A method and apparatus for manufacturing an LED and an LED display

Abstract

The application discloses a preparation method and device of an LED and an LED display, wherein the LED comprises two opposite surfaces, one of which is a light emitting surface; a conductive layer is arranged on the light emitting surface; the LED further comprises a first electrode group arranged on the other surface opposite to the light emitting surface. By arranging the conductive layer on the light emitting surface of the LED, short circuit current can be provided to the LED, the conductive layer generates heat, and then the solder on the LED is melted, so that the LED can be welded or removed. Based on this, the application can provide consistent pickup and release force to the LED, overcome the problem of poor push-pull force after assembly, help to ensure the yield of the LED display, and reduce the repair difficulty.

Description

Technical Field

[0001] This invention relates to the field of LED technology, and in particular to a method and apparatus for manufacturing an LED and an LED display. Background Technology

[0002] With the advancement of display technology, the shortcomings of LCD (Liquid Crystal Display), such as low contrast, low color gamut, and low response speed, as well as the disadvantages of OLED (Organic Light Emitting Display), such as screen burn-in, heavy graininess, color distortion, and poor light comfort, have gradually become prominent, becoming insurmountable technical bottlenecks. Micro LED display technology, as the next-generation display technology, has the advantages of high contrast, high color gamut, high response speed, ultra-high resolution, and long lifespan. It combines the advantages of LCD and OLED while avoiding the aforementioned disadvantages. In addition, Micro LED also has the advantages of flexible display and low energy consumption. Therefore, Micro LED display technology is hailed as the ultimate display technology.

[0003] Fabricating Micro LED displays requires transferring millions of micrometer-sized LEDs onto a backplane, a process known as mass transfer. Several methods exist for mass transfer, including electrostatic transfer, van der Waals transfer, magnetic transfer, self-aligned roller transfer, self-assembly transfer, and laser transfer. However, each has its advantages and disadvantages: for example, van der Waals transfer struggles to achieve consistent pick-up and release; and self-assembly transfer results in poor push-pull force on the assembled Micro LEDs, making repair difficult. Therefore, current Micro LED displays have low yield rates and are difficult to repair. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides a method and apparatus for manufacturing LEDs and LED displays, which solves the problems of poor transfer consistency and poor push-pull force of LEDs in the prior art, resulting in low yield and difficulty in repair of LED displays.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] An LED includes two opposing surfaces, one of which is a light-emitting surface, and a conductive layer is disposed on the light-emitting surface.

[0007] The LED further includes a first electrode group, an n-type layer, a light-emitting layer, and a p-type layer, wherein the first electrode group is disposed on the side opposite to the light-emitting surface.

[0008] Optionally, the conductive layer is a transparent layer with high impedance; the conductive layer is made of conductive oxides such as ITO, BZO, or AZO.

[0009] Optionally, the conductive layer is grid-shaped with a hollow area ratio greater than 80%, and has high impedance; the conductive layer is branch-shaped, and has high impedance; the conductive layer is an ultra-thin layer, and has high impedance; the conductive layer is made of metal, such as tungsten or molybdenum.

[0010] The light-emitting layer is located between the n-type layer and the p-type layer; an electron blocking layer is provided between the light-emitting layer and the p-type layer; a reflective layer is also provided on the side of the p-type layer away from the light-emitting layer.

[0011] Optionally, a substrate is provided between the conductive layer and the n-type layer, and a buffer layer and an intrinsic layer are provided between the substrate and the n-type layer.

[0012] Optionally, the substrate is sapphire or silicon carbide.

[0013] The n-type layer is n-type gallium nitride; the light-emitting layer is InGaN / GaN multiple quantum well; the p-type layer is p-type gallium nitride; the reflective layer is a distributed Bragg reflection layer (DBR), which is composed of multiple layers of materials such as SiO2 / Ta2O5.

