Display panel and display device

Abstract

The application provides a display panel and a display device. The display panel comprises an opening area and a partition area. The partition area is arranged at least partially around the periphery of the opening area. The display panel comprises an array substrate and an encapsulation layer. The array substrate comprises a substrate, a protrusion and an insulating layer. The protrusion is located in the partition area and is arranged between the substrate and the insulating layer. The array substrate comprises a groove. The groove is arranged through the insulating layer and the protrusion and penetrates part of the substrate. The encapsulation layer is arranged on the side of the insulating layer away from the substrate and in the groove. The encapsulation layer covers the inner wall of the groove. The display panel provided by the application is beneficial to making the combination of the encapsulation layer and the insulating layer smoother and denser, reducing the stress concentration of the encapsulation layer on the periphery of the groove, and thus is beneficial to improving the encapsulation reliability of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and a display device. Background Technology

[0002] Display panels are widely used in electronic devices such as mobile phones, tablets, monitors, and televisions due to their advantages such as flat panel design, low power consumption, no electromagnetic radiation, high resolution, high contrast, easy integration, and lightweight portability.

[0003] Display panels typically have through-hole openings to integrate functional components such as cameras and sensors. However, in related technologies, the presence of these openings severely impacts the packaging reliability of the display panel. Summary of the Invention

[0004] This application provides a display panel and a display device, which helps to improve the packaging reliability of the display panel.

[0005] In a first aspect, the display panel provided according to the embodiments of this application includes an opening area and a partition area. The partition area is disposed around at least a portion of the opening area. The display panel includes an array substrate and an encapsulation layer. The array substrate includes a substrate, a protrusion, and an insulating layer. The protrusion is located in the partition area and is disposed between the substrate and the insulating layer. The array substrate includes a groove that passes through the insulating layer and the protrusion and penetrates a portion of the substrate. The encapsulation layer is disposed on the side of the insulating layer away from the substrate and in the groove, and the encapsulation layer covers the inner wall of the groove.

[0006] In some embodiments, the cross-section of the protrusion gradually decreases in the direction from the substrate to the insulating layer, along the direction parallel to the display surface of the display panel.

[0007] In some embodiments, the surface of the protrusion facing the insulating layer is arc-shaped.

[0008] In some embodiments, the orthographic projection of the groove onto the substrate lies within the orthographic projection of the protrusion onto the substrate.

[0009] In some embodiments, the distance e between the center line of the groove and the center line of the protrusion satisfies: 0 ≤ e ≤ 10 μm.

[0010] In some embodiments, the maximum angle between the cross-section of the protrusion facing the insulating layer and the surface of the substrate facing the insulating layer is θ, where 0 < θ < 90°.

[0011] In some embodiments, 10°≤θ≤50°.

[0012] In some embodiments, the display panel further includes a dam disposed in the partition area and between the insulating layer and the encapsulation layer, with protrusions and grooves disposed on the side of the dam near the opening area.

[0013] In some embodiments, protrusions and grooves are also provided on the side of the dam away from the orifice area.

[0014] In some embodiments, the display panel further includes a display area disposed on the side of the partition area opposite to the opening area, with a plurality of grooves and a plurality of protrusions spaced apart in the direction from the opening area to the display area.

[0015] In some embodiments, a plurality of grooves and a plurality of protrusions are spaced apart along the circumference of the opening area.

[0016] In some embodiments, a plurality of grooves and a plurality of protrusions are arranged in a ring array around the opening area.

[0017] In some embodiments, the grooves and protrusions are provided in a one-to-one correspondence.

[0018] In some embodiments, the protrusions are made of organic materials.

[0019] In some embodiments, the protruding material includes at least one of polyimide and resin.

[0020] In some embodiments, the encapsulation layer includes at least a first encapsulation sublayer and a second encapsulation sublayer. The second encapsulation sublayer is disposed on the side of the first encapsulation sublayer facing away from the substrate. The first encapsulation sublayer also covers the inner wall of the groove. The second encapsulation sublayer is also disposed in the groove and is attached to the first encapsulation sublayer.

