Liquid cooling plate and memory liquid cooling module

Abstract

The application discloses a liquid cooling plate and a memory liquid cooling module, and belongs to the technical field of liquid cooling heat dissipation accessories, which is used for reducing the heat dissipation interval close to the memory and comprises first and second parallel cold plate pieces, wherein elastic members are connected between the edges of the first and second cold plate pieces; the first and second cold plate pieces and the elastic members enclose a cold plate inner cavity capable of circulating refrigerant; and a hollow expansion plunger is arranged in the cold plate inner cavity. Since the elastic members have a certain elastic expansion amount, the expansion plunger can be used to expand the interval between the first and second liquid cooling plates, and the cold plate inner cavity outside the expansion plunger circulates refrigerant, so that the first and second liquid cooling plates after expansion are respectively close to the adjacent memory strip, the error between the memory strip and the refrigeration plate can be compensated, the installation of the memory strip can be avoided from being interfered, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of liquid cooling heat dissipation accessories technology, specifically a liquid cooling plate and a memory liquid cooling module. Background Technology

[0002] The main heat dissipation methods for high-power components such as electronic chips are divided into passive cooling, air cooling, and liquid cooling. Passive cooling refers to a method where a heat sink is installed on the electronic chip, without the need for a cooling fan. Air cooling builds upon passive cooling by adding a cooling fan. The fan's rotation accelerates airflow around the heat sink, thus cooling the electronic chip more quickly. Liquid cooling uses a pump to circulate coolant in heat pipes for heat dissipation. Liquid cooling is a widely used method for cooling electronic chips with higher power density. The most mature type is cold plate liquid cooling. Liquid cooling plates mainly use metal components such as aluminum and copper, with internal cavities and fins to form various flow channels. The flow channels of the liquid cooling plate are connected to an external pump circulation system. The liquid cooling plate contacts the heat-generating chip, and the flow of the internal cooling medium quickly removes heat, achieving efficient heat dissipation.

[0003] In servers, multiple memory modules are used simultaneously, with liquid cooling plates interspersed between adjacent modules. Designers must carefully control the gap between the liquid cooling plate and the memory chip surface to ensure no interference during installation and a tight contact between the memory modules and the liquid cooling plate's heat-conducting surfaces after installation. In actual production, because liquid cooling components are mostly welded, dimensional control is difficult, and deformation is common during transportation and factory transfers. This results in a significant difference between the actual and designed gaps after installation, making installation difficult and leading to poor heat dissipation. However, the precise machining and positioning of memory slots on the motherboard ensures a relatively accurate relative position for the installed memory modules.

[0004] Therefore, there is currently a lack of liquid cooling plates that can accommodate the gap between adjacent memory modules. Summary of the Invention

[0005] To address the issue that liquid cooling plates cannot accommodate the gaps between adjacent memory modules, this invention provides a liquid cooling plate and a memory liquid cooling module.

[0006] This invention is achieved through the following technical solution:

[0007] A liquid cooling plate component for reducing the heat dissipation distance near memory modules includes a first cold plate and a second cold plate that are parallel to each other. An elastic element is connected between the edges of the first cold plate and the second cold plate. The first cold plate, the second cold plate, and the elastic element form a cold plate cavity that allows refrigerant to flow through. A hollow expansion plunger is provided inside the cold plate cavity, and the expansion plunger is filled with a liquid that can expand when heated.

[0008] The first and second liquid cooling plates are connected by an elastic element and enclosed to form a structure with an inner cavity. Since the elastic element has a certain amount of elastic expansion and contraction, the gap between the first and second liquid cooling plates can be expanded by means of an expansion plunger. At the same time, the coolant flows in the inner cavity of the cold plate outside the expansion plunger, so that the expanded first and second liquid cooling plates can be moved closer to the adjacent memory modules. This helps to compensate for the error between the memory modules and the cooling plate, avoids interference with the installation of the memory modules, and improves heat dissipation efficiency.

[0009] A further improvement of the present invention is that the aforementioned elastic element is made of a corrugated rubber material. The rubber material has a certain amount of elasticity, and the corrugated nature of the elastic element helps to increase the amount of elasticity.

[0010] A further improvement of the present invention is that the expansion plunger is made of rubber. The rubber material of the expansion plunger ensures the amount of expansion and contraction.

