A transceiver component

Abstract

This invention discloses a transceiver assembly, including a housing, within which a heating chip is disposed. One side of the heating chip is in thermal contact with an exposed heat dissipation surface of the housing to dissipate heat outwards through the exposed heat dissipation surface. The assembly also includes a heat storage device disposed on the other side of the heating chip, which conducts heat directly or indirectly to the heating chip. In this transceiver assembly, the heat storage device on the other side helps dissipate heat by storing the heat emitted by the heating chip, thus avoiding the problem of insufficient heat dissipation. When the heating chip heats up, it can dissipate heat through the exposed heat dissipation surface of the housing while simultaneously absorbing heat through the heat storage device on the other side, achieving a sufficient cooling effect. Therefore, this transceiver assembly effectively solves the problem of low heat dissipation efficiency of heating components in transceiver assemblies.

Description

Technical Field

[0001] This invention relates to the field of transceiver technology, and more specifically, to a transceiver component. Background Technology

[0002] This invention mainly solves the problem of heat dissipation of the transceiver component within a certain period of time under conditions without external heat dissipation.

[0003] With the development of active phased array antenna technology, active phased array antenna systems place higher demands on transceiver components. These components primarily amplify the transmitted and received signals, as well as control the signal amplitude and phase. Transceiver components are increasingly evolving towards lighter weight, smaller size, higher integration, and higher power. While component power density is increasing, heat dissipation is limited; external or internal heat dissipation capabilities may be insufficient, directly impacting component performance. This is especially true when transceiver components are arrayed at a certain scale, making heat dissipation at the array center difficult.

[0004] In summary, how to effectively solve the problem of low heat dissipation efficiency of heat-generating components in transceiver modules is an urgent problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a transceiver assembly that can effectively solve the problem of low heat dissipation efficiency of heat-generating components in a transceiver assembly.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A transceiver component includes a housing, in which a heating chip is disposed, one side of which is in thermal contact with an exposed heat dissipation surface of the housing to dissipate heat to the outside through the exposed heat dissipation surface, and further includes a heat storage device disposed on the other side of the heating chip, wherein the heat storage device conducts heat directly or indirectly with the heating chip.

[0008] Typically, when using transceiver components, the heat generated by the heating chip is insufficient for rapid and timely heat dissipation through the exposed heat dissipation surface alone. However, in the transceiver component of this invention, a heat storage device is also arranged on the other side. This heat storage device can quickly absorb some of the heat, while the heat dissipation from the exposed surface simultaneously provides auxiliary cooling. Combining these two cooling functions achieves a significant cooling effect. Because the heat storage device stores the heat emitted by the heating chip to aid in its dissipation, the problem of insufficient rapid heat dissipation is not addressed. In summary, this transceiver component effectively solves the problem of low heat dissipation efficiency for heating components in transceiver components.

[0009] In some technical solutions, the heat storage device stores heat through phase change of internal phase change materials.

[0010] In some technical solutions, the housing is provided with a partition wall for separating multiple heating chips; the partition wall is in thermally conductive contact with the heated surface of the heat storage device, and the partition wall is in thermally conductive contact with the heating chips, so that the partition wall conducts heat between the heat storage device and the heating chips.

[0011] In some technical solutions, the heat storage device includes a shell and heat storage material disposed inside the shell. The inner side of the shell has an inwardly extending transverse portion, which is connected to the heated side wall of the shell for heat conduction.

[0012] In some technical solutions, at least one of the horizontal sections is aligned with at least one of the partition walls.

[0013] In some technical solutions, the horizontal section has a first connecting part for fixed connection with a second connecting part provided on the partition wall.

[0014] In some technical solutions, the outer shell is a one-piece molded aluminum alloy shell.

[0015] In some technical solutions, an RF board is included, on which the heat-generating chip is disposed. One side of the housing has a cavity for placing the RF board, and the other side is the exposed heat dissipation surface. At the bottom of the cavity, a partition wall and a heating platform that makes thermal contact with the heat-generating chip are disposed. The heating platform and the partition wall are thermally connected. The slot opening of the cavity is encapsulated with a plate-shaped heat storage device. The partition wall extends beyond the RF board and makes thermal contact with the plate surface of the heat storage device.

