Inductor components and their manufacturing methods

Abstract

This invention provides an inductor component that improves manufacturing efficiency and a method for manufacturing the inductor component. An inductor wiring (20) is disposed on the upper surface of an insulating resin (60). A first vertical wiring (51) and a second vertical wiring (52) are connected to the upper surface of the inductor wiring. A first magnetic layer (43) is disposed on the upper surface side of the inductor wiring. A second magnetic layer (45) is disposed on the lower surface side of the inductor wiring. The vertical dimension of the first magnetic layer, i.e., the thickness of the first magnetic layer (TM1), is smaller than the vertical dimension of the second magnetic layer, i.e., the thickness of the second magnetic layer (TM2). Furthermore, the vertical dimension of the inductor wiring, i.e., the thickness of the inductor wiring (TI), is greater than 0.5 times and less than 1.5 times the vertical dimension of the first and second vertical wirings, i.e., the thickness of the vertical wiring.

Description

[0001] This application is a divisional application of application number 2020 1 1022 005.6, filed on September 25, 2020, entitled "Inductor Component and Method for Manufacturing Inductor Component". Technical Field

[0002] This disclosure relates to inductor components and methods for manufacturing inductor components. Background Technology

[0003] Patent Document 1 describes an inductor component with a first inductor wiring disposed on a first surface of a non-magnetic printed circuit board, and a first magnetic layer disposed on the side of the first inductor wiring opposite to the printed circuit board. Furthermore, a second inductor wiring is disposed on a second surface of the printed circuit board opposite to the first surface, and a second magnetic layer is disposed on the side of the second inductor wiring opposite to the printed circuit board. In other words, the inductor component described in Patent Document 1 has a structure in which the layers of the first and second inductor wirings are sandwiched between magnetic layers from both sides.

[0004] Patent Document 1: Japanese Patent No. 6024243

[0005] In the inductor component described in Patent Document 1, sometimes for the purpose of thinning, the second inductor wiring on the second side of the printed circuit board is omitted, resulting in only one layer of the first inductor wiring on the first side. In the case of such a structure, Patent Document 1 does not explore how to set the thickness of the first magnetic layer and the thickness of the second magnetic layer to make the manufacturing of the inductor component more efficient. Summary of the Invention

[0006] To address the aforementioned issues, one aspect of this disclosure comprises: a single-layer inductive wiring; a first magnetic layer disposed on a first surface of the inductive wiring; a second magnetic layer stacked on a second surface of the inductive wiring opposite to the first surface; and a vertical wiring penetrating the first magnetic layer and connected to the inductive wiring. When the direction orthogonal to the main surface of the second magnetic layer is taken as the normal direction, the dimension of the first magnetic layer in the normal direction, i.e., the thickness of the first magnetic layer, is less than the dimension of the second magnetic layer in the normal direction, i.e., the thickness of the second magnetic layer. The dimension of the inductive wiring in the normal direction, i.e., the thickness of the inductive wiring, is greater than 0.5 times and less than 1.5 times the dimension of the vertical wiring in the normal direction, i.e., the thickness of the vertical wiring.

[0007] To address the aforementioned issues, one aspect of this disclosure is a method for manufacturing an inductor component, comprising: a first coating step, forming a first coating portion on a portion of a first surface covered with insulating resin; an inductor wiring processing step, forming inductor wiring on a portion of the first surface of the insulating resin not covered by the first coating portion using a plating method; a second coating step, forming a second coating portion, wherein the second coating portion coats a portion of the first coating portion opposite to the insulating resin (i.e., the first surface) and a portion of the inductor wiring opposite to the insulating resin (i.e., the first surface); a vertical wiring processing step, forming vertical wiring on a portion of the first surface of the insulating resin not covered by the second coating portion using a plating method; and a coating removal step, wherein... After the above-described vertical wiring process, the first and second covered portions are removed; in the first magnetic layer process, after the covered portion removal process, a first magnetic layer is laminated on the first side of the inductor wiring; and in the second magnetic layer process, a second magnetic layer is laminated on the second side of the inductor wiring. When the direction orthogonal to the main surface of the second magnetic layer is taken as the normal direction, the vertical wiring is formed in the above-described vertical wiring process, and the dimension of the vertical wiring in the normal direction, i.e., the thickness of the vertical wiring, is greater than 2 / 3 times the dimension of the first magnetic layer in the normal direction, i.e., the thickness of the first magnetic layer, but less than twice the dimension of the first magnetic layer in the normal direction, i.e., the thickness of the first magnetic layer.

[0008] Based on the above structure, the difference between the thickness of the inductor wiring and the vertical wiring is small. Therefore, the inductor wiring and the vertical wiring can be formed using the same manufacturing equipment and under the same processing conditions. Thus, the manufacturing equipment and processing conditions do not need to be significantly changed in the formation of the inductor wiring and the vertical wiring, making the manufacturing of inductor components more efficient.

[0009] Furthermore, according to the above structure, when the thickness of the first magnetic layer is smaller than the thickness of the second magnetic layer, it is possible to suppress the overall thickness of the inductor component from increasing. On the other hand, since the thickness of the first magnetic layer is small, there is a possibility of magnetic flux leakage from the first magnetic layer side. However, since the inductor wiring is a single layer, the magnetic flux density is small, thus suppressing excessive leakage of magnetic flux from the first magnetic layer side.

[0010] It can make the manufacturing of inductor components more efficient. Attached Figure Description

[0011] Figure 1 This is an exploded perspective view of the inductor component according to the first embodiment.

[0012] Figure 2 This is a perspective top view of the inductor component according to the first embodiment.

[0013] Figure 3This is a cross-sectional view of the inductor component according to the first embodiment.

[0014] Figure 4 This is an exploded perspective view of the inductor component according to the second embodiment.

[0015] Figure 5 This is a perspective top view of the inductor component according to the second embodiment.

[0016] Figure 6 This is a cross-sectional view of the inductor component according to the second embodiment.

[0017] Figure 7 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0018] Figure 8 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0019] Figure 9 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0020] Figure 10 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0021] Figure 11 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0022] Figure 12 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0023] Figure 13 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0024] Figure 14 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0025] Figure 15 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0026] Figure 16 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0027] Figure 17 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0028] Figure 18 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0029] Figure 19 This is an explanatory diagram illustrating the manufacturing process of inductor components.

[0030] Explanation of reference numerals in the attached figures

[0031] 10…Inductor component; 20…Inductor wiring; 21…Wiring body; 21A…Inner peripheral end; 21B…Outer peripheral end; 22…First pad; 23…Second pad; 31…First dummy wiring; 32…Second dummy wiring; 40…Magnetic layer; 41…Inner magnetic circuit; 42…Outer magnetic circuit; 43…First magnetic layer; 44…Insulating resin magnetic layer; 45…Second magnetic layer; 51…First vertical wiring; 52…Second vertical wiring; 60…Insulating resin; L1… Layer 1; L2…Layer 2; L3…Layer 3; L4…Layer 4; TA…Inductor component thickness; TD…Dummy trace thickness; TI…Inductor trace thickness; TM1…First magnetic layer thickness; TM2…Second magnetic layer thickness; TV…Vertical trace thickness; WD…Dummy trace width; WI…Inductor trace width; 110…Inductor component; 120…Inductor trace; 121…Trace body; 121A…First end; 121B…Second end; 122…First pad ; 123… 2nd pad; 131… 1st dummy routing; 132… 2nd dummy routing; 140… Magnetic layer; 141… Inner magnetic circuit; 142… Outer magnetic circuit; 143… 1st magnetic layer; 144… Insulating resin magnetic layer; 145… 2nd magnetic layer; 151… 1st vertical routing; 152… 2nd vertical routing; 160… Insulating resin; 170… Insulating layer; 180… External terminal; 210… Substrate component; 220… Dummy insulating layer; 230… Crystal Layer; 240… First coating; 250… Second coating; L11… First layer; L12… Second layer; L13… Third layer; L14… Fourth layer; MF… Main surface; MF2… Main surface; TA2… Inductor component thickness; TI2… Inductor wiring thickness; TM11… First magnetic layer thickness; TM12… Second magnetic layer thickness; TV2… Vertical wiring thickness; TV3… Vertical wiring thickness before cutting; WD2… Dummy wiring width; WI2… Inductor wiring width. Detailed Implementation

[0032] <Implementation Methods of Inductor Components>

[0033] The following describes various embodiments of the inductor component. Furthermore, in the accompanying drawings, sometimes the constituent elements are shown enlarged for ease of understanding. Sometimes the dimensional ratios of the constituent elements differ from the actual dimensions or from other drawings. Additionally, section lines are indicated in the sectional views, but sometimes section lines of some constituent elements are omitted for ease of understanding.

