Method for manufacturing printed circuit boards

Abstract

The application provides a preparation method of a printed circuit board, and relates to the field of electronic components. The preparation method comprises the following steps: providing a compression structure, a high-frequency structure and a radio frequency structure, and arranging the radio frequency structure on a first surface of the high-frequency structure; forming a containing groove on a first surface of the compression structure; fixing the high-frequency structure and the radio frequency structure in the containing groove, the first surface of the high-frequency structure faces the groove bottom of the containing groove, the second surface of the high-frequency structure is away from the groove bottom of the containing groove, and the high-frequency structure is electrically connected to the compression structure. The application can solve the problem that the high-frequency microwave radio frequency structure is prone to damage and the like, and the normal use of the printed circuit board is affected.

Description

Technical Field

[0001] This application relates to the field of electronic components, and more particularly to methods for manufacturing printed circuit boards. Background Technology

[0002] Printed circuit boards (PCBs) are an important electronic component that can replace complex wiring. The application of PCBs reduces the overall size of the device, lowers equipment costs, and improves the quality and reliability of electronic equipment.

[0003] Printed circuit boards include a lamination structure. During the fabrication process of printed circuit boards, a high-frequency microwave radio frequency structure is usually formed on the surface of the lamination structure to transmit high-frequency electrical pulse signals. However, the high-frequency microwave radio frequency structure is prone to damage, which can affect the normal use of the printed circuit board. Summary of the Invention

[0004] This application provides a method for manufacturing printed circuit boards to solve the problem that high-frequency microwave radio frequency structures are prone to damage, which affects the normal use of printed circuit boards.

[0005] The method for manufacturing a printed circuit board provided in this application includes the following steps:

[0006] A pressing structure, a high-frequency structure, and a radio-frequency structure are provided, wherein the radio-frequency structure is disposed on the first surface of the high-frequency structure;

[0007] A receiving groove is formed on the first surface of the pressed structure;

[0008] The high-frequency structure and the radio frequency structure are fixed in the receiving groove, with the first surface of the high-frequency structure facing the bottom of the receiving groove, the second surface of the high-frequency structure facing away from the bottom of the receiving groove, and the high-frequency structure being electrically connected to the pressing structure.

[0009] By adopting the above technical solution, a receiving groove is formed on the first surface of the pressing structure, and the radio frequency structure and the high frequency structure are placed in the receiving groove, such that the first surface of the high frequency structure faces the bottom of the receiving groove, the second surface of the high frequency structure faces away from the bottom of the receiving groove, and the radio frequency structure is placed on the first surface of the high frequency structure facing away from the opening of the receiving groove.

[0010] Compared with the printed circuit board manufacturing methods in related technologies, the printed circuit board manufacturing method provided in this application embodiment does not require forming the radio frequency structure on the surface of the lamination structure. Therefore, the lamination structure and the high frequency structure can play a certain protective role for the radio frequency structure, reduce the possibility of damage to the radio frequency structure, and ensure the normal use of the printed circuit board.

[0011] In some possible implementations, fixing the high-frequency structure and the radio-frequency structure within the receiving groove includes the following steps:

[0012] A weak flow adhesive layer is formed at the bottom of the receiving tank;

[0013] A separation layer is formed in the weak flow adhesive layer;

[0014] The high-frequency structure and the radio frequency structure are placed in the receiving groove, and the surface of the radio frequency structure facing away from the high-frequency structure is attached to the separator layer;

[0015] The high-frequency structure and the pressed structure are pressed together so that the portion of the weak flow adhesive layer that has not formed the separator layer adheres to the first surface of the high-frequency structure.

[0016] In some possible implementations, forming a separation layer in the weak flow adhesive layer includes the following steps:

[0017] An installation groove is formed in the weak flow adhesive layer;

[0018] The separator layer is formed in the mounting groove, and the surface of the separator layer facing away from the bottom of the mounting groove is flush with the weak flow adhesive layer.

