Array substrate, preparation method thereof, display panel and display device

Abstract

The application provides an array substrate, a preparation method thereof, a display panel and a display device. The array substrate comprises a substrate, an alignment mark, a mark cover layer and a light shielding layer. The alignment mark is arranged on one side of the substrate, the mark cover layer is arranged on the side of the alignment mark away from the substrate, and the mark cover layer and the alignment mark at least partially overlap. The light shielding layer has a transmittance lower than that of the mark cover layer. The light shielding layer is in contact with the mark cover layer, and at least part of the mark cover layer is exposed by the light shielding layer. In the embodiment of the application, since the mark cover layer and the alignment mark at least partially overlap, at least part of the structure of the alignment mark can also be exposed by the light shielding layer. Moreover, since the mark cover layer has a relatively high transmittance, the relative position of the alignment mark can still be determined through the mark cover layer during the preparation of subsequent film layers, so that the positioning function is realized, the preparation needs are met, and the preparation precision is improved.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to an array substrate and its preparation method, a display panel, and a display device. Background Technology

[0002] With the development of science and technology, display panels have also developed rapidly. They are widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers, becoming an indispensable part of people's daily lives.

[0003] In the manufacturing process of display panels, alignment marks are usually set on the array substrate to ensure the alignment of certain film layers and improve the manufacturing accuracy of the display panel. However, these alignment marks are easily obscured, which can lead to deviations in the fabrication of some film layers, thus affecting the yield of the display panel. Summary of the Invention

[0004] This application provides an array substrate and its fabrication method, a display panel, and a display device, which can improve fabrication accuracy.

[0005] In a first aspect, embodiments of this application provide an array substrate, which includes a substrate, a alignment mark, a mark cover layer, and a light-shielding layer. The alignment mark is disposed on one side of the substrate, and the mark cover layer is disposed on the side of the alignment mark facing away from the substrate. The mark cover layer and the alignment mark at least partially overlap. The transmittance of the light-shielding layer is less than the transmittance of the mark cover layer. The light-shielding layer is in contact with the mark cover layer, and the light-shielding layer exposes at least a portion of the mark cover layer.

[0006] Secondly, embodiments of this application provide a display panel, including the array substrate in any of the foregoing embodiments.

[0007] Thirdly, embodiments of this application provide a display device, including the display panel in any of the foregoing embodiments.

[0008] Fourthly, embodiments of this application provide a method for fabricating an array substrate, comprising: An alignment mark is formed on one side of the substrate; A marking cover layer is formed on the side of the alignment mark away from the substrate, and the marking cover layer at least partially overlaps with the alignment mark; After forming the marking overlay, a light-shielding material is applied to the side of the marking away from the substrate. The light-shielding material contacts the marking overlay and exposes at least a portion of the marking overlay, thus forming a light-shielding layer.

[0009] This application provides an array substrate and its fabrication method, a display panel, and a display device. Since the marking cover layer and the alignment marking at least partially overlap, the light-shielding layer can also expose at least a portion of the structure of the alignment marking. Furthermore, because the marking cover layer has relatively high transmittance, the relative position of the alignment marking can still be determined through the marking cover layer during subsequent film fabrication, thereby achieving the positioning function, meeting fabrication requirements, and improving fabrication accuracy. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic cross-sectional view of an array substrate provided in an embodiment of this application; Figure 2 This is a cross-sectional structural schematic diagram of another array substrate provided in the embodiments of this application; Figure 3 This is a cross-sectional structural diagram of another array substrate provided in an embodiment of this application; Figure 4 This is a cross-sectional structural diagram of another array substrate provided in an embodiment of this application; Figure 5 This is a top view of another array substrate provided in an embodiment of this application; Figure 6 yes Figure 5 A schematic diagram showing the relative positional relationship between the alignment marker and the marker overlay layer at point Q in the central region; Figure 7 This application also provides a schematic diagram illustrating the relative positional relationship between the alignment mark and the mark cover layer at region Q of an array substrate; Figure 8 This application provides a cross-sectional structural schematic diagram of an array substrate. Figure 9 This is a cross-sectional structural diagram of a display panel provided in an embodiment of this application; Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application; Figure 11 This is a flowchart of a method for fabricating an array substrate according to an embodiment of this application; Figures 12a to 12c This is a schematic diagram of the process structure of an array substrate fabrication method provided in an embodiment of this application.

[0012] Marker explanation: 10. Substrate; 20. Alignment markers; 30. Signage overlay; 40. Light-shielding layer; 41. Opening structure; 50. First metal layer; 51. First conductive part; 52. Second conductive part; 60. Light-emitting element; 61. First electrode; 62. Second electrode; M1, First surface; M11, First part; M12, Second part; M13, Third part; B. Side wall; X, first direction; Y, thickness direction A1, Zone 1; A2, Zone 2. Detailed Implementation

[0013] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0014] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0015] Alignment marks are typically required on the array substrate, as some film layers require positioning and fabrication using these marks. Specifically, the alignment marks are usually placed at specific locations. During the fabrication of certain film layers, the alignment marks can be positioned by reflecting light, thus determining the exact position of the film layer relative to the array substrate, allowing for precise fabrication of that film layer.

[0016] However, during the manufacturing process, the alignment marks are easily blocked by the light-shielding materials in some film layers, making it difficult to confirm the specific position of the alignment marks when manufacturing other film layers. This can lead to deviations in the manufacturing of some film layers, which is detrimental to the yield of the display panel.