[0011] A further improvement of the present invention is that both the first and second cold plate sheets are made of copper. Using copper for the first and second cold plate sheets helps to increase structural strength while ensuring heat dissipation efficiency.

[0012] A further improvement of the present invention is that both the first and second cold plate sheets are provided with grooves, and the edge of the elastic element is embedded in the grooves. The grooves on the first and second cold plate sheets respectively enable connection with the elastic element, improving assembly convenience and operational stability.

[0013] A further improvement of the present invention is that both the inner surfaces of the first and second cold plate sheets are provided with grooves, and the first cold plate sheet is embedded in the groove of the second cold plate sheet. By having the first and second cold plate sheets, both of which are grooved, fasten together, the sealing and elastic action of the elastic element helps to improve the guiding properties when adjusting the distance between the first and second cold plate sheets.

[0014] A further improvement of the present invention is that the first cold plate has a rectangular cross-section, and the inner side of the second cold plate has a groove, with the first cold plate embedded in the groove of the second cold plate. This embedding of the first cold plate in the groove of the second cold plate allows for adjustment of the distance between the outer walls of the first and second cold plates, while the rectangular cross-section of the first cold plate helps to improve the overall structural strength of the liquid cooling plate.

[0015] A further improvement of the present invention is that the outer surfaces of the first and second cold plates are provided with soft thermal pads. Using soft thermal pads helps to further reduce the gap between the liquid cooling plate and the memory module, and can compensate for contact gaps caused by particles on the surface of the memory module, thereby improving heat dissipation efficiency.

[0016] A memory liquid cooling module includes multiple memory modules. Each memory module has an inlet pipe and an outlet pipe on both sides along its length. A liquid cooling plate is positioned between adjacent memory modules. The inlet and outlet pipes are each connected to a conduit communicating with the inner cavity of the cooling plate. By connecting the inlet and outlet pipes in parallel with the liquid cooling plate positioned between multiple adjacent memory modules, the refrigerant circulates within the inner cavity of the cooling plate, thereby achieving close contact between adjacent memory modules and effectively reducing heat dissipation.

[0017] A further improvement of this invention is that a CPU is located on one side of the memory module, and a coolant inlet pipe on one side contacts the CPU. After heat exchange with the CPU, the coolant enters the inner cavity of the cold plate through the inlet pipe. Since the liquid cooling plate is close to the ambient temperature in its initial state, during use, after the coolant completes heat exchange with the CPU, it comes into contact with the expansion plunger. The liquid inside the expansion plunger expands due to heat, thereby pressing the first and second cold plates back-to-back, thus making contact with the adjacent memory module. Since the coolant temperature is much lower than the memory module temperature during operation, heat dissipation can be achieved for the memory module.

[0018] As can be seen from the above technical solution, the beneficial effects of the present invention are: the first liquid cooling plate and the second liquid cooling plate are connected by an elastic element and enclosed to form a structure with an inner cavity; since the elastic element has a certain elastic expansion and contraction, the gap between the first liquid cooling plate and the second liquid cooling plate can be expanded by means of an expansion plunger, and at the same time, the coolant flows in the inner cavity of the cold plate outside the expansion plunger, so as to move the expanded first liquid cooling plate and the second liquid cooling plate closer to the adjacent memory module, which helps to compensate for the error between the memory module and the cooling plate, avoids interference with the installation of the memory module, and improves the heat dissipation efficiency.

[0019] Initially, the inner cavity of the cold plate is in a vacuum state to minimize the distance between the first and second cold plate sheets. At this time, since the expansion plunger and the expandable liquid inside the expansion plunger are largely unaffected by the external ambient temperature, the expansion plunger is also at its minimum volume. This state helps the liquid cooling plate to be placed between adjacent memory modules with minimal volume, avoiding excessive space occupation and interference during memory module installation. As the refrigerant enters the inner cavity of the cold plate, it first compresses the first and second cold plate sheets. Under the action of the elastic element, the first and second cold plate sheets move back-to-back, thereby expanding the cavity volume of the cold plate. However, the expansion of the inner cavity of the cold plate solely through the flow of refrigerant is extremely limited. As the refrigerant enters the inner cavity of the cold plate and comes into contact with the expansion plunger, the temperature of the refrigerant increases due to the influence of the external environment as it flows through. Therefore, after the heat in the refrigerant is transferred to the heat-expandable liquid in the expansion plunger, the heat-expandable liquid expands in volume, thus acting on the expansion plunger and expanding together. Finally, the first and second cold plates are squeezed and further expand the inner cavity of the cold plate. At this time, the outer surfaces of the first and second cold plates are closer to the memory module. Attached Figure Description

[0020] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the liquid cooling plate structure according to a specific embodiment of the present invention.