[0019] In some possible implementations, after pressing the high-frequency structure and the pressed structure, the fabrication method further includes the following steps:

[0020] A functional groove is formed on the second surface of the pressed structure, the functional groove communicating with the receiving groove, and the separating layer is exposed;

[0021] The separator layer is removed so that the radio frequency structure is disposed within the functional slot, or the radio frequency structure forms the bottom of the functional slot.

[0022] In some possible implementations, a gap is formed between the bottom of the functional groove and the partition layer in the plane containing the bottom of the functional groove, the gap being greater than or equal to 20 mils.

[0023] In some possible implementations, the functional slot is configured as a through slot, and the radio frequency structure is disposed within the through slot;

[0024] Alternatively, the functional slot may be configured as a blind slot, with the radio frequency structure forming the bottom of the blind slot.

[0025] In some possible implementations, the functional slot is configured as a through slot, and the fabrication method further includes the following steps:

[0026] A first metal layer is formed on the first surface of the press-fit structure; the first metal layer at least partially covers the second surface of the high-frequency structure, the first metal layer is provided with a first opening, the first opening is coincidentally disposed in the through groove, and along the thickness direction of the press-fit structure, the orthographic projection of the first opening accommodates the orthographic projection of the through groove;

[0027] A second metal layer is formed on the second surface of the press-fit structure; the second metal layer is provided with a second opening, which is disposed concurrently with the through groove, and the orthographic projection of the second opening accommodates the orthographic projection of the through groove along the thickness direction of the press-fit structure.

[0028] In some possible implementations, the functional slot is configured as a blind slot, and the fabrication method further includes the following steps:

[0029] A first metal layer is formed on the first surface of the press-fit structure; the first metal layer at least partially covers the second surface of the high-frequency structure.

[0030] A second metal layer is formed on the second surface of the press-fit structure; the second metal layer is provided with a second opening, which is disposed concurrently with the blind groove, and the orthographic projection of the second opening accommodates the orthographic projection of the blind groove along the thickness direction of the press-fit structure.

[0031] In some possible implementations, the pressing structure includes a plurality of first core plates stacked along a first direction, and the high-frequency structure includes a plurality of second core plates stacked along the first direction, wherein the number of second core plates is less than the number of first core plates.

[0032] The second core board includes a high-frequency substrate and a conductive layer disposed on the surface of the high-frequency substrate.

[0033] In some possible implementations, the conductive layer has functional regions, and the fabrication method includes the following steps:

[0034] Forming the radio frequency structure includes: removing a portion of the conductive layer located within the functional region, so that the remaining portion of the conductive layer located within the functional region forms the radio frequency structure. Attached Figure Description

[0035] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0036] Figure 1 A schematic flowchart illustrating the method for fabricating a printed circuit board according to an embodiment of this application;

[0037] Figure 2This is a schematic diagram illustrating the process of fixing a high-frequency structure and a radio frequency structure within a receiving groove, provided as an embodiment of this application.

[0038] Figure 3 This is a schematic diagram of the high-frequency structure and radio frequency structure provided in the embodiments of this application;

[0039] Figure 4 This is a schematic diagram of the pressing structure for forming the receiving groove provided in an embodiment of this application;

[0040] Figure 5 This is a schematic diagram of the compression structure for forming a weak flow adhesive layer provided in an embodiment of this application;

[0041] Figure 6 This is a schematic diagram of the compression structure for forming the separator layer provided in an embodiment of this application;

[0042] Figure 7 This is a schematic diagram of the high-frequency pressing structure and the pressing structure provided in the embodiments of this application;

[0043] Figure 8 This is a schematic diagram of the pressing structure for forming a through groove provided in an embodiment of this application;

[0044] Figure 9 Provided for the embodiments of this application Figure 8 A schematic diagram of a laminated structure that forms the first and second metal layers on the basis;

[0045] Figure 10 This is a schematic diagram of the pressing structure for forming a blind groove provided in an embodiment of this application;

[0046] Figure 11 Provided for the embodiments of this application Figure 10 A schematic diagram of the structure in which the first metal layer and the second metal layer are formed by lamination.