[0017] Regarding the above issues, firstly, please refer to [link / reference needed]. Figure 1 and Figure 2 This application provides an array substrate, which includes a substrate 10, alignment marks 20, an identification cover layer 30, and a light-shielding layer 40. The alignment marks 20 are disposed on one side of the substrate 10, and the identification cover layer 30 is disposed on the side of the alignment marks 20 facing away from the substrate 10. The identification cover layer 30 and the alignment marks 20 at least partially overlap. The transmittance of the light-shielding layer 40 is less than that of the identification cover layer, the light-shielding layer 40 is in contact with the identification cover layer 30, and the light-shielding layer 40 exposes at least a portion of the identification cover layer 30.

[0018] The array substrate provided in this embodiment can be used to form a display panel. The array substrate is suitable for various display panels; for example, it can be used for display panels using micro-light-emitting diodes as light-emitting elements, and its structure can be as follows: Figure 1 As shown; or the array substrate can also be used for light-transmitting display panels, and its structure can be as follows. Figure 2 As shown; or the array substrate can also be used for display panels with organic light-emitting structures as light-emitting elements, and its structure can be as follows. Figure 3 As shown.

[0019] The substrate 10 primarily serves a supporting and load-bearing function. Other film layers are sequentially stacked on the substrate 10. Here, "stacked" refers to the other film layers being sequentially arranged along the thickness direction Y of the substrate 10. The substrate 10 may include various film layer structures, and this application embodiment does not limit the specific composition of the film layer structure of the substrate 10. Furthermore, the thickness direction Y of other film layers located on one side of the substrate 10 is generally consistent with the thickness direction Y of the substrate 10 itself. Therefore, for ease of description, the thickness direction Y of the substrate 10 or other film layers mentioned later in this application embodiment will be shown in the same direction.

[0020] Alignment markers 20 are disposed on one side of the substrate 10. Alignment markers 20 provide a positioning reference, thereby calibrating and aligning the film layer positions during subsequent film layer fabrication. This application embodiment does not limit the specific type of film layer requiring positioning using alignment markers 20. For example, the array substrate provided in this application embodiment can be applied to display panels using micro-light-emitting diodes (LEDs) as light sources. During the transfer of micro-LEDs to the array substrate, the alignment markers 20 can be used to determine the transfer position of the micro-LEDs, improving transfer accuracy. Alternatively, when fabricating film layer structures, such as encapsulation structures, protective films, and cover glass, the alignment markers 20 can also be used for positioning to ensure that the final film layer positions in the formed display panel are relatively accurate and reliable.

[0021] The embodiments of this application do not limit the specific material composition of the alignment mark 20 or its specific position in the array substrate. For example, the alignment mark 20 may include a metallic material, which can provide a positioning reference by utilizing the principle of metallic reflection. Furthermore, the alignment mark 20 may be disposed on the same layer as certain metal traces, that is, both are located at the same height dimension in the thickness direction Y, and both have the same internal material composition.

[0022] Furthermore, the alignment mark 20 can have various shapes and structures. Optionally, the orthographic projection of the alignment mark 20 onto the substrate 10 can be a regular shape such as a cross, L, T, triangle, or rhombus, or the orthographic projection of the alignment mark 20 onto the substrate 10 can also be an irregular shape. This application embodiment does not impose any limitations on this. Among them, in Figure 5 The image shows the alignment mark 20 projecting as a cross shape onto the substrate. Figure 6 The image shows the case where the alignment mark 20 is square when projected onto the substrate.

[0023] The light-shielding layer 40 includes a light-shielding material. The presence of the light-shielding layer 40 can absorb light, thereby reducing the risk of display abnormalities in the subsequently formed display panel due to reflections or other issues. The specific location of the light-shielding layer 40 is not limited in this embodiment. Exemplarily, the light-shielding layer 40 can be reused as a pixel definition layer. The pixel definition layer can enclose and form pixel openings for accommodating light-emitting elements 60, wherein the light-emitting elements 60 include, but are not limited to, organic light-emitting elements and micro-light-emitting diodes.

[0024] In related technologies, since the light-shielding layer 40 is located on the side of the alignment mark 20 away from the substrate 10, the light-shielding layer 40 can easily cover the alignment mark 20. This makes it impossible to locate the pattern to be formed by the alignment mark when the entire light-shielding film layer is formed into the light-shielding layer 40 through the patterning process. In addition, it also makes it difficult to achieve positioning with the help of the alignment mark 20 when other film layers on the side of the light-shielding layer 40 away from the substrate 10 are prepared, which can easily lead to preparation errors and is not conducive to the final preparation yield.

[0025] In this embodiment, an identification cover layer 30 is added, which is disposed on the side of the alignment mark 20 facing away from the substrate 10, such as... Figures 1 to 3 As shown, the marking overlay 30 can be positioned in contact with the alignment marking 20, or as... Figure 4 As shown, the marking cover layer 30 can also be spaced apart from the alignment mark 20 in the thickness direction Y. This application embodiment does not limit this, as long as at least part of the marking cover layer 30 is located on the side of the alignment mark 20 away from the substrate 10.

