A dielectric block, dielectric resonator and filter

Abstract

The application provides a medium block, a medium resonator and a filter. The medium block comprises a first surface, a second surface and a third surface connected between the first surface and the second surface. The second surface is provided with a stepped blind hole, and a large hole section of the stepped blind hole is close to the second surface. The stepped blind hole is used for forming a first resonant mode and a second resonant mode. The first resonant mode has a first resonant frequency f1, and the second resonant mode has a second resonant frequency f2. The first resonant frequency f1 and the second resonant frequency f2 are in two filter passbands. The application solves the problem that the double-passband filter in the prior art is large in size and heavy in weight, and is not conducive to miniaturization of the filter.

Description

Technical Field

[0001] This application relates to the field of filter technology, and in particular to a dielectric block, a dielectric resonator, and a filter. Background Technology

[0002] In recent years, with the rapid development of modern communication systems, radio frequency (RF) front-ends are moving towards miniaturization and low loss. As one of the key components of the RF front-end, filters are widely used. Therefore, reducing the size and weight of filters is of great significance for the miniaturization of communication equipment, wireless base stations, and other devices. However, for current mainstream design methods, when designing dual-passband filters, two filtering channels are often set within the filter, each achieving a different passband. Since each filtering channel occupies its own space and requires a resonator to achieve its respective passband, the filter becomes large and heavy, hindering miniaturization. Summary of the Invention

[0003] This application provides a dielectric block, a dielectric resonator, and a filter, which solves the problems of large size and heavy weight of existing dual-passband filters, which are not conducive to filter miniaturization.

[0004] The present invention is implemented as follows: a dielectric block includes a first surface, a second surface, and a third surface connected between the first surface and the second surface. A stepped blind via is provided on the second surface, and the larger section of the stepped blind via is close to the second surface. The stepped blind via is used to form a first resonant mode and a second resonant mode. The first resonant mode has a first resonant frequency f1, and the second resonant mode has a second resonant frequency f2. The first resonant frequency f1 and the second resonant frequency f2 are located in two filter passbands.

[0005] In one embodiment, along the axial direction of the stepped blind hole, the depth of the stepped blind hole is greater than one-quarter of the wavelength of the first resonant frequency f1 and less than one-half the wavelength of the first resonant frequency f1.

[0006] In one embodiment, along the axial direction of the stepped blind hole, the depth of the large hole section of the stepped blind hole is equal to the depth of the small hole section of the stepped blind hole.

[0007] In one embodiment, the shape of the large hole segment of the stepped blind hole is any one of a circle, a square, or a hexagon; the shape of the small hole segment of the stepped blind hole is any one of a circle, a square, or a hexagon.

[0008] In one embodiment, Wherein, Z1 is the characteristic impedance formed between the small hole segment of the stepped blind hole and the third surface, and Z2 is the characteristic impedance formed between the large hole segment of the stepped blind hole and the third surface.

[0009] This application also provides a dielectric resonator, including a dielectric block and a metallized conductive layer as described in any of the above embodiments; the metallized conductive layer is disposed on the outer surface of the dielectric block and the inner surface of the stepped blind via.

[0010] This application also provides a filter, including the dielectric resonator as described in the above embodiments.

[0011] In one embodiment, the filter includes at least two dielectric resonators as described in the above embodiments, a first coupling portion and a second coupling portion; the first coupling portion is located between the large aperture segments of the stepped blind holes of two adjacent dielectric resonators, and the second coupling portion is located between the small aperture segments of the stepped blind holes of two adjacent dielectric resonators.

[0012] In one embodiment, both the first coupling portion and the second coupling portion are block structures, and two adjacent dielectric resonators are integrally formed with the first coupling portion and the second coupling portion located between them.

[0013] In one embodiment, the dielectric block is provided with an input / output port and a power supply hole, and the power supply hole is connected to the input / output port for signal conduction.

[0014] In one embodiment, the feed hole extends axially toward the stepped blind hole.

