Display panel and manufacturing method thereof, display device, and spliced ​​display device

Abstract

A display panel (300) comprises a back plate (10), a connecting lead (20) and a first protective layer (30). The back plate (10) comprises a first surface (11) and a second surface (12) opposite to each other, and a side surface (13) connecting the first surface (11) and the second surface (12). The connecting lead (20) is arranged on the back plate (10) and extends from the first surface (11) to the second surface (12) via the side surface (13). The connecting lead (20) comprises a first lead segment (21) located on the first surface (11), a second lead segment (22) located on the second surface (12), and a third lead segment (23) connecting the first lead segment (21) and the second lead segment (22), wherein the third lead segment (23) is located on the side surface (13). The first protective layer (30) at least covers the first lead segment (21) and the third lead segment (23). The first protective layer (30) is provided with an opening (31), wherein the opening (31) exposes at least a portion of the second lead segment (22). The portion of the second lead segment (22) exposed by the opening (31) is configured to be connected to a circuit board (40).

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, a display device, and a spliced ​​display device. Background Art

[0002] Mini LED (Micro Light-Emitting Diode) display devices and MicroLED (Micro Light-Emitting Diode) display devices have self-luminous display characteristics, and their advantages include all-solid-state, long life, high brightness, low power consumption, small size, ultra-high resolution, etc.

[0003] Since the mass transfer process of Mini LED chips in Mini LED display devices and Micro LED chips in Micro LED display devices is difficult, it is difficult to directly prepare large-size display devices. Therefore, multiple small-size Mini LED display devices or multiple small-size Micro LED display devices are usually spliced ​​to realize the preparation of large-size display panels. Summary of the invention

[0004] On the one hand, a display panel is provided. The display panel includes a back plate, a connecting lead and a first protective layer. The back plate includes a first surface and a second surface opposite to each other, and a side surface connecting the first surface and the second surface. The connecting lead is arranged on the back plate and extends from the first surface to the second surface through the side surface; the connecting lead includes a first lead segment located on the first surface, a second lead segment located on the second surface, and a third lead segment connecting the first lead segment and the second lead segment, and the third lead segment is located on the side surface. The first protective layer at least covers the first lead segment and the third lead segment; the first protective layer is provided with an opening, and the opening exposes at least a portion of the second lead segment; the portion of the second lead segment exposed by the opening is configured to be connected to a circuit board.

[0005] In some embodiments, the orthographic projection of the opening on the second surface is located within the range of the orthographic projection of the second lead segment on the second surface, and, along a first direction, there is a spacing between two side boundaries of the opening and two side boundaries of the second lead segment; the first direction is parallel to the boundary line between the side and the second surface.

[0006] In some embodiments, the display panel includes a plurality of the connecting leads, and the second lead segments of the plurality of the connecting leads are arranged at intervals along a first direction; the first direction is parallel to the boundary line between the side and the second surface; the first protective layer is provided with a plurality of the openings, and the plurality of the openings are arranged at intervals along the first direction; one of the openings exposes at least a portion of the second lead segment of a connecting lead.

[0007] In some embodiments, the first protection layer covers a portion of the second lead segment close to the third lead segment.

[0008] In some embodiments, the second lead segment includes a first sub-segment, a second sub-segment, and a third sub-segment connected in sequence; the first sub-segment is connected to the third lead segment, an extension direction of the second sub-segment intersects with an extension direction of the first sub-segment, and an extension direction of the third sub-segment is substantially the same as an extension direction of the first sub-segment; the first protective layer covers the first sub-segment and the second sub-segment, and the opening exposes the third sub-segment.

[0009] In some embodiments, the display panel includes a plurality of the connecting leads, and the second sub-segments of at least two of the connecting leads are gradually approached from the first sub-segment to the third sub-segment.

[0010] In some embodiments, the second lead segment includes a fourth sub-segment and a fifth sub-segment connected in sequence; the fourth sub-segment is connected to the third lead segment, and the fourth sub-segment and the fifth sub-segment are located on the same straight line; the first protective layer covers the fourth sub-segment, and the opening exposes the fifth sub-segment.

[0011] In some embodiments, the back panel includes a display area and a non-display area located on at least one side of the display area, the first lead segment is located in the non-display area, and the first protective layer also covers the areas on both sides of the connecting lead; the first protective layer does not cover the display area.

[0012] In some embodiments, the display panel further includes a second protective layer, which is located on a side of the first protective layer away from the connecting lead; an orthographic projection of the second protective layer on the second surface does not overlap with an orthographic projection of the opening on the second surface.

[0013] In some embodiments, the second protection layer has a first boundary located on the second surface, and the opening is located on a side of the first boundary away from the side surface.

[0014] In some embodiments, the display panel further includes a circuit board, and the circuit board is located on a side close to the second surface of the back plate; the circuit board is connected to the second lead segment through the opening.

[0015] In some embodiments, the display panel also includes a third protective layer, which is disposed on the second surface of the back panel; the third protective layer covers a portion of the first protective layer located on the second surface and a portion of the circuit board connected to the second lead segment.

[0016] In some embodiments, the display panel further includes a pad, the pad is located on the first surface; the pad is electrically connected to the first lead segment of the connecting lead, and the first protective layer also covers the pad.

[0017] In some embodiments, a material of the first protection layer includes silicon nitride.

[0018] In another aspect, a method for preparing a display panel is provided. The method for preparing a display panel comprises:

[0019] A back plate is provided; the back plate includes a first surface and a second surface opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface.

[0020] A connecting lead is formed on the back panel; the connecting lead extends from the first surface through the side surface to the second surface; the connecting lead includes a first lead segment located on the first surface, a second lead segment located on the second surface, and a third lead segment connecting the first lead segment and the second lead segment, the third lead segment being located on the side surface.

[0021] A first protective layer is formed; the first protective layer at least covers the first lead segment and the third lead segment, the first protective layer is provided with an opening, and the opening exposes at least a portion of the second lead segment; the portion of the second lead segment exposed by the opening is configured to be connected to a circuit board.

[0022] In some embodiments, the forming of the first protective layer includes: forming a first mask layer and a second mask layer; the first mask layer covers the first surface, the first mask layer does not overlap with the first lead segment, and the second mask layer covers at least a portion of the second lead segment. The second mask layer is patterned to obtain a mask pattern covering at least a portion of the second lead segment. A protective film is formed based on the first mask layer and the mask pattern. The first mask layer and the mask pattern are removed to remove the protective film on the first mask layer and the mask pattern, and the portion of the protective film that is not removed serves as the first protective layer.

[0023] In some embodiments, patterning the second mask layer to obtain a mask pattern covering at least a portion of the second lead segment includes: cutting the second mask layer using a laser to form a mask pattern and a pre-stripping pattern separated from each other, and removing the pre-stripping pattern to obtain a mask pattern covering at least a portion of the second lead segment.

[0024] In some embodiments, removing the first mask layer and the mask pattern includes: removing the first mask layer, placing the back plate covered with the mask pattern in an ultrasonic device containing alcohol for cleaning, and removing the mask pattern using a water washing process.

[0025] In another aspect, a display device is provided, wherein the display device comprises the display panel as described in any one of the above embodiments.

