Display device

Abstract

One embodiment of the display device includes: a substrate; a plurality of pixel circuits disposed on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes disposed on the insulating layer and respectively connected to the plurality of pixel circuits; an organic layer disposed on the plurality of first electrodes; a plurality of linear second electrodes disposed on the organic layer; a sensor region opposite to a sensor overlapping the substrate; a relay wiring disposed between the substrate and the insulating layer; and a first connection portion and a second connection portion. At least one of the plurality of second electrodes has a first line portion and a second line portion that are separated by the sensor region when viewed from above. The relay wiring is connected to the first line portion via the first connection portion and to the second line portion via the second connection portion.

Description

Technical Field

[0001] Embodiments of the present invention relate to display devices. Background Technology

[0002] In recent years, display devices using organic light-emitting diodes (OLEDs) as display elements have been put into practical use. These display elements include a first electrode, a second electrode, and an organic layer disposed between these electrodes.

[0003] There are cases where various sensors are overlapped and arranged in a display area containing multiple pixels. In this case, in order to avoid obstructing sensor detection, it may be necessary to create a configuration that differs from the rest of the display area.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent No. 5386554

[0007] Patent Document 2: Japanese Patent Application Publication No. 2008-135325

[0008] Patent Document 3: Japanese Patent Application Publication No. 2000-195677 Summary of the Invention

[0009] The purpose of this invention is to improve the structure of the sensor area opposite to the sensor and its vicinity in a display device in which the sensor is overlapped and arranged in the display area.

[0010] One embodiment of the display device includes: a substrate; a plurality of pixel circuits disposed on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes disposed on the insulating layer and respectively connected to the plurality of pixel circuits; an organic layer disposed on the plurality of first electrodes; a plurality of linear second electrodes disposed on the organic layer; a sensor region opposite to a sensor overlapping the substrate; a relay wiring disposed between the substrate and the insulating layer; and a first connection portion and a second connection portion. At least one of the plurality of second electrodes has a first line portion and a second line portion that are separated by the sensor region when viewed from above. The relay wiring is connected to the first line portion via the first connection portion and to the second line portion via the second connection portion.

[0011] A display device according to another embodiment includes: a substrate; a plurality of pixel circuits disposed on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes disposed on the insulating layer and respectively connected to the plurality of pixel circuits; an organic layer disposed on the plurality of first electrodes; a plurality of linear second electrodes disposed on the organic layer; and a sensor region opposite to a sensor overlapping the substrate. The sensor region is a region that includes the substrate and the insulating layer but does not include at least one of the first electrodes and the pixel circuits. At least one of the plurality of second electrodes traverses the sensor region.

[0012] Another embodiment of the display device includes: a substrate; a plurality of pixel circuits disposed on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes disposed on the insulating layer and respectively connected to the plurality of pixel circuits; an organic layer disposed on the plurality of first electrodes; a plurality of linear second electrodes disposed on the organic layer; a sensor region opposite to a sensor overlapping the substrate; and a conductive coating layer covering the sensor region. The sensor region is a region that includes the substrate and the insulating layer but does not include at least one of the first electrodes and the pixel circuits. The coating layer is connected to at least one of the plurality of second electrodes. Attached Figure Description

[0013] Figure 1 This is a diagram showing a structural example of the display device according to the first embodiment.

[0014] Figure 2 This is a diagram showing an example of the layout of subpixels in the first embodiment.

[0015] Figure 3 It is along Figure 2 A schematic cross-sectional view of the display device for line III-III.

[0016] Figure 4 This is a cross-sectional view showing an example of a layer structure that can be applied to organic layers.

[0017] Figure 5 This is a schematic cross-sectional view of the partition structure and its vicinity in the first embodiment.

[0018] Figure 6 This is a schematic top view of the second electrode, relay wiring, and sensor area in the first embodiment.

[0019] Figure 7 It is along Figure 6 A schematic cross-sectional view of the display device for lines VII-VII.

[0020] Figure 8This is a schematic top view of the second electrode, relay wiring, and sensor area in the second embodiment.

[0021] Figure 9 This is a schematic cross-sectional view of the first connecting part in the third embodiment.

[0022] Figure 10 This is a schematic top view of the second electrode, relay wiring, and sensor area in the fourth embodiment.

[0023] Figure 11 It is along Figure 10 A schematic cross-sectional view of the display device for the XI-XI line.

[0024] Figure 12 This is a schematic cross-sectional view showing another example of the construction of the first connecting part that can be applied to the fourth embodiment.

[0025] Figure 13 This is a schematic top view showing an example of a structure suitable for the trunk cabling in the fourth embodiment.

[0026] Figure 14 This is a schematic top view showing other structures of the trunk cabling that can be applied to the fourth embodiment.

[0027] Figure 15 This is a schematic top view of the second electrode and sensor area in the fifth embodiment.

[0028] Figure 16 It is along Figure 15 A schematic cross-sectional view of a display device with XVI-XVI lines.

[0029] Figure 17 This is a schematic cross-sectional view of another example of a display device applicable to the fifth embodiment.

[0030] Figure 18 This is a schematic top view of the second electrode and sensor area in the sixth embodiment.

[0031] Figure 19 This is a schematic cross-sectional view of the display device according to the seventh embodiment. Detailed Implementation

[0032] The following is a reference to the appendix. Figure 1 Several implementation methods will be explained below.