[0014] The present invention also provides a method for manufacturing an LED display, for welding a transferred LED array, the LED array comprising a plurality of LEDs, wherein the LEDs are LEDs as described in any of the preceding claims;

[0015] The method for manufacturing the LED display includes:

[0016] A first substrate is provided, the first substrate having a first electrode array, the first electrode array including a plurality of second electrode groups corresponding one-to-one with the first electrode group, the first substrate being used to form an LED array by connecting the plurality of second electrode groups with the first electrode groups on a plurality of LEDs;

[0017] A short-circuit current is provided to the conductive layer on the plurality of LEDs, causing the conductive layer to heat up until the solder on the first electrode group and / or the second electrode group melts;

[0018] The short-circuit current is cut off, and the solder cools down.

[0019] Optionally, the method for manufacturing the LED display further includes:

[0020] A second substrate is provided, the second substrate having a second electrode array, the second electrode array including a plurality of third electrode groups corresponding one-to-one with the plurality of LEDs;

[0021] Providing a short-circuit current to the conductive layer on the LED includes:

[0022] The second substrate is covered on the LED array, so that the plurality of third electrode groups are shorted one by one to the conductive layer on the plurality of LEDs;

[0023] Power is applied to the second substrate.

[0024] Optionally, the second substrate is further provided with a plurality of picking mechanisms for removing the LEDs. When the second substrate covers the LED array, the picking mechanisms are respectively arranged on the plurality of LEDs.

[0025] Optionally, when the first substrate and the LED are successfully soldered, there is a first fixing force between the first substrate and the LED; when the soldering of the first substrate and the LED is unsuccessful, there is a second fixing force between the first substrate and the LED, the second fixing force being less than the first fixing force.

[0026] The magnitude of the force exerted by the picking mechanism on the LED is between the first fixing force and the second fixing force.

[0027] Alternatively, the second fixing force can be further reduced by energizing the third electrode of the second electrode array on the second substrate corresponding to the unsuccessfully soldered LED, thereby heating the conductive layer of the unsuccessfully soldered LED and melting the solder corresponding to the unsuccessfully soldered LED.

[0028] Optionally, the pickup mechanism is a vacuum suction mechanism.

[0029] Optionally, the method for manufacturing the LED display further includes:

[0030] Provide the substrate to be replaced.

[0031] A supplementary LED is placed at the vacancy position on the substrate to be supplemented.

[0032] A short-circuit current is provided to the conductive layer of the supplementary LED, causing the conductive layer to heat up until the solder on the electrode group and / or the second electrode group of the supplementary LED melts.

[0033] The present invention also provides an apparatus for manufacturing an LED display, which is applied to the LED as described in any of the preceding claims, for implementing the method for manufacturing an LED display as described in any of the preceding claims;

[0034] The preparation apparatus includes:

[0035] A first substrate has a first electrode array, the first electrode array including a plurality of second electrode groups corresponding one-to-one with the first electrode group, the first substrate being used to form an LED array by connecting the plurality of second electrode groups with the first electrode groups on the plurality of LEDs;

[0036] Welding mechanism, used for:

[0037] A short-circuit current is provided to the conductive layer on the plurality of LEDs, causing the conductive layer to heat up until the solder on the first electrode group and / or the second electrode group melts;

[0038] The LED is then soldered or removed.

[0039] Optionally, the welding mechanism includes a second substrate, on which a second electrode array is provided, and the second electrode array includes a plurality of third electrode groups corresponding one-to-one with the plurality of LEDs;

[0040] The second substrate is used to cover the LED array, so that the multiple third electrode groups are short-circuited one by one to the conductive layers on the multiple LEDs; when the second substrate is energized, it provides a short-circuit current to the conductive layers on the LEDs.

[0041] Optionally, the second substrate is further provided with a plurality of picking mechanisms for removing the LEDs. When the second substrate covers the LED array, the picking mechanisms act on the plurality of LEDs in a one-to-one correspondence.

[0042] When the first substrate and the LED are successfully bonded, there is a first fixing force between the first substrate and the LED; when the bonding between the first substrate and the LED is unsuccessful, there is a second fixing force between the first substrate and the LED, and the second fixing force is less than the first fixing force.

[0043] The magnitude of the force exerted by the picking mechanism on the LED is between the first fixing force and the second fixing force;

[0044] Optionally, the pickup mechanism is a vacuum suction mechanism.