[0021] In some embodiments, the material of the encapsulation layer includes inorganic materials.

[0022] In some embodiments, the insulating layer includes at least a first insulator layer and a second insulator layer, the second insulator layer being disposed on the side of the first insulator layer away from the substrate, and the groove being disposed through the first insulator layer and the second insulator layer.

[0023] In some embodiments, the insulating layer is made of inorganic materials.

[0024] In some embodiments, the insulating layer is made of at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0025] In some embodiments, the display panel further includes a light-emitting layer disposed between the encapsulation layer and the insulating layer, with a groove penetrating through the light-emitting layer.

[0026] Secondly, embodiments of this application provide a display device, including the display panel provided in any of the above embodiments.

[0027] The display panel and display device provided in this application embodiment, by setting a protrusion between the substrate and the insulating layer and setting a groove through the protrusion, facilitates a smoother and denser bonding between the encapsulation layer and the insulating layer during the subsequent preparation of the encapsulation layer, reduces stress concentration on the periphery of the encapsulation layer of the groove, and thus improves the encapsulation reliability of the display panel. Attached Figure Description

[0028] The features, advantages, and technical effects of exemplary embodiments of the present application will now be described with reference to the accompanying drawings. In the drawings, the same parts are referred to by the same reference numerals. The drawings are not drawn to scale.

[0029] Figure 1 A front view of a display panel provided in an embodiment of this application;

[0030] Figure 2 for Figure 1 A schematic diagram of a cross-sectional structure along BB;

[0031] Figure 3 for Figure 2 A magnified view of a section at point C;

[0032] Figure 4 for Figure 1 Another sectional view of the structure along BB;

[0033] Figure 5 for Figure 4 A magnified view of a section at point D;

[0034] Figure 6 Annotated diagram of the display device provided in the embodiments of this application.

[0035] The accompanying drawings are not necessarily drawn to scale.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100. Display panel;

[0038] 110, array substrate; 110a, groove; 111, substrate; 112, protrusion; 113, insulating layer; 1131, first insulator layer; 1132, second insulator layer;

[0039] 120. Encapsulation layer; 121. First encapsulation sublayer; 122. Second encapsulation sublayer;

[0040] 130. Dam;

[0041] 10. Display device;

[0042] KK, Opening area; GL, Partition area; AA, Display area. Detailed Implementation

[0043] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0044] Furthermore, for the sake of understanding and ease of description, the dimensions and thicknesses of each configuration shown in the figures are arbitrarily illustrated, but the concept of this application is not limited thereto. In the figures, the thicknesses of layers, films, panels, and regions, etc., are enlarged for clarity. In the figures, the thicknesses of some layers and regions are enlarged for better understanding and ease of description.

[0045] It is understandable that when an element such as a layer, film, region, or substrate is described as being "on" another element, the element may be directly on that other element, or there may be intermediate elements present. In contrast, when an element is described as being "directly on" another element, there are no intermediate elements present. Furthermore, throughout the specification, the phrase "on" the target element indicates that it is positioned above or below the target element and does not necessarily indicate that it is positioned "on the upper side" based on the direction of gravity.

[0046] Furthermore, unless explicitly stated otherwise, the word "including" will be understood to include the stated elements but not exclude any other elements.

[0047] Display panels are widely used in electronic devices such as mobile phones and tablets. To achieve functions such as camera and fingerprint recognition in display panels, such as OLED (Organic Light Emitting Diode) display panels, openings are typically set in the display panel, and camera elements or photosensitive elements are placed within these openings. Through long-term research, the inventors discovered that during the encapsulation process, the presence of these openings in display panels can easily cause stress concentration in areas of the encapsulation layer near the openings, severely affecting the encapsulation reliability of the display panel.

[0048] In view of the above, this application provides a display panel and a display device. The following will describe various embodiments of the display panel and the display device with reference to the accompanying drawings.