[0016] In some technical solutions, the heating chip is provided on both sides of the radio frequency board along the extension direction of the partition wall, the partition wall has the second connection part near the groove wall of the cavity, and at least one end of the partition wall extends to the middle and has the second connection part.

[0017] In some technical solutions, along the extension direction of the partition wall, one side of the radio frequency board has multiple first radio frequency connectors respectively connected to the heating chip, and the other side has a low-frequency connector and a second radio frequency connector connected to the heating chip; the radio frequency board is also equipped with a power module and a control module. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is an exploded view of the transceiver component provided in an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the internal structure of the heat storage device provided in an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the circuit portion provided in an embodiment of the present invention;

[0022] Figure 4 A three-dimensional structural diagram of one side of the transceiver component provided in an embodiment of the present invention;

[0023] Figure 5 This is a three-dimensional structural diagram of the other side of the transceiver component provided in an embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of the outer casing provided in an embodiment of the present invention;

[0025] Figure 7 This is a comparative schematic diagram of the temperature rise curves of the transceiver components provided in an embodiment of the present invention.

[0026] The following labels are shown in the attached diagram:

[0027] 1. First RF connector 2. Housing 3. Transition substrate 4. Heating chip 5. Heat storage device 6. RF board 7. Low frequency connector 8. Second RF connector 9. Power module 10. Control module 11. Receiver chip 12. Multifunctional chip 13. Circulator 14. Heat sink 15. Screw 16. Outer cover plate

[0028] Exposed heat dissipation surface 2-1, partition wall 2-2, second connecting part 2-3, heating platform 2-4, step 2-5;

[0029] Shell 5-1, heat storage material 5-2, horizontal part 5-3, first connecting part 5-4, heat storage cover plate 5-5. Detailed Implementation

[0030] This invention discloses a transceiver assembly to effectively solve the problem of low heat dissipation efficiency of heat-generating components in transceiver assemblies.

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Please see Figures 1-6 , Figure 1 This is an exploded view of the transceiver component provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of the heat storage device provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the circuit portion provided in an embodiment of the present invention; Figure 4 A three-dimensional structural diagram of one side of the transceiver component provided in an embodiment of the present invention; Figure 5 This is a three-dimensional structural diagram of the other side of the transceiver component provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the outer casing provided in an embodiment of the present invention; Figure 7 This is a comparative schematic diagram of the temperature rise curves of the transceiver components provided in an embodiment of the present invention.

[0033] In some embodiments, this embodiment provides a transceiver component, specifically, the transceiver component mainly includes a housing 2, a heating chip 4, and a heat storage device 5. The heating chip 4 is disposed within the housing 2 and protected by the housing 2. Because it is disposed within the housing 2, it may lead to problems such as insufficient heat dissipation or low heat dissipation efficiency.

[0034] In some embodiments, one side of the heat-generating chip 4 can be in thermal contact with the exposed heat dissipation surface 2-1 of the housing 2, so that heat can be dissipated to the outside through the exposed heat dissipation surface 2-1. This thermal contact can be direct or indirect with the solid part having the exposed heat dissipation surface 2-1. A shorter heat conduction path and higher heat conduction efficiency are better. It should be noted that the exposed heat dissipation surface 2-1 of the housing 2 refers to a portion of the outer surface of the housing 2 that can dissipate heat to the outside. All portions of the outer surface of the housing 2 can be exposed heat dissipation surfaces 2-1, allowing for heat dissipation; alternatively, only a portion of the outer surface of the housing 2 can be exposed heat dissipation surfaces 2-1. Generally, the heat-generating chip 4 is positioned closer to the side of the housing 2, and the outer surface of that side of the housing 2 is the exposed heat dissipation surface 2-1.

[0035] In some embodiments, on one side of the heating chip 4, which is located away from the other side, there is an exposed heat dissipation surface 2-1 for external heat dissipation, and on the other side, there is a heat storage device 5. The heating chip 4 can conduct heat to the exposed heat dissipation surface 2-1 to dissipate heat to the outside, and simultaneously can be thermally connected to the heat storage device 5 to transfer heat to the heat storage device 5 for external heat dissipation. The heat storage device 5 and the heating chip 4 conduct heat directly or indirectly to achieve heat transfer between them; at least the heating chip 4 can transfer heat to the heat storage device 5.

