A fully automatic shielding sheet assembling machine and method

Abstract

The application discloses a kind of full-automatic shielding sheet assembling machine and method, assembling machine includes cabinet, shielding sheet feeding module, wafer piece feeding module, shielding sheet cutting module, shielding sheet transfer module, shielding sheet feeding module, wafer piece feeding module and hot riveting module being set on cabinet;Shielding sheet feeding module, wafer piece feeding module are used to provide shielding sheet material belt and wafer piece material belt, shielding sheet cutting module is used to cut the shielding sheet material belt provided by shielding sheet feeding module;Shielding sheet transfer module is used to transfer the shielding sheet obtained after cutting of shielding sheet feeding module to shielding sheet feeding module;Wafer piece feeding module is used to carry wafer piece material belt and sequentially move to shielding sheet feeding module and hot riveting module.The application can realize the automatic installation of shielding sheet, using the method of hot riveting to fix shielding sheet on wafer piece, no longer secondary injection molding process, greatly save input cost, production efficiency is greatly improved.

Description

Technical Field

[0001] This invention relates to the technical field of shielding sheet assembly equipment, specifically to a fully automatic shielding sheet assembly machine and method. Background Technology

[0002] Connectors can be classified according to their shape into: circular connectors, rectangular connectors, and bent connectors, etc. Among them, circular connectors and rectangular connectors are the most common. Among rectangular connectors, vertical connectors are one of the most common types. In the industry, metal conductor fixing parts containing metal conductors are generally called wafers. Wafers are terminals formed by injection molding, where a layer of plastic material is wrapped around the terminal to form a terminal-plastic combination.

[0003] A shielding sheet needs to be added to the wafer of a high-speed backplane connector. The function of the shielding sheet is to reduce crosstalk in signal transmission and thus improve signal integrity in order to meet the transmission rate of GEN5 / GEN6 signals. Traditional technology relies on injection molding to use a two-stage injection molding process to mold the wafer and shielding sheet into one piece for fixation. Then, the excess material strip on the shielding sheet is cut off by a stamping die. This process is costly, inefficient, has a high scrap rate, and is difficult to execute. Summary of the Invention

[0004] The purpose of this invention is to provide a fully automatic shielding sheet assembly machine, which can realize the automated installation of shielding sheets. It uses a hot riveting method to fix the shielding sheets onto the wafer sheet, eliminating the need for secondary injection molding, greatly saving investment costs and significantly improving production efficiency.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0006] A fully automatic shielding sheet assembly machine includes a chassis, a shielding sheet feeding module, a wafer sheet feeding module, a shielding sheet cutting module, a shielding sheet transfer module, a shielding sheet feeding module, a wafer sheet feeding module, and a hot riveting module, all mounted on the chassis.

[0007] The shielding sheet feeding module and the wafer sheet feeding module are used to provide shielding sheet strips and wafer sheet strips.

[0008] The shielding sheet cutting module is used to cut the shielding sheet material provided by the shielding sheet feeding module;

[0009] The shielding sheet transfer module is used to transfer the shielding sheets obtained after cutting by the shielding sheet feeding module to the shielding sheet feeding module.

[0010] The wafer feeding module is used to carry the wafer strip and move it sequentially to the wafer feeding module and the hot riveting module.

[0011] The shielding sheet feeding module is used to feed the cut shielding sheet onto the wafer sheet material strip on the wafer sheet feeding module, so that the shielding sheet overlaps with the wafer sheet on the wafer sheet material strip;

[0012] The hot riveting module is used to hot rivet overlapping shielding sheets and wafer sheets into a single integrated structure.

[0013] The shielding sheet cutting module includes a first bracket, a shielding sheet flow channel disposed on the first bracket, a punching mechanism disposed on the first bracket, and a first intermittent feeding mechanism disposed on the first bracket. The punching mechanism includes a first driving mechanism, an upper punching die, and a lower punching die. The lower punching die is mounted on the first bracket. The lower punching die and the first bracket are provided with mutually communicating deflector grooves. A cutting blade is detachably disposed in the deflector groove. A guide rod is disposed on the lower punching die. The upper punching die is slidably mounted on the guide rod. A mounting plate is disposed on the top of the guide rod. The first driving mechanism is disposed on the mounting plate and is used to connect with the upper punching die. The upper punching die is provided with a cutting blade corresponding to the cutting blade.