[0049] like Figure 1 , Figure 2 and Figure 3 As shown, the display panel 100 provided according to an embodiment of this application includes an opening area KK and a partition area GL, with the partition area GL surrounding at least a portion of the peripheral side of the opening area KK. The display panel 100 includes an array substrate 110 and an encapsulation layer 120. The array substrate 110 includes a substrate 111, a protrusion 112, and an insulating layer 113. The protrusion 112 is located in the partition area GL and is disposed between the substrate 111 and the insulating layer 113. The array substrate 110 includes a groove 110a, which passes through the insulating layer 113 and the protrusion 112, and penetrates a portion of the substrate 111. The encapsulation layer 120 is disposed on the side of the insulating layer 113 facing away from the substrate 111 and within the groove 110a, and the encapsulation layer 120 covers the inner wall of the groove 110a.

[0050] The opening area KK can be a through hole that penetrates the display panel 100. A camera element or a photosensitive element is disposed within the opening area KK to achieve corresponding camera or fingerprint recognition functions. The partition area GL is disposed around at least part of the periphery of the opening area KK. Depending on the structure of the display panel 100 and the position of the opening area KK, the partition area GL can be disposed around the entire periphery of the opening area KK, or it can be disposed around a portion of the periphery of the opening area KK.

[0051] The display panel 100 may include a display area AA to realize the display function of the display panel 100. The partition area GL may be the part located between the display area AA and the opening area KK of the display panel 100. The encapsulation layer 120 may be connected to the insulating layer 113 in the partition area GL to encapsulate the display area AA and reduce the risk of external water, oxygen and other substances entering the interior of the display panel 100 and causing corrosion to the light-emitting elements inside the display panel 100.

[0052] The display panel 100 may also include a light-emitting layer, such as a cathode layer or an electron blocking layer, hole blocking layer, or other film layer. The light-emitting layer may be disposed between the insulating layer 113 and the encapsulation layer 120 and disposed as a whole layer, that is, it is disposed in both the display area AA and the isolation area GL of the display panel 100.

[0053] The array substrate 110 includes a substrate 111, which may include insulating materials such as PI (Polyimide). The array substrate 110 may also include a pixel driving circuit, which is electrically connected to the light-emitting element of the display panel 100 to drive the light-emitting element to emit light.

[0054] The protrusion 112 may be made of an insulating material, which may include inorganic insulating materials or organic insulating materials. The shape of the protrusion 112 may be set according to the specific process. For example, the protrusion 112 may be an upwardly convex arc shape along the cross-sectional profile perpendicular to the display surface of the display panel 100.

[0055] It is understood that the protrusion 112 is disposed in the partition area GL, and the display panel 100 may have one or more protrusions 112. When the display panel 100 has multiple protrusions 112, the multiple protrusions 112 may be arranged at intervals around the opening area KK. For example, the multiple protrusions 112 are arranged in a ring array around the opening area KK. The protrusion 112 may be manufactured by processes such as dispensing or coating and developing.

[0056] The groove 110a penetrates the insulating layer 113 and the protrusion 112. Since the groove 110a extends through the insulating layer 113 and the protrusion 112 along its thickness direction, it can be formed by etching or other processes after the insulating layer 113, the protrusion 112, and the light-emitting layer are prepared, but before the encapsulation layer 120 is prepared. It is understood that the groove 110a allows the light-emitting layer of the display panel 100, such as the cathode or vapor-deposited material, to be interrupted at the groove 110a, reducing the risk of water, vapor, etc., entering the display area AA from the opening area KK along the cathode or vapor-deposited material, causing display panel 100 display failure.

[0057] If the groove 110a passes through the protrusion 112, then the groove 110a passes through the interior of the protrusion 112, that is, the groove 110a is a certain distance away from the edge of the protrusion 112.

