Cavity package structure and method of forming the same

Abstract

A cavity package structure and a forming method thereof, the cavity package structure comprising: a flange substrate; a shell attached to an edge area of an upper surface of the flange substrate, a pin fixed in the shell, and two end surfaces of the pin exposed by the shell; a radio frequency chip attached to the upper surface of the flange substrate inside the shell, the radio frequency chip electrically connected to the pin through a first metal lead; a non-metallic upper cover attached to the shell, a sealed cavity formed between the non-metallic upper cover, the shell and the flange substrate, and a plurality of perforations in the non-metallic upper cover penetrating through upper and lower surfaces of the non-metallic upper cover; and a metal heat sink comprising a metal heat sink sheet and a plurality of metal heat sink columns protruding from a lower surface of the metal heat sink sheet, the metal heat sink attached to the non-metallic upper cover, wherein the metal heat sink sheet is attached to an upper surface of the non-metallic upper cover, and the metal heat sink columns are attached to the flange substrate through corresponding perforations in the non-metallic upper cover. The heat dissipation performance of the radio frequency chip package structure is improved.

Description

Technical Field

[0001] This disclosure relates to the field of packaging, and more particularly to a cavity-type packaging structure and a method for forming the same. Background Technology

[0002] Cavity-type packaging technology is widely used in RF chip packaging due to its better RF performance and lower dielectric constant.

[0003] In existing cavity-type packaging products, due to the need to consider radio frequency performance and heat dissipation, a ceramic cover is often set on the flange substrate to form an internal cavity structure for packaging the radio frequency chip mounted on the flange substrate.

[0004] However, due to the limited heat dissipation performance of ceramic top covers and the high price of high-heat-dissipation ceramic materials, the heat dissipation problem of high-power cavity-type packaged products has remained unsolved, and large-scale mass production has not been possible. Summary of the Invention

[0005] This disclosure provides a cavity-like encapsulation structure in some embodiments, including:

[0006] Flange base;

[0007] A housing is attached to the upper surface edge region of the flange base, wherein a pin is fixed in the housing, and the housing exposes the two end surfaces of the pin;

[0008] An RF chip is mounted on the upper surface of the flange base inside the enclosure, and the RF chip is electrically connected to the pins via a first metal lead;

[0009] A non-metallic top cover is attached to the enclosure, and a sealed cavity is formed between the non-metallic top cover, the enclosure, and the flange base. The non-metallic top cover has multiple perforations that penetrate the upper and lower surfaces of the non-metallic top cover.

[0010] A metal radiator, comprising metal heat sinks and a plurality of metal heat sink columns protruding from the lower surface of the metal heat sinks, the metal radiator being mounted on a non-metallic top cover, wherein the metal heat sinks are mounted on the upper surface of the non-metallic top cover, and the metal heat sink columns are mounted to the flange base through corresponding perforations in the non-metallic top cover.

[0011] In some embodiments, the flange base has a plurality of grooves, and the metal heat dissipation column passes through the corresponding perforation in the non-metallic top cover and is attached to the corresponding groove in the flange base.

[0012] In some embodiments, the plurality of grooves are located in a flange base on or around the side of the radio frequency chip.

[0013] In some embodiments, the metal heat sink has a plurality of mesh holes extending through the upper and lower surfaces of the metal heat sink.

[0014] In some embodiments, the plurality of mesh openings are arranged in a regular or irregular pattern, and the size of the plurality of mesh openings may be the same or different.

[0015] In some embodiments, the metal heat sink column is attached to the upper surface of the flange base through corresponding perforations in the non-metallic top cover.

[0016] In some embodiments, the metal heat sink column is sealed to the perforation with sealant, and the metal heat sink column is attached to the flange base with non-conductive adhesive.

[0017] In some embodiments, the material of the non-metallic cover is ceramic or epoxy resin; the number of the radio frequency chips is one or more, and when the number of the radio frequency chips is multiple, the multiple radio frequency chips are interconnected by a second metal lead.

[0018] In some embodiments, the pins are secured to the upper surface of the enclosure by adhesive.

[0019] Other embodiments of this disclosure also provide a cavity-like encapsulation structure, including:

[0020] Flange base;

[0021] A housing is attached to the upper surface edge region of the flange base, wherein a pin is fixed in the housing, and the housing exposes the two end surfaces of the pin;

[0022] An RF chip is mounted on the upper surface of the flange base inside the enclosure, and the RF chip is electrically connected to the pins via a first metal lead;

[0023] A non-metallic top cover is attached to the enclosure, forming a sealed cavity between the non-metallic top cover, the enclosure, and the flange base, and the lower surface of the non-metallic top cover has raised non-metallic heat dissipation columns, which are attached to the flange base.