[0034] <First Embodiment>

[0035] The first embodiment of the inductor component will be described below.

[0036] like Figure 1As shown, the inductor component 10 is generally constructed with four thin plate-like layers stacked in the thickness direction. In the following description, the stacking direction of each of the four layers will be described as the vertical direction.

[0037] The first layer L1 consists of inductive wiring 20, first dummy wiring 31, second dummy wiring 32, inner magnetic circuit section 41, and outer magnetic circuit section 42. When viewed from above, the first layer L1 is approximately square.

[0038] like Figure 2 As shown, in the first layer L1, the inductor wiring 20 consists of a wiring body 21, a first pad 22, and a second pad 23. Viewed from above, the inductor wiring 20 extends in a spiral shape centered on the center of the main surface of the square first layer L1. Specifically, viewed from above, the wiring body 21 of the inductor wiring 20 spirals counterclockwise from its outer peripheral end 21A towards its inner peripheral end 21B. Furthermore, Figure 2 In the diagram, the first vertical wiring 51 and the second vertical wiring 52, described later, are represented by double-dotted lines, and the insulating resin 60 is represented by dashed lines.

[0039] Regarding the number of turns of the inductor wiring 20, when moving from one end of the inductor wiring 20 to the other end in the extension direction of the inductor wiring 20, a movement of 360 degrees relative to one end of the inductor wiring 20 is defined as 1.0 turn. That is, the number of turns of the inductor wiring 20 is expressed by the winding angle of the inductor wiring 20. Therefore, for example, if it is wound at 180 degrees, the number of turns is 0.5 turns. In this embodiment, the winding angle of the inductor wiring 20 is 540 degrees. Therefore, the number of turns of the inductor wiring 20 in this embodiment is 1.5 turns.

[0040] The inductive wiring 20 is made of a conductive material. In this embodiment, the composition of the inductive wiring 20 is such that the proportion of copper is 99 wt% or more and the proportion of sulfur is 0.1 wt% or more and less than 1.0 wt%.

[0041] like Figure 1 As shown, a first pad 22 is connected to the outer peripheral end 21A of the wiring body 21. When viewed from above, the first pad 22 is approximately circular in shape. The material of the first pad 22 is the same as that of the wiring body 21.

[0042] The first dummy wiring 31 extends from the first pad 22 toward the outer edge of the first layer L1. The first dummy wiring 31 extends to the side of the first layer L1 and is exposed on the outer surface of the inductor component 10.

[0043] A second pad 23 is connected to the inner peripheral end 21B of the wiring body 21. When viewed from above, the second pad 23 is approximately circular in shape. The material of the second pad 23 is the same as that of the wiring body 21.

[0044] In the portion between the outer peripheral end 21A and the inner peripheral end 21B of the wiring body 21, the second dummy wiring 32 extends from a position where it is wound 0.5 turns from the outer peripheral end 21A. The second dummy wiring 32 extends to the side of the first layer L1 and is exposed on the outer surface of the inductor component 10.

[0045] In the first layer L1, the region inside the inductor wiring 20 is called the inner magnetic circuit section 41. The inner magnetic circuit section 41 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. That is, the inner magnetic circuit section 41 is made of magnetic materials. In the first layer L1, the region outside the inductor wiring 20 is called the outer magnetic circuit section 42. Similar to the inner magnetic circuit section 41, the outer magnetic circuit section 42 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. That is, the outer magnetic circuit section 42 is made of magnetic materials.

[0046] like Figure 1 As shown, a second layer L2, which is the same as the first layer L1 in terms of top view, is stacked on the upper surface of the first layer L1. The second layer L2 is composed of a first vertical wiring 51, a second vertical wiring 52, and a first magnetic layer 43.

[0047] The first vertical wiring 51 is directly connected to the upper surface of the first pad 22 without passing through other layers. The material of the first vertical wiring 51 is the same as that of the inductor wiring 20. The first vertical wiring 51 is cylindrical, with the axis of the cylinder aligned with the vertical direction. When viewed from above, the diameter of the circular first vertical wiring 51 is slightly smaller than the diameter of the first pad 22.

[0048] The second vertical wiring 52 is directly connected to the upper surface of the second pad 23 without passing through other layers. The material of the second vertical wiring 52 is the same as that of the inductor wiring 20. The second vertical wiring 52 is cylindrical, with the axis of the cylinder aligned with the vertical direction. When viewed from above, the diameter of the circular second vertical wiring 52 is slightly smaller than the diameter of the second pad 23. Furthermore, although the inductor wiring 20, the first dummy wiring 31, the second dummy wiring 32, the first vertical wiring 51, and the second vertical wiring 52 are shown separately, they are integrated into one unit.

[0049] The portion of the second layer L2 excluding the first vertical wiring 51 and the second vertical wiring 52 becomes the first magnetic layer 43. Therefore, the first magnetic layer 43 is disposed on the upper surface side, i.e., the first surface side, of the inductor wiring 20. Similar to the inner magnetic circuit portion 41 and the outer magnetic circuit portion 42 described above, the first magnetic layer 43 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. Therefore, the first magnetic layer 43 is made of a magnetic material.

[0050] Below the first layer L1, there is a third layer L3, which is the same square as the first layer L1 when viewed from above. The third layer L3 is composed of insulating resin 60 and an insulating resin magnetic layer 44.

[0051] Insulating resin 60 covers the inductive wiring 20, the first dummy wiring 31, and the second dummy wiring 32 from the bottom. That is, the insulating resin 60 covers the entire bottom surface of the conductive portion of the first layer L1. Viewed from above, the insulating resin 60 covers an area slightly larger than the outer edges of the inductive wiring 20, the first dummy wiring 31, and the second dummy wiring 32. As a result, when viewed from above, the insulating resin 60 has a roughly annular shape. The insulating resin 60 is made of an insulating resin with a higher insulating strength than the inductive wiring 20.

[0052] The portion of the third layer L3 excluding the insulating resin 60 becomes the insulating resin magnetic layer 44. Similar to the inner magnetic circuit portion 41 and the outer magnetic circuit portion 42 described above, the insulating resin magnetic layer 44 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. Therefore, the insulating resin magnetic layer 44 is a magnetic material.

[0053] A fourth layer L4, identical in top view to the first layer L1, is stacked on the lower surface of the third layer L3. The fourth layer L4 becomes the second magnetic layer 45. That is, the second magnetic layer 45 is stacked on the lower surface (the second surface) of the inductor wiring 20, opposite to the upper surface (the first surface). The second magnetic layer 45 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. In other words, similar to the inner magnetic circuit portion 41 and the outer magnetic circuit portion 42 described above, the second magnetic layer 45 is a magnetic material. Here, the surface of the second magnetic layer 45 where the inductor wiring 20 is disposed is designated as the main surface MF of the second magnetic layer 45. Furthermore, in this embodiment, the normal direction orthogonal to the fourth layer L4, i.e., the main surface MF of the second magnetic layer 45, is the vertical direction, which is the same as the stacking direction of the four layers.

[0054] In the inductor component 10, a magnetic layer 40 is formed by an inner magnetic circuit portion 41, an outer magnetic circuit portion 42, a first magnetic layer 43, an insulating resin magnetic layer 44, and a second magnetic layer 45. The inner magnetic circuit portion 41, outer magnetic circuit portion 42, first magnetic layer 43, insulating resin magnetic layer 44, and second magnetic layer 45 are connected to surround the inductor wiring 20. Thus, the magnetic layer 40 forms a closed magnetic circuit relative to the inductor wiring 20. Although the inner magnetic circuit portion 41, outer magnetic circuit portion 42, first magnetic layer 43, insulating resin magnetic layer 44, and second magnetic layer 45 are shown separately, they are integrated into the magnetic layer 40.