[0022] Figure 2 This is a schematic cross-sectional view of the liquid cooling plate according to a specific embodiment of the present invention.

[0023] Figure 3 This is a schematic diagram of the combination of liquid cooling plate and memory module in a specific embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram of a memory liquid cooling module assembly according to a specific embodiment of the present invention.

[0025] Figure 5 This is a schematic cross-sectional view of the liquid cooling plate in the expanded state according to a specific embodiment of the present invention.

[0026] Figure 6 This is a schematic diagram showing the spacing between memory modules reserved in the liquid cooling plate according to a specific embodiment of the present invention.

[0027] Figure 7This is a schematic diagram showing the spacing of the liquid cooling plates in their initial state according to a specific embodiment of the present invention.

[0028] Figure 8 This is a schematic diagram of the spacing of the liquid cooling plates after vacuuming, according to a specific embodiment of the present invention.

[0029] Figure 9 This is a schematic diagram of the spacing after the liquid cooling plate expands, according to a specific embodiment of the present invention.

[0030] In the attached diagram: 10, liquid cooling plate; 11, first cold plate; 12, second cold plate; 13, elastic element; 14, inner cavity of cold plate; 20, expansion plunger; 21, rubber shell; 30, water inlet pipe; 40, water outlet pipe; 50, memory module. Detailed Implementation

[0031] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this patent, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this patent.

[0032] As attached Figure 3 As shown, this invention discloses a memory liquid cooling module, including multiple parallel memory modules 50, with liquid cooling plates 10 spaced apart between adjacent memory modules 50. The liquid cooling plates 10 are staggered between the memory modules 50. Each memory module 50 has an inlet pipe 30 and an outlet pipe 40 on both sides along its length, and each inlet pipe 30 and outlet pipe 40 has a conduit communicating with the inner cavity 14 of the cooling plate. The inlet pipes 30 and outlet pipes 40 are connected in parallel with the liquid cooling plates 10 positioned between multiple adjacent memory modules 50, enabling the flow of refrigerant within the inner cavity 14 of the liquid cooling plates 10. This primarily facilitates heat exchange between the memory modules 50, achieving cooling, and the staggered arrangement also optimizes the overall layout of the memory liquid cooling module.

[0033] As attached Figure 1 and 2As shown, the liquid cooling plate 10 of this invention can be used to reduce the heat dissipation distance near the memory module. The liquid cooling plate 10 includes a first cold plate 11 and a second cold plate 12 that are parallel to each other. That is, the opposite sides of the first cold plate 11 and the second cold plate 12 are respectively positioned close to the memory module 50, which helps to achieve heat exchange with the memory module 50 during operation. An elastic member 13 is connected between the edges of the first cold plate 11 and the second cold plate 12, that is, the elastic member 13 forms a wrapping connection between the first cold plate 11 and the second cold plate 12. The first cold plate 11, the second cold plate 12 and the elastic member 13 enclose a cold plate cavity 14 that allows the refrigerant to flow. The elastic member 13 has a connection port that connects to the inlet pipe 30 and the outlet pipe 40 respectively. Through the connection port, the cold plate cavity 14 can be connected to the inlet pipe 30 and the outlet pipe 40 respectively, thereby ensuring that the refrigerant continuously flows through the cold plate cavity 14, and the refrigerant completes the heat exchange operation of the memory module 50. The inner cavity 14 of the cold plate is also provided with a hollow expansion plunger 20, which is filled with a liquid that can expand when heated. The liquid inside the expansion plunger 20 that expands when heated exchanges heat with the refrigerant flowing in the inner cavity 14 of the cold plate, causing the heated and expanding liquid inside the expansion plunger 20 to compress the expansion plunger 20, thereby ultimately pushing the first cold plate 11 and the second cold plate 12 closer to the adjacent memory module 50. The first and second liquid cooling plates are connected by the elastic element 13 and enclosed to form a structure with an inner cavity. Since the elastic element 13 has a certain elastic expansion and contraction, the gap between the first and second liquid cooling plates can be expanded by means of the expansion plunger 20. At the same time, the coolant flows in the inner cavity 14 of the cold plate outside the expansion plunger 20, so that the expanded first and second liquid cooling plates can be moved closer to the adjacent memory modules 50, which helps to compensate for the error between the memory modules 50 and the cooling plate, avoids interference with the installation of the memory modules 50, and improves heat dissipation efficiency.