[0024] In some embodiments, the flange base has a plurality of grooves, and the non-metallic heat sink is attached to the corresponding grooves in the flange base; the plurality of grooves are located in the flange base on or around the RF chip.

[0025] In some embodiments, the non-metallic heat dissipation column is attached to the upper surface of the flange base.

[0026] In some embodiments, the non-metallic heat dissipation column is attached to the flange base with non-conductive adhesive; the non-metallic top cover and the non-metallic heat dissipation column are an integral structure, and the materials of the non-metallic top cover and the non-metallic heat dissipation column are ceramic.

[0027] In some embodiments, the pins are secured to the upper surface of the enclosure by adhesive.

[0028] Some embodiments of this disclosure also provide a method for forming a cavity-like encapsulation structure, including:

[0029] Provide flange base;

[0030] A casing is attached to the upper surface edge region of the flange base, and a pipe leg is fixed in the casing, with the casing exposing the two end surfaces of the pipe leg;

[0031] An RF chip is mounted on the upper surface of the flange base inside the enclosure, and the RF chip is electrically connected to the pins via a first metal lead.

[0032] A non-metallic top cover is provided, wherein the non-metallic top cover has a plurality of perforations penetrating the upper and lower surfaces of the non-metallic top cover;

[0033] A metal radiator is provided, the metal radiator including metal heat sinks and a plurality of metal heat sink columns protruding from the lower surface of the metal heat sinks;

[0034] The metal heat sink is attached to the non-metallic top cover, wherein the metal heat sink fins are attached to the upper surface of the non-metallic top cover, and the metal heat sink column passes through the corresponding perforation in the non-metallic top cover;

[0035] A non-metallic top cover is attached to the enclosure, forming a sealed cavity between the non-metallic top cover, the enclosure, and the flange base, and the metal heat dissipation column is attached to the flange base through the corresponding perforation in the non-metallic top cover.

[0036] In some embodiments, the flange base has a plurality of grooves, and the metal heat sink column passes through a corresponding perforation in the non-metallic top cover and is attached to a corresponding groove in the flange base; the plurality of grooves are located in the flange base on or around the RF chip.

[0037] In some embodiments, the metal heat sink has a plurality of mesh holes penetrating the upper and lower surfaces of the metal heat sink; the plurality of mesh holes are arranged regularly or irregularly, and the plurality of mesh holes are the same or different in size.

[0038] In some embodiments, the metal heat sink column is attached to the upper surface of the flange base through corresponding perforations in the non-metallic top cover.

[0039] In some embodiments, the metal heat sink column is sealed to the perforation with sealant, and the metal heat sink column is attached to the flange base with non-conductive adhesive.

[0040] In some embodiments, the material of the non-metallic cover is ceramic or epoxy resin; the number of the radio frequency chips is one or more, and when the number of the radio frequency chips is multiple, the multiple radio frequency chips are interconnected by a second metal lead.

[0041] Other embodiments of this disclosure also provide a method for forming a cavity-like encapsulation structure, including:

[0042] Provide flange base;

[0043] A casing is attached to the upper surface edge region of the flange base, and a pipe leg is fixed in the casing, with the casing exposing the two end surfaces of the pipe leg;

[0044] An RF chip is mounted on the upper surface of the flange base inside the enclosure, and the RF chip is electrically connected to the pins via a first metal lead.

[0045] A non-metallic top cover is attached to the enclosure, forming a sealed cavity between the non-metallic top cover, the enclosure, and the flange base. The non-metallic top cover has raised non-metallic heat dissipation columns on its lower surface, which are attached to the flange base.

[0046] In some embodiments, the flange base has a plurality of grooves, and the non-metallic heat sink is attached to the corresponding grooves in the flange base; the plurality of grooves are located in the flange base on or around the RF chip.

[0047] In some embodiments, the non-metallic heat dissipation column is attached to the upper surface of the flange base.