[0015] The beneficial effects of the dielectric block, dielectric resonator, and filter provided in this application are as follows: Compared with the prior art, this application sets a stepped blind via in the dielectric block, thereby enabling the dielectric resonator using the dielectric block to form a first resonant mode and a second resonant mode. The first resonant mode has a first resonant frequency f1, and the second resonant mode has a second resonant frequency f2. The first resonant frequency f1 and the second resonant frequency f2 are located in two different filter passbands, thus enabling the filter using the dielectric resonator to achieve dual-passband filtering function. Compared with the design of traditional dual-passband filters, where the two filter passbands are implemented by different resonators, the filter provided in this application allows a single dielectric resonator to have two resonant frequencies simultaneously, thus enabling it to function effectively in both filter passbands at the same time. This greatly reduces the size and weight of the filter, thereby facilitating the miniaturization and weight reduction of the filter structure and reducing manufacturing costs. Attached Figure Description

[0016] Figure 1 This is a perspective structural diagram of the medium block provided in Embodiment 1 of this application;

[0017] Figure 2 This is a perspective view of the dielectric resonator provided in Embodiment 2 of this application;

[0018] Figure 3 This is a perspective view of the filter provided in Embodiment 3 of this application;

[0019] Figure 4 This is a perspective view of the filter provided in Embodiment 4 of this application;

[0020] Figure 5 yes Figure 4 The front view;

[0021] Figure 6 yes Figure 4 A bottom view;

[0022] Figure 7 This is a simulation result diagram of the transmission response of the filter provided in Embodiment 4 of this application.

[0023] Reference numerals: 1. Medium block; 11. First surface; 12. Second surface; 13. Third surface;

[0024] 2. Stepped blind hole; 21. Large hole section; 22. Small hole section;

[0025] 3. Input / output ports; 4. Feed holes; 5. Metallized conductive layer;

[0026] 100. Dielectric resonator; 201. First coupling part; 202. Second coupling part. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0028] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0029] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0031] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0032] This application provides a dielectric block, a dielectric resonator, and a filter, which solves the problems of large size and heavy weight of existing dual-passband filters, which are not conducive to filter miniaturization.

[0033] Example 1

[0034] refer to Figure 1 The dielectric block 1 provided in Embodiment 1 of this application includes a first surface 11, a second surface 12, and a third surface 13 connected between the first surface 11 and the second surface 12. A stepped blind hole 2 is provided on the second surface 12, and the large hole segment 21 of the stepped blind hole 2 is close to the second surface 12. The stepped blind hole 2 is used to form a first resonant mode and a second resonant mode. The first resonant mode has a first resonant frequency f1, and the second resonant mode has a second resonant frequency f2. The first resonant frequency f1 and the second resonant frequency f2 are located in two filter passbands.

[0035] With the above settings, a stepped blind hole 2 is opened in the dielectric block 1. Since the stepped blind hole 2 includes two holes with different cross-sectional dimensions, the dielectric resonator 100 made through the dielectric block 1 can form a first resonant mode and a second resonant mode. The first resonant mode has a first resonant frequency f1, and the second resonant mode has a second resonant frequency f2. The first resonant frequency f1 and the second resonant frequency f2 are located in two filter passbands, that is, the first resonant frequency f1 and the second resonant frequency f2 are in different frequency bands. In this way, the filter using the dielectric resonator 100 can transmit and process frequencies of two different frequency bands at the same time, which is equivalent to realizing the dual passband filtering function. That is, it can simultaneously filter two frequency bands, greatly reducing the size and weight of the filter, which is conducive to the miniaturization and weight reduction of the filter structure and reduces the processing and manufacturing cost.

[0036] In this embodiment, the specific implementation of fabricating the dielectric block 1 can be as follows: First, a three-dimensional dielectric block 1 is formed by pressing a solid dielectric material, such as ceramic, into shape. Then, a large hole segment 21 is formed by hollowing out the second surface 12 of the dielectric block 1. Next, a small hole segment 22 is formed by hollowing out the bottom surface of the large hole segment 21. The small hole segment 22 does not penetrate the first surface 11. In this way, the large hole segment 21 and the small hole segment 22 form a stepped blind hole 2, thereby fabricating a dielectric block 1. Figure 1 Medium block 1 is shown in the figure.

[0037] Another possible implementation method for manufacturing medium block 1 is: molding it in one step using a mold. Figure 1 The dielectric block 1 shown is an example of this. This not only eliminates the need for a separate stepped blind via 2, but also avoids wasting the solid dielectric material hollowed out when forming the stepped blind via 2, thereby greatly improving the manufacturing efficiency of the dielectric block 1, saving manufacturing materials, and reducing costs.