[0033] Furthermore, the disclosed content is merely an example in principle, and appropriate modifications that can be readily conceived by those skilled in the art to ensure the spirit of the invention are naturally included within the scope of this invention. Additionally, regarding the drawings, to make the description clearer, there are instances where the width, thickness, shape, etc., of various parts are schematically shown compared to the actual form; however, this is merely an example in principle and does not limit the interpretation of the invention. Furthermore, in this specification and the various drawings, there are instances where structural elements that perform the same or similar functions as the aforementioned structural elements in relation to the already presented figures are labeled with the same reference numerals, and repetitive detailed descriptions are appropriately omitted.

[0034] Furthermore, in the accompanying drawings, for ease of understanding, the mutually orthogonal X-axis, Y-axis, and Z-axis are shown. The direction along the X-axis is referred to as the first direction, the direction along the Y-axis as the second direction, and the direction along the Z-axis as the third direction. The plane defined by the X-axis and Y-axis is called the XY plane, and the plane defined by the X-axis and Z-axis is called the XZ plane. Observing the XY plane is referred to as a top-down view.

[0035] The display device DSP in this embodiment is an organic electroluminescent display device that uses organic light-emitting diodes (OLEDs) as display elements, and can be mounted on televisions, personal computers, automotive devices, tablet terminals, smartphones, mobile phone terminals, etc.

[0036] [First Implementation]

[0037] Figure 1 This diagram illustrates a structural example of the display device DSP according to the first embodiment. The display device DSP has a display area DA for displaying images and a peripheral area SA outside the display area DA on an insulating substrate 10. The substrate 10 can be glass or a flexible resin film.

[0038] The display area DA has multiple pixels PX arranged in a matrix along the first direction X and the second direction Y. Each pixel PX has multiple sub-pixels SP. In one example, a pixel PX has a red sub-pixel SP1, a green sub-pixel SP2, and a blue sub-pixel SP3. In addition, a pixel PX may also have four or more sub-pixels, in addition to the above three colors of sub-pixels, with sub-pixels of other colors such as white added.

[0039] The sub-pixel SP includes a pixel circuit 1 and a display element 20 driven by the pixel circuit 1. The pixel circuit 1 includes a pixel switch 2, a driving transistor 3, and a capacitor 4. The pixel switch 2 and the driving transistor 3 are switching elements made of, for example, thin-film transistors.

[0040] In pixel switch 2, the gate is connected to scan line GL. One of the source and drain of pixel switch 2 is connected to signal line SL, and the other is connected to the gate of driving transistor 3 and capacitor 4. In driving transistor 3, one of the source and drain is connected to power line PL and capacitor 4, and the other is connected to the anode of display element 20. A common voltage is supplied to the cathode of display element 20. Furthermore, the structure of pixel circuit 1 is not limited to the example shown.

[0041] Display element 20 is an organic light-emitting diode (OLED) that serves as a light-emitting element. For example, sub-pixel SP1 has a display element that emits light corresponding to the wavelength of red light, sub-pixel SP2 has a display element that emits light corresponding to the wavelength of green light, and sub-pixel SP3 has a display element that emits light corresponding to the wavelength of blue light. The structure of display element 20 will be described later.

[0042] The display device DSP also includes a sensor 5. The sensor 5 is disposed on the back side of the substrate 10. As shown, the sensor 5 overlaps with the display area DA when viewed from above. Hereinafter, the area in the display area DA that overlaps with the sensor 5 will be referred to as the sensor area 50.

[0043] For example, sensor 5 includes at least one of a camera, a sensor for detecting ambient light, a sensor for detecting the proximity of an object, and a sensor for detecting fingerprints. Sensor 5 can also be other types of sensors. Multiple sensors 5 can also be configured at a location overlapping the display area DA, with multiple sensor regions 50 for these sensors 5 configured in the display area DA.

[0044] The display area DA is rectangular, consisting of a first side S1, a second side S2, a third side S3, and a fourth side S4. The first side S1 and the second side S2 are parallel to the first direction X. The third side S3 and the fourth side S4 are parallel to the second direction Y. Figure 1 In the example, the distance between sensor region 50 and the first side S1 is smaller than the distance between sensor region 50 and the second side S2. Furthermore, the distance between sensor region 50 and the third side S3 is the same as the distance between sensor region 50 and the fourth side S4. Figure 1 The position of sensor 5 and sensor area 50 shown is an example. Sensor 5 and sensor area 50 can be configured in various other ways in display area DA.

[0045] Figure 2This diagram illustrates an example of the layout of subpixels SP1, SP2, and SP3. Here, we focus on four pixels PX. In each pixel PX, subpixels SP1, SP2, and SP3 are arranged in this order along the first direction X. That is, in the display area DA, columns consisting of multiple subpixels SP1 arranged along the second direction Y, columns consisting of multiple subpixels SP2 arranged along the second direction Y, and columns consisting of multiple subpixels SP3 arranged along the second direction Y are alternately arranged in the first direction X.

[0046] Ribs 14 are configured at the boundaries of sub-pixels SP1, SP2, and SP3. Figure 2 In the example, rib 14 is a lattice structure having portions located between adjacent sub-pixels SP along the first direction X and portions located between adjacent sub-pixels SP along the second direction Y. Rib 14 forms openings OP in each of sub-pixels SP1, SP2, and SP3.

[0047] Between sub-pixels SP1 and SP2, between sub-pixels SP2 and SP3, and between sub-pixels SP1 and SP3, there are partition structures SSa extending along the second direction Y. That is, each partition structure SSa is located at the boundary of a sub-pixel SP of a different color. For example, the partition structure SSa is a straight line spanning between the two ends in the second direction Y of the display area DA.

[0048] Figure 3 It is along Figure 2 A schematic cross-sectional view of the DSP display device of line III-III. Figure 3 In the diagram, the driving transistor 3 and the display element 20 are shown as components configured in the sub-pixels SP1, SP2, and SP3, while the illustrations of other components are omitted.