[0048] This disclosure discloses a cavity-like packaging structure and its forming method in some of the foregoing embodiments. The cavity-like packaging structure includes: a flange base; a housing attached to the upper surface edge region of the flange base, wherein pins are fixed in the housing and the housing exposes the two end surfaces of the pins; an RF chip attached to the upper surface of the flange base inside the housing, the RF chip being electrically connected to the pins via a first metal lead; a non-metallic cover attached to the housing, wherein a sealed cavity is formed between the non-metallic cover, the housing, and the flange base, and the non-metallic cover has multiple perforations penetrating the upper and lower surfaces of the non-metallic cover; and a metal heat sink, the metal heat sink including metal heat sink fins and multiple metal heat sink columns protruding from the lower surface of the metal heat sink fins, the metal heat sink being attached to the non-metallic cover, wherein the metal heat sink fins are attached to the upper surface of the non-metallic cover, and the metal heat sink columns are attached to the flange base through corresponding perforations in the non-metallic cover. The metal heat sink includes metal heat sink fins and multiple metal heat sink columns protruding from the lower surface of the metal heat sink fins. The metal heat sink fins are attached to the upper surface of the non-metallic top cover, and the metal heat sink columns are attached to the flange base through corresponding perforations in the non-metallic top cover. That is, the metal heat sink fins can release heat present in the non-metallic top cover, and heat in the flange base can be conducted to the metal heat sink columns for release and / or conducted to the metal heat sink fins in the metal heat sink, thus enhancing the heat dissipation effect. Furthermore, this disclosure also allows heat dissipation from the back of the packaging structure through the flange substrate, thereby achieving double-sided heat dissipation and further improving heat dissipation performance. Attached Figure Description

[0049] Figures 1-8 This is a schematic diagram illustrating the formation process of the cavity-type encapsulation structure in some embodiments of the present invention;

[0050] Figure 9 This is a schematic diagram illustrating the formation process of a cavity-type encapsulation structure according to other embodiments of the present invention. Detailed Implementation

[0051] The specific embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. In describing the embodiments of this disclosure in detail, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to general proportions, and the schematic diagrams are merely examples and should not limit the scope of protection of this disclosure. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0052] This disclosure first provides a method for forming a cavity-like encapsulation structure, and the method is described in detail below with reference to the accompanying drawings.

[0053] refer to Figure 1 , providing flange base 100.

[0054] The flange base 100 serves two purposes: firstly, it supports the subsequently mounted radio frequency (RF) chip and forms a sealed cavity with the subsequent non-metallic top cover and housing, where the RF chip is located; secondly, the flange base 100 also serves to dissipate heat from the subsequently mounted RF chip.

[0055] The flange base 100 is made of metal. In some embodiments, the metal may be one or more of Cu, W, Al, Ti, Ag, Au, Pt, and Ni.

[0056] The flange base 100 can be a single-layer or multi-layer structure. In some embodiments, the flange base 100 is a three-layer structure, including a first metal layer 101, an intermediate layer 102 located on the first metal layer 101, and a second metal layer 103 located on the intermediate layer 102. The first metal layer 101 and the second metal layer 103 are made of Cu, and the intermediate layer 102 is made of Mo or ceramic. The flange base 100 with this structure has a small coefficient of thermal expansion, low stress, and good heat dissipation performance, which prevents sealing defects of the subsequently mounted RF chip and improves the heat dissipation efficiency of the RF chip, thereby improving the electrical performance of the cavity-type packaging structure.

[0057] In some embodiments, the flange base 100 may include a central region and an edge region surrounding the central region, on which an RF chip is subsequently mounted, and on which a housing is subsequently mounted.

[0058] In some embodiments, the flange base 100 has a plurality of grooves 104. On the one hand, forming the grooves 104 can further reduce the stress on the flange base 100. On the other hand, it facilitates the subsequent installation of the metal radiator 400 (see reference). Figure 8 When the metal heat sink 400 is installed, the metal heat sink column 402 passes through the corresponding perforation 301 in the non-metallic top cover 300 and is attached to the corresponding groove 104 in the flange base 100. That is, the metal heat sink column 402 penetrates into the groove 104 in the flange base 100, so that more heat in the flange base 100 can be conducted to the metal heat sink column 402 for release and / or conducted to the metal heat sink fins 401 in the metal heat sink 400 for release. In this embodiment, the groove 104 is located in the second metal layer 103 of the flange base 100.

[0059] In some embodiments, the plurality of grooves 104 are located in the flange base 100 on or around the location where the RF chip is subsequently mounted, in order to further improve the heat dissipation efficiency of the metal heat sink and further reduce the impact of stress in the flange base 100 on the RF chip.