[0047] Explanation of reference numerals in the attached figures:

[0048] 100. Press-fit structure;

[0049] 110. First core board; 120. First adhesive layer; 130. Receiving groove; 131. Weak flow adhesive layer; 1311. Mounting groove; 140. Through groove; 150. Blind groove; 160. First metal layer; 161. First opening; 170. Second metal layer; 171. Second opening;

[0050] 200. High-frequency structure;

[0051] 210. Second core board; 211. High-frequency substrate; 212. Conductive layer; 2121. Functional area; 220. Second adhesive layer;

[0052] 300. Radio frequency structure;

[0053] 400. Separator layer.

[0054] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0055] As described in the background section, the surface of the laminated structure is provided with a high-frequency microwave radio frequency (RF) structure to transmit high-frequency electrical pulse signals. Here, radio frequency refers to electromagnetic frequencies that can be radiated into space, with the electromagnetic frequency range between 300 kHz and 300 GHz. However, the circuitry of the high-frequency microwave radio frequency structure transmits not current, but a high-frequency electrical pulse signal. Defects such as pits, notches, and pinholes in the circuitry of the high-frequency microwave radio frequency structure can affect the transmission process of the high-frequency electrical pulse signal.

[0056] In related technologies, a high-frequency microwave radio frequency structure is formed on the surface of the pressed structure to transmit high-frequency pulse signals. However, this makes the high-frequency microwave radio frequency structure prone to contact with other structures or etching solutions, which can easily lead to damage and affect the normal use of the printed circuit board.

[0057] To solve the above-mentioned technical problems, this application provides a method for manufacturing a printed circuit board. A receiving groove is formed on the first surface of the lamination structure, the radio frequency structure is electrically connected to the high frequency structure, and the radio frequency structure and the high frequency structure are disposed in the receiving groove, such that the first surface of the high frequency structure faces the bottom of the receiving groove, the second surface of the high frequency structure faces away from the bottom of the receiving groove, and the radio frequency structure is disposed on the first surface of the high frequency structure facing away from the opening of the receiving groove.

[0058] Compared with the printed circuit board manufacturing methods in related technologies, the printed circuit board manufacturing method provided in this application embodiment does not require forming the radio frequency structure on the surface of the lamination structure. Therefore, the lamination structure and the high frequency structure can play a certain protective role for the radio frequency structure, reduce the possibility of damage to the radio frequency structure, and ensure the normal use of the printed circuit board.

[0059] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0060] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0061] Reference Figures 1-11 This application provides a method for fabricating a printed circuit board, comprising: providing a lamination structure 100, a high-frequency structure 200, and a radio-frequency structure 300, wherein the radio-frequency structure 300 is disposed on a first surface of the high-frequency structure 200; forming a receiving groove 130 on the first surface of the lamination structure 100; fixing the high-frequency structure 200 and the radio-frequency structure 300 within the receiving groove 130, wherein the first surface of the high-frequency structure 200 faces the bottom of the receiving groove 130, the second surface of the high-frequency structure 200 faces away from the bottom of the receiving groove 130, and the high-frequency structure 200 is electrically connected to the lamination structure 100. The fabrication method specifically includes the following steps:

[0062] S101, a pressing structure 100, a high-frequency structure 200 and a radio frequency structure 300 are provided, and the radio frequency structure 300 is disposed on the first surface of the high-frequency structure 200;

[0063] Reference Figures 1-3 In some possible implementations, the pressing structure 100 includes a plurality of first core plates 110 stacked along a first direction. The first core plates 110 can be formed by covering the surface of a substrate with a conductive layer 212, wherein the first direction is parallel to the thickness direction of the pressing structure 100. The pressing structure 100 also includes at least one first adhesive layer 120. The first adhesive layer 120 can be configured as a prepreg, and the first adhesive layer 120 is disposed between two adjacent first core plates 110. The first surface of the first adhesive layer 120 is connected to one of the first core plates 110, and the second surface of the first adhesive layer 120 is connected to the other first core plate 110, so as to realize the connection process of adjacent first core plates 110 through the first adhesive layer 120.