[0026] The overlay layer 30 and the alignment mark 20 at least partially overlap, i.e., as shown in the figure. Figure 6 As shown, the orthographic projection of the marking cover layer 30 onto the substrate 10 can completely cover the alignment mark 20, or as... Figure 5 As shown, the orthographic projection of the marking cover layer 30 onto the substrate 10 may only cover a portion of the structural configuration of the alignment mark 20. Furthermore, the orthographic projection shape of the marking cover layer 30 onto the substrate 10 may be the same as, or different from, the orthographic projection shape of the alignment mark 20 onto the substrate 10; this embodiment does not impose any limitations on this.

[0027] The transmittance of the light-shielding layer 40 is less than that of the marking cover layer 30. Transmittance typically corresponds to the light-transmitting ability of the film structure. Under the same lighting conditions, the higher the transmittance, the more light can pass through the film layer, and the higher the corresponding brightness. The marking cover layer 30 may include a transparent material, or it may include a translucent material; this embodiment does not impose any limitations. The requirement is that the transmittance of the light-shielding layer 40 is less than that of the marking cover layer 30.

[0028] Furthermore, the light-shielding layer 40 contacts the marking cover layer 30, and the light-shielding layer 40 can expose at least a portion of the marking cover layer 30. Specifically, the marking cover layer 30 can be prepared and formed before the light-shielding layer 40, while the light-shielding layer 40 can be formed by coating a light-shielding material. Thus, during the preparation of the light-shielding layer 40, due to limitations such as the material or surface shape of the marking cover layer 30 itself, at least a portion of the light-shielding material falling on the side of the marking cover layer 30 away from the substrate 10 will slide onto the side of the marking cover layer 30 in the direction parallel to the plane of the substrate 10, thereby causing the formed light-shielding layer 40 to contact the marking cover layer 30, while the light-shielding layer 40 can also expose at least a portion of the marking cover layer 30.

[0029] In this case, since the marking cover layer 30 at least partially overlaps with the alignment mark 20, the light-shielding layer 40 can also expose at least a portion of the structure of the alignment mark 20. Furthermore, because the marking cover layer 30 has relatively high transmittance, the relative position of the alignment mark 20 can still be determined through the marking cover layer 30 during subsequent film preparation, thereby achieving the positioning function, meeting preparation requirements, and improving preparation accuracy.

[0030] It should be noted that you should refer to [link / reference]. Figure 5 and Figure 6 The resulting display panel can have a display area for achieving the display effect, and a non-display area surrounding the display area. The array substrate can include a first area A1 corresponding to the display area and a second area A2 corresponding to the non-display area. Based on this, the alignment mark 20 can be set in the first area A1 or in the second area A2, and this embodiment does not limit this.

[0031] The display panel can also consist of only the display area, such as a borderless display panel, in which the alignment mark can be set within the area corresponding to the display area.

[0032] However, in related technologies, to reduce the risk of the light-shielding layer 40 obstructing the alignment mark 20, the light-shielding layer 40 is usually formed by reducing the coating area of ​​the light-shielding material, and the formed light-shielding layer 40 can avoid the alignment mark 20. Taking a display panel with a rectangular outline and a size of 20cm*20cm as an example, the alignment mark 20 can be placed in the non-display area. In this case, the size of the coating area corresponding to the light-shielding material needs to be reduced, and its coating area size can be 18cm*18cm. However, if the alignment mark 20 is placed in the display area, that is, the alignment mark 20 is located in the center of the display panel, even if the coating area of ​​the light-shielding material is reduced, the light-shielding material can still easily cover the alignment mark 20 in different directions from all sides. Therefore, it is difficult to arrange the light-shielding material in the display area in related technologies.

[0033] However, in this embodiment, due to the presence of the marking cover layer 30, the marking cover layer 30 can ensure that the alignment mark 20 can still be exposed to achieve the positioning function after the light-shielding layer 40 is prepared. Thus, the alignment mark 20 can be placed either in the first area A1 corresponding to the display area or in the second area A2 corresponding to the non-display area. Simultaneously, when preparing the light-shielding layer 40, the size of the coating area corresponding to the light-shielding material does not need to be reduced, thereby increasing the coverage area of ​​the light-shielding layer 40 and meeting the actual needs of the subsequently formed display panel.

[0034] In some embodiments, such as Figure 1 As shown, the marking cover layer 30 includes a first surface M1 facing away from the substrate 10, at least a portion of the first surface M1 being inclined relative to the plane of the substrate 10.

[0035] The first surface M1 is the surface of the cover layer 30 that is away from the substrate 10. The first surface M1 can be a planar, folded, or curved surface, or it can be other irregular shapes. This application embodiment does not limit this.

[0036] The light-shielding layer 40 can be prepared after the marking cover layer 30 is formed. During the preparation process, some of the light-shielding material used to form the light-shielding layer 40 will fall on the side of the marking cover layer 30 away from the substrate 10. That is, at least part of the light-shielding material will fall on the first surface M1. If the first surface M1 is parallel to the plane where the substrate 10 is located, it is difficult for the light-shielding material falling on the first surface M1 to be displaced, which will cause the light-shielding material to accumulate on the first surface M1. In severe cases, the light-shielding material will cover and block the alignment mark 20, which will not meet the positioning requirements of the subsequent film layer.

