scan angle to determine a new index depth, and a series of offset values ​​relative to each corresponding index depth can be determined and aggregated, for example, by averaging.

[0057] Figure 7 A block diagram is shown illustrating an example of a machine 700 that can perform any one or more of the technologies (e.g., methods) discussed herein. In various examples, machine 700 may operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, machine 700 may operate as a server machine, a client machine, or both in a server-client network environment. In the examples, machine 700 may act as a peer-to-peer (P2P) (or other distributed) network environment. Machine 700 may be a personal computer (PC), tablet device, set-top box (STB), personal digital assistant (PDA), mobile phone, web application, network router, switch, or bridge, or any machine capable of (sequentially or otherwise) executing instructions specifying actions to be taken by that machine. Furthermore, although only a single machine is shown, the term "machine" should also be understood to include any collection of machines that individually or jointly execute a set (or more) of instructions to perform any one or more of the methods discussed herein, such as cloud computing, Software as a Service (SaaS), or other computer cluster configurations.

[0058] As described herein, examples may include logic or multiple components or mechanisms, or examples may be operated by logic or multiple components or mechanisms. A circuit system is a collection of circuits implemented in a tangible entity including hardware (e.g., simple circuits, gates, logic, etc.). The membership of a circuit system can be flexible with time and potential hardware variability. A circuit system includes components that can perform a specified operation individually or in combination during operation. In the examples, the hardware of the circuit system may be designed invariably to perform the specified operation (e.g., hardwired). In the examples, the hardware including the circuit system may include variable-connected physical components (e.g., execution units, transistors, simple circuits, etc.) including computer-readable media that are physically modified (e.g., magnetic ground, electrical ground, such as via a change in physical state or a transformation of another physical characteristic, etc.) to encode instructions for the specified operation. When connecting physical components, the potential electrical characteristics of the hardware composition may, for example, change from insulating to conductive, or the potential electrical characteristics of the hardware composition may, for example, change from conductive to insulating. Instructions enable embedded hardware (e.g., execution units or loading mechanisms) to hardware-create components of the circuit system via variable connections to perform a portion of the specified operation during operation. Therefore, while the device is operating, the computer-readable medium is communicatively coupled to other components of the circuit system. In this example, any physical component can be used in more than one component of more than one circuit system. For instance, during operation, an execution unit may be used at one point in time in a first circuit of a first circuit system and reused by a second circuit of the first circuit system, or reused at a different time by a third circuit of the second circuit system.

[0059] Machine (e.g., computer system) 700 may include a hardware processor 702 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), main memory 704, and static memory 706, some or all of which may communicate with each other via interconnect (e.g., bus) 730. Machine 700 may also include a display unit 710, an alphanumeric input device 712 (e.g., a keyboard), and a user interface (UI) navigation device 714 (e.g., a mouse). In the example, display unit 710, input device 712, and UI navigation device 714 may be a touchscreen display. Machine 700 may additionally include a storage device (e.g., a drive unit) 716, a signal generation device 718 (e.g., a speaker), a network interface device 720, and one or more sensors 721 such as a global positioning system (GPS) sensor, a compass, an accelerometer, or other sensors. Machine 700 may include an output controller 728, for example, a serial (e.g., Universal Serial Bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection, to communicate with or control one or more peripheral devices (e.g., printers, card readers, etc.).

[0060] Storage device 716 may include a machine-readable medium 722 on which one or more sets of data structures or instructions 724 (e.g., software) are stored, said set of data structures or instructions 724 implementing or being used by any one or more of the techniques or functions described herein. The instructions 724 may also reside wholly or at least partially within main memory 704, static memory 706, or hardware processor 702 during execution by machine 700. In this example, one or any combination of hardware processor 702, main memory 704, static memory 706, or storage device 716 may constitute the machine-readable medium.

[0061] Although machine-readable medium 722 is shown as a single medium, the term "machine-readable medium" can include a single medium or multiple media (e.g., a centralized or distributed database and / or associated cache and server) configured to store one or more instructions 724.

