A vertical electroplating tank internal flow field stabilizing plate

Abstract

This invention relates to the field of electroplating technology and discloses a vertical flow field stabilizing plate for an electroplating tank. The plate includes an outer electroplating tank and a wave-damping device. The wave-damping device comprises an inner electroplating tank, a wave-damping plate, oscillating blades, and an oscillating support. The inner electroplating tank is fixedly connected to the inner wall of the outer electroplating tank. The wave-damping plate is inserted into the inner side of the inner electroplating tank, and a buffer space exists between the wave-damping plate and the inner wall of the inner electroplating tank. The wave-damping plate is provided with spaced-apart conical protrusions, with openings between two conical protrusions. This vertical flow field stabilizing plate, through the wave-damping plate, achieves the goal of maintaining a stable flow field by using the conical protrusions on the plate to disrupt the fluid flowing towards the tank wall when the oscillating blades move back and forth, generating a transverse flow field. The disrupted fluid then flows towards the tank wall through the square openings between the conical protrusions, finally impacting the tank wall, thus achieving uniform electroplating and excellent electroplating results.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, specifically to a flow field stabilizing plate for a vertical electroplating tank. Background Technology

[0002] With the increasing demand for large-size products, the space occupied by horizontal electroplating systems is detrimental to customers' site planning. This has led to the emergence of demand for vertical electroplating machines. Flow field control and electric field control are crucial in the electroplating process.

[0003] The existing vertical electroplating tank equipment has the following main technical defects: During the electroplating process, the oscillating blades in the existing vertical electroplating tank equipment generate a transverse flow field as they move back and forth in the electroplating tank. After the transverse flow field hits the tank wall, the fluid will rebound at the tank wall, generating turbulence. This causes the flow field to be uneven and unstable, resulting in the plated object being located in the turbulent area, leading to uneven electroplating and poor electroplating quality. Summary of the Invention

[0004] The purpose of this invention is to provide a flow field stabilizing plate for a vertical electroplating tank to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a vertical electroplating tank internal flow field stabilizing plate, comprising an electroplating outer tank body, a wave-damping device fixedly installed on the inner side of the electroplating outer tank body, a driving mechanism fixedly connected to the outer side of the electroplating outer tank body, an electroplating device inserted into the inner side of the wave-damping device, a chemical dispersing device fixedly connected inside the electroplating outer tank body and below the wave-damping device, and two driving mechanisms rotatably arranged about the electroplating outer tank body;

[0006] The wave-damping device includes an inner electroplating tank, a wave-damping plate, swaying blades, and a swaying bracket. The inner electroplating tank is fixedly connected to the inner wall of the outer electroplating tank. The wave-damping plate is inserted into the inner side of the inner electroplating tank. There is a buffer space between the wave-damping plate and the inner wall of the inner electroplating tank. The wave-damping plate is provided with spaced conical protrusions, and an opening window is provided between two conical protrusions. The inner side of the outer electroplating tank and the inner side of the wave-damping plate are provided with evenly distributed swaying blades. The outer side of the swaying blades is fixedly connected to the swaying bracket.

[0007] The wave-damping plate is set on the side of the transverse flow field channel wall and maintains a certain space with the channel wall, so that the fluid has a buffer zone and reduces the turbulent flow area after the rebound.

[0008] Conical bumps can have different designs and are not limited in shape or size;

[0009] The opening window can have different designs and is not limited in shape or size;

[0010] Because there are wave-damping plates on both sides of the swing blades and swing brackets, and there are spaced conical protrusions on the wave-damping plates, with opening windows between the two conical protrusions, the conical protrusions on the wave-damping plates disrupt the fluid flowing towards the tank wall. The disrupted fluid then flows towards the tank wall through the square windows between the conical protrusions, and finally impacts the tank wall to reduce the direct rebound of the fluid, which overflows upwards from the electroplating tank.

[0011] Furthermore, since a buffer space is maintained between the wave-damping plate and the inner wall of the electroplating tank, it can prevent and reduce the occurrence of turbulence caused by fluid rebound, thus maintaining a stable flow field.