[0034] Initially, the inner cavity 14 of the cold plate is in a vacuum state to achieve the shortest distance between the first cold plate 11 and the second cold plate 12. At this time, since the expansion plunger 20 inside the inner cavity 14 and the heat-expandable liquid inside the expansion plunger 20 are basically unaffected by the external ambient temperature, the expansion plunger 20 is also in a minimum volume state. In this state, it helps the liquid cooling plate 10 to be placed between adjacent memory modules 50 with a minimum volume, avoiding excessive space occupation and interference during memory module 50 installation. As the refrigerant enters the inner cavity 14 of the cold plate, the refrigerant first compresses the first cold plate 11 and the second cold plate 12. Under the action of the elastic member 13, the first cold plate 11 and the second cold plate 12 move in opposite directions, thereby expanding the cavity volume of the inner cavity 14 of the cold plate. However, the expansion of the inner cavity 14 of the cold plate by the flow of refrigerant alone is extremely limited. As the refrigerant enters the inner cavity 14 of the cold plate and comes into contact with the expansion plunger 20, the temperature of the refrigerant will increase due to the influence of the external environment as it flows through. Therefore, after the heat in the refrigerant is transferred to the heat-expandable liquid in the expansion plunger 20, the heat-expandable liquid expands in volume, thereby acting on the expansion plunger 20 and expanding together. Finally, the first cold plate 11 and the second cold plate 12 are squeezed and further expand the inner cavity 14 of the cold plate. At this time, the outer surfaces of the first cold plate 11 and the second cold plate 12 are closer to the memory module 50.

[0035] As attached Figure 1 , 2As shown in Figures 4 and 5, the liquid cooling plate 10 of the present invention includes a first cold plate 11 and a second cold plate 12 that are parallel to each other. An elastic element 13 is connected between the edges of the first cold plate 11 and the second cold plate 12. The first cold plate 11, the second cold plate 12, and the elastic element 13 form a cold plate cavity 14 that allows the refrigerant to flow. A hollow expansion plunger 20 is provided in the cold plate cavity 14, and the expansion plunger 20 is filled with a liquid that can expand when heated. The cold plate cavity 14 is initially in a vacuum state to achieve the shortest distance between the first cold plate 11 and the second cold plate 12. At this time, since the expansion plunger 20 and the expandable liquid inside the expansion plunger 20 are basically unaffected by the external ambient temperature, the expansion plunger 20 is also in a minimum volume state. In this state, it helps the liquid cooling plate 10 to be placed between adjacent memory modules 50 with a minimum volume, avoiding excessive space occupation and interference during the installation of the memory modules 50. As the refrigerant enters the inner cavity 14 of the cold plate, it first compresses the first cold plate 11 and the second cold plate 12. Under the action of the elastic member 13, the first cold plate 11 and the second cold plate 12 move in opposite directions, thereby expanding the cavity volume of the inner cavity 14 of the cold plate. However, the expansion of the inner cavity 14 of the cold plate is extremely limited by the flow of refrigerant alone. As the refrigerant enters the inner cavity 14 of the cold plate and comes into contact with the expansion plunger 20, its temperature will increase due to the influence of the external environment as it flows through. Therefore, after transferring the heat in the refrigerant to the heat-expandable liquid in the expansion plunger 20, the heat-expandable liquid expands in volume, thereby acting on the expansion plunger 20 and expanding together. Finally, the first cold plate 11 and the second cold plate 12 are compressed, further expanding the inner cavity 14 of the cold plate. At this time, the outer surfaces of the first cold plate 11 and the second cold plate 12 are closer to the memory module 50.

[0036] The elastic element 13 is made of corrugated rubber. Rubber has a certain amount of elasticity, and the corrugated nature of the elastic element 13 further enhances this elasticity. The expansion plunger 20 is also made of rubber. The rubber expansion plunger 20 ensures the amount of elasticity required for its expansion. Both the first cold plate 11 and the second cold plate 12 have grooves, and the edge of the elastic element 13 is embedded in these grooves. The grooves on the first cold plate 11 and the second cold plate 12 respectively enable connection with the elastic element 13, improving assembly convenience and operational stability.

