Mechatronics thermal control layer

Abstract

This invention provides an electromechanical-thermal integrated thermal control layer in the field of spacecraft thermal control technology. It includes a PCB board, a microwave layer, a thermal control layer, a waveguide layer, a T / R assembly, and a direct connector. The PCB board, microwave layer, thermal control layer, and waveguide layer are connected sequentially. The T / R assembly is connected to the PCB board and to the waveguide layer via a direct connector. The thermal control layer, from top to bottom, consists of a heat-conducting layer, a temperature-equalizing layer, an energy storage layer, a heating layer, and a heat dissipation layer. The upper layer of the energy storage layer is a heat storage layer, and the lower layer is a cold storage layer. This invention comprehensively solves all thermal problems of the antenna module through the different functions of each layer. Structurally, only one thermal control module is delivered and integrated with the antenna module, greatly optimizing the AIT (Autonomous In-Process) assembly process.

Description

Technical Field

[0001] This invention relates to the field of spacecraft thermal control technology, and more specifically, to an electromechanical-thermal integrated thermal control layer. Background Technology

[0002] Due to launch vehicle limitations, satellites require a small envelope size when folded up. Simultaneously, to conserve launch vehicle fuel, the satellite's weight must be as light as possible. Traditional phased array antennas are characterized by large array surfaces and wide swaths, with functional areas intertwined, resulting in low space utilization and heavy weight. Satellite antennas are increasingly demanding lightweight thermal control and small envelope designs, making the electromechanical-thermal coupling design of phased array antennas a popular research area.

[0003] The invention patent with authorization announcement number CN104166765B discloses a method for electro-thermal coupling design of a cold plate in an active phased array antenna based on device location. The method includes: determining the parameters of the heat-generating devices in the T / R assembly of the active phased array antenna; designing the topology of the cold plate flow channel and the geometric model of the antenna cold plate based on the location of the heat-generating devices; establishing a finite element model of the antenna; calculating the antenna array surface temperature field distribution; calculating the phase error caused by antenna structural deformation and the excitation current amplitude and phase errors caused by temperature changes; calculating the electrical performance of the active phased array antenna; and determining the design scheme of the active phased array antenna cold plate based on the gain requirements. While this invention primarily protects the theoretical calculations and analyses related to microchannels, this invention primarily protects the concept of layered structure design.

[0004] The invention patent application with publication number CN105787160B provides a lightweight design method for spaceborne active phased array antennas based on electromechanical coupling. This method utilizes the electromechanical coupling model of the array antenna, establishes the relationship between structural parameters and electrical performance, and continuously adjusts the structural geometric parameters by considering the tolerance of electrical performance to the specifications, thereby achieving a lightweight design of the spaceborne active phased array antenna and guiding its structural design. This patent primarily protects the iterative calculation of electromechanical and thermal parameters, which differs significantly from the content of this invention.

[0005] Patent CN106207462B discloses an electromechanical-thermal integrated phased array antenna module, comprising a horizontally polarized waveguide antenna, a vertically polarized waveguide antenna, a T / R assembly, a delay line, a microstrip power divider, a coupled feed network, module-level beam control, and module-level power supply. The horizontally polarized and vertically polarized antennas are arranged in two layers, with the horizontally polarized antenna on the upper layer and the vertically polarized antenna on the lower layer. The horizontally polarized and vertically polarized antennas are staggered, forming a downward-opening groove between the bottom wall of the horizontally polarized antenna and the side wall of the vertically polarized antenna. The T / R assembly is installed within this groove. This patent utilizes the groove formed on the back of the antenna array by the horizontally and vertically polarized waveguide antennas to house the T / R assembly and delay line, belonging to the microscopic field. This patent summarizes the layered structure of lightweight antennas, with different focuses.

[0006] The invention patent with authorization announcement number CN108832249B discloses a splicable antenna module for wide-area coverage, including a radiating element, an RF connector, an N-sided splicing substrate, an angle-adjustable splicing connector, a heat dissipation module, and a TR module. The antenna module can be adjusted in size according to requirements, thereby achieving adjustable size of the entire array antenna after splicing, which is versatile. The structural image protected by the patent is quite different from the protection form of this patent, specifically in the following aspects: (1) The N-sided splicing substrate, angle-adjustable splicing connector, etc. protected by the patent are quite different from the form of this patent; (2) The patent vaguely mentions the heat dissipation module, but does not protect the relative position and functional relationship between the heat dissipation layer and the heat conduction layer, the temperature equalization layer, the energy storage layer, and the heating layer as this patent does.