[0049] The display device DSP includes the aforementioned substrate 10, insulating layers 11, 12, and 13, rib 14, sealing layer 15, and partition structure SSa. Insulating layers 11, 12, and 13 are stacked on the substrate 10 along the third direction Z. For example, insulating layers 11 and 12 are formed of inorganic materials, while insulating layer 13, rib 14, and sealing layer 15 are formed of organic materials.

[0050] The driving transistor 3 includes a semiconductor layer 30 and electrodes 31, 32, and 33. Electrode 31 corresponds to the gate. One of electrodes 32 and 33 corresponds to the source, and the other corresponds to the drain. The semiconductor layer 30 is disposed between the substrate 10 and the insulating layer 11. Electrode 31 is disposed between insulating layers 11 and 12. Electrodes 32 and 33 are disposed between insulating layers 12 and 13 and are in contact with the semiconductor layer 30 through contact holes penetrating the insulating layers 11 and 12.

[0051] In this way, the driving transistor 3 is disposed on the substrate 10 and covered by the insulating layer 13. Figure 1 The other elements of the pixel circuit 1 shown are similarly disposed on the substrate 10 and covered by the insulating layer 13. Other insulating layers may also be sandwiched between the pixel circuit 1 and the substrate 10.

[0052] The display element 20 includes a first electrode E1, an organic layer OR, and a second electrode E2. The first electrode E1 is an electrode configured for each sub-pixel SP, and may be referred to as a pixel electrode, a lower electrode, or an anode. The second electrode E2 is an electrode configured for multiple sub-pixels SP or multiple display elements 20, and may be referred to as a common electrode, an upper electrode, or a cathode.

[0053] Rib 14 is disposed on insulating layer 13. First electrode E1 is disposed on insulating layer 13, overlapping with opening OP. Peripheral portion of first electrode E1 is covered by rib 14. First electrode E1 is electrically connected to electrode 33 through contact hole penetrating insulating layer 13. First electrode E1 is formed of metallic material. However, first electrode E1 can be formed of transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or it can be a laminate of transparent conductive material and metallic material.

[0054] The organic layer OR covers the first electrode E1 and rib 14. The organic layer OR is in contact with the first electrode E1 through the opening OP. A portion of the organic layer OR is located on rib 14.

[0055] The second electrode E2 is covered with an organic layer OR. The second electrode E2 is formed of a metallic material. However, the second electrode E2 can also be formed of a transparent conductive material such as ITO or IZO.

[0056] Details will be described later. In this embodiment, the partition structure SSa is disposed on the rib 14. The sealing layer 15 covers the partition structure SSa and the second electrode E2. The sealing layer 15 is formed to be thicker than, for example, the insulating layers 11, 12, 13 and the rib 14, so as to protect the organic layer OR from the influence of moisture, etc., and to flatten the unevenness caused by the rib 14.

[0057] Figure 4 This is a cross-sectional view showing an example of a layer structure that can be applied to an organic layer OR. For example, the organic layer OR includes a first functional layer F1, a light-emitting layer EL, and a second functional layer F2 stacked sequentially from the first electrode E1 toward the second electrode E2.

[0058] When the potential of the first electrode E1 is relatively higher than the potential of the second electrode E2, the first electrode E1 acts as the anode and the second electrode E2 acts as the cathode. Conversely, when the potential of the second electrode E2 is relatively higher than the potential of the first electrode E1, the second electrode E2 acts as the anode and the first electrode E1 acts as the cathode.

[0059] As an example, when the first electrode E1 is equivalent to the anode, the first functional layer F1 includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the second functional layer F2 includes at least one of an electron transport layer, an electron injection layer, and a hole blocking layer.

[0060] If a potential difference is formed between the first electrode E1 and the second electrode E2, the light-emitting layer EL emits light. In this embodiment, it is envisioned that the light-emitting layers EL contained in the organic layers OR of the sub-pixels SP1, SP2, and SP3 all emit light of the same color (e.g., white). In this case, for example, a color filter corresponding to the color of the sub-pixels SP1, SP2, and SP3 may be disposed above the sealing layer 15. Alternatively, a layer containing quantum dots that generate light of the color corresponding to the sub-pixels SP1, SP2, and SP3 when excited by the light emitted by the light-emitting layers EL may be disposed on the sub-pixels SP1, SP2, and SP3.

[0061] Figure 5 This is a schematic cross-sectional view of the partition structure SSa and its vicinity. The structure of the boundaries of sub-pixels SP1 and SP2 is shown in this figure, but the same structure can also be applied to the boundaries of sub-pixels SP2 and SP3 as well as the boundaries of sub-pixels SP1 and SP3.

[0062] The partition structure SSa has a partition wall PTa disposed on the upper surface 14a of the rib 14. The partition wall PTa has an upper part Ua and a lower part Ba located below the upper part Ua. The lower part Ba contacts the upper surface 14a. The first width W1a of the upper part Ua is greater than the second width W2a of the lower part Ba (W1a > W2a). The width of the partition wall PTa decreases in a stepwise manner between the upper part Ua and the lower part Ba. Such a partition wall PTa shape can also be described as a cantilever shape.

[0063] The organic layer OR and the second electrode E2 are separated by a partition structure SSa. Specifically, the organic layer OR overlapping the opening OP of sub-pixel SP1 and the organic layer OR overlapping the opening OP of sub-pixel SP2 are separated, with a partition wall PTa sandwiched between these organic layers OR. Similarly, the second electrode E2 overlapping the opening OP of sub-pixel SP1 and the second electrode E2 overlapping the opening OP of sub-pixel SP2 are separated, with a partition wall PTa sandwiched between these second electrodes E2. In this way, by separating the organic layers OR of sub-pixels SP of different colors, crosstalk between these sub-pixels SP can be suppressed.