[0036] In some embodiments, when using the transceiver assembly described above, the heat-generating chip 4 generates a significant amount of heat, but only a small portion can be dissipated externally through the exposed heat dissipation surface 2-1. However, this transceiver assembly includes a heat storage device 5 on the other side. This heat storage device 5 absorbs heat without needing to dissipate it externally, thus avoiding the problem of insufficient heat dissipation. When the heat-generating chip 4 generates heat, the heat storage device 5 absorbs heat on the other side, achieving a sufficient cooling effect. The heat dissipation from the exposed heat dissipation surface also provides excellent auxiliary cooling, allowing the two to work together effectively. In summary, this transceiver assembly effectively solves the problem of low heat dissipation efficiency of the heat-generating components in transceiver assemblies.

[0037] It should be noted that some transceiver components may be single-use, and therefore generally have only one opportunity to generate heat. Therefore, there is no need to further consider how the heat from the thermal storage device will dissipate. Of course, in some embodiments, other methods can be used to further direct the heat from the thermal storage device to the outside, such as optionally exposing it or adding external heat conductors.

[0038] It should also be noted that, generally speaking, the heat absorbed by the thermal storage device is significantly greater than the heat dissipated by the exposed heat dissipation surface. However, under extreme product size requirements, the auxiliary role of the exposed heat dissipation surface in heat dissipation is beneficial in reducing the size of the thermal storage device. Of course, depending on the actual operating conditions of different products, the ratio of heat dissipated by the exposed heat dissipation surface to heat absorbed by the thermal storage device can be adjusted; the former may even be higher than the latter, or the former may be almost equal to the latter.

[0039] In some embodiments, for some transceiver components, the lifespan requirement is not high, and they may be used for short periods. Therefore, the heat storage capacity and duration of the heat storage device 5 can be set according to the amount and power of heat dissipation during the working life of the transceiver component. For example, during the required working life of the transceiver component, the heat storage device can continuously absorb heat. In this state, both the heat storage device 5 and the exposed heat dissipation surface 2-1 can sufficiently dissipate heat from the heat-generating chip 4, so that within its lifespan, the heat-generating chip 4 can be effectively dissipated by both the exposed heat dissipation surface 2-1 and the heat storage device 5 to meet the heat dissipation requirements.

[0040] In some embodiments, the heat storage device 5 can be a device capable of heat storage. Specifically, a material with a very high specific heat capacity can be used as the heat storage material of the heat storage device 5. It should be noted that when the heat storage material of the heat storage device 5 performs heat storage, it can undergo physical changes to better achieve heat storage, such as solid-to-liquid conversion; it can also undergo chemical changes to better achieve heat storage; or both physical and chemical changes may occur or neither may occur. Therefore, the heat storage material of the heat storage device 5 is selected according to the actual required heat storage capacity.

[0041] In some embodiments, the thermal storage device 5 can store heat through phase change of an internal phase change material, meaning the thermal storage device 5 employs a phase change thermal storage method. Phase change thermal storage technology is an energy storage technology based on phase change energy storage materials. Thermal storage can also be referred to as energy storage or energy storage. The thermal storage device 5 absorbs heat by making thermally conductive contact with a heat source through a heated surface or heated section, storing the heat internally so that the heat from the heat source can be effectively dissipated. After absorbing heat, the temperature of the heated surface or heated section of the thermal storage device 5 rises slowly or not at all, thus better ensuring continuous heat absorption from the heat source to meet the need to prevent the heat source from heating up further, thereby controlling the temperature rise of the heat source.

[0042] In some embodiments, a partition wall 2-2 for signal separation can be provided inside the housing 2. This is used for main signal isolation. Different heating chips 4 and / or other chips are respectively provided on both sides of the isolation direction of the partition wall 2-2 for transmitting signals from different channels. The partition wall 2-2 provides isolation. Generally, different signal paths are provided on both sides of the isolation direction of the partition wall 2-2, and both signal paths have heating chips 4.