[0012] Furthermore, the driving mechanism includes a rectangular worktable, a rectangular housing, a motor, a rotating shaft, a mounting sleeve, a rotating wheel, and a linkage assembly. The rectangular worktable is fixedly connected to one side of the electroplating outer tank, and the rectangular housing is fixedly connected to the upper side of the rectangular worktable. The motor is fixedly connected to the inner bottom sidewall of the rectangular housing, and the rotating shaft is driven to the upper side of the motor. The mounting sleeve is fixedly connected to the upper side of the rectangular housing, and the rotating shaft passes through the mounting sleeve. The rotating wheel is fixedly connected to the upper side of the rotating shaft, and a linkage assembly is provided on the upper side of the rotating wheel.

[0013] Furthermore, the linkage component includes a rotating block, a moving block, a T-shaped slider, and a movable block. The rotating block is fixedly connected to the upper side of the rotating wheel, the moving block is rotatably connected to the upper side of the rotating block, the T-shaped slider is fixedly connected to the upper side of the moving block, and the movable block is slidably connected to the outer side of the T-shaped slider.

[0014] Furthermore, the motion component includes a motion rod, a motion sleeve, a mounting shell, and a mounting cover. The motion rod is fixedly connected to one side of the movable block, the motion sleeve is slidably connected to the outside of the motion rod, the mounting shell is fixedly connected to the outside of the motion sleeve, the lower side of the mounting shell is fixedly connected to the electroplating outer tank by screws, and the mounting cover is fixedly connected to the side of the mounting shell near the center of the electroplating outer tank. The motion rod is fixedly connected to the swing bracket.

[0015] Guided by the moving sleeve and mounting shell, the moving rod performs linear reciprocating motion, which in turn drives the swing blades and swing brackets fixedly connected to it to move synchronously, causing the liquid inside the electroplating tank to flow and generating a transverse flow field.

[0016] Furthermore, the electroplating apparatus includes a titanium metal anode mesh plate, a conductive block, an anode shield, a cathode shield, and an electroplating fixture. The titanium metal anode mesh plate is inserted into the inner side of the electroplating inner tank, and a conductive block is fixedly connected to the upper side of the titanium metal anode mesh plate. The conductive block is fixedly connected to the outer electroplating tank. The anode shield, cathode shield, and electroplating fixture are also inserted into the inner side of the electroplating inner tank. The electroplating fixture is located at the center of the electroplating inner tank. The titanium metal anode mesh plate, anode shield, cathode shield, and electroplating fixture are arranged sequentially from the center of the electroplating inner tank outwards as the electroplating fixture, cathode shield, anode shield, conductive block, and titanium metal anode mesh plate.

[0017] Insert the titanium metal anode mesh, anode shield, cathode shield, and electroplating fixture into their respective positions inside the electroplating tank in sequence. After the insertion and installation are completed;

[0018] Start the motors on both sides. The motors drive the rotating shaft to rotate, and the rotating shaft drives the rotating wheel fixedly connected to it to rotate synchronously. While the rotating wheel is rotating, under the action of the rotating block, the moving block is driven to slide along the movable block, and at the same time, the movable block is driven to make linear reciprocating motion. Then the movable block drives the moving rod fixedly connected to it to move synchronously.

[0019] Furthermore, the drug solution dispersion device includes a diffusion and diversion plate, a drug solution input pipe, and diversion holes. The diffusion and diversion plate is fixedly connected to the inner side of the outer electroplating tank. The diffusion and diversion plate is located on the lower side of the inner electroplating tank. The drug solution input pipe is provided inside the outer electroplating tank. The drug solution input pipe penetrates the outer wall of the outer electroplating tank and extends to the outer side of the outer electroplating tank. The drug solution input pipe is located on the lower side of the diffusion and diversion plate. The drug solution input pipe has evenly distributed diversion holes. The diffusion and diversion plate has evenly distributed through holes.

[0020] Furthermore, the inner bottom sidewall of the electroplating outer tank is provided with a tapered slope, and the diversion hole corresponds to the tapered slope.

[0021] Furthermore, the electroplating inner tank is provided with slots corresponding to the wave-damping plate, the titanium metal anode mesh plate, the anode shield, and the cathode shield.