[0038] It should be noted that the aforementioned stepped blind hole 2 is composed of a large hole segment 21 and a small hole segment 22 connected together. The shape of the large hole segment 21 of the stepped blind hole 2 can be any one of a circle, a square, or a hexagon; the shape of the small hole segment 22 of the stepped blind hole 2 can be any one of a circle, a square, or a hexagon. Among them, the shapes of the large hole segment 21, the square, and the hexagon are only examples to illustrate the shapes of the large hole segment 21 and the small hole segment 22, and the shapes of the large hole segment 21 and the small hole segment 22 are not limited to circles, squares, and hexagons.

[0039] In this embodiment, the large hole segment 21 and the small hole segment 22 can have the same shape, for example... Figure 1The stepped blind hole 2 shown has a large hole section 21 and a small hole section 22 that are both circular holes, and the diameter of the large hole section 21 is larger than the diameter of the small hole section 22. The shapes of the large hole section 21 and the small hole section 22 can also be different. For example, the large hole section 21 is a circular hole and the small hole section 22 is a square hole. In this case, the orthographic projection of the square hole on the second surface 12 is located within the orthographic projection of the circular hole on the second surface 12.

[0040] It should be noted that the large hole segment 21 of the stepped blind hole 2 provided on the second surface 12 penetrates the second surface 12 at one end near the second surface 12, and the hole wall of the large hole segment 21 is connected and communicated with the second surface 12, so that in the dielectric resonator 100 made by the dielectric block 1, the end of the large hole segment 21 near the second surface 12 is grounded; the end of the large hole segment 21 of the stepped blind hole 2 away from the second surface 12 is connected to the small hole segment 22, and the end of the small hole segment 22 near the first surface 11 does not penetrate the first surface 11, but is spaced a certain distance from the first surface 11, so that in the dielectric resonator 100 made by the dielectric block 1, the end of the small hole segment 22 near the first surface 11 forms a loading capacitance with the first surface 11.

[0041] In some embodiments, the distance between the stepped blind hole 2 and the first surface 11 is inversely proportional to the loading capacitance. That is, the smaller the distance between the stepped blind hole 2 and the first surface 11, the larger the loading capacitance. To ensure that the distance between the stepped blind hole 2 and the first surface 11 is small, the height of the dielectric block 1 in the axial Z direction can be reduced while keeping the height of the stepped blind hole 2 in the axial Z direction constant, or the height of the stepped blind hole 2 in the axial Z direction can be increased while keeping the height of the dielectric block 1 in the axial Z direction constant. In this way, by adjusting the distance between the stepped blind hole 2 and the first surface 11, the size of the loading capacitance can be changed, thereby adjusting the first resonant frequency f1.

[0042] The size of the stepped blind aperture 2 is calculated based on the first resonant frequency f1 and the second resonant frequency f2. Specifically, according to actual needs, the stepped blind aperture 2 is designed to realize the first resonant mode and the second resonant mode. Before fabricating the dielectric block, the size of the stepped blind aperture 2 is calculated based on the preset first resonant frequency f1. Then, the stepped blind aperture 2 is opened on the dielectric block 1 according to the calculated size of the stepped blind aperture 2. This ensures that the stepped blind aperture 2 realizes the first resonant mode and the second resonant mode, so that the dielectric resonator 100 using the dielectric block 1 has the first resonant mode and the second resonant mode, thereby enabling the filter using the dielectric resonator 100 to realize the required dual-passband filtering function.

[0043] In this embodiment, the depth of the stepped blind hole 2 along the Z-axis can be calculated based on the first resonant frequency f1. Specifically, along the Z-axis of the stepped blind hole 2, the depth of the stepped blind hole 2 is greater than one-quarter of the wavelength of the first resonant frequency f1 and less than one-half the wavelength of the first resonant frequency f1. That is, the sum of the depth of the large hole segment 21 of the stepped blind hole 2 along the Z-axis and the depth of the small hole segment 22 of the stepped blind hole 2 along the Z-axis is greater than one-quarter of the wavelength of the first resonant frequency f1 and less than one-half the wavelength of the first resonant frequency f1.

[0044] It should be noted that the depth of the large hole section 21 of the stepped blind hole 2 along the axial direction Z and the depth of the small hole section 22 of the stepped blind hole 2 along the axial direction Z can be the same or different, as long as the above conditions are met.

