Electronic device

Abstract

An electronic device of the present application has a first circuit substrate and a second circuit substrate, an electronic component, a surrounding portion, and a second frame. The electronic component is mounted on at least one of mutually opposing opposing surfaces of the first circuit substrate and the second circuit substrate. The surrounding portion holds mutually opposing one surface of each of the first circuit substrate and the second circuit substrate at a prescribed interval. The surrounding portion encloses a space containing the electronic component in a space between the first circuit substrate and the second circuit substrate. The second frame accommodates the first circuit substrate, the second circuit substrate, and the surrounding portion, and is in contact with the surrounding portion.

Description

[0001] This application is a divisional application of the application filed on March 13, 2019, with application number 201980020347.3 and entitled "Electronic device, imaging device and mobile body".

[0002] Cross-reference of related applications

[0003] This application claims priority to Japanese Patent Application No. 2018-060744, filed on March 27, 2018, the entire disclosure of which is incorporated herein by reference. Technical Field

[0004] This invention relates to electronic devices, imaging devices, and mobile bodies. Background Technology

[0005] Previously, it was known to place heat-absorbing members on electronic components in order to release the heat generated by electronic components mounted on a circuit board (for example, see Patent Document 1).

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2014-036066 Summary of the Invention

[0009] An electronic device according to one embodiment of the present invention includes a first circuit board and a second circuit board, an electronic component, a surrounding portion, and a frame. The electronic component is mounted on at least one of the opposing surfaces of the first and second circuit boards. The surrounding portion holds one surface of each of the first and second circuit boards facing each other at a predetermined interval. The surrounding portion surrounds a space containing the electronic component in the space between the first and second circuit boards. The frame accommodates the first circuit board, the second circuit board, and the surrounding portion, and is in contact with the surrounding portion.

[0010] An imaging apparatus according to one embodiment of the present invention includes an electronic device. The electronic device includes a first circuit board and a second circuit board, an electronic component, a surrounding portion, and a frame. The electronic component is mounted on at least one of the opposing surfaces of the first and second circuit boards. The surrounding portion holds one surface of each of the first and second circuit boards facing each other at a predetermined interval. The surrounding portion surrounds a space containing the electronic component in the space between the first and second circuit boards. The frame accommodates the first circuit board, the second circuit board, and the surrounding portion, and is in contact with the surrounding portion.

[0011] A mobile body according to one embodiment of the present invention includes an electronic device. The electronic device includes a first circuit board and a second circuit board, an electronic component, a surrounding portion, and a frame. The electronic component is mounted on at least one of the opposing surfaces of the first and second circuit boards. The surrounding portion holds one surface of each of the first and second circuit boards facing each other at a predetermined interval. The surrounding portion surrounds a space containing the electronic component in the space between the first and second circuit boards. The frame accommodates the first circuit board, the second circuit board, and the surrounding portion, and is in contact with the surrounding portion. Attached Figure Description

[0012] Figure 1 This indicates that it is equipped with Figure 1 A schematic diagram of the moving part of the imaging device of the electronic device shown.

[0013] Figure 2 This is a cross-sectional view showing the imaging device of the electronic device having the first embodiment.

[0014] Figure 3 It means Figure 2 The three-dimensional view of the surrounding part is shown.

[0015] Figure 4 It means Figure 2 An exploded perspective view of an example of an electronic device shown.

[0016] Figure 5 It means Figure 2 An exploded perspective view of another example of the electronic device shown.

[0017] Figure 6 This is a cross-sectional view showing the imaging device of the electronic device having the second embodiment.

[0018] Figure 7 It means Figure 6A three-dimensional view of the surrounding part and the partition part shown.

[0019] Figure 8 This is a cross-sectional view showing the imaging device of an electronic device having the third embodiment.

[0020] Figure 9 It means Figure 8 A perspective view of the surrounding portion, the partition portion, and the first convex retaining portion.

[0021] Figure 10 This is a cross-sectional view showing the imaging device of the electronic device having the fourth embodiment.

[0022] Figure 11 It means to include Figure 10 The diagram shows a partial exploded three-dimensional view of an electronic device.

[0023] Figure 12 This is a cross-sectional view showing the imaging device of the electronic device having the fifth embodiment.

[0024] Figure 13 It means to include Figure 12 The diagram shows a partial exploded three-dimensional view of an electronic device.

[0025] Figure 14 This is a cross-sectional view showing the imaging device of the electronic device having the sixth embodiment. Detailed Implementation

[0026] With the increasing demand for high-performance devices that incorporate electronic components, there is a need to accommodate multiple substrates, each carrying one of the electronic components, within the device. However, when heat-absorbing components are provided in each of the multiple substrates, it becomes difficult to miniaturize the device as the number of components increases.

[0027] The purpose of this invention is to provide an electronic device, a shooting device, and a mobile body that can maintain heat dissipation while achieving miniaturization.

[0028] Hereinafter, the imaging device 10 of the first embodiment of the present invention will be described with reference to the accompanying drawings.