[0045] Compared with the prior art, the present invention has the following beneficial effects:

[0046] This invention provides a method and apparatus for manufacturing LEDs and LED displays. By providing a conductive layer on the light-emitting surface of the LED, a short-circuit current can be supplied to the LED, causing the conductive layer to heat up and melt the solder on the LED, thereby enabling soldering or removal operations on the LED. Based on this, this invention can provide consistent pick-up and release forces to the LED, overcoming the problem of inconsistent push-pull forces after assembly, which helps ensure the yield rate of LED displays and reduces the difficulty of repair. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 A schematic diagram of an LED structure provided by the present invention;

[0049] Figure 2 A flowchart illustrating a method for manufacturing an LED display provided by the present invention;

[0050] Figure 3 This is another flowchart of a method for manufacturing an LED display provided by the present invention;

[0051] Figure 4 A schematic diagram illustrating the application principle of a method for manufacturing an LED display provided by this invention;

[0052] Figure 5 Another application schematic diagram of the LED display manufacturing method provided by the present invention;

[0053] Figure 6 This is another flowchart illustrating a method for manufacturing an LED display provided by the present invention.

[0054] In the above figure: 100, LED; 101, substrate; 102, n-type layer; 103, light-emitting layer; 104, p-type layer; 105, reflective layer; 1061, p-electrode; 1062, n-electrode; 201, conductive layer; 301, first substrate; 3021, electrode; 3022, electrode; 401, second substrate; 4021, electrode C; 4022, electrode D; 403, pickup mechanism. Detailed Implementation

[0055] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0056] In the description of this invention, it should be understood that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component present simultaneously. When a component is considered to be "set" on another component, it can be directly set on the other component or there may be an intermediate component present simultaneously.

[0057] Furthermore, terms such as “long,” “short,” “inner,” and “outer” indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings. They are used only for the purpose of describing the present invention and are not intended to indicate or imply that the device or component referred to must have this specific orientation or operate in a specific orientational configuration. Therefore, they should not be construed as limitations of the present invention.

[0058] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0059] Example 1

[0060] Please refer to Figure 1 The present invention provides an LED 100, including a light-emitting layer 103 and a first electrode group, and further including an n-type layer 102, a light-emitting layer 103, a p-type layer 104, and a reflective layer 105; the first electrode group includes a p electrode 1061 and an n electrode 1062.

[0061] The LED100 has a conductive layer 201 on its light-emitting surface. It can be understood that the LED100 has two opposing surfaces, one of which is the light-emitting surface, and the first electrode group is disposed on the other side opposite to the light-emitting surface.

[0062] Specifically, the conductive layer 201 has a predetermined impedance value. In this embodiment, the impedance value of the conductive layer is 40±4 Ohm. When the conductive layer 201 is within this range, it can effectively generate heat.

[0063] In one embodiment of this invention, the conductive layer 201 is grid-shaped, and the perforated area of ​​the conductive layer is greater than 80%, which can both distribute the generated heat evenly and achieve the purpose of light transmission.

[0064] In another embodiment of this invention, the conductive layer 201 is branched, which can both distribute the generated heat evenly and achieve the purpose of light transmission.

[0065] In another embodiment of this example, the conductive layer is an ultra-thin layer, which allows for better light transmission.

[0066] In this embodiment, the conductive layer 201 is made of metal, such as tungsten or molybdenum; in addition, the conductive layer 201 can also be made of conductive oxide, such as conductive oxides of ITO, BZO or AZO.

[0067] In this embodiment, by providing a conductive layer 201 on the light-emitting surface of the LED, a short-circuit current can be provided to the LED, causing the conductive layer 201 to heat up, thereby melting the solder on the LED, enabling soldering or removal operations on the LED. Based on this, the embodiment of the present invention can provide consistent pick-up and release force to the LED, overcoming the problem of poor push-pull force after assembly, which helps to ensure the yield rate of LED displays and reduce the difficulty of repair.

[0068] In order not to affect the light-emitting effect of the LED, the conductive layer 201 is a transparent layer with a light transmittance of more than 80%.