[0014] Further optimization includes a first intermittent feeding mechanism comprising a fixed plate, a first telescopic rod fixedly mounted on the fixed plate, a mounting frame slidably mounted on the fixed plate, and a second telescopic rod fixedly mounted on the mounting frame. The movable end of the first telescopic rod is fixedly connected to the mounting frame. The mounting frame is also equipped with a feeding mechanism, which includes a vertical slider and a horizontal bar mounted on the vertical slider and located above the shielding sheet flow channel. Below the horizontal bar is a positioning post corresponding to the positioning hole at the edge of the shielding sheet material. The vertical slider is slidably mounted on the mounting frame and is connected to the movable end of the second telescopic rod.

[0015] The shielding sheet transfer module includes a second bracket, a transverse screw module mounted on the second bracket, and a receiving seat connected to the transverse screw module. The transverse screw module is used to drive the receiving seat to move.

[0016] The receiving seat is equipped with a receiving joint, the shape of which corresponds to the shape of the knife groove, and the receiving joint is equipped with a receiving groove with the same structure as the shielding plate.

[0017] Further specified, the receiving joint is provided with a plurality of first negative pressure holes communicating with the receiving groove, and the first negative pressure holes are used to connect to negative pressure equipment.

[0018] The shielding sheet feeding module includes a third material rack, a horizontal drive component mounted on the third material rack, a vertical drive component mounted on the horizontal drive component, and a feeding seat connected to the vertical drive component. The horizontal drive component is used to drive the vertical drive component and the feeding seat to move horizontally, and the vertical drive component is used to drive the feeding seat to move vertically. The feeding seat is provided with feeding heads, the number of feeding heads corresponds to the number of bearing heads, and the shape of the feeding heads corresponds to the shape of the receiving groove. The feeding heads are provided with several second negative pressure holes, and the second negative pressure holes are connected to a negative pressure device.

[0019] Further optimization involves installing a first positioning pin on the feeding seat, which is used to connect with the positioning hole on the edge of the wafer sheet.

[0020] The feeding head is equipped with several second positioning pins, which correspond to the precision positioning holes on the shielding plate.

[0021] In addition, the present invention also discloses a shielding sheet assembly method, which includes assembling the shielding sheet using the above-mentioned fully automatic shielding sheet assembly machine;

[0022] The specific assembly method is as follows:

[0023] Step 1: Wind the shielding sheet material onto the shielding sheet unloading module, and wind the wafer sheet material onto the wafer sheet unloading module;

[0024] Step 2: The shielding sheet material strip on the shielding sheet feeding module is conveyed to the shielding sheet cutting module, which cuts the shielding sheet material strip into individual shielding sheets;

[0025] Step 3: The shielding sheet transfer module transfers the cut individual shielding sheets to the shielding sheet feeding module for final determination;

[0026] Step 4: The wafer strip on the wafer feeding module passes through the wafer feeding module and the hot riveting module in sequence under the action of the wafer feeding module;

[0027] When the wafer sheet moves to the bottom of the shielding sheet feeding module, the shielding sheet feeding module transfers the independent shielding sheet to the top of the corresponding wafer sheet in the wafer sheet material strip, so that the independent shielding sheet directly overlaps the wafer sheet;

[0028] The wafer is provided with a positioning pin, and the independent shielding sheet is provided with a positioning pin hole corresponding to the positioning pin. When the independent shielding sheet and the wafer overlap, the positioning pin passes through the positioning pin hole.

[0029] After the independent shielding sheet and the wafer sheet are overlapped, the wafer sheet feeding module sends the overlapped independent shielding sheet and the wafer sheet to the hot riveting module. The hot riveting module heat-melts and flattens the positioning pin to fix the independent shielding sheet onto the wafer sheet, thus realizing the assembly of the independent shielding sheet.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] This invention mainly consists of a chassis, a shielding sheet feeding module, a wafer sheet feeding module, a shielding sheet cutting module, a shielding sheet transfer module, a shielding sheet feeding module, a wafer sheet feeding module, and a hot riveting module. By using hot riveting, the shielding sheet is fixed onto the wafer sheet, eliminating the need for secondary injection molding. Furthermore, the shielding sheet material strip can be cut in this invention, completely solving the shortcomings of existing technologies, greatly saving investment costs, significantly improving production efficiency, and providing technical support for similar products. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 This is one of the schematic diagrams of the overall structure of the present invention.