[0029] like Figure 1As shown, the camera device 10 is mounted on the mobile body 50 in a manner capable of capturing the surrounding scenery. The mobile body 50 may include, for example, vehicles, ships, and aircraft. Vehicles may include, for example, automobiles, industrial vehicles, railway vehicles, residential vehicles, and fixed-wing aircraft operating on runways. Automobiles may include, for example, buses, trucks, public buses, motorcycles, and trolleybuses. Industrial vehicles may include, for example, vehicles for agriculture and construction. Industrial vehicles may include, for example, forklifts and golf carts. Agricultural industrial vehicles may include, for example, tractors, tillers, transplanters, harvesters, combine harvesters, and lawnmowers. Construction industrial vehicles may include, for example, bulldozers, excavators, loaders, cranes, dump trucks, and road rollers. Vehicles may include manually operated vehicles. The classification of vehicles is not limited to the examples described above. For example, automobiles also include industrial vehicles capable of operating on roads. The same vehicle may be included in multiple classifications. Ships may include, for example, jet skis, small boats, and cruise ships. Aircraft may include, for example, fixed-wing aircraft and rotary-wing aircraft.

[0030] like Figure 2 As shown, the imaging device 10 includes a first electronic device 11 and a second electronic device (electronic device) 12. Furthermore, in the following description, the optical axis direction of the lens described later is defined as the x-direction, the normal direction of the first circuit board 17 and the second circuit board 18 described later is defined as the y-direction, and the direction perpendicular to the x-direction and the y-direction is defined as the z-direction.

[0031] The first electronic device 11 has an imaging optical system 13, an imaging element 14, an imaging element substrate 15, and a first frame 16.

[0032] The imaging optical system 13 is configured to include one or more lenses. The imaging optical system 13 is fixed to the first frame 16 such that its optical axis OX is perpendicular to the imaging surface of the imaging element 14. The imaging optical system 13 causes light incident from the subject to be imaged as an image of the subject on the imaging surface of the imaging element 14.

[0033] The imaging element 14 generates an image containing the image of the subject imaged on the imaging surface by the imaging optical system 13. The imaging element 14 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device). The imaging element 14 is mounted on the imaging element substrate 15.

[0034] The imaging element substrate 15 is a plate-shaped component. The imaging element substrate 15 is equipped with an imaging element 14, etc.

[0035] The first frame 16 houses the imaging optical system 13 and the imaging element substrate 15 on which the imaging element 14 is mounted.

[0036] The second electronic device 12 performs image processing on the image generated by the first electronic device 11. The second electronic device 12 can also send signals to the first electronic device 11 based on this image processing. The second electronic device 12 has a first circuit board 17, a second circuit board 18, electronic components 19, a surrounding portion 20, and a second frame 21. The second electronic device 12 may also have a first shielding portion 26 and a second shielding portion 27.

[0037] The first circuit board 17 and the second circuit board 18 are plate-shaped components. The first circuit board 17 and the second circuit board 18 are arranged such that one of their respective surfaces is parallel to each other.

[0038] Electronic component 19 is a component that constitutes an electronic circuit. Electronic component 19 includes, for example, resistors, capacitors, diodes, and integrated circuits containing these components.

[0039] Electronic component 19 includes one or more of a first electronic component 22 and a second electronic component 23. Electronic component 19 may also include a third electronic component 24 and a fourth electronic component 25. At least one of the electronic components 19 is mounted on at least one of a first opposing surface 17a and a second opposing surface 18a, described later. The first electronic component 22 is mounted on the first opposing surface 17a of the first circuit board 17. The second electronic component 23 is mounted on the second opposing surface 18a of the second circuit board 18. The first electronic component 22 and the second electronic component 23 are configured in a manner that prevents mutual interference within the second electronic device 12.

[0040] The third electronic component 24 may also be mounted on the side of the first circuit board 17 opposite to the first opposing surface 17a. The fourth electronic component 25 may also be mounted on the side of the second circuit board 18 opposite to the second opposing surface 18a.

[0041] The surrounding portion 20 holds one side of each of the first circuit board 17 and the second circuit board 18 facing each other and maintaining them at a predetermined interval. In addition, the surrounding portion 20 surrounds the space between the first circuit board 17 and the second circuit board 18, which contains the first electronic component 22 and the second electronic component 23.

[0042] For example, around part 20 Figure 3The cylindrical component shown is described. Specifically, the surrounding portion 20 is a rectangular tube shape obtained by framing a rectangular flat plate. The surrounding portion 20 can be composed of a single component that integrates multiple flat plates. The surrounding portion 20 can also be composed of a component that fixes multiple components together. In this embodiment, the surrounding portion 20 is composed of a single component.

[0043] like Figure 2 As shown, the surrounding part 20 is in the axial direction of the square tube ( Figure 2 The first circuit board 17 and the second circuit board 18 are fixed at the ends in the y-direction. For example, the surrounding portion 20 is in the axial direction of the square tube ( Figure 2 The peripheral portion of the first opposing surface 17a of the first circuit board 17 is fixed to one end face 20a on the side in the y-direction. The first opposing surface 17a is the surface of the first circuit board 17 that is opposite to the second circuit board 18. The surrounding portion 20 is in the axial direction of the square tube ( Figure 2 The peripheral portion of the second opposing surface 18a of the second circuit board 18 is fixed to the end face 20b on the other side (in the y direction). The second opposing surface 18a is the surface of the second circuit board 18 that is opposite to the first circuit board 17.

