Guiding device and wet cleaning apparatus

Abstract

The present disclosure provides a guide device and a wet cleaning device, the guide device is used for carrying a wafer, and comprises a support component having oppositely arranged first and second end faces, a first recess is arranged at the top of the support component, the first recess extends towards the bottom of the support component, the first recess extends from the first end face to the second end face, and the first recess is used for supporting the wafer; a first groove is arranged on the first end face, at least part of the first groove is arranged below the first recess, the side of the first groove extends to the first recess to communicate with the first recess, and the minimum width of the first groove is greater than or equal to the maximum width of the first recess. The guide device solves the problem of poor cleaning degree of the wafer after cleaning and drying in the prior art.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing, and more specifically, to a guiding device and a wet cleaning apparatus. Background Technology

[0002] After the wafer is cleaned in the water tank, the guiding mechanism carries the wafer into the drying chamber. Hot IPA (isopropyl alcohol) vapor is sprayed into the drying chamber. Since the temperature of the isopropyl alcohol vapor is higher than that of the wafer and DIW (deionized water), the hot isopropyl alcohol vapor will liquefy when it encounters the wafer. At this time, there is both deionized water and isopropyl alcohol on the wafer surface. Since the surface tension of deionized water is greater than that of isopropyl alcohol, the deionized water is more likely to form water droplets and detach from the wafer, so that an isopropyl alcohol film is formed on the wafer surface, thereby achieving the purpose of being replaced by isopropyl alcohol.

[0003] During the operation of the guiding mechanism, such as Figures 1 to 3 As shown, when the wafer 5, the guide device 1, and the liquid surface 7 surround each other, a very thin water film 8 will be formed. When the water film breaks and flows back when leaving the liquid surface, it will cause deionized water residue 4 to remain in the groove part 6 of the guide device. The surface tension of the deionized water at the edge of the wafer is relatively large in this part, and it is not easy to be replaced by isopropanol vapor and remains on the wafer. The wafer surface will then show a special pattern of contact points. There are more particles on the wafer, and the cleanliness is poor, which leads to continuous yield loss and time consumption for troubleshooting after the accident. Summary of the Invention

[0004] The main objective of this disclosure is to provide a guiding device and a wet cleaning equipment to solve the problem of poor cleanliness of wafers after cleaning and drying in the prior art.

[0005] To achieve the above objectives, according to one aspect of this disclosure, a guiding device is provided for carrying a wafer. The guiding device includes: a support member having a first end face and a second end face disposed opposite to each other; a first recess is provided on the top of the support member, the first recess extending toward the bottom of the support member; the first recess extends from the first end face to the second end face; the first recess is used to support the wafer; a first groove is provided on the first end face, at least a portion of the first groove is disposed below the first recess, and a side portion of the first groove extends to the first recess to communicate with the first recess; wherein the minimum width of the first groove is greater than or equal to the maximum width of the first recess.

[0006] Furthermore, the first recess has a contact surface for contacting the wafer; the minimum depth of the first groove is greater than or equal to the width of the contact surface in the direction from the first end face to the second end face.

[0007] Furthermore, the first groove includes a first groove portion and a second groove portion, the first groove portion is located above the second groove portion, the first end of the first groove portion is connected to the second groove portion, and the second end of the first groove portion extends to the first recess portion; in the direction from the first end of the first groove portion to the second end of the first groove portion, the width of the projection surface of the first groove portion on the second end face is equal.

[0008] Furthermore, the first recess is a V-shaped structure, and the side of the first groove extends to the two side walls of the V-shaped structure; the minimum width of the first groove is greater than or equal to the width of the top opening of the V-shaped structure.

[0009] Furthermore, the support component has multiple first recesses and multiple first grooves, with the multiple first recesses arranged at intervals; the multiple first grooves are provided in a one-to-one correspondence with the multiple first recesses, and each first groove is connected to the corresponding first recess.

[0010] Furthermore, the support component has a flow guide groove, which is disposed on the first end face and located below the first groove. The first end of the flow guide groove is connected to the first groove, and the second end of the flow guide groove extends toward the bottom of the support component.

[0011] Furthermore, the width of the guide channel gradually decreases from the first end to the second end of the guide channel.

[0012] Furthermore, the depth of the guide channel gradually decreases from the first end to the second end of the guide channel.

[0013] Furthermore, the guiding device includes multiple support components, which are arranged at intervals.