[0045] In the embodiments of this application, reference is made to Figure 1 Along the axial direction Z of the stepped blind hole 2, the depth of the large hole section 21 of the stepped blind hole 2 is equal to the depth of the small hole section 22 of the stepped blind hole 2. This eliminates the influence of the depth of the stepped blind hole 2 on the characteristic impedance, so that the impedance can be adjusted only by the distance between the hole wall of the stepped blind hole 2 and the third surface 13. The impedance is easier to adjust and the impedance adjustment is more stable and controllable.

[0046] In this embodiment, the radial width of the stepped blind hole 2 can be calculated based on the first resonant frequency f1 and the second resonant frequency f2. Specifically, Wherein, Z1 refers to the characteristic impedance formed between the small hole segment 22 of the stepped blind hole 2 and the third surface 13, and Z2 refers to the characteristic impedance formed between the large hole segment 21 of the stepped blind hole 2 and the third surface 13. Therefore, based on the preset first resonant frequency f1 and second resonant frequency f2, Z1 / Z2, which is the ratio of the characteristic impedance formed between the small hole segment 22 and the third surface 13 to the characteristic impedance formed between the large hole segment 21 and the third surface 13, can be calculated using the above formula. This allows us to obtain the radial size ratio of the small hole segment 22 and the large hole segment 21. Thus, based on the length of the stepped blind hole 2 in the axial Z direction and its radial width, a stepped blind hole 2 with precisely defined large hole segment 21 and small hole segment 22 can be formed on the dielectric block 1, ensuring that the stepped blind hole 2 can form the first and second resonant modes, meeting practical requirements.

[0047] As mentioned above, the first resonant frequency f1 is mainly determined by the distance between the stepped blind hole 2 and the first surface 11. Therefore, when the distance between the stepped blind hole 2 and the first surface 11 remains constant, the first resonant frequency f1 remains unchanged. It can be seen that when the first resonant frequency f1 remains unchanged, the second resonant frequency f2 can be adjusted by controlling Z1 / Z2, that is, by controlling the ratio of the characteristic impedance formed between the small aperture segment 22 and the third surface 13 to the characteristic impedance formed between the large aperture segment 21 and the third surface 13. Based on this, the second resonant frequency f2 can be flexibly adjusted according to the actual performance requirements of the filter. While achieving convenient frequency tuning, the frequency band of the filter passband where the second resonant mode is located can also be flexibly controlled.

[0048] The filter provided in this application embodiment can adjust the first resonant frequency f1 by changing the capacitance by adjusting the distance between the stepped blind aperture 2 and the first surface 11; and the second resonant frequency f2 can be adjusted by controlling Z1 / Z2, that is, by controlling the ratio of the characteristic impedance formed between the small aperture segment 22 and the third surface 13 to the characteristic impedance formed between the large aperture segment 21 and the third surface 13. Based on the above scheme, the first resonant frequency f1 and the second resonant frequency f2 can be flexibly adjusted according to the actual performance requirements of the filter. While facilitating frequency tuning, it also allows for flexible control of the frequency bands of the filter passbands where the first and second resonant modes are located. In other words, the frequency bands of the two filter passbands of the filter can be flexibly controlled, making the filter provided in this application embodiment more widely applicable.

[0049] Example 2

[0050] refer to Figure 2 The dielectric resonator 100 of Embodiment 2 of this application includes the dielectric block 1 and the metallized conductive layer 5 of Embodiment 1. The metallized conductive layer 5 is disposed on the outer surface of the dielectric block 1 and the inner surface of the stepped blind via 2. Specifically, the metallized conductive layer 5 can be formed by electroplating metal onto the surface of the integrally dry-pressed dielectric block 1 and the inner surface of the stepped blind via 2. The metal can be silver or other metals that meet the actual needs, such as copper, aluminum, or metal alloys. The metallized conductive layer 5 can completely cover the surface of the dielectric block 1 and the inner surface of the stepped blind via 2, or it can only cover a part of it. The specific choice can be made according to actual needs, and this embodiment of the application does not limit it.

[0051] It should be noted that at least part of the metallized conductive layer 5 is covered at the connection between the hole wall of the stepped blind hole 2 and the second surface 12, so that the end of the stepped blind hole 2 near the second surface 12 is grounded.