[0055] like Figure 3As shown, the vertical dimension, i.e., the thickness, of the first layer L1 is 70 μm. Therefore, the vertical dimension, i.e., the inductor wiring thickness TI, of the inductor wiring 20 is 70 μm. In addition, the vertical dimension, i.e., the dummy wiring thickness TD, of the first dummy wiring 31 and the second dummy wiring 32 is 70 μm, the same as the inductor wiring thickness TI.

[0056] Here, as Figure 2 As shown, the dimension of the wiring body 21 of the inductor wiring 20 in a cross-section perpendicular to its extending direction, in a direction orthogonal to the inductor wiring thickness TI, is defined as the inductor wiring width WI. In this case, in the inductor component 10, the inductor wiring width WI is greater than the inductor wiring thickness TI, i.e., 70 μm. In this embodiment, the inductor wiring width WI is the arithmetic mean of the wiring widths at three points: the center position between the outer peripheral end 21A and the inner peripheral end 21B of the wiring body 21, a position offset by 100 μm from the center position towards the outer peripheral end 21A, and a position offset by 100 μm from the center position towards the inner peripheral end 21B. Furthermore, in this embodiment, the inductor wiring width WI is approximately constant within the wiring body 21 of the inductor wiring 20. Furthermore, in this embodiment, the inductor wiring thickness TI is the arithmetic mean of the wiring thickness at three points: the center position between the outer peripheral end 21A and the inner peripheral end 21B of the wiring body 21, a position offset by 100 μm from the center position towards the outer peripheral end 21A, and a position offset by 100 μm from the center position towards the inner peripheral end 21B. In addition, in this embodiment, the inductor wiring thickness TI of the inductor wiring 20 is approximately constant. Furthermore, in the measurement of the inductor wiring width WI and the inductor wiring thickness TI, the maximum value of the vertical dimension in the wiring thickness measurement section and the maximum value of the dimension in the direction orthogonal to the vertical direction in the wiring width measurement section are sufficient.

[0057] like Figure 2 As shown, the dimension of the first dummy wiring 31 in a cross-section perpendicular to its extending direction, in a direction orthogonal to the dummy wiring thickness TD, is defined as the dummy wiring width WD. In this case, in the inductor component 10, the dummy wiring width WD is less than the inductor wiring width WI. Furthermore, in this embodiment, the width of the second dummy wiring 32 is the same as the width of the first dummy wiring 31, i.e., the dummy wiring width WD. The dummy wiring width WD is defined as the maximum value of the width dimension of the surface of the first dummy wiring 31 exposed on the outer surface of the inductor component 10, orthogonal to the vertical direction. Furthermore, in this embodiment, the dummy wiring width WD is approximately constant in both the first dummy wiring 31 and the second dummy wiring 32.

[0058] like Figure 3As shown, the vertical dimension (thickness) of the second layer L2 is 50 μm. Furthermore, the vertical dimensions (thickness) of the first vertical wiring 51, the second vertical wiring 52, and the first magnetic layer 43 constituting the second layer L2 are all the same, 50 μm. Therefore, the vertical dimensions (thickness TV) of the first vertical wiring 51 and the second vertical wiring 52 are 50 μm. Also, the vertical dimension (thickness TM1) of the first magnetic layer 43 is 50 μm. That is, the first vertical wiring 51 and the second vertical wiring 52 penetrate the first magnetic layer 43 in the vertical direction.

[0059] The vertical dimension, i.e., the thickness, of the third layer L3 is 20 μm. In addition, the vertical dimension, i.e., the thickness, of the insulating resin 60 and the insulating resin magnetic layer 44 constituting the third layer L3 is also the same 20 μm.

[0060] The vertical dimension, or thickness, of the fourth layer L4 is 100 μm. Therefore, the vertical dimension, or thickness TM2, of the second magnetic layer 45 constituting the fourth layer L4 is 100 μm. As a result, the vertical dimension, or thickness TA, of the inductor component 10, comprising the first layer L1 to the fourth layer L4, is 0.240 mm.

[0061] Here, comparing the thicknesses mentioned above, the thickness of the first magnetic layer TM1 is less than the thickness of the second magnetic layer TM2. Furthermore, the inductor wiring thickness TI is 1.4 times the vertical wiring thickness TV, which is greater than 0.5 times but less than 1.5 times the vertical wiring thickness TV.

[0062] Next, the effects of the first embodiment described above will be explained.

[0063] (1) In the first embodiment described above, the inductor wiring thickness TI is 1.4 times the vertical wiring thickness TV. Thus, if the inductor wiring thickness TI falls within a range greater than 0.5 times but less than 1.5 times the vertical wiring thickness TV, it can be said that the difference between the inductor wiring thickness TI and the vertical wiring thickness TV is not significant. Therefore, in the formation of the inductor wiring 20 and the formation of the first vertical wiring 51 and the second vertical wiring 52, it is not necessary to significantly change the manufacturing apparatus and processing conditions; the inductor wiring 20, the first vertical wiring 51, and the second vertical wiring 52 can be formed using the same manufacturing apparatus and the same processing conditions. As a result, the manufacturing of the inductor component 10 can be made more efficient.

[0064] (2) In the first embodiment described above, the inductor wiring 20 is not disposed on the lower surface side of the insulating resin 60, and the thickness TM1 of the first magnetic layer is less than the thickness TM2 of the second magnetic layer. Because of these factors, the thickness TA of the inductor component can be suppressed to a relatively thin value. For example, the thickness TA of the inductor component becomes a relatively thin value such as 0.240 mm or less than 0.300 mm. On the other hand, if the thickness TM1 of the first magnetic layer is small, there is a greater possibility of magnetic flux leakage from the magnetic layer 40. However, in the inductor component 10, since the inductor wiring 20 is a single layer, the magnetic flux density is small, thus suppressing excessive magnetic flux leakage.

[0065] In particular, the thickness TI of the inductor wiring is less than 1.5 times the thickness TV of the vertical wiring, meaning that the thickness TM1 of the first magnetic layer is greater than 2 / 3 times the thickness TI of the inductor wiring. This helps to suppress excessive magnetic flux leakage.

[0066] (3) In the first embodiment described above, the inductor wiring thickness TI is less than the inductor wiring width WI. Therefore, under the condition that the cross-sectional area of ​​the inductor wiring 20 is the same, the inductor wiring thickness TI can be made smaller. Therefore, it can help to reduce the overall thickness of the inductor component 10.

[0067] (4) According to the first embodiment described above, the upper surface of the inductor wiring 20 contacts the first vertical wiring 51, the second vertical wiring 52, and the first magnetic layer 43 without passing through other layers. In other words, no other layers such as insulating layers are stacked on the upper surface of the inductor wiring 20. Therefore, it is not necessary to form vias in the layers stacked on the upper surface of the inductor wiring 20 to ensure electrical conduction between the inductor wiring 20 and the first vertical wiring 51 and the second vertical wiring 52, which helps to simplify the manufacturing method.

[0068] (5) According to the first embodiment described above, in the composition of the inductor wiring 20, the proportion of copper is 99 wt% or more, and the proportion of sulfur is 0.1 wt% or more and less than 1.0 wt%. Therefore, it is cheaper than copper and can achieve low resistance. In addition, by adding sulfur, impurities exist at the grain boundaries of copper, and the stress is relieved due to the sulfur as an impurity.

[0069] <Second Implementation>

[0070] The second embodiment of the inductor component will be described below. Furthermore, compared to the inductor component 10 of the first embodiment, the main difference in the second embodiment described below is the shape of the inductor wiring.

[0071] like Figure 4 As shown, the inductor component 110 is generally constructed with four thin plate-like layers stacked in the thickness direction. In the following description, the stacking direction of each of the four layers will be described as vertical. Furthermore, Figure 4 The diagrams of the insulating layer 170 and the external terminal 180, which will be described later, are omitted.

[0072] The first layer L11 consists of two inductor wirings 120, two first dummy wirings 131, two second dummy wirings 132, an inner magnetic circuit section 141, and an outer magnetic circuit section 142. When viewed from above, the first layer L11 appears as a rectangle.