[0014] According to another aspect of this disclosure, a wet cleaning apparatus is provided, including a guiding device, a cleaning tank, and a drying chamber, wherein the guiding device is movably disposed between the cleaning tank and the drying chamber, and the guiding device is the aforementioned guiding device.

[0015] The guiding device disclosed herein includes a support member having a first end face and a second end face disposed opposite to each other. A first recess is provided on the top of the support member, extending towards the bottom of the support member and from the first end face to the second end face. When using the guiding device, the wafer is supported within the first recess. A first groove is provided on the first end face, at least a portion of which is located below the first recess. The side portion of the first groove extends to and communicates with the first recess. When the wafer is supported within the first recess, a water film is generated between the wafer and the guiding device and the liquid surface. The water film breaks down. Cracks can lead to backflow, which affects the cleanliness of the wafer. Therefore, a first groove is provided on the first end face, and the minimum width of the first groove is greater than or equal to the maximum width of the first recess. This ensures that the first recess is wide enough to suppress the formation of a water film, thereby preventing backflow caused by water film rupture at the source. This reduces the surface tension of the water at the wafer edge in the first recess, making it easier for IPA to replace it. This reduces the problem of more particles on the wafer caused by the adhesion of deionized water residue, improves the cleanliness of the wafer, and thus improves the wafer yield and reduces the time spent investigating the cause after an accident. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of this disclosure. The illustrative embodiments of this disclosure and their descriptions are used to explain this disclosure and do not constitute an undue limitation of this disclosure. In the drawings:

[0017] Figure 1 A schematic diagram of water film formation according to the background art of this disclosure is shown;

[0018] Figure 2 A schematic diagram of water film rupture according to the background art of this disclosure is shown;

[0019] Figure 3 This diagram illustrates a residual deionized water layer between the wafer and the trench according to the prior art of this disclosure.

[0020] Figure 4 A schematic diagram of the support component of the guide device according to the present disclosure is shown;

[0021] Figure 5 A cross-sectional view of the support component of the guide device according to the present disclosure is shown;

[0022] Figure 6 A schematic diagram of an embodiment of a guiding device according to the present disclosure is shown;

[0023] Figure 7 Experimental results of wafer surface cleanliness according to this disclosure are shown; and

[0024] Figure 8A schematic diagram of an embodiment of a wet cleaning apparatus according to the present disclosure is shown.

[0025] The above figures include the following reference numerals:

[0026] 10. Support component; 11. First end face; 12. Second end face; 20. First recess; 21. Side wall; 30. First groove; 31. First groove portion; 32. Second groove portion; 40. Guide channel;

[0027] 1. Guiding device; 2. Cleaning tank; 3. Drying chamber; 4. Deionized water residue; 5. Wafer; 6. Groove section; 7. Liquid surface; 8. Water film. Detailed Implementation

[0028] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0030] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0031] This disclosure provides a guiding device for carrying wafers; please refer to [reference needed]. Figures 4 to 6 The guiding device includes: a support member 10 having a first end face 11 and a second end face 12 disposed opposite to each other; a first recess 20 is provided on the top of the support member, and the first recess 20 extends toward the bottom of the support member 10; the first recess 20 extends from the first end face 11 to the second end face 12; the first recess 20 is used to support the wafer; a first groove 30 is provided on the first end face 11, at least a portion of the first groove 30 is disposed below the first recess 20, and the side portion of the first groove 30 extends to the first recess 20 to communicate with the first recess 20; wherein, the minimum width of the first groove 30 is greater than or equal to the maximum width of the first recess 20.

[0032] The guiding device disclosed herein includes a support member 10, which has a first end face 11 and a second end face 12 disposed opposite to each other. A first recess 20 is provided on the top of the support member 10, extending toward the bottom of the support member 10 and from the first end face 11 to the second end face 12. When using the guiding device, the wafer is supported within the first recess 20. A first groove 30 is provided on the first end face 11, at least a portion of which is disposed below the first recess 20. The side portion of the first groove 30 extends to the first recess 20 to communicate with it. When the wafer is supported within the first recess 20, it will interact with the guiding device. A water film is formed on the surface of the liquid. If the water film breaks, it will cause backflow, which will affect the cleanliness of the wafer. Therefore, a first groove 30 is provided on the first end face 11, and the minimum width of the first groove 30 is greater than or equal to the maximum width of the first recess 20. This ensures that the first recess 20 is wide enough to suppress the formation of the water film and prevent backflow caused by water film breakage. This reduces the surface tension of the water at the edge of the wafer in the first recess, making it easier for IPA to replace it. This reduces the problem of more particles on the wafer caused by the adhesion of deionized water residue, improves the cleanliness of the wafer, improves the wafer yield, and reduces the time spent investigating the cause after an accident.