[0044] The surrounding portion 20 secures the first circuit board 17 and the second circuit board 18 using adhesives, solder, or screws. Thus, the surrounding portion 20 maintains a predetermined distance between the first circuit board 17 and the second circuit board 18. This predetermined distance refers to the axial length of the surrounding portion 20.

[0045] The surrounding portion 20 may be heat-conducting. The surrounding portion 20 may be electrical. For example, the surrounding portion 20 may be formed of a metallic material. The surrounding portion 20 may be grounded to the ground portion of at least one of the first circuit board 17 and the second circuit board 18.

[0046] The first shielding portion 26 improves the electromagnetic compatibility (EMC) of the third electronic component 24. The first shielding portion 26 covers the third electronic component 24 and can be fixed to the first circuit board 17. The second shielding portion 27 improves the EMC of the fourth electronic component 25. The second shielding portion 27 covers the fourth electronic component 25 and can be fixed to the second circuit board 18. Both the first shielding portion 26 and the second shielding portion 27 are formed of a conductive material.

[0047] The second frame 21 houses a first circuit board 17 on which a first electronic component 22 is mounted, a second circuit board 18 on which a second electronic component 23 is mounted, and a surrounding portion 20 that holds the first circuit board 17 and the second circuit board 18 respectively. The second frame 21 contacts a portion of the surrounding portion 20 and is fixedly housed within the surrounding portion 20 of the second frame 21. The second frame 21 may also be fixed to the surrounding portion 20 by a fitting structure.

[0048] In one example, such as Figure 4 As shown, the second frame 21 has a guide portion 28 provided on the inner wall surface 21a. The surrounding portion 20 has a fitting portion 29 on its outer side that fits into the guide portion 28. In the manufacturing process, as described above, when the surrounding portion 20 holding the first circuit board 17 and the second circuit board 18 is inserted into the second frame 21, the fitting portion 29 is guided by the guide portion 28, thereby being accommodated in the second frame 21.

[0049] In another example, such as Figure 5 As shown, the second frame 21 has a hole wall portion 21b provided in the second frame 21. The surrounding portion 20 has a protrusion 30 that engages with the hole 21c defined by the hole wall portion 21b. In the manufacturing process, as described above, when the surrounding portion 20 holding the first circuit board 17 and the second circuit board 18 is inserted into the second frame 21, the protrusion 30 engages with the hole 21c, thereby fixing it to the second frame 21.

[0050] As explained above, according to the first embodiment, at least one of the first opposing surface 17a and the second opposing surface 18a is equipped with at least one of the electronic components 19. Furthermore, the surrounding portion 20 contacts the second frame 21 and surrounds the space between the first circuit board 17 and the second circuit board 18 containing one or more electronic components 19. Therefore, in the second electronic device 12, the surrounding portion 20 can absorb heat generated by one or more electronic components 19 and release that heat to the outside via the second frame 21. Thus, the second electronic device 12 can improve the heat dissipation effect of the heat generated by the electronic components 19. In addition, compared to the case where heat-absorbing members are provided on each electronic component 19 mounted on two circuit boards, the second electronic device 12 has fewer components, thus enabling miniaturization of the second electronic device 12.

[0051] Furthermore, according to the first embodiment, in the second electronic device 12, the surrounding portion 20 is conductive and grounded to a ground portion of at least one of the first circuit board 17 and the second circuit board 18. Therefore, in the second electronic device 12, the surrounding portion 20 can improve the electromagnetic compatibility of the electronic component 19.

[0052] Furthermore, according to the first embodiment, in the second electronic device 12, a third electronic component 24 is mounted on the surface of the first circuit board 17 opposite to the first opposing surface 17a. Additionally, in the second electronic device 12, the third electronic component 24 is covered by a first shielding portion 26 that can be fixed to the surrounding portion 20. Therefore, the second electronic device 12 can mount more electronic components 19 without increasing the number of components on the circuit board, and can also reduce the leakage of electromagnetic waves generated by the electronic components 19. Thus, the second electronic device 12 can mount more electronic components 19, improve electromagnetic wave suppression, and prevent large-scale manufacturing.

[0053] Next, the imaging apparatus 100 according to the second embodiment of the present invention will be described. Hereinafter, the second embodiment will be described focusing on the differences from the first embodiment. It should be noted that parts having the same structure as those in the first embodiment will be labeled with the same reference numerals.

[0054] like Figure 6 As shown, the imaging device 100 includes a first electronic device 11 and a second electronic device (electronic device) 120. The structure and function of the first electronic device 11 are the same as in the first embodiment.

[0055] The second electronic device 120 includes a first circuit board 17, a second circuit board 18, one or more electronic components 19, a surrounding portion 20, and a second frame 21. The structure and function of the first circuit board 17, the second circuit board 18, the electronic components 19, the surrounding portion 20, and the second frame 21 of the second electronic device 120 are the same as those in the first embodiment. The second electronic device 120 also includes a partition portion 31.

