Imaging element unit and imaging device

Abstract

The present application relates to an imaging element unit and an imaging device, an imaging element unit which is built in a frame of an imaging device, the imaging element unit including: an imaging element having an imaging surface which captures an object and a back surface which opposes the imaging surface; a vibration-proof function which moves the imaging element in a surface direction of the imaging surface; and a first heat conducting member through which driving heat of the imaging element is conducted from the back surface and which is deformable in response to movement of the imaging element based on the vibration-proof function, the first heat conducting member having an outer layer portion and at least one inner layer portion which is connected to the outer layer portion and is disposed in a space surrounded by the outer layer portion, the outer layer portion and the inner layer portion each having a bending portion which allows deformation.

Description

Technical Field

[0001] The present invention relates to an imaging element unit and a camera device. Background Technology

[0002] Japanese Patent No. 5168047 discloses a camera that includes a heat dissipation structure for an imaging element mounted on a shake correction unit. The heat dissipation structure for the imaging element is characterized in that a heat dissipation component is provided near the shake correction unit, and a metal component located near the imaging element in the shake correction unit and the heat dissipation component are connected by a flexible component with thermal conductivity. The camera is characterized in that the heat dissipation component is in the shape of a ring around the metal component, and multiple extensions are formed on its outer periphery. These multiple extensions are fixed to the lens barrel or frame of the camera.

[0003] Japanese Patent Application Publication No. 2020-067632 discloses a camera device comprising a camera sensor, a sensor substrate on which the camera sensor is mounted, and a metal bracket having a shape larger than the camera sensor. In the camera device, an opening is provided in the sensor substrate to expose a portion of the main surface of the camera sensor, and the metal bracket is configured to directly abut against the exposed portion through the opening. Summary of the Invention

[0004] One embodiment of the present invention provides an imaging element unit and camera device that can more effectively dissipate heat from the driving heat of the imaging element.

[0005] means for solving technical problems

[0006] The imaging element unit of the present invention is built into the frame of a camera device. The imaging element unit includes: an imaging element having an imaging surface for capturing a subject and a back surface opposite to the imaging surface; a vibration damping function for moving the imaging element along the surface direction of the imaging surface; and a first heat-conducting member for conducting driving heat of the imaging element from the back surface and deforming in accordance with the movement of the imaging element based on the vibration damping function, the first heat-conducting member having an outer layer; and at least one inner layer connected to the outer layer and disposed in a space surrounded by the outer layer, the outer layer and the inner layer each having a deformable bending portion.

[0007] Preferably, the first heat-conducting component is formed from a single sheet of material in the form of a bent sheet.

[0008] Preferably, the outer layer and the inner layer are composed of a first sheet portion, a second sheet portion opposite to the first sheet portion, and a connecting portion connecting the first sheet portion and the second sheet portion.

[0009] Preferably, the curved portions of the outer and inner layers extend outwards.

[0010] Preferably, the first heat-conducting component has a reinforcing layer in the portion other than the bend, and the portion with the reinforcing layer is thicker than the bend by an amount equivalent to the amount of the reinforcing layer.

[0011] Preferably, the first heat-conducting component is connected to the imaging element via the second heat-conducting component and to the frame via the third heat-conducting component, and the second and third heat-conducting components are held by the outer layer and the inner layer.

[0012] Preferably, the first heat-conducting component is formed of graphite sheet, and the second and third heat-conducting components are formed of metal.

[0013] Preferably, a fourth heat-conducting component formed of a graphite sheet is connected between the third heat-conducting component and the frame, and the fourth heat-conducting component is thicker than the first heat-conducting component.

[0014] Preferably, a fifth heat-conducting member is provided at a position opposite to the side of the imaging element that connects the imaging surface and the back side, and drives heat to be conducted from the side. The fifth heat-conducting member has a curved portion that can deform in response to the movement of the imaging element based on the vibration damping function.

[0015] Preferably, the first heat-conducting component and the fifth heat-conducting component are composed of a first sheet portion, a second sheet portion opposite to the first sheet portion, and a connecting portion that connects the first sheet portion and the second sheet portion and has a bend. The angle formed by the bend of the fifth heat-conducting component is more acute than the angle formed by the bend of the first heat-conducting component.

[0016] Preferably, the fifth heat-conducting component is formed of a graphite sheet.

[0017] The camera device of the present invention includes a frame and an imaging element unit as described above, which is built into the frame. Attached Figure Description

[0018] Figure 1 This is a diagram representing a digital camera.

[0019] Figure 2 This is a frontal exploded perspective view of the imaging element unit.

[0020] Figure 3 This is an exploded three-dimensional view of the back of the imaging element unit.

[0021] Figure 4 This is an exploded perspective view of the back of the main part of the imaging element unit.

[0022] Figure 5 This is a three-dimensional view of the first, second, and third heat-conducting components.

[0023] Figure 6 This is a top view of the first, second, and third heat-conducting components.

[0024] Figure 7 This is a cross-sectional view of the main part of the imaging element unit.

[0025] Figure 8 This is a perspective view of the third heat-conducting component, the fourth heat-conducting component, and the connecting component.

[0026] Figure 9 This is a simplified top view of the first heat-conducting component.

[0027] Figure 10 This is a diagram showing the first heat-conducting component before and after bending.

[0028] Figure 11 This is a diagram showing the deformation state of the first heat-conducting component.

[0029] Figure 12 This is a diagram showing the deformation state of the first heat-conducting component.

[0030] Figure 13 This is a diagram showing the conduction path of the driving heat of the imaging element.

[0031] Figure 14 This is a diagram showing the first heat-conducting component of the triple structure.

[0032] Figure 15 This is a diagram showing the first heat-conducting component, which is an octagon.

[0033] Figure 16 This is a diagram showing the first heat-conducting component where the corners of the outer layer connection and the inner layer connection are recessed inwards.

[0034] Figure 17 This is a diagram showing an imaging element unit with a fifth heat-conducting component.

[0035] Figure 18 This is a diagram showing an imaging element unit with a fifth heat-conducting component.

[0036] Figure 19 This is a simplified top view of the 5th heat-conducting component.

[0037] Figure 20 This diagram illustrates an example of connecting a second heat-conducting component to the central region of the back side of a circuit board without openings. Detailed Implementation

[0038] Hereinafter, an example of an embodiment of the technology of the present invention will be described with reference to the accompanying drawings.

[0039] [First Implementation]

[0040] As an example, such as Figure 1As shown, the digital camera 2 includes a camera body 10. A lens mount 11 is provided on the front of the camera body 10. The lens mount 11 has a circular image opening 12. An interchangeable imaging lens (not shown) is detachably mounted on the lens mount 11. The digital camera 2 is an example of an "image capturing device" according to the technology of the present invention. Furthermore, the camera body 10 is an example of a "frame" according to the technology of the present invention.