[0058] After the groove 110a is formed, an encapsulation layer 120 can be prepared by processes such as deposition, so that the encapsulation layer 120 covers the insulating layer 113 and the inner wall of the groove 110a. It is understood that the groove 110a may include a bottom wall and side walls, and after the encapsulation layer 120 is formed, it covers the bottom wall and side walls of the groove 110a. The encapsulation layer 120 can prevent external impurities such as water and oxygen from entering the display panel 100, thereby reducing the risk of external impurities entering the interior of the display panel 100 and corroding related internal structures.

[0059] The protrusion 112 is disposed between the substrate 111 and the insulating layer 113. The presence of the protrusion 112 raises the insulating layer 113 by a certain angle. Thus, after the groove 110a is formed on the protrusion 112, during the preparation of the encapsulation layer 120, the encapsulation layer 120 on the periphery of the groove 110a contacts the insulating layer 113 more smoothly, and the joint between the two has better density. This is beneficial to improving the reliability of the joint between the encapsulation layer 120 and the insulating layer 113, and thus beneficial to improving the encapsulation reliability of the display panel 100.

[0060] The insulating layer 113 may include a single-layer structure, meaning that the insulating layer 113 is formed through a single process, or the insulating layer 113 may include a multi-layer structure, meaning that the insulating layer 113 is formed through multiple processes. Similarly, the encapsulation layer 120 may include a single-layer structure or a multi-layer structure.

[0061] The display panel 100 provided in this application embodiment has a protrusion 112 between the substrate 111 and the insulating layer 113, and a groove 110a is provided through the protrusion 112. In the subsequent preparation of the encapsulation layer 120, it is beneficial to improve the smoothness and density of the bonding between the encapsulation layer 120 and the insulating layer 113, reduce the stress concentration of the encapsulation layer 120 around the groove 110a, and thus improve the encapsulation reliability of the display panel 100.

[0062] Please continue reading. Figure 1 , Figure 2 and Figure 3 In some embodiments, the cross-section of the protrusion 112 gradually decreases in the direction from the substrate 111 to the insulating layer 113, along the direction parallel to the display surface of the display panel 100.

[0063] Thus, the surface of the protrusion 112 facing the insulating layer 113 can be inclined. Optionally, the surface of the protrusion 112 facing the insulating layer 113 can be flat or curved. For example, the surface of the protrusion 112 facing the insulating layer 113 is arc-shaped and protrudes towards the insulating layer 113.

[0064] As the protrusion 112 is positioned in the direction from the substrate 111 to the insulating layer 113, the cross-section of the protrusion 112 gradually decreases along the direction parallel to the display surface of the display panel 100. This causes the angle between the contact surface of the encapsulation layer 120 and the insulating layer 113 on the periphery of the groove 110a and the display surface of the display panel 100 to gradually change, making abrupt changes less likely. This further improves the smoothness of the contact between the encapsulation layer 120 and the insulating layer 113, further reduces the risk of stress concentration in the encapsulation layer 120 on the periphery of the groove 110a, improves the reliability of the encapsulation layer 120 structure, and further improves the encapsulation reliability of the display panel 100.

[0065] like Figure 2 and Figure 3 As shown, in some embodiments, the surface of the protrusion 112 facing the insulating layer 113 is arc-shaped.

[0066] This helps to further improve the smoothness of the contact between the encapsulation layer 120 and the insulating layer 113 on the periphery of the groove 110a, further reduce the risk of stress concentration in the encapsulation layer 120, improve the bonding strength between the encapsulation layer 120 and the insulating layer 113, and thus improve the encapsulation reliability of the display panel 100.

[0067] Please continue reading. Figure 2 and Figure 3 In some embodiments, the orthographic projection of the groove 110a onto the substrate 111 lies within the orthographic projection of the protrusion 112 onto the substrate 111.

[0068] Thus, the groove 110a passes through the interior of the protrusion 112, and the encapsulation layer 120 is bonded to the protrusion 112 on all sides of the protrusion 112, so that the encapsulation layer 120 is raised to a certain extent on the entire periphery of the protrusion 112. This is beneficial to further improve the smoothness and density of the bond between the encapsulation layer 120 and the insulating layer 113, and reduce the risk of stress concentration in the encapsulation layer 120 on the periphery of the groove 110a.