[0034] Figure 2 This is the second schematic diagram of the overall structure of the present invention.

[0035] Figure 3 This is one of the schematic diagrams of the overall structure of the shielding sheet cutting module of the present invention.

[0036] Figure 4 This is the second schematic diagram of the overall structure of the shielding sheet cutting module of the present invention.

[0037] Figure 5 This is a schematic diagram of the overall structure of the shielding sheet transfer module of the present invention.

[0038] Figure 6 This is a schematic diagram of the overall structure of the shielding sheet feeding module of the present invention.

[0039] Figure 7 This is a schematic diagram showing the positional relationship between the wafer feeding module and the shielding sheet feeding module of the present invention.

[0040] Figure 8 This is a schematic diagram of the overall structure of the positioning mechanism of the present invention.

[0041] Figure 9 This is a schematic diagram showing the state when the shielding sheet and the wafer sheet of the present invention are stacked.

[0042] Figure 10 This is a schematic diagram of the overall structure of the shielding sheet material of the present invention.

[0043] Figure 11 For the present invention Figure 4 A magnified view of a portion of point A in the middle.

[0044] Figure label:

[0045] 1-Chassis, 2-Shielding sheet feeding module, 3-Wafer sheet feeding module, 4-Shielding sheet cutting module, 5-Shielding sheet transfer module, 6-Shielding sheet feeding module, 7-Wafer sheet feeding module, 8-Hot riveting module, 9-Positioning mechanism, 10-Shielding sheet strip, 11-Wafer sheet strip, 12-Shielding sheet, 13-Wafer sheet, 14-Upper cutter;

[0046] 401-First support, 402-Shielding sheet flow channel, 403-Blanking mechanism, 404-First intermittent feeding mechanism, 405-First drive mechanism, 406-Upper blanking die, 407-Lower blanking die, 408-Deflecting groove, 409-Lower cutting blade, 410-Guide rod, 411-Mounting plate, 412-Upper cutting blade, 413-Fixing plate, 414-First telescopic rod, 415-Scrap box, 416-Positioning hole, 417-Mounting bracket, 418-Second telescopic rod, 419-Material feeding mechanism, 420-Vertical slider, 421-Horizontal bar

[0047] 501-Second bracket, 502-Transverse lead screw module, 503-Receiver seat, 504-Receiver joint, 505-Receiver groove, 506-Connecting plate, 507-Third telescopic rod, 508-First negative pressure hole;

[0048] 601-Third material rack, 602-Horizontal drive assembly, 603-Vertical drive assembly, 604-Discharge seat, 605-Discharge head, 606-Second positioning pin, 607-First positioning pin;

[0049] 701-Support frame, 702-Wafer flow channel, 703-Fixed slider, 704-Slide rail, 705-Fourth telescopic rod, 706-Connecting plate, 707-First feeding mechanism, 708-Connecting seat, 709-Fifth telescopic rod, 710-Slide plate, 711-First crossbar;

[0050] 801-Hot riveting bracket, 802-Sixth telescopic rod, 803-Heating base, 804-Heating block;

[0051] 901-Base, 902-Seventh telescopic rod, 903-First fixed plate, 904-Sliding plate, 905-Support head, 906-Rotating wheel, 907-Push block, 908-Inclined surface. Detailed Implementation

[0052] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the embodiments of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0053] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0054] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0055] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0056] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0057] The following disclosure provides many different implementations or examples for carrying out different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0058] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0059] Example 1

[0060] See Figures 1-11 This embodiment discloses a fully automatic shielding sheet assembly machine, including a chassis 1, a shielding sheet feeding module 2, a wafer sheet feeding module 3, a shielding sheet cutting module 4, a shielding sheet transfer module 5, a shielding sheet feeding module 6, a wafer sheet feeding module 7, and a hot riveting module 8 disposed on the chassis 1.

[0061] Among them, shielding sheet feeding module 2 and wafer sheet feeding module 3 are used to provide shielding sheet material strip 10 and wafer sheet material strip 11.