[0069] Furthermore, the light-emitting layer 103 is located between the n-type layer 102 and the p-type layer 104; an electron blocking layer is provided between the light-emitting layer 103 and the p-type layer 104, and a substrate 101 is provided between the conductive layer 201 and the n-type layer 102, that is, the conductive layer 201 is located on the substrate 101; a buffer layer and an intrinsic layer are provided between the substrate 101 and the n-type layer 102; and the reflective layer 105 is located on the side of the p-type layer 104 away from the light-emitting layer 103.

[0070] In this embodiment, the substrate 101 is sapphire or silicon carbide; the n-type layer 102 is n-type gallium nitride; the light-emitting layer 103 is InGaN / GaN multiple quantum well; the p-type layer 104 is p-type gallium nitride; and the reflective layer 105 is a distributed Bragg reflection layer (DBR), which is composed of multiple layers of materials such as SiO2 / Ta2O5.

[0071] Example 2

[0072] Based on the foregoing embodiments, this invention provides a method for manufacturing an LED display, used for welding a transferred LED array; wherein the LED array includes a plurality of LEDs 100 as described above.

[0073] Please refer to Figure 2 In this embodiment, the method for manufacturing the LED display includes:

[0074] S11. A first substrate 301 is provided, the first substrate 301 having a first electrode array.

[0075] The first electrode array includes multiple second electrode groups that correspond one-to-one with the first electrode group. Each second electrode group includes a positive and a negative electrode composed of electrode 3021 and electrode 3022. The first substrate 301 is used to form an LED array by connecting the multiple second electrode groups to the first electrode groups on multiple LEDs 100.

[0076] S12. A short-circuit current is provided to the conductive layer 201 on the multiple LEDs 100 to heat up the conductive layer 201 until the solder on the first electrode group and / or the second electrode group melts.

[0077] S13. Cut off the short-circuit current and allow the solder to cool.

[0078] Please refer to the reference. Figure 3 , Figure 4 Furthermore, in this embodiment, step S12 includes:

[0079] S121. A second substrate 401 is provided, and a second electrode array is provided on the second substrate 401.

[0080] The second electrode array includes multiple third electrode groups corresponding to the multiple LEDs, and the third electrode groups include positive and negative electrodes composed of electrodes 4021 and 4022.

[0081] S122. Cover the LED array with the second substrate 401, so that the multiple third electrode groups are short-circuited one by one to the conductive layer 201 on the multiple LEDs 100.

[0082] S123, Power on the second substrate 401.

[0083] In this embodiment, by short-circuiting the third electrode group one by one with the conductive layer 201, when the second substrate 401 is powered on, a short-circuit current can be provided to the conductive layer 201 of the multiple LEDs 100, causing the conductive layer 201 to heat up. The heat is transferred to the first electrode group of the LEDs 100, thereby ultimately melting the solder on the first electrode group and / or the second electrode group.

[0084] It is understandable that, in the state of molten solder, a soldering operation can be performed on the first substrate 301 and the LED 100, such as cutting off the current to the second substrate 401 and cooling the molten solder to fix the LED 100 on the first substrate 301; or, in the state of molten solder, a removal operation can be performed on the LED 100 on the first substrate 301, such as applying a force away from the first substrate 301 to the LED 100 so that the LED 100 can detach from the first substrate 301 if the conditions are met, thereby achieving the purpose of removal.

[0085] Please refer to Figure 5 Furthermore, the second substrate 401 is also provided with a plurality of picking mechanisms 403 for removing LEDs 100 on the first substrate 301. When the second substrate 401 covers the LED array, the picking mechanisms 403 are arranged one-to-one on the plurality of LEDs, so that they can act on the plurality of LEDs 100 one-to-one.

[0086] It is understandable that after multiple LEDs 100 are transferred to the first substrate 301 to form an LED array, pixel loss due to poor die bonding is inevitable. If not repaired, this will result in display defects. Therefore, how to repair these missing points is an urgent problem to be solved. Existing repair methods involve first inspecting the backplane to find the missing points and then repairing them one by one; or conducting power-on tests to find the missing points and then repairing them one by one. The disadvantage of these repair methods is that they are inefficient and cannot meet actual production needs.

[0087] In this embodiment, the picking mechanism 403 is used to repair the LED array.