[0064] For example, the number of first adhesive layers 120 is set to be multiple, and the number of first adhesive layers 120 is less than the number of first core boards 110. When forming the pressing structure 100, the multiple first core boards 110 and the multiple first adhesive layers 120 are alternately arranged in sequence along the first direction, so that a first adhesive layer 120 is provided between two adjacent first core boards 110. Then, the multiple first core boards 110 and the multiple first adhesive layers 120 are pressed together to form the pressing structure 100.

[0065] The high-frequency structure 200 includes a plurality of second core boards 210 stacked along a first direction. The number of second core boards 210 is less than the number of first core boards 110. For example, the second core board 210 includes a high-frequency substrate 211 and a conductive layer 212 disposed on the surface of the high-frequency substrate 211 along the first direction, so that the high-frequency substrate 211 is suitable for connecting the radio frequency structure 300. The high-frequency structure 200 also includes at least one second adhesive layer 220. The second adhesive layer 220 can be configured as a prepreg, and the second adhesive layer 220 is disposed between two adjacent second core boards 210. The first surface of the second adhesive layer 220 is connected to one of the second core boards 210, and the second surface of the first adhesive layer 220 is connected to the other second core board 210, so that the connection process of adjacent second core boards 210 is realized through the second adhesive layer 220.

[0066] For example, the number of second adhesive layers 220 is set to be multiple, and the number of second adhesive layers 220 is less than the number of second core boards 210. When forming the high-frequency structure 200, multiple first core boards 110 and multiple second adhesive layers 220 are alternately arranged in sequence along the first direction, so that a second adhesive layer 220 is provided between two adjacent second core boards 210. Then, multiple second core boards 210 and multiple second adhesive layers 220 are pressed together to form the high-frequency structure 200.

[0067] Reference Figure 3 In some possible embodiments, the radio frequency structure 300 can be configured as a radio frequency circuit. In the second core plate 210 of the high-frequency structure 200 facing the bottom of the receiving groove 130, the conductive layer 212 facing the bottom of the receiving groove 130 has a functional region 2121, which accommodates the radio frequency structure 300. The fabrication method includes the following steps:

[0068] Forming a radio frequency structure 300 includes: removing a portion of the conductive layer 212 located within the functional region 2121, so that the remaining portion of the conductive layer 212 located within the functional region 2121 forms the radio frequency structure 300.

[0069] For example, after a conductive layer 212 is formed on the surface of a high-frequency substrate 211 and multiple second core boards 210 are pressed together along a first direction to form a high-frequency structure 200, a portion of the conductive layer 212 located on the first surface of the high-frequency structure 200 can be removed by etching or other means, so that the remaining portion of the conductive layer 212 located within the functional region 2121 forms a radio frequency structure 300, and the remaining portion of the conductive layer 212 located outside the functional region 2121 forms a conductive line, thereby realizing the electrical connection between the multiple second core boards 210.

[0070] By adopting the above technical solution, the formation process of the radio frequency structure 300 is made more convenient by reusing the conductive layer 212 of the second core board 210 to form the radio frequency structure 300. Furthermore, the radio frequency structure 300 can be flush-mounted in the conductive layer 212 of the second core board 210, excluding the functional area 2121, so that the radio frequency structure 300 will not protrude from the surface of the high-frequency substrate 211 relative to the conductive layer 212, thereby making the radio frequency structure 300 more stable.

