一种马兰戈尼干燥方法和晶圆处理装置
By employing the Marangoni drying method, which utilizes precise control and oscillation of the spray nozzle and air jet nozzle, the problem of liquid mark defects on the wafer surface has been solved, achieving efficient wafer drying, improving chip manufacturing yield, and reducing costs.
CN116878240BActive Publication Date: 2026-07-17HWATSING TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HWATSING TECHNOLOGY CO LTD
- Filing Date
- 2023-07-06
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing technologies, liquid marks are prone to appear on the wafer surface after chemical mechanical polishing, which affects chip manufacturing yield and increases costs.
Method used
The Marangoni drying method is employed, which uses the synergistic effect of liquid nozzles and air nozzles to precisely control the air flow rate and the oscillation of the liquid nozzles, thereby preventing liquid film rupture and achieving thorough drying of the wafers by utilizing the Marangoni effect.
Benefits of technology
It effectively avoids watermark defects in the center area of the wafer, improves the wafer drying effect, increases chip manufacturing yield, and reduces costs.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116878240B_ABST
Abstract
本发明公开了一种马兰戈尼干燥方法和晶圆处理装置，该方法应用于晶圆处理装置，所述晶圆处理装置包括带动喷液嘴和喷气嘴摆动的摆臂，所述马兰戈尼干燥方法包括：第一阶段，喷液嘴从朝向晶圆中心的起始位置开始向晶圆表面供液以进行液膜覆盖，同时喷气嘴在保证不撕破液膜的情况下向外喷气，并且摆臂停留第一预设时间；第二阶段，喷液嘴和喷气嘴跟随摆臂的摆动而移动，同时喷液嘴保持供液，喷气嘴降低喷气流量以避免撕破液膜；第三阶段，当喷气嘴移动至其朝向晶圆中心时，喷气嘴的喷气流量增大至执行马兰戈尼干燥的相应流量，并且摆臂停留第二预设时间。
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