[0088] It is understandable that when the first substrate 301 and LED 100 are successfully soldered, there is a first fixing force between the first substrate 301 and LED 100; when the soldering of the first substrate 301 and LED 100 is unsuccessful, there is a second fixing force between the first substrate 301 and LED 100, and the second fixing force is less than the first fixing force.

[0089] In this embodiment, by setting the pickup parameters of the pickup mechanism 403, the magnitude of the force exerted by the pickup mechanism 403 on the LED 100 is between the first fixing force and the second fixing force. Therefore, when the pickup mechanism 403 acts on the LED 100, if the LED 100 is a good product, the LED 100 will not separate from the first substrate 301 under the force of the pickup mechanism 403; if the LED 100 is a defective product, the LED 100 can separate from the first substrate 301 under the force of the pickup mechanism 403, thereby achieving the effect of separating the LED 100 with poor die bonding. Next, the LED 100 is bonded to the first substrate 301 using the aforementioned welding method, and then electrical welding is performed to finally repair the LED array.

[0090] It is understandable that there may be one or more defective individual LEDs in an LED array.

[0091] Furthermore, by energizing the first electrode array of the first substrate 301 to light up the LED array, LEDs 100 that have not been successfully soldered, i.e., defective points, can be detected. Then, the second electrode array of the second substrate 401 is energized at the defective point, causing the conductive layer 201 on the LED 100 that has not been successfully soldered to heat up until the solder on the first electrode group and / or the second electrode group melts, thereby reducing the second fixing force. Then, the LED 100 can be separated from the first substrate 301 under the force of the picking mechanism 403, thereby achieving the effect of detecting and separating LEDs 100 with poor die bonding.

[0092] Please refer to Figure 6 Based on this, the present invention can realize the re-die bonding operation of LED array to achieve the purpose of die replenishment. The re-die bonding operation includes the following steps:

[0093] S21. Provide a substrate to be replaced with a new die.

[0094] It is understandable that the replacement substrate is the first substrate 301 after the defective LED 100 has been removed.

[0095] S22. Insert a supplementary LED into the vacancy position on the substrate to be supplemented.

[0096] Understandably, in this step, the electrode group on the supplementary LED is connected to the electrode group on the substrate to be supplemented.

[0097] S23. A short-circuit current is provided to the conductive layer 201 of the supplementary LED, causing the conductive layer 201 to heat up until the solder on the electrode group and / or the second electrode group of the supplementary LED melts.

[0098] Understandably, by short-circuiting the third electrode group with the conductive layer 201 on the supplementary LED, when the second substrate 401 is energized, a short-circuit current can be provided to the conductive layer 201 of the supplementary LED, causing the conductive layer 201 to heat up. The heat is then transferred to the electrode group on the supplementary LED, thereby ultimately melting the solder on the electrode group on the supplementary LED and / or the second electrode group. Then, through a soldering operation, the supplementary LED is soldered to the substrate to be repaired, thus completing the repair operation.

[0099] In this embodiment, the pickup mechanism 403 is a vacuum suction mechanism. Specifically, a hole array is provided on the second substrate 401, and the hole array is connected to a vacuum system. The hole array includes multiple vacuum suction holes, each of which acts on the corresponding LED 100, thereby providing an adsorption force on the LED 100.

[0100] Example 3

[0101] Please refer to the reference again. Figure 1 , Figure 4 and Figure 5 Based on the foregoing embodiments, the present invention also provides an LED display manufacturing apparatus, which is applied to the LED provided in the above embodiments to implement the LED display manufacturing method provided in the above embodiments.

[0102] In this embodiment, the preparation apparatus includes:

[0103] A first substrate 301 is provided, the first substrate 301 having a first electrode array.

[0104] The first electrode array includes multiple second electrode groups that correspond one-to-one with the first electrode groups, and each second electrode group includes positive and negative electrodes. The first substrate 301 is used to form an LED array by connecting the multiple second electrode groups to the first electrode groups on multiple LEDs 100.

[0105] Welding mechanism, used for:

[0106] A short-circuit current is provided to the conductive layer 201 on multiple LEDs 100, causing the conductive layer 201 to heat up until the solder on the first electrode group and / or the second electrode group melts.