[0033] Specifically, the first recess 20 has a first opening, a second opening, and a top opening. The top of the first opening is connected to the top opening, and the top of the second opening is also connected to the top opening. The top opening is located at the top of the support member. The first recess 20 extends towards the first end face 11 to form the first opening on the first end face 11, and extends to the second end face 12 to form the second opening on the second end face 12. In specific implementations, the first opening, the second opening, and the top opening are all designed to ensure that the wafer can be completely supported by the first recess 20. When the wafer is supported within the first recess 20, a portion of the wafer will be located between the first opening, the second opening, and the top opening. The design of the first opening, the second opening, and the top opening allows the wafer to enter and be supported within the first recess 20.

[0034] It should be noted that the minimum width of the first groove 30 is the width of the first groove 30 in... Figure 4 The minimum width in the left-right direction; the maximum width of the first recess 20 is the width of the first recess 20 in the left-right direction. Figure 4 The maximum width in the left and right directions.

[0035] Specifically, the first end face 11 and the second end face 12 of the support component 10 are arranged opposite to each other. The first end face 11 is located on the back of the second end face 12, and the second end face 12 is a vertical surface perpendicular to the bottom of the support component 10. The first end face 11 is composed of an upper inclined surface and a lower vertical surface. The projected area of ​​the inclined surface and the lower vertical surface of the first end face 11 on the second end face 12 is equal to the area of ​​the second end face 12. The upper inclined surface of the first end face 11 extends from the top of the support component 10 at a preset angle to the lower vertical surface of the first end face 11. The lower vertical surface of the first end face 11 is parallel to the second end face and is spaced a certain distance apart. In specific implementation, the first end face 11 adopts a combination design of inclined and vertical surfaces, which suppresses the formation of water film and facilitates flow, thereby avoiding the backflow of residual liquid when the water film breaks. This prevents the backflow of water after the water film breaks from affecting the quality of the wafer surface, resulting in poor wafer surface cleanliness, thereby improving wafer yield and reducing the time spent investigating the cause after an accident.

[0036] In this embodiment, the first recess 20 has a contact surface for contacting the wafer; the minimum depth of the first groove 30 is greater than or equal to the width of the contact surface in the direction from the first end face 11 to the second end face 12. Specifically, this setting of the minimum depth of the first groove 30 ensures that it has a sufficiently large depth, thereby suppressing the formation of a water film. This fundamentally solves the backflow phenomenon caused by water film rupture, further reducing the surface tension of the water at the wafer edge within the first recess, making it easier for IPA to displace, reducing the problem of excessive particles on the wafer caused by deionized water residue adhesion, improving the cleanliness of the wafer surface, thereby increasing wafer yield and reducing the time spent investigating the cause of accidents.

[0037] It should be noted that the depth direction of the first groove 30 is the same as the direction extending from the first end face 11 to the second end face 12, that is... Figure 5 The left and right directions in the middle; the minimum depth of the first groove 30 is the minimum value in the depth direction of the first groove 30.

[0038] Optionally, the minimum depth 'a' of the first groove 30 is greater than 10 mm and less than 30 mm. Optionally, the minimum depth 'a' of the first groove 30 is greater than 20 mm and less than 25 mm. It is understood that the minimum depth 'a' of the first groove 30 can be set according to actual needs, and this disclosure does not impose any restrictions on it.

[0039] In this embodiment, as Figure 5As shown, the first groove 30 includes a first groove portion 31 and a second groove portion 32. The first groove portion 31 is located above the second groove portion 32. The first end of the first groove portion 31 is connected to the second groove portion 32, and the second end of the first groove portion 31 extends to the first recess 20. The width of the projection surface of the first groove portion 31 on the second end face 12 is equal in the direction from the first end to the second end of the first groove portion 31. In specific implementations, the arrangement of the first groove 30 into the first groove portion 31 and the second groove portion 32, as well as the equal width arrangement of the first groove portion 31, avoids mutual interference between adjacent first grooves 30, thereby preventing interference when the wafer is supported on the support member 10.

[0040] It should be noted that the width of the projection surface of the first groove portion 31 on the second end face 12 is equal, and the width of the projection surface is... Figure 4 The width in the left and right directions.