[0064] An organic layer ORa and a conductive layer E2a covering the organic layer ORa are disposed on the separator PTa. The organic layer ORa is formed of the same material as the organic layer OR. The conductive layer E2a is formed of the same material as the second electrode E2. The organic layer ORa is separate from the organic layer OR disposed on the sub-pixels SP1 and SP2. The conductive layer E2a is separate from the second electrode E2 disposed on the sub-pixels SP1 and SP2.

[0065] The organic layer OR and the second electrode E2 are formed, for example, on the entire surface of the display area DA by vacuum evaporation. At this time, material from the evaporation source adheres to the upper surface of the separator PTa, forming the organic layer ORa and the conductive layer E2a. On the other hand, material from the evaporation source is difficult to adhere to the side surface of the separator PTa. Therefore, the organic layer OR and the organic layer ORa are separated, and the second electrode E2 and the conductive layer E2a are also separated.

[0066] Figure 6 This is a schematic top view of the second electrode E2 and the sensor region 50. In this embodiment, the sensor region 50 is a... Figure 3 The substrate 10 shown has a circular hole (sensor hole) penetrating it and the layers disposed on the substrate 10 (substrate 10, insulating layers 11, 12, 13, and sealing layer 15, etc.). As an example, the sensor region 50 has a diameter of a few millimeters. Furthermore, the shape of the sensor region 50 is not limited to a perfect circle, but can also be other shapes such as ellipse or rectangle.

[0067] The second electrode E2 is a linear (strip-shaped) element extending along the second direction Y. For example, Figure 6 The second electrode E2 shown at the left end overlaps with a plurality of sub-pixels SP1 arranged along the second direction Y. The second second electrode E2 from the left end overlaps with a plurality of sub-pixels SP2 arranged along the second direction Y. The third second electrode E2 from the left end overlaps with a plurality of sub-pixels SP3 arranged along the second direction Y. In this way, the second electrodes E2 overlapping with sub-pixels SP1, E2 overlapping with sub-pixels SP2, and E2 overlapping with sub-pixels SP3 are arranged along the first direction X in the display area DA.

[0068] Although Figure 6 Not shown in the diagram, but the aforementioned partition structure SSa (partition wall PTa) is disposed between adjacent second electrodes E2. Additionally, in Figure 6 An organic layer OR of approximately the same shape as the second electrode E2 is disposed below the second electrode E2 shown.

[0069] One end of the second electrode E2 is located in the peripheral region SA on the first side S1 of the display area DA. The other end of the second electrode E2 is located in the peripheral region SA on the second side S2 of the display area DA. Both ends are connected to the feed line FL, which serves as the supply source of the common voltage, via the connection portion CP located in the peripheral region SA.

[0070] A portion of the plurality of second electrodes E2 has a first wire portion LP1 and a second wire portion LP2 separated from the sensor region 50. The first wire portion LP1 is located on the first side S1 relative to the sensor region 50. The second wire portion LP2 is located on the second side S2 relative to the sensor region 50. Both wire portions LP1 and LP2 are connected to the feed line FL via a connecting portion CP.

[0071] Multiple relay cables RL are arranged around the sensor area 50, bypassing the sensor area 50. The relay cables RL and the first line portion LP1 are connected via a first connecting portion CP1. The relay cables RL and the second line portion LP2 are connected via a second connecting portion CP2. Figure 6 In the example, the relay wiring RL is an arc along the periphery of the sensor region 50.

[0072] Sensor region 50 is surrounded by subpixels SP1, SP2, and SP3. Non-illuminating virtual subpixels DP are disposed around sensor region 50. For example, virtual subpixels DP are subpixels from the regularly arranged subpixels SP1, SP2, and SP3 that partially overlap with sensor region 50. Virtual subpixels DP can also be further disposed around such virtual subpixels DP that partially overlap with sensor region 50. Connecting portions CP1 and CP2 are both disposed around the virtual subpixels DP.

[0073] also, Figure 6 The dimensions of the sensor region 50, the second electrode E2, the relay wiring RL, the sub-pixels SP1, SP2, SP3, and the virtual sub-pixel DP shown are just an example. Figure 6 In the original text, the second electrode E2, which is separated into lines LP1 and LP2 through the sensor area 50, and a portion of the relay wiring RL connecting these lines LP1 and LP2 are omitted.

[0074] Figure 7 It is along Figure 6 A schematic cross-sectional view of the display device DSP for lines VII-VII. In this figure, pixel circuit 1 is shown in a simplified manner. Pixel circuit 1 is disposed between substrate 10 and insulating layer 13.

[0075] The relay wiring RL is disposed between insulating layers 12 and 13. Not limited to this example, the relay wiring RL can also be disposed at other locations between the substrate 10 and the insulating layer 13, such as between insulating layers 11 and 12 or between the substrate 10 and the insulating layer 11. For example, the relay wiring RL can be formed from the same material and using the same process as one of the conductive layers constituting the pixel circuit 1. As an example, the relay wiring RL is made of the same material and using the same process as one of the conductive layers constituting the pixel circuit 1. Figure 3 The electrodes shown are made of the same material and formed using the same process as one of the electrodes 31, 32, and 33.

[0076] The first connection portion CP1 has a contact hole CH penetrating the insulating layer 13 and a conductive layer CL disposed on the insulating layer 13. Both the contact hole CH and the conductive layer CL are disposed on the virtual sub-pixel DP. The conductive layer CL contacts the relay wiring RL through the contact hole CH. The conductive layer CL is formed, for example, from the same material as the first electrode E1 and using the same process.