[0107] In addition, soldering or removing LED100 is performed.

[0108] Furthermore, the welding mechanism includes a second substrate 401, on which a second electrode array is provided.

[0109] The second electrode array includes multiple third electrode groups that correspond one-to-one with each of the LEDs;

[0110] The second substrate 401 is used to cover the LED array, so that multiple third electrode groups are short-circuited one by one to the conductive layer 201 on multiple LEDs 100; when the second substrate 401 is energized, it provides short-circuit current to the conductive layer 201 on the LEDs 100.

[0111] In this embodiment, by short-circuiting the third electrode group with the conductive layer, when the second substrate 401 is energized, a short-circuit current can be provided to the conductive layer 201 of the multiple LEDs 100, causing the conductive layer 201 to heat up, thereby ultimately melting the solder on the first electrode group.

[0112] It is understandable that, in the state of molten solder, a soldering operation can be performed on the first substrate 301 and the LED 100, such as cutting off the current to the second substrate 401 and cooling the molten solder, so that the LED 100 is fixed on the first substrate 301; or, in the state of molten solder, a removal operation can be performed on the LED 100, such as applying a force away from the first substrate 301 to the LED 100, so that the LED 100 can detach from the first substrate 301 if the conditions are met, thereby achieving the purpose of removal.

[0113] Furthermore, the second substrate 401 is also provided with a plurality of picking mechanisms 403 for removing the first substrate 301 and the LED 100. When the second substrate 401 covers the LED array, the picking mechanisms 403 act on the plurality of LEDs 100 in a corresponding manner.

[0114] It is understandable that after the LED100 is transferred to the first substrate 301 to form an LED array, pixel loss due to poor soldering is inevitable. If not repaired, this will result in display defects. Therefore, how to repair these missing pixels is a pressing problem that needs to be solved. Existing repair methods involve first inspecting the backplane to locate the missing pixels and then repairing them one by one; or conducting power-on tests to locate the missing pixels and then repairing them one by one. The drawback of these methods is their low repair efficiency, making them difficult to meet actual production needs.

[0115] In this embodiment, the picking mechanism 403 is used to repair the LED array.

[0116] It is understandable that when the first substrate 301 and LED 100 are successfully soldered, there is a first fixing force between the first substrate 301 and LED 100; when the soldering of the first substrate 301 and LED 100 is unsuccessful, there is a second fixing force between the first substrate 301 and LED 100, and the second fixing force is less than the first fixing force.

[0117] In this embodiment, by setting the pickup parameters of the pickup mechanism 403, the magnitude of the force exerted by the pickup mechanism 403 on the LED 100 is between the first fixing force and the second fixing force. Therefore, when the pickup mechanism 403 acts on the LED 100, if the LED 100 is a good product, the LED 100 will not separate from the first substrate 301 under the force of the pickup mechanism 403; if the LED 100 is a defective product, the LED 100 can separate from the first substrate 301 under the force of the pickup mechanism 403, thereby achieving the effect of separating the poorly soldered LED 100. Then, the aforementioned soldering method is used to bond the LED 100 to the first substrate 301, and then electrical soldering is performed, thereby finally achieving the repair of the LED array.

[0118] In this embodiment, the pickup mechanism 403 is a vacuum suction mechanism. Specifically, a hole array is provided on the second substrate 401, and the hole array is connected to a vacuum system. The hole array includes multiple vacuum suction holes, each of which acts on the corresponding LED 100, thereby providing an adsorption force on the LED 100.

[0119] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing an LED display, characterized in that, This is used for welding a transferred LED array, which includes multiple LEDs, each LED having two opposing sides, one of which is a light-emitting surface; a conductive layer is disposed on the light-emitting surface. The LED further includes a first electrode group, which is disposed on the side opposite to the light-emitting surface; The method for manufacturing the LED display includes: A first substrate is provided, the first substrate having a first electrode array, the first electrode array including a plurality of second electrode groups corresponding one-to-one with the first electrode group, the first substrate being used to form an LED array by connecting the plurality of second electrode groups with the first electrode groups on a plurality of LEDs; Providing a short-circuit current to the conductive layers on the plurality of LEDs to heat the conductive layers until the solder on the first electrode group and / or the second electrode group melts includes: providing a second substrate having a second electrode array, the second electrode array including a plurality of third electrode groups corresponding one-to-one with the plurality of LEDs; covering the LED array with the second substrate such that the plurality of third electrode groups are short-circuited one-to-one with the conductive layers on the plurality of LEDs; Power is applied to the second substrate; The short-circuit current is cut off, and the solder cools down.