[0026] In another aspect, a spliced ​​display device is provided, wherein the spliced ​​display device comprises a plurality of display devices as described in any one of the above embodiments, wherein the plurality of display devices are spliced ​​and assembled. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0028] Figure 1 is a structural diagram of a display panel according to some embodiments;

[0029] Figure 2 is a structural diagram of another display panel according to some embodiments;

[0030] Figure 3 is a top view of yet another display panel according to some embodiments;

[0031] Figure 4 for Figure 3 A cross-sectional view of the provided display panel at DD';

[0032] Figure 5A for Figure 3 An expanded view of the display panel in the CC area is shown;

[0033] Figure 5B for Figure 3 Another expanded view of the display panel in the CC area is shown;

[0034] Figure 5C for Figure 3 Another expanded view of the display panel in the CC area is shown;

[0035] Figure 6 for Figure 5A A cross-sectional view at E-E';

[0036] Figure 7 is a structural diagram of a circuit board according to some embodiments;

[0037] Fig. 8A for Figure 3 Another expanded view of the display panel in the CC area is shown;

[0038] Figure 8B for Figure 3 Another expanded view of the display panel in the CC area is shown;

[0039] Fig. 9 is a top view of yet another display panel according to some embodiments;

[0040] Fig.10 for Fig. 9 A cross-sectional view of the provided display panel at FF';

[0041] Fig.11 for Fig. 9 Another cross-sectional view of the provided display panel at FF';

[0042] Fig.12 for Figure 3 Another expanded view of the display panel in the CC area is shown;

[0043] Fig.13 is a flow chart of a method for preparing a display panel according to some embodiments;

[0044] Fig.14 is a state diagram of a display panel manufacturing process according to some embodiments;

[0045] Fig.15 is a flow chart of another method for preparing a display panel according to some embodiments;

[0046] Fig.16 is a flow chart of another method for preparing a display panel according to some embodiments;

[0047] Fig.17 is a flow chart of another method for preparing a display panel according to some embodiments;

[0048] Fig.18 is another state diagram of a display panel manufacturing process according to some embodiments;

[0049] Fig.19A is another state diagram of a display panel manufacturing process according to some embodiments;

[0050] Fig.19B is another state diagram of a display panel manufacturing process according to some embodiments;

[0051] Fig. 20 is a flow chart of another method for preparing a display panel according to some embodiments;

[0052] Fig.21A is another state diagram of a display panel manufacturing process according to some embodiments;

[0053] Fig. 21B is another state diagram of a display panel manufacturing process according to some embodiments;

[0054] Fig.22A is another state diagram of a display panel manufacturing process according to some embodiments;

[0055] Fig. 22B is another state diagram of a display panel manufacturing process according to some embodiments;

[0056] Fig.23 is a flow chart of another method for preparing a display panel according to some embodiments;

[0057] Fig.24 is a flow chart of another method for preparing a display panel according to some embodiments;

[0058] Fig.25 is a flow chart of another method for preparing a display panel according to some embodiments;

[0059] Fig.26 is a flow chart of another method for preparing a display panel according to some embodiments;

[0060] Fig. 27 is a structural diagram of a display device according to some embodiments;

[0061] Fig.28 is a structural diagram of a spliced ​​display device according to some embodiments. DETAILED DESCRIPTION

[0062] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0063] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0064] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0065] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0066] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0067] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0068] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0069] As used herein, "approximately" includes the stated values ​​and averages that are within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0070] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0071] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0072] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0073] like Figure 1 As shown, the related art provides a display panel 100 , which includes a back plate 10 ′, a first pad 20 ′, a second pad 30 ′, a connecting lead 40 ′ and a circuit board 50 ′.

[0074] The backplane 10' includes a first surface 11' and a second surface 12' opposite to each other, and a side surface 13' connecting the first surface 11' and the second surface 12'. The first pad 20' is located on the first surface 11', and the second pad 30' is located on the second surface 12'. The first pad 20' is configured to be connected to a circuit structure (e.g., a pixel driving circuit) in the backplane 10'.

[0075] The connecting lead 40' is located on the back plate 10' and extends from the first surface 11' through the side surface 13' to the second surface 12'. Two ends of the connecting lead 40' are respectively connected to the first pad 20' and the second pad 30'.

[0076] The circuit board 50' is located on one side of the second surface 12' close to the back plate 10', and the circuit board 50' is connected to the second pad 30'. In this way, the circuit board 50' is connected to the electrical pattern and the electronic device in the back plate 10' through the interconnected second pad 30', the connecting lead 40' and the first pad 20', thereby realizing the control of the electronic device.

[0077] However, since an electrical pattern, an electronic device and a first pad 20' are arranged on the first surface 11' of the back panel 10', and a second pad 30' is arranged on the second surface 12' of the back panel 10', in order to respectively manufacture related structures on both sides of the back panel 10', it is necessary to turn the back panel 10' over after manufacturing the structure on one surface of the back panel 10', and then manufacture the structure on the other surface of the back panel 10'. In this process, one surface of the back panel 10' may be easily scratched, thereby affecting the yield of the display panel 100. At the same time, the above-mentioned process has many and complicated steps, and the preparation cost is relatively high.

[0078] like Figure 2 As shown, another display panel 200 is also provided in the related art, including a back plate 10", a first pad 20", a connecting lead 30" and a circuit board 40".

[0079] The backplane 10" includes a first surface 11" and a second surface 12" opposite to each other, and a side surface 13" connecting the first surface 11" and the second surface 12". The first pad 20" is located on the first surface 11". The first pad 20' is configured to be connected to an electrical pattern or electronic device in the backplane 10'.

[0080] The connecting lead 30 ″ is located on the back plate 10 ″ and extends from the first surface 11 ″ of the back plate 10 ″ through the side surface 13 ″ to the second surface 12 ″.

[0081] The circuit board 40" is located on one side of the second surface 12" close to the back panel 10" and is connected to the connecting lead 30". The circuit board 40" is connected to the electrical pattern or electronic device in the back panel 10' through the interconnected first pad 20" and the connecting lead 30", thereby realizing the control of the electronic device.

[0082] In this way, the second pad is not provided on the second surface 12" of the back plate 10", and during the preparation process of the display panel 100, there is no need to flip the back plate 10', thereby avoiding the occurrence of scratch problems and improving the yield of the display panel 200. At the same time, no circuit structure such as the second pad is provided on the second surface 12" of the back plate 10", and the preparation process of the display panel 200 is also relatively simple, which can save at least one film forming and patterning process, thereby reducing the preparation cost of the display panel 200.

[0083] However, see Figure 2 The connecting leads 30" in the display panel 200 connected to the circuit board 40" are directly exposed to the external environment, making the connecting leads 30" easily corroded by water vapor and oxygen in the external environment, thereby increasing the resistance of the connecting leads 30", and even causing the connecting leads 30" to break in severe cases.

[0084] Based on the above problems, Figure 3 and Figure 4 As shown, some embodiments of the present disclosure provide a display panel 300. The display panel 300 includes a back plate 10, a connecting lead 20 and a first protective layer 30.

[0085] The back plate 10 includes a first surface 11 and a second surface 12 that are opposite to each other, and a side surface 13 connecting the first surface 11 and the second surface 12 .

[0086] Exemplarily, the first surface 11 may be a display surface of the back plate 10 , and the second surface 12 may be a non-display surface of the back plate 10 .

[0087] For example, Figure 3 As shown, the first surface 11 and the second surface 12 may be substantially rectangular, in which case the back plate 10 may be substantially a cuboid, and the back plate 10 may include four side surfaces 13. It is understood that the shapes of the first surface 11 and the second surface 12 in the present disclosure are not limited thereto, for example, the first surface 11 and the second surface 12 may also be hexagonal, in which case the back plate 10 may include six side surfaces 13.

[0088] It can be understood that "substantially rectangular" means that the shapes of the first surface 11 and the second surface 12 are rectangular as a whole, but are not limited to standard rectangles. That is, the "rectangle" here includes not only a basic rectangular shape, but also a shape similar to a rectangle in consideration of process conditions.

[0089] In some examples, the side surface 13 may be a plane. In other examples, the side surface 13 may be a curved surface. In still other examples, the side surface 13 may include a plurality of planes connected in sequence, and the plurality of planes are not coplanar (for example, the side surface 13 may include three planes). In still other examples, Figure 4 As shown, the side surface 13 may include two arc surfaces respectively connected to the first surface 11 and the second surface 12 , and a plane connected to the two arc surfaces.

[0090] The connecting lead 20 is disposed on the back plate 10 and extends from the first surface 11 to the second surface 12 via the side surface 13. The connecting lead 20 includes a first lead segment 21 located on the first surface 11, a second lead segment 22 located on the second surface 12, and a third lead segment 23 connecting the first lead segment 21 and the second lead segment 22, and the third lead segment 23 is located on the side surface 13.

[0091] Exemplarily, the connecting lead 20 can be a single-layer structure or a multi-layer structure. When the connecting lead 20 is a single-layer structure, the material of the connecting lead 20 can include metal, such as copper, etc.; when the connecting lead 20 is a multi-layer structure, the connecting lead 20 can be a metal laminated structure such as titanium / aluminum / titanium, molybdenum / aluminum / molybdenum, titanium / copper / titanium, etc. The connecting lead can also include a first buffer conductive material, a main body material, and a second buffer conductive material stacked in sequence, the adhesion between the first buffer conductive material and the back plate is greater than the adhesion between the main body material and the back plate; the oxidation resistance of the second buffer conductive material is better than the oxidation resistance of the main body material; the first buffer conductive material is the same as the second buffer conductive material, the first buffer conductive material and the second buffer conductive material include at least one of titanium, chromium, molybdenum and molybdenum-niobium alloy, and the main body material can be copper.