[0062] The shielding sheet cutting module 4 is used to cut the shielding sheet material strip 10 provided by the shielding sheet feeding module 2;

[0063] The shielding sheet transfer module 5 is used to transfer the shielding sheet 12 obtained after being cut by the shielding sheet feeding module 2 to the shielding sheet feeding module 6.

[0064] Wafer feeding module 7 is used to carry wafer strip 11 and move it sequentially to wafer feeding module 7 and hot riveting module 8.

[0065] The shielding sheet feeding module 6 is used to feed the cut shielding sheet 12 onto the wafer sheet material strip 11 on the wafer sheet feeding module 7, so that the shielding sheet 12 overlaps with the wafer sheet 13 on the wafer sheet material strip 11;

[0066] The hot riveting module 8 is used to hot rivet the overlapping shielding sheet 12 and the wafer sheet 13 into an integrated structure.

[0067] This embodiment enables automated assembly of the shielding sheet 12 and the wafer sheet 13. Furthermore, by using a hot riveting method to fix the shielding sheet 12 onto the wafer sheet 13, a secondary injection molding process is eliminated. Moreover, the shielding sheet material strip 10 can be cut directly in this invention, completely overcoming the shortcomings of existing technologies, significantly reducing investment costs, greatly improving production efficiency, and providing technical support for similar products.

[0068] To facilitate a better understanding of the present invention by those skilled in the art, the present invention will be further described in detail below with reference to the specific structure of each component.

[0069] In this embodiment, the specific structure of the shielding sheet cutting module 4 is as follows:

[0070] The shielding sheet cutting module 4 includes a first support 401, a shielding sheet flow channel 402 disposed on the first support 401, a punching mechanism 403 disposed on the first support 401, and a first intermittent feeding mechanism 404 disposed on the first support 401; the punching mechanism 403 includes a first driving mechanism 405, an upper punching die 406, and a lower punching die 407, the lower punching die 407 being mounted on the first support 401, and the lower punching die 407 and the first support 401... The upper die is provided with interconnected cutting grooves 408, and a cutting lower die 409 is detachably installed in the cutting grooves 408; a guide rod 410 is provided on the lower die 407, and the upper die 406 is slidably installed on the guide rod 410. A mounting plate 411 is provided on the top of the guide rod 410. A first drive mechanism 405 is installed on the mounting plate 411 and connected to the upper die 406. A cutting upper die 412 corresponding to the cutting lower die 409 is provided on the upper die 406.

[0071] The shielding sheet strip 10 moves intermittently in the shielding sheet flow channel 402 under the action of the first intermittent feeding mechanism 404. When the shielding sheet strip 10 moves to the lower die 407, the first driving mechanism 405 can drive the upper cutting blade 412 to move toward the shielding sheet strip 10. Since the lower cutting blade 409 is detachably provided in the cutting groove 408, the shielding sheet strip 10 is cut under the action of the lower cutting blade 409 and the upper cutting blade 412, and the shielding sheet 12 in the shielding sheet strip 10 is cut into independent shielding sheets 12.

[0072] In practical use, the first drive mechanism 405 is a telescopic rod, which can be a pneumatic telescopic rod or a hydraulic telescopic rod.

[0073] The first intermittent feeding mechanism 404 includes a fixed plate 413, a first telescopic rod 414 fixedly mounted on the fixed plate 413, a mounting frame 417 slidably mounted on the fixed plate 413, and a second telescopic rod 418 fixedly mounted on the mounting frame 417. The movable end of the first telescopic rod 414 is fixedly connected to the mounting frame 417. The mounting frame 417 is also provided with a feeding mechanism 419. The feeding mechanism 419 includes a vertical slider 420 and a horizontal bar 421 mounted on the vertical slider 420 and located above the shielding sheet flow channel 402. A positioning post corresponding to the positioning hole 416 on the edge of the shielding sheet material strip 10 is provided below the horizontal bar 421. The vertical slider 420 is slidably mounted on the mounting frame 417 and is connected to the movable end of the second telescopic rod 418.