[0052] The detailed structure of the dielectric block 1 can be referred to in Embodiment 1 above, and will not be repeated here. It can be understood that since the dielectric block 1 is used in the dielectric resonator 100 of this application, the embodiments of the dielectric resonator 100 of this application include all the technical solutions of all the embodiments of the dielectric block 1 above, and can achieve the technical effects achieved by the above technical solutions.

[0053] Example 3

[0054] refer to Figure 3 Embodiment 3 of this application provides a filter, including the dielectric resonator 100 as described in Embodiment 2 above.

[0055] The filter in Embodiment 3 of this application may include one dielectric resonator 100 provided in Embodiment 2 of this application, or it may include multiple dielectric resonators 100 provided in Embodiment 2 of this application, depending on the actual product requirements. The resonators in the filter may only include the dielectric resonator 100 provided in Embodiment 2, or they may also include other types of resonators (such as coaxial metal resonators, sheet metal resonators, etc.). The filter is provided with input and output ports 3 to receive signals and output signals, and the input and output ports 3 may be located on the dielectric block 1.

[0056] The filter in this application uses the dielectric resonator 100 in Embodiment 2 above, which can realize dual-passband filtering function. Compared with the design of existing dual-passband filters, where the two filter passbands are implemented by different resonators, the filter provided in this application can make a dielectric resonator have two resonant frequencies at the same time, so that it can play a role in both filter passbands at the same time, which greatly reduces the size and weight of the filter, thereby facilitating the miniaturization and weight reduction of the filter structure and reducing the processing and manufacturing cost.

[0057] Example 4

[0058] refer to Figure 4 Embodiment 4 of this application provides a filter, including at least two dielectric resonators 100 as described in Embodiment 2 above, a first coupling part 201 and a second coupling part 202. The first coupling part 201 is located between the large hole segments 21 of the stepped blind holes 2 of two adjacent dielectric resonators 100 and is used to couple the first resonant mode of the two adjacent dielectric resonators 100. The second coupling part 202 is located between the small hole segments 22 of the stepped blind holes 2 of two adjacent dielectric resonators 100 and is used to couple the second resonant mode of the two adjacent dielectric resonators 100.

[0059] Understandably, in this embodiment, the number of dielectric resonators 100 in the filter can be two, three, four, or more. Adjacent dielectric resonators 100 are coupled together, and the first resonant modes of each dielectric resonator 100 are coupled sequentially, as are the second resonant modes. Adjacent dielectric resonators 100 can be connected separately using welding, adhesive bonding, or other methods; alternatively, they can be integrally formed and connected.

[0060] With the above settings, the filter provided in Embodiment 4 of this application can realize dual-passband filtering function. Compared with the design of dual-passband filters in the prior art, where the two filter passbands are implemented by different resonators, the filter provided in this application can enable a dielectric resonator to have two resonant frequencies at the same time, so that it can play a role in both filter passbands at the same time, which greatly reduces the size and weight of the filter, thereby facilitating the miniaturization and weight reduction of the filter structure and reducing the processing and manufacturing cost.

[0061] Specifically, the first coupling portion 201 is configured to adjust the coupling bandwidth between the first resonant modes of two adjacent dielectric resonators 100 by adjusting the shape and / or size of the first coupling portion 201. The second coupling portion 202 is configured to adjust the coupling bandwidth between the second resonant modes of two adjacent dielectric resonators 100 by adjusting the shape and / or size of the second coupling portion 202.

[0062] With the above settings, the coupling bandwidth between the first resonant modes and the coupling bandwidth between the second resonant modes can be controlled relatively independently using the first coupling part 201 and the second coupling part 202, which has very convenient adjustability.

[0063] For example, the first coupling portion 201 can be a region on the bonding surface where two adjacent dielectric resonators 100 are connected without a metallized conductive layer 5. In this case, the coupling bandwidth between the first resonant modes of the two adjacent dielectric resonators 100 can be adjusted by adjusting the area of ​​the first coupling portion 201. The region on the bonding surface where two adjacent dielectric resonators 100 are connected without a metallized conductive layer 5 is equivalent to a coupling window between the two adjacent dielectric resonators 100. By adjusting the size of this coupling window, the coupling bandwidth between the first resonant modes of the two adjacent dielectric resonators 100 can be adjusted. Understandably, in this embodiment, the surfaces of the two dielectric resonators 100 are directly connected. Before connection, the surfaces of the two dielectric resonators 100 facing each other have a metallized conductive layer 5. Before the two dielectric resonators 100 are connected, a portion of the metallized conductive layer 5 on their bonding surface needs to be removed. That is, on the bonding surface where two adjacent dielectric resonators 100 are connected, there are areas with a metallized conductive layer 5 and areas without a metallized conductive layer 5. The areas without a metallized conductive layer 5 form a window for signal coupling and transmission.