[0037] Initially, the elastic element 13 appears as a wrinkled rubber product. Due to the inherent elasticity of rubber, coupled with the wrinkled texture of the elastic element 13, when the volume of the inner cavity 14 of the cold plate expands, a stretching operation is generated on the elastic element 13 by the opposing movement of the first cold plate 11 and the second cold plate 12. Similarly, the rubber expansion plunger 20 is also selected to adapt to the changes in the heat-expandable liquid inside.

[0038] As attached Figure 1 , 2 As shown in Figure 5, the liquid cooling plate 10 of the present invention includes a first cold plate 11 and a second cold plate 12 that are parallel to each other. An elastic member 13 is connected between the edges of the first cold plate 11 and the second cold plate 12. The first cold plate 11, the second cold plate 12, and the elastic member 13 form a cold plate cavity 14 that allows the refrigerant to flow. A hollow expansion plunger 20 is provided in the cold plate cavity 14, and the expansion plunger 20 is filled with a liquid that can expand when heated. The cold plate cavity 14 is initially in a vacuum state to achieve the shortest distance between the first cold plate 11 and the second cold plate 12. At this time, since the expansion plunger 20 and the expandable liquid inside the expansion plunger 20 are basically unaffected by the external ambient temperature, the expansion plunger 20 is also in a minimum volume state. In this state, it helps the liquid cooling plate 10 to be placed between adjacent memory modules 50 with a minimum volume, avoiding excessive space occupation and interference during the installation of the memory modules 50. As the refrigerant enters the inner cavity 14 of the cold plate, it first compresses the first cold plate 11 and the second cold plate 12. Under the action of the elastic member 13, the first cold plate 11 and the second cold plate 12 move in opposite directions, thereby expanding the cavity volume of the inner cavity 14 of the cold plate. However, the expansion of the inner cavity 14 of the cold plate is extremely limited by the flow of refrigerant alone. As the refrigerant enters the inner cavity 14 of the cold plate and comes into contact with the expansion plunger 20, its temperature will increase due to the influence of the external environment as it flows through. Therefore, after transferring the heat in the refrigerant to the heat-expandable liquid in the expansion plunger 20, the heat-expandable liquid expands in volume, thereby acting on the expansion plunger 20 and expanding together. Finally, the first cold plate 11 and the second cold plate 12 are compressed, further expanding the inner cavity 14 of the cold plate. At this time, the outer surfaces of the first cold plate 11 and the second cold plate 12 are closer to the memory module 50.

[0039] The expansion plunger 20 is composed of two grooved rubber shells 21 joined together. This facilitates the addition of heat-expandable liquids. The two rubber shells 21 are respectively connected to the inner walls of the first cold plate 11 and the second cold plate 12, thereby fixing the position of the expansion plunger 20 relative to the first cold plate 11 and the second cold plate 12, enabling it to stably push the expansion of the inner cavity 14 of the cold plates during expansion.

[0040] In the initial state, since the two rubber shells 21 are combined to form a complete expansion plunger 20, the heat-expandable liquid only needs to be poured into the groove of one of the rubber shells 21. Then, the two rubber shells 21 are merged into a complete body that will not leak liquid and are connected to the two cold plates respectively. This helps to ensure that the expansion plunger 20 has compressible space when the inner cavity 14 of the cold plate is in a vacuum state. When heated, the expansion plunger 20 can push the fixing points of the two cold plates to achieve rapid and stable expansion of the first cold plate 11 and the second cold plate 12.