[0022] Compared with the prior art, the present invention provides a vertical flow field stabilizing plate in an electroplating tank, which has the following beneficial effects:

[0023] This vertical electroplating tank's internal flow stabilization plate utilizes a wave-damping plate, a buffer space between the wave-damping plate and the inner wall of the electroplating tank, and spaced-out conical protrusions on the wave-damping plate. The interaction between these protrusions and the opening windows between them allows the flow field to be stabilized. When the oscillating blades move back and forth, generating a transverse flow field, the conical protrusions disrupt the fluid flowing towards the tank wall. The disrupted fluid then flows back towards the tank wall through the square windows between the conical protrusions, finally impacting the tank wall and reducing direct rebound before overflowing out of the electroplating tank. This maintains a stable flow field. Simultaneously, the buffer space between the wave-damping plate and the inner wall of the electroplating tank reduces turbulence caused by fluid rebound, resulting in uniform electroplating and excellent electroplating effects. Attached Figure Description

[0024] Figure 1 This is a frontal perspective view of the present invention;

[0025] Figure 2 This is a cross-sectional three-dimensional structural diagram of the electroplating outer tank of the present invention;

[0026] Figure 3 This is a schematic diagram of the internal three-dimensional structure of the electroplating outer tank of the present invention;

[0027] Figure 4 This is a cross-sectional three-dimensional structural diagram of the electroplating inner tank of the present invention;

[0028] Figure 5 This is a schematic diagram of the internal three-dimensional structure of the electroplating inner tank of the present invention;

[0029] Figure 6 This is a three-dimensional structural diagram of the electroplating inner tank of the present invention;

[0030] Figure 7 This is an exploded three-dimensional structural diagram of the electroplating apparatus of the present invention;

[0031] Figure 8 This is a three-dimensional structural diagram of the electroplating fixture of the present invention;

[0032] Figure 9 For the present invention Figure 8 Enlarged view of point A in the middle;

[0033] Figure 10 This is a three-dimensional schematic diagram of the wave-damping plate of the present invention;

[0034] Figure 11 This is a three-dimensional schematic diagram of the drive mechanism and motion components of the present invention.

[0035] In the diagram: 1. Electroplating outer tank; 2. Wave damping device; 21. Electroplating inner tank; 22. Wave damping plate; 23. Swing blade; 24. Swing support; 3. Drive mechanism; 31. Rectangular worktable; 32. Rectangular shell; 33. Motor; 34. Rotating shaft; 35. Mounting sleeve; 36. Rotating wheel; 37. Linkage assembly; 371. Rotating block; 372. Moving block; 373. T-shaped slider; 374. Movable block; 4. Motion assembly; 41. Moving rod; 42. Moving sleeve; 43. Mounting shell; 44. Mounting cover; 5. Electroplating device; 51. Titanium metal anode mesh plate; 52. Conductive block; 53. Anode shield; 54. Cathode shield; 55. Electroplating fixture; 6. Chemical solution dispersion device; 61. Diffusion and diversion plate; 62. Chemical solution input pipe; 63. Diversion hole. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Example

[0038] Please see Figures 1-11 A vertical electroplating tank internal flow field stabilizing plate includes an electroplating outer tank 1, a wave-damping device 2 fixedly installed on the inner side of the electroplating outer tank 1, a driving mechanism 3 fixedly connected to the outer side of the electroplating outer tank 1, an electroplating device 5 inserted into the inner side of the wave-damping device 2, a liquid dispersing device 6 fixedly connected inside the electroplating outer tank 1 and below the wave-damping device 2, and two driving mechanisms 3 are rotatably arranged about the electroplating outer tank 1.

[0039] The wave-damping device 2 includes an inner electroplating tank 21, a wave-damping plate 22, swaying blades 23, and a swaying bracket 24. The inner wall of the outer electroplating tank 1 is fixedly connected to the inner electroplating tank 21. The wave-damping plate 22 is inserted into the inner side of the inner electroplating tank 21. There is a buffer space between the wave-damping plate 22 and the inner wall of the inner electroplating tank 21. The wave-damping plate 22 is provided with spaced conical protrusions. An opening window is opened between two conical protrusions. The inner side of the outer electroplating tank 1 and the inner side of the wave-damping plate 22 are provided with evenly distributed swaying blades 23. The outer side of the swaying blades 23 is fixedly connected to the swaying bracket 24.

[0040] Since there are wave-damping plates 22 on both sides of the swing blade 23 and the swing bracket 24, and there are spaced conical protrusions on the wave-damping plates 22, and an opening window is opened between the two conical protrusions, the conical protrusions on the wave-damping plates 22 are used to disrupt the fluid flowing towards the tank wall. The disrupted fluid then flows towards the tank wall through the square window between the conical protrusions, and finally hits the tank wall to reduce the direct rebound of the fluid and overflows upward out of the electroplating inner tank 21.