[0007] The thesis, "A Thermal Design Method for Spaceborne Active Phased Array Antennas Based on Electromechanical-Thermal Coupling," addresses the issues of maximum antenna temperature and temperature consistency. Based on the electromechanical-thermal coupling theory of active phased array antennas, it proposes a heat pipe design method for phased array antennas based on device performance temperature drift and an integrated optimization method for spaceborne phased array antennas oriented towards electrical performance. The effectiveness of the method is verified through simulation. The main differences between this research result and this patent are: (1) This patent summarizes and sorts out the factors affecting the heat transfer performance of heat pipes, and analyzes the heat pipe's own factors such as heat pipe size, heat pipe deformation process, vacuum degree, and liquid filling rate, while this patent does not involve them; (2) It proposes an integrated optimization method for spaceborne phased array antennas oriented towards electrical performance. First, sensitivity analysis was performed on various parameters in the thermal control structure to determine the key parameters affecting the antenna's heat dissipation effect. Then, these parameters were used as optimization variables, and the antenna's electrical performance and the quality of the thermal control structure were used as comprehensive optimization objectives. The maximum temperature of the T / R component chip and temperature consistency were used as constraints to establish a comprehensive optimization model and perform optimization calculations. Finally, the optimal thermal design parameters of the phased array antenna were given. The difference with this patent is that it does not optimize the software parameters, but optimizes the energy dissipation channels from the perspective of structural layering. Summary of the Invention

[0008] To address the shortcomings of existing technologies, the purpose of this invention is to provide an electromechanical-thermal integrated thermal control layer.

[0009] According to the present invention, an electromechanical-thermal integrated thermal control layer includes a PCB board, a microwave layer, a thermal control layer, a waveguide layer, a T / R assembly, and a direct connector. The PCB board, microwave layer, thermal control layer, and waveguide layer are connected in sequence. The T / R assembly is connected to the PCB board and connected to the waveguide layer through a direct connector.

[0010] In some embodiments, the T / R component is spot-soldered on the PCB board, and the T / R component is interconnected with the waveguide layer via a straight connector.

[0011] In some embodiments, the thermal control layer includes a heat dissipation layer, a heating layer, an energy storage layer, a temperature equalization layer, and a thermally conductive layer, which are connected sequentially. The heat dissipation layer is connected to the waveguide layer, and the thermally conductive layer is connected to the microwave layer.

[0012] In some embodiments, the energy storage layer includes a heat storage layer and a cold storage layer, which are connected together. The heat storage layer is connected to a temperature equalization layer, and the cold storage layer is connected to a heating layer.

[0013] In some embodiments, the main material of the heat storage layer is a phase change material with a phase change point higher than ℃, and the main material of the cold storage layer is a phase change material with a phase change point lower than ℃.

[0014] In some embodiments, the longitudinal thermal conductivity of the heat-conducting layer and the heat-dissipating layer is greater than W / (m·k).

[0015] In some embodiments, the thermal conductivity of the uniform temperature surface is greater than W / (m·k).

[0016] In some embodiments, the energy storage layer is a phase change energy storage body encapsulated by an aluminum alloy shell or a carbon fiber shell. The energy storage layer absorbs heat through melting or releases heat through solidification of the phase change material inside the encapsulation shell. The phase change material includes, but is not limited to, tetradecane, hexadecane, and octadecane.

[0017] In some embodiments, the heating layer includes a heating element and a mounting plate, with the heating element adhered to the mounting plate and the adhered area of ​​the heating element close to the sensitive area of ​​the electronic component.

[0018] In some embodiments, the heat dissipation layer is a heat dissipation metal waveguide, and the heat dissipation metal waveguide is surface-mounted with one or more of the following methods: surface bright anodizing, surface-mounted germanium film, or radiation-cooling nanofilm.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] This invention comprehensively solves all the thermal problems of the antenna module by using different functions of each layer. In terms of structure, only one thermal control module is delivered and integrated with the antenna module, which greatly optimizes the final assembly (AIT) process. Attached Figure Description

[0021] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0022] Figure 1 This is a schematic diagram of the structure of the present invention.

[0023] Numbering on the map:

[0024] PCB board 1, microwave layer 2, thermal control layer 3, waveguide layer 4, T / R component 5, direct connector 6, heat dissipation layer 7, heating layer 8, energy storage layer 9, temperature equalization layer 10, thermally conductive layer 11, heat storage layer 12, cold storage layer 13. Detailed Implementation

[0025] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0026] Example

[0027] This invention provides an electromechanical-thermal integrated thermal control layer, such as... Figure 1As shown, it includes a PCB board 1, a microwave layer 2, a thermal control layer 3, a waveguide layer 4, a T / R assembly 5, and a straight connector 6. The PCB board 1, microwave layer 2, thermal control layer 3, and waveguide layer 4 are connected in sequence from farthest to near the antenna transmitting surface. The T / R assembly 5 is spot-soldered on the PCB board 1 and interconnected with the waveguide layer 4 through the straight connector 6.