[0092] like Figure 3 As shown, the back panel 10 includes a display area AA and a non-display area BB located at least on one side of the display area AA. Figure 3 In the figure, the non-display area BB is shown surrounding the display area AA.

[0093] The backplane 10 further includes sub-pixels P of multiple colors located in the display area AA and multiple signal lines L. The sub-pixels P of multiple colors include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel, and the first color, the second color, and the third color may be three primary colors (e.g., red, green, and blue).

[0094] Exemplarily, a plurality of sub-pixels P may be arranged in a matrix form, wherein sub-pixels P arranged in a row along a horizontal direction X are referred to as a row of sub-pixels, and sub-pixels P arranged in a row along a vertical direction Y are referred to as a column of sub-pixels.

[0095] For example, Figure 3As shown, each sub-pixel P may include a light emitting device 14 and a pixel driving circuit (not shown). The pixel driving circuit is used to drive the light emitting device 14 to emit light.

[0096] Exemplarily, the pixel driving circuit may include a plurality of thin film transistors and at least one capacitor storage device. The thin film transistor may also include an active layer, a first gate insulating layer, a gate electrode, a second gate insulating layer, a source electrode, and a drain electrode.

[0097] The multiple thin film transistors may all be N-type transistors, or may all be P-type transistors, or may include both N-type and P-type transistors, and may be designed according to actual needs. In addition, the multiple thin film transistors included in the pixel driving circuit may all be low temperature polysilicon (LTPS) transistors, or may all be oxide transistors, or may include both low temperature polysilicon and oxide transistors.

[0098] Exemplarily, the plurality of signal lines L may be gate lines, data lines, or power supply voltage lines. When the signal line L is a gate line, the signal line L may extend in a horizontal direction X, be electrically connected to a row of sub-pixels P, and control the opening and closing of the row of sub-pixels P. When the signal line L is a data line, the signal line L may extend in a vertical direction Y, be electrically connected to a column of sub-pixels P, and provide a data signal to the corresponding column of sub-pixels P. When the signal line L is a power supply voltage line, the signal line L may extend in a vertical direction Y, be electrically connected to at least one column of sub-pixels P, and provide a power supply voltage (e.g., a high level voltage, or a low level voltage, etc.) to the corresponding column of sub-pixels P.

[0099] For example, the first lead segment 21 of a connection lead 20 may be electrically connected in direct contact with a signal line L. To prevent the first lead segment 21 from affecting the normal display of the display panel 300 , the first lead segment 21 may be located in the non-display area BB.

[0100] like Figure 4 As shown, the first protection layer 30 covers at least the first lead segment 21 and the third lead segment 23. The first protection layer 30 has an opening 31, which exposes at least part of the second lead segment 22. The part of the second lead segment 22 exposed by the opening 31 is configured to be connected to the circuit board 40.

[0101] Exemplarily, the first protection layer 30 may only cover the first lead segment 21 and the third lead segment 23 , and in this case, the opening 31 completely exposes the second lead segment 22 .

[0102] Exemplarily, the first protection layer 30 not only covers the first lead segment 21 and the third lead segment 23 , but also may cover a portion of the second lead segment 22 , that is, at this time, the opening 31 exposes a portion of the second lead segment 22 .

[0103] In some embodiments of the present disclosure, there is no limitation on the shape of the opening 31. Figure 5A As shown, the orthographic projection of the opening 31 on the second surface 12 may be substantially rectangular.

[0104] Here, "substantially rectangular" means that the shape of the orthographic projection of the opening 31 on the second surface 12 is rectangular as a whole, but is not limited to a standard rectangle. That is, the "rectangle" here includes not only a basic rectangular shape, but also a shape similar to a rectangle in consideration of process conditions.

[0105] The portion of the second lead segment 22 exposed by the opening 31 is configured to be connected to the circuit board 40. In this way, the connecting lead 20 is connected to the signal line L and the circuit board 40 at the same time, so that the electrical signal emitted by the circuit board 40 can be transmitted to the signal line L through the connecting lead 20, thereby realizing the circuit board 40 controlling the sub-pixel P in the backplane 10.

[0106] Exemplarily, the portion of the second lead segment 22 exposed by the opening 31 is configured to be connected to the circuit board 40 , or the portion of the second lead segment 22 exposed by the opening 31 is configured to be bonded to the circuit board 40 .

[0107] For example, the material of the first protective layer 30 may be a material with high hydrophobicity, such as silicon nitride.

[0108] When the material of the first protective layer 30 includes silicon nitride, for example, the first protective layer 30 can be prepared by a sputtering process, so that the thickness of the first protective layer 30 can be relatively thin, and the thickness of the first protective layer 30 at different positions is relatively uniform. In this way, when a plurality of display devices having the display panel 300 are spliced ​​and assembled to form a spliced ​​display device, it is beneficial to achieve an ultra-narrow splicing seam of the spliced ​​display device.

[0109] Exemplarily, the thickness of the first protection layer 30 may be 1500 angstroms to 7500 angstroms. For example, the thickness of the first protection layer 30 may be 1500 angstroms, 2000 angstroms, 2500 angstroms, 3000 angstroms, 4000 angstroms, 5000 angstroms, 6000 angstroms, 7500 angstroms, etc.

[0110] In some embodiments, the thickness of the first protective layer 30 at different locations may also be different. Figure 4 As shown, the thickness of the first protective layer 30 at position I is d1, the thickness of the first protective layer 30 at position II is d2, the thickness of the first protective layer 30 at position III is d3, and the thickness of the first protective layer 30 at position VI is d4, wherein at least two of d1, d2, d3 and d4 are different in size.

[0111] In some examples, the thickness d3 of the first protective layer 30 at the position III may be greater than the thickness d2 of the first protective layer 30 at the position II.

[0112] In some embodiments, Figure 3 As shown, to prevent the first lead segment 21 from affecting the display screen of the display panel 300, the first lead segment 21 can be located in the non-display area BB. The first protective layer 30 also covers the areas on both sides of the connecting lead 20. The first protective layer 30 can cover the non-display area BB but not the display area AA.

[0113] Since the first protective layer 30 also covers the areas on both sides of the connecting lead 20, it can provide protection for the side of the connecting lead 20, further improving the problem of water vapor and oxygen corrosion of the connecting lead 20. The first protective layer 30 does not cover the display area AA, so that after preparing the first protective layer 30, electronic components (for example, micro light emitting diodes, sensors, micro drivers, etc.) can be arranged at the corresponding positions of the backplane 10.

[0114] like Figure 4 As shown, in some embodiments, the display panel 300 further includes a circuit board 40, which is located on a side close to the second surface 12 of the back plate 10, and the circuit board 40 is connected to the second lead segment 22 through the opening 31. Exemplarily, the circuit board 40 can be a flexible printed circuit (FPC).

[0115] In some embodiments, Figure 4 As shown, the circuit board 40 may include a conductive contact 41 , and the conductive contact 41 is configured to be connected to the second lead segment 22 of the connecting lead 20 .

[0116] In some examples, such as Figure 4 As shown, the extension direction of the conductive contact piece 41 is substantially the same as the extension direction of the second lead segment 22 .

[0117] In some examples, the conductive contact sheet 41 may be a single-layer structure or a multi-layer structure. When the conductive contact sheet 41 is a single-layer structure, the material of the conductive contact sheet 41 may include metal, such as copper. When the conductive contact sheet 41 is a multi-layer structure, the material of the conductive contact sheet 41 may be a metal laminated structure such as titanium-aluminum-titanium, molybdenum-aluminum-molybdenum, titanium-copper-titanium, or a structure in which the main material is copper but the surface is plated with gold.

[0118] The present disclosure does not limit the shape and size of the conductive contact 41. In some examples, the shape and size of the conductive contact 41 can be the same as the shape and size of the portion of the second lead segment 22 exposed by the opening 31. In other examples, the shape and size of the conductive contact 41 can be different from the shape and size of the portion of the second lead segment 22 exposed by the opening 31.