[0043] In some embodiments, the partition wall 2-2 can be made to make thermal contact with the heated surface of the heat storage device 5, so that the partition wall 2-2 can transfer heat to the heat storage device 5, so that the partition wall 2-2 can not only serve as an isolation signal, but also as a heat conduction hub.

[0044] In some embodiments, the partition wall 2-2 and the heating chip 4 are in thermally conductive contact, allowing the partition wall 2-2 to conduct heat between the heat storage device 5 and the heating chip 4. Generally, the number of partition walls 2-2 corresponds to the number of heating chips 4, but a one-to-one correspondence is not required. The number of partition walls 2-2 increases with the number of heating chips 4. Furthermore, when the partition wall 2-2 is used for isolation, it generally needs to cross from one side of the chip to the other. Therefore, structurally, it is possible to guide the heat from the heating chip 4 from one side to the other. It should be noted that the thermally conductive contact between the partition wall 2-2 and the heating chip 4 can be direct or indirect. Direct thermal contact means that the heating chip 4 is directly installed on the partition wall 2-2 and transfers heat to the outside through the partition wall 2-2.

[0045] In some embodiments, the heat storage device 5 may include a housing 5-1 containing a heat storage material 5-2, wherein the housing 5-1 is used to encapsulate the heat storage material 5-2, and the heat storage material 5-2 may be a phase change material or other heat-absorbing material.

[0046] In some embodiments, the inner side of the shell 5-1 may have a transverse portion 5-3 extending towards the center of the shell 5-1. This transverse portion 5-3 connects to the heated sidewall of the shell 5-1 for heat conduction. The transverse portion 5-3 can transfer heat to the internal heat storage material 5-2, allowing heat from the heated side of the shell 5-1 to be directed to the transverse portion 5-3, and then to the heat storage material 5-2. In this configuration, the transverse portion 5-3 resembles a rib structure, providing both reinforcement and heat conduction. Because the transverse portion 5-3 has a large surface area within the shell 5-1, it effectively ensures that heat from the heated side of the shell 5-1 is quickly transferred to the internal heat storage material 5-2.

[0047] In some embodiments, at least one horizontal portion 5-3 can be aligned with at least one partition wall 2-2, so that the horizontal portion 5-3 can be closer to the partition wall 2-2, that is, the part of the housing 5-1 that is in thermal contact with the partition wall 2-2, with one side in thermal contact with the partition wall 2-2 and the other side connected to the horizontal portion 5-3, so that heat can be conducted from the horizontal portion 5-3 to the partition wall 2-2 as quickly as possible. Specifically, the partition walls 2-2 and the horizontal portions 5-3 can be arranged in a one-to-one correspondence. For example, if three partition walls 2-2 are provided to isolate four cavities, then three horizontal portions 5-3 can be provided accordingly; or if two partition walls 2-2 are provided, then two horizontal portions 5-3 can be provided accordingly. The specific structure of the horizontal portion 5-3 can be set as needed.

[0048] In some embodiments, in order to provide a sufficiently large space within the housing 5-1, the heat storage device 5 can be installed through the internal partition wall 2-2, resulting in high connection strength and convenient connection.

[0049] In some embodiments, a connector can be used to connect the horizontal portion 5-3 to the partition wall 2-2 through the housing 5-1, which greatly facilitates installation. Specifically, the horizontal portion 5-3 can have a first connecting portion 5-4 for fixed connection with the second connecting portion 2-3 on the partition wall 2-2. The first connecting portion 5-4 and the second connecting portion 2-3 can be connected by a screw structure such as a screw 15 or a bolt, for example, the screw 15 passes through the first connecting portion 5-4 and then is threadedly connected to the second connecting portion 2-3.

[0050] In some embodiments, the outer casing 2 can be a one-piece molded metal box, specifically an aluminum alloy casing. In some embodiments, for ease of installation, the outer casing 2 can have a cavity on one side and an exposed heat dissipation surface 2-1 on the other side, i.e., the bottom of the cavity has the exposed heat dissipation surface 2-1, and the heat-generating chip 4 is disposed in the cavity. Other structures may also be provided. When a partition wall 2-2 is present, the partition wall 2-2 is connected to the bottom of the cavity and extends towards the center for separation. The heat storage device 5 can be embedded in the cavity opening in a plate shape, and a cover plate is provided on the outside of the heat storage device 5. The heat storage device 5 can be fixedly mounted on the partition wall 2-2, and the partition wall 2-2 provides corresponding support for the heat storage device 5.