[0069] Please continue reading. Figure 2 and Figure 3 In some embodiments, the distance e between the center line of the groove 110a and the center line of the protrusion 112 satisfies: 0≤e≤10μm.

[0070] For example, e can be 0, 1μm, 2μm, 3μm, 4μm or 5μm, etc. In this way, the center line of the groove 110a is made to coincide with the center line of the protrusion 112 as much as possible, so that after the encapsulation layer 120 is combined with the periphery of the protrusion 112, the stress of the encapsulation layer 120 has a high consistency, which helps to further reduce the risk of stress concentration in the encapsulation layer 120.

[0071] like Figure 2 and Figure 3 As shown, in some embodiments, the maximum angle between the cross-section of the protrusion 112 facing the insulating layer 113 and the surface of the substrate 111 facing the insulating layer 113 is θ, where 0 < θ < 90°.

[0072] It is understandable that the surface of the protrusion 112 facing the insulating layer 113 can be arc-shaped, so it can have multiple cross-sections. Therefore, the angle between the corresponding cross-section and the surface of the substrate 111 facing the insulating layer 113 can be multiple, and θ is the largest angle among the multiple angles between the multiple cross-sections of the protrusion 112 and the surface of the substrate 111 facing the insulating layer 113.

[0073] For example, θ can be 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, or 85°, etc.

[0074] After systematic analysis and long-term practice, the inventors discovered that setting 0 < θ < 90° is beneficial to improving the smoothness of the bonding between the encapsulation layer 120 and the insulating layer 113 on the periphery of the groove 110a, reducing the risk of stress concentration in the encapsulation layer 120, and thus improving the reliability of the encapsulation.

[0075] like Figure 2 and Figure 3 As shown, in some embodiments, preferably, 10°≤θ≤50°.

[0076] Optionally, θ can be 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, or 50°, etc.

[0077] After systematic analysis and practice, the inventors discovered that setting 10°≤θ≤50° is beneficial to greatly improve the smoothness of the bonding between the encapsulation layer 120 and the insulating layer 113 on the periphery of the groove 110a, reduce the risk of stress concentration in the encapsulation layer 120, and thus improve the reliability of the encapsulation.

[0078] In some embodiments, the display panel 100 further includes a dam 130, which is disposed in the partition area GL and between the insulating layer 113 and the encapsulation layer 120. A protrusion 112 and a groove 110a are disposed on the side of the dam 130 near the opening area KK.

[0079] During the encapsulation process of the display panel 100, some film layers are formed by inkjet printing. The dam 130 can prevent the flow of ink during inkjet printing to facilitate the formation of the corresponding film layers.

[0080] If the dam 130 is located in the partition area GL, then the dam 130 is located between the opening area KK and the display area AA of the display panel 100. If the protrusion 112 and the groove 110a are located on the side of the dam 130 closer to the opening area KK, then the protrusion 112 is located between the dam 130 and the opening area KK, and the groove 110a is provided at the protrusion 112. That is, the protrusion 112 and the groove 110a are located between the opening area KK and the dam 130. In this way, the protrusion 112 and the groove 110a are located in the partition area GL closer to the edge of the opening area KK. This helps to reduce the stress concentration of the encapsulation layer 120 to a greater extent, thereby greatly improving the encapsulation reliability of the display panel 100.

[0081] like Figure 1 As shown in Figure 2, in some embodiments, the protrusion 112 and the groove 110a are also provided on the side of the dam 130 away from the hole area KK.

[0082] Thus, the protrusion 112 and the groove 110a are provided between the dam 130 and the display area AA of the display panel 100, which helps to improve the encapsulation reliability of the encapsulation layer 120 between the dam 130 and the display area AA, and further helps to improve the encapsulation reliability of the display panel 100.