[0041] As attached Figure 1 , 2As shown in Figure 5, the liquid cooling plate 10 of the present invention includes a first cold plate 11 and a second cold plate 12 that are parallel to each other. An elastic member 13 is connected between the edges of the first cold plate 11 and the second cold plate 12. The first cold plate 11, the second cold plate 12, and the elastic member 13 form a cold plate cavity 14 that allows the refrigerant to flow. A hollow expansion plunger 20 is provided in the cold plate cavity 14, and the expansion plunger 20 is filled with a liquid that can expand when heated. The cold plate cavity 14 is initially in a vacuum state to achieve the shortest distance between the first cold plate 11 and the second cold plate 12. At this time, since the expansion plunger 20 and the expandable liquid inside the expansion plunger 20 are basically unaffected by the external ambient temperature, the expansion plunger 20 is also in a minimum volume state. In this state, it helps the liquid cooling plate 10 to be placed between adjacent memory modules 50 with a minimum volume, avoiding excessive space occupation and interference during the installation of the memory modules 50. As the refrigerant enters the inner cavity 14 of the cold plate, it first compresses the first cold plate 11 and the second cold plate 12. Under the action of the elastic member 13, the first cold plate 11 and the second cold plate 12 move in opposite directions, thereby expanding the cavity volume of the inner cavity 14 of the cold plate. However, the expansion of the inner cavity 14 of the cold plate is extremely limited by the flow of refrigerant alone. As the refrigerant enters the inner cavity 14 of the cold plate and comes into contact with the expansion plunger 20, its temperature will increase due to the influence of the external environment as it flows through. Therefore, after transferring the heat in the refrigerant to the heat-expandable liquid in the expansion plunger 20, the heat-expandable liquid expands in volume, thereby acting on the expansion plunger 20 and expanding together. Finally, the first cold plate 11 and the second cold plate 12 are compressed, further expanding the inner cavity 14 of the cold plate. At this time, the outer surfaces of the first cold plate 11 and the second cold plate 12 are closer to the memory module 50.

[0042] Both the first cold plate 11 and the second cold plate 12 are made of copper. Using copper for the first cold plate 11 and the second cold plate 12 helps to increase structural strength while ensuring heat dissipation efficiency.

[0043] Both the first cold plate 11 and the second cold plate 12 have grooves on their inner surfaces, and the first cold plate 11 is embedded in the groove of the second cold plate 12. By having the first cold plate 11 and the second cold plate 12, which are both grooved, fasten together, the sealing and elastic action of the elastic member 13 helps to improve the guiding performance when adjusting the distance between the first cold plate 11 and the second cold plate 12.

[0044] The first cold plate 11 can also have a rectangular cross-section, and the inner side of the second cold plate 12 is provided with a groove, into which the first cold plate 11 is embedded. The embedding of the first cold plate 11 into the groove of the second cold plate 12 allows for adjustment of the distance between the outer walls of the first cold plate 11 and the second cold plate 12. Simultaneously, the rectangular cross-section of the first cold plate 11 helps to improve the overall structural strength of the liquid cooling plate 10.

[0045] In the initial state, the first cold plate 11 is embedded in the groove of the second cold plate 12, which aims to reduce space occupation while ensuring structural strength. When the inner cavity 14 of the cold plate expands, both cold plates with groove structures, or one cold plate with a groove and the other with a rectangular cross-section, can provide a guiding function during compression or expansion. Moreover, the above-mentioned choice of cold plate structure can increase the overall structural strength of the liquid cooling plate 10 and distribute the pressure on the elastic member 13.

[0046] As attached Figure 1As shown, the liquid cooling plate 10 of the present invention includes a first cold plate 11 and a second cold plate 12 that are parallel to each other. An elastic member 13 is connected between the edges of the first cold plate 11 and the second cold plate 12. The first cold plate 11, the second cold plate 12, and the elastic member 13 form a cold plate cavity 14 that allows the refrigerant to flow. A hollow expansion plunger 20 is provided in the cold plate cavity 14, and the expansion plunger 20 is filled with a liquid that can expand when heated. The cold plate cavity 14 is initially in a vacuum state to achieve the shortest distance between the first cold plate 11 and the second cold plate 12. At this time, since the expansion plunger 20 and the expandable liquid inside the expansion plunger 20 are basically unaffected by the external ambient temperature, the expansion plunger 20 is also in a minimum volume state. In this state, it helps the liquid cooling plate 10 to be placed between adjacent memory modules 50 with a minimum volume, avoiding excessive space occupation and interference during the installation of the memory modules 50. As the refrigerant enters the inner cavity 14 of the cold plate, it first compresses the first cold plate 11 and the second cold plate 12. Under the action of the elastic member 13, the first cold plate 11 and the second cold plate 12 move in opposite directions, thereby expanding the cavity volume of the inner cavity 14 of the cold plate. However, the expansion of the inner cavity 14 of the cold plate is extremely limited by the flow of refrigerant alone. As the refrigerant enters the inner cavity 14 of the cold plate and comes into contact with the expansion plunger 20, its temperature will increase due to the influence of the external environment as it flows through. Therefore, after transferring the heat in the refrigerant to the heat-expandable liquid in the expansion plunger 20, the heat-expandable liquid expands in volume, thereby acting on the expansion plunger 20 and expanding together. Finally, the first cold plate 11 and the second cold plate 12 are compressed, further expanding the inner cavity 14 of the cold plate. At this time, the outer surfaces of the first cold plate 11 and the second cold plate 12 are closer to the memory module 50.