[0064] The first coupling part 201 can also be a block structure, such as a rectangular block, connecting two adjacent dielectric resonators 100 arranged along the first direction X.

[0065] The coupling bandwidth between the first resonant modes of two adjacent dielectric resonators 100 can be adjusted by changing the size of the mating surface between the first coupling portion 201 and the dielectric resonator 100. Specifically, the size of the mating surface between the first coupling portion 201 and the dielectric resonator 100 can be adjusted by changing the size of the first coupling portion 201 in the axial direction Z of the stepped blind hole 2; or by changing the size of the first coupling portion 201 in the second direction Y; or by simultaneously changing both the size of the first coupling portion 201 in the axial direction Z of the stepped blind hole 2 and the size of the first coupling portion 201 in the second direction Y. Here, the first direction X, the second direction Y, and the axial direction Z of the stepped blind hole 2 are all perpendicular to each other. The mating surface between the first coupling portion 201 and the dielectric resonator 100 is equivalent to the coupling window between two adjacent dielectric resonators 100. By adjusting the size of this coupling window, the coupling bandwidth between the first resonant modes of two adjacent dielectric resonators 100 can be adjusted. Understandably, in this embodiment, the bonding surface between the first coupling portion 201 of the block structure and the dielectric resonator 100 is not provided with a metallized conductive layer 5 to form a window for signal coupling and transmission.

[0066] Of course, the coupling bandwidth between the first resonant modes of two adjacent dielectric resonators 100 can also be adjusted by adjusting the distance between them. Specifically, the distance between the two adjacent dielectric resonators 100 can be adjusted by adjusting the size of the first coupling portion 201 connected between them in the first direction X. By adjusting the distance between the two adjacent dielectric resonators 100, the length of the signal transmission path between them can be changed, thereby adjusting the coupling bandwidth between the first resonant modes of the two adjacent dielectric resonators 100.

[0067] For example, the second coupling portion 202 can be a region on the bonding surface where two adjacent dielectric resonators 100 are connected without a metallized conductive layer 5. In this case, the coupling bandwidth between the second resonant modes of the two adjacent dielectric resonators 100 can be adjusted by adjusting the area of ​​the second coupling portion 202. The region on the bonding surface where two adjacent dielectric resonators 100 are connected without a metallized conductive layer 5 is equivalent to a coupling window between the two adjacent dielectric resonators 100. By adjusting the size of this coupling window, the coupling bandwidth between the second resonant modes of the two adjacent dielectric resonators 100 can be adjusted. Understandably, in this embodiment, the surfaces of the two dielectric resonators 100 are directly connected. Before connection, the surfaces of the two dielectric resonators 100 facing each other have a metallized conductive layer 5. Before the two dielectric resonators 100 are connected, a portion of the metallized conductive layer 5 needs to be removed from their bonding surface. That is, the bonding surface where two adjacent dielectric resonators 100 are connected has both regions with and without a metallized conductive layer 5. The regions without a metallized conductive layer 5 form a window for signal coupling and transmission.

[0068] The second coupling part 202 can also be a block structure, such as a rectangular block, connecting two adjacent dielectric resonators 100 arranged along the first direction X.