[0083] Please continue reading. Figure 1 and Figure 2In some embodiments, the display panel 100 further includes a display area AA, which is located on the side of the partition area GL facing away from the opening area KK, and in the direction from the opening area KK to the display area AA. A plurality of grooves 110a and a plurality of protrusions 112 are spaced apart.

[0084] Thus, in the direction from the opening area KK to the display area AA, there are multiple protrusions 112 and multiple grooves 110a. The multiple grooves 110a can better prevent impurities such as water and oxygen from entering the display area AA through the opening area KK. The multiple protrusions 112 help to further improve the smoothness of the bonding between the encapsulation layer 120 and the insulating layer 113, thereby reducing the risk of stress concentration in the encapsulation layer 120, which helps to improve the reliability of the encapsulation layer 120, and thus improves the encapsulation reliability of the display panel 100.

[0085] In some embodiments, a plurality of grooves 110a and a plurality of protrusions 112 are spaced apart along the circumferential direction of the opening region KK.

[0086] Thus, multiple grooves 110a and protrusions 112 are spaced around the opening area KK at approximately circumference. This helps to further reduce the possibility of external impurities such as water and oxygen entering the display area AA through the opening area KK, and also helps to improve the packaging reliability of the display panel 100.

[0087] In some embodiments, a plurality of grooves 110a and a plurality of protrusions 112 are arranged in a ring array around the opening area KK.

[0088] The arrangement of multiple grooves 110a and multiple protrusions 112 surrounding the opening area KK in multiple rings helps to further reduce the risk of external impurities such as water and oxygen entering the display area AA of the display panel 100 through the opening area KK, and also helps to further ensure the packaging reliability of the display panel 100.

[0089] In some embodiments, the groove 110a and the protrusion 112 are provided in a one-to-one correspondence.

[0090] Thus, the grooves 110a are all through the protrusions 112, which helps to reduce the risk of external impurities such as water and oxygen entering the display area AA of the display panel 100 through the opening area KK, while ensuring the packaging reliability of the display panel 100.

[0091] In some embodiments, the material of the protrusion 112 includes an organic material.

[0092] It is understandable that the materials used to create the protrusion 112 include organic materials. Organic materials can be used to form the protrusion 112 in one step through processes such as dispensing, coating, and developing, which simplifies the fabrication process of the protrusion 112. In addition, organic materials have a certain degree of elasticity, which gives the protrusion 112 a good shock-absorbing effect, reducing the risk of cracks in the display panel 100 and helping to widen the process window for manufacturing the display panel 100. Furthermore, it also helps to improve the density of the encapsulation layer 120 and other related film layers around the groove 110a, which helps to improve the reliability of the display panel 100 in subsequent temperature and humidity environmental tests.

[0093] It is understood that the material of the protrusion 112 includes at least one of polyimide and resin. The preparation process of the protrusion 112 using polyimide and resin is simple, and the materials of polyimide and resin are relatively economical and readily available, which helps to reduce the processing cost of the display panel 100.

[0094] like Figure 1 , Figure 4 and Figure 5 As shown, in some embodiments, the encapsulation layer 120 includes at least a first encapsulation sublayer 121 and a second encapsulation sublayer 122. The second encapsulation sublayer 122 is disposed on the side of the first encapsulation sublayer 121 away from the substrate 111. The first encapsulation sublayer 121 also covers the inner wall of the groove 110a. The second encapsulation sublayer 122 is also disposed in the groove 110a and is attached to the first encapsulation sublayer 121.

[0095] The encapsulation layer 120 includes at least a first encapsulation sublayer 121 and a second encapsulation sublayer 122. Alternatively, the encapsulation layer 120 may include only one first encapsulation sublayer 121 and at least one second encapsulation sublayer 122, or the encapsulation layer 120 may also include other film layers.