[0073] like Figure 5 As shown, in the first layer L11, the inductor wiring 120 is composed of a wiring body 121, a first pad 122, and a second pad 123. In top view, the wiring body 121 extends along the long side of the rectangle of the first layer L11. Furthermore, the central portion 121C of the wiring body 121 extends in a straight line along its extension direction, and the first end 121A on one side and the second end 121B on the other side of the wiring body 121 are bent. Both the first end 121A and the second end 121B of the wiring body 121 are bent at approximately 90 degrees towards the central side along the short side of the first layer L11. In addition, Figure 5 In the diagram, the first vertical wiring 151 and the second vertical wiring 152, described later, are shown by double-dotted lines, and the insulating resin 160 is shown by dashed lines.

[0074] The inductor wiring 120 is wound at an angle of 90 degrees at one end and 180 degrees when both ends are combined. Therefore, the number of turns of the inductor wiring 120 is 0.5 turns in this embodiment.

[0075] The inductive wiring 120 is made of a conductive material. In this embodiment, the composition of the inductive wiring 120 contains 99 wt% or more of copper and 0.1 wt% or more and less than 1.0 wt% of sulfur.

[0076] like Figure 4 As shown, a first pad 122 is connected to the first end 121A of the inductor wiring 120. Viewed from above, the first pad 122 is approximately square. The material of the first pad 122 is the same as that of the wiring body 121.

[0077] The first dummy wiring 131 extends from the first pad 122 toward the outer edge of the first layer L11. The first dummy wiring 131 extends to the side of the first layer L11 and is exposed on the outer surface of the inductor component 110.

[0078] A second pad 123 is connected to the second end 121B of the inductor wiring 120. When viewed from above, the second pad 123 is approximately square. The material of the second pad 123 is the same as that of the wiring body 121.

[0079] The second dummy wiring 132 extends from the second pad 123 toward the outer edge of the first layer L11. The second dummy wiring 132 extends to the side of the first layer L11 and is exposed on the outer surface of the inductor component 110.

[0080] Here, the center C of the rectangle on the upper surface of the first layer L11 is the intersection point between a straight line passing through the center of the short side of the first layer L11 and a straight line passing through the center of the short side of the first layer L11 and parallel to the long side of the first layer L11. Furthermore, the first layer L11 is constructed such that the axis passing through this intersection point, i.e., the normal direction of center C, is rotated 180 degrees relative to the center of rotation. Therefore, the second end of the short side of the first layer L11 has the same construction as the first end of the short side of the first layer L11. Additionally, the same reference numerals are used in the accompanying drawings, and descriptions are omitted.

[0081] The region in layer L11 that is inside the inductor wiring 120 is called the inner magnetic circuit section 141. The inner magnetic circuit section 141 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. That is, the inner magnetic circuit section 141 is made of magnetic material. The region in layer L11 that is outside the inductor wiring 120 is called the outer magnetic circuit section 142. Similar to the inner magnetic circuit section 141, the outer magnetic circuit section 142 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. Therefore, the outer magnetic circuit section 142 is made of magnetic material.

[0082] like Figure 4 As shown, a second layer L12, which is the same as the first layer L11 in terms of top view, is stacked on the upper surface of the first layer L11. The second layer L12 is composed of two first vertical wirings 151, two second vertical wirings 152, and a first magnetic layer 143.

[0083] The first vertical wiring 151 is connected to the upper surface of the first pad 122 without passing through other layers. The material of the first vertical wiring 151 is the same as that of the inductor wiring 120. The first vertical wiring 151 is prismatic, with the axis of the prism aligned with the vertical direction. When viewed from above, the dimensions of each side of the square first vertical wiring 151 are slightly smaller than the dimensions of each side of the square first pad 122.

[0084] The second vertical wiring 152 is directly connected to the upper surface of the second pad 123 without passing through any other layers. The material of the second vertical wiring 152 is the same as that of the inductor wiring 120. The second vertical wiring 152 is prismatic, with the axis of the prism aligned with the vertical direction. When viewed from above, the dimensions of each side of the square second vertical wiring 152 are slightly smaller than the dimensions of each side of the square second pad 123. Furthermore, although the inductor wiring 120, the first dummy wiring 131, the second dummy wiring 132, the first vertical wiring 151, and the second vertical wiring 152 are shown separately, they are integrated into one unit.

[0085] The portion of the second layer L12 excluding the first vertical wiring 151 and the second vertical wiring 152 becomes the first magnetic layer 143. Therefore, the first magnetic layer 143 is disposed on the upper surface side, i.e., the first surface side, of the inductor wiring 120. Similar to the inner magnetic circuit portion 141 and the outer magnetic circuit portion 142 described above, the first magnetic layer 143 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. That is, the first magnetic layer 143 is composed of magnetic materials.

[0086] like Figure 6 As shown, an insulating layer 170 and external terminals 180 are disposed on the upper surface of the second layer L12. Specifically, external terminals 180 are connected to the upper surfaces of the two first vertical wirings 151 and the two second vertical wirings 152. The external terminals 180 are made of a conductive material, and in this embodiment, they are a three-layer structure of copper, nickel, and gold.

[0087] The area on the upper surface of the second layer L12 not covered by the external terminal 180 is covered by the insulating layer 170. The insulating layer 170 has higher insulation than the first magnetic layer 143, and in this embodiment, the insulating layer 170 serves as a solder resist.

[0088] like Figure 4 As shown, a third layer L13, which is the same rectangular shape as the first layer L11 when viewed from above, is stacked on the surface below the first layer L11. The third layer L13 is composed of two insulating resins 160 and an insulating resin magnetic layer 144.

[0089] Insulating resin 160 covers the inductive wiring 120, the first dummy wiring 131, and the second dummy wiring 132 from the bottom. That is, the insulating resin 160 covers the entire lower surface of the conductive portion of the first layer L11. Viewed from above, the insulating resin 160 is shaped to cover a slightly larger area than the outer edges of the inductive wiring 120, the first dummy wiring 131, and the second dummy wiring 132. As a result, the insulating resin 160 is generally formed as a strip extending along the long side of the third layer L3, and two insulating resins 160 are arranged along the short side of the third layer L3. The insulating resin 160 is an insulating resin, and its insulating properties are higher than those of the inductive wiring 120.

[0090] The portion of the third layer L13 excluding the insulating resin 160 becomes the insulating resin magnetic layer 144. Similar to the inner magnetic circuit portion 141 and the outer magnetic circuit portion 142 described above, the insulating resin magnetic layer 144 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. Therefore, the insulating resin magnetic layer 144 is a magnetic material.

[0091] A fourth layer, L14, which is rectangular in plan view and has the same shape as the first layer, L11, is stacked on the lower surface of the third layer, L13. The fourth layer, L14, becomes the second magnetic layer 145. Therefore, the second magnetic layer 145 is stacked on the lower surface of the inductor wiring 120, which is opposite to the upper surface, i.e., the first surface, i.e., the second surface. The second magnetic layer 145 is composed of a mixture of resin and magnetic powders such as ferrite and metallic magnetic materials. That is, similar to the inner magnetic circuit portion 141 and the outer magnetic circuit portion 142 described above, the second magnetic layer 145 is a magnetic material. Here, the surface of the second magnetic layer 145 on which the inductor wiring 120 is disposed is designated as the main surface MF2 of the second magnetic layer 145. Furthermore, in this embodiment, the normal direction orthogonal to the main surface MF2 of the fourth layer, L14, i.e., the second magnetic layer 145, is the vertical direction, which is the same as the stacking direction of the four layers.

[0092] In the inductor component 110, a magnetic layer 140 is formed by an inner magnetic circuit portion 141, an outer magnetic circuit portion 142, a first magnetic layer 143, an insulating resin magnetic layer 144, and a second magnetic layer 145. The inner magnetic circuit portion 141, the outer magnetic circuit portion 142, the first magnetic layer 143, the insulating resin magnetic layer 144, and the second magnetic layer 145 are connected and surround the inductor wiring 120. In this way, the magnetic layer 140 forms a closed magnetic circuit with respect to the inductor wiring 120. Furthermore, although the inner magnetic circuit portion 141, the outer magnetic circuit portion 142, the first magnetic layer 143, the insulating resin magnetic layer 144, and the second magnetic layer 145 are shown separately, they are integrated as the magnetic layer 140.