[0071] Furthermore, when the RF structure 300 is disposed on the surface of the lamination structure 100, the RF structure 300 can be made by forming a thick copper layer on the surface of the lamination structure 100. It is easy to understand that the thickness of the thick copper layer forming the surface of the lamination structure 100 is greater than the thickness of the conductive layer 212 of the second core board 210. The processing accuracy error of the thick copper layer is usually greater than or equal to 2 mils, while the processing accuracy error of the conductive layer 212 of the second core board 210 is less than or equal to 1 mil. Therefore, by reusing the conductive layer 212 of the second core board 210 to form the RF structure 300, the processing accuracy error of the RF structure 300 is reduced, thereby improving the processing quality of the RF structure 300.

[0072] It is easy to understand that when the RF structure 300 is disposed on the surface of the lamination structure 100, the plurality of first core boards 110 in the lamination structure 100 need to be formed by covering the surface of the high-frequency substrate 211 with a conductive layer 212. In this embodiment, only the second core board 210 in the high-frequency structure 200 needs to be made of the high-frequency substrate 211. The plurality of first core boards 110 in the lamination structure 100 can be formed by covering the surface of the substrate with a conductive layer 212, so that the first core board 110 in the lamination structure 100 does not need to be made of the high-frequency substrate 211. Moreover, the cost of the high-frequency substrate 211 is higher than the cost of the substrate, so that the printed circuit board provided in this embodiment can reduce the manufacturing cost of the printed circuit board.

[0073] S102, A receiving groove 130 is formed on the first surface of the pressing structure 100;

[0074] Reference Figures 1-4In some possible implementations, a portion of the press-fit structure 100 can be removed from the first surface of the press-fit structure 100 by means of drilling or milling to form a receiving groove 130. Taking a plane perpendicular to the first direction as the cross-section, the cross-sectional shape of the receiving groove 130 is set to square, so that the receiving groove 130 can play a certain positioning role in the installation process of the high-frequency structure 200 and reduce the possibility of the high-frequency structure 200 moving within the receiving groove 130.

[0075] For example, taking a plane perpendicular to the first direction as the cross-section, the cross-sectional area of ​​the receiving groove 130 can be greater than or equal to the cross-sectional area of ​​the high-frequency structure 200, so as to make the installation process of the high-frequency structure 200 in the receiving groove 130 more convenient.

[0076] S103. The high-frequency structure 200 and the radio frequency structure 300 are fixed in the receiving groove 130. The first surface of the high-frequency structure 200 faces the bottom of the receiving groove 130, the second surface of the high-frequency structure 200 is away from the bottom of the receiving groove 130, and the high-frequency structure 200 is electrically connected to the pressing structure 100.

[0077] Reference Figure 2 , Figures 4-6 In some possible implementations, fixing the high-frequency structure 200 and the radio frequency structure 300 within the receiving groove 130 includes the following steps: forming a weak flow adhesive layer 131 at the bottom of the receiving groove 130; forming a separator layer 400 in the weak flow adhesive layer 131.

[0078] For example, a liquid weak-flow adhesive layer 131 can be filled into the bottom of the receiving tank 130 by filling or coating, and then the liquid weak-flow adhesive layer 131 can be cured to form a weak-flow adhesive layer 131, thereby enabling the high-frequency structure 200 to be relatively fixed to the pressing structure 100 through the weak-flow adhesive layer 131.

[0079] Then, a separator layer 400 can be formed on the weak flow adhesive layer 131 by means of bonding or the like, so that the separator layer 400 covers part of the weak flow adhesive layer 131; or, forming a separator layer 400 on the weak flow adhesive layer 131 may further include the following steps:

[0080] S1031, A mounting groove 1311 is formed in the weak flow adhesive layer 131;

[0081] Part of the weak flow adhesive layer 131 can be removed from the surface of the weak flow adhesive layer 131 by drilling or milling to form the mounting groove 1311; the shape of the mounting groove 1311 can be adjusted according to the shape of the separator layer 400, for example, the shape of the mounting groove 1311 can be set to square.