[0041] Specifically, the second groove 32 has a first end and a second end along the direction from the top to the bottom of the support member 10. The first end of the second groove 32 is connected to the first groove 31, and the second end of the second groove 32 is located below the first end of the second groove 32. The width of the second groove 32 gradually decreases from the first end to the second end. In specific implementation, because the width of the second groove 32 gradually decreases, residual liquid can be guided to the bottom of the second groove 32 and then enter the guide groove 40, avoiding backflow of residual liquid after the water film breaks. This prevents the backflow of water after the water film breaks from affecting the quality of the wafer surface, resulting in poor wafer surface cleanliness, thereby improving wafer yield and reducing the time spent investigating the cause after an accident.

[0042] In this embodiment, as Figure 5 As shown, the first recess 20 has a V-shaped structure, and the side of the first groove 30 extends to the two sidewalls 21 of the V-shaped structure; the minimum width of the first groove 30 is greater than or equal to the width of the top opening of the V-shaped structure.

[0043] In specific implementation, the first recess 20 has a V-shaped structure, with the top of the first recess 20 being the part with the largest V-shaped opening. The V-shape of the first recess 20 extends downward along the two side walls 21, and the two side walls 21 converge from the top opening of the first recess 20 to the bottom of the V-shape to form the first recess 20. In this way, the V-shaped design of the first recess 20 allows the wafer to be stably supported by the first recess 20. Furthermore, the minimum width of the first groove 30 is greater than or equal to the width of the top opening of the V-shaped structure, which ensures that a larger width of the first groove 30 is provided, thereby inhibiting the formation of water film and fundamentally preventing the phenomenon of backflow caused by water film rupture. This reduces the surface tension of water at the edge of the wafer in the first recess, making it easier for IPA to replace it, reducing the problem of more particles on the wafer caused by the adhesion of deionized water residue, improving the cleanliness of the wafer, thereby improving the wafer yield, and reducing the time spent investigating the cause after an accident.

[0044] In this embodiment, the support member 10 has a plurality of first recesses 20 and a plurality of first grooves 30, with the plurality of first recesses 20 arranged at intervals; the plurality of first grooves 30 are provided in a one-to-one correspondence with the plurality of first recesses 20, and each first groove 30 is connected to the corresponding first recess 20. In specific implementation, the support member 10 has a plurality of first recesses 20 and a plurality of first grooves 30 for supporting multiple wafers, which greatly improves the practicality and efficiency of the support member 10 of this application. When using the support member of this application, a large number of wafers can be processed.

[0045] Specifically, multiple first recesses 20 and multiple first grooves 30 are arranged at intervals along the horizontal direction on the support member 10 and are configured in a one-to-one correspondence. This arrangement ensures that multiple wafers are arranged in an orderly manner, thereby enabling the support member 10 to support a larger number of wafers.

[0046] In this embodiment, the support component 10 has a flow guide groove 40, which is disposed on the first end face 11 and located below the first groove 30. The first end of the flow guide groove 40 is connected to the first groove 30, and the second end of the flow guide groove 40 extends toward the bottom of the support component 10. In specific implementation, the flow guide groove 40 is located below the first groove 30. After the water film breaks, the water flows out along the flow guide groove 40 and will not flow back to the first recess 20 and adhere to the wafer surface. This prevents the backflow of water after the water film breaks from affecting the quality of the wafer surface, causing poor wafer surface cleanliness, thereby improving wafer yield and reducing the time spent investigating the cause after an accident.

[0047] Specifically, the top of the flow guide trough 40 has an opening, the width direction of which is the same as the width direction of the first groove 30, and the width of the opening of the flow guide trough 40 is smaller than the width of the first groove 30. The opening of the flow guide trough 40 is connected to the bottom of the second groove portion 32 of the first groove 30. When the water film breaks, water flows from the bottom of the second groove portion 32 of the first groove 30 to the opening of the flow guide trough 40 and flows into the flow guide trough 40 along the opening. The width of the opening of the flow guide trough 40 is smaller than the width of the first groove 30 to facilitate flow guidance and prevent water from flowing back into the first recess 20 when the water film breaks. This would prevent the wafer supported in the first recess 20 from being affected by the backflowing water, reducing the quality of the wafer surface and causing poor wafer cleanliness. This, in turn, improves the wafer yield and reduces the time spent investigating the cause after an accident.