[0074] When feeding the shielding sheet strip 10 intermittently, the first telescopic rod 414 drives the mounting bracket 417 to move on the fixed plate 413 to achieve horizontal driving. At the same time, the second telescopic rod 418 drives the vertical slider 420 to move vertically. When the vertical slider 420 moves toward the shielding sheet strip 10, the positioning post below the horizontal rod 421 will pass through the positioning hole 416 on the edge of the shielding sheet strip 10, and then move laterally under the action of the first telescopic rod 414. After moving to the appropriate position, both the first telescopic rod 414 and the second telescopic rod 418 will perform a reset action. By repeating this process, the intermittent feeding of the shielding sheet strip 10 can be achieved.

[0075] In actual use, a waste box 415 is also provided on the frame, which is located at the discharge end of the shielding plate flow channel 402.

[0076] Preferably, a strip cutting mechanism is provided below the upper die 406 for cutting the shielding strip 10 so that the waste box 415 can store the waste.

[0077] The strip cutting mechanism includes an upper cutter 14 disposed on the upper punching die 406 and a lower cutter disposed on the shielding sheet flow channel 402. While the upper cutting cutter 412 on the upper punching die 406 cuts the shielding sheet strip 10, the upper cutter 14 and the lower cutter cut off the excess material of the shielding sheet strip 10.

[0078] The shielding sheet transfer module 5 includes a second bracket 501, a transverse screw module 502 disposed on the second bracket 501, and a receiving seat 503 connected to the transverse screw module 502. The transverse screw module 502 is used to drive the receiving seat 503 to move.

[0079] The receiving seat 503 is provided with a receiving joint 504, the shape of which corresponds to the shape of the knife groove 408, and the receiving joint 504 is provided with a receiving groove 505 that has the same structure as the shielding plate 12.

[0080] In practical use, the horizontal lead screw module 502 drives the receiving seat 503, allowing the receiving seat 503 to move below the cutting groove 408 on the lower die 407. The receiving joint 504 on the receiving seat 503 will then receive the shielding sheet 12 that falls off after cutting.

[0081] In practical use, a connecting plate 506 is provided on the transverse lead screw module 502, and a receiving seat 503 is slidably mounted on the connecting plate 506. A third telescopic rod 507 is provided on the connecting plate 506, and the movable end of the third telescopic rod 507 is connected to the receiving seat 503. When the shielding sheet material strip 10 is cut, the third telescopic rod 507 drives the receiving seat 503 to move upward, so that the receiving joint 504 on the receiving seat 503 extends into the cutting groove 408, so that the receiving joint 504 can be closer to the shielding sheet material strip 10, so that the cut shielding sheet 12 can fall more stably on the receiving groove 505 of the receiving joint 504. The receiving groove 505 can adjust the posture of the shielding sheet 12 to achieve precise positioning of the shielding sheet 12.

[0082] Further optimization involves providing several first negative pressure holes 508 on the receiving joint 504, which communicate with the receiving groove 505. These first negative pressure holes 508 are used to connect to a negative pressure device. In this way, the first negative pressure holes 508 can achieve negative pressure adsorption of the shielding sheet 12, preventing movement during transfer and avoiding inaccurate positioning of the shielding sheet 12.

[0083] The shielding sheet feeding module 6 includes a third material rack 601, a horizontal drive component 602 mounted on the third material rack 601, a vertical drive component 603 mounted on the horizontal drive component 602, and a feeding seat 604 connected to the vertical drive component 603. The horizontal drive component 602 is used to drive the vertical drive component 603 and the feeding seat 604 to move horizontally, and the vertical drive component 603 is used to drive the feeding seat 604 to move vertically. The feeding seat 604 is provided with feeding heads 605, the number of feeding heads 605 corresponds to the number of bearing heads 504, and the shape of the feeding heads 605 corresponds to the shape of the receiving groove 505. The feeding heads 605 are provided with a plurality of second negative pressure holes, and the second negative pressure holes are connected to a negative pressure device.

[0084] When the receiving seat 503 moves to below the feeding head 605, under the action of the vertical drive component 603, the feeding head 605 approaches the shielding sheet 12 and comes into contact with the shielding sheet 12. Then, the shielding sheet 12 is fixed and adsorbed through the second negative pressure hole.

[0085] When the second negative pressure hole adsorbs and fixes the shielding sheet 12, the negative pressure device connected to the first negative pressure hole 508 is in a closed state, and there is no negative pressure inside the first negative pressure hole 508, so it does not have an adsorption force on the shielding sheet 12.