[0077] The first line portion LP1 extends continuously within the area of ​​sub-pixel SP1 and virtual sub-pixel DP. The first line portion LP1 is in contact with the conductive layer CL. Thus, the first line portion LP1 and the relay wiring RL are connected via the conductive layer CL.

[0078] exist Figure 7 In the example described above, the organic layer OR is not configured at the virtual sub-pixel DP. Furthermore, pixel circuit 1 is not configured at the virtual sub-pixel DP. As another example, the organic layer OR can reach the virtual sub-pixel DP, and pixel circuit 1 can be configured at the virtual sub-pixel DP. The sensor region 50, which serves as a hole as described above, is, for example, a space without any components. As another example, the sensor region 50 can also be filled with transparent resin, etc.

[0079] The second connection portion CP2 has the same structure as the first connection portion CP1. That is, the second connection portion CP2 has a contact hole CH that penetrates the insulating layer 13 and a conductive layer CL disposed on the insulating layer 13. The second line portion LP2 and the relay wiring RL are connected via the conductive layer CL.

[0080] In the above embodiment, several second electrodes E2 have a first line portion LP1 and a second line portion LP2 separated by the sensor region 50, and these line portions LP1 and LP2 are connected by a relay wiring RL that bypasses the sensor region 50. Therefore, the second electrodes E2 can be turned on from the first side S1 to the second side S2.

[0081] Furthermore, even if the line sections LP1 and LP2 are not connected via the relay wiring RL, a common voltage is applied to the first line section LP1 via the connection CP near the first side S1, and a common voltage is applied to the second line section LP2 via the connection CP near the second side S2. However, for example, since the end of the second line section LP2 near the sensor region 50 is far from the connection CP, the voltage will decrease, potentially causing display defects in the sub-pixels SP near the sensor region 50. Therefore, if the line sections LP1 and LP2 are connected via the relay wiring RL as in this embodiment, good image display can be achieved even near the sensor region 50.

[0082] In this embodiment, a partition structure SSa is provided between adjacent second electrodes E2. In this case, even if a bypass structure identical to that of the relay wiring RL were to be formed on the second electrode E2, it would be difficult to achieve such a bypass structure due to the partition structure SSa. If the relay wiring RL is formed below the insulating layer 13 as in this embodiment, the relay wiring RL will not be affected by the partition structure SSa.

[0083] In this embodiment, the connection points CP1 and CP2 between the relay wiring RL and the line portions LP1 and LP2 are disposed at the virtual sub-pixels DP. This suppresses the influence of the connection points CP1 and CP2 on the display levels of the sub-pixels SP1, SP2, and SP3 surrounding the sensor area 50.

[0084] Hereinafter, embodiments 2 to 7 of the display device DSP will be described. For structures not specifically mentioned in each embodiment, the same structures as in the previous embodiments can be applied.

[0085] [Second Implementation]

[0086] The shape of the trunk cabling RL is not limited to the shape disclosed in the first embodiment. In the second embodiment, other examples applicable to the trunk cabling RL are disclosed.

[0087] Figure 8 This is a schematic top view of the second electrode E2, the relay wiring RL, and the sensor region 50 in this embodiment. The relay wiring RL is a ring surrounding the sensor region 50. Each first line portion L1 is connected to the relay wiring RL via a first connecting portion CP1. Each second line portion L2 is connected to the relay wiring RL via a second connecting portion CP2.

[0088] In this embodiment, multiple first line sections LP1 and multiple second line sections LP2 are connected by a single relay cable RL. In this case, it is unnecessary to arrange multiple relay cables RL around the sensor area 50. Therefore, the configuration space for the relay cables RL can be reduced.

[0089] [Third Implementation]

[0090] The structure of the first connecting part CP1 and the second connecting part CP2 is not limited to... Figure 7 The structure shown is illustrated. In the third embodiment, other examples applicable to the connecting portions CP1 and CP2 are disclosed.

[0091] Figure 9 This is a schematic cross-sectional view of the first connection portion CP1 in this embodiment. The first connection portion CP1 has a conductive layer CL and a contact hole CH. The conductive layer CL is disposed on the upper surface 14a of the rib 14 located between the sub-pixel SP1 and the virtual sub-pixel DP. A portion of the conductive layer CL is covered by an organic layer OR. The contact hole CH penetrates the insulating layer 13 and the rib 14. The conductive layer CL contacts the relay wiring RL through the contact hole CH.

[0092] The first connecting part CP1 also has a partition structure SSb. Figure 9 In the example, the partition structure SSb is a partition wall PTb disposed on the conductive layer CL. The partition wall PTb has an upper part Ub and a lower part Bb located below the upper part Ub. The lower part Bb is in contact with the conductive layer CL. The first width W1b of the upper part Ub is larger than the second width W2b of the lower part Bb (W1b > W2b). The width of the partition wall PTb gradually decreases from the upper part Ub toward the lower part Bb. Such a partition wall PTb can also be called an inverted cone shape.

[0093] The separator PTb, like the separator PTa described above, separates the organic layer OR and the second electrode E2 (first line LP1). Figure 5 Similarly, organic layer ORa and conductive layer E2a are disposed on the separator PTb, with organic layer ORb made of the same material as organic layer OR and conductive layer E2b made of the same material as second electrode E2.

[0094] By using a separator PTb to isolate the organic layer OR, an exposed area EA is formed on the upper surface of the conductive layer CL, exposing the organic layer OR. The first line portion LP1 contacts the conductive layer CL through the exposed area EA. Thus, the first line portion LP1 and the relay wiring RL are connected via the conductive layer CL.