[0048] In this embodiment, the width of the guide channel 40 gradually decreases from the first end to the second end of the guide channel 40.

[0049] In this embodiment, the depth of the guide channel 40 gradually decreases from the first end to the second end of the guide channel 40.

[0050] Specifically, the width direction of the guide groove 40 is the same as the width direction of the first groove 30, that is... Figure 4 The left and right directions of the flow guide groove 40 are the same as the depth direction of the first groove 30, that is... Figure 5 The flow channel 40 is located in the left and right directions; the first end of the flow channel 40 is located at the top of the flow channel 40 and has an opening at the first end, and the second end of the flow channel 40 is located at the bottom of the flow channel 40. From the opening at the first end of the flow channel 40 to the second end of the flow channel 40, the width and depth gradually decrease, and the flow channel 40 eventually forms a V shape. In specific implementation, the width and depth of the guide channel 40 gradually decrease from the first end to the second end of the guide channel 40 to facilitate the flow of water after the water film breaks to the external space. The water after the water film breaks flows from the second groove portion 32 of the first groove 30 to the opening of the first end of the guide channel 40, then flows from the opening of the first end of the guide channel 40 to the second end of the guide channel 40, and finally exits the guide channel 40 from the second end of the V-shaped bottom and is discharged into the external space. This structural design of the guide channel 40 prevents the water after the water film breaks from flowing from the second end of the guide channel 40, which has a smaller width and depth, to the first end, which has a larger width and depth. This also prevents water from flowing back from the first end of the guide channel 40 to the first groove 30 and the first recess portion 20 when the water film breaks, which would affect the cleanliness of the wafer surface, thereby improving the wafer yield and reducing the time spent investigating the cause after an accident.

[0051] In this embodiment, the guiding device includes a plurality of support components 10, which are arranged at intervals. The arrangement of the plurality of support components 10 in the guiding device provides stable support for the wafer.

[0052] In specific implementation, such as Figure 7 As shown, a and c are the initial particle distribution diagrams of wafer 5; b is the particle distribution diagram of wafer 5 in a after it has been cleaned and dried using a guide device in the prior art; d is the particle distribution diagram of wafer 5 in c after it has been cleaned and dried using the guide device of this application. Analyzing b and d, there are more particles at point A in b, that is, there are more particles on the wafer located in the groove 6 of the guide device; while there are fewer particles at the part of the wafer in d corresponding to point A in b. It can be seen that the wafer cleaned and dried using the guide device of this application has fewer particles at the contact position with the first recess 20, and the cleanliness is better.

[0053] The main improvements of this application include: increasing the space of the inner inclined side to suppress the formation of water film, thereby fundamentally solving the backflow effect caused by the rupture of water film; wherein, the space of the inner inclined side is a part of the space inside the first groove 30 mentioned above, and the space formed between the wafer and the first groove 30 when the wafer is supported on the first recessed part 20 is the inner inclined space; and adding an anti-backflow trench to prevent water from flowing back to the first recessed part 20 when the water film ruptures; wherein, the anti-backflow trench is a guide groove 40.

[0054] This disclosure also provides a wet cleaning device; please refer to [reference needed]. Figure 8 The system includes a guide device 1, a cleaning tank 2, and a drying chamber 3. The guide device 1 is movably disposed between the cleaning tank 2 and the drying chamber 3. The guide device 1 is the guide device in the above embodiment. In specific implementation, the wet cleaning equipment including the guide device 1, the cleaning tank 2, and the drying chamber 3 solves the technical problem of poor cleanliness of wafers after cleaning and drying.

[0055] Specifically, the drying chamber 3 is located above the cleaning tank 2 and is connected to the cleaning tank 2. The guide device 1 is movably arranged between the cleaning tank 2 and the drying chamber 3. During the cleaning and drying process of the wafer, the guide device 1 is located inside the cleaning tank 2, and the guide device 1 carries the wafer so that the wafer can be cleaned in the cleaning tank 2. After the wafer cleaning is completed, the guide device 1 moves upward to the drying chamber 3 at a set speed so that the wafer can be dried in the drying chamber 3. When the guide device 1 carries the wafer away from the cleaning tank 2, the water film between the wafer, the guide device 1, and the liquid surface breaks, and water droplets flow to the liquid surface and enter the cleaning tank 2. It should be noted that both the guide device 1 and the wafer are dried in the drying chamber 3. It can be seen that the guide device 1 plays a role in carrying the wafer, the cleaning tank 2 plays a role in cleaning, and the drying chamber 3 plays a role in drying the guide device 1 and the cleaning tank 2.