[0056] like Figure 7 As shown, the partition wall 31 is, for example, a plate-shaped component. Specifically, the partition wall 31 is rectangular. Figure 6 As shown, the partition 31 separates the space containing the first electronic component 22 and the space containing the second electronic component 23 within the space between the first circuit board 17 and the second circuit board 18. The partition 31 may be a single component integrated with the surrounding portion 20. Alternatively, the partition 31 may be a component separate from the surrounding portion 20 and fixed to the surrounding portion 20.

[0057] Specifically, such as Figure 6 as well as Figure 7 As shown, any portion of the partition wall portion 31 between its two ends in the axial direction of the surrounding portion 20 is integrally formed with the surrounding portion 20. Figure 6 In the example shown, the partition wall 31 is integral at the midpoint of end face 20a and end face 20b, but it is not limited to this. The partition wall 31 may also be integral at any point between the two ends of the surrounding part 20.

[0058] The partition wall 31 may be heat-conducting. The partition wall 31 may be electrical. For example, the partition wall 31 may be formed of a metallic material. The partition wall 31 may also be in direct contact with at least one of the first electronic component 22 and the second electronic component 23. Alternatively, the partition wall 31 may also be in indirect contact with at least one of the first electronic component 22 and the second electronic component 23 via the heat-conducting portion 34.

[0059] As described above, according to the second embodiment, similarly to the first embodiment, in the second electronic device 120, at least one of the electronic components 19 is mounted on at least one of the first opposing surface 17a and the second opposing surface 18a. Furthermore, in the second electronic device 120, the surrounding portion 20 contacts the second frame 21 and surrounds the space containing one or more electronic components 19 in the space between the first circuit board 17 and the second circuit board 18. Therefore, the second electronic device 120 can improve the heat dissipation effect of the heat generated by the electronic components 19. In addition, compared to the case where heat-absorbing members are provided on each electronic component 19 mounted on both circuit boards, the second electronic device 120 can improve the heat dissipation effect of the heat generated by the electronic components 19 with a smaller number of components.

[0060] Furthermore, according to the second embodiment, in the second electronic device 120, the partition 31 separates the space containing the first electronic component 22 and the space containing the second electronic component 23 within the space between the first circuit board 17 and the second circuit board 18. Therefore, the second electronic device 120 can reduce the conduction of heat generated by the first electronic component 22 to the second electronic component 23 through the partition 31, and can release heat to the second frame 21 via the surrounding portion 20. Additionally, the second electronic device 120 can reduce the conduction of heat generated by the second electronic component 23 to the first electronic component 22 through the partition 31, and can release heat to the second frame 21 via the surrounding portion 20. Thus, the second electronic device 120 can further improve heat dissipation. Furthermore, in the second electronic device 120, the partition 31 shields electromagnetic waves generated by the first electronic component 22 and propagating to the second electronic component 23, as well as electromagnetic waves generated by the second electronic component 23 and propagating to the first electronic component 22. Therefore, the second electronic device 120 can improve the electromagnetic compatibility of both the first electronic component 22 and the second electronic component 23.

[0061] Furthermore, according to the second embodiment, in the second electronic device 120, the partition wall 31 is in direct or indirect contact with the first electronic component 22. Therefore, the second electronic device 120 utilizes the partition wall 31 to conduct and release heat generated by the first electronic component 22 to the second frame 21, which is in contact with the partition wall 31. Thus, compared to the case where the first electronic component 22 does not contact the partition wall 31, the second electronic device 120 can more effectively conduct heat to the second frame 21, thereby improving heat dissipation.

[0062] Furthermore, according to the second embodiment, the second electronic device 120 also includes a heat-conducting section 34 that contacts the partition wall portion 31 and the electronic component 19. The first electronic component 22 and the second electronic component 23 are not necessarily in contact with the partition wall portion 31. On the other hand, utilizing the above-described structure, the second electronic device 120 allows at least one of the first electronic component 22 and the second electronic component 23, which is not in direct contact with the partition wall portion 31, to contact the partition wall portion 31 via the heat-conducting section 34. Therefore, in the second electronic device 120, the heat-conducting section 34 can more effectively conduct heat generated by at least one of the first electronic component 22 and the second electronic component 23 using the partition wall portion 31. Thus, the second electronic device 120 can effectively dissipate heat generated by at least one of the first electronic component 22 and the second electronic component 23.

[0063] Next, the imaging device 101 according to the third embodiment of the present invention will be described. Hereinafter, the third embodiment will be described focusing on the differences from the first embodiment. It should be noted that parts having the same structure as those in the first embodiment will be labeled with the same reference numerals.

[0064] like Figure 8 As shown, the imaging device 101 includes a first electronic device 11 and a second electronic device (electronic device) 121. The structure and function of the first electronic device 11 are the same as those in the first embodiment.

[0065] The second electronic device 121 includes a first circuit board 17, a second circuit board 18, one or more electronic components 19, a surrounding portion 20, and a second frame 21. The structure and function of the first circuit board 17, the second circuit board 18, the electronic components 19, the surrounding portion 20, and the second frame 21 of the second electronic device 121 are the same as in the first embodiment. The second electronic device 121 also includes a first convex holding portion 32 and a second convex holding portion 33. The second electronic device 121 may also include a first shielding portion 260, a second shielding portion 270, and a partition portion 31. The partition portion 31 is the same as in the second embodiment.