[0093] like Figure 5As shown, the minimum distance DI between two inductor wirings 120 is the distance between the first pad 122 of one inductor wiring 120 and the second pad 123 of the other inductor wiring 120. The minimum distance DI is more than 20 times the average particle size of the magnetic powder contained in the inner magnetic circuit section 141. In the state of the inductor component 110, the average particle size of the magnetic powder is determined using an SEM (Scanning Electron Microscope) image of a cross-section passing through the center of the magnetic layer 40. Specifically, in an SEM image that can confirm the magnification of more than 15 magnetic powders, the area of ​​each magnetic powder is measured, and the equivalent circle diameter is calculated according to {4 / π×(area)}^(1 / 2), and the arithmetic mean of these is taken as the average particle size of the magnetic powder. In addition, in the raw material stage, in the raw material state of the metallic magnetic material, the average particle size of the magnetic powder is determined by laser diffraction and scattering method. The particle size corresponding to 50% of the cumulative value of the particle size distribution obtained by this laser diffraction and scattering method is taken as the average particle size of the magnetic powder.

[0094] The minimum distance DD between dummy wires connected to two inductive wires 120 is the distance between the first dummy wire 131 of one inductive wire 120 and the second dummy wire 132 of the other inductive wire 120. The minimum distance DD between dummy wires connected to two inductive wires 120 is greater than the minimum distance DI between the two inductive wires 120.

[0095] like Figure 6 As shown, the vertical dimension, i.e., the thickness, of the first layer L11 is 45 μm. Therefore, the vertical dimension, i.e., the inductor wiring thickness TI2, of the inductor wiring 120 is 45 μm. Thus, the inductor wiring thickness T12 is 40 μm or more and 55 μm or less. Furthermore, the vertical dimension, i.e., the dummy wiring thickness, of the first dummy wiring 131 and the second dummy wiring 132 is 45 μm, the same as the inductor wiring thickness TI2.

[0096] Here, as Figure 5As shown, the dimension of the wiring body 121 of the inductor wiring 120 in a cross-section perpendicular to its extending direction, in a direction orthogonal to the inductor wiring thickness TI2, is defined as the inductor wiring width WI2. In this case, in the inductor component 110, the inductor wiring width WI2 is greater than the inductor wiring thickness TI2, i.e., 45 μm. In this embodiment, the inductor wiring width WI2 is the arithmetic mean of the wiring widths at three points: the center position between the first end 121A and the second end 121B of the wiring body 121, a position offset by 100 μm from the center position towards the first end 121A, and a position offset by 100 μm from the center position towards the second end 121B. Furthermore, in this embodiment, the inductor wiring width WI2 of the wiring body 121 of the inductor wiring 120 is approximately constant. Furthermore, in this embodiment, the inductor wiring thickness TI2 is the arithmetic mean of the wiring thickness at three points: the center position between the first end 121A and the second end 121B of the wiring body 121, a position offset by 100 μm from the center position towards the first end 121A, and a position offset by 100 μm from the center position towards the second end 121B. In addition, in this embodiment, the inductor wiring thickness TI2 of the inductor wiring 120 is approximately constant. Furthermore, in the measurement of the inductor wiring width WI2 and the inductor wiring thickness TI2, the maximum value of the vertical dimension of the wiring thickness measurement section and the maximum value of the dimension of the wiring width measurement section in the direction orthogonal to the vertical direction are sufficient.

[0097] like Figure 5 As shown, the dimension of the first dummy wiring 131 in a cross-section perpendicular to its extension direction and orthogonal to the dummy wiring thickness is defined as the dummy wiring width WD2. In this case, in the inductor component 110, the dummy wiring width WD2 is smaller than the inductor wiring width WI2. Furthermore, in this embodiment, the width of the second dummy wiring 132 is the same as the width of the first dummy wiring 131, i.e., the dummy wiring width WD2. The dummy wiring width WD2 is defined as the maximum value of the width dimension of the surface of the first dummy wiring 131 exposed on the outer surface of the inductor component 110, orthogonal to the vertical direction. Furthermore, in this embodiment, the dummy wiring width WD2 is approximately constant in both the first dummy wiring 131 and the second dummy wiring 132.

[0098] like Figure 6As shown, the vertical dimension (thickness) of the second layer L12 is 50 μm. Furthermore, the vertical dimensions (thickness) of the first vertical wiring 151, the second vertical wiring 152, and the first magnetic layer 143 constituting the second layer L12 are all the same, 50 μm. Therefore, the vertical dimension (thickness TV2) of the first vertical wiring 151 and the second vertical wiring 152 is 50 μm. Also, the vertical dimension (thickness TM11) of the first magnetic layer 143 is 50 μm. That is, the first vertical wiring 151 and the second vertical wiring 152 penetrate the first magnetic layer 143 in the vertical direction.

[0099] The vertical dimension (thickness) of the insulating layer 170 covering the upper surface of the second layer L12 is 10 μm. Additionally, the vertical dimension (thickness) of the external terminal 180 covering the upper surface of the second layer L12 is approximately 11 μm. Therefore, the thickness of the external terminal 180 is slightly greater than the thickness of the insulating layer 170.

[0100] The vertical dimension, i.e., the thickness, of the third layer L13 is 10 μm. In addition, the vertical dimension, i.e., the thickness, of the insulating resin 160 and the insulating resin magnetic layer 144 constituting the third layer L13 is also the same, 10 μm.

[0101] The vertical dimension, or thickness, of the fourth layer L14 is 90 μm. Therefore, the vertical dimension, or thickness TM12, of the second magnetic layer 145 constituting the fourth layer L14 is 90 μm. As a result, the vertical dimension, or thickness TA2, of the inductor component 110, comprising the first layer L11 to the fourth layer L14, is 0.206 mm.

[0102] Here, comparing the thicknesses mentioned above, the thickness of the first magnetic layer TM11 is less than the thickness of the second magnetic layer TM12. Furthermore, the inductor wiring thickness TI2 is 0.9 times the vertical wiring thickness TV2, greater than 0.5 times the vertical wiring thickness TV2, but less than 1.5 times.

[0103] Next, the function and effects of the second embodiment described above will be explained. In addition to the effects of (1) to (5) of the first embodiment described above, the following effects are also achieved.

[0104] (6) According to the second embodiment described above, the number of turns in the inductor wiring 120 is less than 1.0 turn. Therefore, the DC resistance of the inductor wiring 120 can be reduced, allowing a relatively large current to flow. In addition, since the number of turns in the inductor wiring 120 is small, the volume of the inductor wiring 120 relative to the overall volume of the inductor component 110 can be reduced. Therefore, by relatively increasing the volume ratio of the magnetic layer 140, it is less likely to hinder the reduction of the inductance acquisition rate relative to the overall volume of the inductor component 110.

[0105] (7) According to the second embodiment described above, the inductor wiring thickness TI2 is 40 μm or more and 55 μm or less. Since the inductor wiring thickness TI2 is 55 μm or less, it helps to reduce the thickness of the inductor component 110. Furthermore, since the inductor wiring thickness TI2 is 40 μm or more, the DC resistance is not excessive.

[0106] (8) According to the second embodiment described above, the upper surface of the first magnetic layer 143 is covered by an insulating layer 170, and external terminals 180 are connected to the upper surfaces of the first vertical wiring 151 and the second vertical wiring 152. Therefore, short circuits between the external terminals 180 can be suppressed by the insulating layer 170.

[0107] (9) According to the second embodiment described above, the two inductor wirings 120 are disposed in the same layer of the first layer L11. Here, it is assumed that if the two inductor wirings 120 are disposed in different layers, the two inductor wirings 120 are arranged in the vertical direction. Compared with this case, in the second embodiment described above, since the two inductor wirings 120 are disposed in the same layer of the first layer L11, the increase in the vertical dimension of the inductor component 110 is suppressed.

[0108] (10) According to the second embodiment described above, the minimum distance DI between the two inductor wires 120 is more than 20 times the average particle size of the magnetic powder in the magnetic layer 140. It is assumed that if the minimum distance DI between the two inductor wires 120 is too small, the inductor wires 120 may short-circuit with each other via particles of the metallic magnetic material. According to the second embodiment described above, the minimum distance DI between the two inductor wires 120 is sufficiently far from the particle size of the magnetic powder. Therefore, short-circuiting between the two inductor wires 120 is easily prevented.