[0060] In some embodiments, the groove 104 may be square, circular, elliptical or other polygonal in shape.

[0061] refer to Figure 2 A casing 105 is attached to the upper surface edge region of the flange base 100, and a pin 107 is fixed in the casing 105, with the upper surfaces of both ends of the pin 107 exposed.

[0062] The enclosure 105 serves two purposes: firstly, it supports the pins 107, allowing the pins 107 to be mounted on the upper sides or around the flange base plate 100, and electrically isolating the pins 107 from the flange base plate 100; secondly, the enclosure 105 also forms a sealed cavity between the flange base plate 100 and the subsequently mounted top cover.

[0063] The housing 105 is a hollow ring and is attached to the upper surface edge area of ​​the flange base 100, that is, the middle area surrounding the flange base 100.

[0064] In some embodiments, the enclosure 105 is attached to the edge region surface of the flange base 100 by an adhesive 106.

[0065] In some embodiments, the casing 105 is made of ceramic or insulating resin.

[0066] The pin 107 is used to lead out the electrical signals of the subsequently mounted RF chip for electrical connection to other devices. The pin 107 is located on the upper sides or around the flange base 100. The pin 107 includes two ends, one end facing the middle area near the flange base 100 for electrical connection with the RF chip, and the other end facing away from the middle area of ​​the flange base 100 for electrical connection with other devices outside the cavity-like package structure formed in this application.

[0067] In some embodiments, the pin 107 may be fixed to the upper surface of the housing 105 or fixed within the housing 105. In some embodiments, the pin 107 is fixed to the upper surface of the housing 105 by adhesive.

[0068] refer to Figure 3 An RF chip 200 is mounted on the upper surface of the flange base 100 inside the housing 105. The RF chip 200 is electrically connected to the pin 107 via a first metal lead 203.

[0069] The radio frequency (RF) chip 200 is a core component of the mobile communication system, primarily used to process high-frequency (including RF transceiver, frequency synthesis, and power amplification) RF signals, typically operating in the frequency range of several kilohertz (kHz) to tens of gigahertz (GHz). The RF chip 201 generally consists of five parts: a filter, a power amplifier (PA), an RF switch, a low-noise amplifier (LNA), and duplexers (duplexer and diplexer).

[0070] The radio frequency chip 200 includes a functional side and a back side, the functional side having pads, and the pads on the functional side of the radio frequency chip 200 being electrically connected to the pin 107 via a first metal lead 203. In some embodiments, the material of the first pad is one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.

[0071] The back of the radio frequency chip 200 is attached to the upper surface of the flange base 100 by a thermal adhesive 201. The heat generated by the radio frequency chip 200 is transferred to the flange base 100 through the thermal adhesive 201.

[0072] The number of the mounted radio frequency chips 200 can be one or more (greater than or equal to two). In some embodiments, when the number of mounted radio frequency chips 200 is multiple, the multiple radio frequency chips 200 can be interconnected through the second metal lead 204.

[0073] In some embodiments, the materials of the first metal lead 203 and the second metal lead 204 may be one or more of gold, aluminum, copper, and silver. The formation process of the first metal lead 203 and the second metal lead 204 includes a wire bonding process.

[0074] refer to Figure 4 A non-metallic top cover 300 is provided, wherein the non-metallic top cover 300 has a plurality of perforations 301 extending through the upper and lower surfaces of the non-metallic top cover 300.

[0075] The non-metallic top cover 300 is subsequently attached to the housing 105 (see reference). Figure 8 After being placed on top, it is used to form a sealed cavity between the enclosure 105 and the flange base plate 100.

[0076] The non-metallic cover 300 is made of a non-metallic material to prevent interference with the radio frequency signals emitted by the radio frequency chip 200. In some embodiments, the material of the non-metallic cover 300 is ceramic, such as alumina. In a specific embodiment, the material of the non-metallic cover 300 can be ceramic or epoxy resin, which have relatively low heat dissipation performance, to reduce costs.

[0077] The non-metallic top cover 300 has multiple through holes 301 penetrating the upper and lower surfaces of the non-metallic top cover 300, which are subsequently attached to the housing 105 (reference). Figure 8 After installation, the position of the perforation 301 corresponds to the position of the groove 104 in the flange base plate 100. Subsequently, a metal heat sink 400 is installed on the non-metallic top cover 300 (see reference). Figure 8 When the metal heat sink 400 is in use, the metal heat sink column 402 can pass through the corresponding perforation 301 in the non-metallic top cover 300 and be attached to the corresponding groove 104 in the flange base 100.