[0066] like Figure 9As shown, the first convex retaining portion 32 is disposed in the space surrounded by the surrounding portion 20. The first convex retaining portion 32 is disposed on one side of the partition wall portion 31. The first convex retaining portion 32 may be constituted by a single component integrated with the partition wall portion 31. The partition wall portion 31 may also be constituted by a component separate from the surrounding portion 20 and fixed to the surrounding portion 20.

[0067] The second electronic device 121 has three first convex holding portions 32. In this structure, the three first convex holding portions 32 are arranged such that one of the first convex holding portions 32 is detached from the straight line connecting the other two first convex holding portions 32. For example, the first convex holding portions 32 are respectively positioned at two adjacent vertices of the rectangle surrounded by the surrounding portion 20 and on the side opposite the side between the two vertices. Each of the three first convex holding portions 32 has a plane on the side that holds the first circuit board 17. The three first convex holding portions 32 use this plane to fix the first circuit board 17. Thus, the three first convex holding portions 32 hold the first circuit board 17 in the plane including the end of each of the three first convex holding portions 32.

[0068] Furthermore, the second electronic device 121 may also have a first convex retaining portion 32. In the structure where the second electronic device 121 has a first convex retaining portion 32, the first convex retaining portion 32 has an axial relationship with the surrounding portion 20 ( Figure 9 The first convex retaining portion 32 holds the first circuit board 17 by fixing the first circuit board 17 on this plane (in the y-direction). The second electronic device 121 has two or more first convex retaining portions 32.

[0069] like Figure 8 As shown, the axial height h1 of the first convex retaining portion 32 is lower than the height h2 of the axial end face 20a from the partition portion 31 to the surrounding portion 20.

[0070] The function and structure of the second convex retaining portion 33 are similar to those of the first convex retaining portion 32. The second convex retaining portion 33 differs from the first convex retaining portion 32 in that it is located on the side of the partition wall portion 31 opposite to the side where the first convex retaining portion 32 is located. Furthermore, similar to the first convex retaining portion 32, the axial height h3 of the first convex retaining portion 32 is lower than the height h4 of the axial end face 20a from the partition wall portion 31 to the surrounding portion 20.

[0071] With this structure, the first convex holding portion 32 and the second convex holding portion 33 make one side of each of the first circuit board 17 and the second circuit board 18 face the partition wall portion 31, and hold the first circuit board 17 and the second circuit board 18 at a predetermined interval. The predetermined interval is the sum of the height h1 of the first convex holding portion 32, the height h3 of the second convex holding portion 33, and the thickness h5 of the partition wall portion 31.

[0072] The first shielding portion 260 and the second shielding portion 270 are the same as in the first embodiment, and can respectively improve the electromagnetic compatibility of the third electronic component 24 and the fourth electronic component 25. The first shielding portion 260 can be fixed to the end face 20a of the surrounding portion 20. The second shielding portion 270 can be fixed to the end face 20b of the surrounding portion 20. The first shielding portion 260 and the second shielding portion 270 are, for example, plate-shaped components. Specifically, the first shielding portion 260 and the second shielding portion 270 are rectangular. In a structure in the surrounding portion 20 where the height h6 from the surface of the first circuit board 17 that is not opposite to the partition wall portion 31 to the axial end face 20a is higher than the axial height of the third electronic component 24, the first shielding portion 260 can cover the third electronic component 24. In a structure in the surrounding portion 20 where the height h7 from the surface of the second circuit board 18 that is not opposite to the partition wall portion 31 to the axial end face 20b is higher than the axial height of the fourth electronic component 25, the second shielding portion 270 can cover the fourth electronic component 25.

[0073] As described above, according to the third embodiment, similarly to the first embodiment, in the second electronic device 121, at least one of the electronic components 19 is mounted on at least one of the first opposing surface 17a and the second opposing surface 18a. Furthermore, in the second electronic device 121, the surrounding portion 20 contacts the second frame 21 and surrounds the space between the first circuit board 17 and the second circuit board 18 containing one or more electronic components 19. Therefore, the second electronic device 121 can improve the heat dissipation effect of the heat released by the electronic components 19. In addition, compared to the case where heat-absorbing members are provided on each electronic component 19 mounted on both circuit boards, the second electronic device 121 can improve the heat dissipation effect with a smaller number of components.

[0074] Next, the imaging apparatus 102 according to the fourth embodiment of the present invention will be described. Hereinafter, the fourth embodiment will be described focusing on the differences from the first embodiment. In addition, the same reference numerals are used to mark the parts that have the same structure as those in the first embodiment.

[0075] like Figure 10 As shown, the imaging device 102 includes a first electronic device 11 and a second electronic device (electronic device) 122. The structure and function of the first electronic device 11 are the same as in the first embodiment.