[0096] The encapsulation layer 120 includes at least a first encapsulation sublayer 121 and a second encapsulation sublayer 122, and both the first encapsulation sublayer 121 and the second encapsulation sublayer 122 are partially located within the groove 110a. In this way, if one of them fails, the other can still prevent impurities such as water and oxygen from entering the interior of the display panel 100, which helps to further improve the encapsulation reliability of the display panel 100.

[0097] In addition, by providing the encapsulation layer 120 including a first encapsulation sub-layer 121 and a second encapsulation sub-layer 122, it is beneficial to reduce the thickness of the first encapsulation sub-layer 121 that is directly bonded to the insulating layer 113, thereby improving the smoothness of the bond between the first encapsulation sub-layer 121 and the insulating layer 113 and reducing the risk of stress concentration in the encapsulation layer 120.

[0098] In some embodiments, the material of the encapsulation layer 120 includes inorganic materials.

[0099] It is understandable that inorganic materials have a good ability to block water and oxygen. The inclusion of inorganic materials in the encapsulation layer 120 is beneficial to further improve the ability of the encapsulation layer 120 to block impurities such as water and oxygen.

[0100] Please continue reading. Figure 1 , Figure 4 and Figure 5 In some embodiments, the insulating layer 113 includes at least a first insulator layer 1131 and a second insulator layer 1132, with the second insulator layer 1132 disposed on the side of the first insulator layer 1131 facing away from the substrate 111, and the groove 110a is disposed through the first insulator layer 1131 and the second insulator layer 1132.

[0101] The insulating layer 113 includes at least a first insulator layer 1131 and a second insulator layer 1132. Alternatively, the insulating layer 113 may include only one first insulator layer 1131 and at least one second insulator layer 1132, or the insulating layer 113 may include other film layers.

[0102] The insulating layer 113 includes at least a first insulator layer 1131 and a second insulator layer 1132. The groove 110a is provided through the first insulator layer 1131 and the second insulator layer 1132. In this way, during the formation of the encapsulation layer 120, the encapsulation layer 120 is bonded to the first insulator layer 1131 and the second insulator layer 1132 within the groove 110a. This helps to further improve the bonding strength between the encapsulation layer 120 and the insulating layer 113, thereby improving the encapsulation reliability of the display panel 100.

[0103] In some embodiments, the material of the insulating layer 113 includes inorganic materials.

[0104] Inorganic materials have a good effect on blocking impurities such as water and oxygen. The material of the insulating layer 113 includes inorganic materials, which helps to reduce the risk of external impurities such as water and oxygen entering the array substrate 110 and causing certain corrosion to the relevant pixel driving circuit.

[0105] In some embodiments, the material of the insulating layer 113 includes at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0106] Silicon oxide, silicon nitride, and silicon oxynitride have good insulating properties and are easy to process. Therefore, the material for the insulating layer 113 includes at least one of silicon oxide, silicon nitride, and silicon oxynitride, which helps to simplify the preparation process of the insulating layer 113 while ensuring its insulating effect.

[0107] In some embodiments, the display panel 100 further includes a light-emitting layer disposed between the encapsulation layer 120 and the insulating layer 113, and the groove 110a is disposed through the light-emitting layer.

[0108] The light-emitting layer may include a cathode layer and an electron transport layer, an electron blocking layer, a hole blocking layer, a hole transport layer, etc., which are integrally deposited by a vapor deposition process.

[0109] By setting the light-emitting layer between the display encapsulation layer 120 and the insulating layer 113, and by setting a groove 110a through the light-emitting layer, the light-emitting layer can be disconnected at the groove 110a. This reduces the risk of external impurities such as water and oxygen entering the display area AA of the display panel 100 along the light-emitting layer, thereby corroding the light-emitting elements inside the display panel 100 and affecting the normal display of the display panel 100. This is beneficial to improving the display reliability of the display panel 100.

[0110] like Figure 6 As shown, the display device 10 provided according to the embodiments of this application includes the display panel 100 provided in any of the above embodiments.

[0111] The display device 10 in this application embodiment includes, but is not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0112] The display device 10 provided in this application embodiment has the same technical effect as the display panel 100 provided in any of the above embodiments, and will not be described again here.