[0109] (11) The wiring body 121 is generally a straight line extending along the long side of the first layer L11 and arranged along the short side of the first layer L11, thereby making it easy to shorten the distance between the wiring bodies 121. According to the second embodiment described above, the minimum distance DI between two inductor wirings 120 is the distance between the first pad 122 connected to one inductor wiring 120 and the second pad 123 connected to the other inductor wiring 120. Therefore, the distance between the wiring bodies 121 of the inductor wirings 120 is greater than the minimum distance DI. By making the distance between the wiring bodies 121 greater than the distance between the pads, the distance between the wiring bodies 121 can be made correspondingly larger. Therefore, it is easy to suppress short circuits between the wiring bodies 121.

[0110] <Implementation Method of Manufacturing Inductor Components>

[0111] Hereinafter, embodiments of the manufacturing method of the inductor component will be described. Hereinafter, the manufacturing method of the inductor component 110 described in the second embodiment will be described.

[0112] like Figure 7 As shown, the first step is to prepare the base component. Specifically, a plate-shaped base component 210 is prepared. The base component 210 is made of ceramic. When viewed from above, the base component 210 has a quadrilateral shape, and the dimensions of each side are such that it can accommodate the inductor component 110. In the following description, the direction orthogonal to the surface direction of the base component 210 will be described as the up and down direction.

[0113] Next, as Figure 8 As shown, a dummy insulating layer 220 is coated on the entire upper surface of the substrate member 210. Next, in an area slightly larger than the area where the inductor wiring 120 is arranged when viewed from above, a pattern is etched onto the insulating resin 160, which functions as the insulating resin, using photolithography.

[0114] Next, a seed layer formation process is performed to form the seed layer 230. Specifically, a copper seed layer 230 is formed on the upper surface of the insulating resin 160 and the dummy insulating layer 220, i.e., the first surface, from the upper surface side of the substrate member 210 by sputtering. In addition, the seed layer 230 is shown in bold in the attached drawings.

[0115] Next, as Figure 9As shown, a first coating process is performed to form a first coated portion 240, which coats the portion of the upper surface of the seed layer 230 where the inductive wiring 120, the first dummy wiring 131, and the second dummy wiring 132 are not formed. Specifically, firstly, a photosensitive dry film resist is coated onto the entire upper surface of the seed layer 230. Next, the entire upper surface of the dummy insulating layer 220 and the upper surface of the outer edge of the area covered by the insulating resin 160 are cured by exposure. Subsequently, the uncured portions of the coated dry film resist are peeled off using a chemical solution. Thus, the cured portions of the coated dry film resist are formed as the first coated portion 240. On the other hand, the portions of the seed layer 230 that are not covered by the first coated portion 240 are exposed where the dry film resist has been removed by the chemical solution. The vertical dimension of the first covering portion 240, i.e., the thickness TC1 of the first covering portion, is... Figure 6 The inductor wiring thickness TI2 of the inductor component 110 shown is slightly larger. Furthermore, the photolithography in other processes is the same, therefore detailed descriptions are omitted.

[0116] Next, as Figure 10 As shown, an inductor wiring process is performed by electroplating to form inductor wiring 120, first dummy wiring 131, and second dummy wiring 132 on the upper surface of the insulating resin 160 that is not covered by the first covered portion 240. Specifically, electrolytic copper plating is performed, where copper grows on the upper surface of the insulating resin 160 in the portion exposed from the seed layer 230. This forms inductor wiring 120, first dummy wiring 131, and second dummy wiring 132. The vertical dimension of inductor wiring 120, i.e., its thickness TI2, is the same as the vertical dimension of first dummy wiring 131 and second dummy wiring 132, i.e., their dummy wiring thickness. Furthermore, the inductor wiring thickness TI2 is less than the thickness TC1 of the first covered portion. Additionally, the adjacent inductor components 110, separated by a cut-off line DL (described later), are connected to each other via first dummy wiring 131 and second dummy wiring 132. Figure 10 The diagram shows inductor wiring 120, but does not show the first dummy wiring 131 and the second dummy wiring 132.

[0117] Next, as Figure 11As shown, a second coating process is performed to form the second coated portion 250. The area where the second coated portion 250 is formed is the entire upper surface of the first coated portion 240, the entire upper surface of the first dummy wiring 131, the entire upper surface of the second dummy wiring 132, and the area on the upper surface of the inductor wiring 120 where the first vertical wiring 151 and the second vertical wiring 152 are not formed. Within this area, the second coated portion 250 is formed by photolithography using the same method as that used to form the first coated portion 240. Furthermore, the vertical dimension of the second coated portion 250, i.e., the thickness TC2 of the second coated portion, is the same as the thickness TC1 of the first coated portion.

[0118] Next, a vertical wiring process is performed to form the first vertical wiring 151 and the second vertical wiring 152. Specifically, the portion of the upper surface of the inductor wiring 120 not covered by the second coating portion 250 is formed by electrolytic copper plating to form the first vertical wiring 151 and the second vertical wiring 152. Furthermore, in the vertical wiring process, the upper end of the grown copper is set to a position slightly lower than the upper surface of the second coating portion 250. Specifically, the first vertical wiring 151 and the second vertical wiring 152 are formed such that the vertical dimension of the first vertical wiring 151 and the second vertical wiring 152 before cutting (described later), i.e., the vertical wiring thickness TV3 before cutting, is greater than 2 / 3 times but less than twice the inductor wiring thickness TI2. In this embodiment, the vertical wiring thickness TV3 before cutting is set to be the same as the inductor wiring thickness TI2.

[0119] Next, as Figure 12 As shown, a coating removal process is performed to remove the first coating portion 240 and the second coating portion 250. Specifically, parts of the first coating portion 240 and the second coating portion 250 are physically grasped, and the first coating portion 240 and the second coating portion 250 are separated from the base member 210 and peeled off.

[0120] Next, a seed layer etching process is performed to etch the seed layer 230. By etching the seed layer 230, the exposed seed layer 230 is removed. That is, the inductor wiring 120, the first dummy wiring 131, and the second dummy wiring 132 are formed by SAP (Semi-Additive Process).

[0121] Next, as Figure 13As shown, the first magnetic layer 143 is processed by laminating the first magnetic layer. Specifically, firstly, a resin containing the material of the magnetic layer 140, i.e., magnetic powder, is coated onto the upper surface of the substrate member 210. At this time, the upper surfaces of the first vertical wiring 151 and the second vertical wiring 152 are also coated with the resin containing magnetic powder. Next, the resin containing magnetic powder is cured by stamping, thereby forming the magnetic layer 140 on the upper surface of the substrate member 210. Thus, the first magnetic layer 143 is also formed on the upper surface of the inductive wiring 120.

[0122] Next, as Figure 14 As shown, the upper portion of the magnetic layer 140 is scraped until the upper surfaces of the first vertical wiring 151 and the second vertical wiring 152 are exposed. As a result, the vertical dimensions of the first vertical wiring 151 and the second vertical wiring 152 before cutting, i.e., the vertical wiring thickness TV3 before cutting, become a vertical wiring thickness TV2 that is smaller than the vertical dimensions of the copper grown in the vertical wiring process by scraping the upper end. Furthermore, although the inner magnetic circuit portion 141, the outer magnetic circuit portion 142, and the first magnetic layer 143 are integrally formed, the first layer L11 and the second layer L12 are shown separately in the accompanying drawings. Therefore, the inner magnetic circuit portion 141, the outer magnetic circuit portion 142, and the first magnetic layer 143 are also shown separately.

[0123] Next, as Figure 15 As shown, an insulating layer processing step is performed. Specifically, on the upper surface of the first magnetic layer 143, the upper surface of the first vertical wiring 151, and the upper surface of the second vertical wiring 152, where the external terminals 180 are not formed, a pattern is formed on the solder resist that functions as the insulating layer 170 by photolithography.

[0124] Next, as Figure 16 As shown, a base component cutting process is performed. Specifically, the base component 210 and the dummy insulating layer 220 are completely removed by cutting. In addition, as a result of completely cutting the dummy insulating layer 220, the lower part of the insulating resin 160 is also removed by partial cutting, but the inductor wiring 120 is not removed.

[0125] Next, as Figure 17As shown, the second magnetic layer 145 is processed by laminating it. Specifically, firstly, a resin containing the material of magnetic layer 140, i.e., magnetic powder, is coated onto the lower side of the substrate member 210. Next, the resin containing magnetic powder is cured by stamping, thereby forming the second magnetic layer 145 on the lower side of the substrate member 210. Here, the side of the second magnetic layer 145 where the inductive wiring 120 is disposed is designated as the main surface MF2 of the second magnetic layer 145. Furthermore, in this embodiment, the normal direction orthogonal to the main surface MF2 of the fourth layer L14, i.e., the second magnetic layer 145, is the vertical direction, and is the same as the direction orthogonal to the surface direction of the substrate member 210.