[0082] The size of the mounting groove 1311 is larger than the size of the separator layer 400, so that the separator layer 400 is more convenient in the process of forming the mounting groove 1311. The depth of the mounting groove 1311 can be equal to the thickness of the weak flow adhesive layer 131, or the depth of the mounting groove 1311 can be less than the depth of the weak flow adhesive layer 131.

[0083] S1032. A separation layer 400 is formed in the mounting groove 1311. The surface of the separation layer 400 facing away from the bottom of the mounting groove 1311 is flush with the weak flow adhesive layer 131.

[0084] For example, the partition layer 400 can be pasted into the mounting groove 1311 by means of adhesive bonding, so that the partition layer 400 is bonded to the inner wall of the mounting groove 1311, and the surface of the partition layer 400 facing away from the bottom of the mounting groove 1311 is flush with the weak flow adhesive layer 131, thereby realizing the process of fixing the partition layer 400 into the mounting groove 1311.

[0085] S1033. The high-frequency structure 200 and the radio frequency structure 300 are placed in the receiving groove 130, and the surface of the radio frequency structure 300 facing away from the high-frequency structure 200 is bonded with the separation layer 400.

[0086] Reference Figures 4-7 In some possible implementations, the high-frequency structure 200 and the radio frequency structure 300 are placed in the receiving groove 130 such that the first surface of the high-frequency structure 200 faces the bottom of the receiving groove 130 and the second surface of the high-frequency structure 200 faces away from the bottom of the receiving groove 130; the surface of the radio frequency structure 300 facing away from the high-frequency structure 200 is bonded with the separation layer 400, and the high-frequency structure 200 is bonded with the weak flow adhesive layer 131.

[0087] Furthermore, a gap is formed between the bottom of the functional groove and the separator layer 400 in the plane containing the bottom of the functional groove, and the gap is greater than or equal to 20 mils. For example, the gap can be set to one of 20 mils, 30 mils, or 40 mils to facilitate the removal process of the separator layer 400.

[0088] S1034, pressing high-frequency structure 200 and pressing structure 100, so that the weak flow adhesive layer 131 of which has not formed the separator layer 400 is attached to the first surface of high-frequency structure 200;

[0089] For example, the high-frequency structure 200 and the pressing structure 100 are pressed together so that the portion of the weak flow adhesive layer 131 that has not formed the separator layer 400 is attached to the first surface of the high-frequency structure 200, thereby bonding the high-frequency structure 200 to the pressing structure 100 through the weak flow adhesive layer 131, so as to realize the process of installing the high-frequency structure 200 in the receiving groove 130.

[0090] Reference Figures 8-11After pressing the high-frequency structure 200 and the pressing structure 100, the preparation method further includes the following steps:

[0091] A functional groove is formed on the second surface of the press-fit structure 100, the functional groove is connected to the receiving groove 130, and the partition layer 400 is exposed; the partition layer 400 is removed so that the radio frequency structure 300 is disposed in the functional groove, or the radio frequency structure 300 forms the bottom of the functional groove so that the radio frequency structure 300 is exposed by forming the functional groove in the press-fit structure 100.

[0092] Reference Figure 8 and Figure 9 For example, the functional slot is configured as a through slot 140, with at least a portion of the high-frequency structure 200 and at least a portion of the radio frequency structure 300 located within the through slot 140. This through-hole provides some heat dissipation for the high-frequency structure 200 and the radio frequency structure 300, improving their heat dissipation efficiency and ensuring the normal operation of the radio frequency structure 300. Furthermore, the fabrication method includes the following steps:

[0093] A first metal layer 160 is formed on the first surface of the press-fit structure 100; the first metal layer 160 at least partially covers the second surface of the high-frequency structure 200; the first metal layer 160 is provided with a first opening 161; the first opening 161 is superimposed on the through groove 140; and along the thickness direction of the press-fit structure 100, the orthographic projection of the first opening 161 accommodates the orthographic projection of the through groove 140.