[0119] In some embodiments, Figure 4 As shown, the display panel 300 may further include a conductive adhesive film 42 located between the conductive contact sheet 41 and the second lead segment 22. The conductive adhesive film 42 is in direct contact with the conductive contact sheet 41 and the second lead segment 22.

[0120] Exemplarily, the conductive film 42 may include a plurality of conductive microspheres 421 and an insulator 422. The plurality of conductive microspheres 421 are embedded in the insulator 422 in a separated state, and the conductive microspheres 421 and the insulator 422 of the conductive film 42 both have the characteristics of adhesion and deformation. Exemplarily, the conductive film 42 may be anisotropic conductive film. The particle size of the conductive microspheres 421 is about 5 μm, and the density of the conductive microspheres 421 in the insulator 422 is 2*10 5 Pieces / mm 2 Exemplarily, the conductive microsphere 421 is a structure including gold and nickel on the surface and coated with resin inside, and the conductive microsphere 421 will be crushed when subjected to a certain pressing force, so that the metal particles in the conductive microsphere 421 will be embedded in the conductive contact sheet 41 and / or the second lead segment 22, thereby achieving electrical connection between the two.

[0121] In some embodiments, Figure 4 As shown, the conductive contact piece 41 and the second lead segment 22 are electrically connected by the bonding and deformation characteristics of the conductive microspheres 421 of the conductive adhesive film 42 and the insulator 422 and the conductive effect of the conductive microspheres 421 .

[0122] In the display panel 300 provided in some embodiments of the present disclosure, the circuit board 40 is directly connected to the second lead segment 22 of the connecting lead 20 located on the second surface 12, so that no other circuit structure is required to be provided on the second surface 12, which effectively simplifies the structure and preparation process of the display panel 300, reduces the preparation cost of the display panel, and improves the yield of the display panel 300. At the same time, except for the portion of the connecting lead 20 configured to be connected to the circuit board 40 (that is, at least the portion of the second lead segment 22 exposed by the first opening 31), the rest of the connecting lead 20 is covered by the first protective layer 30, and is not easily corroded by water vapor and oxygen in the air, thereby effectively improving the yield of the connecting lead 20, and further effectively improving the yield and service life of the display panel 300.

[0123] In some embodiments, Figure 5A and Figure 6As shown, the orthographic projection of the opening 31 on the second surface 12 is located inside the orthographic projection of the second lead segment 22 on the second surface 12, and, along the first direction O, there is a spacing d5 between the two side boundaries of the opening 31 and the two side boundaries of the second lead segment 22. Wherein, d5 is greater than 0. The first direction O is parallel to the boundary line W between the side surface 13 and the second surface 12.

[0124] It can be understood that the boundary lines W between different side surfaces 13 and the second surface 12 may have different extending directions. When the side surfaces 13 where the connecting leads 20 are located are different, the first directions O may also be different. Figure 5A In the example, the boundary line W between the side surface 13 and the second surface 12 extends along the horizontal direction X, and the first direction O is parallel to the horizontal direction X.

[0125] By setting this up, see Figure 5A and Figure 6 Only the top surface S1 of the second lead segment 22 away from the back plate 10 is exposed by the opening 31, and the side surface S2 of the second lead segment 22 is covered by the first protective layer 30. Water vapor and oxygen are not easy to corrode the second lead segment 22 from the side surface of the second lead segment 22, so that the connecting lead 20 is less likely to be corroded by water vapor and oxygen in the environment, further improving the yield and service life of the display panel 300.

[0126] In other embodiments, Figure 5B As shown, along the first direction O, the size of the opening 31 is larger than the size of the second lead segment 22 .

[0127] Here, “along the first direction O, the size of the opening 31 is larger than the size of the second lead segment 22 ”, for example, can be as follows: Figure 5B As shown, along the first direction O, the two side boundaries of the second lead segment 22 are located between the two side boundaries of the opening 31. For another example, along the first direction O, the orthographic projection of one side boundary of the second lead segment 22 on the second surface 12 overlaps with the orthographic projection of one side boundary of the opening 31 on the second surface 12, and the other side boundary of the second lead segment 22 is located between the two side boundaries of the opening 31.

[0128] By such arrangement, the top surface S1 of the second lead segment 22 away from the back plate 10 is completely exposed by the opening 31, so that the surface area of ​​the second lead segment 22 configured for bonding connection with the circuit board 40 is larger, which is beneficial to the bonding of the second lead segment 22 and the circuit board 40 and improves the connection stability of the second lead segment 22 and the circuit board 40 at the bonding point.

[0129] In some embodiments, Figure 5A , Figure 5B and Figure 5CAs shown, the display panel 300 includes a plurality of connecting leads 20 , and the second lead segments 22 of the plurality of connecting leads 20 are arranged at intervals along a first direction O. The first direction O is parallel to a boundary line between the side surface 13 and the second surface 12 .

[0130] In some embodiments of the present disclosure, there is no restriction on the specific number of connecting leads 20, which can be designed according to actual needs. In the first direction O, the distance between any second lead segment 22 and two adjacent second lead segments 22 can be different or the same. Along the first direction O, the distances between different positions on the boundary of the second lead segment 22 and the boundary of the adjacent second lead segment 22 can be different or the same.

[0131] In some examples, such as Figure 7 As shown, the circuit board 40 may include a plurality of conductive contacts 41, which are arranged at intervals along the first direction O, and one conductive contact 41 is configured to be connected to a second lead segment 22 of a connecting lead 20. That is, the number of the conductive contacts 41 is the same as the number of the second lead segments 22.

[0132] In some examples, such as Figure 5A and Figure 5B As shown, the first protection layer 30 is provided with a plurality of openings 31 , and the plurality of openings 31 are arranged at intervals along the first direction O. One opening 31 exposes at least a portion of the second lead segment 22 of one connecting lead 20 .

[0133] Exemplarily, the sizes and shapes of the plurality of openings 31 may be the same, so as to facilitate the preparation of the first protective layer 31 .

[0134] In this way, the second lead segment 22 of each connecting lead 20 can be bonded to the circuit board 40, and except for the part of each connecting lead 20 configured to be bonded to the circuit board 40, the rest is covered by the first protective layer 30 and is not easily corroded by water vapor and oxygen in the environment.

[0135] Based on this, see Figure 4 A conductive adhesive film 42 may be provided in each opening 31. During bonding of the second lead segment 22 to the circuit board 40, the conductive microspheres 421 in the conductive adhesive film 42 are denatured by heat pressing, and metal particles in the conductive microspheres 421 are embedded in the conductive contact piece 41 and the second lead segment 22, thereby achieving electrical connection between the conductive contact piece 41 and the second lead segment 22.

[0136] In other examples, such as Figure 5CAs shown, at least one opening 31 is provided in the first protective layer 30, and one opening 31 exposes at least part of the second lead segments 22 of the plurality of connecting leads 20. At this time, along the first direction O, both side boundaries of the part of the second lead segment 22 exposed by the first opening 31 are located between both side boundaries of the opening 31.

[0137] Here, “at least one opening 31 is provided in the first protective layer 30 ” may mean, for example, that the first protective layer 30 has one opening 31 , or may mean that the first protective layer 30 has multiple openings 31 .

[0138] When a plurality of openings 31 are provided in the first protective layer 30 , the plurality of openings 31 may be arranged at intervals along the first direction O. When a plurality of openings 31 are provided in the first protective layer 30 , the numbers of connection leads 20 exposed in different openings 31 may be the same or different.

[0139] Understandably, Figure 5C Only one opening 31 is used to expose at least part of the second lead segments 22 of five connecting leads 20 for illustration. In some embodiments of the present disclosure, the number of openings 31 and the number of connecting leads 20 exposed by each opening 31 are not limited thereto.

[0140] By such arrangement, the second lead segment 22 of each connecting lead 20 can be bonded to the circuit board 40, and the rest of each connecting lead 20 except the portion configured to be bonded to the circuit board 40 is covered by the first protective layer 30, and is not easily corroded by water vapor and oxygen in the environment. At the same time, one opening 31 exposes a plurality of connecting leads 20, so that the number of openings 31 provided in the first protective layer 30 can be reduced, and the patterning process of the first protective layer 30 can be simpler, which is conducive to improving the manufacturing efficiency of the display panel.