[0037] Based on this, the embodiments of this application control the shape of the marking cover layer 30 so that at least a portion of the first surface M1 is inclined relative to the plane of the substrate 10, that is, the first surface M1 can have a certain slope. This allows the light-shielding material falling on the first surface M1 to move downwards along the first surface M1 under the influence of gravity and other factors, thereby reducing the risk of light-shielding material accumulating on the first surface M1. This allows more structures in the alignment mark 20 to be exposed from the light-shielding layer 40, meeting the positioning requirements of subsequent fabrication.

[0038] In some embodiments, the first surface M1 includes a curved surface. The first surface M1 may be entirely curved, or it may be only partially curved; this embodiment does not impose any limitations on this.

[0039] Curved surfaces typically have a certain curvature. Compared to the technical solution where the first surface M1 includes an inclined plane, the inclination angle of the curved surface relative to the plane where the substrate 10 is located is not the same at different positions. Therefore, the position in the first surface M1 where the light-shielding material is easily gathered can be set with a higher slope according to the actual situation. This makes it easier for the light-shielding material to move along the first surface M1 and separate from the first surface M1. As a result, the alignment mark 20 can be more easily exposed from the light-shielding layer 40, thereby reducing the difficulty of subsequent film preparation and improving the preparation accuracy. This method has high practicality.

[0040] In some embodiments, the curved surface protrudes in a direction away from the substrate 10, and the curved surface at least partially overlaps with the alignment mark 20.

[0041] The curved surface itself has a certain slope, and the curved surface can protrude in the direction away from the substrate 10. In this way, when the light-shielding material falls onto the curved surface, the light-shielding material can easily move down along the slope of the curved surface, making it difficult for the light-shielding material to accumulate on the curved surface.

[0042] At the same time, the curved surface and the alignment mark 20 overlap at least partially, that is, the orthographic projection of the curved surface on the substrate 10 can completely cover the orthographic projection of the alignment mark 20 on the substrate 10, or the orthographic projection of the curved surface on the substrate 10 can only cover part of the structure of the orthographic projection of the alignment mark 20 on the substrate 10.

[0043] This design can reduce the probability of light-shielding material accumulating on curved surfaces during the preparation of the light-shielding layer 40, thereby further reducing the risk of the light-shielding layer 40 covering the alignment mark 20 and ensuring that the alignment mark 20 can be more easily exposed from the light-shielding layer 40. This reduces the difficulty of preparing subsequent film layers and improves the preparation accuracy of subsequent film layers.

[0044] In addition, this design allows the marking cover layer 30 to act as a convex lens, making the alignment marking 20 easier to identify during the alignment process, thereby reducing the difficulty of alignment and improving the alignment accuracy.

[0045] In some embodiments, please refer to Figure 8 The first surface M1 includes a first part M11 and a second part M12. The second part M12 is located on one side of the first part M11 in a direction parallel to the plane of the substrate 10. The first part M11 is inclined relative to the plane of the substrate 10, and the second part M12 intersects with the first part M11.

[0046] The first surface M1 includes at least an intersecting first portion M11 and a second portion M12. The first portion M11 may be inclined relative to the plane of the substrate 10, so that the light-shielding material falling on the first portion M11 can move along the slope of the first portion M11 and thus leave the first surface M1. The second portion M12 may be inclined relative to the plane of the substrate 10, or the second portion M12 may be parallel to the plane of the substrate 10. This application embodiment does not limit this.

[0047] In some alternative embodiments, the second portion M12 is arranged parallel to the plane of the substrate 10, that is, the cross-sectional shape of the marking cover layer 30 can be trapezoidal. Further, the first surface M1 also includes a third portion M13 located on the side of the second portion M12 opposite to the first portion M11. The third portion M13 can be symmetrically arranged with the first portion M11 in the thickness direction Y, so that the cross-sectional shape of the marking cover layer 30 can be an isosceles trapezoidal structure.

[0048] In this embodiment of the application, by setting the first portion M11 in the first surface M1 to be inclined relative to the plane of the substrate 10, the light-shielding material can move along the slope of the first portion M11 during the preparation of the light-shielding layer 40, thereby reducing the risk of the light-shielding material accumulating at the first surface M1, and thus ensuring that the alignment mark 20 can be more easily exposed from the light-shielding layer 40 to meet the alignment requirements.

[0049] In some embodiments, the identification cover layer 30 includes a hydrophobic material.

[0050] Hydrophobic materials refer to a class of low surface energy materials with a static liquid contact angle greater than 90° on a smooth surface. Hydrophobic materials typically have important characteristics such as waterproofing, anti-fogging, snowproofing, pollution prevention, anti-adhesion, anti-oxidation, anti-corrosion, self-cleaning, and prevention of electric current conduction.

[0051] Based on this, the embodiments of this application provide that the marking cover layer 30 includes a hydrophobic material, making the first surface M1 on the marking cover layer 30 relatively smooth. This allows the light-shielding material to slide off the first surface M1 more easily during the preparation of the light-shielding layer 40, thereby reducing the probability that the light-shielding layer 40 covers the marking cover layer 30, and ensuring that the alignment mark 20 can be exposed from the light-shielding layer 40 to meet the alignment requirements.

[0052] Of course, in other embodiments, the surface of the marking cover layer 30 facing away from the substrate 10 may also be formed by a hydrophobic treatment.

[0053] Hydrophobic treatment refers to transforming the surface of an object to be hydrophobic, making it less prone to liquid accumulation and reducing the probability of the surface becoming wet. Based on this, the embodiments of this application, by hydrophobically treating the first surface M1, also allow the light-shielding material to slide off the first surface M1 more easily, reducing the risk of light-shielding material accumulating on the first surface M1 and meeting practical needs.