[0086] The horizontal drive component 602 drives the feeding head 605 to the top of the wafer sheet 11, and then the vertical drive component 603 drives the feeding head 605 to approach the wafer sheet 13, thereby assembling the wafer sheet 13 and the shielding sheet 12. This allows the positioning pins on the wafer sheet 13 to pass through the positioning pin holes on the independent shielding sheet 12, thereby achieving the overlapping of the wafer sheet 13 and the shielding sheet 12.

[0087] Further optimization involves providing a first positioning pin 607 on the feeding base 604. This first positioning pin 607 is used to engage with the positioning hole 416 on the edge of the wafer strip 11. By engaging the first positioning pin 607 with the positioning hole 416 on the edge of the wafer strip 11, the shielding sheet 12 can be accurately placed onto the wafer sheet 13, thus improving the accuracy of the stacking process.

[0088] More importantly, the feeding head 605 is provided with several second positioning pins 606, which correspond to the precision positioning holes provided on the shielding sheet 12. Through the cooperation of the second positioning pins 606 and the precision positioning holes, the gripping progress of the shielding sheet 12 can be effectively improved, so as to ensure that the wafer sheet 13 and the shielding sheet 12 can be accurately overlapped.

[0089] In this embodiment, the wafer feeding module 7 is mainly used to convey the wafer sheet material strip 11. The wafer feeding module 7 includes a support frame 701, a wafer sheet flow channel 702 disposed on the support frame 701, a fixed slider 703 disposed on the support frame 701, and a slide rail 704 that slides with the fixed slider 703. A fourth telescopic rod 705 is also disposed on the support frame 701. The movable end of the fourth telescopic rod 705 is fixedly connected to the slide rail 704 through a connecting plate 706. A plurality of first feeding mechanisms 707 are disposed on the slide rail 704.

[0090] The first feeding mechanism 707 includes a connecting seat 708, a fifth telescopic rod 709 disposed on the connecting seat 708, and a sliding plate 710 slidably disposed on the connecting seat 708. The upper part of the sliding plate 710 is connected to the movable end of the fifth telescopic rod 709, and the lower end is connected to a first crossbar 711. The first crossbar 711 is provided with a first positioning post corresponding to the positioning hole 416 on the edge of the wafer sheet 11.

[0091] In this way, the fourth telescopic rod 705 drives the slide rail 704 to move laterally, and the fifth telescopic rod 709 drives the first crossbar 711 to move vertically. Under the action of the fourth telescopic rod 705 and the fifth telescopic rod 709, the wafer sheet 11 can be driven intermittently. The principle of driving the wafer sheet 11 to move is the same as the principle of driving the shielding sheet 12 to move, and will not be described in detail here.

[0092] The hot riveting module 8 includes a hot riveting bracket 801, a sixth telescopic rod 802 disposed on the hot riveting bracket 801, and a heating seat 803 disposed on the movable end of the sixth telescopic rod 802. A heating block 804 is disposed on the heating seat 803. When the stacked shielding sheet 12 and wafer sheet 13 move to the underside of the heating seat 803, the sixth telescopic rod 802 drives the heating seat 803 to approach the shielding sheet 12 and wafer sheet 13, and after the positioning pin is hot-melted and flattened, the independent shielding sheet 12 is fixed on the wafer sheet 13, thereby realizing the assembly of the independent shielding sheet 12.

[0093] In actual use, a positioning mechanism 9 is provided on the chassis 1 located at the overlapping position of the wafer sheet 13 and the shielding sheet 12 and below the hot riveting module 8, and a through groove is provided at the wafer sheet flow channel 702 above the positioning mechanism 9.

[0094] The positioning mechanism 9 includes a base 901, a seventh telescopic rod 902, a first fixed plate 903, and a sliding plate 904. The base 901 is mounted on the chassis 1. The seventh telescopic rod 902 is fixedly mounted on the base 901. The first fixed plate 903 is fixedly mounted on the base 901. The sliding plate 904 is slidably mounted on the first fixed plate 903. A support head 905 is provided above the sliding plate 904 and is located in the through groove. A rotating wheel 906 is provided on the sliding plate 904. A push block 907 is provided on the base 901. An inclined surface 908 is provided on the push block 907. The rotating wheel 906 contacts the inclined surface 908. After the push block 907 is slidably mounted on the base 901, it is connected to the seventh telescopic rod 902. The seventh telescopic rod 902 drives the push block 907 to move. Under the action of the inclined surface 908, the sliding plate 904 can be driven, thereby enabling the support head 905 to contact and limit the bottom of the wafer sheet 13.