[0069] The coupling bandwidth between the second resonant modes of two adjacent dielectric resonators 100 can be adjusted by regulating the size of the mating surface between the second coupling portion 202 and the dielectric resonator 100. Specifically, the size of the mating surface between the second coupling portion 202 and the dielectric resonator 100 can be adjusted by regulating the size of the second coupling portion 202 in the Z-axis of the stepped blind hole 2; or by regulating the size of the second coupling portion 202 in the Y-axis of the second direction; or by simultaneously regulating both the size of the second coupling portion 202 in the Z-axis of the stepped blind hole 2 and the size of the second coupling portion 202 in the Y-axis of the second direction. In this configuration, the first direction X, the second direction Y, and the Z-axis of the stepped blind hole 2 are all perpendicular to each other. The mating surface between the second coupling portion 202 and the dielectric resonator 100 is essentially a coupling window between two adjacent dielectric resonators 100. By adjusting the size of this coupling window, the coupling bandwidth between the second resonant modes of two adjacent dielectric resonators 100 can be adjusted. Understandably, in this embodiment, the bonding surface between the second coupling portion 202 of the block structure and the dielectric resonator 100 is not provided with a metallized conductive layer 5 to form a window for signal coupling and transmission.

[0070] Of course, the coupling bandwidth between the second resonant modes of two adjacent dielectric resonators 100 can also be adjusted by adjusting the distance between them. Specifically, the distance between the two adjacent dielectric resonators 100 can be adjusted by adjusting the size of the second coupling portion 202 connected between them in the first direction X. By adjusting the distance between the two adjacent dielectric resonators 100, the length of the signal transmission path between them can be changed, thereby adjusting the coupling bandwidth between the second resonant modes of the two adjacent dielectric resonators 100.

[0071] In some embodiments, two adjacent dielectric resonators 100 are integrally formed with the first coupling portion 201 and the second coupling portion 202 located between them. This simplifies the manufacturing process of the first coupling portion 201 and the second coupling portion 202 and improves the filter manufacturing efficiency. Furthermore, the integral forming method can improve the connection stability between the first coupling portion 201 and the second coupling portion 202 and the dielectric resonator 100. Compared to welding at least two dielectric resonators 100 together, where a portion of the welding joint surface is not provided with a metallized conductive layer 5 to form a coupling window, this application only requires integrally forming at least two dielectric resonators 100, the first coupling portion 201 and the second coupling portion 202 into a whole, and then applying a metallized conductive layer 5 to the outer surface of the whole. The metallized conductive layer 5 can be provided on the surface. At this time, the bonding surface between the first coupling part 201 and the dielectric resonator 100 and the bonding surface between the second coupling part 202 and the dielectric resonator 100 are not provided with the metallized conductive layer 5, thus forming a coupling window. This not only simplifies the process of setting the coupling window and makes it easier to control the size accuracy of the coupling window, but also makes the metallized conductive layer 5 more complete, which is conducive to maintaining the stability of the coupling strength index. Furthermore, since the first coupling part 201 and the second coupling part 202 are integrated with the dielectric resonator 100, the signal will not leak during the coupling process and the signal loss will be small.

[0072] Specifically, at least two dielectric resonators 100, the first coupling part 201 and the second coupling part 202 are integrally pressed from solid dielectric material.

[0073] In some embodiments, both the first coupling portion 201 and the second coupling portion 202 are block structures.

[0074] It should be noted that the first coupling part 201, the second coupling part 202 and the dielectric resonator 100 all use the same solid dielectric material, and the first coupling part 201 and the second coupling part 202 can be solid cubic structures.

[0075] Specifically, the first coupling part 201 can be, but is not limited to, a square, a rhombus, a hexagon, etc., and the second coupling part 202 can be, but is not limited to, a square, a rhombus, a hexagon, etc. The shapes of the first coupling part 201 and the second coupling part 202 can be the same or different, and this application embodiment does not limit them. When the size of the first coupling part 201 in the axial Z of the stepped blind hole 2 and / or in the first X direction and / or in the second Y direction changes, the coupling bandwidth between the first resonant modes can be adjusted. When the size of the second coupling part 202 in the axial Z of the stepped blind hole 2 and / or in the first X direction and / or in the second Y direction changes, the coupling bandwidth between the second resonant modes can be adjusted.

[0076] In some embodiments, reference Figures 3-6 The medium block 1 is provided with an input / output port 3 and a power supply hole 4, and the power supply hole 4 is connected to the input / output port 3 for signal conduction.

[0077] The input / output port 3 can be located on the first surface 11, the second surface 12, or the third surface 13 of the medium block 1. For example, as shown... Figure 4 As shown, the input / output port 3 is located on the third surface 13 of the medium block 1.

[0078] The feed hole 4 can be disposed on the first surface 11, the second surface 12, or the third surface 13 of the dielectric block 1; a metallized conductive layer 5 is disposed on all or part of the inner wall of the feed hole 4. For example, as shown... Figure 4 As shown, the power supply hole 4 is disposed on the second surface 12 of the dielectric block 1.