[0056] As can be seen from the above description, the embodiments of this disclosure achieve the following technical effects:

[0057] The guiding device disclosed herein includes a support member 10, which has a first end face 11 and a second end face 12 disposed opposite to each other. A first recess 20 is provided on the top of the support member 10, extending toward the bottom of the support member 10 and from the first end face 11 to the second end face 12. When using the guiding device, the wafer is supported within the first recess 20. A first groove 30 is provided on the first end face 11, at least a portion of which is disposed below the first recess 20. The side portion of the first groove 30 extends to the first recess 20 to communicate with it. When the wafer is supported within the first recess 20, it will interact with the guiding device. A water film is formed on the surface of the liquid. If the water film breaks, it will cause backflow, which will affect the cleanliness of the wafer. Therefore, a first groove 30 is provided on the first end face 11, and the minimum width of the first groove 30 is greater than or equal to the maximum width of the first recess 20. This ensures that the first recess 20 is wide enough to suppress the formation of the water film and prevent backflow caused by water film breakage. This reduces the surface tension of the water at the edge of the wafer in the first recess, making it easier for IPA to replace it. This reduces the problem of more particles on the wafer caused by the adhesion of deionized water residue, improves the cleanliness of the wafer, improves the wafer yield, and reduces the time spent investigating the cause after an accident.

[0058] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0059] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0060] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A guiding device for carrying a wafer, characterized in that, The guiding device includes: A support member (10) has a first end face (11) and a second end face (12) disposed opposite to each other. A first recess (20) is provided on the top of the support member, and the first recess (20) extends toward the bottom of the support member (10). The first recess (20) extends from the first end face (11) to the second end face (12). The first recess (20) is used to support the wafer. A first groove (30) is provided on the first end face (11), at least a portion of the first groove (30) is provided below the first recess (20), and the side of the first groove (30) extends to the first recess (20) to communicate with the first recess (20). Wherein, the minimum width of the first groove (30) is greater than or equal to the maximum width of the first recess (20).

2. The guiding device according to claim 1, characterized in that, The first recess (20) has a contact surface for contacting the wafer; the minimum depth of the first groove (30) is greater than or equal to the width of the contact surface in the direction from the first end face (11) to the second end face (12).

3. The guiding device according to claim 1, characterized in that, The first groove (30) includes a first groove portion (31) and a second groove portion (32). The first groove portion (31) is located above the second groove portion (32). The first end of the first groove portion (31) is connected to the second groove portion (32). The second end of the first groove portion (31) extends to the first recess (20). In the direction from the first end of the first groove portion (31) to the second end of the first groove portion (31), the width of the projection surface of the first groove portion (31) on the second end face (12) is equal.

4. The guiding device according to claim 1, characterized in that, The first recess (20) is a V-shaped structure, and the side of the first groove (30) extends to the two sidewalls (21) of the V-shaped structure; the minimum width of the first groove (30) is greater than or equal to the width of the top opening of the V-shaped structure.

5. The guiding device according to any one of claims 1 to 4, characterized in that, The support member (10) has a plurality of first recesses (20) and a plurality of first grooves (30), the plurality of first recesses (20) being arranged at intervals; the plurality of first grooves (30) being provided in a one-to-one correspondence with the plurality of first recesses (20), and each first groove (30) being connected to the corresponding first recess (20).

6. The guiding device according to any one of claims 1 to 4, characterized in that, The support member (10) has a flow guide groove (40), which is disposed on the first end face (11) and located below the first groove (30). The first end of the flow guide groove (40) is connected to the first groove (30), and the second end of the flow guide groove (40) extends toward the bottom of the support member (10).

7. The guiding device according to claim 6, characterized in that, The width of the guide groove (40) gradually decreases from the first end to the second end of the guide groove (40).

8. The guiding device according to claim 6, characterized in that, The depth of the guide groove (40) gradually decreases from the first end to the second end of the guide groove (40).

9. The guiding device according to any one of claims 1 to 4, characterized in that, The guiding device includes a plurality of the support components (10), which are arranged at intervals.

10. A wet cleaning apparatus, comprising a guiding device (1), a cleaning tank (2), and a drying chamber (3), wherein the guiding device (1) is movably disposed between the cleaning tank (2) and the drying chamber (3), characterized in that, The guiding device (1) is the guiding device according to any one of claims 1 to 9.

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