[0054] It should be noted that, in this embodiment, the marking cover layer 30 may include a hydrophobic material, and the first surface M1 may also be hydrophobically treated, thereby further improving the hydrophobic properties of the first surface M1 and reducing the risk of light-shielding material accumulating on the first surface M1. Furthermore, in this embodiment, since the first surface M1 itself has a certain degree of hydrophobicity, at least a portion of the first surface M1 may be inclined relative to the plane of the substrate 10, or the first surface M1 may be completely parallel to the plane of the substrate 10; this embodiment does not impose any limitations on this.

[0055] In some embodiments, the maximum height of the marking cover layer 30 in the thickness direction Y of the substrate 10 is not less than the maximum height of the light-shielding layer 40. That is, in the thickness direction Y of the substrate 10, the marking cover layer 30 may partially extend beyond the light-shielding layer 40, or the marking cover layer 30 may partially be flush with the light-shielding layer 40.

[0056] Generally, with the size of the light-shielding layer 40 remaining constant, the smaller the size of the marking cover layer 30 in the thickness direction Y, the easier it is for the light-shielding material to cover the marking cover layer 30. If the maximum height of the marking cover layer 30 in the thickness direction Y is less than the maximum height of the light-shielding layer 40, the light-shielding material may completely cover and block the marking cover layer 30 during the preparation of the light-shielding layer 40, thus preventing the alignment mark 20 from being exposed from the light-shielding layer 40 and easily causing problems such as difficulty in subsequent film alignment.

[0057] In this embodiment, by setting the maximum height of the marking cover layer 30 to be no less than the maximum height of the light-shielding layer 40, it can be ensured that the marking cover layer 30 has a certain height in the thickness direction Y, which facilitates the sliding of the light-shielding material off the marking cover layer 30. Simultaneously, it can reduce the probability that the light-shielding layer 40 completely covers the marking cover layer 30, ensuring that the alignment mark 20 can be exposed from the light-shielding layer 40, thus helping to meet the alignment requirements in subsequent manufacturing processes.

[0058] In some embodiments, such as Figure 8 As shown, the maximum height of the overlay layer 30 is H, where H satisfies: 1μm ≤ H ≤ 20μm. For example, H is one of 1μm, 2μm, 5μm, 10μm, 15μm, and 20μm.

[0059] As can be seen from the foregoing, the smaller the maximum height H of the marking cover layer 30, the easier it is for the light-shielding material to cover the marking cover layer 30, which may lead to the risk that the alignment mark 20 cannot be exposed from the light-shielding layer 40. Therefore, in this embodiment, the maximum height H of the marking cover layer 30 is set to be not less than 1 μm, thereby ensuring that the alignment mark 20 can be exposed from the light-shielding layer 40.

[0060] If the maximum height H of the marking cover layer 30 is too large, it will cause unevenness in some parts of the array substrate, which is not conducive to the subsequent fabrication of the film structure and may also lead to an excessively thick overall display panel, which is detrimental to the user experience. Therefore, in this embodiment, the maximum height H of the marking cover layer 30 is set to be greater than 20 μm, which helps to improve the flatness of the film layer and reduces the risk of the final display panel being too thick.

[0061] In some embodiments, such as Figure 1 and Figure 7 As shown, the orthographic projection of the marking cover layer 30 onto the substrate 10 covers the orthographic projection of the alignment mark 20 onto the substrate 10.

[0062] The marking cover layer 30 can completely cover the alignment mark 20. The orthographic projection of the marking cover layer 30 on the substrate 10 can coincide with the orthographic projection of the alignment mark 20 on the substrate 10, or the orthographic projection of the marking cover layer 30 on the substrate 10 can be partially located outside the orthographic projection of the alignment mark 20 on the substrate 10. This application embodiment does not limit this.

[0063] It should be noted that when the orthographic projection of the marking cover layer 30 on the substrate 10 coincides with the orthographic projection of the alignment mark 20 on the substrate 10, etching or other processes can be used to make the size and shape of the marking cover layer 30 consistent with and coincide with the size and shape of the alignment mark 20.

[0064] In this embodiment, by overlaying the orthogonal projection of the marking cover layer 30 onto the orthogonal projection of the alignment mark 20 onto the substrate 10, some or all of the structures in the alignment mark 20 can be exposed from the light-shielding layer 40 after the light-shielding layer 40 is prepared. This helps to further improve the alignment accuracy of the subsequent film layer structure and improve the yield of the final display panel.

[0065] In some embodiments, such as Figure 1 As shown, in the first direction X, the marking cover layer 30 extends at least partially beyond the alignment mark 20 so that the marking cover layer 30 can cover the sidewall B of the alignment mark 20 in the first direction X.

[0066] The first direction X can be a direction parallel to the plane of the substrate 10. The orthographic projection of the marking cover layer 30 onto the substrate 10 is at least partially located outside the orthographic projection of the alignment mark 20 onto the substrate 10, and the marking cover layer 30 can cover the sidewall B of the alignment mark 20 in the first direction X. The orthographic projection shape of the marking cover layer 30 onto the substrate 10 can be the same as or the same as the orthographic projection shape of the alignment mark 20 onto the substrate 10, or it can be different from the orthographic projection shape of the alignment mark 20 onto the substrate 10. This embodiment does not impose any limitations on this.