[0041] An imaging element unit 15 is built into the camera body 10. A rectangular plate-shaped imaging element 16 is mounted in the imaging element unit 15. The imaging element 16 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The imaging element 16 has a rectangular imaging surface 17 for capturing the subject. The imaging surface 17 receives subject light representing the subject. As is known, pixels are arranged in a two-dimensional pattern on the imaging surface 17 to perform photoelectric conversion on the received subject light and output electrical signals. The entire imaging surface 17 is exposed to the outside through the camera opening 12.

[0042] A CPU (Central Processing Unit) 18 is connected to the imaging element unit 15. The CPU 18 controls the operation of the imaging element unit 15. Additionally, although not shown in the diagram, the CPU 18 is connected via bus lines to memory, namely ROM (Read Only Memory) and / or RAM (Random Access Memory). The CPU 18, memory, and bus lines together constitute a computer.

[0043] The imaging element unit 15 has a vibration stabilization function. The vibration stabilization function is used to suppress the positional shift caused by vibrations applied to the camera body 10 and the relative positional shift of the subject light incident on the imaging surface 17 and the digital camera 2. Vibrations applied to the camera body 10 include hand tremors of the user holding the camera body 10 to take pictures of the subject.

[0044] Under the control of CPU 18, the imaging element 16 is moved in the direction that offsets the positional shift by an amount offset through the anti-vibration function. More specifically, the anti-vibration function moves the imaging element 16 along the X-axis direction parallel to the edge 19 of the imaging surface 17 of the imaging element 16 and / or along the Y-axis direction orthogonal to the edge 19, i.e., parallel to the edge 20 that intersects the edge 19 at a 90° angle. The X-axis and Y-axis directions are examples of the "surface directions" involved in the technology of this invention. In addition, in this specification, the terms "orthogonal" and "90°" include not only the meaning of being completely orthogonal and 90°, but also the meaning of being approximately orthogonal and approximately 90°, including errors allowed in design and manufacturing. Furthermore, in this specification, the terms "parallel" include not only the meaning of being completely parallel, but also the meaning of being approximately parallel, including errors allowed in design and manufacturing. Hereinafter, one side of the edge 19 will be referred to as "down," and the side opposite to the edge 19 in the Y-axis direction will be referred to as "up." Furthermore, one side of edge 20 is represented as "left", and the side opposite to edge 20 in the X-axis direction is represented as "right".

[0045] In this specification, "positional offset" refers to the phenomenon caused by a change in the optical axis OA relative to the subject due to vibration. "Optical axis OA" refers to the optical axis of the subject light incident on the imaging plane 17 through the imaging lens. A change in the optical axis OA indicates that the optical axis OA is tilted due to a positional offset relative to a reference axis (e.g., the optical axis OA before the positional offset occurred). Furthermore, in this specification, "compensating for positional offset" includes not only the meaning of eliminating positional offset but also the meaning of reducing positional offset.

[0046] exist Figure 2 and Figure 3 In this camera, the imaging element unit 15 includes a fixed member 30, a movable member 31, and a magnetic yoke 32. The fixed member 30 is disposed on the rear side of the camera body 10, and the magnetic yoke 32 is disposed on the front side of the camera body 10. The fixed member 30 is fixed to the camera body 10. Furthermore, the fixed member 30 and the magnetic yoke 32 are fixed at intervals in the Z-axis direction, which is orthogonal to the X-axis and Y-axis. The movable member 31 is disposed between the fixed member 30 and the magnetic yoke 32 via three balls 35, 36, and 37 of the same size. The movable member 31 can move relative to the fixed member 30 and the magnetic yoke 32 in the X-axis and Y-axis directions (rotation about the Z-axis) via the balls 35-37. In addition, the Z-axis is parallel to the optical axis OA before the position offset occurs.

[0047] The fixing member 30 holds magnets 40, 41, and 42. Magnets 40 and 42 are mounted on the front side of the fixing member 30, which is opposite to the movable member 31. Magnets 40 and 42 are combinations of rolled plate-shaped magnets with their N pole facing the movable member 31 and rolled plate-shaped magnets with their S pole facing the movable member 31. Magnet 40 is positioned at the lower center of the fixing member 30 with its long side along the X-axis. Magnets 41 and 42 are arranged along the Y-axis. Magnet 41 is positioned at the upper left corner of the fixing member 30 with its long side along the Y-axis. Magnet 42 is positioned at the lower left corner of the fixing member 30 with its long side along the Y-axis.

[0048] On the front of the fixing component 30, in addition to magnets 40-42, plates 45, 46, and 47 are also provided. Plate 45 is located at the lower right corner of the fixing component 30 and above the magnets 40. Plate 46 is located on the left side of the fixing component 30 and between magnets 41 and 42. Plate 47 is located at the upper right corner of the fixing component 30. Plate 45 rotatably supports ball 35, plate 46 rotatably supports ball 36, and plate 47 rotatably supports ball 37.

[0049] Square-shaped limiting openings 50 and 51 are formed in the fixed member 30 to restrict the movement range of the movable member 31 in the XY plane. The limiting openings 50 and 51 are approximately the same size when viewed from above along the Z-axis. The limiting opening 50 is formed in the lower left corner of the fixed member 30 between the magnet 42 and the plate 45. The limiting opening 51 is formed in the upper right corner of the fixed member 30, adjacent to the left of the plate 47. That is, the limiting openings 50 and 51 are positioned approximately diagonally opposite each other in the fixed member 30.

[0050] Internal threads 55, 56, 57, and 58 are provided in the fixing component 30 via spacers. Internal thread 55 is located at the lower right corner of the fixing component 30. Internal thread 56 is located at the upper left corner of the fixing component 30. Internal thread 57 is located at the lower left corner of the fixing component 30. Internal thread 58 is located at the upper right corner of the fixing component 30.

[0051] A large rectangular access opening 59 is formed at the center of the fixed member 30. The access opening 59 is provided for accessing the back of the movable member 31 from the back of the fixed member 30.

[0052] The movable member 31 holds the imaging element 16, and also holds coils 60, 61, and 62. The imaging element 16 is positioned at the center of the movable member 31. Coil 60 is positioned at the lower center of the movable member 31, opposite to magnet 40 in the Z-axis direction. Coil 61 is positioned at the upper left corner of the movable member 31, opposite to magnet 41 in the Z-axis direction. Coil 62 is positioned at the lower left corner of the movable member 31, opposite to magnet 42 in the Z-axis direction. Coil 60 is configured such that its long side is along the X-axis direction. Coils 61 and 62 are arranged along the Y-axis direction. Coils 61 and 62 are each configured such that their long sides are along the Y-axis direction.