[0094] A second metal layer 170 is formed on the second surface of the press-fit structure 100; the second metal layer 170 is provided with a second opening 171, which is disposed concurrently with the through groove 140, and the orthographic projection of the second opening 171 accommodates the orthographic projection of the through groove 140 along the thickness direction of the press-fit structure 100.

[0095] By setting the cross-sectional area of ​​the first opening 161 to be greater than the cross-sectional area of ​​the through slot 140, and setting the cross-sectional area of ​​the second opening 171 to be greater than the cross-sectional area of ​​the through slot 140, the second metal layer 170, the lamination structure 100, and the high-frequency structure 200 can be arranged in a stepped manner, thereby reducing the interference of the RF structure 300 from the first core board 110, the first metal layer 160, and the second metal layer 170 in the lamination structure 100, and ensuring the stability of the RF structure 300's operation; and by placing the RF structure 300 inside the lamination structure 100, the possibility of damage to the RF structure 300 during the printed circuit board manufacturing process is reduced.

[0096] Or, refer to Figure 10 and Figure 11The functional slot is configured as a blind slot 150, and the radio frequency structure 300 forms the bottom of the blind slot 150. The blind slot 150 is connected to the receiving slot 130. In a first direction, the sum of the depth of the blind slot 150 and the depth of the receiving slot 130 is equal to the thickness of the pressing structure 100. At least a portion of the high-frequency structure 200 and at least a portion of the radio frequency structure 300 are located at one end of the blind slot 150 away from the second surface of the pressing structure 100. The fabrication method further includes the following steps:

[0097] A first metal layer 160 is formed on the first surface of the press-fit structure 100; the first metal layer 160 at least partially covers the second surface of the high-frequency structure 200.

[0098] A second metal layer 170 is formed on the second surface of the press-fit structure 100; the second metal layer 170 is provided with a second opening 171, which is disposed concurrently with the blind groove 150, and the orthographic projection of the second opening 171 accommodates the orthographic projection of the blind groove 150 along the thickness direction of the press-fit structure 100.

[0099] By setting the cross-sectional area of ​​the second opening 171 to be larger than that of the through hole, the second metal layer 170, the lamination structure 100, and the high-frequency structure 200 can be arranged in a stepped manner, thereby reducing the interference of the RF structure 300 from the first core board 110, the first metal layer 160, and the second metal layer 170 in the lamination structure 100, and ensuring the stability of the RF structure 300's operation. Furthermore, by placing the RF structure 300 inside the lamination structure 100, the possibility of damage to the RF structure 300 during the printed circuit board manufacturing process is reduced.

[0100] In summary, by forming a receiving groove 130 on the first surface of the pressing structure 100, the radio frequency structure 300 is electrically connected to the high frequency structure 200, and the radio frequency structure 300 and the high frequency structure 200 are disposed in the receiving groove 130, such that the first surface of the high frequency structure 200 faces the bottom of the receiving groove 130, the second surface of the high frequency structure 200 faces away from the bottom of the receiving groove 130, and the radio frequency structure 300 is disposed on the first surface of the high frequency structure 200 facing away from the opening of the receiving groove 130.

[0101] Compared with the printed circuit board manufacturing methods in related technologies, the printed circuit board manufacturing method provided in this application embodiment does not require forming the radio frequency structure 300 on the surface of the lamination structure 100. Therefore, the lamination structure 100 and the high frequency structure 200 can play a certain protective role for the radio frequency structure 300, reduce the possibility of damage to the radio frequency structure 300, and ensure the normal use of the printed circuit board.