[0067] In this embodiment, by extending the marking cover layer 30 at least partially beyond the alignment mark 20, the marking cover layer 30 can better cover the alignment mark 20. This helps increase the exposed size of the alignment mark 20 relative to the light-shielding layer 40 after the light-shielding layer 40 is prepared, reducing the difficulty of subsequent film alignment. Simultaneously, the marking cover layer 30 covers the sidewall B of the alignment mark 20 in the first direction X, thus isolating the sidewall B from the external environment, reducing the risk of oxidation and denaturation of the alignment mark 20, and ensuring the reliability of the alignment mark 20.

[0068] In some embodiments, such as Figure 1 As shown, the size of the overlay layer 30 in the first direction X is L1, and the size of the alignment mark 20 in the first direction X is L2. L1 and L2 satisfy: L1≥1.2L2.

[0069] The greater the size of the marking cover layer 30 that extends beyond the alignment mark 20 in the first direction X, the higher the probability that the alignment mark 20 is completely exposed from the light-shielding layer 40 in the first direction X. Therefore, in this embodiment, L1 is set to be no less than 1.2L2 to increase the probability that the alignment mark 20 is completely exposed in the first direction X and improve the alignment reliability during subsequent film preparation.

[0070] It should be noted that, in addition to the first direction X, the marking cover layer 30 can also extend beyond the alignment mark 20 in other directions parallel to the plane of the substrate 10, thereby further increasing the size of the alignment mark 20 exposed from the light-shielding layer 40 to meet the preparation requirements.

[0071] In some embodiments, the identification overlay 30 is disposed in contact with the alignment identification 20.

[0072] In this embodiment, there are no other film layers between the marking cover layer 30 and the alignment mark 20. This reduces the risk of low transmittance at the alignment mark 20 due to other film layers, thereby reducing the alignment difficulty and improving alignment accuracy during subsequent film layer preparation. Furthermore, during the preparation of the marking cover layer 30, the close proximity between the marking cover layer 30 and the alignment mark 20 helps ensure that the completed marking cover layer 30 overlaps with the alignment mark 20, further reducing preparation difficulty.

[0073] It should be noted that the specific film positions of the marking cover layer 30 and the alignment mark 20 are not limited in the embodiments of this application.

[0074] In some embodiments, such as Figure 1 As shown, the array substrate also includes a first conductive portion 51 disposed on one side of the substrate 10. The first conductive portion 51 is used to transmit a first power signal. The first conductive portion 51 and the alignment mark 20 are made of the same material and are located in the same film layer.

[0075] The first conductive part 51 is used to transmit a first power signal. For example, the first power signal is used to transmit to the light-emitting element 60 to drive the light-emitting element 60 to realize light emission display. The first conductive part 51 may include a metallic material.

[0076] Based on this, in this embodiment of the application, the alignment mark 20 and the first conductive part 51 are set as the same film layer and both include the same material. This allows the first conductive part 51 and the alignment mark 20 to be prepared and formed together in the same preparation process using the same material while meeting the reflective alignment requirements of the alignment mark 20. This improves the preparation efficiency and reduces the required preparation cost.

[0077] It should be noted that the alignment mark 20 needs to be insulated from the first conductive part 51, that is, the first power signal is not transmitted within the alignment mark 20. However, the alignment mark 20 may not transmit any signal, or it may be used to transmit other specific signals besides the first power signal; this embodiment does not impose any limitations on this.

[0078] In some embodiments, such as Figure 6 and Figure 7 As shown, the orthographic projection shape of the alignment mark 20 on the substrate 10 is different from the orthographic projection shape of the mark cover layer 30 on the substrate 10.

[0079] In this embodiment, the alignment mark 20 and the mark cover layer 30 may have different orthogonal projection shapes on the substrate 10. Therefore, the mark cover layer 30 does not need to be formed by etching. It can be formed by coating or dripping, which can reduce the difficulty of preparing the mark cover layer 30 and improve the preparation efficiency.

[0080] The present application does not limit the orthographic shape of the marking cover layer 30 on the substrate 10. For example, the orthographic shape of the marking cover layer 30 on the substrate 10 can be a circle, a square, or other regular shapes, or the orthographic shape of the marking cover layer 30 on the substrate 10 can also be an irregular shape.

[0081] Secondly, please refer to Figure 9 This application provides a display panel that includes the array substrate in any of the foregoing embodiments.

[0082] The display panel provided in this application embodiment has the beneficial effects of the array substrate in any of the foregoing embodiments. For details, please refer to the foregoing description of the beneficial effects of the array substrate. This application embodiment will not repeat the details.

[0083] In some embodiments, the display panel further includes a light-emitting element 60, the light-shielding layer 40 is provided with an opening structure 41, the light-emitting element 60 is disposed within the opening structure 41, and the light-emitting element 60 includes a first electrode 61 and a second electrode 62 facing the side of the substrate 10.

[0084] The array substrate includes a first metal layer 50, which includes a first conductive portion 51 and a second conductive portion 52 that are insulated from each other. The first conductive portion 51 and the second conductive portion 52 are at least partially exposed from the opening structure 41, so that the first electrode 61 is electrically connected to the first conductive portion 51 and the second electrode 62 is electrically connected to the second conductive portion 52.