[0113] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, The display panel includes an opening area and a partition area, the partition area being disposed around at least a portion of the periphery of the opening area, and the display panel comprising: An array substrate includes a substrate, a protrusion, and an insulating layer. The protrusion is located in the partition region and is disposed between the substrate and the insulating layer. The array substrate includes a groove that passes through the insulating layer and the protrusion and penetrates a portion of the substrate. An encapsulation layer is disposed on the side of the insulating layer opposite to the substrate and within the groove, the encapsulation layer covering the inner wall of the groove; The display panel further includes a light-emitting layer disposed between the encapsulation layer and the insulating layer. The protrusion is located on the side of the insulating layer away from the light-emitting layer and on the periphery of the groove, for raising the insulating layer so that the encapsulation layer and the insulating layer are smoothly connected. In the direction from the substrate to the insulating layer, the cross-section of the protrusion gradually decreases along the direction parallel to the display surface of the display panel.

2. The display panel according to claim 1, characterized in that, The surface of the protrusion facing the insulating layer is arc-shaped.

3. The display panel according to claim 1, characterized in that, The groove's orthogonal projection onto the substrate lies within the protrusion's orthogonal projection onto the substrate.

4. The display panel according to claim 1, characterized in that, The distance e between the center line of the groove and the center line of the protrusion satisfies: 0 ≤ e ≤ 10 μm.

5. The display panel according to claim 1, characterized in that, The maximum angle between the cross-section of the protrusion facing the insulating layer and the surface of the substrate facing the insulating layer is θ, where 0 < θ < 90°.

6. The display panel according to claim 5, characterized in that, 10°≤θ≤50°.

7. The display panel according to any one of claims 1 to 6, characterized in that, The display panel also includes a dam, which is located in the partition area and between the insulating layer and the encapsulation layer. The protrusion and the groove are located on the side of the dam near the opening area.

8. The display panel according to claim 7, characterized in that, The protrusion and the groove are also provided on the side of the dam away from the opening area.

9. The display panel according to claim 1, characterized in that, The display panel further includes a display area, which is located on the side of the partition area opposite to the opening area. In the direction from the opening area to the display area, a plurality of grooves and a plurality of protrusions are spaced apart.

10. The display panel according to claim 1, characterized in that, Along the circumference of the opening area, a plurality of grooves and a plurality of protrusions are spaced apart.

11. The display panel according to claim 1, characterized in that, The plurality of grooves and the plurality of protrusions are arranged in a ring array around the opening area.

12. The display panel according to claim 1, characterized in that, The grooves and protrusions are arranged in a one-to-one correspondence.

13. The display panel according to claim 1, characterized in that, The protrusions are made of organic materials.

14. The display panel according to claim 1, characterized in that, The material of the protrusion includes at least one of polyimide and resin.

15. The display panel according to claim 1, characterized in that, The encapsulation layer includes at least a first encapsulation sublayer and a second encapsulation sublayer. The second encapsulation sublayer is disposed on the side of the first encapsulation sublayer facing away from the substrate. The first encapsulation sublayer also covers the inner wall of the groove. The second encapsulation sublayer is also disposed in the groove and is attached to the first encapsulation sublayer.

16. The display panel according to claim 1, characterized in that, The encapsulation layer is made of inorganic materials.

17. The display panel according to claim 1, characterized in that, The insulating layer includes at least a first insulator layer and a second insulator layer, the second insulator layer being disposed on the side of the first insulator layer away from the substrate, and the groove being disposed through the first insulator layer and the second insulator layer.

18. The display panel according to claim 1, characterized in that, The insulating layer is made of inorganic materials.

19. The display panel according to claim 1, characterized in that, The insulating layer is made of at least one of silicon oxide, silicon nitride, and silicon oxynitride.

20. The display panel according to claim 1, characterized in that, The groove extends through the light-emitting layer.

21. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 20.

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