[0076] The second electronic device 122 includes a first circuit board 17, a second circuit board 18, one or more electronic components 19, and a second frame 21. The structure and function of the first circuit board 17, the second circuit board 18, the electronic components 19, and the second frame 21 of the second electronic device 122 are the same as those in the first embodiment. The second electronic device 122 also includes a first cover portion 35, two second cover portions 36, a first convex holding portion 320, and a second convex holding portion 330.

[0077] like Figure 11 As shown, the first covering portion 35 has two first wall portions 37 and a connecting portion 38.

[0078] The first wall portion 37 is, for example, a plate-shaped component. Specifically, the first wall portion 37 is rectangular. The long side of the first wall portion 37 is oriented in the direction of ( Figure 11 The length of the first wall portion 37 (in the x-direction) is greater than or equal to the length of the first side of the surfaces of the first circuit board 17 and the second circuit board 18. The first wall portion 37 may be heat-conducting. The first wall portion 37 may be electrically conductive. For example, the first wall portion 37 may be formed of a metallic material.

[0079] The connecting portion 38 holds the two first wall portions 37 at a predetermined interval. The connecting portion 38 holds the two first wall portions 37 in a manner in which the two first wall portions 37 are parallel to each other. The predetermined interval is greater than or equal to the length of the second side perpendicular to the length of the first side on the surfaces of the first circuit board 17 and the second circuit board 18. The connecting portion 38 is, for example, a plate-shaped member. Specifically, the connecting portion 38 is rectangular. The partition portion 31 of the second embodiment can also be used as the connecting portion 38. Figure 11 In the example shown, the connecting portion 38 fixes each of the first wall portions 37 generally along the long side direction, but the connecting portion 38 may also fix the first wall portions 37 on a portion of the long side direction.

[0080] The first convex retaining portion 320 and the second convex retaining portion 330 are disposed within the space surrounded by the first wall portion 37 and the second wall portion 39 (described later). The function and structure of the first convex retaining portion 320 and the second convex retaining portion 330 are the same as in the third embodiment. The first convex retaining portion 320 and the second convex retaining portion 330 can be integrally formed with the first covering portion 35, or they can be formed by components separate from the first covering portion 35 and fixed to the first covering portion 35. Figure 10 In the example shown, the first convex retaining portion 320 and the second convex retaining portion 330 are composed of components that are separate from the first covering portion 35.

[0081] The second cover portion 36 has a second wall portion 39 and two bottom portions 40.

[0082] The second wall portion 39 is, for example, a plate-like component. Specifically, the second wall portion 39 is rectangular. The long side of the second wall portion 39 is ( Figure 11 The length L1 in the z-direction of the second wall portion 39 is greater than or equal to the distance L2 between the two first wall portions 37 when they are fixed to the connecting portion 38. The length L1 in the short side direction of the second wall portion 39 is greater than or equal to the distance L2 between the two first wall portions 37 when they are fixed to the connecting portion 38. Figure 11 The length L3 in the y-direction of the first wall 37 is equal to the length L3 in the direction perpendicular to the long side. Figure 11 The length L4 (in the y-direction). The second wall portion 39 may be heat-conducting. The second wall portion 39 may be electrical. For example, the second wall portion 39 may be formed of a metallic material.

[0083] The bottom portion 40 is, for example, a plate-shaped component. Specifically, the bottom portion 40 is rectangular. The two bottom portions 40 can improve the electromagnetic compatibility of electronic components 19 disposed near the bottom portions 40. The two bottom portions 40 are erected perpendicularly to the plate surface of the second wall portion 39 along the long side of the second wall portion 39. The normal direction of the surface of the second wall portion 39 in the respective bottom portions 40 of the two second covers 36 ( Figure 11 The sum of the lengths L51 and L52 in the x-direction of the first wall portion 37 is in the long side direction ( Figure 11 The length L6 or more in the x-direction. The bottom surface 40 may be conductive. For example, the bottom surface 40 may be formed of a metallic material.

[0084] The first covering portion 35 is embedded in the space between the two bottom portions 40 of the second covering portion 36. The first covering portion 35 is embedded in the second covering portion 36 in such a way that the two first wall portions 37 are perpendicular to the second wall portion 39 and the bottom portion 40, respectively. In addition, the first covering portion 35 is embedded in the two second covering portions 36 in such a way that the second wall portions 39 of the two second covering portions 36 are opposite to each other.

[0085] With the first cover 35 embedded in the two second cover 36, the two first wall portions 37 and the second wall portions 39 have a square tube shape obtained by framing a rectangular plate, and constitute a surrounding portion that surrounds the electronic component 19.

[0086] like Figure 10 As shown, the length L3 between the two bottom portions 40 is longer than the axial length L7 of the overall structure formed by mounting electronic components 19 on the first circuit board 17 and the second circuit board 18, which are fixed to the first cover portion 35. The third electronic component 24 is covered by one bottom portion 40, the first wall portion 37, and the second wall portion 39 of each of the two second cover portions 36. Similarly, the fourth electronic component 25 is covered by the other bottom portion 40, the first wall portion 37, and the second wall portion 39 of each of the two second cover portions 36.