[0085] The light-emitting element 60 is a key component in the display panel used to achieve the display effect. For example, the light-emitting element 60 can be a micro light-emitting diode. The light-emitting element 60 includes a first electrode 61 and a second electrode 62, which are respectively used to receive different power signals to meet the light-emitting needs of the light-emitting element 60.

[0086] Based on this, the array substrate is provided with a first metal layer 50, which may be the metal layer closest to the light-emitting element 60. The first metal layer 50 includes a first conductive portion 51 and a second conductive portion 52 that are insulated from each other, wherein the first conductive portion 51 is used to transmit signals to the first electrode 61, and the second conductive portion 52 is used to transmit signals to the second electrode 62.

[0087] Based on this, in this embodiment, the first conductive portion 51 and the second conductive portion 52 are at least partially exposed from the opening structure 41 to meet the need for electrical connection between the first conductive portion 51 and the first electrode 61, and the need for electrical connection between the second conductive portion 52 and the second electrode 62. Optionally, the light-shielding layer 40 may cover a portion of the structure in the first conductive portion 51, and the opening structure 41 may also expose a portion of the structure in the first conductive portion 51. Similarly, the light-shielding layer 40 may cover a portion of the structure in the second conductive portion 52, and the opening structure 41 may also expose a portion of the structure in the second conductive portion 52.

[0088] The array substrate provided in this application embodiment can be applied to display panels that use micro light-emitting diodes or similar structures as light-emitting elements 60. During the process of transferring the light-emitting element 60 to the array substrate, the alignment mark 20 can be used for positioning reference, thereby improving the transfer accuracy of the light-emitting element 60 and ensuring the reliability of the connection between the light-emitting element 60 and the first conductive part 51 and the second conductive part 52.

[0089] In some alternative embodiments, the alignment mark 20 may be located within the first metal layer 50, and the alignment mark 20 and the first conductive portion 51 may be made of the same material. That is, both may be made of the same material and formed together in the same fabrication process, thereby improving fabrication efficiency and reducing fabrication costs.

[0090] Thirdly, please refer to Figure 10 This application provides a display device, including the display panel in any of the foregoing embodiments.

[0091] The display device provided in this application has the beneficial effects of the display panel in any of the foregoing embodiments. For details, please refer to the foregoing description of the beneficial effects of the display panel. This application will not repeat the details here.

[0092] Fourthly, please refer to Figure 11 As shown in Figure 12, this application embodiment provides a method for fabricating an array substrate, including: S100: Form alignment marks on one side of the substrate.

[0093] Please see Figure 12a In step S100, alignment mark 20 is formed on one side of substrate 10. The specific location of alignment mark 20 is not limited in this embodiment. Optionally, alignment mark 20 and first conductive part 51 can be formed together in the same fabrication process, and the two are insulated from each other. The first conductive part 51 is used to transmit the first power signal.

[0094] S110: A marking cover layer is formed on the side of the alignment mark that is away from the substrate.

[0095] Please see Figure 12bIn step S110, the marking cover layer 30 and the alignment mark 20 at least partially overlap, meaning that the orthographic projection of the marking cover layer 30 onto the substrate 10 can completely cover the alignment mark 20, or the orthographic projection of the marking cover layer 30 onto the substrate 10 can only cover a portion of the structure of the alignment mark 20. The marking cover layer 30 can be in contact with the alignment mark 20, or the marking cover layer 30 can be spaced apart from the alignment mark 20 in the thickness direction Y.

[0096] The marking cover layer 30 may include transparent or semi-transparent materials, that is, the marking cover layer 30 itself has a certain transmittance. Therefore, when a part of the film layer is prepared, the alignment mark 20 can be identified through the marking cover layer 30 to achieve film layer positioning and improve preparation accuracy.

[0097] S120: After forming the marking overlay, apply a light-shielding material.

[0098] Please see Figure 12c In step S120, due to limitations such as the material or surface shape of the marking cover layer 30 itself, the light-shielding material will slide onto one side of the marking cover layer 30 in the direction parallel to the plane of the substrate 10, thereby enabling the light-shielding material to contact the marking cover layer 30 and expose at least a portion of the marking cover layer 30, forming a light-shielding layer 40.

[0099] In this embodiment, since the marking cover layer 30 and the alignment mark 20 at least partially overlap, the light-shielding layer 40 can also expose at least a portion of the structure of the alignment mark 20. Furthermore, because the marking cover layer 30 has relatively high transmittance, the relative position of the alignment mark 20 can still be determined through the marking cover layer 30 during subsequent film preparation, thereby achieving the positioning function, meeting preparation requirements, and improving preparation accuracy.

[0100] In some embodiments, in step S110, the surface of the marking cover layer 30 facing away from the substrate 10 is hydrophobically treated.

[0101] Hydrophobic treatment refers to transforming the surface of an object to be hydrophobic, so that the surface is less likely to accumulate liquid, thereby reducing the probability of the surface becoming wet.

[0102] Based on this, the marking cover layer 30 has a first surface M1 facing away from the substrate 10. By making the first surface M1 hydrophobic, the light-shielding material can be more easily slid off the first surface M1, reducing the risk of the light-shielding material accumulating on the first surface M1. This allows the light-shielding layer 40 to expose at least part of the structure of the alignment mark 20, thus meeting the alignment requirements.

[0103] In some embodiments, in step S110, a hydrophobic material is applied to the side of the alignment mark 20 away from the substrate 10 by coating or dripping to form an identification cover layer 30.