[0051] In some embodiments, a radio frequency (RF) board 6 may be provided, and a heat-generating chip 4 may be provided on the RF board 6. Other structures may also be provided on the RF board 6. The aforementioned cavity is used to house the RF board 6. Specifically, steps 2-5 may be provided on the surrounding walls of the cavity to support the RF board 6. A partition wall 2-2 and a heating platform 2-4 in thermal contact with the heat-generating chip 4 are provided at the bottom of the cavity. The heating platform 2-4 and the partition wall 2-2 are thermally connected to transfer heat. The heating platform 2-4 faces the cavity opening, and a heat sink 14 is generally provided on the heating platform 2-4.

[0052] In some embodiments, the heat storage device 5 can be embedded in the housing 2 and make thermal contact with the side wall at the slot of the housing 2 and the steps 2-5 for better heat conduction.

[0053] The slot opening of the cavity is encapsulated with the plate-shaped heat storage device 5, and the partition wall 2-2 passes over the radio frequency plate 6 and makes thermal contact with the side of the heat storage device 5. The part of the radio frequency plate 6 corresponding to the partition wall 2-2 can be provided with a notch to facilitate the passage of the partition wall 2-2.

[0054] In some embodiments, the heating chip 4 is provided on both sides of the radio frequency board 6 along the extending direction of the partition wall 2-2, wherein the partition wall 2-2 has the second connecting portion 2-3 near the groove wall of the cavity, and at least one end of the partition wall 2-2 extends to the middle and has the second connecting portion 2-3, so as to improve the fit between the heat storage device 5 and the partition wall 2-2.

[0055] In some embodiments, along the extending direction of partition 2-2, one side of the RF board 6 has multiple first RF connectors 1 respectively connected to the heating chip 4, and the other side has a low-frequency connector 7 and a second RF connector 8 connected to the heating chip 4, wherein the first RF connector 1 is used to connect the antenna, and the second RF connector 8 is used to connect the frequency conversion channel. Specifically, the RF board 6 may also be equipped with a power module 9 and a control module 10.

[0056] In some embodiments, a transceiver assembly includes a housing 2, a circuit section, a heat storage section, and a cover plate.

[0057] The circuit section mainly includes an RF board 6, a power module 9, a control module 10, a low-frequency connector 7, and multiple RF connectors and multiple channel components.

[0058] Four of the RF connectors are designated as first RF connectors 1, used for external antenna connections. Each first RF connector 1 corresponds to a channel assembly, which mainly includes a circulator 13, an amplifier chip, a receiver chip 11, and a multi-function chip 12. One port of the circulator 13 connects to the first RF connector 1, and the other two ports connect to the amplifier chip and the receiver chip 11, respectively. Transition substrates 3 are provided at both ends of the circulator 13 to facilitate position adjustment. The transition substrates 3 connecting to the first RF connectors 1 allow the position of each channel assembly to be independent of the distance between the first RF connectors 1. The transition substrates 3 connecting to the amplifier chip allow the circulator 13 to be repositioned without needing to adjust its position based on the amplifier chip and the receiver chip 11, thus improving compatibility. In the channel assembly, the receiver chip 11 and the multi-function chip 12 are generally mounted on the RF board 6. The amplifier chip is mounted on the housing 2 via a heat sink 14.

[0059] Four of the channel components combine into one signal (or split into four signals) at a common port to connect to another RF connector, which is the second RF connector 8 mentioned above. Since the above lines are distributed on the RF board 6, the corresponding second RF connector 8 can be connected to the lines on the RF board 6 through the transition substrate 3.

[0060] The RF board 6 is also connected to a power module 9, a control module 10, and a low-frequency connector 7. The power module 9 is used for power modulation of the amplifier chip, receiver chip 11, and multi-function chip 12 for receiving and transmitting. The control module 10 is used for phase shifting, attenuation, receiving low-noise amplification, and transmitting drive amplification functions.