[0041] Furthermore, since a buffer space is maintained between the wave-damping plate 22 and the inner wall of the electroplating tank 21, it can prevent the occurrence of turbulence caused by fluid rebound and maintain the stability of the flow field.

[0042] Furthermore, the drive mechanism 3 includes a rectangular worktable 31, a rectangular housing 32, a motor 33, a rotating shaft 34, a mounting sleeve 35, a rotating wheel 36, and a linkage component 37. The rectangular worktable 31 is fixedly connected to one side of the electroplating outer tank 1. The rectangular housing 32 is fixedly connected to the upper side of the rectangular worktable 31. The motor 33 is fixedly connected to the inner bottom side wall of the rectangular housing 32. The rotating shaft 34 is driven to the upper side of the motor 33. The mounting sleeve 35 is fixedly connected to the upper side of the rectangular housing 32. The rotating shaft 34 passes through the mounting sleeve 35. The rotating wheel 36 is fixedly connected to the upper side of the rotating shaft 34. The linkage component 37 is provided on the upper side of the rotating wheel 36.

[0043] Furthermore, the linkage component 37 includes a rotating block 371, a moving block 372, a T-shaped slider 373, and a movable block 374. The rotating block 371 is fixedly connected to the upper side of the rotating wheel 36, the moving block 372 is rotatably connected to the upper side of the rotating block 371, the T-shaped slider 373 is fixedly connected to the upper side of the moving block 372, and the movable block 374 is slidably connected to the outer side of the T-shaped slider 373.

[0044] Furthermore, the motion component 4 includes a motion rod 41, a motion sleeve 42, a mounting shell 43, and a mounting cover 44. The motion rod 41 is fixedly connected to one side of the movable block 374. The motion sleeve 42 is slidably connected to the outside of the motion rod 41. The mounting shell 43 is fixedly connected to the outside of the motion sleeve 42. The lower side of the mounting shell 43 is fixedly connected to the electroplating outer tank 1 by screws. The mounting cover 44 is fixedly connected to the side of the mounting shell 43 near the center of the electroplating outer tank 1. The motion rod 41 is fixedly connected to the swing bracket 24.

[0045] Under the guidance of the moving sleeve 42 and the mounting shell 43, the moving rod 41 performs linear reciprocating motion, which in turn drives the swing blade 23 and the swing bracket 24 fixedly connected to it to move synchronously, so that the liquid inside the electroplating outer tank 1 flows and generates a transverse flow field.

[0046] Furthermore, the electroplating apparatus 5 includes a titanium metal anode mesh plate 51, a conductive block 52, an anode shield 53, a cathode shield 54, and an electroplating fixture 55. The titanium metal anode mesh plate 51 is inserted into the inner side of the electroplating inner tank 21, and the conductive block 52 is fixedly connected to the upper side of the titanium metal anode mesh plate 51. The conductive block 52 is fixedly connected to the electroplating outer tank 1. The anode shield 53, the cathode shield 54, and the electroplating fixture 55 are also inserted into the inner side of the electroplating inner tank 21. The electroplating fixture 55 is located at the center of the electroplating inner tank 21. The titanium metal anode mesh plate 51, the anode shield 53, the cathode shield 54, and the electroplating fixture 55 are arranged in the following order from the center of the electroplating inner tank 21 outward: electroplating fixture 55, cathode shield 54, anode shield 53, conductive block 52, and titanium metal anode mesh plate 51.

[0047] The titanium metal anode mesh plate 51, anode shield 53, cathode shield 54 and electroplating fixture 55 are sequentially inserted into the corresponding positions inside the electroplating inner tank 21. After the insertion and installation are completed.

[0048] Start the motors 33 on both sides. The motors 33 drive the rotating shaft 34 to rotate. The rotating shaft 34 drives the rotating wheel 36 fixedly connected to it to rotate synchronously. While the rotating wheel 36 is rotating, under the action of the rotating block 371, the moving block 372 is driven to slide along the movable block 374. At the same time, the movable block 374 is driven to make linear reciprocating motion. Then the movable block 374 drives the moving rod 41 fixedly connected to it to move synchronously.