[0047] The outer surfaces of the first cold plate 11 and the second cold plate 12 are provided with soft thermal pads. The use of soft thermal pads helps to further reduce the gap between the liquid cooling plate 10 and the memory module 50, and can compensate for the contact gaps caused by particles on the surface of the memory module 50, thereby improving heat dissipation efficiency.

[0048] Initially, as the inner cavity 14 of the cold plate is compressed, the thermal pad maintains a certain distance from the memory module 50. As the volume of the inner cavity 14 of the cold plate increases, the distance between the thermal pad and the memory module 50 gradually decreases. With the help of the soft characteristics of the thermal pad, it can adapt to the particle characteristics on the surface of the memory module 50, which helps to improve the adhesion between the thermal pad and the memory module 50.

[0049] As attached Figure 6-9 As shown, the power source for the volume expansion of the deformable, compressible, and expandable liquid-cooled plate 10 can be divided into two types:

[0050] Hydraulic expansion: The design pressure of a typical refrigerant system is around 1.0 MPa, but in actual operation, it can fluctuate within the pressure range of 0.5 MPa to 1.0 MPa. Assuming atmospheric pressure is P0, the internal pressure of the deformable, compressible, and expandable liquid-cooled plate 10 after processing, sealing, and vacuuming is P1, the minimum pressure fluctuation within the refrigerant circulation system is P2, and the normal projected area of ​​the heat transfer surface of the liquid-cooled plate 10 is S. Then, the compressive force exerted on the liquid-cooled plate 10 under vacuum due to atmospheric pressure is F1 = (P0 - P1) * S, and the expansion force under refrigerant pressure is F2 = (P2 - P0) * S. Assuming the thickness of the deformable, compressible, and expandable liquid-cooled plate 10 before vacuuming is d, after vacuuming, the heat transfer surfaces on both sides of the plate are subjected to pressure F1, and the thickness of the plate becomes D1. After liquid filling and expansion, the thickness of the plate becomes D2 under the expansion force from the refrigerant pressure.

[0051] The internal expansion plunger 20 expands due to CPU temperature: Since the liquid cooling plate 10 and the CPU are connected in series, the CPU's outlet water temperature is the same as the inlet water temperature of the memory liquid cooling system, which is generally around 50℃. Before component installation, the temperature is close to the ambient temperature, meaning there is a temperature difference of over 20℃ between the memory liquid cooling system described in this article before and after installation. An expansion plunger 20 is placed between the two flat heat transfer surfaces of the liquid cooling plate 10. The expansion plunger 20 is filled with a liquid with a high temperature and pressure resistance and expansion coefficient. After the system starts operating, the refrigerant heated by the CPU flows into the inner cavity 14 of the cold plate. The liquid inside the expansion plunger 20 heats up and expands, pushing the rubber shell 21 outward, causing the expansion plunger 20 to elongate. The end face of the expansion plunger 20 pushes the thickness of the cold plate to expand from D1 to D2, causing the heat transfer surface of the cold plate to come into close contact with and tightly press against the surface of the memory chips, achieving efficient heat transfer.

[0052] Depending on the required functional expansion of the expansion plunger 20, the expansion plunger 20 can also be made of a high-elasticity, high-temperature resistant material such as rubber to form a sealed cavity. The shape and size do not need to be specially specified. The interior is filled with a liquid with a high temperature and pressure expansion coefficient. After the liquid expands when heated, the volume of the rubber cavity increases, which can also increase the thickness of the cold plate, thereby making the heat transfer surface of the cold plate close to and tightly pressed against the surface of the memory chip.