[0095] The second connecting portion CP2 has the same structure as the first connecting portion CP1. That is, the second connecting portion CP2 has a contact hole CH, a conductive layer CL, and a blocking structure SSb. The second line portion LP2 contacts the conductive layer CL through the exposed area EA formed by the blocking structure SSb.

[0096] The structure of the connecting portions CP1 and CP2 in this embodiment exhibits high resistance to moisture intrusion from the sensor region 50. That is, in Figure 9In the example, an organic layer OR is also configured in the virtual subpixel DP, with its end exposed to the sensor area 50. Even if moisture intrudes from this end, since the organic layer OR of the virtual subpixel DP and the organic layer OR of the subpixel SP1 are separated by the partition structure SSb, moisture has difficulty reaching the organic layer OR of the subpixel SP1. Thus, it is possible to suppress the degradation of the display level of the subpixel SP.

[0097] The partition structure SSb is not limited to Figure 9 The structure shown. For example, the partition wall PTb, as an example of the partition structure SSb, can have the same... Figure 5 The partition wall PTa shown has the same cantilever shape. In addition, the partition structure SSb can be a channel (groove) provided on the rib 14. For example, if a channel with a width at the top being smaller than the width at the bottom is formed, the organic layer OR formed on the rib 14 by vapor deposition can be blocked by the channel.

[0098] Furthermore, the partition structure SSa is not limited to... Figure 5 The structure shown. For example, the partition wall PTa, as an example of the partition structure SSa, can have the same... Figure 9 The partition wall PTb shown has the same inverted cone shape. Additionally, the partition structure SSa can be a channel provided in rib 14.

[0099] [Fourth Implementation]

[0100] Figure 10 This is a schematic top view of the second electrode E2, relay wiring RL, and sensor region 50 in the fourth embodiment. In the first embodiment, it is envisioned that the sensor region 50 is an aperture. In this embodiment, the sensor region 50 is also provided with a substrate 10, insulating layers 11, 12, 13, and a sealing layer 15. Preferably, the substrate 10, insulating layers 11, 12, 13, and sealing layer 15 have high light transmittance to avoid hindering the sensing and detection of the sensor 5. For example, the rib 14 and the partition structure SSa are not provided in the sensor region 50.

[0101] For example, sensor region 50 is a region that does not include at least one of the first electrode E1 and pixel circuit 1. Sensor region 50 can also be described as a region that does not include sub-pixels SP. Such sensor region 50 has a higher light transmittance than the surrounding region where sub-pixels SP are disposed. Therefore, the sensing and detection of sensor 5 is less likely to be hindered.

[0102] exist Figure 10 In this example, similar to the embodiments described above, the first line portion LP1 and the second line portion LP2 are connected by a relay cable RL. The relay cable RL traverses the sensor region 50. The relay cable RL connects one first line portion LP1 and one second line portion LP2.

[0103] Figure 11 It is along Figure 10 A schematic cross-sectional view of the DSP display device with the XI-XI line. The sensor region 50 includes a substrate 10, insulating layers 11, 12, and 13, and a sealing layer 15. The relay wiring RL is disposed between insulating layers 12 and 13. Not limited to this example, the relay wiring RL can also be disposed at other locations between the substrate 10 and the insulating layer 13, such as between insulating layers 11 and 12 or between the substrate 10 and the insulating layer 11. The first connection portion CP1 and... Figure 7 The example shown also has a contact hole CH and a conductive layer CL.

[0104] Figure 12 This is a schematic cross-sectional view showing other examples of constructions applicable to the first connecting part CP1. The first connecting part CP1 is... Figure 9 The example shown also includes a barrier structure SSb. The first line portion LP1 contacts the conductive layer CL through the exposed area EA formed by the barrier structure SSb. The second connection portion CP2 can also be used. Figure 11 and Figure 12 Each of the structures shown in the diagram is one of them.

[0105] Figure 13 This is a schematic top view illustrating an example of a structure suitable for a relay wiring RL. The relay wiring RL is, for example, composed of mesh-like metal wires. If the relay wiring RL has such a structure, the transmittance of the sensor region 50 can be increased, thus making it less likely that the sensing detection of the sensor 5 will be hindered by the relay wiring RL.

[0106] Figure 14 This is a schematic top view illustrating other structures that can be applied to the relay wiring RL. In the example shown in this figure, the relay wiring RL, composed of mesh-like metal wires, is a circle that overlaps entirely with the sensor region 50. The relay wiring RL connects multiple first wire sections LP1 and multiple second wire sections LP2.

[0107] The relay wiring RL is not limited to a mesh shape. As another example, the relay wiring RL can be formed from a transparent conductive material such as ITO. In this case, the relay wiring RL can be a strip connecting a first line portion LP1 and a second line portion LP2. Alternatively, the relay wiring RL can be shaped to completely overlap with the sensor region 50 and connect multiple first line portions LP1 and multiple second line portions LP2. When the relay wiring RL is formed from a transparent conductive material, the transmittance of the sensor region 50 can also be improved.

[0108] [Fifth Implementation]

[0109] Figure 15This is a schematic top view of the second electrode E2 and sensor region 50 in the fifth embodiment. Similar to the fourth embodiment, the sensor region 50 is not a hole, and is provided with a substrate 10, insulating layers 11, 12, 13, and a sealing layer 15, etc.

[0110] In this embodiment, the second electrode E2 does not pass through the relay wiring RL, but instead traverses the sensor region 50. For example, the width of the second electrode E2 is fixed within the range from the end on the first side S1 to the end on the second side S2. As another example, the width of the second electrode E2 in the sensor region 50 and the width of the second electrode E2 in the region outside the sensor region 50 may also be different. The shape of the portion of the second electrode E2 that overlaps with the sensor region 50 may also be... Figure 13 The mesh-like pattern shown.