[0087] As described above, according to the fourth embodiment, similarly to the first embodiment, in the second electronic device 122, at least one of the electronic components 19 is mounted on at least one of the first opposing surface 17a and the second opposing surface 18a. Furthermore, the surrounding portion formed by the first wall portion 37 and the second wall portion 39 contacts the second frame 21 and surrounds the space between the first circuit board 17 and the second circuit board 18, thus improving the heat dissipation effect of the electronic components 19. Additionally, compared to the case where heat-absorbing members are provided on each electronic component 19 mounted on both circuit boards, the second electronic device 122 can improve the heat dissipation effect with a smaller number of components.

[0088] Next, the imaging device 103 according to the fifth embodiment of the present invention will be described. Hereinafter, the fifth embodiment will be described focusing on the differences from the fourth embodiment. It should be noted that parts having the same structure as those in the fourth embodiment will be labeled with the same reference numerals.

[0089] like Figure 12 As shown, the imaging device 103 has a first electronic device 11 and a second electronic device (electronic device) 123. The structure and function of the first electronic device 11 are the same as those in the fourth embodiment.

[0090] The second electronic device 123 includes a first circuit board 17, a second circuit board 18, one or more electronic components 19, a second frame 21, a first convex holding portion 320, and a second convex holding portion 330. The structure and function of the first circuit board 17, the second circuit board 18, the electronic components 19, the second frame 21, the first convex holding portion 320, and the second convex holding portion 330 of the second electronic device 123 are the same as those in the fourth embodiment. The second electronic device 123 also includes a first cover portion 350 and a second cover portion 360.

[0091] like Figure 13 As shown, the first cover portion 350 has two first wall portions 37 and a connecting portion 38. The first cover portion 350 also has a third wall portion 41. The two first wall portions 37 and the connecting portion 38 have the same function and structure as in the fourth embodiment.

[0092] The third wall portion 41 is, for example, a plate-like component. Specifically, the third wall portion 41 is rectangular. The third wall portion 41 extends along the longitudinal direction of the two first wall portions 37 ( Figure 13 The end face on one side (in the x-direction) is vertically fixed to the two first wall portions 37. The third wall portion 41 may be heat-conducting. The third wall portion 41 may be electrical. For example, the third wall portion 41 may be formed of a metallic material.

[0093] The second cover portion 360 has a second wall portion 39 and two bottom portions 400. The function and structure of the second wall portion 39 are the same as in the fourth embodiment.

[0094] The base portion 400 is a rectangular plate-like component. Specifically, the base portion 400 is rectangular. Two base portions 400 are vertically erected along the long side of the second wall portion 39. The normal direction of the second wall portion 39 in the base portion 400 ( Figure 13 The length L8 in the x-direction of the first wall 37 is (in the long side direction). Figure 13 The length L6 or more in the x-direction. The bottom surface 400 may be conductive. For example, the bottom surface 400 may be formed of a metallic material.

[0095] The first cover portion 350 is embedded in the space between the two bottom portions 400 of the second cover portion 360. The first cover portion 350 is embedded in the second cover portion 360 in such a way that the two first wall portions 37 are perpendicular to the second wall portion 39 and the bottom portion 400 respectively, and the third wall portion 41 is opposite to the second wall portion 39.

[0096] With the first cover 350 embedded in a second cover 360, the first wall portion 37, the second wall portion 39, and the third wall portion 41 have a square tube shape obtained by framing a rectangular plate, thereby forming a surrounding portion that surrounds the electronic component 19.

[0097] As described above, according to the fifth embodiment, similarly to the first embodiment, in the second electronic device 123, at least one of the electronic components 19 is mounted on at least one of the first opposing surface 17a and the second opposing surface 18a. Furthermore, a surrounding portion formed by the first wall portion 37, the second wall portion 39, and the third wall portion 41 contacts the second frame 21 and surrounds the space containing one or more electronic components 19 in the space between the first circuit board 17 and the second circuit board 18. Therefore, the second electronic device 123 can improve the heat dissipation effect of the heat generated by the electronic components 19. In addition, compared to the case where heat-absorbing members are provided on each electronic component 19 mounted on both circuit boards, the second electronic device 123 can improve the heat dissipation effect with a smaller number of components.

[0098] Next, the imaging device 104 according to the sixth embodiment of the present invention will be described. Hereinafter, the sixth embodiment will be described focusing on the differences from the first embodiment. It should be noted that parts having the same structure as those in the first embodiment will be labeled with the same reference numerals.

[0099] like Figure 14 As shown, the imaging device 104 includes a first electronic device 11 and a second electronic device (electronic device) 124. The structure and function of the first electronic device 11 are the same as in the first embodiment.

[0100] The second electronic device 124 includes a first circuit board 17, a second circuit board 18, one or more electronic components 19, a surrounding portion 20, and a second frame 21. The structure and function of the first circuit board 17, the second circuit board 18, the electronic components 19, the surrounding portion 20, and the second frame 21 of the second electronic device 124 are the same as those in the first embodiment. The second electronic device 124 also includes a heat conduction portion 42.