[0053] A magnet 65 is held in the yoke 32. A magnetic body 66 is mounted in coil 61, and a magnetic body 67 is mounted in coil 62. The magnet 65 is, for example, a neodymium magnet. The magnetic bodies 66 and 67 are, for example, thin iron plates. The magnet 65 is configured to cover coil 60 and increase the driving force of coil 60. The magnetic bodies 66 and 67 are arranged along the Y-axis. Magnetic body 66 is located on the upper side of coil 61, and magnetic body 67 is located on the lower side of coil 62.

[0054] As mentioned above, coil 60 is positioned opposite magnet 40 in the Z-axis direction, and therefore magnet 65 is also positioned opposite magnet 40 in the Z-axis direction. Thus, magnet 65 is attracted by magnet 40 while fixed to yoke 32.

[0055] Similarly, as mentioned above, coil 61 is positioned opposite magnet 41 in the Z-axis direction, and therefore magnetic body 66 is also positioned opposite magnet 41 in the Z-axis direction. Therefore, magnetic body 66 is attracted by magnet 41. Furthermore, as mentioned above, coil 62 is positioned opposite magnet 42 in the Z-axis direction, and therefore magnetic body 67 is also positioned opposite magnet 42 in the Z-axis direction. Therefore, magnetic body 67 is attracted by magnet 42.

[0056] Recesses 70, 71, and 72 are formed on the back of the movable member 31, which is opposite to the fixed member 30. Recess 70 is located at the lower right corner of the movable member 31 and is opposite to the plate 45 in the Z-axis direction. Recess 71 is located between coils 61 and 62 on the left side of the movable member 31 and is opposite to the plate 46 in the Z-axis direction. Recess 72 is located at the upper right corner of the movable member 31 and is opposite to the plate 47 in the Z-axis direction. Recess 70 rotatably accommodates ball 35, recess 71 rotatably accommodates ball 36, and recess 72 rotatably accommodates ball 37. When viewed from above in the Z-axis direction, the size of recesses 70-72 is larger than the diameter of balls 35-37. Furthermore, the depth of recesses 70-72 in the Z-axis direction is slightly smaller than the diameter of balls 35-37.

[0057] On the back of the movable member 31, a cylindrical protrusion 80 protruding toward the fixed member 30 is provided at a position opposite to the limiting opening 50 in the Z-axis direction. Similarly, on the back of the movable member 31, a cylindrical protrusion 81 protruding toward the fixed member 30 is provided at a position opposite to the limiting opening 51 in the Z-axis direction. The protrusion 80 is inserted through the limiting opening 50, and the protrusion 81 is inserted through the limiting opening 51. Therefore, the protrusions 80 and 81 function as limiting pins restricting the movement of the movable member 31 in the XY plane.

[0058] The yoke 32 is a magnetic material, such as a thin sheet of iron, and is roughly C-shaped. The yoke 32 forms a magnetic circuit with the magnets 40 to 42 and increases the magnetic flux received by the coils 60 to 62.

[0059] External threads 85, 86, 87, and 88 are installed in the magnetic yoke 32. External threads 85 to 88 are fastened to the internal threads 55 to 58 of the fixing member 30. Thus, the fixing member 30 and the magnetic yoke 32 are fixed, and the movable member 31 is movably held between the fixing member 30 and the magnetic yoke 32.

[0060] The imaging element unit 15 includes a pair of voice coil motors (VCMs). The pair of VCMs consists of a first VCM and a second VCM. The first VCM includes a magnet 40 paired with a coil 60 and a yoke 32, generating power to move the movable member 31 along the Y-axis. Conversely, the second VCM includes a magnet 41 paired with a coil 61, a magnet 42 paired with a coil 62, and a yoke 32, generating power to move the movable member 31 along the X-axis. More specifically, the first VCM generates power to move the movable member 31 along the Y-axis through the magnetic force of the magnet 40 and the current flowing through the coil 60. Furthermore, the second VCM generates power to move the movable member 31 along the X-axis through the magnetic force of the magnet 41 and the current flowing through the coil 61, and the magnetic force of the magnet 42 and the current flowing through the coil 62.

[0061] Although not illustrated, the movable part 31 is equipped with a Hall element for detecting its position and a temperature sensor for measuring the temperature around the Hall element. The CPU 18 acquires the difference between the position of the movable part 31 detected by the Hall element and the target position of the movable part 31 used to correct positional deviations, and performs feedback control to drive the VCM in a manner that eliminates the difference. When the difference is large, the power generated by the VCM is relatively large; conversely, when the difference is small, the power generated by the VCM is relatively small. Furthermore, the CPU 18 uses the temperature measured by the temperature sensor to correct for temperature drift in the Hall element.

[0062] like Figure 4 As shown, a rectangular plate-shaped circuit board 90, approximately the same size as the imaging element 16, is mounted on the back surface 89 of the imaging element 16 opposite to the imaging surface 17. The circuit board 90 is formed, for example, of a resin such as epoxy resin. A rectangular opening 91 is formed in the circuit board 90. The opening 91 is formed at the center of the circuit board 90 and exposes the central region 92 of the back surface 89 of the imaging element 16. The central region 92 is a region of a predetermined size centered at and surrounding the center point C of the back surface 89 of the imaging element 16. Identification information 98 of the imaging element 16 is recorded in the central region 92. The opening 91 is formed for visual identification of this identification information 98. The identification information 98 is, for example, a two-dimensional barcode for navigation to a webpage containing a management number or management information.

[0063] The circuit board 90 houses the control circuit, drive circuit, and power supply circuit of the imaging element 16. Connectors 93 and 94 are located at the lower end of the back side of the circuit board 90. Furthermore, connector 95 is located at the left end of the back side of the circuit board 90.

[0064] One end of the flexible substrate 96 is connected in connectors 93 and 94. The other end of the flexible substrate 96 is pulled out through the access opening 59 to the back side of the fixing member 30 (see reference). Figure 7 The other end of the flexible substrate 96 is connected to the CPU 18 and a power supply circuit (not shown) that supplies power from the battery. Furthermore, the flexible substrate 97 is connected in the connector 95. Figure 1 One end of the flexible substrate 97 is referenced. The other end of the flexible substrate 97 wraps around the front of the movable member 31 and is connected to the imaging element 16. In summary, the other end of the flexible substrate 97 is connected to the imaging element 16, and one end of the flexible substrate 97 is connected to the connector 95. Furthermore, one end of the flexible substrate 96 is connected to the connectors 93 and 94, and the CPU 18 and the like are connected to the other end of the flexible substrate 96. Therefore, the imaging element 16, the circuit board 90, and the CPU 18 are connected via the flexible substrate 97, the connector 95, the connectors 93 and 94, and the flexible substrate 96.