[0053] The liquid-cooled plate and memory liquid-cooled module of the present invention, in the initial state, the inner cavity 14 of the cold plate is in a vacuum state to achieve the shortest distance between the first cold plate 11 and the second cold plate 12. At this time, since the expansion plunger 20 inside the inner cavity 14 of the cold plate and the heat-expandable liquid inside the expansion plunger 20 are basically unaffected by the external ambient temperature, the expansion plunger 20 is also in a minimum volume state. In this state, it helps the liquid-cooled plate 10 to be placed between adjacent memory modules 50 with the minimum volume, avoiding excessive space occupation and interference during the installation of memory modules 50. As the refrigerant enters the inner cavity 14 of the cold plate, the refrigerant first compresses the first cold plate 11 and the second cold plate 12. Under the action of the elastic member 13, the first cold plate 11 and the second cold plate 12 move in opposite directions, thereby expanding the cavity volume of the inner cavity 14 of the cold plate. Since the expansion of the inner cavity 14 of the cold plate by the flow of refrigerant alone is extremely limited. As the refrigerant enters the inner cavity 14 of the cold plate and comes into contact with the expansion plunger 20, the temperature of the refrigerant will increase due to the influence of the external environment as it flows through. Therefore, after the heat in the refrigerant is transferred to the heat-expandable liquid in the expansion plunger 20, the heat-expandable liquid expands in volume, thereby acting on the expansion plunger 20 and expanding together. Finally, the first cold plate 11 and the second cold plate 12 are squeezed and further expand the inner cavity 14 of the cold plate. At this time, the outer surfaces of the first cold plate 11 and the second cold plate 12 are closer to the memory module 50.

[0054] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0055] The terms "upper," "lower," "outer," "inner," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish relative positional relationships and are not necessarily qualitative. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0056] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A memory liquid cooling module, comprising multiple memory modules (50), wherein water inlet pipes (30) and water outlet pipes (40) are respectively provided on both sides along the length of the memory modules (50), characterized in that, A liquid cooling plate (10) is provided between adjacent memory modules (50). The liquid cooling plate (10) is used to reduce the heat dissipation distance close to the memory module. It includes a first cold plate (11) and a second cold plate (12) that are parallel to each other. An elastic element (13) is connected between the edges of the first cold plate (11) and the second cold plate (12). The first cold plate (11), the second cold plate (12) and the elastic element (13) form a cold plate cavity (14) that can circulate coolant. A hollow expansion plunger (20) is provided in the cold plate cavity (14). The expansion plunger (20) is filled with a liquid that can expand when heated. The expansion plunger (20) is made of rubber; The inner surfaces of the first cold plate (11) and the second cold plate (12) are provided with grooves, and the first cold plate (11) is embedded in the groove of the second cold plate (12); The outer surfaces of the first cold plate (11) and the second cold plate (12) are provided with soft heat-conducting pads; the inlet pipe (30) and the outlet pipe (40) are respectively provided with pipes that communicate with the inner cavity (14) of the cold plate; The CPU is located on one side of the memory module (50), and the coolant inlet pipe (30) on one side is in contact with the CPU; In the initial state, the inner cavity (14) of the cold plate is in a vacuum state, the first cold plate (11) and the second cold plate (12) are close to each other to the shortest distance, and the expansion plunger (20) is in the minimum volume state. After the refrigerant enters the inner cavity (14), it first uses hydraulic compression to make the first cold plate (11) and the second cold plate (12) move back to back to expand the inner cavity (14). Then, it transfers heat to the heat-expandable liquid in the expansion plunger (20) by contacting it, so that the expansion plunger (20) expands and further pushes the first cold plate (11) and the second cold plate (12) to move back to back until the outer surfaces of the first cold plate (11) and the second cold plate (12) are attached to the memory module (50).

2. The memory liquid cooling module according to claim 1, characterized in that, The elastic element (13) is made of rubber with corrugations.

3. A memory liquid cooling module according to claim 1, characterized in that, Both the first cold plate (11) and the second cold plate (12) are made of copper.

4. A memory liquid cooling module according to claim 1, characterized in that, Both the first cold plate (11) and the second cold plate (12) are provided with grooves, and the edge of the elastic member (13) is embedded in the groove.

5. A memory liquid cooling module according to claim 1, characterized in that, The first cold plate (11) has a rectangular cross section, and the inner side of the second cold plate (12) is provided with a groove. The first cold plate (11) is embedded in the groove of the second cold plate (12).

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