[0028] The thermal control layer 3 includes a heat dissipation layer 7, a heating layer 8, an energy storage layer 9, a temperature equalization layer 10, and a heat conduction layer 11. The heat dissipation layer 7, the heating layer 8, the energy storage layer 9, the temperature equalization layer 10, and the heat conduction layer 11 are connected in sequence. The heat dissipation layer 7 is connected to the waveguide layer 4, and the heat conduction layer 11 is connected to the microwave layer 2.

[0029] The heat dissipation layer 7 uses a heat-dissipating metal waveguide. The waveguide can be surface-anodized with a bright finish, or a germanium film or a radiation-cooling nanofilm can be adhered to its surface. The heating layer 8 includes a heating element and a mounting plate. The heating element is adhered to the mounting plate, with the adhesion area close to the sensitive areas of the electronic components. The thermally conductive layer 11 and the heat dissipation layer 7 use materials with a longitudinal thermal conductivity greater than 1000 W / (m·K) to ensure efficient heat transfer from the hot end to the cold end. The temperature equalization layer 10 uses a material with a surface thermal conductivity greater than 1000 W / (m·K) to ensure uniform surface temperature across the antenna.

[0030] The energy storage layer 9 is a phase change energy storage body encapsulated by an aluminum alloy shell or a carbon fiber shell. The energy storage layer 9 absorbs heat through melting or releases heat through solidification of the phase change material inside the encapsulation shell. The phase change material includes, but is not limited to, tetradecane, hexadecane, and octadecane. The energy storage layer 9 includes a heat storage layer 12 and a cold storage layer 13, which are connected. The heat storage layer 12 is connected to the temperature equalization layer 10, and the cold storage layer 13 is connected to the heating layer 8. The main material of the heat storage layer 12 is a phase change material with a phase change point higher than 28℃, and the main material of the cold storage layer 13 is a phase change material with a phase change point lower than 18℃.

[0031] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0032] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A thermo-mechanical integrated thermal control layer, characterized in that, The device includes a PCB board (1), a microwave layer (2), a thermal control layer (3), a waveguide layer (4), a T / R assembly (5), and a direct connector (6). The PCB board (1), the microwave layer (2), the thermal control layer (3), and the waveguide layer (4) are connected in sequence. The T / R assembly (5) is connected to the PCB board (1), and the T / R assembly (5) is connected to the waveguide layer (4) through the direct connector (6). The thermal control layer (3) includes a heat dissipation layer (7), a heating layer (8), an energy storage layer (9), a temperature equalization layer (10), and a heat conduction layer (11). The heat dissipation layer (7), the heating layer (8), the energy storage layer (9), the temperature equalization layer (10), and the heat conduction layer (11) are connected in sequence. The heat dissipation layer (7) is connected to the waveguide layer (4), and the heat conduction layer (11) is connected to the microwave layer (2). The energy storage layer (9) includes a heat storage layer (12) and a cold storage layer (13). The heat storage layer (12) and the cold storage layer (13) are connected. The heat storage layer (12) is connected to the temperature equalization layer (10), and the cold storage layer (13) is connected to the heating layer (8).

2. The electromechanical-thermal integrated thermal control layer according to claim 1, characterized in that, The T / R component (5) is spot-welded onto the PCB board (1), and the T / R component (5) is interconnected with the waveguide layer (4) through the straight plug (6).

3. The electromechanical-thermal integrated thermal control layer according to claim 1, characterized in that, The main material of the heat storage layer (12) is a phase change material with a phase change point higher than 28°C, and the main material of the cold storage layer (13) is a phase change material with a phase change point lower than 18°C.

4. The electromechanical-thermal integrated thermal control layer according to claim 1, characterized in that, The heat-conducting layer (11) and the heat-dissipating layer (7) are made of materials with a longitudinal thermal conductivity greater than 1000 W / (m·k).

5. The electromechanical-thermal integrated thermal control layer according to claim 4, characterized in that, The temperature uniform layer (10) is made of a material with a surface thermal conductivity greater than 1000 W / (m·k).

6. The electromechanical-thermal integrated thermal control layer according to claim 1, characterized in that, The energy storage layer (9) is a phase change energy storage body encapsulated by an aluminum alloy shell or a carbon fiber shell. The energy storage layer (9) absorbs heat by melting or releases heat by solidifying the phase change material inside the encapsulation shell. The phase change material includes, but is not limited to, tetradecane, hexadecane and octadecane.

7. The electromechanical-thermal integrated thermal control layer according to claim 1, characterized in that, The heating layer (8) includes a heating element and a mounting plate, wherein the heating element is attached to the mounting plate.

8. The electromechanical-thermal integrated thermal control layer according to claim 1, characterized in that, The heat dissipation layer (7) adopts a heat dissipation metal waveguide, which is grounded by one or more of the following methods: surface bright anodizing, surface pasting of germanium film, or radiation cooling nanofilm.

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