[0065] The imaging element unit 15 also includes a first heat-conducting component 100, a second heat-conducting component 101, and a third heat-conducting component 102, which conduct the driving heat of the imaging element 16.

[0066] A second heat-conducting component 101 and a third heat-conducting component 102 are connected in a first heat-conducting component 100. Driving heat is conducted from the second heat-conducting component 101 to the first heat-conducting component 100. Furthermore, the first heat-conducting component 100 conducts driving heat to the third heat-conducting component 102. The second heat-conducting component 101 is connected to the central region 92 of the back surface 89 of the imaging element 16 exposed through the opening 91. Driving heat is conducted from the central region 92 to the second heat-conducting component 101.

[0067] The first heat-conducting component 100 and the second heat-conducting component 101 are fixed together by an adhesive. An internal thread 68 is formed in the fixing component 30. A through hole 103 is formed in the first heat-conducting component 100. An external thread 104 is installed in the third heat-conducting component 102. The external thread 104 passes through the through hole 103 of the first heat-conducting component 100 and is securely fixed to the internal thread 68 of the fixing component 30. Thus, the first heat-conducting component 100 and the third heat-conducting component 102 are fixed together.

[0068] The first heat-conducting component 100 is formed of a graphite sheet. The graphite sheet is a structure in which a resin film, such as a PET (polyethylene terephthalate) film, is used to process the graphite sheet body. The thickness of the graphite sheet body is, for example, 70 μm, and the thickness of the resin film is, for example, 5 μm.

[0069] The second heat-conducting component 101 and the third heat-conducting component 102 are metal plates, such as copper plates. Therefore, the second heat-conducting component 101 and the third heat-conducting component 102 have higher rigidity than the first heat-conducting component 100 formed of graphite sheet. In other words, the first heat-conducting component 100 has higher elasticity than the second heat-conducting component 101 and the third heat-conducting component 102.

[0070] As an example, such as Figure 5 and Figure 6 As shown, the first heat-conducting component 100 has a dual structure having an outer layer 110 and an inner layer 111. The inner layer 111 is connected via a connecting portion 112 (see also...). Figure 9 (etc.) is connected to the outer layer 110 and disposed in the space surrounded by the outer layer 110. A mounting portion 113 with an insertion hole 103 is provided on the upper part of the outer layer 110.

[0071] Both the outer layer 110 and the inner layer 111 are hexagonal. The outer layer 110 is composed of a first sheet 115, a second sheet 116 having the same length as the first sheet 115 and opposite to it, and a pair of V-shaped connecting portions 117 connecting the first sheet 115 and the second sheet 116. Similarly, the inner layer 111 is composed of a first sheet 118, a second sheet 119 having the same length as the first sheet 118 and opposite to it, and a pair of V-shaped connecting portions 120 connecting the first sheet 118 and the second sheet 119. The first sheet 115 and the second sheet 116, as well as the first sheet 118 and the second sheet 119, are planar.

[0072] The second heat-conducting component 101 has a first sheet 125 and a second sheet 126. The first sheet 125 is parallel to the imaging surface 17 and the back surface 89 of the imaging element 16 and is opposite to the back surface 89 of the imaging element 16. The first sheet 125 is connected to the central region 92 of the back surface 89. The second sheet 126 is bent at 90° from the first sheet 125 and extends along the normal direction of the imaging surface 17 and the back surface 89 of the imaging element 16. The normal direction of the imaging surface 17 and the back surface 89 of the imaging element 16 is the Z-axis direction (the direction of the optical axis OA before the position offset occurs). The second sheet 126 has a size approximately the same as the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111.

[0073] The second heat-conducting component 101 is connected to the first heat-conducting component 100 via the second piece 126. More specifically, the second piece 126 is inserted into the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111, and is held in a state by being clamped by the first sheet portion 115 and the first sheet portion 118. Double-sided tape is adhered to the portions of the first sheet portion 115 and the first sheet portion 118 that contact the second piece 126. The first sheet portion 115, the first sheet portion 118, the second piece 126, and the first heat-conducting component 100 and the second heat-conducting component 101 are fixed by the adhesive of the double-sided tape.

[0074] The third heat-conducting component 102 has a first piece 127 and a second piece 128. Similar to the first piece 125 of the second heat-conducting component 101, the first piece 127 is parallel to the imaging surface 17 and the back surface 89 of the imaging element 16 and is wing-shaped and elongated in the X-axis direction. Similar to the second piece 126 of the second heat-conducting component 101, the second piece 128 is bent at 90° from the first piece 127 and extends along the normal direction of the imaging surface 17 and the back surface 89 of the imaging element 16.

[0075] The third heat-conducting component 102 is connected to the first heat-conducting component 100 via the second sheet 128. More specifically, the second sheet 128 is inserted into the space between the second sheet portion 116 of the outer layer portion 110 and the second sheet portion 119 of the inner layer portion 111, and is held in a state by the second sheet portion 116 and the second sheet portion 119. A claw 129 is provided in the second sheet 128 to hang on the edge of the second sheet portion 119.

[0076] The thickness TH2 of the second heat-conducting component 101 is thicker than the thickness TH1 of the first heat-conducting component 100. The thickness TH1 of the first heat-conducting component 100 is, for example, 80 μm, and the thickness of the second heat-conducting component 101 is, for example, 1 mm. In addition, although not shown, the thickness of the third heat-conducting component 102 is also thicker than the thickness TH1 of the first heat-conducting component 100, for example, 1 mm.

[0077] As an example, such as Figure 7 As shown, the flexible substrate 96, which is pulled out through the access opening 59, is disposed on the side opposite to the first heat-conducting member 100, with the second piece 126 of the second heat-conducting member 101 in between.

[0078] As an example, such as Figure 8 As shown, a fourth thermally conductive component 135 is mounted in the third thermally conductive component 102 using an adhesive. Similar to the first thermally conductive component 100, the fourth thermally conductive component 135 is formed of a graphite sheet. The thickness TH4 of the fourth thermally conductive component 135 is greater than the thickness TH1 of the first thermally conductive component 100 (see reference). Figure 6 Thickness. The thickness TH4 of the fourth thermally conductive component 135 is, for example, 500 μm.