[0111] To form the second electrode E2, which traverses the sensor region 50, ribs 14 and partition structures SSa can also be configured within the sensor region 50. Therefore, by depositing the material of the second electrode E2 onto the entire display region DA containing the sensor region 50, it is possible to achieve... Figure 15 The second electrode E2 is formed as shown, traversing the sensor region 50.

[0112] Figure 16 It is along Figure 15 A schematic cross-sectional view of the XVI-XVI line display device DSP. In sensor region 50, the second electrode E2 is disposed above the insulating layer 13 and covered by the sealing layer 15. No organic layer OR is disposed in sensor region 50. The end of the organic layer OR is located, for example, above the rib 14 near sensor region 50.

[0113] Figure 17 This is a schematic cross-sectional view of other examples applicable to a display device DSP. In the example shown in this figure, an organic layer OR is also disposed in the sensor region 50. In the sensor region 50, the organic layer OR is located between the insulating layer 13 and the second electrode E2.

[0114] If the second electrode E2 is formed across the sensor region 50 as in this embodiment, then there is no need to provide relay wiring RL and connecting parts CP1 and CP2. Therefore, the manufacturing process of the display device DSP is simpler than that of the embodiments described above.

[0115] [Sixth Implementation]

[0116] Figure 18 This is a schematic top view of the second electrode E2 and sensor region 50 in the sixth embodiment. Similar to the fourth and fifth embodiments, the sensor region 50 is not a hole, and is provided with a substrate 10, insulating layers 11, 12, 13, and a sealing layer 15, etc.

[0117] exist Figure 18 In the example, a conductive coating layer CV is configured to cover the sensor region 50. The coating layer CV is, for example, a circle identical to the sensor region 50, and overlaps entirely with the sensor region 50. The coating layer CV may also have a shape larger than the sensor region 50. Alternatively, the coating layer CV may have a shape that covers only a portion of the sensor region 50.

[0118] The coating layer CV is connected to multiple second electrodes E2. The coating layer CV can be formed from the same material as the second electrodes E2 and using the same process. In this case, no partition structure SSa is configured in the sensor region 50.

[0119] Cross-sectional structures containing the coating layer CV, for example, with Figure 16 The example is the same. That is, the coating layer CV is located between the insulating layer 13 and the sealing layer 15 in the sensor region 50. The cross-sectional configuration containing the coating layer CV can be the same as... Figure 17 The same example applies. In this case, the organic layer OR is sandwiched between the coating layer CV and the insulating layer 13. For example, the organic layer OR has the same planar shape as the coating layer CV in the sensor region 50.

[0120] For example, in such Figure 10 In the case of a relay cable RL traversing the sensor area 50 as in the example, in such a case... Figure 14 In the example where the relay wiring RL is a mesh pattern overlapping the sensor area 50, as in the case of... Figure 15 In the case where the second electrode E2 traverses the sensor region 50, diffraction of light caused by the relay wiring RL or the second electrode E2 may occur, potentially affecting the sensing and detection of the sensor 5. Furthermore, if the sensor 5 is a camera, ghosting may occur due to the relay wiring RL or the second electrode E2. To address this, configuring a coating layer CV that covers the sensor region 50 can suppress the generation of diffraction and ghosting.

[0121] [Seventh Implementation]

[0122] In the embodiments described above, it is envisioned that the light-emitting layers (ELs) contained in the organic layers OR of sub-pixels SP1, SP2, and SP3 all emit light of the same color. In this embodiment, it is envisioned that the light-emitting layers (ELs) contained in the organic layers OR of sub-pixels SP1, SP2, and SP3 emit light of different colors.

[0123] Figure 19This is a schematic cross-sectional view of the display device DSP according to the seventh embodiment. The structure of the boundaries of sub-pixels SP1 and SP2 is shown in this figure, but the same structure can also be applied to the boundaries of sub-pixels SP2 and SP3 as well as the boundaries of sub-pixels SP1 and SP3. Figure 19 The shape of the partition structure SSa (partition wall PTa) shown is similar to Figure 5 The examples are the same.

[0124] exist Figure 19 In the example, an organic layer OR1 is disposed in sub-pixel SP1, and an organic layer OR2 is disposed in sub-pixel SP2. Organic layer OR1 has a light-emitting layer EL that emits, for example, red light. Organic layer OR2 has a light-emitting layer EL that emits, for example, green light. Although in Figure 19 It is not shown in the cross section, but the organic layer OR configured in the sub-pixel SP3 has a light-emitting layer EL that emits blue light.

[0125] Organic layer OR1 covers the first electrode E1 of sub-pixel SP1 through opening OP, and also covers the portion of rib 14 that is closer to sub-pixel SP1 than the separator wall PTa. Organic layer OR2 covers the first electrode E1 of sub-pixel SP2 through opening OP, and also covers the portion of rib 14 that is closer to sub-pixel SP2 than the separator wall PTa.

[0126] Organic layers OR1a and OR2a, and a conductive layer E2a covering the organic layers OR1a and OR2a, are disposed above the separator wall PTa. Organic layer OR1a is formed of the same material as organic layer OR1. Organic layer OR2a is formed of the same material as organic layer OR2. Conductive layer E2a is formed of the same material as the second electrode E2. Organic layer OR1a is separate from organic layer OR1. Organic layer OR2a is separate from organic layer OR2. Figure 19 In the example, a portion of organic layer OR1a is covered by organic layer OR2a.