[0141] Based on this, the conductive adhesive film 42 can be located in the opening 31, wherein the conductive microspheres 421 located between the conductive contact piece 41 and the second lead segment 22 in the conductive adhesive film 42 are denatured by heat and pressure, and the metal particles in the conductive microspheres 421 are embedded in the conductive contact piece 41 and the second lead segment 22, thereby realizing the electrical connection between the conductive contact piece 41 and the second lead segment 22. The conductive microspheres 421 located between two adjacent second lead segments 22 (or conductive contact pieces 41) in the conductive adhesive film 42 are not subjected to sufficient pressing force, and thus will not be crushed, so that the conductive adhesive film in this part has no conductivity, and the two adjacent second lead segments 22 (or conductive contact pieces 41) are electrically insulated.

[0142] In some embodiments, Figure 4 , Figure 5A , Figure 5B , Figure 5C , Fig. 8A and Figure 8B As shown, the first protection layer 30 covers the portion of the second lead segment 22 close to the third lead segment 23 . That is, the portion of the second lead segment 22 away from the third lead segment 23 is exposed by the first opening 31 , so as to be configured to be bonded to the circuit board 40 .

[0143] In this way, the orthographic projection of the circuit board 40 on the second surface 12 is closer to the center of the second surface 12 and away from the side surface 13, so that when preparing a spliced ​​display device, it is not easy to cause splicing difficulties and increased splicing seams due to the circuit board 40 being close to the edge of the display device.

[0144] In some examples, such as Figure 5A , Figure 5B and Figure 5C As shown, the second lead segment 22 includes a first sub-segment 221, a second sub-segment 222 and a third sub-segment 223 which are connected in sequence. The first sub-segment 221 is connected to the third lead segment 23. The extension direction of the second sub-segment 222 intersects with the extension direction of the first sub-segment 221, and the extension direction of the third sub-segment 223 is substantially the same as the extension direction of the first sub-segment 221.

[0145] At this time, the first protection layer 30 may cover the first subsection 221 and the second subsection 222 , and the opening 31 may expose the third subsection 223 .

[0146] The extension direction of the third sub-segment 223 is substantially the same as the extension direction of the first sub-segment 221, that is, the extension direction of the third sub-segment 223 is completely the same as the extension direction of the first sub-segment 221, and the extension direction of the third sub-segment 223 and the extension direction of the first sub-segment 221 are angled, and the angle is within an acceptable deviation range. The angle is, for example, less than 5°.

[0147] In this way, the first protective layer 30 can protect the first sub-segment 221 and the second sub-segment 222 in the second lead segment 22, so that the first sub-segment 221 and the second sub-segment 222 are not easily corroded by water vapor and oxygen in the air, thereby improving the yield of the connecting lead 20, and further effectively improving the yield and service life of the display panel 300.

[0148] For example, Figure 5A , Figure 5B and Figure 5C As shown, the first sub-segment 221 and the third sub-segment 223 may both extend in a direction perpendicular to the first direction O.

[0149] For example, Figure 5A , Figure 5B and Figure 5CAs shown, when the display panel 300 includes a plurality of connecting leads 20, the first sub-segments 221 of the plurality of connecting leads 20 may be parallel to each other, and the third sub-segments 221 of the plurality of connecting leads 20 may also be parallel to each other. In this way, the preparation of the connecting leads 20 may be facilitated and the preparation process of the connecting leads 20 may be simplified.

[0150] In some possible implementations, such as Figure 5A , Figure 5B and Figure 5C As shown, the display panel 300 includes a plurality of connecting leads 20 , which point from the first sub-segment 221 to the direction of the third sub-segment 223 , and the second sub-segments 222 of at least two connecting leads 20 gradually approach each other.

[0151] At this time, if Figure 5A As shown, in the first direction O, the plurality of connecting leads 20 include two connecting leads 20 located at the edge. In a direction perpendicular to the first direction O and away from the side surface 13, the distance between the second sub-segments 222 of the two connecting leads 20 located at the edge in the first direction O gradually decreases. That is, the distance d6 between the ends of the two second sub-segments 222 connected to the first sub-segment 221 in the first direction O is greater than the distance d7 between the ends of the two second sub-segments 222 connected to the third sub-segment 223 in the first direction O.

[0152] By such arrangement, the spacing between the third sub-segments 223 of the plurality of connecting leads 20 connected to the circuit board 40 is made smaller, so that the area of ​​the portion of the circuit board 40 connected to the connecting leads 20 can be made smaller, which is beneficial to reducing the overall area of ​​the circuit board 40.

[0153] In some possible implementations, the distances between the first sub-segments 221 of any two adjacent connecting leads 20 may be equal.

[0154] In some other possible implementations, the distances between the third sub-segments 223 of any two adjacent connecting leads 20 may be equal.

[0155] In some other possible implementations, the distance between the first sub-segments 221 of any two adjacent connection leads 20 may be equal, and the distance between the third sub-segments 223 of any two adjacent connection leads 20 may be equal.

[0156] In this way, it is convenient to prepare a plurality of connecting leads 20 , and the preparation process of the display panel 300 is simplified.

[0157] In other examples, such as Fig. 8A and Figure 8BAs shown, the second lead segment 22 includes a fourth sub-segment 224 and a fifth sub-segment 225 connected in sequence. The fourth sub-segment 224 is connected to the third lead segment 23, and the fourth sub-segment 224 and the fifth sub-segment 225 are located on the same straight line. The first protection layer 30 covers the fourth sub-segment 224, and the opening 31 exposes the fifth sub-segment 225.

[0158] In this way, the fourth sub-segment 224 and the fifth sub-segment 225 are located on the same straight line, and the structure of the second lead segment 22 is simple, which is conducive to simplifying the preparation process of the connecting lead 20 and improving the preparation efficiency of the connecting lead 20 .

[0159] In addition, the first protective layer 20 covers the fourth sub-segment 224, and the opening 31 exposes the fifth sub-segment 225. While achieving bonding between the connecting lead 20 and the circuit board 40, the fourth sub-segment 224 in the second lead segment 22 is effectively protected, so that the fourth sub-segment 224 is not easily corroded by water vapor and oxygen in the environment, thereby improving the yield of the connecting lead 20, thereby improving the yield of the display panel and the service life of the display panel.

[0160] Exemplarily, the extension directions of the fourth sub-segment 224 and the fifth sub-segment 225 are both perpendicular to the first direction O.

[0161] In some embodiments, Fig. 9 and Fig.10 As shown, the display panel 300 further includes a second protective layer 50. The second protective layer 50 is located on a side of the first protective layer 30 away from the connecting lead 20. The orthographic projection of the second protective layer 50 on the second surface 12 does not overlap with the orthographic projection of the opening 31 on the second surface 12.

[0162] Exemplarily, the material of the second protective layer 50 is a material with high anti-oxidation performance, which can block water vapor and oxygen in the environment. For example, the material of the second protective layer 50 may include ink, ultraviolet curing glue, thermal curing glue, etc.

[0163] In this way, by setting the second protective layer 50 on the side of the first protective layer 30 away from the connecting lead 20, the orthographic projection of the second protective layer 50 on the second surface 12 does not overlap with the orthographic projection of the opening 31 on the second surface 12, so that the second protective layer 50 and the first protective layer 30 can simultaneously provide protection for the portion of the connecting lead 20 that is not bonded to the circuit board 40, and the portion of the connecting lead 20 that is not bonded to the circuit board 40 is less susceptible to corrosion by water vapor and oxygen in the environment, thereby further improving the yield of the connecting lead 20 and improving the yield and service life of the display panel.

[0164] Exemplarily, the thickness of the second protective layer 50 may be 0.5 micrometers to 2 micrometers. For example, the thickness of the second protective layer 50 may be 0.5 micrometers, 1 micrometer, 1.5 micrometers, 2 micrometers, etc.

[0165] In this way, on the one hand, the second protective layer 50 can be used to better protect the connecting lead 20, so that the part of the connecting lead 20 that is not bonded to the circuit board 40 is less susceptible to corrosion by water vapor and oxygen. On the other hand, it can also avoid the problem of a wider display device frame and a larger splicing seam of the spliced ​​display device caused by the thick second protective layer.

[0166] It can be understood that the thickness of the second protective layer 50 in some embodiments of the present disclosure is not limited thereto.