[0061] The outer casing 2 forms the aforementioned cavity. The first side wall of the cavity has three partitions 2-2 connected to the bottom of the cavity, dividing this side cavity into four chambers for housing the four channel components. The first side wall also has four through holes for mounting the first RF connector 1. Inside the first side wall are multiple heating platforms 2-4 for mounting one, more, or all of the following structures: a circulator 13, an amplifier chip, and a transition substrate 3. A heat sink 14 is positioned between the amplifier chip and the heating platform 2-4. The heat sink 14 is soldered to the outer casing 2, and the amplifier chip is then eutectic-bonded to the heat sink 14. The receiver chip 11 and the multi-function chip 12 are bonded to the RF board 6 with conductive adhesive. Steps 2-5 are provided on the four side walls of the cavity to support the RF board 6.

[0062] The second side wall of the cavity has a through slot for mounting the low-frequency connector 7 and the second RF connector 8. The second side wall and the first side wall are positioned opposite each other, and the cavity can be approximately square or rectangular. A partition wall 2-2 connected to the first side wall extends from the first side wall to the second side wall.

[0063] The heat storage device 5 is plate-shaped and embedded in the slot of the cavity to cover the radio frequency board 6. The heated surface of the heat storage device 5 is abutted against the partition wall 2-2. That is, the partition wall 2-2 is connected to the exposed heat dissipation surface 2-1 at the bottom of the cavity on one side in the slot direction, while the other side is tightly abutted against the heat storage device 5 to form a thermally conductive contact for heat conduction.

[0064] The heat storage device 5 includes a housing 5-1, within which a horizontal section 5-3 is provided. The horizontal section 5-3 has a rib-like structure and is arranged in a one-to-one correspondence with the partition wall 2-2, and is aligned accordingly. The housing 5-1 is filled with a phase change material. The side of the housing 5-1 away from the RF board 6 is sealed by a heat storage cover plate 5-5. An inner protrusion is provided inside the housing 5-1 at a position corresponding to the second RF connector 8, which can also be considered a horizontal section 5-3. Similarly, the outer shell 2 has an inner protrusion at the second RF connector 8, which can also be considered a partition wall 2-2. The horizontal section 5-3 has a protrusion near the edge of the shell 5-1 to accommodate a connection hole. A connection hole is also present at one end of the horizontal section 5-3 extending towards the center. Connection holes are also provided at corresponding locations on the shell 5-1 and the two ends of the first side groove wall. A connection hole is also provided on the inner protrusion of the shell 5-1. The heat storage cover plate 5-5 has a slot corresponding to the connection hole, allowing the screw 15 to pass through the connection hole for threaded connection with the threaded hole on the partition wall 2-2 or other threaded holes in the shell 2. The screw 15 can also serve as a heat conductor to conduct heat between the partition wall 2-2 and the horizontal section 5-3. The heat storage cover plate 5-5 is welded to the shell 5-1 to seal the phase change material; laser sealing can be used for this purpose.

[0065] An outer cover plate 16 can be provided on the side of the heat storage device 5 away from the radio frequency plate 6 to cover the slot opening of the aforementioned cavity.

[0066] The traditional inner cover of the transceiver component is replaced with a heat storage device 5, which is filled with phase change thermal storage material. This significantly delays the high-temperature time during component operation. Simultaneously, the heat storage device 5 enhances heat transfer during the phase change of the phase change material by incorporating multiple horizontal sections 5-3, serving as reinforcing ribs and facilitating heat transfer. The heat storage device 5 is also installed using 15 screws at multiple points to reduce thermal resistance at the mounting surface. The heat storage device 5 is sealed to prevent leakage of the phase change material after the phase change. The transceiver component's internal cavity within the heat storage device 5 becomes a solid metal, and the heat storage cavity is filled with phase change thermal storage material. After operating for 1200 seconds under a certain condition, the internal chip temperature rise curve is compared as follows: Figure 6 As shown, the temperature has improved significantly.