[0062] The term "machine-readable medium" can include any medium capable of storing, encoding, or carrying instructions for use by machine 700 and to cause machine 700 to perform any one or more of the technologies of this disclosure, or capable of storing, encoding, or carrying data structures used by or associated with such instructions. Non-limiting examples of machine-readable media can include solid-state memory, as well as optical and magnetic media. Therefore, machine-readable media are not transient propagation signals. Specific examples of high-capacity machine-readable media can include: non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic or other phase-change or state-changing memory circuits; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0063] Commands 724 can also be sent or received via a communication network 726 using a transmission medium via a network interface device 720, utilizing any of multiple transport protocols (e.g., Frame Relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Hypertext Transfer Protocol (HTTP), etc.). Example communication networks may include local area networks (LANs), wide area networks (WANs), packet data networks (e.g., the Internet), mobile phone networks (e.g., cellular networks, such as those conforming to one or more standards such as 4G or Long Term Evolution (LTE), ordinary old-style telephone (POTS) networks, and wireless data networks (e.g., those referred to as…). The IEEE 802.11 family of standards, the IEEE 802.15.4 family of standards, peer-to-peer (P2P) networks, etc., are examples of such standards. In the example, network interface device 720 may include one or more physical jacks (e.g., Ethernet jacks, coaxial jacks, or telephone jacks) or one or more antennas for connecting to communication network 726. In the example, network interface device 720 may include multiple antennas to wirelessly communicate using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) technologies. The term "transmission medium" should be considered to include any intangible medium capable of storing, encoding, or carrying instructions for execution by machine 700, and includes digital or analog communication signals or other intangible media to facilitate communication of such software.

[0064] Various annotations

[0065] Each of the non-limiting aspects in this document may exist independently or may be combined in various arrangements or combinations with one or more of the other aspects or other topics described in this document.

[0066] The above detailed description includes reference to the accompanying drawings, which form part of the detailed description. The drawings illustrate, by way of illustration, specific embodiments in which the invention can be practiced. These embodiments are generally also referred to as "examples". Such examples may include elements other than those shown or described. However, the inventors also contemplate examples in which only those elements shown or described are provided. Furthermore, the inventors also contemplate examples (or one or more aspects of examples) using any combination or arrangement of those elements shown or described with respect to a particular example (or one or more aspects of a particular example) or with respect to other examples (or one or more aspects of other examples).

[0067] In the event of any inconsistency between the usage in this document and any other document incorporated by reference, the usage in this document shall prevail.

[0068] In this document, as is common in patent literature, the terms "a" or "an" are used to include one or more, regardless of any other instance or usage of "at least one" or "one or more". In this document, unless otherwise indicated, the term "or" is used to refer to a non-exclusive "or", such that "A or B" includes "A but not B", "B but not A", and "A and B". In this document, the terms "including" and "in which" are used as concise English equivalents to the corresponding terms "comprising" and "wherein". Furthermore, in the appended claims, the terms "including" and "comprising" are open-ended, meaning that a system, apparatus, article, composition, formulation, or process that includes elements other than those listed after such terms in the claims is still considered to fall within the scope of the claims. Moreover, in the appended claims, the terms "first", "second", and "third", etc., are used only as designations and are not intended to impose numerical requirements on their objects.

[0069] The method examples described herein may be implemented, at least in part, by a machine or computer. Some examples may include computer-readable or machine-readable media encoded with instructions operable to configure an electronic device to perform the methods described in the examples above. Implementations of such methods may include code, such as microcode, assembly language code, higher-level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Such instructions may be read and executed by one or more processors to enable the performance of operations, such as those including the methods. The instructions may be in any suitable form, such as, but not limited to, source code, compiled code, interpreted code, executable code, static code, dynamic code, etc. Additionally, in the examples, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, for example, during execution or at other times. Examples of such tangible computer-readable media may include, but are not limited to, hard disks, removable disks, removable optical discs (e.g., compact discs and digital video discs), magnetic tape cartridges, memory cards or memory sticks, random access memory (RAM), read-only memory (ROM), etc.

[0070] The above description is intended to be illustrative and not restrictive. For example, the examples (or one or more aspects of the examples) described above can be used in combination with each other. Other embodiments can be used by those skilled in the art after consulting the above description. An abstract is provided to allow the reader to quickly determine the nature of the technical disclosure. The abstract is submitted on the understanding that it will not be used to define or limit the scope or meaning of the claims. In addition, in the specific embodiments described above, various features may be combined together to simplify the disclosure. This should not be construed as implying that any unclaimed disclosed feature is necessary for any claim. Rather, the subject matter of the invention may lie in fewer than all features of a particular disclosed embodiment. Therefore, the appended claims are incorporated herein by way of example or embodiment, each claim existing independently as a separate embodiment, and it is contemplated that such embodiments may be combined with each other in various combinations or arrangements. The scope of the invention should be determined by reference to the appended claims and the full scope of the equivalents to which such claims are entitled.