[0126] Next, the lower portion of the second magnetic layer 145 is scraped. For example, the lower portion of the second magnetic layer 145 is scraped so that the dimension from the upper surface of the outer terminal 180 to the lower surface of the second magnetic layer 145 becomes the desired value. In the second magnetic layer processing step, the second magnetic layer 145 is scraped so that the vertical dimension of the first magnetic layer 143, i.e., the thickness TM11 of the first magnetic layer, is smaller than the vertical dimension of the second magnetic layer 145, i.e., the thickness TM12 of the second magnetic layer.

[0127] Next, as Figure 18 As shown, an external terminal processing step is performed. Specifically, external terminals 180 are formed on the portions of the upper surfaces of the first magnetic layer 143, the first vertical wiring 151, and the second vertical wiring 152 that are not covered by the insulating layer 170. The external terminals 180 are formed by chemical plating for copper, nickel, and gold, respectively. Thus, a three-layer external terminal 180 is formed.

[0128] Next, as Figure 19 As shown, a single-piece processing step is performed. Specifically, single-piece processing is performed by cutting at the cutting line DL. As a result, the inductor component 110 of the second embodiment can be obtained. In addition, at this time, the first dummy wiring 131 and the second dummy wiring 132 contained in the cutting line DL are also cut, exposing the first dummy wiring 131 and the second dummy wiring 132 on the side of the inductor component 110.

[0129] Next, the function and effects of the above manufacturing method will be explained.

[0130] (12) According to the above manufacturing method, inductor wiring 120, first vertical wiring 151, and second vertical wiring 152 are formed using SAP. Therefore, the composition of inductor wiring 120, first vertical wiring 151, and second vertical wiring 152 consists of a copper content of 99 wt% or more and a sulfur content of 0.1 wt% or more and less than 1.0 wt%. Therefore, inductor wiring 120, first vertical wiring 151, and second vertical wiring can be formed through the same process, thus enabling relatively inexpensive fabrication. Furthermore, since it is a single process, the residual stress of copper is the same in each wiring, thereby improving the reliability of the connection between each wiring.

[0131] (13) According to the manufacturing method described above, the first dummy wiring 131 and the second dummy wiring 132 connect multiple inductor components 110. Therefore, when manufacturing multiple inductor components 110 at one time, before the monolithic fabrication process, they are at the same potential in the substrate state through the first dummy wiring 131 and the second dummy wiring 132. As a result, for example, in the substrate state, grounding is performed on one of the multiple inductor components 110, making it easier for current generated due to static electricity during processing to flow. In addition, for example, in the vertical wiring process, current flows only on one of the multiple inductor components 110, enabling copper growth.

[0132] (14) According to the manufacturing method described above, the entire lower surface of the inductor wiring 120 is covered with insulating resin 160, which serves as an insulating resin. Therefore, during the processing steps, plating growth on the lower side of the inductor wiring 120 can be suppressed. This is also the case in the first and second embodiments.

[0133] The above embodiments can be modified as follows. The embodiments and the following modifications can be combined and implemented within the scope of technical inconsistency.

[0134] In each embodiment of the inductor component described above, the structure, shape, and material of the inductor wiring are not particularly limited as long as the structure can impart inductance to the inductor component by generating magnetic flux in the magnetic layer when current flows. For example, the first and second pads may be omitted in the inductor wiring. Furthermore, in the first embodiment, the inductor wiring 20 may be a curve with less than 1.0 turn or a straight line with 0 turns. In the second embodiment, the inductor wiring 120 may be a curve with more than 1.0 turn. Additionally, in each embodiment, the inductor wiring 20 may be a zigzag shape.

[0135] • In each embodiment of the above-described inductor component, the thickness of the inductor wiring may be greater than or equal to the width of the inductor wiring.

[0136] • In each embodiment of the inductor component described above, the composition of the inductor wiring is not limited to the examples of the embodiments described above.

[0137] • In each embodiment of the above-described inductor component, the inductor wiring thickness is not limited to the examples of the above embodiments. For example, in the first embodiment, the inductor wiring thickness TI may be less than 40 μm, and in the second embodiment, the inductor wiring thickness TI2 may be greater than 55 μm.

[0138] In the various embodiments of the inductor component described above, the inductor wiring thickness may be greater than 0.5 times but less than 1.5 times the vertical wiring thickness, or the inductor wiring thickness may be equal to the vertical wiring thickness. In this case, in the manufacturing method illustrated above, the manufacturing conditions of the vertical wiring processing step may be changed so that the vertical wiring thickness TV3 before cutting is greater than the inductor wiring thickness TI2 by the amount of cutting.

[0139] In various embodiments of the inductor component described above, the inductor wiring and the first vertical wiring may be connected via other layers. For example, a conductive via may be added between the inductor wiring and the first vertical wiring. The same applies to the inductor wiring and the second vertical wiring.

[0140] In various embodiments of the inductor component described above, the outer surface of the inductor wiring, excluding the portion connected to the first vertical wiring and the second vertical wiring, may be covered with insulating resin. In this case, for example, during the manufacturing process, after covering the entire outer surface of the inductor wiring with insulating resin once, a through-hole is machined at the portion connecting the first vertical wiring and the second vertical wiring, and a conductive so-called via is formed in this hole. By forming the first vertical wiring and the second vertical wiring on the upper surface of this via, the inductor component can be manufactured.

[0141] In various embodiments of the inductor component described above, the third layer may be omitted. In this case, the lower surface of the inductor wiring is not covered by insulating resin and is in direct contact with the second magnetic layer. Furthermore, in this manufacturing method, when cutting the dummy insulating layer 220, all of the insulating resin 160 can be cut away.

[0142] In various embodiments of the inductor component described above, the inner magnetic circuit 41, outer magnetic circuit 42, first magnetic layer 43, insulating resin magnetic layer 44, and second magnetic layer 45 may not be integrated and may be independent, with boundaries present. Furthermore, although boundaries are shown in the drawings, the actual component may not have boundaries.

[0143] • In the second embodiment of the inductor described above, the construction of the external terminal 180 is not limited to the example of the second embodiment described above. For example, it may also be composed of a layer of copper only.

[0144] • In the second embodiment of the inductor component described above, the insulating layer 170 and the external terminal 180 may be omitted. Alternatively, in the first embodiment described above, a structure equivalent to the insulating layer 170 and external terminal 180 of the second embodiment may also be provided.

[0145] • In each embodiment of the above-described inductor component, the first dummy wiring and the second dummy wiring may also be omitted.

[0146] In various embodiments of the inductor component described above, the inductor wiring, the first dummy wiring, the second dummy wiring, the first vertical wiring, and the second vertical wiring may not be integrated but are independent and have boundaries. Furthermore, while boundaries are shown in the accompanying drawings, the actual device may not have boundaries.

[0147] In each embodiment of the inductor component described above, the number of inductor wires disposed in the same layer as the first layer is not limited to the examples of the above embodiments. For example, in the first embodiment, there may be two or more inductor wires 20 disposed in the first layer L1. In addition, in the second embodiment, there may be one or three or more inductor wires 120 disposed in the first layer L11.

[0148] In the second embodiment of the inductor component described above, the minimum distance DI between the two inductor traces 120 may not be the distance between the first pad 122 and the second pad 123. For example, the distance between the trace bodies 121 may also be the minimum distance between the two inductor traces 120.

[0149] In the second embodiment of the inductor component described above, the relationship between the minimum distance DI between the two inductor wires 120 and the average particle size of the magnetic layer 140 is not limited to the example of the second embodiment described above. Specifically, the minimum distance DI between the two inductor wires 120 may also be less than 20 times the average particle size of the magnetic layer 140.

[0150] In the second embodiment of the inductor component described above, the relationship between the minimum distance DI between the two inductor wires 120 and the minimum distance DD between the dummy wires connected to the two inductor wires 120 is not limited to the example of the second embodiment described above. Specifically, the minimum distance DD between the dummy wires connected to the two inductor wires 120 may also be less than or equal to the minimum distance between the two inductor wires 120.