[0095] Among them, the shielding sheet feeding module 2 and the wafer sheet feeding module 3 have the same structure. They both include a material rack installed on the chassis 1 and a reel set on the material rack. They are mainly used to wind and feed the shielding sheet material strip 10 and the wafer sheet material strip 11. Their specific structures will not be described in detail.

[0096] Example 2

[0097] This embodiment also discloses a method for assembling a shielding sheet, the specific assembly method of which is as follows:

[0098] Step 1: Wind the shielding sheet material strip 10 onto the shielding sheet feeding module 2, and wind the wafer sheet material strip 11 onto the wafer sheet feeding module 3;

[0099] Step 2: The shielding sheet material strip 10 on the shielding sheet feeding module 2 is conveyed to the shielding sheet cutting module 4. The shielding sheet cutting module 4 cuts the shielding sheet material strip 10 to form independent shielding sheets 12.

[0100] Step 3: The shielding sheet transfer module 5 transfers the cut independent shielding sheets 12 to the shielding sheet feeding module 6 for further processing;

[0101] Step 4: The wafer sheet material strip 11 on the wafer sheet feeding module 3 passes through the wafer sheet feeding module 7 and the hot riveting module 8 in sequence under the action of the wafer sheet feeding module 7.

[0102] When the wafer sheet 13 moves to the area below the shielding sheet feeding module 6, the shielding sheet feeding module 6 transfers the independent shielding sheet 12 to the area directly above the corresponding wafer sheet 13 in the wafer sheet material strip 11, so that the independent shielding sheet 12 directly overlaps the wafer sheet 13.

[0103] The wafer 13 is provided with a positioning pin, and the independent shielding sheet 12 is provided with a positioning pin hole corresponding to the positioning pin. When the independent shielding sheet 12 overlaps with the wafer 13, the positioning pin passes through the positioning pin hole.

[0104] After the independent shielding sheet 12 and the wafer sheet 13 are overlapped, the wafer sheet feeding module 7 sends the overlapped independent shielding sheet 12 and wafer sheet 13 to the hot riveting module 8. The hot riveting module 8 heat-melts and flattens the positioning pin to fix the independent shielding sheet 12 onto the wafer sheet 13, thus realizing the assembly of the independent shielding sheet 12.

[0105] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0106] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fully automatic shielding sheet assembly machine, comprising a chassis, characterized in that: It also includes a shielding sheet feeding module, a wafer sheet feeding module, a shielding sheet cutting module, a shielding sheet transfer module, a shielding sheet feeding module, a wafer sheet feeding module, and a hot riveting module, all installed on the chassis. The shielding sheet feeding module and the wafer sheet feeding module are used to provide shielding sheet strips and wafer sheet strips. The shielding sheet cutting module is used to cut the shielding sheet material provided by the shielding sheet feeding module; The shielding sheet transfer module is used to transfer the shielding sheets obtained after cutting by the shielding sheet feeding module to the shielding sheet feeding module. The wafer feeding module is used to carry the wafer strip to the shielding sheet feeding module and the hot riveting module in sequence. The shielding sheet feeding module is used to feed the cut shielding sheet onto the wafer sheet material strip on the wafer sheet feeding module, so that the shielding sheet overlaps with the wafer sheet on the wafer sheet material strip; The hot riveting module is used to hot rivet overlapping shielding sheets and wafer sheets into a single integrated structure; The shielding sheet cutting module includes a first bracket, a shielding sheet flow channel disposed on the first bracket, a punching mechanism disposed on the first bracket, and a first intermittent feeding mechanism disposed on the first bracket; The first intermittent feeding mechanism includes a fixed plate, a first telescopic rod fixedly mounted on the fixed plate, a mounting frame slidably mounted on the fixed plate, and a second telescopic rod fixedly mounted on the mounting frame. The movable end of the first telescopic rod is fixedly connected to the mounting frame. The mounting frame is also equipped with a feeding mechanism, which includes a vertical slider and a horizontal bar mounted on the vertical slider and located above the shielding sheet flow channel. A positioning post corresponding to the positioning hole on the edge of the shielding sheet is provided below the horizontal bar. The vertical slider is slidably mounted on the mounting frame and is connected to the movable end of the second telescopic rod.