[0049] Furthermore, the liquid dispersion device 6 includes a diffusion and diversion plate 61, a liquid input pipe 62, and diversion holes 63. The diffusion and diversion plate 61 is fixedly connected to the inner side of the electroplating outer tank 1. The diffusion and diversion plate 61 is located on the lower side of the electroplating inner tank 21. The liquid input pipe 62 is provided inside the electroplating outer tank 1. The liquid input pipe 62 penetrates the outer wall of the electroplating outer tank 1 and extends to the outer side of the electroplating outer tank 1. The liquid input pipe 62 is located on the lower side of the diffusion and diversion plate 61. The liquid input pipe 62 is provided with evenly distributed diversion holes 63. The diffusion and diversion plate 61 is provided with evenly distributed through holes.

[0050] Furthermore, the inner bottom sidewall of the electroplating outer tank 1 is provided with a tapered slope, and the diversion hole 63 corresponds to the tapered slope.

[0051] Furthermore, the inner electroplating tank 21 is provided with slots corresponding to the wave-damping plate 22, the titanium metal anode mesh plate 51, the anode shield 53 and the cathode shield 54.

[0052] The specific usage and function of this embodiment are as follows:

[0053] In use, the titanium metal anode mesh plate 51, anode shield 53, cathode shield 54 and electroplating fixture 55 are first inserted into the corresponding positions inside the electroplating inner tank 21. After the insertion and installation are completed, the motors 33 on both sides are started. The motors 33 drive the rotating shaft 34 to rotate. The rotating shaft 34 drives the rotating wheel 36 fixedly connected to it to rotate synchronously. While the rotating wheel 36 is rotating, under the action of the rotating block 371, the moving block 372 is driven to slide along the movable block 374. At the same time, the movable block 374 is driven to make linear reciprocating motion. Then the movable block 374 drives the moving rod 41 fixedly connected to it to move synchronously.

[0054] Under the guidance of the moving sleeve 42 and the mounting shell 43, the moving rod 41 performs linear reciprocating motion, which in turn drives the swing blade 23 and the swing bracket 24 fixedly connected to it to move synchronously, so that the liquid inside the electroplating outer tank 1 flows and generates a transverse flow field.

[0055] Since there are wave-damping plates 22 on both sides of the swing blade 23 and the swing bracket 24, and there are spaced conical protrusions on the wave-damping plates 22, and an opening window is opened between the two conical protrusions, the conical protrusions on the wave-damping plates 22 are used to disrupt the fluid flowing towards the tank wall. The disrupted fluid then flows towards the tank wall through the square window between the conical protrusions, and finally hits the tank wall to reduce the direct rebound of the fluid and overflows upward out of the electroplating inner tank 21.

[0056] Furthermore, since a buffer space is maintained between the wave-damping plate 22 and the inner wall of the electroplating tank 21, it can prevent the occurrence of turbulence caused by fluid rebound and maintain the stability of the flow field.

[0057] The above is the process flow of this patent.

[0058] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vertical flow field stabilizing plate for an electroplating tank, comprising an outer electroplating tank (1), characterized in that: A wave-damping device (2) is fixedly installed on the inner side of the electroplating outer tank (1), a drive mechanism (3) is fixedly connected to the outer side of the electroplating outer tank (1), an electroplating device (5) is inserted into the inner side of the wave-damping device (2), a liquid dispersing device (6) is fixedly connected inside the electroplating outer tank (1) and below the wave-damping device (2), and two drive mechanisms (3) are rotatably arranged about the electroplating outer tank (1); The wave-damping device (2) includes an inner electroplating tank (21), a wave-damping plate (22), swaying blades (23), and a swaying bracket (24). The inner wall of the outer electroplating tank (1) is fixedly connected to the inner electroplating tank (21). The inner side of the inner electroplating tank (21) is inserted with the wave-damping plate (22). There is a buffer space between the wave-damping plate (22) and the inner wall of the inner electroplating tank (21). The wave-damping plate (22) is provided with spaced conical protrusions. An opening window is provided between two conical protrusions. The inner side of the outer electroplating tank (1) and the inner side of the wave-damping plate (22) are provided with evenly distributed swaying blades (23). The outer side of the swaying blades (23) is fixedly connected to the swaying bracket (24).