[0078] In this embodiment, the non-metallic top cover 300 is in the shape of an inverted "U".

[0079] refer to Figure 5 and Figure 6 ,in Figure 5 for Figure 6 A cross-sectional structural diagram along the cutting line AB shows a metal heat sink 400, which includes a metal heat sink 401 and a plurality of metal heat sink columns 402 protruding from the lower surface of the metal heat sink 401.

[0080] The metal heat sink 400 is subsequently mounted on the non-metallic top cover 300 (see reference). Figure 8 This invention provides a method for heat dissipation from the front of the packaging structure, and also allows heat dissipation from the back of the packaging structure via the flange substrate 100, thus achieving double-sided heat dissipation and improving heat dissipation performance.

[0081] The metal radiator 400 includes a metal heat sink 401 and a plurality of metal heat sink pillars 402 protruding from the lower surface of the metal heat sink 401. The metal heat sink 401 is subsequently attached to the non-metallic upper cover 300 (see reference). Figure 8 On the upper surface of the non-metallic top cover 400, the metal heat sink 402 passes through the corresponding perforation 301 in the non-metallic top cover 400 and is attached to the corresponding groove 104 in the flange base 100 (see reference). Figure 8 In this process, the metal heat sink 401 can release the heat present in the non-metallic top cover 300. When the metal heat sink 402 is attached to the corresponding groove 104 in the flange base 100 (the metal heat sink 402 penetrates the groove 104 in the flange base 100), more heat in the flange base 100 can be conducted to the metal heat sink 402, so that the heat can be released through the metal heat sink 402 and / or conducted through the metal heat sink 402 to the metal heat sink 401 in the metal radiator 400 for release, thereby enhancing the heat dissipation effect.

[0082] The metal heat sink 401 and the plurality of metal heat sink pillars 402 are an integral structure. In a specific embodiment, the plurality of metal heat sink pillars 402 are welded to the lower surface of the metal heat sink 401.

[0083] In some embodiments, the metal heat sink 401 has a plurality of mesh holes 403 penetrating the upper and lower surfaces of the metal heat sink 401. The presence of the mesh holes 403 can prevent the metal heat sink 400 from affecting the radio frequency signals emitted by the packaged radio frequency chip or the radio frequency signals introduced from the outside. That is, the radio frequency signals emitted by the radio frequency chip or the radio frequency signals introduced from the outside can pass through the mesh holes and be transmitted out or transmitted without being affected by the metal heat sink 401.

[0084] In some embodiments, the plurality of meshes 403 are arranged in a regular (e.g., array, honeycomb, concentric rings, etc.) or irregular manner, and the plurality of meshes 403 may have the same or different sizes.

[0085] In this embodiment, the metal heat sink 401 is a single piece of plate, and the plate has multiple mesh holes 403 penetrating its upper and lower surfaces. In other embodiments, the metal heat sink 401 may include multiple separate sub-plates, each sub-plate having multiple mesh holes 403 penetrating its upper and lower surfaces. In a specific embodiment, for ease of installation, adjacent sub-plates can be connected by a central rib.

[0086] In some embodiments, the height of the metal heat sink 402 is greater than the height of the non-metallic top cover 300.

[0087] refer to Figure 7 The metal heat sink 400 is attached to the non-metallic top cover 300, wherein the metal heat sink 401 is attached to the upper surface of the non-metallic top cover 300, and the metal heat sink column 402 passes through the corresponding perforation 301 in the non-metallic top cover 300.

[0088] In some embodiments, the metal heat sink 400 is attached to the non-metallic top cover 300 by filling the space between the metal heat sink 402 and the perforation 301 with sealant 404, thereby sealing the metal heat sink 402 and the perforation 301.

[0089] In some embodiments, the metal heat sink 401 can be directly attached to the surface of the non-metallic top cover 300, or attached to the surface of the non-metallic top cover 300 by a thermally conductive adhesive.

[0090] refer to Figure 8The non-metallic top cover 300 is attached to the enclosure 105, forming a sealed cavity between the non-metallic top cover 300, the enclosure 105 and the flange base 100, and the metal heat dissipation column 402 is attached to the flange base 100 through the corresponding perforation 301 in the non-metallic top cover 300.