[0151] • In each embodiment of the inductor component described above, the thickness of the inductor component is not limited to the examples of the above embodiments. The thickness of the inductor component may also be 0.300 mm or more.

[0152] • In each embodiment of the inductor component described above, the shape of the inductor component when viewed from above is not limited to the examples of the embodiments described above. For example, in the first embodiment, the inductor component 10 can be rectangular or circular when viewed from above. In this case, the shapes of the first layer L1 to the fourth layer L4 are also the same, appearing as rectangular or circular when viewed from above.

[0153] • In the embodiments of the above manufacturing method, the shape, size, material, etc. of the base member 210 are not limited to the manufacturing method illustrated above. In particular, since the thickness of the base member 210 does not affect the thickness TA2 of the manufactured inductor component, it can be processed to a thickness that is easy to handle appropriately.

[0154] • In the embodiments of the above manufacturing method, the method for forming the seed layer 230 is not limited to sputtering. For example, it can also be formed by metal film, vapor deposition, coating, etc.

[0155] In the embodiments of the above manufacturing method, the materials of the first coated portion 240 and the second coated portion 250 are not particularly limited. For example, organic insulating resins such as epoxy resins, phenolic resins, and polyimide resins may also be formed.

[0156] • In the embodiments of the above manufacturing method, the methods of the first coating step and the second coating step are not limited to the method of using a dry film resist. For example, the first coated portion 240 and the second coated portion 250 can also be formed by using a thin film.

[0157] • In the embodiments of the above manufacturing method, the method for inductor wiring processing is not limited to a semi-additive process. For example, it can also be a fully additive process, a subtractive process, or a coating process such as screen printing, dispensing, or inkjet printing.

[0158] In the embodiments of the above manufacturing method, the amount of scraping the upper end of the magnetic layer 140 in the first magnetic layer processing step can be appropriately adjusted. For example, if it is desired to set the thickness of the first magnetic layer TM11 and the thickness of the second magnetic layer TM12 to be larger, the amount of scraping the upper end of the magnetic layer 140 can be reduced.

[0159] In the embodiments of the above manufacturing method, the amount of scraping the lower end of the magnetic layer 140 during the second magnetic layer processing step can be appropriately adjusted. For example, if it is desired to set a larger thickness TM12 of the second magnetic layer, the amount of scraping the lower end of the magnetic layer 140 can be reduced.

[0160] • In the embodiments of the above manufacturing method, the manufactured inductor component is not limited to inductor component 110. For example, it can also be used in the manufacture of inductor component 10. In this case, the external terminal processing step and the insulation layer processing step are omitted.

Claims

1. An inductor component, characterized in that, have: Single-layer inductive wiring; A first magnetic layer is disposed on the first surface side of the inductive wiring; A second magnetic layer is stacked on the second side of the inductive wiring, opposite to the first side; as well as A vertical wiring is provided that penetrates the first magnetic layer and connects to the inductive wiring. When the direction orthogonal to the principal surface of the second magnetic layer is taken as the normal direction... The dimension of the first magnetic layer in the normal direction, i.e., the thickness of the first magnetic layer, is smaller than the dimension of the second magnetic layer in the normal direction, i.e., the thickness of the second magnetic layer. The dimension of the inductor wiring in the normal direction, i.e., the thickness of the inductor wiring, is greater than 0.5 times the dimension of the vertical wiring in the normal direction, i.e., the thickness of the vertical wiring, but less than 1.5 times the dimension of the vertical wiring in the normal direction, i.e., the thickness of the vertical wiring. The vertical wiring only penetrates the thinner first magnetic layer and is not disposed in the thicker second magnetic layer.

2. The inductor component according to claim 1, characterized in that, The inductor wiring has pads connected to the vertical wiring and wiring bodies connected to the pads. In a cross-section perpendicular to the extension direction of the wiring body, the thickness of the inductor wiring is less than the dimension of the wiring body in a direction orthogonal to the thickness of the inductor wiring, i.e., the width of the inductor wiring.

3. The inductor component according to claim 1 or 2, characterized in that, The inductor wiring contains at least 99 wt% copper and at least 0.1 wt% sulfur but less than 1.0 wt%.

4. The inductor component according to claim 1 or 2, characterized in that, The inductor wiring has less than 1.0 turn.

5. The inductor component according to claim 1 or 2, characterized in that, The thickness of the inductor wiring is greater than 40μm and less than 55μm.

6. The inductor component according to claim 1 or 2, characterized in that, The inductor wiring has pads connected to the vertical wiring and wiring bodies connected to the pads. A dummy wiring is provided on the same layer as the inductor wiring. The first end of the dummy wiring is connected to the inductive wiring. The second end of the dummy wiring is exposed on the outer surface of the inductor component. The dimension of the dummy wiring in the normal direction, i.e., the thickness of the dummy wiring, is equal to the thickness of the inductor wiring. In a cross section perpendicular to the extension direction of the dummy wiring, the dimension of the dummy wiring in the direction orthogonal to the thickness of the dummy wiring, i.e., the width of the dummy wiring, is smaller than the dimension of the wiring body in a cross section perpendicular to the extension direction of the wiring body in the direction orthogonal to the thickness of the inductor wiring, i.e., the width of the inductor wiring.

7. The inductor component according to claim 1 or 2, characterized in that, At least a portion of the outer surface of the inductive wiring is covered with an insulating resin that has a higher insulating property than the inductive wiring.

8. The inductor component according to claim 7, characterized in that, The insulating resin covers at least the surface of the inductive wiring on the side of the second magnetic layer in the normal direction.

9. The inductor component according to claim 1 or 2, characterized in that, The first side of the inductive wiring does not contact the vertical wiring and the first magnetic layer through other layers.

10. The inductor component according to claim 1 or 2, characterized in that, have: External terminals, which are connected to the opposite side of the vertical wiring to the inductor wiring; and An insulating layer that covers the side of the first magnetic layer opposite to the second magnetic layer and has higher insulation properties than the first magnetic layer.

11. The inductor component according to claim 1, characterized in that, The dimension of the inductor in the normal direction, i.e. the thickness of the inductor, is less than 0.300 mm.

12. A method for manufacturing an inductor component, comprising: The first coating process forms a partial first coating portion on the first surface of the coated insulating resin; In the inductor wiring process, an inductor wiring is formed on the portion of the first surface of the insulating resin that is not covered by the first covered portion using a plating method. The second coating process forms a second coated portion, which coats a portion of the surface of the first coated portion opposite to the insulating resin, i.e., the first surface, and a portion of the surface of the inductive wiring opposite to the insulating resin, i.e., the first surface. The vertical wiring process involves forming vertical wiring on the portion of the first surface of the insulating resin that is not covered by the second covered portion using a plating method. The coating removal process is performed after the vertical wiring processing process, removing the first coating and the second coating. The first magnetic layer processing step involves, after the coating removal step, stacking the first magnetic layer on the first side of the inductor wiring; and The second magnetic layer processing step involves stacking a second magnetic layer on the second side of the inductor wiring. The method for manufacturing the inductor component is characterized in that, When the direction orthogonal to the principal surface of the second magnetic layer is taken as the normal direction... In the vertical wiring process, the vertical wiring is formed such that the dimension of the vertical wiring in the normal direction, i.e., the thickness of the vertical wiring, is greater than 2 / 3 times the dimension of the inductor wiring in the normal direction, i.e., the thickness of the inductor wiring, but less than twice the dimension of the inductor wiring in the normal direction, i.e., the thickness of the inductor wiring. In the second magnetic layer processing step, the second magnetic layer is formed such that the thickness of the second magnetic layer is greater than the thickness of the first magnetic layer.

13. The method for manufacturing an inductor component according to claim 12, characterized in that, have: The seed layer formation process forms a seed layer before the first coating process; and The seed layer etching process is performed after the coating removal process, etching the seed layer.

14. The method for manufacturing an inductor component according to claim 12, characterized in that, In the first magnetic layer processing step, the first magnetic layer is scraped. In the second magnetic layer processing step, the second magnetic layer is scraped. The dimension of the normal direction of the first magnetic layer, i.e., the thickness of the first magnetic layer, is smaller than the dimension of the normal direction of the second magnetic layer, i.e., the thickness of the second magnetic layer.

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