[0167] In some embodiments, Fig.10 As shown, the second protection layer 50 has a first boundary 51 located on the second surface 12 , and the opening 31 is located on a side of the first boundary 51 away from the side surface 13 .

[0168] In this way, the second protective layer 50 can be used to provide protection for the connecting lead 20, making the connecting lead 20 less susceptible to corrosion by water vapor and oxygen in the environment, and can also prevent the second protective layer 50 from covering the second lead segment 22 exposed by the opening 31, thereby ensuring that the connecting lead 20 is bonded to the circuit board 40.

[0169] In some embodiments, Fig.11 and Fig.12 As shown, the display panel 300 further includes a third protective layer 60. The third protective layer 60 is disposed on the second surface 12 of the back plate 10. The third protective layer 60 covers the portion of the first protective layer 30 located on the second surface 12 and the portion of the circuit board 40 connected to the second lead segment 22.

[0170] Exemplarily, the material of the third protective layer 60 may also be a material with high hydrophobicity, which can block external water and oxygen.

[0171] In some possible implementations, the material of the third protective layer 60 includes a fluorine-containing polymer using hydrofluoroether as a solvent. For example, the third protective layer 60 is a fluorinating agent layer.

[0172] In this way, the third protective layer 60 covers the portion of the first protective layer 30 located on the second surface 12, thereby providing protection for the connecting lead 20 together with the first protective layer 30, making the connecting lead 20 less susceptible to corrosion by water vapor and oxygen in the environment, further improving the yield of the connecting lead 20. The third protective layer 60 covers the portion of the circuit board 40 bonded to the second lead segment 22, thereby providing protection for the circuit board 40, making the circuit board 40 less susceptible to corrosion by water vapor and oxygen in the environment.

[0173] like Fig.11As shown, in the case where the display panel 300 includes the second protective layer 50 , the third protective layer 60 may also cover the portion of the second protective layer 50 located on the second surface 12 .

[0174] In this way, the third protection layer 60 covers a portion of the second protection layer 50 , which can improve the adverse effects of pores generated by the material properties of the second protection layer 50 on the plurality of connection leads 20 when the second protection layer 50 is made of an organic material.

[0175] In some embodiments, the third protection layer 60 may not only cover the portion of the first protection layer 30 located on the second surface 12 , but also cover the portion of the first protection layer 30 located on the side surface 13 , thereby protecting the third lead segment 23 located on the side surface 13 .

[0176] In some embodiments, Fig.11 As shown, the display panel 300 further includes a pad 70 . The pad 70 is located on the first surface 11 , is electrically connected to the first lead segment 21 of the connecting lead 20 , and the first protection layer 30 also covers the pad 70 .

[0177] Exemplarily, the material of the pad 70 may be metal, such as copper.

[0178] For example, the pad 70 can be connected to the signal line L in the above embodiment. The pad 70 can also be prepared simultaneously with the circuit structure layer in the backplane 10. In this way, there is no need to form a conductive film layer separately, and an additional mask plate is used, thereby reducing the preparation cost of the display panel 300.

[0179] Exemplarily, one end of the pad 70 connected to the signal line L may extend into the display area AA and be located in a gap between adjacent sub-pixels P.

[0180] The present disclosure does not limit the shape of the pad 70. In some examples, see Fig.12 , the orthographic projection of the pad 70 on the first surface 11 is substantially rectangular. In other examples, the orthographic projection of the pad 70 on the first surface 11 may also be substantially trapezoidal.

[0181] The first protective layer 30 also covers the liner 70 , thereby providing protection for the liner 70 and preventing the liner 70 from being corroded by water vapor and oxygen in the environment.

[0182] When the display panel 30 includes a plurality of pads 70 , the plurality of pads 70 are arranged at intervals along the first direction O. One pad 70 is electrically connected to the first lead segment 21 of one connecting lead 20 . The first protection layer 30 covers the plurality of pads 70 at the same time.

[0183] The present disclosure does not limit the distance between two adjacent gaskets 70 , as long as the two adjacent gaskets 70 do not contact each other.

[0184] like Fig.13 As shown, some embodiments of the present disclosure also provide a method for preparing a display panel 300. The preparation method includes:

[0185] S100 , providing a back plate 10 . The back plate 10 includes a first surface 11 and a second surface 12 opposite to each other, and a side surface 13 connecting the first surface 11 and the second surface 12 .

[0186] S200, such as Fig.14 As shown, a connecting lead 20 is formed on the back plate 10. The connecting lead 20 extends from the first surface 11 to the second surface 12 via the side surface 13. The connecting lead 20 includes a first lead segment 21 located on the first surface 11, a second lead segment 22 located on the second surface 12, and a third lead segment 23 connecting the first lead segment 21 and the second lead segment 22, and the third lead segment 23 is located on the side surface 13.

[0187] Exemplarily, the connecting lead 20 may be a single-layer structure or a multi-layer structure. When the connecting lead 20 is a single-layer structure, the material of the connecting lead 20 may include metal, such as copper. When the connecting lead 20 is a multi-layer structure, the connecting lead 20 may be a metal laminated structure such as titanium / aluminum / titanium, molybdenum / aluminum / molybdenum, titanium / copper / titanium, etc. The connecting lead may also include a first buffer conductive material, a main body material, and a second buffer conductive material stacked in sequence, the adhesion between the first buffer conductive material and the back plate is greater than the adhesion between the main body material and the back plate; the oxidation resistance of the second buffer conductive material is better than the oxidation resistance of the main body material; the first buffer conductive material is the same as the second buffer conductive material, the first buffer conductive material and the second buffer conductive material include at least one of titanium, chromium, molybdenum and molybdenum-niobium alloy, and the main body material may be copper.

[0188] In some examples, such as Fig.15 As shown, step S200, forming the connecting lead 20 on the back plate 10, may include:

[0189] S210 , forming a conductive layer on the back plate 10 by using a sputtering process, wherein the conductive layer covers a portion of the first surface 11 close to the side surface 13 , the side surface 13 , and a portion of the second surface 12 close to the side surface 13 .

[0190] S220 , patterning the conductive layer using a laser etching process to form a connecting lead 20 .

[0191] In other examples, such as Fig.16 As shown, step S200, forming the connecting lead 20 on the back plate 10, may include:

[0192] S230 , using a 3D mask plate and a sputtering process to form connecting leads 20 on the back plate 10 .

[0193] Exemplarily, step S200 , forming the connecting leads 20 on the back plate 10 , may be to form a plurality of connecting leads 20 on the back plate 10 at the same time.

[0194] S300, see Figure 5A , Figure 5B and Figure 5C , Fig. 8A and Figure 8B , forming a first protective layer 30. The first protective layer 30 covers at least the first lead segment 21 and the third lead segment 23. The first protective layer 30 is provided with an opening 31, and the opening 31 exposes at least a portion of the second lead segment 22. The portion of the second lead segment 22 exposed by the opening 31 is configured to be connected to the circuit board 40.

[0195] In the display panel 300 obtained by the method for preparing a display panel provided by some embodiments of the present disclosure, the second lead segment 22 located on the second surface 12 is configured to be directly connected to the circuit board 40, so that no circuit structure is required to be provided on the second surface 12, which effectively simplifies the structure and preparation process of the display panel 300, reduces the preparation cost of the display panel, and improves the yield of the display panel 300. At the same time, except for the portion of the connecting lead 20 configured to be bonded to the circuit board 40 (i.e., at least the portion of the second lead segment 22 exposed by the first opening 31), the rest of the connecting lead 20 is covered by the first protective layer 30, and is not easily corroded by water vapor and oxygen in the air, thereby effectively improving the yield of the connecting lead 20, and further effectively improving the yield and service life of the display panel 300.

[0196] In some embodiments, Fig.17 As shown, step S300, forming the first protective layer 30 includes:

[0197] S310, such as Fig.18 As shown, a first mask layer 81 and a second mask layer 82 are formed. The first mask layer 81 covers the first surface 11 , and the first mask layer 81 does not overlap with the first lead segment 21 . The second mask layer 82 covers at least a portion of the second lead segment 22 .

[0198] In some examples, such as Fig.18 As shown, the second mask layer 82 may only cover a portion of the second lead segment 22 .

[0199] In other examples, the second mask layer 82 may cover the entire second lead segment 22 .