2. The vertical electroplating tank flow stabilizing plate according to claim 1, characterized in that: The drive mechanism (3) includes a rectangular worktable (31), a rectangular housing (32), a motor (33), a rotating shaft (34), a mounting sleeve (35), a rotating wheel (36), and a linkage component (37). The rectangular worktable (31) is fixedly connected to one side of the electroplating outer tank (1). The rectangular housing (32) is fixedly connected to the upper side of the rectangular worktable (31). The motor (33) is fixedly connected to the inner bottom side wall of the rectangular housing (32). The rotating shaft (34) is driven to the upper side of the motor (33). The mounting sleeve (35) is fixedly connected to the upper side of the rectangular housing (32). The rotating shaft (34) passes through the mounting sleeve (35). The rotating wheel (36) is fixedly connected to the upper side of the rotating shaft (34). The linkage component (37) is provided on the upper side of the rotating wheel (36).

3. The vertical electroplating tank flow stabilizing plate according to claim 2, characterized in that: The linkage component (37) includes a rotating block (371), a moving block (372), a T-shaped slider (373), and a movable block (374). The rotating block (371) is fixedly connected to the upper side of the rotating wheel (36), the moving block (372) is rotatably connected to the upper side of the rotating block (371), the T-shaped slider (373) is fixedly connected to the upper side of the moving block (372), and the movable block (374) is slidably connected to the outer side of the T-shaped slider (373).

4. A flow field stabilizing plate for a vertical electroplating tank according to claim 3, characterized in that: The motion component (4) includes a motion rod (41), a motion sleeve (42), a mounting shell (43), and a mounting cover (44). The motion rod (41) is fixedly connected to one side of the movable block (374). The motion sleeve (42) is slidably connected to the outside of the motion rod (41). The mounting shell (43) is fixedly connected to the outside of the motion sleeve (42). The lower side of the mounting shell (43) is fixedly connected to the electroplating outer tank (1) by screws. The mounting cover (44) is fixedly connected to the side of the mounting shell (43) near the center of the electroplating outer tank (1). The motion rod (41) is fixedly connected to the swing bracket (24).

5. A flow field stabilizing plate for a vertical electroplating tank according to claim 1, characterized in that: The electroplating apparatus (5) includes a titanium metal anode mesh plate (51), a conductive block (52), an anode shield (53), a cathode shield (54), and an electroplating fixture (55). The titanium metal anode mesh plate (51) is inserted into the inner side of the electroplating inner tank (21), and the conductive block (52) is fixedly connected to the upper side of the titanium metal anode mesh plate (51). The conductive block (52) is fixedly connected to the electroplating outer tank (1). An anode is also inserted into the inner side of the electroplating inner tank (21). The electroplating fixture (55) is located at the center of the electroplating inner tank (21). The titanium metal anode mesh plate (51), anode mask plate (53), cathode mask plate (54) and electroplating fixture (55) are arranged in the following order from the center of the electroplating inner tank (21) outward: electroplating fixture (55), cathode mask plate (54), anode mask plate (53), conductive block (52) and titanium metal anode mesh plate (51).

6. A flow field stabilizing plate for a vertical electroplating tank according to claim 1, characterized in that: The drug solution dispersion device (6) includes a diffusion and diversion plate (61), a drug solution input pipe (62), and diversion holes (63). The diffusion and diversion plate (61) is fixedly connected to the inner side of the electroplating outer tank (1). The diffusion and diversion plate (61) is located on the lower side of the electroplating inner tank (21). The drug solution input pipe (62) is provided inside the electroplating outer tank (1). The drug solution input pipe (62) penetrates the outer wall of the electroplating outer tank (1) and extends to the outer side of the electroplating outer tank (1). The drug solution input pipe (62) is located on the lower side of the diffusion and diversion plate (61). The drug solution input pipe (62) is provided with evenly distributed diversion holes (63). The diffusion and diversion plate (61) is provided with evenly distributed through holes.

7. A flow field stabilizing plate for a vertical electroplating tank according to claim 6, characterized in that: The inner bottom wall of the electroplating outer tank (1) is provided with a tapered slope, and the diversion hole (63) corresponds to the tapered slope.

8. A flow field stabilizing plate for a vertical electroplating tank according to claim 5, characterized in that: The electroplating inner tank (21) has slots corresponding to the wave-damping plate (22), titanium metal anode mesh plate (51), anode shield (53) and cathode shield (54).

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