[0102] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0103] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0104] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a printed circuit board, characterized in that, Includes the following steps: A pressing structure, a high-frequency structure, and a radio-frequency structure are provided, wherein the radio-frequency structure is disposed on a first surface of the high-frequency structure; A receiving groove is formed on the first surface of the pressed structure; The high-frequency structure and the radio frequency structure are fixed in the receiving groove, with the first surface of the high-frequency structure facing the bottom of the receiving groove, the second surface of the high-frequency structure facing away from the bottom of the receiving groove, and the high-frequency structure being electrically connected to the pressing structure. Fixing the high-frequency structure and the radio-frequency structure within the receiving groove includes the following steps: A weak flow adhesive layer is formed at the bottom of the receiving tank; A separation layer is formed in the weak flow adhesive layer; The high-frequency structure and the radio frequency structure are placed in the receiving groove, and the surface of the radio frequency structure facing away from the high-frequency structure is attached to the separator layer; The high-frequency structure and the pressed structure are pressed together so that the portion of the weak flow adhesive layer that has not formed the separator layer adheres to the first surface of the high-frequency structure; After pressing the high-frequency structure and the pressed structure, the preparation method further includes the following steps: A functional groove is formed on the second surface of the pressed structure, the functional groove communicating with the receiving groove, and the separating layer is exposed; The separator layer is removed so that the radio frequency structure is disposed within the functional slot, or the radio frequency structure forms the bottom of the functional slot.

2. The method for preparing a printed circuit board according to claim 1, characterized in that, Forming a separation layer in the weak flow adhesive layer includes the following steps: An installation groove is formed in the weak flow adhesive layer; The separator layer is formed in the mounting groove, and the surface of the separator layer facing away from the bottom of the mounting groove is flush with the weak flow adhesive layer.

3. The method for preparing a printed circuit board according to claim 1, characterized in that, Within the plane containing the bottom of the functional groove, a gap is formed between the bottom of the functional groove and the partition layer, and the gap is greater than or equal to 20 mils.

4. The method for preparing a printed circuit board according to claim 3, characterized in that, The functional slot is configured as a through slot, and the radio frequency structure is disposed within the through slot; Alternatively, the functional slot may be configured as a blind slot, with the radio frequency structure forming the bottom of the blind slot.

5. The method for preparing a printed circuit board according to claim 4, characterized in that, The functional groove is configured as a through groove, and the preparation method further includes the following steps: A first metal layer is formed on the first surface of the press-fit structure; the first metal layer at least partially covers the second surface of the high-frequency structure, the first metal layer is provided with a first opening, the first opening is coincidentally disposed in the through groove, and along the thickness direction of the press-fit structure, the orthographic projection of the first opening accommodates the orthographic projection of the through groove; A second metal layer is formed on the second surface of the press-fit structure; the second metal layer is provided with a second opening, which is disposed concurrently with the through groove, and the orthographic projection of the second opening accommodates the orthographic projection of the through groove along the thickness direction of the press-fit structure.

6. The method for preparing a printed circuit board according to claim 4, characterized in that, The functional slot is configured as a blind slot, and the preparation method further includes the following steps: A first metal layer is formed on the first surface of the press-fit structure; the first metal layer at least partially covers the second surface of the high-frequency structure. A second metal layer is formed on the second surface of the press-fit structure; the second metal layer is provided with a second opening, which is disposed concurrently with the blind groove, and the orthographic projection of the second opening accommodates the orthographic projection of the blind groove along the thickness direction of the press-fit structure.

7. The method for manufacturing a printed circuit board according to any one of claims 1-6, characterized in that, The pressing structure includes a plurality of first core plates stacked along a first direction, and the high-frequency structure includes a plurality of second core plates stacked along the first direction, wherein the number of second core plates is less than the number of first core plates. The second core board includes a high-frequency substrate and a conductive layer disposed on the surface of the high-frequency substrate.

8. The method for preparing a printed circuit board according to claim 7, characterized in that, The conductive layer has functional regions, and the preparation method includes the following steps: Forming the radio frequency structure includes: removing a portion of the conductive layer located within the functional region, so that the remaining portion of the conductive layer located within the functional region forms the radio frequency structure.

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