[0079] A connecting member 136 is also installed in the fourth heat-conducting component 135 using an adhesive. Similar to the second heat-conducting component 101 and the third heat-conducting component 102, the connecting member 136 is a metal plate, such as a copper plate. The connecting member 136 is connected to the top plate 137 of the camera body 10. The top plate 137 of the camera body 10 is, for example, a magnesium plate or an aluminum plate.

[0080] As an example, such as Figure 9 As shown, the outer layer 110 of the first heat-conducting member 100 is hexagonal as described above, and therefore has six corners 140, 141, 142, 143, 144, and 145. The inner layer 111 is also hexagonal, and therefore has six corners 146, 147, 148, 149, 150, and 151. Corners 140-145 and 146-151 function as curved portions that allow deformation to follow the movement of the imaging element 16 based on the anti-vibration function. Corners 140-145 extend outward. Similarly, corners 146-151 also extend outward. That is, the first heat-conducting member 100 has a shape similar to a pantograph. In addition, in Figure 9The illustration of the mounting part 113 is omitted, and the first heat-conducting component 100 is simplified. Figure 11 and Figure 12 The same applies to the others.

[0081] As an example, such as Figure 10 As shown, the first heat-conducting component 100 is formed by bending a sheet of material 160 in the shape of a sheet, as indicated by the dotted lines. Specifically, firstly, the portion of the connecting portion 112 is bent so that the portion that becomes the outer layer 110 and the portion that becomes the inner layer 111 face each other. Then, the portion with bending angles 146 to 151 is bent to form the inner layer 111, and the portion with bending angles 140 to 145 is bent to form the outer layer 110. Finally, the portion that becomes the mounting portion 113 is bent to complete the first heat-conducting component 100.

[0082] The first heat-conducting component 100 has a reinforcing layer 161. The reinforcing layer 161 is a resin film, such as a PET film with a thickness of 40 μm. The reinforcing layer 161 is disposed on both sides constituting the connecting portion 117 and the connecting portion 120, but not on the corners 144, 145, 150, and 151 that function as curved portions. Naturally, the two sides constituting the connecting portion 117 and the connecting portion 120 are thicker than the corners 144, 145, 150, and 151 that function as curved portions by an amount greater than that of the reinforcing layer 161. The two sides constituting the connecting portion 117 and the connecting portion 120 are an example of a "part having a reinforcing layer" according to the technology of this invention.

[0083] As an example, such as Figure 11 and Figure 12 As shown, the first heat-conducting component 100 is able to deform in response to the movement of the imaging element 16 based on the vibration-damping function. Figure 11 The image shows the state in which the first heat-conducting component 100 stretches and deforms in the vertical direction as it moves along the Y-axis in accordance with the movement of the imaging element 16 based on the vibration damping function. Figure 12 The image shows the state in which the first heat-conducting component 100 tilts and deforms in the left-right direction as the imaging element 16 based on the vibration damping function moves along the X-axis.

[0084] Next, the function based on the above structure will be explained. In the digital camera 2, for example, when a large load is applied to the imaging element 16 during photography, such as video recording at 120 frames per second (4K / 120p) with a resolution equivalent to 4K, non-negligible driving heat is generated in the imaging element 16.

[0085] In the imaging element unit 15 of this example, the driving thermal tracing of the imaging element 16 is as follows: Figure 13The heat transfer path is as described above. That is, the driving heat of the imaging element 16 is first conducted from the back surface 89 of the imaging element 16 to the second heat-conducting component 101 connected to the central region 92 of the back surface 89. Then, the driving heat is conducted from the second heat-conducting component 101 to the first heat-conducting component 100 connected through the second piece 126 of the second heat-conducting component 101.

[0086] The driving heat conducted to the first heat-conducting component 100 is conducted to the third heat-conducting component 102 connected by the second piece 128. Furthermore, the driving heat is conducted from the third heat-conducting component 102 to the fourth heat-conducting component 135, and from the fourth heat-conducting component 135 to the connecting component 136. Then, it is conducted through the connecting component 136 to the top plate 137 of the camera body 10, and dissipated to the outside through the top plate 137.

[0087] In the imaging element unit 15, the movable member 31 is movable relative to the fixed member 30 and the magnetic yoke 32. The movable member 31 holds the imaging element 16. Therefore, the imaging element 16 moves along with the movable member 31. When the position of the subject light incident on the imaging surface 17 shifts due to the user's hand tremor, the movable member 31, and thus the imaging element 16, moves in the direction that cancels the position shift under the control of the CPU 18 to cancel the position shift by the amount of position shift. Figure 11 and Figure 12 As shown, the first heat-conducting component 100 deforms in response to the movement of the imaging element 16 based on the vibration-damping function.

[0088] As described above, the imaging element unit 15 includes: an imaging element 16 having an imaging surface 17 for capturing a subject and a back surface 89 opposite to the imaging surface 17; a circuit board 90 mounted on the back surface 89; and a first heat-conducting member 100 and a second heat-conducting member 101, through which the driving heat of the imaging element 16 is conducted. An opening 91 is formed in the circuit board 90 to expose the central region 92 of the back surface 89 of the imaging element 16. The first heat-conducting member 100 is connected to the second heat-conducting member 101 and has higher elasticity than the second heat-conducting member 101. The second heat-conducting member 101 is connected to the back surface 89 via the opening 91. By directly connecting the more rigid and less deformable second heat-conducting member 101 to the imaging element 16, compared to directly connecting the more elastic and easily deformable first heat-conducting member 100 to the imaging element 16, the heat-conducting member is less likely to detach from the imaging element 16.

[0089] The imaging element unit 15 has a vibration damping function that allows the imaging element 16 to move along the surface direction. For example... Figure 11 and Figure 12As shown, the first heat-conducting component 100 can deform in response to the movement of the imaging element 16 based on the vibration-damping function. Therefore, the effect of directly connecting the second heat-conducting component 101, which has higher rigidity and is less prone to deformation, to the imaging element 16 can be further utilized, making it less likely for the heat-conducting component to peel off.

[0090] Furthermore, when the first heat-conducting component 100 is directly connected to the imaging element 16, the thickness TH1 of the first heat-conducting component 100 needs to be increased to improve the conduction efficiency. If the thickness TH1 is thick, the repulsive force of the first heat-conducting component 100 increases accordingly, making it more difficult to deform in response to the movement of the imaging element 16 based on the vibration-damping function. However, in this example, it is not necessary to make the thickness TH1 of the first heat-conducting component 100 so thick. Therefore, compared with the case where it is directly connected to the imaging element 16, the first heat-conducting component 100 can deform in response to the movement of the imaging element 16 based on the vibration-damping function without much resistance.