[0200] In yet other examples, the second mask layer 82 may cover the entire second surface 12 .

[0201] When the display panel 300 includes a plurality of connecting leads 20 , the second mask layer 82 simultaneously covers at least a portion of the second lead segments 22 of the plurality of connecting leads 20 .

[0202] In some examples, the material of the first mask layer 81 may be the same as the material of the second mask layer 82. For example, the material of the first mask layer 81 and the material of the second mask layer 82 may be selected from polyimide (PI).

[0203] In other examples, the material of the first mask layer 81 may be different from the material of the second mask layer 82 .

[0204] Exemplarily, the first mask layer 81 may cover the display area of ​​the back panel 10, so that when the first mask layer 81 is removed to remove the protective film 90 on the first mask layer 81 and obtain the first protective layer 30, the first protective layer 30 may not cover the display area AA, so that after preparing the first protective layer 30, electronic components (for example, micro light emitting diodes, sensors, micro drivers, etc.) can be set at corresponding positions of the back panel 10.

[0205] S320, such as Fig.19A and Fig.19B As shown, the second mask layer 82 is patterned to obtain a mask pattern 83 covering at least a portion of the second lead segment 22 .

[0206] By forming the mask pattern 83 on the second lead segment 22 , at least a portion of the protection film 90 formed in a subsequent step may not directly contact the second lead segment 22 , so that at least a portion of the protection film 90 can be easily removed to form an opening.

[0207] In some embodiments, Fig.19A As shown, when the display panel 300 includes a plurality of connecting leads 20 , the second mask layer 82 is patterned to obtain a plurality of mask patterns 83 , and one mask pattern 83 covers at least a portion of the second lead segment 22 of one connecting lead 20 .

[0208] In other embodiments, Fig.19B As shown, when the display panel 300 includes a plurality of connecting leads 20 , the second mask layer 82 is patterned to obtain at least one mask pattern 83 , and one mask pattern 83 covers at least a portion of the second lead segments 22 of the plurality of connecting leads 20 .

[0209] In some examples, such as Fig. 20 As shown, step S320, patterning the second mask layer 82 to obtain a mask pattern 83 covering at least a portion of the second lead segment 22, includes:

[0210] S321, such as Fig.21A and Fig. 21B As shown, the second mask layer 82 is cut by laser to form a mask pattern 83 and a pre-stripping pattern 84 separated from each other.

[0211] S322, see Fig.19A and Fig.19B , the pre-stripping pattern 84 is removed to obtain a mask pattern 83 covering at least a portion of the second lead segment 22 .

[0212] S330, such as Fig.22A and Fig. 22B As shown, based on the first mask layer 81 and the mask pattern 83 , a protection film 90 is formed.

[0213] For example, the protection film 90 may be formed by a sputtering process, so that the thickness of the protection film 90 is relatively thin and the thickness of the protection film 90 at different positions is uniform.

[0214] For example, the material of the protective film 90 may be a material with high hydrophobicity. For example, the material of the first protective layer 30 may include silicon nitride.

[0215] S340, such as Fig. 8A and Figure 8B As shown, the first mask layer 81 and the mask pattern 83 are removed to remove the protection film 90 on the first mask layer 81 and the mask pattern 83 , and the unremoved portion of the protection film 90 serves as the first protection layer 30 .

[0216] In some examples, at least one surface of the first mask layer 81 is adhesive, and the first mask layer 81 is bonded to the first surface 11 through its adhesive surface. At least one surface of the mask pattern 83 (or the second mask layer 82) is adhesive, and the mask pattern 83 (or the second mask layer 82) is bonded to the second surface 12 and the second lead segment 22 through its adhesive surface.

[0217] Based on this, Fig.23 As shown, step S340, removing the first mask layer 81 and the mask pattern 83, includes:

[0218] S341 , removing the first mask layer 81 .

[0219] For example, since the first mask layer 81 has a large area and the adhesive layer of the first mask layer 81 has a low adhesion to the first surface 11 , the first mask layer 81 can be removed by manual or mechanical tearing.

[0220] S342, placing the back plate 10 covered with the mask pattern 83 into an ultrasonic device containing alcohol for cleaning.

[0221] Exemplarily, the back plate 10 can be placed vertically in an ultrasonic device so that the alcohol covers the mask pattern 83. The alcohol solution can penetrate the protective film 90 and dissolve the sticky material on the surface of the mask pattern 83 (the surface material in contact with the mask pattern 83), thereby separating the mask pattern 83 and the second lead segment 22 from each other. The separation here can mean that the two can be in physical contact, but there is no stickiness between the two.

[0222] S343, using a water washing process to remove the mask pattern 83. Exemplarily, the mask pattern 83 may be removed using an air knife in the water washing process.

[0223] In other examples, after the back plate 10 covered with the mask pattern 83 is placed in an ultrasonic device containing alcohol for cleaning, an air gun may be used to directly blow off the mask pattern 83 and dry the back plate 10.

[0224] It should be noted that, although the mask pattern 83 is covered with a protective film 90 before the water washing process (or air gun removal method) is performed, the protective film 90 has a general coverage of the mask pattern 83 because the thickness of the protective film 90 (for example, the thickness of the protective film 90 is at the nanometer level) is much smaller than the thickness of the mask pattern 83 (for example, the thickness of the mask pattern 83 is at the micrometer level). At the same time, due to the presence of the second lead segment 22 and the mask pattern 83, there is a step difference between the portion of the protective film 90 located on the side of the mask pattern 83 away from the second surface 12 and the portion of the protective film 90 that is not in contact with the mask pattern 83, that is, the protective film 90 inevitably has some cracks at the step difference position, and under the action of the wind knife or air gun, the cracks will spread, so that the mask pattern 83 and the corresponding area of ​​the protective film 90 covering the mask pattern 83 can be removed together.

[0225] In some other examples, the first mask layer 81 and the mask pattern 83 can also be removed by using a tape. For example, a tape can be attached to the back plate 10, and the tape at least covers the first mask layer 81 and the mask pattern 83. The viscosity of the tape can be greater than the viscosity of the mask pattern 83, but less than the viscosity of the protective film 90. In this way, in the process of removing the tape, the first mask layer 81 is separated from the first surface 11 of the back plate 10 by force, and the mask pattern 83 is separated from the second lead segment 22 by force, so that it is removed together with the tape. The tape can be removed manually or mechanically.

[0226] In some embodiments, since during the process of forming the protection film 90, part of the material of the protection film 90 will penetrate between the mask pattern 83 and the second lead segment 22, Fig. 8A , Figure 8B , Fig.19A and Fig.19B, an area of ​​an orthographic projection of the opening 31 of the first protection layer 30 on the second surface 12 is smaller than an area of ​​an orthographic projection of the mask pattern 83 on the second surface 12 .

[0227] Exemplarily, when the orthographic projection of the mask pattern 83 on the second surface 12 is approximately rectangular, and the orthographic projection of the opening 31 on the second surface 12 is also approximately rectangular, the size of the orthographic projection of the opening 31 on the second surface 12 in the horizontal direction X is smaller than the size of the orthographic projection of the mask pattern 83 on the second surface 12 in the horizontal direction X. And / or, the size of the orthographic projection of the opening 31 on the second surface 12 in the vertical direction Y is smaller than the size of the orthographic projection of the mask pattern 83 on the second surface 12 in the vertical direction Y.

[0228] In some embodiments, Fig.24 As shown, the preparation method also includes:

[0229] S400 , forming a second protection layer 50 on a side of the first protection layer 30 away from the connection lead 20 . The orthographic projection of the second protection layer 50 on the second surface 12 does not overlap with the orthographic projection of the opening 31 on the second surface 12 .

[0230] For example, the second protection layer 50 may be formed by a pad printing process.

[0231] In some embodiments, Fig.25 As shown, the preparation method also includes:

[0232] S500 , providing a circuit board 40 , wherein the circuit board 40 is located on a side close to the second surface 12 of the back plate 10 . The circuit board 40 is connected to the second lead segment 22 through the opening 31 .

[0233] In some embodiments, Fig.26 As shown, the preparation method also includes:

[0234] S600, forming a third protection layer 60. The third protection layer 60 is disposed on the second surface 12 of the back plate 10. The third protection layer 60 covers the portion of the first protection layer 30 located on the second surface 12 and the portion of the circuit board 40 connected to the second lead segment 22.