2. The method for manufacturing an LED display according to claim 1, characterized in that, The second substrate is also provided with a plurality of picking mechanisms for removing the first substrate and the LEDs. When the second substrate covers the LED array, the picking mechanisms are respectively arranged on the plurality of LEDs.

3. The method for manufacturing an LED display according to claim 2, characterized in that, When the first substrate and the LED are successfully bonded, there is a first fixing force between the first substrate and the LED; when the bonding between the first substrate and the LED is unsuccessful, there is a second fixing force between the first substrate and the LED, and the second fixing force is less than the first fixing force. The magnitude of the force exerted by the picking mechanism on the LED is between the first fixing force and the second fixing force.

4. The method for manufacturing an LED display according to claim 3, characterized in that, Also includes: When the welding between the first substrate and the LED fails, the second electrode array on the second substrate corresponding to the location where the welding failed is energized, so that the conductive layer on the LED that failed to weld is energized, and the conductive layer heats up until the solder on the first electrode group and / or the second electrode group melts, thereby reducing the second fixing force.

5. The method for manufacturing an LED display according to claim 1, characterized in that, Also includes: Provide the substrate to be replaced; A supplementary LED is placed at the vacancy position on the substrate to be repaired; A short-circuit current is provided to the conductive layer of the supplementary LED, causing the conductive layer to heat up until the solder on the first electrode group and / or the second electrode group of the supplementary LED melts.

6. The method for manufacturing an LED display according to claim 1, characterized in that, The conductive layer is a transparent layer and has a predetermined impedance value.

7. The method for manufacturing an LED display according to claim 1, characterized in that, The conductive layer is grid-shaped, and the proportion of the hollow area of ​​the conductive layer is greater than 80%; or the conductive layer is branch-shaped; or the conductive layer is an ultra-thin layer.

8. The method for manufacturing an LED display according to claim 1, characterized in that, The conductive layer is made of metal.

9. The method for manufacturing an LED display according to claim 8, characterized in that, The conductive layer is made of conductive oxides such as ITO, BZO, or AZO.

10. An apparatus for manufacturing an LED display, characterized in that, For implementing the method of manufacturing an LED display as described in any one of claims 1 to 9; The preparation apparatus includes: A first substrate has a first electrode array, the first electrode array includes a plurality of second electrode groups that correspond one-to-one with the first electrode group, and the first substrate is used to form an LED array by connecting the plurality of second electrode groups with the first electrode groups on the plurality of LEDs; Welding mechanism, used for: A short-circuit current is provided to the conductive layer on the plurality of LEDs, causing the conductive layer to heat up until the solder on the first electrode group and / or the second electrode group melts. The LED is soldered or removed. The welding mechanism includes a second substrate, on which a second electrode array is provided, and the second electrode array includes a plurality of third electrode groups corresponding one-to-one with the plurality of LEDs; The second substrate is used to cover the LED array, so that the multiple third electrode groups are short-circuited one by one to the conductive layers on the multiple LEDs; when the second substrate is energized, it provides a short-circuit current to the conductive layers on the LEDs.

11. The apparatus for manufacturing an LED display according to claim 10, characterized in that, The second substrate is also provided with a plurality of picking mechanisms for removing the LEDs. When the second substrate covers the LED array, the picking mechanisms are respectively arranged on the plurality of LEDs. When the first substrate and the LED are successfully bonded, there is a first fixing force between the first substrate and the LED; when the bonding between the first substrate and the LED is unsuccessful, there is a second fixing force between the first substrate and the LED, and the second fixing force is less than the first fixing force. The magnitude of the force exerted by the picking mechanism on the LED is between the first fixing force and the second fixing force.

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