[0091] like Figure 5 As shown, the second heat-conducting member 101 has a first piece 125 connected to the central region 92 and opposite to the back surface 89, and a second piece 126 bent from the first piece 125. The first heat-conducting member 100 is connected to the second piece 126. Therefore, the first heat-conducting member 100 does not follow the movement of the imaging element 16 itself, but can deform to follow the movement of the second piece 126. When it can deform to follow the movement of the imaging element 16 itself, the first heat-conducting member 100 needs to be made into a complex structure, but since it can deform to follow the movement of the second piece 126, the first heat-conducting member 100 can be made into a simple structure.

[0092] Furthermore, the second piece 126 extends along the normal direction of the imaging surface 17 and the back surface 89. Therefore, the first heat-conducting component 100 can be designed with a simpler structure. In addition, the angle at which the second piece 126 is bent from the first piece 125 can be less than 90° or greater than 90°.

[0093] The imaging element unit 15 includes a flexible substrate 96 mounted on the circuit board 90. For example... Figure 7 As shown, the flexible substrate 96 is disposed on the side opposite to the first heat-conducting member 100, with the second piece 126 of the second heat-conducting member 101 in between. Therefore, there are no concerns about the flexible substrate 96 contacting the first heat-conducting member 100 and the interference of signals to and / or from the imaging element 16.

[0094] like Figure 6 As shown, the thickness TH2 of the second heat-conducting component 101 is thicker than the thickness TH1 of the first heat-conducting component 100. Therefore, the heat conduction efficiency of the second heat-conducting component 101 can be improved.

[0095] The graphite sheet forming the first heat-conducting component 100 has a thermal conductivity of 1600 W / m·K. On the other hand, the copper forming the second heat-conducting component 101 has a thermal conductivity of 390 W / m·K, which is lower than that of the graphite sheet. However, as described above, if the thickness TH2 of the second heat-conducting component 101 is set to be thicker than the thickness TH1 of the first heat-conducting component 100, the decrease in thermal conductivity can be compensated for. Therefore, the thermal conductivity of the second heat-conducting component 101 can be set to be higher than that of the first heat-conducting component 100. If the thermal conductivity of the second heat-conducting component 101 is higher than that of the first heat-conducting component 100, the driving heat can be smoothly conducted from the second heat-conducting component 101 to the first heat-conducting component 100.

[0096] Furthermore, by increasing the thickness TH2 of the second heat-conducting component 101, the thermal conductivity of the second heat-conducting component 101 is set to be higher than that of the first heat-conducting component 100, but this is not a limitation. Instead of increasing the thickness TH2 of the second heat-conducting component 101, or in any other way, the thermal conductivity of the second heat-conducting component 101 can be set to be higher than that of the first heat-conducting component 100 by forming the second heat-conducting component 101 with a material that has a higher thermal conductivity than that of the first heat-conducting component 100.

[0097] like Figure 4 As shown, the opening 91 of the circuit board 90 exposes the central region 92 of the back surface 89 of the imaging element 16. The central region 92 is the area on the back surface 89 of the imaging element 16 where the driving heat of the imaging element 16 is highest. Therefore, the driving heat of the imaging element 16 can be dissipated more effectively.

[0098] Furthermore, the central region 92 is the region where the identification information 98 of the imaging element 16 is recorded. Therefore, the opening 91 formed for visual recognition of the identification information 98 can be effectively utilized for heat dissipation of the driving heat of the imaging element 16.

[0099] like Figure 2 As shown, the first heat-conducting component 100 is formed of a graphite sheet, and the second heat-conducting component 101 and the third heat-conducting component 102 are formed of metal. Therefore, the first heat-conducting component 100 can have appropriate elasticity, and the second heat-conducting component 101 and the third heat-conducting component 102 can have appropriate rigidity.

[0100] like Figure 9As shown, the first heat-conducting member 100 has an outer layer 110 and an inner layer 111 connected to the outer layer 110 and disposed in the space surrounded by the outer layer 110. The outer layer 110 and the inner layer 111 each have a curved portion (angles 140-145 and 146-151) that allows deformation to follow the movement of the imaging element 16 based on its anti-vibration function. Therefore, compared to the case where only the outer layer 110 is used, the driving heat of the imaging element 16 can be dissipated more effectively. As a result, compared to the past, photography that places a greater load on the imaging element 16, such as 4K / 120p video recording, can be performed for a longer period. Furthermore, by providing a dual structure for the first heat-conducting member 100, space can be saved for the heat-conducting member itself.

[0101] like Figure 10 As shown, the first heat-conducting component 100 is formed from a single sheet of material 160 that is bent into a sheet shape. Therefore, compared to the case where the outer layer 110 and the inner layer 111 are formed from different materials and then connected, the first heat-conducting component 100 can be formed more simply.

[0102] like Figure 5 As shown, the first heat-conducting member 100 is composed of a first sheet portion 115 and a first sheet portion 118, a second sheet portion 116 and a second sheet portion 119 opposite to the first sheet portion 115 and the first sheet portion 118, a connecting portion 117 connecting the first sheet portion 115 and the second sheet portion 116, and a connecting portion 120 connecting the first sheet portion 118 and the second sheet portion 119. Therefore, the first heat-conducting member 100 can reasonably deform in accordance with the movement of the imaging element 16 based on the vibration-damping function.

[0103] And, as Figure 9 As shown, in the outer layer 110 and the inner layer 111, the angles 140-145 and 146-151, which function as curved portions, extend outward. Therefore, the space surrounded by the outer layer 110 can be increased, thereby making it easier to form the inner layer 111.

[0104] like Figure 10As shown, the first heat-conducting member 100 has a reinforcing layer 161 on both sides constituting the connecting portion 117 and the connecting portion 120, except for the corners 144, 145, 150, and 151 which function as bends. Furthermore, the thickness of the two sides constituting the connecting portion 117 and the connecting portion 120 is greater than the thickness of the reinforcing layer 161 compared to the corners 140-145 and 146-151 which function as bends. Therefore, accidental deformation of the two sides constituting the connecting portion 117 and the connecting portion 120 can be prevented. Moreover, since the reinforcing layer 161 is not provided in the corners 140-145 and 146-151 which function as bends, the first heat-conducting member 100 can deform without significant resistance as it follows the movement of the imaging element 16 based on the vibration-damping function. Additionally, a reinforcing layer 161 may be provided on the first sheet portion 115 and the first sheet portion 118, as well as on the second sheet portion 116 and the second sheet portion 119.