[0127] An organic layer OR1 is formed by vacuum evaporation using a mask with an opening shaped like sub-pixel SP1. At this time, material from the evaporation source adheres to the upper surface of the separator PTa, forming organic layer OR1a. After forming organic layer OR1, an organic layer OR2 is formed by vacuum evaporation using a mask with an opening shaped like sub-pixel SP2. At this time, material from the evaporation source adheres to the upper surface of the separator PTa, forming organic layer OR2a.

[0128] The structure of this embodiment can also be applied to any of the embodiments described above. For example, in... Figure 18 When the cover layer CV is configured in the sensor region 50 as shown, the organic layers OR1, OR2 and the organic layer OR of the sub-pixel SP3 can be disposed overlappingly below the cover layer CV.

[0129] All display devices implemented by those skilled in the art based on the display devices described as embodiments of the present invention, after appropriate design modifications, are also within the scope of the present invention, as long as they contain the spirit of the present invention.

[0130] Within the scope of this invention, it is understood that various modifications would be conceived by those skilled in the art, and these modifications also fall within the scope of this invention. For example, embodiments obtained by adding, deleting, or changing structural elements appropriately by those skilled in the art, or embodiments obtained by adding, omitting, or changing processes or conditions, are also included within the scope of this invention, as long as they possess the essence of this invention.

[0131] Furthermore, regarding other effects resulting from the manner described in the above embodiments, effects that are clearly defined based on the description in this specification, or effects that can be appropriately conceived by those skilled in the art, are of course interpreted as effects resulting from the present invention.

[0132] Explanation of reference numerals in the attached figures

[0133] DSP…display device, PX…pixel, SP…subpixel, DP…virtual subpixel, E1…first electrode, E2…second electrode, OR…organic layer, SSa, SSb…isolation structure, RL…relay wiring, CP1…first connection, CP2…second connection, 1…pixel circuit, 5…sensor, 13…insulating layer, 14…rib, 20…display element, 50…sensor area.

Claims

1. A display device comprising: Substrate; Multiple pixel circuits disposed on the substrate; An insulating layer covering the plurality of pixel circuits; A plurality of first electrodes disposed on the insulating layer and respectively connected to the plurality of pixel circuits; An organic layer disposed on the plurality of first electrodes; A plurality of linear second electrodes are disposed on the organic layer; The sensor region opposite to the sensor overlapping the substrate; A relay wiring configured between the substrate and the insulating layer; and The first connecting part and the second connecting part, At least one of the plurality of second electrodes has a first line portion and a second line portion that are separated by the sensor region when viewed from above. The relay cabling is connected to the first wire portion via the first connecting part and to the second wire portion via the second connecting part. The sensor region is a region that includes the substrate and the insulating layer, but does not include at least one of the first electrode and the pixel circuit. The relay wiring consists of mesh-like metal wires that traverse the sensor area.

2. The display device as claimed in claim 1, wherein, The sensor includes at least one of a camera, a sensor for detecting ambient light, a sensor for detecting the proximity of an object, and a sensor for detecting fingerprints.

3. A display device comprising: Substrate; Multiple pixel circuits disposed on the substrate; An insulating layer covering the plurality of pixel circuits; A plurality of first electrodes disposed on the insulating layer and respectively connected to the plurality of pixel circuits; An organic layer disposed on the plurality of first electrodes; A plurality of linear second electrodes are disposed on the organic layer; The sensor region opposite to the sensor overlapping the substrate; A relay wiring configured between the substrate and the insulating layer; and The first connecting part and the second connecting part, At least one of the plurality of second electrodes has a first line portion and a second line portion that are separated by the sensor region when viewed from above. The relay cabling is connected to the first wire portion via the first connecting part and to the second wire portion via the second connecting part. The first connecting portion and the second connecting portion each have: Contact hole, which penetrates the insulating layer; and A conductive layer, disposed on top of the insulating layer, is connected to the relay wiring through the contact hole. The first line portion is in contact with the conductive layer of the first connection portion. The conductive layer of the second line portion is in contact with the second connection portion. The conductive layer of each of the first connecting portion and the second connecting portion is covered by the organic layer. The first connecting portion and the second connecting portion each also have a partition structure that isolates the organic layer to form an exposed area for a portion of the conductive layer to be exposed from the organic layer. The first line portion comes into contact with the conductive layer of the first connection portion through the exposed area formed by the partition structure of the first connection portion. The second line portion contacts the conductive layer of the second connection portion through the exposed area formed by the partition structure of the second connection portion.

4. The display device as claimed in claim 3, wherein, The sensor area is a hole that penetrates the substrate and the insulating layer.

5. The display device as claimed in claim 4, wherein, It also has a sealing layer covering the second electrode. The hole penetrates the sealing layer.

6. The display device as claimed in claim 3, wherein, The sensor area is circular. The relay wiring is an arc shape along the periphery of the sensor area.

7. The display device as claimed in claim 3, wherein, The partition structure includes a partition wall disposed on the conductive layer. The partition wall has an upper portion with a first width and a lower portion with a second width that is smaller than the first width.

8. The display device as claimed in claim 3, wherein, It also has ribs disposed on the insulating layer. The contact hole penetrates the insulating layer and the rib.

9. The display device as claimed in claim 3, wherein, It also features multiple non-illuminating virtual sub-pixels configured around the sensor area.

10. The display device as claimed in claim 9, wherein, The first connecting portion and the second connecting portion are disposed on the virtual sub-pixel.

11. The display device according to any one of claims 3 to 10, wherein, The sensor includes at least one of a camera, a sensor for detecting ambient light, a sensor for detecting the proximity of an object, and a sensor for detecting fingerprints.

Images