[0101] The heat-conducting portion 42 is fixed in contact with at least one of the first electronic component 22 and the second electronic component 23. The heat-conducting portion 42 is fixed in contact with the surrounding portion 20. The heat-conducting portion 42 is, for example, a plate-shaped component. Specifically, the heat-conducting portion 42 is rectangular. The heat-conducting portion 42 is arranged parallel to the first circuit board 17 and the second circuit board 18. The heat-conducting portion 42 can be integrally formed with the surrounding portion 20. The partition portion 31 can also be formed by a component separate from the surrounding portion 20 and fixed to the surrounding portion 20. Figure 10 In the example shown, the heat conduction part 42 is composed of components that are separate from the surrounding part 20.

[0102] As shown above, according to the sixth embodiment, similar to the first embodiment, in the second electronic device 124, at least one of the electronic components 19 is mounted on at least one of the first opposing surface 17a and the second opposing surface 18a. Furthermore, the surrounding portion 20 contacts the second frame 21 and surrounds the space containing one or more electronic components 19 in the space between the first circuit board 17 and the second circuit board 18. Therefore, the second electronic device 124 can improve the heat dissipation effect of the heat generated by the electronic components 19. In addition, compared to the case where heat-absorbing members are provided for each electronic component 19 mounted on both circuit boards, the second electronic device 124 can improve the heat dissipation effect with a smaller number of components.

[0103] Furthermore, according to the sixth embodiment, the second electronic device 124 includes a first electronic component 22, a second electronic component 23, and a heat-conducting portion 42 that contacts the surrounding portion 20. Therefore, in the second electronic device 124, the heat-conducting portion 42 effectively conducts the heat generated by the first electronic component 22 to the surrounding portion 20. Thus, the second electronic device 124 is capable of effectively conducting and dissipating heat generated by the first electronic component 22 to the second frame 21 via the heat-conducting portion 42.

[0104] The above embodiments have been described as representative examples, but it is obvious to those skilled in the art that various modifications and substitutions can be made within the spirit and scope of this invention. Therefore, this invention should not be construed as limited to the above embodiments, and various variations or modifications can be made without departing from the claims. For example, multiple structural modules described in the embodiments and examples can be combined into one, or a structural module can be divided.

[0105] The accompanying drawings, which illustrate the above embodiments of the present invention, are schematic. The dimensions and proportions in the drawings may not necessarily match reality.

[0106] Explanation of reference numerals in the attached figures:

[0107] Filming devices 10, 100, 101, 102, 103, 104

[0108] 11 First Electronic Device

[0109] 12, 120, 121, 122, 123, 124 Second electronic devices (electronic devices)

[0110] 13-shot optical system

[0111] 14 imaging elements

[0112] 15. Photographing the component substrate

[0113] 16 First frame

[0114] 17 First Circuit Board

[0115] 17a First Opposite Face

[0116] 18 Second Circuit Board

[0117] 18a Second Opposite Face

[0118] 19 electronic components

[0119] 20 surrounding departments

[0120] 20a and 20b end faces

[0121] 21. Second frame (frame)

[0122] 21a inner wall surface

[0123] 21b Hole Wall

[0124] 21c hole

[0125] 22 First Electronic Component

[0126] 23 Second electronic component

[0127] 24 Third Electronic Components

[0128] 25 Fourth Electronic Component

[0129] 26 First Shielding Section

[0130] 27 Second Shielding Section

[0131] 28 Guiding Department

[0132] 29 Chimeric part

[0133] 30 protrusions

[0134] 31 Next Door

[0135] 32, 320 First convex retaining part

[0136] 33, 330 Second convex retaining portion

[0137] 34, 42 Heat conduction sections

[0138] 35, 350 First Coverage Section

[0139] 36. 360 Second Coverage Section

[0140] 37 First wall section

[0141] 38 connecting parts

[0142] 39 Second wall section

[0143] 40, 400 base surface

[0144] 41 Third wall section

[0145] 50 moving bodies

Claims

1. An electronic device, wherein, have: First circuit board and second circuit board; An electronic component is mounted on at least one of the opposing surfaces of the first circuit board and the second circuit board; The surrounding portion encloses the space defined by a predetermined interval between the first circuit board and the second circuit board; The frame houses the first circuit board, the second circuit board, and the surrounding portion; The partition is disposed between the first circuit board and the second circuit board; A first holding portion is disposed in the space surrounded by the surrounding portion to hold the first circuit board; as well as The second holding portion is disposed in the space surrounded by the surrounding portion to hold the second circuit board.

2. The electronic device as claimed in claim 1, wherein, The first retaining part is disposed on one side of the partition wall portion. The second retaining part is disposed on the other side of the partition wall.

3. The electronic device as claimed in claim 1 or 2, wherein, The first holding portion has a plane on the side that holds the first circuit board. The second holding portion has a plane on the side that holds the second circuit board.

4. The electronic device as claimed in claim 1 or 2, wherein, The first retaining part is composed of a component integrated with the partition wall part.

5. The electronic device as claimed in claim 1 or 2, wherein, The partition wall is configured as a different component from the surrounding part and is fixed to the surrounding part.

6. The electronic device as claimed in claim 1 or 2, wherein, The frame has a guide section. The surrounding portion has a fitting portion that engages with the guiding portion.

Images