[0105] The first heat-conducting component 100 is connected to the imaging element 16 via the second heat-conducting component 101, and to the camera body 10 via the third heat-conducting component 102. For example... Figure 5 As shown, the second heat-conducting member 101 and the third heat-conducting member 102 are held by the outer layer 110 and the inner layer 111. Therefore, the efficiency of heat conduction from the second heat-conducting member 101 to the first heat-conducting member 100 and from the first heat-conducting member 100 to the third heat-conducting member 102 can be improved. Furthermore, the holding force of the second heat-conducting member 101 and the third heat-conducting member 102 based on the first heat-conducting member 100 can be improved. Additionally, the third heat-conducting member 102 can be formed as part of the camera body 10.

[0106] like Figure 8 As shown, a fourth heat-conducting component 135, formed of a graphite sheet, is connected between the third heat-conducting component 102 and the top plate 137 of the camera body 10. The thickness TH4 of the fourth heat-conducting component 135 is thicker than the thickness TH1 of the first heat-conducting component 100. Unlike the first heat-conducting component 100, the fourth heat-conducting component 135 cannot deform to follow the movement of the imaging element 16 based on the vibration damping function. Therefore, like the first heat-conducting component 100, there is no need to sacrifice some of the driving heat conduction efficiency to make the thickness TH1 relatively thinner in order to achieve smooth deformation, thereby allowing the thickness TH4 to be increased to ensure sufficient conduction efficiency.

[0107] The inner layer 111 is not limited to one. As an example, such as Figure 14 The first heat-conducting component 170 shown can be configured as a triple structure having an outer layer 171 and two inner layers 172 and 173 disposed in a space surrounded by the outer layer 171. Furthermore, the shape of the first heat-conducting component is not limited to hexagonal. For example, as shown... Figure 15The first heat-conducting component 180 shown can have its outer layer 181 and inner layer 182 octagonal. Furthermore, as an example, such as... Figure 16 As shown, a first heat-conducting member 190 is recessed inward from the corners 195 and 196 of the connecting portion 193 of the outer layer 191 and the corners 197 and 198 of the connecting portion 194 of the inner layer 192. The first heat-conducting member 190 has a shape that makes the so-called "Σ" shape fit its mirror image.

[0108] [Second Implementation]

[0109] As an example, such as Figure 17 and Figure 18 As shown, the imaging element unit 200 of the second embodiment includes a fifth heat-conducting member 201. The fifth heat-conducting member 201 is disposed opposite to the side surface 202 of the imaging element 16 connecting the imaging surface 17 and the back surface 89, and is located within a space formed by a flexible substrate 97 connected to the imaging element 16 and extending around the front surface of the movable member 31. Driving heat from the imaging element 16 is conducted from the side surface 202 to the fifth heat-conducting member 201. Furthermore, a sixth heat-conducting member 203, formed of a metal plate, is connected to the fifth heat-conducting member 201. The sixth heat-conducting member 203 is connected to a side plate or the like of the camera body 10. Driving heat from the fifth heat-conducting member 201 is conducted to the camera body 10 through the sixth heat-conducting member 203.

[0110] Similar to the first heat-conducting component 100, the fifth heat-conducting component 201 is formed of graphite sheet and has high elasticity. Like the first heat-conducting component 100, the fifth heat-conducting component 201 can deform to follow the movement of the imaging element 16 based on its vibration-damping function. However, unlike the first heat-conducting component 100, the fifth heat-conducting component 201 has a structure without an inner layer.

[0111] As an example, such as Figure 19 As shown, similar to the first heat-conducting member 100, the fifth heat-conducting member 201 is a hexagon with six corners 205, 206, 207, 208, 209, and 210. Corners 205 to 210 function as curved portions that allow deformation to follow the movement of the imaging element 16 based on the vibration damping function. Furthermore, similar to the first heat-conducting member 100, the fifth heat-conducting member 201 is composed of a first sheet portion 211, a second sheet portion 212 having the same length as the first sheet portion 211 and opposite to the first sheet portion 211, and a pair of V-shaped connecting portions 213 connecting the first sheet portion 211 and the second sheet portion 212. The angles θ5 of the connecting portion 213, which function as bends, 209 and 210, and the angles θ1 of the connecting portions 117 and 120 of the first heat-conducting component 100, which function as bends, 144 and 145, and 150 and 151 (for reference) Figure 9It is more acute than )

[0112] Thus, the imaging element unit 200 of the second embodiment includes a fifth heat-conducting member 201. The fifth heat-conducting member 201 is positioned opposite the side surface 202 of the imaging element 16 that connects the imaging surface 17 and the back surface 89. Driving heat is conducted from the side surface 202 to the fifth heat-conducting member 201. The fifth heat-conducting member 201 is deformable in response to the movement of the imaging element 16 based on the vibration-damping function. The fifth heat-conducting member 201 has a curved portion that allows deformation in response to the movement of the imaging element 16 based on the vibration-damping function. Therefore, driving heat can be effectively dissipated without hindering the movement of the imaging element 16 based on the vibration-damping function.

[0113] The fifth heat-conducting component 201 is composed of a first sheet portion 211, a second sheet portion 212 opposite to the first sheet portion 211, and a connecting portion 213 connecting the first sheet portion 211 and the second sheet portion 212. Therefore, the fifth heat-conducting component 201 can ensure the connection between itself and the sixth heat-conducting component 203, etc., and can deform reasonably in response to the movement of the imaging element 16 based on the vibration-damping function.

[0114] Furthermore, the angle θ5 formed by the bend of the connecting portion 213 of the fifth heat-conducting member is more acute than the angle θ1 formed by the bends of the connecting portions 117 and 120 of the first heat-conducting member 100. Therefore, the repulsive force of the fifth heat-conducting member 201 can be reduced, and the fifth heat-conducting member 201 can deform without significant resistance as it follows the movement of the imaging element 16 based on the vibration-damping function. Moreover, the fifth heat-conducting member 201 is more compact than the first heat-conducting member 100 by an amount equivalent to the distance between the first sheet portion 211 and the second sheet portion 212. Therefore, it can also be positioned in a narrower space, such as within the space formed by the flexible substrate 97, opposite the side surface 202 of the imaging element 16.

[0115] The fifth heat-conducting component 201 is formed of a graphite sheet. Therefore, the fifth heat-conducting component 201 can have appropriate elasticity.

[0116] Similar to the first heat-conducting component 100, the fifth heat-conducting component 201 can be configured as a multi-component structure. Furthermore, as... Figure 15 In the example shown, the fifth heat-conducting component 201 can be octagonal. Furthermore, as... Figure 16 In the example shown, the fifth heat-conducting component 201 can be configured with the corner of the connector recessed inward.