Claims

1. A method for performing an auxiliary ultrasound examination using a machine, the method comprising: First B-scan echo data are obtained from a specified first depth range at a specified scanning angle, the first depth range including at least a portion of the structure being inspected; Based on the first B-scan echo data, generate each first sum of echo amplitude across each scan axis position, wherein each first sum corresponds to a different corresponding depth; Identify the first extreme value in each of the first sums; Determine the first depth corresponding to the first extreme value; For each scan axis position, identify a second extreme value within a specified second depth range relative to the determined first depth, the second depth range defining a window around the determined first depth; The identified second extreme value is used to determine the offset value relative to the first depth; as well as Update the rendering of the offset value determined by the indication used to display to the user.

2. The machine-implemented method according to claim 1, comprising determining a plurality of offset values ​​corresponding to different scan axis positions.

3. The machine-implemented method according to claim 1, comprising determining a plurality of offset values ​​corresponding to different specified scanning angles.

4. The machine-implemented method of claim 3, comprising determining the central trend of the determined offset values ​​corresponding to different specified scanning angles.

5. The machine-implemented method according to any one of claims 1 to 4, wherein, The structure being inspected includes welds.

6. The machine-implemented method according to claim 5, wherein, Updating the presentation used for display includes generating the weld overlay template position using the determined offset value.

7. The machine-implemented method according to claim 6, wherein, The presentation used for display includes an S-scan representation.

8. The machine-implemented method according to any one of claims 1 to 4, wherein, The offset value is converted into a lateral offset distance between the ultrasound probe and a feature of the structure being inspected.

9. The machine-implemented method according to claim 8, wherein, The features include the edge of the weld root, the edge of the weld cap, or the centerline of the weld structure.

10. The machine-implemented method according to any one of claims 1 to 4, wherein, The ultrasound probe is oriented to perform acoustic penetration over the specified first depth range using the specified scanning angle.

11. The machine-implemented method according to any one of claims 1 to 4, wherein, At least one of driving or monitoring the acoustic inspection probe in a manner that forms a beam at the specified scanning angle.

12. The machine-implemented method according to any one of claims 1 to 4, wherein, The specified scanning angle is a downward angle that extends obliquely into the structure being inspected.

13. The machine-implemented method according to any one of claims 1 to 4, comprising receiving a selection of the specified scanning angle from a user.

14. The machine-implemented method according to any one of claims 1 to 4, wherein, The specified scanning angle is shown as a mark on the presentation including a sector scan ("S-scan").

15. The machine-implemented method according to any one of claims 1 to 4, wherein, Generating each of the first sums includes summing the pixel values ​​in the first B-scan image across each scan axis position in the first B-scan image; as well as Identifying the first extreme value among the first sums includes determining the corresponding sum with the largest amplitude among the first sums.

16. The machine-implemented method according to any one of claims 1 to 4, comprising using the rendering to generate a graphical representation of a series of offset values ​​corresponding to different scan axis positions.

17. The machine-implemented method according to claim 16, wherein, The offset values ​​relative to the first depth are displayed graphically as a series of offset values.

18. The machine-implemented method according to claim 16, wherein, The graphical representation includes a representation of the features of the structure being examined.

19. The machine-implemented method according to claim 18, wherein, The representation of the feature includes a covering layer indicating the boundary of the weld structure.

20. The machine-implemented method according to claim 16, wherein, The series of offset values ​​are adjusted to provide offset values ​​representing the lateral distance between the ultrasound probe and a feature of the structure being inspected.

21. The machine-implemented method according to any one of claims 1 to 4, wherein, The first extreme value and the second extreme value are the maximum values.

22. A system comprising: Acoustic inspection probe; The front-end circuit is coupled to the acoustic inspection probe; monitor; A processor circuitry coupled to the front-end circuitry and the display; as well as A memory circuit coupled to the processor circuit, the memory circuit including instructions that, when executed by the processor circuit, cause the system to perform the machine-implemented method according to any one of claims 1 to 21.

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