[0091] In some embodiments, the metal heat sink 402 of the metal heat sink 400 can pass through corresponding perforations 301 in the non-metallic top cover 300 and be attached to corresponding grooves 104 in the flange base 100. In a specific embodiment, the metal heat sink 402 is attached to the corresponding grooves 104 in the flange base 100 using a non-conductive adhesive 405, thus ensuring that there is no electrical connection between the metal heat sink 402 and the flange base 100, further preventing interference with radio frequency signals.

[0092] In some embodiments, when there is no groove in the flange base 100, the metal heat dissipation column 402 passes through the corresponding perforation 301 in the non-metallic top cover 300 and is attached to the upper surface of the flange base 100. In a specific embodiment, the metal heat dissipation column 402 is attached to the upper surface of the flange base 100 using a non-conductive adhesive.

[0093] In some embodiments, the non-metallic top cover 300 is attached to the housing 105 by an adhesive 302.

[0094] Some embodiments of this application also provide a cavity-like encapsulation structure, see reference. Figure 8 ,include:

[0095] Flange base 100;

[0096] A housing 105 is attached to the upper surface edge region of the flange base 100, and a pin 107 is fixed in the housing 105, with the two end surfaces of the pin 107 exposed in the housing 105.

[0097] The radio frequency chip 200 is attached to the upper surface of the flange base 100 inside the enclosure 105, and the radio frequency chip 200 is electrically connected to the pin 107 through the first metal lead 203.

[0098] A non-metallic top cover 300 is attached to the housing 105, and a sealed cavity is formed between the non-metallic top cover 300, the housing 105 and the flange base 100. The non-metallic top cover 300 has a plurality of perforations 301 that penetrate the upper and lower surfaces of the non-metallic top cover 300.

[0099] A metal radiator 400 includes a metal heat sink 401 and a plurality of metal heat sink columns 402 protruding from the lower surface of the metal heat sink 401. The metal radiator 400 is attached to the non-metallic top cover 300, wherein the metal heat sink 401 is attached to the upper surface of the non-metallic top cover 300, and the metal heat sink columns 402 are attached to the flange base 100 through corresponding perforations 301 in the non-metallic top cover 300.

[0100] In some embodiments, the flange base 100 has a plurality of grooves 104, and the metal heat dissipation column 402 passes through the corresponding perforation 301 in the non-metallic top cover 300 and is attached to the corresponding groove 104 in the flange base 100.

[0101] In some embodiments, the plurality of grooves 104 are located in the flange base 100 on or around the radio frequency chip 200.

[0102] In some embodiments, the metal heat sink 401 has a plurality of mesh holes 403 extending through the upper and lower surfaces of the metal heat sink.

[0103] In some embodiments, the plurality of mesh openings 403 are arranged in a regular or irregular manner, and the plurality of mesh openings 403 may be the same or different in size.

[0104] In some embodiments, the metal heat sink 402 is attached to the upper surface of the flange base 100 through a corresponding perforation 301 in the non-metallic top cover 300.

[0105] In some embodiments, the metal heat sink 402 is sealed to the perforation 301 by sealant 404, and the metal heat sink 402 is attached to the flange base 100 by non-conductive adhesive 405.

[0106] In some embodiments, the non-metallic cover 300 is made of ceramic or epoxy resin; the number of radio frequency chips 200 is one or more, and when the number of radio frequency chips 200 is multiple, the multiple radio frequency chips 200 are interconnected by a second metal lead 204.

[0107] The pin 107 is fixed in the enclosure or on the upper surface of the enclosure. In some embodiments, the pin 107 is fixed to the upper surface of the enclosure 105 by adhesive.

[0108] Other embodiments of this application also provide a method for forming a cavity-like encapsulation structure, see reference. Figure 9 ,include:

[0109] Flange base 100;

[0110] A housing 105 is attached to the upper surface edge region of the flange base 100, and a pipe leg 107 is fixed in the housing 105, with the housing 105 exposing the two end surfaces of the pipe leg 107.

[0111] An RF chip 200 is mounted on the upper surface of the flange base 100 inside the enclosure 105. The RF chip 200 is electrically connected to the pin 107 via a first metal lead 203.

[0112] A non-metallic top cover 300 is attached to the housing 105, forming a sealed cavity between the non-metallic top cover 300, the housing 105, and the flange base 100. The non-metallic top cover 300 has raised non-metallic heat dissipation columns 304 on its lower surface, and the non-metallic heat dissipation columns 304 are attached to the flange base 100.