[0235] For example, the third protective layer 60 may be formed by coating.

[0236] Some embodiments of the present disclosure provide a display device 400. The display device 400 includes the display panel 300 described in any of the above embodiments.

[0237] Exemplarily, the display device 400 may be a Mini LED (Mini Light Emitting Diode) display device, or the display device 400 may be a Micro LED (Micro Light-Emitting Diode) display device.

[0238] In some embodiments, the display device 400 may further include a housing, and the display panel 300 is located inside the housing. The housing is configured to protect the display panel 300. In other embodiments, the display panel 400 may further include a mainboard, which may be connected to the circuit board to control the display panel. The mainboard may also be directly connected to the circuit board to control the display panel. In yet other embodiments, the display device 400 may further include a frame.

[0239] The beneficial effects that can be achieved by the display device 400 provided in some embodiments of the present disclosure are the same as the beneficial effects that can be achieved by the display panel 300 provided in any of the above embodiments, and are not elaborated here.

[0240] like Fig.28 As shown, some embodiments of the present disclosure further provide a spliced ​​display device 1000, comprising a plurality of display devices 400 provided by the above embodiments, wherein the plurality of display devices 400 are spliced ​​and assembled.

[0241] The spliced ​​display device 1000 can realize the display of a relatively large screen. For example, the spliced ​​display device 1000 can be used as an advertising spliced ​​screen, a conference spliced ​​screen, etc.

[0242] The present disclosure does not limit the number of display devices 400 in the spliced ​​display device 1000. Fig. 27 In the example, a spliced ​​display device 1000 includes nine display devices 400 .

[0243] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: include: a back plate comprising a first surface and a second surface opposite to each other, and a side surface connecting the first surface and the second surface; a connecting lead disposed on the back plate and extending from the first surface through the side surface to the second surface; the connecting lead includes a first lead segment located on the first surface, a second lead segment located on the second surface, and a third lead segment connecting the first lead segment and the second lead segment, the third lead segment being located on the side surface; a first protective layer covering at least the first lead segment and the third lead segment; the first protective layer having an opening exposing at least a portion of the second lead segment; and the first protective layer further covering a side of the second lead segment away from the third lead segment; a conductive adhesive film located in the opening, wherein a portion of the second lead segment exposed by the opening is configured to be connected to a circuit board through the conductive adhesive film; the circuit board is located on a side adjacent to the second surface of the backplane; the circuit board includes a conductive contact, and the conductive contact of the circuit board is connected to the second lead segment through the opening; a second protective layer located on a side of the first protective layer away from the connecting lead; an orthographic projection of the second protective layer on the second surface and an orthographic projection of the opening on the second surface do not overlap; the second protective layer has a first boundary located on the second surface, and the opening is located on a side of the first boundary away from the side surface; A third protective layer is arranged on the second surface of the backplane; the third protective layer covers the portion of the second protective layer located on the second surface, the portion of the circuit board connected to the second lead segment, the first protective layer exposed between the second protective layer and the circuit board, and the side of the circuit board and the conductive contact close to the second protective layer.

2. The display panel according to claim 1, wherein: The orthographic projection of the opening on the second surface is located within the range of the orthographic projection of the second lead segment on the second surface, and, along a first direction, there is a distance between the two side boundaries of the opening and the two side boundaries of the second lead segment; the first direction is parallel to the boundary line between the side surface and the second surface.

3. The display panel according to claim 1, wherein: The display panel includes a plurality of connecting leads, wherein the second lead segments of the plurality of connecting leads are arranged at intervals along a first direction; the first direction is parallel to a boundary line between the side surface and the second surface; The first protective layer is provided with a plurality of openings, and the plurality of openings are arranged at intervals along the first direction; One of the openings exposes at least a portion of the second lead segment of one of the connecting leads.

4. The display panel according to claim 1, wherein: The first protection layer covers a portion of the second lead segment close to the third lead segment.

5. The display panel according to claim 4, wherein: The second lead segment includes a first sub-segment, a second sub-segment, and a third sub-segment connected in sequence; the first sub-segment is connected to the third lead segment, an extension direction of the second sub-segment intersects with an extension direction of the first sub-segment, and an extension direction of the third sub-segment is substantially the same as an extension direction of the first sub-segment; The first protection layer covers the first sub-segment and the second sub-segment, and the opening exposes the third sub-segment.

6. The display panel according to claim 5, wherein: The display panel includes a plurality of connecting leads, which extend from the first sub-segment to the third sub-segment, and the second sub-segments of at least two connecting leads gradually approach each other.

7. The display panel according to claim 4, wherein: The second lead segment includes a fourth sub-segment and a fifth sub-segment connected in sequence; the fourth sub-segment is connected to the third lead segment, and the fourth sub-segment and the fifth sub-segment are located on the same straight line; The first protection layer covers the fourth subsegment, and the opening exposes the fifth subsegment.

8. The display panel according to any one of claims 1 to 7, wherein: The back panel includes a display area and a non-display area located at least on one side of the display area, the first lead segment is located in the non-display area, and the first protective layer also covers areas on both sides of the connecting lead; The first protection layer does not cover the display area.

9. The display panel according to any one of claims 1 to 7, wherein: Also includes: A pad is located on the first surface; the pad is electrically connected to the first lead segment of the connecting lead, and the first protective layer also covers the pad.

10. The display panel according to any one of claims 1 to 7, wherein: The material of the first protection layer includes silicon nitride.

11. A method for preparing a display panel, characterized in that: include: Provide back panel; The back plate includes a first surface and a second surface opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface; A connecting lead is formed on the back plate; the connecting lead extends from the first surface through the side surface to the second surface; the connecting lead includes a first lead segment located on the first surface, a second lead segment located on the second surface, and a third lead segment connecting the first lead segment and the second lead segment, the third lead segment being located on the side surface; forming a first protective layer; the first protective layer covers at least the first lead segment and the third lead segment, the first protective layer having an opening, the opening exposing at least a portion of the second lead segment; the first protective layer also covers a side of the second lead segment away from the third lead segment; forming a conductive adhesive film, wherein the conductive adhesive film is located in the opening, and a portion of the second lead segment exposed by the opening is configured to be connected to the circuit board through the conductive adhesive film; The circuit board is located on a side close to the second surface of the back plate; the circuit board includes a conductive contact, and the conductive contact of the circuit board is connected to the second lead segment through the opening; forming a second protective layer located on a side of the first protective layer away from the connecting lead; an orthographic projection of the second protective layer on the second surface and an orthographic projection of the opening on the second surface do not overlap; the second protective layer has a first boundary located on the second surface, and the opening is located on a side of the first boundary away from the side surface; A third protective layer is formed and disposed on the second surface of the backplane; the third protective layer covers the portion of the second protective layer located on the second surface, the portion of the circuit board connected to the second lead segment, the first protective layer exposed between the second protective layer and the circuit board, and the side surfaces of the circuit board and the conductive contact sheet close to the second protective layer.

12. The preparation method according to claim 11, characterized in that The forming of the first protective layer comprises: forming a first mask layer and a second mask layer; wherein the first mask layer covers the first surface, the first mask layer does not overlap with the first lead segment, and the second mask layer covers at least a portion of the second lead segment; patterning the second mask layer to obtain a mask pattern covering at least a portion of the second lead segment; forming a protective film based on the first mask layer and the mask pattern; The first mask layer and the mask pattern are removed to remove the protective film on the first mask layer and the mask pattern, and the portion of the protective film that is not removed serves as a first protective layer.

13. The preparation method according to claim 12, characterized in that Patterning the second mask layer to obtain a mask pattern covering at least a portion of the second lead segment comprises: cutting the second mask layer by using a laser to form a mask pattern and a pre-stripping pattern separated from each other; The pre-stripping pattern is removed to obtain a mask pattern covering at least a portion of the second lead segment.

14. The preparation method according to claim 12, characterized in that Removing the first mask layer and the mask pattern includes: removing the first mask layer; placing the back plate covered with the mask pattern in an ultrasonic device filled with alcohol for cleaning; The mask pattern is removed by a water washing process.

15. A display device, characterized in that: include: The display panel according to any one of claims 1 to 10.

16. A splicing display device, characterized in that: include: A plurality of display devices as claimed in claim 15, wherein the plurality of display devices are spliced ​​and assembled.

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