[0067] The transceiver components work for a certain period of time, relying on their own internal heat capacity to absorb the heat inside the components, which is more conducive to using transceiver components in array. At the same time, after arraying, each transceiver component has its own phase change heat storage, and the array surface temperature distribution is uniform.

[0068] The outer shell 2, outer cover 16, housing 5-1 of the heat storage device 5, and heat storage cover 5-5 in the component are all made of high thermal conductivity aluminum alloy in one piece. The radio frequency output port and radio frequency input port adopt SMP-J connectors and are connected to the outside blind mating through KK head.

[0069] The outer shell 2 has a partition wall 2-2 between the channels, which plays a good role in channel isolation and shielding. At the same time, the partition wall 2-2 is close to the heating chip 4, which has high heat conduction efficiency and effectively reduces the thermal resistance between the heat source chip and the phase change heat storage material.

[0070] In terms of circuit design, the input and output ports of the RF connector both use transition substrate 3 for conversion. At the same time, the circulator 13 and the RF board 6 also use transition substrate 3 for conversion, which increases the debuggability of the components and improves the yield.

[0071] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0072] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A transceiver assembly, comprising a housing (2), wherein a heating chip (4) is disposed within the housing (2), one side of the heating chip (4) being in thermal contact with an exposed heat dissipation surface (2-1) of the housing (2) to dissipate heat to the outside through the exposed heat dissipation surface (2-1), characterized in that, It also includes a heat storage device (5) disposed on the other side of the heating chip (4), the heat storage device (5) conducting heat directly or indirectly to the heating chip (4); The outer casing (2) is provided with a partition wall (2-2) for separating multiple heating chips (4); the partition wall (2-2) is in thermal contact with the heated surface of the heat storage device (5), and the partition wall (2-2) is in thermal contact with the heating chip (4) so ​​that the partition wall (2-2) conducts heat between the heat storage device (5) and the heating chip (4).

2. The transceiver component according to claim 1, characterized in that, The heat storage device (5) stores heat through the phase change of the internal phase change material.

3. The transceiver component according to claim 1, characterized in that, The heat storage device (5) includes a shell (5-1) and a heat storage material (5-2) disposed in the shell (5-1). The inner side of the shell (5-1) has a transverse portion (5-3) extending toward the center of the shell (5-1). The transverse portion (5-3) is connected to the heated side wall of the shell (5-1) for heat conduction.

4. The transceiver component according to claim 3, characterized in that, At least one of the horizontal sections (5-3) is aligned with at least one of the partition walls (2-2).

5. The transceiver component according to claim 4, characterized in that, The horizontal section (5-3) has a first connecting part (5-4) for fixed connection with the second connecting part (2-3) provided on the partition wall (2-2).

6. The transceiver component according to claim 5, characterized in that, The outer shell (2) is a one-piece molded aluminum alloy shell (5-1).

7. The transceiver component according to claim 5, characterized in that, The device includes an RF board (6) on which the heat-generating chip (4) is disposed. The outer casing (2) has a cavity on one side for placing the RF board (6) and an exposed heat dissipation surface (2-1) on the other side. The cavity has a partition wall (2-2) and a heat-receiving platform (2-4) in thermal contact with the heat-generating chip (4) at the bottom. The heat-receiving platform (2-4) and the partition wall (2-2) are thermally connected. The cavity has a plate-shaped heat storage device (5) encapsulated at the opening. The partition wall (2-2) extends across the RF board (6) and is in thermal contact with the plate surface of the heat storage device (5).

8. The transceiver component according to claim 7, characterized in that, Along the extension direction of the partition wall (2-2), the radio frequency board (6) has the heating chip (4) on both sides. The partition wall (2-2) has the second connecting part (2-3) near the wall of the cavity. At least one end of the partition wall (2-2) extends to the middle and has the second connecting part (2-3).

9. The transceiver component according to claim 8, characterized in that, Along the extension direction of the partition wall (2-2), one side of the radio frequency board (6) has a plurality of first radio frequency connectors (1) respectively connected to the heating chip (4), and the other side has a low frequency connector (7) and a second radio frequency connector (8) connected to the heating chip (4); the radio frequency board (6) is also provided with a power supply module (9) and a control module (10).

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