[0113] The non-metallic top cover 300 has raised non-metallic heat dissipation columns 304 on its lower surface. The non-metallic heat dissipation columns 304 are attached to the flange base 100, so that the heat in the flange base 100 can be conducted to the non-metallic heat dissipation columns 304 for release and / or conducted to the non-metallic top cover 300 for release, thereby enhancing the heat dissipation effect.

[0114] In some embodiments, the flange base 100 has a plurality of grooves 104, and the non-metallic heat dissipation pillar 304 is attached to the corresponding grooves 104 in the flange base 100, that is, the non-metallic heat dissipation pillar 304 extends into the grooves 104 in the flange base 100, so that more heat in the flange base 100 can be conducted to the non-metallic heat dissipation pillar 304 for release through the non-metallic heat dissipation pillar 304 and / or through the non-metallic cover 300 of the non-metallic heat dissipation pillar 304. In some embodiments, the plurality of grooves 104 are located in the flange base 100 on one side or around the RF chip 200.

[0115] In other embodiments, the non-metallic heat dissipation column 304 is attached to the upper surface of the flange base 100.

[0116] The non-metallic top cover 300 and the non-metallic heat dissipation column 304 are an integral structure. In some embodiments, the non-metallic top cover 300 and the non-metallic heat dissipation column 304 are made of ceramic.

[0117] In some embodiments, the non-metallic heat dissipation column 304 is attached to the flange base 100 using non-conductive adhesive 405.

[0118] The pin 107 is fixed in the enclosure or on the upper surface of the enclosure. In some embodiments, the pin 107 is fixed to the upper surface of the enclosure 105 by adhesive.

[0119] Other embodiments of this application also provide a cavity-like encapsulation structure, see reference. Figure 9 ,

[0120] Flange base 100;

[0121] A housing 105 is attached to the upper surface edge region of the flange base 100, and a pin 107 is fixed in the housing 105, with the two end surfaces of the pin 107 exposed in the housing 105.

[0122] The radio frequency chip 200 is attached to the upper surface of the flange base 100 inside the enclosure 105, and the radio frequency chip 200 is electrically connected to the pin 107 through the first metal lead 203.

[0123] A non-metallic top cover 300 is attached to the housing 105, forming a sealed cavity between the non-metallic top cover 300, the housing 105 and the flange base 100, and the lower surface of the non-metallic top cover 300 has a raised non-metallic heat dissipation column 304, which is attached to the flange base 100.

[0124] In some embodiments, the pin 107 is fixed to the upper surface of the housing 105 by adhesive.

[0125] In some embodiments, the flange base 100 has a plurality of grooves 104, and the non-metallic heat dissipation column 304 is attached to the corresponding groove 104 in the flange base 100; the plurality of grooves 104 are located in the flange base 100 on one side or around the RF chip 200.

[0126] In some embodiments, the non-metallic heat dissipation column 304 is attached to the upper surface of the flange base 100.

[0127] In some embodiments, the non-metallic heat dissipation column 304 is attached to the flange base 100 by non-conductive adhesive 405; the non-metallic top cover 300 and the non-metallic heat dissipation column 304 are an integral structure, and the materials of the non-metallic top cover 300 and the non-metallic heat dissipation column 304 are ceramic.

[0128] It should be noted that the terms "comprising" and "having," and their variations, used in this disclosure are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context. It should be understood that such data used interchangeably where appropriate. Furthermore, embodiments and features within embodiments of this disclosure can be combined with each other unless otherwise specified. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this disclosure. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar or identical parts between embodiments can be referred to (or understood) interchangeably.

[0129] Although this disclosure has been presented above with reference to preferred embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make possible changes and modifications to the technical solutions of this disclosure by utilizing the methods and techniques disclosed above without departing from the spirit and scope of this disclosure. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solutions of this disclosure shall fall within the protection scope of the technical solutions of this disclosure.