[0104] In this embodiment, the marking cover layer 30 can be formed by coating or dripping, so that the orthographic projection shape of the formed marking cover layer 30 on the substrate 10 can be different from the orthographic projection shape of the alignment mark 20 on the substrate 10, thereby reducing the difficulty of preparing the marking cover layer 30.

[0105] Meanwhile, the marking cover layer 30 is composed of hydrophobic materials. Hydrophobic materials refer to a class of low surface energy materials with a static liquid contact angle greater than 90° on a smooth surface. Hydrophobic materials usually have important characteristics such as waterproofing, anti-fogging, anti-snow, anti-pollution, anti-adhesion, anti-oxidation, anti-corrosion, self-cleaning, and prevention of current conduction.

[0106] This design makes the first surface M1 on the marking cover layer 30 relatively smooth, so that during the preparation of the light-shielding layer 40, the light-shielding material can more easily slide off the first surface M1, thereby reducing the probability that the light-shielding layer 40 covers the marking cover layer 30, so as to ensure that the alignment mark 20 can be exposed from the light-shielding layer 40 to meet the alignment requirements.

[0107] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0108] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. An array substrate, characterized in that, include: Substrate; Alignment markers are provided on one side of the substrate; A marking overlay layer is disposed on the side of the alignment mark opposite to the substrate, and the marking overlay layer at least partially overlaps with the alignment mark; A light-shielding layer having a transmittance less than that of the signage covering layer, the light-shielding layer being in contact with the signage covering layer, and the light-shielding layer exposing at least a portion of the signage covering layer.

2. The array substrate according to claim 1, characterized in that, The marking overlay includes a first surface facing away from the substrate, at least a portion of which is inclined relative to the plane of the substrate.

3. The array substrate according to claim 2, characterized in that, The first surface includes a curved surface.

4. The array substrate according to claim 3, characterized in that, The curved surface protrudes in a direction away from the substrate, and the curved surface at least partially overlaps with the alignment mark.

5. The array substrate according to claim 2, characterized in that, The first surface includes a first portion and a second portion, the second portion being located on one side of the first portion in a direction parallel to the plane of the substrate, the first portion being inclined relative to the plane of the substrate, and the second portion intersecting with the first portion.

6. The array substrate according to claim 1, characterized in that, The marking overlay includes a hydrophobic material; and / or, The marking overlay is formed on the surface of the substrate that is away from the substrate by a hydrophobic treatment.

7. The array substrate according to claim 1, characterized in that, In the thickness direction of the substrate, the maximum height of the marking cover layer is not less than the maximum height of the light-shielding layer.

8. The array substrate according to claim 7, characterized in that, The maximum height of the marking overlay is H, where H satisfies: 1μm≤H≤20μm.

9. The array substrate according to claim 1, characterized in that, The orthographic projection of the marking overlay on the substrate covers the orthographic projection of the alignment marking on the substrate.

10. The array substrate according to claim 9, characterized in that, In a first direction, the marking overlay extends at least partially beyond the alignment marking so that the marking overlay can cover the sidewall of the alignment marking in the first direction.

11. The array substrate according to claim 10, characterized in that, The dimension of the marking overlay layer in the first direction is L1, and the dimension of the alignment mark in the first direction is L2; Among them, L1 and L2 satisfy: L1≥1.2L2.

12. The array substrate according to claim 1, characterized in that, The marking overlay is positioned in contact with the alignment marking.

13. The array substrate according to claim 1, characterized in that, It also includes a first conductive portion disposed on one side of the substrate, the first conductive portion being used to transmit a first power signal, the first conductive portion and the alignment mark being made of the same material and located in the same film layer.

14. The array substrate according to claim 1, characterized in that, The orthographic projection shape of the alignment mark on the substrate is different from the orthographic projection shape of the mark cover layer on the substrate.

15. A display panel, characterized in that, Includes the array substrate as described in any one of claims 1 to 14.

16. The display panel according to claim 15, characterized in that, It also includes a light-emitting element, the light-shielding layer has an opening structure, the light-emitting element is disposed within the opening structure, and the light-emitting element includes a first electrode and a second electrode facing the substrate; The array substrate includes a first metal layer, the first metal layer including a first conductive portion and a second conductive portion that are insulated from each other, the first conductive portion and the second conductive portion being exposed at least partially from the opening structure, so that the first electrode is electrically connected to the first conductive portion and the second electrode is electrically connected to the second conductive portion.

17. A display device, characterized in that, Includes the display panel as described in claim 15 or 16.

18. A method for fabricating an array substrate, characterized in that, include: An alignment mark is formed on one side of the substrate; A marking cover layer is formed on the side of the alignment mark away from the substrate, and the marking cover layer at least partially overlaps with the alignment mark; After the marking overlay is formed, a light-shielding material is applied, which contacts the marking overlay and exposes at least a portion of the marking overlay, thus forming a light-shielding layer.

19. The preparation method according to claim 18, characterized in that, In the process of forming an identification cover layer on the side of the alignment mark away from the substrate, the surface of the identification cover layer away from the substrate is hydrophobically treated.

20. The preparation method according to claim 18, characterized in that, In the process of forming a label covering layer on the side of the alignment mark away from the substrate, a hydrophobic material is applied to the side of the alignment mark away from the substrate by coating or dripping to form the label covering layer.

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