[0117] In the first embodiment described above, an opening 91 is shown that exposes the central region 92 of the back surface 89 of the imaging element 16 on the circuit board 90, and the first piece 125 of the second heat-conducting member 101 is connected to the central region 92 via the opening 91, but it is not limited to this. As an example, such as Figure 20 As shown, the second heat-conducting component 101 can be connected to the central region 222 of the back side 221 of the circuit board 220, which does not have an opening 91.

[0118] Furthermore, although the illustration is omitted, the circuit board without the opening 91 and the second thermally conductive component 101 can be connected via thermally conductive gel or the like.

[0119] CPU 18 is exemplified as a processor for controlling the operation of imaging element unit 15, but it is not limited to this. Instead of CPU 18, or in addition to CPU 18, processors with customizable circuit structures such as FPGA (Field Programmable Gate Array), PLD (Programmable Logic Device), and / or ASIC (Application Specific Integrated Circuit) with dedicated circuit structures specifically configured for performing specific processes can be used.

[0120] In the first embodiment described above, plates 45-47 are disposed on the fixed member 30, and recesses 70-72 are disposed on the movable member 31, but this is not a limitation. Plates 45-47 can be disposed on the movable member 31, and recesses 70-72 can be disposed on the fixed member 30. Furthermore, in the first embodiment described above, magnets 40-42 are disposed on the fixed member 30, and coils 60-62 are disposed on the movable member 31, but this is not a limitation. Magnets 40-42 can be disposed on the movable member 31, and coils 60-62 can be disposed on the fixed member 30.

[0121] The number of sets of balls 35-37, plates 45-47, and recesses 70-72 is not limited to 3 sets; it can be 4 sets or more.

[0122] The imaging element unit of the present invention can be applied to imaging devices other than the illustrated digital camera 2, such as smartphones, tablet terminals or surveillance cameras.

[0123] The technology of the present invention can also be appropriately combined with the various embodiments and / or variations described above. Furthermore, it is not limited to the embodiments described above; of course, various structures can be adopted as long as the spirit is not departed from.

[0124] The descriptions and illustrations shown above are detailed explanations of the parts involved in the technology disclosed herein, and are merely one example of the technology disclosed herein. For example, the descriptions related to the structure, function, role, and effect described above are only one example of the structure, function, role, and effect of the parts involved in the technology disclosed herein. Therefore, it is self-evident that unnecessary parts may be deleted, new elements may be added, or substitutions may be made to the descriptions and illustrations shown above without departing from the spirit of the technology disclosed herein. Furthermore, in order to avoid complexity and facilitate understanding of the parts involved in the technology disclosed herein, descriptions related to technical common sense that do not require special explanation have been omitted from the descriptions and illustrations shown above, based on the premise that the technology disclosed herein can be implemented.

[0125] In this specification, "A and / or B" has the same meaning as "at least one of A and B". That is, "A and / or B" means that it can be only A, only B, or a combination of A and B. Furthermore, in this specification, when three or more things are connected and expressed using "and / or", the same way of thinking applies as with "A and / or B".

[0126] All documents, patent applications and technical standards described in this specification are incorporated herein by reference to the same extent as those specifically and individually described herein.

Claims

1. An imaging element unit, built into the frame of a camera device, the imaging element unit comprising: An imaging element having an imaging surface for capturing a subject and a back surface opposite to the imaging surface; The vibration damping function allows the imaging element to move along the surface direction of the imaging surface; The first heat-conducting component conducts the driving heat of the imaging element from the back side and is able to deform in response to the movement of the imaging element based on the anti-vibration function. and A fifth heat-conducting component is disposed opposite to the side of the imaging element on the back side, connecting the imaging surface and the back side, and the driving heat is conducted from the side side. The first heat-conducting component has: Outer layer; and At least one inner layer portion is connected to the outer layer portion and disposed in the space surrounded by the outer layer portion. The outer layer and the inner layer each have a curved portion that allows for the deformation. The fifth heat-conducting component has a curved portion that can deform in response to the movement of the imaging element based on the vibration-damping function.

2. The imaging element unit according to claim 1, wherein, The first heat-conducting component is formed from a single sheet of material that has been bent into a sheet shape.

3. The imaging element unit according to claim 1, wherein, The outer layer and the inner layer are composed of: First Sheet Division; A second sheet portion opposite to the first sheet portion; and The connection portion that connects the first sheet portion and the second sheet portion is formed.

4. The imaging element unit according to claim 1, wherein, The curved portions of the outer layer and the inner layer extend outward.

5. The imaging element unit according to claim 1, wherein, The first thermally conductive component has a reinforcing layer in the portion other than the bent portion. The portion having the reinforcing layer is thicker than the bending portion by the amount of the reinforcing layer.

6. The imaging element unit according to claim 1, wherein, The first thermally conductive component is connected to the imaging element via the second thermally conductive component, and is also connected to the frame via the third thermally conductive component. The second and third heat-conducting components are sandwiched between the outer layer and the inner layer.

7. The imaging element unit according to claim 6, wherein, The first heat-conducting component is formed of a graphite sheet. The second and third heat-conducting components are made of metal.

8. The imaging element unit according to claim 7, wherein, A fourth heat-conducting component, formed of a graphite sheet, is connected between the third heat-conducting component and the frame. The fourth heat-conducting component is thicker than the first heat-conducting component.

9. The imaging element unit according to claim 1, wherein, The first heat-conducting component and the fifth heat-conducting component are composed of: First Sheet Division; A second sheet portion opposite to the first sheet portion; and A connecting portion that connects the first sheet portion and the second sheet portion and has a bent portion is formed. The angle formed by the bend of the fifth heat-conducting component is more acute than the angle formed by the bend of the first heat-conducting component.

10. The imaging element unit according to claim 1 or 9, wherein, The fifth heat-conducting component is formed from a graphite sheet.

11. A camera device comprising: Frame; and The imaging element unit according to any one of claims 1 to 10 is built into the frame.

12. An imaging element unit, built into the frame of a camera device, the imaging element unit comprising: An imaging element having an imaging surface for capturing a subject and a back surface opposite to the imaging surface; The vibration damping function allows the imaging element to move along the surface direction of the imaging surface; and The first heat-conducting component conducts the driving heat of the imaging element from the back side and is deformable in response to the movement of the imaging element based on the anti-vibration function. The first heat-conducting component has: Outer layer; and At least one inner layer portion is connected to the outer layer portion and disposed in the space surrounded by the outer layer portion. The outer layer and the inner layer each have a curved portion that allows for the deformation. The first thermally conductive component has a reinforcing layer in the portion other than the bent portion. The portion having the reinforcing layer is thicker than the bending portion by the amount of the reinforcing layer.

13. A camera device comprising: Frame; and The imaging element unit of claim 12 is built into the frame.

Images