Claims

1. A cavity-like encapsulation structure, characterized in that, include: Flange base; A housing is attached to the upper surface edge region of the flange base, wherein a pin is fixed in the housing, and the housing exposes the two end surfaces of the pin; An RF chip is mounted on the upper surface of the flange base inside the enclosure, and the RF chip is electrically connected to the pins via a first metal lead; A non-metallic top cover is attached to the enclosure, and a sealed cavity is formed between the non-metallic top cover, the enclosure, and the flange base. The non-metallic top cover has multiple perforations that penetrate the upper and lower surfaces of the non-metallic top cover. A metal radiator, comprising metal heat sinks and a plurality of metal heat sink columns protruding from the lower surface of the metal heat sinks, the metal radiator being mounted on a non-metallic top cover, wherein the metal heat sinks are mounted on the upper surface of the non-metallic top cover, and the metal heat sink columns are mounted to the flange base through corresponding perforations in the non-metallic top cover.

2. The cavity-type encapsulation structure according to claim 1, characterized in that, The flange base has multiple grooves, and the metal heat dissipation column passes through the corresponding perforation in the non-metallic top cover and is attached to the corresponding groove in the flange base.

3. The cavity-type encapsulation structure according to claim 2, characterized in that, The plurality of grooves are located in the flange base on or around the side of the RF chip.

4. The cavity-type encapsulation structure according to claim 1 or 2, characterized in that, The metal heat sink has multiple mesh holes that penetrate the upper and lower surfaces of the metal heat sink.

5. The cavity-type encapsulation structure according to claim 4, characterized in that, The plurality of mesh openings are arranged in a regular or irregular manner, and the size of the plurality of mesh openings may be the same or different.

6. The cavity-type encapsulation structure according to claim 1, characterized in that, The metal heat sink column is attached to the upper surface of the flange base through corresponding perforations in the non-metallic top cover.

7. The cavity-type encapsulation structure according to claim 2 or 6, characterized in that, The metal heat sink column is sealed to the perforation with sealant, and the metal heat sink column is attached to the flange base with non-conductive adhesive.

8. The cavity-type encapsulation structure according to claim 1, characterized in that, The non-metallic cover is made of ceramic or epoxy resin; the number of radio frequency chips is one or more, and when the number of radio frequency chips is multiple, the multiple radio frequency chips are interconnected by a second metal lead.

9. The cavity-type encapsulation structure according to claim 1, characterized in that, The pins are fixed to the upper surface of the enclosure with adhesive.

10. A method for forming a cavity-like encapsulation structure, characterized in that, include: Provide flange base; A casing is attached to the upper surface edge region of the flange base, and a pipe leg is fixed in the casing, with the casing exposing the two end surfaces of the pipe leg; An RF chip is mounted on the upper surface of the flange base inside the enclosure, and the RF chip is electrically connected to the pins via a first metal lead. A non-metallic top cover is provided, wherein the non-metallic top cover has a plurality of perforations penetrating the upper and lower surfaces of the non-metallic top cover; A metal radiator is provided, the metal radiator including metal heat sinks and a plurality of metal heat sink columns protruding from the lower surface of the metal heat sinks; The metal heat sink is attached to the non-metallic top cover, wherein the metal heat sink fins are attached to the upper surface of the non-metallic top cover, and the metal heat sink column passes through the corresponding perforation in the non-metallic top cover; A non-metallic top cover is attached to the enclosure, forming a sealed cavity between the non-metallic top cover, the enclosure, and the flange base, and the metal heat dissipation column is attached to the flange base through the corresponding perforation in the non-metallic top cover.

11. The method for forming a cavity-like encapsulation structure according to claim 10, characterized in that, The flange base has multiple grooves, and the metal heat sink column passes through the corresponding perforation in the non-metallic top cover and is attached to the corresponding groove in the flange base; the multiple grooves are located in the flange base on or around the RF chip.

12. The method for forming a cavity-like encapsulation structure according to claim 11, characterized in that, The metal heat sink has multiple mesh holes that penetrate the upper and lower surfaces of the metal heat sink; the multiple mesh holes are arranged regularly or irregularly, and the multiple mesh holes may be the same or different in size.

13. The method for forming a cavity-like encapsulation structure according to claim 10, characterized in that, The metal heat sink column is attached to the upper surface of the flange base through corresponding perforations in the non-metallic top cover.

14. The method for forming a cavity-like encapsulation structure according to claim 11 or 13, characterized in that, The metal heat sink column is sealed to the perforation with sealant, and the metal heat sink column is attached to the flange base with non-conductive adhesive.

15. The method for forming a cavity-like encapsulation structure according to claim 11, characterized in that, The non-metallic cover is made of ceramic or epoxy resin; the number of radio frequency chips is one or more, and when the number of radio frequency chips is multiple, the multiple radio frequency chips are interconnected by a second metal lead.

Images