[0079] By setting input / output ports 3 and power supply holes 4 on the dielectric block 1, the power supply holes 4 and input / output ports 3 form taps. This allows for direct tap power supply to input filter signals into the filter, or to output filter signals through tap power supply, thus simplifying the input and output of filter signals and making it easier to use.

[0080] In some embodiments, reference Figure 4 The power supply port 4 is connected to the input / output port 3. For example, as shown... Figure 4 As shown, an input / output port 3 is provided on the third surface 13 of the dielectric block 1, and a feed hole 4 is provided on the second surface 12 of the dielectric block 1. The end of the feed hole 4 away from the second surface 12 is connected to the input / output port 3. By connecting the feed hole 4 to the input / output port 3, the signal transmission strength can be improved.

[0081] In some embodiments, reference Figure 5The feed hole 4 extends along the axial direction Z of the stepped blind hole 2. That is, the axial direction Z of the feed hole 4 is parallel to the axial direction Z of the stepped blind hole 2. This helps to increase the coupling area between the feed hole 4 and the stepped blind hole 2, and makes it easier for the filter signal to be input into the dielectric resonator 100.

[0082] By adopting the technical solution provided in the embodiments of this application, since the dielectric resonator 100 applied in the filter has two resonant frequencies, the filter can realize the dual-passband filtering function. Compared with the design of the dual-passband filter in the prior art, in which the two filtering passbands are realized by different resonators, the filter provided in this application can make one dielectric resonator have two resonant frequencies at the same time, so that it can play a role in both filtering passbands at the same time, which greatly reduces the size and weight of the filter, thereby facilitating the miniaturization and weight reduction of the filter structure and reducing the processing and manufacturing cost.

[0083] The simulation results of the filter in this application are shown in the figure below. Figure 7 As shown. By Figure 7 As can be seen, the filter has two passbands, thus enabling dual-passband filtering. The center frequency of the low-frequency passband is 2.58 GHz, and the center frequency of the high-frequency passband is 4.833 GHz.

[0084] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A medium block, characterized in that, It includes a first surface, a second surface, and a third surface connected between the first surface and the second surface. A stepped blind hole is provided on the second surface, and the larger section of the stepped blind hole is close to the second surface. The stepped blind aperture is used to form a first resonant mode and a second resonant mode, the first resonant mode having a first resonant frequency. The second resonant mode has a second resonant frequency. The first resonant frequency and the second resonant frequency They are located in two filter passbands; Wherein, Z1 is the characteristic impedance formed between the small hole segment of the stepped blind hole and the third surface, and Z2 is the characteristic impedance formed between the large hole segment of the stepped blind hole and the third surface.

2. The dielectric block according to claim 1, characterized in that, Along the axial direction of the stepped blind hole, the depth of the stepped blind hole is greater than one-quarter of the first resonant frequency. The wavelength, and less than half of the first resonant frequency. The wavelength.

3. The dielectric block according to claim 2, characterized in that, Along the axial direction of the stepped blind hole, the depth of the large hole section of the stepped blind hole is equal to the depth of the small hole section of the stepped blind hole.

4. A dielectric resonator, characterized in that, include: The medium block as described in any one of claims 1-3; A metallized conductive layer is disposed on the outer surface of the dielectric block and the inner surface of the stepped blind hole.

5. A filter, characterized in that, Includes the dielectric resonator as described in claim 4.

6. The filter according to claim 5, characterized in that, The filter includes: At least two dielectric resonators as described in claim 4; A first coupling portion is located between the large aperture segments of the stepped blind holes of two adjacent dielectric resonators; The second coupling section is located between the small hole segments of the stepped blind holes of two adjacent dielectric resonators.

7. The filter according to claim 6, characterized in that, Both the first coupling portion and the second coupling portion are block structures, and two adjacent dielectric resonators are integrally formed with the first coupling portion and the second coupling portion located between them.

8. The filter according to any one of claims 5-7, characterized in that, The dielectric block is provided with input / output ports and power feed holes, and the power feed holes are connected to the input / output ports for signal conduction.

9. The filter according to claim 8, characterized in that, The power supply hole extends axially toward the stepped blind hole.

Images