2. The fully automatic shielding sheet assembly machine according to claim 1, characterized in that: The blanking mechanism includes a first drive mechanism, an upper blanking die, and a lower blanking die. The lower blanking die is mounted on a first support. The lower blanking die and the first support are provided with interconnected deflector grooves, and a cutting blade is detachably installed in the deflector groove. A guide rod is provided on the lower blanking die, and the upper blanking die is slidably mounted on the guide rod. A mounting plate is provided on the top of the guide rod. The first drive mechanism is mounted on the mounting plate and is used to connect with the upper blanking die. The upper blanking die is provided with a cutting blade corresponding to the cutting blade.

3. The fully automatic shielding sheet assembly machine according to claim 1, characterized in that: The shielding plate transfer module includes a second bracket, a transverse screw module mounted on the second bracket, and a receiving seat connected to the transverse screw module. The transverse screw module is used to drive the receiving seat to move. The receiving seat is equipped with a receiving joint, the shape of which corresponds to the shape of the knife groove, and the receiving joint is equipped with a receiving groove with the same structure as the shielding plate.

4. The fully automatic shielding sheet assembly machine according to claim 3, characterized in that: The connector is provided with a plurality of first negative pressure holes that communicate with the receiving groove. The first negative pressure holes are used to connect to negative pressure equipment.

5. The fully automatic shielding sheet assembly machine according to claim 4, characterized in that: The shielding sheet feeding module includes a third material rack, a horizontal drive component mounted on the third material rack, a vertical drive component mounted on the horizontal drive component, and a feeding seat connected to the vertical drive component. The horizontal drive component is used to drive the vertical drive component and the feeding seat to move horizontally, and the vertical drive component is used to drive the feeding seat to move vertically. The feeding seat is provided with feeding heads, the number of feeding heads corresponds to the number of bearing heads, and the shape of the feeding heads corresponds to the shape of the receiving groove. The feeding heads are provided with several second negative pressure holes, and the second negative pressure holes are connected to a negative pressure device.

6. The fully automatic shielding sheet assembly machine according to claim 5, characterized in that: The feeding seat is equipped with a first positioning pin, which is used to connect with the positioning hole set on the edge of the wafer sheet.

7. The fully automatic shielding sheet assembly machine according to claim 6, characterized in that: The feeding head is equipped with several second positioning pins, which correspond to the precision positioning holes on the shielding plate.

8. A method for assembling a shielding sheet, characterized in that: This includes assembling shielding sheets using a fully automatic shielding sheet assembly machine as described in any one of claims 1-7; The specific assembly method is as follows: Step 1: Wind the shielding sheet material onto the shielding sheet unloading module, and wind the wafer sheet material onto the wafer sheet unloading module; Step 2: The shielding sheet material strip on the shielding sheet feeding module is conveyed to the shielding sheet cutting module, which cuts the shielding sheet material strip into individual shielding sheets; Step 3: The shielding sheet transfer module transfers the cut individual shielding sheets to the shielding sheet feeding module for final determination; Step 4: The wafer sheet material strip on the wafer sheet feeding module passes sequentially through the shielding sheet feeding module and the hot riveting module under the action of the wafer sheet feeding module; when the wafer sheet moves to the bottom of the shielding sheet feeding module, the shielding sheet feeding module transfers the independent shielding sheet to the top of the corresponding wafer sheet in the wafer sheet material strip, so that the independent shielding sheet directly overlaps the wafer sheet; The wafer is provided with a positioning pin, and the independent shielding sheet is provided with a positioning pin hole corresponding to the positioning pin. When the independent shielding sheet and the wafer overlap, the positioning pin passes through the positioning pin hole. After the independent shielding sheet and the wafer sheet are overlapped, the wafer sheet feeding module sends the overlapped independent shielding sheet and the wafer sheet to the hot riveting module. The hot riveting module heat-melts and flattens the positioning pin to fix the independent shielding sheet onto the wafer sheet, thus realizing the assembly of the independent shielding sheet.

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